IP4359CX4-H500 [NXP]
Dual channel low capacitance high performance ESD protection; 双通道低电容高性能ESD保护
| 型号： | IP4359CX4-H500 |
| 厂家： | 
NXP |
| 描述： | Dual channel low capacitance high performance ESD protection |
| 文件： | 总12页 (文件大小：311K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IP4359CX4
Dual channel low capacitance high performance ESD
protection
Rev. 1 — 6 August 2010
Product data sheet
1. Product profile
1.1 General description
The IP4359CX4 is a dual channel low capacitance ElectroStatic Discharge (ESD)
protection device, providing protection to downstream components from ESD voltages as
high as ±15 kV contact discharge and > ±15 kV air discharge according the
IEC 61000-4-2 model, far exceeding standard level 4.
The device is optimized for protection of high speed interfaces such as Universal Serial
Bus (USB) 2.0, High Definition Multimedia Interface (HDMI), Digital Visual Interface (DVI)
and other interfaces requiring very low capacitance ESD protection.
The device is available in two different heights. 0.61 mm and reduced maximum height of
0.5 mm. Both versions contain identical circuits and show an identical electrical
performance. Both ESD protection channels share common ground connections, but are
electrically separated, thereby preventing current back drive into the adjacent channel.
IP4359CX4 is fabricated using monolithic silicon technology in a single Wafer-Level
Chip-Scale Package (WLCSP). These features make the IP4359CX4 ideal for use in
applications requiring component miniaturization such as mobile phone handsets and
other portable electronic devices.
1.2 Features and benefits
Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)
2 ultra low input capacity rail-to-rail ESD protection diodes with C(I/O-GND) = 1.3 pF
Rdyn = 0.45 Ω
Integrated ESD protection withstanding ±15 kV contact discharge and > ±15 kV air
discharge, far exceeding IEC 61000-4-2 level 4
Standard height version (0.61 mm) available as IP4359CX4/LF
Reduced height version (maximum height of 0.5 mm) available as
IP4359CX4/LF-H500
2 × 2 solder ball WLCSP with 0.4 mm pitch
1.3 Applications
High-speed interface ESD protection such as USB 2.0, HDMI, DVI etc.
Interfaces with special requirements on low capacitive ESD protection
Interfaces requiring separation of the positive clamping voltage/current path
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
2. Pinning information
Table 1.
Pin
Pinning
Description
Simplified outline
Graphic symbol
A1 and A2
B1 and B2
ESD protection
ground
bump A1
index area
1
2
A1
A2
A
B
B1
B2
008aaa239
008aaa236
transparent top view,
solder balls facing down
3. Ordering information
Table 2.
Ordering information
Type number
Package height Package
Name
Description
Version
IP4359CX4/LF
standard[1]
reduced[2]
WLCSP4 wafer level chip-size package; 4 bumps (2 × 2)
WLCSP4 wafer level chip-size package; 4 bumps (2 × 2)
IP4359CX4
IP4359CX4
IP4359CX4/LF-H500
[1] For details see Table 5.
[2] For details see Table 6.
IP4359CX4
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 6 August 2010
2 of 12
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VI
Parameter
Conditions
Min Max Unit
−0.5 +5.5
input voltage
pins A1 and A2 to ground (B1, B2)
pins A1 and A2 to ground (B1, B2)
contact discharge
V
VESD
electrostatic discharge
voltage
[1]
[1]
−15 +15 kV
−20 +20 kV
air discharge
IEC 61000-4-2 level 4;
pins A1 and A2 to ground (B1, B2)
contact discharge
air discharge
−8
+8
kV
−15 +15 kV
−55 +150 °C
Tstg
storage temperature
Treflow(peak) peak reflow temperature 10 s maximum
Tamb ambient temperature
-
260 °C
−35 +85 °C
[1] Device is qualified with 1000 pulses of ±15 kV contact discharges each, according to the IEC61000-4-2
model and far exceeds the specified level 4 (8 kV contact discharge).
5. Characteristics
Table 4.
Electrical characteristics
Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min Typ Max Unit
[1]
C(I/O-GND) input/output to ground
capacitance
pins A1 and A2 to ground (B1,
B2); VI = 3.3 V; f = 1 MHz
-
1.3 1.5
pF
ILR
reverse leakage current pins A1 and A2 to ground (B1,
B2); VI = 3.3 V
-
-
100 nA
VBRzd
Zener diode breakdown Itest = 1 mA
voltage
6
-
-
9
-
V
V
VF
forward voltage
0.7
Rdyn
dynamic resistance
Itest = 1 A; IEC 61000-4-5
positive discharge
-
-
0.45 -
0.45 -
Ω
Ω
negative discharge
[1] Guaranteed by design.
IP4359CX4
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 6 August 2010
3 of 12
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
6. Application information
6.1 Insertion loss
The IP4359CX4 is mainly designed as an ESD protection device for high speed interfaces
such as USB 2.0, DVI and HDMI high speed data lines etc. The insertion loss
measurement configuration of a typical 50 Ω NetWork Analyzer (NWA) system for
evaluation of the IP4359CX4 is shown in Figure 1.
The insertion loss of IP4359CX4 is depicted in Figure 2.
