MC09XS3400AFKR2 [NXP]
BUF OR INV BASED PRPHL DRVR;
| 型号： | MC09XS3400AFKR2 |
| 厂家： | 
NXP |
| 描述： | BUF OR INV BASED PRPHL DRVR |
| 文件： | 总51页 (文件大小：1337K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Document Number: MC09XS3400
Rev. 5.0, 8/2018
NXP Semiconductors
Technical Data
Quad high-side switch (9.0 mOhm)
09XS3400
The 09XS3400 is one in a family of SMARTMOS devices designed for low-
voltage automotive lighting applications. Its four low RDS(on) MOSFETs (quad
9.0 mΩ) can control four separate 55 W bulbs, and/or Xenon modules, and/or
LEDs.
HIGH-SIDE SWITCH
Programming, control and diagnostics are accomplished using a 16-bit SPI
interface. Output slew rates are selectable to control electromagnetic emissions.
Additionally, each output has its own parallel input or SPI control for pulse-width
modulation (PWM) control if desired. The 09XS3400 allows the user to program
via the SPI the fault current trip levels and duration of acceptable lamp inrush.
The device has fail-safe mode to provide fail-safe functionality of the outputs in
case of MCU damage.
FK SUFFIX (PB-FREE)
98ARL10596D
24-PIN PQFN
Features
Applications
• Low-voltage automotive lighting
• Halogen bulbs
• Light-emitting diodes (LEDs)
• High beam
• Low beam
• Flashers
• Four protected 9.0 mΩ high-side switches (at 25 °C)
• Operating voltage range of 6.0 V to 20 V with sleep current < 5.0 μA,
extended mode from 4.0 V to 28 V
• 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting with daisy
chain capability
• PWM module using external clock or calibratable internal oscillator with
programmable outputs delay management
• Low-voltage industrial lighting
• Smart overcurrent shutdown compliant to huge inrush current, severe
short-circuit, overtemperature protections with time limited autoretry, and
fail-safe mode in case of MCU damage
• Output OFF or ON openload detection compliant to bulbs or LEDs and
short-to-battery detection, analog current feedback with selectable ratio
and board temperature feedback
V
V
V
V
V
PWR
DD
DD
PWR
DD
09XS3400
VDD
VPWR
HS0
WAKE
FSB
LOAD
LOAD
LOAD
LOAD
I/O
SCLK
CS
SCLK
CBS
SO
RSTB
SI
IN0
IN1
IN2
IN3
CSNS
FSI
HS1
HS2
HS3
SI
I/O
SO
I/O
I/O
I/O
MCU
I/O
A/D
GND
GND
Figure 1. 09XS3400 simplified application diagram
© 2018 NXP B.V.
Table of contents
1
2
3
Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Pinout diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 Static electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.3 Dynamic electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.4 Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.2 Functional pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.3 Functional internal block description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Functional device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.1 SPI protocol description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.2 Operational modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.3 Protection and diagnostic features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.4 Logic commands and registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.2 Marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
8.3 Package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
4
5
6
7
8
9
09XS3400
NXP Semiconductors
2
ORDERABLE PARTS
1
Orderable parts
Table 1. Orderable part variations
Part number
Temperature (TA)
Package
MC09XS3400AFK (1)
-40 °C to 125 °C
24-pin PQFN
Notes
1. To order parts in tape and reel, add the R2 suffix to the part number.
09XS3400
3
NXP Semiconductors
INTERNAL BLOCK DIAGRAM
2
Internal block diagram
VDD
VPWR
VPWR
Voltage Clamp
Internal
Regulator
Over/Undervoltage
Protections
VDD Failure
Detection
Charge
Pump
POR
I
UP
VREG
CSB
SCLK
Selectable Slew Rate
Gate Driver
I
DWN
Selectable Overcurrent
Detection
HS0
SO
SI
RSTB
WAKE
FSB
Severe Short-circuit
Detection
Logic
Short to VPWR
Detection
IN0
Overtemperature
Detection
IN1
IN2
IN3
Open-Load
Detections
HS0
R
R
I
DWN
DWN
DWN
HS1
HS1
HS2
HS3
PWM
Module
Calibratable
Oscillator
HS2
HS3
VREG
Programmable
Watchdog
FSI
Temperature
Feedback
Selectable Output
Current Recopy
Overtemperature
Prewarning
Analog MUX
VDD
GND
CSNS
Figure 2. 09XS3400 simplified internal block diagram
09XS3400
NXP Semiconductors
4
PIN CONNECTIONS
3
Pin connections
3.1
Pinout diagram
Transparent top view of package
13 12 11 10
9
8
7
6
5
4
3
2
1
SO
16
17
24
23
FSI
GND
GND
14
GND
HS2
22
18
HS3
15
VPWR
19
20
21
HS0
HS1
NC
Figure 3. 09XS3400 pin connections
3.2
Pin definitions
A functional description of each pin can be found in the functional pin description section beginning on page 19.
Table 2. 09XS3400 pin definitions
Pin
number
Pin
function
Pin name
Formal name
Definition
This pin reports an analog value proportional to the designated HS[0:3] output current or
the temperature of the GND flag (pin 14). It is used externally to generate a ground-
referenced voltage for the microcontroller (MCU). Current recopy and temperature
feedback is SPI programmable.
Output current
monitoring
1
CSNS
Output
Input
Each direct input controls the device mode. The IN[0:3] high-side input pins are used to
directly control HS0:HS3 high-side output pins.
If the device is SPI configured to use an external clock, the external clock is applied at the
IN0 pin.
2
3
5
6
IN0
IN1
IN2
IN3
Direct inputs
Fault status
(active low)
This pin is an open drain configured output requiring an external pull-up resistor to VDD
for fault reporting.
7
8
9
FSB
WAKE
RSTB
Output
Input
Wake
Reset
This input pin controls the device mode.
This input pin is used to initialize the device configuration and fault registers, as well as
place the device in a low-current sleep mode.
Input
Chip select
(active low)
10
11
CSB
Input
Input
This input pin is connected to a chip select output of a master microcontroller (MCU).
This input pin is connected to the MCU providing the required bit shift clock for SPI
communication.
SCLK
Serial clock
09XS3400
5
NXP Semiconductors
PIN CONNECTIONS
Table 2. 09XS3400 pin definitions (continued)
Pin
number
Pin
function
Pin name
Formal name
Definition
This pin is a command data input pin connected to the SPI Serial Data Output of the MCU
or to the SO pin of the previous device of a daisy-chain of devices.
12
13
SI
Input
Power
Ground
Serial input
VDD
GND
Digital drain voltage This pin is an external voltage input pin used to supply power interfaces to the SPI bus.
These pins, internally shorted, are the ground for the logic and analog circuitry of the
device. These ground pins must be also shorted on the board.
14, 17, 23
Ground
This pin connects to the positive power supply and is the source of operational power for
the device and power for the load.
15
16
VPWR
SO
Power
Output
Positive power supply
This output pin is connected to the SPI Serial Data Input pin of the MCU or to the SI pin
of the next device of a daisy-chain of devices.
Serial output
18
19
21
22
HS3
HS1
HS0
HS2
Output
High-side outputs
Protected 9.0 mΩ high-side power output pins to the load.
4, 20
24
NC
FSI
N/A
No connect
These pins can be left open or shorted to GND.
This input enables the watchdog timeout feature.
Input
Fail-safe input
09XS3400
NXP Semiconductors
6
ELECTRICAL CHARACTERISTICS
4
Electrical characteristics
4.1
Maximum ratings
Table 3. Maximum ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage
to the device.
Symbol
Ratings
Value
Unit
Notes
Electrical ratings
V
supply voltage range
PWR
• Load dump (400 ms)
• Maximum operating voltage
• Reverse battery
41
28
-18
V
V
PWR(SS)
VDD
VDIG
VSO
IDIG
VDD supply voltage range
Input/output voltage
-0.3 to 5.5
-0.3 to 5.5
-0.3 to VDD + 0.3
100
V
V
(5)
(5)
SO and CSNS output voltage
V
Digital input/output current in Clamp mode
WAKE input clamp current
µA
mA
mA
I
2.5
CL(WAKE)
I
CSNS input clamp current
2.5
CL(CSNS)
HS [0:3] voltage
• Positive
V
41
V
HS[0:3]
• Negative
-24
V
- V
High-side breakdown voltage
Output current
47
6.0
100
V
A
PWR
HS
(2)
(3)
I
HS[0:3]
E
Output clamp energy using single pulse method
mJ
CL[0:3]
ESD voltage
• Human Body Model (HBM) for HS[0:3], VPWR and GND
• Human Body Model (HBM) for other pins
• Charge Device Model (CDM)
V
V
±8000
±2000
ESD1
ESD2
(4)
V
• Corner pins (1, 13, 19, 21)
V
V
±750
±500
ESD3
ESD4
• All Other pins (2-12, 14-18, 20, 22-24)
Thermal ratings
Operating temperature
• Ambient
T
A
-40 to 125
-40 to 150
°C
°C
T
• Junction
J
T
Storage temperature
-55 to 150
STG
Notes
2. Continuous high-side output current rating per channel so long as maximum junction temperature is not exceeded. Calculation of maximum output
current using package thermal resistance is required.
3. Active clamp energy using single-pulse method (L = 2.0 mH, R = 0 Ω, V
= 14.0 V, T = 150 °C initial).
J
L
PWR
4. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), and the Charge Device Model
(CDM), Robotic (CZAP = 4.0 pF).
5. Input / Output pins are: IN[0:3], RSTB, FSI, SI, SCLK, CSB, and FSB.
09XS3400
7
NXP Semiconductors
ELECTRICAL CHARACTERISTICS
Table 3. Maximum ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage
to the device.
Symbol
Ratings
Value
Unit
Notes
Thermal resistance
Thermal resistance
• Junction to Case
• Junction to Ambient
(6)
RθJC
RθJA
<1.0
30
°C/W
°C
(7), (8)
T
Peak Pin Reflow Temperature During Solder Mounting
Note 8
SOLDER
Notes
6. Thermal resistance for all channels active. Device mounted on a 2s2p test board per JEDEC JESD51-2 all channels active. 15 °C/W of RθJA can
be reached in a real application case (4 layer board).
7. See Soldering information.
8. NXP’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and
Moisture Sensitivity Levels (MSL), go to www.nxp.com, search by part number (remove prefixes/suffixes) and enter the core ID to view all
orderable parts, and review parametrics.
