ISP1104 [NXP]
Advanced Universal Serial Bus transceiver; 高级通用串行总线收发器
| 型号： | ISP1104 |
| 厂家： | 
NXP |
| 描述： | Advanced Universal Serial Bus transceiver |
| 文件： | 总19页 (文件大小：454K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ISP1104
Advanced Universal Serial Bus transceiver
Rev. 02 — 14 October 2003
Product data
1. General description
The ISP1104 Universal Serial Bus (USB) transceiver is compliant with the Universal
Serial Bus Specification Rev. 2.0. The ISP1104 can transmit and receive USB data at
full-speed (12 Mbit/s). It allows single and differential input modes selectable by a
MODE input.
It allows USB Application Specific Integrated Circuits (ASICs) and Programmable
Logic Devices (PLDs) with power supply voltages from 1.65 V to 3.6 V to interface
with the physical layer of the USB. It has an integrated 5 V-to-3.3 V voltage regulator
for direct powering via the USB supply line VBUS. It has an integrated voltage detector
to detect the presence of the VBUS line voltage (VCC(5.0)). When VBUS (VCC(5.0)) is lost,
the D+ and D− pins can be shared with other serial protocols.
The ISP1104 is available in HBCC16 package.
The ISP1104 is ideal for use in portable electronic devices, such as mobile phones,
digital still cameras, personal digital assistants and information appliances.
2. Features
■ Complies with Universal Serial Bus Specification Rev. 2.0
■ Supports full-speed (12 Mbit/s) serial data rate
■ Integrated 5 V-to-3.3 V voltage regulator for powering via USB line VBUS
■ VBUS voltage presence indication on pin VBUSDET
■ Used as USB device transceiver or USB transceiver
■ Stable RCV output during single-ended zero (SE0) condition
■ Two single-ended receivers with hysteresis
■ Low-power operation
■ Supports I/O voltage range from 1.65 V to 3.6 V
■ ±12 kV ESD protection at pins D+, D-, VCC(5.0) and GND
■ Full industrial operating temperature range from −40 °C to +85 °C
■ Available in HBCC16 lead-free and halogen-free package.
3. Applications
■ Portable electronic devices, such as:
◆ Mobile phone
◆ Digital Still Camera (DSC)
◆ Personal Digital Assistant (PDA)
◆ Information Appliance (IA).
ISP1104
Advanced USB transceiver
Philips Semiconductors
4. Ordering information
Table 1:
Ordering information
Package
Type
number
Name
Description
Version
ISP1104W HBCC16
plastic thermal enhanced bottom chip carrier;
SOT639-2
16 terminals; body 3 × 3 × 0.65 mm
5. Block diagram
3.3 V
VOLTAGE
REGULATOR
V
V
CC(I/O)
CC(5.0)
reg(3.3)
V
V
pu(3.3)
VBUSDET
SOFTCON
OE
1.5 kΩ
33 Ω (1%)
D+
D−
33 Ω (1%)
MODE
(1)
VMO/FSE0
LEVEL
SHIFTER
(1)
VPO/VO
ISP1104
SUSPND
RCV
VP
VM
GND
004aaa035
(1) Pin function depends on the device function, see Section 7.2.
Fig 1. Block diagram.
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Product data
Rev. 02 — 14 October 2003
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ISP1104
Advanced USB transceiver
Philips Semiconductors
6. Pinning information
6.1 Pinning
6
7
8
D−
SUSPND
5
9
D+
VM
VP
4
3
2
10
11
12
ISP1104W
VPO/VO
VMO/FSE0
GND
(exposed diepad)
RCV
V
13
1
16
15
14
reg(3.3)
OE
Bottom view
004aaa036
Fig 2. Pin configuration HBCC16.