IN
OUT
DUT
50 Ω
50 Ω
TEST BOARD
V
gen
001aai755
Fig 1. Frequency response measurement configuration
008aaa237
5
s
21
(dB)
−5
−15
−25
−35
−1
2
3
4
10
1
10
10
10
10
f (MHz)
Pin A1 and pin A2 to ground.
Fig 2. Measured insertion loss magnitude
IP4359CX4
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 6 August 2010
4 of 12
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
6.2 Crosstalk
The crosstalk measurement configuration of a typical 50 Ω NWA system for evaluation of
the IP4359CX4 is shown in Figure 3.
The crosstalk measurement results of IP4359CX4 are depicted in Figure 4.
IN_1
IN_2
OUT_2
OUT_1
DUT
50 Ω
50 Ω
TEST BOARD
50 Ω
50 Ω
V
gen
001aai756
Fig 3. Crosstalk measurement configuration
008aaa238
0
α
ct
(dB)
−20
−40
−60
−80
−100
2
3
4
1
10
10
10
10
f (MHz)
Pin A1 to pin A2.
Fig 4. Measured crosstalk between different channels
IP4359CX4
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 6 August 2010
5 of 12
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
7. Package outline
WLCSP4: wafer level chip-size package; 4 bumps (2 x 2)
D
bump A1
index area
A
A
2
E
A
1
detail X
e
b
B
A
e
1
2
X
European
projection
wlcsp4_2x2_po
Fig 5. Package outline IP4359CX4 (WLCSP4)
Table 5.
Dimensions of IP4359CX4/LF for Figure 5
Symbol
Min
0.57
0.18
0.39
0.21
0.71
0.71
-
Typ
0.61
0.20
0.41
0.26
0.76
0.76
0.4
Max
0.65
0.22
0.43
0.31
0.81
0.81
-
Unit
mm
mm
mm
mm
mm
mm
mm
A
A1
A2
b
D
E
e
IP4359CX4
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 6 August 2010
6 of 12
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
Table 6.
Dimensions of IP4359CX4/LF-H500 for Figure 5
Symbol
Min
0.41
0.18
0.23
0.21
0.71
0.71
-
Typ
0.45
0.20
0.25
0.26
0.76
0.76
0.4
Max
0.49
0.22
0.27
0.31
0.81
0.81
-
Unit
mm
mm
mm
mm
mm
mm
mm
A
A1
A2
b
D
E
e
8. Design and assembly recommendations
8.1 PCB design guidelines
For optimum performance it is recommended to use a Non-Solder Mask Defined (NSMD),
also known as a copper-defined design, incorporating laser-drilled micro-vias connecting
the ground pads to a buried ground-plane layer. This results in the lowest possible ground
inductance and provides the best high frequency and ESD performance. For this case,
refer to Table 7 for the recommended PCB design parameters.
Table 7.
Recommended PCB design parameters
Parameter
Value or specification
250 μm
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
100 μm (0.004 inch)
325 μm
20 μm to 40 μm
AuNi or OSP
FR4
PCB material
8.2 PCB assembly guidelines for Pb-free soldering
Table 8.
Assembly recommendations
Parameter
Value or specification
290 μm
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder / flux ratio
100 μm (0.004 inch)
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
50 / 50
Solder reflow profile
see Figure 6
IP4359CX4
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 6 August 2010
7 of 12
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
T
(°C)
reflow(peak)
250
T
230
217
cooling rate
pre-heat
t (s)
t
t
2
1
t
3
t
4
t
5
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 6. Pb-free solder reflow profile
Table 9.
Symbol
Characteristics
Parameter
Conditions
Min Typ Max Unit
Treflow(peak) peak reflow temperature
230
60
-
-
-
-
-
-
-
-
-
260 °C
t1
time 1
soak time
180
30
s
t2
time 2
time during T ≥ 250 °C
time during T ≥ 230 °C
time during T > 217 °C
s
t3
time 3
10
30
-
50
s
t4
time 4
150
540
−6
s
t5
time 5
s
dT/dt
rate of change of temperature
cooling rate
pre-heat
-
°C/s
2.5
4.0 °C/s
IP4359CX4
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 6 August 2010
8 of 12
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
9. Abbreviations
Table 10. Abbreviations
Acronym
DUT
Description
Device Under Test
DVI
Digital Visual Interface
ESD
ElectroStatic Discharge
FR4
Flame Retard 4
HDMI
IEC
High Definition Multimedia Interface
International Electrotechnical Commission
Non-Solder Mask Defined
NetWork Analyzer
NSMD
NWA
OSP
Organic Solderability Preservative
Printed-Circuit Board
PCB
RoHS
USB
Restriction of Hazardous Substances
Universal Serial Bus
WLCSP
Wafer-Level Chip-Scale Package
10. Revision history
Table 11. Revision history
Document ID
Release date
20100806
Data sheet status
Change notice
Supersedes
IP4359CX4 v.1
Product data sheet
-
-
IP4359CX4
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 6 August 2010
9 of 12
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
11.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
11.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
IP4359CX4
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 6 August 2010
10 of 12
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4359CX4
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 6 August 2010
11 of 12
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
6.1
6.2
Application information. . . . . . . . . . . . . . . . . . . 4
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
8
8.1
8.2
Design and assembly recommendations . . . . 7
PCB design guidelines . . . . . . . . . . . . . . . . . . . 7
PCB assembly guidelines for Pb-free
soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
9
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 6 August 2010
Document identifier: IP4359CX4
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