LPC1500 [NXP]
32-bit ARM Cortex-M3 microcontroller; up to 256 kB flash and 36 kB SRAM;
| 型号： | LPC1500 |
| 厂家： | 
NXP |
| 描述： | 32-bit ARM Cortex-M3 microcontroller; up to 256 kB flash and 36 kB SRAM 静态存储器 |
| 文件： | 总99页 (文件大小：1701K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LPC15xx
32-bit ARM Cortex-M3 microcontroller; up to 256 kB flash and
36 kB SRAM; FS USB, CAN, RTC, SPI, USART, I2C
Rev. 1 — 19 February 2014
Product data sheet
1. General description
The LPC15xx are ARM Cortex-M3 based microcontrollers for embedded applications
featuring a rich peripheral set with very low power consumption. The ARM Cortex-M3 is a
next generation core that offers system enhancements such as enhanced debug features
and a higher level of support block integration.
The LPC15xx operate at CPU frequencies of up to 72 MHz. The ARM Cortex-M3 CPU
incorporates a 3-stage pipeline and uses a Harvard architecture with separate local
instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3
CPU also includes an internal prefetch unit that supports speculative branching.
The LPC15xx includes up to 256 kB of flash memory, 32 kB of ROM, a 4 kB EEPROM,
and up to 36 kB of SRAM. The peripheral compliment includes one full-speed USB 2.0
device, two SPI interfaces, three USARTs, one Fast-mode Plus I2C-bus interface, one
C_CAN module, PWM/timer subsystem with four configurable, multi-purpose State
Configurable Timers (SCTimer/PWM) with input pre-processing unit, a Real-time clock
module with independent power supply and a dedicated oscillator, two 12-channel/12-bit,
2 Msamples/s ADCs, one 12-bit, 500 kSamples/s DAC, four voltage comparators with
internal voltage reference, and a temperature sensor. A DMA engine can service most
peripherals.
For additional documentation related to the LPC15xx parts, see Section 17 “References”.
2. Features and benefits
System:
ARM Cortex-M3 processor (version r2p1), running at frequencies of up to 72 MHz.
ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
System tick timer.
Serial Wire Debug (SWD) with four breakpoints and two watchpoints.
Single-cycle multiplier supported.
Memory Protection Unit (MPU) included.
Memory:
Up to 256 kB on-chip flash programming memory with 256 Byte page write and
erase.
Up to 36 kB SRAM.
4 kB EEPROM.
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
ROM API support:
Boot loader with boot options from flash or external source via USART, C_CAN, or
USB
USB drivers
ADC drivers
SPI drivers
USART drivers
I2C drivers
Power profiles and power mode configuration with low-power mode configuration
option
DMA drivers
C_CAN drivers
Flash In-Application Programming (IAP) and In-System Programming (ISP).
Digital peripherals:
Simple DMA engine with 18 channels and 20 programmable input triggers.
High-speed GPIO interface with up to 76 General-Purpose I/O (GPIO) pins with
configurable pull-up/pull-down resistors, open-drain mode, input inverter, and
programmable digital glitch filter.
GPIO interrupt generation capability with boolean pattern-matching feature on eight
external inputs.
Two GPIO grouped port interrupts.
Switch matrix for flexible configuration of each I/O pin function.
CRC engine.
Quadrature Encoder Interface (QEI).
Configurable PWM/timer/motor control subsystem:
Up to four 32-bit counter/timers or up to eight 16-bit counter/timers or combinations
of 16-bit and 32-bit timers.
Up to 28 match outputs and 22 configurable capture inputs with input multiplexer.
Up to 28 PWM outputs total.
Dither engine for improved average resolution of pulse edges.
Four State Configurable Timers (SCTimers) for highly flexible, event-driven timing
and PWM applications.
SCT Input Pre-processor Unit (SCTIPU) for processing timer inputs and immediate
handling of abort situations.
Integrated with ADC threshold compare interrupts, temperature sensor, and analog
comparator outputs for motor control feedback using analog signals.
Special-application and simple timers:
24-bit, four-channel, multi-rate timer (MRT) for repetitive interrupt generation at up
to four programmable, fixed rates.
Repetitive interrupt timer for general purpose use.
Windowed Watchdog timer (WWDT).
High-resolution 32-bit Real-time clock (RTC) with selectable 1 s or 1 ms time
resolution running in the always-on power domain. RTC can be used for wake-up
from all low power modes including Deep power-down.
LPC15XX
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
2 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Analog peripherals:
Two 12-bit ADC with up to 12 input channels per ADC and with multiple internal
and external trigger inputs and sample rates of up to 2 Msamples/s. Each ADC
supports two independent conversion sequences. ADC conversion clock can be
the system clock or an asynchronous clock derived from one of the three PLLs.
One 12-bit DAC.
Integrated temperature sensor and band gap internal reference voltage.
Four comparators with external and internal voltage references (ACMP0 to 3).
Comparator outputs are internally connected to the SCTimer/PWMs and ADCs and
externally to pins. Each comparator output contains a programmable glitch filter.
Serial interfaces:
Three USART interfaces with DMA, RS-485 support, autobaud, and with
synchronous mode and 32 kHz mode for wake-up from Deep-sleep and
Power-down modes. The USARTs share a fractional baud-rate generator.
Two SPI controllers.
One I2C-bus interface supporting fast mode and Fast-mode Plus with data rates of
up to 1Mbit/s and with multiple address recognition and monitor mode.
One C_CAN controller.
One USB 2.0 full-speed device controller with on-chip PHY.
Clock generation:
12 MHz internal RC oscillator trimmed to 1 % accuracy for 25 C Tamb +85 C
that can optionally be used as a system clock.
Crystal oscillator with an operating range of 1 MHz to 25 MHz.
Watchdog oscillator with a frequency range of 503 kHz.
32 kHz low-power RTC oscillator with 32 kHz, 1 kHz, and 1 Hz outputs.
System PLL allows CPU operation up to the maximum CPU rate without the need
for a high-frequency crystal. May be run from the system oscillator or the internal
RC oscillator.
Two additional PLLs for generating the USB and SCTimer/PWM clocks.
Clock output function with divider that can reflect the crystal oscillator, the main
clock, the IRC, or the watchdog oscillator.
Power control:
Integrated PMU (Power Management Unit) to minimize power consumption.
Reduced power modes: Sleep mode, Deep-sleep mode, Power-down mode, and
Deep power-down mode.
APIs provided for optimizing power consumption in active and sleep modes and for
configuring Deep-sleep, Power-down, and Deep power-down modes.
Wake-up from Deep-sleep and Power-down modes on activity on USB, USART,
SPI, and I2C peripherals.
Wake-up from Sleep, Deep-sleep, Power-down, and Deep power-down modes
from the RTC alarm or wake-up interrupts.
Timer-controlled self wake-up from Deep power-down mode using the RTC
high-resolution/wake-up 1 kHz timer.
Power-On Reset (POR).
BrownOut Detect BOD).
JTAG boundary scan modes supported.
Unique device serial number for identification.
LPC15XX
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
3 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Single power supply 2.4 V to 3.6 V.
Temperature range 40 °C to +105 °C.
Available as LQFP100, LQFP64, and LQFP48 packages.
3. Applications
Motor control
Solar inverters
Motion drives
Home appliances
Digital power supplies
Industrial and medical
Building and factory automation
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC1549JBD100
LPC1549JBD64
LPC1549JBD48
LPC1548JBD100
LPC1548JBD64
LPC1547JBD64
LPC1547JBD48
LPC1519JBD100
LPC1519JBD64
LPC1518JBD100
LPC1518JBD64
LPC1517JBD64
LPC1517JBD48
LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm
LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm
LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm
LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm
LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm
LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm
LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm
LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm
SOT407-1
SOT314-2
SOT313-2
SOT407-1
SOT314-2
SOT314-2
SOT313-2
SOT407-1
SOT314-2
SOT407-1
SOT314-2
SOT314-2
SOT313-2
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
4 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
4.1 Ordering options
Table 2.
Ordering options for LPC15xx
Flash/ EEPROM/ Total
Type number
USB USART I2C SPI C_CAN SCTimer/ 12-bit
DAC GPIO
kB
kB
SRAM/
kB
PWM
ADC0/1
channels
LPC1549JBD100 256
LPC1549JBD64 256
LPC1549JBD48 256
LPC1548JBD100 128
LPC1548JBD64 128
LPC1547JBD64 64
LPC1547JBD48 64
LPC1519JBD100 256
LPC1519JBD64 256
LPC1518JBD100 128
LPC1518JBD64 128
LPC1517JBD64 64
LPC1517JBD48 64
4
4
4
4
4
4
4
4
4
4
4
4
4
36
36
36
20
20
12
12
36
36
20
20
12
12
yes
yes
yes
yes
yes
yes
yes
no
3
3
3
3
3
3
3
3
3
3
3
3
3
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
4
4
4
4
4
4
4
4
4
4
4
4
4
12/12
12/12
9/7
1
1
1
1
1
1
1
1
1
1
1
1
1
76
44
30
76
44
44
30
78
46
78
46
46
32
12/12
12/12
12/12
9/7
12/12
12/12
12/12
12/12
12/12
9/7
no
no
no
no
no
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
5 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
5. Marking
n
n
1
1
Terminal 1 index area
Terminal 1 index area
aaa-011231
aaa-011232
Fig 1. LQFP64/100 package marking
Fig 2. LQFP48 package marking
The LPC15xx devices typically have the following top-side marking for LQFP100
packages:
LPC15xxJxxx
Xxxxxx xx
xxxyywwxxx
The LPC15xx devices typically have the following top-side marking for LQFP64 packages:
LPC15xxJ
Xxxxxx xx
xxxyywwxxx
The LPC15xx devices typically have the following top-side marking for LQFP48 packages:
LPC15xxJ
Xxxxxx
Xxxyy
wwxxx
Field ‘yy’ states the year the device was manufactured. Field ‘ww’ states the week the
device was manufactured during that year.
LPC15XX
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
6 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
6. Block diagram
LPC15xx
PROCESSOR CORE
TEST/DEBUG INTERFACE
SWD/ETM
ARM
CORTEX-M3
NVIC
MPU
SYSTICK
HS GPIO
PORT0/1/2
MEMORY
256/128/64 kB FLASH
AHB MULTILAYER
MATRIX
4 kB EEPROM
PINT/
PATTERN MATCH
INPUT MUX
n
pads
36/20/12 kB SRAM
32 kB ROM
GINT0/1
AHB/APB BRIDGES
ANALOG PERIPHERALS
ACMP1
ACMP2
ACMP3
ACMP0/
TEMPERATURE
SENSOR
12-bit ADC0
TRIGGER MUX
12-bit ADC1
TRIGGER MUX
12-bit DAC
INPUT MUX
INPUT MUX
SWM
n
pads
SCTIMER/PWM/MOTOR CONTROL SUBSYSTEM
DMA TRIGGER
DMA
SCTIMER0/ SCTIMER1/ SCTIMER2/ SCTIMER3/
QEI
PWM
PWM
PWM
PWM
SCTIPU
SERIAL PERIPHERALS
C_CAN
USART0
USART1
FM+ I2C0
USART2
SPI1
SPI0
FS USB/
PHY
TIMERS
MRT
RIT
WWDT
RTC
CLOCK
GENERATION
PRECISION
IRC
WATCHDOG
OSCILLATOR
SYSTEM
OSCILLATOR
RTC
OSCILLATOR
SYSTEM
PLL
USB
PLL
SCT
PLL
FREQUENCY
MEASUREMENT
INPUT MUX
SYSTEM/MEMORY CONTROL
SYSCON IOCON
PMU
CRC
FLASH CTRL
EEPROM CTRL
aaa-010869
Grey-shaded blocks show peripherals that can provide hardware triggers for DMA transfers or have DMA request lines.
Fig 3. LPC15xx Block diagram
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
7 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
7. Pinning information
7.1 Pinning
PIO0_22/I2C0_SCL 37
PIO0_23/I2C0_SDA 38
24 PIO0_16/ADC1_9
23 PIO0_15/ADC1_8
V
39
40
41
42
22 PIO0_14/ADC1_7/ SCT1_OUT5
21 PIO0_13/ADC1_6
DD
V
V
SS
SS
DD
20 V
SS
V
19 PIO0_12/DAC_OUT
18 PIO0_11/ADC1_3
LPC1547JBD48
LPC1549JBD48
PIO0_24/SCT0_OUT6 43
PIO0_25/ACMP0_I4 44
17 V
16 V
SSA
DDA
PIO0_26/ACMP0_I3/ SCT3_OUT3 45
PIO0_27/ACMP_I1 46
15 PIO0_10/ADC1_2
PIO0_28/ACMP1_I3 47
14 VREFP_DAC_VDDCMP
13 PIO0_18/ SCT0_OUT5
PIO0_29/ACMP2_I3/ SCT2_OUT4 48
aaa-009352
Fig 4. LQFP48 pin configuration (with USB)
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
8 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
PIO0_22/I2C0_SCL 37
PIO0_23/I2C0_SDA 38
24 PIO0_16/ADC1_9
23 PIO0_15/ADC1_8
V
39
40
41
42
22 PIO0_14/ADC1_7/ SCT1_OUT5
21 PIO0_13/ADC1_6
DD
V
V
SS
SS
DD
20 V
SS
V
19 PIO0_12/DAC_OUT
18 PIO0_11/ADC1_3
LPC1517JBD48
PIO0_24/SCT0_OUT6 43
PIO0_25/ACMP0_I4 44
17 V
16 V
SSA
DDA
PIO0_26/ACMP0_I3/ SCT3_OUT3 45
PIO0_27/ACMP_I1 46
15 PIO0_10/ADC1_2
PIO0_28/ACMP1_I3 47
14 VREFP_DAC_VDDCMP
13 PIO0_18/ SCT0_OUT5
PIO0_29/ACMP2_I3/ SCT2_OUT4 48
aaa-009354
Fig 5. LQFP48 pin configuration (without USB)
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
9 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
PIO0_22 49
PIO0_23 50
PIO1_7 51
32 PIO0_16
31 PIO0_15
30 PIO0_14
29 PIO0_13
28 PIO1_3
V
DD
52
PIO1_8 53
PIO1_9 54
27 V
26 V
SS
SS
V
V
55
56
57
SS
SS
DD
LPC1549JBD64
LPC1548JBD64
LPC1547JBD64
25 PIO1_2
24 PIO0_12
23 PIO0_11
V
PIO0_24 58
PIO1_10 59
PIO0_25 60
PIO0_26 61
PIO0_27 62
PIO0_28 63
PIO0_29 64
22 V
21 V
20 V
DD
SSA
DDA
19 PIO0_10
18 VREFP_DAC_VDDCMP
17 PIO0_18
aaa-009353
See Table 3 for the full pin name.
Fig 6. LQFP64 pin configuration (with USB)
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
10 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
PIO0_22 49
PIO0_23 50
PIO1_7 51
32 PIO0_16
31 PIO0_15
30 PIO0_14
29 PIO0_13
28 PIO1_3
V
DD
52
PIO1_8 53
PIO1_9 54
27 V
26 V
SS
SS
V
V
55
56
57
SS
SS
DD
LPC1519JBD64
LPC1518JBD64
LPC1517JBD64
25 PIO1_2
24 PIO0_12
23 PIO0_11
V
PIO0_24 58
PIO1_10 59
PIO0_25 60
PIO0_26 61
PIO0_27 62
PIO0_28 63
PIO0_29 64
22 V
21 V
20 V
DD
SSA
DDA
19 PIO0_10
18 VREFP_DAC_VDDCMP
17 PIO0_18
aaa-009376
Fig 7. LQFP64 pin configuration (without USB)
76
50
LPC1548JBD100
LPC1518JBD100
100
26
aaa-009351
Fig 8. LQFP100 pin configuration
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
11 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
7.2 Pin description
Most pins are configurable for multiple functions, which can be analog or digital. Digital
inputs can be connected to several peripherals at once, however only one digital output or
one analog function can be assigned to any on pin. The pin’s connections to internal
peripheral blocks are configured by the switch matrix (SWM), the input multiplexer (INPUT
MUX), and the SCT Input Pre-processor Unit (SCTIPU).
The switch matrix enables certain fixed-pin functions that can only reside on specific pins
(see Table 3) and assigns all other pin functions (movable functions) to any available pin
(see Table 4), so that the pinout can be optimized for a given application.
The input mux provides many choices (pins and internal signals) for selecting the inputs of
the SCTimer/PWMs and the frequency measure block. Pins that are connected to the
input mux are listed in Table 5. If a pin is selected in the input mux, it is directly connected
to the peripheral input without being routed through the switch matrix. Independently of
being selected in the input mux, the same pin can also be assigned by the switch matrix to
another peripheral input.
Four pins can also be connected directly to the SCTIPU and at the same time be inputs to
the input mux and the switch matrix (see Table 5).
Table 3.
Symbol
Pin description with fixed-pin functions
Reset Type Description
state[1]
[2]
[2]
[2]
[2]
[2]
PIO0_0/ADC0_10/
SCT0_OUT3
1
2
3
4
5
2
5
6
7
2
I; PU
I; PU
I; PU
I; PU
I; PU
IO
A
PIO0_0 — General purpose port 0 input/output 0.
ADC0_10 — ADC0 input 10.
O
SCT0_OUT3 — SCTimer0/PWM output 3.
PIO0_1 — General purpose port 0 input/output 1.
ADC0_7 — ADC0 input 7.
PIO0_1/ADC0_7/
SCT0_OUT4
6
IO
A
O
SCT0_OUT4 — SCTimer0/PWM output 4.
PIO0_2 — General purpose port 0 input/output 2.
ADC0_6 — ADC0 input 6.
PIO0_2/ADC0_6/
SCT1_OUT3
8
IO
O
SCT1_OUT3 — SCTimer1/PWM output 3.
PIO0_3 — General purpose port 0 input/output 3.
ADC0_5 — ADC0 input 5.
PIO0_3/ADC0_5/
SCT1_OUT4
10
IO
A
O
SCT1_OUT4 — SCTimer1/PWM output 4.
PIO0_4/ADC0_4
PIO0_5/ADC0_3
8
9
13
14
IO
PIO0_4 — General purpose port 0 input/output 4. This is
the ISP_0 boot pin for the LQFP48 package.
A
ADC0_4 — ADC0 input 4.
[2]
[2]
6
7
I; PU
I; PU
IO
A
PIO0_5 — General purpose port 0 input/output 5.
ADC0_3 — ADC0 input 3.
PIO0_6/ADC0_2/
SCT2_OUT3
10 16
11 17
IO
A
PIO0_6 — General purpose port 0 input/output 6.
ADC0_2 — ADC0 input 2.
O
IO
A
SCT2_OUT3 — SCTimer2/PWM output 3.
PIO0_7 — General purpose port 0 input/output 7.
ADC0_1 — ADC0 input 1.
[2]
PIO0_7/ADC0_1
8
I; PU
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
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LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Symbol
Pin description with fixed-pin functions
Reset Type Description
state[1]
[2]
[2]
PIO0_8/ADC0_0/TDO
PIO0_9/ADC1_1/TDI
9
12 19
I; PU
I; PU
IO
PIO0_8 — General purpose port 0 input/output 8.
In boundary scan mode: TDO (Test Data Out).
ADC0_0 — ADC0 input 0.
A
12 16 24
IO
PIO0_9 — General purpose port 0 input/output 9.
In boundary scan mode: TDI (Test Data In).
ADC1_1 — ADC1 input 1.
A
[2]
[2]
PIO0_10/ADC1_2
PIO0_11/ADC1_3
15 19 28
18 23 33
I; PU
I; PU
IO
A
PIO0_10 — General purpose port 0 input/output 10.
ADC1_2 — ADC1 input 2.
IO
PIO0_11 — General purpose port 0 input/output 11.
On the LQFP64 package, this pin is assigned to
CAN0_RD in ISP C_CAN mode.
A
ADC1_3 — ADC1 input 3.
[3]
[2]
PIO0_12/DAC_OUT
PIO0_13/ADC1_6
19 24 35
I; PU
I; PU
IO
PIO0_12 — General purpose port 0 input/output 12. If this
pin is configured as a digital input, the input voltage level
must not be higher than VDDA
.
A
DAC_OUT — DAC analog output.
21 29 43
IO
PIO0_13 — General purpose port 0 input/output 13.
