MC33901WEF [NXP]
DATACOM, INTERFACE CIRCUIT, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8;
| 型号： | MC33901WEF |
| 厂家： | 
NXP |
| 描述： | DATACOM, INTERFACE CIRCUIT, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8 电信 光电二极管 电信集成电路 |
| 文件： | 总24页 (文件大小：580K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Document Number: MC33901
Rev. 3.0, 6/2015
ale Semiconductor
cal Data
High-speed CAN Transceiver
33901
34901
The MC33901/34901 are SMARTMOS high-speed (up to 1.0 Mbits/s) CAN
transceivers providing the physical interface between the CAN protocol
controller of an MCU and the physical dual wires CAN bus. They are packaged
in an 8-pin SOIC with market standard pinout, and offer excellent EMC and ESD
performance without the need for external filter components.
.
HIGH-SPEED CAN TRANSCEIVER
Four devices variations are available:
- Versions with and without CAN bus wake-up.
- Versions with and without TXD dominant protection.
Features
• Very low-current consumption in standby mode
• Compatible with 3.3 V or 5.0 V MCU interface
• Standby mode with remote CAN wake-up on some versions.
• Pin and function compatible with market standard
EF SUFFIX (PB-FREE)
98ASA42564B
8-PIN SOICN
Cost efficient robustness:
Industrial Applications (MC34901)
• Transportation
• Backplanes
• High system level ESD performance
• Very high electromagnetic Immunity and low electromagnetic emission
without common mode choke or other external components.
• Lift/elevators
Fail-safe behaviors:
• Factory automation
• Industrial process control
Automotive Applications (MC33901)
• Supports automotive CAN high-speed applications
• Body electronics
• TXD Dominant timeout, on the 33901 version.
• Ideal passive when unpowered, CAN bus leakage current <10 A.
• VDD and VIO monitoring
• Power train
• Chassis and safety
• Infotainment
• Diagnostic equipment
• Accessories
33901
34901
VREG
5.0 V
5.0 V
VDD
VIO
3.3 V
V
PWR
MCU
CAN H
CAN BUS
3.3 V
120
VCC
STB
I/O
TX
RX
CAN L
CAN
TXD
RXD
protocol
controller
GND
Figure 1. Simplified Application Diagram for MC3x901xEF
© Freescale Semiconductor, Inc., 2013-2015. All rights reserved.
33901
34901
VREG
5.0 V
5.0 V
VDD
STB
V
PWR
MCU
CAN H
CAN L
CAN BUS
120
VCC
I/O
TX
RX
CAN
TXD
RXD
protocol
controller
GND
Figure 2. Simplified Application Diagram for MC3x901xNEF
33901
Analog Integrated Circuit Device Data
2
Freescale Semiconductor
Table of Contents
1
2
3
Orderable Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Internal Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.3 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.5 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
General IC Functional Description and Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2 Pin Function and Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.3 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.4 Fail-safe Mechanisms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.5 Device Operation Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Typical Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.1 Application Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.1 Package Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4
5
6
7
33901
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
1
Orderable Parts
This section describes the part numbers available to be purchased along with their differences.
Table 1. Orderable Part Variations
Part Number (1)
MC33901WEF
Temperature (T )
Package
VIO
Yes
No
Wake-up Function
Available
TXD dominant protection
A
MC33901WNEF
MC33901SEF
MC33901SNEF
MC34901WEF
MC34901WNEF
MC34901SEF
MC34901SNEF
Notes
Available
Yes
No
Not Available
Available
-40 to 125 °C
SOIC 8 pins
Yes
No
Not Available
Yes
No
Not Available
1. To order parts in Tape & Reel, add the R2 suffix to the part number.
Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to http://
www.freescale.com and perform a part number search.