6.2 Pin description
Table 2:
Symbol[1]
Pin description
Pin
Type
Description
OE
1
I
input for output enable (CMOS level with respect to
VCC(I/O), active LOW); enables the transceiver to transmit
data on the USB bus
input pad; push pull; CMOS
RCV
2
3
O
O
differential data receiver output (CMOS level with respect
to VCC(I/O)); driven LOW when input SUSPND is HIGH;
the output state of RCV is preserved and stable during an
SE0 condition
output pad; push pull; 4 mA output drive; CMOS
VP
single-ended D+ receiver output (CMOS level with
respect to VCC(I/O)); for external detection of SE0, error
conditions and speed of connected device; driven HIGH
when no supply voltage is connected to VCC(5.0) and
Vreg(3.3)
output pad; push pull; 4 mA output drive; CMOS
VM
4
O
single-ended D− receiver output (CMOS level with
respect to VCC(I/O)); for external detection of SE0, error
conditions and speed of connected device; driven HIGH
when no supply voltage is connected to VCC(5.0) and
Vreg(3.3)
output pad; push pull; 4 mA output drive; CMOS
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Product data
Rev. 02 — 14 October 2003
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ISP1104
Advanced USB transceiver
Philips Semiconductors
Table 2:
Pin description…continued
Symbol[1]
Pin
Type
Description
SUSPND
5
I
suspend input (CMOS level with respect to VCC(I/O)); a
HIGH level enables low-power state while the USB bus is
inactive and drives output RCV to a LOW level
input pad; push pull; CMOS
MODE
6
I
mode input (CMOS level with respect to VCC(I/O)); a HIGH
level enables the differential input mode (pins VPO and
VMO) whereas a LOW level enables a single-ended input
mode (pins VO and FSE0); see Table 4 and Table 5
input pad; push pull; CMOS
VCC(I/O)
7
8
-
supply voltage for digital I/O pins (1.65 V to 3.6 V); when
VCC(I/O) is not connected, the pins D+ and D− are in
three-state; this supply pin is totally independent of
VCC(5.0) and Vreg(3.3) and must never exceed the Vreg(3.3)
voltage
VBUSDET
O
VBUS indicator output (CMOS level with respect to
VCC(I/O)); when VBUS > 4.1 V, then VBUSDET = HIGH and
when VBUS < 3.6 V, then VBUSDET = LOW
output pad; push pull; 4 mA output drive; CMOS
D−
D+
9
AI/O
AI/O
negative USB data bus connection (analog, differential)
10
positive USB data bus connection (analog, differential);
connect a 1.5 kΩ resistor to pin Vpu(3.3)
VPO/VO
11
I
I
driver data input (CMOS level with respect to VCC(I/O)
Schmitt trigger); see Table 4 and Table 5
,
input pad; push pull; CMOS
VMO/FSE0 12
driver data input (CMOS level with respect to VCC(I/O)
Schmitt trigger); see Table 4 and Table 5
,
input pad; push pull; CMOS
Vreg(3.3)
VCC(5.0)
Vpu(3.3)
13
14
15
-
-
-
regulated supply voltage output (3.0 V to 3.6 V); a
decoupling capacitor of at least 0.1 µF is required
supply voltage input (4.0 V to 5.5 V); can be connected
directly to the USB supply line VBUS
pull-up supply voltage (3.3 V ± 10 %); connect an external
1.5 kΩ resistor on pin D+ (full-speed); pin function is
controlled by input SOFTCON
SOFTCON = LOW — Vpu(3.3) floating (high impedance);
ensures zero pull-up current
SOFTCON = HIGH — Vpu(3.3) = 3.3 V; internally
connected to Vreg(3.3)
SOFTCON 16
I
software controlled USB connection input; a HIGH level
applies 3.3 V to pin Vpu(3.3), which is connected to an
external 1.5 kΩ pull-up resistor; this allows USB connect
or disconnect signalling to be controlled by software
input pad; push pull; CMOS
GND
exposed -
die pad
ground supply; down bonded to the exposed die pad
(heatsink); to be connected to the PCB ground
[1] Symbol names with an overscore (for example, NAME) indicate active LOW signals.
