MAX6401-26UK [NXP]
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, BGA4, MO-195, WL-CSP4, Power Management Circuit;型号: | MAX6401-26UK |
厂家: | NXP |
描述: | IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, BGA4, MO-195, WL-CSP4, Power Management Circuit |
文件: | 总11页 (文件大小:114K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
MAX6400/MAX6401/MAX6402/
MAX6403/MAX6404/MAX6405
Ultra-low-power microprocessor reset circuit
in 4-bump Chip-Scale package
Product data
2003 May 27
Philips
Semiconductors
Philips Semiconductors
Product data
Ultra-low-power microprocessor reset circuit
in 4-bump Chip-Scale package
MAX6400/MAX6401/MAX6402/
MAX6403/MAX6404/MAX6405
DESCRIPTION
TheMAX6400/MAX6401//MAX6402/MAX6403/MAX6404/MAX6405
microprocessor (µP) reset circuits monitor power supplies in µP and
digital systems. These devices eliminate external components and
adjustments while providing excellent circuit reliability and low cost
solution. They are used to monitor 2.5 V, 3 V, 3.3 V and 5 V power
supplies. A manual reset input is also available.
MAX6400-MAX6405 assert a reset signal when the V supply
DD
voltage falls below a preset reset threshold voltage. The reset signal
remains asserted for at least 100 ms after the V rises above the
DD
reset threshold. The reset threshold are factory trimmable from 2.2 V
to 4.63 V in approximately 100 mV increments. All these parts are
guaranteed to assert a reset for V down to 1 V. They have
DD
excellent immunity to fast transients on V
.
DD
The devices vary in their output configuration. The
MAX6400/MAX6403 have push-pull, active-LOW reset output; while
the MAX6402/MAX6405 have open drain, active-LOW reset output.
The MAX6401/MAX6404 have push-pull, active-HIGH reset output.
The lower threshold MAX6400/MAX6401/MAX6402 have ultra-low
supply current of typically 500 nA, making them ideal for battery
powered applications. All six devices are available in the 4-bump
Chip-Scale (WL-CSP4) package.
FEATURES
APPLICATIONS
• Ultra-Low 1 µA (max) supply current
• PDAs and pagers
• Precision monitoring of 2.5 V, 3 V, 3.3 V, and 5 V power supply
• MP3 players
• Portable/battery-powered equipment
• Cellular phones
voltages
• Reset thresholds available from 2.2 V to 4.63 V
• ±2.5% threshold accuracy from –40 °C to +85 °C
• 100 ms (min) Power-on-Reset delay time
• Manual Reset input
• Power transient immunity
• Available in three versions: push-pull RESET, push-pull RESET,
and open-drain RESET
• Guaranteed reset valid to V = 1.0 V
DD
• Ultra-small 4-bump Chip-Scale packages
SIMPLIFIED SYSTEM DIAGRAM
V
DD
R
PU
V
V
DD
DD
RESET
RESET
MOTOROLA
68HCXX
MAX6402/MAX6405
MR
GND
GND
PUSH-BUTTON
RESET SWITCH
SL01890
Figure 1. Simplified system diagram.
2
2003 May 27
853-2428 29962
Philips Semiconductors
Product data
Ultra-low-power microprocessor reset circuit
in 4-bump Chip-Scale package
MAX6400/MAX6401/MAX6402/
MAX6403/MAX6404/MAX6405
ORDERING INFORMATION
MAX6400/MAX6401/MAX6402
PACKAGE
TEMPERATURE
RANGE
TYPE NUMBER
NAME
DESCRIPTION
MAX6400-XXUK
MAX6401-XXUK
WL-CSP4
WL-CSP4
WL-CSP4
Wafer-level, chip-scale package; 4 bumps; surface mount
Wafer-level, chip-scale package; 4 bumps; surface mount
Wafer-level, chip-scale package; 4 bumps; surface mount
–40 °C to +85 °C
–40 °C to +85 °C
–40 °C to +85 °C
MAX6402-XXUK
NOTE:
Each device has 5 standard voltage options, indicated by ‘XX’ on the ‘Type number’.