33901
Analog Integrated Circuit Device Data
Freescale Semiconductor
4
2
Internal Block Diagram
VDD
TXD
VIO
Bus Biasing
2.5V
V
Monitor
VDD
DD
Pre-
driver
Timeout
MC33xx only
Input
CAN H
CAN L
R
IN
VIO
VDD
R
IN
50 k
High
Impedance
Mode
and
Buffer
RXD
Pre-
driver
VIO
Control
VDD
Over
temperature
-
STB
VIO
VIO
Differential
Receiver
V
IO
V
Monitor
IO
Wake-up
Receiver (*)
GND
(*) MC3x901WEF only
Figure 3. Internal Block Diagram for MC3x901xEF
VDD
TXD
V
IO
Bus Biasing
V
DD
VDD Monitor
Pre-
driver
Timeout
MC33xx only
Input
2.5V
CAN H
CAN L
RIN
RIN
VIO
V
DD
50 k
High
Impedance
Mode
and
Buffer
RXD
Pre-
driver
V
IO
Control
V
DD
STB
NC
Over-
temperature
V
V
DD
IO
Differential
Receiver
V
IO
VIO Monitor
Wake-up
Receiver (*)
GND
(*) MC3x901WNEF only
Figure 4. Internal Block Diagram for MC3x901xNEF (Version N)
33901
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
3
Pin Connections
3.1
Pinout
TXD
TXD
8
7
8
7
1
2
3
STB
1
2
3
STB
CANH
CANH
GND
VDD
GND
VDD
6
5
6
5
CANL
VIO
CANL
NC
4
4
RXD
RXD
MC3x901xEF
MC3x901xNEF
Figure 5. 8-Pin SOIC Pinout
3.2
Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 9.
Table 2. 33901 Pin Definitions
MC3x901xEF Mc3x901xNEF
Pin Number
Pin Function
Definition
Pin Name
Pin Name
1
2
3
4
5
TXD
TXD
CAN bus transmit data input pin
Ground
Input
Ground
Input
GND
GND
VDD
VDD
5.0 V input supply for CAN driver and receiver
CAN bus receive data output pin
RXD
RXD
Output
VIO
NC
Input supply for the digital input output pins (MC3x901WEF and MC3x901SEF)
or
Not connected pin (MC3x901WNEF and MC3x901SNEF)
Input
or
Not connected
6
7
8
CAN L
CAN H
STB
CAN L
CAN H
STB
CAN bus low pin
Input/Output
Input/Output
Input
CAN bus high pin
Standby input for device mode selection
33901
Analog Integrated Circuit Device Data
6
Freescale Semiconductor
3.3
Maximum Ratings
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage
to the device.
Symbol
Description (Rating)
Min.
Max.
Unit
Notes
ELECTRICAL RATINGS
V
-0.3
-0.3
-0.3
-0.3
-0.3
-27
VDD Logic Supply Voltage
Input/Output Logic Voltage
Standby pin Input Voltage
TXD maximum voltage range
7.0
7.0
7.0
7.0
7.0
40
V
V
V
V
V
V
V
DD
V
IO
V
V
V
STB
TXD
RXD maximum voltage range
CANH Bus pin maximum range
CANL Bus pin maximum range
RXD
VCANH
V
-27
40
CANL
ESD Voltage
• Human Body Model (HBM) (all pins except CANH and CANL pins)
• Human Body Model (HBM) (CANH, CANL pins)
• Machine Model (MM)
±2000
±8000
±200
V
• Charge Device Model (CDM)(/corners pins)
• System level ESD
±500(/±750)
(2)
V
ESD
• 330 /150 pF Unpowered According to IEC61000-4-2:
• 330 /150 pF Unpowered According to OEM LIN, CAN, Flexray
Conformance
8.0
6.0
kV
• 2.0 k/150 pF Unpowered According to ISO10605.2008
• 2.0 k/330 pF Powered According to ISO10605.2008
8.0
6.0
Notes
2. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 ), the Machine Model (MM)
(CZAP = 200 pF, RZAP = 0 ), and the Charge Device Model.
3.4
Thermal Characteristics
Table 4. Thermal Ratings
Symbol
Description (Rating)
Min.
Max.
Unit
Notes
THERMAL RATINGS
Operating Temperature
• Ambient
TA
TJ
-40
-40
125
150
°C
• Junction
TSTG
Storage Temperature
-55
–
150
–
°C
°C
TPPRT
Peak Package Reflow Temperature During Reflow
THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS
R
Junction-to-Ambient, Natural Convection, Single-Layer Board
Thermal Shutdown
–
150
–
140
–
°C/W
°C
JA
TSD
TSDH
Thermal Shutdown Hysteresis
15
°C
33901
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
3.5
Operating Conditions
This section describes the operating conditions of the device. Conditions apply to all the following data, unless otherwise noted.
Table 5. Operating Conditions
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage
to the device.
