LPC11U22FBD48/301 [NXP]
RISC MICROCONTROLLER;
| 型号： | LPC11U22FBD48/301 |
| 厂家： | 
NXP |
| 描述： | RISC MICROCONTROLLER |
| 文件： | 总74页 (文件大小：1810K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LPC11U2x
32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash; up
to 10 kB SRAM and 4 kB EEPROM; USB device; USART
Rev. 2.3 — 27 March 2014
Product data sheet
1. General description
The LPC11U2x are an ARM Cortex-M0 based, low-cost 32-bit MCU family, designed for
8/16-bit microcontroller applications, offering performance, low power, simple instruction
set and memory addressing together with reduced code size compared to existing 8/16-bit
architectures.
The LPC11U2x operate at CPU frequencies of up to 50 MHz.
Equipped with a highly flexible and configurable Full-Speed USB 2.0 device controller, the
LPC11U2x brings unparalleled design flexibility and seamless integration to today’s
demanding connectivity solutions.
The peripheral complement of the LPC11U2x includes up to 32 kB of flash memory, up to
10 kB of SRAM data memory and 4 kB EEPROM, one Fast-mode Plus I2C-bus interface,
one RS-485/EIA-485 USART with support for synchronous mode and smart card
interface, two SSP interfaces, four general-purpose counter/timers, a 10-bit ADC
(Analog-to-Digital Converter), and up to 54 general-purpose I/O pins.
For additional documentation related to the LPC11U2x parts, see Section 15
“References”.
2. Features and benefits
System:
ARM Cortex-M0 processor, running at frequencies of up to 50 MHz.
ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).
Non-Maskable Interrupt (NMI) input selectable from several input sources.
System tick timer.
Memory:
Up to 32 kB on-chip flash program memory.
Up to 4 kB on-chip EEPROM data memory; byte erasable and byte programmable.
Up to 10 kB SRAM data memory.
16 kB boot ROM.
In-System Programming (ISP) and In-Application Programming (IAP) for flash and
EEPROM via on-chip bootloader software.
ROM-based USB drivers. Flash updates via USB supported.
ROM-based 32-bit integer division routines.
Debug options:
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Standard JTAG (Joint Test Action Group) test interface for BSDL (Boundary Scan
Description Language).
Serial Wire Debug.
Digital peripherals:
Up to 54 General-Purpose I/O (GPIO) pins with configurable pull-up/pull-down
resistors, repeater mode, and open-drain mode.
Up to 8 GPIO pins can be selected as edge and level sensitive interrupt sources.
Two GPIO grouped interrupt modules enable an interrupt based on a
programmable pattern of input states of a group of GPIO pins.
High-current source output driver (20 mA) on one pin.
High-current sink driver (20 mA) on true open-drain pins.
Four general-purpose counter/timers with a total of up to 5 capture inputs and 13
match outputs.
Programmable Windowed WatchDog Timer (WWDT) with a dedicated, internal
low-power WatchDog Oscillator (WDO).
Analog peripherals:
10-bit ADC with input multiplexing among eight pins.
Serial interfaces:
USB 2.0 full-speed device controller.
USART (Universal Synchronous Asynchronous Receiver/Transmitter) with
fractional baud rate generation, internal FIFO, a full modem control handshake
interface, and support for RS-485/9-bit mode and synchronous mode. USART
supports an asynchronous smart card interface (ISO 7816-3).
Two SSP (Synchronous Serial Port) controllers with FIFO and multi-protocol
capabilities.
I2C-bus interface supporting the full I2C-bus specification and Fast-mode Plus with
a data rate of up to 1 Mbit/s with multiple address recognition and monitor mode.
Clock generation:
Crystal Oscillator with an operating range of 1 MHz to 25 MHz (system oscillator).
12 MHz high-frequency Internal RC oscillator (IRC) that can optionally be used as
a system clock.
Internal low-power, low-frequency WatchDog Oscillator (WDO) with programmable
frequency output.
PLL allows CPU operation up to the maximum CPU rate with the system oscillator
or the IRC as clock sources.
A second, dedicated PLL is provided for USB.
Clock output function with divider that can reflect the crystal oscillator, the main
clock, the IRC, or the watchdog oscillator.
Power control:
Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, Power-down, and Deep power-down modes.
Power profiles residing in boot ROM provide optimized performance and minimized
power consumption for any given application through one simple function call.
Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep
power-down.
Processor wake-up from Deep-sleep and Power-down modes via reset, selectable
GPIO pins, watchdog interrupt, or USB port activity.
LPC11U2X
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.3 — 27 March 2014
2 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Processor wake-up from Deep power-down mode using one special function pin.
Power-On Reset (POR).
Brownout detect with four separate thresholds for interrupt and forced reset.
Unique device serial number for identification.
Single 3.3 V power supply (1.8 V to 3.6 V).
Temperature range 40 C to +85 C.
Available as LQFP64, LQFP48, TFBGA48, and HVQFN33 packages.
3. Applications
Consumer peripherals
Handheld scanners
USB audio devices
Medical
Industrial control
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
SOT313-2
SOT313-2
n/a
LPC11U22FBD48/301 LQFP48
LPC11U23FBD48/301 LQFP48
plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
LPC11U24FHI33/301 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 5 5 0.85 mm
LPC11U24FBD48/301 LQFP48
plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
SOT313-2
LPC11U24FET48/301 TFBGA48 plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 4.5 SOT1155-2
0.7 mm
LPC11U24FHN33/401 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33
n/a
terminals; body 7 7 0.85 mm
LPC11U24FBD48/401 LQFP48
LPC11U24FBD64/401 LQFP64
plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
SOT313-2
plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm SOT314-2
4.1 Ordering options
Table 2.
Part ordering options
Part Number
Flash EEPROM Main
USB
USB I2C-bus SSP ADC
GPIO Package
(kB) (kB) SRAM SRAM
FM+
channels
(kB)
6
(kB)
2
LPC11U22FBD48/301 16
LPC11U23FBD48/301 24
LPC11U24FHI33/301 32
LPC11U24FBD48/301 32
LPC11U24FET48/301 32
LPC11U24FHN33/401 32
LPC11U24FBD48/401 32
LPC11U24FBD64/401 32
1
1
2
2
2
4
4
4
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
8
8
8
8
8
8
8
8
40
40
26
40
40
26
40
54
LQFP48
6
2
LQFP48
6
2
HVQFN33 (5 5)
LQFP48
6
2
6
2
TFBGA48
HVQFN33 (7 7)
LQFP48
8
2
8
2
8
2
LQFP64
LPC11U2X
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.3 — 27 March 2014
3 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
5. Block diagram
SWD, JTAG
XTALIN XTALOUT
RESET
LPC11U2x
SYSTEM OSCILLATOR
TEST/DEBUG
INTERFACE
CLOCK
GENERATION,
IRC, WDO
BOD
POWER CONTROL,
SYSTEM
CLKOUT
ARM
FUNCTIONS
CORTEX-M0
POR
PLL0
USB PLL
EEPROM
1/2/4 kB
FLASH
SRAM
ROM
16 kB
system bus
slave
16/24/32 kB
8/10 kB
master
slave
slave
slave
slave
USB_DP
USB_DM
USB_VBUS
USB DEVICE
CONTROLLER
HIGH-SPEED
GPIO
AHB-LITE BUS
GPIO ports 0/1
USB_FTOGGLE,
USB_CONNECT
slave
AHB TO APB
BRIDGE
RXD
TXD
DCD, DSR , RI
CTS, RTS, DTR
SCLK
USART/
SMARTCARD INTERFACE
(1)
(1)
AD[7:0]
10-bit ADC
SCL, SDA
2
I C-BUS
CT16B0_MAT[2:0]
16-bit COUNTER/TIMER 0
(2)
CT16B0_CAP[1:0]
SCK0, SSEL0,
MISO0, MOSI0
SSP0
CT16B1_MAT[1:0]
16-bit COUNTER/TIMER 1
32-bit COUNTER/TIMER 0
(2)
CT16B1_CAP[1:0]
SCK1, SSEL1,
MISO1, MOSI1
CT32B0_MAT[3:0]
SSP1
(2)
CT32B0_CAP[1:0]
IOCON
CT32B1_MAT[3:0]
32-bit COUNTER/TIMER 1
(2)
CT32B1_CAP[1:0]
SYSTEM CONTROL
PMU
WINDOWED WATCHDOG
TIMER
GPIO pins
GPIO INTERRUPTS
GPIO pins
GPIO pins
GPIO GROUP0 INTERRUPTS
GPIO GROUP1 INTERRUPTS
002aag333
(1) Not available on HVQFN33 packages.
(2) CT32B1_CAP1 available on TFBGA48/LQFP64 packages only. CT16B0_CAP1 and CT16B1_CAP1 available on LQFP64
packages only. CT32B0_CAP1 available on LQFP48/TFBGA48/LQFP64 packages only.
Fig 1. Block diagram
LPC11U2X
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.3 — 27 March 2014
4 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
6. Pinning information
6.1 Pinning
terminal 1
index area
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
PIO1_19/DTR/SSEL1
TRST/PIO0_14/AD3/CT32B1_MAT1
TDO/PIO0_13/AD2/CT32B1_MAT0
TMS/PIO0_12/AD1/CT32B1_CAP0
TDI/PIO0_11/AD0/CT32B0_MAT3
PIO0_22/AD6/CT16B1_MAT1/MISO1
SWCLK/PIO0_10/SCK0/CT16B0_MAT2
PIO0_9/MOSI0/CT16B0_MAT1
RESET/PIO0_0
PIO0_1/CLKOUT/CT32B0_MAT2/USB_FTOGGLE
XTALIN
LPC11U24
XTALOUT
V
DD
PIO0_20/CT16B1_CAP0
33 V
SS
PIO0_2/SSEL0/CT16B0_CAP0
PIO0_8/MISO0/CT16B0_MAT0
002aag621
Transparent top view
Fig 2. Pin configuration (HVQFN33)
LPC11U2X
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.3 — 27 March 2014
5 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
ball A1
index area
LPC11U24FET48/301
1
2
3
4
5
6
7
8
A
B
C
D
E
F
G
H
002aag623
Transparent top view
Fig 3. Pin configuration (TFBGA48)
LPC11U2X
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.3 — 27 March 2014
6 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
1
2
36
35
34
33
32
31
30
29
28
27
26
25
PIO1_25/CT32B0_MAT1
PIO1_13/DTR/CT16B0_MAT0/TXD
TRST/PIO0_14/AD3/CT32B1_MAT1
TDO/PIO0_13/AD2/CT32B1_MAT0
TMS/PIO0_12/AD1/CT32B1_CAP0
TDI/PIO0_11/AD0/CT32B0_MAT3
PIO1_29/SCK0/CT32B0_CAP1
PIO0_22/AD6/CT16B1_MAT1/MISO1
SWCLK/PIO0_10/SCK0/CT16B0_MAT2
PIO0_9/MOSI0/CT16B0_MAT1
PIO0_8/MISO0/CT16B0_MAT0
PIO1_21/DCD/MISO1
PIO1_19/DTR/SSEL1
RESET/PIO0_0
3
4
PIO0_1/CLKOUT/CT32B0_MAT2/USB_FTOGGLE
5
V
SS
LPC11U22FBD48/301
LPC11U23FBD48/301
LPC11U24FBD48/301
LPC11U24FBD48/401
6
XTALIN
7
XTALOUT
8
V
DD
9
PIO0_20/CT16B1_CAP0
PIO0_2/SSEL0/CT16B0_CAP0
PIO1_26/CT32B0_MAT2/RXD
PIO1_27/CT32B0_MAT3/TXD
10
11
12
PIO1_31
002aag622
Fig 4. Pin configuration (LQFP48)
LPC11U2X
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.3 — 27 March 2014
7 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
1
2
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PIO1_0
PIO1_25
V
DD
PIO1_13
3
PIO1_19
TRST/PIO0_14
TDO/PIO0_13
TMS/PIO0_12
PIO1_11
4
RESET/PIO0_0
PIO0_1
5
6
PIO1_7
7
V
SS
TDI/PIO0_11
PIO1_29
8
XTALIN
LPC11U24FBD64/401
9
XTALOUT
PIO0_22
10
11
12
13
14
15
16
V
PIO1_8
DD
PIO0_20
PIO1_10
PIO0_2
SWCLK/PIO0_10
PIO0_9
PIO0_8
PIO1_26
PIO1_27
PIO1_4
PIO1_21
PIO1_2
V
DD
002aag624
See Table 3 for the full pin name.
Fig 5. Pin configuration (LQFP64)
LPC11U2X
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.3 — 27 March 2014
8 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
6.2 Pin description
Table 3 shows all pins and their assigned digital or analog functions in order of the GPIO
port number. The default function after reset is listed first. All port pins have internal
pull-up resistors enabled after reset except for the true open-drain pins PIO0_4 and
PIO0_5.
Every port pin has a corresponding IOCON register for programming the digital or analog
function, the pull-up/pull-down configuration, the repeater, and the open-drain modes.
The USART, counter/timer, and SSP functions are available on more than one port pin.
Table 3.
Symbol
Pin description
Reset Type Description
state
[1]
[2]
RESET/PIO0_0
2
C1
3
4
I; PU
I
RESET — External reset input with 20 ns glitch filter.
A LOW-going pulse as short as 50 ns on this pin
resets the device, causing I/O ports and peripherals to
take on their default states, and processor execution
to begin at address 0. This pin also serves as the
debug select input. LOW level selects the JTAG
boundary scan. HIGH level selects the ARM SWD
debug mode.
