MC3S12Q96CPB16 [NXP]
16-BIT, FLASH, 16MHz, MICROCONTROLLER, PQFP52, LQFP-52;
| 型号： | MC3S12Q96CPB16 |
| 厂家： | 
NXP |
| 描述： | 16-BIT, FLASH, 16MHz, MICROCONTROLLER, PQFP52, LQFP-52 时钟 微控制器 外围集成电路 |
| 文件： | 总644页 (文件大小：3248K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC9S12Q128
Reference Manual
Covers MC9S12Q Family
HCS12
Microcontrollers
Rev 1.10
MC9S12Q128
05/2010
freescale.com
To provide the most up-to-date information, the revision of our documents on the World Wide Web will be
the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
http://freescale.com/
A full list of family members and options is included in the appendices.
The following revision history table summarizes changes contained in this document.
This document contains information for all constituent modules, with the exception of the S12 CPU. For
S12 CPU information please refer to the CPU S12 Reference Manual.
Revision
Level
Date
Description
Updated LVI levels in electrical parameter section
Fixed incorrect reference to TSCR2
January 2006
01.05
Added 0M66G PART ID number
May 2006
Dec 2006
01.06
01.07
Corrected missing overbars on pin names
Added units to MSCAN timing table
Corrected CRGFLG contents in register summary
Corrected unintended symbol font
Added emulation package info.
Corrected TIM and PWM channel count in PIM section
Updated ATD section
May 2007
01.08
Corrected typos and inconsistent register listing format
Dec 2007
May 2010
01.09
01.10
Added new PartID
Updated TIM section (see TIM rev. history)
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Chapter 5
Chapter 6
Chapter 7
Chapter 8
Chapter 9
MC9S12Q Device Overview (MC9S12Q128-Family) . . . . . . . .17
Port Integration Module (PIM9C32) . . . . . . . . . . . . . . . . . . . . .73
Module Mapping Control (MMCV4) . . . . . . . . . . . . . . . . . . . .109
Multiplexed External Bus Interface (MEBIV3) . . . . . . . . . . . .129
Interrupt (INTV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .157
Background Debug Module (BDMV4) . . . . . . . . . . . . . . . . . .165
Debug Module (DBGV1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .191
Analog-to-Digital Converter (ATD10B8C) . . . . . . . . . . . . . . .223
Clocks and Reset Generator (CRGV4) . . . . . . . . . . . . . . . . . .251
Chapter 10 Scalable Controller Area Network (S12MSCANV2) . . . . . . . .287
Chapter 11 Oscillator (OSCV2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .343
Chapter 12 Pulse-Width Modulator (PWM8B4CV1). . . . . . . . . . . . . . . . . 347
Chapter 13 Serial Communications Interface (S12SCIV2) . . . . . . . . . . . .379
Chapter 14 Serial Peripheral Interface (SPIV3) . . . . . . . . . . . . . . . . . . . . .409
Chapter 15 Timer Module (TIM16B6C) . . . . . . . . . . . . . . . . . . . . . . . . . . .431
Chapter 16 Dual Output Voltage Regulator (VREG3V3V2) . . . . . . . . . . .455
Chapter 17 32 Kbyte Flash Module (S12FTS32KV1). . . . . . . . . . . . . . . . .463
Chapter 18 64 Kbyte Flash Module (S12FTS64KV4). . . . . . . . . . . . . . . . .497
Chapter 19 96 Kbyte Flash Module (S12FTS96KV1). . . . . . . . . . . . . . . . .531
Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1). . . . . . . . . . . . . .565
Appendix A Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . .599
Appendix B Emulation Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .631
Appendix C Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .633
Appendix D Derivative Differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .637
Appendix E Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .638
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Chapter 1
MC9S12Q Device Overview (MC9S12Q128-Family)
1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
1.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
1.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1.2 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1.2.1 Device Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
1.2.2 Detailed Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
1.2.3 Part ID Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
1.3 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
1.3.1 Device Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
1.3.2 Signal Properties Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
1.3.3 Pin Initialization for 48- and 52-Pin LQFP Bond Out Versions . . . . . . . . . . . . . . . . . . . 49
1.3.4 Detailed Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
1.3.5 Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
1.4 System Clock Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
1.5 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
1.5.1 Chip Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
1.5.2 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
1.5.3 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
1.6 Resets and Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
1.6.1 Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
1.6.2 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
1.7 Device Specific Information and Module Dependencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
1.7.1 PPAGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
1.7.2 BDM Alternate Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
1.7.3 Extended Address Range Emulation Implications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
1.7.4 VREGEN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
1.7.5 V
, V
, V , V
DD1
DD2 SS1 SS2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
1.7.6 Clock Reset Generator And VREG Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
1.7.7 Analog-to-Digital Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
1.7.8 MODRR Register Port T And Port P Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
1.7.9 Port AD Dependency On PIM And ATD Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
1.8 Recommended Printed Circuit Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Chapter 2
Port Integration Module (PIM9C32) Block Description
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
2.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
2.1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
2.2 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
2.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
2.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
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2.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
2.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
2.4.1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
2.4.2 Port Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
2.4.3 Port A, B, E and BKGD Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
2.4.4 External Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
2.4.5 Low Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
2.5 Initialization Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
2.5.1 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
2.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
2.6.1 Interrupt Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
2.6.2 Recovery from STOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
2.7 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Chapter 3
Module Mapping Control (MMCV4) Block Description
3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
3.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
3.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
3.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
3.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
3.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
3.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
3.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
3.4.1 Bus Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
3.4.2 Address Decoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
3.4.3 Memory Expansion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Chapter 4
Multiplexed External Bus Interface (MEBIV3)
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
4.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
4.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
4.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
4.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
4.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
4.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
4.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
4.4.1 Detecting Access Type from External Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
4.4.2 Stretched Bus Cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
4.4.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
4.4.4 Internal Visibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
4.4.5 Low-Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
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MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 5
Interrupt (INTV1) Block Description
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
5.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
5.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
5.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
5.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
5.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
5.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
5.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
5.4.1 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
5.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
5.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
5.6.1 Interrupt Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
5.6.2 Highest Priority I-Bit Maskable Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
5.6.3 Interrupt Priority Decoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
5.7 Exception Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
Chapter 6
Background Debug Module (BDMV4) Block Description
6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
6.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
6.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
6.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
6.2.1 BKGD — Background Interface Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
6.2.2 TAGHI — High Byte Instruction Tagging Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
6.2.3 TAGLO — Low Byte Instruction Tagging Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
6.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
6.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
6.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
6.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
6.4.1 Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
6.4.2 Enabling and Activating BDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
6.4.3 BDM Hardware Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
6.4.4 Standard BDM Firmware Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
6.4.5 BDM Command Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
6.4.6 BDM Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
6.4.7 Serial Interface Hardware Handshake Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
6.4.8 Hardware Handshake Abort Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184
6.4.9 SYNC — Request Timed Reference Pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
6.4.10 Instruction Tracing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187
6.4.11 Instruction Tagging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
6.4.12 Serial Communication Time-Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
6.4.13 Operation in Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
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6.4.14 Operation in Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
Chapter 7
Debug Module (DBGV1) Block Description
7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
7.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
7.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
7.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
7.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
7.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
7.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
7.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
7.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
7.4.1 DBG Operating in BKP Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
7.4.2 DBG Operating in DBG Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
7.4.3 Breakpoints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
7.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
7.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
Chapter 8
Analog-to-Digital Converter (ATD10B8C)
Block Description
8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
8.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
8.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
8.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
8.2 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
8.2.1 AN7 / ETRIG / PAD7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
8.2.2 AN6 / PAD6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
8.2.3 AN5 / PAD5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
8.2.4 AN4 / PAD4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
8.2.5 AN3 / PAD3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
8.2.6 AN2 / PAD2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
8.2.7 AN1 / PAD1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
8.2.8 AN0 / PAD0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
8.2.9 V , V
RH
RL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
8.2.10 V
, V
DDA
SSA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
8.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226
8.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226
8.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230
8.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
8.4.1 Analog Sub-block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
8.4.2 Digital Sub-block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246
8.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247
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8.5.1 Setting up and starting an A/D conversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247
8.5.2 Aborting an A/D conversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248
8.6 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248
8.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249
Chapter 9
Clocks and Reset Generator (CRGV4) Block Description
9.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251
9.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251
9.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
9.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
9.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253
9.2.1 V
, V
— PLL Operating Voltage, PLL Ground . . . . . . . . . . . . . . . . . . . . . . 253
DDPLL
SSPLL
9.2.2 XFC — PLL Loop Filter Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253
9.2.3 RESET — Reset Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254
9.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254
9.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254
9.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255
9.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266
9.4.1 Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266
9.4.2 System Clocks Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269
9.4.3 Clock Monitor (CM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270
9.4.4 Clock Quality Checker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270
9.4.5 Computer Operating Properly Watchdog (COP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272
9.4.6 Real-Time Interrupt (RTI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272
9.4.7 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273
9.4.8 Low-Power Operation in Run Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274
9.4.9 Low-Power Operation in Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274
9.4.10 Low-Power Operation in Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278
9.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282
9.5.1 Clock Monitor Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284
9.5.2 Computer Operating Properly Watchdog (COP) Reset . . . . . . . . . . . . . . . . . . . . . . . . . 284
9.5.3 Power-On Reset, Low Voltage Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 285
9.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 286
9.6.1 Real-Time Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 286
9.6.2 PLL Lock Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 286
9.6.3 Self-Clock Mode Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 286
Chapter 10
Freescale’s Scalable Controller Area Network (S12MSCANV2)
10.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287
10.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 287
10.1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288
10.1.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288
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10.1.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289
10.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289
10.2.1 RXCAN — CAN Receiver Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289
10.2.2 TXCAN — CAN Transmitter Output Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289
10.2.3 CAN System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 289
10.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290
10.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290
10.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 292
10.3.3 Programmer’s Model of Message Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314
10.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323
10.4.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 323
10.4.2 Message Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324
10.4.3 Identifier Acceptance Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327
10.4.4 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333
10.4.5 Low-Power Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 334
10.4.6 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 339
10.4.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 339
10.5 Initialization/Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 341
10.5.1 MSCAN initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 341
Chapter 11
Oscillator (OSCV2) Block Description
11.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 343
11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 343
11.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 343
11.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 344
11.2.1 V
and V
— PLL Operating Voltage, PLL Ground . . . . . . . . . . . . . . . . . . . 344
DDPLL
SSPLL
11.2.2 EXTAL and XTAL — Clock/Crystal Source Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 344
11.2.3 XCLKS — Colpitts/Pierce Oscillator Selection Signal . . . . . . . . . . . . . . . . . . . . . . . . . 345
11.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 346
11.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 346
11.4.1 Amplitude Limitation Control (ALC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 346
11.4.2 Clock Monitor (CM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 346
11.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 346
Chapter 12
Pulse-Width Modulator (PWM8B4C) Block Description
12.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347
12.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347
12.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347
12.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348
12.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348
12.2.1 PWM3 — Pulse Width Modulator Channel 3 Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348
12.2.2 PWM2 — Pulse Width Modulator Channel 2 Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348
10
MC9S12Q128
Rev 1.10
Freescale Semiconductor
12.2.3 PWM1 — Pulse Width Modulator Channel 1 Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 348
12.2.4 PWM0 — Pulse Width Modulator Channel 0 Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349
12.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349
12.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349
12.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350
12.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 367
12.4.1 PWM Clock Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 367
12.4.2 PWM Channel Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 370
12.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377
12.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 377
Chapter 13
Serial Communications Interface (S12SCIV2)
Block Description
13.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 379
13.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 379
13.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 379
13.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 380
13.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 381
13.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 381
13.2.1 TXD-SCI Transmit Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 381
13.2.2 RXD-SCI Receive Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 381
13.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382
13.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382
13.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 382
13.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 390
13.4.1 Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 391
13.4.2 Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 392
13.4.3 Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 393
13.4.4 Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 396
13.4.5 Single-Wire Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405
13.4.6 Loop Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405
13.5 Initialization Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405
13.5.1 Reset Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 405
13.5.2 Interrupt Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 406
13.5.3 Recovery from Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 407
Chapter 14
Serial Peripheral Interface (SPIV3) Block Description
14.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 409
14.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 409
14.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 409
14.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 410
14.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 410
Freescale Semiconductor
MC9S12Q128
Rev 1.10
11
14.2.1 MOSI — Master Out/Slave In Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 410
14.2.2 MISO — Master In/Slave Out Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 411
14.2.3 SS — Slave Select Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 411
14.2.4 SCK — Serial Clock Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 411
14.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 411
14.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 411
14.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 412
14.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 419
14.4.1 Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 420
14.4.2 Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 421
14.4.3 Transmission Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 422
14.4.4 SPI Baud Rate Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 425
14.4.5 Special Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 426
14.4.6 Error Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 427
14.4.7 Operation in Run Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 428
14.4.8 Operation in Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 428
14.4.9 Operation in Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 428
14.5 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 429
14.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 429
14.6.1 MODF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 429
14.6.2 SPIF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 429
14.6.3 SPTEF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 429
Chapter 15
Timer Module (TIM16B6CV1) Block Description
15.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 431
15.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 431
15.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 431
15.1.3 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 432
15.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 434
15.2.1 IOC7 — Input Capture and Output Compare Channel 7 Pin . . . . . . . . . . . . . . . . . . . . 434
15.2.2 IOC6 — Input Capture and Output Compare Channel 6 Pin . . . . . . . . . . . . . . . . . . . . 434
15.2.3 IOC5 — Input Capture and Output Compare Channel 5 Pin . . . . . . . . . . . . . . . . . . . . 434
15.2.4 IOC4 — Input Capture and Output Compare Channel 4 Pin . . . . . . . . . . . . . . . . . . . . 434
15.2.5 IOC3 — Input Capture and Output Compare Channel 3 Pin . . . . . . . . . . . . . . . . . . . . 434
15.2.6 IOC2 — Input Capture and Output Compare Channel 2 Pin . . . . . . . . . . . . . . . . . . . . 434
15.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 434
15.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 434
15.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 435
15.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 451
15.4.1 Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 452
15.4.2 Input Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 452
15.4.3 Output Compare . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 452
15.4.4 Pulse Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 452
15.4.5 Event Counter Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453
12
MC9S12Q128
Rev 1.10
Freescale Semiconductor
15.4.6 Gated Time Accumulation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453
15.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 453
15.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454
15.6.1 Channel [7:2] Interrupt (C[7:2]F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454
15.6.2 Pulse Accumulator Input Interrupt (PAOVI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454
15.6.3 Pulse Accumulator Overflow Interrupt (PAOVF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454
15.6.4 Timer Overflow Interrupt (TOF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 454
Chapter 16
Dual Output Voltage Regulator (VREG3V3V2)
Block Description
16.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 455
16.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 455
16.1.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 455
16.1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 456
16.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 457
16.2.1 V
16.2.2 V
— Regulator Power Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 457
DDR
DDA
, V
— Regulator Reference Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 457
SSA
16.2.3 V , V — Regulator Output1 (Core Logic) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 458
DD
SS
16.2.4 V
16.2.5 V
, V
— Regulator Output2 (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 458
DDPLL
SSPLL
— Optional Regulator Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 458
REGEN
16.3 Memory Map and Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 458
16.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 458
16.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 459
16.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 459
16.4.1 REG — Regulator Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 460
16.4.2 Full-Performance Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 460
16.4.3 Reduced-Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 460
16.4.4 LVD — Low-Voltage Detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 460
16.4.5 POR — Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 460
16.4.6 LVR — Low-Voltage Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 460
16.4.7 CTRL — Regulator Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 460
16.5 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461
16.5.1 Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461
16.5.2 Low-Voltage Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461
16.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461
16.6.1 LVI — Low-Voltage Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 461
Chapter 17
32 Kbyte Flash Module (S12FTS32KV1)
17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 463
17.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 463
17.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 463
17.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 464
Freescale Semiconductor
MC9S12Q128
Rev 1.10
13
17.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 464
17.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 464
17.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 465
17.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 465
17.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 468
17.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 480
17.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 480
17.4.2 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 494
17.4.3 Flash Module Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 494
17.4.4 Flash Reset Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 496
17.4.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 496
Chapter 18
64 Kbyte Flash Module (S12FTS64KV4)
18.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 497
18.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 497
18.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 497
18.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498
18.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498
18.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 498
18.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 499
18.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 499
18.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 502
18.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 514
18.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 514
18.4.2 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 528
18.4.3 Flash Module Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 528
18.4.4 Flash Reset Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 530
18.4.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 530
Chapter 19
96 Kbyte Flash Module (S12FTS96KV1)
19.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 531
19.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 531
19.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 531
19.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 532
19.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 532
19.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 532
19.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533
19.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533
19.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 536
19.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 548
19.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 548
19.4.2 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 562
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19.4.3 Flash Module Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 562
19.4.4 Flash Reset Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 564
19.4.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 564
Chapter 20
128 Kbyte Flash Module (S12FTS128K1V1)
20.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 565
20.1.1 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 565
20.1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 565
20.1.3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 566
20.1.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 566
20.2 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 566
20.3 Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 567
20.3.1 Module Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 567
20.3.2 Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 570
20.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 582
20.4.1 Flash Command Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 582
20.4.2 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596
20.4.3 Flash Module Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 596
20.4.4 Flash Reset Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 598
20.4.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 598
Appendix A
Electrical Characteristics
A.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 599
A.1.1 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 599
A.1.2 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 599
A.1.3 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600
A.1.4 Current Injection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600
A.1.5 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 601
A.1.6 ESD Protection and Latch-up Immunity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 602
A.1.7 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 603
A.1.8 Power Dissipation and Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 604
A.1.9 I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 606
A.1.10 Supply Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 607
A.2 ATD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 610
A.2.1 ATD Operating Characteristics In 5V Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 610
A.2.2 ATD Operating Characteristics In 3.3V Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611
A.2.3 Factors Influencing Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611
A.2.4 ATD Accuracy (5V Range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 612
A.2.5 ATD Accuracy (3.3V Range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 613
A.3 MSCAN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615
A.4 Reset, Oscillator and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615
A.4.1 Startup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 615
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A.4.2 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 616
A.4.3 Phase Locked Loop. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 618
A.5 NVM, Flash, and EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 621
A.5.1 NVM Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 621
A.5.2 NVM Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 624
A.6 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625
A.6.1 Master Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 625
A.6.2 Slave Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 627
A.7 Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 629
A.7.1 Voltage Regulator Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 629
A.7.2 Chip Power-up and LVI/LVR Graphical Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . 629
A.7.3 Output Loads. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 630
Appendix B
Emulation Information
B.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 631
B.1.1 PK[2:0] / XADDR[16:14]. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 632
Appendix C
Package Information
C.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633
C.1.1 80-Pin QFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 634
C.1.2 52-Pin LQFP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 635
C.1.3 48-Pin LQFP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 636
Appendix D
Derivative Differences
Appendix E
Ordering Information
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Chapter 1
MC9S12Q Device Overview (MC9S12Q128-Family)
1.1
Introduction
The MC9S12Q128-Family is a 48/52/80 pin Flash-based MCU family, which delivers the power and
flexibility of the 16 Bit core to a whole new range of cost and space sensitive, general purpose Industrial
and Automotive network applications All MC9S12Q128-Familymembers feature standard on-chip
peripherals including a 16-bit central processing unit (CPU12), up to 128K bytes of Flash EEPROM (or
ROM), up to 4K bytes of RAM, an asynchronous serial communications interface (SCI), a serial peripheral
interface (SPI), a 6-channel 16-bit timermodule (TIM), a 4-channel 8-bit pulse width modulator (PWM),
an 8-channel, 10-bit analog-to-digital converter (ADC).
All MC9S12Q128-Family devices feature full 16-bit data paths throughout. The inclusion of a PLL circuit
allows power consumption and performance to be adjusted to suit operational requirements. In addition to
the I/O ports available in each module, up to 10 dedicated I/O port bits are available with wake-up
capability from stop or wait mode. The MC9S12Q128-Family devices are available in 48-, 52-, and 80-pin
QFP packages, with the 80-pin version pin compatible to the HCS12 A, B,, C and D Family derivatives.
1.1.1
Features
•
16-bit HCS12 core:
— HCS12 CPU
– Upward compatible with M68HC11 instruction set
– Interrupt stacking and programmer’s model identical to M68HC11
– Instruction queue
– Enhanced indexed addressing
— MMC (memory map and interface)
— INT (interrupt control)
— BDM (background debug mode)
— DBG12 (enhanced debug12 module, including breakpoints and change-of-flow trace buffer)
— MEBI (multiplexed expansion bus interface) available only in 80-pin package version
•
Wake-up interrupt inputs:
— Up to 12 port bits available for wake up interrupt function with digital filtering
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Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
•
Memory options:
— 32Kbyte ROM or Flash EEPROM (erasable in 512-byte sectors)
64K, 96K, or 128Kbyte ROM or Flash EEPROM (erasable in 1024-byte sectors)
— 1K, 2K, 3K or 4K Byte RAM
•
Analog-to-digital converters:
— One 8-channel module with 10-bit resolution
— External conversion trigger capability
— One 1M bit per second, CAN 2.0 A, B software compatible module
— Five receive and three transmit buffers
— Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit, or 8 x 8 bit
— Four separate interrupt channels for Rx, Tx, error, and wake-up
— Low-pass filter wake-up function
— Loop-back for self test operation
•
Timer module (TIM):
— 6-Channel timer
— Each channel configurable as either input capture or output compare
— Simple PWM mode
— Modulo reset of timer counter
— 16-bit pulse accumulator
— External event counting
— Gated time accumulation
•
PWM module:
— Programmable period and duty cycle
— 8-bit 4-channel or 16-bit 2-channel
— Separate control for each pulse width and duty cycle
— Center-aligned or left-aligned outputs
— Programmable clock select logic with a wide range of frequencies
— Fast emergency shutdown input
•
•
Serial interfaces:
— One asynchronous serial communications interface (SCI)
— One synchronous serial peripheral interface (SPI)
CRG (clock reset generator module)
— Windowed COP watchdog
— Real time interrupt
— Clock monitor
— Pierce or low current Colpitts oscillator
— Phase-locked loop clock frequency multiplier
— Limp home mode in absence of external clock
— Low power 0.5MHz to 16MHz crystal oscillator reference clock
:Operating frequency
•
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Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
— 16MHz equivalent to 8MHz Bus Speed for single chip
— 16MHz equivalent to 8MHz Bus Speed in expanded bus modes
— Option of 32 MHz equivalent to 16MHz Bus Speed
•
Internal 2.5V regulator:
— Supports an input voltage range from 2.97V to 5.5V
— Low power mode capability
— Includes low voltage reset (LVR) circuitry
— Includes low voltage interrupt (LVI) circuitry
•
•
48-pin LQFP, 52-pin LQFP, or 80-pin QFP package:
— Up to 58 I/O lines with 5V input and drive capability (80-pin package)
— Up to 2 dedicated 5V input only lines (IRQ, XIRQ)
— 5V 8 A/D converter inputs and 5V I/O
Development support:
— Single-wire background debug™ mode (BDM)
— On-chip hardware breakpoints
— Enhanced DBG12 debug features
1.1.2
Modes of Operation
User modes (expanded modes are only available in the 80-pin package version).
•
Normal and emulation operating modes:
— Normal single-chip mode
— Normal expanded wide mode
— Normal expanded narrow mode
— Emulation expanded wide mode
— Emulation expanded narrow mode
•
•
Special operating modes:
— Special single-chip mode with active background debug mode
— Special test mode (Freescale use only)
— Special peripheral mode (Freescale use only)
Low power modes:
— Stop mode
— Pseudo stop mode
— Wait mode
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Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
1.1.3
Block Diagram
Figure 1-1. MC9S12Q128-Family Block Diagram
VSSR
VDDR
VDDX
VSSX
VDDA
VSSA
VRH
VDDA
VSSA
VRH
ATD
VRL
VRL
Voltage Regulator
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
PAD0
PAD1
PAD2
PAD3
PAD4
PAD5
PAD6
PAD7
32K, 64K, 96K, 128K Byte Flash/ROM
VDD2
VSS2
VDD1
VSS1
1K, 2K, 3K, 4K Byte RAM
Single-wire Background
PT0
PT1
PT2
PT3
PT4
PT5
PT6
PT7
BKGD
HCS12
CPU
Debug12 Module
XFC
VDDPLL
VSSPLL
EXTAL
XTAL
IOC2
IOC3
IOC4
IOC5
IOC6
IOC7
MUX
Clock and
Reset
Timer
Module
PLL
Generation
COP Watchdog
Clock Monitor
Periodic Interrupt
Module
RESET
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
XIRQ
IRQ
R/W
LSTRB/TAGLO
ECLK
MODA/IPIPE0
MODB/IPIPE1
NOACC/XCLKS
PW0
PW1
PW2
PW3
PP0
PP1
PP2
PP3
PP4
PP5
PP6
PP7
PWM
System
Module
Integration
Module
(SIM)
PWM Module is only available on the
128K and 96K Versions
TEST/VPP
PJ6
PJ7
Multiplexed Address/Data Bus
RXD
PS0
PS1
PS2
PS3
SCI
TXD
DDRA
PTA
DDRB
PTB
RXCAN
MSCAN
PM0
PM1
PM2
PM3
PM4
PM5
TXCAN
MISO
SS
MOSI
SPI
SCK
Multiplexed
Wide Bus
Signals shown in Bold are not available on the 52 or 48 Pin Package
Signals shown in Bold Italic are available in the 52, but not the 48 Pin Package
Internal Logic 2.5V
I/O Driver 5V
VDD1,2
VSS1,2
VDDX
VSSX
PLL 2.5V
A/D Converter 5V
VRL is bonded internally to VSSA
for 52 and 48 Pin packages
VDDPLL
VSSPLL
VDDA
VSSA
Voltage Regulator 5V & I/O
VDDR
VSSR
20
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
1.2
Memory Map and Registers
Device Memory Map
1.2.1
Table 1-1 shows the device register map after reset.The figures on the following pages illustrate the full
device memory map.
Table 1-1. Device Register Map Overview
Address
Module
Size
0x0000–0x0017 Core (ports A, B, E, modes, inits, test)
24
1
0x0018
0x0019
Reserved
Voltage regulator (VREG)
1
0x001A–0x001B Device ID register
0x001C–0x001F Core (MEMSIZ, IRQ, HPRIO)
0x0020–0x002F Core (DBG)
2
4
16
4
0x0030–0x0033 Core (PPAGE(1)
)
0x0034–0x003F Clock and reset generator (CRG)
0x0040–0x006F Standard timer module (TIM)
0x0070–0x007F Reserved
12
48
16
32
40
8
0x0080–0x009F Analog-to-digital converter (ATD)
0x00A0–0x00C7 Reserved
0x00C8–0x00CF Serial communications interface (SCI)
0x00D0–0x00D7 Reserved
8
0x00D8–0x00DF Serial peripheral interface (SPI)
0x00E0–0x00FF Pulse width modulator (PWM)
0x0100–0x010F Flash control register
0x0110–0x013F Reserved
8
32
16
48
64
192
64
384
0x0140–0x017F Scalable controller area network (MSCAN)
0x0180–0x023F Reserved
0x0240–0x027F Port integration module (PIM)
0x0280–0x03FF Reserved
1. External memory paging is not supported on this device (Section 1.7.1, “PPAGE”).
Freescale Semiconductor
MC9S12Q128
Rev 1.10
21
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
$0000
1K Register Space
$03FF
$0000
Mappable to any 2K Boundary
$0000
$0400
16K Fixed Flash EEPROM/ROM
4K Bytes RAM
$3FFF
$3000
$3000
$4000
$3FFF
$4000
Mappable to any 4K Boundary
16K Fixed Flash EEPROM/ROM
$7FFF
$8000
$8000
16K Page Window
8 * 16K Flash EEPROM/ROM Pages
EXT
$BFFF
$C000
$C000
$FF00
16K Fixed Flash EEPROM/ROM
$FFFF
$FF00
BDM
(If Active)
VECTORS
VECTORS
VECTORS
$FFFF
$FFFF
NORMAL
SINGLE CHIP
EXPANDED
SPECIAL
SINGLE CHIP
The figure shows a useful map, which is not the map out of reset. After reset the map is:
$0000 - $03FF: Register Space
$0000 - $0FFF: 4K RAM (only 3K visible $0400 - $0FFF)
Flash Erase Sector Size is 1024 Bytes
Figure 1-2. MCxS12Q128 User Configurable Memory Map
22
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
$0000
1K Register Space
$03FF
$0000
Mappable to any 2K Boundary
$0000
$0400
16K Fixed Flash EEPROM/ROM
3K Bytes RAM
$3FFF
$3400
$3400
$4000
$3FFF
$4000
Mappable to any 4K Boundary
16K Fixed Flash EEPROM/ROM
$7FFF
$8000
$8000
16K Page Window
6 * 16K Flash EEPROM/ROM Pages
EXT
$BFFF
$C000
$C000
16K Fixed Flash EEPROM/ROM
$FFFF
$FF00
BDM
(If Active)
$FF00
$FFFF
VECTORS
VECTORS
VECTORS
$FFFF
NORMAL
SINGLE CHIP
EXPANDED
SPECIAL
SINGLE CHIP
The figure shows a useful map, which is not the map out of reset. After reset the map is:
$0000 - $03FF: Register Space
$0400 - $0FFF: 3K RAM
Flash Erase Sector Size is 1024 Bytes
Figure 1-3. MCxS12Q96 User Configurable Memory Map
Freescale Semiconductor
MC9S12Q128
Rev 1.10
23
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
$0000
1K Register Space
$03FF
$0000
Mappable to any 2K Boundary
$0000
$0400
16K Fixed Flash EEPROM/ROM
2K Bytes RAM
$3FFF
$3800
$3800
$4000
$3FFF
$4000
Mappable to any 4K Boundary
16K Fixed Flash EEPROM/ROM
$7FFF
$8000
$8000
16K Page Window
4 * 16K Flash EEPROM/ROM Pages
$BFFF
$C000
$C000
$FF00
16K Fixed Flash EEPROM/ROM
$FFFF
$FF00
BDM
(If Active)
VECTORS
VECTORS
$FFFF
$FFFF
NORMAL
SINGLE CHIP
SPECIAL
SINGLE CHIP
The figure shows a useful map, which is not the map out of reset. After reset the map is:
$0000 - $03FF: Register Space
$0800 - $0FFF: 2K RAM
Flash Erase Sector Size is 512 Bytes
Figure 1-4. MCxS12Q64 User Configurable Memory Map
24
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
$0000
$03FF
1K Register Space
Mappable to any 2K Boundary
$0000
$0400
$3C00
$3FFF
1K Bytes RAM
$3C00
$4000
Mappable to any 2K Boundary
$8000
$8000
16K Page Window
2 * 16K Flash EEPROM/ROM Pages
$BFFF
$C000
$C000
16K Fixed Flash EEPROM/ROM
$FFFF
$FF00
BDM
(If Active)
$FF00
$FFFF
VECTORS
VECTORS
$FFFF
NORMAL
SINGLE CHIP
SPECIAL
SINGLE CHIP
The figure shows a useful map, which is not the map out of reset. After reset the map is:
$0000 - $03FF: Register Space
$0C00 - $0FFF: 1K RAM
Flash Erase Sector Size is 512 Bytes
Figure 1-5. MCxS12Q32 User Configurable Memory Map
Freescale Semiconductor
MC9S12Q128
Rev 1.10
25
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
1.2.2
Detailed Register Map
The detailed register map of the MC9S12Q128-Family is listed in address order below.
0x0000–0x000F MEBI Map 1 of 3 (HCS12 Multiplexed External Bus Interface)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0x0000
PORTA
Bit 7
6
5
4
3
2
1
Bit 0
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
0x0008
0x0009
0x000A
0x000B
0x000C
0x000D
0x000E
0x000F
PORTB
DDRA
Bit 7
Bit 7
6
6
5
5
4
4
3
3
2
2
1
1
Bit 0
Bit 0
DDRB
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
Reserved
Reserved
Reserved
Reserved
PORTE
DDRE
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Bit 1
0
Bit 0
0
Bit 7
Bit 7
6
5
5
4
4
3
3
2
6
0
Bit 2
0
0
PEAR
NOACCE
MODC
PUPKE
PIPOE
NECLK
0
LSTRE
RDWE
0
MODE
MODB
0
MODA
0
IVIS
0
EMK
EME
PUPAE
RDPA
0
0
0
0
PUCR
PUPEE
PUPBE
0
0
0
0
0
0
0
0
0
RDRIV
RDPK
0
RDPE
0
RDPB
0
EBICTL
Reserved
ESTR
0
0
0
0
26
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x0010–0x0014
MMC Map 1 of 4 (HCS12 Module Mapping Control)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0
0
0x0010
INITRM
RAM15
0
RAM14
RAM13
RAM12
RAM11
RAMHAL
0
0
0
0
0
0x0011
0x0012
0x0013
0x0014
INITRG
INITEE
MISC
REG14
REG13
REG12
REG11
EE11
EE15
0
EE14
0
EE13
0
EE12
0
EEON
EXSTR1 EXSTR0 ROMHM ROMON
0
0
0
0
0
0
0
0
Reserved
0x0015–0x0016
INT Map 1 of 2 (HCS12 Interrupt)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
0
0
0
0x0015
ITCR
WRINT
ADR3
ADR2
ADR1
ADR0
0x0016
ITEST
INTE
INTC
INTA
INT8
INT6
INT4
INT2
INT0
0x0017–0x0017
MMC Map 2 of 4 (HCS12 Module Mapping Control)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
0
0
0
0
0
0
0
0
0x0017
Reserved
0x0018–0x0018
Miscellaneous Peripherals (Device User Guide)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