On the LQFP64 package, this pin is assigned to U0_RXD
in ISP USART mode.
On the LQFP48 package, this pin is assigned to
CAN0_RD in ISP C_CAN mode.
A
ADC1_6 — ADC1 input 6.
[2]
PIO0_14/ADC1_7/
SCT1_OUT5
22 30 45
I; PU
I; PU
IO
PIO0_14 — General purpose port 0 input/output 14.
On the LQFP48 package, this pin is assigned to U0_RXD
in ISP USART mode.
A
ADC1_7 — ADC1 input 7.
O
IO
SCT1_OUT5 — SCTimer1/PWM output 5.
PIO0_15 — General purpose port 0 input/output 15.
[2]
PIO0_15/ADC1_8
PIO0_16/ADC1_9
23 31 47
On the LQFP48 package, this pin is assigned to U0_TXD
in ISP USART mode.
A
ADC1_8 — ADC1 input 8.
[2]
[4]
24 32 49
28 39 61
I; PU
I; PU
IO
PIO0_16 — General purpose port 0 input/output 16.
On the LQFP48 package, this is the ISP_1 boot pin.
ADC1_9 — ADC1 input 9.
A
PIO0_17/WAKEUP/
TRST
IO
PIO0_17 — General purpose port 0 input/output 17. In
boundary scan mode: TRST (Test Reset).
This pin triggers a wake-up from Deep power-down mode.
For wake up from Deep power-down mode via an external
pin, do not assign any movable function to this pin. Pull
this pin HIGH externally while in Deep power-down mode.
Pull this pin LOW to exit Deep power-down mode. A
LOW-going pulse as short as 50 ns wakes up the part.
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
13 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Symbol
Pin description with fixed-pin functions
Reset Type Description
state[1]
[5]
PIO0_18/
13 17 26
I; PU
IO
PIO0_18 — General purpose port 0 input/output 18.
SCT0_OUT5
On the LQFP64 package, this pin is assigned to U0_TXD
in ISP USART mode.
On the LQFP48 package, this pin is assigned to
CAN0_TD in ISP C_CAN mode.
O
I
SCT0_OUT5 — SCTimer0/PWM output 5.
[5]
[5]
SWCLK/
PIO0_19/TCK
29 40 63
I; PU
I; PU
SWCLK — Serial Wire Clock. SWCLK is enabled by
default on this pin.
In boundary scan mode: TCK (Test Clock).
IO
PIO0_19 — General purpose port 0 input/output 19.
SWDIO/
33 44 69
I/O
SWDIO — Serial Wire Debug I/O. SWDIO is enabled by
PIO0_20/SCT1_OUT6/
TMS
default on this pin.
In boundary scan mode: TMS (Test Mode Select).
PIO0_20 — General purpose port 0 input/output 20.
SCT1_OUT6 — SCTimer1/PWM output 6.
I/O
O
I
[6]
RESET/PIO0_21
34 45 71
I; PU
RESET — External reset input: A LOW-going pulse as
short as 50 ns on this pin resets the device, causing I/O
ports and peripherals to take on their default states, and
processor execution to begin at address 0.
In deep power-down mode, this pin must be pulled HIGH
externally. The RESET pin can be left unconnected or be
used as a GPIO or for any movable function if an external
RESET function is not needed and the Deep power-down
mode is not used.
I/O
IO
PIO0_21 — General purpose port 0 input/output 21.
PIO0_22 — General purpose port 0 input/output 22.
I2C0_SCL — I2C-bus clock input/output. High-current sink
if I2C Fast-mode Plus is selected in the I/O configuration
register.
[7]
[7]
[8]
PIO0_22/I2C0_SCL
PIO0_23/I2C0_SDA
37 49 78
38 50 79
43 58 90
IA
I/O
IA
IO
PIO0_23 — General purpose port 0 input/output 23.
I/O
I2C0_SDA — I2C-bus data input/output. High-current sink
if I2C Fast-mode Plus is selected in the I/O configuration
register.
PIO0_24/SCT0_OUT6
PIO0_25/ACMP0_I4
I; PU
IO
PIO0_24 — General purpose port 0 input/output 24.
High-current output driver.
O
IO
A
SCT0_OUT6 — SCTimer0/PWM output 6.
[2]
[2]
44 60 93
45 61 95
I; PU
I; PU
PIO0_25 — General purpose port 0 input/output 25.
ACMP0_I4 — Analog comparator 0 input 4.
PIO0_26 — General purpose port 0 input/output 26.
ACMP0_I3 — Analog comparator 0 input 3.
SCT3_OUT3 — SCTimer3/PWM output 3.
PIO0_26/ACMP0_I3/
SCT3_OUT3
IO
A
O
IO
A
[2]
PIO0_27/ACMP_I1
46 62 97
I; PU
PIO0_27 — General purpose port 0 input/output 27.
ACMP_I1 — Analog comparator common input 1.
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
14 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Symbol
Pin description with fixed-pin functions
Reset Type Description
state[1]
[2]
[2]
PIO0_28/ACMP1_I3
47 63 98
48 64 100
I; PU
I; PU
IO
A
PIO0_28 — General purpose port 0 input/output 28.
ACMP1_I3 — Analog comparator 1 input 3.
PIO0_29 — General purpose port 0 input/output 29.
ACMP2_I3 — Analog comparator 2 input 3.
SCT2_OUT4 — SCTimer2/PWM output 4.
PIO0_30 — General purpose port 0 input/output 30.
ADC0_11 — ADC0 input 11.
PIO0_29/ACMP2_I3/
SCT2_OUT4
IO
A
O
[2]
[2]
PIO0_30/ADC0_11
PIO0_31/ADC0_9
-
-
1
3
1
3
I; PU
I; PU
IO
A
IO
PIO0_31 — General purpose port 0 input/output 31.
On the LQFP64 package, this pin is assigned to
CAN0_TD in ISP C_CAN mode.
A
ADC0_9 — ADC0 input 9.
[2]
[2]
[2]
[2]
[2]
[2]
[2]
[2]
[2]
PIO1_0/ADC0_8
PIO1_1/ADC1_0
PIO1_2/ADC1_4
PIO1_3/ADC1_5
PIO1_4/ADC1_10
PIO1_5/ADC1_11
PIO1_6/ACMP_I2
PIO1_7/ACMP3_I4
-
-
-
-
-
-
-
-
-
4
5
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
IO
A
PIO1_0 — General purpose port 1 input/output 0.
ADC0_8 — ADC0 input 8.
15 23
25 36
28 41
33 51
34 52
46 73
51 81
53 84
IO
A
PIO1_1 — General purpose port 1 input/output 1.
ADC1_0 — ADC1 input 0.
IO
A
PIO1_2 — General purpose port 1 input/output 2.
ADC1_4 — ADC1 input 4.
IO
A
PIO1_3 — General purpose port 1 input/output 3.
ADC1_5 — ADC1 input 5.
IO
A
PIO1_4 — General purpose port 1 input/output 4.
ADC1_10 — ADC1 input 10.
IO
A
PIO1_5 — General purpose port 1 input/output 5.
ADC1_11 — ADC1 input 11.
IO
A
PIO1_6 — General purpose port 1 input/output 6.
ACMP_I2 — Analog comparator common input 2.
PIO1_7 — General purpose port 1 input/output 7.
ACMP3_I4 — Analog comparator 3 input 4.
PIO1_8 — General purpose port 1 input/output 8.
ACMP3_I3 — Analog comparator 3 input 3.
SCT3_OUT4 — SCTimer3/PWM output 4.
PIO1_9 — General purpose port 1 input/output 9.
On the LQFP64 package, this is the ISP_0 boot pin.
ACMP2_I4 — Analog comparator 2 input 4.
PIO1_10 — General purpose port 1 input/output 10.
ACMP1_I4 — Analog comparator 1 input 4.
PIO1_11 — General purpose port 1 input/output 11.
On the LQFP64 package, this is the ISP_1 boot pin.
PIO1_12 — General purpose port 1 input/output 12.
PIO1_13 — General purpose port 1 input/output 13.
IO
A
PIO1_8/ACMP3_I3/
SCT3_OUT4
IO
A
O
[2]
PIO1_9/ACMP2_I4
-
54 85
I; PU
IO
A
[2]
[5]
PIO1_10/ACMP1_I4
PIO1_11
-
-
59 91
38 58
I; PU
I; PU
IO
A
IO
[5]
[5]
PIO1_12
PIO1_13
-
-
-
-
9
I; PU
I; PU
IO
IO
11
LPC15XX
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Product data sheet
Rev. 1 — 19 February 2014
15 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Symbol
Pin description with fixed-pin functions
Reset Type Description
state[1]
[5]
PIO1_14/SCT0_OUT7
-
-
12
I; PU
IO
O
PIO1_14 — General purpose port 1 input/output 14.
SCT0_OUT7 — SCTimer0/PWM output 7.
[5]
[5]
[5]
PIO1_15
-
-
-
-
-
-
15
18
20
I; PU
I; PU
I; PU
IO
IO
IO
O
PIO1_15 — General purpose port 1 input/output 15.
PIO1_16 — General purpose port 1 input/output 16.
PIO1_17 — General purpose port 1 input/output 17.
SCT1_OUT7 — SCTimer1/PWM output 7.
PIO1_16
PIO1_17/SCT1_OUT7
[5]
[5]
[5]
PIO1_18
-
-
-
-
-
-
25
29
34
I; PU
I; PU
I; PU
IO
IO
IO
O
PIO1_18 — General purpose port 1 input/output 18.
PIO1_19 — General purpose port 1 input/output 19.
PIO1_20 — General purpose port 1 input/output 20.
SCT2_OUT5 — SCTimer2/PWM output 5.
PIO1_19
PIO1_20/SCT2_OUT5
[5]
[5]
[5]
[5]
PIO1_21
-
-
-
-
-
-
-
-
37
38
42
44
I; PU
I; PU
I; PU
I; PU
IO
IO
IO
IO
O
PIO1_21 — General purpose port 1 input/output 21.
PIO1_22 — General purpose port 1 input/output 22.
PIO1_23 — General purpose port 1 input/output 23.
PIO1_24 — General purpose port 1 input/output 24.
SCT3_OUT5 — SCTimer3/PWM output 5.
PIO1_22
PIO1_23
PIO1_24/SCT3_OUT5
[5]
[5]
[5]
[5]
[5]
[5]
[5]
[5]
[5]
[5]
[5]
[5]
PIO1_25
PIO1_26
PIO1_27
PIO1_28
PIO1_29
PIO1_30
PIO1_31
PIO2_0
PIO2_1
PIO2_2
PIO2_3
PIO2_4
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
46
48
50
55
56
59
60
62
64
72
76
77
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
I; PU
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
PIO1_25 — General purpose port 1 input/output 25.
PIO1_26 — General purpose port 1 input/output 26.
PIO1_27 — General purpose port 1 input/output 27.
PIO1_28 — General purpose port 1 input/output 28.
PIO1_29 — General purpose port 1 input/output 29.
PIO1_30 — General purpose port 1 input/output 30.
PIO1_31 — General purpose port 1 input/output 31.
PIO2_0 — General purpose port 2 input/output 0.
PIO2_1 — General purpose port 2 input/output 1.
PIO2_2 — General purpose port 2 input/output 2.
PIO2_3 — General purpose port 2 input/output 3.
PIO2_4 — General purpose port 2 input/output 4.
On the LQFP100 package, this is the ISP_1 boot pin.
PIO2_5 — General purpose port 2 input/output 5.
On the LQFP100 package, this is the ISP_0 boot pin.
PIO2_6 — General purpose port 2 input/output 6.
[5]
[5]
PIO2_5
PIO2_6
-
-
-
-
80
82
I; PU
I; PU
IO
IO
On the LQFP100 package, this pin is assigned to U0_TXD
in ISP USART mode.
[5]
[5]
PIO2_7
PIO2_8
-
-
-
-
86
92
I; PU
I; PU
IO
IO
PIO2_7 — General purpose port 2 input/output 7.
On the LQFP100 package, this pin is assigned to
U0_RXD in ISP USART mode.
PIO2_8 — General purpose port 2 input/output 8.
On the LQFP100 package, this pin is assigned to
CAN0_TD in ISP C_CAN mode.
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
16 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Symbol
Pin description with fixed-pin functions
Reset Type Description
state[1]
[5]
PIO2_9
-
-
94
I; PU
IO
PIO2_9 — General purpose port 2 input/output 9.
On the LQFP100 package, this pin is assigned to
CAN0_RD in ISP C_CAN mode.
[5]
[5]
[5]
PIO2_10
PIO2_11
PIO2_12
-
-
-
-
96
99
I; PU
I; PU
I; PU
IO
IO
IO
PIO2_10 — General purpose port 2 input/output 10.
PIO2_11 — General purpose port 2 input/output 11.
35 47 74
36 48 75
35 47 74
36 48 75
31 42 66
PIO2_12 — General purpose port 2 input/output 12. On
parts LPC1519/17/18 only.
[5]
PIO2_13
USB_DP
USB_DM
RTCXIN
I; PU
IO
IO
IO
PIO2_13 — General purpose port 2 input/output 13. On
parts LPC1519/17/18 only.
[10]
[10]
[9]
-
-
-
USB bidirectional D+ line. Pad includes internal 33 Ω
series termination resistor. On parts LPC1549/48/47 only.
USB bidirectional D line. Pad includes internal 33 Ω
series termination resistor. On parts LPC1549/48/47 only.
RTC oscillator input. This input should be grounded if the
RTC is not used.
[9]
[9]
RTCXOUT
XTALIN
32 43 67
26 36 54
-
-
RTC oscillator output.
Input to the oscillator circuit and internal clock generator
circuits. Input voltage must not exceed 1.8 V.
[9]
XTALOUT
VBAT
25 35 53
30 41 65
-
-
Output from the oscillator amplifier.
Battery supply voltage. If no battery is used, tie VBAT to
VDD or to ground.
VDDA
16 20 30
-
-
Analog supply voltage. VDD and the analog reference
voltages VREFP_ADC and VREFP_DAC_VDDCMP must
not exceed the voltage level on VDDA. VDDAshould typically
be the same voltages as VDD but should be isolated to
minimize noise and error. VDDA should be tied to VDD if the
ADC is not used.
VDD
39, 22, 4,
27, 52, 32,
42 37, 70,
57 83,
57,
3.3 V supply voltage (2.4 V to 3.6 V). The voltage level on
VDD must be equal or lower than the analog supply
voltage VDDA
.
89
[9]
VREFP_DAC_VDDCMP 14 18 27
-
-
DAC positive reference voltage and analog comparator
reference voltage. The voltage level on
VREFP_DAC_VDDCMP must be equal to or lower than
the voltage applied to VDDA
ADC and DAC negative voltage reference. If the ADC is
not used, tie VREFN to VSS
.
VREFN
11 14 22
.
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
17 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Symbol
Pin description with fixed-pin functions
Reset Type Description
state[1]
VREFP_ADC
10 13 21
-
ADC positive reference voltage. The voltage level on
VREFP_ADC must be equal to or lower than the voltage
applied to VDDA. If the ADC is not used, tie VREFP_ADC
to VDD
.
VSSA
17 21 31
-
-
Analog ground. VSSAshould typically be the same voltage
as VSS but should be isolated to minimize noise and error.
VSSA should be tied to VSS if the ADC is not used.
VSS
41, 56, 88,
20, 26, 7,
40 27, 39,
55 40,
68,
Ground.
87
[1] Pin state at reset for default function: I = Input; O = Output; PU = internal pull-up enabled; IA = inactive, no pull-up/down enabled;
F = floating; If the pins are not used, tie floating pins to ground or power to minimize power consumption.
[2] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, configurable hysteresis, and analog input.
When configured as analog input, digital section of the pad is disabled and the pin is not 5 V tolerant. This pin includes a 10 ns on/off
glitch filter. By default, the glitch filter is turned on.
[3] This pin is not 5 V tolerant due to special analog functionality. When configured for a digital function, this pin is 3 V tolerant and provides
standard digital I/O functions with configurable internal pull-up and pull-down resistors and hysteresis. When configured for DAC_OUT,
the digital section of the pin is disabled and this pin is a 3 V tolerant analog output. This pin includes a 10 ns on/off glitch filter. By default,
the glitch filter is turned on.
[4] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, and configurable hysteresis. This pin
includes a 10 ns on/off glitch filter. By default, the glitch filter is turned on. This pin is powered in deep power-down mode and can wake
up the part.
[5] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis.
[6] 5 V tolerant pad. RESET functionality is not available in Deep power-down mode. Use the WAKEUP pin to reset the chip and wake up
from Deep power-down mode. An external pull-up resistor is required on this pin for the Deep power-down mode.
[7] I2C-bus pins compliant with the I2C-bus specification for I2C standard mode, I2C Fast-mode, and I2C Fast-mode Plus.
[8] 5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis; includes
high-current output driver.
[9] Special analog pin.
[10] Pad provides USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode
only). This pad is not 5 V tolerant.
Table 4.
Movable functions
Function name
U0_TXD
Type
Description
O
I
Transmitter output for USART0.
Receiver input for USART0.
U0_RXD
U0_RTS
O
I
Request To Send output for USART0.
Clear To Send input for USART0.
Serial clock input/output for USART0 in synchronous mode.
Transmitter output for USART1.
Receiver input for USART1.
U0_CTS
U0_SCLK
U1_TXD
I/O
O
I
U1_RXD
U1_RTS
O
Request To Send output for USART1.
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
18 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 4.
Movable functions …continued
Function name
U1_CTS
Type
I
Description
Clear To Send input for USART1.
Serial clock input/output for USART1 in synchronous mode.
Transmitter output for USART2.
Receiver input for USART2.
Serial clock input/output for USART1 in synchronous mode.
Serial clock for SPI0.
U1_SCLK
I/O
O
U2_TXD
U2_RXD
I
U2_SCLK
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
SPI0_SCK
SPI0_MOSI
SPI0_MISO
SPI0_SSEL0
SPI0_SSEL1
SPI0_SSEL2
SPI0_SSEL3
SPI1_SCK
Master Out Slave In for SPI0.
Master In Slave Out for SPI0.
Slave select 0 for SPI0.
Slave select 1 for SPI0.
Slave select 2 for SPI0.
Slave select 3 for SPI0.
Serial clock for SPI1.
SPI1_MOSI
SPI1_MISO
SPI1_SSEL0
SPI1_SSEL1
CAN0_TD
Master Out Slave In for SPI1.
Master In Slave Out for SPI1.
Slave select 0 for SPI1.
Slave select 1 for SPI1.
CAN0 transmit.
CAN0_RD
I
CAN0 receive.
USB_VBUS
SCT0_OUT0
SCT0_OUT1
SCT0_OUT2
SCT1_OUT0
SCT1_OUT1
SCT1_OUT2
SCT2_OUT0
SCT2_OUT1
SCT2_OUT2
SCT3_OUT0
SCT3_OUT1
SCT3_OUT2
SCT_ABORT0
SCT_ABORT1
ADC0_PINTRIG0
ADC0_PINTRIG1
ADC1_PINTRIG0
ADC1_PINTRIG1
DAC_PINTRIG
DAC_SHUTOFF
ACMP0_O
I
USB VBUS.
O
SCTimer0/PWM output 0.
SCTimer0/PWM output 1.
SCTimer0/PWM output 2.
SCTimer1/PWM output 0.
SCTimer1/PWM output 1.
SCTimer1/PWM output 2.
SCTimer2/PWM output 0.
SCTimer2/PWM output 1.
SCTimer2/PWM output 2.
SCTimer3/PWM output 0.
SCTimer3/PWM output 1.
SCTimer3/PWM output 2.
SCT abort 0.
O
O
O
O
O
O
O
O
O
O
O
I
I
SCT abort 1.
I
ADC0 external pin trigger input 0.
ADC0 external pin trigger input 1.
ADC1 external pin trigger input 0.
ADC1 external pin trigger input 1.
DAC external pin trigger input.
DAC shut-off external input.
Analog comparator 0 output.
I
I
I
I
I
O
LPC15XX
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Product data sheet
Rev. 1 — 19 February 2014
19 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 4.
Movable functions …continued
Function name
ACMP1_O
Type
O
Description
Analog comparator 1 output.
Analog comparator 2 output.
Analog comparator 3 output.
Clock output.
ACMP2_O
O
ACMP3_O
O
CLKOUT
O
ROSC
O
Analog comparator ring oscillator output.