In deep power-down mode, this pin must be pulled
HIGH externally. The RESET pin can be left
unconnected or be used as a GPIO pin if an external
RESET function is not needed and Deep power-down
mode is not used.
-
I/O
I/O
PIO0_0 — General purpose digital input/output pin.
[3]
PIO0_1/CLKOUT/
CT32B0_MAT2/
USB_FTOGGLE
3
C2
4
5
I; PU
PIO0_1 — General purpose digital input/output pin. A
LOW level on this pin during reset starts the ISP
command handler or the USB device enumeration.
-
O
CLKOUT — Clockout pin.
-
O
CT32B0_MAT2 — Match output 2 for 32-bit timer 0.
USB_FTOGGLE — USB 1 ms Start-of-Frame signal.
PIO0_2 — General purpose digital input/output pin.
SSEL0 — Slave select for SSP0.
-
O
[3]
[3]
PIO0_2/SSEL0/
CT16B0_CAP0
8
9
F1 10 13
H2 14 19
I; PU
I/O
I/O
I
-
-
CT16B0_CAP0 — Capture input 0 for 16-bit timer 0.
PIO0_3/USB_VBUS
I; PU
I/O
PIO0_3 — General purpose digital input/output pin. A
LOW level on this pin during reset starts the ISP
command handler. A HIGH level during reset starts
the USB device enumeration.
-
I
USB_VBUS — Monitors the presence of USB bus
power.
[4]
PIO0_4/SCL
10 G3 15 20
I; IA
-
I/O
I/O
PIO0_4 — General purpose digital input/output pin
(open-drain).
SCL — I2C-bus clock input/output (open-drain).
High-current sink only if I2C Fast-mode Plus is
selected in the I/O configuration register.
LPC11U2X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.3 — 27 March 2014
9 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Table 3.
Symbol
Pin description
Reset Type Description
state
[1]
[4]
[3]
PIO0_5/SDA
11 H3 16 21
I; IA
-
I/O
I/O
PIO0_5 — General purpose digital input/output pin
(open-drain).
SDA — I2C-bus data input/output (open-drain).
High-current sink only if I2C Fast-mode Plus is
selected in the I/O configuration register.
PIO0_6/USB_CONNECT/ 15 H6 22 29
SCK0
I; PU
-
I/O
O
PIO0_6 — General purpose digital input/output pin.
USB_CONNECT — Signal used to switch an external
1.5 k resistor under software control. Used with the
SoftConnect USB feature.
-
I/O
I/O
SCK0 — Serial clock for SSP0.
[5]
[3]
PIO0_7/CTS
16 G7 23 30
17 F8 27 36
I; PU
PIO0_7 — General purpose digital input/output pin
(high-current output driver).
-
I
CTS — Clear To Send input for USART.
PIO0_8/MISO0/
CT16B0_MAT0
I; PU
I/O
I/O
O
PIO0_8 — General purpose digital input/output pin.
MISO0 — Master In Slave Out for SSP0.
-
-
CT16B0_MAT0 — Match output 0 for 16-bit timer 0.
PIO0_9 — General purpose digital input/output pin.
MOSI0 — Master Out Slave In for SSP0.
[3]
[3]
PIO0_9/MOSI0/
CT16B0_MAT1
18 F7 28 37
19 E7 29 38
I; PU
I/O
I/O
O
-
-
CT16B0_MAT1 — Match output 1 for 16-bit timer 0.
SWCLK/PIO0_10/SCK0/
CT16B0_MAT2
I; PU
I
SWCLK — Serial wire clock and test clock TCK for
JTAG interface.
-
I/O
O
O
I
PIO0_10 — General purpose digital input/output pin.
SCK0 — Serial clock for SSP0.
-
-
CT16B0_MAT2 — Match output 2 for 16-bit timer 0.
TDI — Test Data In for JTAG interface.
[6]
[6]
[6]
TDI/PIO0_11/AD0/
CT32B0_MAT3
21 D8 32 42
22 C7 33 44
23 C8 34 45
I; PU
-
I/O
I
PIO0_11 — General purpose digital input/output pin.
AD0 — A/D converter, input 0.
-
-
O
I
CT32B0_MAT3 — Match output 3 for 32-bit timer 0.
TMS — Test Mode Select for JTAG interface.
PIO_12 — General purpose digital input/output pin.
AD1 — A/D converter, input 1.
TMS/PIO0_12/AD1/
CT32B1_CAP0
I; PU
-
I/O
I
-
-
I
CT32B1_CAP0 — Capture input 0 for 32-bit timer 1.
TDO — Test Data Out for JTAG interface.
PIO0_13 — General purpose digital input/output pin.
AD2 — A/D converter, input 2.
TDO/PIO0_13/AD2/
CT32B1_MAT0
I; PU
O
I/O
I
-
-
-
O
CT32B1_MAT0 — Match output 0 for 32-bit timer 1.
LPC11U2X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.3 — 27 March 2014
10 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Table 3.
Symbol
Pin description
Reset Type Description
state
[1]
[6]
[6]
[6]
TRST/PIO0_14/AD3/
CT32B1_MAT1
24 B7 35 46
25 B6 39 52
26 A6 40 53
I; PU
I
TRST — Test Reset for JTAG interface.
-
I/O
I
PIO0_14 — General purpose digital input/output pin.
AD3 — A/D converter, input 3.
-
-
O
CT32B1_MAT1 — Match output 1 for 32-bit timer 1.
SWDIO — Serial wire debug input/output.
PIO0_15 — General purpose digital input/output pin.
AD4 — A/D converter, input 4.
SWDIO/PIO0_15/AD4/
CT32B1_MAT2
I; PU
I/O
I/O
I
-
-
-
O
CT32B1_MAT2 — Match output 2 for 32-bit timer 1.
PIO0_16/AD5/
CT32B1_MAT3/WAKEUP
I; PU
I/O
PIO0_16 — General purpose digital input/output pin.
In Deep power-down mode, this pin functions as the
WAKEUP pin with 20 ns glitch filter. Pull this pin HIGH
externally to enter Deep power-down mode. Pull this
pin LOW to exit Deep power-down mode. A
LOW-going pulse as short as 50 ns wakes up the
part.
-
I
AD5 — A/D converter, input 5.
-
O
I/O
O
I
CT32B1_MAT3 — Match output 3 for 32-bit timer 1.
PIO0_17 — General purpose digital input/output pin.
RTS — Request To Send output for USART.
CT32B0_CAP0 — Capture input 0 for 32-bit timer 0.
[3]
PIO0_17/RTS/
30 A3 45 60
I; PU
CT32B0_CAP0/SCLK
-
-
-
I/O
SCLK — Serial clock input/output for USART in
synchronous mode.
[3]
[3]
PIO0_18/RXD/
CT32B0_MAT0
31 B3 46 61
I; PU
-
I/O
I
PIO0_18 — General purpose digital input/output pin.
RXD — Receiver input for USART. Used in UART ISP
mode.
-
O
CT32B0_MAT0 — Match output 0 for 32-bit timer 0.
PIO0_19 — General purpose digital input/output pin.
PIO0_19/TXD/
CT32B0_MAT1
32 B2 47 62
I; PU
-
I/O
O
TXD — Transmitter output for USART. Used in UART
ISP mode.
-
O
CT32B0_MAT1 — Match output 1 for 32-bit timer 0.
PIO0_20 — General purpose digital input/output pin.
CT16B1_CAP0 — Capture input 0 for 16-bit timer 1.
PIO0_21 — General purpose digital input/output pin.
CT16B1_MAT0 — Match output 0 for 16-bit timer 1.
MOSI1 — Master Out Slave In for SSP1.
[3]
[3]
PIO0_20/CT16B1_CAP0
7
F2
9
11
I; PU
I/O
I
-
PIO0_21/CT16B1_MAT0/ 12 G4 17 22
MOSI1
I; PU
I/O
O
-
-
I/O
I/O
I
[6]
PIO0_22/AD6/
20 E8 30 40
I; PU
PIO0_22 — General purpose digital input/output pin.
AD6 — A/D converter, input 6.
CT16B1_MAT1/MISO1
-
-
-
O
CT16B1_MAT1 — Match output 1 for 16-bit timer 1.
MISO1 — Master In Slave Out for SSP1.
I/O
LPC11U2X
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LPC11U2x
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32-bit ARM Cortex-M0 microcontroller
Table 3.
Symbol
Pin description
Reset Type Description
state
[1]
[6]
[3]
[3]
[3]
[3]
[3]
[3]
PIO0_23/AD7
27 A5 42 56
I; PU
I/O
I
PIO0_23 — General purpose digital input/output pin.
AD7 — A/D converter, input 7.
-
PIO1_0/CT32B1_MAT0
PIO1_1/CT32B1_MAT1
PIO1_2/CT32B1_MAT2
PIO1_3/CT32B1_MAT3
PIO1_4/CT32B1_CAP0
PIO1_5/CT32B1_CAP1
-
-
-
-
-
-
-
-
-
-
-
-
-
1
I; PU
I/O
O
PIO1_0 — General purpose digital input/output pin.
CT32B1_MAT0 — Match output 0 for 32-bit timer 1.
PIO1_1 — General purpose digital input/output pin.
CT32B1_MAT1 — Match output 1 for 32-bit timer 1.
PIO1_2 — General purpose digital input/output pin.
CT32B1_MAT2 — Match output 2 for 32-bit timer 1.
PIO1_3 — General purpose digital input/output pin.
CT32B1_MAT3 — Match output 3 for 32-bit timer 1.
PIO1_4 — General purpose digital input/output pin.
CT32B1_CAP0 — Capture input 0 for 32-bit timer 1.
PIO1_5 — General purpose digital input/output pin.
CT32B1_CAP1 — Capture input 1 for 32-bit timer 1.
PIO1_6 — General purpose digital input/output pin.
PIO1_7 — General purpose digital input/output pin.
PIO1_8 — General purpose digital input/output pin.
PIO1_9 — General purpose digital input/output pin.
PIO1_10 — General purpose digital input/output pin.
PIO1_11 — General purpose digital input/output pin.
PIO1_12 — General purpose digital input/output pin.
PIO1_13 — General purpose digital input/output pin.
DTR — Data Terminal Ready output for USART.
CT16B0_MAT0 — Match output 0 for 16-bit timer 0.
TXD — Transmitter output for USART.
-
-
17
34
50
16
32
I; PU
I/O
O
-
-
I; PU
-
I/O
O
-
I; PU
-
I/O
O
-
I; PU
-
I/O
I
H8
I; PU
-
I/O
I
[3]
[3]
[3]
[3]
[3]
[3]
[3]
[3]
PIO1_6
PIO1_7
PIO1_8
PIO1_9
PIO1_10
PIO1_11
PIO1_12
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
64
6
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
-
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
39
55
12
43
59
PIO1_13/DTR/
CT16B0_MAT0/TXD
B8 36 47
-
O
-
O
[3]
[3]
[3]
PIO1_14/DSR/
CT16B0_MAT1/RXD
-
A8 37 49
I; PU
-
I/O
I
PIO1_14 — General purpose digital input/output pin.
DSR — Data Set Ready input for USART.
-
O
CT16B0_MAT1 — Match output 1 for 16-bit timer 0.
RXD — Receiver input for USART.
-
I
PIO1_15/DCD/
CT16B0_MAT2/SCK1
28 A4 43 57
I; PU
I/O
I
PIO1_15 — General purpose digital input/output pin.
DCD — Data Carrier Detect input for USART.
CT16B0_MAT2 — Match output 2 for 16-bit timer 0.
SCK1 — Serial clock for SSP1.
-
O
-
I/O
I/O
I
PIO1_16/RI/
CT16B0_CAP0
-
A2 48 63
I; PU
PIO1_16 — General purpose digital input/output pin.
RI — Ring Indicator input for USART.
-
-
I
CT16B0_CAP0 — Capture input 0 for 16-bit timer 0.
LPC11U2X
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NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Table 3.
Symbol
Pin description
Reset Type Description
state
[1]
[3]
[3]
[3]
[3]
[3]
[3]
[3]
PIO1_17/CT16B0_CAP1/
RXD
-
-
1
-
-
-
-
-
-
23
28
3
I; PU
I/O
I
PIO1_17 — General purpose digital input/output pin.
CT16B0_CAP1 — Capture input 1 for 16-bit timer 0.
RXD — Receiver input for USART.
-
-
I
PIO1_18/CT16B1_CAP1/
TXD
-
-
I; PU
I/O
I
PIO1_18 — General purpose digital input/output pin.
CT16B1_CAP1 — Capture input 1 for 16-bit timer 1.
TXD — Transmitter output for USART.
-
-
O
PIO1_19/DTR/SSEL1
PIO1_20/DSR/SCK1
PIO1_21/DCD/MISO1
PIO1_22/RI/MOSI1
B1
2
I; PU
I/O
O
PIO1_19 — General purpose digital input/output pin.
DTR — Data Terminal Ready output for USART.
SSEL1 — Slave select for SSP1.
-
-
I/O
I/O
I
H1 13 18
G8 26 35
A7 38 51
H4 18 24
G6 21 27
I; PU
PIO1_20 — General purpose digital input/output pin.
DSR — Data Set Ready input for USART.
-
-
I/O
I/O
I
SCK1 — Serial clock for SSP1.
I; PU
PIO1_21 — General purpose digital input/output pin.