09XS3400
NXP Semiconductors
8
ELECTRICAL CHARACTERISTICS
4.2
Static electrical characteristics
Table 4. Static electrical characteristics
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, -40 °C ≤ TA ≤ 125 °C, GND = 0 V, unless otherwise
noted. Typical values are measured at TA = 25 °C and at nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
Power inputs
Battery supply voltage range
• Fully operational
(9)
V
6.0
4.0
–
–
20
28
V
PWR
• Extended mode
(10)
V
Battery clamp voltage
41
–
47
53
10
V
PWR(CLAMP)
V
operating supply current
PWR
I
7.2
mA
PWR(ON)
• Outputs commanded ON, HS[0:3] open, IN[0:3] > V
IH
V
PWR supply current
• Outputs commanded OFF, OFF openload detection disabled, HS[0:3]
shorted to the ground with VDD= 5.5 V, WAKE > VIH or RSTB > V and
I
–
6.5
7.5
mA
PWR(SBY)
IH
IN[0:3] < V
IL
Sleep state supply current
VPWR = 12 V, RSTB = WAKE = IN[0:3] < VIL, HS[0:3] shorted to the ground
I
μA
PWR(SLEEP)
• TA = 25 °C
• TA = 85 °C
–
–
1.0
–
5.0
30
V
V
V
supply voltage
3.0
–
5.5
V
DD(ON)
DD
supply current at V = 5.5 V
DD
DD
(11)
I
• No SPI communication
• 8.0 MHz SPI communication
–
–
1.6
5.0
2.2
–
mA
DD(ON)
I
V
sleep state current at V = 5.5 V
–
–
5.0
36
μA
DD(SLEEP)
DD
DD
V
Overvoltage shutdown threshold
Overvoltage shutdown hysteresis
Undervoltage shutdown threshold
28
32
0.8
3.9
–
V
PWR(OV)
V
0.2
3.3
0.5
3.4
2.2
1.5
4.3
0.9
4.5
2.8
V
PWR(OVHYS)
(12)
V
V
PWR(UV)
SUPPLY(POR)
V
V
and VDD power-on reset threshold
VPWR(UV)
PWR
V
Recovery undervoltage threshold
supply failure threshold (for V
4.1
2.5
V
V
PWR(UV)_UP
V
V
> V
)
PWR(UV)
DD(FAIL)
DD
PWR
Outputs HS0 TO HS3
HS[0:3] output Drain-to-Source ON resistance (I = 5.0 A, T = 25 °C)
HS
A
• V
• V
• V
• V
= 4.5 V
= 6.0 V
= 10 V
= 13 V
–
–
–
–
–
–
–
–
32.5
14.5
9.0
PWR
PWR
PWR
PWR
R
R
mΩ
mΩ
DS(on)
DS(on)
9.0
HS[0:3] output Drain-to-Source ON resistance (I = 5.0 A, T = 150 °C)
HS
A
• V
• V
• V
• V
= 4.5 V
= 6.0 V
= 10 V
= 13 V
–
–
–
–
–
–
–
–
55.3
24.7
15.3
15.3
PWR
PWR
PWR
PWR
Notes
9. In extended mode, the functionality is guaranteed but not the electrical parameters. From 4.0 V to 6.0 V voltage range, the device is only protected
with the thermal shutdown detection.
10. Measured with the outputs open.
11. Typical value guaranteed per design.
12. Output automatically recover with time limited autoretry to instructed state when V
voltage is restored to normal, as long as the V
PWR
PWR
degradation level does not go below the undervoltage power-ON reset threshold. This applies to all internal device logic supplied by V
and
PWR
assumes the external V
supply is within specification.
DD
09XS3400
9
NXP Semiconductors
ELECTRICAL CHARACTERISTICS
Table 4. Static electrical characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, -40 °C ≤ TA ≤ 125 °C, GND = 0 V, unless otherwise
noted. Typical values are measured at TA = 25 °C and at nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
Outputs HS0 TO HS3 (continued)
HS[0:3] output Source-to-Drain ON resistance (I = -5.0 A, V
HS
-18 V)
PWR=
(13)
(14)
R
R
• T = 25 °C
–
–
–
–
13.5
18
mΩ
mΩ
SD(ON)
SHORT
A
• T = 150 °C
A
HS[0:3] maximum severe short-circuit impedance detection
21
47
75
HS[0:3] output leakage current in OFF state
• Sleep mode, outputs grounded, T = 25 °C
–
–
–
0
0
20
2.0
3.0
25
A
ILEAK(OFF)
µA
• Sleep mode, outputs grounded, T = 125 °C
A
Normal mode (OLOFF_dis_s=1 and OS_dis_s=1), outputs grounded
OCHI1
OCHI2
OC1
OC2
OC3
89.4
55.8
49.8
42.4
35.7
28.1
21.6
14
–
–
–
–
–
–
–
–
–
–
131.6
83.7
73
62.7
52
41.6
31.2
20.8
16.7
11.5
HS[0:3] output overcurrent detection levels (6.0 V < V
< 20 V)
A
HS[0:3]
OC4
OCLO4
OCLO3
OCLO2
OCLO1
11
6.9
HS[0:3] current sense ratio (6.0 V <
• CSNS_ratio bit = 0
< 20 V, CSNS < 5.0 V)
HS[0:3]
(15)
C
C
–
–
1/10300
1/61000
–
–
–
SR0
SR1
• CSNS_ratio bit = 1
HS[0:3] current sense ratio (C
• IHS[0:3] = 12.5 A
) accuracy (6.0 V < V
< 20 V)
HS[0:3]
SR0
-12
-13
-16
-20
–
–
–
–
12
13
16
20
C
• IHS[0:3] = 5.0 A
• IHS[0:3] = 3.0 A
• IHS[0:3] = 1.5 A
%
SR0_ACC
HS[0:3] current recopy accuracy with one calibration point done at 5.0 A and
25 °C (6.0 V < V < 20 V)
(16)
(17)
C
-5.0
–
–
–
5.0
%
%/°C
%
HS[0:3]
SR0_ACC(CAL)
• IHS[0:3] = 5.0 A
HS[0,3] C current recopy temperature drift (6.0 V < V
< 20 V)
HS[0:3]
SR0
Δ(C
)/Δ(T)
0.04
SR0
• IHS[0:3] = 5.0 A
HS[0,3] current sense ratio (C
• IHS[0:3] = 12.5 A
) accuracy (6.0 V < V
< 20 V)
HS[0:3]
SR1
C
-17
-12
–
–
+17
+12
SR1_ACC
• IHS[0:3] = 75 A
HS[0,3] current recopy accuracy with one calibration point done at 12.5 A and
25 °C (6.0 V < V < 20 V)
(16)
C
-5.0
–
–
5.0
%
V
HS[0:3]
SR1_ACC(CAL)
• IHS[0:3] = 12.5 A
Current sense clamp voltage
• CSNS Open; I 5.0 A with C
VDD+0.2
5
V
VDD+1.0
CL(CSNS)
ratio
SR0
HS[0:3] =
Notes
13. Source-Drain ON Resistance (Reverse Drain-to-Source ON Resistance) with negative polarity V
.
PWR
14. Short-circuit impedance calculated from HS[0:3] to GND pins. Value guaranteed per design.
15. Current sense ratio = ICSNS / IHS[0:3]
16. Based on statistical analysis. It is not production tested.
17. Based on statistical data: delta(C
production tested.
)/delta(T) = {(measured ICSNS at T1 - measured ICSNS at T2) / measured ICSNS at room} / {T1-T2}. Not
SR0
09XS3400
NXP Semiconductors
10
ELECTRICAL CHARACTERISTICS
Table 4. Static electrical characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, -40 °C ≤ TA ≤ 125 °C, GND = 0 V, unless otherwise
noted. Typical values are measured at TA = 25 °C and at nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
Outputs HS0 TO HS3 (continued)
(18)
(18)
I
OFF openload detection source current
30
2.0
110
–
100
4.0
μA
V
OLD(off)
V
OFF openload fault detection voltage threshold
ON openload fault detection current threshold
ON openload fault detection current threshold with LED
3.0
330
OLD(THRES)
I
660
mA
OLD(on)
I
2.5
5.0
10
VPWR-0.4
-16
mA
V
OLD(ON_LED)
V
= V
- 0.75 V
HS[0:3]
PWR
VPWR
0.8
-
V
Output short to V
detection voltage threshold, output programmed OFF VPWR-1.2
PWR
OSD(THRES)
VCL
Output negative clamp voltage
• 0.5 A < I < 5.0 A, output programmed OFF
-22
–
V
HS[0:3]
T
Output overtemperature shutdown for 4.5 V < VPWR < 28 V
Input logic high voltage
155
2.0
-0.3
5.0
5.0
–
175
–
195
5.5
0.8
20
°C
V
SD
(19)
(19)
(22)
(23)
(20)
V
IH
V
Input logic low voltage
–
V
IL
I
Input logic pull-down current (SCLK, SI)
Input logic pull-up current (CSB)
SO, FSB tri-state capacitance
–
μA
μA
pF
kΩ
pF
DWN
I
–
20
UP
C
–
20
SO
R
Input logic pull-down resistor (RSTB, WAKE and IN[0:3])
Input capacitance
125
–
250
4.0
500
12
DWN
(20)
(21)
CIN
Wake input clamp voltage
V
18
25
–
32
-0.3
–
V
V
V
CL(WAKE)
• I
< 2.5 mA
CL(WAKE)
Wake input forward voltage
• I = -2.5 mA
V
-2.0
F(WAKE)
CL(WAKE)
SO high state output voltage
• I = 1.0 mA
V
VDD-0.4
–
SOH
OH
Control interface
SO and FSB Low-state Output Voltage
V
–
–
0.4
2.0
V
SOL
• I = -1.0 mA
OL
SO, CSNS and FSB Tri-state Leakage Current
I
-2.0
0.0
μA
SO(LEAK)
RFS
• CSB = VIH and 0 V < VSO < VDD, or FSB = 5.5 V, or CSNS = 0.0 V
FSI External Pull-down Resistance
• Watchdog Disabled
(24)
–
10
0.0
Infinite
1.0
–
kΩ
• Watchdog Enabled
Notes
18. Output OFF openload detection current is the internal current source used during OFF state openload diagnostic. An openload fault is detected
when the output voltage is greater than VOLD(THRES)
19. Upper and lower logic threshold voltage range applies to SI, CSB, SCLK, RSTB, IN[0:3] and WAKE input signals. The WAKE and RSTB signals
may be supplied by a voltage reference derived from V
.
PWR
20. Input capacitance of SI, CSB, SCLK, RSTB, IN[0:3] and WAKE. This parameter is guaranteed by process monitoring but is not production tested.
21. The current must be limited by a series resistance when using voltages > 7.0 V.
22. Pull-down current is with VSI > 1.0 V and VSCLK > 1.0 V.
23. Pull-up current is wiTH VCSB < 2.0 V. CSB has an active internal pull-up to V
.
DD
24. In fail-safe HS[0:3] output depends respectively on IN[0:3] input. FSI has an active internal pull-up to V
~ 3.0 V.
REG
09XS3400
11
NXP Semiconductors
ELECTRICAL CHARACTERISTICS
4.3
Dynamic electrical characteristics
Table 5. Dynamic electrical characteristics
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, -40 °C ≤ TA ≤ 125 °C, GND = 0 V, unless otherwise
noted. Typical values are measured at TA = 25 °C and at nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
Power output timing HS0 TO HS3
Output rising medium slew rate (medium speed slew rate / SR[1:0] = 00)
• V = 14 V
(25)
(25)
SRR_00
SRR_01
SRR_10
SRF_00
SRF_01
SRF_10
tDLY(on)
tDLY(off)
ΔSR
0.25
0.125
0.5
0.6
0.3
1.2
0.6
0.3
1.2
–
1.0
0.5
1.5
1.0
0.5
1.5
105
65
V/μs
V/μs
V/μs
V/μs
V/μs
V/μs
μs
PWR
Output rising slow slew rate (low speed slew rate / SR[1:0] = 01)
• V = 14 V
PWR
Output rising fast slew rate (high speed slew rate / SR[1:0] = 10)
• V = 14 V
(25)
PWR
Output falling medium slew rate (medium speed slew rate / SR[1:0] = 00)
• V = 14 V
(25)
0.25
0.125
0.5
PWR
Output falling slow slew rate (low speed slew rate / SR[1:0] = 01)
• V = 14 V
(25)
PWR
Output falling fast slew rate (high speed slew rate / SR[1:0] = 10)
• V = 14 V
(25)
PWR
HS[0:3] outputs turn-on delay time
• V = 14 V for medium speed slew rate (SR[1:0] = 00)
(26)(27)
(26)(27)
55
PWR
HS[0:3] outputs turn-off delay time
• V = 14 V for medium speed slew rate (SR[1:0] = 00)
15
–
μs
PWR
Driver output matching slew rate (SR /SR )
R
F
0.64
1.0
0.96
V
= 14 V at 25 °C and for medium speed slew rate (SR[1:0] = 00)
PWR
HS[0:3] driver output matching time (t
- t
) V
= 14 V,
PWR
DLY(on) DLY(off)
ΔtRF
f
= 240 Hz, PWM duty cycle = 50%, at 25 °C for medium speed slew
rate (SR[1:0] = 00)
15
–
65
μs
PWM
(28)
(29)
(30)
(31)
tFAULT
tDETECT
tCNSVAL
tWDTO
Fault detection blanking time
Output shutdown delay time
CSNS valid time
1.0
–
5.0
7.0
70
20
30
μs
μs
μs
ms
–
100
400
Watchdog timeout
217
310
ON openload fault cyclic detection time with LED
8.3
PWM
period
tOLLED
• Internal clock (PWM_en bit = 1 & CLOCK_Set = 1)
• External clock (PWM_en bit = 1 & CLOCK_Set = 0)
6.3
–
12
–
ms
Notes
25. Rise and Fall Slew Rates measured across a 5.0 Ω resistive load at high-side output = 30% to 70% (see Figure 4, page 16).