Symbol
VDD_F
Ratings
Min
Max
7.0
5.5
7.0
5.5
Unit
V
Notes
VDD_UV
Functional operating VDD voltage
Parametric operating VDD voltage
Functional operating VIO voltage
Parametric operating VIO voltage
VDD_OP
VIO_F
4.5
V
VIO_UV
V
VIO_OP
2.8
V
VDD
VIO
Max rating exceeded
Max rating exceeded
7.0 V
7.0 V
Device functional
Device functional
5.5 V
5.5 V
5.0 V
VIO operating range
VDD operating range
5.0 V
4.5 V
3.3 V
2.8 V
Device functional or
Device functional or
CAN bus recessive state
CAN bus recessive state
Device in Standby mode
V
UV
V
UV
IO
DD
Device in Unpowered mode
0 V
0 V
Figure 6. Supply Voltage Operating Range
33901
Analog Integrated Circuit Device Data
8
Freescale Semiconductor
4
General IC Functional Description and Application
Information
4.1
Introduction
The 33901/34901 are high speed CAN transceivers providing the physical interface between the CAN protocol controller of an MCU and
the physical dual wires CAN bus. They are packaged in an 8-pin SOIC with market standard pinout, and offer excellent EMC and ESD
performance without the need for external filter components. They meet the ISO 11898-2 and ISO11898-5 standards, and have low
leakage on CAN bus while unpowered.
The devices are supplied from VDD and VIO, to allow automatic operation with 5.0 V and 3.3 V microcontrollers. They are offered in four
versions: with and without CAN bus wake-up, and with and without TXD dominant timeout.
• MC3x901xEF devices are supplied from VDD and VIO, to allow automatic operation with 5.0 V and 3.3 V microcontrollers.
• MC3x901xNEF devices are supplied from VDD, to allow operation with 5.0 V microcontrollers.
They are offered in eight versions: with and without CAN bus wake-up, with and without TXD dominant time out, and with or without
external VIO.
4.2
Pin Function and Description
4.2.1 VDD Power Supply
This is the supply for the CANH and CANL bus drivers, the bus differential receiver and the bus biasing voltage circuitry. VDD is monitored
for under voltage conditions. See Fail-safe Mechanisms. When the device is in standby mode, the consumption on VDD is extremely low
(Refer to IVDD).
4.2.2 VIO Digital I/O Power Supply
This is the supply for the TXD, RXD, and STB digital input outputs pins. VIO also supplies the low-power differential wake-up receivers
and filter circuitry. This allows detecting and reporting bus wake-up events with device supplied only from VIO. VIO is monitored for
undervoltage conditions. See Fail-safe Mechanisms. When the device is in Standby mode, the consumption on VIO is extremely low
(Refer to IVIO). VIO is internally connected to VDD for the MC3x901xNEF.
4.2.3 STB
STB is the input pin to control the device mode. When STB is high or floating, the device is in Standby mode. When STB is low, the device
is set in Normal mode. STB has an internal pull-up to VIO, so if STB is left open, the device is set to a predetermined Standby mode.
4.2.4 TXD
TXD is the device input pin to control the CAN bus level. In the application, this pin is connected to the microcontroller transmit terminal.
In Normal mode, when TXD is high or floating, the CANH and CANL drivers are OFF, setting the bus in a recessive state. When TXD is
low, the CANH and CANL drivers are activated and the bus is set to a dominant state. TXD has a built-in timing protection that disables
the bus when TXD is dominant for more than tXDOM
.
In Standby mode, TXD has no effect on the device. The TXD dominant protection is available on 33901, but not available on 34901.
4.2.5 RXD
RXD is the bus output level report pin. In the application, this pin is connected to the microcontroller receive terminal. In Normal mode,
RXD is a push-pull structure. When the bus is in a recessive state, RXD is high. When the bus is dominant, RXD is low.
In Standby mode, the push-pull structure is disabled, RXD is pulled up to VIO via a resistor (RPU-RXD), and is in a high level. When the
bus wake-up is detected, the push-pull structure resumes and TXD reports a wake-up via a toggling mechanism (refer to Figure 10). The
toggling mechanism for bus wake-up reports is available on the MC33901WEF. This mechanism is not available on the MC33901SEF.
33901
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
4.2.6 CANH and CANL
These are the CAN bus terminals.
CANL is a low side driver to GND, and CANH is a high-side driver to VDD. In Normal mode and TXD high, the CANH and CANL drivers
are OFF, and the voltage at CANH and CANL is approx. 2.5 V, provided by the internal bus biasing circuitry. When TXD is low, CANL is
pulled to GND and CANH to VDD, creating a differential voltage on the CAN bus.
