KMZ10B [NXP]

Magnetic field sensor; 磁科幻场传感器
KMZ10B
型号: KMZ10B
厂家: NXP    NXP
描述:

Magnetic field sensor
磁科幻场传感器

传感器 换能器 磁场传感器
文件: 总8页 (文件大小:71K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
book, halfpage  
KMZ10B  
Magnetic field sensor  
1998 Mar 31  
Product specification  
Supersedes data of 1996 Nov 08  
File under Discrete Semiconductors, SC17  
Philips Semiconductors  
Product specification  
Magnetic field sensor  
KMZ10B  
DESCRIPTION  
The KMZ10B is a sensitive magnetic field sensor,  
employing the magnetoresistive effect of thin-film  
permalloy. Its properties enable this sensor to be used in a  
wide range of applications for current and field  
measurement, revolution counters, angular or linear  
position measurement, proximity detectors, etc.  
H
y
handbook, halfpage  
H
x
PINNING  
1
2 3 4  
MGD806  
PIN  
SYMBOL  
DESCRIPTION  
1
2
3
4
+VO  
GND  
VO  
VCC  
output voltage  
ground  
output voltage  
supply voltage  
Fig.1 Simplified outline SOT195.  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
VCC  
Hy  
Hx  
S
bridge supply voltage  
magnetic field strength  
5
3
4
12  
+2  
V
2  
kA/m  
kA/m  
auxiliary field  
sensitivity  
mV V  
----------------  
kA m  
Rbridge  
Voffset  
bridge resistance  
offset voltage  
1.6  
2.6  
kΩ  
1.5  
+1.5  
mV/V  
CIRCUIT DIAGRAM  
MLC716  
1
2
3
4
+V  
GND  
–V  
V
O
O
CC  
Fig.2 Simplified circuit diagram.  
2
1998 Mar 31  
Philips Semiconductors  
Product specification  
Magnetic field sensor  
KMZ10B  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
bridge supply voltage  
CONDITIONS  
MIN.  
MAX.  
12  
UNIT  
VCC  
Ptot  
V
total power dissipation  
storage temperature  
up to Tamb = 130 °C  
120  
mW  
°C  
Tstg  
65  
40  
+150  
+150  
Tbridge  
bridge operating temperature  
°C  
MSA927  
150  
handbook, halfpage  
P
tot  
(mW)  
100  
50  
0
0
50  
100  
150  
o
T
amb  
( C)  
Fig.3 Power derating curve.  
1998 Mar 31  
3
Philips Semiconductors  
Product specification  
Magnetic field sensor  
KMZ10B  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
UNIT  
Rth j-a  
thermal resistance from junction to ambient  
180  
K/W  
CHARACTERISTICS  
Tamb = 25 °C; Hx = 3 kA/m; note 1.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VCC  
Hy  
S
bridge supply voltage  
magnetic field strength  
sensitivity  
5
V
2  
+2  
kA/m  
open circuit, notes 2 and 3 3.2  
4.8  
mV V  
----------------  
kA m  
TCVO  
temperature coefficient of  
output voltage  
VCC = 5 V;  
Tj = 25 to +125 °C  
0.4  
%/K  
IB = 3 mA;  
0.1  
%/K  
Tj = 25 to +125 °C  
Rbridge  
bridge resistance  
1.6  
2.6  
kΩ  
TCRbridge temperature coefficient of  
bridge resistance  
Tbridge = 25 to +125 °C  
Tj = 25 to +125 °C  
0.3  
%/K  
Voffset  
offset voltage  
1.5  
3  
+1.5  
mV/V  
TCVoffset offset voltage drift  
+3  
µ V V  
---------------  
K
FL  
linearity deviation of output  
voltage  
Hy = 0 to ±1 kA/m  
Hy = 0 to ±1.6 kA/m  
Hy = 0 to ±2 kA/m  
0
±0.5  
±1.7  
±2  
% FS  
% FS  
% FS  
% FS  
MHz  
FH  
f
hysteresis of output voltage  
operating frequency  
0.5  
1
Notes  
1. In applications with Hx < 3 kA/m the sensor has to be reset before first operation by application of an auxiliary field  
Hx = 3 kA/m.  
2. No disturbing field (Hd) allowed; for stable operation under disturbing conditions see Fig.4 (SOAR) and see Fig.5 for  
decrease of sensitivity.  
(V O at Hy = 1.6 kA m) (VO at Hy = 0)  
3. S =  
.
---------------------------------------------------------------------------------------------------------------  
1.6 × VCC  
1998 Mar 31  
4
Philips Semiconductors  
Product specification  
Magnetic field sensor  
KMZ10B  
MGD802  
MGD803  
2
20  
H
d
(kA/m)  
S
(H )  
x
S
(3 kA/m)  
H
x
H
y
H
d
1
10  
safe operating  
area  
(1)  
H
> 1 kA/m  
(2)  
y
H
1 kA/m  
y
0
0
0
1
2
3
4
H
5
0
1
2
3
4
H
5
(kA/m)  
(kA/m)  
x
x
In applications with Hx < 3 kA/m, the sensor has to be reset,  
after leaving the SOAR, by an auxiliary field of Hx = 3 kA/m.  
(1) Region of permissible operation.  
In applications with Hx 3 kA/m, the sensor has to be  
reset by an auxiliary field of Hx = 3 kA/m before using.  
(2) Permissible extension if Hy < 1 kA/m.  
Fig.4 Safe Operating Area (permissible disturbing  
field Hd as a component of auxiliary field Hx).  
Fig.5 Relative sensitivity (ratio of sensitivity at  
certain Hx and sensitivity at Hx = 3 kA/m).  
MSA926  
max  
typ  
min  
8
V
o
(mV/V)  
4
0
4
8
2
1
0
1
2
H
(kA/m)  
y
VB = constant; Hx = 3 kA/m; Tamb = 25 °C; Voffset = 0.  
Fig.6 Sensor output characteristics.  
1998 Mar 31  
5
Philips Semiconductors  
Product specification  
Magnetic field sensor  
KMZ10B  
PACKAGE OUTLINE  
Plastic single-ended flat package; 4 in-line leads  
SOT195  
E
Q
b
1
A
chip  
D
L
1
L
1
2
3
4
e
b
1
p
c
e
0
1
4 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
L
1
UNIT  
b
b
c
e
e
Q
A
D
E
L
p
1
1
max.  
1.8  
1.6  
0.48  
0.40  
0.7  
0.5  
0.45  
0.39  
5.2  
5.0  
4.8  
4.4  
14.5  
12.7  
0.8  
0.7  
mm  
3.75  
1.25  
2
Notes  
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
SOT195  
97-06-02  
1998 Mar 31  
6
Philips Semiconductors  
Product specification  
Magnetic field sensor  
KMZ10B  
DEFINITIONS  
Data Sheet Status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1998 Mar 31  
7
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For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1998  
SCA58  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
115106/00/03/pp8  
Date of release: 1998 Mar 31  
Document order number: 9397 750 03639  

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