26. Turn-ON delay time measured from rising edge of any signal (IN[0:3] and CSB) that would turn the output ON to V
= V
/ 2 with
PWR
HS[0:3]
R = 5.0 Ω resistive load.
L
27. Turn-OFF delay time measured from falling edge of any signal (IN[0:3] and CSB) that would turn the output OFF to V
= V
/ 2 with
HS[0:3]
PWR
R = 5.0 Ω resistive load.
L
28. Time necessary to report the fault to the FSB pin.
29. Time necessary to switch-off the output in case of OT or OC or SC or UV fault detection (from negative edge of the FSB pin to HS voltage = 50%
of VPWR
30. Time necessary for CSNS to be within ±5.0% of the targeted value (from HS voltage = 50% of VPWR to ±5.0% of the targeted CSNS value).
31. For FSI open, the Watchdog timeout delay measured from the rising edge of RST, to commanded HS[0:3] output state depend on the
corresponding input command.
09XS3400
NXP Semiconductors
12
ELECTRICAL CHARACTERISTICS
Table 5. Dynamic electrical characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, -40 °C ≤ TA ≤ 125 °C, GND = 0 V, unless otherwise
noted. Typical values are measured at TA = 25 °C and at nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
Power output timing HS0 TO HS3 (continued)
tOC1_00
tOC2_00
tOC3_00
tOC4_00
tOC5_00
tOC6_00
tOC7_00
HS[0:3] output overcurrent time step for OC[1:0] = 00 (slow by default)
4.40
1.62
2.10
2.88
4.58
10.16
73.2
6.30
2.32
3.00
4.12
6.56
8.02
3.00
3.90
5.36
8.54
14.52
104.6
18.88
134.0
tOC1_01
tOC2_01
tOC3_01
tOC4_01
tOC5_01
tOC6_01
tOC7_01
OC[1:0] = 01 (fast)
1.10
0.40
0.52
0.72
1.14
2.54
18.2
1.57
0.58
0.75
1.03
1.64
3.63
26.1
2.00
0.75
0.98
1.34
2.13
4.72
34.0
ms
tOC1_10
tOC2_10
tOC3_10
tOC4_10
tOC5_10
tOC6_10
tOC7_10
OC[1:0] = 10 (medium)
2.20
0.81
1.05
1.44
2.29
5.08
36.6
3.15
1.16
1.50
2.06
3.28
7.26
52.3
4.01
1.50
1.95
2.68
4.27
9.44
68.0
tOC1_11
tOC2_11
tOC3_11
tOC4_11
tOC5_11
tOC6_11
tOC7_11
OC[1:0] = 11 (very slow)
8.8
3.2
4.2
5.7
9.1
12.6
4.6
6.0
16.4
21.4
7.8
10.7
17.0
37.7
272.0
8.2
13.1
29.0
209.2
20.3
146.4
tBC1_00
tBC2_00
tBC3_00
tBC4_00
tBC5_00
tBC6_00
HS[0:3] Bulb Cooling Time Step for CB[1:0] = 00 or 11 (medium)
242
126
140
158
181
211
347
181
200
226
259
302
452
236
260
294
337
393
tBC1_01
tBC2_01
tBC3_01
tBC4_01
tBC5_01
tBC6_01
CB[1:0] = 01 (fast)
CB[1:0] = 10 (slow)
121
63
70
79
90
173
90
100
113
129
151
226
118
130
147
169
197
ms
105
tBC1_10
tBC2_10
tBC3_10
tBC4_10
tBC5_10
tBC6_10
484
252
280
316
362
422
694
362
400
452
518
604
1904
472
520
588
674
786
09XS3400
13
NXP Semiconductors
ELECTRICAL CHARACTERISTICS
Table 5. Dynamic electrical characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, -40 °C ≤ TA ≤ 125 °C, GND = 0 V, unless otherwise
noted. Typical values are measured at TA = 25 °C and at nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
PWM module timing
f
Input PWM clock range on IN0
7.68
1.0
–
2.0
–
30.72
4.0
400
781
+10
156
26
kHz
kHz
kHz
Hz
%
IN0
(32)
(32)
f
Input PWM clock low frequency detection range on IN0
Input PWM clock high frequency detection range on IN0
Output PWM frequency range using external clock on IN0
Output PWM frequency accuracy using calibrated oscillator
Default output PWM frequency using internal oscillator
CSB calibration low minimum time detection range
CSB calibration low maximum time detection range
Output PWM duty cycle range for fPWM = 1.0 kHz for high speed slew rate
Output PWM duty cycle range for fPWM = 400 Hz
IN0(LOW)
f
100
31.25
-10
84
IN0(HIGH)
f
–
PWM
FPWM(CAL)
A
–
f
120
20
200
Hz
μs
PWM(0)
tCSB(MIN)
14
tCSB(MAX)
RPWM_1k
140
10
260
94
μs
(33)
(33)
(33)
%
RPWM_400
RPWM_200
Input timing
6.0
98
%
Output PWM duty cycle range for fPWM = 200 Hz
5.0
98
%
t
Direct input toggle timeout
175
105
250
150
325
195
ms
ms
IN
Autoretry timing
t
Autoretry period
AUTO
Temperature on the GND flag
(34)
(34)
T
Thermal prewarning detection
110
1.15
-3.5
125
1.20
-3.7
140
1.25
-3.9
°C
V
OTWAR
TFEED
Analog temperature feedback at TA = 25 °C with RCSNS = 2.5 kΩ
Analog temperature feedback derating with RCSNS = 2.5 kΩ
DTFEED
mV/°C
Notes
32. Clock Fail detector available for PWM_en bit is set to logic [1] and CLOCK_sel is set to logic [0].
33. The PWM ratio is measured at VHS = 50% of VPWR and for the default SR value. It is possible to put the device fully-on (PWM duty cycle 100%)
and fully-off (duty cycle 0%). For values outside this range, a calibration is needed between the PWM duty cycle programming and the PWM on
the output with R = 5.0 Ω resistive load.
L
34. Parameters guaranteed by design, not production tested.
09XS3400
NXP Semiconductors
14
ELECTRICAL CHARACTERISTICS
Table 5. Dynamic electrical characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, -40 °C ≤ TA ≤ 125 °C, GND = 0 V, unless otherwise
noted. Typical values are measured at TA = 25 °C and at nominal conditions, unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
SPI interface characteristics (35)
(41)
f
Maximum frequency of SPI operation
–
10
–
8.0
–
MHz
μs
ns
μs
ns
ns
ns
ns
ns
ns
SPI
(36)
(37)
(37)
(37)
(37)
(37)
(37)
(38)
(38)
t
Required low state duration for RSTB
–
–
–
–
–
–
–
–
–
WRST
tCS
Rising edge of CSB to falling edge of CSB (required setup time)
Rising edge of RSTB to falling edge of CSB (required setup time)
Falling edge of CSB to rising edge of SCLK (required setup time)
Required high state duration of SCLK (required setup time)
Required low state duration of SCLK (required setup time)
Falling edge of SCLK to rising edge of CSB (required setup time)
SI to falling edge of SCLK (required setup time)
Falling edge of SCLK to SI (required setup time)
SO rise time
500
5.0
500
50
tENBL
–
t
–
LEAD
t
–
WSCLKh
t
–
50
WSCLKl
t
–
60
LAG
t
–
37
SI(SU)
t
–
49
SI(HOLD)
t
t
–
–
–
–
13
13
ns
ns
RSO
FSO
• C = 80 pF
L
SO fall time
• C = 80 pF
L
(38)
(38)
(39)
(40)
t
SI, CSB, SCLK, incoming signal rise time
–
–
–
–
–
–
–
–
13
13
60
60
ns
ns
ns
ns
RSI
FSI
t
SI, CSB, SCLK, incoming signal fall time
t
Time from falling edge of CSB to SO low-impedance
Time from rising edge of CSB to SO high-impedance
SO(EN)
t
SO(DIS)
Notes
35. Parameters guaranteed by design, not production tested.
36. RSTB low duration measured with outputs enabled and going to OFF or disabled condition.
37. Maximum setup time required for the 09XS3400 is the minimum guaranteed time needed from the microcontroller.
38. Rise and Fall time of incoming SI, CSB, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.
39. Time required for output status data to be available for use at SO. 1.0 kΩ on pull-up on CSB.
40. Time required for output status data to be terminated at SO. 1.0 kΩ on pull-up on CSB.
41. The SPI frequency is limited if tRSI and tFSI are higher than 13 ns due to resistor in series with SPI signal.
09XS3400
15
NXP Semiconductors
ELECTRICAL CHARACTERISTICS
4.4
Timing diagrams
IN[0:3]
High logic level
Low logic level
Time
Time
or
CSB
High logic level
Low logic level
VHS[0:3]
V
PWR
R
PWM
50%V
PWR
Time
tDLY(off)
tDLY(on)
VHS[0:3]
70% V
30% V
PWR
SRF
SRR
PWR
Time
Figure 4. Output slew rate and time delays
I
OCH1
I
I
OCH2
OC1
OC2
Load
Current
I
I
I
OC3
OC4
I
I
I
OCLO4
OCLO3
OCLO2
I
OCLO1
Time
t
t
t
t
OC7
OC3
OC1
t
OC5
t
t
OC6
OC4
OC2
Figure 5. Overcurrent shutdown protection
09XS3400
NXP Semiconductors
16
ELECTRICAL CHARACTERISTICS
I
OCH1
OCH2
I
I
OC1
OC2
I
I
I
I
I
OC3
OC4
OCLO4
OCLO3
I
OCLO2
I
OCLO1
Previous OFF duration
(tOFF
)
t
t
t
B
C5
B
C3
B
C1
t
B
C6
t
B
C4
t
B
C2
Figure 6. Bulb cooling management
VIH
RSTB
10% VDD
D
VIL
t
t
ENBL
CSB
t
WRSTB
VIH
90% V
DD
CSB
10%V
DD
VIL
t
RSI
T
t
WSCLKH
t
LEAD
t
LAG
VIH
90% VDD
SCLK
10% VDD
VIL
t
SI(SU)
t
WSCLKl
t
FSI
t
SI(HOLD)
VIH
90%V
DD
Don’t Care
Don’t Care
Don’t Care
Valid
Valid
SI
10%V
DD
VIH
Figure 7. Input timing switching characteristics
09XS3400
17
NXP Semiconductors
ELECTRICAL CHARACTERISTICS
t
t
FSI
RSI
VOH
90% V
DD
50%
SCLK
10% VDD
VOL
tSO(EN)
10%VDD
VOH
90% V
DD
SO
VOL
Low to High
tRSO
tVALID
tFSO
SO
VOH
90% V
DD
High to Low
10% VDD
VOL
tSO(DIS)
Figure 8. SCLK waveform and valid SO data delay time
09XS3400
NXP Semiconductors
18
FUNCTIONAL DESCRIPTION
5
Functional description
5.1
Introduction
The 09XS3400 is one in a family of devices designed for low-voltage automotive lighting applications. Its four low RDS(on) MOSFETs (quad
9.0 mΩ) can control four separate 55 W bulbs and/or Xenon modules.