In Standby mode, CANH and CANL drivers are OFF, and these pins are pulled to GND via the device RIN resistor for the MC3x901WEF
versions (ref to parameter Input resistance). In device unpowered mode, CANH and CANL are high-impedance with extremely low leakage
to GND, making the device ideally passive when unpowered.
CANH and CANL have integrated ESD protection and extremely high robustness versus external disturbance, such as EMC and electrical
transients. These pins have current limitation and thermal protection.
4.3
Operating Modes
The device has two operating modes: Standby and Normal.
4.3.1 Normal Mode
This mode is selected when the STB pin is low. In this mode, the device is able to transmit information from TXD to the bus and report the
bus level to the RXD pin. When TXD is high, CANH and CANL drivers are off and the bus is in the recessive state (unless it is in an
application where another device drives the bus to the dominant state). When TXD is low, CANH and CANL drivers are ON and the bus
is in the dominant state.
4.3.2 Standby Mode
This mode is selected when the STB pin is high or floating. In this mode, the device is not able to transmit information from TXD to the
bus, and it cannot report accurate bus information. The Device can only report bus wake-up events via the RXD toggling mechanism.
The bus wake-up report is available on the MC3x901WEF and MC3x901WNEF. This feature is not available on the MC3x901SEF. In
Standby mode, the consumption from VDD and VIO is extremely low. In this mode, the CANH and CANL pins are pulled to GND via the
internal RIN resistor, for device versions MC33901WEF and MC34901WNEF.
4.3.2.1
Wake-up Mechanism
The device versions MC3x901WEF and MC34901WNEF include bus monitoring circuitry to detect and report bus wake-ups. To activate
a wake-up report, three events must occur on the CAN bus:
- event 1: a dominant level for a time longer than tWU_FLT1 followed by
- event 2: a recessive level (event 2) longer than tWU_FLT2 followed by
- event 3: a dominant level (event 3) longer than tWU_FLT2
.
The RXD terminal then reports the bus state (bus dominant => RXD low, bus recessive => RXD high). The delay between bus dominant
and RXD low, and bus recessive and RXD high is longer than in Normal mode (refer to tTGLT).
The three events must occur within the tWU_TO timeout.
Figure 10 illustrates the wake-up detection and reporting (toggling) mechanism. If the three events do not occur within the TWU_TO timeout,
the wake-up and toggling mechanism are not active. This is illustrated in Figure 11.
The three events and the timeout function avoid a permanent dominant state on the bus that would generate a permanent wake-up
situation, which would prevent the system from entering low power mode.
4.3.3 Unpowered Mode
When VIO is below VIO UV, the device is in unpowered mode. The CAN bus is in high-impedance and is unable to transmit, receive, or
report bus wake-up events.
4.4
Fail-safe Mechanisms
The device implements various protection, detection, and predictable fail-safe mechanisms.
33901
Analog Integrated Circuit Device Data
10
Freescale Semiconductor
4.4.1 STB and TXD Input Pins
The STB input pin has an internal integrated pull-up structure to the VIO supply pin. If STB is open, the device is set to Standby mode to
ensure predictable behavior and minimize system current consumption.
The TXD input pin also has an internal integrated pull-up structure to the VIO supply pin. If TXD is open, the CAN driver is set to the
recessive state to minimize current consumption and ensure that no false dominant bit is transmitted on the bus.
4.4.2 TXD Dominant Timeout Detection
If TXD is set low for a time longer than the TXD DOM parameter, the CAN drivers are disabled and the CAN bus returns to recessive state.
This prevents the bus from being set to the dominant state permanently in case a fault sets the TXD input to low level permanently.
The device recovers from this when a high level is detected on TXD. Refer to Figures 12.
4.4.3 CAN Current Limitation
The current flowing in and out of the CANH and CANL driver is limited to a maximum of 100 mA, in case of a short-circuit (parameter for
ILIM).
4.4.4 CAN Overtemperature
If the driver temperature exceeds TSD, the driver is turned off to protect the device. A hysteresis is implemented in this protection feature.
The device overtemperature and recovery conditions are shown in Figure 7 “Overtemperature behavior”. The driver remains disabled until
the temperature has fallen below the OT threshold minus the hysteresis and a TXD high to low transition is detected.