DCD — Data Carrier Detect input for USART.
MISO1 — Master In Slave Out for SSP1.
-
-
I/O
I/O
I
I; PU
PIO1_22 — General purpose digital input/output pin.
RI — Ring Indicator input for USART.
-
-
I/O
I/O
O
MOSI1 — Master Out Slave In for SSP1.
PIO1_23/CT16B1_MAT1/
SSEL1
I; PU
PIO1_23 — General purpose digital input/output pin.
CT16B1_MAT1 — Match output 1 for 16-bit timer 1.
SSEL1 — Slave select for SSP1.
-
-
I/O
I/O
O
[3]
[3]
[3]
PIO1_24/CT32B0_MAT0
PIO1_25/CT32B0_MAT1
-
-
-
I; PU
PIO1_24 — General purpose digital input/output pin.
CT32B0_MAT0 — Match output 0 for 32-bit timer 0.
PIO1_25 — General purpose digital input/output pin.
CT32B0_MAT1 — Match output 1 for 32-bit timer 0.
PIO1_26 — General purpose digital input/output pin.
CT32B0_MAT2 — Match output 2 for 32-bit timer 0.
RXD — Receiver input for USART.
-
A1
1
2
I; PU
I/O
O
-
PIO1_26/CT32B0_MAT2/
RXD
G2 11 14
G1 12 15
H7 24 31
I; PU
I/O
O
-
-
I
[3]
[3]
PIO1_27/CT32B0_MAT3/
TXD
-
-
I; PU
I/O
O
PIO1_27 — General purpose digital input/output pin.
CT32B0_MAT3 — Match output 3 for 32-bit timer 0.
TXD — Transmitter output for USART.
-
-
O
PIO1_28/CT32B0_CAP0/
SCLK
I; PU
I/O
I
PIO1_28 — General purpose digital input/output pin.
CT32B0_CAP0 — Capture input 0 for 32-bit timer 0.
-
-
I/O
SCLK — Serial clock input/output for USART in
synchronous mode.
[3]
PIO1_29/SCK0/
CT32B0_CAP1
-
D7 31 41
I; PU
I/O
I/O
I
PIO1_29 — General purpose digital input/output pin.
SCK0 — Serial clock for SSP0.
-
-
CT32B0_CAP1 — Capture input 1 for 32-bit timer 0.
LPC11U2X
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Product data sheet
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13 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Table 3.
Symbol
Pin description
Reset Type Description
state
[1]
[3]
[7]
[7]
[8]
PIO1_31
USB_DM
USB_DP
XTALIN
-
-
25
-
I; PU
I/O
PIO1_31 — General purpose digital input/output pin.
USB_DM — USB bidirectional D line.
13 G5 19 25
14 H5 20 26
F
F
-
-
-
-
USB_DP — USB bidirectional D+ line.
4
D1
6
8
Input to the oscillator circuit and internal clock
generator circuits. Input voltage must not exceed
1.8 V.
[8]
XTALOUT
VDD
5
E1
7
9
-
-
-
-
Output from the oscillator amplifier.
6; B4; 8;
29 E2 44 33;
10;
Supply voltage to the internal regulator, the external
rail, and the ADC. Also used as the ADC reference
voltage.
48;
58
VSS
33 B5; 5;
7;
-
-
Ground.
D2 41 54
[1] Pin state at reset for default function: I = Input; O = Output; PU = internal pull-up enabled; IA = inactive, no pull-up/down enabled;
F = floating; If the pins are not used, tie floating pins to ground or power to minimize power consumption.
[2] 5 V tolerant pad. RESET functionality is not available in Deep power-down mode. Use the WAKEUP pin to reset the chip and wake up
from Deep power-down mode. An external pull-up resistor is required on this pin for the Deep power-down mode. See Figure 32 for the
reset pad configuration.
[3] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis (see Figure 31).
[4] I2C-bus pin compliant with the I2C-bus specification for I2C standard mode, I2C Fast-mode, and I2C Fast-mode Plus. The pin requires an
external pull-up to provide output functionality. When power is switched off, this pin is floating and does not disturb the I2C lines.
Open-drain configuration applies to all functions on this pin.
[5] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis (see Figure 31);
includes high-current output driver.
[6] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, configurable hysteresis, and analog input.
When configured as a ADC input, digital section of the pad is disabled and the pin is not 5 V tolerant (see Figure 31); includes digital
input glitch filter.
[7] Pad provides USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode
only). This pad is not 5 V tolerant.
[8] When the system oscillator is not used, connect XTALIN and XTALOUT as follows: XTALIN can be left floating or can be grounded
(grounding is preferred to reduce susceptibility to noise). Leave XTALOUT floating.
7. Functional description
7.1 On-chip flash programming memory
The LPC11U2x contain 24 kB or 32 kB on-chip flash program memory. The flash can be
programmed using In-System Programming (ISP) or In-Application Programming (IAP)
via the on-chip boot loader software.
7.2 EEPROM
The LPC11U2x contain 1 kB, 2 kB, or 4 kB of on-chip byte-erasable and
byte-programmable EEPROM data memory. The EEPROM can be programmed using
In-Application Programming (IAP) via the on-chip boot loader software.
LPC11U2X
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7.3 SRAM
32-bit ARM Cortex-M0 microcontroller
The LPC11U2x contain a total of 8 kB or 10 kB on-chip static RAM memory.
7.4 On-chip ROM
The on-chip ROM contains the boot loader and the following Application Programming
Interfaces (APIs):
• In-System Programming (ISP) and In-Application Programming (IAP) support for flash
• IAP support for EEPROM
• USB API
• Power profiles for configuring power consumption and PLL settings
• 32-bit integer division routines
7.5 Memory map
The LPC11U2x incorporates several distinct memory regions, shown in the following
figures. Figure 6 shows the overall map of the entire address space from the user
program viewpoint following reset. The interrupt vector area supports address remapping.
The AHB (Advanced High-performance Bus) peripheral area is 2 MB in size and is divided
to allow for up to 128 peripherals. The APB (Advanced Peripheral Bus) peripheral area is
512 kB in size and is divided to allow for up to 32 peripherals. Each peripheral of either
type is allocated 16 kB of space. This addressing scheme allows simplifying the address
decoding for each peripheral.
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32-bit ARM Cortex-M0 microcontroller
LPC11U2x
4 GB
0xFFFF FFFF
reserved
0xE010 0000
0xE000 0000
private peripheral bus
reserved
APB peripherals
0x4008 0000
0x5000 4000
0x5000 0000
GPIO
25 - 31 reserved
0x4006 4000
GPIO GROUP1 INT
GPIO GROUP0 INT
24
23
22
0x4006 0000
0x4005 C000
reserved
0x4008 4000
SSP1
USB
0x4005 8000
0x4004 C000
0x4008 0000
0x4000 0000
20 - 21 reserved
APB peripherals
1 GB
GPIO interrupts
19
0x4004 C000
0x4004 8000
0x4004 4000
0x4004 0000
reserved
system control
IOCON
18
17
16
0x2000 4800
SSP0
2 kB USB RAM
reserved
0x2000 4000
0x2000 0000
15 flash/EEPROM controller
0x4003 C000
0x4003 8000
0.5 GB
14
PMU
reserved
10 - 13 reserved
0x1FFF 4000
0x1FFF 0000
0x4002 8000
0x4002 4000
0x4002 0000
16 kB boot ROM
reserved
reserved
9
8
7
6
5
4
3
2
reserved
ADC
0x4001 C000
0x4001 8000
0x1000 2000
32-bit counter/timer 1
8 kB SRAM (LPC11U2x/401)
6 kB SRAM (LPC11U2x/301)
32-bit counter/timer 0
16-bit counter/timer 1
16-bit counter/timer 0
USART/SMART CARD
WWDT
0x1000 1800
0x1000 0000
0x4001 4000
0x4001 0000
0x4000 C000
0x4000 8000
reserved
0x0000 8000
0x0000 6000
1
0
0x4000 4000
0x4000 0000
32 kB on-chip flash (LPC11U24)
2
I C-bus
24 kB on-chip flash (LPC11U23)
16 kB on-chip flash (LPC11U22)
0x0000 4000
0x0000 00C0
active interrupt vectors
0x0000 0000
0x0000 0000
0 GB
002aag594
Fig 6. LPC11U2x memory map
7.6 Nested Vectored Interrupt Controller (NVIC)
The Nested Vectored Interrupt Controller (NVIC) is part of the Cortex-M0. The tight
coupling to the CPU allows for low interrupt latency and efficient processing of late arriving
interrupts.
7.6.1 Features
• Controls system exceptions and peripheral interrupts.
• In the LPC11U2x, the NVIC supports 24 vectored interrupts.
LPC11U2X
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32-bit ARM Cortex-M0 microcontroller
• Four programmable interrupt priority levels, with hardware priority level masking.
• Software interrupt generation.
7.6.2 Interrupt sources
Each peripheral device has one interrupt line connected to the NVIC but can have several
interrupt flags. Individual interrupt flags can also represent more than one interrupt
source.
7.7 IOCON block
The IOCON block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on-chip peripherals.
Connect peripherals to the appropriate pins before activating the peripheral and before
enabling any related interrupt. Activity of any enabled peripheral function that is not
mapped to a related pin is treated as undefined.
7.7.1 Features
• Programmable pull-up, pull-down, or repeater mode.
• All GPIO pins (except PIO0_4 and PIO0_5) are pulled up to 3.3 V (VDD = 3.3 V) if their
pull-up resistor is enabled.
• Programmable pseudo open-drain mode.
• Programmable 10 ns glitch filter on pins PIO0_22, PIO0_23, and PIO0_11 to
PIO0_16. The glitch filter is turned on by default.
• Programmable hysteresis.
• Programmable input inverter.
7.8 General-Purpose Input/Output GPIO
The GPIO registers control device pin functions that are not connected to a specific
peripheral function. Pins can be dynamically configured as inputs or outputs. Multiple
outputs can be set or cleared in one write operation.
LPC11U2x use accelerated GPIO functions:
• GPIO registers are a dedicated AHB peripheral so that the fastest possible I/O timing
can be achieved.
• Entire port value can be written in one instruction.
Any GPIO pin providing a digital function can be programmed to generate an interrupt on
a level, a rising or falling edge, or both.
The GPIO block consists of three parts:
1. The GPIO ports.
2. The GPIO pin interrupt block to control eight GPIO pins selected as pin interrupts.
3. Two GPIO group interrupt blocks to control two combined interrupts from all GPIO
pins.
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7.8.1 Features
• GPIO pins can be configured as input or output by software.
• All GPIO pins default to inputs with interrupt disabled at reset.
• Pin registers allow pins to be sensed and set individually.
• Up to eight GPIO pins can be selected from all GPIO pins to create an edge- or
level-sensitive GPIO interrupt request.
• Any pin or pins in each port can trigger a port interrupt.
7.9 USB interface
The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a
host and one or more (up to 127) peripherals. The host controller allocates the USB
bandwidth to attached devices through a token-based protocol. The bus supports
hot-plugging and dynamic configuration of the devices. The host controller initiates all
transactions.
The LPC11U2x USB interface consists of a full-speed device controller with on-chip PHY
(PHYsical layer) for device functions.
Remark: Configure the LPC11U2x in default power mode with the power profiles before
using the USB (see Section 7.17.5.1). Do not use the USB with the part in performance,
efficiency, or low-power mode.
7.9.1 Full-speed USB device controller
The device controller enables 12 Mbit/s data exchange with a USB Host controller. It
consists of a register interface, serial interface engine, and endpoint buffer memory. The
serial interface engine decodes the USB data stream and writes data to the appropriate
endpoint buffer. The status of a completed USB transfer or error condition is indicated via
status registers. If enabled, an interrupt is generated.
7.9.1.1 Features
• Dedicated USB PLL available.
• Fully compliant with USB 2.0 specification (full speed).
• Supports 10 physical (5 logical) endpoints including one control endpoint.
• Single and double buffering supported.
• Each non-control endpoint supports bulk, interrupt, or isochronous endpoint types.
• Supports wake-up from Deep-sleep mode and Power-down mode on USB activity
and remote wake-up.
• Supports SoftConnect.
7.10 USART
The LPC11U2x contains one USART.
The USART includes full modem control, support for synchronous mode, and a smart
card interface. The RS-485/9-bit mode allows both software address detection and
automatic address detection using 9-bit mode.
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32-bit ARM Cortex-M0 microcontroller
The USART uses a fractional baud rate generator. Standard baud rates such as
115200 Bd can be achieved with any crystal frequency above 2 MHz.
7.10.1 Features
• Maximum USART data bit rate of 3.125 Mbit/s.
• 16 byte receive and transmit FIFOs.
• Register locations conform to 16C550 industry standard.
• Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
• Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Fractional divider for baud rate control, auto baud capabilities and FIFO control
mechanism that enables software flow control implementation.
• Support for RS-485/9-bit mode.
• Support for modem control.
• Support for synchronous mode.
• Includes smart card interface.
7.11 SSP serial I/O controller
The SSP controllers operate on a SSP, 4-wire SSI, or Microwire bus. It can interact with
multiple masters and slaves on the bus. Only a single master and a single slave can
communicate on the bus during a given data transfer. The SSP supports full duplex
transfers, with frames of 4 bit to 16 bit of data flowing from the master to the slave and
from the slave to the master. In practice, often only one of these data flows carries
meaningful data.