Analog comparator ring oscillator reset.
ROSC_RESET
USB_FTOGGLE
I
O
USB frame toggle. Do not assign this function to a pin until a USB
device is connected and the first SOF interrupt has been received
by the device.
QEI_PHA
QEI_PHB
QEI_IDX
I
QEI phase A input.
I
QEI phase B input.
I
QEI index input.
GPIO_INT_BMAT
SWO
O
O
Output of the pattern match engine.
Serial wire output.
Table 5.
Symbol
Pins connected to the INPUT MUX and SCT IPU
Description
PIO0_2/ADC0_6/SCT1_OUT3
PIO0_3/ADC0_5/SCT1_OUT4
PIO0_4/ADC0_4
3
4
5
6
8
6
8
SCT0 input mux
7
10 SCT0 input mux
13 SCT2 input mux
14 FREQMEAS
8
PIO0_5/ADC0_3
9
PIO0_7/ADC0_1
11
17 SCT3 input mux
PIO0_14/ADC1_7/SCT1_OUT5
PIO0_15/ADC1_8
22 30 45 SCTIPU input SAMPLE_IN_A0
23 31 47 SCT1 input mux
24 32 49 SCT1 input mux
28 39 61 SCT0 input mux
29 40 63 FREQMEAS
PIO0_16/ADC1_9
PIO0_17/WAKEUP/TRST
SWCLK/PIO0_19/TCK
RESET/PIO0_21
34 45 71 SCT1 input mux
44 60 93 SCTIPU input SAMPLE_IN_A1
46 62 97 SCT2 input mux
PIO0_25/ACMP0_I4
PIO0_27/ACMP_I1
PIO0_30/ADC0_11
-
1
1
FREQMEAS
SCT0 input mux
SCT1 input mux
PIO0_31/ADC0_9
PIO1_4/ADC1_10
PIO1_5/ADC1_11
PIO1_6/ACMP_I2
PIO1_7/ACMP3_I4
PIO1_11
-
-
-
-
-
-
3
3
33 51 SCT1 input mux
34 52 SCT1 input mux
46 73 SCT0 input mux
51 81 SCT0 input mux
38 58 SCT3 input mux
SCTIPU input SAMPLE_IN_A2
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Table 5.
Pins connected to the INPUT MUX and SCT IPU
Symbol
Description
PIO1_12
PIO1_13
PIO1_15
PIO1_16
PIO1_18
PIO1_19
PIO1_21
PIO1_22
PIO1_26
PIO1_27
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
9
SCT0 input mux
SCT0 input mux
11
12 SCT1 input mux
18 SCT1 input mux
25 SCT2 input mux
29 SCT2 input mux
37 SCT3 input mux
38 SCT3 input mux
48 SCTIPU input SAMPLE_IN_A3
50 FREQMEAS
8. Functional description
8.1 ARM Cortex-M3 processor
The ARM Cortex-M3 is a general purpose, 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM Cortex-M3 offers many new
features, including a Thumb-2 instruction set, low interrupt latency, hardware division,
hardware single-cycle multiply, interruptible/continuable multiple load and store
instructions, automatic state save and restore for interrupts, tightly integrated interrupt
controller, and multiple core buses capable of simultaneous accesses.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM Cortex-M3 processor is described in detail in the Cortex-M3 Technical
Reference Manual, which is available on the official ARM website.
8.2 Memory Protection Unit (MPU)
The LPC15xx have a Memory Protection Unit (MPU) which can be used to improve the
reliability of an embedded system by protecting critical data within the user application.
The MPU allows separating processing tasks by disallowing access to each other's data,
disabling access to memory regions, allowing memory regions to be defined as read-only
and detecting unexpected memory accesses that could potentially break the system.
The MPU separates the memory into distinct regions and implements protection by
preventing disallowed accesses. The MPU supports up to eight regions each of which can
be divided into eight subregions. Accesses to memory locations that are not defined in the
MPU regions, or not permitted by the region setting, will cause the Memory Management
Fault exception to take place.
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8.3 On-chip flash programming memory
The LPC15xx contain up to 256 kB on-chip flash program memory. The flash can be
programmed using In-System Programming (ISP) or In-Application Programming (IAP)
via the on-chip boot loader software. Flash updates via USB are supported as well.
The flash memory is divided into 4 kB sectors with each sector consisting of 16 pages.
Individual pages of 256 byte each can be erased using the IAP erase page command.
8.3.1 ISP pin configuration
The LPC15xx supports ISP via the USART0, C_CAN, or USB interfaces. The ISP mode is
determined by the state of two pins (ISP_0 and ISP_1) at boot time:
Table 6.
ISP modes
ISP_0
Boot mode
No ISP
ISP_1
Description
HIGH
HIGH
ISP bypassed. Part attempts to boot
from flash. If the user code in flash is
not valid, then enters ISP via USB.
C_CAN
USB
HIGH
LOW
LOW
LOW
HIGH
LOW
Part enters ISP via C_CAN.
Part enters ISP via USB.
Part enters ISP via USART0.
USART0
The ISP pin assignment is different for each package, so that the fewest functions
possible are blocked. No more than four pins must be set aside for entering ISP in any
ISP mode. The boot code assigns two ISP pins for each package, which are probed when
the part boots to determine whether or not to enter ISP mode. Once the ISP mode has
been determined, the boot loader configures the necessary serial pins for each package.
Pins which are not configured by the boot loader for the selected boot mode (for example
CAN0_RD and CAN0_TD in USART mode) can be assigned to any function through the
switch matrix.
Table 7.
Boot pin
ISP_0
Pin assignments for ISP modes
LQFP48
PIO0_4
PIO0_16
LQFP64
PIO1_9
PIO1_11
LQFP100
PIO2_5
PIO2_4
ISP_1
USART mode
U0_TXD
PIO0_15
PIO0_14
PIO0_18
PIO0_13
PIO2_6
PIO2_7
U0_RXD
C_CAN mode
CAN0_TD
PIO0_18
PIO0_13
PIO0_31
PIO0_11
PIO2_8
PIO2_9
CAN0_RD
USB mode
USB_VBUS (same as ISP_1)
PIO0_16
PIO1_11
PIO2_4
8.4 EEPROM
The LPC15xx contain 4 kB of on-chip byte-erasable and byte-programmable EEPROM
data memory. The EEPROM can be programmed using In-Application Programming (IAP)
via the on-chip boot loader software.
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8.5 SRAM
32-bit ARM Cortex-M3 microcontroller
The LPC15xx contain a total 36 kB, 20 kB or 12 kB of contiguous, on-chip static RAM
memory. For each SRAM configuration, the SRAM is divided into three blocks: 2 x 16 kB +
4 kB for 36 kB SRAM, 2 x 8 kB + 4 kB for 20 kB SRAM, and 2 x 4 kB + 4 kB for 12 kB
SRAM. The bottom 16 kB, 8 kB, or 4 kB are enabled by the bootloader and cannot be
disabled. The next two SRAM blocks in each configuration can be disabled or enabled
individually in the SYSCON block to save power.
Table 8.
LPC15xx SRAM configurations
SRAM0
SRAM1
SRAM2
LPC1549/19 (total SRAM = 36 kB)
address range
0x0200 0000 to
0x0200 3FFF
0x0200 4000 to
0x0200 7FFF
0x0200 8000 to
0x0200 8FFF
size
16 kB
16 kB
4 kB
control
default
cannot be disabled
enabled
disable/enable
enabled
disable/enable
enabled
LPC1548/18 (total SRAM = 20 kB)
address range
0x0200 0000 to
0x0200 1FFF
0x0200 2000 to
0x0200 3FFF
0x0200 4000 to
0x0200 4FFF
size
8 kB
8 kB
4 kB
control
default
cannot be disabled
enabled
disable/enable
enabled
disable/enable
enabled
LPC1547/17 (total SRAM = 12 kB)
address range
0x0200 0000 to
0x0200 0FFF
0x0200 1000 to
0x0200 1FFF
0x0200 2000 to
0x0200 2FFF
size
4 kB
4 kB
4 kB
control
default
cannot be disabled
enabled
disable/enable
enabled
disable/enable
enabled
8.6 On-chip ROM
The on-chip ROM contains the boot loader and the following Application Programming
Interfaces (APIs):
• In-System Programming (ISP) and In-Application Programming (IAP) support for flash
including IAP erase page command.
• IAP support for EEPROM.
• Flash updates via USB and C_CAN supported.
• USB API (HID, CDC, and MSC drivers).
• DMA, I2C, USART, SPI, and C_CAN drivers.
• Power profiles for configuring power consumption and PLL settings.
• Power mode configuration for configuring deep-sleep, power-down, and deep
power-down modes.
• ADC drivers for analog-to-digital conversion and ADC calibration.
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8.7 AHB multilayer matrix
TEST/DEBUG
INTERFACE
ARM
CORTEX-M3
USB
DMA
masters
System
bus
I-code D-code
bus
bus
slaves
FLASH
SRAM0
SRAM1
SRAM2
ROM
EEPROM
HS GPIO
SCTIMER0/PWM
SCTIMER1/PWM
SCTIMER2/PWM
SCTIMER3/PWM
CRC
AHB-TO-APB
BRIDGE0
DAC
ACMP
INPUT MUX
RTC
ADC0
WWDT
SWM
PMU
USART1 USART2
SPI0
SPI1
I2C0
QEI
SYSCON
AHB-TO-APB
BRIDGE1
AHB MULTILAYER MATRIX
PINT
GINT1
GINT0
ADC1
MRT
SCTIPU
USART2
RIT
FLASH CTRL
C_CAN
IOCON
EEPROM CTRL
= master-slave connection
aaa-010870
Fig 9. AHB multilayer matrix
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8.8 Memory map
APB peripherals
0x400F 0000
EEPROM CTRL
0x400F C000
IOCON
31
30
29
28
27
26
25:17
16
15
14
13
12
11
10
9
0x400F 8000
reserved
0x400F 4000
C_CAN
LPC15xx
0x400F 0000
reserved
4 GB
0xFFFF FFFF
0x400E C000
reserved
reserved
0x400E 8000
0xE010 0000
0xE000 0000
reserved
USART2
flash ctrl FMC
SCTIPU
RIT
0x400C 4000
0x400C 0000
0x400B C000
0x400B 8000
0x400B 4000
0x400B 0000
0x400A C000
0x400A 8000
0x400A 4000
0x400A 0000
0x4008 4000
private peripheral bus
reserved
0x400F 0000
APB peripherals 1
APB peripherals 0
0x4008 0000
0x4000 0000
reserved
GINT1
reserved
GINT0
0x1C02 8000
0x1C02 4000
PINT
SCTimer3/PWM
SCTimer2/PWM
MRT
8
reserved
ADC1
0x1C02 0000
0x1C01 C000
0x1C01 8000
7:1
0
SCTimer1/PWM
SCTimer0/PWM
reserved
0x4008 0000
0x4008 0000
31:30
29
reserved
SYSCON
reserved
QEI
0x4007 8000
0x4007 4000
0x4005 C000
0x4005 8000
0x4005 4000
0x4005 0000
0x4004 C000
0x4004 8000
0x4004 4000
0x4004 0000
0x4003 C000
0x4003 8000
0x4003 0000
0x4002 C000
0x4002 8000
0x4001 C000
0x4001 8000
0x4001 4000
0x4000 C000
0x4000 8000
0x4000 4000
0x4000 0000
0x1C01 4000
0x1C01 0000
28:23
22
CRC
USB
reserved
DMA
reserved
I2C0
21
0x1C00 C000
0x1C00 8000
20
SPI1
19
0x1C00 4000
0x1C00 0000
GPIO
SPI0
18
reserved
USART1
USART0
PMU
17
0x1000 0000
16
reserved
4 kB EEPROM
reserved
0x0320 1000
0x0320 0000
15
switch matrix SWM
reserved
WWDT
14
0x0300 8000
0x0300 0000
13:12
11
32 kB boot ROM
RTC
10
reserved
reserved
reserved
INPUT MUX
reserved
9:7
6
0x0200 9000
0x0200 5000
0x0200 3000
0x0200 0000
36 kB SRAM (LPC1549/19)
20 kB SRAM (LPC1548/18)
12 kB SRAM (LPC1547/17)
5
4:3
analog comparators ACMP
2
1
0
DAC
reserved
ADC0
0x0004 0000
256 kB flash
0x0000 00C0
active interrupt vectors
0x0000 0000
0x0000 0000
0 GB
aaa-010871
See Section 8.5 “SRAM” for SRAM configuration.
Fig 10. Memory map
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8.9 Nested Vectored Interrupt controller (NVIC)
The Nested Vectored Interrupt Controller (NVIC) is part of the Cortex-M3. The tight
coupling to the CPU allows for low interrupt latency and efficient processing of late arriving
interrupts.
8.9.1 Features
• Nested Vectored Interrupt Controller that is an integral part of the ARM Cortex-M3.
• Tightly coupled interrupt controller provides low interrupt latency.
• Controls system exceptions and peripheral interrupts.
• The NVIC supports 47 vectored interrupts.
• Eight programmable interrupt priority levels with hardware priority level masking.
• Software interrupt generation using the ARM exceptions SVCall and PendSV.
• Support for NMI.
• ARM Cortex-M3 Vector table offset register VTOR implemented.
8.9.2 Interrupt sources
Typically, each peripheral device has one interrupt line connected to the NVIC but can
have several interrupt flags. Individual interrupt flags can also represent more than one
interrupt source.
8.10 IOCON block
The IOCON block configures the electrical properties of the pins such as pull-up and
pull-down resistors, hysteresis, open-drain modes and input filters.
Remark: The pin function and whether the pin operates in digital or analog mode are
entirely under the control of the switch matrix.
Enabling an analog function through the switch matrix disables the digital pad. However,
the internal pull-up and pull-down resistors as well as the pin hysteresis must be disabled
to obtain an accurate reading of the analog input.
8.10.1 Features
• Programmable pull-up, pull-down, or repeater mode.
• All pins (except PIO0_22 and PIO0_23) are pulled up to 3.3 V (VDD = 3.3 V) if their
pull-up resistor is enabled.
• Programmable pseudo open-drain mode.
• Programmable (on/off) 10 ns glitch filter on 36 pins (PIO0_0 to PIO0_17, PIO0_25 to
PIO0_31, PIO1_0 to PIO1_10). The glitch filter is turned on by default.
• Programmable hysteresis.
• Programmable input inverter.
• Digital filter with programmable filter constant on all pins.
8.10.2 Standard I/O pad configuration
Figure 11 shows the possible pin modes for standard I/O pins with analog input function:
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• Digital output driver with configurable open-drain output
• Digital input: Weak pull-up resistor (PMOS device) enabled/disabled
• Digital input: Weak pull-down resistor (NMOS device) enabled/disabled
• Digital input: Repeater mode enabled/disabled
• Digital input: Input digital filter configurable on all pins
• Digital input: Input glitch filter enabled/disabled on select pins
• Analog input
V
V
DD
DD
open-drain enable
output enable
strong
pull-up
ESD
data output
PIN
pin configured
as digital output
driver
strong
pull-down
ESD
V
SS
V
DD
weak
pull-up
pull-up enable
weak
pull-down
repeater mode
enable
pull-down enable
data input
PROGRAMMABLE
DIGITAL FILTER
10 ns GLITCH
FILTER
pin configured
as digital input
select data
inverter
select glitch
filter
select analog input
analog input
pin configured
as analog input
aaa-010776
Fig 11. Standard I/O pin configuration
8.11 Switch Matrix (SWM)
The switch matrix controls the function of each digital or mixed analog/digital pin in a
highly flexible way by allowing to connect many functions like the USART, SPI, SCT, and
I2C functions to any pin that is not power or ground. These functions are called movable
functions and are listed in Table 4.
Functions that need specialized pads like the ADC or analog comparator inputs can be
enabled or disabled through the switch matrix. These functions are called fixed-pin
functions and cannot move to other pins. The fixed-pin functions are listed in Table 3. If a
fixed-pin function is disabled, any other movable function can be assigned to this pin.
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8.12 Fast General-Purpose parallel I/O (GPIO)
Device pins that are not connected to a specific peripheral function through the switch
matrix are controlled by the GPIO registers. Pins may be dynamically configured as inputs
or outputs. Multiple outputs can be set or cleared in one write operation.
LPC15xx use accelerated GPIO functions.
• An entire port value can be written in one instruction.
• Mask, set, and clear operations are supported for the entire port.
8.12.1 Features
• Bit level port registers allow a single instruction to set and clear any number of bits in
one write operation.
• Direction control of individual bits.
8.13 Pin interrupt/pattern match engine (PINT)
The pin interrupt block configures up to eight pins from the digital pins on ports 1 and 2 for
providing eight external interrupts connected to the NVIC. The input mux block is used to
select the pins.
The pattern match engine can be used, in conjunction with software, to create complex
state machines based on pin inputs.
Any digital pin on ports 0 and 1 can be configured through the SYSCON block as input to
the pin interrupt or pattern match engine. The registers that control the pin interrupt or
pattern match engine are located on the IO+ bus for fast single-cycle access.
8.13.1 Features
• Pin interrupts
– Up to eight pins can be selected from all digital pins on ports 0 and 1 as edge- or
level-sensitive interrupt requests. Each request creates a separate interrupt in the
NVIC.
– Edge-sensitive interrupt pins can interrupt on rising or falling edges or both.
– Level-sensitive interrupt pins can be HIGH- or LOW-active.
– Pin interrupts can wake up the part from sleep mode, deep-sleep mode, and
power-down mode.
• Pin interrupt pattern match engine
– Up to 8 pins can be selected from all digital pins on ports 0 and 1 to contribute to a
boolean expression. The boolean expression consists of specified levels and/or
transitions on various combinations of these pins.
– Each minterm (product term) comprising the specified boolean expression can
generate its own, dedicated interrupt request.
– Any occurrence of a pattern match can be programmed to also generate an RXEV
notification to the ARM CPU.
– The pattern match engine does not facilitate wake-up.
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8.14 GPIO group interrupts (GINT0/1)
The GPIO pins can be used in several ways to set pins as inputs or outputs and use the
inputs as combinations of level and edge sensitive interrupts. For each port/pin connected
to one of the two the GPIO Grouped Interrupt blocks (GINT0 and GINT1), the GPIO
grouped interrupt registers determine which pins are enabled to generate interrupts and
what the active polarities of each of those inputs are.
The GPIO grouped interrupt registers also select whether the interrupt output will be level
or edge triggered and whether it will be based on the OR or the AND of all of the enabled
inputs.
When the designated pattern is detected on the selected input pins, the GPIO grouped
interrupt block generates an interrupt. If the part is in a power-savings mode, it first
asynchronously wakes the part up prior to asserting the interrupt request. The interrupt
request line can be cleared by writing a one to the interrupt status bit in the control
register.
8.14.1 Features
• Two group interrupts are supported to reflect two distinct interrupt patterns.
• The inputs from any number of digital pins can be enabled to contribute to a combined
group interrupt.
• The polarity of each input enabled for the group interrupt can be configured HIGH or
LOW.
• Enabled interrupts can be logically combined through an OR or AND operation.
• The grouped interrupts can wake up the part from sleep, deep-sleep or power-down
modes.
8.15 DMA controller
The DMA controller can access all memories and the USART, SPI, I2C, and DAC
peripherals using DMA requests. DMA transfers can also be triggered by internal events
like the ADC interrupts, the SCT DMA request signals, or the analog comparator outputs.
8.15.1 Features
• 18 channels with 14 channels connected to peripheral request inputs.
• DMA operations can be triggered by on-chip events. Each DMA channel can select
one trigger input from 24 sources through the input mux.
• Priority is user selectable for each channel.
• Continuous priority arbitration.
• Address cache with four entries.
• Efficient use of data bus.
• Supports single transfers up to 1,024 words.
• Address increment options allow packing and/or unpacking data.
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8.16 Input multiplexing (Input mux)
The input mux allows to select from multiple external and internal sources for the SCT
inputs, DMA trigger inputs, and the frequency measure block. The input mux is
implemented as a register interface with one source selection register for each input. The
input mux can for example connect SCT outputs, the ADC interrupts, or the comparator
outputs to the SCT inputs and thus enables the SCT to use a large variety of events to
control the timing operation.
The ADCs and analog comparators also support input multiplexing using source selection
registers as part of their configuration registers.