Overtemperature Threshold
Hysteresis
Event 3
Hysteresis
Temperature
Event 1
Event 1
Event 2
Event 2
Event 4
Event 3
low
high
TXD
BUS
recessive
dominant
dominant
dominant
Event 1: overtemperature detection. CAN driver disable.
Event 2: temperature falls below “overtemperature threshold minus hysteresis” => CAN driver remains disable.
Event 3: temperature below “overtemperature threshold minus hysteresis” and TxD high to low transition => CAN driver enable.
Event 4: temperature above “overtemperature threshold minus hysteresis” and TxD high to low transition => CAN driver remains disable.
Figure 7. Overtemperature behavior
4.4.5 VDD and VIO Supply Voltage Monitoring
For MC3x901WEF and MC3x901SEF versions:
The device monitors the VDD and VIO supply inputs. If VDD falls below VDD UV (VDD_UV), the device is set in Standby mode. This ensures
a predictable behavior due to the loss of VDD. CAN driver, receiver, or bus biasing cannot operate any longer. In this case, the bus wake-
up is available as VIO remains active.
If VIO falls below VIO UV (VIO_UV), the device is set to an unpowered condition. This ensures a predictable behavior due to the loss of
VIO, CAN driver, receiver, or bus biasing can not operate any longer. This sets the bus in high-impedance and in ideal passive behavior.
33901
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
For MC3x901WNEF and MC3x901SNEF versions:
As VIO is internally connected to VDD, VIO voltage depends on the VDD supply. If VDD is between VIO_UV and VDD_UV, the device is set in
Standby mode. If VDD is below VIO UV, the device is set in unpowered mode.
4.4.6 Bus Dominant State Behavior in Standby Mode
In device Standby mode, a bus dominant condition due, for instance to a short-circuit or a fault in one of the other CAN nodes, does not
generate a permanent wake-up event, by virtue of the multiple events (dominant, recessive, dominant) and timeout required to detect and
report bus wake-ups.
4.5
Device Operation Summary
The following table summarizes the device operation and the state of the input output pins, depending on the operating mode and power
supply conditions.
Table 6. Operation for VIO Devices
STANDBY AND NORMAL MODES FOR MC3X901 VERSION
VDD
range
VIO
range
MODE
Description
STB
TXD
RXD
CAN
Wake-up
CANH and CANL drivers
controlled by TXD input.
Differential receiver report bus
state on RXD pins.
Biasing circuitry provides approx
2.5 in recessive state.
TXD High
=> bus
recessive
TXD Low
=> bus
dominant
Report CAN state
(bus recessive =>
RXD high, bus
dominant => RXD
low).
Nominal
supply and
normal mode
from
4.5 V to
5.5 V
from 2.8 V
to 5.5 V
Normal
Low
Disabled
CAN driver and differential
receiver disabled.
Bus biased to GND via internal RIN
resistors for MC3x901WNEF.
Bus high-impedance for
MC3x901SNEF.
Report bus wake
up via toggling
mechanism for
MC3x901WNEF.
RXD High level for
MC3x901SNEF
Enabled on
MC3x901WNEF
Not available on
MC3x901SNEF
Nominal
supply and
standby mode
No effect.
on CAN
bus.
from 0 V from 2.8 V High or
to 5.5 V to 5.5 V floating
Standby
UNDERVOLTAGE AND LOSS OF POWER CONDITIONS FOR MC3X901 VERSION
VDD
range
VIO
range
MODE
Description
STB
TXD
RXD
CAN
Wake up
CAN driver and differential
receiver disabled.
Bus biased to GND via internal RIN MC33901WEF
resistors for MC3x901WEF.
Bus high-impedance for
MC3x901SEF.
Device in
standby mode
due to loss of
VDD (VDD fall
below VDD
UV)
Report bus wake
up via toggling
mechanism for
MC3x901WEF.
RXD High level for
MC3x901SEF
from 0 V
to
VDD_UV
Enabled on
from 2.8 V
to 5.5 V
(5)
Standby
due to VDD
loss
X
(3)
X
Not available on
MC33901SEF.
(4)
Device in
unpowered
state due to
low VIO. CAN
bus high-
CAN driver and differential
receiver disabled.
High-impedance, with ideal
passive behavior.