0
0
0
0
0
0
0
0
0x0018
Reserved
0x0019–0x0019
VREG3V3 (Voltage Regulator)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
0
0
0
0
0
LVDS
$0019
VREGCTRL
LVIE
LVIF
Freescale Semiconductor
MC9S12Q128
Rev 1.10
27
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x001A–0x001B Miscellaneous Peripherals (Device User Guide)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
ID15
ID14
ID13
ID12
ID11
ID10
ID9
ID8
0x001A
PARTIDH
ID7
ID6
ID5
ID4
ID3
ID2
ID1
ID0
0x001B
PARTIDL
0x001C–0x001D MMC Map 3 of 4 (HCS12 Module Mapping Control, Device User Guide)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
reg_sw0
0
eep_sw1 eep_sw0
0
ram_sw2 ram_sw1 ram_sw0
0x001C
MEMSIZ0
rom_sw1 rom_sw0
0
0
0
0
pag_sw1 pag_sw0
0x001D
MEMSIZ1
0x001E–0x001E
MEBI Map 2 of 3 (HCS12 Multiplexed External Bus Interface)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
0
0
0
0
0
0
0x001E
INTCR
IRQE
IRQEN
0x001F–0x001F
INT Map 2 of 2 (HCS12 Interrupt)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
0
0x001F
HPRIO
PSEL7
PSEL6
PSEL5
PSEL4
PSEL3
PSEL2
PSEL1
0x0020–0x002F
DBG (Including BKP) Map 1 of 1 (HCS12 Debug)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
0
0x0020
DBGC1
DBGEN
AF
ARM
BF
TRGSEL BEGIN DBGBRK
CAPMOD
CF
0
0x0021
0x0022
0x0023
0x0024
0x0025
DBGSC
DBGTBH
DBGTBL
DBGCNT
DBGCCX
TRG
Read: Bit 15
Write:
Bit 14
Bit 6
0
Bit 13
Bit 5
Bit 12
Bit 4
Bit 11
Bit 3
Bit 10
Bit 2
Bit 9
Bit 1
Bit 8
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Bit 7
TBF
CNT
PAGSEL
EXTCMP
28
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x0020–0x002F
DBG (Including BKP) Map 1 of 1 (HCS12 Debug) (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0x0026
DBGCCH
Bit 15
14
13
12
11
10
9
Bit 8
0x0027
0x0028
0x0029
0x002A
0x002B
0x002C
0x002D
0x002E
0x002F
DBGCCL
Bit 7
6
5
4
3
2
1
Bit 0
RWC
RWB
DBGC2
BKPCT0
DBGC3
BKPCT1
DBGCAX
BKP0X
BKABEN
FULL
BDM
TAGAB
BKCEN
TAGC
RWA
RWCEN
RWBEN
BKAMBH BKAMBL BKBMBH BKBMBL RWAEN
PAGSEL
Bit 15
Bit 7
PAGSEL
EXTCMP
DBGCAH
BKP0H
14
6
13
5
12
4
11
3
10
2
9
1
Bit 8
Bit 0
DBGCAL
BKP0L
DBGCBX
BKP1X
EXTCMP
DBGCBH
BKP1H
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
9
1
Bit 8
Bit 0
DBGCBL
BKP1L
0x0030–0x0031
MMC Map 4 of 4 (HCS12 Module Mapping Control)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
0
0
0x0030
PPAGE
PIX5
0
PIX4
0
PIX3
0
PIX2
0
PIX1
0
PIX0
0
0
0
0x0031
Reserved
0x0032–0x0033
MEBI Map 3 of 3 (HCS12 Multiplexed External Bus Interface)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Address
Name
Bit 7
0
Bit 6
0
Bit 5
0
Bit 4
0
Bit 3
0
Bit 2
0
Bit 1
0
Bit 0
0
Read:
Write:
Read:
Write:
$0032
$0033
Reserved
Reserved
0
0
0
0
0
0
0
0
Freescale Semiconductor
MC9S12Q128
Rev 1.10
29
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x0034–0x003F
CRG (Clock and Reset Generator)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
0
0
0x0034
SYNR
SYN5
0
SYN4
0
SYN3
SYN2
SYN1
SYN0
0
0
0x0035
0x0036
0x0037
0x0038
0x0039
0x003A
0x003B
0x003C
0x003D
0x003E
0x003F
REFDV
REFDV3 REFDV2 REFDV1 REFDV0
Read: TOUT7
Write:
TOUT6
TOUT5
TOUT4
TOUT3
LOCK
0
TOUT2
TRACK
0
TOUT1
TOUT0
SCM
0
CTFLG
TEST ONLY
Read:
RTIF
CRGFLG
CRGINT
CLKSEL
PLLCTL
RTICTL
PORF
0
LVRF
0
LOCKIF
LOCKIE
SCMIF
SCMIE
Write:
Read:
RTIE
Write:
Read:
PLLSEL
Write:
PSTP
PLLON
RTR6
SYSWAI ROAWAI PLLWAI
0
CWAI
PRE
RTIWAI COPWAI
Read:
CME
AUTO
ACQ
PCE
RTR1
CR1
SCME
RTR0
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0
RTR5
0
RTR4
0
RTR3
0
RTR2
COPCTL
WCOP
RSBCK
CR2
0
CR0
0
0
0
FORBYP
TEST ONLY
RTIBYP COPBYP
PLLBYP
TCTL4
FCM
Read: TCTL7
Write:
TCTL6
TCTL5
TCLT3
TCTL2
TCTL1
TCTL0
CTCTL
TEST ONLY
Read:
Write:
0
0
6
0
5
0
4
0
3
0
2
0
1
0
ARMCOP
Bit 7
Bit 0
0x0040-0x006F TIM
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
0x0040
TIOS
IOS7
IOS6
IOS5
IOS4
IOS3
IOS2
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0
0
0
0
0
0
0
0
0x0041
0x0042
0x0043
0x0044
0x0045
0x0046
CFORC
OC7M
FOC7
FOC6
FOC5
FOC4
FOC3
FOC2
OC7M7 OC7M6 OC7M5 OC7M4 OC7M3 OC7M2
OC7D
OC7D7
OC7D6
OC7D5
OC7D4
OC7D3
OC7D2
Bit 15
14
13
12
11
10
9
1
0
Bit 8
Bit 0
0
TCNT (hi)
TCNT (lo)
TSCR1
Bit 7
6
5
4
3
2
0
0
TEN
TSWAI
TSFRZ
TFFCA
30
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x0040-0x006F TIM
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
OM4
Bit 0
OL4
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0x0047
TTOV
TOV7
TOV6
TOV5
TOV4
TOV3
TOV2
0x0048
0x0049
0x004A
0x004B
0x004C
0x004D
0x004E
0x004F
0x0050
0x0051
0x0052
0x0053
0x0054
0x0055
0x0056
0x0057
0x0058
0x0059
0x005A
0x005B
TCTL1
TCTL2
OM7
OM3
EDG7B
EDG3B
C7I
OL7
OL3
OM6
OM2
OL6
OL2
OM5
OL5
TCTL3
EDG7A
EDG3A
EDG6B
EDG2B
EDG6A
EDG2A
EDG5B
EDG5A
EDG4B
EDG4A
TCTL4
TIE
C6I
0
C5I
0
C4I
0
C3I
C2I
C1I
C0I
TSCR2
TFLG1
TOI
TCRE
PR2
PR1
PR0
C7F
C6F
0
C5F
0
C4F
0
C3F
0
C2F
0
0
0
TFLG2
TOF
Reserved
Reserved
Reserved
Reserved
TC2 (hi)
TC2 (lo)
TC3 (hi)
TC3 (lo)
TC4 (hi)
TC4 (lo)
TC5 (hi)
TC5 (lo)
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
9
1
9
1
9
1
9
1
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
Bit 8
Bit 0
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
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Rev 1.10
31
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x0040-0x006F TIM
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0x005C
Bit 15
14
13
12
11
10
9
Bit 8
TC6 (hi)
0x005D
0x005E
0x005F
0x0060
0x0061
0x0062
0x0063
0x0064
0x0065
0x0066
0x0067
0x0068
0x0069
0x006A
0x006B
0x006C
0x006D
0x006E
0x006F
Bit 7
6
14
6
5
13
5
4
12
4
3
11
3
2
10
2
1
Bit 0
Bit 8
Bit 0
PAI
TC6 (lo)
TC7 (hi)
Bit 15
9
1
Bit 7
0
TC7 (lo)
PAEN
PAMOD PEDGE
CLK1
CLK0
PAOVI
PAOVF
9
PACTL
0
0
0
0
0
0
PAFLG
PAIF
Bit 8
Bit 15
14
13
12
11
10
PACNT (hi)
PACNT (lo)
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
ep0x0040-0x006F TIM
32
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x0080–0x009F
ATD (Analog-to-Digital Converter 10 Bit 8 Channel)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0
0
0
0
0
0
0
0
0x0080
ATDCTL0
0
0
0
0
0
0
0
0
0x0081
0x0082
0x0083
0x0084
0x0085
0x0086
0x0087
0x0088
0x0089
0x008A
0x008B
0x008C
0x008D
0x008E
0x008F
0x0090
0x0091
0x0092
0x0093
0x0094
0x0095
ATDCTL1
ATDCTL2
ATDCTL3
ATDCTL4
ATDCTL5
ATDSTAT0
Reserved
ATDTEST0
ATDTEST1
Reserved
ATDSTAT1
Reserved
ATDDIEN
Reserved
PORTAD
ASCIF
ADPU
0
AFFC
S8C
AWAI
S4C
ETRIGLE ETRIGP
ETRIG
FIFO
ASCIE
FRZ1
PRS1
S2C
PRS4
MULT
S1C
FRZ0
PRS0
SRES8
DJM
SMP1
SMP0
SCAN
PRS3
0
PRS2
DSGN
0
CC
CB
CA
0
CC2
CC1
CC0
SCF
0
ETORF
0
FIFOR
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
SC
0
Read: CCF7
Write:
CCF6
0
CCF5
0
CCF4
0
CCF3
0
CCF2
0
CCF1
0
CCF0
0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
Bit7
Bit15
Bit7
6
5
13
0
4
12
0
3
11
0
2
10
0
1
9
0
9
0
9
0
BIT 0
Bit8
0
14
ATDDR0H
ATDDR0L
ATDDR1H
ATDDR1L
ATDDR2H
ATDDR2L
Bit6
14
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
Bit6
14
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
Bit6
Freescale Semiconductor
MC9S12Q128
Rev 1.10
33
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x0080–0x009F
ATD (Analog-to-Digital Converter 10 Bit 8 Channel) (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Bit15
14
13
12
11
10
9
Bit8
0x0096
ATDDR3H
Bit7
Bit15
Bit7
Bit6
14
0
13
0
0
12
0
0
11
0
0
10
0
0
9
0
9
0
9
0
9
0
0
Bit8
0
0x0097
0x0098
0x0099
0x009A
0x009B
0x009C
0x009D
0x009E
0x009F
ATDDR3L
ATDDR4H
ATDDR4L
ATDDR5H
ATDDR5L
ATDDR6H
ATDDR6L
ATDDR7H
ATDDR7L
Bit6
14
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
Bit6
14
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
Bit6
14
Bit15
Bit7
13
0
12
0
11
0
10
0
Bit8
0
Bit6
0x00A0–0x00C7 Reserved
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
0
0
0
0
0
0
0
0
0x00A0–
0x00C7
Reserved
0x00C8–0x00CF SCI (Asynchronous Serial Interface)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0
0
0
0x00C8
SCIBDH
SBR12
SBR11
SBR10
SBR9
SBR8
0x00C9
0x00CA
0x00CB
0x00CC
SCIBDL
SCICR1
SCICR2
SCISR1
SBR7
SBR6
SBR5
RSRC
SBR4
M
SBR3
SBR2
ILT
SBR1
PE
SBR0
PT
LOOPS SCISWAI
WAKE
TIE
TCIE
TC
RIE
ILIE
TE
RE
NF
RWU
FE
SBK
PF
Read: TDRE
Write:
RDRF
IDLE
OR
34
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x00C8–0x00CF SCI (Asynchronous Serial Interface) (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
0
0
0
0
0
RAF
0x00CD
SCISR2
BRK13
0
TXDIR
0
R8
0
0
0
0
0x00CE
0x00CF
SCIDRH
SCIDRL
T8
R7
T7
R6
T6
R5
T5
R4
T4
R3
T3
R2
T2
R1
T1
R0
T0
0x00D0–0x00D7 Reserved
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
0
0
0
0
0
0
0
0
0x00D0–
0x00D7
Reserved
0x00D8–0x00DF SPI (Serial Peripheral Interface)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0x00D8
SPICR1
SPIE
0
SPE
0
SPTIE
0
MSTR
CPOL
CPHA
0
SSOE
LSBFE
0x00D9
0x00DA
0x00DB
0x00DC
0x00DD
0x00DE
0x00DF
SPICR2
SPIBR
MODFEN BIDIROE
SPISWAI
SPC0
0
SPIF
0
0
SPPR2
0
SPPR1
SPTEF
SPPR0
SPR2
0
SPR1
0
SPR0
0
MODF
0
0
0
SPISR
0
0
0
0
0
Reserved
SPIDR
Bit7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit0
0
Reserved
Reserved
0
0
0
0
0
0
0
0
Freescale Semiconductor
MC9S12Q128
Rev 1.10
35
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x00E0-0x00FF PWM
Address
Name
Bit 7
0
Bit 6
0
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0x00E0
PWME
PWME3 PWME2 PWME1 PWME0
0
0
0
0
0
0
0
0
0
0x00E1
0x00E2
0x00E3
0x00E4
0x00E5
0x00E6
0x00E7
0x00E8
0x00E9
0x00EA
0x00EB
0x00EC
0x00ED
0x00EE
0x00EF
0x00E0
0x00E1
0x00E2
0x00E3
0x00E4
PWMPOL
PWMCLK
PWMPRCLK
PWMCAE
PWMCTL
PPOL3
PPOL2
PCLK2
PCKA2
CAE2
PPOL1
PCLK1
PCKA1
PPOL0
PCLK0
PCKA0
PCLK3
0
PCKB2
0
PCKB1
PCKB0
CAE3
CAE1
0
CAE0
0
CON23
0
CON01
0
PSWAI
0
PFRZ
0
0
0
0
0
0
0
PWMTST
Test Only
0
5
0
4
0
3
0
2
PWMPRSC
PWMSCLA
PWMSCLB
PWMSCNTA
PWMSCNTB
PWMCNT0
PWMCNT1
PWMCNT2
PWMCNT3
Reserved
Bit 7
6
1
Bit 0
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
0
0
0
0
0
0
0
0
Bit 7
0
6
0
6
0
6
0
6
0
5
0
5
0
5
0
5
0
4
0
4
0
4
0
4
0
3
0
3
0
3
0
3
0
2
0
2
0
2
0
2
0
1
0
1
0
1
0
1
0
Bit 0
0
Bit 7
0
Bit 0
0
Bit 7
0
Bit 0
0
Bit 7
0
Bit 0
0
Reserved
PWMPER0
PWMPER1
PWMPER2
Bit 7
Bit 7
Bit 7
6
6
6
5
5
5
4
4
4
3
3
3
2
2
2
1
1
1
Bit 0
Bit 0
Bit 0
36
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x00E0-0x00FF PWM
Address
Name
Bit 7
Bit 7
Bit 6
6
Bit 5
5
Bit 4
4
Bit 3
3
Bit 2
2
Bit 1
1
Bit 0
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
0x00E5
PWMPER3
0x00E6
0x00E7
0x00E8
0x00E9
0x00EA
0x00EB
0x00EC
0x00ED
Reserved
Reserved
PWMDTY0
PWMDTY1
PWMDTY2
PWMDTY3
Reserved
Reserved
Bit 7
Bit 7
Bit 7
Bit 7
6
6
6
6
5
5
5
5
4
4
4
4
3
3
3
3
2
2
2
2
1
1
1
1
Bit 0
Bit 0
Bit 0
Bit 0
0
0
PWM5IN
0
0x00EE
0x00EF
PWMIF
0
PWMIE
0
PWMLVL
0
PWM5INL PWM5ENA
Reserved
Reserved
PWMRSTR
T
Write:
Read:
Write:
0
0
0
0
0x0100–0x010F
Flash Control Register
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read: FDIVLD
Write:
0x0100
FCLKDIV
PRDIV8
FDIV5
NV5
FDIV4
NV4
FDIV3
NV3
FDIV2
NV2
FDIV1
SEC1
FDIV0
SEC0
Read: KEYEN1 KEYEN0
0x0101
0x0102
0x0103
0x0104
0x0105
0x0106
0x0107
FSEC
FTSTMOD
FCNFG
FPROT
FSTAT
Write:
Read:
0
0
0
0
0
0
0
0
0
WRALL
0
0
0
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
CBEIE
FPOPEN
CCIE
KEYACC
FPHDIS
NV6
FPHS1
FPHS0
0
FPLDIS
BLANK
FPLS1
0
FPLS0
0
CCIF
CBEIF
0
PVIOL ACCERR
0
0
0
0
0
FCMD
CMDB6
0
CMDB5
CMDB2
0
CMDB0
0
0
0
0
Reserved for
Factory Test
Freescale Semiconductor
MC9S12Q128
Rev 1.10
37
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x0100–0x010F
Flash Control Register (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0
0
0
0
0
0
0
0
Reserved for
Factory Test
0x0108
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Reserved for
Factory Test
0x0109
0x010A
0x010B
0x010C
0x010D
0x010E
0x010F
Reserved for
Factory Test
Reserved for
Factory Test
Reserved
Reserved
Reserved
Reserved
0x0110–0x013F
Reserved
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
0
0
0
0
0
0
0
0
0x0110–
0x003F
Reserved
0x0140–0x017F
CAN (Scalable Controller Area Network — MSCAN)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
RXACT
SYNCH
0x0140
CANCTL0
RXFRM
CSWAI
TIME
0
WUPE
SLPRQ
SLPAK
INITRQ
INITAK
0x0141
0x0142
0x0143
0x0144
0x0145
0x0146
0x0147
CANCTL1
CANBTR0
CANBTR1
CANRFLG
CANRIER
CANTFLG
CANTIER
CANE
SJW1
SAMP
WUPIF
CLKSRC LOOPB
SJW0 BRP5
LISTEN
BRP4
WUPM
BRP2
BRP3
BRP1
BRP0
TSEG22 TSEG21 TSEG20 TSEG13 TSEG12 TSEG11 TSEG10
RSTAT1 RSTAT0
TSTAT1
TSTAT0
CSCIF
OVRIF
RXF
RXFIE
TXE0
WUPIE
0
CSCIE RSTATE1 RSTATE0 TSTATE1 TSTATE0 OVRIE
0
0
0
0
0
0
0
0
TXE2
TXE1
0
TXEIE2
TXEIE1
TXEIE0
38
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x0140–0x017F
CAN (Scalable Controller Area Network — MSCAN) (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0
0
0
0
0
0x0148
CANTARQ
ABTRQ2 ABTRQ1 ABTRQ0
ABTAK2 ABTAK1 ABTAK0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x0149
0x014A
0x014B
0x014C
0x014D
0x014E
0x014F
CANTAAK
CANTBSEL
CANIDAC
TX2
TX1
TX0
IDHIT2
IDHIT1
IDHIT0
IDAM1
0
IDAM0
0
0
0
0
0
0
0
Reserved
0
0
Reserved
Read: RXERR7 RXERR6 RXERR5 RXERR4 RXERR3 RXERR2 RXERR1 RXERR0
CANRXERR
CANTXERR
Write:
Read: TXERR7 TXERR6 TXERR5 TXERR4 TXERR3 TXERR2 TXERR1 TXERR0
Write:
Read:
0x0150– CANIDAR0 -
0x0153 CANIDAR3
AC7
AM7
AC7
AM7
AC6
AM6
AC6
AM6
AC5
AM5
AC5
AM5
AC4
AM4
AC4
AM4
AC3
AM3
AC3
AM3
AC2
AM2
AC2
AM2
AC1
AM1
AC1
AM1
AC0
AM0
AC0
AM0
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0x0154– CANIDMR0 -
0x0157 CANIDMR3
0x0158– CANIDAR4 -
0x015B CANIDAR7
0x015C– CANIDMR4 -
0x015F
CANIDMR7
FOREGROUND RECEIVE BUFFER see Table 1-2
0x0160–
0x016F
CANRXFG
0x0170–
0x017F
CANTXFG
FOREGROUND TRANSMIT BUFFER see Table 1-2
Table 1-2. Detailed MSCAN Foreground Receive and Transmit Buffer Layout
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Extended ID
Standard ID
Read:
Read:
ID28
ID10
ID27
ID9
ID26
ID8
ID25
ID7
ID24
ID6
ID23
ID5
ID22
ID4
ID21
ID3
0xXXX0
CANxRIDR0 Write:
Extended ID
Standard ID
Read:
Read:
ID20
ID2
ID19
ID1
ID18
ID0
SRR=1
RTR
IDE=1
IDE=0
ID17
ID9
ID16
ID8
ID15
ID7
0xXXX1
0xXXX2
0xXXX3
CANxRIDR1 Write:
Extended ID
Standard ID
Read:
Read:
ID14
ID6
ID13
ID5
ID12
ID4
ID11
ID3
ID10
ID2
CANxRIDR2 Write:
Extended ID
Standard ID
Read:
Read:
ID1
ID0
RTR
CANxRIDR3 Write:
Freescale Semiconductor
MC9S12Q128
Rev 1.10
39
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
Table 1-2. Detailed MSCAN Foreground Receive and Transmit Buffer Layout (continued)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
0xXXX4– CANxRDSR0–
0xXXXB CANxRDSR7
DLC3
DLC2
DLC1
DLC0
0xXXXC
0xXXXD
CANRxDLR
Reserved
Read: TSR15
Write:
TSR14
TSR6
TSR13
TSR5
TSR12
TSR4
TSR11
TSR3
TSR10
TSR2
TSR9
TSR1
TSR8
TSR0
0xXXXE CANxRTSRH
Read: TSR7
Write:
0xXXXF CANxRTSRL
Extended ID
Read:
ID28
ID27
ID9
ID26
ID8
ID25
ID7
ID24
ID6
ID23
ID5
ID22
ID4
ID21
ID3
CANxTIDR0
0xxx10
Write:
Read:
ID10
Standard ID
Write:
Extended ID
Read:
ID20
ID19
ID1
ID18
ID0
SRR=1
RTR
IDE=1
IDE=0
ID10
ID17
ID16
ID15
CANxTIDR1
0xxx11
Write:
Read:
ID2
Standard ID
Write:
Extended ID
Read:
ID14
ID13
ID12
ID11
ID9
ID1
ID8
ID0
ID7
CANxTIDR2
0xxx12
Write:
Read:
Write:
Standard ID
Extended ID
Read:
ID6
ID5
ID4
ID3
ID2
RTR
CANxTIDR3
0xxx13
Write:
Read:
Write:
Standard ID
Read:
DB7
0xxx14– CANxTDSR0–
DB6
DB5
DB4
DB3
DB2
DB1
DB0
0xxx1B
CANxTDSR7
Write:
Read:
Write:
0xxx1C
CANxTDLR
DLC3
DLC2
DLC1
DLC0
Read:
PRIO7
Write:
0xxx1D CONxTTBPR
PRIO6
TSR14
PRIO5
TSR13
PRIO4
TSR12
PRIO3
TSR11
PRIO2
TSR10
PRIO1
TSR9
PRIO0
TSR8
Read: TSR15
Write:
0xxx1E
0xxx1F
CANxTTSRH
CANxTTSRL
Read: TSR7
Write:
TSR6
TSR5
TSR4
TSR3
TSR2
TSR1
TSR0
0x0180–0x023F
Reserved
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
0
0
0
0
0
0
0
0
0x0180–
0x023F
Reserved
40
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x0240–0x027F
PIM (Port Interface Module) (Sheet 1 of 3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
0x0240
PTT
PTT7
PTT6
PTT5
PTT4
PTT3
PTT2
PTT1
PTT0
Read: PTIT7
Write:
PTIT6
PTIT5
PTIT4
PTIT3
PTIT2
PTIT1
PTIT0
0x0241
0x0242
0x0243
0x0244
0x0245
0x0246
0x0247
0x0248
0x0249
0x024A
0x024B
0x024C
0x024D
0x024E
0x024F
0x0250
0x0251
0x0252
0x0253
0x0254
0x0255
PTIT
DDRT
RDRT
PERT
Read:
DDRT7
Write:
DDRT7
RDRT6
PERT6
DDRT5
RDRT5
PERT5
DDRT4
RDRT4
PERT4
DDRT3
RDRT3
PERT3
DDRT2
RDRT2
PERT2
DDRT1
RDRT1
PERT1
DDRT0
RDRT0
PERT0
Read:
RDRT7
Write:
Read:
PERT7
Write:
Read:
PPST7
Write:
PPST
PPST6
0
PPST5
0
PPST4
0
PPST3
0
PPST2
0
PPST1
0
PPST0
0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Reserved
MODRR
PTS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
MODRR4 MODRR3 MODRR2 MODRR1 MODRR0
0
PTS3
PTS2
PTS1
PTS0
0
0
0
0
0
0
0
PTIS3
PTIS2
PTIS1
PTIS0
PTIS
DDRS
RDRS
PERS
PPSS
WOMS
Reserved
PTM
DDRS3
RDRS3
PERS3
PPSS3
DDRS2
RDRS2
PERS2
PPSS2
DDRS1
RDRS1
PERS1
PPSS1
DDRS0
RDRS0
PERS0
PPSS0
WOMS3 WOMS2 WOMS1 WOMS0
0
0
0
0
PTM5
PTM4
PTM3
PTM2
PTM1
PTM0
PTIM5
PTIM4
PTIM3
PTIM2
PTIM1
PTIM0
PTIM
DDRM
RDRM
PERM
PPSM
DDRM5 DDRM4 DDRM3 DDRM2 DDRM1 DDRM0
RDRM5 RDRM4 RDRM3 RDRM2 RDRM1 RDRM0
PERM5
PPSM5
PERM4
PPSM4
PERM3
PPSM3
PERM2
PPSM2
PERM1
PPSM1
PERM0
PPSM0
Freescale Semiconductor
MC9S12Q128
Rev 1.10
41
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x0240–0x027F
PIM (Port Interface Module) (Sheet 2 of 3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
0
0
0x0256
WOMM
WOMM5 WOMM4 WOMM3 WOMM2 WOMM1 WOMM0
0
0
0
0
0
0
0
0
0x0257
0x0258
0x0259
0x025A
0x025B
0x025C
0x025D
0x025E
0x025F
0x0260
0x0261
0x0262
0x0263
0x0264
0x0265
0x0266
0x0267
0x0268
0x0269
0x026A
0x026B
0x026C
Reserved
PTP
PTP7
PTP6
PTP5
PTP4
PTP3
PTP2
PTP1
PTP0
Read: PTIP7
Write:
PTIP6
PTIP5
PTIP4
PTIP3
PTIP2
PTIP1
PTIP0
PTIP
Read:
DDRP7
Write:
DDRP
DDRP7
RDRP6
PERP6
PPSP6
PIEP6
DDRP5
RDRP5
PERP5
PPSP5
PIEP5
DDRP4
RDRP4
PERP4
PPSP4
PIEP4
DDRP3
RDRP3
PERP3
PPSP3
PIEP3
DDRP2
RDRP2
PERP2
PPSP2
PIEP2
DDRP1
RDRP1
PERP1
PPSP1
PIEP1
DDRP0
RDRP0
PERP0
PPSS0
PIEP0
Read:
RDRP7
Write:
RDRP
Read:
PERP7
Write:
PERP
Read:
PPSP7
Write:
PPSP
Read:
PIEP7
Write:
PIEP
Read:
PIFP7
Write:
PIFP
PIFP6
0
PIFP5
0
PIFP4
0
PIFP3
0
PIFP2
0
PIFP1
0
PIFP0
0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0
0
0
0
0
0
0
0
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
PTJ
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PTJ7
PTJ6
Read: PTIJ7
Write:
PTIJ6
PTIJ
Read:
DDRJ7
Write:
DDRJ
DDRJ7
RDRJ6
PERJ6
Read:
RDRJ7
Write:
RDRJ
Read:
PERJ7
Write:
PERJ
42
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
0x0240–0x027F
PIM (Port Interface Module) (Sheet 3 of 3)
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0
0
0
0
0
0
0x026D
PPSJ
PPSJ7
PPSJ6
0
0
0
0
0
0
0
0
0
0
0
0
0x026E
0x026F
0x0270
0x0271
0x0272
0x0273
0x0274
0x0275
PIEJ
PIFJ
PIEJ7
PIFJ7
PTAD7
PIEJ6
PIFJ6
PTAD
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
PTIJ7
Read: PTIAD7
Write:
PTIAD6
PTIAD5
PTIAD4
PTIAD3
PTIAD2
PTIAD1
PTIAD
DDRAD
RDRAD
PERAD
PPSAD
Reserved
Read:
DDRAD7 DDRAD6 DDRAD5 DDRAD4 DDRAD3 DDRAD2 DDRAD1 DDRAD0
RDRAD7 RDRAD6 RDRAD5 RDRAD4 RDRAD3 RDRAD2 RDRAD1 RDRAD0
PERAD7 PERAD6 PERAD5 PERAD4 PERAD3 PERAD2 PERAD1 PERAD0
PPSAD7 PPSAD6 PPSAD5 PPSAD4 PPSAD3 PPSAD2 PPSAD1 PPSAD0
Write:
Read:
Write:
Read:
Write:
Read:
Write:
Read:
Write:
0
0
0
0
0
0
0
0
0x0276-
0x027F
0x0280–0x03FF
Reserved Space
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Read:
Write:
Read:
Write:
0
0
0
0
0
0
0
0
0x0280–
0x2FF
Reserved
0
0
0
0
0
0
0
0
0x0300
–0x03FF
Unimplemented
Freescale Semiconductor
MC9S12Q128
Rev 1.10
43
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
1.2.3
Part ID Assignments
The part ID is located in two 8-bit registers PARTIDH and PARTIDL (addresses 0x001A and ox001B after
reset). The read-only value is a unique part ID for each revision of the chip. Table 1-3 shows the assigned
part ID numbers for production mask sets.
Table 1-3. Assigned Part ID Numbers
MC9S12Q32
MC9S12Q32
2L45J
1M34C
2L09S
0M66G
2L45J
$3302
$3311
$3102
$3103
$3302
$3311
$3102
$3103
MC9S12Q64, MC9S12Q96, MC9S12Q128
MC9S12Q64, MC9S12Q96, MC9S12Q128
MC3S12Q32
MC3S12Q32
1M34C
2L09S
0M66G
MC3S12Q64, MC3S12Q96, MC3S12Q128
MC3S12Q64, MC3S12Q96, MC3S12Q128
The device memory sizes are located in two 8-bit registers MEMSIZ0 and MEMSIZ1 (addresses 0x001C
and 0x001D after reset). Table 1-4 shows the read-only values of these registers. Refer to Module Mapping
and Control (MMC) Block Guide for further details.
Table 1-4. Memory Size Registers
Device
Register Name
Value
MEMSIZ0
MEMSIZ1
MEMSIZ0
MEMSIZ1
MEMSIZ0
MEMSIZ1
MEMSIZ0
MEMSIZ1
$00
$80
$01
$C0
$01
$C0
$01
$C0
MC9S12Q32
MC9S12Q64
MC9S12Q96
MC9S12Q128
44
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
1.3
Signal Description
Device Pinouts
1.3.1
Figure 1-6. Pin Assignments in 80-Pin QFP
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
PW3/KWP3/PP3
PW2/KWP2/PP2
PW1/KWP1/PP1
PW0/KWP0/PP0
PW0/PT0
1
VRH
VDDA
2
3
PAD07/AN07
PAD06/AN06
4
5
PAD05/AN05
PAD04/AN04
PW1/PT1
6
PW2/IOC2/PT2
PW3/IOC3/PT3
VDD1
7
PAD03/AN03
PAD02/AN02
8
9
PAD01/AN01
PAD00/AN00
VSS1
IOC4/PT4
10
11
12
13
14
15
16
17
18
19
20
MC9S12Q128-Family
VSS2
VDD2
IOC5/PT5
IOC6/PT6
IOC7/PT7
PA7/ADDR15/DATA15
PA6/ADDR14/DATA14
PA5/ADDR13/DATA13
PA4/ADDR12/DATA12
PA3/ADDR11/DATA11
PA2/ADDR10/DATA10
PA1/ADDR9/DATA9
PA0/ADDR8/DATA8
MODC/TAGHI/BKGD
ADDR0/DATA0/PB0
ADDR1/DATA1/PB1
ADDR2/DATA2/PB2
ADDR3/DATA3/PB3
ADDR4/DATA4/PB4
Signals shown in Bold are not available on the 52 or 48 Pin Package
Signals shown in Bold Italic are available in the 52, but not the 48 Pin Package
The MODRR register within the PIM allows for mapping of PWM channels to Port T in the absence of
Port P pins for the low pin count packages. For the 80QFP package option it is recommended not to use
MODRR since this is intended to support PWM channel availability in low pin count packages. Note that
when mapping PWM channels to Port T in an 80QFP option, the associated PWM channels are then
mapped to both Port P and Port T
Freescale Semiconductor
MC9S12Q128
Rev 1.10
45
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
VRH
39
38
37
36
35
34
33
32
31
30
29
28
27
PW3/KWP3/PP3
PW0/PT0
1
VDDA
2
PW1/PT1
PAD07/AN07
PAD06/AN06
PAD05/AN05
3
PW2/IOC2/PT2
PW3/IOC3/PT3
4
5
PAD04/AN04
PAD03/AN03
PAD02/AN02
PAD01/AN01
PAD00/AN00
PA2
VDD1
VSS1
6
MC9S12Q128-Family
7
IOC4/PT4
IOC5/PT5
IOC6/PT6
IOC7/PT7
MODC/BKGD
PB4
8
9
10
11
12
13
PA1
PA0
* Signals shown in Bold italic are not available on the 48 Pin Package
Figure 1-7. Pin Assignments in 52-Pin LQFP
46
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
PW0/PT0
PW1/PT1
PW2/IOC2/PT2
PW3/IOC3/PT3
VDD1
VRH
1
36
35
34
33
32
31
30
29
28
27
26
25
2
VDDA
3
PAD07/AN07
PAD06/AN06
PAD05/AN05
4
5
PAD04/AN04
PAD03/AN03
PAD02/AN02
PAD01/AN01
PAD00/AN00
PA0
VSS1
6
MC9S12Q128-Family
IOC4/PT4
IOC5/PT5
IOC6/PT6
IOC7/PT7
MODC/BKGD
PB4
7
8
9
10
11
12
XIRQ/PE0
Figure 1-8. Pin Assignments in 48-Pin LQFP
Freescale Semiconductor
MC9S12Q128
Rev 1.10
47
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
1.3.2
Signal Properties Summary
Table 1-5. Signal Properties
Internal Pull
Resistor
Pin Name
Pin Name
Pin Name
Power
Description
Function 1 Function 2 Function 3 Domain
Reset
CTRL
State
EXTAL
XTAL
RESET
XFC
—
—
—
—
VDDPLL
VDDPLL
VDDX
NA
NA
NA
NA
Oscillator pins
—
—
None
NA
None
NA
External reset pin
PLL loop filter pin
Test pin only
—
—
VDDPLL
VSSX
TEST
BKGD
PE7
VPP
—
NA
NA
MODC
NOACC
TAGHI
XCLKS
VDDX
Up
Up
Background debug, mode pin, tag signal high
Port E I/O pin, access, clock select
Port E I/O pin and pipe status
VDDX
PUCR
Up
While RESET
pin is low: Down
PE6
PE5
PE4
PE3
PE2
IPIPE1
IPIPE0
ECLK
LSTRB
R/W
MODB
MODA
—
VDDX
VDDX
VDDX
VDDX
VDDX
While RESET
pin is low: Down
Port E I/O pin and pipe status
Mode
PUCR
Port E I/O pin, bus clock output
Dep(1)
Mode
PUCR
Port E I/O pin, low strobe, tag signal low
Port E I/O pin, R/W in expanded modes
TAGLO
—
Dep1
Mode
PUCR
Dep1
PE1
PE0
IRQ
—
—
VDDX
VDDX
PUCR
PUCR
Up
Up
Port E input, external interrupt pin
XIRQ
Port E input, non-maskable interrupt pin
Port A I/O pin and multiplexed address/data
ADDR[15:1/
DATA[15:1]
PA[7:3]
PA[2:1]
PA[0]
—
—
VDDX
VDDX
VDDX
VDDX
VDDX
VDDX
VDDA
VDDX
VDDX
VDDX
VDDX
PUCR
PUCR
PUCR
PUCR
PUCR
PUCR
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
ADDR[10:9/
DATA[10:9]
Port A I/O pin and multiplexed address/data
Port A I/O pin and multiplexed address/data
Port B I/O pin and multiplexed address/data
Port B I/O pin and multiplexed address/data
Port B I/O pin and multiplexed address/data
Port AD I/O pins and ATD inputs
ADDR[8]/
DATA[8]
—
ADDR[7:5]/
DATA[7:5]
PB[7:5]
PB[4]
—
ADDR[4]/
DATA[4]
—
ADDR[3:0]/
DATA[3:0]
PB[3:0]
PAD[7:0]
PP[7]
—
PERAD/P
PSAD
AN[7:0]
KWP[7]
KWP[6]
KWP[5]
KWP[4:3]
—
PERP/
PPSP
Port P I/O pins and keypad wake-up
—
PERP/
PPSP
Port P I/O pins, keypad wake-up, and ROMON
enable.
PP[6]
ROMCTL
PW5
PW[3]
PERP/
PPSP
Port P I/O pin, keypad wake-up, PW5 output
PP[5]
PERP/
PPSP
Port P I/O pin, keypad wake-up, PWM output
PP[4:3]
48
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
Table 1-5. Signal Properties (continued)
Internal Pull
Resistor
Pin Name
Pin Name
Pin Name
Power
Description
Function 1 Function 2 Function 3 Domain
Reset
CTRL
State
PERP/
PPSP
Port P I/O pins, keypad wake-up, PWM outputs
Port J I/O pins and keypad wake-up
Port M I/O pin and SPI SCK signal
Port M I/O pin and SPI MOSI signal
Port M I/O pin and SPI SS signal
Port M I/O pin and SPI MISO signal
Port M I/O pin and CAN transmit signal
Port M I/O pin and CAN receive signal
Port S I/O pins
PP[2:0]
PJ[7:6]
PM5
KWP[2:0]
KWJ[7:6]
SCK
PW[2:0]
VDDX
VDDX
VDDX
VDDX
VDDX
VDDX
VDDX
VDDX
VDDX
VDDX
VDDX
VDDX
VDDX
Disabled
PERJ/
PPSJ
—
—
Disabled
Up
PERM/
PPSM
PERM/
PPSM
PM4
MOSI
SS
—
Up
PERM/
PPSM
PM3
—
Up
PERM/
PPSM
PM2
MISO
TXCAN
RXCAN
—
—
Up
PERM/
PPSM
PM1
—
Up
PERM/
PPSM
PM0
—
Up
PERS/
PPSS
PS[3:2]
PS1
—
Up
PERS/
PPSS
Port S I/O pin and SCI transmit signal
Port S I/O pin and SCI receive signal
Port T I/O pins shared with timer (TIM)
Port T I/O pins shared with timer and PWM
TXD
—
Up
PERS/
PPSS
PS0
RXD
—
Up
PERT/
PPST
PT[7:5]
IOC[7:5]
—
Disabled
PERT/
PPST
PT[4:0]
IOC[4:2]
PW[3:0]
Disabled
1. The Port E output buffer enable signal control at reset is determined by the PEAR register and is mode dependent. For
example, in special test mode RDWE = LSTRE = 1 which enables the PE[3:2] output buffers and disables the pull-ups. Refer
to S12_MEBI user guide for PEAR register details.
1.3.3
Pin Initialization for 48- and 52-Pin LQFP Bond Out Versions
Not Bonded Pins:
If the port pins are not bonded out in the chosen package the user should initialize the registers to
be inputs with enabled pull resistance to avoid excess current consumption. This applies to the
following pins:
(48LQFP): Port A[7:1], Port B[7:5], Port B[3:0], PortE[6,5,3,2], Port P[7:6], PortP[4:0], Port
J[7:6], PortS[3:2]
(52LQFP): Port A[7:3], Port B[7:5], Port B[3:0], PortE[6,5,3,2], Port P[7:6], PortP[2:0], Port
J[7:6], PortS[3:2]
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1.3.4
Detailed Signal Descriptions
EXTAL, XTAL — Oscillator Pins
1.3.4.1
EXTAL and XTAL are the crystal driver and external clock pins. On reset all the device clocks are derived
from the EXTAL input frequency. XTAL is the crystal output.
1.3.4.2
RESET — External Reset Pin
RESET is an active low bidirectional control signal that acts as an input to initialize the MCU to a known
start-up state. It also acts as an open-drain output to indicate that an internal failure has been detected in
either the clock monitor or COP watchdog circuit. External circuitry connected to the RESET pin should
not include a large capacitance that would interfere with the ability of this signal to rise to a valid logic one
within 32 ECLK cycles after the low drive is released. Upon detection of any reset, an internal circuit
drives the RESET pin low and a clocked reset sequence controls when the MCU can begin normal
processing.
1.3.4.3
TEST / VPP — Test Pin
This pin is reserved for test and must be tied to V in all applications.
SS
1.3.4.4
XFC — PLL Loop Filter Pin
Dedicated pin used to create the PLL loop filter. See CRG BUG for more detailed information.PLL loop
filter. Please ask your Motorola representative for the interactive application note to compute PLL loop
filter elements. Any current leakage on this pin must be avoided.
XFC
R
0
C
P
MCU
C
S
V
V
DDPLL
DDPLL
Figure 1-9. PLL Loop Filter Connections
1.3.4.5
BKGD / TAGHI / MODC — Background Debug, Tag High, and Mode Pin
The BKGD / TAGHI / MODC pin is used as a pseudo-open-drain pin for the background debug
communication. In MCU expanded modes of operation when instruction tagging is on, an input low on
this pin during the falling edge of E-clock tags the high half of the instruction word being read into the
instruction queue. It is also used as a MCU operating mode select pin at the rising edge during reset, when
the state of this pin is latched to the MODC bit.
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1.3.4.6
PA[7:0] / ADDR[15:8] / DATA[15:8] — Port A I/O Pins
PA7–PA0 are general purpose input or output pins,. In MCU expanded modes of operation, these pins are
used for the multiplexed external address and data bus. PA[7:1] pins are not available in the 48-pin package
version. PA[7:3] are not available in the 52-pin package version.
1.3.4.7
PB[7:0] / ADDR[7:0] / DATA[7:0] — Port B I/O Pins
PB7–PB0 are general purpose input or output pins. In MCU expanded modes of operation, these pins are
used for the multiplexed external address and data bus. PB[7:5] and PB[3:0] pins are not available in the
48-pin nor 52-pin package version.
1.3.4.8
PE7 / NOACC / XCLKS — Port E I/O Pin 7
PE7 is a general purpose input or output pin. During MCU expanded modes of operation, the NOACC
signal, when enabled, is used to indicate that the current bus cycle is an unused or “free” cycle. This signal
will assert when the CPU is not using the bus.The XCLKS is an input signal which controls whether a
crystal in combination with the internal Colpitts (low power) oscillator is used or whether Pierce
oscillator/external clock circuitry is used. The state of this pin is latched at the rising edge of RESET. If
the input is a logic low the EXTAL pin is configured for an external clock drive or a Pierce oscillator. If
input is a logic high a Colpitts oscillator circuit is configured on EXTAL and XTAL. Since this pin is an
input with a pull-up device during reset, if the pin is left floating, the default configuration is a Colpitts
oscillator circuit on EXTAL and XTAL.
EXTAL
1
CDC
C
1
MCU
Crystal or
Ceramic Resonator
XTAL
C
2
V
SSPLL
1. Due to the nature of a translated ground Colpitts oscillator a DC voltage
bias is applied to the crystal. Please contact the crystal manufacturer for
crystal DC.
Figure 1-10. Colpitts Oscillator Connections (PE7 = 1)
EXTAL
C
1
MCU
R
Crystal or
B
Ceramic Resonator
1
R
S
XTAL
C
2
V
SSPLL
1. RS can be zero (shorted) when used with higher frequency crystals,
refer to manufacturer’s data.
Figure 1-11. Pierce Oscillator Connections (PE7 = 0)
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CMOS Compatible
External Oscillator
EXTAL
MCU
(V
Level)
DDPLL
XTAL
Not Connected
Figure 1-12. External Clock Connections (PE7 = 0)
1.3.4.9
PE6 / MODB / IPIPE1 — Port E I/O Pin 6
PE6 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODB bit at the rising edge of RESET. This pin is shared with the
instruction queue tracking signal IPIPE1. This pin is an input with a pull-down device which is only active
when RESET is low. PE[6] is not available in the 48- / 52-pin package versions.
1.3.4.10 PE5 / MODA / IPIPE0 — Port E I/O Pin 5
PE5 is a general purpose input or output pin. It is used as a MCU operating mode select pin during reset.
The state of this pin is latched to the MODA bit at the rising edge of RESET. This pin is shared with the
instruction queue tracking signal IPIPE0. This pin is an input with a pull-down device which is only active
when RESET is low. This pin is not available in the 48- / 52-pin package versions.
1.3.4.11 PE4 / ECLK— Port E I/O Pin [4] / E-Clock Output
ECLK is the output connection for the internal bus clock. It is used to demultiplex the address and data in
expanded modes and is used as a timing reference. ECLK frequency is equal to 1/2 the crystal frequency
out of reset. The ECLK pin is initially configured as ECLK output with stretch in all expanded modes. The
E clock output function depends upon the settings of the NECLK bit in the PEAR register, the IVIS bit in
the MODE register and the ESTR bit in the EBICTL register. All clocks, including the E clock, are halted
when the MCU is in stop mode. It is possible to configure the MCU to interface to slow external memory.
ECLK can be stretched for such accesses. Reference the MISC register (EXSTR[1:0] bits) for more
information. In normal expanded narrow mode, the E clock is available for use in external select decode
logic or as a constant speed clock for use in the external application system. Alternatively PE4 can be used
as a general purpose input or output pin.
1.3.4.12 PE3 / LSTRB — Port E I/O Pin [3] / Low-Byte Strobe (LSTRB)
In all modes this pin can be used as a general-purpose I/O and is an input with an active pull-up out of
reset. If the strobe function is required, it should be enabled by setting the LSTRE bit in the PEAR register.
This signal is used in write operations. Therefore external low byte writes will not be possible until this
function is enabled. This pin is also used as TAGLO in special expanded modes and is multiplexed with
the LSTRB function. This pin is not available in the 48- / 52-pin package versions.
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1.3.4.13 PE2 / R/W — Port E I/O Pin [2] / Read/Write
In all modes this pin can be used as a general-purpose I/O and is an input with an active pull-up out of
reset. If the read/write function is required it should be enabled by setting the RDWE bit in the PEAR
register. External writes will not be possible until enabled. This pin is not available in the 48- / 52-pin
package versions.
1.3.4.14 PE1 / IRQ — Port E Input Pin [1] / Maskable Interrupt Pin
The IRQ input provides a means of applying asynchronous interrupt requests to the MCU. Either falling
edge-sensitive triggering or level-sensitive triggering is program selectable (INTCR register). IRQ is
always enabled and configured to level-sensitive triggering out of reset. It can be disabled by clearing
IRQEN bit (INTCR register). When the MCU is reset the IRQ function is masked in the condition code
register. This pin is always an input and can always be read. There is an active pull-up on this pin while in
reset and immediately out of reset. The pull-up can be turned off by clearing PUPEE in the PUCR register.
1.3.4.15 PE0 / XIRQ — Port E input Pin [0] / Non Maskable Interrupt Pin
The XIRQ input provides a means of requesting a non-maskable interrupt after reset initialization. During
reset, the X bit in the condition code register (CCR) is set and any interrupt is masked until MCU software
enables it. Because the XIRQ input is level sensitive, it can be connected to a multiple-source wired-OR
network. This pin is always an input and can always be read. There is an active pull-up on this pin while
in reset and immediately out of reset. The pull-up can be turned off by clearing PUPEE in the PUCR
register.
1.3.4.16 PAD[7:0] / AN[7:0] — Port AD I/O Pins [7:0]
PAD7–PAD0 are general purpose I/O pins and also analog inputs for the analog to digital converter. In
order to use a PAD pin as a standard input, the corresponding ATDDIEN register bit must be set. These
bits are cleared out of reset to configure the PAD pins for A/D operation.
When the A/D converter is active in multi-channel mode, port inputs are scanned and converted
irrespective of Port AD configuration. Thus Port AD pins that are configured as digital inputs or digital
outputs are also converted in the A/D conversion sequence.
1.3.4.17 PP[7] / KWP[7] — Port P I/O Pin [7]
PP7 is a general purpose input or output pin, shared with the keypad interrupt function. When configured
as an input, it can generate interrupts causing the MCU to exit stop or wait mode. This pin is not available
in the 48- / 52-pin package versions.
1.3.4.18 PP[6] / KWP[6]/ROMCTL — Port P I/O Pin [6]
PP6 is a general purpose input or output pin, shared with the keypad interrupt function. When configured
as an input, it can generate interrupts causing the MCU to exit stop or wait mode. This pin is not available
in the 48- / 52-pin package versions. During MCU expanded modes of operation, this pin is used to enable
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the Flash EEPROM memory in the memory map (ROMCTL). At the rising edge of RESET, the state of
this pin is latched to the ROMON bit.
•
•
PP6 = 1 in emulation modes equates to ROMON = 0 (ROM space externally mapped)
PP6 = 0 in expanded modes equates to ROMON = 0 (ROM space externally mapped)
1.3.4.19 PP[5:0] / KWP[5:0] / PW[3:0] — Port P I/O Pins [5:0]
PP[5:0] are general purpose input or output pins, shared with the keypad interrupt function. When
configured as inputs, they can generate interrupts causing the MCU to exit stop or wait mode.
PP[3:0] are also shared with the PWM output signals, PW[3:0].Pins PP[2:0] are only available in the 80-
pin package version. Pins PP[4:3] are not available in the 48-pin package version.
1.3.4.20 PJ[7:6] / KWJ[7:6] — Port J I/O Pins [7:6]
PJ[7:6] are general purpose input or output pins, shared with the keypad interrupt function. When
configured as inputs, they can generate interrupts causing the MCU to exit stop or wait mode. These pins
are not available in the 48-pin package version nor in the 52-pin package version.
1.3.4.21 PM5 / SCK — Port M I/O Pin 5
PM5 is a general purpose input or output pin and also the serial clock pin SCK for the serial peripheral
interface (SPI).
1.3.4.22 PM4 / MOSI — Port M I/O Pin 4
PM4 is a general purpose input or output pin and also the master output (during master mode) or slave
input (during slave mode) pin for the serial peripheral interface (SPI).
1.3.4.23 PM3 / SS — Port M I/O Pin 3
PM3 is a general purpose input or output pin and also the slave select pin SS for the serial peripheral
interface (SPI).
1.3.4.24 PM2 / MISO — Port M I/O Pin 2
PM2 is a general purpose input or output pin and also the master input (during master mode) or slave
output (during slave mode) pin for the serial peripheral interface (SPI).
1.3.4.25 PM1 / TXCAN — Port M I/O Pin 1
PM1 is a general purpose input or output pin and the transmit pin, TXCAN, of the CAN module if
available.
1.3.4.26 PM0 / RXCAN — Port M I/O Pin 0
PM0 is a general purpose input or output pin and the receive pin, RXCAN, of the CAN module if available.
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1.3.4.27 PS[3:2] — Port S I/O Pins [3:2]
PS3 and PS2 are general purpose input or output pins. These pins are not available in the 48- / 52-pin
package versions.
1.3.4.28 PS1 / TXD — Port S I/O Pin 1
PS1 is a general purpose input or output pin and the transmit pin, TXD, of serial communication interface
(SCI).
1.3.4.29 PS0 / RXD — Port S I/O Pin 0
PS0 is a general purpose input or output pin and the receive pin, RXD, of serial communication interface
(SCI).
1.3.4.30 PT[7:5] / IOC[7:5] — Port T I/O Pins [7:5]
PT7–PT5 are general purpose input or output pins. They can also be configured as the timer system input
capture or output compare pins IOC7-IOC5.
1.3.4.31 PT[4:0] / IOC[4:2] / PW[3:0]— Port T I/O Pins [4:0]
PT4–PT0 are general purpose input or output pins. They can also be configured as the timer system input
capture or output compare pins IOC[n] or as the PWM outputs PW[n].
1.3.5
Power Supply Pins
1.3.5.1
VDDX,VSSX — Power and Ground Pins for I/O Drivers
External power and ground for I/O drivers. Bypass requirements depend on how heavily the MCU pins are
loaded.
1.3.5.2
VDDR, VSSR — Power and Ground Pins for I/O Drivers and for Internal
Voltage Regulator
External power and ground for the internal voltage regulator. Connecting V
internal voltage regulator.
to ground disables the
DDR
1.3.5.3
VDD1, VDD2, VSS1, VSS2 — Internal Logic Power Pins
Power is supplied to the MCU through V and V . This 2.5V supply is derived from the internal voltage
DD
SS
regulator. There is no static load on those pins allowed. The internal voltage regulator is turned off, if V
DDR
is tied to ground.
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1.3.5.4
VDDA, VSSA — Power Supply Pins for ATD and VREG
V
, V
are the power supply and ground input pins for the voltage regulator reference and the analog
DDA SSA
to digital converter.
1.3.5.5
VRH, VRL — ATD Reference Voltage Input Pins
V
and V are the reference voltage input pins for the analog to digital converter.
RL
RH
1.3.5.6
VDDPLL, VSSPLL — Power Supply Pins for PLL
Provides operating voltage and ground for the oscillator and the phased-locked loop. This allows the
supply voltage to the oscillator and PLL to be bypassed independently. This 2.5V voltage is generated by
the internal voltage regulator.
Table 1-6. Power and Ground Connection Summary
Nominal
Voltage (V)
Mnemonic
Description
VDD1, VDD2
VSS1, VSS2
2.5
Internal power and ground generated by internal regulator. These also allow an external source
to supply the core VDD/VSS voltages and bypass the internal voltage regulator.
0
In the 48 and 52 LQFP packages VDD2 and VSS2 are not available.
External power and ground, supply to internal voltage regulator.
VDDR
VSSR
VDDX
VSSX
VDDA
VSSA
VRH
5.0
0
5.0
0
External power and ground, supply to pin drivers.
5.0
0
Operating voltage and ground for the analog-to-digital converters and the reference for the
internal voltage regulator, allows the supply voltage to the A/D to be bypassed independently.
5.0
0
Reference voltage low for the ATD converter.
In the 48 and 52 LQFP packages VRL is bonded to VSSA
.
VRL
VDDPLL
2.5
Provides operating voltage and ground for the phased-locked loop. This allows the supply voltage
to the PLL to be bypassed independently. Internal power and ground generated by internal
regulator.
VSSPLL
0
NOTE
All V pins must be connected together in the application. Because fast
SS
signal transitions place high, short-duration current demands on the power
supply, use bypass capacitors with high-frequency characteristics and place
them as close to the MCU as possible. Bypass requirements depend on
MCU pin load.
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1.4
System Clock Description
The clock and reset generator provides the internal clock signals for the core and all peripheral modules.
Figure 1-13 shows the clock connections from the CRG to all modules. Consult the CRG Block User
Guide for details on clock generation.
S12_CORE
Core Clock
Flash
RAM
TIM
ATD
PIM
EXTAL
SCI
SPI
Bus Clock
CRG
MSCAN
Not on 9S12GC
Oscillator Clock
XTAL
VREG
TPM
Figure 1-13. Clock Connections
1.5
Modes of Operation
Eight possible modes determine the device operating configuration. Each mode has an associated default
memory map and external bus configuration controlled by a further pin.
Three low power modes exist for the device.
1.5.1
Chip Configuration Summary
The operating mode out of reset is determined by the states of the MODC, MODB, and MODA pins during
reset. The MODC, MODB, and MODA bits in the MODE register show the current operating mode and
provide limited mode switching during operation. The states of the MODC, MODB, and MODA pins are
latched into these bits on the rising edge of the reset signal. The ROMCTL signal allows the setting of the
ROMON bit in the MISC register thus controlling whether the internal Flash is visible in the memory map.
ROMON = 1 mean the Flash is visible in the memory map. The state of the ROMCTL pin is latched into
the ROMON bit in the MISC register on the rising edge of the reset signal.
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Table 1-7. Mode Selection
BKGD =
MODC
PE6 =
MODB MODA
PE5 =
PP6 =
ROMCTL
ROMON
Mode Description
Bit
Special Single Chip, BDM allowed and ACTIVE. BDM is allowed in
all other modes but a serial command is required to make BDM
active.
0
0
0
X
1
0
1
X
0
1
X
0
1
1
0
0
1
0
1
0
1
Emulation Expanded Narrow, BDM allowed
0
0
0
1
1
0
1
1
0
0
1
0
1
0
1
Special Test (Expanded Wide), BDM allowed
Emulation Expanded Wide, BDM allowed
Normal Single Chip, BDM allowed
Normal Expanded Narrow, BDM allowed
Peripheral; BDM allowed but bus operations would cause bus
conflicts (must not be used)
1
1
1
1
0
1
X
1
0
1
0
1
Normal Expanded Wide, BDM allowed
For further explanation on the modes refer to the S12_MEBI block guide.
Table 1-8. Clock Selection Based on PE7
PE7 = XCLKS
Description
Colpitts Oscillator selected
Pierce Oscillator/external clock selected
1
0
1.5.2
Security
The device will make available a security feature preventing the unauthorized read and write of the
memory contents. This feature allows:
•
•
•
Protection of the contents of FLASH,
Operation in single-chip mode,
Operation from external memory with internal FLASH disabled.
The user must be reminded that part of the security must lie with the user’s code. An extreme example
would be user’s code that dumps the contents of the internal program. This code would defeat the purpose
of security. At the same time the user may also wish to put a back door in the user’s program. An example
of this is the user downloads a key through the SCI which allows access to a programming routine that
updates parameters.
1.5.2.1
Securing the Microcontroller
Once the user has programmed the FLASH, the part can be secured by programming the security bits
located in the FLASH module. These non-volatile bits will keep the part secured through resetting the part
and through powering down the part.
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The security byte resides in a portion of the Flash array.
Check the Flash Block User Guide for more details on the security configuration.
1.5.2.2
Operation of the Secured Microcontroller
Normal Single Chip Mode
1.5.2.2.1
This will be the most common usage of the secured part. Everything will appear the same as if the part was
not secured with the exception of BDM operation. The BDM operation will be blocked.
1.5.2.2.2
Executing from External Memory
The user may wish to execute from external space with a secured microcontroller. This is accomplished
by resetting directly into expanded mode. The internal FLASH will be disabled. BDM operations will be
blocked.
1.5.2.3
Unsecuring the Microcontroller
In order to unsecure the microcontroller, the internal FLASH must be erased. This can be done through an
external program in expanded mode or via a sequence of BDM commands. Unsecuring is also possible via
the Backdoor Key Access. Refer to Flash Block Guide for details.
Once the user has erased the FLASH, the part can be reset into special single chip mode. This invokes a
program that verifies the erasure of the internal FLASH. Once this program completes, the user can erase
and program the FLASH security bits to the unsecured state. This is generally done through the BDM, but
the user could also change to expanded mode (by writing the mode bits through the BDM) and jumping to
an external program (again through BDM commands). Note that if the part goes through a reset before the
security bits are reprogrammed to the unsecure state, the part will be secured again.
1.5.3
Low-Power Modes
The microcontroller features three main low power modes. Consult the respective Block User Guide for
information on the module behavior in stop, pseudo stop, and wait mode. An important source of
information about the clock system is the Clock and Reset Generator User Guide (CRG).
1.5.3.1
Stop
Executing the CPU STOP instruction stops all clocks and the oscillator thus putting the chip in fully static
mode. Wake up from this mode can be done via reset or external interrupts.
1.5.3.2
Pseudo Stop
This mode is entered by executing the CPU STOP instruction. In this mode the oscillator is still running
and the real time interrupt (RTI) or watchdog (COP) sub module can stay active. Other peripherals are
turned off. This mode consumes more current than the full stop mode, but the wake up time from this mode
is significantly shorter.
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1.5.3.3
Wait
This mode is entered by executing the CPU WAI instruction. In this mode the CPU will not execute
instructions. The internal CPU signals (address and data bus) will be fully static. All peripherals stay
active. For further power consumption reduction the peripherals can individually turn off their local clocks.
1.5.3.4
Run
Although this is not a low-power mode, unused peripheral modules should not be enabled in order to save
power.
1.6
Resets and Interrupts
Consult the Exception Processing section of the CPU12 Reference Manual for information.
1.6.1
Vectors
Table 1-9 lists interrupt sources and vectors in default order of priority.