Programming, control and diagnostics are accomplished using a 16-bit SPI interface. Its output with selectable slew-rate improves
electromagnetic compatibility (EMC) behavior. Additionally, each output has its own parallel input or SPI control for pulse-width modulation
(PWM) control if desired. The 09XS3400 allows the user to program via the SPI the fault current trip levels and duration of acceptable
lamp inrush. The device has fail-safe mode to provide fail-safe functionality of the outputs in case of MCU damage.
5.2
Functional pin description
5.2.1 Output current monitoring (CSNS)
The current sense pin provides a current proportional to the designated HS0:HS3 output or a voltage proportional to the temperature on
the GND flag. This current feeds into a ground-referenced resistor (2.5 kΩ typical) and its voltage is monitored by an MCU's A/D. The
output type is selected via the SPI. This pin can be tri-stated through the SPI.
5.2.2 Direct inputs (IN0, IN1, IN2, IN3)
Each IN input wakes the device. The IN0:IN3 high-side input pins are also used to directly control HS0:HS3 high-side output pins. In case
of the outputs are controlled by PWM module, the external PWM clock is applied to IN0 pin. These pins are to be driven with CMOS levels,
and they have a passive internal pull-down, RDWN
.
5.2.3 Fault status (FSB)
This pin is an open drain configured output requiring an external pull-up resistor to VDD for fault reporting. If a device fault condition is
detected, this pin is active LOW. Detailed diagnostic and fault in formation is reported via the SPI SO pin.
5.2.4 Wake
The WAKE input wakes the device. An external resistor (10 kΩ typical) and in internal voltage clamp protect this pin from high damaging
voltages. This input has a passive internal pull-down, RDWN
.
5.2.5 Reset (RSTB)
The reset input wakes the device. This is used to initialize the device configuration and fault registers, as well as place the device in a low
current sleep mode. The pin also starts the watchdog timer when transitioning from logic [0] to logic [1]. This pin has a passive internal
pull-down, RDWN
.
5.2.6 Chip select (CSB)
The CSB pin enables communication with the master microcontroller (MCU). When this pin is in a logic [0] state, the device is capable of
transferring information to, and receiving information from, the MCU. The 09XS3400 latches in data from the Input Shift registers to the
addressed registers on the rising edge of CSB. The device transfers status information to the Shift register on the falling edge of CSB.
The SO output driver is enabled when CSB is logic [0]. CSB should transition from a logic [1] to a logic [0] state only when SCLK is a
logic [0]. CSB has an active internal pull-up to VDD, IUP
.
09XS3400
19
NXP Semiconductors
FUNCTIONAL DESCRIPTION
5.2.7 Serial clock (SCLK)
The SCLK pin clocks the internal shift registers of the 09XS3400 device. The serial input (SI) pin accepts data into the input shift register
on the falling edge of the SCLK signal while the serial output (SO) pin shifts data information out of the SO line driver on the rising edge
of the SCLK signal. The SCLK pin should be in a logic low state whenever CSB makes any transition. For this reason, it is recommended
the SCLK pin be in a logic [0] whenever the device is not accessed (CSB logic [1] state). When CSB is logic [1], signals at the SCLK and
SI pins are ignored and SO is tri-stated (high-impedance) (see Figure 10). SCLK input has an active internal pull-down, IDWN
.
5.2.8 Serial Input (SI)
This is a serial interface (SI) command data input pin. Each SI bit is read on the falling edge of SCLK. A 16-bit stream of serial data is
required on the SI pin, starting with D15 (MSB) to D0 (LSB). The internal registers of the 09XS3400 are configured and controlled using
a 5-bit addressing scheme described in Table 10. Register addressing and configuration are described in Table 11. SI input has an active
internal pull-down, IDWN
.
5.2.9 Digital drain voltage (VDD)
This pin is an external voltage input pin used to supply power to the SPI circuit. When VDD is lost (VDD Failure), the device goes to fail-
safe mode.
5.2.10 Ground (GND)
These pins are the ground for the device.
5.2.11 Positive power supply (VPWR)
This pin connects to the positive power supply and is the source of operational power for the device. The VPWR contact is the backside
surface mount tab of the package.
5.2.12 Serial output (SO)
The SO data pin is a tri-stateable output from the shift register. The SO pin remains in a high-impedance state until the CSB pin is put into
a logic [0] state. The SO data is capable of reporting the status of the output, the device configuration, the state of the key inputs, etc. The
SO pin changes state on the rising edge of SCLK and reads out on the falling edge of SCLK. SO reporting descriptions are provided in
Table 23.
5.2.13 High-side outputs (HS3, HS1, HS0, HS2)
These are protected 9.0 mΩ high-side power outputs to the loads.
5.2.14 Fail-safe input (FSI)
This pin incorporates an active internal pull-up current source from internal supply (VREG). This enables the watchdog timeout feature.
When the FSI pin is opened, the watchdog circuit is enabled. After a watchdog timeout occurs, the output states depends on IN[0:3]. In
case of a VDD failure and when VDD failure detection is activated, the output states depend on IN{0:3].
09XS3400
NXP Semiconductors
20
FUNCTIONAL DESCRIPTION
5.3
Functional internal block description
09XS3400 - functional block diagram
Power supply
MCU
interface
MCU interface and output control
SPI interface
Self-protected
high-side
switches
HS0-HS3
Parallel control inputs
PWM controller
Supply
MCU Interface & Output Control
Self-Protected High-side Switches
Figure 9. Functional block diagram
5.3.1 Power supply
The 09XS3400 is designed to operate from 4.0 V to 28 V on the VPWR pin. Device characterization is provided from 6.0 V to 20 V. The
VPWR pin supplies power to internal regulator, analog, and logic circuit blocks. The VDD supply is used for serial peripheral interface (SPI)
communication to configure and diagnose the device. This IC architecture provides a low quiescent current sleep mode. Applying VPWR
and VDD to the device places the device in the Normal mode. The device transits to fail-safe mode in case of failures on the SPI or/and
on VDD voltage.
5.3.2 High-side switches: HS0–HS3
These pins are the high-side outputs controlling automotive lamps, such as 65 W/55 W bulbs and Xenon-HID modules. Those N-channel
MOSFETs with 9.0 mΩ RDS(on) are self-protected and present extended diagnostics in order to detect bulb outage and short-circuit fault
condition. The HS output is actively clamped during turn off of inductive loads and inductive battery line. When driving DC motor or
solenoid loads, an external recirculation device must be used to maintain the device in its safe operating area.
5.3.3 MCU interface and output control
In Normal mode, each bulb is controlled directly from the MCU through SPI. A pulse width modulation control module allows improvement
of lamp lifetime with bulb power regulation (PWM frequency range from 100 Hz to 400 Hz) and addressing the dimming application (day
running light). An analog feedback output provides a current proportional to the load current or the temperature of the board. The SPI is
used to configure and to read the diagnostic status (faults) of high-side outputs. The reported fault conditions are: openload, short-circuit
to battery, short-circuit to ground (overcurrent and severe short-circuit), thermal shutdown, and under/overvoltage. With accurate and
configurable overcurrent detection circuitry and wire harness optimization, the vehicle is lighter.
In Fail-safe mode, each lamp is controlled with dedicated parallel input pins. The device reverts to its default mode.
09XS3400
21
NXP Semiconductors
FUNCTIONAL DEVICE OPERATION
6
Functional device operation
6.1
SPI protocol description
The SPI interface has a full duplex, three-wire synchronous data transfer with four I/O lines associated with it: Serial Input (SI), Serial
Output (SO), Serial Clock (SCLK), and Chip Select (CSB).
The SI/SO pins of the 09XS3400 follow a first-in first-out (D15 to D0) protocol, with both input and output words transferring the most
significant bit (MSB) first. All inputs are compatible with 5.0 V or 3.3 V CMOS logic levels.
CSB
SCLK
SI
D15
D14
D13
D12 D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
SO
OD15 OD14 OD13 OD12 OD11 OD10 OD9 OD8 OD7 OD6 OD5 OD4 OD3 OD2 OD1 OD0
Notes 1. RSTB is a logic [1] state during the above operation.
2. D15 D0 relate to the most recent ordered entry of data into the device.
:
3. OD15:OD0 relate to the first 16 bits of ordered fault and status data out of the device.
Figure 10. Single 16-Bit word SPI Communication
6.2
Operational modes
The 09XS3400 has four operating modes: Sleep, Normal, Fail-safe, and Fault. Table 6 and Figure 12 summarize details contained in
succeeding paragraphs. The Figure 11 describes an internal signal called IN_ON[x] which is a function of the respective IN[x] input.
tIN
N[x]
N_ON[x]
Figure 11. IN_ON[x] internal signal
The 09XS3400 transits to operating modes according to the following signals:
• wake-up = RSTB or WAKE or IN_ON[0] or IN_ON[1] or IN_ON[2] or IN_ON[3],
• fail = (VDD Failure and VDD_FAIL_en) or (Watchdog timeout and FSI input not shorted to ground),
• fault = OC[0:3] or OT[0:3] or SC[0:3] or UV or (OV and OV_dis).
09XS3400
NXP Semiconductors
22
FUNCTIONAL DEVICE OPERATION
Table 6. 09XS3400 operating modes
Mode Wake-up Fail Fault
Comments
Sleep
Normal
Fail-safe
0
1
1
x
0
1
x
0
0
Device is in Sleep mode. All outputs are OFF.
Device is currently in Normal mode. Watchdog is active if enabled.
Device is currently in fail-safe mode due to Watchdog timeout or VDD Failure conditions.
Device is currently in fault mode. The faulted output(s) is (are) OFF. The safe autoretry circuitry is active to turn-on again
the output(s).
Fault
1
X
1
x = Don’t care.
(fail = 0) and (wake-up = 1) and (fault = 0)
Sleep
(wake-up = 0)
(wake-up = 1) and
(fail = 1)
and (fault = 0)
(wake-up=0)
(wake-up = 1)
and (fault = 1)
(wake-up = 0)
(fail = 1) and
(wake-up
and (fault = 1)
(fail = 0) and
(wake-up = 1)
and (fault = 1)
=
1)
Fault
Normal
(fail = 0) and
(wake-up = 1)
and (fault = 0)
(fail = 1) and
(wake-up = 1)
and (fault = 0)
Fail-safe
(fail = 0) and (wake-up = 1) and (fault = 0)
(fail = 1) and (wake-up = 1) and (fault = 0)
Figure 12. Operating modes
6.2.1 Sleep mode
The 09XS3400 is in Sleep mode when:
• VPWR and VDD are within the normal voltage range,
• wake-up = 0,
• fail = X,
• fault = X.
This is the Default mode of the device after first applying battery voltage (VPWR) prior to any I/O transitions. This is also the state of the
device when the WAKE and RSTB and IN_ON[0:3] are logic [0]. In the Sleep mode, the output and all unused internal circuitry, such as
the internal regulator, are off to minimize draw current. In addition, all SPI-configurable features of the device are set to logic [0].
6.2.2 Normal mode
The 09XS3400 is in Normal mode when:
• VPWR and VDD are within the normal voltage range,
• wake-up = 1,
• fail = 0,
• fault = 0.