8.17 USB interface
Remark: The USB interface is available on parts LPC1549/48/47 only.
The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a
host and one or more (up to 127) peripherals. The host controller allocates the USB
bandwidth to attached devices through a token-based protocol. The bus supports
hot-plugging and dynamic configuration of the devices. All transactions are initiated by the
host controller.
The USB interface consists of a full-speed device controller with on-chip PHY (PHYsical
layer) for device functions.
Remark: Configure the part in default power mode with the power profiles before using
the USB (see Section 8.40.1). Do not use the USB when the part runs in performance,
efficiency, or low-power mode.
8.17.1 Full-speed USB device controller
The device controller enables 12 Mbit/s data exchange with a USB Host controller. It
consists of a register interface, serial interface engine, and endpoint buffer memory. The
serial interface engine decodes the USB data stream and writes data to the appropriate
endpoint buffer. The status of a completed USB transfer or error condition is indicated via
status registers. An interrupt is also generated if enabled.
8.17.1.1 Features
• Dedicated USB PLL available.
• Fully compliant with USB 2.0 specification (full speed).
• Supports 10 physical (5 logical) endpoints including one control endpoint.
• Single and double buffering supported.
• Each non-control endpoint supports bulk, interrupt, or isochronous endpoint types.
• Supports wake-up from Deep-sleep mode and Power-down mode on USB activity
and remote wake-up.
• Supports SoftConnect functionality through internal pull-up resistor.
• Internal 33 ꢀ series termination resistors on USB_DP and USB_DM lines eliminate
the need for external series resistors.
• Supports Link Power Management (LPM).
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8.18 USART0/1/2
Remark: All USART functions are movable functions and are assigned to pins through
the switch matrix. Do not connect USART functions to the open-drain pins PIO0_22 and
PIO0_23.
Interrupts generated by the USART peripherals can wake up the part from Deep-sleep
and power-down modes if the USART is in synchronous mode, the 32 kHz mode is
enabled, or the CTS interrupt is enabled.
8.18.1 Features
• Maximum bit rates of 4.5 Mbit/s in asynchronous mode, 15 Mbit/s in synchronous
mode master mode, and 18 Mbit/s in synchronous slave mode.
• 7, 8, or 9 data bits and 1 or 2 stop bits.
• Synchronous mode with master or slave operation. Includes data phase selection and
continuous clock option.
• Multiprocessor/multidrop (9-bit) mode with software address compare.
• RS-485 transceiver output enable.
• Autobaud mode for automatic baud rate detection
• Parity generation and checking: odd, even, or none.
• Software selectable oversampling from 5 to 16 clocks in asynchronous mode.
• One transmit and one receive data buffer.
• RTS/CTS for hardware signaling for automatic flow control. Software flow control can
be performed using Delta CTS detect, Transmit Disable control, and any GPIO as an
RTS output.
• Received data and status can optionally be read from a single register
• Break generation and detection.
• Receive data is 2 of 3 sample "voting". Status flag set when one sample differs.
• Built-in Baud Rate Generator with auto-baud function.
• A fractional rate divider is shared among all USARTs.
• Interrupts available for Receiver Ready, Transmitter Ready, Receiver Idle, change in
receiver break detect, Framing error, Parity error, Overrun, Underrun, Delta CTS
detect, and receiver sample noise detected.
• Loopback mode for testing of data and flow control.
• In synchronous slave mode, wakes up the part from deep-sleep and power-down
modes.
• Special operating mode allows operation at up to 9600 baud using the 32 kHz RTC
oscillator as the UART clock. This mode can be used while the device is in
Deep-sleep or Power-down mode and can wake-up the device when a character is
received.
• USART transmit and receive functions work with the system DMA controller.
8.19 SPI0/1
All SPI functions are movable functions and are assigned to pins through the switch
matrix. Do not connect SPI functions to the open-drain pins PIO0_22 and PIO0_23.
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8.19.1 Features
• Maximum data rates of 17 Mbit/s in master mode and slave mode for SPI functions
connected to all digital pins except PIO0_22 and PIO0_23.
• Data transmits of 1 to 16 bits supported directly. Larger frames supported by software.
• Master and slave operation.
• Data can be transmitted to a slave without the need to read incoming data. This can
be useful while setting up an SPI memory.
• Control information can optionally be written along with data. This allows very
versatile operation, including “any length” frames.
• Up to four Slave Select input/outputs with selectable polarity and flexible usage.
• Supports DMA transfers: SPIn transmit and receive functions work with the system
DMA controller.
Remark: Texas Instruments SSI and National Microwire modes are not supported.
8.20 I2C-bus interface
The I2C-bus is bidirectional for inter-IC control using only two wires: a serial clock line
(SCL) and a serial data line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be
controlled by more than one bus master connected to it.
The I2C-bus functions are fixed-pin functions and must be enabled through the switch
matrix on the open-drain pins PIO0_22 and PIO0_23.
8.20.1 Features
• Supports standard and fast mode with data rates of up to 400 kbit/s.
• Supports Fast-mode Plus with bit rates up to 1 Mbit/s.
• Fail-safe operation: When the power to an I2C-bus device is switched off, the SDA
and SCL pins connected to the I2C-bus are floating and do not disturb the bus.
• Independent Master, Slave, and Monitor functions.
• Supports both Multi-master and Multi-master with Slave functions.
• Multiple I2C slave addresses supported in hardware.
• One slave address can be selectively qualified with a bit mask or an address range in
order to respond to multiple I2C bus addresses.
• 10-bit addressing supported with software assist.
• Supports SMBus.
• Supported by on-chip ROM API.
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8.21 C_CAN
Controller Area Network (CAN) is the definition of a high performance communication
protocol for serial data communication. The C_CAN controller is designed to provide a full
implementation of the CAN protocol according to the CAN Specification Version 2.0B. The
C_CAN controller can build powerful local networks with low-cost multiplex wiring by
supporting distributed real-time control with a high level of reliability.
The C_CAN functions are movable functions and are assigned to pins through the switch
matrix. Do not connect C_CAN functions to the open-drain pins PIO0_22 and PIO0_23.
8.21.1 Features
• Conforms to protocol version 2.0 parts A and B.
• Supports bit rate of up to 1 Mbit/s.
• Supports 32 Message Objects.
• Each Message Object has its own identifier mask.
• Provides programmable FIFO mode (concatenation of Message Objects).
• Provides maskable interrupts.
• Supports Disabled Automatic Retransmission (DAR) mode for time-triggered CAN
applications.
• Provides programmable loop-back mode for self-test operation.
8.22 PWM/timer/motor control subsystem
The SCTimer/PWMs (State Configurable Timer/Pulse Width Modulators) and the analog
peripherals support multiple ways of interconnecting their inputs and outputs and of
interfacing to the pins and the DMA controller. Using the highly flexible and programmable
connection scheme makes it easy to configure various subsystems for motor control and
complex timing and tracking applications. Specifically, the inputs to the SCTs and the
trigger inputs of the ADCs and DMA are selected through the input mux which offers a
choice of many possible sources for each input or trigger. SCT outputs are assigned to
pins through the switch matrix allowing for many pinout solutions.
8.22.1 SCtimer/PWM subsystem
The SCTimer/PWMs can be configured to build a PWM controller with multiple outputs by
programming the MATCH and MATCHRELOAD registers to control the base frequency
and the duty cycle of each SCTimer/PWM output. More complex waveforms that span
multiple counter cycles or change behavior across or within counter cycles can be
generated using the state capability built into the SCTimer/PWMs.
Combining the PWM functions with the analog functions, the PWM output can react to
control signals like comparator outputs or the ADC interrupts. The SCT IPU adds
emergency shut-down functions and pre-processing of controlling events. For an overview
of the PWM subsystem, see Figure 12 “PWM-Analog subsystem”.
For high-speed PWM functionality, use only outputs that are fixed-pin functions to
minimize pin-to-pin differences in output skew. See also Table 22 “SCT output dynamic
characteristics”. This reduces the number of PWM outputs to five for each large SCT.
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digital signal from/to pins
analog signal from/to pins
analog peripheral
digital peripheral
digital signal internal
analog signal internal
ADC0/ADC1
4
SCT0/1/2/3
8 x PWM OUT
SCT0
MATCH/
TIMER0
TIMER1
TIMER2
TIMER3
OUTPUTS
MATCHRELOAD
8 x PWM OUT
6 x PWM OUT
SCT1
OUTPUTS
MATCH/
MATCHRELOAD
VDDA DIVIDER
TEMP SENSOR
SCT2
OUTPUTS
MATCH/
MATCHRELOAD
VOLTAGE
REFERENCE
SCT IPU
6 x PWM OUT
SCT3
OUTPUTS
MATCH/
MATCHRELOAD
ACMP0
ACMP1
ACMP2
ACMP3
aaa-010873
Fig 12. PWM-Analog subsystem
8.22.2 Timer controlled subsystem
The timers, the analog components, and the DMA can be configured to form a subsystem
that can run independently of the main processor under the control of the SCTs and any
events that are generated by the A/D converters, the comparators, the SCT output
themselves, or the external pins. A/D conversions can be triggered by the timer outputs,
the comparator outputs or by events from external pins. Data can be transferred from the
ADCs to memory using the DMA controller, and the DMA transfers can be triggered by the
ADCs, the comparator outputs, or by the timer outputs.
For an overview of the subsystem, see Figure 13 “Subsystem with timers, switch matrix,
DMA, and analog components”.
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DMA
digital signal from/to pins
analog signal from/to pins
analog peripheral
digital peripheral
digital signal internal
analog signal internal
4
ADC0/ADC1
NVIC
TIMER0 (SCT0)
VDDA DIVIDER
TEMP SENSOR
TIMER1 (SCT1)
TIMER2 (SCT2)
TIMER3 (SCT3)
VOLTAGE
REFERENCE
SCT IPU
ACMP0
ACMP1
ACMP2
ACMP3
DAC_SHUTOFF
DAC
aaa-010874
Fig 13. Subsystem with timers, switch matrix, DMA, and analog components
8.22.3 SCTimer/PWM in the large configuration (SCT0/1)
Remark: For applications that require exact timing of the SCT outputs (for example
PWM), assign the outputs only to fixed-pin functions to ensure that the output skew is
nearly the same for all outputs.
8.22.3.1 Features
The following feature list summarizes the configuration for the two large SCTs. Each large
SCT has a companion small SCT (see Section 8.22.4) with fewer inputs and outputs and
a reduced feature set.
• Each SCT supports:
– 16 match/capture registers
– 16 events
– 16 states
– Match register 0 to 5 support a fractional component for the dither engine
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– 8 inputs and 10 outputs
– DMA support
• Counter/timer features:
– Configurable as two 16-bit counters or one 32-bit counter.
– Counters clocked by system clock or selected input.
– Configurable as up counters or up-down counters.
– Configurable number of match and capture registers. Up to 16 match and capture
registers total.
– Upon match create the following events: stop, halt, limit counter or change counter
direction; toggle outputs; create an interrupt; change the state.
– Counter value can be loaded into capture register triggered by match or
input/output toggle.
• PWM features:
– Counters can be used in conjunction with match registers to toggle outputs and
create time-proportioned PWM signals.
– Up to eight single-edge or dual-edge controlled PWM outputs with up to eight
independent duty cycles when configured as 32-bit timers.
• Event creation features:
– The following conditions define an event: a counter match condition, an input (or
output) condition such as an rising or falling edge or level, a combination of match
and/or input/output condition.
– Events can only have an effect while the counter is running.
– Selected events can limit, halt, start, or stop a counter or change its direction.
– Events trigger state changes, output toggles, interrupts, and DMA transactions.
– Match register 0 can be used as an automatic limit.
– In bi-directional mode, events can be enabled based on the count direction.
– Match events can be held until another qualifying event occurs.
• State control features:
– A state is defined by the set of events that are allowed to happen in the state.
– A state changes into another state as result of an event.
– Each event can be assigned to one or more states.
– State variable allows sequencing across multiple counter cycles.
• Dither engine.
• Integrated with an input pre-processing unit (SCTIPU) to combine or delay input
events.
Inputs and outputs on the SCTimer0/PWM and SCTimer1/PWM are configured as follows:
• 8 inputs
– 7 inputs. Each input except input 7 can select one of 23 sources from an input
multiplexer.
– One input connected directly to the SCT PLL for a high-speed dedicated clock
input.
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• 10 outputs (some outputs are connected to multiple locations)
– Three outputs connected to external pins through the switch matrix as movable
functions.
– Five outputs connected to external pins through the switch matrix as fixed-pin
functions.
– Two outputs connected to the SCTIPU to sample or latch input events.
– One output connected to the other large SCT
– Four outputs connected to one small SCT
– Two outputs connected to each ADC trigger input
8.22.4 State-Configurable Timers in the small configuration (SCT2/3)
Remark: For applications that require exact timing of the SCT outputs (for example
PWM), assign the outputs only to fixed-pin functions to ensure that the output skew is
nearly the same for all outputs.
8.22.4.1 Features
The following feature list summarizes the configuration for the two small SCTs. Each small
SCT has a companion large SCT (see Section 8.22.3) with more inputs and outputs and a
dither engine.
• Each SCT supports:
– 8 match/capture registers
– 10 events
– 10 states
– 3 inputs and 6 outputs
– DMA support
• Counter/timer features:
– Configurable as two 16-bit counters or one 32-bit counter.
– Counters clocked by bus clock or selected input.
– Up counters or up-down counters.
– Configurable number of match and capture registers. Up to 16 match and capture
registers total.
– Upon match create the following events: interrupt, stop, limit timer or change
direction; toggle outputs; change state.
– Counter value can be loaded into capture register triggered by match or
input/output toggle.
• PWM features:
– Counters can be used in conjunction with match registers to toggle outputs and
create time-proportioned PWM signals.
– Up to six single-edge or dual-edge controlled PWM outputs with independent duty
cycles if configured as 32-bit timers.
• Event creation features:
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– The following conditions define an event: a counter match condition, an input (or
output) condition, a combination of a match and/or and input/output condition in a
specified state.
– Selected events can limit, halt, start, or stop a counter.
– Events control state changes, outputs, interrupts, and DMA requests.
– Match register 0 can be used as an automatic limit.
– In bi-directional mode, events can be enabled based on the count direction.
– Match events can be held until another qualifying event occurs.
• State control features:
– A state is defined by events that can take place in the state while the counter is
running.
– A state changes into another state as result of an event.
– Each event can be assigned to one or more states.
– State variable allows sequencing across multiple counter cycles.
• Integrated with an input pre-processing unit (SCTIPU) to combine or delay input
events.
Inputs and outputs on the SCTimer2/PWM and SCTimer3/PWM are configured as follows:
• 3 inputs. Each input selects one of 21 sources from a pin multiplexer.
• 6 outputs (some outputs are connected to multiple locations)
– Three outputs connected to external pins through the switch matrix as movable
functions.
– Three outputs connected to external pins through the switch matrix as fixed-pin
functions.
– Two outputs connected to the SCT IPU to sample or latch input events.
– Four outputs connected to the accompanying large SCT
– Two outputs connected to each ADC trigger input
8.22.5 SCT Input processing unit (SCTIPU)
The SCTIPU allows to block or propagate signals to inputs of the SCT under the control of
an SCT output. Using the SCTIPU in this way, allows signals to be blocked from entering
the SCT inputs for a certain amount of time, for example while they are known to be
invalid.
In addition, the SCTIPU can generate a common signal from several combined input
sources that can be selected on all SCT inputs. Such a mechanism can be useful to
create an abort signal that stops all timers.
8.22.5.1 Features
The SCTIPU pre-processes inputs to the State-Configurable Timers (SCT).
• Four outputs created from a selection of input transitions. Each output can be used as
abort input to the SCTs or for any other application which requires a collection of
multiple SCT inputs to trigger an identical SCT response.
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• Four registers to indicate which specific input sources caused the abort input to the
SCTs.
• Four additional outputs which can be sampled at certain times and latched at others
before being routed to SCT inputs.
• Nine abort inputs. Any combination of the abort inputs can trigger the dedicated abort
input of each SCT.
8.23 Quadrature Encoder Interface (QEI)
A quadrature encoder, also known as a 2-channel incremental encoder, converts angular
displacement into two pulse signals. By monitoring both the number of pulses and the
relative phase of the two signals, the user code can track the position, direction of rotation,
and velocity. In addition, a third channel, or index signal, can be used to reset the position
counter. The quadrature encoder interface decodes the digital pulses from a quadrature
encoder wheel to integrate position over time and determine direction of rotation. In
addition, the QEI can capture the velocity of the encoder wheel.
8.23.1 Features
• Tracks encoder position.
• Increments/decrements depending on direction.
• Programmable for 2 or 4 position counting.
• Velocity capture using built-in timer.
• Velocity compare function with “less than” interrupt.
• Uses 32-bit registers for position and velocity.
• Three position-compare registers with interrupts.
• Index counter for revolution counting.
• Index compare register with interrupts.
• Can combine index and position interrupts to produce an interrupt for whole and
partial revolution displacement.
• Digital filter with programmable delays for encoder input signals.
• Can accept decoded signal inputs (clock and direction).
8.24 Analog-to-Digital Converter (ADC)
The ADC supports a resolution of 12 bit and fast conversion rates of up to 2 Msamples/s.
Sequences of analog-to-digital conversions can be triggered by multiple sources. Possible
trigger sources are internal connections to other on-chip peripherals such as the SCT and
analog comparator outputs, external pins, and the ARM TXEV interrupt.
The ADC supports a variable clocking scheme with clocking synchronous to the system
clock or independent, asynchronous clocking for high-speed conversions.
The ADC includes a hardware threshold compare function with zero-crossing detection.
The threshold crossing interrupt is connected internally to the SCT inputs for tight timing
control between the ADC and the SCTs.
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8.24.1 Features
• 12-bit successive approximation analog-to-digital converter.
• 12-bit conversion rate of 2 MHz.
• Input multiplexing among 12 pins and up to 4 internal sources.
• Internal sources are the temperature sensor voltage, internal reference voltage, core
voltage regulator output, and VDDA/2.
• Two configurable conversion sequences with independent triggers.
• Optional automatic high/low threshold comparison and zero-crossing detection.
• Power-down mode and low-power operating mode.
• Measurement range VREFN to VREFP (typically 3 V; not to exceed VDDA voltage
level).
• Burst conversion mode for single or multiple inputs.
• Synchronous or asynchronous operation. Asynchronous operation maximizes
flexibility in choosing the ADC clock frequency, Synchronous mode minimizes trigger
latency and can eliminate uncertainty and jitter in response to a trigger.
8.25 Digital-to-Analog Converter (DAC)
The DAC supports a resolution of 12 bits. Conversions can be triggered by an external pin
input or an internal timer.
The DAC includes an optional automatic hardware shut-off feature which forces the DAC
output voltage to zero while a HIGH level on the external DAC_SHUTOFF pin is detected.
8.25.1 Features
• 12-bit digital-to-analog converter.
• Supports DMA.
• Internal timer or pin external trigger for staged, jitter-free DAC
conversion sequencing.
• Automatic hardware shut-off triggered by an external pin.
8.26 Analog comparator (ACMP)
The LPC15xx include four analog comparators with seven selectable inputs each for each
positive or negative input channel. Two analog inputs are common to all four comparators.
Internal voltage inputs include a voltage ladder reference with selectable voltage supply
source, the temperature sensor or the internal voltage reference.
The analog inputs to the comparators are fixed-pin functions and must be enabled through
the switch matrix.
The outputs of each analog comparator are internally connected to the ADC trigger inputs
and to the SCT inputs, so that the result of a voltage comparison can trigger a timer
operation or an analog-to-digital conversion.
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8.26.1 Features
• Seven selectable inputs. Fully configurable on either the positive side or the negative
input channel.
• 32-stage voltage ladder internal reference for selectable voltages on each
comparator; configurable on either positive or negative comparator input.
• Voltage ladder source voltage is selectable from an external pin or the 3.3 V analog
voltage supply.
• 0.9 V internal band gap reference voltage selectable as either positive or negative
input on each comparator.
• Temperature sensor voltage selectable as either positive or negative input on each
comparator.
• Voltage ladder can be separately powered down for applications only requiring the
comparator function.
• Individual comparator outputs can be connected internally to the SCT and ADC trigger
inputs or the external pins.
• Separate interrupt for each comparator.