Table 1-9. Interrupt Vector Locations
CCR
Mask
HPRIO Value
to Elevate
Vector Address
Interrupt Source
Local Enable
External reset, power on reset,
or low voltage reset
(see CRG flags register to determine
reset source)
0xFFFE, 0xFFFF
None
None
—
0xFFFC, 0xFFFD
0xFFFA, 0xFFFB
0xFFF8, 0xFFF9
0xFFF6, 0xFFF7
0xFFF4, 0xFFF5
0xFFF2, 0xFFF3
0xFFF0, 0xFFF1
$FFEE, $FFEF
Clock monitor fail reset
None
None
None
None
X-Bit
I bit
COPCTL (CME, FCME)
COP rate select
None
—
—
COP failure reset
Unimplemented instruction trap
—
SWI
XIRQ
None
—
None
—
IRQ
INTCR (IRQEN)
CRGINT (RTIE)
0x00F2
0x00F0
Real time Interrupt
I bit
Reserved
Reserved
I bit
$FFEC, $FFED
0xFFEA, 0xFFEB
0xFFE8, 0xFFE9
0xFFE6, 0xFFE7
0xFFE4, 0xFFE5
0xFFE2, 0xFFE3
0xFFE0, 0xFFE1
0xFFDE, 0xFFDF
0xFFDC, 0xFFDD
Standard timer channel 2
Standard timer channel 3
Standard timer channel 4
Standard timer channel 5
Standard timer channel 6
Standard timer channel 7
Standard timer overflow
Pulse accumulator A overflow
TIE (C2I)
TIE (C3I)
0x00EA
0x00E8
0x00E6
0x00E4
0x00E2
0x00E0
0x00DE
0x00DC
I bit
I bit
TIE (C4I)
I bit
TIE (C5I)
I bit
TIE (C6I)
I bit
TIE (C7I)
I bit
TMSK2 (TOI)
PACTL (PAOVI)
I bit
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Table 1-9. Interrupt Vector Locations (continued)
CCR
Mask
HPRIO Value
to Elevate
Vector Address
Interrupt Source
Local Enable
0xFFDA, 0xFFDB
0xFFD8, 0xFFD9
Pulse accumulator input edge
SPI
I bit
I bit
PACTL (PAI)
0x00DA
0x00D8
SPICR1 (SPIE, SPTIE)
SCICR2
(TIE, TCIE, RIE, ILIE)
0xFFD6, 0xFFD7
SCI
I bit
0x00D6
0xFFD4, 0xFFD5
0xFFD2, 0xFFD3
0xFFD0, 0xFFD1
0xFFCE, 0xFFCF
0xFFCC, 0xFFCD
0xFFCA, 0xFFCB
0xFFC8, 0xFFC9
0xFFC6, 0xFFC7
0xFFC4, 0xFFC5
0xFFBA to 0xFFC3
0xFFB8, 0xFFB9
0xFFB6, 0xFFB7
0xFFB4, 0xFFB5
Reserved
I bit
ATD
ATDCTL2 (ASCIE)
PIEP (PIEP7-6)
0x00D2
0x00CE
Reserved
I bit
Port J
Reserved
Reserved
Reserved
I bit
CRG PLL lock
PLLCR (LOCKIE)
PLLCR (SCMIE)
0x00C6
0x00C4
CRG self clock mode
I bit
Reserved
I bit
FLASH
FCNFG (CCIE, CBEIE)
CANRIER (WUPIE)
0x00B8
0x00B6
0x00B4
CAN wake-up
I bit
I bit
I bit
I bit
CANRIER (CSCIE, OVRIE)
CANRIER (RXFIE)
CAN errors
CAN receive
CAN transmit
0xFFB2, 0xFFB3
0x00B2
0x00B0
0xFFB0, 0xFFB1
0xFF90 to 0xFFAF
0xFF8E, 0xFF8F
0xFF8C, 0xFF8D
0xFF8A, 0xFF8B
0xFF80 to 0xFF89
CANTIER (TXEIE[2:0])
Reserved
I bit
Port P
PIEP (PIEP7-0)
CTRL0 (LVIE)
0x008E
0x008A
Reserved
I bit
VREG LVI
Reserved
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1.6.2
Resets
Resets are a subset of the interrupts featured in Table 1-9. The different sources capable of generating a
system reset are summarized in Table 1-10. When a reset occurs, MCU registers and control bits are
changed to known start-up states. Refer to the respective module Block User Guides for register reset
states.
1.6.2.1
Reset Summary Table
Table 1-10. Reset Summary
Reset
Priority
Source
Vector
Power-on Reset
External Reset
1
1
1
2
3
CRG module
RESET pin
0xFFFE, 0xFFFF
0xFFFE, 0xFFFF
0xFFFE, 0xFFFF
0xFFFC, 0xFFFD
0xFFFA, 0xFFFB
Low Voltage Reset
Clock Monitor Reset
COP Watchdog Reset
VREG module
CRG module
CRG module
1.6.2.2
Effects of Reset
When a reset occurs, MCU registers and control bits are changed to known start-up states. Refer to the
respective module Block User Guides for register reset states. Refer to the HCS12 Multiplexed External
Bus Interface (MEBI) Block Guide for mode dependent pin configuration of port A, B and E out of reset.
Refer to the PIM Block User Guide for reset configurations of all peripheral module ports.
Refer to Figure 1-2. to Figure 1-5. footnotes for locations of the memories depending on the operating
mode after reset.
The RAM array is not automatically initialized out of reset.
NOTE
For devices assembled in 48-pin or 52-pin LQFP packages all non-bonded
out pins should be configured as outputs after reset in order to avoid current
drawn from floating inputs. Refer to Table 1-5 for affected pins.
1.7
Device Specific Information and Module Dependencies
PPAGE
1.7.1
External paging is not supported on these devices. In order to access the 16K flash blocks in the address
range 0x8000–0xBFFF the PPAGE register must be loaded with the corresponding value for this range.
Refer to Table 1-11 for device specific page mapping.
For all devices Flash Page 3F is visible in the 0xC000–0xFFFF range if ROMON is set. For all devices
(except MC9S12GC16) Page 3E is also visible in the 0x4000–0x7FFF range if ROMHM is cleared and
ROMON is set. For all devices apart from MC9S12Q32 Flash Page 3D is visible in the 0x0000–0x3FFF
range if ROMON is set...
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Table 1-11. Device Specific Flash PAGE Mapping
Device
PAGE
PAGE Visible with PPAGE Contents
3E
3F
3C
3D
3E
3F
3A
3B
3C
3D
3E
3F
38
39
3A
3B
3C
3D
3E
3F
$00,$02,$04,$06,$08,$0A,$0C,$0E,$10,$12......$2C,$2E,$30,$32,$34,$36,$38,$3A,$3C,$3E
$01,$03,$05,$07,$09,$0B,$0D,$0F,$11,$13.....$2D,$2F,$31,$33,$35,$37,$39,$3B,$3D,$3F
$04,$0C,$14,$1C,$24,$2C,$34,$3C
MC9S12Q32
$05,$0D,$15,$1D,$25,$2D,$35,$3D
MC9S12Q64
MC9S12Q96
$06,$0E,$16,$1E,$26,$2E,$36,$3E
$07,$0F,$17,$1F,$27,$2F,$37,$3F
$02,$0A,$12,$1A,$22,$2A,$32,$3A
$03,$0B,$13,$1B,$23,$2B,$33,$3B
$04,$0C,$14,$1C,$24,$2C,$34,$3C
$05,$0D,$15,$1D,$25,$2D,$35,$3D
$06,$0E,$16,$1E,$26,$2E,$36,$3E
$07,$0F,$17,$1F,$27,$2F,$37,$3F
$00,$08,$10,$18,$20,$28,$30,$38
$01,$09,$11,$19,$21,$29,$31,$39
$02,$0A,$12,$1A,$22,$2A,$32,$3A
$03,$0B,$13,$1B,$23,$2B,$33,$3B
MC9S12Q128
$04,$0C,$14,$1C,$24,$2C,$34,$3C
$05,$0D,$15,$1D,$25,$2D,$35,$3D
$06,$0E,$16,$1E,$26,$2E,$36,$3E
$07,$0F,$17,$1F,$27,$2F,$37,$3F
1.7.2
BDM Alternate Clock
The BDM section reference to alternate clock is equivalent to the oscillator clock.
1.7.3
Extended Address Range Emulation Implications
In order to emulate the devices, external addressing of a 128K memory map is required. This is provided
in a 112 LQFP package version which includes the 3 necessary extra external address bus signals via
PortK[2:0]. This package version is for emulation only and not provided as a general production package.
The reset state of DDRK is 0x0000, configuring the pins as inputs.
The reset state of PUPKE in the PUCR register is “1” enabling the internal Port K pullups.
In this reset state the pull-ups provide a defined state and prevent a floating input, thereby preventing
unnecessary current flow at the input stage.
To prevent unnecessary current flow in production package options, the states of DDRK and PUPKE
should not be changed by software.
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1.7.4
VREGEN
The VREGEN input mentioned in the VREG section is device internal, connected internally to V
.
DDR
1.7.5
VDD1, VDD2, VSS1, VSS2
In the 80-pin QFP package versions, both internal V and V of the 2.5V domain are bonded out on 2
DD
SS
sides of the device as two pin pairs (V
, V
& V
, V ). V
and V
are connected together
DD1
SS1
DD2
SS2
DD1
DD2
internally. V
and V
are connected together internally. The extra pin pair enables systems using the
SS1
SS2
80-pin package to employ better supply routing and further decoupling.
1.7.6
Clock Reset Generator And VREG Interface
The low voltage reset feature uses the low voltage reset signal from the VREG module as an input to the
CRG module. When the regulator output voltage supply to the internal chip logic falls below a specified
threshold the LVR signal from the VREG module causes the CRG module to generate a reset.
NOTE
If the voltage regulator is shut down by connecting V
to ground then the
DDR
LVRF flag in the CRG flags register (CRGFLG) is undefined.
1.7.7
Analog-to-Digital Converter
In the 48- and 52-pin package versions, the V pad is bonded internally to the V
pin.
RL
SSA
1.7.8
MODRR Register Port T And Port P Mapping
The MODRR register within the PIM allows for mapping of PWM channels to port T in the absence of
port P pins for the low pin count packages. For the 80QFP package option it is recommended not to use
MODRR since this is intended to support PWM channel availability in low pin count packages. Note that
when mapping PWM channels to port T in an 80QFP option, the associated PWM channels are then
mapped to both port P and port T. MODRR[4] must not be set for.
1.7.9
Port AD Dependency On PIM And ATD Registers
The port AD pins interface to the PIM module. However, the port pin digital state can be read from either
the PORTAD register in the ATD register map or from the PTAD register in the PIM register map.
In order to read a digital pin value from PORTAD the corresponding ATDDIEN bit must be set and the
corresponding DDRDA bit cleared. If the corresponding ATDDIEN bit is cleared then the pin is configured
as an analog input and the PORTAD bit reads back as "1".
In order to read a digital pin value from PTAD, the corresponding DDRAD bit must be cleared, to
configure the pin as an input.
Furthermore in order to use a port AD pin as an analog input, the corresponding DDRAD bit must be
cleared to configure the pin as an input
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1.8
Recommended Printed Circuit Board Layout
The PCB must be carefully laid out to ensure proper operation of the voltage regulator as well as of the
MCU itself. The following rules must be observed:
•
Every supply pair must be decoupled by a ceramic capacitor connected as near as possible to the
corresponding pins.
•
•
•
•
Central point of the ground star should be the V
pin.
SSR
Use low ohmic low inductance connections between V , V , and V .
SSR
SS1
SS2
V
must be directly connected to V
.
SSPLL
SSR
Keep traces of V
, EXTAL, and XTAL as short as possible and occupied board area for C6,
SSPLL
C7, C11, and Q1 as small as possible.
•
•
Do not place other signals or supplies underneath area occupied by C6, C7, C5, and Q1 and the
connection area to the MCU.
Central power input should be fed in at the V
/V
pins.
DDA SSA
Table 1-12. Recommended Component Values
Component
Purpose
Type
Value
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
V
DD1 filter capacitor
Ceramic X7R
X7R/tantalum
Ceramic X7R
220nF, 470nF(1)
>=100nF
VDDR filter capacitor
VDDPLL filter capacitor
PLL loop filter capacitor
PLL loop filter capacitor
OSC load capacitor
100nF
See PLL specification chapter
See PLL specification chapter
OSC load capacitor
V
DD2 filter capacitor (80 QFP only)
VDDA filter capacitor
Ceramic X7R
220nF
100nF
Ceramic X7R
X7R/tantalum
VDDX filter capacitor
>=100nF
Colpitts mode only, if recommended by
quartz manufacturer
C11
DC cutoff capacitor
R1
R2
Pierce Mode Select Pullup
PLL loop filter resistor
PLL loop filter resistor
PLL loop filter resistor
Quartz
Pierce Mode Only
See PLL Specification chapter
R3 / RB
R4 / RS
Q1
Pierce mode only
—
—
1. In 48LQFP and 52LQFP package versions, VDD2 is not available. Thus 470nF must be connected to
VDD1
.
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Figure 1-14. Recommended PCB Layout (48 LQFP) Colpitts Oscillator
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Figure 1-15. Recommended PCB Layout (52 LQFP) Colpitts Oscillator
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Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
Figure 1-16. Recommended PCB Layout (80 QFP) Colpitts Oscillator
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Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
Figure 1-17. Recommended PCB Layout for 48 LQFP Pierce Oscillator
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Chapter 1 MC9S12Q Device Overview (MC9S12Q128-Family)
Figure 1-18. Recommended PCB Layout for 52 LQFP Pierce Oscillator
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Figure 1-19. Recommended PCB Layout for 80QFP Pierce Oscillator
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Chapter 2
Port Integration Module (PIM9C32) Block Description
2.1
Introduction
The Port Integration Module establishes the interface between the peripheral modules and the I/O pins for
all ports.
This chapter covers:
•
•
•
•
•
•
Port A, B, and E related to the core logic and the multiplexed bus interface
Port T connected to the TIM module (PWM module can be routed to port T as well)
Port S connected to the SCI module
Port M associated to the MSCAN and SPI module
Port P connected to the PWM module, external interrupt sources available
Port J pins can be used as external interrupt sources and standard I/O’s
The following I/O pin configurations can be selected:
•
Available on all I/O pins:
— Input/output selection
— Drive strength reduction
— Enable and select of pull resistors
Available on all Port P and Port J pins:
— Interrupt enable and status flags
•
The implementation of the Port Integration Module is device dependent.
2.1.1
Features
A standard port has the following minimum features:
•
•
•
•
Input/output selection
5-V output drive with two selectable drive strength
5-V digital and analog input
Input with selectable pull-up or pull-down device
Optional features:
•
•
Open drain for wired-OR connections
Interrupt inputs with glitch filtering
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.1.2
Block Diagram
Figure 2-1 is a block diagram of the PIM.
Port Integration Module
MUX
PT0
PT1
PT2
PT3
PT4
PT5
PT6
PT7
IOC2
IOC3
IOC4
IOC5
IOC6
IOC7
PP0
PP1
PP2
PP3
PP4
PP5
PP6
PP7
PWM0
PWM1
PWM2
PWM3
PJ6
PJ7
PS0
PS1
PS2
PS3
RXD
TXD
SCI
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
PAD0
PAD1
PAD2
PAD3
PAD4
PAD5
PAD6
PAD7
PM0
PM1
PM2
PM3
PM4
PM5
RXCAN
TXCAN
MISO
MOSI
SCK
ATD
CAN
SPI
SS
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
ADDR0/DATA0
ADDR1/DATA1
ADDR2/DATA2
ADDR3/DATA3
ADDR4/DATA4
ADDR5/DATA5
ADDR6/DATA6
ADDR7/DATA7
BKGD
BKGD/MODC/TAGHI
XIRQ
IRQ
R/W
LSTRB/TAGLO
ECLK
IPIPE0/MODA
IPIPE1/MODB
NOACC/XCLKS
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
CORE
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
ADDR8/DATA8
ADDR9/DATA9
ADDR10/DATA10
ADDR11/DATA11
ADDR12/DATA12
ADDR13/DATA13
ADDR14/DATA14
ADDR15/DATA15
Figure 2-1. PIM Block Diagram
Note: The MODRR register within the PIM allows for mapping of PWM channels to Port T in the absence
of Port P pins for the low pin count packages. For the 80QFP package option it is recommended not to use
MODRR since this is intended to support PWM channel availability in low pin count packages. Note that
when mapping PWM channels to Port T in an 80QFP option, the associated PWM channels are then
mapped to both Port P and Port T.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.2
Signal Description
This section lists and describes the signals that do connect off-chip.
Table 2-1 shows all pins and their functions that are controlled by the PIM module. If there is more than
one function associated to a pin, the priority is indicated by the position in the table from top (highest
priority) to down (lowest priority).
Table 2-1. Pin Functions and Priorities
Pin Function
after Reset
Port
Pin Name
Pin Function
Description
Port T
PT[7:0]
PWM[3:0]
IOC[7:2]
GPIO
PWM outputs (only available if enabled in MODRR register)
Standard timer channels
General-purpose I/O
GPIO
Port S
Port M
Port P
PS3
PS2
PS1
GPIO
General-purpose I/O
GPIO
General purpose I/O
TXD
Serial communication interface transmit pin
General-purpose I/O
GPIO
PS0
RXD
Serial communication interface receive pin
General-purpose I/O
GPIO
PM5
PM4
SCK
SPI clock
MOSI
SPI transmit pin
PM3
SS
SPI slave select line
PM2
MISO
SPI receive pin
PM1
TXCAN
RXCAN
PWM[3:0]
GPIO[7:0]
ROMON
GPIO
MSCAN transmit pin
PM0
MSCAN receive pin
PP[7:0]
PWM outputs
General purpose I/O with interrupt
ROMON input signal
PP[6]
PJ[7:6]
PAD[7:0]
Port J
General purpose I/O with interrupt
ATD analog inputs
Port AD
ATD[7:0]
GPIO[7:0]
General purpose I/O
Port A
Port B
PA[7:0]
PB[7:0]
ADDR[15:8]/
DATA[15:8]/
GPIO
Refer to MEBI Block Guide.
ADDR[7:0]/
DATA[7:0]/
GPIO
Refer to MEBI Block Guide.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
Table 2-1. Pin Functions and Priorities (continued)
Pin Function
after Reset
Port
Pin Name
Pin Function
Description
NOACC/
XCLKS/
GPIO
PE7
IPIPE1/
MODB/
GPIO
PE6
IPIPE0/
MODA/
GPIO
PE5
PE4
PE3
Port E
Refer to MEBI Block Guide.
ECLK/GPIO
LSTRB/
TAGLO/
GPIO
R/W/
GPIO
PE2
PE1
PE0
IRQ/GPI
XIRQ/GPI
2.3
Memory Map and Registers
This section provides a detailed description of all registers.
2.3.1
Module Memory Map
Figure 2-2 shows the register map of the Port Integration Module.
Address Name
Bit 7
PTT7
IOC7
6
5
4
3
2
1
Bit 0
R
W
PTT6
IOC6
PTT5
IOC5
PTT4
IOC4
PTT3
PTT2
PTT1
PTT0
TIM
PWM
R
IOC3
PWM3
PTIT3
IOC2
PWM2
PTIT2
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
PTT
PTIT
PWM1
PTIT1
PWM0
PTIT0
PTIT7
PTIT6
PTIT5
PTIT4
W
R
DDRT
RDRT
PERT
PPST
DDRT7
RDRT7
PERT7
PPST7
DDRT6
RDRT6
PERT6
PPST6
DDRT5
RDRT5
PERT5
PPST5
DDRT4
RDRT4
PERT4
PPST4
DDRT3
RDRT3
PERT3
PPST3
DDRT2
RDRT2
PERT2
PPST2
DDRT1
RDRT1
PERT1
PPST1
DDRT0
RDRT0
PERT0
PPST0
W
R
W
R
W
R
W
= Unimplemented or Reserved
Figure 2-2. Quick Reference to PIM Registers (Sheet 1 of 3)
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Address Name
Bit 7
6
5
4
3
2
1
Bit 0
R
W
R
0
0
0
0
0
0
0
0
0x0006 Reserved
0
0
0
0
0
0
0x0007 MODRR
MODRR4 MODRR3 MODRR2 MODRR1 MODRR0
0
W
R
PTS3
PTS2
PTS1
PTS0
0x0008
PTS
W
SCI
R
—
0
—
0
—
0
—
0
—
—
TXD
RXD
PTIS3
PTIS2
PTIS1
PTIS0
0x0009
0x000A
0x000B
0x000C
0x000D
0x000E
PTIS
DDRS
RDRS
PERS
PPSS
WOMS
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
DDRS3
RDRS3
PERS3
PPSS3
DDRS2
RDRS2
PERS2
PPSS2
DDRS1
RDRS1
PERS1
PPSS1
DDRS0
RDRS0
PERS0
PPSS0
W
R
W
R
W
R
W
R
WOMS3 WOMS2 WOMS1 WOMS0
W
R
0
0
0
0
0x000F Reserved
W
R
PTM5
PTM4
PTM3
PTM2
PTM1
PTM0
W
0x0010
PTM
MSCAN
/
—
0
—
0
SCK
MOSI
SS
MISO
TXCAN
PTIM1
RXCAN
PTIM0
SPI
R
W
R
PTIM5
PTIM4
PTIM3
PTIM2
0x0011
0x0012
0x0013
0x0014
0x0015
0x0016
PTIM
DDRM
RDRM
PERM
PPSM
WOMM
0
0
0
0
0
0
0
0
0
0
0
0
DDRM5
RDRM5
PERM5
PPSM5
DDRM4
RDRM4
PERM4
PPSM4
DDRM3
RDRM3
PERM3
PPSM3
DDRM2
RDRM2
PERM2
PPSM2
DDRM1
RDRM1
PERM1
PPSM1
DDRM0
RDRM0
PERM0
PPSM0
W
R
W
R
W
R
W
R
WOMM5 WOMM4 WOMM3 WOMM2 WOMM1 WOMM0
W
R
0
0
0
0
0
0
0x0017 Reserved
W
R
PTP7
PTP6
PTP5
PTP4
PTP3
PTP2
PTP1
PTP0
0x0018
0x0019
PTP
W
PWM
R
—
—
—
—
PWM3
PTIP3
PWM2
PTIP2
PWM1
PTIP1
PWM0
PTIP0
PTIP7
PTIP6
PTIP5
PTIP4
PTIP
W
= Unimplemented or Reserved
Figure 2-2. Quick Reference to PIM Registers (Sheet 2 of 3)
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Chapter 2 Port Integration Module (PIM9C32) Block Description
Address Name
Bit 7
6
5
4
3
2
1
Bit 0
R
W
R
0x001A
0x001B
0x001C
0x001D
0x001E
0x001F
DDRP
RDRP
PERP
PPSP
PIEP
DDRP7
DDRP6
DDRP5
DDRP4
DDRP3
DDRP2
DDRP1
DDRP0
RDRP7
PERP7
PPSP7
PIEP7
RDRP6
PERP6
PPSP6
PIEP6
RDRP5
PERP5
PPSP5
PIEP5
RDRP4
PERP4
PPSP4
PIEP4
RDRP3
PERP3
PPSP3
PIEP3
RDRP2
PERP2
PPSP2
PIEP2
RDRP1
PERP1
PPSP1
PIEP1
RDRP0
PERP0
PPSP0
PIEP0
W
R
W
R
W
R
W
R
PIFP
PIFP7
0
PIFP6
0
PIFP5
0
PIFP4
0
PIFP3
0
PIFP2
0
PIFP1
0
PIFP0
0
W
R
0x0020–
0x0027
Reserved
PTJ
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x0028
0x0029
0x002A
0x002B
0x002C
0x002D
0x002E
0x002F
0x0030
0x0031
PTJ7
PTJ6
W
R
PTIJ7
PTIJ6
PTIJ
W
R
DDRJ
RDRJ
PERJ
PPSJ
PIEJ
DDRJ7
RDRJ7
PERJ7
PPSJ7
PIEJ7
DDRJ6
RDRJ6
PERJ6
PPSJ6
PIEJ6
W
R
W
R
W
R
W
R
W
R
PIFJ
PIFJ7
PIFJ6
W
R
PTAD
PTIAD
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
W
R
PTIAD7
PTIAD6
PTIAD5
PTIAD4
PTIAD3
PTIAD2
PTIAD1
PTIAD0
W
R
0x0032 DDRAD
0x0033 RDRAD
0x0034 PERAD
0x0035 PPSAD
DDRAD7 DDRAD6 DDRAD5 DDRAD4 DDRAD3 DDRAD2 DDRAD1 DDRAD0
RDRAD7 RDRAD6 RDRAD5 RDRAD4 RDRAD3 RDRAD2 RDRAD1 RDRAD0
PERAD7 PERAD6 PERAD5 PERAD4 PERAD3 PERAD2 PERAD1 PERAD0
PPSAD7 PPSAD6 PPSAD5 PPSAD4 PPSAD3 PPSAD2 PPSAD1 PPSAD0
W
R
W
R
W
R
W
R
0
0
0
0
0
0
0
0
0x0036–
Reserved
0x003F
W
= Unimplemented or Reserved
Figure 2-2. Quick Reference to PIM Registers (Sheet 3 of 3)
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2
Register Descriptions
Table 2-2 summarizes the effect on the various configuration bits — data direction (DDR), input/output
level (I/O), reduced drive (RDR), pull enable (PE), pull select (PS), and interrupt enable (IE) for the ports.
The configuration bit PS is used for two purposes:
1. Configure the sensitive interrupt edge (rising or falling), if interrupt is enabled.
2. Select either a pull-up or pull-down device if PE is active.
Table 2-2. Pin Configuration Summary
DDR
IO
RDR
PE
PS
IE(1)
Function
Pull Device
Interrupt
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
X
X
X
X
X
X
X
0
1
0
1
0
1
0
1
X
X
X
X
X
X
X
0
0
1
1
0
0
1
1
0
1
X
0
1
0
1
0
1
X
X
X
X
0
1
0
1
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
Input
Input
Disabled
Pull up
Disabled
Disabled
1
Input
Pull down
Disabled
Disabled
Pull up
Disabled
0
Input
Falling edge
Rising edge
Falling edge
rising edge
Disabled
0
Input
1
Input
1
Input
Pull down
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
Disabled
X
X
X
X
X
X
X
X
Output, full drive to 0
Output, full drive to 1
Output, reduced drive to 0
Output, reduced drive to 1
Output, full drive to 0
Output, full drive to 1
Output, reduced drive to 0
Output, reduced drive to 1
Disabled
Disabled
Disabled
Falling edge
Rising edge
Falling edge
Rising edge
1. Applicable only on ports P and J.
NOTE
All bits of all registers in this module are completely synchronous to internal
clocks during a register read.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.1
Port T Registers
2.3.2.1.1
Port T I/O Register (PTT)
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
PTT7
W
PTT6
PTT5
PTT4
PTT3
PTT2
PTT1
PTT0
TIM
PWM
Reset
IOC7
IOC6
IOC5
0
IOC4
0
IOC3
PWM3
0
IOC2
PWM2
0
PWM1
0
PWM0
0
0
0
= Unimplemented or Reserved
Figure 2-3. Port T I/O Register (PTT)
Read: Anytime.
Write: Anytime.
If the data direction bits of the associated I/O pins are set to 1, a read returns the value of the port register,
otherwise the value at the pins is read.
If a TIM-channel is defined as output, the related port T is assigned to IOC function.
In addition to the possible timer functionality of port T pins PWM channels can be routed to port T. For
this the Module Routing Register (MODRR) needs to be configured.
(1)
Table 2-3. Port T[4:0] Pin Functionality Configurations
TIMEN[x]
MODRR[x]
PWME[x]
Port T[x] Output
(2)
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
General Purpose I/O
Timer
General Purpose I/O
Timer
General Purpose I/O
Timer
PWM
PWM
1. All fields in the that are not shaded are standard use cases.
2. TIMEN[x] means that the timer is enabled (TSCR1[7]), the related channel is
configured for output compare function (TIOS[x] or special output on a timer
overflow event — configurable in TTOV[x]) and the timer output is routed to the
port pin (TCTL1/TCTL2).
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.1.2
Port T Input Register (PTIT)
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
PTIT7
PTIT6
PTIT5
PTIT4
PTIT3
PTIT2
PTIT1
PTIT0
Reset
—
—
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 2-4. Port T Input Register (PTIT)
Read: Anytime.
Write: Never, writes to this register have no effect.
Table 2-4. PTIT Field Descriptions
Field
Description
Port T Input Register — This register always reads back the status of the associated pins. This can also be
7–0
PTIT[7:0] used to detect overload or short circuit conditions on output pins.
2.3.2.1.3
Port T Data Direction Register (DDRT)
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
DDRT7
W
DDRT6
DDRT5
DDRT4
DDRT3
DDRT2
DDRT1
DDRT0
Reset
0
0
0
0
0
0
0
0
Figure 2-5. Port T Data Direction Register (DDRT)
Read: Anytime.
Write: Anytime.
Table 2-5. DDRT Field Descriptions
Description
Field
7–0
Data Direction Port T — This register configures each port T pin as either input or output.
DDRT[7:0]
The standard TIM / PWM modules forces the I/O state to be an output for each standard TIM / PWM module port
associated with an enabled output compare. In these cases the data direction bits will not change.
The DDRT bits revert to controlling the I/O direction of a pin when the associated timer output compare is
disabled.
The timer input capture always monitors the state of the pin.
0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus cycles until the correct value is read on PTT
or PTIT registers, when changing the DDRT register.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.1.4
Port T Reduced Drive Register (RDRT)
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
RDRT7
W
RDRT6
RDRT5
RDRT4
RDRT3
RDRT2
RDRT1
RDRT0
Reset
0
0
0
0
0
0
0
0
Figure 2-6. Port T Reduced Drive Register (RDRT)
Read: Anytime.
Write: Anytime.
Table 2-6. RDRT Field Descriptions
Description
Field
7–0
Reduced Drive Port T — This register configures the drive strength of each port T output pin as either full or
RDRT[7:0] reduced. If the port is used as input this bit is ignored.
0 Full drive strength at output.
1 Associated pin drives at about 1/3 of the full drive strength.
2.3.2.1.5
Port T Pull Device Enable Register (PERT)
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
PERT7
W
PERT6
PERT5
PERT4
PERT3
PERT2
PERT1
PERT0
Reset
0
0
0
0
0
0
0
0
Figure 2-7. Port T Pull Device Enable Register (PERT)
Read: Anytime.
Write: Anytime.
Table 2-7. PERT Field Descriptions
Description
Field
7–0
Pull Device Enable — This register configures whether a pull-up or a pull-down device is activated, if the port
PERT[7:0] is used as input. This bit has no effect if the port is used as output. Out of reset no pull device is enabled.
0 Pull-up or pull-down device is disabled.
1 Either a pull-up or pull-down device is enabled.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.1.6
Port T Polarity Select Register (PTTST)
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
PPST7
W
PPST6
PPST5
PPST4
PPST3
PPST2
PPST1
PPST0
Reset
0
0
0
0
0
0
0
0
Figure 2-8. Port T Polarity Select Register (PPST)
Read: Anytime.
Write: Anytime.
Table 2-8. PPST Field Descriptions
Description
Field
7–0
Pull Select Port T — This register selects whether a pull-down or a pull-up device is connected to the pin.
PPST[7:0] 0 A pull-up device is connected to the associated port T pin, if enabled by the associated bit in register PERT
and if the port is used as input.
1 A pull-down device is connected to the associated port T pin, if enabled by the associated bit in register PERT
and if the port is used as input.
2.3.2.1.7
Port T Module Routing Register (MODRR)
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
0
0
0
MODRR4
MODRR3
MODRR2
MODRR1
MODRR0
Reset
—
—
—
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-9. Port T Module Routing Register (MODRR)
Read: Anytime.
Write: Anytime.
NOTE
MODRR[4] must be kept clear on devices featuring a 4 channel PWM.
Table 2-9. MODRR Field Descriptions
Field
Description
4–0
Module Routing Register Port T — This register selects the module connected to port T.
MODRR[4:0] 0 Associated pin is connected to TIM module
1 Associated pin is connected to PWM module
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.2
Port S Registers
2.3.2.2.1
Port S I/O Register (PTS)
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PTS3
PTS2
PTS1
PTS0
SCI
—
0
—
0
—
0
—
0
—
0
—
0
TXD
0
RXD
0
Reset
= Unimplemented or Reserved
Figure 2-10. Port S I/O Register (PTS)
Read: Anytime.
Write: Anytime.
If the data direction bits of the associated I/O pins are set to 1, a read returns the value of the port register,
otherwise the value at the pins is read.
The SCI port associated with transmit pin 1 is configured as output if the transmitter is enabled and the
SCI pin associated with receive pin 0 is configured as input if the receiver is enabled. Please refer to SCI
Block User Guide for details.
2.3.2.2.2
Port S Input Register (PTIS)
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PTIS3
PTIS2
PTIS1
PTIS0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-11. Port S Input Register (PTIS)
Read: Anytime.
Write: Never, writes to this register have no effect.
Table 2-10. PTIS Field Descriptions
Field
Description
Port S Input Register — This register always reads back the status of the associated pins. This also can be
3–0
PTIS[3:0] used to detect overload or short circuit conditions on output pins.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.2.3
Port S Data Direction Register (DDRS)
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
0
0
0
0
DDRS3
DDRS2
DDRS1
DDRS0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-12. Port S Data Direction Register (DDRS)
Read: Anytime.
Write: Anytime.
Table 2-11. DDRS Field Descriptions
Description
Field
3–0
Direction Register Port S — This register configures each port S pin as either input or output.
DDRS[3:0]
If the associated SCI transmit or receive channel is enabled this register has no effect on the pins. The pin is
forced to be an output if the SCI transmit channel is enabled, it is forced to be an input if the SCI receive channel
is enabled.
The DDRS bits revert to controlling the I/O direction of a pin when the associated channel is disabled.
0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus cycles until the correct value is read on PTS
or PTIS registers, when changing the DDRS register.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.2.4
Port S Reduced Drive Register (RDRS)
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
W
0
0
0
0
RDRS3
RDRS2
RDRS1
RDRS0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-13. Port S Reduced Drive Register (RDRS)
Read: Anytime.
Write: Anytime.
Table 2-12. RDRS Field Descriptions
Description
Field
3–0
Reduced Drive Port S — This register configures the drive strength of each port S output pin as either full or
RDRS[3:0] reduced. If the port is used as input this bit is ignored.
0 Full drive strength at output.
1 Associated pin drives at about 1/3 of the full drive strength.
2.3.2.2.5
Port S Pull Device Enable Register (PERS)
Module Base + 0x000C
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PERS3
PERS2
PERS1
PERS0
Reset
0
0
0
0
1
1
1
1
= Unimplemented or Reserved
Figure 2-14. Port S Pull Device Enable Register (PERS)
Read: Anytime.
Write: Anytime.
Table 2-13. PERS Field Descriptions
Description
Field
3–0
Reduced Drive Port S — This register configures whether a pull-up or a pull-down device is activated, if the port
PERS[3:0] is used as input or as output in wired-or (open drain) mode. This bit has no effect if the port is used as push-pull
output. Out of reset a pull-up device is enabled.
0 Pull-up or pull-down device is disabled.
1 Either a pull-up or pull-down device is enabled.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.2.6
Port S Polarity Select Register (PPSS)
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PPSS3
PPSS2
PPSS1
PPSS0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-15. Port S Polarity Select Register (PPSS)
Read: Anytime.
Write: Anytime.
Table 2-14. PPSS Field Descriptions
Description
Field
3–0
Pull Select Port S — This register selects whether a pull-down or a pull-up device is connected to the pin.
PPSS[3:0] 0 A pull-up device is connected to the associated port S pin, if enabled by the associated bit in register PERS
and if the port is used as input or as wired-or output.
1 A pull-down device is connected to the associated port S pin, if enabled by the associated bit in register PERS
and if the port is used as input.
2.3.2.2.7
Port S Wired-OR Mode Register (WOMS)
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
W
0
0
0
0
WOMS3
WOMS2
WOMS1
WOMS0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-16. Port S Wired-Or Mode Register (WOMS)
Read: Anytime.
Write: Anytime.
Table 2-15. WOMS Field Descriptions
Description
Field
3–0
Wired-OR Mode Port S — This register configures the output pins as wired-or. If enabled the output is driven
WOMS[3:0] active low only (open-drain). A logic level of “1” is not driven. This bit has no influence on pins used as inputs.
0 Output buffers operate as push-pull outputs.
1 Output buffers operate as open-drain outputs.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.3
Port M Registers
2.3.2.3.1
Port M I/O Register (PTM)
Module Base + 0x0010
7
6
5
4
3
2
1
0
R
0
0
PTM5
PTM4
PTM3
PTM2
PTM1
PTM0
W
MSCAN/
SPI
—
0
—
0
SCK
0
MOSI
0
SS
0
MISO
0
TXCAN
0
RXCAN
0
Reset
= Unimplemented or Reserved
Figure 2-17. Port M I/O Register (PTM)
Read: Anytime.
Write: Anytime.
If the data direction bits of the associated I/O pins are set to 1, a read returns the value of the port register,
otherwise the value at the pins is read.
The SPI pin configurations (PM[5:2]) is determined by several status bits in the SPI module. Please refer
to the SPI Block User Guide for details.
2.3.2.3.2
Port M Input Register (PTIM)
Module Base + 0x0011
7
6
5
4
3
2
1
0
R
W
0
0
PTIM5
PTIM4
PTIM3
PTIM2
PTIM1
PTIM0
Reset
—
—
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 2-18. Port M Input Register (PTIM)
Read: Anytime.
Write: Never, writes to this register have no effect.
Table 2-16. PTIM Field Descriptions
Field
Description
Port M Input Register — This register always reads back the status of the associated pins. This also can be
5–0
PTIM[5:0] used to detect overload or short circuit conditions on output pins.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.3.3
Port M Data Direction Register (DDRM)
Module Base + 0x0012
7
6
5
4
3
2
1
0
R
W
0
0
DDRM5
DDRM4
DDRM3
DDRM2
DDRM1
DDRM0
Reset
—
—
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-19. Port M Data Direction Register (DDRM)
Read: Anytime.
Write: Anytime.
Table 2-17. DDRM Field Descriptions
Description
Field
5–0
Data Direction Port M — This register configures each port S pin as either input or output
DDRM[5:0] If SPI or MSCAN is enabled, the SPI and MSCAN modules determines the pin directions. Please refer to the SPI
and MSCAN Block User Guides for details.
If the associated SCI or MSCAN transmit or receive channels are enabled, this register has no effect on the pins.
The pins are forced to be outputs if the SCI or MSCAN transmit channels are enabled, they are forced to be inputs
if the SCI or MSCAN receive channels are enabled.
The DDRS bits revert to controlling the I/O direction of a pin when the associated channel is disabled.
0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus cycles until the correct value is read on PTM
or PTIM registers, when changing the DDRM register.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.3.4
Port M Reduced Drive Register (RDRM)
Module Base + 0x0013
7
6
5
4
3
2
1
0
R
W
0
0
RDRM5
RDRM4
RDRM3
RDRM2
RDRM1
RDRM0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-20. Port M Reduced Drive Register (RDRM)
Read: Anytime.
Write: Anytime.
Table 2-18. RDRM Field Descriptions
Description
Field
5–0
Reduced Drive Port M — This register configures the drive strength of each port M output pin as either full or
RDRM[5:0] reduced. If the port is used as input this bit is ignored.
0 Full drive strength at output.
1 Associated pin drives at about 1/3 of the full drive strength.
2.3.2.3.5
Port M Pull Device Enable Register (PERM)
Module Base + 0x0014
7
6
5
4
3
2
1
0
R
W
0
0
PERM5
PERM4
PERM3
PERM2
PERM1
PERM0
Reset
0
0
1
1
1
1
1
1
= Unimplemented or Reserved
Figure 2-21. Port M Pull Device Enable Register (PERM)
Read: Anytime.
Write: Anytime.
Table 2-19. PERM Field Descriptions
Description
Field
5–0
Pull Device Enable Port M — This register configures whether a pull-up or a pull-down device is activated, if
PERM[5:0] the port is used as input or as output in wired-or (open drain) mode. This bit has no effect if the port is used as
push-pull output. Out of reset a pull-up device is enabled.
0 Pull-up or pull-down device is disabled.
1 Either a pull-up or pull-down device is enabled.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.3.6
Port M Polarity Select Register (PPSM)
Module Base + 0x0015
7
6
5
4
3
2
1
0
R
W
0
0
PPSM5
PPSM4
PPSM3
PPSM2
PPSM1
PPSM0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-22. Port M Polarity Select Register (PPSM)
Read: Anytime.
Write: Anytime.
Table 2-20. PPSM Field Descriptions
Description
Field
5–0
Polarity Select Port M — This register selects whether a pull-down or a pull-up device is connected to the pin.
PPSM[5:0] 0 A pull-up device is connected to the associated port M pin, if enabled by the associated bit in register PERM
and if the port is used as input or as wired-or output.
1 A pull-down device is connected to the associated port M pin, if enabled by the associated bit in register PERM
and if the port is used as input.
2.3.2.3.7
Port M Wired-OR Mode Register (WOMM)
Module Base + 0x0016
7
6
5
4
3
2
1
0
R
W
0
0
WOMM5
WOMM4
WOMM3
WOMM2
WOMM1
WOMM0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 2-23. Port M Wired-OR Mode Register (WOMM)
Read: Anytime.
Write: Anytime.
Table 2-21. WOMM Field Descriptions
Description
Field
5–0
Wired-OR Mode Port M — This register configures the output pins as wired-or. If enabled the output is driven
WOMM[5:0] active low only (open-drain). A logic level of “1” is not driven. This bit has no influence on pins used as inputs.
0 Output buffers operate as push-pull outputs.
1 Output buffers operate as open-drain outputs.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.4
Port P Registers
2.3.2.4.1
Port P I/O Register (PTP)
Module Base + 0x0018
7
6
5
4
3
2
1
0
R
PTP7
W
PTP6
PTP5
PTP4
PTP3
PTP2
PTP1
PTP0
PWM
Reset
—
0
—
0
—
0
—
0
PWM3
0
PWM2
0
PWM1
0
PWM0
0
Figure 2-24. Port P I/O Register (PTP)
Read: Anytime.
Write: Anytime.
If the data direction bits of the associated I/O pins are set to 1, a read returns the value of the port register,
otherwise the value at the pins is read.
2.3.2.4.2
Port P Input Register (PTIP)
Module Base + 0x0019
7
6
5
4
3
2
1
0
R
W
PTIP7
PTIP6
PTIP5
PTIP4
PTIP3
PTIP2
PTIP1
PTIP0
Reset
—
—
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 2-25. Port P Input Register (PTIP)
Read: Anytime.
Write: Never, writes to this register have no effect.
This register always reads back the status of the associated pins. This can be also used to detect overload
or short circuit conditions on output pins.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.4.3
Port P Data Direction Register (DDRP)
Module Base + 0x001A
7
6
5
4
3
2
1
0
R
DDRP7
W
DDRP6
DDRP5
DDRP4
DDRP3
DDRP2
DDRP1
DDRP0
Reset
0
0
0
0
0
0
0
0
Figure 2-26. Port P Data Direction Register (DDRP)
Read: Anytime.
Write: Anytime.
Table 2-22. DDRP Field Descriptions
Description
Field
7–0
Data Direction Port P — This register configures each port P pin as either input or output.
DDRP[7:0] 0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus cycles until the correct value is read on PTP
or PTIP registers, when changing the DDRP register.
2.3.2.4.4
Port P Reduced Drive Register (RDRP)
Module Base + 0x001B
7
6
5
4
3
2
1
0
R
RDRP7
W
RDRP6
RDRP5
RDRP4
RDRP3
RDRP2
RDRP1
RDRP0
Reset
0
0
0
0
0
0
0
0
Figure 2-27. Port P Reduced Drive Register (RDRP)
Read: Anytime.
Write: Anytime.
Table 2-23. RDRP Field Descriptions
Description
Field
7–0
Reduced Drive Port P — This register configures the drive strength of each port P output pin as either full or
RDRP[7:0] reduced. If the port is used as input this bit is ignored.
0 Full drive strength at output.
1 Associated pin drives at about 1/3 of the full drive strength.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.4.5
Port P Pull Device Enable Register (PERP)
Module Base + 0x001C
7
6
5
4
3
2
1
0
R
PERP7
W
PERP6
PERP5
PERP4
PERP3
PERP2
PERP1
PERP0
Reset
0
0
0
0
0
0
0
0
Figure 2-28. Port P Pull Device Enable Register (PERP)
Read: Anytime.
Write: Anytime.
Table 2-24. PERP Field Descriptions
Description
Field
7–0
Pull Device Enable Port P — This register configures whether a pull-up or a pull-down device is activated, if the
PERP[7:0] port is used as input. This bit has no effect if the port is used as output. Out of reset no pull device is enabled.
0 Pull-up or pull-down device is disabled.
1 Either a pull-up or pull-down device is enabled.
2.3.2.4.6
Port P Polarity Select Register (PPSP)
Module Base + 0x001D
7
6
5
4
3
2
1
0
R
PPSP7
W
PPSP6
PPSP5
PPSP4
PPSP3
PPSP2
PPSP1
PPSP0
Reset
0
0
0
0
0
0
0
0
Figure 2-29. Port P Polarity Select Register (PPSP)
Read: Anytime.
Write: Anytime.
Table 2-25. PPSP Field Descriptions
Description
Field
7–0
Pull Select Port P — This register serves a dual purpose by selecting the polarity of the active interrupt edge
PPSP[7:0] as well as selecting a pull-up or pull-down device if enabled.
0 Falling edge on the associated port P pin sets the associated flag bit in the PIFP register.A pull-up device is
connected to the associated port P pin, if enabled by the associated bit in register PERP and if the port is used
as input.
1 Rising edge on the associated port P pin sets the associated flag bit in the PIFP register.A pull-down device
is connected to the associated port P pin, if enabled by the associated bit in register PERP and if the port is
used as input.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.4.7
Port P Interrupt Enable Register (PIEP)
Module Base + 0x001E
7
6
5
4
3
2
1
0
R
PIEP7
W
PIEP6
PIEP5
PIEP4
PIEP3
PIEP2
PIEP1
PIEP0
Reset
0
0
0
0
0
0
0
0
Figure 2-30. Port P Interrupt Enable Register (PIEP)
Read: Anytime.
Write: Anytime.
Table 2-26. PIEP Field Descriptions
Description
Field
7–0
PIEP[7:0] associated with port P.
0 Interrupt is disabled (interrupt flag masked).
Pull Select Port P — This register disables or enables on a per pin basis the edge sensitive external interrupt
1 Interrupt is enabled.
2.3.2.4.8
Port P Interrupt Flag Register (PIFP)
Module Base + 0x001F
7
6
5
4
3
2
1
0
R
PIFP7
W
PIFP6
PIFP5
PIFP4
PIFP3
PIFP2
PIFP1
PIFP0
Reset
0
0
0
0
0
0
0
0
Figure 2-31. Port P Interrupt Flag Register (PIFP)
Read: Anytime.
Write: Anytime.
Table 2-27. PIFP Field Descriptions
Description
Field
7–0
Interrupt Flags Port P — Each flag is set by an active edge on the associated input pin. This could be a rising
PIFP[7:0] or a falling edge based on the state of the PPSP register. To clear this flag, write a “1” to the corresponding bit
in the PIFP register. Writing a “0” has no effect.
0 No active edge pending.
Writing a “0” has no effect.
1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set).