09XS3400
23
NXP Semiconductors
FUNCTIONAL DEVICE OPERATION
In this mode, the NM bit is set to fault_control logic [1] and the outputs HS[0:3] are under control, as defined by the hson signal:
hson[x] = ( ( (IN[x] and DIR_dis[x]) or On bit[x] ) and PWM_en ) or (On bit [x] and Duty_cycle[x] and PWM_en).
In this mode and also in fail-safe, the fault condition reset depends on fault_control signal, as defined by the following:
fault_control[x] = ( (IN_ON[x] and DIR_dis[x]) and PWM_en ) or (On bit [x]).
6.2.2.1
Programmable PWM module
The outputs HS[0:3] are controlled by the programmable PWM module if PWM_en and On bit [x] are set to logic [1]. The clock frequency
from IN0 input pin or from internal clock is the factor 27 (128) of the output PWM frequency (CLOCK_sel bit). The outputs HS[0:3] can be
controlled in the range of 5% to 98% with a resolution of 7 bits of duty cycle (Table 7). The states of other IN pins are ignored.
Table 7. Output PWM Resolution
On bit
Duty cycle
X
Output state
OFF
0
1
0000000
PWM (1/128 duty cycle)
1
1
1
1
0000001
0000010
n
PWM (2/128 duty cycle)
PWM (3/128 duty cycle)
PWM ((n+1)/128 duty cycle)
fully ON
1111111
The timing includes seven programmable PWM switching delays (number of PWM clock rising edges) to stagger the turn on/off times of
the outputs (Table 8).
Table 8. Output PWM switching delay
Delay bits
Output delay
000
001
010
011
100
101
110
111
no delay
16 PWM clock periods
32 PWM clock periods
48 PWM clock periods
64 PWM clock periods
80 PWM clock periods
96 PWM clock periods
112 PWM clock periods
The clock frequency from IN0 is permanently monitored to report a clock failure in case the frequency is outside a specified frequency
range (from fIN0(LOW) to fIN0(HIGH)). During a clock failure, no PWM feature is provided, the On bit defines the outputs’ states and the
CLOCK_fail bit reports [1].
6.2.2.2
Calibratable internal clock
The internal clock can vary as much as 30 percent relative to the to typical fPWM(0) output switching period. Using the existing SPI inputs
and the precision timing reference already available to the MCU, the 09XS3400 allows clock calibration to 10 percent of accuracy.
Calibrating the internal clock is initiated by defined word to CALR register. The calibration pulse is provided by the MCU. The pulse is sent
on the CSB pin after the SPI word is launched. The MCU keeps the CSB pin low for 1/128th of the desired PWM frequency.
09XS3400
NXP Semiconductors
24
FUNCTIONAL DEVICE OPERATION
CSB
SI
SI command
ignored
CALR
Internal
clock duration
Figure 13. Internal clock calibration diagram
If the negative CSB pulse is outside a predefined time range (from tCSB(MIN) to tCSB(MAX)), the calibration event is ignored and the internal
clock is unaltered or reset to its default value (fPWM(0)), if this was not calibrated before. The calibratable clock is used, instead of the clock
from IN0 input, when CLOCK_sel is set to [1].
6.2.3 Fail-safe mode
The 09XS3400 is in Fail-safe mode when:
• VPWR is within the normal voltage range,
• wake-up = 1,
• fail = 1,
• fault = 0.
6.2.4 Watchdog
If the FSI input is not grounded, the watchdog timeout detection is active when either the WAKE or IN_ON[0:3] or RSTB input pin
transitions from logic [0] to logic [1]. The WAKE input is capable of being pulled up to VPWR with a series resistance limiting the internal
clamp current according to the specification.
The Watchdog timeout interval is a multiple of the internal oscillator. As long as the WD bit (D15) of an incoming SPI message is toggled
within the minimum watchdog timeout period (WDTO), the device operates normally.
6.2.4.1
Fail-safe conditions
If an internal watchdog timeout occurs before the WD bit for FSI open (Table 9) or in case of VDD failure condition (VDD< VDD(FAIL))) for
VDD_FAIL_en bit is set to logic [1], the device reverts to a fail-safe mode until the WD bit is written to logic [1] (see fail-safe to normal
mode transition paragraph) and VDD is within the normal voltage range.
Table 9. SPI watchdog activation
Typical RFSI (Ω)
Watchdog
0 (shorted to ground)
(open)
Disabled
Enabled
During the Fail-safe mode, the outputs depend on the corresponding input. The SPI register contents are reset to their default values
(except POR bit) and fault protections are fully operational. The NM bit is set to (0] when the device is in Fail-safe mode.
09XS3400
25
NXP Semiconductors
FUNCTIONAL DEVICE OPERATION
6.2.5 Normal and fail-safe mode transitions
6.2.5.1
Transition fail-safe to normal mode
To leave the Fail-safe mode, VDD must be within its valid operating voltage range and the microcontroller has to send an SPI command
with WDIN bit set to logic [1]; the other bits are not considered. The previously latched faults are reset by the transition into Normal mode
(autoretry included). Moreover, the device can be brought out of the Fail-safe mode due to a watchdog timeout issue by forcing the FSI
pin to logic [0].
6.2.5.2
Transition normal to fail-safe mode
To enter the Fail-safe mode from normal mode, a fail-safe condition must occur (fail = 1). The previous latched faults are reset by the
transition into Fail-safe mode (autoretry included).
6.2.6 Fault mode
The 09XS3400 is in Fault mode when:
• VPWR and VDD are within the normal voltage range,
• wake-up = 1,
• fail = X,
• fault = 1.
This device indicates the faults below as they occur by driving the FSB pin to logic [0], provided the RSTB input is pulled up:
• Overtemperature fault,
• Overcurrent fault,
• Severe short-circuit fault,
• Output(s) shorted to VPWR fault in OFF state,
• Openload fault in OFF state,
• Overvoltage fault (enabled by default),
• Undervoltage fault.
The FS pin automatically returns to logic [1] when the fault condition is removed, except for overcurrent, severe short-circuit,
overtemperature, and undervoltage which resets by a new turn-on command (each fault_control signal to be toggled). Fault information
is retained in the SPI fault register and is available (and reset) via the SO pin during the first valid SPI communication. The openload fault
in ON state is only reported through the SPI register without effect on the corresponding output state (HS[x]) and the FSB pin.
6.2.7 Typical start-up sequence
The 09XS3400 enters in Normal mode after start-up if following sequence is provided:
• VPWR and VDD power supplies must be above their undervoltage thresholds,
• generate wake-up event (wake-up = 1) from 0 to 1 on RSTB. The device switches to Normal mode with SPI register content is reset
(as defined in Table 11 and Table 23). All features of the 09XS3400 are available after 50 μs typical, and all SPI registers are set to
default values (set to logic [0]).
• toggle WD bit from 0 to 1.
And, if the PWM module is used (PWM_en bit is set to logic [1]) with an external reference clock:
• apply PWM clock on IN0 input pin between 26 µs and 140 µs.
If the correct start-up sequence is not provided, the PWM function is not guaranteed.
09XS3400
NXP Semiconductors
26
FUNCTIONAL DEVICE OPERATION
6.3
Protection and diagnostic features
6.3.1 Protections
6.3.1.1
Overtemperature fault
The 09XS3400 incorporates overtemperature detection and shutdown circuitry for each output channel. Two cases need to be considered
when the output temperature is higher than TSD
:
• If the output command is ON: the corresponding output is latched OFF. FSB also latches to logic [0]. To delatch the fault and be able
to turn ON again the outputs, the failure condition must disappear and the autoretry circuitry must be active or the corresponding
output must be commanded OFF and then ON (toggling fault_control signal of corresponding output) or VSUPPLY(POR) condition if
VDD = 0.
• If the output command is OFF: FSB goes to logic [0] until the corresponding output temperature is below TSD
.
For both cases, the fault register OT[0:3] bit into the status register is set to [1]. The fault bits are cleared in the status register after a SPI
read command.
6.3.1.2
Overcurrent fault
The 09XS3400 incorporates output shutdown to protect each output structure against resistive short-circuit condition. This protection is
composed of four predefined current levels (time dependent) to fit Xenon-HID current profiles by default or 55 W bulb profiles, selectable
by Xenon bit (as illustrated Figure 17). Initial turn-on of a cold lamp filament usually creates a large inrush current, as shown in Figure 5.
This overcurrent protection is programmable: OC[1:0] bits select overcurrent slope speed and OCHI1 current step can be removed in case
of OCHI bit is set to [1].
Over-current thresholds
fault_control
hson
Figure 14. Overcurrent detection profile
In steady state, the wire harness is protected by OCLO2 current level by default. Three other DC overcurrent levels are available: OCLO1
or OCLO3 or OCLO4 based on the state of the OCLO[1,0] bits.
If the load current level ever reaches the overcurrent detection level, the corresponding output latches the output OFF and FSB is also
latched to logic [0]. To delatch the fault and be able to turn ON again the corresponding output, the failure condition must disappear and
the autoretry circuitry must be active or the corresponding output must be commanded OFF and then ON (toggling fault_control signal of
corresponding output) or the VSUPPLY(POR) condition if VDD = 0.
The SPI fault bits (OC[0:3] bits) are cleared after a read operation.
In Normal mode using internal PWM module, the 09XS3400 also incorporates a cooling bulb filament management if OC_mode and
Xenon are set to logic [1]. In this case, the 1st step of multi-step overcurrent protection depends on the previous OFF duration, as illustrated
in Figure 6. The following figure illustrates how the current level depends on the duration of previous OFF state (toff). The slope of cooling
bulb emulator is configurable with OCOFFCB[1:0] bits.
09XS3400
27
NXP Semiconductors
FUNCTIONAL DEVICE OPERATION
Depending on toff
Over-current thresholds
Cooling
toff
fault_control
hson signal
PWM
hson
Figure 15. Bulb cooling principle
6.3.1.3
Severe short-circuit fault
The 09XS3400 immediately turns-off an output channel if it detects a severe short circuit at turn-on. If the short-circuit impedance is below
RSHORT, the device latches the output OFF, FSB goes to logic [0] and the fault register SC[0:3] bit is set to [1]. To delatch the fault and be
able to turn ON again the outputs, the failure condition must disappear and the corresponding output must be commanded OFF and then
ON (toggling fault_control signal of corresponding output) or VSUPPLY(POR) condition if VDD = 0. The SPI fault bits (SC[0:3] bits) are
cleared after a read operation.
6.3.1.4
Overvoltage fault (enabled by default)
By default, the overvoltage protection is enabled. The 09XS3400 shuts down all outputs and FSB goes to logic [0] during an overvoltage
fault condition on the VPWR pin (VPWR > VPWR(OV)). The outputs remain in the OFF state until the overvoltage condition is removed
(VPWR < VPWR(OV) -VPWR(OVHYS)). When experiencing this fault, the OVF fault bit is set to logic [1] and cleared after a valid SPI read.
The overvoltage protection can be disabled through SPI (OV_dis bit is disabled when set to logic [1]). The fault register reflects any
overvoltage condition (VPWR > VPWR(OV)). This overvoltage diagnosis, as a warning, is removed after a read operation, if the fault condition
disappears. The HS[0:3] outputs cannot be commanded on during an over voltage condition.
6.3.1.5
Undervoltage fault
The output(s) latch off at some battery voltage below VPWR(UV). As long as the VDD level stays within the normal specified range, the
internal logic states within the device will remain (configuration and reporting). If the battery voltage drops below the undervoltage
threshold (VPWR < VPWR(UV)), the outputs turn off, FSB goes to logic [0], and the fault register UV bit is set to [1].
