IP4309CX9 [NXP]
Data Line Filter, 8 FUNCTIONS, DATA LINE FILTER, SURFACE MOUNT;
| 型号： | IP4309CX9 |
| 厂家： | 
NXP |
| 描述： | Data Line Filter, 8 FUNCTIONS, DATA LINE FILTER, SURFACE MOUNT LTE |
| 文件： | 总14页 (文件大小：273K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IP4309CX9
HDMI octal channel low capacitive high-performance
ESD protection
Rev. 1 — 10 March 2011
Product data sheet
1. Product profile
1.1 General description
The IP4309CX9 is a 8-channel low capacitance ElectroStatic Discharge (ESD) protection
device, providing protection to downstream components from ESD voltages up to 15 kV
contact discharge and higher than 15 kV air discharge, far exceeding IEC 61000-4-2,
level 4.
The device is optimized for the protection of high-speed interfaces such as High-Definition
Multimedia Interface (HDMI), Digital Video Interface (DVI) and other interfaces requiring
very low capacitance ESD protection. In order to prevent any current backdrive into the
adjacent channel, all eight ESD protection channels are electrically separated and share
only the same ground connections.
The IP4309CX9 is fabricated using monolithic silicon technology in a single Wafer Level
Chip-Size Package (WLCSP). These features make IP4309CX9 ideal for use in
applications requiring component miniaturization, such as mobile phone handsets.
1.2 Features and benefits
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (dark green compliant)
8 ultra low input capacitance rail-to-rail ESD protection diodes with CI/O = 1.3 pF
Rdyn = 0.45
Downstream ESD protection up to 15 kV (contact), exceeding IEC 61000-4-2, level 4
3 3 pin WLCSP with 0.4 mm pitch
1.3 Applications
High-speed interface ESD protection such as HDMI, DVI and USB etc.
Interfaces with special requirements on low capacitive ESD protection
Interfaces requiring separation of the positive clamping voltage / current path
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
2. Pinning information
2.1 Pinning
bump A1
index area
1
2
3
A
B
C
001aam186
transparent top view,
solder balls facing down
Fig 1. Pin configuration IP4309CX9
2.2 Pin description
Table 1.
Pin
A1
Pinning
Description
ESD protection
ESD protection
ESD protection
ESD protection
ground
A2
A3
B1
B2
B3
ESD protection
ESD protection
ESD protection
ESD protection
C1
C2
C3
IP4309CX9
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
2 of 14
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
3. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
Version
IP4309CX9
WLCSP9 wafer level chip-size package; 9 bumps;
IP4309CX9
1.16 1.16 0.61 mm
4. Functional diagram
A1
A2 A3
B3
B2
B1
C1 C2
C3
018aaa112
Fig 2. Schematic diagram IP4309CX9
IP4309CX9
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
3 of 14
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
5. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VI
Parameter
Conditions
Min
Max
Unit
input voltage
at I/O pins
0.5
+5.5
V
[1]
[2]
[2]
VESD
electrostatic discharge
voltage
contact discharge
air discharge
-
-
15
15
kV
kV
IEC 61000-4-2, level 4
contact discharge
air discharge
-
8
kV
kV
C
C
C
-
15
+150
260
+85
Tstg
storage temperature
55
-
Treflow(peak) peak reflow temperature tp 10 s
Tamb ambient temperature
30
[1] All pins to ground.
[2] IP4309CX9 is qualified to 1000 contact discharges of 15 kV using the IEC 61000-4-2 model, far exceeding
the specified IEC 61000-4-2, level 4 (8 kV contact discharge).
6. Characteristics
Table 4.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
C(I/O-GND) input/output to
ground capacitance
reverse leakage current VI = 3 V
Parameter
Conditions
Min
Typ
Max Unit
[1][2]
[2]
VI = 0.5 V; f = 1 MHz
1.0
1.3
1.5
pF
ILR
-
-
-
50
11
nA
V
VBRzd
Zener diode
Itest = 1 mA
6
breakdown voltage
VF
forward voltage
-
0.7
-
V
[3]
Rdyn
dynamic resistance
I = 1 A
positive transient
negative transient
-
-
0.45
0.5
-
-
[1] Guaranteed by design.
[2] Pins A1, A2, A3, B1, B3, C1 and C2 to ground.
[3] According to IEC 61000-4-5 and IEC 61000-4-9.
IP4309CX9
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
4 of 14
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
7. Application information
7.1 Insertion loss
The IP4309CX9 is mainly designed as an ESD protection device for high-speed interfaces
such as HDMI, DVI and USB data lines etc.
The insertion loss in a 50 NetWork Analyzer (NWA) of two channels of IP4309CX9 is
depicted in Figure 4. The other channels behave similar as all channels contain an
identical electrical circuitry.
The insertion loss measurement configuration of a typical 50 NWA system for
evaluation of the IP4309CX9 is shown in Figure 3. It was measured using a test
Printed-Circuit Board (PCB) utilizing laser-drilled micro-via holes that connect the
PCB ground plane to the ground pins.
DUT
IN
OUT
50 Ω
50 Ω
TEST BOARD
V
gen
018aaa016
Fig 3. Frequency response setup
018aaa113
5
S
21
(dB)
–5
(2)
(1)
–15
–25
10
–1
2
3
4
1
10
10
10
10
f (MHz)
(1) Pin A1
(2) Pin A2
Fig 4. Typical IP4309CX9 frequency response curves
IP4309CX9
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
5 of 14
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
7.2 Crosstalk
The setup for crosstalk measurements in a 50 NWA system for several pin
combinations reflecting the various possible physical distances is shown in Figure 5.