Additional voltage options may be available (see Table 1 for details).
XX
Reset threshold voltage (V)
(Typical)
(type number suffix)
22
23
26
29
31
2.200
2.320
2.630
2.930
3.080
MAX6403/MAX6404/MAX6405
PACKAGE
TYPE NUMBER
TEMPERATURE
RANGE
NAME
DESCRIPTION
MAX6403-XXUK
MAX6404-XXUK
WL-CSP4
WL-CSP4
WL-CSP4
Wafer-level, chip-scale package; 4 bumps; surface mount
Wafer-level, chip-scale package; 4 bumps; surface mount
Wafer-level, chip-scale package; 4 bumps; surface mount
–40 °C to +85 °C
–40 °C to +85 °C
–40 °C to +85 °C
MAX6405-XXUK
NOTE:
Each device has 2 standard voltage options, indicated by ‘XX’ on the ‘Type number’.
Additional voltage options may be available (see Table 1 for details).
XX
Reset threshold voltage (V)
(Typical)
(type number suffix)
44
46
4.380
4.630
3
2003 May 27
Philips Semiconductors
Product data
Ultra-low-power microprocessor reset circuit
in 4-bump Chip-Scale package
MAX6400/MAX6401/MAX6402/
MAX6403/MAX6404/MAX6405
Table 1. Factory-trimmed reset thresholds (note 1)
Reset Threshold Voltage, V (V)
th
T
= +25 °C
T
= –40 °C to +85 °C
Max
Part number
Suffix (XX)
amb
amb
Min
Typ
Max
Min
22
2.167
2.285
2.364
2.462
2.591
2.660
2.758
2.886
2.955
3.034
3.250
3.349
3.447
3.546
3.644
3.743
3.841
3.940
4.038
4.137
4.235
4.314
4.432
4.560
2.200
2.320
2.400
2.500
2.630
2.700
2.800
2.930
3.000
3.080
3.300
3.400
3.500
3.600
3.700
3.800
3.900
4.000
4.100
4.200
4.300
4.380
4.500
4.630
2.233
2.355
2.436
2.537
2.669
2.741
2.842
2.974
3.045
3.126
3.350
3.451
3.552
3.654
3.755
3.857
3.958
4.060
4.161
4.263
4.364
4.446
4.567
4.699
2.145
2.262
2.340
2.437
2.564
2.633
2.730
2.857
2.925
3.003
3.217
3.315
3.412
3.510
3.607
3.705
3.802
3.900
3.997
4.095
4.192
4.270
4.387
2.250
2.375
2.460
2.562
2.696
2.768
2.870
3.000
3.075
3.150
3.383
3.485
3.587
3.690
3.792
3.895
3.997
4.100
4.202
4.305
4.407
4.489
4.612
23
24 (Note 2)
25 (Note 2)
26
MAX6400-XXUK
MAX6401-XXUK
MAX6402-XXUK
27 (Note 2)
28 (Note 2)
29
30 (Note 2)
31
33 (Note 2)
34 (Note 2)
35 (Note 2)
36 (Note 2)
37 (Note 2)
38 (Note 2)
39 (Note 2)
40 (Note 2)
41 (Note 2)
42 (Note 2)
43 (Note 2)
44
MAX6403-XXUK
MAX6404-XXUK
MAX6405-XXUK
45 (Note 2)
46
4.3514
4.746
NOTES:
1. Factory-trimmed reset thresholds are available in 100 mV increments with ±1.5% tolerance at room temperature.
2. Consult factory for availability.
4
2003 May 27
Philips Semiconductors
Product data
Ultra-low-power microprocessor reset circuit
in 4-bump Chip-Scale package
MAX6400/MAX6401/MAX6402/
MAX6403/MAX6404/MAX6405
PINNING
MAX6400/MAX6402/MAX6403/MAX6405
MAX6401/MAX6404
BUMP A1
DESIGNATOR
BUMP A1
DESIGNATOR
GND
A1
B1
A2
B2
V
GND
A1
B1
A2
B2
V
DD
DD
RESET
MR
RESET
MR
TOP VIEW
(SUBSTRATE SIDE)
TOP VIEW
(SUBSTRATE SIDE)
SL01891
SL01892
Figure 2. MAX6400/MAX6402/MAX6403/MAX6405
pin configuration.