7.11.1 Features
• Maximum SSP speed of 25 Mbit/s (master) or 4.17 Mbit/s (slave) (in SSP mode)
• Compatible with Motorola SPI (Serial Peripheral Interface), 4-wire Texas Instruments
SSI (Serial Synchronous Interface), and National Semiconductor Microwire buses
• Synchronous serial communication
• Master or slave operation
• 8-frame FIFOs for both transmit and receive
• 4-bit to 16-bit frame
7.12 I2C-bus serial I/O controller
The LPC11U2x contain one I2C-bus controller.
The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial CLock line
(SCL) and a Serial DAta line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, and
more than one bus master connected to the interface can be controlled the bus.
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32-bit ARM Cortex-M0 microcontroller
7.12.1 Features
• The I2C-interface is an I2C-bus compliant interface with open-drain pins. The I2C-bus
interface supports Fast-mode Plus with bit rates up to 1 Mbit/s.
• Easy to configure as master, slave, or master/slave.
• Programmable clocks allow versatile rate control.
• Bidirectional data transfer between masters and slaves.
• Multi-master bus (no central master).
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
• The I2C-bus controller supports multiple address recognition and a bus monitor mode.
7.13 10-bit ADC
The LPC11U2x contains one ADC. It is a single 10-bit successive approximation ADC with
eight channels.
7.13.1 Features
• 10-bit successive approximation ADC.
• Input multiplexing among 8 pins.
• Power-down mode.
• Measurement range 0 V to VDD
.
• 10-bit conversion time 2.44 s (up to 400 kSamples/s).
• Burst conversion mode for single or multiple inputs.
• Optional conversion on transition of input pin or timer match signal.
• Individual result registers for each ADC channel to reduce interrupt overhead.
7.14 General purpose external event counter/timers
The LPC11U2x includes two 32-bit counter/timers and two 16-bit counter/timers. The
counter/timer is designed to count cycles of the system derived clock. It can optionally
generate interrupts or perform other actions at specified timer values, based on four
match registers. Each counter/timer also includes one capture input to trap the timer value
when an input signal transitions, optionally generating an interrupt.
7.14.1 Features
• A 32-bit/16-bit timer/counter with a programmable 32-bit/16-bit prescaler.
• Counter or timer operation.
• One capture channel per timer, that can take a snapshot of the timer value when an
input signal transitions. A capture event can also generate an interrupt.
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32-bit ARM Cortex-M0 microcontroller
• Four match registers per timer that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Up to four external outputs corresponding to match registers, with the following
capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
• The timer and prescaler can be configured to be cleared on a designated capture
event. This feature permits easy pulse-width measurement by clearing the timer on
the leading edge of an input pulse and capturing the timer value on the trailing edge.
7.15 System tick timer
The ARM Cortex-M0 includes a system tick timer (SYSTICK) that is intended to generate
a dedicated SYSTICK exception at a fixed time interval (typically 10 ms).
7.16 Windowed WatchDog Timer (WWDT)
The purpose of the WWDT is to prevent an unresponsive system state. If software fails to
update the watchdog within a programmable time window, the watchdog resets the
microcontroller
7.16.1 Features
• Internally resets chip if not periodically reloaded during the programmable time-out
period.
• Optional windowed operation requires reload to occur between a minimum and
maximum time period, both programmable.
• Optional warning interrupt can be generated at a programmable time before watchdog
time-out.
• Software enables the WWDT, but a hardware reset or a watchdog reset/interrupt is
required to disable the WWDT.
• Incorrect feed sequence causes reset or interrupt, if enabled.
• Flag to indicate watchdog reset.
• Programmable 24-bit timer with internal prescaler.
• Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 224 4) in
multiples of Tcy(WDCLK) 4.
• The Watchdog Clock (WDCLK) source can be selected from the IRC or the dedicated
watchdog oscillator (WDO). The clock source selection provides a wide range of
potential timing choices of watchdog operation under different power conditions.
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7.17 Clocking and power control
7.17.1 Integrated oscillators
The LPC11U2x include three independent oscillators: the system oscillator, the Internal
RC oscillator (IRC), and the watchdog oscillator. Each oscillator can be used for more
than one purpose as required in a particular application.
Following reset, the LPC11U2x operates from the internal RC oscillator until software
switches to a different clock source. The IRC allows the system to operate without any
external crystal and the bootloader code to operate at a known frequency.
See Figure 7 for an overview of the LPC11U2x clock generation.
LPC11U2X
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CPU, system control,
PMU
system clock
n
SYSTEM CLOCK
DIVIDER
memories,
peripheral clocks
SYSAHBCLKCTRLn
(AHB clock enable)
IRC oscillator
main clock
SSP0 PERIPHERAL
CLOCK DIVIDER
SSP0
UART
SSP1
watchdog oscillator
USART PERIPHERAL
CLOCK DIVIDER
MAINCLKSEL
(main clock select)
SSP1 PERIPHERAL
CLOCK DIVIDER
IRC oscillator
SYSTEM PLL
system oscillator
SYSPLLCLKSEL
(system PLL clock select)
USB PLL
system oscillator
USB 48 MHz CLOCK
DIVIDER
USB
USBPLLCLKSEL
(USB clock select)
USBUEN
(USB clock update enable)
IRC oscillator
system oscillator
watchdog oscillator
CLKOUT PIN CLOCK
DIVIDER
CLKOUT pin
CLKOUTUEN
(CLKOUT update enable)
IRC oscillator
WDT
watchdog oscillator
WDCLKSEL
(WDT clock select)
002aaf892
Fig 7. LPC11U2x clocking generation block diagram
7.17.1.1 Internal RC oscillator
The IRC can be used as the clock source for the WDT, and/or as the clock that drives the
system PLL and then the CPU. The nominal IRC frequency is 12 MHz.
Upon power-up, any chip reset, or wake-up from Deep power-down mode, the LPC11U2x
use the IRC as the clock source. Software can later switch to one of the other available
clock sources.
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7.17.1.2 System oscillator
The system oscillator can be used as the clock source for the CPU, with or without using
the PLL. On the LPC11U2x, use the system oscillator to provide the clock source to USB.
The system oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be
boosted to a higher frequency, up to the maximum CPU operating frequency, by the
system PLL.
7.17.1.3 Watchdog oscillator
The watchdog oscillator can be used as a clock source that directly drives the CPU, the
watchdog timer, or the CLKOUT pin. The watchdog oscillator nominal frequency is
programmable between 7.8 kHz and 1.7 MHz. The frequency spread over processing and
temperature is 40 % (see also Table 13).
7.17.2 System PLL and USB PLL
The LPC11U2x contain a system PLL and a dedicated PLL for generating the 48 MHz
USB clock. The system and USB PLLs are identical.
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input
frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO).
The multiplier can be an integer value from 1 to 32. The CCO operates in the range of
156 MHz to 320 MHz. To support this frequency range, an additional divider keeps the
CCO within its frequency range while the PLL is providing the desired output frequency.
The output divider can be set to divide by 2, 4, 8, or 16 to produce the output clock. The
PLL output frequency must be lower than 100 MHz. Since the minimum output divider
value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off
and bypassed following a chip reset. Software can enable the PLL later. The program
must configure and activate the PLL, wait for the PLL to lock, and then connect to the PLL
as a clock source. The PLL settling time is 100 s.
7.17.3 Clock output
The LPC11U2x feature a clock output function that routes the IRC oscillator, the system
oscillator, the watchdog oscillator, or the main clock to an output pin.
7.17.4 Wake-up process
The LPC11U2x begin operation by using the 12 MHz IRC oscillator as the clock source at
power-up and when awakened from Deep power-down mode. This mechanism allows
chip operation to resume quickly. If the application uses the main oscillator or the PLL,
software must enable these components and wait for them to stabilize. Only then can the
system use the PLL and main oscillator as a clock source.
7.17.5 Power control
The LPC11U2x support various power control features. There are four special modes of
processor power reduction: Sleep mode, Deep-sleep mode, Power-down mode, and
Deep power-down mode. The CPU clock rate can also be controlled as needed by
changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider
value. This power control mechanism allows a trade-off of power versus processing speed
based on application requirements. In addition, a register is provided for shutting down the
clocks to individual on-chip peripherals. This register allows fine-tuning of power
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consumption by eliminating all dynamic power use in any peripherals that are not required
for the application. Selected peripherals have their own clock divider which provides even
better power control.
7.17.5.1 Power profiles
The power consumption in Active and Sleep modes can be optimized for the application
through simple calls to the power profile. The power configuration routine configures the
LPC11U2x for one of the following power modes:
• Default mode corresponding to power configuration after reset.
• CPU performance mode corresponding to optimized processing capability.
• Efficiency mode corresponding to optimized balance of current consumption and CPU
performance.
• Low-current mode corresponding to lowest power consumption.
In addition, the power profile includes routines to select the optimal PLL settings for a
given system clock and PLL input clock.
Remark: When using the USB, configure the LPC11U2x in Default mode.
7.17.5.2 Sleep mode
When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep
mode does not need any special sequence but re-enabling the clock to the ARM core.
In Sleep mode, execution of instructions is suspended until either a reset or interrupt
occurs. Peripheral functions continue operation during Sleep mode and can generate
interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic
power used by the processor itself, by memory systems and related controllers, and by
internal buses.
7.17.5.3 Deep-sleep mode
In Deep-sleep mode, the LPC11U2x is in Sleep-mode and all peripheral clocks and all
clock sources are off except for the IRC. The IRC output is disabled unless the IRC is
selected as input to the watchdog timer. In addition all analog blocks are shut down and
the flash is in stand-by mode. In Deep-sleep mode, the application can keep the watchdog
oscillator and the BOD circuit running for self-timed wake-up and BOD protection.
The LPC11U2x can wake up from Deep-sleep mode via reset, selected GPIO pins, a
watchdog timer interrupt, or an interrupt generating USB port activity.
Deep-sleep mode saves power and allows for short wake-up times.
7.17.5.4 Power-down mode
In Power-down mode, the LPC11U2x is in Sleep-mode and all peripheral clocks and all
clock sources are off except for watchdog oscillator if selected. In addition all analog
blocks and the flash are shut down. In Power-down mode, the application can keep the
BOD circuit running for BOD protection.
The LPC11U2x can wake up from Power-down mode via reset, selected GPIO pins, a
watchdog timer interrupt, or an interrupt generating USB port activity.
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Power-down mode reduces power consumption compared to Deep-sleep mode at the
expense of longer wake-up times.
7.17.5.5 Deep power-down mode
In Deep power-down mode, power is shut off to the entire chip except for the WAKEUP
pin. The LPC11U2x can wake up from Deep power-down mode via the WAKEUP pin.
The LPC11U2x can be prevented from entering Deep power-down mode by setting a lock
bit in the PMU block. Locking out Deep power-down mode enables the application to keep
the watchdog timer or the BOD running at all times.
When entering Deep power-down mode, an external pull-up resistor is required on the
WAKEUP pin to hold it HIGH. Pull the RESET pin HIGH to prevent it from floating while in
Deep power-down mode.
7.17.6 System control
7.17.6.1 Reset
Reset has four sources on the LPC11U2x: the RESET pin, the Watchdog reset, power-on
reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt
trigger input pin. Assertion of chip reset by any source, once the operating voltage attains
a usable level, starts the IRC and initializes the flash controller.
A LOW-going pulse as short as 50 ns resets the part.
When the internal Reset is removed, the processor begins executing at address 0, which
is initially the Reset vector mapped from the boot block. At that point, all of the processor
and peripheral registers have been initialized to predetermined values.
In Deep power-down mode, an external pull-up resistor is required on the RESET pin.
7.17.6.2 Brownout detection
The LPC11U2x includes four levels for monitoring the voltage on the VDD pin. If this
voltage falls below one of the four selected levels, the BOD asserts an interrupt signal to
the NVIC. This signal can be enabled for interrupt in the Interrupt Enable Register in the
NVIC to cause a CPU interrupt. Alternatively, software can monitor the signal by reading a
dedicated status register. Four additional threshold levels can be selected to cause a
forced reset of the chip.
7.17.6.3 Code security (Code Read Protection - CRP)
CRP provides different levels of security in the system so that access to the on-chip flash
and use of the Serial Wire Debugger (SWD) and In-System Programming (ISP) can be
restricted. Programming a specific pattern into a dedicated flash location invokes CRP.
IAP commands are not affected by the CRP.
In addition, ISP entry via the PIO0_1 pin can be disabled without enabling CRP. For
details, see the LPC11Uxx user manual.
There are three levels of Code Read Protection:
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1. CRP1 disables access to the chip via the SWD and allows partial flash update
(excluding flash sector 0) using a limited set of the ISP commands. This mode is
useful when CRP is required and flash field updates are needed but all sectors cannot
be erased.
2. CRP2 disables access to the chip via the SWD and only allows full flash erase and
update using a reduced set of the ISP commands.
3. Running an application with level CRP3 selected, fully disables any access to the chip
via the SWD pins and the ISP. This mode effectively disables ISP override using
PIO0_1 pin as well. If necessary, the application must provide a flash update
mechanism using IAP calls or using a call to the reinvoke ISP command to enable
flash update via the USART.
CAUTION
If level three Code Read Protection (CRP3) is selected, no future factory testing can be
performed on the device.
In addition to the three CRP levels, sampling of pin PIO0_1 for valid user code can be
disabled. For details, see the LPC11Uxx user manual.
7.17.6.4 APB interface
The APB peripherals are located on one APB bus.