Writing a “1” clears the associated flag.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.5
Port J Registers
2.3.2.5.1
Port J I/O Register (PTJ)
Module Base + 0x0028
7
6
5
4
3
2
1
0
R
0
0
0
0
0
0
PTJ7
W
PTJ6
Reset
0
0
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 2-32. Port J I/O Register (PTJ)
Read: Anytime.
Write: Anytime.
If the data direction bits of the associated I/O pins are set to 1, a read returns the value of the port register,
otherwise the value at the pins is read.
2.3.2.5.2
Port J Input Register (PTIJ)
Module Base + 0x0029
7
6
5
4
3
2
1
0
R
W
PTIJ7
PTIJ6
0
0
0
0
0
0
Reset
0
0
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 2-33. Port J Input Register (PTIJ)
Read: Anytime.
Write: Never, writes to this register have no effect.
This register always reads back the status of the associated pins. This can be used to detect overload or
short circuit conditions on output pins.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.5.3
Port J Data Direction Register (DDRJ)
Module Base + 0x002A
7
6
5
4
3
2
1
0
R
0
0
0
0
0
0
DDRJ7
W
DDRJ6
Reset
0
0
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 2-34. Port J Data Direction Register (DDRJ)
Read: Anytime.
Write: Anytime.
Table 2-28. DDRJ Field Descriptions
Description
Field
7–6
Data Direction Port J — This register configures port pins J[7:6] as either input or output.
DDRJ[7:6] DDRJ[7:6] — Data Direction Port J
0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus cycles until the correct value is read on PTJ
or PTIJ registers, when changing the DDRJ register.
2.3.2.5.4
Port J Reduced Drive Register (RDRJ)
Module Base + 0x002B
7
6
5
4
3
2
1
0
R
0
0
0
0
0
0
RDRJ7
W
RDRJ6
Reset
0
0
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 2-35. Port J Reduced Drive Register (RDRJ)
Read: Anytime.
Write: Anytime.
Table 2-29. RDRJ Field Descriptions
Description
Field
7–6
Reduced Drive Port J — This register configures the drive strength of each port J output pin as either full or
RDRJ[7:6] reduced. If the port is used as input this bit is ignored.
0 Full drive strength at output.
1 Associated pin drives at about 1/3 of the full drive strength.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.5.5
Port J Pull Device Enable Register (PERJ)
Module Base + 0x002C
7
6
5
4
3
2
1
0
R
0
0
0
0
0
0
PERJ7
W
PERJ6
Reset
0
0
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 2-36. Port J Pull Device Enable Register (PERJ)
Read: Anytime.
Write: Anytime.
Table 2-30. PERJ Field Descriptions
Description
Field
7–6
Reduced Drive Port J — This register configures whether a pull-up or a pull-down device is activated, if the port
PERJ[7:6] is used as input or as wired-or output. This bit has no effect if the port is used as push-pull output.
0 Pull-up or pull-down device is disabled.
1 Either a pull-up or pull-down device is enabled.
2.3.2.5.6
Port J Polarity Select Register (PPSJ)
Module Base + 0x002D
7
6
5
4
3
2
1
0
R
0
0
0
0
0
0
PPSJ7
W
PPSJ6
Reset
0
0
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 2-37. Port J Polarity Select Register (PPSJ)
Read: Anytime.
Write: Anytime.
Table 2-31. PPSJ Field Descriptions
Description
Field
7–6
Reduced Drive Port J — This register serves a dual purpose by selecting the polarity of the active interrupt edge
PPSJ[7:6] as well as selecting a pull-up or pull-down device if enabled.
0 Falling edge on the associated port J pin sets the associated flag bit in the PIFJ register.
A pull-up device is connected to the associated port J pin, if enabled by the associated bit in register PERJ
and if the port is used as general purpose input.
1 Rising edge on the associated port J pin sets the associated flag bit in the PIFJ register.
A pull-down device is connected to the associated port J pin, if enabled by the associated bit in register PERJ
and if the port is used as input.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.5.7
Port J Interrupt Enable Register (PIEJ)
Module Base + 0x002E
7
6
5
4
3
2
1
0
R
0
0
0
0
0
0
PIEJ7
W
PIEJ6
Reset
0
0
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 2-38. Port J Interrupt Enable Register (PIEJ)
Read: Anytime.
Write: Anytime.
Table 2-32. PIEJ Field Descriptions
Description
Field
7–6
PIEJ[7:6]
Interrupt Enable Port J — This register disables or enables on a per pin basis the edge sensitive external
interrupt associated with port J.
0 Interrupt is disabled (interrupt flag masked).
1 Interrupt is enabled.
2.3.2.5.8
Port J Interrupt Flag Register (PIFJ)
Module Base + 0x002F
7
6
5
4
3
2
1
0
R
0
0
0
0
0
0
PIFJ7
W
PIFJ6
Reset
0
0
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 2-39. Port J Interrupt Flag Register (PIFJ)
Read: Anytime.
Write: Anytime.
Table 2-33. PIFJ Field Descriptions
Description
Field
7–6
PIFJ[7:6]
Interrupt Flags Port J — Each flag is set by an active edge on the associated input pin. This could be a rising
or a falling edge based on the state of the PPSJ register. To clear this flag, write “1” to the corresponding bit in
the PIFJ register. Writing a “0” has no effect.
0 No active edge pending.
Writing a “0” has no effect.
1 Active edge on the associated bit has occurred (an interrupt will occur if the associated enable bit is set).
Writing a “1” clears the associated flag.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.6
Port AD Registers
2.3.2.6.1
Port AD I/O Register (PTAD)
Module Base + 0x0030
7
6
5
4
3
2
1
0
R
PTAD7
W
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
Reset
0
0
0
0
0
0
0
0
Figure 2-40. Port AD I/O Register (PTAD)
Read: Anytime.
Write: Anytime.
If the data direction bits of the associated I/O pins are set to 1, a read returns the value of the port register,
otherwise the value at the pins is read.
2.3.2.6.2
Port AD Input Register (PTIAD)
Module Base + 0x0031
7
6
5
4
3
2
1
0
R
W
PTIAD7
PTIAD6
PTIAD5
PTIAD4
PTIAD3
PTIAD2
PTIAD1
PTIAD0
Reset
—
—
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 2-41. Port AD Input Register (PTIAD)
Read: Anytime.
Write: Never, writes to this register have no effect.
This register always reads back the status of the associated pins. This can be used to detect overload or
short circuit conditions on output pins.
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2.3.2.6.3
Port AD Data Direction Register (DDRAD)
Module Base + 0x0032
7
6
5
4
3
2
1
0
R
DDRAD7
W
DDRAD6
DDRAD5
DDRAD4
DDRAD3
DDRAD2
DDRAD1
DDRAD0
Reset
0
0
0
0
0
0
0
0
Figure 2-42. Port AD Data Direction Register (DDRAD)
Read: Anytime.
Write: Anytime.
Table 2-34. DDRAD Field Descriptions
Description
Field
7–0
Data Direction Port AD — This register configures port pins AD[7:0] as either input or output.
DDRAD[7:0] 0 Associated pin is configured as input.
1 Associated pin is configured as output.
Note: Due to internal synchronization circuits, it can take up to 2 bus cycles until the correct value is read on
PTAD or PTIAD registers, when changing the DDRAD register.
2.3.2.6.4
Port AD Reduced Drive Register (RDRAD)
Module Base + 0x0033
7
6
5
4
3
2
1
0
R
RDRAD7
W
RDRAD6
RDRAD5
RDRAD4
RDRAD3
RDRAD2
RDRAD1
RDRAD0
Reset
0
0
0
0
0
0
0
0
Figure 2-43. Port AD Reduced Drive Register (RDRAD)
Read: Anytime.
Write: Anytime.
Table 2-35. RDRAD Field Descriptions
Description
Field
7–0
Reduced Drive Port AD — This register configures the drive strength of each port AD output pin as either full
RDRAD[7:0] or reduced. If the port is used as input this bit is ignored.
0 Full drive strength at output.
1 Associated pin drives at about 1/3 of the full drive strength.
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.3.2.6.5
Port AD Pull Device Enable Register (PERAD)
Module Base + 0x0034
7
6
5
4
3
2
1
0
R
PERAD7
W
PERAD6
PERAD5
PERAD4
PERAD3
PERAD2
PERAD1
PERAD0
Reset
0
0
0
0
0
0
0
0
Figure 2-44. Port AD Pull Device Enable Register (PERAD)
Read: Anytime.
Write: Anytime.
Table 2-36. PERAD Field Descriptions
Description
Field
7–0
Pull Device Enable Port AD — This register configures whether a pull-up or a pull-down device is activated, if
PERAD[7:0] the port is used as input. This bit has no effect if the port is used as output. Out of reset no pull device is enabled.
It is not possible to enable pull devices when a associated ATD channel is enabled simultaneously.
0 Pull-up or pull-down device is disabled.
1 Either a pull-up or pull-down device is enabled.
2.3.2.6.6
Port AD Polarity Select Register (PPSAD)
Module Base + 0x0035
7
6
5
4
3
2
1
0
R
PPSAD7
W
PPSAD6
PPSAD5
PPSAD4
PPSAD3
PPSAD2
PPSAD1
PPSAD0
Reset
0
0
0
0
0
0
0
0
Figure 2-45. Port AD Polarity Select Register (PPSAD)
Read: Anytime.
Write: Anytime.
Table 2-37. PPSAD Field Descriptions
Description
Field
7–0
Pull Select Port AD — This register selects whether a pull-down or a pull-up device is connected to the pin.
PPSAD[7:0] 0 A pull-up device is connected to the associated port AD pin, if enabled by the associated bit in register PERAD
and if the port is used as input.
1 A pull-down device is connected to the associated port AD pin, if enabled by the associated bit in register
PERAD and if the port is used as input.
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2.4
Functional Description
Each pin can act as general purpose I/O. In addition the pin can act as an output from a peripheral module
or an input to a peripheral module.
A set of configuration registers is common to all ports. All registers can be written at any time, however a
specific configuration might not become active.
Example: Selecting a pull-up resistor. This resistor does not become active while the port is used as a push-
pull output.
2.4.1
Registers
2.4.1.1
I/O Register
This register holds the value driven out to the pin if the port is used as a general purpose I/O. Writing to
this register has only an effect on the pin if the port is used as general purpose output. When reading this
address, the value of the pins are returned if the data direction register bits are set to 0.
If the data direction register bits are set to 1, the contents of the I/O register is returned. This is independent
of any other configuration (Figure 2-46).
PTI
0
1
PAD
0
1
PT
0
1
DDR
Data Out
Module
Output Enable
Module Enable
Figure 2-46. Illustration of I/O Pin Functionality
2.4.1.2
Input Register
This is a read-only register and always returns the value of the pin (Figure 2-46).
2.4.1.3
Data Direction Register
This register defines whether the pin is used as an input or an output. If a peripheral module controls the
pin the contents of the data direction register is ignored (Figure 2-46).
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Chapter 2 Port Integration Module (PIM9C32) Block Description
2.4.1.4
Reduced Drive Register
If the port is used as an output the register allows the configuration of the drive strength.
2.4.1.5
Pull Device Enable Register
This register turns on a pull-up or pull-down device. It becomes only active if the pin is used as an input
or as a wired-or output.
2.4.1.6
Polarity Select Register
This register selects either a pull-up or pull-down device if enabled. It becomes only active if the pin is
used as an input. A pull-up device can be activated if the pin is used as a wired-OR output.
2.4.2
Port Descriptions
Port T
2.4.2.1
This port is associated with the Standard Capture Timer. PWM output channels can be rerouted from port
P to port pins T. In all modes, port T pins can be used for either general-purpose I/O, Standard Capture
Timer I/O or as PWM channels module, if so configured by MODRR.
During reset, port T pins are configured as high-impedance inputs.
2.4.2.2
Port S
This port is associated with the serial SCI module. Port S pins PS[3:0] can be used either for general-
purpose I/O, or with the SCI subsystem.
During reset, port S pins are configured as inputs with pull-up.
2.4.2.3
Port M
This port is associated with the MSCAN and SPI module. Port M pins PM[5:0] can be used either for
general-purpose I/O, with the MSCAN or SPI subsystems.
During reset, port M pins are configured as inputs with pull-up.
2.4.2.4
Port AD
This port is associated with the ATD module. Port AD pins can be used either for general-purpose I/O, or
for the ATD subsystem. There are 2 data port registers associated with the Port AD: PTAD[7:0], located
in the PIM and PORTAD[7:0] located in the ATD.
To use PTAD[n] as a standard input port, the corresponding DDRD[n] must be cleared. To use PTAD[n]
as a standard output port, the corresponding DDRD[n] must be set
NOTE: To use PORTAD[n], located in the ATD as an input port register, DDRD[n] must be cleared and
ATDDIEN[n] must be set. Please refer to ATD Block Guide for details.
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2.4.2.5
Port P
The PWM module is connected to port P. Port P pins can be used as PWM outputs. Further the Keypad
Wake-Up function is implemented on pins PP[7:0]. During reset, port P pins are configured as high-
impedance inputs.
Port P offers 8 general purpose I/O pins with edge triggered interrupt capability in wired-or fashion. The
interrupt enable as well as the sensitivity to rising or falling edges can be individually configured on per
pin basis. All 8 bits/pins share the same interrupt vector. Interrupts can be used with the pins configured
as inputs or outputs.
An interrupt is generated when a bit in the port interrupt flag register and its corresponding port interrupt
enable bit are both set. This external interrupt feature is capable to wake up the CPU when it is in STOP
or WAIT mode.
A digital filter on each pin prevents pulses (Figure 2-48) shorter than a specified time from generating an
interrupt. The minimum time varies over process conditions, temperature and voltage (Figure 2-47 and
Table 2-38).
Glitch, filtered out, no interrupt flag set
Valid pulse, interrupt flag set
t
pign
t
pval
Figure 2-47. Interrupt Glitch Filter on Port P and J (PPS = 0)
Table 2-38. Pulse Detection Criteria
STOP Mode
Value
STOP(1) Mode
Value
Pulse
Unit
Unit
Ignored
Uncertain
Valid
tpign <= 3
Bus clocks
Bus clocks
Bus clocks
tpign <= 3.2
3.2 < tpulse < 10
tpval >= 10
µs
µs
µs
3 < tpulse < 4
t
pval >= 4
1. These values include the spread of the oscillator frequency over temperature,
voltage and process.
tpulse
Figure 2-48. Pulse Illustration
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A valid edge on input is detected if 4 consecutive samples of a passive level are followed by 4 consecutive
samples of an active level directly or indirectly.
The filters are continuously clocked by the bus clock in RUN and WAIT mode. In STOP mode the clock
is generated by a single RC oscillator in the Port Integration Module. To maximize current saving the RC
oscillator runs only if the following condition is true on any pin:
Sample count <= 4 and port interrupt enabled (PIE=1) and port interrupt flag not set (PIF=0).
2.4.2.6
Port J
In all modes, port J pins PJ[7:6] can be used for general purpose I/O or interrupt driven general purpose
I/O’s. During reset, port J pins are configured as inputs.
Port J offers 2 I/O ports with the same interrupt features as on port P.
2.4.3
Port A, B, E and BKGD Pin
All port and pin logic is located in the core module. Please refer to S12_mebi Block User Guide for details.
2.4.4
External Pin Descriptions
All ports start up as general purpose inputs on reset.
2.4.5
Low Power Options
Run Mode
2.4.5.1
No low power options exist for this module in run mode.
2.4.5.2
Wait Mode
No low power options exist for this module in wait mode.
2.4.5.3
Stop Mode
All clocks are stopped. There are asynchronous paths to generate interrupts from STOP on port P and J.
2.5
Initialization Information
The reset values of all registers are given in Section 2.3.2, “Register Descriptions”.
2.5.1
Reset Initialization
All registers including the data registers get set/reset asynchronously. Table 2-39 summarizes the port
properties after reset initialization.
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Table 2-39. Port Reset State Summary
Reset States
Port
Data Direction
Pull Mode
Reduced Drive
Wired-OR Mode
Interrupt
T
S
M
P
J
Input
Input
Input
Input
Input
Hi-z
Pull up
Pull up
Hi-z
Disabled
Disabled
Disabled
Disabled
Disabled
n/a
Disabled
Disabled
n/a
n/a
n/a
n/a
Disabled
Disabled
Hi-z
n/a
A
B
E
Refer to MEBI Block Guide for details.
Refer to BDM Block Guide for details.
BKGD pin
2.6
Interrupts
Port P and J generate a separate edge sensitive interrupt if enabled.
2.6.1
Interrupt Sources
Table 2-40. Port Integration Module Interrupt Sources
Interrupt Source
Interrupt Flag
Local Enable
Global (CCR) Mask
Port P
Port J
PIFP[7:0]
PIFJ[7:6]
PIEP[7:0]
PIEJ[7:6]
I Bit
I Bit
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
2.6.2
Recovery from STOP
The PIM can generate wake-up interrupts from STOP on port P and J. For other sources of external
interrupts please refer to the respective Block User Guide.
2.7
Application Information
It is not recommended to write PORTx and DDRx in a word access. When changing the register pins from
inputs to outputs, the data may have extra transitions during the write access. Initialize the port data register
before enabling the outputs.
Power consumption will increase the more the voltages on general purpose input pins deviate from the
supply voltages towards mid-range because the digital input buffers operate in the linear region.
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Chapter 3
Module Mapping Control (MMCV4) Block Description
3.1
Introduction
This section describes the functionality of the module mapping control (MMC) sub-block of the S12 core
platform.
The block diagram of the MMC is shown in Figure 3-1.
MMC
MMC_SECURE
SECURE
SECURITY
BDM_UNSECURE
STOP, WAIT
ADDRESS DECODE
READ & WRITE ENABLES
CLOCKS, RESET
REGISTERS
PORT K INTERFACE
INTERNAL MEMORY
EXPANSION
MODE INFORMATION
MEMORY SPACE SELECT(S)
PERIPHERAL SELECT
CORE SELECT (S)
EBI ALTERNATE ADDRESS BUS
EBI ALTERNATE WRITE DATA BUS
EBI ALTERNATE READ DATA BUS
ALTERNATE ADDRESS BUS (BDM)
ALTERNATE WRITE DATA BUS (BDM)
BUS CONTROL
CPU ADDRESS BUS
CPU READ DATA BUS
ALTERNATE READ DATA BUS (BDM)
CPU WRITE DATA BUS
CPU CONTROL
Figure 3-1. MMC Block Diagram
The MMC is the sub-module which controls memory map assignment and selection of internal resources
and external space. Internal buses between the core and memories and between the core and peripherals is
controlled in this module. The memory expansion is generated in this module.
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3.1.1
Features
•
Registers for mapping of address space for on-chip RAM, EEPROM, and FLASH (or ROM)
memory blocks and associated registers
•
•
•
•
•
•
•
•
•
•
Memory mapping control and selection based upon address decode and system operating mode
Core address bus control
Core data bus control and multiplexing
Core security state decoding
Emulation chip select signal generation (ECS)
External chip select signal generation (XCS)
Internal memory expansion
External stretch and ROM mapping control functions via the MISC register
Reserved registers for test purposes
Configurable system memory options defined at integration of core into the system-on-a-chip
(SoC).
3.1.2
Modes of Operation
Some of the registers operate differently depending on the mode of operation (i.e., normal expanded wide,
special single chip, etc.). This is best understood from the register descriptions.
3.2
External Signal Description
All interfacing with the MMC sub-block is done within the core, it has no external signals.
3.3
Memory Map and Register Definition
A summary of the registers associated with the MMC sub-block is shown in Figure 3-2. Detailed
descriptions of the registers and bits are given in the subsections that follow.
3.3.1
Module Memory Map
Table 3-1. MMC Memory Map
Address
Offset
Register
Access
0x0010
0x0011
0x0012
0x0013
0x0014
Initialization of Internal RAM Position Register (INITRM)
Initialization of Internal Registers Position Register (INITRG)
Initialization of Internal EEPROM Position Register (INITEE)
Miscellaneous System Control Register (MISC)
Reserved
R/W
R/W
R/W
R/W
—
.
.
.
.
—
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Table 3-1. MMC Memory Map (continued)
Address
Offset
Register
Access
0x0017
Reserved
—
—
.
.
.
.
0x001C
0x001D
Memory Size Register 0 (MEMSIZ0)
Memory Size Register 1 (MEMSIZ1)
R
R
.
.
.
.
0x0030
0x0031
Program Page Index Register (PPAGE)
Reserved
R/W
—
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3.3.2
Register Descriptions
Name
Bit 7
6
5
4
3
2
1
Bit 0
0x0010
INITRM
R
0
0
RAM15
RAM14
RAM13
RAM12
RAM11
RAMHAL
W
0x0011
INITRG
R
0
0
0
0
0
0
REG14
REG13
REG12
REG11
EE11
W
0x0012
INITEE
R
EE15
0
EE14
0
EE13
0
EE12
0
EEON
W
0x0013
MISC
R
EXSTR1
3
EXSTR0
2
ROMHM
1
ROMON
Bit 0
W
0x0014
MTSTO
R
Bit 7
Bit 7
6
6
0
5
5
4
4
W
0x0017
MTST1
R
3
2
1
Bit 0
W
0x001C
MEMSIZ0
R REG_SW0
W
EEP_SW1 EEP_SW0
0
0
RAM_SW2 RAM_SW1 RAM_SW0
0x001D
MEMSIZ1
R ROM_SW1 ROM_SW0
W
0
0
0
PAG_SW1 PAG_SW0
0x0030
PPAGE
R
0
0
0
0
PIX5
0
PIX4
0
PIX3
0
PIX2
0
PIX1
0
PIX0
0
W
0x0031
R
Reserved
W
= Unimplemented
Figure 3-2. MMC Register Summary
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3.3.2.1
Initialization of Internal RAM Position Register (INITRM)
Module Base + 0x0010
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
RAM15
RAM14
RAM13
RAM12
RAM11
RAMHAL
Reset
0
0
0
0
1
0
0
1
= Unimplemented or Reserved
Figure 3-3. Initialization of Internal RAM Position Register (INITRM)
Read: Anytime
Write: Once in normal and emulation modes, anytime in special modes
NOTE
Writes to this register take one cycle to go into effect.
This register initializes the position of the internal RAM within the on-chip system memory map.
Table 3-2. INITRM Field Descriptions
Field
Description
7:3
Internal RAM Map Position — These bits determine the upper five bits of the base address for the system’s
RAM[15:11] internal RAM array.
0
RAM High-Align — RAMHAL specifies the alignment of the internal RAM array.
RAMHAL 0 Aligns the RAM to the lowest address (0x0000) of the mappable space
1 Aligns the RAM to the higher address (0xFFFF) of the mappable space
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3.3.2.2
Initialization of Internal Registers Position Register (INITRG)
Module Base + 0x0011
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
REG14
REG13
REG12
REG11
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-4. Initialization of Internal Registers Position Register (INITRG)
Read: Anytime
Write: Once in normal and emulation modes and anytime in special modes
This register initializes the position of the internal registers within the on-chip system memory map. The
registers occupy either a 1K byte or 2K byte space and can be mapped to any 2K byte space within the first
32K bytes of the system’s address space.
Table 3-3. INITRG Field Descriptions
Field
Description
6:3
Internal Register Map Position — These four bits in combination with the leading zero supplied by bit 7 of
REG[14:11] INITRG determine the upper five bits of the base address for the system’s internal registers (i.e., the minimum
base address is 0x0000 and the maximum is 0x7FFF).
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3.3.2.3
Initialization of Internal EEPROM Position Register (INITEE)
Module Base + 0x0012
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
EE15
EE14
EE13
EE12
EE11
EEON
Reset1
—
—
—
—
—
—
—
—
1. The reset state of this register is controlled at chip integration. Please refer to the device overview section to determine the
actual reset state of this register.
= Unimplemented or Reserved
Figure 3-5. Initialization of Internal EEPROM Position Register (INITEE)
Read: Anytime
Write: The EEON bit can be written to any time on all devices. Bits E[11:15] are “write anytime in all
modes” on most devices. On some devices, bits E[11:15] are “write once in normal and emulation modes
and write anytime in special modes”. See device overview chapter to determine the actual write access
rights.
NOTE
Writes to this register take one cycle to go into effect.
This register initializes the position of the internal EEPROM within the on-chip system memory map.
Table 3-4. INITEE Field Descriptions
Field
Description
7:3
Internal EEPROM Map Position — These bits determine the upper five bits of the base address for the system’s
EE[15:11] internal EEPROM array.
0
Enable EEPROM — This bit is used to enable the EEPROM memory in the memory map.
EEON
0 Disables the EEPROM from the memory map.
1 Enables the EEPROM in the memory map at the address selected by EE[15:11].
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3.3.2.4
Miscellaneous System Control Register (MISC)
Module Base + 0x0013
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
0
0
0
0
EXSTR1
EXSTR0
ROMHM
ROMON
W
Reset: Expanded
or Emulation
1
0
0
0
0
1
1
0
—
Reset: Peripheral
or Single Chip
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
0
Reset: Special Test
1. The reset state of this bit is determined at the chip integration level.
= Unimplemented or Reserved
Figure 3-6. Miscellaneous System Control Register (MISC)
Read: Anytime
Write: As stated in each bit description
NOTE
Writes to this register take one cycle to go into effect.
This register initializes miscellaneous control functions.
Table 3-5. INITEE Field Descriptions
Field
Description
3:2
External Access Stretch Bits 1 and 0
EXSTR[1:0] Write: once in normal and emulation modes and anytime in special modes
This two-bit field determines the amount of clock stretch on accesses to the external address space as shown in
Table 3-6. In single chip and peripheral modes these bits have no meaning or effect.
1
FLASH EEPROM or ROM Only in Second Half of Memory Map
ROMHM
Write: once in normal and emulation modes and anytime in special modes
0 The fixed page(s) of FLASH EEPROM or ROM in the lower half of the memory map can be accessed.
1 Disables direct access to the FLASH EEPROM or ROM in the lower half of the memory map. These physical
locations of the FLASH EEPROM or ROM remain accessible through the program page window.
0
ROMON — Enable FLASH EEPROM or ROM
ROMON
Write: once in normal and emulation modes and anytime in special modes
This bit is used to enable the FLASH EEPROM or ROM memory in the memory map.
0 Disables the FLASH EEPROM or ROM from the memory map.
1 Enables the FLASH EEPROM or ROM in the memory map.
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Table 3-6. External Stretch Bit Definition
Stretch Bit EXSTR1 Stretch Bit EXSTR0 Number of E Clocks Stretched
0
0
1
1
0
1
0
1
0
1
2
3
3.3.2.5
Reserved Test Register 0 (MTST0)
Module Base + 0x0014
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 3-7. Reserved Test Register 0 (MTST0)
Read: Anytime
Write: No effect — this register location is used for internal test purposes.
3.3.2.6
Reserved Test Register 1 (MTST1)
Module Base + 0x0017
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
1
0
0
0
0
= Unimplemented or Reserved
Figure 3-8. Reserved Test Register 1 (MTST1)
Read: Anytime
Write: No effect — this register location is used for internal test purposes.
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3.3.2.7
Memory Size Register 0 (MEMSIZ0)
Module Base + 0x001C
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
REG_SW0
0
EEP_SW1
EEP_SW0
0
RAM_SW2 RAM_SW1 RAM_SW0
Reset
—
—
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 3-9. Memory Size Register 0 (MEMSIZ0)
Read: Anytime
Write: Writes have no effect
Reset: Defined at chip integration, see device overview section.
The MEMSIZ0 register reflects the state of the register, EEPROM and RAM memory space configuration
switches at the core boundary which are configured at system integration. This register allows read
visibility to the state of these switches.
Table 3-7. MEMSIZ0 Field Descriptions
Field
Description
7
Allocated System Register Space
REG_SW0
0
1
Allocated system register space size is 1K byte
Allocated system register space size is 2K byte
5:4
Allocated System EEPROM Memory Space — The allocated system EEPROM memory space size is as
EEP_SW[1:0] given in Table 3-8.
2
Allocated System RAM Memory Space — The allocated system RAM memory space size is as given in
RAM_SW[2:0] Table 3-9.
Table 3-8. Allocated EEPROM Memory Space
eep_sw1:eep_sw0
Allocated EEPROM Space
00
01
10
11
0K byte
2K bytes
4K bytes
8K bytes
Table 3-9. Allocated RAM Memory Space
Allocated
RAM Space
RAM
Mappable Region
INITRM
Bits Used
RAM Reset
ram_sw2:ram_sw0
Base Address(1)
000
001
010
2K bytes
4K bytes
6K bytes
2K bytes
4K bytes
8K bytes(2)
RAM[15:11]
RAM[15:12]
RAM[15:13]
0x0800
0x0000
0x0800
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Table 3-9. Allocated RAM Memory Space (continued)
Allocated
RAM Space
RAM
Mappable Region
INITRM
Bits Used
RAM Reset
ram_sw2:ram_sw0
Base Address(1)
011
100
101
110
111
8K bytes
10K bytes
12K bytes
14K bytes
16K bytes
8K bytes
16K bytes 2
16K bytes 2
16K bytes 2
16K bytes
RAM[15:13]
RAM[15:14]
RAM[15:14]
RAM[15:14]
RAM[15:14]
0x0000
0x1800
0x1000
0x0800
0x0000
1. The RAM Reset BASE Address is based on the reset value of the INITRM register, 0x0009.
2. Alignment of the Allocated RAM space within the RAM mappable region is dependent on the value of RAMHAL.
NOTE
As stated, the bits in this register provide read visibility to the system
physical memory space allocations defined at system integration. The actual
array size for any given type of memory block may differ from the allocated
size. Please refer to the device overview chapter for actual sizes.
3.3.2.8
Memory Size Register 1 (MEMSIZ1)
Module Base + 0x001D
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
ROM_SW1 ROM_SW0
0
0
0
0
PAG_SW1
PAG_SW0
Reset
—
—
—
—
—
—
—
—
= Unimplemented or Reserved
Figure 3-10. Memory Size Register 1 (MEMSIZ1)
Read: Anytime
Write: Writes have no effect
Reset: Defined at chip integration, see device overview section.
The MEMSIZ1 register reflects the state of the FLASH or ROM physical memory space and paging
switches at the core boundary which are configured at system integration. This register allows read
visibility to the state of these switches.
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Table 3-10. MEMSIZ0 Field Descriptions
Field
Description
7:6
Allocated System FLASH or ROM Physical Memory Space — The allocated system FLASH or ROM
ROM_SW[1:0] physical memory space is as given in Table 3-11.
1:0 Allocated Off-Chip FLASH or ROM Memory Space — The allocated off-chip FLASH or ROM memory space
PAG_SW[1:0] size is as given in Table 3-12.
Table 3-11. Allocated FLASH/ROM Physical Memory Space
Allocated FLASH
or ROM Space
rom_sw1:rom_sw0
00
01
10
11
0K byte
16K bytes
48K bytes(1)
64K bytes(1)
NOTES:
1. The ROMHM software bit in the MISC register determines the accessibility of the
FLASH/ROM memory space. Please refer to Section 3.3.2.8, “Memory Size Register 1
(MEMSIZ1),” for a detailed functional description of the ROMHM bit.
Table 3-12. Allocated Off-Chip Memory Options
pag_sw1:pag_sw0
Off-Chip Space
On-Chip Space
00
01
10
11
876K bytes
768K bytes
512K bytes
0K byte
128K bytes
256K bytes
512K bytes
1M byte
NOTE
As stated, the bits in this register provide read visibility to the system
memory space and on-chip/off-chip partitioning allocations defined at
system integration. The actual array size for any given type of memory
block may differ from the allocated size. Please refer to the device overview
chapter for actual sizes.
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3.3.2.9
Program Page Index Register (PPAGE)
Module Base + 0x0030
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
PIX5
PIX4
PIX3
PIX2
PIX1
PIX0
Reset1
—
—
—
—
—
—
—
—
1. The reset state of this register is controlled at chip integration. Please refer to the device overview section to determine the
actual reset state of this register.
= Unimplemented or Reserved
Figure 3-11. Program Page Index Register (PPAGE)
Read: Anytime
Write: Determined at chip integration. Generally it’s: “write anytime in all modes;” on some devices it will
be: “write only in special modes.” Check specific device documentation to determine which applies.
Reset: Defined at chip integration as either 0x00 (paired with write in any mode) or 0x3C (paired with
write only in special modes), see device overview chapter.
The HCS12 core architecture limits the physical address space available to 64K bytes. The program page
index register allows for integrating up to 1M byte of FLASH or ROM into the system by using the six
page index bits to page 16K byte blocks into the program page window located from 0x8000 to 0xBFFF
as defined in Table 3-14. CALL and RTC instructions have special access to read and write this register
without using the address bus.
NOTE
Normal writes to this register take one cycle to go into effect. Writes to this
register using the special access of the CALL and RTC instructions will be
complete before the end of the associated instruction.
Table 3-13. MEMSIZ0 Field Descriptions
Field
Description
5:0
Program Page Index Bits 5:0 — These page index bits are used to select which of the 64 FLASH or ROM
PIX[5:0]
array pages is to be accessed in the program page window as shown in Table 3-14.
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Table 3-14. Program Page Index Register Bits
Program Space
Selected
PIX5
PIX4
PIX3
PIX2
PIX1
PIX0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
1
16K page 0
16K page 1
16K page 2
16K page 3
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.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
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3.4
Functional Description
The MMC sub-block performs four basic functions of the core operation: bus control, address decoding
and select signal generation, memory expansion, and security decoding for the system. Each aspect is
described in the following subsections.
3.4.1
Bus Control
The MMC controls the address bus and data buses that interface the core with the rest of the system. This
includes the multiplexing of the input data buses to the core onto the main CPU read data bus and control
of data flow from the CPU to the output address and data buses of the core. In addition, the MMC manages
all CPU read data bus swapping operations.
3.4.2
Address Decoding
As data flows on the core address bus, the MMC decodes the address information, determines whether the
internal core register or firmware space, the peripheral space or a memory register or array space is being
addressed and generates the correct select signal. This decoding operation also interprets the mode of
operation of the system and the state of the mapping control registers in order to generate the proper select.
The MMC also generates two external chip select signals, emulation chip select (ECS) and external chip
select (XCS).
3.4.2.1
Select Priority and Mode Considerations
Although internal resources such as control registers and on-chip memory have default addresses, each can
be relocated by changing the default values in control registers. Normally, I/O addresses, control registers,
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vector spaces, expansion windows, and on-chip memory are mapped so that their address ranges do not
overlap. The MMC will make only one select signal active at any given time. This activation is based upon
the priority outlined in Table 3-15. If two or more blocks share the same address space, only the select
signal for the block with the highest priority will become active. An example of this is if the registers and
the RAM are mapped to the same space, the registers will have priority over the RAM and the portion of
RAM mapped in this shared space will not be accessible. The expansion windows have the lowest priority.
This means that registers, vectors, and on-chip memory are always visible to a program regardless of the
values in the page select registers.
Table 3-15. Select Signal Priority
Priority
Address Space
Highest
BDM (internal to core) firmware or register space
Internal register space
...
...
RAM memory block
...
EEPROM memory block
...
On-chip FLASH or ROM
Lowest
Remaining external space
In expanded modes, all address space not used by internal resources is by default external memory space.
The data registers and data direction registers for ports A and B are removed from the on-chip memory
map and become external accesses. If the EME bit in the MODE register (see MEBI block description
chapter) is set, the data and data direction registers for port E are also removed from the on-chip memory
map and become external accesses.
In special peripheral mode, the first 16 registers associated with bus expansion are removed from the on-
chip memory map (PORTA, PORTB, DDRA, DDRB, PORTE, DDRE, PEAR, MODE, PUCR, RDRIV,
and the EBI reserved registers).
In emulation modes, if the EMK bit in the MODE register (see MEBI block description chapter) is set, the
data and data direction registers for port K are removed from the on-chip memory map and become
external accesses.
3.4.2.2
Emulation Chip Select Signal
When the EMK bit in the MODE register (see MEBI block description chapter) is set, port K bit 7 is used
as an active-low emulation chip select signal, ECS. This signal is active when the system is in emulation
mode, the EMK bit is set and the FLASH or ROM space is being addressed subject to the conditions
outlined in Section 3.4.3.2, “Extended Address (XAB19:14) and ECS Signal Functionality.” When the
EMK bit is clear, this pin is used for general purpose I/O.
3.4.2.3
External Chip Select Signal
When the EMK bit in the MODE register (see MEBI block description chapter) is set, port K bit 6 is used
as an active-low external chip select signal, XCS. This signal is active only when the ECS signal described
above is not active and when the system is addressing the external address space. Accesses to
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unimplemented locations within the register space or to locations that are removed from the map (i.e., ports
A and B in expanded modes) will not cause this signal to become active. When the EMK bit is clear, this
pin is used for general purpose I/O.
3.4.3
Memory Expansion
The HCS12 core architecture limits the physical address space available to 64K bytes. The program page
index register allows for integrating up to 1M byte of FLASH or ROM into the system by using the six
page index bits to page 16K byte blocks into the program page window located from 0x8000 to 0xBFFF
in the physical memory space. The paged memory space can consist of solely on-chip memory or a
combination of on-chip and off-chip memory. This partitioning is configured at system integration through
the use of the paging configuration switches (pag_sw1:pag_sw0) at the core boundary. The options
available to the integrator are as given in Table 3-16 (this table matches Table 3-12 but is repeated here for
easy reference).
Table 3-16. Allocated Off-Chip Memory Options
pag_sw1:pag_sw0
Off-Chip Space
On-Chip Space
00
01
10
11
876K bytes
768K bytes
512K bytes
0K byte
128K bytes
256K bytes
512K bytes
1M byte
Based upon the system configuration, the program page window will consider its access to be either
internal or external as defined in Table 3-17.
Table 3-17. External/Internal Page Window Access
Page Window
pag_sw1:pag_sw0
Partitioning
PIX5:0 Value
Access
00
876K off-Chip,
128K on-Chip
0x0000–0x0037
0x0038–0x003F
0x0000–0x002F
0x0030–0x003F
0x0000–0x001F
0x0020–0x003F
N/A
External
Internal
External
Internal
External
Internal
External
Internal
01
10
11
768K off-chip,
256K on-chip
512K off-chip,
512K on-chip
0K off-chip,
1M on-chip
0x0000–0x003F
NOTE
The partitioning as defined in Table 3-17 applies only to the allocated
memory space and the actual on-chip memory sizes implemented in the
system may differ. Please refer to the device overview chapter for actual
sizes.
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The PPAGE register holds the page select value for the program page window. The value of the PPAGE
register can be manipulated by normal read and write (some devices don’t allow writes in some modes)
instructions as well as the CALL and RTC instructions.
Control registers, vector spaces, and a portion of on-chip memory are located in unpaged portions of the
64K byte physical address space. The stack and I/O addresses should also be in unpaged memory to make
them accessible from any page.
The starting address of a service routine must be located in unpaged memory because the 16-bit exception
vectors cannot point to addresses in paged memory. However, a service routine can call other routines that
are in paged memory. The upper 16K byte block of memory space (0xC000–0xFFFF) is unpaged. It is
recommended that all reset and interrupt vectors point to locations in this area.
3.4.3.1
CALL and Return from Call Instructions
CALL and RTC are uninterruptable instructions that automate page switching in the program expansion
window. CALL is similar to a JSR instruction, but the subroutine that is called can be located anywhere in
the normal 64K byte address space or on any page of program expansion memory. CALL calculates and
stacks a return address, stacks the current PPAGE value, and writes a new instruction-supplied value to
PPAGE. The PPAGE value controls which of the 64 possible pages is visible through the 16K byte
expansion window in the 64K byte memory map. Execution then begins at the address of the called
subroutine.
During the execution of a CALL instruction, the CPU:
•
Writes the old PPAGE value into an internal temporary register and writes the new instruction-
supplied PPAGE value into the PPAGE register.
•
Calculates the address of the next instruction after the CALL instruction (the return address), and
pushes this 16-bit value onto the stack.
•
•
Pushes the old PPAGE value onto the stack.
Calculates the effective address of the subroutine, refills the queue, and begins execution at the new
address on the selected page of the expansion window.
This sequence is uninterruptable; there is no need to inhibit interrupts during CALL execution. A CALL
can be performed from any address in memory to any other address.
The PPAGE value supplied by the instruction is part of the effective address. For all addressing mode
variations except indexed-indirect modes, the new page value is provided by an immediate operand in the
instruction. In indexed-indirect variations of CALL, a pointer specifies memory locations where the new
page value and the address of the called subroutine are stored. Using indirect addressing for both the new
page value and the address within the page allows values calculated at run time rather than immediate
values that must be known at the time of assembly.
The RTC instruction terminates subroutines invoked by a CALL instruction. RTC unstacks the PPAGE
value and the return address and refills the queue. Execution resumes with the next instruction after the
CALL.
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During the execution of an RTC instruction, the CPU:
•
•
•
•
Pulls the old PPAGE value from the stack
Pulls the 16-bit return address from the stack and loads it into the PC
Writes the old PPAGE value into the PPAGE register
Refills the queue and resumes execution at the return address
This sequence is uninterruptable; an RTC can be executed from anywhere in memory, even from a different
page of extended memory in the expansion window.
The CALL and RTC instructions behave like JSR and RTS, except they use more execution cycles.
Therefore, routinely substituting CALL/RTC for JSR/RTS is not recommended. JSR and RTS can be used
to access subroutines that are on the same page in expanded memory. However, a subroutine in expanded
memory that can be called from other pages must be terminated with an RTC. And the RTC unstacks a
PPAGE value. So any access to the subroutine, even from the same page, must use a CALL instruction so
that the correct PPAGE value is in the stack.
3.4.3.2
Extended Address (XAB19:14) and ECS Signal Functionality
If the EMK bit in the MODE register is set (see MEBI block description chapter) the PIX5:0 values will
be output on XAB19:14 respectively (port K bits 5:0) when the system is addressing within the physical
program page window address space (0x8000–0xBFFF) and is in an expanded mode. When addressing
anywhere else within the physical address space (outside of the paging space), the XAB19:14 signals will
be assigned a constant value based upon the physical address space selected. In addition, the active-low
emulation chip select signal, ECS, will likewise function based upon the assigned memory allocation. In
the cases of 48K byte and 64K byte allocated physical FLASH/ROM space, the operation of the ECS
signal will additionally depend upon the state of the ROMHM bit (see Section 3.3.2.4, “Miscellaneous
System Control Register (MISC)”) in the MISC register. Table 3-18, Table 3-19, Table 3-20, and Table 3-
21 summarize the functionality of these signals based upon the allocated memory configuration. Again,
this signal information is only available externally when the EMK bit is set and the system is in an
expanded mode.
Table 3-18. 0K Byte Physical FLASH/ROM Allocated
Address Space
Page Window Access
ROMHM
ECS
XAB19:14
0x0000–0x3FFF
0x4000–0x7FFF
0x8000–0xBFFF
0xC000–0xFFFF
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
1
1
0
0
0x3D
0x3E
PIX[5:0]
0x3F
Table 3-19. 16K Byte Physical FLASH/ROM Allocated
Address Space
Page Window Access
ROMHM
ECS
XAB19:14
0x0000–0x3FFF
0x4000–0x7FFF
0x8000–0xBFFF
0xC000–0xFFFF
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
1
1
1
0
0x3D
0x3E
PIX[5:0]
0x3F
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Table 3-20. 48K Byte Physical FLASH/ROM Allocated
Address Space
Page Window Access
ROMHM
ECS
XAB19:14
0x0000–0x3FFF
0x4000–0x7FFF
N/A
N/A
N/A
0
1
0
1
1
0
0
0x3D
0x3E
N/A
1
0x8000–0xBFFF
0xC000–0xFFFF
External
Internal
N/A
N/A
N/A
N/A
PIX[5:0]
0x3F
Table 3-21. 64K Byte Physical FLASH/ROM Allocated
Address Space
Page Window Access
ROMHM
ECS
XAB19:14
0x0000–0x3FFF
N/A
N/A
0
1
0
1
0
1
1
0
0
0x3D
0x4000–0x7FFF
0x8000–0xBFFF
0xC000–0xFFFF
N/A
0
0x3E
PIX[5:0]
0x3F
N/A
1
External
Internal
N/A
N/A
N/A
N/A
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A graphical example of a memory paging for a system configured as 1M byte on-chip FLASH/ROM with
64K allocated physical space is given in Figure 3-12.
0x0000
61
16K FLASH
(UNPAGED)
0x4000
62
16K FLASH
(UNPAGED)
ONE 16K FLASH/ROM PAGE ACCESSIBLE AT A TIME
(SELECTED BY PPAGE = 0 TO 63)
0x8000
0
1
2
3
59
60
61
62
63
16K FLASH
(PAGED)
0xC000
63
These 16K FLASH/ROM pages accessible from 0x0000 to 0x7FFF if selected
by the ROMHM bit in the MISC register.
16K FLASH
(UNPAGED)
0xFF00
0xFFFF
VECTORS
NORMAL
SINGLE CHIP
Figure 3-12. Memory Paging Example: 1M Byte On-Chip FLASH/ROM, 64K Allocation
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Chapter 4
Multiplexed External Bus Interface (MEBIV3)
4.1
Introduction
This section describes the functionality of the multiplexed external bus interface (MEBI) sub-block of the
S12 core platform. The functionality of the module is closely coupled with the S12 CPU and the memory
map controller (MMC) sub-blocks.
Figure 4-1 is a block diagram of the MEBI. In Figure 4-1, the signals on the right hand side represent pins
that are accessible externally. On some chips, these may not all be bonded out.
The MEBI sub-block of the core serves to provide access and/or visibility to internal core data
manipulation operations including timing reference information at the external boundary of the core and/or
system. Depending upon the system operating mode and the state of bits within the control registers of the
MEBI, the internal 16-bit read and write data operations will be represented in 8-bit or 16-bit accesses
externally. Using control information from other blocks within the system, the MEBI will determine the
appropriate type of data access to be generated.
4.1.1
Features
The block name includes these distinctive features:
•
•
•
•
•
•
•
•
•
External bus controller with four 8-bit ports A,B, E, and K
Data and data direction registers for ports A, B, E, and K when used as general-purpose I/O
Control register to enable/disable alternate functions on ports E and K
Mode control register
Control register to enable/disable pull resistors on ports A, B, E, and K
Control register to enable/disable reduced output drive on ports A, B, E, and K
Control register to configure external clock behavior
Control register to configure IRQ pin operation
Logic to capture and synchronize external interrupt pin inputs
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REGS
PK[7:0]/ECS/XCS/X[19:14]
ADDR
Addr[19:0]
Data[15:0]
ADDR
DATA
PA[7:0]/A[15:8]/
D[15:8]/D[7:0]
EXT
BUS
I/F
CTL
(Control)
PB[7:0]/A[7:0]/
D[7:0]
ADDR
DATA
PE[7:2]/NOACC/
IPIPE1/MODB/CLKTO
IPIPE0/MODA/
ECLK/
LSTRB/TAGLO
R/W
ECLK CTL
PIPE CTL
CPU pipe info
PE1/IRQ
IRQ interrupt
XIRQ interrupt
PE0/XIRQ
IRQ CTL
TAG CTL
BDM tag info
mode
BKGD/MODC/TAGHI
BKGD
Control signal(s)
Data signal (unidirectional)
Data signal (bidirectional)
Data bus (unidirectional)
Data bus (bidirectional)
Figure 4-1. MEBI Block Diagram
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4.1.2
Modes of Operation
•
Normal expanded wide mode
Ports A and B are configured as a 16-bit multiplexed address and data bus and port E provides bus
control and status signals. This mode allows 16-bit external memory and peripheral devices to be
interfaced to the system.