Unpowered
due to VIO
loss
Pulled up to VIO
down to VIO
approx 1.5 V.
from0 Vto
VIO_UV
(4)
X
X
Not available.
impedance
Notes
3. STB pin has no effect. Device enters in standby mode.
4. VDD consumption < 10 uA down to VDD approx 1.5 V.
5. VIO consumption < 10 uA down to VIO approx 1.5 V. If STB is high or floating.
33901
Analog Integrated Circuit Device Data
12
Freescale Semiconductor
Table 7. Operation for Non-VIO Devices
STANDBY AND NORMAL MODES FOR MC3X901N VERSIONS
MODE
Description VDD range
STB
TXD
RXD
CAN
Wake-up
Report CAN state
(bus recessive =>
RXD high, bus
dominant => RXD
low)
CANH and CANL drivers controlled
by TXD input. Differential receiver
report bus state on RXD pins.
Biasingcircuitryprovides approx2.5
in recessive state
TXD High
=> bus recessive
TXD Low
Nominal
supply and
normal mode
from 4.5 V
to 5.5 V
Normal
Low
Disabled
=> bus dominant
CAN driver and differential receiver
disabled.
Bus biased to GND via internal RIN
resistors for MC3x901WEF.
Bus high-impedance for
MC3x901SEF
Reportbuswake up
via toggling
mechanism for
MC3x901WEF.
RXD High level for
MC3x901SEF
Enabled on
MC33901WEF
Not available on
MC33901SEF
Nominal
from 2.8 V
supply and
to 5.5 V
High or
floating
No effect. on
CAN bus.
Standby
standby mode
UNDERVOLTAGE AND LOSS OF POWER CONDITIONS FOR MC3X901N VERSIONS
MODE
Description VDD range
STB
TXD
RXD
CAN
Wake-up
Device in
unpowered
CAN driver and differential receiver
disabled.
High-impedance, with ideal passive
behavior
Unpowered
due to VDD
loss
Pulled up to VIO
down to VIO
approx 1.5 V.
state due to
low VDD and
so VIO. CAN
bus high-
from 0 V to
VIO_UV
X
X
Not available.
impedance
33901
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
4.6
Electrical Characteristics
Table 8. Static Electrical Characteristics
Characteristics noted under conditions 4.5 V VDD 5.5 V, 2.8 V VIO 5.5 V, -40 C TA 125 C, GND = 0 V, R on CAN bus
(RL) = 60 , unless otherwise noted. Typical values noted reflect the approximate parameter at TA = 25 °C under nominal conditions,
unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
POWER INPUT VDD
VDD Supply Voltage Range
VDD
V
4.5
3.0
–
–
5.5
4.5
• Nominal Operation
VDD_UV
VDD Undervoltage threshold
V
VDD supply current
• Normal mode, TXD High
• Normal mode, TXD Low
• Standby mode (MC3x901)
• Standby mode (MC3x901N)
–
–
–
–
–
40
–
5.0
65
5.0
15
mA
mA
µA
IVDD
—
µA
POWER INPUT VIO
Vio Supply Voltage Range
• Nominal Operation
VIO
V
2.8
–
–
–
5.5
2.8
VIO_UV
VIO Under voltage threshold
V
VIO supply current
• Normal mode, TXD high
–
–
–
–
–
–
5.0
–
200
1.0
10
µA
mA
µA
µA
IVIO
• Normal mode, TXD low or CAN bus in dominant state
• Standby mode, CAN bus in recessive state
• Standby mode, wake-up filter and wake-up time out running
150
STB INPUT
Input voltages
VIO
V
mV
• High level Input Voltage
• Low level input voltage
• Input threshold hysteresis
0.7
–
200
–
–
–
–
0.3
–
VSTB
RPU-STB
Pull-up resistor to VIO
–
100
–
k
TXD INPUT
Input voltages
VIO
V
mV
• High level Input Voltage
• Low level input voltage
• Input threshold hysteresis
0.7
–
200
–
–
300
–
0.3
–
VTXD
RPU-TXD
Pull-up resistor to VIO
5.0
–
50
k
RXD OUTPUT
Output current
mA
IRXD
• RXD high, VRXD high = VIO - 0.4 V
• RXD low, VRXD high = 0.4 V
-5.0
1.0
-2.5
2.5
-1.0
5.0
Pull-up resistor to VIO (in standby mode, without toggling - no wake-up
report)
RPU-RXD
25
50
90
k
33901
Analog Integrated Circuit Device Data
14
Freescale Semiconductor
Table 8. Static Electrical Characteristics (continued)
Characteristics noted under conditions 4.5 V VDD 5.5 V, 2.8 V VIO 5.5 V, -40 C TA 125 C, GND = 0 V, R on CAN bus