• Pin filter included on each comparator output.
• Three propagation delay values are programmable to optimize between speed and
power consumption.
• Relaxation oscillator circuitry output for a 555 style timer operation using comparator
blocks 0 and 1.
8.27 Temperature sensor
The temperature sensor transducer uses an intrinsic pn-junction diode reference and
outputs a CTAT voltage (Complement To Absolute Temperature). The output voltage
varies inversely with device temperature with an absolute accuracy of better than ±5 C
over the full temperature range (40 C to +105 C). The temperature sensor is only
approximately linear with a slight curvature. The output voltage is measured over different
ranges of temperatures and fit with linear-least-square lines.
After power-up, the temperature sensor output must be allowed to settle to its stable value
before it can be used as an accurate ADC input.
For an accurate measurement of the temperature sensor by the ADC, the ADC must be
configured in single-channel burst mode. The last value of a nine-conversion (or more)
burst provides an accurate result.
8.28 Internal voltage reference
The internal voltage reference is an accurate 0.9 V and is the output of a low voltage band
gap circuit. A typical value at Tamb = 25 C is 0.905 V. The internal voltage reference can
be used in the following applications:
• When the supply voltage VDD is known accurately, the internal voltage reference can
be used to reduce the offset error EO of the ADC code output. The ADC error
correction then increases the accuracy of temperature sensor voltage output
measurements.
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• When the ADC is accurately calibrated, the internal voltage reference can be used to
measure the power supply voltage. This requires calibration by recording the ADC
code of the internal voltage reference at different power supply levels yielding a
different ADC code value for each supply voltage level. In a particular application, the
internal voltage reference can be measured and the actual power supply voltage can
be determined from the stored calibration values. The calibration values can be stored
in the EEPROM for easy access.
After power-up, the internal voltage reference must be allowed to settle to its stable value
before it can be used as an ADC reference voltage input.
For an accurate measurement of the internal voltage reference by the ADC, the ADC must
be configured in single-channel burst mode. The last value of a nine-conversion (or more)
burst provides an accurate result.
8.29 Multi-Rate Timer (MRT)
The Multi-Rate Timer (MRT) provides a repetitive interrupt timer with four channels. Each
channel can be programmed with an independent time interval, and each channel
operates independently from the other channels.
8.29.1 Features
• 24-bit interrupt timer
• Four channels independently counting down from individually set values
• Repeat and one-shot interrupt modes
8.30 Windowed WatchDog Timer (WWDT)
The watchdog timer resets the controller if software fails to periodically service it within a
programmable time window.
8.30.1 Features
• Internally resets chip if not periodically reloaded during the programmable time-out
period.
• Optional windowed operation requires reload to occur between a minimum and
maximum time period, both programmable.
• Optional warning interrupt can be generated at a programmable time prior to
watchdog time-out.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
• Incorrect feed sequence causes reset or interrupt if enabled.
• Flag to indicate watchdog reset.
• Programmable 24-bit timer with internal prescaler.
• Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 224 4) in
multiples of Tcy(WDCLK) 4.
• The WWDT is clocked by the dedicated watchdog oscillator (WDOsc) running at a
fixed frequency.
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8.31 Repetitive Interrupt (RI) timer
The repetitive interrupt timer provides a free-running 48-bit counter which is compared to
a selectable value, generating an interrupt when a match occurs. Any bits of the
timer/compare can be masked such that they do not contribute to the match detection.
The repetitive interrupt timer can be used to create an interrupt that repeats at
predetermined intervals.
8.31.1 Features
• 48-bit counter running from the main clock. Counter can be free-running or can be
reset when an RIT interrupt is generated.
• 48-bit compare value.
• 48-bit compare mask. An interrupt is generated when the counter value equals the
compare value, after masking. This allows for combinations not possible with a simple
compare.
8.32 System tick timer
The ARM Cortex-M3 includes a system tick timer (SYSTICK) that is intended to generate
a dedicated SYSTICK exception at a fixed time interval (typically 10 ms).
8.33 Real-Time Clock (RTC)
The RTC resides in a separate, always-on voltage domain with battery back-up. The RTC
uses an independent 32 kHz oscillator, also located in the always-on voltage domain.
8.33.1 Features
• 32-bit, 1 Hz RTC counter and associated match register for alarm generation.
• Separate 16-bit high-resolution/wake-up timer clocked at 1 kHz for 1 ms resolution
with a more that one minute maximum time-out period.
• RTC alarm and high-resolution/wake-up timer time-out each generate independent
interrupt requests. Either time-out can wake up the part from any of the low power
modes, including Deep power-down.
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8.34 Clock generation
IRC
system oscillator
watchdog oscillator
CPU, system control,
PMU
MAINCLKSELA
(main clock select A)
system clock
n
SYSTEM CLOCK
DIVIDER
main clock
memories,
peripheral clocks
RTC oscillator
SYSAHBCLKCTRLn
(AHB clock enable)
32 kHz
MAINCLKSELB
(main clock select B)
ARM core
SYSTICK
SYSTICK PERIPHERAL
CLOCK DIVIDER
IRC
SYSTEM PLL
system oscillator
USART PERIPHERAL
CLOCK DIVIDER
FRACTIONAL RATE
GENERATOR
USART[n:0]
SYSPLLCLKSEL
(system PLL clock select)
IOCONCLKDIV
CLOCK DIVIDER
IOCON digital
glitch filter
ARM TRACE CLOCK
CLOCK DIVIDER
ARM trace
USB
IRC
system oscillator
USB 48 MHz CLOCK
DIVIDER
IRC
system oscillator
USB PLL
SCT PLL
USBPLLCLKSEL
(USB PLL clock select)
USBCLKSEL
(USB clock select)
IRC
SCT
ADC
system oscillator
IRC
SCTPLLCLKSEL
(SCT PLL clock select)
ASYNC ADC CLOCK
DIVIDER
ADCASYNCCLKSEL
(clock select)
IRC
system oscillator
watchdog oscillator
CLKOUTSELA
(CLKOUT clock select A)
CLKOUT PIN CLOCK
DIVIDER
CLKOUT pin
RTC oscillator 32 kHz
CLKOUTSELB
(CLKOUT clock select B)
watchdog oscillator
WWDT
aaa-010875
Fig 14. Clock generation
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8.35 Power domains
The LPC15xx provide two independent power domains that allow the bulk of the device to
have power removed while maintaining operation of the RTC and the backup Registers.
The VBAT pin supplies power only to the RTC domain. The RTC requires a minimum of
power to operate, which can be supplied by an external battery. The device core power
(VDD) is used to operate the RTC whenever VDD is present. Therefore, there is no power
drain from the RTC battery when VDD is and VDD >= VBAT + 0.3 V.
LPC15xx
to I/O pads
to core
VSS
VDD
REGULATOR
to memories,
peripherals,
oscillators,
PLLs
WAKEUP
MAIN POWER DOMAIN
ULTRA LOW-POWER
REGULATOR
VBAT
WAKE-UP
CONTROL
BACKUP REGISTERS
REAL-TIME CLOCK
RTCXIN
32 kHz
OSCILLATOR
RTCXOUT
ALWAYS-ON/RTC POWER DOMAIN
ADC
TEMP SENSE
INTERNAL
VDDA
VDD
VOLTAGE REF
ACMP
DAC
ADC POWER DOMAIN
VSSA
aaa-010876
Fig 15. Power distribution
8.36 Integrated oscillators
The LPC15xx include the following independent oscillators: the system oscillator, the
Internal RC oscillator (IRC), the watchdog oscillator, and the 32 kHz RTC oscillator. Each
oscillator can be used for multiple purposes.
Following reset, the LPC15xx operates from the internal RC oscillator until software
switches to a different clock source. The IRC allows the system to operate without any
external crystal and the bootloader code to operate at a known frequency.
See Figure 14 for an overview of the LPC15xx clock generation.
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8.36.1 Internal RC oscillator
The IRC can be used as the clock that drives the system PLL and then the CPU. In
addition, the IRC can be selected as input to various clock dividers and as the clock
source for the USB PLL and the SCT PLL (see Figure 14). The nominal IRC frequency is
12 MHz.
Upon power-up, any chip reset, or wake-up from Deep power-down mode, the LPC15xx
use the IRC as the clock source. Software can later switch to one of the other available
clock sources.
8.36.2 System oscillator
The system oscillator can be used as a stable and accurate clock source for the CPU, with
or without using the PLL. For USB applications, use the system oscillator to provide the
clock source to USB PLL.
The system oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be
boosted to a higher frequency, up to the maximum CPU operating frequency, by the
system PLL.
The system oscillator has a wake-up time of approximately 500 μs.
8.36.3 Watchdog oscillator
The low-power watchdog oscillator can be used as a clock source that directly drives the
CPU, the watchdog timer, or the CLKOUT pin. The watchdog oscillator nominal frequency
is fixed at 503 kHz. The frequency spread over processing and temperature is 40 %.
8.36.4 RTC oscillator
The low-power RTC oscillator provides a 1 Hz clock and a 1 kHz clock to the RTC and a
32 kHz clock output that can be used to obtain the main clock (see Figure 14).The 32 kHz
oscillator output can be observed on the CLKOUT pin to allow trimming the RTC oscillator
without interference from a probe.
8.37 System PLL, USB PLL, and SCT PLL
The LPC15xx contain a three identical PLLs for generating the system clock, the 48 MHz
USB clock, and an asynchronous clock for the ADCs and SCTs. The system PLL is used
to create the main clock. The SCT and USB PLLs create dedicated clocks for the
asynchronous ADC, the asynchronous SCT clock input, and the USB.
Remark: The USB PLL is available on parts LPC1549/48/47 only.
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input
frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO).
The multiplier can be an integer value from 1 to 32. The CCO operates in the range of
156 MHz to 320 MHz. To support this frequency range, an additional divider keeps the
CCO within its frequency range while the PLL is providing the desired output frequency.
The output divider can be set to divide by 2, 4, 8, or 16 to produce the output clock. The
PLL output frequency must be lower than 100 MHz. Since the minimum output divider
value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off
and bypassed following a chip reset. Software can enable the PLL later. The program
must configure and activate the PLL, wait for the PLL to lock, and then connect to the PLL
as a clock source. The PLL settling time is 100 s.
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8.38 Clock output
The LPC15xx feature a clock output function that routes the internal oscillator outputs, the
PLL outputs, or the main clock an output pin where they can be observed directly.
8.39 Wake-up process
The LPC15xx begin operation by using the 12 MHz IRC oscillator as the clock source at
power-up and when awakened from Deep power-down mode. This mechanism allows
chip operation to resume quickly. If the application uses the system oscillator or the PLL,
software must enable these components and wait for them to stabilize. Only then can the
system use the PLL and system oscillator as a clock source.
8.40 Power control
The LPC15xx support various power control features. There are four special modes of
processor power reduction: Sleep mode, Deep-sleep mode, Power-down mode, and
Deep power-down mode. The CPU clock rate can also be controlled as needed by
changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider
value. This power control mechanism allows a trade-off of power versus processing speed
based on application requirements. In addition, a register is provided for shutting down the
clocks to individual on-chip peripherals. This register allows fine-tuning of power
consumption by eliminating all dynamic power use in any peripherals that are not required
for the application. Selected peripherals have their own clock divider which provides
additional power control.
8.40.1 Power profiles
The power consumption in Active and Sleep modes can be optimized for the application
through simple calls to the power profile. The power configuration routine configures the
LPC15xx for one of the following power modes:
• Default mode corresponding to power configuration after reset.
• CPU performance mode corresponding to optimized processing capability.
• Efficiency mode corresponding to optimized balance of current consumption and CPU
performance.
• Low-current mode corresponding to lowest power consumption.
In addition, the power profile includes routines to select the optimal PLL settings for a
given system clock and PLL input clock and to easily set the configuration options for
Deep-sleep and power-down modes.
Remark: When using the USB, configure the LPC15xx in Default mode.
8.40.2 Sleep mode
When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep
mode does not need any special sequence but re-enabling the clock to the ARM core.
In Sleep mode, execution of instructions is suspended until either a reset or interrupt
occurs. Peripheral functions continue operation during Sleep mode and can generate
interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic
power used by the processor itself, by memory systems and related controllers, and by
internal buses.
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8.40.3 Deep-sleep mode
In Deep-sleep mode, the LPC15xx is in Sleep-mode and all peripheral clocks and all clock
sources are off except for the IRC. The IRC output is disabled unless the IRC is selected
as input to the watchdog timer. In addition all analog blocks are shut down and the flash is
in stand-by mode. In Deep-sleep mode, the application can keep the watchdog oscillator
and the BOD circuit running for self-timed wake-up and BOD protection.
The LPC15xx can wake up from Deep-sleep mode via reset, selected GPIO pins, a
watchdog timer interrupt, an interrupt generating USB port activity, an RTC interrupt, or
any interrupts that the USART, SPI, or I2C interfaces can create in Deep-sleep mode. The
USART wake-up requires the 32 kHz mode, the synchronous mode, or the CTS interrupt
to be set up.
Deep-sleep mode saves power and allows for short wake-up times.
8.40.4 Power-down mode
In Power-down mode, the LPC15xx is in Sleep-mode and all peripheral clocks and all
clock sources are off except for watchdog oscillator if selected. In addition all analog
blocks and the flash are shut down. In Power-down mode, the application can keep the
BOD circuit running for BOD protection.
The LPC15xx can wake up from Power-down mode via reset, selected GPIO pins, a
watchdog timer interrupt, an interrupt generating USB port activity, an RTC interrupt, or
any interrupts that the USART, SPI, or I2C interfaces can create in Power-down mode.
The USART wake-up requires the 32 kHz mode, the synchronous mode, or the CTS
interrupt to be set up.
Power-down mode reduces power consumption compared to Deep-sleep mode at the
expense of longer wake-up times.
8.40.5 Deep power-down mode
In Deep power-down mode, power is shut off to the entire chip except for the WAKEUP
pin and the always-on RTC power-domain. The LPC15xx can wake up from Deep
power-down mode via the WAKEUP pin or a wake-up signal generated by the RTC
interrupt.
The LPC15xx can be blocked from entering Deep power-down mode by setting a lock bit
in the PMU block. Blocking the Deep power-down mode enables the application to keep
the watchdog timer or the BOD running at all times.
If the WAKEUP pin is used in the application, an external pull-up resistor is required on
the WAKEUP pin to hold it HIGH while the part is in deep power-down mode. Pulling the
WAKEUP pin LOW wakes up the part from deep power-down mode. In addition, pull the
RESET pin HIGH to prevent it from floating while in Deep power-down mode.
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8.41 System control
8.41.1 Reset
Reset has four sources on the LPC15xx: the RESET pin, the Watchdog reset, power-on
reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt
trigger input pin. Assertion of chip reset by any source, once the operating voltage attains
a usable level, starts the IRC and initializes the flash controller.
When the internal Reset is removed, the processor begins executing at address 0, which
is initially the Reset vector mapped from the boot block. At that point, all of the processor
and peripheral registers have been initialized to predetermined values.
In Deep power-down mode, an external pull-up resistor is required on the RESET pin.
The RESET pin is operational in active, sleep, deep-sleep, and power-down modes if the
RESET function is selected through the switch matrix for pin PIO0_21 (this is the default).
A LOW-going pulse as short as 50 ns executes the reset and thereby wakes up the part to
its active state. The RESET pin is not functional in Deep power-down mode and must be
pulled HIGH externally while the part is in Deep power-down mode.
9
''
9
''
9
''
5
SX
(6'
ꢀꢁꢂQVꢂ5&
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3,1
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9
66
DDDꢀꢁꢁꢂꢃꢄꢅ
Fig 16. RESET pin configuration
8.41.2 Brownout detection
The LPC15xx includes brown-out detection (BOD) with two levels for monitoring the
voltage on the VDD pin. If this voltage falls below one of two selected levels, the BOD
asserts an interrupt signal to the NVIC. This signal can be enabled for interrupt in the
Interrupt Enable Register in the NVIC to cause a CPU interrupt. Alternatively, software can
monitor the signal by reading a dedicated status register. Two threshold levels can be
selected to cause a forced reset of the chip.
8.41.3 Code security (Code Read Protection - CRP)
CRP provides different levels of security in the system so that access to the on-chip flash
and use of the Serial Wire Debugger (SWD) and In-System Programming (ISP) can be
restricted. Programming a specific pattern into a dedicated flash location invokes CRP.
IAP commands are not affected by the CRP.
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In addition, ISP entry the external pins can be disabled without enabling CRP. For details,
see the LPC15xx user manual.
There are three levels of Code Read Protection:
1. CRP1 disables access to the chip via the SWD and allows partial flash update
(excluding flash sector 0) using a limited set of the ISP commands. This mode is
useful when CRP is required and flash field updates are needed but all sectors cannot
be erased.
2. CRP2 disables access to the chip via the SWD and only allows full flash erase and
update using a reduced set of the ISP commands.
3. Running an application with level CRP3 selected, fully disables any access to the chip
via the SWD pins and the ISP. This mode effectively disables ISP override using ISP
pin as well. If necessary, the application must provide a flash update mechanism
using IAP calls or using a call to the reinvoke ISP command to enable flash update via
the USART.
CAUTION
If level three Code Read Protection (CRP3) is selected, no future factory testing can be
performed on the device.
In addition to the three CRP levels, sampling of the ISP pins for valid user code can be
disabled. For details, see the LPC15xx user manual.
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8.42 Emulation and debugging
Debug functions are integrated into the ARM Cortex-M3. Serial wire debug functions are
supported in addition to a standard JTAG boundary scan. The ARM Cortex-M3 is
configured to support up to four breakpoints and two watch points.
The RESET pin selects between the JTAG boundary scan (RESET = LOW) and the ARM
SWD debug (RESET = HIGH). The ARM SWD debug port is disabled while the LPC15xx
is in reset.
To perform boundary scan testing, follow these steps:
1. Erase any user code residing in flash.
2. Power up the part with the RESET pin pulled HIGH externally.
3. Wait for at least 250 s.
4. Pull the RESET pin LOW externally.
5. Perform boundary scan operations.
6. Once the boundary scan operations are completed, assert the TRST pin to enable the
SWD debug mode, and release the RESET pin (pull HIGH).
Remark: The JTAG interface cannot be used for debug purposes.
9. Limiting values
Table 9.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol Parameter
Conditions
Min
Max
VDDA
+4.6
VDDA
VDDA
+4.6
+5.5
Unit
V
[2]
VDD
VDDA
Vref
supply voltage (3.3 V)
0.5
0.5
0.5
0.5
0.5
0.5
analog supply voltage
reference voltage
V
on pin VREFP_DAC_VDDCMP
on pin VREFP_ADC
V
V
VBAT
VI
battery supply voltage
input voltage
V
[3][4]
5 V tolerant I/O pins; only valid
when the VDD(IO) supply voltage
is present
V
[5]
[6]
on I2C open-drain pins
PIO0_22, PIO0_23
0.5
0.5
+5.5
V
V
3 V tolerant I/O pin without
over-voltage protection. Applies
to PIO0_12.
VDDA
USB_DM, USB_DP pins
0.5
0.5
VDD + 0.5
+4.6
V
V
[7][8]
[9]
VIA
analog input voltage
[2]
[2]
Vi(xtal)
Vi(rtcx)
IDD
crystal input voltage
32 kHz oscillator input voltage
supply current
0.5
+2.5
+4.6
100
100
V
0.5
V
per supply pin
per ground pin
-
-
mA
mA
ISS
ground current
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Table 9.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol Parameter
Conditions
Min
Max
Unit
Ilatch
I/O latch-up current
(0.5VDD(IO)) < VI < (1.5VDD(IO));
Tj < 125 C
-
100
mA
[10]
[11]
Tstg
storage temperature
65
+150
150
1.5
C
C
W
Tj(max)
maximum junction temperature
-
-
Ptot(pack) total power dissipation (per
package)
based on package heat
transfer, not device power
consumption
Vesd
electrostatic discharge voltage
human body model; all pins
-
5
kV
[1] The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2] Maximum/minimum voltage above the maximum operating voltage (see Table 11) and below ground that can be applied for a short time
(< 10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter lifetime of the device.
[3] Applies to all 5 V tolerant I/O pins except true open-drain pins PIO0_22 and PIO0_23 and except the 3 V tolerant pin PIO0_12.