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Product data
Rev. 02 — 14 October 2003
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ISP1104
Advanced USB transceiver
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7. Functional description
7.1 Function selection
Table 3:
Function table
SUSPND OE
D+ and D−
RCV
VP/VM
Function
L
L
driving/
active
active
normal driving
receiving
(differential receiver active)
L
H
L
receiving[1]
active
inactive[2] active
active
receiving
H
driving
driving during ‘suspend’
(differential receiver inactive)
H
H
high-Z[1]
inactive[2] active
low-power state
[1] Signal levels on pins D+ and D− are determined by other USB devices and external pull-up or
pull-down resistors.
[2] In the suspend mode (pin SUSPND = HIGH), the differential receiver is inactive and the output RCV is
always LOW. Out-of-suspend (K) signalling is detected via the single-ended receivers VP and VM.
7.2 Operating functions
Table 4:
Driving function using single-ended input data interface (pin OE = L and
pin MODE = L)
FSE0
VO
L
Data
L
differential logic 0
differential logic 1
SE0
L
H
L
H
H
H
SE0
Table 5:
Driving function using differential input data interface (pin OE = L and
pin MODE = H)
VMO
VPO
L
Data
L
SE0
L
H
differential logic 1
differential logic 0
illegal state
H
H
L
H
Table 6:
Receiving function (pin OE = H)
RCV
D+ and D−
VP[1]
VM[1]
differential logic 0
differential logic 1
SE0
L
L
H
L
H
L
L
H
RCV*[2]
[1] VP = VM = H indicates the sharing mode (VCC(5.0) is disconnected).
[2] RCV* denotes the signal level on output RCV just before the SE0 state occurs. This level is stable
during the SE0 period.
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Product data
Rev. 02 — 14 October 2003
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ISP1104
Advanced USB transceiver
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7.3 Power supply configurations
The ISP1104 can be used with different power supply configurations, which can be
changed dynamically. Table 8 provides an overview of power supply configurations.
Normal mode — Both VCC(I/O) and VCC(5.0) are connected. For 5 V operation,
VCC(5.0) is connected to a 5 V source (4.0 V to 5.5 V). The internal voltage regulator
then produces 3.3 V for USB connections. VCC(I/O) is independently connected to a
voltage source (1.65 V to 3.6 V), depending on the supply voltage of the external
circuit.
Disable mode — VCC(I/O) is not connected and VCC(5.0) is connected. In this mode,
the internal circuits of the ISP1104 ensure that the D+ and D− pins are in three-state
and the power consumption drops to the low-power (suspended) state level. Some
hysteresis is built into the detection of VCC(I/O) lost.
Sharing mode — VCC(I/O) is connected and VCC(5.0) < 3.6 V to differentiate between
the USB mode and other modes when sharing the VBUS. In this mode, pins D+ and
D− are made three-state and the ISP1104 allows external signals of up to 3.6 V to
share the D+ and D− lines. The internal circuits of the ISP1104 ensure that virtually
no current (maximum 10 µA) is drawn via the D+ and D− lines. The power
consumption through pin VCC(I/O) and pin VCC(5.0) drops to the low-power (suspended)
state level. Pins VP and VM are driven HIGH and pins VBUSDET and RCV are driven
LOW to indicate this mode. Some hysteresis is built into the detection of VCC(5.0) lost.
Table 7:
Pin
Pin states in disable or sharing mode
Disable mode
5 V input
Sharing mode
VCC(5.0)
Vreg(3.3)
VCC(I/O)
Vpu(3.3)
D+, D−
VP, VM
RCV
<3.6 V
3.3 V output
not present
pulled-down
1.65 V to 3.6 V input
high impedance (off)
high impedance (off)
high impedance
invalid[1]
invalid[1]
high impedance
H
L
VBUSDET
invalid[1]
L
VPO/VO, VMO/FSE0, MODE,
SUSPND, OE, SOFTCON
high impedance
high impedance
[1] High impedance or driven LOW.
Table 8:
VCC(5.0)
Power supply configuration overview
VCC(I/O)
Configuration
Special characteristics
connected
connected
connected
normal mode
-
not connected disable mode
D+, D− and Vpu(3.3) high impedance;
VP, VM, RCV: invalid[1][2]
not connected connected
or <3.6 V
sharing mode
D+, D− and Vpu(3.3) high impedance;
VP, VM driven HIGH; RCV driven
LOW; VBUSDET driven LOW; Vreg(3.3)
pulled-down
[1] High impedance or driven LOW.