Figure 3. MAX6401/MAX6404
pin configuration.
MAX6400/MAX6402/MAX6403/MAX6405
Pin description
MAX6401/MAX6404
Pin description
BUMP
A1
SYMBOL
DESCRIPTION
Device ground.
BUMP
A1
SYMBOL
DESCRIPTION
Device ground.
Positive supply voltage.
Active-HIGH Reset Output. RESET
GND
GND
A2
V
DD
Positive supply voltage.
A2
V
DD
B1
RESET
Active-LOW Reset output. RESET
B1
RESET
MR
remains LOW while V is below the
remains HIGH while V is below the
DD
DD
reset threshold and for a reset delay time
reset threshold and remains HIGH for at
of at least 100 ms after V rises above
least 100 ms after V rises above the
DD
DD
the reset threshold. MAX6402/MAX6405
have open-drain output and the
MAX6400/MAX6403 are push-pull output.
reset threshold.
B2
Active-LOW Manual Reset. Internal 50 kΩ
pull-up resistor to V . Pull LOW to
DD
assert a reset condition. As long as MR is
LOW, the reset remains asserted. Reset
is released in typically 185 ms (reset
delay time) after MR goes HIGH. When
B2
MR
Active-LOW Manual Reset. Internal 50 kΩ
pull-up resistor to V . Pull LOW to
DD
assert a reset condition. As long as MR is
LOW, the reset remains asserted. Reset
is released in typically 185 ms (reset
delay time) after MR goes HIGH. When
unused, the MR pin is connected to V
DD
or left floating.
unused, the MR pin is connected to V
or left floating.
DD
MAXIMUM RATINGS
SYMBOL
PARAMETER
Supply voltage
CONDITIONS
MIN.
–0.3
–0.3
–0.3
–0.3
–
MAX.
UNIT
V
V
DD
+6
Voltage RESET, RESET (push-pull)
Voltage RESET (open drain)
Voltage manual reset, MR
Input current (any pin)
V
V
+ 0.3
V
DD
+6
+ 0.3
V
V
CC
I
I
20
mA
mA
°C
°C
mW
IN
Output current (any pin)
–
20
+85
+150
303
OUT
T
amb
Ambient temperature range
Storage temperature range
Power dissipation, 4-bump WL–CSP
–40
–65
–
T
stg
P
D
Derate 3.8 mW/°C above T
= 70 °C
amb
5
2003 May 27
Philips Semiconductors
Product data
Ultra-low-power microprocessor reset circuit
in 4-bump Chip-Scale package
MAX6400/MAX6401/MAX6402/
MAX6403/MAX6404/MAX6405
ELECTRICAL CHARACTERISTICS
V
= full range (T
= –40 °C to +85 °C) unless otherwise specified. Typical values are at T
= +25 °C and V = 3 V (Note 1).
amb DD
DD
amb
SYMBOL
PARAMETER
CONDITIONS
= 0 °C to +70 °C
MIN.
1.0
1.2
–
TYP.
–
MAX.