[4] Including the voltage on outputs in 3-state mode.
[5] VDD(IO) present or not present. Compliant with the I2C-bus standard. 5.5 V can be applied to this pin when VDD(IO) is powered down.
[6] Applies to 3 V tolerant pins PIO0_12.
[7] An ADC input voltage above 3.6 V can be applied for a short time without leading to immediate, unrecoverable failure. Accumulated
exposure to elevated voltages at 4.6 V must be less than 106 s total over the lifetime of the device. Applying an elevated voltage to the
ADC inputs for a long time affects the reliability of the device and reduces its lifetime.
[8] If the comparator is configured with the common mode input VIC = VDD, the other comparator input can be up to 0.2 V above or below
VDD without affecting the hysteresis range of the comparator function.
[9] It is recommended to connect an overvoltage protection diode between the analog input pin and the voltage supply pin.
[10] Dependent on package type.
[11] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
10. Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
Tj = Tamb + PD Rthj – a
(1)
• Tamb = ambient temperature (C),
• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
• PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
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Table 10. Thermal resistance value (C/W): ±15 %
Symbol
Parameter
Conditions
Typ
Unit
LQFP48
ja
thermal resistance
junction-to-ambient
JEDEC (4.5 in 4 in)
0 m/s
1 m/s
64
55
50
C/W
C/W
C/W
2.5 m/s
8-layer (4.5 in 3 in)
0 m/s
96
76
67
13
C/W
C/W
C/W
C/W
1 m/s
2.5 m/s
jc
jb
thermal resistance
junction-to-case
thermal resistance
junction-to-board
16
C/W
LQFP64
ja
thermal resistance
junction-to-ambient
JEDEC (4.5 in 4 in)
0 m/s
1 m/s
51
45
41
C/W
C/W
C/W
2.5 m/s
8-layer (4.5 in 3 in)
0 m/s
75
60
54
13
C/W
C/W
C/W
C/W
1 m/s
2.5 m/s
jc
jb
thermal resistance
junction-to-case
thermal resistance
junction-to-board
17
C/W
LQFP100
ja
thermal resistance
junction-to-ambient
JEDEC (4.5 in 4 in)
0 m/s
1 m/s
42
37
34
C/W
C/W
C/W
2.5 m/s
8-layer (4.5 in 3 in)
0 m/s
59
48
44
12
C/W
C/W
C/W
C/W
1 m/s
2.5 m/s
jc
jb
thermal resistance
junction-to-case
thermal resistance
junction-to-board
17
C/W
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11. Static characteristics
Table 11. Static characteristics
Tamb = 40 C to +105 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
[2]
VDD
supply voltage (core
and external rail)
2.4
3.3
VDDA
V
VDDA
Vref
analog supply voltage
reference voltage
2.4
2.4
2.7
2.4
3.3
-
3.6
V
V
V
V
on pin VREFP_DAC_VDDCMP
on pin VREFP_ADC
VDDA
VDDA
3.6
-
VBAT
IDD
battery supply voltage
supply current
3.3
Active mode; code
while(1){}
executed from flash;
[3][4][5]
[7][8]
system clock = 12 MHz; default
mode; VDD = 3.3 V
-
-
-
-
4.3
2.7
19.3
18
-
-
-
-
mA
mA
mA
mA
[3][4][5]
[7][8]
system clock = 12 MHz;
low-current mode; VDD = 3.3 V
[3][4][7]
[8][10]
system clock = 72 MHz; default
mode; VDD = 3.3 V
[3][4][7]
[8][10]
system clock = 72 MHz;
low-current mode; VDD = 3.3 V
Sleep mode;
[3][4][5]
[7][8]
system clock = 12 MHz; default
mode; VDD = 3.3 V
-
-
-
-
-
2.1
1.5
8.0
7.3
-
-
-
-
mA
mA
mA
mA
[3][4][5]
[7][8]
system clock = 12 MHz;
low-current mode; VDD = 3.3 V
[3][4][10]
[7][8]
system clock = 72 MHz; default
mode; VDD = 3.3 V
[3][4][10]
[7][8]
system clock = 72 MHz;
low-current mode; VDD = 3.3 V
[3][4][11]
IDD
IDD
IDD
supply current
supply current
supply current
Deep-sleep mode;
V
DD = 3.3 V;
Tamb = 25 C
Tamb = 105 C
310
-
380
620
A
A
-
-
[3][4][11]
Power-down mode;
VDD = 3.3 V
T
amb = 25 C
3.8
-
8
A
A
Tamb = 105 C
-
163
[3][12][13]
Deep power-down mode; VDD
=
3.3 V; VBAT = 0 or VBAT = 3.0 V
RTC oscillator running
T
amb = 25 C
-
-
-
1.1
-
1.3[14] A
Tamb = 105 C
15
-
A
[3][12]
RTC oscillator input grounded;
560
nA
Tamb = 25 C
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Table 11. Static characteristics …continued
Tamb = 40 C to +105 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
nA
[13]
[13]
IBAT
battery supply current
Deep power-down mode; VDD
VDDA = 3.3 V; VBAT = 3.0 V
=
0
1
-
-
VDD and VDDA tied to ground;
VBAT = 3.0 V
A
Standard port pins configured as digital pins, RESET; see Figure 17
IIL
LOW-level input current VI = 0 V; on-chip pull-up resistor
disabled
-
0.5
0.5
0.5
-
10[14]
10[14]
10[14]
5
nA
nA
nA
V
IIH
IOZ
VI
HIGH-level input
current
VI = VDD; on-chip pull-down
resistor disabled
-
OFF-state output
current
VO = 0 V; VO = VDD; on-chip
pull-up/down resistors disabled
-
[16]
[18]
input voltage
VDD 2.4 V; 5 V tolerant pins
0
0
except PIO0_12
VDD 2.4 V; on 3 V tolerant pin
-
VDDA
PIO0_12
VDD = 0 V
0
-
-
-
3.6
VDD
-
V
V
V
VO
output voltage
output active
0
VIH
HIGH-level input
voltage
0.7VDD
VIL
LOW-level input voltage
hysteresis voltage
-
-
-
-
0.3VDD
V
V
V
V
Vhys
2.4 V <= VDD < 3.0 V
3.0 V <= VDD <= 3.6 V
IOH = 4 mA
0.30
0.35
-
-
-
VOH
VOL
IOH
HIGH-level output
voltage
VDD 0.4 -
LOW-level output
voltage
IOL = 4 mA
-
-
-
-
-
-
0.4
-
V
HIGH-level output
current
VOH = VDD 0.4 V
VOL = 0.4 V
4
4
-
mA
mA
mA
mA
IOL
LOW-level output
current
-
[19]
[19]
IOHS
IOLS
HIGH-level short-circuit VOH = 0 V
output current
-45
50
LOW-level short-circuit VOL = VDD
output current
-
Ipd
Ipu
pull-down current
pull-up current
VI = 5 V
10
10
0
50
50
0
150
85
0
A
A
A
VI = 0 V;
VDD < VI < 5 V
High-drive output pin configured as digital pin (PIO0_24); see Figure 17
IIL
LOW-level input current VI = 0 V; on-chip pull-up resistor
disabled
-
-
-
0.5
0.5
0.5
10[14]
10[14]
10[14]
nA
nA
nA
IIH
IOZ
HIGH-level input
current
VI = VDD; on-chip pull-down
resistor disabled
OFF-state output
current
VO = 0 V; VO = VDD; on-chip
pull-up/down resistors disabled
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Table 11. Static characteristics …continued
Tamb = 40 C to +105 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
[16]
[18]
VI
input voltage
VDD 2.4 V
0
-
5.0
V
VDD = 0 V
0
-
-
-
3.6
VDD
-
V
V
V
VO
output voltage
output active
0
VIH
HIGH-level input
voltage
0.7VDD
VIL
LOW-level input voltage
hysteresis voltage
-
-
-
-
0.3VDD
V
V
V
V
Vhys
2.4 V <= VDD < 3.0 V
3.0 V <= VDD <= 3.6 V
0.30
0.35
-
-
-
VOH
HIGH-level output
voltage
IOH = 20 mA; 2.7 V <= VDD
3.6 V
<
<
VDD 0.4 -
I
OH = 12 mA; 2.4 V <= VDD
VDD 0.4 -
-
V
2.7 V
VOL
IOH
LOW-level output
voltage
IOL = 4 mA
-
-
-
-
-
-
0.4
V
HIGH-level output
current
VOH = VDD 0.4 V; 2.7 V <= VDD
< 3.6 V
20
12
4
-
mA
mA
mA
mA
VOH = VDD 0.4 V; 2.4 V <= VDD
-
< 2.7 V
IOL
LOW-level output
current
VOL = 0.4 V
-
[19]
IOLS
LOW-level short-circuit VOL = VDD
output current
-
50
[20]
[20]
Ipd
Ipu
pull-down current
pull-up current
VI = 5 V
10
10
0
50
50
0
150
85
0
A
A
A
VI = 0 V
VDD < VI < 5 V
I2C-bus pins (PIO0_22 and PIO0_23); see Figure 17
VIH
HIGH-level input
voltage
0.7VDD
-
-
V
VIL
LOW-level input voltage
hysteresis voltage
-
-
0.3VDD
V
Vhys
IOL
-
0.05VDD
-
-
-
V
LOW-level output
current
VOL = 0.4 V; I2C-bus pins
configured as standard mode pins
3.5
mA
IOL
LOW-level output
current
VOL = 0.4 V; I2C-bus pins
configured as Fast-mode Plus
pins; 2.7 V <= VDD < 3.6 V
VOL = 0.4 V; I2C-bus pins
configured as Fast-mode Plus
pins; 2.4 V <= VDD < 2.7 V
20
16
-
-
-
-
mA
mA
[21]
[2]
ILI
input leakage current
VI = VDD
VI = 5 V
-
-
2
4
A
A
10
22
USB_DM and USB_DP pins
VI
input voltage
0
-
VDD
V
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Table 11. Static characteristics …continued
Tamb = 40 C to +105 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
VIH
HIGH-level input
voltage
1.8
-
-
V
VIL
LOW-level input voltage
hysteresis voltage
-
-
-
-
-
1.0
-
V
V
ꢀ
V
Vhys
Zout
VOH
0.32
28
2.9
output impedance
44
-
HIGH-level output
voltage
VOL
IOH
LOW-level output
voltage
-
-
-
-
-
-
0.18
-
V
[22]
[22]
HIGH-level output
current
VOH = VDD 0.3 V
4.8
5.0
-
mA
mA
mA
mA
IOL
LOW-level output
current
VOL = 0.3 V
-
IOLS
LOW-level short-circuit drive LOW; pad connected to
output current ground
125
125
IOHS
HIGH-level short-circuit drive HIGH; pad connected to
-
output current
ground
Oscillator pins
Vi(xtal)
Vo(xtal)
Vi(rtcx)
crystal input voltage
on pin XTALIN
on pin XTALOUT
on pin RTCXIN
0.5
0.5
0.5
1.8
1.8
-
1.95
1.95
3.6
V
V
V
crystal output voltage
[23]
[23]
32 kHz oscillator input
voltage
Vo(rtcx)
32 kHz oscillator output on pin RTCXOUT
voltage
0.5
-
3.6
V
Pin capacitance
Cio input/output
capacitance
[24]
[24]
[24]
pins with analog and digital
functions
I2C-bus pins (PIO0_22 and
PIO0_23)
-
-
-
-
-
-
7.1
2.5
2.8
pF
pF
pF
pins with digital functions only
[1] Typical ratings are not guaranteed. The values listed are for room temperature (25 C), nominal supply voltages.
[2] For USB operation: 3.0 VVDD 3.6 V.
[3] Tamb = 25 C.
[4]
IDD measurements were performed with all pins configured as GPIO outputs driven LOW and pull-up resistors disabled.
[5] IRC enabled; system oscillator disabled; system PLL disabled.
[6] System oscillator enabled; IRC disabled; system PLL disabled.
[7] BOD disabled.
[8] All peripherals disabled in the SYSAHBCLKCTRL0/1 registers. Peripheral clocks to USART, CLKOUT, and IOCON disabled in system
configuration block.
[9] IRC enabled; system oscillator disabled; system PLL enabled.
[10] IRC disabled; system oscillator enabled; system PLL enabled.
[11] All oscillators and analog blocks turned off: Use API power_mode_configure() with mode parameter set to DEEP_SLEEP or
POWER_DOWN and peripheral parameter set to 0xFF.
[12] WAKEUP pin pulled HIGH externally.
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[13] RTC running or not running.
[14] Characterized on samples. Not tested in production.
[15] Low-current mode PWR_LOW_CURRENT selected when running the set_power routine in the power profiles.
[16] Including voltage on outputs in tri-state mode.
[17] VDD supply voltage must be present.
[18] Tri-state outputs go into tri-state mode in Deep power-down mode.
[19] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[20] Pull-up and pull-down currents are measured across the weak internal pull-up/pull-down resistors. See Figure 17.
[21] To VSS
.
[22] The parameter values specified are simulated and absolute values.
[23] The input voltage of the RTC oscillator is limited as follows: Vi(rtcx), Vo(rtcx) < max(VBAT, VDD).
[24] Including bonding pad capacitance.
V
DD
I
I
OL
pd
+
-
pin PIO0_n
pin PIO0_n
A
I
I
OH
pu
-
+
A
aaa-010819
Fig 17. Pin input/output current measurement
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11.1 Power consumption
Power measurements in Active, Sleep, and Deep-sleep modes were performed under the
following conditions:
• Configure all pins as GPIO with pull-up resistor disabled in the IOCON block.
• Configure GPIO pins as outputs using the GPIO DIR register.
• Write 1 to the GPIO CLR register to drive the outputs LOW.
aaa-011384
20
I
DD
72 MHz
60 MHz
(mA)
16
12
8
48 MHz
36 MHz
24 MHz
4
12 MHz
6 MHz
1 MHz
0
2.4
2.6
2.8
3
3.2
3.4
3.6
V
(V)
DD
Conditions: Tamb = 25 C; active mode entered executing code while(1){} from flash; all
peripherals disabled in the SYSAHBCLKCTRL0/1 registers; all peripheral clocks disabled; internal
pull-up resistors disabled; BOD disabled; low-current mode.
1 MHz - 6 MHz: IRC enabled; PLL disabled.
12 MHz: IRC enabled; PLL disabled.
24 MHz to 72 MHz: IRC enabled; PLL enabled.
Fig 18. Active mode: Typical supply current IDD versus supply voltage VDD
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aaa-011385
20
16
12
8
I
DD
72 MHz
60 MHz
(mA)
48 MHz
36 MHz
24 MHz
12 MHz
4
6 MHz
1 MHz
0
-40
-10
20
50
80
110
temperature (°C)
Conditions: VDD = 3.3 V; active mode entered executing code while(1){} from flash; all
peripherals disabled in the SYSAHBCLKCTRL0/1 registers; all peripheral clocks disabled; internal
pull-up resistors disabled; BOD disabled; low-current mode.
1 MHz - 6 MHz: IRC enabled; PLL disabled.
12 MHz: IRC enabled; PLL disabled.
24 MHz to 72 MHz: IRC enabled; PLL enabled.
Fig 19. Active mode: Typical supply current IDD versus temperature
aaa-011386
8
I
DD
72 MHz
60 MHz
(mA)
6
4
2
0
48 MHz
36 MHz
24 MHz
12 MHz
6 MHz
1 MHz
-40
-10
20
50
80
temperature (°C)
110
Conditions: VDD = 3.3 V; sleep mode entered from flash; all peripherals disabled in the
SYSAHBCLKCTRL0/1 registers; all peripheral clocks disabled; internal pull-up resistors disabled;
BOD disabled; low-current mode.
1 MHz - 6 MHz: IRC enabled; PLL disabled.
12 MHz: IRC enabled; PLL disabled.
24 MHz to 72 MHz: IRC enabled; PLL enabled.
Fig 20. Sleep mode: Typical supply current IDD versus temperature for different system
clock frequencies
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aaa-011234
400
I
DD
(μA)
380
3.6 V
3.3 V
3.0 V
2.7 V
2.4 V
360
340
320
300
280
-40
-10
20
50
80
110
temperature (°C)
Conditions: BOD disabled; all oscillators and analog blocks disabled. Use API
power_mode_configure() with mode parameter set to DEEP_SLEEP and peripheral parameter set
to 0xFF.
Fig 21. Deep-sleep mode: Typical supply current IDD versus temperature for different
supply voltages VDD
aaa-011235
80
I
DD
(μA)
60
40
20
0
-40
-10
20
50
80
110
temperature (°C)
Conditions: BOD disabled; all oscillators and analog blocks disabled; VDD = 2.4 V to 3.6 V. Use API
power_mode_configure() with mode parameter set to POWER_DOWN and peripheral parameter
set to 0xFF.
Fig 22. Power-down mode: Typical supply current IDD versus temperature for different
supply voltages VDD
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aaa-011236
4
3
2
1
0
I
DD
(μA)
3.6 V
3.3 V
2.4 V
-40
-10
20
50
80
110
temperature (°C)
VBAT = 0 V.
Fig 23. Deep power-down mode: Typical supply current IDD versus temperature for
different supply voltages VDD
aaa-011333
4
I
BAT
(μA)
3
2
1
0
-40
-10
20
50
80
110
temperature (°C)
VBAT = 3.3 V; VDD floating.
Fig 24. Deep power-down mode: Typical battery supply current IBAT versus temperature
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11.2 CoreMark data
aaa-011746
2.65
CM score
2.6
2.55
2.5
cpu
2.45
2.4
efficiency
default/low current
2.35
0
12
24
36
48
60
72
system clock frequency (MHz)
Conditions: VDD = 3.3 V; active mode; all peripherals except one UART and the SCT disabled in
the SYSAHBCLKCTRL0/1 register; internal pull-up resistors enabled; BOD disabled. Measured
with Keil uVision v.4.73.0.0, C compiler v.5.03.0.76.
Fig 25. CoreMark score
aaa-011747
30
25
20
15
10
5
I
DD
(mA)
default
cpu
efficiency
low-current
0
0
12
24
36
48
60
72
system clock frequency (MHz)
Conditions: VDD = 3.3 V; Tamb = 25 C; active mode; all peripherals except one UART and the SCT
disabled in the SYSAHBCLKCTRL0/1 registers; system clock derived from the IRC; system
oscillator disabled; internal pull-up resistors enabled; BOD disabled. Measured with Keil uVision
v.4.73.0.0, C compiler v.5.03.0.76.
Fig 26. Active mode: CoreMark power consumption IDD
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11.3 Peripheral power consumption
The supply current per peripheral is measured as the difference in supply current between
the peripheral block enabled and the peripheral block disabled in the SYSAHBCLKCFG
and PDRUNCFG (for analog blocks) registers. All other blocks are disabled in both
registers and no code accessing the peripheral is executed. Measured on a typical
sample at Tamb = 25 C. Unless noted otherwise, the system oscillator and PLL are
running in both measurements.
The supply currents are shown for system clock frequencies of 12 MHz and 72 MHz.
Table 12. Power consumption for individual analog and digital blocks
Peripheral
Typical supply current in mA
Notes
n/a
12 MHz
72 MHz
IRC
0.008
-
-
System oscillator running; PLL off; independent
of main clock frequency.
System oscillator at 12 MHz
Watchdog oscillator
0.220
0.002
-
-
-
-
IRC running; PLL off; independent of main clock
frequency.
System oscillator running; PLL off; independent
of main clock frequency.
BOD
0.045
-
-
-
-
Independent of main clock frequency.
-
Main PLL
USB PLL
SCT PLL
CLKOUT
0.085
0.100
0.110
0.005
-
0.01
Main clock divided by 4 in the CLKOUTDIV
register.
ROM
-
-
0.015
0.55
0.02
0.60
-
GPIO + pin interrupt/pattern
match
GPIO pins configured as outputs and set to
LOW. Direction and pin state are maintained if
the GPIO is disabled in the SYSAHBCLKCFG
register.
SWM
-
0.04
0.05
0.06
0.18
0.19
0.13
0.16
0.02
0.01
0.03
0.01
0.29
0.30
0.40
1.10
1.10
0.70
0.90
0.1
-
INPUT MUX
IOCON
-
-
-
-
-
-
-
-
-
-
SCTimer0/PWM
SCTimer1/PWM
SCTimer2/PWM
SCTimer3/PWM
SCT IPU
RTC
-
-
-
0.05
0.10
0.10
-
-
MRT
WWDT
Main clock selected as clock source for the
WDT.