7.17.6.5 AHBLite
The AHBLite connects the CPU bus of the ARM Cortex-M0 to the flash memory, the main
static RAM, and the ROM.
7.17.6.6 External interrupt inputs
All GPIO pins can be level or edge sensitive interrupt inputs.
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7.18 Emulation and debugging
Debug functions are integrated into the ARM Cortex-M0. Serial wire debug functions are
supported in addition to a standard JTAG boundary scan. The ARM Cortex-M0 is
configured to support up to four breakpoints and two watch points.
The RESET pin selects between the JTAG boundary scan (RESET = LOW) and the ARM
SWD debug (RESET = HIGH). The ARM SWD debug port is disabled while the
LPC11U2x is in reset.
To perform boundary scan testing, follow these steps:
1. Erase any user code residing in flash.
2. Power up the part with the RESET pin pulled HIGH externally.
3. Wait for at least 250 s.
4. Pull the RESET pin LOW externally.
5. Perform boundary scan operations.
6. Once the boundary scan operations are completed, assert the TRST pin to enable the
SWD debug mode, and release the RESET pin (pull HIGH).
Remark: The JTAG interface cannot be used for debug purposes.
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8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
[2]
VDD
supply voltage (core and
external rail)
0.5
+4.6
V
[5][2]
VI
input voltage
5 V tolerant digital I/O pins;
VDD 1.8 V
0.5
+5.5
V
V
VDD = 0 V
0.5
0.5
+3.6
+5.5
[2][4]
5 V tolerant open-drain pins
PIO0_4 and PIO0_5
[2]
[3]
VIA
analog input voltage
pin configured as analog input
0.5
4.6
V
IDD
supply current
per supply pin
-
-
-
100
100
100
mA
mA
mA
ISS
ground current
I/O latch-up current
per ground pin
(0.5VDD) < VI < (1.5VDD);
Tj < 125 C
Ilatch
[6]
Tstg
storage temperature
non-operating
65
+150
150
C
C
Tj(max)
maximum junction
temperature
-
Ptot(pack)
total power dissipation (per
package)
based on package heat
transfer, not device power
consumption
-
-
1.5
W
V
[7]
VESD
electrostatic discharge
voltage
human body model; all pins
+6500
[1] The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
c) The limiting values are stress ratings only. Operating the part at these values is not recommended, and proper operation is not
guaranteed. The conditions for functional operation are specified in Table 5.
[2] Maximum/minimum voltage above the maximum operating voltage (see Table 5) and below ground that can be applied for a short time
(< 10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter lifetime of the device.
[3] See Table 6 for maximum operating voltage.
[4] VDD present or not present. Compliant with the I2C-bus standard. 5.5 V can be applied to this pin when VDD is powered down.
[5] Including voltage on outputs in 3-state mode.
[6] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined
based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details.
[7] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
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9. Static characteristics
Table 5.
Static characteristics
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ[1]
Max
Unit
[2]
VDD
supply voltage (core
and external rail)
1.8
3.3
3.6
V
IDD
supply current
Active mode; VDD = 3.3 V;
Tamb = 25 C; code
while(1){}
executed from flash;
system clock = 12 MHz
[3][4][5]
[6][7][8]
-
-
-
2
7
1
-
-
-
mA
mA
mA
[4][5][6]
[7][8][9]
system clock = 50 MHz
[3][4][5]
[6][7][8]
Sleep mode;
VDD = 3.3 V; Tamb = 25 C;
system clock = 12 MHz
[4][7]
Deep-sleep mode; VDD = 3.3 V;
Tamb = 25 C
-
-
-
360
2
-
-
-
A
A
nA
Power-down mode; VDD = 3.3 V;
Tamb = 25 C
[10]
Deep power-down mode;
220
VDD = 3.3 V; Tamb = 25 C
Standard port pins, RESET
IIL
LOW-level input current VI = 0 V; on-chip pull-up resistor
disabled
-
0.5
0.5
0.5
-
10
10
10
5.0
nA
nA
nA
V
IIH
IOZ
VI
HIGH-level input
current
VI = VDD; on-chip pull-down resistor
disabled
-
OFF-state output
current
VO = 0 V; VO = VDD; on-chip
pull-up/down resistors disabled
-
[11][12]
[13]
input voltage
pin configured to provide a digital
function
0
VO
output voltage
output active
0
-
-
VDD
-
V
V
VIH
HIGH-level input
voltage
0.7VDD
VIL
LOW-level input voltage
hysteresis voltage
-
-
0.3VDD
V
Vhys
VOH
-
0.4
-
V
HIGH-level output
voltage
2.0 V VDD 3.6 V; IOH = 4 mA
1.8 V VDD < 2.0 V; IOH = 3 mA
2.0 V VDD 3.6 V; IOL = 4 mA
1.8 V VDD < 2.0 V; IOL = 3 mA
VOH = VDD 0.4 V;
VDD 0.4
-
-
-
-
-
-
V
VDD 0.4
-
V
VOL
LOW-level output
voltage
-
0.4
0.4
-
V
-
V
IOH
HIGH-level output
current
4
mA
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
3
-
-
mA
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Table 5.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ[1]
Max
Unit
IOL
LOW-level output
current
VOL = 0.4 V
4
-
-
mA
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
3
-
-
-
-
mA
mA
[14]
[14]
IOHS
IOLS
HIGH-level short-circuit VOH = 0 V
output current
45
LOW-level short-circuit VOL = VDD
output current
-
-
50
mA
Ipd
Ipu
pull-down current
pull-up current
VI = 5 V
VI = 0 V;
10
50
150
A
A
15
50
85
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
10
50
85
A
A
VDD < VI < 5 V
0
0
0
High-drive output pin (PIO0_7)
IIL
LOW-level input current VI = 0 V; on-chip pull-up resistor
disabled
-
0.5
0.5
0.5
-
10
10
10
5.0
nA
nA
nA
V
IIH
IOZ
VI
HIGH-level input
current
VI = VDD; on-chip pull-down resistor
disabled
-
OFF-state output
current
VO = 0 V; VO = VDD; on-chip
pull-up/down resistors disabled
-
[11][12]
[13]
input voltage
pin configured to provide a digital
function
0
VO
output voltage
output active
0
-
-
VDD
-
V
V
VIH
HIGH-level input
voltage
0.7VDD
VIL
LOW-level input voltage
hysteresis voltage
-
-
-
-
-
-
-
-
0.3VDD
V
Vhys
VOH
0.4
-
V
HIGH-level output
voltage
2.5 V VDD 3.6 V; IOH = 20 mA
1.8 V VDD < 2.5 V; IOH = 12 mA
2.0 V VDD 3.6 V; IOL = 4 mA
1.8 V VDD < 2.0 V; IOL = 3 mA
VDD 0.4
-
V
VDD 0.4
-
V
VOL
LOW-level output
voltage
-
0.4
0.4
-
V
-
V
IOH
HIGH-level output
current
VOH = VDD 0.4 V;
2.5 V VDD 3.6 V
20
mA
1.8 V VDD < 2.5 V
VOL = 0.4 V
12
4
-
-
-
-
mA
mA
IOL
LOW-level output
current
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
3
-
-
-
-
mA
mA
[14]
IOLS
LOW-level short-circuit VOL = VDD
output current
50
Ipd
Ipu
pull-down current
pull-up current
VI = 5 V
VI = 0 V
10
50
150
A
A
15
50
85
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
10
50
85
A
A
VDD < VI < 5 V
0
0
0
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Table 5.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ[1]
Max
Unit
I2C-bus pins (PIO0_4 and PIO0_5)
VIH
HIGH-level input
voltage
0.7VDD
-
-
V
VIL
LOW-level input voltage
hysteresis voltage
-
-
0.3VDD
V
Vhys
IOL
-
0.05VDD
-
-
-
V
LOW-level output
current
VOL = 0.4 V; I2C-bus pins configured
as standard mode pins
3.5
mA
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
VOL = 0.4 V; I2C-bus pins configured
as Fast-mode Plus pins
3
-
-
-
-
IOL
LOW-level output
current
20
mA
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
VI = VDD
16
-
-
-
[15]
ILI
input leakage current
2
4
A
A
VI = 5 V
-
10
22
Oscillator pins
Vi(xtal)
crystal input voltage
0.5
0.5
1.8
1.8
1.95
1.95
V
V
Vo(xtal)
USB pins
IOZ
crystal output voltage
[2]
OFF-state output
current
0 V < VI < 3.3 V
-
-
10
A
[2]
[2]
VBUS
VDI
bus supply voltage
-
-
-
5.25
-
V
V
differential input
(D+) (D)
0.2
sensitivity voltage
[2]
[2]
VCM
differential common
mode voltage range
includes VDI range
0.8
0.8
-
-
2.5
2.0
V
V
Vth(rs)se single-ended receiver
switching threshold
voltage
[2]
[2]
VOL
LOW-level output
voltage
for low-/full-speed;
RL of 1.5 k to 3.6 V
-
-
-
0.18
3.5
V
V
VOH
HIGH-level output
voltage
driven; for low-/full-speed;
RL of 15 k to GND
2.8
[2]
Ctrans
ZDRV
transceiver capacitance pin to GND
-
-
-
20
pF
[16][2]
driver output
with 33 series resistor; steady state
drive
36
44.1
impedance for driver
which is not high-speed
capable
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Table 5.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol Parameter
Pin capacitance
Conditions
Min
Typ[1]
Max
Unit
Cio
input/output
capacitance
pins configured for analog function
I2C-bus pins (PIO0_4 and PIO0_5)
pins configured as GPIO
-
-
-
-
-
-
7.1
2.5
2.8
pF
pF
pF
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2] For USB operation 3.0 V VDD 3.6 V. Guaranteed by design.
[3] IRC enabled; system oscillator disabled; system PLL disabled.
[4]
IDD measurements were performed with all pins configured as GPIO outputs driven LOW and pull-up resistors disabled.
[5] BOD disabled.
[6] All peripherals disabled in the AHBCLKCTRL register. Peripheral clocks to USART, SSP0/1 disabled in the SYSCON block.
[7] USB_DP and USB_DM pulled LOW externally.
[8] Low-current mode PWR_LOW_CURRENT selected when running the set_power routine in the power profiles.
[9] IRC disabled; system oscillator enabled; system PLL enabled.
[10] WAKEUP pin pulled HIGH externally. An external pull-up resistor is required on the RESET pin for the Deep power-down mode.
[11] Including voltage on outputs in 3-state mode.
[12] VDD supply voltage must be present.
[13] 3-state outputs go into 3-state mode in Deep power-down mode.
[14] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[15] To VSS
.
[16] Includes external resistors of 33 1 % on USB_DP and USB_DM.
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Table 6.
ADC static characteristics
Tamb = 40 C to +85 C unless otherwise specified; ADC frequency 4.5 MHz, VDD = 2.5 V to 3.6 V.
Symbol
VIA
Parameter
Conditions
Min
Typ
Max
VDD
1
Unit
V
analog input voltage
analog input capacitance
differential linearity error
integral non-linearity
offset error
0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Cia
pF
[1][2]
[3]
ED
1
LSB
LSB
LSB
%
EL(adj)
EO
1.5
3.5
0.6
4
[4]
[5]
EG
gain error
[6]
ET
absolute error
LSB
k
Rvsi
voltage source interface
resistance
40
[7][8]
Ri
input resistance
-
-
2.5
M
[1] The ADC is monotonic, there are no missing codes.
[2] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 8.
[3] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 8.
[4] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 8.
[5] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 8.
[6] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated
ADC and the ideal transfer curve. See Figure 8.
[7] Tamb = 25 C; maximum sampling frequency fs = 400 kSamples/s and analog input capacitance Cia = 1 pF.
[8] Input resistance Ri depends on the sampling frequency fs: Ri = 1 / (fs Cia).
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offset
error
gain
error
E
E
O
G
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
4
3
2
1
0
(5)
(4)
(3)
1 LSB
(ideal)
1018 1019 1020 1021 1022 1023 1024
1
2
3
4
5
6
7
V
(LSB
)
ideal
IA
offset error
E
O
V
− V
SS
DD
1 LSB =
1024
002aaf426
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 8. ADC characteristics
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9.1 BOD static characteristics
Table 7.
BOD static characteristics[1]
Tamb = 25 C.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Vth
threshold voltage interrupt level 1
assertion
-
-
2.22
2.35
-
-
V
V
de-assertion
interrupt level 2
assertion
-
-
2.52
2.66
-
-
V
V
de-assertion
interrupt level 3
assertion
-
-
2.80
2.90
-
-
V
V
de-assertion
reset level 0
assertion
-
-
1.46
1.63
-
-
V
V
de-assertion
reset level 1
assertion
-
-
2.06
2.15
-
-
V
V
de-assertion
reset level 2
assertion
-
-
2.35
2.43
-
-
V
V
de-assertion
reset level 3
assertion
-
-
2.63
2.71
-
-
V
V
de-assertion
[1] Interrupt levels are selected by writing the level value to the BOD control register BODCTRL, see the
LPC11Uxx user manual.
9.2 Power consumption
Power measurements in Active, Sleep, and Deep-sleep modes were performed under the
following conditions (see the LPC11Uxx user manual):
• Configure all pins as GPIO with pull-up resistor disabled in the IOCON block.
• Configure GPIO pins as outputs using the GPIOnDIR registers.
• Write 0 to all GPIOnDATA registers to drive the outputs LOW.