5.5
UNIT
V
T
V
DD
Supply voltage range
amb
T
amb
= –40 °C to +85 °C
–
5.5
V
V
V
= 3.0 V for V ≤ 2.93 V;
0.5
1.0
µA
I
Supply current
DD
DD
th
DD
= 3.2 V for V ≥ 2.93 V, no load
th
V
T
= 5.5 V, no load
= +25 °C
–
1.0
1.75
µA
V
DD
V
V
– 1.5%
V
th
V
+ 1.5%
th
V
th
Reset threshold (see Table 1)
amb
th
T
amb
= –40 °C to +85 °C
– 2.5%
V
th
V
+ 2.5%
th
V
th
∆V /°C
Reset threshold temperature coefficient
Reset threshold hysteresis
–
–
40
6.3
9.5
20
185
–
–
–
ppm/°C
mV
mV
µs
th
MAX6400/MAX6401/MAX6402
MAX6403/MAX6404/MAX6405
V
hys
–
–
t
t
V
DD
to Reset release delay
V
DD
= (V + 100 mV) to (V – 100 mV)
–
–
RD
th
th
Reset active time-out period
100
–
280
0.8
ms
V
RP
V
th
V
th
V
th
V
th
> 4.0 V
≤ 4.0 V
> 4.0 V
≤ 4.0 V
V
LOW-level input voltage on MR pin
IL
IH
–
–
0.2 × V
V
DD
2.0
–
–
–
V
V
HIGH-level input voltage on MR pin
0.7 × V
–
V
DD
t
t
MR minimum input pulse width
MR glitch rejection
1
–
–
–
µs
MD
MR
100
200
50
–
–
ns
MR to Reset time delay
MR pull-up resistance
–
–
ns
25
–
75
0.3
kΩ
V
I
= 1.6 mA; V > 2.1 V;
DD
V
LOW-level output voltage
on RESET pin
(MAX6400/MAX6402/
MAX6403/MAX6405)
SINK
OL(RESET)
OH(RESET)
RESET asserted
I
= 100 µA; V > 2.1 V;
–
0.8 × V
0.8 × V
0.8 × V
0.8 × V
0.8 × V
–
–
–
–
–
–
–
–
–
–
–
0.4
–
V
V
SINK
DD
RESET asserted
I
= 500 µA; V = 3.2 V;
V
HIGH-level output voltage
on RESET pin
(MAX6400/MAX6403)
SOURCE
DD
DD
DD
DD
DD
DD
MAX6400 only; RESET released
I
= 800 µA; V = 4.5 V;
–
V
SOURCE
DD
V
≤ 4.38 V; RESET released
th
I
= 800 µA; V = V ;
th(max)
–
V
SOURCE
DD
V
≥ 4.5 V; RESET released
th
I
= 500 µA; V ≥ 2.1 V;
–
V
V
V
HIGH-level output voltage
on RESET pin
(MAX6401/MAX6404)
SOURCE
DD
OH(RESET)
RESET asserted
I
= 50 µA; V ≥ 1.2 V;
–
V
SOURCE
DD
RESET asserted
I
= 1.2 mA, V ≥ 3.2 V;
0.3
0.4
0.4
0.1
V
LOW-level output voltage
on RESET pin
(MAX6401/MAX6404)
SINK
DD
OL(RESET)
RESET released; MAX6401 only
I
= 3.2 mA, V ≥ 4.5 V;
–
V
SINK
DD
V
≤ 4.38 V; RESET released
th
I
= 3.2 mA, V = V ;
th(max)
–
V
SINK
DD
Vth ≥ 4.5 V; RESET released
Open drain RESET output leakage
current (Note 2)
RESET released
–
µA
NOTES:
1. Over-temperature limits are guaranteed by design and are not production tested.
2. Guaranteed by design; not production tested.
6
2003 May 27
Philips Semiconductors
Product data
Ultra-low-power microprocessor reset circuit
in 4-bump Chip-Scale package
MAX6400/MAX6401/MAX6402/
MAX6403/MAX6404/MAX6405
TIMING DIAGRAM
The timing diagram in Figure 4 depicts the operation of the device.
Letters indicate events on the TIME axis.
(Event D). At Event E, V falls below the reset threshold before the
reset delay time is reached, and reset remains asserted.
DD
On power-up, when V reaches 1 V, RESET is guaranteed to be a
At F, the V rises above the reset threshold and remains above the
DD
DD
logic LOW.
reset threshold for typically 185 ms. At G, the reset is once again
released.
At Event A, V rises to reset threshold voltage, V . At this time,
DD
th
the internal reset delay timer is initiated. RESET and remains
asserted for a reset delay time, t of typically 180 ms after the
At H, the MR is externally pulled LOW for greater than 1 µs
(minimum MR pulse width, t
for V = +5 V).
DD
RP
MD
supply voltage rises above the reset threshold, V .
th
At I, the manual reset is asserted in 200 ns (typical MR to reset out
delay time, t for V = +5 V).