The FSB pin follows the battery voltage. This pin goes to a logic [0] when VPWR < VPWR(UV) and returns to a logic [1] when
VPWR > VPWR(UV)_UP
.
In extended mode, the output is protected by overtemperature shutdown circuitry. All previous latched faults, which occurred when VPWR
was within the normal voltage range, are guaranteed if VDD is within the operational voltage range or until VSUPPLY(POR) if VDD = 0. Any
new OT fault is detected (VDD failure included) and reported through SPI above VPWR(UV). The output state is not changed as long as
the VPWR voltage does not drop any lower than 3.5 V typical.
Below 3.5 V (typ) of VPWR, the output shutdown delay time is not guaranteed. The N-channel MOSFSET could drain current during the
next 10 μs to 30 μs.
All latched faults (overtemperature, overcurrent, severe short-circuit, over and undervoltage) are reset if:
• VDD < VDD(FAIL) with VPWR in nominal voltage range,
• VDD and VPWR supplies are below VSUPPLY(POR) voltage value.
09XS3400
NXP Semiconductors
28
FUNCTIONAL DEVICE OPERATION
(fault_control = 0)
(OpenloadOFF = 1
or ShortVpwr = 1
or OV = 1)
(OpenloadOFF = 1
or ShortVpwr = 1
or OV = 1)
(fault_control = 1 and OV = 0)
(fault_control = 0 or OV = 1)
(fault_control = 0)
(OpenloadON = 1)
OFF
if hson = 0
(SC = 1)
ON
if hson=1
Latched
OFF
(count = 16)
(Retry = 1)
(SC = 1)
(OpenloadON = 1)
(after Retry Period and OV = 0)
(OV = 1)
Autoretry
OFF
Autoretry
ON
if hson = 1
(Retry = 1)
= > count = count+1
(OpenloadOFF = 1
or ShortVpwr = 1
or OV = 1)
(fault_control = 0)
Figure 16. Autoretry state machine
6.3.2 Autoretry
The autoretry circuitry is used to reactivate the output(s) automatically in case of overcurrent or overtemperature or undervoltage failure
conditions, to provide a high availability of the load.
Autoretry feature is available in Fault mode. It is activated when the internal retry signal is set to logic [1]:
retry[x] = OC[x] or OT[x] or UV.
The feature attempts to reactivate the output(s) after one autoretry period (tAUTO), limited to 16 retries per channel. The counter of retry
occurrences is reset in case of Fail-safe to Normal or Normal to Fail-safe mode transitions. At each autoretry, the overcurrent detection
is set to default values to sustain the inrush current. The Figure 16 describes the autoretry state machine.
6.3.3 Diagnostic
6.3.3.1
Output shorted to VPWR fault
The 09XS3400 incorporates output shorted to VPWR detection circuitry in OFF state. Output shorted to VPWR fault is detected if output
voltage is higher than VOSD(THRES) and reported as a fault condition when the output is disabled (OFF). The output shorted to VPWR fault
is latched into the status register after the internal gate voltage is pulled low enough to turn OFF the output. The OS[0:3] and OL_OFF[0:3]
fault bits are set in the status register and the FSB pin reports the fault in real time. If the output shorted to VPWR fault is removed, the
status register clears after reading the register. The output shorted to VPWR protection can be disabled through the SPI (OS_DIS[0:3] bit).
6.3.3.2
Openload faults
The 09XS3400 incorporates three dedicated openload detection circuitries on the output to detect in OFF and in ON state.
09XS3400
29
NXP Semiconductors
FUNCTIONAL DEVICE OPERATION
6.3.3.3
Openload detection in OFF state
The OFF output openload fault is detected when the output voltage is higher than VOLD(THRES) pulled up with internal current source
(IOLD(off)) and reported as a fault condition when the output is disabled (OFF). The OFF Output openload fault is latched into the status
register when the internal gate voltage is pulled low enough to turn OFF the output. The OL_OFF[0:3] fault bit is set in the status register.
If the openload fault is removed (FSB output pin goes to high), the status register clears after reading the register. The OFF output
openload protection can be disabled through the SPI (OLOFF_DIS[0:3] bit).
6.3.3.4
Openload detection in ON state
The ON output openload current thresholds can be chosen by the SPI to monitor standard bulbs or LEDs (OLLED[0:3] bit set to logic [1]).
In the case where load current drops below the defined current threshold, the OLON bit is set to logic [1], the output stays ON and FSB
is not disturbed.
6.3.3.5
Openload detection in ON state for LED
Openload for LEDs only (OLLED[0:3] set to logic [1]) is detected periodically each tOLLED (fully-on, D[7:0] = FF). To detect OLLED in fully-
on state, the output must be ON at least tOLLED and PWM module must be enabled (PWM_en = 1 in GCR register). To delatch the
diagnosis, the condition should be removed and an SPI read operation is needed (OL_ON[0:3] bit). The ON output openload protection
can be disabled through SPI (OLON_DIS[0:3] bit).
6.3.4 Analog current recopy and temperature feedback
The CSNS pin is an analog output reporting a current proportional to the designed output current or a voltage proportional to the
temperature of the GND flag (pin #14). The designed signal is SPI programmable (TEMP_en, CSNS_en, CSNS_s[1,0] and CSNS_ratio_s
bits).
In case the current recopy is active, the CSNS output delivers current only during ON time of the output switch. The CSNS control circuitry
creates the signal without overshoot. The maximum current is.0 mA typical. The typical value of external CSNS resistor connected to the
ground is 2.5 kΩ. The current recopy is not active in Fail-safe mode.
6.3.4.1
Temperature prewarning detection
In Normal mode, the 09XS3400 provides a temperature prewarning reported via SPI if the temperature of the GND flag is higher than
TOTWAR. This diagnosis (OTW bit set to [1]) is latched in the SPI DIAGR0 register. To delatch this diagnostic, a read SPI command is
needed and the temperature must be below TOTWAR
.
6.3.5 Active clamp on VPWR
The device provides an active gate clamp circuit to limit the maximum transient VPWR voltage at VPWR(CLAMP). In case of an overload on
an output, the corresponding output is turned off, which leads to high voltage at VPWR with an inductive VPWR line. When VPWR voltage
exceeds VPWR(CLAMP) threshold, the turn-off on the corresponding output is deactivated and all HS[0:3] outputs are switched ON
automatically to demagnetize the inductive Battery line.
6.3.6 Reverse battery on VPWR
The output survives the application of reverse voltage as low as -18 V. Under these conditions, the ON resistance of the output is two
times higher than typical ohmic values in forward mode. No additional passive components are required except a diode in the VDD
regulator circuitry.
6.3.7 Ground disconnect protection
In the event the 09XS3400 ground is disconnected from load ground, the device protects itself and safely turns OFF the outputs regardless
of the state of the outputs at the time of disconnection (maximum VPWR = 16 V). A 10 kΩ resistor needs to be added between the MCU
and each digital input pin in order to ensure the device turns off during a ground disconnect and to prevent this pin from exceeding
maximum ratings.
09XS3400
NXP Semiconductors
30
FUNCTIONAL DEVICE OPERATION
6.3.8 Loss of supply lines
6.3.8.1
Loss of V
DD
If the external VDD supply is disconnected (or not within specification: VDD < VDD(FAIL)) with VDD_FAIL_en bit is set to logic [1]), all SPI
register content is reset.
The outputs can still be driven by the direct inputs IN[0:3] if VPWR is within its specified voltage range. The 09XS3400 uses the battery
input to power the output MOSFET-related current sense circuitry and any other internal logic providing fail-safe device operation with no
VDD supplied. In this state, the overtemperature, overcurrent, severe short-circuit, short to VPWR, and OFF openload protection circuitry
are fully operational with default values corresponding to all SPI bits are set to logic [0]. SPI fault register remain reset.
During a loss of VDD, no current is conducted from VPWR to VDD
.
6.3.8.2
Loss of V
PWR
If the external VPWR supply is disconnected (or not within specification), the SPI configuration, reporting, and daisy chain features are
maintained provided RST to set to logic [1] and VDD is within nominal operating range. This fault condition can be diagnosed with UV fault
in SPI STATR_s registers. The SPI pull-up and pull-down current sources are not operational. The previous device configuration is
maintained. No current is conducted from VDD to VPWR
.
6.3.8.3
Loss of V
and V
PWR DD
If the external VPWR and VDD supplies are disconnected (or not within specification: (VDD and VPWR) < VSUPPLY(POR)), all SPI register
contents are reset with default values corresponding to all SPI bits are set to logic [0] and all latched faults are also reset.
6.3.9 EMC performances
All following tests are performed on NXP evaluation board in accordance with the typical application schematic. The device is protected
during positive and negative transients on the VPWR line (per ISO 7637-2). The 09XS3400 successfully meets the Class 5 of the CISPR25
emission standard and 200 V/m or BCI 200 mA injection level for immunity tests.
6.4
Logic commands and registers
6.4.1 Serial input communication
SPI communication is accomplished using 16-bit messages. A message is transmitted by the MCU starting with the MSB D15 and ending
with the LSB, D0 (Table 10). Each incoming command message on the SI pin can be interpreted using the following bit assignments: the
MSB, D15, is the watchdog bit (WDIN). In some cases, output selection is done with bits D14:D13. The next three bits, D12:D10, are
used to select the command register. The remaining nine bits, D8:D0, are used to configure and control the outputs and their protection
features.
Multiple messages can be transmitted in succession to accommodate those applications where daisy-chaining is desirable, or to confirm
transmitted data, as long as the messages are all multiples of 16 bits. Any attempt made to latch in a message not 16 bits is ignored. The
09XS3400 has defined registers, which are used to configure the device and to control the state of the outputs. Table 11 summarizes the
SI registers.
09XS3400
31
NXP Semiconductors
FUNCTIONAL DEVICE OPERATION
Table 10. SI message bit assignment
Bit sig
SI Msg bit
Message bit description
Watchdog in: toggled to satisfy watchdog requirements.
MSB
D15
D14:D13
D12:D10
D9
Register address bits used in some cases for output selection (Table 12).
Register address bits.
Not used (set to logic [0]).
LSB
D8:D0
Used to configure the inputs, outputs, and the device protection features and SO status content.
Table 11. Serial input address and configuration bit map
SI data
D6
SI Register
D15 D14 D13 D12 D11 D10 D9
D8
D7
0
D5
0
D4
D3
D2
D1
D0
STATR_s
PWMR_s
WDIN
WDIN
X
X
0
0
0
0
0
1
0
1
0
0
0
0
0
0
PWM6_s
0
SOA4
SOA3
SOA2
SOA1
SOA0
(42)
A
A
0
ON_s
0
PWM5_s
DIR_dis_s
PWM4_s
SR1_s
PWM3_s
SR0_s
PWM2_s
PWM1_s
PWM0_s
1
1
0
0
CONFR0_s WDIN
CONFR1_s WDIN
A
A
A
A
0
0
DELAY2_s DELAY1_s DELAY0_s
Retry_
Retry_dis_
s
OLON_dis OLOFF_di OLLED_en CSNS_rati
0
1
1
0
1
0
0
0
0
OS_dis_s
OC0_s
1
1
0
0
_s
s_s
_s
o_s
unlimited_s
OC_mode
_s
OCR_s
WDIN
A
A
Xenon_s
BC1_s
BC0_s
OC1_s
OCHI_s
OLCO1_s OLCO0_s
VDD_FAIL
_en
CLOCK_se
l
GCR
WDIN
WDIN
0
0
1
1
0
1
1
1
0
0
PWM_en
0
TEMP_en CSNS_en
CSNS1
1
CSNS0
0
X
1
OV_dis
1
CALR
0
0
1
1
0
1
Registerstate
after RST = 0
or V
DD(FAIL)
or
0
0
0
X
X
X
0
0
0
0
0
0
0
0
0
0
V
SUPPLY(POR)
condition
x = Don’t care.
s = Output selection with the bits A A as defined in Table 12.