RIT
0.07
0.12
0.02
0.03
0.01
0.20
0.80
0.12
0.3
QEI
I2C0
SPI0
SPI1
-
-
-
-
-
-
0.28
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Table 12. Power consumption for individual analog and digital blocks …continued
Peripheral
Typical supply current in mA
Notes
n/a
12 MHz
0.02
0.02
0.02
0.50
0.10
0.01
0.05
0.04
0.03
0.03
72 MHz
0.15
0.16
0.15
3.00
0.50
0.03
0.33
0.33
0.03
0.04
USART0
-
-
-
-
-
-
-
-
-
-
-
-
-
USART1
USART2
C_CAN
USB
Comparator ACMP0/1/2/3
ADC0
-
-
-
ADC1
temperature sensor
internal voltage reference/band
gap
DAC
DMA
CRC
-
-
-
0.02
0.36
0.01
0.09
1.5
-
-
0.08
11.4 Electrical pin characteristics
aaa-011257
3.3
V
OHH
(V)
3.2
3.1
3
-40 °C
25 °C
90 °C
105 °C
2.9
2.8
2.7
0
10
20
30
40
50
I
(mA)
OH
Conditions: VDD = 3.3 V; on pin PIO0_24.
Fig 27. High-drive output: Typical HIGH-level output voltage VOH versus HIGH-level
output current IOH
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aaa-011258
50
40
30
20
10
0
I
OLH
(mA)
-40 °C
25 °C
90 °C
105 °C
0
0.1
0.2
0.3
0.4
0.5
V
OL
(V)
Conditions: VDD = 3.3 V; on pins PIO0_22 and PIO0_23.
Fig 28. I2C-bus pins (high current sink): Typical LOW-level output current IOL versus
LOW-level output voltage VOL
aaa-011263
10
V
OLL
(V)
8
6
4
2
0
-40 °C
25 °C
90 °C
105 °C
0
0.1
0.2
0.3
0.4
0.5
I
(mA)
OL
Conditions: VDD = 3.3 V; standard port pins and high-drive pin PIO0_24.
Fig 29. Typical LOW-level output current IOL versus LOW-level output voltage VOL
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aaa-011276
3.3
I
OHH
(mA)
-40 °C
25 °C
90 °C
105 °C
3.1
2.9
2.7
0
3
6
9
12
V
OH
(V)
Conditions: VDD = 3.3 V; standard port pins.
Fig 30. Typical HIGH-level output voltage VOH versus HIGH-level output source current
IOH
aaa-011277
0
I
pddu
(μA)
-20
105 °C
90 °C
25 °C
-40 °C
-40
-60
-80
0
1
2
3
4
5
V (V)
I
Conditions: VDD = 3.3 V; standard port pins.
Fig 31. Typical pull-up current Ipu versus input voltage VI
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aaa-011278
80
60
40
20
0
I
pu
(μA)
-40 °C
25 °C
90 °C
105 °C
0
1
2
3
4
5
V (V)
I
Conditions: VDD = 3.3 V; standard port pins.
Fig 32. Typical pull-down current Ipd versus input voltage VI
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12. Dynamic characteristics
12.1 Flash/EEPROM memory
Table 13. Flash characteristics
amb = 40 C to +105 C. Based on JEDEC NVM qualification. Failure rate < 10 ppm for parts as
specified below.
T
Symbol
Nendu
tret
Parameter
Conditions
Min
10000
10
Typ
100000
20
Max
Unit
[1]
endurance
-
cycles
years
years
ms
retention time
powered
-
not powered
20
40
-
ter
erase time
page or multiple
consecutivepages,
sector or multiple
consecutive
95
100
105
sectors
[2]
tprog
programming
time
0.95
1
1.05
ms
[1] Number of program/erase cycles.
[2] Programming times are given for writing 256 bytes to the flash. Tamb <= +85 C. Flash programming with
IAP calls (see LPC15xx user manual).
Table 14. EEPROM characteristics
Tamb = 40 C to +85 C; VDD = 2.7 V to 3.6 V. Based on JEDEC NVM qualification. Failure rate <
10 ppm for parts as specified below.
Symbol
Nendu
tret
Parameter
endurance
Conditions
Min
100000
100
150
-
Typ
Max
Unit
1000000
200
-
-
-
-
cycles
years
years
ms
retention time
powered
not powered
64 bytes
300
tprog
programming
time
2.9
12.2 External clock for the oscillator in slave mode
Remark: The input voltage on the XTALIN and XTALOUT pins must be 1.95 V (see
Table 11). For connecting the oscillator to the XTAL pins, also see Section 14.2.
Table 15. Dynamic characteristic: external clock (XTALIN input)
T
amb = 40 C to +105 C; VDD over specified ranges.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
MHz
ns
fosc
oscillator frequency
clock cycle time
clock HIGH time
clock LOW time
clock rise time
clock fall time
1
-
-
-
-
-
-
25
Tcy(clk)
tCHCX
tCLCX
tCLCH
tCHCL
40
1000
Tcy(clk) 0.4
-
ns
Tcy(clk) 0.4
-
ns
-
-
5
5
ns
ns
[1] Parameters are valid over operating temperature range unless otherwise specified.
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[2] Typical ratings are not guaranteed. The values listed are for room temperature (25 C), nominal supply
voltages.
W
&+&;
W
W
W
&/&+
&+&/
&/&;
7
F\ꢃFONꢄ
DDDꢀꢁꢁꢂꢃꢂꢆ
Fig 33. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
12.3 Internal oscillators
Table 16. Dynamic characteristics: IRC
Tamb = 40 C to +105 C; 2.7 V VDD 3.6 V[1]
.
Symbol Parameter
Conditions
Min
Typ[2] Max
Unit
MHz
MHz
fosc(RC)
internal RC
25 C Tamb +85 C 12 - 1%
40 C Tamb < 25 C 12 - 2%
12
12
12 + 1 %
12 + 1 %
oscillator frequency
85 C < Tamb 105 C 12 - 1.5 % 12
12 + 1.5 % MHz
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are for room temperature (25 C), nominal supply
voltages.
aaa-011233
12.15
f
osc(RC)
3.6 V
3.3 V
3.0 V
2.7 V
(MHz)
12.1
12.05
12
11.95
11.9
11.85
-40
-10
20
50
80
110
temperature (°C)
Conditions: Frequency values are typical values. 12 MHz 1 % accuracy is guaranteed for
2.7 V VDD 3.6 V and Tamb = 25 C to +85 C. Variations between parts may cause the IRC to
fall outside the 12 MHz 1 % accuracy specification for voltages below 2.7 V.
Fig 34. Typical Internal RC oscillator frequency versus temperature
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Table 17. Dynamic characteristics: Watchdog oscillator
Symbol
fosc(int)
Parameter
Conditions
Min
Typ[1]
Max
Unit
[2]
internal oscillator
frequency
-
-
503
-
kHz
[1] Typical ratings are not guaranteed. The values listed are at nominal supply voltages.
[2] The typical frequency spread over processing and temperature (Tamb = 40 C to +105 C) is 40 %.
12.4 I/O pins
Table 18. Dynamic characteristics: I/O pins[1]
Tamb = 40 C to +105 C; 3.0 V VDD 3.6 V.
Symbol Parameter Conditions
Min
3.0
2.5
Typ
Max
5.0
Unit
ns
tr
tf
rise time
fall time
pin configured as output
pin configured as output
-
-
5.0
ns
[1] Applies to standard port pins and RESET pin.
12.5 I2C-bus
Table 19. Dynamic characteristic: I2C-bus pins[1]
Tamb = 40 C to +105 C; values guaranteed by design.[2]
Symbol
Parameter
Conditions
Standard-mode
Fast-mode
Min
Max
Unit
kHz
kHz
MHz
fSCL
SCL clock
frequency
0
0
0
100
400
1
Fast-mode Plus; on
pins PIO0_22 and
PIO0_23
[4][5][6][7]
tf
fall time
of both SDA and
SCL signals
-
300
ns
Standard-mode
Fast-mode
20 + 0.1 Cb 300
ns
ns
Fast-mode Plus;
on pins PIO0_22
and PIO0_23
-
120
tLOW
LOW period of
the SCL clock
Standard-mode
Fast-mode
4.7
1.3
-
-
-
s
s
s
Fast-mode Plus; on 0.5
pins PIO0_22 and
PIO0_23
tHIGH
HIGH period of
the SCL clock
Standard-mode
Fast-mode
4.0
0.6
-
-
-
s
s
s
Fast-mode Plus; on 0.26
pins PIO0_22 and
PIO0_23
[3][4][8]
tHD;DAT
data hold time
Standard-mode
Fast-mode
0
0
0
-
-
-
s
s
s
Fast-mode Plus; on
pins PIO0_22 and
PIO0_23
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32-bit ARM Cortex-M3 microcontroller
Table 19. Dynamic characteristic: I2C-bus pins[1]
Tamb = 40 C to +105 C; values guaranteed by design.[2]
Symbol
Parameter
Conditions
Standard-mode
Fast-mode
Min
250
100
Max
Unit
ns
[9][10]
tSU;DAT
data set-up
time
-
-
-
ns
Fast-mode Plus; on 50
pins PIO0_22 and
PIO0_23
ns
[1] See the I2C-bus specification UM10204 for details.
[2] Parameters are valid over operating temperature range unless otherwise specified.
[3]
tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission
and the acknowledge.
[4] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the
VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL.
[5] Cb = total capacitance of one bus line in pF.
[6] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA
output stage tf is specified at 250 ns. This allows series protection resistors to be connected in between the
SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf.
[7] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors
are used, designers should allow for this when considering bus timing.
[8] The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than
the maximum of tVD;DAT or tVD;ACK by a transition time (see UM10204). This maximum must only be met if
the device does not stretch the LOW period (tLOW) of the SCL signal. If the clock stretches the SCL, the
data must be valid by the set-up time before it releases the clock.
[9] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in
transmission and the acknowledge.
[10] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement
tSU;DAT = 250 ns must then be met. This will automatically be the case if the device does not stretch the
LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must
output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the
Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must
meet this set-up time.
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Fig 35. I2C-bus pins clock timing
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12.6 SPI interfaces
The maximum data bit rate is 17 Mbit/s in master mode and in slave mode.
Remark: SPI functions can be assigned to all digital pins. The characteristics are valid for
all digital pins except the open-drain pins PIO0_22 and PIO0_23.
Table 20. SPI dynamic characteristics
Tamb = 40 C to 105 C; 2.4 V <= VDD <= 3.6 V; CL = 10 pF; input slew = 1 ns. Simulated
parameters sampled at the 50 % level of the rising or falling edge; values guaranteed by design.
Symbol
SPI master
tDS
Parameter
Min
Max
Unit
data set-up time
30
0
-
ns
ns
ns
ns
tDH
data hold time
-
tv(Q)
data output valid time
data output hold time
-
4
-
th(Q)
2
SPI slave
tDS
data set-up time
6
-
ns
ns
ns
ns
tDH
data hold time
0
-
tv(Q)
data output valid time
data output hold time
-
29
-
th(Q)
12
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Tcy(clk) = CCLK/DIVVAL with CCLK = system clock frequency. DIVVAL is the SPI clock divider. See
the LPC15xx User manual UM10736.
Fig 36. SPI master timing
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32-bit ARM Cortex-M3 microcontroller
7
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Fig 37. SPI slave timing
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32-bit ARM Cortex-M3 microcontroller
12.7 USART interface
The maximum USART bit rate is 15 Mbit/s in synchronous mode master mode and
18 Mbit/s in synchronous slave mode.
Remark: USART functions can be assigned to all digital pins. The characteristics are valid
for all digital pins except the open-drain pins PIO0_22 and PIO0_23.
Table 21. USART dynamic characteristics
Tamb = 40 C to 105 C; 2.4 V <= VDD <= 3.6 V; CL = 10 pF; input slew = 10 ns. Simulated
parameters sampled at the 50 % level of the falling or rising edge; values guaranteed by design.
Symbol
Parameter
Min
Max
Unit
USART master (in synchronous mode)
tsu(D)
th(D)
tv(Q)
th(Q)
data input set-up time
data input hold time
data output valid time
data output hold time
33
0
-
ns
ns
ns
ns
-
-
7
-
2
USART slave (in synchronous mode)
tsu(D)
th(D)
tv(Q)
th(Q)
data input set-up time
data input hold time
data output valid time
data output hold time
13
0
-
ns
ns
ns
ns
-
-
28
-
12
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In master mode, Tcy(clk) = U_PCLK/BRGVAL. See the LPC15xx User manual UM10736.
Fig 38. USART timing
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12.8 SCT output timing
Table 22. SCT output dynamic characteristics
Tamb = 40 C to 105 C; 2.4 V <= VDD <= 3.6 V Cl = 10 pF. Simulated skew (over process, voltage,
and temperature) of any two SCT fixed-pin output signals; sampled at the 50 % level of the falling or
rising edge; values guaranteed by design.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ns
tsk(o)
output skew time
SCTimer0/PWM
SCTimer1/PWM
SCTimer2/PWM
SCTimer3/PWM
-
-
-
-
-
-
-
-
4
3
1
2
ns
ns
ns
13. Characteristics of analog peripherals
Table 23. BOD static characteristics[1]
Tamb = 25 C.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Vth
threshold voltage interrupt level 2
assertion
-
-
2.55
2.69
-
-
V
V
de-assertion
interrupt level 3
assertion
-
-
2.83
2.96
-
-
V
V
de-assertion
reset level 2
assertion
-
-
2.34
2.49
-
-
V
V
de-assertion
reset level 3
assertion
-
-
2.64
2.79
-
-
V
V
de-assertion
[1] Interrupt levels are selected by writing the level value to the BOD control register BODCTRL, see the
LPC15xx user manual.
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Table 24. 12-bit ADC static characteristics
Tamb = 40 C to +105 C; VDD = 2.4 V to 3.6 V; VREFP = VDDA; VSSA = 0; VREFN = VSSA
.
Symbol Parameter
Conditions
Min
Max
VDDA
0.32
Unit
[1]
VIA
Cia
analog input voltage
0
-
V
analog input
capacitance
pF
fclk(ADC) ADC clock frequency
VDDA 2.7 V
VDDA 2.4 V
VDDA 2.7 V
VDDA 2.4 V
50
25
2
MHz
MHz
fs
sampling frequency
-
-
-
Msamples/s
Msamples/s
LSB
1
[2]
ED
differential linearity
error
+/- 2
[3]
[4]
[5]
EL(adj)
EO
integral non-linearity
offset error
-
-
-
+/- 2
LSB
LSB
%
+/- 3
Verr(fs)
full-scale error voltage 2 Msamples/s
1 Msamples/s
+/- 0.12
+/- 0.07
-
%
[6][7]
Zi
input impedance
fs = 2 Msamples/s
0.1
M
[1] The input resistance of ADC channel 0 is higher than for all other channels.
[2] The differential linearity error (ED) is the difference between the actual step width and the ideal step width.
See Figure 40.
[3] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and
the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 40.
[4] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the
straight line which fits the ideal curve. See Figure 40.
[5] The full-scale error voltage or gain error (EG) is the difference between the straight line fitting the actual
transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See
Figure 40.
[6] Tamb = 25 C; maximum sampling frequency fs = 2 Msamples/s and analog input capacitance Cia = 0.1 pF.
[7] Input impedance Zi is inversely proportional to the sampling frequency and the total input capacity including
Cia and Cio: Zi 1 / (fs Ci). See Table 11 for Cio.
ADC
R
= 0.25 kΩ...2.5 kΩ
1
ADCn_0
C
io
R
= 5 Ω...25 Ω
sw
ADCn_[1:11]
DAC
C
DAC
C
io
C
ia
aaa-011748
Fig 39. ADC input impedance
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offset
error
O
gain
error
E
E
G
4095
4094
4093
4092
4091
4090
(2)
7
code
out
(1)
6
5
4
3
2
1
0
(5)
(4)
(3)
1 LSB
(ideal)
4090 4091 4092 4093 4094 4095 4096
1
2
3
4
5
6
7
V
IA
(LSB
)
ideal
offset error
E
O
VREFP - V
4096
SS
1 LSB =
002aaf436
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 40. 12-bit ADC characteristics
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Table 25. DAC static and dynamic characteristics
VDDA = 2.4 V to 3.6 V; Tamb = 40 C to +105 C unless otherwise specified; CL = 100 pF;
RL = 10 k..
Symbol Parameter
Conditions
Min Typ Max
Unit
[1]
fc(DAC)
DAC conversion
-
-
500
kSamples/s
frequency
RO
ts
output resistance
settling time
-
-
-
300
-
-
2.5
s
ED
differential
+/-0.4
LSB
linearity error
EL(adj)
EO
integral
non-linearity
-
-
+/-3
LSB
offset error
VDDA = 3.3 V
VDDA = 2.4 V
-
-
-
-
-
-
-
-
+/-9
LSB
LSB
%
+/-8
EG
VO
gain error
+/- 0.1
output voltage
Output voltage range
with less than 1 LSB
deviation; with
VDDA - 0.3
V
minimum RL
connected to ground
or power supply
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
LPCxxxx
DVM
DAC
R
L
10 kΩ
aaa-011964
Fig 41. DAC test circuit
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Table 26. Internal voltage reference static and dynamic characteristics
Symbol Parameter
Conditions
output voltage Tamb = 40 C to +105 C
Tamb = 25 C
Min
Typ
Max
Unit
mV
mV
s
[1]
VO
875
-
925
905
-
ts(pu)
power-up
to 99% of VO
-
125
settling time
[1] Maximum and minimum values are measured on samples from the corners of the process matrix lot.
[2] Settling time applies to switching between comparator and ADC channels.
aaa-011179
920
Voltage
(V)
915
910
905
900
895
890
-40
-10
20
50
80
110
temperature (°C)
VDDA = 3.3 V; averaged over process corners
Fig 42. Average internal voltage reference output voltage
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Table 27. Temperature sensor static and dynamic characteristics
VDDA = 2.4 V to 3.6 V
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
DTsen
sensor
Tamb = 40 C to +105 C
-
-
5
C
temperature
accuracy
EL
linearity error
Tamb = 40 C to +105 C
-
-
-
5
C
s
[2][3]
ts(pu)
power-up
settling time
to 99% of temperature
sensor output value
81
110
[1] Absolute temperature accuracy.
[2] Typical values are derived from nominal simulation (VDDA = 3.3 V; Tamb = 27 C; nominal process models).
Maximum values are derived from worst case simulation (VDDA = 2.6 V; Tamb = 105 C; slow process
models).
[3] Internal voltage reference must be powered before the temperature sensor can be turned on.
[4] Settling time applies to switching between comparator and ADC channels.
Table 28. Temperature sensor Linear-Least-Square (LLS) fit parameters
VDDA = 2.4 V to 3.6 V
Fit parameter
LLS slope
Range
Min
Typ
-2.29
577.3
-
Max
Unit
mV/C
mV
[1]
[1]
[2]
Tamb = 40 C to +105 C
Tamb = 40 C to +105 C
-
-
LLS intercept at 0 C
Value at 30 C
-
-
502
514
mV
[1] Measured over matrix samples.
[2] Measured for samples over process corners.
aaa-011334
800
V
O
(mV)
LLS fit
600
400
200
0
mMeasured temperature sensor output
-40
-10
20
50
80
110
temperature (°C)
VDDA = 3.3 V; measured on matrix samples.
Fig 43. LLS fit of the temperature sensor output voltage
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Table 29. Comparator characteristics
VDDA = 3.0 V. DLY = 0x0 in the analog comparator CTRL register for shortest propagation delay setting. See the LPC15xx
user manual UM10736.