[2] Vreg(3.3) may not be operational.
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Product data
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ISP1104
Advanced USB transceiver
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8. Electrostatic discharge (ESD)
8.1 ESD protection
The pins that are connected to the USB connector (D+, D−, VCC(5.0) and GND) have a
minimum of ±12 kV ESD protection. The ±12 kV measurement is limited by the test
equipment. Capacitors of 4.7 µF connected from Vreg(3.3) to GND and VCC(5.0) to GND
are required to achieve this ±12 kV ESD protection (see Figure 3).
The ISP1104 can withstand ±12 kV using the Human Body Model and ±5 kV using
the Contact Discharge Method as specified in IEC 61000-4-2.
R
R
C
D
1 MΩ
1500 Ω
charge current
limit resistor
discharge
resistance
DEVICE UNDER
TEST
V
A
CC(5.0)
V
reg(3.3)
HIGH VOLTAGE
DC SOURCE
B
C
S
storage
capacitor
4.7 µF
4.7 µF
100 pF
GND
004aaa145
Fig 3. Human Body ESD test model.
8.2 ESD test conditions
A detailed report on test set-up and results is available on request.
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Product data
Rev. 02 — 14 October 2003
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ISP1104
Advanced USB transceiver
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9. Limiting values
Table 9:
Absolute maximum ratings
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC(5.0)
VCC(I/O)
VI
Parameter
Conditions
Min
−0.5
−0.5
−0.5
-
Max
Unit
V
supply voltage
+6.0
I/O supply voltage
DC input voltage
latch-up current
+4.6
V
VCC(I/O) + 0.5
100
V
Ilu
VI = −1.8 V to +5.4 V
mA
V
[1][2]
Vesd
electrostatic discharge voltage
on pins D+, D−, VCC(5.0)
and GND; ILI < 1 µA
−12000
+12000
on other pins; ILI < 1 µA
−2000
−40
+2000
+125
V
Tstg
storage temperature
°C
[1] Testing equipment limits measurement to only ±12 kV. Capacitors needed on VCC(5.0) and Vreg(3.3) (see Section 8).
[2] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).
10. Recommended operating conditions
Table 10: Recommended operating conditions
Symbol
VCC(5.0)
VCC(I/O)
VI
Parameter
Conditions
Min
4.0
1.65
0
Typ
Max
5.5
Unit
V
supply voltage
5.0
I/O supply voltage
input voltage
-
-
-
-
3.6
V
VCC(I/O)
3.6
V
VI(AI/O)
Tamb
input voltage on AI/O pins
ambient temperature
pins D+ and D−
0
V
−40
+85
°C
11. Static characteristics
Table 11: Static characteristics: supply pins
VCC(5.0) = 4.0 V to 5.5 V; VCC(I/O) = 1.65 V to 3.6 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
regulated supply voltage output internal regulator option;
load ≤ 300 µA
Conditions
Min
Typ
Max
Unit
[1][2]
[3]
Vreg(3.3)
3.0
3.3
3.6
V
I
ICC
operating supply current
transmitting and receiving at
12 Mbit/s; CL = 50 pF on
pins D+ and D−
-
4
8
mA
[3]
[4]
ICC(I/O)
ICC(idle)
operating I/O supply current
transmitting and receiving at
12 Mbit/s
-
-
1
-
2
mA
supply current during full-speed idle: VD+ > 2.7 V, VD− < 0.3 V;
500
µA
idle and SE0
SE0: VD+ < 0.3 V, VD− < 0.3 V
idle, SE0 or suspend
SUSPND = H
ICC(I/O)(static)
ICC(susp)
static I/O supply current
suspend supply current
-
-
-
-
-
-
20
µA
µA
µA
[4]
[4]
100
100
ICC-I/O(dis)
disable current from VCC to
VCC(I/O)
VCC(I/O) not connected
ICC(I/O)(sharing) sharing mode I/O supply current VCC(5.0) not connected
-
-
20
µA
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Product data
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ISP1104
Advanced USB transceiver
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Table 11: Static characteristics: supply pins…continued
VCC(5.0) = 4.0 V to 5.5 V; VCC(I/O) = 1.65 V to 3.6 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IDx(sharing)
sharing mode load current on
VCC(5.0) not connected;
-
-
10
µA
pins D+ and D−
SOFTCON = L; VDx = 3.6 V
VCC(5.0)th
supply voltage detection
threshold
1.65 V ≤ VCC(I/O) ≤ 3.6 V
supply lost
-
-
3.6
V
supply present
4.1
-
-
-
-
V
VCC(5.0)hys
VCC(I/O)th
supply voltage detection
hysteresis
VCC(I/O) = 1.8 V
70
mV
I/O supply voltage detection
threshold
Vreg(3.3) = 2.7 V to 3.6 V
supply lost
-
-
0.5
V
V
V
supply present
Vreg(3.3) = 3.3 V
1.4
-
-
-
-
VCC(I/O)hys
I/O supply voltage detection
hysteresis
0.45
[1] Iload includes the pull-up resistor current via pin Vpu(3.3)
[2] The minimum voltage is 2.7 V in the suspend mode.