1
0
Notes
42. The PWMR_s D8 bit must always be a logic low and never placed in a logic high.
6.4.2 Device register addressing
The following section describes the possible register addresses (D[14:10]) and their impact on device operation.
6.4.2.1
Address XX000—Status register (STATR_S)
The STATR register is used to read the device status and the various configuration register contents without disrupting the device
operation or the register contents. The five least significant register bits, F[4:0], are called SOA[4:0]. Bits SOA[4:3] are used to select the
output channel of interest and bit SOA[2:0] are used to request status information for that channel. The status is returned as part of the
first sixteen bits of the SO data. In addition to the device status, this feature provides the ability to read the content of the PWMR_s,
CONFR0_s, CONFR1_s, OCR_s, GCR and CALR registers (Refer to the section 6.4.3 Serial output communication (device status return
data), page 36.
09XS3400
NXP Semiconductors
32
FUNCTIONAL DEVICE OPERATION
6.4.2.2
Address A A 001—Output PWM control register (PWMR_S)
1 0
The PWMR_s register allows the MCU to control the state of corresponding output through the SPI. Each output “s” is independently
selected for configuration based on the state of the D14:D13 bits (Tables 12).
Table 12. Output selection
A1 (D14)
A0 (D13)
HS selection
0
0
1
1
0
1
0
1
HS0 (default)
HS1
HS2
HS3
Bit D7 sets the output’s ON/OFF state. A logic [1] enables the corresponding output switch and a logic [0] turns it OFF (if IN input is also
pulled down). Bits D6:D0 set the output PWM duty-cycle to one of 128 levels provided PWM_en is set to logic [1], as shown Table 7.
6.4.2.3
Address A A 010—Output configuration register (CONFR0_S)
1 0
The CONFR0_s register allows the MCU to configure corresponding output switching through the SPI. Each output “s” is independently
selected for configuration based on the state of the D14:D13 bits (Table 12).
For the selected output, a logic [0] on bit D5 (DIR_DIS_s) will enable the output for direct control by its respective IN[3:0] pin. A logic [1]
on bit D5 will disable the output from direct control (in this case, the output is only controlled by On bit).
D4:D3 bits (SR1_s and SR0_s) are used to select the high or medium or low speed slew rate for the selected output, the default value
[00] corresponds to the medium speed slew rate (Table 13).
Table 13. Slew rate speed selection
SR1_s (D4)
SR0_s (D3)
Slew rate speed
0
0
1
1
0
1
0
1
medium (default)
low
high
Not guaranteed
Incoming message bits D[2:0] specify the desired PWM switching delay. This delay is relative to the PWM clock rising edge as illustrated
in Table 8. The adjustable phase delay is available only when the PWM_en bit is set to logic [1].
6.4.2.4
Address A A 011—Output configuration register (CONFR1_S)
1 0
The CONFR1_s register allows the MCU to configure corresponding output fault management through the SPI. Each output “s” is
independently selected for configuration based on the state of the D14:D13 bits (Table 12).
A logic [1] on bit D6 (RETRY_unlimited_s) disables the autoretry counter for the selected output, the default value [1] corresponds to
enable autoretry feature without time limitation.
A logic [1] on bit D5 (RETRY_dis_s) disables the autoretry for the selected output, the default value [0] enables this feature.
A logic [1] on bit D4 (OS_dis_s) disables the output hard shorted to VPWR protection for the selected output, the default value [0] enables
this feature.
A logic [1] on bit D3 (OLON_dis_s) disables the ON output openload detection for the selected output, the default value [0] enables this
feature (Table 14).
A logic [1] on bit D2 (OLOFF_dis_s) disables the OFF output openload detection for the selected output, the default value [0] enables this
feature.
A logic [1] on bit D1 (OLLED_en_s) enables the ON output openload detection for LEDs for the selected output, the default value [0]
enables the On output openload detection for bulbs (Table 14).
09XS3400
33
NXP Semiconductors
FUNCTIONAL DEVICE OPERATION
Table 14. On openload selection
OLON_dis_s (D3)
OLLED_en_s (D1)
ON openload detection
0
0
1
0
1
enable with bulb threshold (default)
enable with LED threshold
disable
X
A logic [1] on bit D0 (CSNS_ratio_s) selects the high ratio on the CSNS pin for the corresponding output. The default value [0] is the low
ratio (Table 15).
Table 15. Current sense ratio selection
CSNS_high_s (D0)
Current sense ratio
0
1
CRS0 (default)
CRS1
6.4.2.5
Address A A 100—Output overcurrent register (OCR)
1 0
The OCR_s register allows the MCU to configure corresponding output overcurrent protection through the SPI. Each output “s” is
independently selected for configuration based on the state of the D14:D13 bits (Table 12). A logic [1] on bit D8 (Xenon_s) disables the
Xenon overcurrent profile, as described Table 14.
Xenon bit set to logic [0]:
I
OCH1
I
OCH2
I
OC1
I
OC2
I
OCLO4
I
OCLO3
I
OCLO2
I
OCLO1
Time
t
t
t
t
t
t
OC7
OC1
OC3 OC4 OC5
OC2
OC6
t
Xenon bit set to logic [1]:
I
I
OCH1
OCH2
I
OC1
OC2
OC3
OC4
I
I
I
I
I
OCL4
OCL3
I
I
OCL2
OCL1
Time
t
t
t
t
t
t
OC7
OC1
t
OC3 OC4 OC5
OC6
OC2
Figure 17. Overcurrent profile depending on xenon bit
D[7:6] bits are used to select the bulb cooling curves and D[5:4] bits modify the decay speed of the overcurrent profile, as shown Table 16
and Table 17.
09XS3400
NXP Semiconductors
34
FUNCTIONAL DEVICE OPERATION
Table 16. Cooling curve selection
BC1_s (D7)
BC0_s (D6)
Profile curves speed
0
0
1
1
0
1
0
1
medium (default)
slow
fast
medium
Table 17. Inrush curve selection
OC1_s (D5)
OC0_s (D4)
Profile curves speed
0
0
1
1
0
1
0
1
slow (default)
fast
medium
very slow
A logic [1] on bit D3 (OCHI_s bit reduces the current threshold from IOCHI1 to IOCHI2 during tOC1, as shown Table 15.
I
OCH1
I
OCH2
I
OC1
I
OC2
I
OC3
I
OC4
I
I
OCL4
OCL3
I
I
OCL2
OCL1
Time
t
t
t
t
t
t
OC7
OC1
t
OC3 OC4 OC5
OC6
OC2
Figure 18. Overcurrent profile with OCHI bit set to ‘1’
The wire harness is protected by one of four possible current levels in steady state, as defined in Table 18.
Table 18. Output steady state selection
OCLO1 (D2)
OCLO0 (D1)
Steady state current
0
0
1
1
0
1
0
1
OCLO2 (default)
OCLO3
OCLO4
OCLO1
Bit D0 (OC_mode_sel) determines which of two overcurrent modes the output uses. In one mode the overcurrent profile is used every
time the output turns on. In the other mode, Which can be used during PWM operation, the overcurrent profile is adjusted to account for
bulb cooling effects, as described Table 19.
Table 19. Overcurrent mode selection
OC_mode_s (D0)
Overcurrent mode
0
1
only inrush current management (default)
inrush current and bulb cooling management
09XS3400
35
NXP Semiconductors
FUNCTIONAL DEVICE OPERATION
6.4.2.6
Address 00101—Global configuration register (GCR)
The GCR register allows the MCU to configure the device through the SPI. The D8 bit controls how the device responds to a VDD_FAIL
condition, which is, VDD < VDD(FAIL). If the VDD_FAIL_en bit is logic [1], then the loss of VDD, the device enters immediately in Fail-safe
mode. In the VDD_FAIL_en bit is logic [0], the Fail-safe mode transition is done after the SPI watchdog timeout.
Bit D8 allows the MCU to enable or disable the VDD failure detector. A logic [1] on VDD_FAIL_en bit allows switch-off the outputs HS[0:3]
in fail-safe mode. Bit D7 allows the MCU to enable or disable the PWM module. A logic [1] on PWM_en bit allows control of the outputs
HS[0:3] with PWMR register (the direct input states are ignored). Bit D6 (CLOCK_sel) is used to select the clock used as reference by
PWM module, as described in the following Table 20.
Table 20. PWM module selection
PWM_en (D7)
CLOCK_sel (D6)
PWM module
0
X
PWM module disabled (default)
PWM module enabled with external clock
from IN0
1
1
0
1
PWM module enabled with
internal calibrated clock
Bits D5:D4 allow the MCU to select one of two analog signals on CSNS output pin, as shown in Table 21.
Table 21. CSNS reporting selection
TEMP_en (D5) CSNS_en (D4)
CSNS reporting
0
X
1
0
1
0
CSNS tri-stated (default)
current recopy of selected output (D3:2] bits)
temperature on GND flag
The Table 22 describes how bits D[3:2] specifies the output channel whose current is being mirrored at the CSNS pin.
Table 22. Output current recopy selection
CSNS1 (D3)
CSNS0 (D2)
CSNS reporting
0
0
1
1
0
1
0
1
HS0 (default)
HS1
HS2
HS3
The GCR register disables the overvoltage protection (D0). When this bits is [0], the overvoltage is enabled (default value).
6.4.2.7
Address 00111—Calibration register (CALR)
The CALR register allows the MCU to calibrate internal clock.
6.4.3 Serial output communication (device status return data)
When the CSB pin is pulled low, the output register is loaded. Meanwhile, the data is clocked out MSB- (OD15-) first as the new message
data is clocked into the SI pin after a CSB transition. The first sixteen bits of data clocking out of the SO are dependent upon the previously
written SPI word.
Any bits clocked out of the Serial Output (SO) pin after the first 16 bits are representative of the initial message bits clocked into the SI pin
since the CSB pin first transitioned to a logic [0]. This feature is useful for daisy-chaining devices as well as for message verification.
A valid message length is determined following a CSB transition of [0] to [1]. If there is a valid message length, the data is latched into the
appropriate registers. A valid message length is a multiple of 16 bits. At this time, the SO pin is tri-stated and the fault status register is
now able to accept new fault status information.
SO data includes information ranging from fault status to register contents, user selected by writing to the STATR bits OD4, OD3, OD2,
OD1, and OD0. The value of the previous bits SOA4 and SOA3 determine which output the SO information applies to for the registers
which are output specific; viz., Fault, PWMR, CONFR0, CONFR1, and OCR registers.
09XS3400
NXP Semiconductors
36
FUNCTIONAL DEVICE OPERATION
Note that the SO data continues to reflect the information for each output (depending on the previous SOA4, SOA3 state) selected during
the most recent STATR write until changed with an updated STATR write.
The output status register correctly reflects the status of the STATR-selected register data at the time that CSB is pulled to a logic [0]
during SPI communication, and/or for the period of time since the last valid SPI communication, with the following exception:
• The previous SPI communication was determined to be invalid. In this case, the status is reported as though the invalid SPI
communication never occurred.
• The VPWR voltage is below 4.0 V. In this case the status must be ignored by the MCU.
6.4.4 Serial output bit assignment
The 16 bits of serial output data depend on the previous serial input message, as explained in the following paragraphs. Table 23,
summarizes SO returned data for bits OD15:OD0.
• Bit OD15 is the MSB; it reflects the state of the Watchdog bit from the previously clocked-in message.
