HT2DC20S20F [NXP]
HITAG 2 transponder IC;
| 型号： | HT2DC20S20F |
| 厂家： | 
NXP |
| 描述： | HITAG 2 transponder IC |
| 文件： | 总9页 (文件大小：122K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HT2x
HITAG 2 transponder IC
Rev. 3.1 — 3 November 2014
210431
Product short data sheet
COMPANY PUBLIC
1. General description
HITAG 2 based transponders are highly integrated and do not need any additional
components beside the HITAG 2 transponder IC and the external coil. Data are
transmitted bidirectionally, in half duplex mode, between Read Write Device (RWD) and
HITAG transponder IC. To achieve a main stream security, data may be transmitted
enciphered. HITAG 2 transponder IC offer a memory of 256 bit.
Custom specific configuration of the transponder IC is possible by using the configuration
page. The configuration page allows the selection of different modes and access
possibilities and also the configuration of the memory. The pages of the memory can be
protected against read or write access by setting corresponding memory flags.
The HITAG 2 transponder IC provides - besides password and crypto mode - the following
three standard read only modes, that can be configured using the configuration byte:
• public-mode A
• public-mode B (animal identification, according to ISO 11784 and ISO 11785)
• public-mode C (PIT compatible mode PCF793x)
2. Features and benefits
Identification transponder for use in contactless applications
Operating frequency 125 kHz
Data transmission and energy supply via RF link, no internal battery
Reading distance same as writing distance
Non-volatile memory of 256 bits (128-bit user data and 128-bit control data/secret
memory) organized in 8 pages, 4 bytes each
10 years non-volatile data retention
100000 erase/write cycles
Selective read/write protection of memory content
Two coding schemes for read operation: Biphase and Manchester coding
Effective communication protocol with outstanding data integrity check
Mutual authentication function
Read/write mode allows:
Plain data transmission (password mode)
Encrypted data transmission (crypto mode)
In read/write mode multi-tag operation possible because of special HALT-function
Emulation of standard industrial read-only transponders:
HT2x
NXP Semiconductors
HITAG 2 transponder IC
public-mode A (MIRO and transponders from EM (H400x))
public-mode B (according to ISO 11784 and ISO 11785 for animal identification)
public-mode C (PIT compatible mode)
3. Applications
Logistics
Livestock tracking
Asset tracking
Gas cylinder ID
Casino - gambling
Industrial automation
4. Quick reference data
Table 1.
Symbol
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
Wafer EEPROM characteristics
tret
retention time
Tamb 55 C
10
-
-
-
-
year
Nendu(W)
write endurance
100000
cycle
Interface characteristics
Ci input capacitance
between LA and LB
189
210
231
pF
HT2ICS2002W/V6F/R
5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
HT2ICS2002W/V6F/R Wafer
HT2MOA4S20/E/3/R PLLMC
sawn wafer on FFC, 150 m, 8 inch, UV, inkless -
plastic leadless module carrier package; 35 mm SOT500-2[1]
wide tape
HT2DC20S20/F/R
PLLMC
plastic leadless module carrier package
SOT385-1
[1] This package is also known as MOA4.
HT2X_SDS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.1 — 3 November 2014
210431
2 of 9
HT2x
NXP Semiconductors
HITAG 2 transponder IC
6. Block diagram
The HITAG 2 transponder IC requires no external power supply. The contactless interface
generates the power supply and the system clock via the resonant circuitry by inductive
coupling to the RWD. The interface also demodulates data transmitted from the RWD to
the HITAG 2 transponder IC, and modulates the magnetic field for data transmission from
the HITAG 2 transponder IC to the RWD.
Data are stored in a non-volatile memory (EEPROM). The memory has a capacity of
256 bit and is organized in pages.
ANALOGUE
RF INTERFACE
DIGITAL CONTROL
EEPROM
VREG
PAD
VDD
RECT
Cres
DEMOD
READ/WRITE
CONTROL
data
in
TRANSPONDER
ACCESS CONTROL
MOD
data
out
R/W
EEPROM INTERFACE
CONTROL
CLK
PAD
clock
RF INTERFACE
CONTROL
SEQUENCER
CHARGE PUMP
001aao244
Fig 1. Block diagram of HITAG 2 transponder IC
HT2X_SDS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.1 — 3 November 2014
210431
3 of 9
HT2x
NXP Semiconductors
HITAG 2 transponder IC
7. Functional description
7.1 Overview of transponder
Table 3.