[3] Characterized only, not tested in production.
.
[4] Excluding any load current and Vpu(3.3) or Vsw source current to the 1.5 kΩ and 15 kΩ pull-up and pull-down resistors (200 µA typ.).
Table 12: Static characteristics: digital pins
VCC(I/O) = 1.65 V to 3.6 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCC(I/O) = 1.65 V to 3.6 V
Input levels
VIL
LOW-level input voltage
-
-
-
0.3VCC(I/O)
-
V
V
VIH
HIGH-level input voltage
LOW-level output voltage
HIGH-level output voltage
0.6VCC(I/O)
Output levels
VOL
IOL = 100 µA
IOL = 2 mA
-
-
-
-
-
-
0.15
V
V
V
V
0.4
VOH
IOH = 100 µA
IOH = 2 mA
V
CC(I/O) − 0.15
CC(I/O) − 0.4
-
-
V
Leakage current
[1]
ILI
input leakage current
−1
-
-
+1
µA
Capacitance
CIN
input capacitance
pin to GND
-
10
pF
Example 1: VCC(I/O) = 1.8 V ± 0.15 V
Input levels
VIL
LOW-level input voltage
HIGH-level input voltage
-
-
-
0.5
-
V
V
VIH
1.2
Output levels
VOL
LOW-level output voltage
IOL = 100 µA
-
-
-
-
0.15
0.4
V
V
IOL = 2 mA
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Product data
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ISP1104
Advanced USB transceiver
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Table 12: Static characteristics: digital pins…continued
VCC(I/O) = 1.65 V to 3.6 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
IOH = 100 µA
IOH = 2 mA
Min
1.5
Typ
Max
Unit
V
VOH
HIGH-level output voltage
-
-
-
-
1.25
V
Example 2: VCC(I/O) = 2.5 V ± 0.2 V
Input levels
VIL
LOW-level input voltage
HIGH-level input voltage
-
-
-
0.7
-
V
V
VIH
1.7
Output levels
VOL
LOW-level output voltage
HIGH-level output voltage
IOL = 100 µA
IOL = 2 mA
-
-
-
-
-
0.15
V
V
V
V
-
0.4
VOH
IOH = 100 µA
IOH = 2 mA
2.15
1.9
-
-
Example 3: VCC(I/O) = 3.3 V ± 0.3 V
Input levels
VIL
LOW-level input voltage
HIGH-level input voltage
-
-
-
0.9
-
V
V
VIH
2.15
Output levels
VOL
LOW-level output voltage
HIGH-level output voltage
IOL = 100 µA
IOL = 2 mA
-
-
-
-
-
0.15
V
V
V
V
-
0.4
VOH
IOH = 100 µA
IOH = 2 mA
2.85
2.6
-
-
[1] If VCC(I/O) ≥ Vreg(3.3), then the leakage current will be higher than the specified value.