Symbol Parameter
Static characteristics
Conditions
Min Typ
Max
Unit
IDD
supply current
VP > VM
VM > VP
-
48
-
A
A
V
-
38
-
VIC
common-mode input voltage
output voltage variation
offset voltage
0
0
-
-
VDDA
DVO
Voffset
-
VDD
V
VIC = 0.1 V
VIC = 1.5 V
VIC = 2.9 V
+/- 3
+/- 3
+/- 6
-
-
-
mV
mV
mV
-
-
Dynamic characteristics
tstartup
tPD
start-up time
nominal process
-
4.5
6
s
propagation delay
HIGH to LOW; VDDA = 3.0 V;
VIC = 0.1 V; 50 mV overdrive input
VIC = 0.1 V; rail-to-rail input
VIC = 1.5 V; 50 mV overdrive input
VIC = 1.5 V; rail-to-rail input
VIC = 2.9 V; 50 mV overdrive input
VIC = 2.9 V; rail-to-rail input
LOW to HIGH; VDDA = 3.0 V;
[1]
[1]
[1]
[1]
[1]
[1]
-
-
-
-
-
-
86
196
68
64
86
48
130
250
110
90
ns
ns
ns
ns
ns
ns
130
80
tPD
propagation delay
[1]
[1]
[1]
[1]
[1]
[1]
[2]
V
IC = 0.1 V; 50 mV overdrive input
-
-
-
-
-
-
98
24
88
68
84
98
130
40
ns
ns
ns
ns
ns
ns
VIC = 0.1 V; rail-to-rail input
VIC = 1.5 V; 50 mV overdrive input
VIC = 1.5 V; rail-to-rail input
130
120
110
180
VIC = 2.9 V; 50 mV overdrive input
VIC = 2.9 V; rail-to-rail input
Vhys
Vhys
Rlad
hysteresis voltage
hysteresis voltage
ladder resistance
positive hysteresis; VDDA = 3.0 V;
VIC = 1.5 V; settings:
5 mV
3
-
-
-
8
mV
mV
mV
10 mV
8
13
25
15 mV
17
[1][2]
negative hysteresis; VDDA = 3.0 V;
IC = 1.5 V; settings:
V
5 mV
3
-
9
mV
mV
mV
M
10 mV
8
-
18
27
-
15 mV
18
-
-
-
1
[1] CL = 10 pF; results from measurements on silicon samples over process corners and over the full temperature range Tamb = -40 C to
+105 C.
[2] Input hysteresis is relative to the reference input channel and is software programmable.
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Table 30. Comparator voltage ladder dynamic characteristics
Symbol Parameter
Conditions
Min
Typ
Max
Unit
ts(pu)
power-up settling
time
to 99% of voltage
ladder output
value
-
-
30
s
ts(sw)
switching settling
time
to 99% of voltage
ladder output
value
-
-
20
s
Table 31. Comparator voltage ladder reference static characteristics
VDD(3V3) = 3.3 V; Tamb = -40 C to + 105C; external or internal reference.
Symbol
Parameter
Conditions
Min
-
Typ
Max[1]
3
Unit
mV
%
[2]
EV(O)
output voltage error
decimal code = 00
decimal code = 08
decimal code = 16
decimal code = 24
decimal code = 30
decimal code = 31
0
0
0
0
0
0
-1.5
-1.5
-1.5
-1.5
-1.5
+1.5
+1.5
+1.5
+1.5
+1.5
%
%
%
%
[1] Measured over a polyresistor matrix lot with a 2 kHz input signal and overdrive < 100 V.
[2] All peripherals except comparator, temperature sensor, and IRC turned off.
LPC15XX
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Product data sheet
Rev. 1 — 19 February 2014
83 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
14. Application information
14.1 Suggested USB interface solutions
The USB device can be connected to the USB as self-powered device (see Figure 44) or
bus-powered device (see Figure 45).
On the LPC15xx, the PIO0_3/USB_VBUS pin is 5 V tolerant only when VDD is applied and
at operating voltage level. Therefore, if the USB_VBUS function is connected to the USB
connector and the device is self-powered, the USB_VBUS pin must be protected for
situations when VDD = 0 V.
If VDD is always greater than 0 V while VBUS = 5 V, the USB_VBUS pin can be connected
directly to the VBUS pin on the USB connector.
For systems where VDD can be 0 V and VBUS is directly applied to the VBUS pin,
precautions must be taken to reduce the voltage to below 3.6 V, which is the maximum
allowable voltage on the USB_VBUS pin in this case.
One method is to use a voltage divider to connect the USB_VBUS pin to the VBUS on the
USB connector. The voltage divider ratio should be such that the USB_VBUS pin will be
greater than 0.7VDD to indicate a logic HIGH while below the 3.6 V allowable maximum
voltage.
For the following operating conditions
VBUSmax = 5.25 V
VDD = 3.6 V,
the voltage divider should provide a reduction of 3.6 V/5.25 V or ~0.686 V.
LPC1xxx
V
DD
R2
R3
USB_CONNECT
USB
R1
1.5 kΩ
USB_VBUS
R
S
= 33 Ω
= 33 Ω
USB-B
connector
USB_DP
USB_DM
R
S
V
SS
aaa-010820
Fig 44. USB interface on a self-powered device where USB_VBUS = 5 V
For a bus-powered device, the VBUS signal does not need to be connected to the
USB_VBUS pin (see Figure 45). The USB_CONNECT function can additionally be
enabled internally by setting the DCON bit in the DEVCMDSTAT register to prevent the
USB from timing out when there is a significant delay between power-up and handling
USB traffic. External circuitry is not required for the USB_CONNECT functionality.
LPC15XX
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© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
84 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
LPC1xxx
V
DD
REGULATOR
USB_CONNECT
USB
R1
1.5 kΩ
VBUS
R
R
= 33 Ω
= 33 Ω
USB-B
connector
S
S
USB_DP
USB_DM
V
SS
aaa-010821
Fig 45. USB interface on a bus-powered device
Remark: When a bus-powered circuit as shown in Figure 45 is used or, for a self-powered
device, when the VBUS pin is not connected, configure the PIO0_3/USB_VBUS pin for
GPIO (PIO0_3) in the IOCON block. This ties the VBUS signal HIGH internally.
14.1.1 USB Low-speed operation
The USB device controller can be used in low-speed mode supporting 1.5 Mbit/s data
exchange with a USB host controller.
Remark: To operate in low-speed mode, change the board connections as follows:
1. Connect USB_DP to the D- pin of the connector.
2. Connect USB_DM to the D+ pin of the connector.
External 10 ꢀ resistors are recommended in low-speed mode to reduce over-shoots and
accommodate for 5 m cable length required for USB-IF testing.
14.2 XTAL input and crystal oscillator component selection
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave
mode, a minimum of 200 mV(RMS) is needed.
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Product data sheet
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85 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
LPC1xxx
XTALIN
C
i
C
g
100 pF
002aae788
Fig 46. Slave mode operation of the on-chip oscillator
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure 46), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTALOUT pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in Figure 47 and in
Table 32 and Table 33. Since the feedback resistance is integrated on chip, only a crystal
and the capacitances CX1 and CX2 need to be connected externally in case of
fundamental mode oscillation (the fundamental frequency is represented by L, CL and
RS). Capacitance CP in Figure 47 represents the parallel package capacitance and should
not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal
manufacturer (see Table 32).
LPC1xxx
L
XTALIN
XTALOUT
C
L
C
P
=
XTAL
R
S
C
X2
C
X1
002aaf424
Fig 47. Oscillator modes and models: oscillation mode of operation and external crystal
model used for CX1/CX2 evaluation
Table 32. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation Crystal load
Maximum crystal
External load
frequency FOSC
capacitance CL
series resistance RS
capacitors CX1, CX2
1 MHz to 5 MHz
10 pF
< 300
< 300
< 300
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
20 pF
30 pF
LPC15XX
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Product data sheet
Rev. 1 — 19 February 2014
86 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 32. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation Crystal load
Maximum crystal
External load
frequency FOSC
capacitance CL
series resistance RS
capacitors CX1, CX2
5 MHz to 10 MHz
10 pF
< 300
< 200
< 100
< 160
< 60
18 pF, 18 pF
39 pF, 39 pF
57 pF, 57 pF
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
20 pF
30 pF
10 MHz to 15 MHz
15 MHz to 20 MHz
10 pF
20 pF
10 pF
< 80
Table 33. Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) high frequency mode
Fundamental oscillation Crystal load
Maximum crystal
External load
frequency FOSC
capacitance CL
series resistance RS
capacitors CX1, CX2
15 MHz to 20 MHz
10 pF
< 180
< 100
< 160
< 80
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
39 pF, 39 pF
20 pF
20 MHz to 25 MHz
10 pF
20 pF
14.3 XTAL Printed-Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plane. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Smaller values of Cx1 and Cx2 should be chosen
according to the increase in parasitics of the PCB layout.
LPC15XX
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Product data sheet
Rev. 1 — 19 February 2014
87 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
14.4 RTC oscillator component selection
The 32 kHz crystal must be connected to the part via the RTCXIN and RTCXOUT pins as
shown in Figure 48. If the RTC is not used, the RTCXIN pin can be grounded.
LPC1xxx
L
RTCXIN
RTCXOUT
C
C
P
=
L
XTAL
R
S
C
C
X2
X1
aaa-010822
Fig 48. RTC oscillator components
Select Cx1 and Cx2 based on the external 32 kHz crystal used in the application
circuitry.The pad capacitance CP of the RTCXIN and RTCXOUT pad is 3 pF. If the external
crystal’s load capacitance is CL, the optimal Cx1 and Cx2 can be selected as:
Cx1 = Cx2 = 2 x CL – CP
LPC15XX
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Product data sheet
Rev. 1 — 19 February 2014
88 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
15. Package outline
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
c
y
X
36
25
A
E
37
24
Z
E
e
H
E
A
2
A
(A )
3
A
1
w M
p
θ
pin 1 index
b
L
p
L
13
48
detail X
1
12
Z
v M
D
A
e
w M
b
p
D
B
H
v
M
B
D
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.20 1.45
0.05 1.35
0.27 0.18 7.1
0.17 0.12 6.9
7.1
6.9
9.15 9.15
8.85 8.85
0.75
0.45
0.95 0.95
0.55 0.55
1.6
mm
0.25
0.5
1
0.2 0.12 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-01-19
03-02-25
SOT313-2
136E05
MS-026
Fig 49. Package outline LQFP48 (SOT313-2)
LPC15XX
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Product data sheet
Rev. 1 — 19 February 2014
89 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2
y
X
A
48
33
Z
49
32
E
e
H
A
E
2
E
A
(A )
3
A
1
w M
p
θ
b
L
p
pin 1 index
L
64
17
detail X
1
16
Z
v
M
A
D
e
w M
b
p
D
B
H
v
M
B
D
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.20 1.45
0.05 1.35
0.27 0.18 10.1 10.1
0.17 0.12 9.9 9.9
12.15 12.15
11.85 11.85
0.75
0.45
1.45 1.45
1.05 1.05
1.6
mm
0.25
0.5
1
0.2 0.12 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-01-19
03-02-25
SOT314-2
136E10
MS-026
Fig 50. Package outline LQFP64 (SOT314-2)
LPC15XX
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Product data sheet
Rev. 1 — 19 February 2014
90 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
y
X
A
51
75
50
26
(1)
76
Z
E
e
H
A
E
2
E
A
(A )
3
A
1
w M
p
θ
b
L
p
pin 1 index
L
detail X
100
1
25
Z
D
v
M
A
B
e
w M
b
p
D
B
H
v
M
5
D
0
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
p
v
w
y
Z
Z
θ
1
2
3
p
E
D
E
max.
7o
0o
0.15 1.45
0.05 1.35
0.27 0.20 14.1 14.1
0.17 0.09 13.9 13.9
16.25 16.25
15.75 15.75
0.75
0.45
1.15 1.15
0.85 0.85
mm
1.6
0.25
0.5
1
0.2 0.08 0.08
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-02-01
03-02-20
SOT407-1
136E20
MS-026
Fig 51. Package outline LQFP100 (SOT407-1)
LPC15XX
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91 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
16. Soldering
Footprint information for reflow soldering of LQFP48 package
SOT313-2
Hx
Gx
(0.125)
P2
P1
Hy Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500 0.560 10.350 10.350 7.350 7.350 1.500 0.280 0.500 7.500 7.500 10.650 10.650
sot313-2_fr
Fig 52. Reflow soldering for the LQFP48 package
LPC15XX
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Product data sheet
Rev. 1 — 19 February 2014
92 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Footprint information for reflow soldering of LQFP64 package
SOT314-2
Hx
Gx
(0.125)
P2
P1
Hy Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500 0.560 13.300 13.300 10.300 10.300 1.500 0.280 0.400 10.500 10.500 13.550 13.550
sot314-2_fr
Fig 53. Reflow soldering for the LQFP64 package
LPC15XX
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Product data sheet
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93 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Footprint information for reflow soldering of LQFP100 package
SOT407-1
Hx
Gx
(0.125)
P2
P1
Hy Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ax
Ay
Bx
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500 0.560 17.300 17.300 14.300 14.300 1.500 0.280 0.400 14.500 14.500 17.550 17.550
sot407-1
Fig 54. Reflow soldering for the LQFP100 package
LPC15XX
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Product data sheet
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94 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
17. References
[1] LPC15xx User manual UM10736:
http://www.nxp.com/documents/user_manual/UM10736.pdf
[2] LPC15xx Errata sheet:
http://www.nxp.com/documents/errata_sheet/ES_LPC15XX.pdf
18. Revision history
Table 34. Revision history
Document ID
Release date
20140219
Data sheet status
Change notice
Supersedes
LPC15XX v.1
Product data sheet
-
-
LPC15XX
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LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
19.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
LPC15XX
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NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
19.4 Trademarks
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
LPC15XX
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LPC15xx
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32-bit ARM Cortex-M3 microcontroller
21. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
8.21.1
8.22
8.22.1
8.22.2
8.22.3
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PWM/timer/motor control subsystem. . . . . . . 33
SCtimer/PWM subsystem . . . . . . . . . . . . . . . 33
Timer controlled subsystem . . . . . . . . . . . . . . 34
SCTimer/PWM in the large configuration
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Ordering information. . . . . . . . . . . . . . . . . . . . . 4
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 5
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
4.1
5
(SCT0/1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8.22.3.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8.22.4
6
State-Configurable Timers in the small
configuration (SCT2/3). . . . . . . . . . . . . . . . . . 37
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 8
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 12
8.22.4.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.22.5 SCT Input processing unit (SCTIPU). . . . . . . 38
8.22.5.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
8
8.1
8.2
8.3
8.3.1
8.4
8.5
8.6
8.7
Functional description . . . . . . . . . . . . . . . . . . 21
ARM Cortex-M3 processor . . . . . . . . . . . . . . . 21
Memory Protection Unit (MPU). . . . . . . . . . . . 21
On-chip flash programming memory . . . . . . . 22
ISP pin configuration . . . . . . . . . . . . . . . . . . . 22
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
On-chip ROM . . . . . . . . . . . . . . . . . . . . . . . . . 23
AHB multilayer matrix . . . . . . . . . . . . . . . . . . . 24
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 25
Nested Vectored Interrupt controller (NVIC). . 26
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 26
IOCON block . . . . . . . . . . . . . . . . . . . . . . . . . 26
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Standard I/O pad configuration. . . . . . . . . . . . 26
Switch Matrix (SWM) . . . . . . . . . . . . . . . . . . . 27
Fast General-Purpose parallel I/O (GPIO) . . . 28
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Pin interrupt/pattern match engine (PINT) . . . 28
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
GPIO group interrupts (GINT0/1) . . . . . . . . . . 29
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
DMA controller . . . . . . . . . . . . . . . . . . . . . . . . 29
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Input multiplexing (Input mux) . . . . . . . . . . . . 30
USB interface . . . . . . . . . . . . . . . . . . . . . . . . 30
Full-speed USB device controller . . . . . . . . . . 30
8.23
8.23.1
8.24
8.24.1
8.25
8.25.1
8.26
8.26.1
8.27
8.28
8.29
8.29.1
8.30
8.30.1
8.31
8.31.1
8.32
8.33
8.33.1
8.34
Quadrature Encoder Interface (QEI) . . . . . . . 39
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Analog-to-Digital Converter (ADC). . . . . . . . . 39
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Digital-to-Analog Converter (DAC). . . . . . . . . 40
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Analog comparator (ACMP). . . . . . . . . . . . . . 40
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Temperature sensor. . . . . . . . . . . . . . . . . . . . 41
Internal voltage reference . . . . . . . . . . . . . . . 41
Multi-Rate Timer (MRT) . . . . . . . . . . . . . . . . . 42
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Windowed WatchDog Timer (WWDT) . . . . . . 42
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Repetitive Interrupt (RI) timer. . . . . . . . . . . . . 43
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
System tick timer . . . . . . . . . . . . . . . . . . . . . . 43
Real-Time Clock (RTC) . . . . . . . . . . . . . . . . . 43
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Clock generation . . . . . . . . . . . . . . . . . . . . . . 44
Power domains . . . . . . . . . . . . . . . . . . . . . . . 45
Integrated oscillators . . . . . . . . . . . . . . . . . . . 45
Internal RC oscillator . . . . . . . . . . . . . . . . . . . 46
System oscillator . . . . . . . . . . . . . . . . . . . . . . 46
Watchdog oscillator . . . . . . . . . . . . . . . . . . . . 46
RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 46
System PLL, USB PLL, and SCT PLL . . . . . . 46
Clock output. . . . . . . . . . . . . . . . . . . . . . . . . . 47
Wake-up process . . . . . . . . . . . . . . . . . . . . . . 47
Power control. . . . . . . . . . . . . . . . . . . . . . . . . 47
Power profiles . . . . . . . . . . . . . . . . . . . . . . . . 47
Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . 48
Power-down mode. . . . . . . . . . . . . . . . . . . . . 48
Deep power-down mode . . . . . . . . . . . . . . . . 48
System control . . . . . . . . . . . . . . . . . . . . . . . . 49
8.8
8.9
8.9.1
8.9.2
8.10
8.10.1
8.10.2
8.11
8.12
8.12.1
8.13
8.13.1
8.14
8.14.1
8.15
8.15.1
8.16
8.17
8.17.1
8.35
8.36
8.36.1
8.36.2
8.36.3
8.36.4
8.37
8.38
8.39
8.40
8.40.1
8.40.2
8.40.3
8.40.4
8.40.5
8.41
8.17.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.18
8.18.1
8.19
8.19.1
8.20
USART0/1/2 . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
SPI0/1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . 32
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
C_CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8.20.1
8.21
continued >>
LPC15XX
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 19 February 2014
98 of 99
LPC15xx
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
8.41.1
8.41.2
8.41.3
8.42
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Brownout detection. . . . . . . . . . . . . . . . . . . . . 49
Code security (Code Read Protection - CRP) 49
Emulation and debugging. . . . . . . . . . . . . . . . 51
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 51
Thermal characteristics . . . . . . . . . . . . . . . . . 52
10
11
Static characteristics. . . . . . . . . . . . . . . . . . . . 54
Power consumption . . . . . . . . . . . . . . . . . . . . 59
CoreMark data . . . . . . . . . . . . . . . . . . . . . . . . 63
Peripheral power consumption. . . . . . . . . . . . 64
Electrical pin characteristics . . . . . . . . . . . . . . 65
11.1
11.2
11.3
11.4
12
Dynamic characteristics . . . . . . . . . . . . . . . . . 69
Flash/EEPROM memory . . . . . . . . . . . . . . . . 69
External clock for the oscillator in slave mode 69
Internal oscillators. . . . . . . . . . . . . . . . . . . . . . 70
I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
SPI interfaces . . . . . . . . . . . . . . . . . . . . . . . . . 73
USART interface. . . . . . . . . . . . . . . . . . . . . . . 75
SCT output timing. . . . . . . . . . . . . . . . . . . . . . 76
12.1
12.2
12.3
12.4
12.5
12.6
12.7
12.8
13
Characteristics of analog peripherals . . . . . . 76
14
Application information. . . . . . . . . . . . . . . . . . 84
Suggested USB interface solutions . . . . . . . . 84
USB Low-speed operation . . . . . . . . . . . . . . . 85
XTAL input and crystal oscillator component
selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
XTAL Printed-Circuit Board (PCB) layout
14.1
14.1.1
14.2
14.3
guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
RTC oscillator component selection . . . . . . . . 88
14.4
15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 89
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 95
16
17
18
19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 96
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 96
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 97
19.1
19.2
19.3
19.4
20
21
Contact information. . . . . . . . . . . . . . . . . . . . . 97
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 February 2014
Document identifier: LPC15XX
相关型号：
LPC1519JBD64E
LPC1519JBD64 - Motion Control 32-bit Microcontroller based on ARM Cortex-M3 QFP 64-Pin
NXP
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