(RL) = 60 , unless otherwise noted. Typical values noted reflect the approximate parameter at TA = 25 °C under nominal conditions,
unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
CANL AND CANH TERMINALS
Recessive voltage, TXD high, no load
• CANL recessive voltage
VREC
2.0
2.0
2.5
2.5
3.0
3.0
V
mV
V
• CANH recessive voltage
VDIFF_REC
CANH - CANL differential recessive voltage, TXD high, no load
-50
–
50
Recessive voltage, sleep mode, no load
• CANL recessive voltage
VREC_SM
-0.1
-0.1
–
–
0.1
0.1
• CANH recessive voltage
Dominant voltage, TXD low (t < TXDOM), RL = 45 to 65
• CANL dominant voltage
VDOM
0.5
2.75
–
–
2.25
4.5
V
• CANH dominant voltage
CANH - CANL differential dominant voltage, RL = 45 to 65
VDIFF_DOM
VSYM
1.5
0.9
2.0
1.0
3.0
1.1
V
TxDLOW
VDD
Driver symmetry CANH + CANL
Current limitation, TXD low (t < TXDOM
)
ILIM
• CANL current limitation, CANL 5.0 V to 28 V
• CANH current limitation, CANH = 0 V
40
-100
–
–
100
-40
mA
VDIFF_THR
VDIFF_HYS
VDIFF_THR_S
VCM
CANH - CANL Differential input threshold
CANH - CANL Differential input voltage hysteresis
CANH - CANL Differential input threshold, in standby mode
Common Mode Voltage
0.5
50
–
–
–
–
0.9
400
1.15
12
V
mV
V
0.4
-12
V
Input resistance
RIN
• CANL input resistance
• CANH input resistance
5.0
5.0
–
–
50
50
k
RIN_DIFF
CANH, CANL differential input resistance
Input resistance matching
10
–
–
100
3.0
k
RIN_MATCH
-3.0
%
CANL or CANH input current, device unpowered, VDD = VIO = 0 V,
VCANL and VCANH 0 V to 5.0 V range
IIN_UPWR
µA
• VDD connected with R = 0 k to GND
• VDD connected with R=47 k to GND
-10
-10
–
–
10
10
RIN_UPWR
CCAN_CAP
CDIF_CAP
TSD
CANL, CANH input resistance, VCANL = VCANH = 12 V
10
–
–
–
–
k
CANL, CANH input capacitance (guaranteed by design and
characterization)
20
pF
CANL, CANH differential input capacitance (guaranteed by design
and characterization)
–
10
–
–
pF
°C
Temperature Shutdown
150
185
33901
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
Table 9. Dynamic Electrical Characteristics
Characteristics noted under conditions 4.5 V VDD 5.5 V, 2.8 V VIO 5.5 V, -40 C TA 125 C, GND = 0 V, R on CAN bus (RL) =
60 , unless otherwise noted. Typical values noted reflect the approximate parameter at TA = 25 °C under nominal conditions, unless
otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
TIMING PARAMETERS
(6)
tXDOM
tLOOP
TXD DOM
2.5
–
–
–
16
255
5.0
1.0
1.3
7.0
300
40
ms
ns
µs
µs
µs
ms
µs
us
T loop
(7)
(7)
(7)
(7)
tWU_FLT1
tWU_FLT2
tTGLT
TWU filter1
0.5
0.08
–
–
TWU filter2
–
Tdelay during toggling
Twake up timeout
–
tWU_TO
1.5
–
–
tDELAY_PWR
tDELAY_SN
Notes
Delay between power-up and device ready
120
Transition time from Standby to Normal mode (STB high to low)
6. MC33901 & MC33901N versions only
7. MC3x901WEF and MC3x901WNEF versions only
5.0 V
1.0 F
100 nF
VDD
VIO
CANH
STB
MC33901
60
100 pF
TXD
RXD
CANL
15 pF
GND
Figure 8. Timing Test Circuit
33901
Analog Integrated Circuit Device Data
16
Freescale Semiconductor
high
TXD
low
CANH
CANL
dominant
0.9 V
VDIFF
(CANH - CANL)
0.5 V
recessive
high
0.7 VIO
RXD
0.3 VIO
low
tLOOP (R-D)
tLOOP (D-R)
Figure 9. CAN Timing Diagram
recessive
recessive
recessive
dominant
t_WUFL1
dominant
dominant
BUS
t_WUFL2
t_WUFL2
1st event
2nd event
3rd event
T_TOG
T_TOG
T_TOG
T_TOG
high
RXD
low
note: 1st, 2nd and 3rd event must occurs within t_WUTO timing.
t_WUTO
Figure 10. Wake-up Pattern Timing Illustration
33901
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
recessive
recessive
dominant
t_WUFL1
dominant
t_WUFL1
BUS
t_wUFL2
t_WUFL2
1st event
2nd event
1st event
2nd event
t_WUTO (expired)
high
note: only the 1st and the 2nd event occurred within t_WUTO timing.