• Bits OD14:OD10 reflect the state of the bits SOA4:SOA0 from the previously clocked in message.
• Bit OD9 is set to logic [1] in Normal mode (NM).
• The contents of bits OD8:OD0 depend on bits D4:D0 from the most recent STATR command SOA4:SOA0 as explained in the
paragraphs following Table 23.
Table 23. Serial output bit map description
Previous STATR
SO returned data
SOA SOA SOA SOA SOA OD
OD
14
OD
13
OD
12
OD
11
OD
10
OD9 OD8 OD7 OD6 OD5 OD4 OD3 OD2 OD1 OD0
4
3
2
1
0
15
OLON OLOF
STATR_s
A
A
0
0
0
WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
POR
UV
OV
OS_s OT_s SC_s OC_s
1
0
_s
F_s
PWM PWM PWM PWM PWM PWM PWM
PWMR_s
A
A
A
A
0
0
0
1
1
0
WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
0
ON_s
X
1
1
0
0
6_s
X
5_s
4_s
3_s
2_s
1_s
0_s
DIR_d SR1_ SR0_ DELA DELA DELA
CONFR0_s
X
is_s
s
s
Y2_s Y1_s Y0_s
Retry
_
unlimit
ed_s
OLOF OLLE CSNS
F_dis D_en _ratio
Retry OS_di OLON
_dis_s s_s _dis_s
CONFR1_s
A
A
A
A
0
1
1
WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
X
X
1
1
0
0
_s
_s
_s
Xenon BC1_
_s
BC0_ OC1_ OC0_ OCHI OCLO OCLO OC_m
s
OCR_s
GCR
1
1
1
0
0
1
0
1
1
s
s
_s
1_s
0_s ode_s
s
VDD_
PWM CLOC TEMP CSNS CSNS CSNS
_en K_sel _en
OV_di
s
0
0
WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM FAIL_
en
X
_en
1
0
CAL_f
OTW
ail
CLOC
K_fail
DIAGR0
0
0
WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
X
X
X
X
X
X
WD_e
DIAGR1
DIAGR2
0
1
1
0
1
1
1
1
1
1
WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
X
X
X
X
X
X
X
X
IN3
X
IN2
X
IN1
0
IN0
n
0
0
0
Register
state after
RST = 0 or
N/A N/A N/A N/A N/A
0
0
0
0
0
0
0
X
0
0
0
0
0
0
0
V
or
DD(FAIL)
V
SUPPLY(POR)
condition
s = Output selection with the bits A A as defined in Table 12
1
0
6.4.4.1
Previous address SOA4:SOA0 = A A 000 (STATR_S)
1 0
The returned data OD8 reports logic [1] in case of previous power-on reset condition (VSUPPLY(POR)). This bit is only reset by a read
operation.
Bits OD7:OD0 reflect the current state of the Fault register (FLTR) corresponding to the output previously selected with the bits
SOA4:SOA3 = A1A0 (Table 23).
• OC_s: overcurrent fault detection for a selected output,
• SC_s: severe short-circuit fault detection for a selected output,
09XS3400
37
NXP Semiconductors
FUNCTIONAL DEVICE OPERATION
• OS_s: output shorted to VPWR fault detection for a selected output,
• OLOFF_s: openload in OFF state fault detection for a selected output,
• OLON_s: openload in ON state fault detection (depending on current level threshold: bulb or LED) for a selected output,
• OV: overvoltage fault detection,
• UV: undervoltage fault detection
• POR: power-on reset detection.
The FSB pin reports all faults. For latched faults, this pin is reset by a new Switch OFF command (toggling fault_control signal).
6.4.4.2
Previous address SOA4:SOA0 = A A 001 (PWMR_S)
1 0
The returned data contains the programmed values in the PWMR register for the output selected with A1A0.
6.4.4.3
Previous address SOA4:SOA0 = A A 010 (CONFR0_S)
1 0
The returned data contains the programmed values in the CONFR0 register for the output selected with A1A0.
6.4.4.4
Previous address SOA4:SOA0 = A A 011 (CONFR1_S)
1 0
The returned data contains the programmed values in the CONFR1 register for the output selected with A1A0.
6.4.4.5
Previous address SOA4:SOA0 = A A 100 (OCR_S)
1 0
The returned data contains the programmed values in the OCR register for the output selected with A1A0.
6.4.4.6
Previous address SOA4:SOA0 = 00101 (GCR)
The returned data contains the programmed values in the GCR register.
6.4.4.7
Previous address SOA4:SOA0 = 00111 (DIAGR0)
The returned data OD2 reports logic [1] in case of PWM clock on IN0 pin is out of specified frequency range.
The returned data OD1 reports logic [1] in case of clock calibration failure.
The returned data OD0 reports logic [1] in case of overtemperature prewarning (temperature of GND flag is above TOTWAR).
6.4.4.8
Previous address SOA4:SOA0 = 01111 (DIAGR1)
The returned data OD[4:1] report in real time the state of the direct input IN[3:0]. The OD0 indicates if the watchdog is enabled (set to logic
[1]) or not (set to logic [0]). OD4:OD1 report the output state in case of fail-safe state due to watchdog time-out as explained in the following
Table 24.
Table 24. Watchdog activation report
WD_en (OD0)
SPI watchdog
0
1
disabled
enabled
6.4.4.9
Previous address SOA4:SOA0 = 10111 (DIAGR2)
The returned data is the product ID. Bits OD2:OD0 are set to 000 for protected quad 9.0 mΩ high-side switches.
09XS3400
NXP Semiconductors
38
FUNCTIONAL DEVICE OPERATION
6.4.5 Default device configuration
The default device configuration is explained by the following:
• HS output is commanded by corresponding IN input or On bit through the SPI. The medium slew-rate is used,
• HS output is fully protected by the Xenon overcurrent profile by default, the severe short-circuit protection, the undervoltage, and the
overtemperature protection. The autoretry feature is enabled,
• Openload in ON and OFF state and HS shorted to VPWR detections are available,
• No current recopy and no analog temperature feedback active,
• Overvoltage protection is enabled,
• SO reporting fault status from HS0,
• VDD failure detection is disabled.
09XS3400
39
NXP Semiconductors
TYPICAL APPLICATIONS
7
Typical applications
7.1
Introduction
Figure 19 shows a typical automotive lighting application using an external PWM clock from the main MCU. In this instance, an auxiliary
circuit (watchdog) provides IN[3:0] control inputs if the system detects a serious fault such as a watchdog timeout. A 22 nF decoupling
capacitor, placed at the module connector, is recommended for each output. 100 nF decoupling capacitors, placed at the device power
supply pins are also recommended to pass conducted emission and susceptibility tests.
VPWR
VDD
Voltage regulator
10 µF
100 nF
10 µF
100 nF
VPWR
VDD
VDD
VPWR
ignition
switch
VDD
VPWR
VDD
100 nF
100 nF
10 k
10 k
100 nF
VDD
WAKE
HS0
HS1
HS2
22 nF
22 nF
I/O
I/O
FSB
IN0
IN1
IN2
IN3
10 k
LOAD 0
MCU
09XS3400
10 k
10 k
10 k
10 k
LOAD 1
LOAD 2
LOAD 3
SCLK
CSB
I/O
SO
SI
SCLK
CSB
RSTB
SI
22 nF
22 nF
SO
HS3
A/D
CSNS
FSI
10 k
GND
22 nF
2.5 k
VPWR
Watchdog
direct light commands (pedal, comodo,...)
Figure 19. 09XS3400 typical application schematic
09XS3400
NXP Semiconductors
40
PACKAGING
8
Packaging
8.1
Soldering information
The 09XS3400 is packaged in a surface mount power package intended to be soldered directly to the printed circuit board. The 09XS3400
was qualified in accordance with JEDEC standards J-STD-020D for moisture sensitivity level (MSL) 3, Pb-free assembly.
The Peak Package Body Temperature (TP) must not exceed the classification temperature TC = 260 °C during the soldering process. The
time (tP) within the specified classification temperature TC - 5.0 °C must not exceed 40 seconds maximum. The application note AN2467
provides guidelines for printed circuit board design and assembly.
8.2
Marking information
The device is identified by the part number: 09XS3400.
Device markings indicate build information containing the week and year of manufacture. The date is coded with the last four characters
of the nine character build information code (e.g. “CTKAH0929”). The date is coded as four numerical digits where the first two digits
indicate the year and the last two digits indicate the week. For instance, the date code “0929” indicates the 29th week of the year 2009.
8.3
Package dimensions
Package dimensions are provided in package drawings. To find the most current package outline drawing, go to www.nxp.com and
perform a keyword search for the drawing’s document number.
Table 25. Package outline
Package
Suffix
Package outline drawing number
24-pin QFN
FK
98ARL10596D
09XS3400
41
NXP Semiconductors
PACKAGING
09XS3400
NXP Semiconductors
42
PACKAGING
09XS3400
43
NXP Semiconductors
PACKAGING
09XS3400
NXP Semiconductors
44
PACKAGING
09XS3400
45
NXP Semiconductors
PACKAGING
09XS3400
NXP Semiconductors
46
PACKAGING
09XS3400
47
NXP Semiconductors
PACKAGING
09XS3400
NXP Semiconductors
48
PACKAGING
09XS3400
49
NXP Semiconductors
REVISION HISTORY
9
Revision history
Revision
Date
Description of changes
1.0
2.0
2/2012
•
•
Initial release
No technical changes. Revised back page. Updated document properties. Added SMARTMOS
sentence to last paragraph on page one.
4/2014
8/2014
•
•
•
Modified tDLY and slew rates per Product Bulletin 16375
Fixed typo in Table 5
Updated to current data sheet template style
3.0
4.0
•
Deleted the 28W mode references as per PB 17070
• Table 4 - relabeled parameter descriptions, conditions, and symbols
• Table 5 - relabeled parameter descriptions, conditions, and symbols
• Table 11 - changed the PWMR_s D8 bit
• Table 23 - changed the PWMR_s D8 bit
Added note (42) for Table 11
1/2016
•
•
Updated document form and style
1/2016
1/2016
7/2016
•
•
Corrected PB number
Detailed a description for the 28W mode change
Updated NXP document form and style.
•
•
Updated as per CIN 201808007I
• Corrected tOLLED values in Table 5, Dynamic electrical characteristics
8/2018
5.0
• Updated Openload detection in ON state for LED (added clarification for the usage of openload
LED function and changed D[6:0]=7F to D[7:0]=FF)
• Deleted 28 W references
09XS3400
NXP Semiconductors
50
Information in this document is provided solely to enable system and software implementers to use NXP products.
There are no expressed or implied copyright licenses granted hereunder to design or fabricate any integrated circuits
based on the information in this document. NXP reserves the right to make changes without further notice to any
products herein.
How to Reach Us:
Home Page:
NXP.com
Web Support:
http://www.nxp.com/support
NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular
purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation, consequential or incidental damages. "Typical"
parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications,
and actual performance may vary over time. All operating parameters, including "typicals," must be validated for each
customer application by the customer's technical experts. NXP does not convey any license under its patent rights nor
the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the
following address:
http://www.nxp.com/terms-of-use.html.
NXP, the NXP logo, Freescale, the Freescale logo and SMARTMOS are trademarks of NXP B.V. All other product or
service names are the property of their respective owners. All rights reserved.
© 2018 NXP B.V.
Document Number: MC09XS3400
Rev. 5.0
8/2018
相关型号：
MC1,5/10-ST-3,81
Barrier Strip Terminal Block, 8A, 1.5mm2, 1 Row(s), 1 Deck(s), ROHS COMPLIANT
PHOENIX
©2020 ICPDF网 联系我们和版权申明