Table 13: Static characteristics: analog I/O pins D+ and D−
VCC(5.0) = 4.0 V to 5.5 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Input levels
Differential receiver
VDI
differential input sensitivity
|VI(D+) − VI(D−)
|
0.2
0.8
-
-
-
V
V
VCM
differential common mode
voltage
includes VDI range
2.5
Single-ended receiver
VIL
LOW-level input voltage
-
-
-
-
0.8
-
V
V
V
VIH
HIGH-level input voltage
hysteresis voltage
2.0
0.4
Vhys
0.7
Output levels
VOL
VOH
LOW-level output voltage
HIGH-level output voltage
RL = 1.5 kΩ to +3.6 V
RL = 15 kΩ to GND
-
-
-
0.3
3.6
V
V
[1]
2.8
Leakage current
ILZ
OFF-state leakage current
−1
-
+1
µA
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Product data
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ISP1104
Advanced USB transceiver
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Table 13: Static characteristics: analog I/O pins D+ and D−…continued
VCC(5.0) = 4.0 V to 5.5 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Capacitance
CIN
Parameter
Conditions
Min
Typ
Max
Unit
transceiver capacitance
pin to GND
-
-
20
pF
Resistance
ZDRV
[2]
driver output impedance
input impedance
steady-state drive
34
10
-
39
-
44
-
Ω
ZINP
MΩ
Ω
RSW
internal switch resistance at
pin Vpu(3.3)
-
10
Termination
[3][4]
VTERM
termination voltage for
3.0
-
3.6
V
upstream port pull-up (Rpu)
[1] VOH(min) = Vreg(3.3) − 0.2 V.
[2] Includes external resistors of 33 Ω ±1 % on both pins D+ and D−.
[3] This voltage is available at pins Vreg(3.3) and Vpu(3.3)
.
[4] The minimum voltage is 2.7 V in the suspend mode.
12. Dynamic characteristics
Table 14: Dynamic characteristics: analog I/O pins D+ and D−
VCC(5.0) = 4.0 V to 5.5 V; VCC(I/O) = 1.65 V to 3.6 V; VGND = 0 V; Tamb = −40 °C to +85 °C; see Figure 8; unless otherwise
specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Driver characteristics
tFR
rise time
CL = 50 pF to 125 pF;
10 % to 90 % of |VOH − VOL|;
see Figure 4
4
-
20
ns
tFF
fall time
CL = 50 pF to 125 pF;
90 % to 10 % of |VOH − VOL|;
see Figure 4
4
-
20
ns
FRFM
VCRS
differential rise/fall time
excluding the first transition
from idle state
90
-
-
111.1
2.0
%
V
matching (tFR/tFF
)
[1]
output signal crossover
voltage
excluding the first transition
from idle state; see Figure 5
1.3
Driver timing
tPLH(drv)
driver propagation delay
(VPO/VO, VMO/FSE0 to
D+, D−)
LOW-to-HIGH; see Figure 5
HIGH-to-LOW; see Figure 5
-
-
-
-
18
18
ns
ns
tPHL(drv)
driver propagation delay
(VPO/VO, VMO/FSE0 to
D+, D−)
tPHZ
tPLZ
driver disable delay (OE to
D+, D−)
HIGH-to-OFF; see Figure 6
LOW-to-OFF; see Figure 6
-
-
-
-
15
15
ns
ns
driver disable delay
(OE to D+, D−)
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Table 14: Dynamic characteristics: analog I/O pins D+ and D−…continued
VCC(5.0) = 4.0 V to 5.5 V; VCC(I/O) = 1.65 V to 3.6 V; VGND = 0 V; Tamb = −40 °C to +85 °C; see Figure 8; unless otherwise
specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tPZH
driver enable delay
OFF-to-HIGH; see Figure 6
-
-
15
ns
(OE to D+, D−)
tPZL
driver enable delay
OFF-to-LOW; see Figure 6
-
-
15
ns
(OE to D+, D−)
Receiver timings
Differential receiver
tPLH(rcv)
propagation delay
(D+, D− to RCV)
LOW-to-HIGH; see Figure 7
HIGH-to-LOW; see Figure 7
-
-
-
-
15
15
ns
ns
tPHL(rcv)
propagation delay
(D+, D− to RCV)
Single-ended receiver
tPLH(se) propagation delay
LOW-to-HIGH; see Figure 7
HIGH-to-LOW; see Figure 7
-
-
-
-
18
18
ns
ns
(D+, D− to VP, VM)
tPHL(se)
propagation delay
(D+, D− to VP, VM)
[1] Characterized only, not tested. Limits guaranteed by design.