•
Normal expanded narrow mode
Ports A and B are configured as a 16-bit address bus and port A is multiplexed with 8-bit data.
Port E provides bus control and status signals. This mode allows 8-bit external memory and
peripheral devices to be interfaced to the system.
•
•
Normal single-chip mode
There is no external expansion bus in this mode. The processor program is executed from internal
memory. Ports A, B, K, and most of E are available as general-purpose I/O.
Special single-chip mode
This mode is generally used for debugging single-chip operation, boot-strapping, or security
related operations. The active background mode is in control of CPU execution and BDM firmware
is waiting for additional serial commands through the BKGD pin. There is no external expansion
bus after reset in this mode.
•
•
•
Emulation expanded wide mode
Developers use this mode for emulation systems in which the users target application is normal
expanded wide mode.
Emulation expanded narrow mode
Developers use this mode for emulation systems in which the users target application is normal
expanded narrow mode.
Special test mode
Ports A and B are configured as a 16-bit multiplexed address and data bus and port E provides bus
control and status signals. In special test mode, the write protection of many control bits is lifted
so that they can be thoroughly tested without needing to go through reset.
•
Special peripheral mode
This mode is intended for Freescale Semiconductor factory testing of the system. The CPU is
inactive and an external (tester) bus master drives address, data, and bus control signals.
4.2
External Signal Description
In typical implementations, the MEBI sub-block of the core interfaces directly with external system pins.
Some pins may not be bonded out in all implementations.
Table 4-1 outlines the pin names and functions and gives a brief description of their operation reset state
of these pins and associated pull-ups or pull-downs is dependent on the mode of operation and on the
integration of this block at the chip level (chip dependent).
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.
Table 4-1. External System Pins Associated With MEBI
Pin Name
Pin Functions
MODC
Description
BKGD/MODC/
TAGHI
At the rising edge on RESET, the state of this pin is registered into the MODC
bit to set the mode. (This pin always has an internal pullup.)
BKGD
TAGHI
Pseudo open-drain communication pin for the single-wire background debug
mode. There is an internal pull-up resistor on this pin.
When instruction tagging is on, a 0 at the falling edge of E tags the high half of
the instruction word being read into the instruction queue.
PA7/A15/D15/D7
thru
PA0/A8/D8/D0
PA7–PA0
A15–A8
General-purpose I/O pins, see PORTA and DDRA registers.
High-order address lines multiplexed during ECLK low. Outputs except in
special peripheral mode where they are inputs from an external tester system.
D15–D8
High-order bidirectional data lines multiplexed during ECLK high in expanded
wide modes, special peripheral mode, and visible internal accesses (IVIS = 1)
in emulation expanded narrow mode. Direction of data transfer is generally
indicated by R/W.
D15/D7
thru
D8/D0
Alternate high-order and low-order bytes of the bidirectional data lines
multiplexed during ECLK high in expanded narrow modes and narrow accesses
in wide modes. Direction of data transfer is generally indicated by R/W.
PB7/A7/D7
thru
PB0/A0/D0
PB7–PB0
A7–A0
General-purpose I/O pins, see PORTB and DDRB registers.
Low-order address lines multiplexed during ECLK low. Outputs except in
special peripheral mode where they are inputs from an external tester system.
D7–D0
Low-order bidirectional data lines multiplexed during ECLK high in expanded
wide modes, special peripheral mode, and visible internal accesses (with
IVIS = 1) in emulation expanded narrow mode. Direction of data transfer is
generally indicated by R/W.
PE7/NOACC
PE7
General-purpose I/O pin, see PORTE and DDRE registers.
NOACC
CPU No Access output. Indicates whether the current cycle is a free cycle. Only
available in expanded modes.
PE6/IPIPE1/
MODB/CLKTO
MODB
At the rising edge of RESET, the state of this pin is registered into the MODB
bit to set the mode.
PE6
General-purpose I/O pin, see PORTE and DDRE registers.
Instruction pipe status bit 1, enabled by PIPOE bit in PEAR.
IPIPE1
CLKTO
System clock test output. Only available in special modes. PIPOE = 1 overrides
this function. The enable for this function is in the clock module.
PE5/IPIPE0/MODA
MODA
At the rising edge on RESET, the state of this pin is registered into the MODA
bit to set the mode.
PE5
General-purpose I/O pin, see PORTE and DDRE registers.
Instruction pipe status bit 0, enabled by PIPOE bit in PEAR.
IPIPE0
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Table 4-1. External System Pins Associated With MEBI (continued)
Pin Name
PE4/ECLK
Pin Functions
Description
PE4
ECLK
General-purpose I/O pin, see PORTE and DDRE registers.
Bus timing reference clock, can operate as a free-running clock at the system
clock rate or to produce one low-high clock per visible access, with the high
period stretched for slow accesses. ECLK is controlled by the NECLK bit in
PEAR, the IVIS bit in MODE, and the ESTR bit in EBICTL.
PE3/LSTRB/ TAGLO PE3
LSTRB
General-purpose I/O pin, see PORTE and DDRE registers.
Low strobe bar, 0 indicates valid data on D7–D0.
SZ8
In special peripheral mode, this pin is an input indicating the size of the data
transfer (0 = 16-bit; 1 = 8-bit).
TAGLO
In expanded wide mode or emulation narrow modes, when instruction tagging
is on and low strobe is enabled, a 0 at the falling edge of E tags the low half of
the instruction word being read into the instruction queue.
PE2/R/W
PE2
R/W
General-purpose I/O pin, see PORTE and DDRE registers.
Read/write, indicates the direction of internal data transfers. This is an output
except in special peripheral mode where it is an input.
PE1/IRQ
PE0/XIRQ
PK7/ECS
PK6/XCS
PE1
General-purpose input-only pin, can be read even if IRQ enabled.
Maskable interrupt request, can be level sensitive or edge sensitive.
General-purpose input-only pin.
IRQ
PE0
XIRQ
PK7
Non-maskable interrupt input.
General-purpose I/O pin, see PORTK and DDRK registers.
Emulation chip select
ECS
PK6
General-purpose I/O pin, see PORTK and DDRK registers.
External data chip select
XCS
PK5/X19
thru
PK0/X14
PK5–PK0
X19–X14
General-purpose I/O pins, see PORTK and DDRK registers.
Memory expansion addresses
Detailed descriptions of these pins can be found in the device overview chapter.
4.3
Memory Map and Register Definition
A summary of the registers associated with the MEBI sub-block is shown in Table 4-2. Detailed
descriptions of the registers and bits are given in the subsections that follow. On most chips the registers
are mappable. Therefore, the upper bits may not be all 0s as shown in the table and descriptions.
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4.3.1
Module Memory Map
Table 4-2. MEBI Memory Map
Address
Offset
Use
Access
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
0x0008
0x0009
0x000A
0x000B
0x000C
0x000D
0x000E
0x000F
0x001E
0x00032
0x00033
Port A Data Register (PORTA)
Port B Data Register (PORTB)
Data Direction Register A (DDRA)
Data Direction Register B (DDRB)
Reserved
R/W
R/W
R/W
R/W
R
Reserved
R
Reserved
R
Reserved
R
Port E Data Register (PORTE)
Data Direction Register E (DDRE)
Port E Assignment Register (PEAR)
Mode Register (MODE)
Pull Control Register (PUCR)
Reduced Drive Register (RDRIV)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
External Bus Interface Control Register (EBICTL)
Reserved
IRQ Control Register (IRQCR)
Port K Data Register (PORTK)
Data Direction Register K (DDRK)
R/W
R/W
R/W
4.3.2
Register Descriptions
4.3.2.1
Port A Data Register (PORTA)
Module Base + 0x0000
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Single Chip
Expanded Wide,
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
Emulation Narrow with AB/DB15 AB/DB14 AB/DB13 AB/DB12 AB/DB11 AB/DB10
IVIS, and Peripheral
AB/DB9
AB/DB8
AB8 and
Expanded Narrow AB15 and AB14 and AB13 and AB12 and AB11 and AB10 and AB9 and
DB15/DB7 DB14/DB6 DB13/DB5 DB12/DB4 DB11/DB3 DB10/DB2 DB9/DB1 DB8/DB0
Figure 4-2. Port A Data Register (PORTA)
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Read: Anytime when register is in the map
Write: Anytime when register is in the map
Port A bits 7 through 0 are associated with address lines A15 through A8 respectively and data lines
D15/D7 through D8/D0 respectively. When this port is not used for external addresses such as in single-
chip mode, these pins can be used as general-purpose I/O. Data direction register A (DDRA) determines
the primary direction of each pin. DDRA also determines the source of data for a read of PORTA.
This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these
accesses will be echoed externally.
NOTE
To ensure that you read the value present on the PORTA pins, always wait
at least one cycle after writing to the DDRA register before reading from the
PORTA register.
4.3.2.2
Port B Data Register (PORTB)
Module Base + 0x0001
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Single Chip
Expanded Wide,
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
Emulation Narrow with AB/DB7
IVIS, and Peripheral
AB/DB6
AB6
AB/DB5
AB5
AB/DB4
AB4
AB/DB3
AB3
AB/DB2
AB2
AB/DB1
AB1
AB/DB0
AB0
Expanded Narrow
AB7
Figure 4-3. Port A Data Register (PORTB)
Read: Anytime when register is in the map
Write: Anytime when register is in the map
Port B bits 7 through 0 are associated with address lines A7 through A0 respectively and data lines D7
through D0 respectively. When this port is not used for external addresses, such as in single-chip mode,
these pins can be used as general-purpose I/O. Data direction register B (DDRB) determines the primary
direction of each pin. DDRB also determines the source of data for a read of PORTB.
This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these
accesses will be echoed externally.
NOTE
To ensure that you read the value present on the PORTB pins, always wait
at least one cycle after writing to the DDRB register before reading from the
PORTB register.
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4.3.2.3
Data Direction Register A (DDRA)
Module Base + 0x0002
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 4-4. Data Direction Register A (DDRA)
Read: Anytime when register is in the map
Write: Anytime when register is in the map
This register controls the data direction for port A. When port A is operating as a general-purpose I/O port,
DDRA determines the primary direction for each port A pin. A 1 causes the associated port pin to be an
output and a 0 causes the associated pin to be a high-impedance input. The value in a DDR bit also affects
the source of data for reads of the corresponding PORTA register. If the DDR bit is 0 (input) the buffered
pin input state is read. If the DDR bit is 1 (output) the associated port data register bit state is read.
This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these
accesses will be echoed externally. It is reset to 0x00 so the DDR does not override the three-state control
signals.
Table 4-3. DDRA Field Descriptions
Field
Description
7:0
Data Direction Port A
DDRA
0 Configure the corresponding I/O pin as an input
1 Configure the corresponding I/O pin as an output
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4.3.2.4
Data Direction Register B (DDRB)
Module Base + 0x0003
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 4-5. Data Direction Register B (DDRB)
Read: Anytime when register is in the map
Write: Anytime when register is in the map
This register controls the data direction for port B. When port B is operating as a general-purpose I/O port,
DDRB determines the primary direction for each port B pin. A 1 causes the associated port pin to be an
output and a 0 causes the associated pin to be a high-impedance input. The value in a DDR bit also affects
the source of data for reads of the corresponding PORTB register. If the DDR bit is 0 (input) the buffered
pin input state is read. If the DDR bit is 1 (output) the associated port data register bit state is read.
This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these
accesses will be echoed externally. It is reset to 0x00 so the DDR does not override the three-state control
signals.
Table 4-4. DDRB Field Descriptions
Field
Description
7:0
Data Direction Port B
DDRB
0 Configure the corresponding I/O pin as an input
1 Configure the corresponding I/O pin as an output
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4.3.2.5
Reserved Registers
Module Base + 0x0004
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-6. Reserved Register
Module Base + 0x0005
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-7. Reserved Register
Module Base + 0x0006
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-8. Reserved Register
Module Base + 0x0007
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-9. Reserved Register
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These register locations are not used (reserved). All unused registers and bits in this block return logic 0s
when read. Writes to these registers have no effect.
These registers are not in the on-chip map in special peripheral mode.
4.3.2.6
Port E Data Register (PORTE)
Module Base + 0x0008
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
Bit 1
Bit 0
Bit 7
6
5
4
3
2
Reset
0
0
0
0
0
0
u
u
Alternate
Pin Function
MODB
or IPIPE1
or CLKTO
MODA
or IPIPE0
LSTRB
or TAGLO
NOACC
ECLK
R/W
IRQ
XIRQ
= Unimplemented or Reserved
u = Unaffected by reset
Figure 4-10. Port E Data Register (PORTE)
Read: Anytime when register is in the map
Write: Anytime when register is in the map
Port E is associated with external bus control signals and interrupt inputs. These include mode select
(MODB/IPIPE1, MODA/IPIPE0), E clock, size (LSTRB/TAGLO), read/write (R/W), IRQ, and XIRQ.
When not used for one of these specific functions, port E pins 7:2 can be used as general-purpose I/O and
pins 1:0 can be used as general-purpose input. The port E assignment register (PEAR) selects the function
of each pin and DDRE determines whether each pin is an input or output when it is configured to be
general-purpose I/O. DDRE also determines the source of data for a read of PORTE.
Some of these pins have software selectable pull resistors. IRQ and XIRQ can only be pulled up whereas
the polarity of the PE7, PE4, PE3, and PE2 pull resistors are determined by chip integration. Please refer
to the device overview chapter (Signal Property Summary) to determine the polarity of these resistors.
A single control bit enables the pull devices for all of these pins when they are configured as inputs.
This register is not in the on-chip map in special peripheral mode or in expanded modes when the EME
bit is set. Therefore, these accesses will be echoed externally.
NOTE
It is unwise to write PORTE and DDRE as a word access. If you are
changing port E pins from being inputs to outputs, the data may have extra
transitions during the write. It is best to initialize PORTE before enabling as
outputs.
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NOTE
To ensure that you read the value present on the PORTE pins, always wait
at least one cycle after writing to the DDRE register before reading from the
PORTE register.
4.3.2.7
Data Direction Register E (DDRE)
Module Base + 0x0009
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
Bit 7
6
5
4
3
Bit 2
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-11. Data Direction Register E (DDRE)
Read: Anytime when register is in the map
Write: Anytime when register is in the map
Data direction register E is associated with port E. For bits in port E that are configured as general-purpose
I/O lines, DDRE determines the primary direction of each of these pins. A 1 causes the associated bit to
be an output and a 0 causes the associated bit to be an input. Port E bit 1 (associated with IRQ) and bit 0
(associated with XIRQ) cannot be configured as outputs. Port E, bits 1 and 0, can be read regardless of
whether the alternate interrupt function is enabled. The value in a DDR bit also affects the source of data
for reads of the corresponding PORTE register. If the DDR bit is 0 (input) the buffered pin input state is
read. If the DDR bit is 1 (output) the associated port data register bit state is read.
This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these
accesses will be echoed externally. Also, it is not in the map in expanded modes while the EME control bit
is set.
Table 4-5. DDRE Field Descriptions
Field
Description
7:2
Data Direction Port E
DDRE
0 Configure the corresponding I/O pin as an input
1 Configure the corresponding I/O pin as an output
Note: It is unwise to write PORTE and DDRE as a word access. If you are changing port E pins from inputs to
outputs, the data may have extra transitions during the write. It is best to initialize PORTE before enabling
as outputs.
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4.3.2.8
Port E Assignment Register (PEAR)
Module Base + 0x000A
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
NOACCE
PIPOE
NECLK
LSTRE
RDWE
Reset
Special Single Chip
Special Test
Peripheral
0
0
0
0
0
0
0
1
0
0
0
0
0
1
0
0
1
0
0
0
0
0
0
0
Emulation Expanded
Narrow
1
0
1
0
1
1
0
0
Emulation Expanded
Wide
1
0
0
0
0
0
0
0
1
0
0
0
0
1
0
0
1
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
Normal Single Chip
Normal Expanded
Narrow
Normal Expanded Wide
= Unimplemented or Reserved
Figure 4-12. Port E Assignment Register (PEAR)
Read: Anytime (provided this register is in the map).
Write: Each bit has specific write conditions. Please refer to the descriptions of each bit on the following
pages.
Port E serves as general-purpose I/O or as system and bus control signals. The PEAR register is used to
choose between the general-purpose I/O function and the alternate control functions. When an alternate
control function is selected, the associated DDRE bits are overridden.
The reset condition of this register depends on the mode of operation because bus control signals are
needed immediately after reset in some modes. In normal single-chip mode, no external bus control signals
are needed so all of port E is configured for general-purpose I/O. In normal expanded modes, only the E
clock is configured for its alternate bus control function and the other bits of port E are configured for
general-purpose I/O. As the reset vector is located in external memory, the E clock is required for this
access. R/W is only needed by the system when there are external writable resources. If the normal
expanded system needs any other bus control signals, PEAR would need to be written before any access
that needed the additional signals. In special test and emulation modes, IPIPE1, IPIPE0, E, LSTRB, and
R/W are configured out of reset as bus control signals.
This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these
accesses will be echoed externally.
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Table 4-6. PEAR Field Descriptions
Field
Description
7
CPU No Access Output Enable
NOACCE Normal: write once
Emulation: write never
Special: write anytime
1 The associated pin (port E, bit 7) is general-purpose I/O.
0 The associated pin (port E, bit 7) is output and indicates whether the cycle is a CPU free cycle.
This bit has no effect in single-chip or special peripheral modes.
5
Pipe Status Signal Output Enable
PIPOE
Normal: write once
Emulation: write never
Special: write anytime.
0 The associated pins (port E, bits 6:5) are general-purpose I/O.
1 The associated pins (port E, bits 6:5) are outputs and indicate the state of the instruction queue
This bit has no effect in single-chip or special peripheral modes.
4
No External E Clock
NECLK
Normal and special: write anytime
Emulation: write never
0 The associated pin (port E, bit 4) is the external E clock pin. External E clock is free-running if ESTR = 0
1 The associated pin (port E, bit 4) is a general-purpose I/O pin.
External E clock is available as an output in all modes.
3
Low Strobe (LSTRB) Enable
LSTRE
Normal: write once
Emulation: write never
Special: write anytime.
0 The associated pin (port E, bit 3) is a general-purpose I/O pin.
1 The associated pin (port E, bit 3) is configured as the LSTRB bus control output. If BDM tagging is enabled,
TAGLO is multiplexed in on the rising edge of ECLK and LSTRB is driven out on the falling edge of ECLK.
This bit has no effect in single-chip, peripheral, or normal expanded narrow modes.
Note: LSTRB is used during external writes. After reset in normal expanded mode, LSTRB is disabled to provide
an extra I/O pin. If LSTRB is needed, it should be enabled before any external writes. External reads do
not normally need LSTRB because all 16 data bits can be driven even if the system only needs 8 bits of
data.
2
Read/Write Enable
RDWE
Normal: write once
Emulation: write never
Special: write anytime
0 The associated pin (port E, bit 2) is a general-purpose I/O pin.
1 The associated pin (port E, bit 2) is configured as the R/W pin
This bit has no effect in single-chip or special peripheral modes.
Note: R/W is used for external writes. After reset in normal expanded mode, R/W is disabled to provide an extra
I/O pin. If R/W is needed it should be enabled before any external writes.
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4.3.2.9
Mode Register (MODE)
Module Base + 0x000B
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
0
0
MODC
MODB
MODA
IVIS
EMK
EME
W
Reset
Special Single Chip
0
0
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
0
0
0
0
0
0
0
1
1
1
0
0
0
0
0
0
0
0
0
1
0
1
0
0
0
1
0
1
0
0
Emulation Expanded
Narrow
Special Test
Emulation Expanded
Wide
Normal Single Chip
Normal Expanded
Narrow
Peripheral
1
1
1
1
0
1
0
0
0
0
0
0
0
0
0
0
Normal Expanded Wide
= Unimplemented or Reserved
Figure 4-13. Mode Register (MODE)
Read: Anytime (provided this register is in the map).
Write: Each bit has specific write conditions. Please refer to the descriptions of each bit on the following
pages.
The MODE register is used to establish the operating mode and other miscellaneous functions (i.e.,
internal visibility and emulation of port E and K).
In special peripheral mode, this register is not accessible but it is reset as shown to system configuration
features. Changes to bits in the MODE register are delayed one cycle after the write.
This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these
accesses will be echoed externally.
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Table 4-7. MODE Field Descriptions
Field
Description
7:5
Mode Select Bits — These bits indicate the current operating mode.
MOD[C:A]
If MODA = 1, then MODC, MODB, and MODA are write never.
If MODC = MODA = 0, then MODC, MODB, and MODA are writable with the exception that you cannot change
to or from special peripheral mode
If MODC = 1, MODB = 0, and MODA = 0, then MODC is write never. MODB and MODA are write once, except
that you cannot change to special peripheral mode. From normal single-chip, only normal expanded narrow and
normal expanded wide modes are available.
See Table 4-8 and Table 4-16.
3
IVIS
Internal Visibility (for both read and write accesses) — This bit determines whether internal accesses
generate a bus cycle that is visible on the external bus.
Normal: write once
Emulation: write never
Special: write anytime
0 No visibility of internal bus operations on external bus.
1 Internal bus operations are visible on external bus.
1
Emulate Port K
EMK
Normal: write once
Emulation: write never
Special: write anytime
0 PORTK and DDRK are in the memory map so port K can be used for general-purpose I/O.
1 If in any expanded mode, PORTK and DDRK are removed from the memory map.
In single-chip modes, PORTK and DDRK are always in the map regardless of the state of this bit.
In special peripheral mode, PORTK and DDRK are never in the map regardless of the state of this bit.
0
Emulate Port E
EME
Normal and Emulation: write never
Special: write anytime
0 PORTE and DDRE are in the memory map so port E can be used for general-purpose I/O.
1 If in any expanded mode or special peripheral mode, PORTE and DDRE are removed from the memory map.
Removing the registers from the map allows the user to emulate the function of these registers externally.
In single-chip modes, PORTE and DDRE are always in the map regardless of the state of this bit.
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Table 4-8. MODC, MODB, and MODA Write Capability
MODC
MODB
MODA
Mode
MODx Write Capability
0
0
0
Special single chip
MODC, MODB, and MODA
write anytime but not to 110(2)
0
0
0
1
1
0
Emulation narrow
Special test
No write
MODC, MODB, and MODA
write anytime but not to 110(2)
0
1
1
0
1
0
Emulation wide
No write
Normal single chip
MODC write never,
MODB and MODA write once
but not to 110
1
1
1
0
1
1
1
0
1
Normal expanded narrow
Special peripheral
No write
No write
No write
Normal expanded wide
1. No writes to the MOD bits are allowed while operating in a secure mode. For more details, refer to the device over-
view chapter.
2. If you are in a special single-chip or special test mode and you write to this register, changing to normal single-chip
mode, then one allowed write to this register remains. If you write to normal expanded or emulation mode, then no
writes remain.
4.3.2.10 Pull Control Register (PUCR)
Module Base + 0x000C
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
PUPKE
PUPEE
PUPBE
PUPAE
Reset1
1
0
0
1
0
0
0
0
NOTES:
1. The default value of this parameter is shown. Please refer to the device overview chapter to deter-
mine the actual reset state of this register.
= Unimplemented or Reserved
Figure 4-14. Pull Control Register (PUCR)
Read: Anytime (provided this register is in the map).
Write: Anytime (provided this register is in the map).
This register is used to select pull resistors for the pins associated with the core ports. Pull resistors are
assigned on a per-port basis and apply to any pin in the corresponding port that is currently configured as
an input. The polarity of these pull resistors is determined by chip integration. Please refer to the device
overview chapter to determine the polarity of these resistors.
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This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these
accesses will be echoed externally.
NOTE
These bits have no effect when the associated pin(s) are outputs. (The pull
resistors are inactive.)
Table 4-9. PUCR Field Descriptions
Field
Description
7
Pull resistors Port K Enable
PUPKE
0 Port K pull resistors are disabled.
1 Enable pull resistors for port K input pins.
4
Pull resistors Port E Enable
PUPEE
0 Port E pull resistors on bits 7, 4:0 are disabled.
1 Enable pull resistors for port E input pins bits 7, 4:0.
Note: Pins 5 and 6 of port E have pull resistors which are only enabled during reset. This bit has no effect on
these pins.
1
Pull resistors Port B Enable
PUPBE
0 Port B pull resistors are disabled.
1 Enable pull resistors for all port B input pins.
0
Pull resistors Port A Enable
PUPAE
0 Port A pull resistors are disabled.
1 Enable pull resistors for all port A input pins.
4.3.2.11 Reduced Drive Register (RDRIV)
Module Base + 0x000D
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
RDRK
RDPE
RDPB
RDPA
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-15. Reduced Drive Register (RDRIV)
Read: Anytime (provided this register is in the map)
Write: Anytime (provided this register is in the map)
This register is used to select reduced drive for the pins associated with the core ports. This gives reduced
power consumption and reduced RFI with a slight increase in transition time (depending on loading). This
feature would be used on ports which have a light loading. The reduced drive function is independent of
which function is being used on a particular port.
This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these
accesses will be echoed externally.
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Table 4-10. RDRIV Field Descriptions
Field
Description
7
Reduced Drive of Port K
RDRK
0 All port K output pins have full drive enabled.
1 All port K output pins have reduced drive enabled.
4
Reduced Drive of Port E
RDPE
0 All port E output pins have full drive enabled.
1 All port E output pins have reduced drive enabled.
1
Reduced Drive of Port B
RDPB
0 All port B output pins have full drive enabled.
1 All port B output pins have reduced drive enabled.
0
Reduced Drive of Ports A
RDPA
0 All port A output pins have full drive enabled.
1 All port A output pins have reduced drive enabled.
4.3.2.12 External Bus Interface Control Register (EBICTL)
Module Base + 0x000E
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
0
0
0
0
0
0
0
ESTR
W
Reset:
Peripheral
All other modes
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 4-16. External Bus Interface Control Register (EBICTL)
Read: Anytime (provided this register is in the map)
Write: Refer to individual bit descriptions below
The EBICTL register is used to control miscellaneous functions (i.e., stretching of external E clock).
This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these
accesses will be echoed externally.
Table 4-11. EBICTL Field Descriptions
Field
Description
0
E Clock Stretches — This control bit determines whether the E clock behaves as a simple free-running clock or
as a bus control signal that is active only for external bus cycles.
Normal and Emulation: write once
ESTR
Special: write anytime
0 E never stretches (always free running).
1 E stretches high during stretched external accesses and remains low during non-visible internal accesses.
This bit has no effect in single-chip modes.
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4.3.2.13 Reserved Register
Module Base + 0x000F
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-17. Reserved Register
This register location is not used (reserved). All bits in this register return logic 0s when read. Writes to
this register have no effect.
This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these
accesses will be echoed externally.
4.3.2.14 IRQ Control Register (IRQCR)
Module Base + 0x001E
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
IRQE
IRQEN
Reset
0
1
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 4-18. IRQ Control Register (IRQCR)
Read: See individual bit descriptions below
Write: See individual bit descriptions below
Table 4-12. IRQCR Field Descriptions
Field
Description
7
IRQ Select Edge Sensitive Only
IRQE
Special modes: read or write anytime
Normal and Emulation modes: read anytime, write once
0 IRQ configured for low level recognition.
1 IRQ configured to respond only to falling edges. Falling edges on the IRQ pin will be detected anytime
IRQE = 1 and will be cleared only upon a reset or the servicing of the IRQ interrupt.
6
External IRQ Enable
IRQEN
Normal, emulation, and special modes: read or write anytime
0 External IRQ pin is disconnected from interrupt logic.
1 External IRQ pin is connected to interrupt logic.
Note: When IRQEN = 0, the edge detect latch is disabled.
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4.3.2.15 Port K Data Register (PORTK)
Module Base + 0x0032
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Alternate
Pin Function
ECS
XCS
XAB19
XAB18
XAB17
XAB16
XAB15
XAB14
Figure 4-19. Port K Data Register (PORTK)
Read: Anytime
Write: Anytime
This port is associated with the internal memory expansion emulation pins. When the port is not enabled
to emulate the internal memory expansion, the port pins are used as general-purpose I/O. When port K is
operating as a general-purpose I/O port, DDRK determines the primary direction for each port K pin. A 1
causes the associated port pin to be an output and a 0 causes the associated pin to be a high-impedance
input. The value in a DDR bit also affects the source of data for reads of the corresponding PORTK register.
If the DDR bit is 0 (input) the buffered pin input is read. If the DDR bit is 1 (output) the output of the port
data register is read.
This register is not in the map in peripheral or expanded modes while the EMK control bit in MODE
register is set. Therefore, these accesses will be echoed externally.
When inputs, these pins can be selected to be high impedance or pulled up, based upon the state of the
PUPKE bit in the PUCR register.
Table 4-13. PORTK Field Descriptions
Field
Description
7
Port K, Bit 7 — This bit is used as an emulation chip select signal for the emulation of the internal memory
Port K, Bit 7 expansion, or as general-purpose I/O, depending upon the state of the EMK bit in the MODE register. While
this bit is used as a chip select, the external bit will return to its de-asserted state (VDD) for approximately 1/4
cycle just after the negative edge of ECLK, unless the external access is stretched and ECLK is free-running
(ESTR bit in EBICTL = 0). See the MMC block description chapter for additional details on when this signal
will be active.
6
Port K, Bit 6 — This bit is used as an external chip select signal for most external accesses that are not
Port K, Bit 6 selected by ECS (see the MMC block description chapter for more details), depending upon the state the of
the EMK bit in the MODE register. While this bit is used as a chip select, the external pin will return to its de-
asserted state (VDD) for approximately 1/4 cycle just after the negative edge of ECLK, unless the external
access is stretched and ECLK is free-running (ESTR bit in EBICTL = 0).
5:0
Port K, Bits 5:0 — These six bits are used to determine which FLASH/ROM or external memory array page
Port K, Bits 5:0 is being accessed. They can be viewed as expanded addresses XAB19–XAB14 of the 20-bit address used to
access up to1M byte internal FLASH/ROM or external memory array. Alternatively, these bits can be used for
general-purpose I/O depending upon the state of the EMK bit in the MODE register.
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4.3.2.16 Port K Data Direction Register (DDRK)
Module Base + 0x0033
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 4-20. Port K Data Direction Register (DDRK)
Read: Anytime
Write: Anytime
This register determines the primary direction for each port K pin configured as general-purpose I/O. This
register is not in the map in peripheral or expanded modes while the EMK control bit in MODE register is
set. Therefore, these accesses will be echoed externally.
Table 4-14. EBICTL Field Descriptions
Field
Description
7:0
Data Direction Port K Bits
DDRK
0 Associated pin is a high-impedance input
1 Associated pin is an output
Note: It is unwise to write PORTK and DDRK as a word access. If you are changing port K pins from inputs to
outputs, the data may have extra transitions during the write. It is best to initialize PORTK before enabling
as outputs.
Note: To ensure that you read the correct value from the PORTK pins, always wait at least one cycle after writing
to the DDRK register before reading from the PORTK register.
4.4
Functional Description
4.4.1
Detecting Access Type from External Signals
The external signals LSTRB, R/W, and AB0 indicate the type of bus access that is taking place. Accesses
to the internal RAM module are the only type of access that would produce LSTRB = AB0 = 1, because
the internal RAM is specifically designed to allow misaligned 16-bit accesses in a single cycle. In these
cases the data for the address that was accessed is on the low half of the data bus and the data for
address + 1 is on the high half of the data bus. This is summarized in Table 4-15.
Table 4-15. Access Type vs. Bus Control Pins
LSTRB
AB0
R/W
Type of Access
1
0
1
0
0
1
0
1
1
1
0
0
8-bit read of an even address
8-bit read of an odd address
8-bit write of an even address
8-bit write of an odd address
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Table 4-15. Access Type vs. Bus Control Pins
LSTRB
AB0
R/W
Type of Access
0
1
0
1
1
1
16-bit read of an even address
16-bit read of an odd address
(low/high data swapped)
0
1
0
1
0
0
16-bit write to an even address
16-bit write to an odd address
(low/high data swapped)
4.4.2
Stretched Bus Cycles
In order to allow fast internal bus cycles to coexist in a system with slower external memory resources, the
HCS12 supports the concept of stretched bus cycles (module timing reference clocks for timers and baud
rate generators are not affected by this stretching). Control bits in the MISC register in the MMC sub-block
of the core specify the amount of stretch (0, 1, 2, or 3 periods of the internal bus-rate clock). While
stretching, the CPU state machines are all held in their current state. At this point in the CPU bus cycle,
write data would already be driven onto the data bus so the length of time write data is valid is extended
in the case of a stretched bus cycle. Read data would not be captured by the system until the E clock falling
edge. In the case of a stretched bus cycle, read data is not required until the specified setup time before the
falling edge of the stretched E clock. The chip selects, and R/W signals remain valid during the period of
stretching (throughout the stretched E high time).
NOTE
The address portion of the bus cycle is not stretched.
4.4.3
Modes of Operation
The operating mode out of reset is determined by the states of the MODC, MODB, and MODA pins during
reset (Table 4-16). The MODC, MODB, and MODA bits in the MODE register show the current operating
mode and provide limited mode switching during operation. The states of the MODC, MODB, and MODA
pins are latched into these bits on the rising edge of the reset signal.
Table 4-16. Mode Selection
MODC
MODB
MODA
Mode Description
0
0
0
Special Single Chip, BDM allowed and ACTIVE. BDM is allowed in all
other modes but a serial command is required to make BDM active.
0
0
0
1
1
1
0
1
1
0
0
1
1
0
1
0
1
0
Emulation Expanded Narrow, BDM allowed
Special Test (Expanded Wide), BDM allowed
Emulation Expanded Wide, BDM allowed
Normal Single Chip, BDM allowed
Normal Expanded Narrow, BDM allowed
Peripheral; BDM allowed but bus operations would cause bus conflicts
(must not be used)
1
1
1
Normal Expanded Wide, BDM allowed
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There are two basic types of operating modes:
1. Normal modes: Some registers and bits are protected against accidental changes.
2. Special modes: Allow greater access to protected control registers and bits for special purposes
such as testing.
A system development and debug feature, background debug mode (BDM), is available in all modes. In
special single-chip mode, BDM is active immediately after reset.
Some aspects of Port E are not mode dependent. Bit 1 of Port E is a general purpose input or the IRQ
interrupt input. IRQ can be enabled by bits in the CPU’s condition codes register but it is inhibited at reset
so this pin is initially configured as a simple input with a pull-up. Bit 0 of Port E is a general purpose input
or the XIRQ interrupt input. XIRQ can be enabled by bits in the CPU’s condition codes register but it is
inhibited at reset so this pin is initially configured as a simple input with a pull-up. The ESTR bit in the
EBICTL register is set to one by reset in any user mode. This assures that the reset vector can be fetched
even if it is located in an external slow memory device. The PE6/MODB/IPIPE1 and PE5/MODA/IPIPE0
pins act as high-impedance mode select inputs during reset.
The following paragraphs discuss the default bus setup and describe which aspects of the bus can be
changed after reset on a per mode basis.
4.4.3.1
Normal Operating Modes
These modes provide three operating configurations. Background debug is available in all three modes, but
must first be enabled for some operations by means of a BDM background command, then activated.
4.4.3.1.1
Normal Single-Chip Mode
There is no external expansion bus in this mode. All pins of Ports A, B and E are configured as general
purpose I/O pins Port E bits 1 and 0 are available as general purpose input only pins with internal pull
resistors enabled. All other pins of Port E are bidirectional I/O pins that are initially configured as high-
impedance inputs with internal pull resistors enabled. Ports A and B are configured as high-impedance
inputs with their internal pull resistors disabled.
The pins associated with Port E bits 6, 5, 3, and 2 cannot be configured for their alternate functions IPIPE1,
IPIPE0, LSTRB, and R/W while the MCU is in single chip modes. In single chip modes, the associated
control bits PIPOE, LSTRE, and RDWE are reset to zero. Writing the opposite state into them in single
chip mode does not change the operation of the associated Port E pins.
In normal single chip mode, the MODE register is writable one time. This allows a user program to change
the bus mode to narrow or wide expanded mode and/or turn on visibility of internal accesses.
Port E, bit 4 can be configured for a free-running E clock output by clearing NECLK=0. Typically the only
use for an E clock output while the MCU is in single chip modes would be to get a constant speed clock
for use in the external application system.
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4.4.3.1.2
Normal Expanded Wide Mode
In expanded wide modes, Ports A and B are configured as a 16-bit multiplexed address and data bus and
Port E bit 4 is configured as the E clock output signal. These signals allow external memory and peripheral
devices to be interfaced to the MCU.
Port E pins other than PE4/ECLK are configured as general purpose I/O pins (initially high-impedance
inputs with internal pull resistors enabled). Control bits PIPOE, NECLK, LSTRE, and RDWE in the
PEAR register can be used to configure Port E pins to act as bus control outputs instead of general purpose
I/O pins.
It is possible to enable the pipe status signals on Port E bits 6 and 5 by setting the PIPOE bit in PEAR, but
it would be unusual to do so in this mode. Development systems where pipe status signals are monitored
would typically use the special variation of this mode.
The Port E bit 2 pin can be reconfigured as the R/W bus control signal by writing “1” to the RDWE bit in
PEAR. If the expanded system includes external devices that can be written, such as RAM, the RDWE bit
would need to be set before any attempt to write to an external location. If there are no writable resources
in the external system, PE2 can be left as a general purpose I/O pin.
The Port E bit 3 pin can be reconfigured as the LSTRB bus control signal by writing “1” to the LSTRE bit
in PEAR. The default condition of this pin is a general purpose input because the LSTRB function is not
needed in all expanded wide applications.
The Port E bit 4 pin is initially configured as ECLK output with stretch. The E clock output function
depends upon the settings of the NECLK bit in the PEAR register, the IVIS bit in the MODE register and
the ESTR bit in the EBICTL register. The E clock is available for use in external select decode logic or as
a constant speed clock for use in the external application system.
4.4.3.1.3
Normal Expanded Narrow Mode
This mode is used for lower cost production systems that use 8-bit wide external EPROMs or RAMs. Such
systems take extra bus cycles to access 16-bit locations but this may be preferred over the extra cost of
additional external memory devices.
Ports A and B are configured as a 16-bit address bus and Port A is multiplexed with data. Internal visibility
is not available in this mode because the internal cycles would need to be split into two 8-bit cycles.
Since the PEAR register can only be written one time in this mode, use care to set all bits to the desired
states during the single allowed write.
The PE3/LSTRB pin is always a general purpose I/O pin in normal expanded narrow mode. Although it is
possible to write the LSTRE bit in PEAR to “1” in this mode, the state of LSTRE is overridden and Port
E bit 3 cannot be reconfigured as the LSTRB output.
It is possible to enable the pipe status signals on Port E bits 6 and 5 by setting the PIPOE bit in PEAR, but
it would be unusual to do so in this mode. LSTRB would also be needed to fully understand system
activity. Development systems where pipe status signals are monitored would typically use special
expanded wide mode or occasionally special expanded narrow mode.
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The PE4/ECLK pin is initially configured as ECLK output with stretch. The E clock output function
depends upon the settings of the NECLK bit in the PEAR register, the IVIS bit in the MODE register and
the ESTR bit in the EBICTL register. In normal expanded narrow mode, the E clock is available for use in
external select decode logic or as a constant speed clock for use in the external application system.
The PE2/R/W pin is initially configured as a general purpose input with an internal pull resistor enabled
but this pin can be reconfigured as the R/W bus control signal by writing “1” to the RDWE bit in PEAR.
If the expanded narrow system includes external devices that can be written such as RAM, the RDWE bit
would need to be set before any attempt to write to an external location. If there are no writable resources
in the external system, PE2 can be left as a general purpose I/O pin.
4.4.3.1.4
Emulation Expanded Wide Mode
In expanded wide modes, Ports A and B are configured as a 16-bit multiplexed address and data bus and
Port E provides bus control and status signals. These signals allow external memory and peripheral devices
to be interfaced to the MCU. These signals can also be used by a logic analyzer to monitor the progress of
application programs.
The bus control related pins in Port E (PE7/NOACC, PE6/MODB/IPIPE1, PE5/MODA/IPIPE0,
PE4/ECLK, PE3/LSTRB/TAGLO, and PE2/R/W) are all configured to serve their bus control output
functions rather than general purpose I/O. Notice that writes to the bus control enable bits in the PEAR
register in emulation mode are restricted.
4.4.3.1.5
Emulation Expanded Narrow Mode
Expanded narrow modes are intended to allow connection of single 8-bit external memory devices for
lower cost systems that do not need the performance of a full 16-bit external data bus. Accesses to internal
resources that have been mapped external (i.e. PORTA, PORTB, DDRA, DDRB, PORTE, DDRE, PEAR,
PUCR, RDRIV) will be accessed with a 16-bit data bus on Ports A and B. Accesses of 16-bit external
words to addresses which are normally mapped external will be broken into two separate 8-bit accesses
using Port A as an 8-bit data bus. Internal operations continue to use full 16-bit data paths. They are only
visible externally as 16-bit information if IVIS=1.
Ports A and B are configured as multiplexed address and data output ports. During external accesses,
address A15, data D15 and D7 are associated with PA7, address A0 is associated with PB0 and data D8
and D0 are associated with PA0. During internal visible accesses and accesses to internal resources that
have been mapped external, address A15 and data D15 is associated with PA7 and address A0 and data
D0 is associated with PB0.
The bus control related pins in Port E (PE7/NOACC, PE6/MODB/IPIPE1, PE5/MODA/IPIPE0,
PE4/ECLK, PE3/LSTRB/TAGLO, and PE2/R/W) are all configured to serve their bus control output
functions rather than general purpose I/O. Notice that writes to the bus control enable bits in the PEAR
register in emulation mode are restricted.
The main difference between special modes and normal modes is that some of the bus control and system
control signals cannot be written in emulation modes.
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4.4.3.2
Special Operating Modes
There are two special operating modes that correspond to normal operating modes. These operating modes
are commonly used in factory testing and system development.
4.4.3.2.1
Special Single-Chip Mode
When the MCU is reset in this mode, the background debug mode is enabled and active. The MCU does
not fetch the reset vector and execute application code as it would in other modes. Instead the active
background mode is in control of CPU execution and BDM firmware is waiting for additional serial
commands through the BKGD pin. When a serial command instructs the MCU to return to normal
execution, the system will be configured as described below unless the reset states of internal control
registers have been changed through background commands after the MCU was reset.
There is no external expansion bus after reset in this mode. Ports A and B are initially simple bidirectional
I/O pins that are configured as high-impedance inputs with internal pull resistors disabled; however,
writing to the mode select bits in the MODE register (which is allowed in special modes) can change this
after reset. All of the Port E pins (except PE4/ECLK) are initially configured as general purpose high-
impedance inputs with internal pull resistors enabled. PE4/ECLK is configured as the E clock output in
this mode.
The pins associated with Port E bits 6, 5, 3, and 2 cannot be configured for their alternate functions IPIPE1,
IPIPE0, LSTRB, and R/W while the MCU is in single chip modes. In single chip modes, the associated
control bits PIPOE, LSTRE and RDWE are reset to zero. Writing the opposite value into these bits in
single chip mode does not change the operation of the associated Port E pins.
Port E, bit 4 can be configured for a free-running E clock output by clearing NECLK=0. Typically the only
use for an E clock output while the MCU is in single chip modes would be to get a constant speed clock
for use in the external application system.
4.4.3.2.2
Special Test Mode
In expanded wide modes, Ports A and B are configured as a 16-bit multiplexed address and data bus and
Port E provides bus control and status signals. In special test mode, the write protection of many control
bits is lifted so that they can be thoroughly tested without needing to go through reset.
4.4.3.3
Test Operating Mode
There is a test operating mode in which an external master, such as an I.C. tester, can control the on-chip
peripherals.
4.4.3.3.1
Peripheral Mode
This mode is intended for factory testing of the MCU. In this mode, the CPU is inactive and an external
(tester) bus master drives address, data and bus control signals in through Ports A, B and E. In effect, the
whole MCU acts as if it was a peripheral under control of an external CPU. This allows faster testing of
on-chip memory and peripherals than previous testing methods. Since the mode control register is not
accessible in peripheral mode, the only way to change to another mode is to reset the MCU into a different
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mode. Background debugging should not be used while the MCU is in special peripheral mode as internal
bus conflicts between BDM and the external master can cause improper operation of both functions.
4.4.4
Internal Visibility
Internal visibility is available when the MCU is operating in expanded wide modes or emulation narrow
mode. It is not available in single-chip, peripheral or normal expanded narrow modes. Internal visibility is
enabled by setting the IVIS bit in the MODE register.
If an internal access is made while E, R/W, and LSTRB are configured as bus control outputs and internal
visibility is off (IVIS=0), E will remain low for the cycle, R/W will remain high, and address, data and the
LSTRB pins will remain at their previous state.
When internal visibility is enabled (IVIS=1), certain internal cycles will be blocked from going external.
During cycles when the BDM is selected, R/W will remain high, data will maintain its previous state, and
address and LSTRB pins will be updated with the internal value. During CPU no access cycles when the
BDM is not driving, R/W will remain high, and address, data and the LSTRB pins will remain at their
previous state.
NOTE
When the system is operating in a secure mode, internal visibility is not
available (i.e., IVIS = 1 has no effect). Also, the IPIPE signals will not be
visible, regardless of operating mode. IPIPE1–IPIPE0 will display 0es if
they are enabled. In addition, the MOD bits in the MODE control register
cannot be written.
4.4.5
Low-Power Options
The MEBI does not contain any user-controlled options for reducing power consumption. The operation
of the MEBI in low-power modes is discussed in the following subsections.
4.4.5.1
Operation in Run Mode
The MEBI does not contain any options for reducing power in run mode; however, the external addresses
are conditioned to reduce power in single-chip modes. Expanded bus modes will increase power
consumption.
4.4.5.2
Operation in Wait Mode
The MEBI does not contain any options for reducing power in wait mode.
4.4.5.3
Operation in Stop Mode
The MEBI will cease to function after execution of a CPU STOP instruction.
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Interrupt (INTV1) Block Description
5.1
Introduction
This section describes the functionality of the interrupt (INT) sub-block of the S12 core platform.
A block diagram of the interrupt sub-block is shown in Figure 5-1.
INT
HPRIO (OPTIONAL)
WRITE DATA BUS
HIGHEST PRIORITY
I-INTERRUPT
INTERRUPTS
INTERRUPT INPUT REGISTERS
AND CONTROL REGISTERS
READ DATA BUS
XMASK
IMASK
WAKEUP
QUALIFIED
INTERRUPTS
INTERRUPT PENDING
VECTOR ADDRESS
RESET FLAGS
PRIORITY DECODER
VECTOR REQUEST
Figure 5-1. INTV1 Block Diagram
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The interrupt sub-block decodes the priority of all system exception requests and provides the applicable
vector for processing the exception. The INT supports I-bit maskable and X-bit maskable interrupts, a non-
maskable unimplemented opcode trap, a non-maskable software interrupt (SWI) or background debug
mode request, and three system reset vector requests. All interrupt related exception requests are managed
by the interrupt sub-block (INT).