Event B: At this time, the reset is released. RESET goes HIGH.
The reset delay time helps to ensure valid reset signals with erratic
changes in supply voltage.
MR
CC
At J, the MR pin returns HIGH. At this point, reset delay timer is
initiated and in typically 180 ms (at K), the reset condition is
released.
Events C–E: At Event C, under brown-out conditions, V falls
DD
below the reset threshold minus the hysteresis voltage, V , the
hys
Event L: On power-down, when V falls below V – V , RESET
DD
th
hys
reset signal is asserted. When power recovers and V rises above
DD
is guaranteed to be asserted until V falls below 1 V.
DD
the reset threshold, it once again initiates the reset delay timer
V
DD
V
V
– V
hys
V
V – V
th hys
th
th
th
t
t
t
RP
RP
RP
RESET
MR
t
MR
t
MD
TIME
A
B
C
D
E
F
G
H
I
J
K
L
SL01893
Figure 4. Timing diagram.
7
2003 May 27
Philips Semiconductors
Product data
Ultra-low-power microprocessor reset circuit
in 4-bump Chip-Scale package
MAX6400/MAX6401/MAX6402/
MAX6403/MAX6404/MAX6405
TECHNICAL DISCUSSION
General discussion
Manual Reset
MAX6400–MAX6405 microprocessor (µP) supervisory ICs provide
system protection by monitoring power supply voltage and asserting
a reset signal if the supply falls below the specified threshold.
The MAX6402/MAX6405 have an active-LOW open drain output.
The MAX6400/MAX6403 have an active-LOW, push-pull output;
while the MAX6401/MAX6404 have an active-HIGH, push-pull
The manual reset input, MR is active-LOW logic. It allows the
RESET to be asserted by a pushbutton switch. A mechanical
pushbutton switch is effectively debounced by the glitch filter. The
typical glitch rejection is 100 ns. MR may be driven from an external
logic circuit since it is TTL/CMOS compatible. The minimum MR
input pulse is 1 µs for V = +1.2 V to +5.5 V. When not in use, the
DD
output. The reset state is guaranteed to remain valid as long as V
is above +1 V.
pin is left floating or tied to V
.
DD
DD
Threshold levels
The reset threshold voltages are factory trimmable from 2.2 V to
4.63 V in approximately 100 mV increments. Sample stock is
available for all standard threshold voltages shown in Table 1,
“Factory-trimmed reset thresholds”. Guaranteed threshold voltage
tolerance is ±1.5% at T
ambient temperature, T
= 25 °C and ±2.5% over the operating
= –40 °C to +85 °C.
amb
amb
8
2003 May 27
Philips Semiconductors
Product data
Ultra-low-power microprocessor reset circuit
in 4-bump Chip-Scale package
MAX6400/MAX6401/MAX6402/
MAX6403/MAX6404/MAX6405
APPLICATION INFORMATION
Interfacing to µPs with bi-directional reset pins
The MAX6402/MAX6405 RESET outputs are open drain and are
easily interfaced with microprocessors which have bi-directional
reset pins, such as the Motorola 68HC11. Directly connecting the
MAX6402/MAX6405 RESET output to the µP’s reset input and
System configurations with various µPs
The MAX6400–MAX6405 Series resets provide a system solution
for various µPs. Figures 7 and 8, respectively, reference the Philips
µPs which are compatible with the MAX6400/MAX6403 and
MAX6401/MAX6404 system resets.
providing a pull-up resistor to V allows either device to
DD
independently assert reset (Figure 5).
V
DD
V
DD
V
V
DD
DD
RESET
RESET
R
PU
V
V
DD
DD
MICROPROCES-
SOR
MAX6400/
MAX6403
RESET
RESET
MOTOROLA
68HCXX
MAX6402/
MAX6405
PUSH-BUTTON
RESET
SWITCH
MR
GND
GND
PUSH-BUTTON
RESET
SWITCH
MR
GND
GND
SL01896
NOTE:
SL01894
1. Philips microprocessors with active-LOW resets:
All 16-bit devices from the XA family (XA-Cxx, XA-Gxx, XA-Sxx,
XA-Hxx), all LPC7xx devices (P87LPC760/761/762/767/768/769,
P80C591/P87C591 (with on-chip CAN controller).