1.65 V
logic input 0.9 V
0.9 V
t
, t
t
, t
0 V
OH
FR LR
FF LF
t
t
PHL(drv)
V
PLH(drv)
OH
90 %
90 %
V
differential
data lines
V
V
CRS
CRS
10 %
10 %
V
V
OL
OL
MGS963
MGS964
Fig 4. Rise and fall times.
Fig 5. Timing of VPO/VO and VMO/FSE0 to D+ and D−.
2.0 V
1.65 V
differential
data lines
V
V
CRS
CRS
0.9 V
logic input 0.9 V
0 V
0.8 V
t
t
PLH(rcv)
PLH(se)
PHL(rcv)
t
t
t
t
PHZ
PLZ
PZH
PZL
t
t
PHL(se)
V
OH
V
OH
V
−0.3 V
OH
differential
data lines
0.9 V
0.9 V
logic output
V
CRS
V
+0.3 V
OL
V
V
OL
MGS966
OL
MGS965
Fig 6. Timing of OE to D+ and D−.
Fig 7. Timing of D+ and D− to RCV, VP and VM.
9397 750 11229
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Product data
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ISP1104
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13. Test information
V
pu(3.3)
test point
1.5 kΩ
33 Ω
D.U.T.
D+/D−
004aaa037
C
L
15 kΩ
Load capacitance CL = 50 pF (minimum or maximum timing).
Fig 8. Load on pins D+ and D−.
test point
33 Ω
500 Ω
D.U.T.
50 pF
V
MBL142
V = 0 V for tPZH and tPHZ
.
V = Vreg(3.3) for tPZL and tPLZ
.
Fig 9. Load on pins D+ and D− for enable and disable times.
test point
D.U.T.
25 pF
MGS968
Fig 10. Load on pins VM, VP and RCV.
9397 750 11229
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Product data
Rev. 02 — 14 October 2003
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ISP1104
Advanced USB transceiver
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14. Package outline
HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm
SOT639-2
b
v
M
M
C
C
A B
D
B
A
E
w
f
v
M
C
A
B
w
M
C
terminal 1
index area
b
1
b
3
v
M
M
C
C
A B
w
b
v
M
M
C
A B
2
w
C
detail X
e
1
C
D
h
e
y
y
C
1
5
9
e
e
4
E
e
h
2
1/2 e
4
1
13
16
A
X
1
1/2 e
3
A
2
e
3
A
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
A
A
b
E
e
e
w
b
b
b
D
D
E
e
e
3
e
f
v
y
y
1
UNIT
1
2
h
1
1
2
3
h
2
4
max.
0.10 0.7 0.33 0.33 0.38 0.38 3.1 1.45 3.1 1.45
0.05 0.6 0.27 0.27 0.32 0.32 2.9 1.35 2.9 1.35
0.23
0.17
mm
0.8
0.1 0.05 0.2
0.5
2.5
2.5 2.45 2.45
0.08
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
01-11-13
03-03-12
SOT639-2
MO-217
Fig 11. HBCC16 package outline.
9397 750 11229
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Product data
Rev. 02 — 14 October 2003
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ISP1104
Advanced USB transceiver
Philips Semiconductors
15. Packaging
The ISP1104W (HBCC16 package) is delivered on a type A carrier tape, see
Figure 12. The tape dimensions are given in Table 15.
The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not
designed for use in a baking process.
The cumulative tolerance of 10 successive sprocket holes is ±0.02 mm. The camber
must not exceed 1 mm in 100 mm.
i
4
A0
K0
W
B0
P1
Type A
direction of feed
A0
K0
4
W
B0
elongated
sprocket hole
P1
direction of feed
MLC338
Type B
Fig 12. Carrier tape dimensions.