The crosstalk measurement results are depicted in Figure 6. Other combinations behave
similar, depending on the distance between the pins.
IN1
IN2
OUT2
OUT1
DUT
50 Ω
50 Ω
TEST BOARD
V
gen
50 Ω
50 Ω
018aaa019
Fig 5. Crosstalk measurement configuration
018aaa114
0
S
21
(dB)
–40
(3)
(4)
(1)
(2)
–80
–120
2
3
4
1
10
10
10
10
f (MHz)
(1) Pin A1 to A2
(2) Pin A1 to B1
(3) Pin A1 to C3
(4) Pin A1 to A3
Fig 6. Typical IP4309CX9 crosstalk behavior
IP4309CX9
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
6 of 14
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
8. Package outline
WLCSP9: wafer level chip-size package; 9 bumps (3 x 3)
D
bump A1
index area
A
2
E
A
A
1
detail X
e
1
b
e
C
B
A
e
e
1
1
2
3
X
European
projection
wlcsp9_3x3_po
Fig 7. Package outline WLCSP9 (IP4309CX9)
Table 5.
Package outline dimensions
Symbol
Min
0.57
0.18
0.59
0.21
1.11
1.11
-
Typ
Max
0.65
0.22
0.63
0.31
1.21
1.21
-
Unit
mm
mm
mm
mm
mm
mm
mm
mm
A
0.61
0.20
0.61
0.26
1.16
1.16
0.40
0.8
A1
A2
b
D
E
e
e1
-
-
IP4309CX9
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
7 of 14
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
9. Packing information
K
B - B
A
D
1
K
0
P
A
0
G
W
B
0
1
W
B
B
F
E
P
D
0
T
1
0.05 / 40
A
2
P
T
position of PIN A1
0
A - A
direction of feed
001aai051
Fig 8. Tape and reel information
Table 6. Tape dimensions
Description
Item
Symbol
Specification (mm)
Dimension
8.00
Tolerance
0.1
Overall dimensions
tape width
thickness
distance
diameter
distance
pitch
W
K
1.20
max
G
0.75
min
Sprocket holes[1]
D0
E
1.50
+0.1
1.75
0.1
P0
P2
F
4.00
0.1
Distance between center lines length direction
width direction
2.00
0.05
0.05
0.05
0.05
0.05
+0.1
3.50
Compartments
length
A0
B0
K0
D1
P
1.32
width
1.28
depth
0.80
hole diameter
pitch
0.50
4.00
0.1
IP4309CX9
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
8 of 14
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
Table 6.
Tape dimensions …continued
Description
Item
Symbol
Specification (mm)
Dimension
20
Tolerance
max
Device
rotation
Carrier tape antistatic[2]
Cover tape[3]
film thickness
width
T
0.25
0.07
max
W1
T1
R
5.75
film thickness
in winding direction
0.1
max
Bending radius
30
min
[1] Cumulated pitch error: 0.2 mm per 10 pitches.
[2] Carbon-loaded polystyrene 100 % recyclable.
[3] The cover tape shall not overlap the sprocket holes.
10. Design and assembly recommendations
10.1 PCB design guidelines
It is recommended, for optimum performance, to use a Non-Solder Mask
Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled
micro-vias connecting the ground pads to a buried ground-plane layer. This results in the
lowest possible ground inductance and provides the best high frequency and
ESD performance. Refer to Table 7 for the recommended PCB design parameters.
Table 7.
Recommended PCB design parameters
Parameter
Value or specification
250 m
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
100 m (0.004 inch)
325 m
20 m to 40 m
AuNi
PCB material
FR4
10.2 PCB assembly guidelines for Pb-free soldering
Table 8.
Assembly recommendations
Parameter
Value or specification
325 m
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder to flux ratio
100 m (0.004 inch)
SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %)
50 : 50
Solder reflow profile
see Figure 9
IP4309CX9
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
9 of 14
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
T
(°C)
reflow(peak)
250
T
230
217
cooling rate
preheat
t (s)
t
t
2
1
t
t
3
4
t
5
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 9. Pb-free solder reflow profile
Table 9.
Symbol
Characteristics
Parameter
Conditions
Min
230
60
-
Typ
Max Unit
Treflow(peak) peak reflow temperature
-
-
-
-
-
-
-
-
260
180
30
C
s
t1
time 1
time 2
time 3
time 4
time 5
soak time
t2
time during T 250 C
time during T 230 C
time during T > 217 C
s
t3
10
30
-
50
s
t4
150
540
6
s
t5
s
dT/dt
rate of change of
temperature
cooling rate
preheat
-
C/s
C/s
2.5
4.0
IP4309CX9
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
10 of 14
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
11. Revision history
Table 10. Revision history
Document ID
Release date
20110310
Data sheet status
Change notice
Supersedes
IP4309CX9 v.1
Product data sheet
-
-
IP4309CX9
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
11 of 14
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
12.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
12.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
IP4309CX9
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
12 of 14
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4309CX9
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
13 of 14
IP4309CX9
NXP Semiconductors
HDMI octal channel low capacitive high-performance ESD protection
14. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
2
2.1
2.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
3
4
5
6
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
7.1
7.2
Application information. . . . . . . . . . . . . . . . . . . 5
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8
9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 8
10
10.1
10.2
Design and assembly recommendations . . . . 9
PCB design guidelines . . . . . . . . . . . . . . . . . . . 9
PCB assembly guidelines for Pb-free soldering 9
11
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
12.1
12.2
12.3
12.4
13
14
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 March 2011
Document identifier: IP4309CX9
相关型号：
IP4309CX9/P,135
IP4309CX9 - HDMI octal channel low capacitive high-performance ESD protection CSP 9-Pin
NXP
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