5.1.1
Features
The INT includes these features:
•
•
•
Provides two to 122 I-bit maskable interrupt vectors (0xFF00–0xFFF2)
Provides one X-bit maskable interrupt vector (0xFFF4)
Provides a non-maskable software interrupt (SWI) or background debug mode request vector
(0xFFF6)
•
•
•
•
•
•
•
Provides a non-maskable unimplemented opcode trap (TRAP) vector (0xFFF8)
Provides three system reset vectors (0xFFFA–0xFFFE) (reset, CMR, and COP)
Determines the appropriate vector and drives it onto the address bus at the appropriate time
Signals the CPU that interrupts are pending
Provides control registers which allow testing of interrupts
Provides additional input signals which prevents requests for servicing I and X interrupts
Wakes the system from stop or wait mode when an appropriate interrupt occurs or whenever XIRQ
is active, even if XIRQ is masked
•
•
Provides asynchronous path for all I and X interrupts, (0xFF00–0xFFF4)
(Optional) selects and stores the highest priority I interrupt based on the value written into the
HPRIO register
5.1.2
Modes of Operation
The functionality of the INT sub-block in various modes of operation is discussed in the subsections that
follow.
•
•
•
•
Normal operation
The INT operates the same in all normal modes of operation.
Special operation
Interrupts may be tested in special modes through the use of the interrupt test registers.
Emulation modes
The INT operates the same in emulation modes as in normal modes.
Low power modes
See Section 5.4.1, “Low-Power Modes,” for details
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5.2
External Signal Description
Most interfacing with the interrupt sub-block is done within the core. However, the interrupt does receive
direct input from the multiplexed external bus interface (MEBI) sub-block of the core for the IRQ and
XIRQ pin data.
5.3
Memory Map and Register Definition
Detailed descriptions of the registers and associated bits are given in the subsections that follow.
5.3.1
Module Memory Map
Table 5-1. INT Memory Map
Address
Offset
Use
Interrupt Test Control Register (ITCR)
Access
0x0015
0x0016
0x001F
R/W
R/W
R/W
Interrupt Test Registers (ITEST)
Highest Priority Interrupt (Optional) (HPRIO)
5.3.2
Register Descriptions
5.3.2.1
Interrupt Test Control Register
Module Base + 0x0015
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
0
0
WRTINT
ADR3
ADR2
ADR1
1
ADR0
Reset
0
0
0
0
1
1
1
= Unimplemented or Reserved
Figure 5-2. Interrupt Test Control Register (ITCR)
Read: See individual bit descriptions
Write: See individual bit descriptions
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Table 5-2. ITCR Field Descriptions
Description
Field
4
Write to the Interrupt Test Registers
Read: anytime
WRTINT
Write: only in special modes and with I-bit mask and X-bit mask set.
0 Disables writes to the test registers; reads of the test registers will return the state of the interrupt inputs.
1 Disconnect the interrupt inputs from the priority decoder and use the values written into the ITEST registers
instead.
Note: Any interrupts which are pending at the time that WRTINT is set will remain until they are overwritten.
3:0
Test Register Select Bits
ADR[3:0]
Read: anytime
Write: anytime
These bits determine which test register is selected on a read or write. The hexadecimal value written here will
be the same as the upper nibble of the lower byte of the vector selects. That is, an “F” written into ADR[3:0] will
select vectors 0xFFFE–0xFFF0 while a “7” written to ADR[3:0] will select vectors 0xFF7E–0xFF70.
5.3.2.2
Interrupt Test Registers
Module Base + 0x0016
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
INTE
INTC
INTA
INT8
INT6
INT4
INT2
INT0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 5-3. Interrupt TEST Registers (ITEST)
Read: Only in special modes. Reads will return either the state of the interrupt inputs of the interrupt sub-
block (WRTINT = 0) or the values written into the TEST registers (WRTINT = 1). Reads will always
return 0s in normal modes.
Write: Only in special modes and with WRTINT = 1 and CCR I mask = 1.
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Table 5-3. ITEST Field Descriptions
Description
Field
7:0
INT[E:0]
Interrupt TEST Bits — These registers are used in special modes for testing the interrupt logic and priority
independent of the system configuration. Each bit is used to force a specific interrupt vector by writing it to a
logic 1 state. Bits are named INTE through INT0 to indicate vectors 0xFFxE through 0xFFx0. These bits can be
written only in special modes and only with the WRTINT bit set (logic 1) in the interrupt test control register
(ITCR). In addition, I interrupts must be masked using the I bit in the CCR. In this state, the interrupt input lines
to the interrupt sub-block will be disconnected and interrupt requests will be generated only by this register.
These bits can also be read in special modes to view that an interrupt requested by a system block (such as a
peripheral block) has reached the INT module.
There is a test register implemented for every eight interrupts in the overall system. All of the test registers share
the same address and are individually selected using the value stored in the ADR[3:0] bits of the interrupt test
control register (ITCR).
Note: When ADR[3:0] have the value of 0x000F, only bits 2:0 in the ITEST register will be accessible. That is,
vectors higher than 0xFFF4 cannot be tested using the test registers and bits 7:3 will always read as a
logic 0. If ADR[3:0] point to an unimplemented test register, writes will have no effect and reads will always
return a logic 0 value.
5.3.2.3
Highest Priority I Interrupt (Optional)
Module Base + 0x001F
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
PSEL7
PSEL6
PSEL5
PSEL4
PSEL3
PSEL2
PSEL1
Reset
1
1
1
1
0
0
1
0
= Unimplemented or Reserved
Figure 5-4. Highest Priority I Interrupt Register (HPRIO)
Read: Anytime
Write: Only if I mask in CCR = 1
Table 5-4. HPRIO Field Descriptions
Description
Field
7:1
Highest Priority I Interrupt Select Bits — The state of these bits determines which I-bit maskable interrupt will
PSEL[7:1] be promoted to highest priority (of the I-bit maskable interrupts). To promote an interrupt, the user writes the least
significant byte of the associated interrupt vector address to this register. If an unimplemented vector address or
a non I-bit masked vector address (value higher than 0x00F2) is written, IRQ (0xFFF2) will be the default highest
priority interrupt.
5.4
Functional Description
The interrupt sub-block processes all exception requests made by the CPU. These exceptions include
interrupt vector requests and reset vector requests. Each of these exception types and their overall priority
level is discussed in the subsections below.
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5.4.1
Low-Power Modes
The INT does not contain any user-controlled options for reducing power consumption. The operation of
the INT in low-power modes is discussed in the following subsections.
5.4.1.1
Operation in Run Mode
The INT does not contain any options for reducing power in run mode.
5.4.1.2
Operation in Wait Mode
Clocks to the INT can be shut off during system wait mode and the asynchronous interrupt path will be
used to generate the wake-up signal upon recognition of a valid interrupt or any XIRQ request.
5.4.1.3
Operation in Stop Mode
Clocks to the INT can be shut off during system stop mode and the asynchronous interrupt path will be
used to generate the wake-up signal upon recognition of a valid interrupt or any XIRQ request.
5.5
Resets
The INT supports three system reset exception request types: normal system reset or power-on-reset
request, crystal monitor reset request, and COP watchdog reset request. The type of reset exception request
must be decoded by the system and the proper request made to the core. The INT will then provide the
service routine address for the type of reset requested.
5.6
Interrupts
As shown in the block diagram in Figure 5-1, the INT contains a register block to provide interrupt status
and control, an optional highest priority I interrupt (HPRIO) block, and a priority decoder to evaluate
whether pending interrupts are valid and assess their priority.
5.6.1
Interrupt Registers
The INT registers are accessible only in special modes of operation and function as described in
Section 5.3.2.1, “Interrupt Test Control Register,” and Section 5.3.2.2, “Interrupt Test Registers,”
previously.
5.6.2
Highest Priority I-Bit Maskable Interrupt
When the optional HPRIO block is implemented, the user is allowed to promote a single I-bit maskable
interrupt to be the highest priority I interrupt. The HPRIO evaluates all interrupt exception requests and
passes the HPRIO vector to the priority decoder if the highest priority I interrupt is active. RTI replaces
the promoted interrupt source.
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5.6.3
Interrupt Priority Decoder
The priority decoder evaluates all interrupts pending and determines their validity and priority. When the
CPU requests an interrupt vector, the decoder will provide the vector for the highest priority interrupt
request. Because the vector is not supplied until the CPU requests it, it is possible that a higher priority
interrupt request could override the original exception that caused the CPU to request the vector. In this
case, the CPU will receive the highest priority vector and the system will process this exception instead of
the original request.
NOTE
Care must be taken to ensure that all exception requests remain active until
the system begins execution of the applicable service routine; otherwise, the
exception request may not be processed.
If for any reason the interrupt source is unknown (e.g., an interrupt request becomes inactive after the
interrupt has been recognized but prior to the vector request), the vector address will default to that of the
last valid interrupt that existed during the particular interrupt sequence. If the CPU requests an interrupt
vector when there has never been a pending interrupt request, the INT will provide the software interrupt
(SWI) vector address.
5.7
Exception Priority
The priority (from highest to lowest) and address of all exception vectors issued by the INT upon request
by the CPU is shown in Table 5-5.
Table 5-5. Exception Vector Map and Priority
Vector Address
Source
0xFFFE–0xFFFF
0xFFFC–0xFFFD
0xFFFA–0xFFFB
0xFFF8–0xFFF9
0xFFF6–0xFFF7
0xFFF4–0xFFF5
0xFFF2–0xFFF3
0xFFF0–0xFF00
System reset
Crystal monitor reset
COP reset
Unimplemented opcode trap
Software interrupt instruction (SWI) or BDM vector request
XIRQ signal
IRQ signal
Device-specific I-bit maskable interrupt sources (priority in descending order)
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Chapter 6
Background Debug Module (BDMV4) Block Description
6.1
Introduction
This section describes the functionality of the background debug module (BDM) sub-block of the HCS12
core platform.
A block diagram of the BDM is shown in Figure 6-1.
HOST
SYSTEM
16-BIT SHIFT REGISTER
BKGD
ADDRESS
ENTAG
BUS INTERFACE
AND
CONTROL LOGIC
INSTRUCTION DECODE
AND EXECUTION
BDMACT
TRACE
DATA
CLOCKS
STANDARD BDM
FIRMWARE
LOOKUP TABLE
SDV
CLKSW
ENBDM
Figure 6-1. BDM Block Diagram
The background debug module (BDM) sub-block is a single-wire, background debug system implemented
in on-chip hardware for minimal CPU intervention. All interfacing with the BDM is done via the BKGD
pin.
BDMV4 has enhanced capability for maintaining synchronization between the target and host while
allowing more flexibility in clock rates. This includes a sync signal to show the clock rate and a handshake
signal to indicate when an operation is complete. The system is backwards compatible with older external
interfaces.
6.1.1
Features
•
•
•
•
•
•
Single-wire communication with host development system
BDMV4 (and BDM2): Enhanced capability for allowing more flexibility in clock rates
BDMV4: SYNC command to determine communication rate
BDMV4: GO_UNTIL command
BDMV4: Hardware handshake protocol to increase the performance of the serial communication
Active out of reset in special single-chip mode
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•
•
•
•
•
•
•
Nine hardware commands using free cycles, if available, for minimal CPU intervention
Hardware commands not requiring active BDM
15 firmware commands execute from the standard BDM firmware lookup table
Instruction tagging capability
Software control of BDM operation during wait mode
Software selectable clocks
When secured, hardware commands are allowed to access the register space in special single-chip
mode, if the FLASH and EEPROM erase tests fail.
6.1.2
Modes of Operation
BDM is available in all operating modes but must be enabled before firmware commands are executed.
Some system peripherals may have a control bit which allows suspending the peripheral function during
background debug mode.
6.1.2.1
Regular Run Modes
All of these operations refer to the part in run mode. The BDM does not provide controls to conserve power
during run mode.
•
Normal operation
General operation of the BDM is available and operates the same in all normal modes.
Special single-chip mode
•
In special single-chip mode, background operation is enabled and active out of reset. This allows
programming a system with blank memory.
•
Special peripheral mode
BDM is enabled and active immediately out of reset. BDM can be disabled by clearing the
BDMACT bit in the BDM status (BDMSTS) register. The BDM serial system should not be used
in special peripheral mode.
NOTE
The BDM serial system should not be used in special peripheral mode since
the CPU, which in other modes interfaces with the BDM to relinquish
control of the bus during a free cycle or a steal operation, is not operating in
this mode.
•
Emulation modes
General operation of the BDM is available and operates the same as in normal modes.
6.1.2.2
Secure Mode Operation
If the part is in secure mode, the operation of the BDM is reduced to a small subset of its regular run mode
operation. Secure operation prevents access to FLASH or EEPROM other than allowing erasure.
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6.2
External Signal Description
A single-wire interface pin is used to communicate with the BDM system. Two additional pins are used
for instruction tagging. These pins are part of the multiplexed external bus interface (MEBI) sub-block and
all interfacing between the MEBI and BDM is done within the core interface boundary. Functional
descriptions of the pins are provided below for completeness.
•
•
•
•
•
BKGD — Background interface pin
TAGHI — High byte instruction tagging pin
TAGLO — Low byte instruction tagging pin
BKGD and TAGHI share the same pin.
TAGLO and LSTRB share the same pin.
NOTE
Generally these pins are shared as described, but it is best to check the
device overview chapter to make certain. All MCUs at the time of this
writing have followed this pin sharing scheme.
6.2.1
BKGD — Background Interface Pin
Debugging control logic communicates with external devices serially via the single-wire background
interface pin (BKGD). During reset, this pin is a mode select input which selects between normal and
special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the
background debug mode.
6.2.2
TAGHI — High Byte Instruction Tagging Pin
This pin is used to tag the high byte of an instruction. When instruction tagging is on, a logic 0 at the falling
edge of the external clock (ECLK) tags the high half of the instruction word being read into the instruction
queue.
6.2.3
TAGLO — Low Byte Instruction Tagging Pin
This pin is used to tag the low byte of an instruction. When instruction tagging is on and low strobe is
enabled, a logic 0 at the falling edge of the external clock (ECLK) tags the low half of the instruction word
being read into the instruction queue.
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6.3
Memory Map and Register Definition
A summary of the registers associated with the BDM is shown in Figure 6-2. Registers are accessed by
host-driven communications to the BDM hardware using READ_BD and WRITE_BD commands.
Detailed descriptions of the registers and associated bits are given in the subsections that follow.
6.3.1
Module Memory Map
Table 6-1. INT Memory Map
Register
Address
Use
Access
0xFF00
0xFF01
Reserved
—
R/W
—
BDM Status Register (BDMSTS)
Reserved
0xFF02–
0xFF05
0xFF06
0xFF07
BDM CCR Holding Register (BDMCCR)
BDM Internal Register Position (BDMINR)
Reserved
R/W
R
0xFF08–
0xFF0B
—
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6.3.2
Register Descriptions
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
0xFF00
R
X
X
X
X
X
X
0
0
Reserved
W
0xFF01
BDMSTS
R
BDMACT
SDV
X
TRACE
UNSEC
0
X
X
X
X
ENBDM
X
ENTAG
X
CLKSW
X
W
0xFF02
Reserved
R
X
X
X
X
X
X
X
X
X
X
X
X
W
0xFF03
Reserved
R
X
X
X
X
X
X
X
X
X
X
W
0xFF04
Reserved
R
X
W
0xFF05
R
X
Reserved
W
0xFF06
BDMCCR
R
CCR7
0
CCR6
CCR5
CCR4
CCR3
CCR2
0
CCR1
0
CCR0
0
W
0xFF07
R
REG14
REG13
REG12
REG11
BDMINR
W
0xFF08
Reserved
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
W
0xFF09
R
Reserved
W
0xFF0A
Reserved
R
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
W
0xFF0B
R
Reserved
W
= Unimplemented, Reserved
= Indeterminate
= Implemented (do not alter)
= Always read zero
X
0
Figure 6-2. BDM Register Summary
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6.3.2.1
BDM Status Register (BDMSTS)
0xFF01
7
6
5
4
3
2
1
0
R
W
BDMACT
SDV
TRACE
UNSEC
0
ENBDM
ENTAG
CLKSW
Reset:
Special single-chip mode:
Special peripheral mode:
All other modes:
1(1)
0
0
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0(2)
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
= Implemented (do not alter)
Figure 6-3. BDM Status Register (BDMSTS)
Note:
1. ENBDM is read as "1" by a debugging environment in Special single-chip mode when the device is not secured or secured
but fully erased (Flash and EEPROM).This is because the ENBDM bit is set by the standard firmware before a BDM command
can be fully transmitted and executed.
2. UNSEC is read as "1" by a debugging environment in Special single-chip mode when the device is secured and fully erased,
else it is "0" and can only be read if not secure (see also bit description).
Read: All modes through BDM operation
Write: All modes but subject to the following:
•
BDMACT can only be set by BDM hardware upon entry into BDM. It can only be cleared by the
standard BDM firmware lookup table upon exit from BDM active mode.
•
•
CLKSW can only be written via BDM hardware or standard BDM firmware write commands.
All other bits, while writable via BDM hardware or standard BDM firmware write commands,
should only be altered by the BDM hardware or standard firmware lookup table as part of BDM
command execution.
•
ENBDM should only be set via a BDM hardware command if the BDM firmware commands are
needed. (This does not apply in special single-chip mode).
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Table 6-2. BDMSTS Field Descriptions
Field
Description
7
Enable BDM — This bit controls whether the BDM is enabled or disabled. When enabled, BDM can be made
active to allow firmware commands to be executed. When disabled, BDM cannot be made active but BDM
hardware commands are allowed.
ENBDM
0 BDM disabled
1 BDM enabled
Note: ENBDM is set by the firmware immediately out of reset in special single-chip mode. In secure mode, this
bit will not be set by the firmware until after the EEPROM and FLASH erase verify tests are complete.
6
BDM Active Status — This bit becomes set upon entering BDM. The standard BDM firmware lookup table is
BDMACT then enabled and put into the memory map. BDMACT is cleared by a carefully timed store instruction in the
standard BDM firmware as part of the exit sequence to return to user code and remove the BDM memory from
the map.
0 BDM not active
1 BDM active
5
Tagging Enable — This bit indicates whether instruction tagging in enabled or disabled. It is set when the
TAGGO command is executed and cleared when BDM is entered. The serial system is disabled and the tag
function enabled 16 cycles after this bit is written. BDM cannot process serial commands while tagging is active.
0 Tagging not enabled or BDM active
ENTAG
1 Tagging enabled
4
SDV
Shift Data Valid — This bit is set and cleared by the BDM hardware. It is set after data has been transmitted as
part of a firmware read command or after data has been received as part of a firmware write command. It is
cleared when the next BDM command has been received or BDM is exited. SDV is used by the standard BDM
firmware to control program flow execution.
0 Data phase of command not complete
1 Data phase of command is complete
3
TRACE1 BDM Firmware Command is Being Executed — This bit gets set when a BDM TRACE1 firmware
command is first recognized. It will stay set as long as continuous back-to-back TRACE1 commands are
executed. This bit will get cleared when the next command that is not a TRACE1 command is recognized.
0 TRACE1 command is not being executed
TRACE
1 TRACE1 command is being executed
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Table 6-2. BDMSTS Field Descriptions (continued)
Field
Description
2
Clock Switch — The CLKSW bit controls which clock the BDM operates with. It is only writable from a hardware
BDM command. A 150 cycle delay at the clock speed that is active during the data portion of the command will
occur before the new clock source is guaranteed to be active. The start of the next BDM command uses the new
clock for timing subsequent BDM communications.
CLKSW
Table 6-3 shows the resulting BDM clock source based on the CLKSW and the PLLSEL (Pll select from the clock
and reset generator) bits.
Note: The BDM alternate clock source can only be selected when CLKSW = 0 and PLLSEL = 1. The BDM serial
interface is now fully synchronized to the alternate clock source, when enabled. This eliminates frequency
restriction on the alternate clock which was required on previous versions. Refer to the device overview
section to determine which clock connects to the alternate clock source input.
Note: If the acknowledge function is turned on, changing the CLKSW bit will cause the ACK to be at the new rate
for the write command which changes it.
1
Unsecure — This bit is only writable in special single-chip mode from the BDM secure firmware and always gets
reset to zero. It is in a zero state as secure mode is entered so that the secure BDM firmware lookup table is
enabled and put into the memory map along with the standard BDM firmware lookup table.
UNSEC
The secure BDM firmware lookup table verifies that the on-chip EEPROM and FLASH EEPROM are erased. This
being the case, the UNSEC bit is set and the BDM program jumps to the start of the standard BDM firmware
lookup table and the secure BDM firmware lookup table is turned off. If the erase test fails, the UNSEC bit will
not be asserted.
0 System is in a secured mode
1 System is in a unsecured mode
Note: When UNSEC is set, security is off and the user can change the state of the secure bits in the on-chip
FLASH EEPROM. Note that if the user does not change the state of the bits to “unsecured” mode, the
system will be secured again when it is next taken out of reset.
Table 6-3. BDM Clock Sources
PLLSEL
CLKSW
BDMCLK
0
0
1
0
1
0
Bus clock
Bus clock
Alternate clock (refer to the device overview chapter to determine the alternate clock
source)
1
1
Bus clock dependent on the PLL
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6.3.2.2
BDM CCR Holding Register (BDMCCR)
0xFF06
7
6
5
4
3
2
1
0
R
W
CCR7
CCR6
CCR5
CCR4
CCR3
CCR2
CCR1
CCR0
Reset
0
0
0
0
0
0
0
0
Figure 6-4. BDM CCR Holding Register (BDMCCR)
Read: All modes
Write: All modes
NOTE
When BDM is made active, the CPU stores the value of the CCR register in
the BDMCCR register. However, out of special single-chip reset, the
BDMCCR is set to 0xD8 and not 0xD0 which is the reset value of the CCR
register.
When entering background debug mode, the BDM CCR holding register is used to save the contents of the
condition code register of the user’s program. It is also used for temporary storage in the standard BDM
firmware mode. The BDM CCR holding register can be written to modify the CCR value.
6.3.2.3
BDM Internal Register Position Register (BDMINR)
0xFF07
7
6
5
4
3
2
1
0
R
W
0
REG14
REG13
REG12
REG11
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 6-5. BDM Internal Register Position (BDMINR)
Read: All modes
Write: Never
Table 6-4. BDMINR Field Descriptions
Description
Field
6:3
Internal Register Map Position — These four bits show the state of the upper five bits of the base address for
REG[14:11] the system’s relocatable register block. BDMINR is a shadow of the INITRG register which maps the register
block to any 2K byte space within the first 32K bytes of the 64K byte address space.
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6.4
Functional Description
The BDM receives and executes commands from a host via a single wire serial interface. There are two
types of BDM commands, namely, hardware commands and firmware commands.
Hardware commands are used to read and write target system memory locations and to enter active
background debug mode, see Section 6.4.3, “BDM Hardware Commands.” Target system memory
includes all memory that is accessible by the CPU.
Firmware commands are used to read and write CPU resources and to exit from active background debug
mode, see Section 6.4.4, “Standard BDM Firmware Commands.” The CPU resources referred to are the
accumulator (D), X index register (X), Y index register (Y), stack pointer (SP), and program counter (PC).
Hardware commands can be executed at any time and in any mode excluding a few exceptions as
highlighted, see Section 6.4.3, “BDM Hardware Commands.” Firmware commands can only be executed
when the system is in active background debug mode (BDM).
6.4.1
Security
If the user resets into special single-chip mode with the system secured, a secured mode BDM firmware
lookup table is brought into the map overlapping a portion of the standard BDM firmware lookup table.
The secure BDM firmware verifies that the on-chip EEPROM and FLASH EEPROM are erased. This
being the case, the UNSEC bit will get set. The BDM program jumps to the start of the standard BDM
firmware and the secured mode BDM firmware is turned off and all BDM commands are allowed. If the
EEPROM or FLASH do not verify as erased, the BDM firmware sets the ENBDM bit, without asserting
UNSEC, and the firmware enters a loop. This causes the BDM hardware commands to become enabled,
but does not enable the firmware commands. This allows the BDM hardware to be used to erase the
EEPROM and FLASH. After execution of the secure firmware, regardless of the results of the erase tests,
the CPU registers, INITEE and PPAGE, will no longer be in their reset state.
6.4.2
Enabling and Activating BDM
The system must be in active BDM to execute standard BDM firmware commands. BDM can be activated
only after being enabled. BDM is enabled by setting the ENBDM bit in the BDM status (BDMSTS)
register. The ENBDM bit is set by writing to the BDM status (BDMSTS) register, via the single-wire
interface, using a hardware command such as WRITE_BD_BYTE.
1
After being enabled, BDM is activated by one of the following :
•
•
•
•
Hardware BACKGROUND command
BDM external instruction tagging mechanism
CPU BGND instruction
2
Breakpoint sub-block’s force or tag mechanism
When BDM is activated, the CPU finishes executing the current instruction and then begins executing the
firmware in the standard BDM firmware lookup table. When BDM is activated by the breakpoint sub-
1. BDM is enabled and active immediately out of special single-chip reset.
2. This method is only available on systems that have a a breakpoint or a debug sub-block.
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block, the type of breakpoint used determines if BDM becomes active before or after execution of the next
instruction.
NOTE
If an attempt is made to activate BDM before being enabled, the CPU
resumes normal instruction execution after a brief delay. If BDM is not
enabled, any hardware BACKGROUND commands issued are ignored by
the BDM and the CPU is not delayed.
In active BDM, the BDM registers and standard BDM firmware lookup table are mapped to addresses
0xFF00 to 0xFFFF. BDM registers are mapped to addresses 0xFF00 to 0xFF07. The BDM uses these
registers which are readable anytime by the BDM. However, these registers are not readable by user
programs.
6.4.3
BDM Hardware Commands
Hardware commands are used to read and write target system memory locations and to enter active
background debug mode. Target system memory includes all memory that is accessible by the CPU such
as on-chip RAM, EEPROM, FLASH EEPROM, I/O and control registers, and all external memory.
Hardware commands are executed with minimal or no CPU intervention and do not require the system to
be in active BDM for execution, although they can continue to be executed in this mode. When executing
a hardware command, the BDM sub-block waits for a free CPU bus cycle so that the background access
does not disturb the running application program. If a free cycle is not found within 128 clock cycles, the
CPU is momentarily frozen so that the BDM can steal a cycle. When the BDM finds a free cycle, the
operation does not intrude on normal CPU operation provided that it can be completed in a single cycle.
However, if an operation requires multiple cycles the CPU is frozen until the operation is complete, even
though the BDM found a free cycle.
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The BDM hardware commands are listed in Table 6-5.
Table 6-5. Hardware Commands
Opcode
(hex)
Command
Data
Description
BACKGROUND
90
None
Enter background mode if firmware is enabled. If enabled, an ACK will
be issued when the part enters active background mode.
ACK_ENABLE
D5
None
Enable handshake. Issues an ACK pulse after the command is
executed.
ACK_DISABLE
D6
E4
None
Disable handshake. This command does not issue an ACK pulse.
READ_BD_BYTE
16-bit address Read from memory with standard BDM firmware lookup table in map.
16-bit data out Odd address data on low byte; even address data on high byte.
READ_BD_WORD
READ_BYTE
EC
E0
E8
C4
CC
C0
C8
16-bit address Read from memory with standard BDM firmware lookup table in map.
16-bit data out Must be aligned access.
16-bit address Read from memory with standard BDM firmware lookup table out of
16-bit data out map. Odd address data on low byte; even address data on high byte.
READ_WORD
16-bit address Read from memory with standard BDM firmware lookup table out of
16-bit data out map. Must be aligned access.
WRITE_BD_BYTE
WRITE_BD_WORD
WRITE_BYTE
16-bit address Write to memory with standard BDM firmware lookup table in map. Odd
16-bit data in
address data on low byte; even address data on high byte.
16-bit address Write to memory with standard BDM firmware lookup table in map. Must
16-bit data in be aligned access.
16-bit address Write to memory with standard BDM firmware lookup table out of map.
16-bit data in Odd address data on low byte; even address data on high byte.
WRITE_WORD
NOTE:
16-bit address Write to memory with standard BDM firmware lookup table out of map.
16-bit data in Must be aligned access.
If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is
complete for all BDM WRITE commands.
The READ_BD and WRITE_BD commands allow access to the BDM register locations. These locations
are not normally in the system memory map but share addresses with the application in memory. To
distinguish between physical memory locations that share the same address, BDM memory resources are
enabled just for the READ_BD and WRITE_BD access cycle. This allows the BDM to access BDM
locations unobtrusively, even if the addresses conflict with the application memory map.
6.4.4
Standard BDM Firmware Commands
Firmware commands are used to access and manipulate CPU resources. The system must be in active
BDM to execute standard BDM firmware commands, see Section 6.4.2, “Enabling and Activating BDM.”
Normal instruction execution is suspended while the CPU executes the firmware located in the standard
BDM firmware lookup table. The hardware command BACKGROUND is the usual way to activate BDM.
As the system enters active BDM, the standard BDM firmware lookup table and BDM registers become
visible in the on-chip memory map at 0xFF00–0xFFFF, and the CPU begins executing the standard BDM
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firmware. The standard BDM firmware watches for serial commands and executes them as they are
received.
The firmware commands are shown in Table 6-6.
Table 6-6. Firmware Commands
Command(1)
Opcode (hex)
Data
Description
READ_NEXT
READ_PC
READ_D
62
63
64
65
66
67
42
43
44
45
46
47
08
16-bit data out Increment X by 2 (X = X + 2), then read word X points to.
16-bit data out Read program counter.
16-bit data out Read D accumulator.
READ_X
16-bit data out Read X index register.
READ_Y
16-bit data out Read Y index register.
READ_SP
WRITE_NEXT
WRITE_PC
WRITE_D
WRITE_X
WRITE_Y
WRITE_SP
GO
16-bit data out Read stack pointer.
16-bit data in
16-bit data in
16-bit data in
16-bit data in
16-bit data in
16-bit data in
None
Increment X by 2 (X = X + 2), then write word to location pointed to by X.
Write program counter.
Write D accumulator.
Write X index register.
Write Y index register.
Write stack pointer.
Go to user program. If enabled, ACK will occur when leaving active
background mode.
GO_UNTIL(2)
TRACE1
0C
10
18
None
None
None
Go to user program. If enabled, ACK will occur upon returning to active
background mode.
Execute one user instruction then return to active BDM. If enabled, ACK
will occur upon returning to active background mode.
TAGGO
Enable tagging and go to user program. There is no ACK pulse related to
this command.
1. If enabled, ACK will occur when data is ready for transmission for all BDM READ commands and will occur after the write is
complete for all BDM WRITE commands.
2. Both WAIT (with clocks to the S12 CPU core disabled) and STOP disable the ACK function. The GO_UNTIL command will not
get an Acknowledge if one of these two CPU instructions occurs before the “UNTIL” instruction. This can be a problem for any
instruction that uses ACK, but GO_UNTIL is a lot more difficult for the development tool to time-out.
6.4.5
BDM Command Structure
Hardware and firmware BDM commands start with an 8-bit opcode followed by a 16-bit address and/or a
16-bit data word depending on the command. All the read commands return 16 bits of data despite the byte
or word implication in the command name.
NOTE
8-bit reads return 16-bits of data, of which, only one byte will contain valid
data. If reading an even address, the valid data will appear in the MSB. If
reading an odd address, the valid data will appear in the LSB.
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NOTE
16-bit misaligned reads and writes are not allowed. If attempted, the BDM
will ignore the least significant bit of the address and will assume an even
address from the remaining bits.
For hardware data read commands, the external host must wait 150 bus clock cycles after sending the
address before attempting to obtain the read data. This is to be certain that valid data is available in the
BDM shift register, ready to be shifted out. For hardware write commands, the external host must wait
150 bus clock cycles after sending the data to be written before attempting to send a new command. This
is to avoid disturbing the BDM shift register before the write has been completed. The 150 bus clock cycle
delay in both cases includes the maximum 128 cycle delay that can be incurred as the BDM waits for a
free cycle before stealing a cycle.
For firmware read commands, the external host should wait 44 bus clock cycles after sending the command
opcode and before attempting to obtain the read data. This includes the potential of an extra 7 cycles when
the access is external with a narrow bus access (+1 cycle) and / or a stretch (+1, 2, or 3 cycles), (7 cycles
could be needed if both occur). The 44 cycle wait allows enough time for the requested data to be made
available in the BDM shift register, ready to be shifted out.
NOTE
This timing has increased from previous BDM modules due to the new
capability in which the BDM serial interface can potentially run faster than
the bus. On previous BDM modules this extra time could be hidden within
the serial time.
For firmware write commands, the external host must wait 32 bus clock cycles after sending the data to be
written before attempting to send a new command. This is to avoid disturbing the BDM shift register
before the write has been completed.
The external host should wait 64 bus clock cycles after a TRACE1 or GO command before starting any
new serial command. This is to allow the CPU to exit gracefully from the standard BDM firmware lookup
table and resume execution of the user code. Disturbing the BDM shift register prematurely may adversely
affect the exit from the standard BDM firmware lookup table.
NOTE
If the bus rate of the target processor is unknown or could be changing, it is
recommended that the ACK (acknowledge function) be used to indicate
when an operation is complete. When using ACK, the delay times are
automated.
Figure 6-6 represents the BDM command structure. The command blocks illustrate a series of eight bit
times starting with a falling edge. The bar across the top of the blocks indicates that the BKGD line idles
1
in the high state. The time for an 8-bit command is 8 × 16 target clock cycles.
1. Target clock cycles are cycles measured using the target MCU’s serial clock rate. See Section 6.4.6, “BDM Serial Interface,”
and Section 6.3.2.1, “BDM Status Register (BDMSTS),” for information on how serial clock rate is selected.
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8 BITS
AT ∼16 TC/BIT
16 BITS
AT ∼16 TC/BIT
150-BC
DELAY
16 BITS
AT ∼16 TC/BIT
HARDWARE
READ
NEXT
COMMAND
COMMAND
COMMAND
COMMAND
COMMAND
COMMAND
ADDRESS
DATA
150-BC
DELAY
HARDWARE
WRITE
NEXT
COMMAND
ADDRESS
DATA
44-BC
DELAY
FIRMWARE
READ
NEXT
COMMAND
DATA
32-BC
DELAY
FIRMWARE
WRITE
NEXT
COMMAND
DATA
64-BC
DELAY
GO,
TRACE
NEXT
COMMAND
BC = BUS CLOCK CYCLES
TC = TARGET CLOCK CYCLES
Figure 6-6. BDM Command Structure
6.4.6
BDM Serial Interface
The BDM communicates with external devices serially via the BKGD pin. During reset, this pin is a mode
select input which selects between normal and special modes of operation. After reset, this pin becomes
the dedicated serial interface pin for the BDM.
The BDM serial interface is timed using the clock selected by the CLKSW bit in the status register see
Section 6.3.2.1, “BDM Status Register (BDMSTS).” This clock will be referred to as the target clock in
the following explanation.
The BDM serial interface uses a clocking scheme in which the external host generates a falling edge on
the BKGD pin to indicate the start of each bit time. This falling edge is sent for every bit whether data is
transmitted or received. Data is transferred most significant bit (MSB) first at 16 target clock cycles per
bit. The interface times out if 512 clock cycles occur between falling edges from the host.
The BKGD pin is a pseudo open-drain pin and has an weak on-chip active pull-up that is enabled at all
times. It is assumed that there is an external pull-up and that drivers connected to BKGD do not typically
drive the high level. Because R-C rise time could be unacceptably long, the target system and host provide
brief driven-high (speedup) pulses to drive BKGD to a logic 1. The source of this speedup pulse is the host
for transmit cases and the target for receive cases.
The timing for host-to-target is shown in Figure 6-7 and that of target-to-host in Figure 6-8 and Figure 6-
9. All four cases begin when the host drives the BKGD pin low to generate a falling edge. Because the host
and target are operating from separate clocks, it can take the target system up to one full clock cycle to
recognize this edge. The target measures delays from this perceived start of the bit time while the host
measures delays from the point it actually drove BKGD low to start the bit up to one target clock cycle
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earlier. Synchronization between the host and target is established in this manner at the start of every bit
time.
Figure 6-7 shows an external host transmitting a logic 1 and transmitting a logic 0 to the BKGD pin of a
target system. The host is asynchronous to the target, so there is up to a one clock-cycle delay from the
host-generated falling edge to where the target recognizes this edge as the beginning of the bit time. Ten
target clock cycles later, the target senses the bit level on the BKGD pin. Internal glitch detect logic
requires the pin be driven high no later that eight target clock cycles after the falling edge for a logic 1
transmission.
Because the host drives the high speedup pulses in these two cases, the rising edges look like digitally
driven signals.
CLOCK
TARGET SYSTEM
HOST
TRANSMIT 1
HOST
TRANSMIT 0
PERCEIVED
START OF BIT TIME
TARGET SENSES BIT
EARLIEST
START OF
NEXT BIT
10 CYCLES
SYNCHRONIZATION
UNCERTAINTY
Figure 6-7. BDM Host-to-Target Serial Bit Timing
The receive cases are more complicated. Figure 6-8 shows the host receiving a logic 1 from the target
system. Because the host is asynchronous to the target, there is up to one clock-cycle delay from the host-
generated falling edge on BKGD to the perceived start of the bit time in the target. The host holds the
BKGD pin low long enough for the target to recognize it (at least two target clock cycles). The host must
release the low drive before the target drives a brief high speedup pulse seven target clock cycles after the
perceived start of the bit time. The host should sample the bit level about 10 target clock cycles after it
started the bit time.
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CLOCK
TARGET SYSTEM
HOST
DRIVE TO
BKGD PIN
HIGH-IMPEDANCE
TARGET SYSTEM
SPEEDUP
PULSE
HIGH-IMPEDANCE
HIGH-IMPEDANCE
PERCEIVED
START OF BIT TIME
R-C RISE
BKGD PIN
10 CYCLES
10 CYCLES
EARLIEST
START OF
NEXT BIT
HOST SAMPLES
BKGD PIN
Figure 6-8. BDM Target-to-Host Serial Bit Timing (Logic 1)
Figure 6-9 shows the host receiving a logic 0 from the target. Because the host is asynchronous to the
target, there is up to a one clock-cycle delay from the host-generated falling edge on BKGD to the start of
the bit time as perceived by the target. The host initiates the bit time but the target finishes it. Because the
target wants the host to receive a logic 0, it drives the BKGD pin low for 13 target clock cycles then briefly
drives it high to speed up the rising edge. The host samples the bit level about 10 target clock cycles after
starting the bit time.
CLOCK
TARGET SYS.
HOST
DRIVE TO
BKGD PIN
HIGH-IMPEDANCE
SPEEDUP PULSE
TARGET SYS.
DRIVE AND
SPEEDUP PULSE
PERCEIVED
START OF BIT TIME
BKGD PIN
10 CYCLES
10 CYCLES
EARLIEST
START OF
NEXT BIT
HOST SAMPLES
BKGD PIN
Figure 6-9. BDM Target-to-Host Serial Bit Timing (Logic 0)
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6.4.7
Serial Interface Hardware Handshake Protocol
BDM commands that require CPU execution are ultimately treated at the MCU bus rate. Because the BDM
clock source can be asynchronously related to the bus frequency, when CLKSW = 0, it is very helpful to
provide a handshake protocol in which the host could determine when an issued command is executed by
the CPU. The alternative is to always wait the amount of time equal to the appropriate number of cycles at
the slowest possible rate the clock could be running. This sub-section will describe the hardware
handshake protocol.
The hardware handshake protocol signals to the host controller when an issued command was successfully
executed by the target. This protocol is implemented by a 16 serial clock cycle low pulse followed by a
brief speedup pulse in the BKGD pin. This pulse is generated by the target MCU when a command, issued
by the host, has been successfully executed (see Figure 6-10). This pulse is referred to as the ACK pulse.
After the ACK pulse has finished: the host can start the bit retrieval if the last issued command was a read
command, or start a new command if the last command was a write command or a control command
(BACKGROUND, GO, GO_UNTIL, or TRACE1). The ACK pulse is not issued earlier than 32 serial
clock cycles after the BDM command was issued. The end of the BDM command is assumed to be the
16th tick of the last bit. This minimum delay assures enough time for the host to perceive the ACK pulse.
Note also that, there is no upper limit for the delay between the command and the related ACK pulse,
because the command execution depends upon the CPU bus frequency, which in some cases could be very
slow compared to the serial communication rate. This protocol allows a great flexibility for the POD
designers, because it does not rely on any accurate time measurement or short response time to any event
in the serial communication.
BDM CLOCK
(TARGET MCU)
16 CYCLES
TARGET
TRANSMITS
HIGH-IMPEDANCE
32 CYCLES
HIGH-IMPEDANCE
ACK
PULSE
SPEEDUP PULSE
MINIMUM DELAY
FROM THE BDM COMMAND
BKGD PIN
EARLIEST
START OF
NEXT BIT
16th TICK OF THE
LAST COMMAD BIT
Figure 6-10. Target Acknowledge Pulse (ACK)
NOTE
If the ACK pulse was issued by the target, the host assumes the previous
command was executed. If the CPU enters WAIT or STOP prior to
executing a hardware command, the ACK pulse will not be issued meaning
that the BDM command was not executed. After entering wait or stop mode,
the BDM command is no longer pending.
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Figure 6-11 shows the ACK handshake protocol in a command level timing diagram. The READ_BYTE
instruction is used as an example. First, the 8-bit instruction opcode is sent by the host, followed by the
address of the memory location to be read. The target BDM decodes the instruction. A bus cycle is grabbed
(free or stolen) by the BDM and it executes the READ_BYTE operation. Having retrieved the data, the
BDM issues an ACK pulse to the host controller, indicating that the addressed byte is ready to be retrieved.
After detecting the ACK pulse, the host initiates the byte retrieval process. Note that data is sent in the form
of a word and the host needs to determine which is the appropriate byte based on whether the address was
odd or even.
TARGET
HOST
(2) BYTES ARE
RETRIEVED
NEW BDM
COMMAND
BKGD PIN
READ_BYTE
BYTE ADDRESS
TARGET
HOST
TARGET
HOST
BDM ISSUES THE
ACK PULSE (OUT OF SCALE)
BDM DECODES
THE COMMAND
BDM EXECUTES THE
READ_BYTE COMMAND
Figure 6-11. Handshake Protocol at Command Level
Differently from the normal bit transfer (where the host initiates the transmission), the serial interface ACK
handshake pulse is initiated by the target MCU by issuing a falling edge in the BKGD pin. The hardware
handshake protocol in Figure 6-10 specifies the timing when the BKGD pin is being driven, so the host
should follow this timing constraint in order to avoid the risk of an electrical conflict in the BKGD pin.
NOTE
The only place the BKGD pin can have an electrical conflict is when one
side is driving low and the other side is issuing a speedup pulse (high). Other
“highs” are pulled rather than driven. However, at low rates the time of the
speedup pulse can become lengthy and so the potential conflict time
becomes longer as well.
The ACK handshake protocol does not support nested ACK pulses. If a BDM command is not
acknowledge by an ACK pulse, the host needs to abort the pending command first in order to be able to
issue a new BDM command. When the CPU enters WAIT or STOP while the host issues a command that
requires CPU execution (e.g., WRITE_BYTE), the target discards the incoming command due to the
WAIT or STOP being detected. Therefore, the command is not acknowledged by the target, which means
that the ACK pulse will not be issued in this case. After a certain time the host should decide to abort the
ACK sequence in order to be free to issue a new command. Therefore, the protocol should provide a
mechanism in which a command, and therefore a pending ACK, could be aborted.
NOTE
Differently from a regular BDM command, the ACK pulse does not provide
a time out. This means that in the case of a WAIT or STOP instruction being
executed, the ACK would be prevented from being issued. If not aborted, the
ACK would remain pending indefinitely. See the handshake abort procedure
described in Section 6.4.8, “Hardware Handshake Abort Procedure.”
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6.4.8
Hardware Handshake Abort Procedure
The abort procedure is based on the SYNC command. In order to abort a command, which had not issued
the corresponding ACK pulse, the host controller should generate a low pulse in the BKGD pin by driving
it low for at least 128 serial clock cycles and then driving it high for one serial clock cycle, providing a
speedup pulse. By detecting this long low pulse in the BKGD pin, the target executes the SYNC protocol,
see Section 6.4.9, “SYNC — Request Timed Reference Pulse,” and assumes that the pending command
and therefore the related ACK pulse, are being aborted. Therefore, after the SYNC protocol has been
completed the host is free to issue new BDM commands.
Although it is not recommended, the host could abort a pending BDM command by issuing a low pulse in
the BKGD pin shorter than 128 serial clock cycles, which will not be interpreted as the SYNC command.
The ACK is actually aborted when a falling edge is perceived by the target in the BKGD pin. The short
abort pulse should have at least 4 clock cycles keeping the BKGD pin low, in order to allow the falling
edge to be detected by the target. In this case, the target will not execute the SYNC protocol but the pending
command will be aborted along with the ACK pulse. The potential problem with this abort procedure is
when there is a conflict between the ACK pulse and the short abort pulse. In this case, the target may not
perceive the abort pulse. The worst case is when the pending command is a read command (i.e.,
READ_BYTE). If the abort pulse is not perceived by the target the host will attempt to send a new
command after the abort pulse was issued, while the target expects the host to retrieve the accessed
memory byte. In this case, host and target will run out of synchronism. However, if the command to be
aborted is not a read command the short abort pulse could be used. After a command is aborted the target
assumes the next falling edge, after the abort pulse, is the first bit of a new BDM command.
NOTE
The details about the short abort pulse are being provided only as a reference
for the reader to better understand the BDM internal behavior. It is not
recommended that this procedure be used in a real application.
Because the host knows the target serial clock frequency, the SYNC command (used to abort a command)
does not need to consider the lower possible target frequency. In this case, the host could issue a SYNC
very close to the 128 serial clock cycles length. Providing a small overhead on the pulse length in order to
assure the SYNC pulse will not be misinterpreted by the target. See Section 6.4.9, “SYNC — Request
Timed Reference Pulse.”
Figure 6-12 shows a SYNC command being issued after a READ_BYTE, which aborts the READ_BYTE
command. Note that, after the command is aborted a new command could be issued by the host computer.
NOTE
Figure 6-12 does not represent the signals in a true timing scale
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READ_BYTE CMD IS ABORTED
BY THE SYNC REQUEST
(OUT OF SCALE)
SYNC RESPONSE
FROM THE TARGET
(OUT OF SCALE)
BKGD PIN
READ_BYTE
HOST
MEMORY ADDRESS
READ_STATUS
HOST TARGET
NEW BDM COMMAND
TARGET
HOST
TARGET
BDM DECODE
AND STARTS TO EXECUTES
THE READ_BYTE CMD
NEW BDM COMMAND
Figure 6-12. ACK Abort Procedure at the Command Level
Figure 6-13 shows a conflict between the ACK pulse and the SYNC request pulse. This conflict could
occur if a POD device is connected to the target BKGD pin and the target is already in debug active mode.
Consider that the target CPU is executing a pending BDM command at the exact moment the POD is being
connected to the BKGD pin. In this case, an ACK pulse is issued along with the SYNC command. In this
case, there is an electrical conflict between the ACK speedup pulse and the SYNC pulse. Because this is
not a probable situation, the protocol does not prevent this conflict from happening.