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002aag749
9
6
3
0
(2)
48 MHz
I
DD
(mA)
(2)
36 MHz
(2)
24 MHz
(1)
12 MHz
1.8
2.4
3.0
3.6
V
(V)
DD
Conditions: Tamb = 25 C; Active mode entered executing code while(1){} from flash;
internal pull-up resistors disabled; BOD disabled; all peripherals disabled in the
SYSAHBCLKCTRL register; all peripheral clocks disabled; low-current mode; USB_DP and
USB_DM pulled LOW externally.
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
Fig 9. Typical supply current versus regulator supply voltage VDD in active mode
002aag750
9
(2)
48 MHz
36 MHz
I
DD
(mA)
6
3
0
(2)
(2)
(1)
24 MHz
12 MHz
-40
-15
10
35
60
85
temperature (°C)
Conditions: VDD = 3.3 V; Active mode entered executing code while(1){} from flash; internal
pull-up resistors disabled; BOD disabled; all peripherals disabled in the SYSAHBCLKCTRL
register; all peripheral clocks disabled; low-current mode; USB_DP and USB_DM pulled LOW
externally.
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
Fig 10. Typical supply current versus temperature in Active mode
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002aag751
4
3
2
1
0
I
DD
(mA)
(2)
48 MHz
(2)
36 MHz
(2)
24 MHz
(1)
12 MHz
-40
-15
10
35
60
85
temperature (°C)
Conditions: VDD = 3.3 V; Sleep mode entered from flash; internal pull-up resistors disabled; BOD
disabled; all peripherals disabled in the SYSAHBCLKCTRL register; all peripheral clocks disabled;
low-current mode; USB_DP and USB_DM pulled LOW externally.
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
Fig 11. Typical supply current versus temperature in Sleep mode
002aag745
385
I
DD
(μA)
375
V
V
= 3.6 V
= 3.3 V
DD
DD
365
355
345
V
V
= 2.0 V
= 1.8 V
DD
DD
-40
-15
10
35
60
85
temperature (°C)
Conditions: BOD disabled; all oscillators and analog blocks turned off in the PDSLEEPCFG
register; USB_DP and USB_DM pulled LOW externally.
Fig 12. Typical supply current versus temperature in Deep-sleep mode
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002aag746
20
I
DD
V
= 3.6 V, 3.3 V
DD
(μA)
V
= 2.0 V
= 1.8 V
DD
V
DD
15
10
5
0
-40
-15
10
35
60
85
temperature (°C)
Conditions: BOD disabled; all oscillators and analog blocks turned off in the PDSLEEPCFG
register; USB_DP and USB_DM pulled LOW externally.
Fig 13. Typical supply current versus temperature in Power-down mode
002aag747
0.8
I
DD
V
DD
V
DD
V
DD
V
DD
= 3.6 V
= 3.3 V
= 2.0 V
= 1.8 V
(μA)
0.6
0.4
0.2
0
-40
-15
10
35
60
85
temperature (°C)
Fig 14. Typical supply current versus temperature in Deep power-down mode
9.3 Peripheral power consumption
The supply current per peripheral is measured as the difference in supply current between
the peripheral block enabled and the peripheral block disabled in the SYSAHBCLKCFG
and PDRUNCFG (for analog blocks) registers. All other blocks are disabled in both
registers and no code is executed. Measured on a typical sample at Tamb = 25 C. Unless
noted otherwise, the system oscillator and PLL are running in both measurements.
The supply currents are shown for system clock frequencies of 12 MHz and 48 MHz.
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Table 8.
Power consumption for individual analog and digital blocks
Peripheral
Typical supply current in
mA
Notes
n/a
12 MHz 48 MHz
IRC
0.27
-
-
-
-
-
-
System oscillator running; PLL off; independent
of main clock frequency.
System oscillator 0.22
at 12 MHz
IRC running; PLL off; independent of main clock
frequency.
Watchdog
oscillator at
500 kHz/2
0.004
System oscillator running; PLL off; independent
of main clock frequency.
BOD
0.051
-
-
Independent of main clock frequency.
Main PLL
ADC
-
-
-
0.21
0.08
0.12
-
-
-
0.29
0.47
CLKOUT
Main clock divided by 4 in the CLKOUTDIV
register.
CT16B0
CT16B1
CT32B0
CT32B1
GPIO
-
-
-
-
-
0.02
0.02
0.02
0.02
0.23
0.06
0.06
0.07
0.06
0.88
-
-
-
-
GPIO pins configured as outputs and set to
LOW. Direction and pin state are maintained if
the GPIO is disabled in the SYSAHBCLKCFG
register.
IOCONFIG
I2C
-
-
-
-
-
-
-
0.03
0.04
0.04
0.12
0.12
0.22
0.02
0.10
0.13
0.15
0.45
0.45
0.82
0.06
-
-
-
-
-
-
ROM
SPI0
SPI1
UART
WWDT
Main clock selected as clock source for the
WDT.
USB
-
-
1.2
-
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9.4 Electrical pin characteristics
002aae990
3.6
V
(V)
OH
T = 85 °C
25 °C
−40 °C
3.2
2.8
2.4
2
0
10
20
30
40
50
60
I
(mA)
OH
Conditions: VDD = 3.3 V; on pin PIO0_7.
Fig 15. High-drive output: Typical HIGH-level output voltage VOH versus HIGH-level
output current IOH
.
002aaf019
60
I
T = 85 °C
25 °C
−40 °C
OL
(mA)
40
20
0
0
0.2
0.4
0.6
V
(V)
OL
Conditions: VDD = 3.3 V; on pins PIO0_4 and PIO0_5.
Fig 16. I2C-bus pins (high current sink): Typical LOW-level output current IOL versus
LOW-level output voltage VOL
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002aae991
15
I
OL
T = 85 °C
25 °C
−40 °C
(mA)
10
5
0
0
0.2
0.4
0.6
V
(V)
OL
Conditions: VDD = 3.3 V; standard port pins and PIO0_7.
Fig 17. Typical LOW-level output current IOL versus LOW-level output voltage VOL
002aae992
3.6
V
OH
(V)
T = 85 °C
25 °C
−40 °C
3.2
2.8
2.4
2
0
8
16
24
I
(mA)
OH
Conditions: VDD = 3.3 V; standard port pins.
Fig 18. Typical HIGH-level output voltage VOH versus HIGH-level output source current
IOH
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002aae988
10
I
pu
(μA)
−10
−30
−50
−70
T = 85 °C
25 °C
−40 °C
0
1
2
3
4
5
V (V)
I
Conditions: VDD = 3.3 V; standard port pins.
Fig 19. Typical pull-up current Ipu versus input voltage VI
002aae989
80
T = 85 °C
I
pd
25 °C
(μA)
−40 °C
60
40
20
0
0
1
2
3
4
5
V (V)
I
Conditions: VDD = 3.3 V; standard port pins.
Fig 20. Typical pull-down current Ipd versus input voltage VI
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10. Dynamic characteristics
10.1 Flash memory
Table 9.
Flash characteristics
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Nendu
tret
Parameter
endurance
Conditions
Min
Typ
Max
Unit
[1]
10000 100000
-
cycles
years
years
ms
retention time
powered
10
20
95
-
-
unpowered
-
-
ter
erase time
sector or multiple
100
105
consecutive sectors
[2]
tprog
programming time
0.95
1
1.05
ms
[1] Number of program/erase cycles.
[2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash
in blocks of 256 bytes.
Table 10. EEPROM characteristics
Tamb = 40 C to +85 C; VDD = 2.7 V to 3.6 V. Based on JEDEC NVM qualification. Failure rate <
10 ppm for parts as specified below.
Symbol
Nendu
tret
Parameter
endurance
Conditions
Min
100000
100
150
-
Typ
Max
Unit
1000000
200
-
-
-
-
cycles
years
years
ms
retention time
powered
unpowered
64 bytes
300
tprog
programming
time
2.9
10.2 External clock
Table 11. Dynamic characteristic: external clock
Tamb = 40 C to +85 C; VDD over specified ranges.[1]
Symbol Parameter Conditions
Min
Typ[2] Max
Unit
MHz
ns
fosc
oscillator frequency
1
-
-
-
-
-
-
25
Tcy(clk)
tCHCX
tCLCX
tCLCH
tCHCL
clock cycle time
clock HIGH time
clock LOW time
clock rise time
clock fall time
40
1000
Tcy(clk) 0.4
-
ns
Tcy(clk) 0.4
-
ns
-
-
5
5
ns
ns
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
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t
CHCX
t
t
t
CHCL
CLCX
CLCH
T
cy(clk)
002aaa907
Fig 21. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
10.3 Internal oscillators
Table 12. Dynamic characteristics: IRC
amb = 40 C to +85 C; 2.7 V VDD 3.6 V[1].
T
Symbol
fosc(RC)
Parameter
Conditions
Min
Typ[2]
Max
Unit
internal RC oscillator
frequency
-
11.88
12
12.12
MHz
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
002aaf403
12.15
f
(MHz)
VDD = 3.6 V
3.3 V
3.0 V
2.7 V
12.05
2.4 V
2.0 V
11.95
11.85
−40
−15
10
35
60
85
temperature (°C)
Conditions: Frequency values are typical values. 12 MHz 1 % accuracy is guaranteed for
2.7 V VDD 3.6 V and Tamb = 40 C to +85 C. Variations between parts may cause the IRC to
fall outside the 12 MHz 1 % accuracy specification for voltages below 2.7 V.
Fig 22. Internal RC oscillator frequency versus temperature
Table 13. Dynamic characteristics: Watchdog oscillator
Symbol
Parameter
Conditions
Min Typ[1] Max Unit
[2][3]
[2][3]
fosc(int)
internal oscillator DIVSEL = 0x1F, FREQSEL = 0x1
-
7.8
-
kHz
frequency
in the WDTOSCCTRL register;
DIVSEL = 0x00, FREQSEL = 0xF
in the WDTOSCCTRL register
-
1700
-
kHz
[1] Typical ratings are not guaranteed. The values listed are at nominal supply voltages.
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[2] The typical frequency spread over processing and temperature (Tamb = 40 C to +85 C) is 40 %.
[3] See the LPC11Uxx user manual.
10.4 I/O pins
Table 14. Dynamic characteristics: I/O pins[1]
Tamb = 40 C to +85 C; 3.0 V VDD 3.6 V.
Symbol Parameter Conditions
Min
3.0
2.5
Typ
Max
5.0
Unit
ns
tr
tf
rise time
fall time
pin configured as output
pin configured as output
-
-
5.0
ns
[1] Applies to standard port pins and RESET pin.
10.5 I2C-bus
Table 15. Dynamic characteristic: I2C-bus pins[1]
Tamb = 40 C to +85 C.[2]
Symbol
Parameter
Conditions
Min
Max
100
400
1
Unit
fSCL
SCL clock
frequency
Standard-mode
Fast-mode
0
0
0
-
kHz
kHz
MHz
ns
Fast-mode Plus
[3][4][5][6]
tf
fall time
of both SDA and SCL
signals
300
Standard-mode
Fast-mode
20 + 0.1 Cb
300
ns
ns
s
s
s
s
s
s
s
s
s
ns
ns
ns
Fast-mode Plus
Standard-mode
Fast-mode
-
120
tLOW
LOW period of the
SCL clock
4.7
1.3
0.5
4.0
0.6
0.26
0
-
-
-
-
-
-
-
-
-
-
-
-
Fast-mode Plus
Standard-mode
Fast-mode
tHIGH
HIGH period of the
SCL clock
Fast-mode Plus
Standard-mode
Fast-mode
[3][7][8]
[9][10]
tHD;DAT
data hold time
0
Fast-mode Plus
Standard-mode
Fast-mode
0
tSU;DAT
data set-up time
250
100
50
Fast-mode Plus
[1] See the I2C-bus specification UM10204 for details.
[2] Parameters are valid over operating temperature range unless otherwise specified.
[3] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the SCL signal) to
bridge the undefined region of the falling edge of SCL.
[4] Cb = total capacitance of one bus line in pF.
[5] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at
250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines
without exceeding the maximum specified tf.
[6] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should
allow for this when considering bus timing.
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[7] The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than the maximum of tVD;DAT or
tVD;ACK by a transition time (see UM10204). This maximum must only be met if the device does not stretch the LOW period (tLOW) of the
SCL signal. If the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock.
[8] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge.
[9] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the
acknowledge.
[10] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement tSU;DAT = 250 ns must then be met.
This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the
LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the
Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time.
t
f
t
SU;DAT
70 %
30 %
70 %
30 %
SDA
SCL
t
t
HD;DAT
VD;DAT
t
f
t
HIGH
70 %
30 %
70 %
30 %
70 %
30 %
70 %
30 %
t
LOW
1 / f
S
SCL
002aaf425
Fig 23. I2C-bus pins clock timing
LPC11U2X
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10.6 SSP interface
Table 16. Dynamic characteristics of SPI pins in SPI mode
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
SPI master (in SPI mode)
[1]
[1]
[2]
Tcy(clk)
clock cycle time
data set-up time
full-duplex mode
when only transmitting
in SPI mode
50
40
15
-
-
-
-
ns
ns
ns
tDS
2.4 V VDD 3.6 V
2.0 V VDD < 2.4 V
1.8 V VDD < 2.0 V
in SPI mode
[2]
[2]
[2]
[2]
[2]
20
24
0
ns
ns
ns
ns
ns
-
-
-
-
-
tDH
data hold time
-
tv(Q)
th(Q)
data output valid time in SPI mode
data output hold time in SPI mode
-
10
-
0
SPI slave (in SPI mode)
Tcy(PCLK) PCLK cycle time
20
-
-
-
-
-
-
ns
ns
ns
ns
ns
[3][4]
[3][4]
[3][4]
[3][4]
tDS
data set-up time
data hold time
in SPI mode
in SPI mode
0
-
tDH
3 Tcy(PCLK) + 4
-
tv(Q)
th(Q)
data output valid time in SPI mode
data output hold time in SPI mode
-
-
3 Tcy(PCLK) + 11
2 Tcy(PCLK) + 5
[1] Tcy(clk) = (SSPCLKDIV (1 + SCR) CPSDVSR) / fmain. The clock cycle time derived from the SPI bit rate Tcy(clk) is a function of the
main clock frequency fmain, the SPI peripheral clock divider (SSPCLKDIV), the SPI SCR parameter (specified in the SSP0CR0 register),
and the SPI CPSDVSR parameter (specified in the SPI clock prescale register).