Overview of transponders
Description
Parameter
Unit
kHz
-
carrier frequency
coding read
125
Manchester/Biphase
coding write
Pulse duration
-
modulation
ASK (amplitude shift keying)
-
total memory size
user memory read/write
read only serial number
data retention
256
bit
bit
bit
year
-
128
32
10
data security
encryption, authentication, passwords
data integrity
half-duplex handshake, reverse data transmission
-
7.2 Memory map
The 256 bit memory area of the HITAG 2 transponder IC is divided into 8 pages. Each
page has a size of 32 bits.
Depending on the operation mode (crypto mode/password mode) the memory is
organized as described in the following:
Table 4.
Memory map in Crypto Mode
Content
Page
Access
ro
0
1
2
serial number
secret key low (32 bit)
r/w or 0
r/w or ro
secret key high (16 bit)
reserved bit (14 bit)
3
configuration (8 bit)
password tag (24 bit)
r/w or ro
4
5
6
7
usable memory page
usable memory page
usable memory page
usable memory page
r/w or ro
r/w or ro
r/w or ro
r/w or ro
HT2X_SDS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.1 — 3 November 2014
210431
4 of 9
HT2x
NXP Semiconductors
HITAG 2 transponder IC
Table 5.
Memory map in Password Mode
Content
Page
Access
ro
0
1
2
3
serial number
password RWD
r/w or 0
r/w or 0
r/w or ro
reserved for future use
configuration (8 bit)
password tag (24 bit)
4
5
6
7
usable memory page
usable memory page
usable memory page
usable memory page
r/w or ro
r/w or ro
r/w or ro
r/w or ro
8. Limiting values
Table 6.
Symbol
VDD
Limiting values - HT2ICS2002W/V6F/R[1]
Parameter
Conditions
Min
0.5
2
Max
+6.5
-
Unit
V
supply voltage
VESD
electrostatic discharge voltage
MIL-STD 883D, Method
3015.7, Human Body
kV
Ilu
latch-up current
MIL-STD 883D, Method 3023
IN1-IN2
100
-
-
mA
mA
C
Ii(max)
Tj
maximum input current
junction temperature
30
55
+140
[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical
Characteristics section of this specification is not implied.
Table 7.
Symbol
Tstg
Limiting values - HT2DC20S20/F/R (SOT385-1)/ HT2MOA4S20/E/3/R (SOT500-2)[1]
Parameter
Conditions
Min
Max
Unit
storage temperature
55
+125
C
[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical
Characteristics section of this specification is not implied.
9. Abbreviations
Table 8.
Acronym
EEPROM
IC
Abbreviations
Description
Electrically Erasable Programmable Read-Only Memory
Integrated Circuit
RF
Radio Frequency
RWD
Read Write Device
HT2X_SDS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.1 — 3 November 2014
210431
5 of 9
HT2x
NXP Semiconductors
HITAG 2 transponder IC
10. Revision history
Table 9.
Revision history
Document ID
HT2X_SDS v.3.1
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20141103
Product short data sheet
-
HT2X_SDS v.3.0
• Section 11 “Legal information”: License statement “ICs with HITAG functionality” removed
• Section 5 “Ordering information”: updated
• Table 7: Title updated
HT2X_SDS v.3.0
20110916
Product short data sheet
-
-
HT2X_SDS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.1 — 3 November 2014
210431
6 of 9
HT2x
NXP Semiconductors
HITAG 2 transponder IC
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
11.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
11.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
HT2X_SDS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.1 — 3 November 2014
210431
7 of 9
HT2x
NXP Semiconductors
HITAG 2 transponder IC
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
non-automotive qualified products in automotive equipment or applications.
HITAG — is a trademark of NXP Semiconductors N.V.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
HT2X_SDS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.1 — 3 November 2014
210431
8 of 9
HT2x
NXP Semiconductors
HITAG 2 transponder IC
13. Contents
1
2
3
4
5
6
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
7.1
7.2
Functional description . . . . . . . . . . . . . . . . . . . 4
Overview of transponder . . . . . . . . . . . . . . . . . 4
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 November 2014
210431
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