Table 15: Type A carrier tape dimensions for the ISP1104W
Dimension
Value
3.3
Unit
mm
mm
mm
mm
mm
A0
B0
K0
P1
W
3.3
1.1
8.0
12.0 ± 0.3
9397 750 11229
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Product data
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Advanced USB transceiver
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16. Additional soldering information
16.1 (H)BCC packages: footprint
The surface material of the terminals on the resin protrusion consists of a 4-layer
metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1 µm min.) ensures
solderability, the Ni layer (5 µm min.) prevents diffusion, and the Pd layer on top
(0.5 µm min.) ensures effective wire bonding.
Terminal
PCB land
Solder resist mask
Stencil mask
All dimensions in mm
Solder land
Normal
0.05
0.05
b
1
b
1
Solder resist
Solder stencil
b
b
0.05
0.05
For exact dimensions
see package outline
drawing (SOT639-2)
Corner
0.05
0.05
b
b
2
2
b
b
2
2
0.05
0.3 (8×)
0.05
Cavity
0.05
Stencil print thickness:
0.1 to 0.12 mm
0.1
(4×)
E
E
h
h
004aaa123
D
D
h
h
0.05
Cavity: exposed die pad, either functioning as heatsink or as ground connection; only for HBCC packages.
Fig 13. (H)BCC footprint and solder resist mask dimensions.
16.2 (H)BCC packages: reflow soldering profile
The conditions for reflow soldering of (H)BCC packages are as follows:
• Preheating time: minimum 90 s at T = 145 to 155 °C
• Soldering time: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183 °C
• Peak temperature:
– Ambient temperature: Tamb(max) = 260 °C
– Device surface temperature: Tcase(max) = 255 °C.
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Product data
Rev. 02 — 14 October 2003
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Advanced USB transceiver
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17. Revision history
Table 16: Revision history
Rev Date
CPCN
-
Description
02 20031014
Product data (9397 750 11229)
Modifications:
• Changed USB 1.1 reference to USB 2.0; also added data transfer rates
• Section 2: updated
• Figure 1, Figure 8 and Figure 9: removed the figure note on 33 Ω
• Table 2: updated the description for pin 8; added pad details
• Section 7.3 sharing mode: updated the first sentence
• Table 8: updated
• Table 9: added a table note
• Table 11: changed ICC(dis) to ICC-I/O(dis); also, changed the description
• Table 13: removed ZDRV2, and also the relevant (old) table note 3.
Product data (9397 750 09784)
01 20020826
-
9397 750 11229
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Product data
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ISP1104
Advanced USB transceiver
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18. Data sheet status
Level Data sheet status[1]
Product status[2][3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
[2]
Please consult the most recently issued data sheet before initiating or completing a design.
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19. Definitions
20. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.
Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
18 of 19
9397 750 11229
Product data
Rev. 02 — 14 October 2003
ISP1104
Advanced USB transceiver
Philips Semiconductors
Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 5
Function selection. . . . . . . . . . . . . . . . . . . . . . . 5
Operating functions. . . . . . . . . . . . . . . . . . . . . . 5
Power supply configurations. . . . . . . . . . . . . . . 6
7.1
7.2
7.3
8
8.1
8.2
Electrostatic discharge (ESD). . . . . . . . . . . . . . 7
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . 7
ESD test conditions . . . . . . . . . . . . . . . . . . . . . 7
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recommended operating conditions. . . . . . . . 8
Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . 11
Test information. . . . . . . . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
10
11
12
13
14
15
16
16.1
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17
Package related soldering information . . . . . . 17
16.2
16.3
16.4
16.5
17
17.1
17.2
Additional soldering information . . . . . . . . . . 19
(H)BCC packages: footprint . . . . . . . . . . . . . . 19
(H)BCC packages: reflow soldering profile. . . 19
18
19
20
21
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 21
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
© Koninklijke Philips Electronics N.V. 2003.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 14 October 2003
Document order number: 9397 750 11229
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