[2]
[3] Tcy(clk) = 12 Tcy(PCLK)
[4] Tamb = 25 C; for normal voltage supply range: VDD = 3.3 V.
Tamb = 40 C to 85 C.
.
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32-bit ARM Cortex-M0 microcontroller
T
cy(clk)
SCK (CPOL = 0)
SCK (CPOL = 1)
MOSI
t
t
h(Q)
v(Q)
DATA VALID
DATA VALID
CPHA = 1
t
t
DH
DS
DATA VALID
DATA VALID
MISO
t
t
h(Q)
v(Q)
DATA VALID
DATA VALID
t
MOSI
MISO
t
CPHA = 0
DS
DH
DATA VALID
DATA VALID
002aae829
Fig 24. SSP master timing in SPI mode
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T
cy(clk)
SCK (CPOL = 0)
SCK (CPOL = 1)
t
t
DH
DS
MOSI
MISO
DATA VALID
DATA VALID
t
t
h(Q)
v(Q)
CPHA = 1
DATA VALID
DATA VALID
t
t
DH
DS
MOSI
MISO
DATA VALID
DATA VALID
DATA VALID
t
t
h(Q)
CPHA = 0
v(Q)
DATA VALID
002aae830
Fig 25. SSP slave timing in SPI mode
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10.7 USB interface
Table 17. Dynamic characteristics: USB pins (full-speed)
CL = 50 pF; Rpu = 1.5 k on D+ to VDD; 3.0 V VDD 3.6 V.
Symbol
Parameter
rise time
fall time
Conditions
10 % to 90 %
10 % to 90 %
tr / tf
Min
8.5
7.7
-
Typ
Max
13.8
13.7
109
Unit
ns
tr
-
-
-
tf
ns
tFRFM
differential rise and fall time
matching
%
VCRS
output signal crossover voltage
source SE0 interval of EOP
1.3
160
2
-
-
-
2.0
175
+5
V
tFEOPT
tFDEOP
see Figure 26
ns
ns
source jitter for differential transition see Figure 26
to SE0 transition
tJR1
receiver jitter to next transition
18.5
9
-
-
-
+18.5
ns
ns
ns
tJR2
receiver jitter for paired transitions
EOP width at receiver
10 % to 90 %
+9
-
[1]
tEOPR
must accept as
EOP; see
82
Figure 26
[1] Characterized but not implemented as production test. Guaranteed by design.
T
PERIOD
crossover point
extended
crossover point
differential
data lines
source EOP width: t
FEOPT
differential data to
SE0/EOP skew
PERIOD FDEOP
n
T
+ t
receiver EOP width: t
EOPR
aaa-009330
Fig 26. Differential data-to-EOP transition skew and EOP width
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11. Application information
11.1 Suggested USB interface solutions
The USB device can be connected to the USB as self-powered device (see Figure 27) or
bus-powered device (see Figure 28).
On the LPC11U2x, the PIO0_3/USB_VBUS pin is 5 V tolerant only when VDD is applied
and at operating voltage level. Therefore, if the USB_VBUS function is connected to the
USB connector and the device is self-powered, the USB_VBUS pin must be protected for
situations when VDD = 0 V.
If VDD is always at operating level while VBUS = 5 V, the USB_VBUS pin can be
connected directly to the VBUS pin on the USB connector.
For systems where VDD can be 0 V and VBUS is directly applied to the VBUS pin,
precautions must be taken to reduce the voltage to below 3.6 V, which is the maximum
allowable voltage on the USB_VBUS pin in this case.
One method is to use a voltage divider to connect the USB_VBUS pin to the VBUS on the
USB connector. The voltage divider ratio should be such that the USB_VBUS pin will be
greater than 0.7VDD to indicate a logic HIGH while below the 3.6 V allowable maximum
voltage.
For the following operating conditions
VBUSmax = 5.25 V
VDD = 3.6 V,
the voltage divider should provide a reduction of 3.6 V/5.25 V or ~0.686 V.
V
DD
USB_CONNECT
soft-connect switch
R1
1.5 kΩ
LPC1xxx
R2
R3
USB_VBUS
R
= 33 Ω
= 33 Ω
S
S
USB-B
connector
USB_DP
USB_DM
R
V
SS
aaa-010178
Fig 27. USB interface on a self-powered device where USB_VBUS = 5 V
LPC11U2X
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For a bus-powered device, the VBUS signal does not need to be connected to the
USB_VBUS pin (see Figure 28). The USB_CONNECT function can additionally be
connected as shown in Figure 27 to prevent the USB from timing out when there is a
significant delay between power-up and handling USB traffic.
V
DD
REGULATOR
LPC1xxx
R1
1.5 kΩ
VBUS
USB-B
connector
R
R
= 33 Ω
= 33 Ω
S
USB_DP
USB_DM
S
V
SS
aaa-010179
Fig 28. USB interface on a bus-powered device
Remark: When a bus-powered circuit as shown in Figure 28 is used, configure the
PIO0_3/USB_VBUS pin for GPIO (PIO0_3) in the IOCON block to ensure that the
USB_CONNECT signal can still be controlled by software. For details on the soft-connect
feature, see the LPC11U2x user manual (Ref. 1).
Remark: When a self-powered circuit is used without connecting VBUS, configure the
PIO0_3/USB_VBUS pin for GPIO (PIO0_3) and provide software that can detect the host
presence through some other mechanism before enabling USB_CONNECT and the
soft-connect feature. Enabling the soft-connect without host presence will lead to USB
compliance failure.
11.2 XTAL input
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave
mode, a minimum of 200 mV (RMS) is needed.
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LPC1xxx
XTALIN
C
i
C
g
100 pF
002aae788
Fig 29. Slave mode operation of the on-chip oscillator
In slave mode, couple the input clock signal with a capacitor of 100 pF (Figure 29), with an
amplitude between 200 mV (RMS) and 1000 mV (RMS). This signal corresponds to a
square wave signal with a signal swing of between 280 mV and 1.4 V. The XTALOUT pin
in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in Figure 30 and in
Table 18 and Table 19. Since the feedback resistance is integrated on chip, only a crystal
and the capacitances CX1 and CX2 need to be connected externally in case of
fundamental mode oscillation (L, CL and RS represent the fundamental frequency).
Capacitance CP in Figure 30 represents the parallel package capacitance and must not be
larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal
manufacturer.
LPC1xxx
L
XTALIN
XTALOUT
C
L
C
P
=
XTAL
R
S
C
X2
C
X1
002aaf424
Fig 30. Oscillator modes and models: oscillation mode of operation and external crystal
model used for CX1/CX2 evaluation
LPC11U2X
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Table 18. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation Crystal load
Maximum crystal
External load
frequency FOSC
capacitance CL
series resistance RS
capacitors CX1, CX2
1 MHz to 5 MHz
10 pF
< 300
< 300
< 300
< 300
< 200
< 100
< 160
< 60
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
20 pF
30 pF
5 MHz to 10 MHz
10 pF
20 pF
30 pF
10 MHz to 15 MHz
15 MHz to 20 MHz
10 pF
20 pF
10 pF
< 80
Table 19. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) high frequency mode
Fundamental oscillation Crystal load
Maximum crystal
External load
frequency FOSC
capacitance CL
series resistance RS
capacitors CX1, CX2
15 MHz to 20 MHz
10 pF
< 180
< 100
< 160
< 80
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
39 pF, 39 pF
20 pF
20 MHz to 25 MHz
10 pF
20 pF
11.3 XTAL Printed-Circuit Board (PCB) layout guidelines
Follow these guidelines for PCB layout:
• Connect the crystal on the PCB as close as possible to the oscillator input and output
pins of the chip.
• Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal
use have a common ground plane.
• Connect the external components to the ground plain.
• To keep parasitics and the noise coupled in via the PCB as small as possible, keep
loops as small as possible.
• Choose smaller values of Cx1 and Cx2 if parasitics of the PCB layout increase.
LPC11U2X
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11.4 Standard I/O pad configuration
Figure 31 shows the possible pin modes for standard I/O pins with analog input function:
• Digital output driver
• Digital input: Pull-up enabled/disabled
• Digital input: Pull-down enabled/disabled
• Digital input: Repeater mode enabled/disabled
• Analog input
V
DD
ESD
output enable
pin configured
as digital output
driver
output
PIN
ESD
V
V
DD
SS
weak
pull-up
pull-up enable
weak
pull-down
repeater mode
enable
pin configured
as digital input
pull-down enable
data input
select analog input
pin configured
as analog input
analog input
002aaf304
Fig 31. Standard I/O pad configuration
LPC11U2X
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32-bit ARM Cortex-M0 microcontroller
11.5 Reset pad configuration
V
DD
V
DD
V
DD
R
pu
ESD
20 ns RC
GLITCH FILTER
reset
PIN
ESD
V
SS
002aaf274
Fig 32. Reset pad configuration
11.6 ADC effective input impedance
A simplified diagram of the ADC input channels can be used to determine the effective
input impedance seen from an external voltage source. See Figure 33.
ADC Block
Source
R
R
R
mux
sw
s
ADC
COMPARATOR
<2 kΩ
<1.3 kΩ
R
in
C
ia
V
C
EXT
io
V
SS
002aah615
Fig 33. ADC input channel
The effective input impedance, Rin, seen by the external voltage source, VEXT, is the
parallel impedance of ((1/fs x Cia) + Rmux + Rsw) and (1/fs x Cio), and can be calculated
using Equation 1 with
fs = sampling frequency
Cia = ADC analog input capacitance
Rmux = analog mux resistance
Rsw = switch resistance
Cio = pin capacitance
1
1
-----------------
Rin
=
+ Rmux + R
(1)
-----------------
sw
fs Cio
fs Cia
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32-bit ARM Cortex-M0 microcontroller
Under nominal operating condition VDD = 3.3 V and with the maximum sampling
frequency fs = 400 kHz, the parameters assume the following values:
Cia = 1 pF (max)
Rmux = 2 kΩ (max)
Rsw = 1.3 kΩ (max)
Cio = 7.1 pF (max)
The effective input impedance with these parameters is Rin = 308 kΩ.
11.7 ADC usage notes
The following guidelines show how to increase the performance of the ADC in a noisy
environment beyond the ADC specifications listed in Table 6:
• The ADC input trace must be short and as close as possible to the LPC11U2x chip.
• Shield The ADC input traces from fast switching digital signals and noisy power
supply lines.
• The ADC and the digital core share the same power supply. Therefore, filter the power
supply line adequately.
• To improve the ADC performance in a noisy environment, put the device in Sleep
mode during the ADC conversion.