Figure 5. Interfacing to µPs with bi-directional reset pins.
Negative-going V transients
Figure 7. µP system diagram using MAX6400/MAX6403
DD
The MAX6400–MAX6405 Series resets are relatively immune to
push-pull, active-LOW resets.
short duration, negative-going V transients or power glitches. This
DD
capability greatly reduces false resets with short -duration pulses.
V
DD
Figure 6, “Maximum transient duration versus reset comparator
overdrive” shows the maximum transient condition for which reset
signals are not generated. The graph shows the maximum pulse
width that a negative-going transient may have before it will
generate a reset signal. Note: as the amplitude of the transient
increases, the maximum allowable transient pulse width decreases.
V
V
DD
DD
RESET
RESET
MICROPROCES-
SOR
MAX6401/
MAX6404
450
400
PUSH-BUTTON
RESET
SWITCH
MR
GND
GND
350
MAX6400/MAX6401/MAX6402
300
250
200
SL01897
NOTE:
1. Philips microprocessors with active-HIGH resets:
MAX6403/MAX6404/MAX6405
8xC5x, 8xC3x, 8xC5xX2, 8xC3xX2, 8xC51Fx, 8xC51Rx+,
89C51Rx2, 89C66x, 8xC554, 8xC552, etc.
150
100
50
Figure 8. µP system diagram using MAX6401/MAX6404
push-pull, active-HIGH resets.
0
1
10
100
1000
RESET COMPARATOR OVERDRIVE, V – V (mV)
th
DD
SL01895
Figure 6. Maximum transient duration versus
reset comparator overdrive.
9
2003 May 27
Philips Semiconductors
Product data
Ultra-low-power microprocessor reset circuit
in 4-bump Chip-Scale package
MAX6400/MAX6401/MAX6402/
MAX6403/MAX6404/MAX6405
PACKING METHOD
The MAX6401–MAX6405 Series are packed in reels, as shown in Figure 9.
GUARD
BAND
TAPE
TAPE DETAIL
REEL
ASSEMBLY
COVER TAPE
CARRIER TAPE
BARCODE
LABEL
BOX
SL01305
Figure 9. Tape and reel packing method.
WL-CSP4: wafer level, chip-scale package; 4 bumps
E
A
2
PIN A1
CORNER INDEX
A1
B1
A2
B2
A
A
1
D
SIDE VIEW
TOP VIEW
e
B1
A1
B2
A2
b
h
PIN A1
INDICATOR
BOTTOM VIEW
DIMENSIONS
UNIT
A
A
A
b
D
E
e
h
1
2
0.024
0.020
φ 0.009
0.013
0.0120 0.042
0.042 0.0197
0.038 BASIC reference
0.010
inch
±0.0015 reference BASIC 0.038
Meets JEDEC MO195.
10
2003 May 27
Philips Semiconductors
Product data
Ultra-low-power microprocessor reset circuit
in 4-bump Chip-Scale package
MAX6400/MAX6401/MAX6402/
MAX6403/MAX6404/MAX6405
REVISION HISTORY
Rev
Date
Description
Product data (9397 750 10644); ECN 853-2428 29962 of 27 May 2003
_1
20030527
Data sheet status
Product
status
Definitions
[1]
Level
Data sheet status
[2] [3]
I
Objective data
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
Production
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limitingvaluesdefinition— Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
viaaCustomerProduct/ProcessChangeNotification(CPCN).PhilipsSemiconductorsassumesnoresponsibilityorliabilityfortheuseofanyoftheseproducts,conveys
nolicenseortitleunderanypatent, copyright, ormaskworkrighttotheseproducts, andmakesnorepresentationsorwarrantiesthattheseproductsarefreefrompatent,
copyright, or mask work right infringement, unless otherwise specified.
Koninklijke Philips Electronics N.V. 2003
Contact information
All rights reserved. Printed in U.S.A.
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 05-03
9397 750 10644
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Document order number:
Philips
Semiconductors
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