RXD
Figure 11. Timeout Wake-up Timing Illustration
recovery condition: TXD high
high
TXD
BUS
low
recessive
dominant
dominant
dominant
TXD_dom timeout
TXD_dom timeout
TXD_dom timeout
TXD dom timeout expired
high
RXD
low
Figure 12. TXD Dominant Timeout Detection Illustration
33901
Analog Integrated Circuit Device Data
18
Freescale Semiconductor
5
Typical Applications
5.1
Application Diagrams
VPWR
D
5.0 V
5.0 V Reg.
VDD
VIO
VCC
C1
CANH
STB
MCU
Port_xx
MC3x901xEF
R1
TXD
TXD
CANL
CAN
controller
RXD
RXD
C1: 1.0 µF
R1: application dependant
(ex: 60, 120 ohm or other value)
GND
Figure 13. Single Supply Typical Application Schematic for MC3x901xEF
VPWR
D
5.0 V
5.0 V Reg.
VDD
VCC
C1
CANH
STB
MCU
Port_xx
R1
MC3x901xNEF
TXD
TXD
CANL
CAN
controller
RXD
RXD
C1: 1.0 µF
R1: application dependant
(ex: 60, 120 ohm or other value)
GND
Figure 14. Single Supply Typical Application Schematic for MC3x901xNEF
33901
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
5.0 V
5.0 V Reg
C2
D
VPWR
3.3 - 5.0 V
3.3-5.0 V Reg
VDD
VIO
VCC
C1
STB
CANH
MCU
Port_xx
TXD
MC3x901xEF
TXD
R1
CAN
controller
CANL
RXD
RXD
C1: 1.0 µF
C2: 1.0 µF
GND
R1: application dependant
(ex: 60, 120 ohm or other value)
Figure 15. Dual Supply Typical Application Schematic for MC3x901xEF
CANH
R2, R3: application dependant
(ex: 60 ohm or other value):
R2
R3
C3: application dependant
(ex: 4.7 nF or other value):
C3
CANL
Figure 16. Example of Bus Termination Options
33901
Analog Integrated Circuit Device Data
20
Freescale Semiconductor
6
Packaging
6.1
Package Mechanical Dimensions
Package dimensions are provided in package drawings. To find the most current package outline drawing, go to www.freescale.com and
perform a keyword search for the drawing’s document number.
Table 10. Packaging Information
Package
Suffix
Package Outline Drawing Number
98ASA42564B
8-Pin SOICN
EF
.
33901
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
.
33901
Analog Integrated Circuit Device Data
22
Freescale Semiconductor
7
Revision History
REVISION
DATE
DESCRIPTION OF CHANGES
1.0
12/2013
•
Initial release
•
•
•
Changed Advance Information to Technical Data
Added information for high-speed (up to 1.0 Mbit/s)
Added VREC_SM (CANH, CANL recessive voltage, sleep mode) to Table 7
2.0
3.0
4/2015
•
•
Added VSYM (Driver symmetry) to Table 7
Added IIN_UPWR to Table 7
•
•
Added MC33901xNEF and MC34901xNEF parts to Table 1, Orderable Parts
6/2015
Added additions to all figures and tables to include the variations for the new part numbers
33901
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
Information in this document is provided solely to enable system and software implementers to use Freescale products.
There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based
on the information in this document.
How to Reach Us:
Home Page:
freescale.com
Web Support:
freescale.com/support
Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no
warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance
may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by
customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others.
Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address:
freescale.com/SalesTermsandConditions.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off.
SMARTMOS is a trademark of Freescale Semiconductor, Inc. All other product or service names are the property of their
respective owners.
© 2015 Freescale Semiconductor, Inc.
Document Number: MC33901
Rev. 3.0
6/2015
相关型号：
©2020 ICPDF网 联系我们和版权申明