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12. Package outline
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 x 7 x 0.85 mm
D
B
A
terminal 1
index area
E
A
A
1
c
detail X
e
1
C
v
C
C
A
B
e
b
y
1
y
w
C
9
16
L
8
17
e
E
e
2
h
33
1
24
X
terminal 1
index area
32
25
0
D
h
2.5
scale
5 mm
v
Dimensions
Unit
(1)
(1)
(1)
A
A
b
c
D
D
E
E
e
e
1
e
2
L
w
y
y
1
1
h
h
max 1.00 0.05 0.35
mm nom 0.85 0.02 0.28 0.2 7.0 4.70 7.0 4.70 0.65 4.55 4.55 0.60 0.1 0.05 0.08 0.1
min 0.80 0.00 0.23 6.9 4.55 6.9 4.55 0.45
7.1 4.85 7.1 4.85
0.75
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
hvqfn33_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
- - -
09-03-17
09-03-23
Fig 34. Package outline HVQFN33 (7 x 7 x 0.85 mm)
LPC11U2X
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Product data sheet
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59 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
D
B
A
terminal 1
index area
A
A
1
E
c
detail X
C
e
1
y
y
v
w
C
C
A
B
C
1
e
1/2 e
b
9
16
L
17
8
e
e
E
h
2
1/2 e
24
1
terminal 1
index area
32
25
X
D
h
0
2.5
scale
5 mm
Dimensions (mm are the original dimensions)
(1)
(1)
(1)
(1)
Unit
A
A
1
b
c
D
D
E
E
e
e
e
L
v
w
y
y
1
h
h
1
2
max
0.05 0.30
5.1 3.75 5.1 3.75
0.5
mm nom 0.85
min
0.2
0.5 3.5 3.5
0.1 0.05 0.05 0.1
0.00 0.18
4.9 3.45 4.9 3.45
0.3
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
hvqfn33f_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
11-10-11
11-10-17
MO-220
Fig 35. Package outline HVQFN33 (5 x 5 x 0.85 mm)
LPC11U2X
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LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
c
y
X
36
25
A
E
37
24
Z
E
e
H
E
A
2
A
(A )
3
A
1
w M
p
θ
pin 1 index
b
L
p
L
13
48
detail X
1
12
Z
v M
D
A
e
w M
b
p
D
B
H
v
M
B
D
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.20 1.45
0.05 1.35
0.27 0.18 7.1
0.17 0.12 6.9
7.1
6.9
9.15 9.15
8.85 8.85
0.75
0.45
0.95 0.95
0.55 0.55
1.6
mm
0.25
0.5
1
0.2 0.12 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-01-19
03-02-25
SOT313-2
136E05
MS-026
Fig 36. Package outline LQFP48 (SOT313-2)
LPC11U2X
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Product data sheet
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61 of 74
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NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2
y
X
A
48
33
Z
49
32
E
e
H
A
E
2
E
A
(A )
3
A
1
w M
p
θ
b
L
p
pin 1 index
L
64
17
detail X
1
16
Z
v
M
A
D
e
w M
b
p
D
B
H
v
M
B
D
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.20 1.45
0.05 1.35
0.27 0.18 10.1 10.1
0.17 0.12 9.9 9.9
12.15 12.15
11.85 11.85
0.75
0.45
1.45 1.45
1.05 1.05
1.6
mm
0.25
0.5
1
0.2 0.12 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-01-19
03-02-25
SOT314-2
136E10
MS-026
Fig 37. Package outline LQFP64 (SOT314-2)
LPC11U2X
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NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
TFBGA48: plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 x 4.5 x 0.7 mm
SOT1155-2
D
B
A
ball A1
index area
A
2
E
A
A
1
detail X
e
1
C
Ø v
Ø w
C
C
A
B
e
1/2 e
b
y
1
y
C
H
e
G
F
E
D
C
B
A
e
2
1/2 e
ball A1
index area
solder mask open area
not for solder ball
1
2
3
4
5
6
7
8
X
0
5 mm
scale
Dimensions
Unit
A
A
1
A
2
b
D
E
e
e
1
e
2
v
w
y
y
1
max 1.10 0.30 0.80 0.35 4.6 4.6
mm nom 0.95 0.25 0.70 0.30 4.5 4.5 0.5 3.5 3.5 0.15 0.05 0.08 0.1
min 0.85 0.20 0.65 0.25 4.4 4.4
sot1155-2_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
- - -
JEITA
13-06-17
13-06-19
SOT1155-2
Fig 38. Package outline TFBGA48 (SOT1155-2)
LPC11U2X
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Product data sheet
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NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
13. Soldering
Footprint information for reflow soldering of HVQFN33 package
Hx
Gx
see detail X
P
nSPx
Ay
By
SLy
Hy Gy
nSPy
C
D
SLx
Bx
Ax
0.60
0.30
solder land
solder paste
occupied area
detail X
Dimensions in mm
P
Ax
Ay
Bx
By
C
D
Gx
Gy
Hx
Hy
6.2
SLx
SLy
nSPx nSPy
0.5
5.95
5.95
4.25
4.25
0.85
0.27
5.25
5.25
6.2
3.75
3.75
3
3
11-11-15
11-11-20
Issue date
002aag766
Fig 39. Reflow soldering for the HVQFN33 (5x5) package
LPC11U2X
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Product data sheet
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64 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Footprint information for reflow soldering of HVQFN33 package
OID = 8.20 OA
PID = 7.25 PA+OA
OwDtot = 5.10 OA
evia = 4.25
0.20 SR
chamfer (4×)
W = 0.30 CU
e = 0.65
SPD = 1.00 SP
0.45 DM
GapD = 0.70 SP
evia = 2.40
B-side
SDhtot = 2.70 SP
Solder resist
covered via
4.55 SR
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
0.30 PH
0.60 SR cover
0.60 CU
(A-side fully covered)
number of vias: 20
solder land
solder land plus solder paste
solder paste deposit
occupied area
solder resist
Remark:
Stencil thickness: 0.125 mm
Dimensions in mm
001aao134
Fig 40. Reflow soldering for the HVQFN33 (7x7) package
LPC11U2X
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Product data sheet
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65 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Footprint information for reflow soldering of LQFP48 package
SOT313-2
Hx
Gx
(0.125)
P2
P1
Hy Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500 0.560 10.350 10.350 7.350 7.350 1.500 0.280 0.500 7.500 7.500 10.650 10.650
sot313-2_fr
Fig 41. Reflow soldering for the LQFP48 package
LPC11U2X
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Product data sheet
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66 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Footprint information for reflow soldering of TFBGA48 package
SOT1155-2
Hx
P
P
Hy
see detail X
solder land
solder paste deposit
solder land plus solder paste
SL
occupied area
solder resist
SP
SR
detail X
DIMENSIONS in mm
P
SL
SP
SR
Hx
Hy
0.50
0.225 0.275 0.325
4.75
4.75
sot1155-2_fr
Fig 42. Reflow soldering for the TFBGA48 package
LPC11U2X
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Product data sheet
Rev. 2.3 — 27 March 2014
67 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Footprint information for reflow soldering of LQFP64 package
SOT314-2
Hx
Gx
(0.125)
P2
P1
Hy Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500 0.560 13.300 13.300 10.300 10.300 1.500 0.280 0.400 10.500 10.500 13.550 13.550
sot314-2_fr
Fig 43. Reflow soldering for the LQFP64 package
LPC11U2X
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Product data sheet
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68 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
14. Abbreviations
Table 20. Abbreviations
Acronym
A/D
Description
Analog-to-Digital
ADC
AHB
APB
Analog-to-Digital Converter
Advanced High-performance Bus
Advanced Peripheral Bus
BrownOut Detection
BOD
GPIO
JTAG
PLL
General Purpose Input/Output
Joint Test Action Group
Phase-Locked Loop
RC
Resistor-Capacitor
SPI
Serial Peripheral Interface
Serial Synchronous Interface
Synchronous Serial Port
Test Access Port
SSI
SSP
TAP
USART
Universal Synchronous Asynchronous Receiver/Transmitter
15. References
[1] LPC11U2x User manual UM10462:
http://www.nxp.com/documents/user_manual/UM10462.pdf
[2] LPC11U2x Errata sheet:
http://www.nxp.com/documents/errata_sheet/ES_LPC11U2X.pdf
LPC11U2X
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Product data sheet
Rev. 2.3 — 27 March 2014
69 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
16. Revision history
Table 21. Revision history
Document ID
Release date
20140327
Data sheet status
Change notice
Supersedes
LPC11U2x v.2.3
Product data sheet
-
LPC11U2X v.2.2
Part LPC11U22FBD48/301 added.
20140311 Product data sheet
LPC11U2X v.2.2
Modifications:
-
LPC11U2X v.2.1
• Updated Section 11.1 “Suggested USB interface solutions” for clarity.
• Open-drain I2C-bus and RESET pin descriptions updated for clarity. See Table 3.
LPC11U2X v.2.1
Modifications:
20130917
Product data sheet
-
LPC11U2X v.2
• Number of CAP and MAT functions for timers updated in Figure 1.
• Table 3: Added “5 V tolerant pad” to RESET/PIO0_0 table note.
• Table 7: Removed BOD interrupt level 0.
• Added Section 11.6 “ADC effective input impedance”.
• Programmable glitch filter is enabled by default. See Section 7.7.1.
• Table 5 “Static characteristics” added Pin capacitance section.
• Updated Section 11.1 “Suggested USB interface solutions”.
• Table 4 “Limiting values”:
–
Updated VDD min and max.
–
Updated VI conditions.
• Table 10 “EEPROM characteristics”:
–
Removed fclk and ter; the user does not have control over these parameters.
–
Changed the tprog from 1.1 ms to 2.9 ms; the EEPROM IAP always does an erase and
program, thus the total program time is ter + tprog
.
• Changed title of Figure 29 from “USB interface on a self-powered device” to “USB interface
with soft-connect”.
• Section 10.7 “USB interface” added. Parameter tEOPR1 and tEOPR2 renamed to tEOPR
.
LPC11U2X v.2
Modifications:
20120113 Product data sheet LPC11U2X v.1
-
• Use of USB with power profiles specified (Section 7.17.5.1).
• Power consumption data added in Section 9.2.
• SSP dynamic characteristics added (Table 16).
• IRC dynamic characteristics added (Table 12).
• Data sheet status changed to Product data sheet.
LPC11U2X v.1
20111129
Preliminary data sheet
-
-
LPC11U2X
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LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
17.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
LPC11U2X
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Product data sheet
Rev. 2.3 — 27 March 2014
71 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
17.4 Trademarks
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP Semiconductors N.V.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
LPC11U2X
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Product data sheet
Rev. 2.3 — 27 March 2014
72 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
19. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
7.17.5
Power control. . . . . . . . . . . . . . . . . . . . . . . . . 24
7.17.5.1 Power profiles . . . . . . . . . . . . . . . . . . . . . . . . 25
7.17.5.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.17.5.3 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . 25
7.17.5.4 Power-down mode. . . . . . . . . . . . . . . . . . . . . 25
7.17.5.5 Deep power-down mode . . . . . . . . . . . . . . . . 26
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
4
4.1
5
7.17.6
System control . . . . . . . . . . . . . . . . . . . . . . . . 26
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.17.6.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.17.6.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 26
7.17.6.3 Code security (Code Read Protection - CRP) 26
7.17.6.4 APB interface. . . . . . . . . . . . . . . . . . . . . . . . . 27
7.17.6.5 AHBLite . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
7.17.6.6 External interrupt inputs. . . . . . . . . . . . . . . . . 27
7
7.1
7.2
7.3
7.4
7.5
7.6
7.6.1
7.6.2
7.7
7.7.1
7.8
Functional description . . . . . . . . . . . . . . . . . . 14
On-chip flash programming memory . . . . . . . 14
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
On-chip ROM . . . . . . . . . . . . . . . . . . . . . . . . . 15
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 15
Nested Vectored Interrupt Controller (NVIC) . 16
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 17
IOCON block . . . . . . . . . . . . . . . . . . . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
General-Purpose Input/Output GPIO . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
USB interface . . . . . . . . . . . . . . . . . . . . . . . . 18
Full-speed USB device controller . . . . . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
SSP serial I/O controller . . . . . . . . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
I2C-bus serial I/O controller . . . . . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
General purpose external event
7.18
Emulation and debugging . . . . . . . . . . . . . . . 28
8
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 29
9
Static characteristics . . . . . . . . . . . . . . . . . . . 30
BOD static characteristics . . . . . . . . . . . . . . . 36
Power consumption . . . . . . . . . . . . . . . . . . . 36
Peripheral power consumption . . . . . . . . . . . 39
Electrical pin characteristics. . . . . . . . . . . . . . 41
9.1
9.2
9.3
9.4
10
Dynamic characteristics. . . . . . . . . . . . . . . . . 44
Flash memory . . . . . . . . . . . . . . . . . . . . . . . . 44
External clock. . . . . . . . . . . . . . . . . . . . . . . . . 44
Internal oscillators . . . . . . . . . . . . . . . . . . . . . 45
I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
I2C-bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
SSP interface. . . . . . . . . . . . . . . . . . . . . . . . . 48
USB interface . . . . . . . . . . . . . . . . . . . . . . . . 51
10.1
10.2
10.3
10.4
10.5
10.6
10.7
7.8.1
7.9
7.9.1
7.9.1.1
7.10
7.10.1
7.11
7.11.1
7.12
7.12.1
7.13
7.13.1
7.14
11
Application information . . . . . . . . . . . . . . . . . 52
Suggested USB interface solutions . . . . . . . . 52
XTAL input . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
XTAL Printed-Circuit Board (PCB) layout
11.1
11.2
11.3
guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Standard I/O pad configuration . . . . . . . . . . . 56
Reset pad configuration. . . . . . . . . . . . . . . . . 57
ADC effective input impedance . . . . . . . . . . . 57
ADC usage notes. . . . . . . . . . . . . . . . . . . . . . 58
11.4
11.5
11.6
11.7
counter/timers. . . . . . . . . . . . . . . . . . . . . . . . . 20
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
System tick timer . . . . . . . . . . . . . . . . . . . . . . 21
Windowed WatchDog Timer (WWDT) . . . . . . 21
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Clocking and power control . . . . . . . . . . . . . . 22
Integrated oscillators . . . . . . . . . . . . . . . . . . . 22
7.14.1
7.15
7.16
7.16.1
7.17
7.17.1
12
13
14
15
16
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 59
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 69
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Revision history . . . . . . . . . . . . . . . . . . . . . . . 70
7.17.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 23
7.17.1.2 System oscillator . . . . . . . . . . . . . . . . . . . . . . 24
7.17.1.3 Watchdog oscillator . . . . . . . . . . . . . . . . . . . . 24
7.17.2
7.17.3
7.17.4
17
Legal information . . . . . . . . . . . . . . . . . . . . . . 71
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 71
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 71
17.1
17.2
17.3
System PLL and USB PLL . . . . . . . . . . . . . . . 24
Clock output . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Wake-up process . . . . . . . . . . . . . . . . . . . . . . 24
continued >>
LPC11U2X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.3 — 27 March 2014
73 of 74
LPC11U2x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
17.4
18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Contact information. . . . . . . . . . . . . . . . . . . . . 72
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 March 2014
Document identifier: LPC11U2X
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