AT LEAST 128 CYCLES
BDM CLOCK
(TARGET MCU)
ACK PULSE
TARGET MCU
DRIVES TO
BKGD PIN
HIGH-IMPEDANCE
ELECTRICAL CONFLICT
SPEEDUP PULSE
HOST AND
TARGET DRIVE
TO BKGD PIN
HOST
DRIVES SYNC
TO BKGD PIN
HOST SYNC REQUEST PULSE
BKGD PIN
16 CYCLES
Figure 6-13. ACK Pulse and SYNC Request Conflict
NOTE
This information is being provided so that the MCU integrator will be aware
that such a conflict could eventually occur.
The hardware handshake protocol is enabled by the ACK_ENABLE and disabled by the ACK_DISABLE
BDM commands. This provides backwards compatibility with the existing POD devices which are not
able to execute the hardware handshake protocol. It also allows for new POD devices, that support the
hardware handshake protocol, to freely communicate with the target device. If desired, without the need
for waiting for the ACK pulse.
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The commands are described as follows:
•
ACK_ENABLE — enables the hardware handshake protocol. The target will issue the ACK pulse
when a CPU command is executed by the CPU. The ACK_ENABLE command itself also has the
ACK pulse as a response.
•
ACK_DISABLE — disables the ACK pulse protocol. In this case, the host needs to use the worst
case delay time at the appropriate places in the protocol.
The default state of the BDM after reset is hardware handshake protocol disabled.
All the read commands will ACK (if enabled) when the data bus cycle has completed and the data is then
ready for reading out by the BKGD serial pin. All the write commands will ACK (if enabled) after the data
has been received by the BDM through the BKGD serial pin and when the data bus cycle is complete. See
Section 6.4.3, “BDM Hardware Commands,” and Section 6.4.4, “Standard BDM Firmware Commands,”
for more information on the BDM commands.
The ACK_ENABLE sends an ACK pulse when the command has been completed. This feature could be
used by the host to evaluate if the target supports the hardware handshake protocol. If an ACK pulse is
issued in response to this command, the host knows that the target supports the hardware handshake
protocol. If the target does not support the hardware handshake protocol the ACK pulse is not issued. In
this case, the ACK_ENABLE command is ignored by the target because it is not recognized as a valid
command.
The BACKGROUND command will issue an ACK pulse when the CPU changes from normal to
background mode. The ACK pulse related to this command could be aborted using the SYNC command.
The GO command will issue an ACK pulse when the CPU exits from background mode. The ACK pulse
related to this command could be aborted using the SYNC command.
The GO_UNTIL command is equivalent to a GO command with exception that the ACK pulse, in this
case, is issued when the CPU enters into background mode. This command is an alternative to the GO
command and should be used when the host wants to trace if a breakpoint match occurs and causes the
CPU to enter active background mode. Note that the ACK is issued whenever the CPU enters BDM, which
could be caused by a breakpoint match or by a BGND instruction being executed. The ACK pulse related
to this command could be aborted using the SYNC command.
The TRACE1 command has the related ACK pulse issued when the CPU enters background active mode
after one instruction of the application program is executed. The ACK pulse related to this command could
be aborted using the SYNC command.
The TAGGO command will not issue an ACK pulse because this would interfere with the tagging function
shared on the same pin.
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6.4.9
SYNC — Request Timed Reference Pulse
The SYNC command is unlike other BDM commands because the host does not necessarily know the
correct communication speed to use for BDM communications until after it has analyzed the response to
the SYNC command. To issue a SYNC command, the host should perform the following steps:
1. Drive the BKGD pin low for at least 128 cycles at the lowest possible BDM serial communication
frequency (the lowest serial communication frequency is determined by the crystal oscillator or the
clock chosen by CLKSW.)
2. Drive BKGD high for a brief speedup pulse to get a fast rise time (this speedup pulse is typically
one cycle of the host clock.)
3. Remove all drive to the BKGD pin so it reverts to high impedance.
4. Listen to the BKGD pin for the sync response pulse.
Upon detecting the SYNC request from the host, the target performs the following steps:
1. Discards any incomplete command received or bit retrieved.
2. Waits for BKGD to return to a logic 1.
3. Delays 16 cycles to allow the host to stop driving the high speedup pulse.
4. Drives BKGD low for 128 cycles at the current BDM serial communication frequency.
5. Drives a one-cycle high speedup pulse to force a fast rise time on BKGD.
6. Removes all drive to the BKGD pin so it reverts to high impedance.
The host measures the low time of this 128 cycle SYNC response pulse and determines the correct speed
for subsequent BDM communications. Typically, the host can determine the correct communication speed
within a few percent of the actual target speed and the communication protocol can easily tolerate speed
errors of several percent.
As soon as the SYNC request is detected by the target, any partially received command or bit retrieved is
discarded. This is referred to as a soft-reset, equivalent to a time-out in the serial communication. After the
SYNC response, the target will consider the next falling edge (issued by the host) as the start of a new
BDM command or the start of new SYNC request.
Another use of the SYNC command pulse is to abort a pending ACK pulse. The behavior is exactly the
same as in a regular SYNC command. Note that one of the possible causes for a command to not be
acknowledged by the target is a host-target synchronization problem. In this case, the command may not
have been understood by the target and so an ACK response pulse will not be issued.
6.4.10 Instruction Tracing
When a TRACE1 command is issued to the BDM in active BDM, the CPU exits the standard BDM
firmware and executes a single instruction in the user code. As soon as this has occurred, the CPU is forced
to return to the standard BDM firmware and the BDM is active and ready to receive a new command. If
the TRACE1 command is issued again, the next user instruction will be executed. This facilitates stepping
or tracing through the user code one instruction at a time.
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If an interrupt is pending when a TRACE1 command is issued, the interrupt stacking operation occurs but
no user instruction is executed. Upon return to standard BDM firmware execution, the program counter
points to the first instruction in the interrupt service routine.
6.4.11 Instruction Tagging
The instruction queue and cycle-by-cycle CPU activity are reconstructible in real time or from trace history
that is captured by a logic analyzer. However, the reconstructed queue cannot be used to stop the CPU at
a specific instruction. This is because execution already has begun by the time an operation is visible
outside the system. A separate instruction tagging mechanism is provided for this purpose.
The tag follows program information as it advances through the instruction queue. When a tagged
instruction reaches the head of the queue, the CPU enters active BDM rather than executing the instruction.
NOTE
Tagging is disabled when BDM becomes active and BDM serial commands
are not processed while tagging is active.
Executing the BDM TAGGO command configures two system pins for tagging. The TAGLO signal shares
a pin with the LSTRB signal, and the TAGHI signal shares a pin with the BKGD signal.
Table 6-7 shows the functions of the two tagging pins. The pins operate independently, that is the state of
one pin does not affect the function of the other. The presence of logic level 0 on either pin at the fall of
the external clock (ECLK) performs the indicated function. High tagging is allowed in all modes. Low
tagging is allowed only when low strobe is enabled (LSTRB is allowed only in wide expanded modes and
emulation expanded narrow mode).
Table 6-7. Tag Pin Function
TAGHI
TAGLO
Tag
1
1
0
0
1
0
1
0
No tag
Low byte
High byte
Both bytes
6.4.12 Serial Communication Time-Out
The host initiates a host-to-target serial transmission by generating a falling edge on the BKGD pin. If
BKGD is kept low for more than 128 target clock cycles, the target understands that a SYNC command
was issued. In this case, the target will keep waiting for a rising edge on BKGD in order to answer the
SYNC request pulse. If the rising edge is not detected, the target will keep waiting forever without any
time-out limit.
Consider now the case where the host returns BKGD to logic one before 128 cycles. This is interpreted as
a valid bit transmission, and not as a SYNC request. The target will keep waiting for another falling edge
marking the start of a new bit. If, however, a new falling edge is not detected by the target within 512 clock
cycles since the last falling edge, a time-out occurs and the current command is discarded without affecting
memory or the operating mode of the MCU. This is referred to as a soft-reset.
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If a read command is issued but the data is not retrieved within 512 serial clock cycles, a soft-reset will
occur causing the command to be disregarded. The data is not available for retrieval after the time-out has
occurred. This is the expected behavior if the handshake protocol is not enabled. However, consider the
behavior where the BDC is running in a frequency much greater than the CPU frequency. In this case, the
command could time out before the data is ready to be retrieved. In order to allow the data to be retrieved
even with a large clock frequency mismatch (between BDC and CPU) when the hardware handshake
protocol is enabled, the time out between a read command and the data retrieval is disabled. Therefore, the
host could wait for more then 512 serial clock cycles and continue to be able to retrieve the data from an
issued read command. However, as soon as the handshake pulse (ACK pulse) is issued, the time-out feature
is re-activated, meaning that the target will time out after 512 clock cycles. Therefore, the host needs to
retrieve the data within a 512 serial clock cycles time frame after the ACK pulse had been issued. After
that period, the read command is discarded and the data is no longer available for retrieval. Any falling
edge of the BKGD pin after the time-out period is considered to be a new command or a SYNC request.
Note that whenever a partially issued command, or partially retrieved data, has occurred the time out in the
serial communication is active. This means that if a time frame higher than 512 serial clock cycles is
observed between two consecutive negative edges and the command being issued or data being retrieved
is not complete, a soft-reset will occur causing the partially received command or data retrieved to be
disregarded. The next falling edge of the BKGD pin, after a soft-reset has occurred, is considered by the
target as the start of a new BDM command, or the start of a SYNC request pulse.
6.4.13 Operation in Wait Mode
The BDM cannot be used in wait mode if the system disables the clocks to the BDM.
There is a clearing mechanism associated with the WAIT instruction when the clocks to the BDM (CPU
core platform) are disabled. As the clocks restart from wait mode, the BDM receives a soft reset (clearing
any command in progress) and the ACK function will be disabled. This is a change from previous BDM
modules.
6.4.14 Operation in Stop Mode
The BDM is completely shutdown in stop mode.
There is a clearing mechanism associated with the STOP instruction. STOP must be enabled and the part
must go into stop mode for this to occur. As the clocks restart from stop mode, the BDM receives a soft
reset (clearing any command in progress) and the ACK function will be disabled. This is a change from
previous BDM modules.
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Chapter 7
Debug Module (DBGV1) Block Description
7.1
Introduction
This section describes the functionality of the debug (DBG) sub-block of the HCS12 core platform.
The DBG module is designed to be fully compatible with the existing BKP_HCS12_A module (BKP
mode) and furthermore provides an on-chip trace buffer with flexible triggering capability (DBG mode).
The DBG module provides for non-intrusive debug of application software. The DBG module is optimized
for the HCS12 16-bit architecture.
7.1.1
Features
The DBG module in BKP mode includes these distinctive features:
•
•
•
•
Full or dual breakpoint mode
— Compare on address and data (full)
— Compare on either of two addresses (dual)
BDM or SWI breakpoint
— Enter BDM on breakpoint (BDM)
— Execute SWI on breakpoint (SWI)
Tagged or forced breakpoint
— Break just before a specific instruction will begin execution (TAG)
— Break on the first instruction boundary after a match occurs (Force)
Single, range, or page address compares
— Compare on address (single)
— Compare on address 256 byte (range)
— Compare on any 16K page (page)
•
•
•
At forced breakpoints compare address on read or write
High and/or low byte data compares
Comparator C can provide an additional tag or force breakpoint (enhancement for BKP mode)
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The DBG in DBG mode includes these distinctive features:
•
Three comparators (A, B, and C)
— Dual mode, comparators A and B used to compare addresses
— Full mode, comparator A compares address and comparator B compares data
— Can be used as trigger and/or breakpoint
— Comparator C used in LOOP1 capture mode or as additional breakpoint
Four capture modes
•
— Normal mode, change-of-flow information is captured based on trigger specification
— Loop1 mode, comparator C is dynamically updated to prevent redundant change-of-flow
storage.
— Detail mode, address and data for all cycles except program fetch (P) and free (f) cycles are
stored in trace buffer
— Profile mode, last instruction address executed by CPU is returned when trace buffer address is
read
•
•
•
Two types of breakpoint or debug triggers
— Break just before a specific instruction will begin execution (tag)
— Break on the first instruction boundary after a match occurs (force)
BDM or SWI breakpoint
— Enter BDM on breakpoint (BDM)
— Execute SWI on breakpoint (SWI)
Nine trigger modes for comparators A and B
— A
— A or B
— A then B
— A and B, where B is data (full mode)
— A and not B, where B is data (full mode)
— Event only B, store data
— A then event only B, store data
— Inside range, A ≤ address ≤ B
— Outside range, address < Α or address > B
•
•
Comparator C provides an additional tag or force breakpoint when capture mode is not configured
in LOOP1 mode.
Sixty-four word (16 bits wide) trace buffer for storing change-of-flow information, event only data
and other bus information.
— Source address of taken conditional branches (long, short, bit-conditional, and loop constructs)
— Destination address of indexed JMP, JSR, and CALL instruction.
— Destination address of RTI, RTS, and RTC instructions
— Vector address of interrupts, except for SWI and BDM vectors
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— Data associated with event B trigger modes
— Detail report mode stores address and data for all cycles except program (P) and free (f) cycles
— Current instruction address when in profiling mode
— BGND is not considered a change-of-flow (cof) by the debugger
7.1.2
Modes of Operation
There are two main modes of operation: breakpoint mode and debug mode. Each one is mutually exclusive
of the other and selected via a software programmable control bit.
In the breakpoint mode there are two sub-modes of operation:
•
Dual address mode, where a match on either of two addresses will cause the system to enter
background debug mode (BDM) or initiate a software interrupt (SWI).
•
Full breakpoint mode, where a match on address and data will cause the system to enter
background debug mode (BDM) or initiate a software interrupt (SWI).
In debug mode, there are several sub-modes of operation.
•
Trigger modes
There are many ways to create a logical trigger. The trigger can be used to capture bus information
either starting from the trigger or ending at the trigger. Types of triggers (A and B are registers):
— A only
— A or B
— A then B
— Event only B (data capture)
— A then event only B (data capture)
— A and B, full mode
— A and not B, full mode
— Inside range
— Outside range
•
Capture modes
There are several capture modes. These determine which bus information is saved and which is
ignored.
— Normal: save change-of-flow program fetches
— Loop1: save change-of-flow program fetches, ignoring duplicates
— Detail: save all bus operations except program and free cycles
— Profile: poll target from external device
7.1.3
Block Diagram
Figure 7-1 is a block diagram of this module in breakpoint mode. Figure 7-2 is a block diagram of this
module in debug mode.
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CLOCKS AND
CONTROL SIGNALS
BKP CONTROL
SIGNALS
CONTROL BLOCK
BREAKPOINT MODES
AND GENERATION OF SWI,
FORCE BDM, AND TAGS
. . . . . .
. . . . . .
EXPANSION ADDRESS
ADDRESS
WRITE DATA
READ DATA
REGISTER BLOCK
BKPCT0
BKPCT1
COMPARE BLOCK
COMPARATOR
EXPANSION ADDRESSES
BKP READ
DATA BUS
BKP0X
BKP0H
BKP0L
ADDRESS HIGH
ADDRESS LOW
WRITE
DATA BUS
COMPARATOR
COMPARATOR
COMPARATOR
COMPARATOR
COMPARATOR
COMPARATOR
COMPARATOR
EXPANSION ADDRESSES
BKP1X
BKP1H
DATA HIGH
DATA/ADDRESS
HIGH MUX
ADDRESS HIGH
DATA LOW
DATA/ADDRESS
LOW MUX
ADDRESS LOW
BKP1L
READ DATA HIGH
READ DATA LOW
Figure 7-1. DBG Block Diagram in BKP Mode
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DBG READ DATA BUS
ADDRESS BUS
ADDRESS/DATA/CONTROL
REGISTERS
CONTROL
WRITE DATA BUS
READ DATA BUS
TRACER
BUFFER
CONTROL
LOGIC
MATCH_A
MATCH_B
COMPARATOR A
COMPARATOR B
COMPARATOR C
TAG
READ/WRITE
FORCE
MATCH_C
LOOP1
DBG MODE ENABLE
CHANGE-OF-FLOW
INDICATORS
MCU IN BDM
DETAIL
EVENT ONLY
STORE
CPU PROGRAM COUNTER
POINTER
INSTRUCTION
LAST CYCLE
M
U
X
REGISTER
PROFILE CAPTURE MODE
TRACE BUFFER
OR PROFILING DATA
64 x 16 BIT
M
U
X
BUS CLOCK
WORD
TRACE
BUFFER
M
U
X
WRITE DATA BUS
READ DATA BUS
M
U
X
LAST
INSTRUCTION
ADDRESS
PROFILE
CAPTURE
REGISTER
READ/WRITE
Figure 7-2. DBG Block Diagram in DBG Mode
7.2
External Signal Description
The DBG sub-module relies on the external bus interface (generally the MEBI) when the DBG is matching
on the external bus.
The tag pins in Table 7-1 (part of the MEBI) may also be a part of the breakpoint operation.
Table 7-1. External System Pins Associated with DBG and MEBI
Pin Name
Pin Functions
Description
BKGD/MODC/
TAGHI
TAGHI
When instruction tagging is on, a 0 at the falling edge of E tags the high half of the
instruction word being read into the instruction queue.
PE3/LSTRB/ TAGLO
TAGLO
In expanded wide mode or emulation narrow modes, when instruction tagging is on
and low strobe is enabled, a 0 at the falling edge of E tags the low half of the
instruction word being read into the instruction queue.
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7.3
Memory Map and Register Definition
A summary of the registers associated with the DBG sub-block is shown in Figure 7-3. Detailed
descriptions of the registers and bits are given in the subsections that follow.
7.3.1
Module Memory Map
Table 7-2. DBGV1 Memory Map
Address
Offset
Use
Access
0x0020
0x0021
0x0022
0x0023
0x0024
0x0025
0x0026
0x0027
0x0028
0x0029
0x002A
0x002B
0x002C
0x002D
0x002E
0x002F
Debug Control Register (DBGC1)
R/W
R/W
R
Debug Status and Control Register (DBGSC)
Debug Trace Buffer Register High (DBGTBH)
Debug Trace Buffer Register Low (DBGTBL)
R
Debug Count Register (DBGCNT)
R
Debug Comparator C Extended Register (DBGCCX)
Debug Comparator C Register High (DBGCCH)
Debug Comparator C Register Low (DBGCCL)
Debug Control Register 2 (DBGC2) / (BKPCT0)
Debug Control Register 3 (DBGC3) / (BKPCT1)
Debug Comparator A Extended Register (DBGCAX) / (/BKP0X)
Debug Comparator A Register High (DBGCAH) / (BKP0H)
Debug Comparator A Register Low (DBGCAL) / (BKP0L)
Debug Comparator B Extended Register (DBGCBX) / (BKP1X)
Debug Comparator B Register High (DBGCBH) / (BKP1H)
Debug Comparator B Register Low (DBGCBL) / (BKP1L)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7.3.2
Register Descriptions
This section consists of the DBG register descriptions in address order. Most of the register bits can be
written to in either BKP or DBG mode, although they may not have any effect in one of the modes.
However, the only bits in the DBG module that can be written while the debugger is armed (ARM = 1) are
DBGEN and ARM
Name(1)
Bit 7
6
5
4
3
2
1
Bit 0
CAPMOD
R
0
0x0020
DBGC1
DBGEN
ARM
TRGSEL
BEGIN
DBGBRK
W
R
AF
BF
CF
0
0x0021
DBGSC
TRG
W
= Unimplemented or Reserved
Figure 7-3. DBG Register Summary
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Name(1)
Bit 7
6
5
4
3
2
1
Bit 0
R
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
0x0022
DBGTBH
W
R
Bit 7
TBF
Bit 6
0
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0x0023
DBGTBL
W
R
CNT
0x0024
DBGCNT
W
R
0x0025
PAGSEL
EXTCMP
DBGCCX((2))
W
R
0x0026
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
9
1
Bit 8
Bit 0
DBGCCH(2)
W
R
0x0027
DBGCCL(2)
W
0x0028
DBGC2
BKPCT0
R
BKABEN
FULL
BDM
TAGAB
BKCEN
RWAEN
TAGC
RWA
RWCEN
RWBEN
RWC
RWB
W
0x0029
DBGC3
BKPCT1
R
BKAMBH BKAMBL BKBMBH BKBMBL
W
0x002A
DBGCAX
BKP0X
R
PAGSEL
EXTCMP
W
0x002B
DBGCAH
BKP0H
R
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
9
1
Bit 8
Bit 0
W
0x002C
DBGCAL
BKP0L
R
W
0x002D
DBGCBX
BKP1X
R
PAGSEL
EXTCMP
W
0x002E
DBGCBH
BKP1H
R
Bit 15
Bit 7
14
6
13
5
12
4
11
3
10
2
9
1
Bit 8
Bit 0
W
0x002F
DBGCBL
BKP1L
R
W
= Unimplemented or Reserved
Figure 7-3. DBG Register Summary (continued)
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1. The DBG module is designed for backwards compatibility to existing BKP modules. Register and bit names have changed from
the BKP module. This column shows the DBG register name, as well as the BKP register name for reference.
2. Comparator C can be used to enhance the BKP mode by providing a third breakpoint.
7.3.2.1
Debug Control Register 1 (DBGC1)
NOTE
All bits are used in DBG mode only.
Module Base + 0x0020
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
0
DBGEN
ARM
TRGSEL
BEGIN
DBGBRK
CAPMOD
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-4. Debug Control Register (DBGC1)
NOTE
This register cannot be written if BKP mode is enabled (BKABEN in
DBGC2 is set).
Table 7-3. DBGC1 Field Descriptions
Description
Field
7
DBG Mode Enable Bit — The DBGEN bit enables the DBG module for use in DBG mode. This bit cannot be
DBGEN
set if the MCU is in secure mode.
0 DBG mode disabled
1 DBG mode enabled
6
ARM
Arm Bit — The ARM bit controls whether the debugger is comparing and storing data in the trace buffer. See
Section 7.4.2.4, “Arming the DBG Module,” for more information.
0 Debugger unarmed
1 Debugger armed
Note: This bit cannot be set if the DBGEN bit is not also being set at the same time. For example, a write of 01
to DBGEN[7:6] will be interpreted as a write of 00.
5
Trigger Selection Bit — The TRGSEL bit controls the triggering condition for comparators A and B in DBG
mode. It serves essentially the same function as the TAGAB bit in the DBGC2 register does in BKP mode. See
Section 7.4.2.1.2, “Trigger Selection,” for more information. TRGSEL may also determine the type of breakpoint
based on comparator A and B if enabled in DBG mode (DBGBRK = 1). Please refer to Section 7.4.3.1,
“Breakpoint Based on Comparator A and B.”
TRGSEL
0 Trigger on any compare address match
1 Trigger before opcode at compare address gets executed (tagged-type)
4
Begin/End Trigger Bit — The BEGIN bit controls whether the trigger begins or ends storing of data in the trace
BEGIN
buffer. See Section 7.4.2.8.1, “Storing with Begin-Trigger,” and Section 7.4.2.8.2, “Storing with End-Trigger,” for
more details.
0 Trigger at end of stored data
1 Trigger before storing data
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Table 7-3. DBGC1 Field Descriptions (continued)
Field
Description
3
DBG Breakpoint Enable Bit — The DBGBRK bit controls whether the debugger will request a breakpoint based
DBGBRK on comparator A and B to the CPU upon completion of a tracing session. Please refer to Section 7.4.3,
“Breakpoints,” for further details.
0 CPU break request not enabled
1 CPU break request enabled
1:0
Capture Mode Field — See Table 7-4 for capture mode field definitions. In LOOP1 mode, the debugger will
CAPMOD automatically inhibit redundant entries into capture memory. In detail mode, the debugger is storing address and
data for all cycles except program fetch (P) and free (f) cycles. In profile mode, the debugger is returning the
address of the last instruction executed by the CPU on each access of trace buffer address. Refer to
Section 7.4.2.6, “Capture Modes,” for more information.
Table 7-4. CAPMOD Encoding
CAPMOD
Description
00
01
10
11
Normal
LOOP1
DETAIL
PROFILE
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7.3.2.2
Debug Status and Control Register (DBGSC)
Module Base + 0x0021
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
AF
BF
CF
0
TRG
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-5. Debug Status and Control Register (DBGSC)
Table 7-5. DBGSC Field Descriptions
Description
Field
7
AF
Trigger A Match Flag — The AF bit indicates if trigger A match condition was met since arming. This bit is
cleared when ARM in DBGC1 is written to a 1 or on any write to this register.
0 Trigger A did not match
1 Trigger A match
6
BF
Trigger B Match Flag — The BF bit indicates if trigger B match condition was met since arming.This bit is
cleared when ARM in DBGC1 is written to a 1 or on any write to this register.
0 Trigger B did not match
1 Trigger B match
5
CF
Comparator C Match Flag — The CF bit indicates if comparator C match condition was met since arming.This
bit is cleared when ARM in DBGC1 is written to a 1 or on any write to this register.
0 Comparator C did not match
1 Comparator C match
3:0
Trigger Mode Bits — The TRG bits select the trigger mode of the DBG module as shown Table 7-6. See
TRG
Section 7.4.2.5, “Trigger Modes,” for more detail.
Table 7-6. Trigger Mode Encoding
TRG Value
Meaning
0000
0001
0010
0011
0100
0101
0110
0111
1000
A only
A or B
A then B
Event only B
A then event only B
A and B (full mode)
A and Not B (full mode)
Inside range
Outside range
1001
↓
1111
Reserved
(Defaults to A only)
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7.3.2.3
Debug Trace Buffer Register (DBGTB)
Module Base + 0x0022
Starting address location affected by INITRG register setting.
15
14
13
12
11
10
9
8
R
W
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
u
u
u
u
u
u
u
u
= Unimplemented or Reserved
Figure 7-6. Debug Trace Buffer Register High (DBGTBH)
Module Base + 0x0023
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
u
u
u
u
u
u
u
u
= Unimplemented or Reserved
Figure 7-7. Debug Trace Buffer Register Low (DBGTBL)
Table 7-7. DBGTB Field Descriptions
Description
Field
15:0
Trace Buffer Data Bits — The trace buffer data bits contain the data of the trace buffer. This register can be read
only as a word read. Any byte reads or misaligned access of these registers will return 0 and will not cause the
trace buffer pointer to increment to the next trace buffer address. The same is true for word reads while the
debugger is armed. In addition, this register may appear to contain incorrect data if it is not read with the same
capture mode bit settings as when the trace buffer data was recorded (See Section 7.4.2.9, “Reading Data from
Trace Buffer”). Because reads will reflect the contents of the trace buffer RAM, the reset state is undefined.
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7.3.2.4
Debug Count Register (DBGCNT)
Module Base + 0x0024
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
TBF
0
CNT
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-8. Debug Count Register (DBGCNT)
Table 7-8. DBGCNT Field Descriptions
Description
Field
7
TBF
Trace Buffer Full — The TBF bit indicates that the trace buffer has stored 64 or more words of data since it was
last armed. If this bit is set, then all 64 words will be valid data, regardless of the value in CNT[5:0]. The TBF bit
is cleared when ARM in DBGC1 is written to a 1.
5:0
CNT
Count Value — The CNT bits indicate the number of valid data words stored in the trace buffer. Table 7-9 shows
the correlation between the CNT bits and the number of valid data words in the trace buffer. When the CNT rolls
over to 0, the TBF bit will be set and incrementing of CNT will continue if DBG is in end-trigger mode. The
DBGCNT register is cleared when ARM in DBGC1 is written to a 1.
Table 7-9. CNT Decoding Table
TBF
CNT
Description
0
0
0
000000
000001
No data valid
1 word valid
000010
2 words valid
..
..
..
..
111110
62 words valid
0
1
111111
000000
63 words valid
64 words valid; if BEGIN = 1, the
ARM bit will be cleared. A
breakpoint will be generated if
DBGBRK = 1
1
000001
64 words valid,
oldest data has been overwritten
by most recent data
..
..
111111
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7.3.2.5
Debug Comparator C Extended Register (DBGCCX)
Module Base + 0x0025
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
PAGSEL
EXTCMP
Reset
0
0
0
0
0
0
0
0
Figure 7-9. Debug Comparator C Extended Register (DBGCCX)
Table 7-10. DBGCCX Field Descriptions
Description
Field
7:6
PAGSEL
Page Selector Field — In both BKP and DBG mode, PAGSEL selects the type of paging as shown in Table 7-11.
DPAGE and EPAGE are not yet implemented so the value in bit 7 will be ignored (i.e., PAGSEL values of 10 and
11 will be interpreted as values of 00 and 01, respectively).
5:0
Comparator C Extended Compare Bits — The EXTCMP bits are used as comparison address bits as shown
EXTCMP in Table 7-11 along with the appropriate PPAGE, DPAGE, or EPAGE signal from the core.
Note: Comparator C can be used when the DBG module is configured for BKP mode. Extended addressing
comparisons for comparator C use PAGSEL and will operate differently to the way that comparator A and
B operate in BKP mode.
(1)
Table 7-11. PAGSEL Decoding
PAGSEL
Description
EXTCMP
Comment
00
01
Normal (64k)
Not used
No paged memory
PPAGE
(256 — 16K pages)
EXTCMP[5:0] is compared to
address bits [21:16](2)
PPAGE[7:0] / XAB[21:14] becomes
address bits [21:14]1
10(3)
DPAGE (reserved)
(256 — 4K pages)
EXTCMP[3:0] is compared to
address bits [19:16]
DPAGE / XAB[21:14] becomes address
bits [19:12]
112
EPAGE (reserved)
(256 — 1K pages)
EXTCMP[1:0] is compared to
address bits [17:16]
EPAGE / XAB[21:14] becomes address
bits [17:10]
1. See Figure 7-10.
2. Current HCS12 implementations have PPAGE limited to 6 bits. Therefore, EXTCMP[5:4] should be set to 00.
3. Data page (DPAGE) and Extra page (EPAGE) are reserved for implementation on devices that support paged data and extra
space.
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DBGCXX
EXTCMP
DBGCXH[15:12]
PAGSEL
BIT 15
BIT 14
BIT 13
BIT 12
0
5
0
4
7
6
3
2
1
BIT 0
SEE NOTE 1
PORTK/XAB
XAB21
PIX7
XAB20
PIX6
XAB19
PIX5
XAB18
PIX4
XAB17
PIX3
XAB16
PIX2
XAB15
PIX1
XAB14
PIX0
PPAGE
SEE NOTE 2
NOTES:
1. In BKP and DBG mode, PAGSEL selects the type of paging as shown in Table 7-11.
2. Current HCS12 implementations are limited to six PPAGE bits, PIX[5:0]. Therefore, EXTCMP[5:4] = 00.
Figure 7-10. Comparator C Extended Comparison in BKP/DBG Mode
7.3.2.6
Debug Comparator C Register (DBGCC)
Module Base + 0x0026
Starting address location affected by INITRG register setting.
15
14
13
12
11
10
9
8
R
W
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-11. Debug Comparator C Register High (DBGCCH)
Module Base + 0x0027
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 7-12. Debug Comparator C Register Low (DBGCCL)
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Table 7-12. DBGCC Field Descriptions
Field
Description
15:0
Comparator C Compare Bits — The comparator C compare bits control whether comparator C will compare
the address bus bits [15:0] to a logic 1 or logic 0. See Table 7-13.
0 Compare corresponding address bit to a logic 0
1 Compare corresponding address bit to a logic 1
Note: This register will be cleared automatically when the DBG module is armed in LOOP1 mode.
Table 7-13. Comparator C Compares
PAGSEL
EXTCMP Compare
High-Byte Compare
x0
x1
No compare
DBGCCH[7:0] = AB[15:8]
EXTCMP[5:0] = XAB[21:16]
DBGCCH[7:0] = XAB[15:14],AB[13:8]
7.3.2.7
Debug Control Register 2 (DBGC2)
Module Base + 0x0028
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
BKABEN(1)
FULL
BDM
TAGAB
BKCEN(2)
TAGC2
RWCEN2
RWC2
Reset
0
0
0
0
0
0
0
0
1. When BKABEN is set (BKP mode), all bits in DBGC2 are available. When BKABEN is cleared and DBG is used in DBG mode,
bits FULL and TAGAB have no meaning.
2. These bits can be used in BKP mode and DBG mode (when capture mode is not set in LOOP1) to provide a third breakpoint.
Figure 7-13. Debug Control Register 2 (DBGC2)
Table 7-14. DBGC2 Field Descriptions
Field
Description
7
Breakpoint Using Comparator A and B Enable — This bit enables the breakpoint capability using comparator
A and B, when set (BKP mode) the DBGEN bit in DBGC1 cannot be set.
0 Breakpoint module off
BKABEN
1 Breakpoint module on
6
Full Breakpoint Mode Enable — This bit controls whether the breakpoint module is in dual mode or full mode.
In full mode, comparator A is used to match address and comparator B is used to match data. See
Section 7.4.1.2, “Full Breakpoint Mode,” for more details.
FULL
0 Dual address mode enabled
1 Full breakpoint mode enabled
5
BDM
Background Debug Mode Enable — This bit determines if the breakpoint causes the system to enter
background debug mode (BDM) or initiate a software interrupt (SWI).
0 Go to software interrupt on a break request
1 Go to BDM on a break request
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Table 7-14. DBGC2 Field Descriptions (continued)
Field
Description
4
Comparator A/B Tag Select — This bit controls whether the breakpoint will cause a break on the next instruction
boundary (force) or on a match that will be an executable opcode (tagged). Non-executed opcodes cannot cause
a tagged breakpoint.
TAGAB
0 On match, break at the next instruction boundary (force)
1 On match, break if/when the instruction is about to be executed (tagged)
3
Breakpoint Comparator C Enable Bit — This bit enables the breakpoint capability using comparator C.
0 Comparator C disabled for breakpoint
BKCEN
1 Comparator C enabled for breakpoint
Note: This bit will be cleared automatically when the DBG module is armed in loop1 mode.
2
Comparator C Tag Select — This bit controls whether the breakpoint will cause a break on the next instruction
boundary (force) or on a match that will be an executable opcode (tagged). Non-executed opcodes cannot cause
a tagged breakpoint.
TAGC
0 On match, break at the next instruction boundary (force)
1 On match, break if/when the instruction is about to be executed (tagged)
1
Read/Write Comparator C Enable Bit — The RWCEN bit controls whether read or write comparison is enabled
for comparator C. RWCEN is not useful for tagged breakpoints.
0 Read/Write is not used in comparison
RWCEN
1 Read/Write is used in comparison
0
Read/Write Comparator C Value Bit — The RWC bit controls whether read or write is used in compare for
comparator C. The RWC bit is not used if RWCEN = 0.
0 Write cycle will be matched
RWC
1 Read cycle will be matched
7.3.2.8
Debug Control Register 3 (DBGC3)
Module Base + 0x0029
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
BKAMBH(1)
BKAMBL1
BKBMBH(2)
BKBMBL2
RWAEN
RWA
RWBEN
RWB
Reset
0
0
0
0
0
0
0
0
1. In DBG mode, BKAMBH:BKAMBL has no meaning and are forced to 0’s.
2. In DBG mode, BKBMBH:BKBMBL are used in full mode to qualify data.
Figure 7-14. Debug Control Register 3 (DBGC3)
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Table 7-15. DBGC3 Field Descriptions
Field
Description
7:6
Breakpoint Mask High Byte for First Address — In dual or full mode, these bits may be used to mask (disable)
BKAMB[H:L] the comparison of the high and/or low bytes of the first address breakpoint. The functionality is as given in
Table 7-16.
The x:0 case is for a full address compare. When a program page is selected, the full address compare will be
based on bits for a 20-bit compare. The registers used for the compare are {DBGCAX[5:0], DBGCAH[5:0],
DBGCAL[7:0]}, where DBGAX[5:0] corresponds to PPAGE[5:0] or extended address bits [19:14] and CPU
address [13:0]. When a program page is not selected, the full address compare will be based on bits for a 16-bit
compare. The registers used for the compare are {DBGCAH[7:0], DBGCAL[7:0]} which corresponds to CPU
address [15:0].
Note: This extended address compare scheme causes an aliasing problem in BKP mode in which several
physical addresses may match with a single logical address. This problem may be avoided by using DBG
mode to generate breakpoints.
The 1:0 case is not sensible because it would ignore the high order address and compare the low order and
expansion addresses. Logic forces this case to compare all address lines (effectively ignoring the BKAMBH
control bit).
The 1:1 case is useful for triggering a breakpoint on any access to a particular expansion page. This only makes
sense if a program page is being accessed so that the breakpoint trigger will occur only if DBGCAX compares.
5:4
Breakpoint Mask High Byte and Low Byte of Data (Second Address) — In dual mode, these bits may be
BKBMB[H:L] used to mask (disable) the comparison of the high and/or low bytes of the second address breakpoint. The
functionality is as given in Table 7-17.
The x:0 case is for a full address compare. When a program page is selected, the full address compare will be
based on bits for a 20-bit compare. The registers used for the compare are {DBGCBX[5:0], DBGCBH[5:0],
DBGCBL[7:0]} where DBGCBX[5:0] corresponds to PPAGE[5:0] or extended address bits [19:14] and CPU
address [13:0]. When a program page is not selected, the full address compare will be based on bits for a 16-bit
compare. The registers used for the compare are {DBGCBH[7:0], DBGCBL[7:0]} which corresponds to CPU
address [15:0].
Note: This extended address compare scheme causes an aliasing problem in BKP mode in which several
physical addresses may match with a single logical address. This problem may be avoided by using DBG
mode to generate breakpoints.
The 1:0 case is not sensible because it would ignore the high order address and compare the low order and
expansion addresses. Logic forces this case to compare all address lines (effectively ignoring the BKBMBH
control bit).
The 1:1 case is useful for triggering a breakpoint on any access to a particular expansion page. This only makes
sense if a program page is being accessed so that the breakpoint trigger will occur only if DBGCBX compares.
In full mode, these bits may be used to mask (disable) the comparison of the high and/or low bytes of the data
breakpoint. The functionality is as given in Table 7-18.
3
Read/Write Comparator A Enable Bit — The RWAEN bit controls whether read or write comparison is enabled
for comparator A. See Section 7.4.2.1.1, “Read or Write Comparison,” for more information. This bit is not useful
for tagged operations.
RWAEN
0 Read/Write is not used in comparison
1 Read/Write is used in comparison
2
Read/Write Comparator A Value Bit — The RWA bit controls whether read or write is used in compare for
comparator A. The RWA bit is not used if RWAEN = 0.
0 Write cycle will be matched
RWA
1 Read cycle will be matched
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Table 7-15. DBGC3 Field Descriptions (continued)
Field
Description
1
Read/Write Comparator B Enable Bit — The RWBEN bit controls whether read or write comparison is enabled
for comparator B. See Section 7.4.2.1.1, “Read or Write Comparison,” for more information. This bit is not useful
for tagged operations.
RWBEN
0 Read/Write is not used in comparison
1 Read/Write is used in comparison
0
Read/Write Comparator B Value Bit — The RWB bit controls whether read or write is used in compare for
comparator B. The RWB bit is not used if RWBEN = 0.
0 Write cycle will be matched
RWB
1 Read cycle will be matched
Note: RWB and RWBEN are not used in full mode.
Table 7-16. Breakpoint Mask Bits for First Address
BKAMBH:BKAMBL
Address Compare
DBGCAX
DBGCAH
DBGCAL
x:0
0:1
1:1
Full address compare
256 byte address range
16K byte address range
Yes(1)
Yes1
Yes1
Yes
Yes
No
Yes
No
No
1. If PPAGE is selected.
Table 7-17. Breakpoint Mask Bits for Second Address (Dual Mode)
BKBMBH:BKBMBL
Address Compare
DBGCBX
DBGCBH
DBGCBL
x:0
0:1
Full address compare
256 byte address range
16K byte address range
Yes(1)
Yes1
Yes1
Yes
Yes
No
Yes
No
No
1:1
1. If PPAGE is selected.
Table 7-18. Breakpoint Mask Bits for Data Breakpoints (Full Mode)
BKBMBH:BKBMBL
Data Compare
DBGCBX
DBGCBH
DBGCBL
0:0
0:1
1:0
1:1
High and low byte compare
High byte
No(1)
No1
No1
No1
Yes
Yes
No
Yes
No
Low byte
Yes
No
No compare
No
1. Expansion addresses for breakpoint B are not applicable in this mode.
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7.3.2.9
Debug Comparator A Extended Register (DBGCAX)
Module Base + 0x002A
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
PAGSEL
EXTCMP
Reset
0
0
0
0
0
0
0
0
Figure 7-15. Debug Comparator A Extended Register (DBGCAX)
Table 7-19. DBGCAX Field Descriptions
Description
Field
7:6
Page Selector Field — If DBGEN is set in DBGC1, then PAGSEL selects the type of paging as shown in Table 7-
PAGSEL
20.
DPAGE and EPAGE are not yet implemented so the value in bit 7 will be ignored (i.e., PAGSEL values of 10 and
11 will be interpreted as values of 00 and 01, respectively).
In BKP mode, PAGSEL has no meaning and EXTCMP[5:0] are compared to address bits [19:14] if the address
is in the FLASH/ROM memory space.
5:0
Comparator A Extended Compare Bits — The EXTCMP bits are used as comparison address bits as shown
EXTCMP in Table 7-20 along with the appropriate PPAGE, DPAGE, or EPAGE signal from the core.
Table 7-20. Comparator A or B Compares
Mode
EXTCMP Compare
High-Byte Compare
BKP(1)
DBG(2)
Not FLASH/ROM access
FLASH/ROM access
PAGSEL = 00
No compare
EXTCMP[5:0] = XAB[19:14]
No compare
DBGCxH[7:0] = AB[15:8]
DBGCxH[5:0] = AB[13:8]
DBGCxH[7:0] = AB[15:8]
PAGSEL = 01
EXTCMP[5:0] = XAB[21:16]
DBGCxH[7:0] = XAB[15:14], AB[13:8]
1. See Figure 7-16.
2. See Figure 7-10 (note that while this figure provides extended comparisons for comparator C, the figure also pertains to
comparators A and B in DBG mode only).
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PAGSEL
EXTCMP
DBGCXX
0
0
5
4
3
2
1
BIT 0
XAB14
PIX0
SEE NOTE 1
PORTK/XAB XAB21
XAB20
PIX6
XAB19
PIX5
XAB18
PIX4
XAB17
PIX3
XAB16
PIX2
XAB15
PIX1
PPAGE
PIX7
SEE NOTE 2
NOTES:
1. In BKP mode, PAGSEL has no functionality. Therefore, set PAGSEL to 00 (reset state).
2. Current HCS12 implementations are limited to six PPAGE bits, PIX[5:0].
Figure 7-16. Comparators A and B Extended Comparison in BKP Mode
7.3.2.10 Debug Comparator A Register (DBGCA)
Module Base + 0x002B
Starting address location affected by INITRG register setting.
15
14
13
12
11
10
9
8
R
W
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 7-17. Debug Comparator A Register High (DBGCAH)
Module Base + 0x002C
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 7-18. Debug Comparator A Register Low (DBGCAL)
Table 7-21. DBGCA Field Descriptions
Description
Field
15:0
15:0
Comparator A Compare Bits — The comparator A compare bits control whether comparator A compares the
address bus bits [15:0] to a logic 1 or logic 0. See Table 7-20.
0 Compare corresponding address bit to a logic 0
1 Compare corresponding address bit to a logic 1
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7.3.2.11 Debug Comparator B Extended Register (DBGCBX)
Module Base + 0x002D
7
6
5
4
3
2
1
0
R
PAGSEL
EXTCMP
W
Reset
0
0
0
0
0
0
0
0
Figure 7-19. Debug Comparator B Extended Register (DBGCBX)
Table 7-22. DBGCBX Field Descriptions
Description
Field
7:6
Page Selector Field — If DBGEN is set in DBGC1, then PAGSEL selects the type of paging as shown in Table 7-
PAGSEL
11.
DPAGE and EPAGE are not yet implemented so the value in bit 7 will be ignored (i.e., PAGSEL values of 10 and
11 will be interpreted as values of 00 and 01, respectively.)
In BKP mode, PAGSEL has no meaning and EXTCMP[5:0] are compared to address bits [19:14] if the address
is in the FLASH/ROM memory space.
5:0
Comparator B Extended Compare Bits — The EXTCMP bits are used as comparison address bits as shown
EXTCMP in Table 7-11 along with the appropriate PPAGE, DPAGE, or EPAGE signal from the core. Also see Table 7-20.
7.3.2.12 Debug Comparator B Register (DBGCB)
Module Base + 0x002E
Starting address location affected by INITRG register setting.
15
14
13
12
11
10
9
8
R
W
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 7-20. Debug Comparator B Register High (DBGCBH)
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Module Base + 0x002F
Starting address location affected by INITRG register setting.
7
6
5
4
3
2
1
0
R
W
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 7-21. Debug Comparator B Register Low (DBGCBL)
Table 7-23. DBGCB Field Descriptions
Description
Field
15:0
15:0
Comparator B Compare Bits — The comparator B compare bits control whether comparator B compares the
address bus bits [15:0] or data bus bits [15:0] to a logic 1 or logic 0. See Table 7-20.
0 Compare corresponding address bit to a logic 0, compares to data if in Full mode
1 Compare corresponding address bit to a logic 1, compares to data if in Full mode
7.4
Functional Description
This section provides a complete functional description of the DBG module. The DBG module can be
configured to run in either of two modes, BKP or DBG. BKP mode is enabled by setting BKABEN in
DBGC2. DBG mode is enabled by setting DBGEN in DBGC1. Setting BKABEN in DBGC2 overrides the
DBGEN in DBGC1 and prevents DBG mode. If the part is in secure mode, DBG mode cannot be enabled.
7.4.1
DBG Operating in BKP Mode
In BKP mode, the DBG will be fully backwards compatible with the existing BKP_ST12_A module. The
DBGC2 register has four additional bits that were not available on existing BKP_ST12_A modules. As
long as these bits are written to either all 1s or all 0s, they should be transparent to the user. All 1s would
enable comparator C to be used as a breakpoint, but tagging would be enabled. The match address register
would be all 0s if not modified by the user. Therefore, code executing at address 0x0000 would have to
occur before a breakpoint based on comparator C would happen.
The DBG module in BKP mode supports two modes of operation: dual address mode and full breakpoint
mode. Within each of these modes, forced or tagged breakpoint types can be used. Forced breakpoints
occur at the next instruction boundary if a match occurs and tagged breakpoints allow for breaking just
before the tagged instruction executes. The action taken upon a successful match can be to either place the
CPU in background debug mode or to initiate a software interrupt.
The breakpoint can operate in dual address mode or full breakpoint mode. Each of these modes is
discussed in the subsections below.
7.4.1.1
Dual Address Mode
When dual address mode is enabled, two address breakpoints can be set. Each breakpoint can cause the
system to enter background debug mode or to initiate a software interrupt based upon the state of BDM in
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DBGC2 being logic 1 or logic 0, respectively. BDM requests have a higher priority than SWI requests. No
data breakpoints are allowed in this mode.
TAGAB in DBGC2 selects whether the breakpoint mode is forced or tagged. The BKxMBH:L bits in
DBGC3 select whether or not the breakpoint is matched exactly or is a range breakpoint. They also select
whether the address is matched on the high byte, low byte, both bytes, and/or memory expansion. The
RWx and RWxEN bits in DBGC3 select whether the type of bus cycle to match is a read, write, or
read/write when performing forced breakpoints.
7.4.1.2
Full Breakpoint Mode
Full breakpoint mode requires a match on address and data for a breakpoint to occur. Upon a successful
match, the system will enter background debug mode or initiate a software interrupt based upon the state
of BDM in DBGC2 being logic 1 or logic 0, respectively. BDM requests have a higher priority than SWI
requests. R/W matches are also allowed in this mode.
TAGAB in DBGC2 selects whether the breakpoint mode is forced or tagged. When TAGAB is set in
DBGC2, only addresses are compared and data is ignored. The BKAMBH:L bits in DBGC3 select
whether or not the breakpoint is matched exactly, is a range breakpoint, or is in page space. The
BKBMBH:L bits in DBGC3 select whether the data is matched on the high byte, low byte, or both bytes.
RWA and RWAEN bits in DBGC2 select whether the type of bus cycle to match is a read or a write when
performing forced breakpoints. RWB and RWBEN bits in DBGC2 are not used in full breakpoint mode.
NOTE
The full trigger mode is designed to be used for either a word access or a
byte access, but not both at the same time. Confusing trigger operation
(seemingly false triggers or no trigger) can occur if the trigger address
occurs in the user program as both byte and word accesses.
7.4.1.3
Breakpoint Priority
Breakpoint operation is first determined by the state of the BDM module. If the BDM module is already
active, meaning the CPU is executing out of BDM firmware, breakpoints are not allowed. In addition,
while executing a BDM TRACE command, tagging into BDM is not allowed. If BDM is not active, the
breakpoint will give priority to BDM requests over SWI requests. This condition applies to both forced
and tagged breakpoints.
In all cases, BDM related breakpoints will have priority over those generated by the Breakpoint sub-block.
This priority includes breakpoints enabled by the TAGLO and TAGHI external pins of the system that
interface with the BDM directly and whose signal information passes through and is used by the
breakpoint sub-block.
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NOTE
BDM should not be entered from a breakpoint unless the ENABLE bit is set
in the BDM. Even if the ENABLE bit in the BDM is cleared, the CPU
actually executes the BDM firmware code. It checks the ENABLE and
returns if ENABLE is not set. If the BDM is not serviced by the monitor then
the breakpoint would be re-asserted when the BDM returns to normal CPU
flow.
There is no hardware to enforce restriction of breakpoint operation if the
BDM is not enabled.
When program control returns from a tagged breakpoint through an RTI or
a BDM GO command, it will return to the instruction whose tag generated
the breakpoint. Unless breakpoints are disabled or modified in the service
routine or active BDM session, the instruction will be tagged again and the
breakpoint will be repeated. In the case of BDM breakpoints, this situation
can also be avoided by executing a TRACE1 command before the GO to
increment the program flow past the tagged instruction.
7.4.1.4
Using Comparator C in BKP Mode
The original BKP_ST12_A module supports two breakpoints. The DBG_ST12_A module can be used in
BKP mode and allow a third breakpoint using comparator C. Four additional bits, BKCEN, TAGC,
RWCEN, and RWC in DBGC2 in conjunction with additional comparator C address registers, DBGCCX,
DBGCCH, and DBGCCL allow the user to set up a third breakpoint. Using PAGSEL in DBGCCX for
expanded memory will work differently than the way paged memory is done using comparator A and B in
BKP mode. See Section 7.3.2.5, “Debug Comparator C Extended Register (DBGCCX),” for more
information on using comparator C.
7.4.2
DBG Operating in DBG Mode
Enabling the DBG module in DBG mode, allows the arming, triggering, and storing of data in the trace
buffer and can be used to cause CPU breakpoints. The DBG module is made up of three main blocks, the
comparators, trace buffer control logic, and the trace buffer.
NOTE
In general, there is a latency between the triggering event appearing on the
bus and being detected by the DBG circuitry. In general, tagged triggers will
be more predictable than forced triggers.
7.4.2.1
Comparators
The DBG contains three comparators, A, B, and C. Comparator A compares the core address bus with the
address stored in DBGCAH and DBGCAL. Comparator B compares the core address bus with the address
stored in DBGCBH and DBGCBL except in full mode, where it compares the data buses to the data stored
in DBGCBH and DBGCBL. Comparator C can be used as a breakpoint generator or as the address
comparison unit in the loop1 mode. Matches on comparator A, B, and C are signaled to the trace buffer
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control (TBC) block. When PAGSEL = 01, registers DBGCAX, DBGCBX, and DBGCCX are used to
match the upper addresses as shown in Table 7-11.
NOTE
If a tagged-type C breakpoint is set at the same address as an A/B tagged-
type trigger (including the initial entry in an inside or outside range trigger),
the C breakpoint will have priority and the trigger will not be recognized.
7.4.2.1.1
Read or Write Comparison
Read or write comparisons are useful only with TRGSEL = 0, because only opcodes should be tagged as
they are “read” from memory. RWAEN and RWBEN are ignored when TRGSEL = 1.
In full modes (“A and B” and “A and not B”) RWAEN and RWA are used to select read or write
comparisons for both comparators A and B. Table 7-24 shows the effect for RWAEN, RWA, and RW on
the DBGCB comparison conditions. The RWBEN and RWB bits are not used and are ignored in full
modes.
Table 7-24. Read or Write Comparison Logic Table
RWAEN bit
RWA bit
RW signal
Comment
0
0
1
1
1
1
x
x
0
0
1
1
0
1
0
1
0
1
Write data bus
Read data bus
Write data bus
No data bus compare since RW=1
No data bus compare since RW=0
Read data bus
7.4.2.1.2
Trigger Selection
The TRGSEL bit in DBGC1 is used to determine the triggering condition in DBG mode. TRGSEL applies
to both trigger A and B except in the event only trigger modes. By setting TRGSEL, the comparators A
and B will qualify a match with the output of opcode tracking logic and a trigger occurs before the tagged
instruction executes (tagged-type trigger). With the TRGSEL bit cleared, a comparator match forces a
trigger when the matching condition occurs (force-type trigger).
NOTE
If the TRGSEL is set, the address stored in the comparator match address
registers must be an opcode address for the trigger to occur.
7.4.2.2
Trace Buffer Control (TBC)
The TBC is the main controller for the DBG module. Its function is to decide whether data should be stored
in the trace buffer based on the trigger mode and the match signals from the comparator. The TBC also
determines whether a request to break the CPU should occur.
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7.4.2.3
Begin- and End-Trigger
The definitions of begin- and end-trigger as used in the DBG module are as follows:
•
Begin-trigger: Storage in trace buffer occurs after the trigger and continues until 64 locations are
filled.
•
End-trigger: Storage in trace buffer occurs until the trigger, with the least recent data falling out of
the trace buffer if more than 64 words are collected.
7.4.2.4
Arming the DBG Module
In DBG mode, arming occurs by setting DBGEN and ARM in DBGC1. The ARM bit in DBGC1 is cleared
when the trigger condition is met in end-trigger mode or when the Trace Buffer is filled in begin-trigger
mode. The TBC logic determines whether a trigger condition has been met based on the trigger mode and
the trigger selection.
7.4.2.5
Trigger Modes
The DBG module supports nine trigger modes. The trigger modes are encoded as shown in Table 7-6. The
trigger mode is used as a qualifier for either starting or ending the storing of data in the trace buffer. When
the match condition is met, the appropriate flag A or B is set in DBGSC. Arming the DBG module clears
the A, B, and C flags in DBGSC. In all trigger modes except for the event-only modes and DETAIL capture
mode, change-of-flow addresses are stored in the trace buffer. In the event-only modes only the value on
the data bus at the trigger event B will be stored. In DETAIL capture mode address and data for all cycles
except program fetch (P) and free (f) cycles are stored in trace buffer.
7.4.2.5.1
A Only
In the A only trigger mode, if the match condition for A is met, the A flag in DBGSC is set and a trigger
occurs.
7.4.2.5.2
A or B
In the A or B trigger mode, if the match condition for A or B is met, the corresponding flag in DBGSC is
set and a trigger occurs.
7.4.2.5.3
A then B
In the A then B trigger mode, the match condition for A must be met before the match condition for B is
compared. When the match condition for A or B is met, the corresponding flag in DBGSC is set. The
trigger occurs only after A then B have matched.
NOTE
When tagging and using A then B, if addresses A and B are close together,
then B may not complete the trigger sequence. This occurs when A and B
are in the instruction queue at the same time. Basically the A trigger has not
yet occurred, so the B instruction is not tagged. Generally, if address B is at
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least six addresses higher than address A (or B is lower than A) and there
are not changes of flow to put these in the queue at the same time, then this
operation should trigger properly.
7.4.2.5.4
Event-Only B (Store Data)
In the event-only B trigger mode, if the match condition for B is met, the B flag in DBGSC is set and a
trigger occurs. The event-only B trigger mode is considered a begin-trigger type and the BEGIN bit in
DBGC1 is ignored. Event-only B is incompatible with instruction tagging (TRGSEL = 1), and thus the
value of TRGSEL is ignored. Please refer to Section 7.4.2.7, “Storage Memory,” for more information.
This trigger mode is incompatible with the detail capture mode so the detail capture mode will have
priority. TRGSEL and BEGIN will not be ignored and this trigger mode will behave as if it were “B only”.
7.4.2.5.5
A then Event-Only B (Store Data)
In the A then event-only B trigger mode, the match condition for A must be met before the match condition
for B is compared, after the A match has occurred, a trigger occurs each time B matches. When the match
condition for A or B is met, the corresponding flag in DBGSC is set. The A then event-only B trigger mode
is considered a begin-trigger type and BEGIN in DBGC1 is ignored. TRGSEL in DBGC1 applies only to
the match condition for A. Please refer to Section 7.4.2.7, “Storage Memory,” for more information.
This trigger mode is incompatible with the detail capture mode so the detail capture mode will have
priority. TRGSEL and BEGIN will not be ignored and this trigger mode will be the same as A then B.
7.4.2.5.6
A and B (Full Mode)
In the A and B trigger mode, comparator A compares to the address bus and comparator B compares to
the data bus. In the A and B trigger mode, if the match condition for A and B happen on the same bus cycle,
both the A and B flags in the DBGSC register are set and a trigger occurs.
If TRGSEL = 1, only matches from comparator A are used to determine if the trigger condition is met and
comparator B matches are ignored. If TRGSEL = 0, full-word data matches on an odd address boundary
(misaligned access) do not work unless the access is to a RAM that manages misaligned accesses in a
single clock cycle (which is typical of RAM modules used in HCS12 MCUs).
7.4.2.5.7
A and Not B (Full Mode)
In the A and not B trigger mode, comparator A compares to the address bus and comparator B compares
to the data bus. In the A and not B trigger mode, if the match condition for A and not B happen on the same
bus cycle, both the A and B flags in DBGSC are set and a trigger occurs.
If TRGSEL = 1, only matches from comparator A are used to determine if the trigger condition is met and
comparator B matches are ignored. As described in Section 7.4.2.5.6, “A and B (Full Mode),” full-word
data compares on misaligned accesses will not match expected data (and thus will cause a trigger in this
mode) unless the access is to a RAM that manages misaligned accesses in a single clock cycle.
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7.4.2.5.8
Inside Range (A ≤ address ≤ B)
In the inside range trigger mode, if the match condition for A and B happen on the same bus cycle, both
the A and B flags in DBGSC are set and a trigger occurs. If a match condition on only A or only B occurs
no flags are set. If TRGSEL = 1, the inside range is accurate only to word boundaries. If TRGSEL = 0, an
aligned word access which straddles the range boundary will cause a trigger only if the aligned address is
within the range.
7.4.2.5.9
Outside Range (address < A or address > B)
In the outside range trigger mode, if the match condition for A or B is met, the corresponding flag in
DBGSC is set and a trigger occurs. If TRGSEL = 1, the outside range is accurate only to word boundaries.
If TRGSEL = 0, an aligned word access which straddles the range boundary will cause a trigger only if the
aligned address is outside the range.
7.4.2.5.10
Control Bit Priorities
The definitions of some of the control bits are incompatible with each other. Table 7-25 and the notes
associated with it summarize how these incompatibilities are managed:
•
•
•
Read/write comparisons are not compatible with TRGSEL = 1. Therefore, RWAEN and RWBEN
are ignored.
Event-only trigger modes are always considered a begin-type trigger. See Section 7.4.2.8.1,
“Storing with Begin-Trigger,” and Section 7.4.2.8.2, “Storing with End-Trigger.”
Detail capture mode has priority over the event-only trigger/capture modes. Therefore, event-only
modes have no meaning in detail mode and their functions default to similar trigger modes.
Table 7-25. Resolution of Mode Conflicts
Normal / Loop1
Tag Force
Detail
Mode
Tag
Force
A only
A or B
A then B
Event-only B
1
2
5
5
6
6
1, 3
4
3
4
A then event-only B
A and B (full mode)
A and not B (full mode)
Inside range
5
5
6
Outside range
6
1 — Ignored — same as force
2 — Ignored for comparator B
3 — Reduces to effectively “B only”
4 — Works same as A then B
5 — Reduces to effectively “A only” — B not compared
6 — Only accurate to word boundaries
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7.4.2.6
Capture Modes
The DBG in DBG mode can operate in four capture modes. These modes are described in the following
subsections.
7.4.2.6.1
Normal Mode
In normal mode, the DBG module uses comparator A and B as triggering devices. Change-of-flow
information or data will be stored depending on TRG in DBGSC.
7.4.2.6.2
Loop1 Mode
The intent of loop1 mode is to prevent the trace buffer from being filled entirely with duplicate information
from a looping construct such as delays using the DBNE instruction or polling loops using
BRSET/BRCLR instructions. Immediately after address information is placed in the trace buffer, the DBG
module writes this value into the C comparator and the C comparator is placed in ignore address mode.
This will prevent duplicate address entries in the trace buffer resulting from repeated bit-conditional
branches. Comparator C will be cleared when the ARM bit is set in loop1 mode to prevent the previous
contents of the register from interfering with loop1 mode operation. Breakpoints based on comparator C
are disabled.
Loop1 mode only inhibits duplicate source address entries that would typically be stored in most tight
looping constructs. It will not inhibit repeated entries of destination addresses or vector addresses, because
repeated entries of these would most likely indicate a bug in the user’s code that the DBG module is
designed to help find.
NOTE
In certain very tight loops, the source address will have already been fetched
again before the C comparator is updated. This results in the source address
being stored twice before further duplicate entries are suppressed. This
condition occurs with branch-on-bit instructions when the branch is fetched
by the first P-cycle of the branch or with loop-construct instructions in
which the branch is fetched with the first or second P cycle. See examples
below:
LOOP INCX
; 1-byte instruction fetched by 1st P-cycle of BRCLR
BRCLR CMPTMP,#$0c,LOOP ; the BRCLR instruction also will be fetched by 1st P-cycle of BRCLR
LOOP2 BRN
NOP
*
; 2-byte instruction fetched by 1st P-cycle of DBNE
; 1-byte instruction fetched by 2nd P-cycle of DBNE
; this instruction also fetched by 2nd P-cycle of DBNE
DBNE A,LOOP2
NOTE
Loop1 mode does not support paged memory, and inhibits duplicate entries
in the trace buffer based solely on the CPU address. There is a remote
possibility of an erroneous address match if program flow alternates
between paged and unpaged memory space.
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7.4.2.6.3
Detail Mode
In the detail mode, address and data for all cycles except program fetch (P) and free (f) cycles are stored
in trace buffer. This mode is intended to supply additional information on indexed, indirect addressing
modes where storing only the destination address would not provide all information required for a user to
determine where his code was in error.
7.4.2.6.4
Profile Mode
This mode is intended to allow a host computer to poll a running target and provide a histogram of program
execution. Each read of the trace buffer address will return the address of the last instruction executed. The
DBGCNT register is not incremented and the trace buffer does not get filled. The ARM bit is not used and
all breakpoints and all other debug functions will be disabled.
7.4.2.7
Storage Memory
The storage memory is a 64 words deep by 16-bits wide dual port RAM array. The CPU accesses the RAM
array through a single memory location window (DBGTBH:DBGTBL). The DBG module stores trace
information in the RAM array in a circular buffer format. As data is read via the CPU, a pointer into the
RAM will increment so that the next CPU read will receive fresh information. In all trigger modes except
for event-only and detail capture mode, the data stored in the trace buffer will be change-of-flow addresses.
change-of-flow addresses are defined as follows:
•
•
•
•
Source address of conditional branches (long, short, BRSET, and loop constructs) taken
Destination address of indexed JMP, JSR, and CALL instruction
Destination address of RTI, RTS, and RTC instructions
Vector address of interrupts except for SWI and BDM vectors
In the event-only trigger modes only the 16-bit data bus value corresponding to the event is stored. In the
detail capture mode, address and then data are stored for all cycles except program fetch (P) and free (f)
cycles.
7.4.2.8
Storing Data in Memory Storage Buffer
Storing with Begin-Trigger
7.4.2.8.1
Storing with begin-trigger can be used in all trigger modes. When DBG mode is enabled and armed in the
begin-trigger mode, data is not stored in the trace buffer until the trigger condition is met. As soon as the
trigger condition is met, the DBG module will remain armed until 64 words are stored in the trace buffer.
If the trigger is at the address of the change-of-flow instruction the change-of-flow associated with the
trigger event will be stored in the trace buffer.
7.4.2.8.2
Storing with End-Trigger
Storing with end-trigger cannot be used in event-only trigger modes. When DBG mode is enabled and
armed in the end-trigger mode, data is stored in the trace buffer until the trigger condition is met. When
the trigger condition is met, the DBG module will become de-armed and no more data will be stored. If
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the trigger is at the address of a change-of-flow address the trigger event will not be stored in the trace
buffer.
7.4.2.9
Reading Data from Trace Buffer
The data stored in the trace buffer can be read using either the background debug module (BDM) module
or the CPU provided the DBG module is enabled and not armed. The trace buffer data is read out first-in
first-out. By reading CNT in DBGCNT the number of valid words can be determined. CNT will not
decrement as data is read from DBGTBH:DBGTBL. The trace buffer data is read by reading
DBGTBH:DBGTBL with a 16-bit read. Each time DBGTBH:DBGTBL is read, a pointer in the DBG will
be incremented to allow reading of the next word.
Reading the trace buffer while the DBG module is armed will return invalid data and no shifting of the
RAM pointer will occur.
NOTE
The trace buffer should be read with the DBG module enabled and in the
same capture mode that the data was recorded. The contents of the trace
buffer counter register (DBGCNT) are resolved differently in detail mode
verses the other modes and may lead to incorrect interpretation of the trace
buffer data.
7.4.3
Breakpoints
There are two ways of getting a breakpoint in DBG mode. One is based on the trigger condition of the
trigger mode using comparator A and/or B, and the other is using comparator C. External breakpoints
generated using the TAGHI and TAGLO external pins are disabled in DBG mode.
7.4.3.1
Breakpoint Based on Comparator A and B
A breakpoint request to the CPU can be enabled by setting DBGBRK in DBGC1. The value of BEGIN in
DBGC1 determines when the breakpoint request to the CPU will occur. When BEGIN in DBGC1 is set,
begin-trigger is selected and the breakpoint request will not occur until the trace buffer is filled with
64 words. When BEGIN in DBGC1 is cleared, end-trigger is selected and the breakpoint request will occur
immediately at the trigger cycle.
There are two types of breakpoint requests supported by the DBG module, tagged and forced. Tagged
breakpoints are associated with opcode addresses and allow breaking just before a specific instruction
executes. Forced breakpoints are not associated with opcode addresses and allow breaking at the next
instruction boundary. The type of breakpoint based on comparators A and B is determined by TRGSEL in
the DBGC1 register (TRGSEL = 1 for tagged breakpoint, TRGSEL = 0 for forced breakpoint). Table 7-26
illustrates the type of breakpoint that will occur based on the debug run.
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Table 7-26. Breakpoint Setup
BEGIN
TRGSEL
DBGBRK
Type of Debug Run
Fill trace buffer until trigger address
0
0
0
(no CPU breakpoint — keep running)
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
Fill trace buffer until trigger address, then a forced breakpoint
request occurs
Fill trace buffer until trigger opcode is about to execute
(no CPU breakpoint — keep running)
Fill trace buffer until trigger opcode about to execute, then a
tagged breakpoint request occurs
Start trace buffer at trigger address
(no CPU breakpoint — keep running)
Start trace buffer at trigger address, a forced breakpoint
request occurs when trace buffer is full
Start trace buffer at trigger opcode
(no CPU breakpoint — keep running)
Start trace buffer at trigger opcode, a forced breakpoint request
occurs when trace buffer is full
7.4.3.2
Breakpoint Based on Comparator C
A breakpoint request to the CPU can be created if BKCEN in DBGC2 is set. Breakpoints based on a
successful comparator C match can be accomplished regardless of the mode of operation for comparator
A or B, and do not affect the status of the ARM bit. TAGC in DBGC2 is used to select either tagged or
forced breakpoint requests for comparator C. Breakpoints based on comparator C are disabled in LOOP1
mode.
NOTE
Because breakpoints cannot be disabled when the DBG is armed, one must
be careful to avoid an “infinite breakpoint loop” when using tagged-type C
breakpoints while the DBG is armed. If BDM breakpoints are selected,
executing a TRACE1 instruction before the GO instruction is the
recommended way to avoid re-triggering a breakpoint if one does not wish
to de-arm the DBG. If SWI breakpoints are selected, disarming the DBG in
the SWI interrupt service routine is the recommended way to avoid re-
triggering a breakpoint.
7.5
Resets
The DBG module is disabled after reset.
The DBG module cannot cause a MCU reset.
7.6
Interrupts
The DBG contains one interrupt source. If a breakpoint is requested and BDM in DBGC2 is cleared, an
SWI interrupt will be generated.
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Chapter 8
Analog-to-Digital Converter (ATD10B8C)
Block Description
8.1
Introduction
The ATD10B8C is an 8-channel, 10-bit, multiplexed input successive approximation analog-to-digital
converter. Refer to device electrical specifications for ATD accuracy.
The block is designed to be upwards compatible with the 68HC11 standard 8-bit A/D converter. In
addition, there are new operating modes that are unique to the HC12 design.
8.1.1
Features
•
•
•
•
•
•
•
•
•
•
•
•
8/10-bit resolution.
7 µsec, 10-bit single conversion time.
Sample buffer amplifier.
Programmable sample time.
Left/right justified, signed/unsigned result data.
External trigger control.
Conversion completion interrupt generation.
Analog input multiplexer for eight analog input channels.
Analog/digital input pin multiplexing.
1-to-8 conversion sequence lengths.
Continuous conversion mode.
Multiple channel scans.
8.1.2
Modes of Operation
8.1.2.1
Conversion Modes
There is software programmable selection between performing single or continuous conversion on a
single channel or multiple channels.
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8.1.2.2
MCU Operating Modes
•
Stop Mode
Entering stop mode causes all clocks to halt and thus the system is placed in a minimum power
standby mode. This aborts any conversion sequence in progress. During recovery from stop mode,
there must be a minimum delay for the stop recovery time, t , before initiating a new ATD
SR
conversion sequence.
•
•
Wait Mode
Entering wait mode the ATD conversion either continues or aborts for low power depending on the
logical value of the AWAIT bit.
Freeze Mode
In freeze mode the ATD10B8C will behave according to the logical values of the FRZ1 and FRZ0
bits. This is useful for debugging and emulation.
8.1.3
Block Diagram
Figure 8-1 is a block diagram of the ATD.
ATD10B8C
ATD CLOCK
CLOCK
PRESCALER
BUS CLOCK
CONVERSION
MODE AND TIMING CONTROL
COMPLETE INTERRUPT
RESULTS
ATD 0
ATD 1
ATD 2
ATD 3
ATD 4
ATD 5
ATD 6
ATD 7
SUCCESSIVE
V
RH
APPROXIMATION
REGISTER (SAR)
AND DAC
V
RL
V
DDA
V
SSA
AN7 / PAD7
AN6 / PAD6
AN5 / PAD5
AN4 / PAD4
AN3 / PAD3
AN2 / PAD2
AN1 / PAD1
AN0 / PAD0
+
SAMPLE & HOLD
1
–
1
COMPARATOR
ATD INPUT ENABLE REGISTER
ANALOG
MUX
PORT AD DATA REGISTER
Figure 8-1. ATD10B8C Block Diagram
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
8.2
Signal Description
The ATD10B8C has a total of 12 external pins.
8.2.1
AN7 / ETRIG / PAD7
This pin serves as the analog input channel 7. It can be configured to provide an external trigger for the
ATD conversion. It can be configured as general-purpose digital I/O.
8.2.2
AN6 / PAD6
This pin serves as the analog input channel 6. It can be configured as general-purpose digital I/O.
8.2.3
AN5 / PAD5
This pin serves as the analog input channel 5. It can be configured as general-purpose digital I/O.
8.2.4
AN4 / PAD4
This pin serves as the analog input channel 4. It can be configured as general-purpose digital I/O.
8.2.5
AN3 / PAD3
This pin serves as the analog input channel 3. It can be configured as general-purpose digital I/O.
8.2.6
AN2 / PAD2
This pin serves as the analog input channel 2. It can be configured as general-purpose digital I/O.
8.2.7
AN1 / PAD1
This pin serves as the analog input channel 1. It can be configured as general-purpose digital I/O.
8.2.8
AN0 / PAD0
This pin serves as the analog input channel 0. It can be configured as general-purpose digital I/O.
8.2.9
VRH, VRL
V
is the high reference voltage and V is the low reference voltage for ATD conversion.
RL
RH
8.2.10 VDDA, VSSA
These pins are the power supplies for the analog circuitry of the ATD10B8C block.
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
8.3
Memory Map and Registers
This section provides a detailed description of all registers accessible in the ATD10B8C.
8.3.1
Module Memory Map
Figure 8-2 gives an overview on all ATD10B8C registers.
Address
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
W
R
0
0
0
0
0
0
0
0
0x0000
ATDCTL0
0
0
0
0
0
0
0
0
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
ATDCTL1
ATDCTL2
ATDCTL3
ATDCTL4
ATDCTL5
ATDSTAT0
W
R
ASCIF
ADPU
0
AFFC
S8C
AWAI
S4C
ETRIGLE ETRIGP ETRIGE
ASCIE
FRZ1
PRS1
W
R
S2C
PRS4
MULT
S1C
FIFO
FRZ0
PRS0
W
R
SRES8
DJM
SMP1
SMP0
SCAN
PRS3
0
PRS2
W
R
DSGN
0
CC
CB
CA
W
R
0
CC2
CC1
CC0
SCF
0
ETORF
0
FIFOR
0
W
R
0
0
0
0
0
0x0007 Unimplemented
W
R
U
U
U
U
U
U
U
U
0x0008
0x0009
ATDTEST0
ATDTEST1
W
R
U
0
U
0
U
0
U
0
U
0
U
0
U
0
SC
0
W
R
0x000A Unimplemented
W
R
CCF7
0
CCF6
0
CCF5
0
CCF4
0
CCF3
0
CCF2
0
CCF1
0
CCF0
0
0x000B
ATDSTAT1
W
R
0x000C Unimplemented
W
R
0x000D
ATDDIEN
IEN7
0
IEN6
0
IEN5
0
IEN4
0
IEN3
0
IEN2
0
IEN1
0
IEN0
0
W
R
0x000E Unimplemented
W
R
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
0x000F
PORTAD
W
= Unimplemented or Reserved
Figure 8-2. ATD Register Summary (Sheet 1 of 4)
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Address
Name
Bit 7
6
5
4
3
2
1
Bit 0
Left Justified Result Data
R BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
0x0010
0x0011
0x0012
0x0013
0x0014
0x0015
0x0016
0x0017
0x0018
0x0019
0x001A
0x001B
0x001C
0x001D
ATDDR0H
ATDDR0L
ATDDR1H
ATDDR1L
ATDDR2H
ATDDR2L
ATDDR3H
ATDDR3L
ATDDR4H
ATDDR4L
ATDDR5H
ATDDR5L
ATDDR6H
ATDDR6L
W
R
BIT 1
u
BIT 0
u
0
0
0
0
0
0
0
0
0
0
0
0
W
R BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
W
R
BIT 1
u
BIT 0
u
0
0
0
0
0
0
0
0
0
0
0
0
W
R BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
W
R
BIT 1
u
BIT 0
u
0
0
0
0
0
0
0
0
0
0
0
0
W
R BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
W
R
BIT 1
u
BIT 0
u
0
0
0
0
0
0
0
0
0
0
0
0
W
R BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
W
R
BIT 1
u
BIT 0
u
0
0
0
0
0
0
0
0
0
0
0
0
W
R BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
W
R
BIT 1
u
BIT 0
u
0
0
0
0
0
0
0
0
0
0
0
0
W
R BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
W
R
BIT 1
u
BIT 0
u
0
0
0
0
0
0
0
0
0
0
0
0
W
= Unimplemented or Reserved
Figure 8-2. ATD Register Summary (Sheet 2 of 4)
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
Address
Name
Bit 7
6
5
4
3
2
1
Bit 0
R BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
0x001E
ATDDR7H
W
R
BIT 1
u
BIT 0
u
0
0
0
0
0
0
0
0
0
0
0
0
0x001F
ATDDR7L
W
Right Justified Result Data
R
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
0x0010
0x0011
0x0012
0x0013
0x0014
0x0015
0x0016
0x0017
0x0018
0x0019
0x001A
0x001B
ATDDR0H
ATDDR0L
ATDDR1H
ATDDR1L
ATDDR2H
ATDDR2L
ATDDR3H
ATDDR3L
ATDDR4H
ATDDR4L
ATDDR5H
ATDDR5L
W
R
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
W
R
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
W
R
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
W
R
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
W
R
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
W
R
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
W
R
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
W
R
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
W
R
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
W
R
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
W
R
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
W
= Unimplemented or Reserved
Figure 8-2. ATD Register Summary (Sheet 3 of 4)
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
Address
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
0x001C
ATDDR6H
W
R
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
0x001D
0x001E
0x001F
ATDDR6L
ATDDR7H
ATDDR7L
W
R
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
W
R
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
W
= Unimplemented or Reserved
Figure 8-2. ATD Register Summary (Sheet 4 of 4)
NOTE
Register Address = Module Base Address + Address Offset, where the
Module Base Address is defined at the MCU level and the Address Offset is
defined at the module level.
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
8.3.2
Register Descriptions
This section describes in address order all the ATD10B8C registers and their individual bits.
8.3.2.1
Reserved Register (ATDCTL0)
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-3. Reserved Register (ATDCTL0)
Read: Always read $00 in normal modes
Write: Unimplemented in normal modes
8.3.2.2
Reserved Register (ATDCTL1)
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-4. Reserved Register (ATDCTL1)
Read: Always read $00 in normal modes
Write: Unimplemented in normal modes
NOTE
Writing to this registers when in special modes can alter functionality.
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
8.3.2.3
ATD Control Register 2 (ATDCTL2)
This register controls power down, interrupt, and external trigger. Writes to this register will abort current
conversion sequence but will not start a new sequence.
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
ASCIF
ADPU
AFFC
AWAI
ETRIGLE
ETRIGP
ETRIGE
ASCIE
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-5. ATD Control Register 2 (ATDCTL2)
Read: Anytime
Write: Anytime
Table 8-1. ATDCTL2 Field Descriptions
Description
Field
7
ATD Power Down — This bit provides on/off control over the ATD10B8C block allowing reduced MCU power
ADPU
consumption. Because analog electronic is turned off when powered down, the ATD requires a recovery time
period after ADPU bit is enabled.
0 Power down ATD
1 Normal ATD functionality
6
ATD Fast Flag Clear All
AFFC
0 ATD flag clearing operates normally (read the status register ATDSTAT1 before reading the result register to
clear the associate CCF flag).
1 Changes all ATD conversion complete flags to a fast clear sequence. Any access to a result register will cause
the associate CCF flag to clear automatically.
5
ATD Power Down in Wait Mode — When entering Wait Mode this bit provides on/off control over the ATD10B8C
block allowing reduced MCU power. Because analog electronic is turned off when powered down, the ATD
requires a recovery time period after exit from Wait mode.
AWAI
0 ATD continues to run in Wait mode
1 Halt conversion and power down ATD during Wait mode
After exiting Wait mode with an interrupt conversion will resume. But due to the recovery time the result of this
conversion should be ignored.
4
External Trigger Level/Edge Control — This bit controls the sensitivity of the external trigger signal. See
ETRIGLE Table 8-2 for details.
3
External Trigger Polarity — This bit controls the polarity of the external trigger signal. See Table 8-2 for details.
ETRIGP
2
External Trigger Mode Enable — This bit enables the external trigger on ATD channel 7. The external trigger
ETRIGE
allows to synchronize sample and ATD conversions processes with external events.
0 Disable external trigger
1 Enable external trigger
Note: The conversion results for the external trigger ATD channel 7 have no meaning while external trigger mode
is enabled.
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
Table 8-1. ATDCTL2 Field Descriptions (continued)
Field
Description
1
ATD Sequence Complete Interrupt Enable
ASCIE
0 ATD Sequence Complete interrupt requests are disabled.
1 ATD Interrupt will be requested whenever ASCIF = 1 is set.
0
ATD Sequence Complete Interrupt Flag — If ASCIE = 1 the ASCIF flag equals the SCF flag (see
Section 8.3.2.7, “ATD Status Register 0 (ATDSTAT0)”), else ASCIF reads zero. Writes have no effect.
0 No ATD interrupt occurred
ASCIF
1 ATD sequence complete interrupt pending
Table 8-2. External Trigger Configurations
ETRIGLE
ETRIGP
External Trigger Sensitivity
0
0
1
1
0
1
0
1
Falling edge
Rising edge
Low level
High level
8.3.2.4
ATD Control Register 3 (ATDCTL3)
This register controls the conversion sequence length, FIFO for results registers and behavior in Freeze
Mode. Writes to this register will abort current conversion sequence but will not start a new sequence.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
0
S8C
S4C
S2C
S1C
FIFO
FRZ1
FRZ0
Reset
0
0
1
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-6. ATD Control Register 3 (ATDCTL3)
Read: Anytime
Write: Anytime
Table 8-3. ATDCTL3 Field Descriptions
Description
Field
6–3
Conversion Sequence Length — These bits control the number of conversions per sequence. Table 8-4 shows
S8C, S4C, all combinations. At reset, S4C is set to 1 (sequence length is 4). This is to maintain software continuity to HC12
S2C, S1C Family.
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Table 8-3. ATDCTL3 Field Descriptions (continued)
Field
Description
2
Result Register FIFO Mode — If this bit is zero (non-FIFO mode), the A/D conversion results map into the result
registers based on the conversion sequence; the result of the first conversion appears in the first result register,
the second result in the second result register, and so on.
FIFO
If this bit is one (FIFO mode) the conversion counter is not reset at the beginning or ending of a conversion
sequence; sequential conversion results are placed in consecutive result registers. In a continuously scanning
conversion sequence, the result register counter will wrap around when it reaches the end of the result register
file. The conversion counter value (CC2-0 in ATDSTAT0) can be used to determine where in the result register
file, the current conversion result will be placed.
Aborting a conversion or starting a new conversion by write to an ATDCTL register (ATDCTL5-0) clears the
conversion counter even if FIFO=1. So the first result of a new conversion sequence, started by writing to
ATDCTL5, will always be place in the first result register (ATDDDR0). Intended usage of FIFO mode is continuos
conversion (SCAN=1) or triggered conversion (ETRIG=1).
Which result registers hold valid data can be tracked using the conversion complete flags. Fast flag clear mode
may or may not be useful in a particular application to track valid data.
0 Conversion results are placed in the corresponding result register up to the selected sequence length.
1 Conversion results are placed in consecutive result registers (wrap around at end).
1–0
Background Debug Freeze Enable — When debugging an application, it is useful in many cases to have the
FRIZ[1:0] ATD pause when a breakpoint (Freeze Mode) is encountered. These 2 bits determine how the ATD will respond
to a breakpoint as shown in Table 8-5. Leakage onto the storage node and comparator reference capacitors may
compromise the accuracy of an immediately frozen conversion depending on the length of the freeze period.
Table 8-4. Conversion Sequence Length Coding
Number of Conversions per
S8C
S4C
S2C
S1C
Sequence
0
0
0
0
0
0
0
0
1
0
0
0
0
1
1
1
1
X
0
0
1
1
0
0
1
1
X
0
1
0
1
0
1
0
1
X
8
1
2
3
4
5
6
7
8
Table 8-5. ATD Behavior in Freeze Mode (Breakpoint)
FRZ1
FRZ0
Behavior in Freeze Mode
0
0
1
1
0
1
0
1
Continue conversion
Reserved
Finish current conversion, then freeze
Freeze Immediately
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
8.3.2.5
ATD Control Register 4 (ATDCTL4)
This register selects the conversion clock frequency, the length of the second phase of the sample time and
the resolution of the A/D conversion (i.e.: 8-bits or 10-bits). Writes to this register will abort current
conversion sequence but will not start a new sequence.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
SRES8
SMP1
SMP0
PRS4
PRS3
PRS2
PRS1
PRS0
Reset
0
0
0
0
0
1
0
1
Figure 8-7. ATD Control Register 4 (ATDCTL4)
Read: Anytime
Write: Anytime
Table 8-6. ATDCTL4 Field Descriptions
Description
Field
7
A/D Resolution Select — This bit selects the resolution of A/D conversion results as either 8 or 10 bits. The A/D
SRES8
converter has an accuracy of 10 bits; however, if low resolution is required, the conversion can be speeded up
by selecting 8-bit resolution.
0 10-bit resolution
1 8-bit resolution
6–5
Sample Time Select — These two bits select the length of the second phase of the sample time in units of ATD
SMP[1:0] conversion clock cycles. Note that the ATD conversion clock period is itself a function of the prescaler value (bits
PRS4-0). The sample time consists of two phases. The first phase is two ATD conversion clock cycles long and
transfers the sample quickly (via the buffer amplifier) onto the A/D machine’s storage node. The second phase
attaches the external analog signal directly to the storage node for final charging and high accuracy. Table 8-7
lists the lengths available for the second sample phase.
4–0
ATD Clock Prescaler — These 5 bits are the binary value prescaler value PRS. The ATD conversion clock
PRS[4:0}
frequency is calculated as follows:
[BusClock]
ATDclock =
× 0.5
-----------------------------
[PRS + 1]
Note: The maximum ATD conversion clock frequency is half the Bus Clock. The default (after reset) prescaler
value is 5 which results in a default ATD conversion clock frequency that is Bus Clock divided by 12.
Table 8-8 illustrates the divide-by operation and the appropriate range of the Bus Clock.
Table 8-7. Sample Time Select
SMP1
SMP0
Length of 2nd Phase of Sample Time
0
0
1
1
0
1
0
1
2 A/D conversion clock periods
4 A/D conversion clock periods
8 A/D conversion clock periods
16 A/D conversion clock periods
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
Table 8-8. Clock Prescaler Values
Total Divisor
Value
Maximum
Minimum
Prescale Value
Bus Clock(1)
Bus Clock(2)
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
10000
10001
10010
10011
10100
10101
10110
10111
11000
11001
11010
11011
11100
11101
11110
11111
Divide by 2
Divide by 4
4 MHz
8 MHz
1 MHz
2 MHz
Divide by 6
12 MHz
16 MHz
20 MHz
24 MHz
28 MHz
32 MHz
36 MHz
40 MHz
44 MHz
48 MHz
52 MHz
56 MHz
60 MHz
64 MHz
68 MHz
72 MHz
76 MHz
80 MHz
84 MHz
88 MHz
92 MHz
96 MHz
100 MHz
104 MHz
108 MHz
112 MHz
116 MHz
120 MHz
124 MHz
128 MHz
3 MHz
Divide by 8
4 MHz
Divide by 10
Divide by 12
Divide by 14
Divide by 16
Divide by 18
Divide by 20
Divide by 22
Divide by 24
Divide by 26
Divide by 28
Divide by 30
Divide by 32
Divide by 34
Divide by 36
Divide by 38
Divide by 40
Divide by 42
Divide by 44
Divide by 46
Divide by 48
Divide by 50
Divide by 52
Divide by 54
Divide by 56
Divide by 58
Divide by 60
Divide by 62
Divide by 64
5 MHz
6 MHz
7 MHz
8 MHz
9 MHz
10 MHz
11 MHz
12 MHz
13 MHz
14 MHz
15 MHz
16 MHz
17 MHz
18 MHz
19 MHz
20 MHz
21 MHz
22 MHz
23 MHz
24 MHz
25 MHz
26 MHz
27 MHz
28 MHz
29 MHz
30 MHz
31 MHz
32 MHz
1. Maximum ATD conversion clock frequency is 2 MHz. The maximum allowed bus clock frequency is
shown in this column.
2. Minimum ATD conversion clock frequency is 500 kHz. The minimum allowed bus clock frequency
is shown in this column.
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
8.3.2.6
ATD Control Register 5 (ATDCTL5)
This register selects the type of conversion sequence and the analog input channels sampled. Writes to this
register will abort current conversion sequence and start a new conversion sequence.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
0
DJM
DSGN
SCAN
MULT
CC
CB
CA
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-8. ATD Control Register 5 (ATDCTL5)
Read: Anytime
Write: Anytime
Table 8-9. ATDCTL5 Field Descriptions
Description
Field
7
DJM
Result Register Data Justification — This bit controls justification of conversion data in the result registers.
See Section 8.3.2.13, “ATD Conversion Result Registers (ATDDRHx/ATDDRLx)” for details.
0 Left justified data in the result registers
1 Right justified data in the result registers
6
Result Register Data Signed or Unsigned Representation — This bit selects between signed and unsigned
conversion data representation in the result registers. Signed data is represented as 2’s complement. Signed
data is not available in right justification. See Section 8.3.2.13, “ATD Conversion Result Registers
(ATDDRHx/ATDDRLx)” for details.
DSGN
0 Unsigned data representation in the result registers
1 Signed data representation in the result registers
Table 8-10 summarizes the result data formats available and how they are set up using the control bits.
Table 8-11 illustrates the difference between the signed and unsigned, left justified output codes for an input
signal range between 0 and 5.12 Volts.
5
Continuous Conversion Sequence Mode — This bit selects whether conversion sequences are performed
continuously or only once.
SCAN
0 Single conversion sequence
1 Continuous conversion sequences (scan mode)
4
Multi-Channel Sample Mode — When MULT is 0, the ATD sequence controller samples only from the specified
analog input channel for an entire conversion sequence. The analog channel is selected by channel selection
code (control bits CC/CB/CA located in ATDCTL5). When MULT is 1, the ATD sequence controller samples
across channels. The number of channels sampled is determined by the sequence length value (S8C, S4C, S2C,
S1C). The first analog channel examined is determined by channel selection code (CC, CB, CA control bits);
subsequent channels sampled in the sequence are determined by incrementing the channel selection code.
0 Sample only one channel
MULT
1 Sample across several channels
2–1
Analog Input Channel Select Code — These bits select the analog input channel(s) whose signals are
CC, CB, CA sampled and converted to digital codes. Table 8-12 lists the coding used to select the various analog input
channels. In the case of single channel scans (MULT = 0), this selection code specified the channel examined.
In the case of multi-channel scans (MULT = 1), this selection code represents the first channel to be examined
in the conversion sequence. Subsequent channels are determined by incrementing channel selection code;
selection codes that reach the maximum value wrap around to the minimum value.
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Table 8-10. Available Result Data Formats
Result Data Formats
Description and Bus Bit Mapping
SRES8
DJM
DSGN
1
1
1
0
0
0
0
0
1
0
0
1
0
1
X
0
1
X
8-bit / left justified / unsigned — bits 8–15
8-bit / left justified / signed — bits 8–15
8-bit / right justified / unsigned — bits 0–7
10-bit / left justified / unsigned — bits 6–15
10-bit / left justified / signed — bits 6–15
10-bit / right justified / unsigned — bits 0–9
Table 8-11. Left Justified, Signed, and Unsigned ATD Output Codes.
Input Signal
Signed
8-Bit
Unsigned
8-Bit
Signed
10-Bit
Unsigned
10-Bit
VRL = 0 Volts
VRH = 5.12 Volts
Codes
Codes
Codes
Codes
5.120 Volts
5.100
7F
7F
7E
FF
FF
FE
7FC0
7F00
7E00
FFC0
FF00
FE00
5.080
2.580
2.560
2.540
01
00
FF
81
80
7F
0100
0000
FF00
8100
8000
7F00
0.020
0.000
81
80
01
00
8100
8000
0100
0000
Table 8-12. Analog Input Channel Select Coding
CC
CB
CA
Analog Input Channel
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
8.3.2.7
ATD Status Register 0 (ATDSTAT0)
This read-only register contains the sequence complete flag, overrun flags for external trigger and FIFO
mode, and the conversion counter.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
0
CC2
CC1
CC0
SCF
ETORF
FIFOR
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-9. ATD Status Register 0 (ATDSTAT0)
Read: Anytime
Write: Anytime (no effect on (CC2, CC1, CC0))
Table 8-13. ATDSTAT0 Field Descriptions
Field
Description
7
SCF
Sequence Complete Flag — This flag is set upon completion of a conversion sequence. If conversion
sequences are continuously performed (SCAN = 1), the flag is set after each one is completed. This flag is
cleared when one of the following occurs:
A) Write “1” to SCF
B) Write to ATDCTL5 (a new conversion sequence is started)
C) If AFFC=1 and read of a result register
0 Conversion sequence not completed
1 Conversion sequence has completed
5
External Trigger Overrun Flag — While in edge trigger mode (ETRIGLE = 0), if additional active edges are
detected while a conversion sequence is in process the overrun flag is set. This flag is cleared when one of the
following occurs:
ETORF
A) Write “1” to ETORF
B) Write to ATDCTL2, ATDCTL3 or ATDCTL4 (a conversion sequence is aborted)
C) Write to ATDCTL5 (a new conversion sequence is started)
0 No External trigger over run error has occurred
1 External trigger over run error has occurred
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Table 8-13. ATDSTAT0 Field Descriptions (continued)
Field
Description
4
FIFO Over Run Flag — This bit indicates that a result register has been written to before its associated
conversion complete flag (CCF) has been cleared. This flag is most useful when using the FIFO mode because
the flag potentially indicates that result registers are out of sync with the input channels. However, it is also
practical for non-FIFO modes, and indicates that a result register has been over written before it has been read
(i.e. the old data has been lost). This flag is cleared when one of the following occurs:
A) Write “1” to FIFOR
FIFOR
B) Start a new conversion sequence (write to ATDCTL5 or external trigger)
0 No over run has occurred
1 An over run condition exists
2–0
CC[2:0]
Conversion Counter — These 3 read-only bits are the binary value of the conversion counter. The conversion
counter points to the result register that will receive the result of the current conversion. For example, CC2 = 1,
CC1 = 1, CC0 = 0 indicates that the result of the current conversion will be in ATD Result Register 6. If in non-
FIFO mode (FIFO = 0) the conversion counter is initialized to zero at the begin and end of the conversion
sequence. If in FIFO mode (FIFO = 1) the register counter is not initialized. The conversion counters wraps
around when its maximum value is reached.
Aborting a conversion or starting a new conversion by write to an ATDCTL register (ATDCTL5-2) clears the
conversion counter even if FIFO=1.
8.3.2.8
Reserved Register (ATDTEST0)
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
U
U
U
U
U
U
U
U
Reset
1
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-10. Reserved Register (ATDTEST0)
Read: Anytime, returns unpredictable values
Write: Anytime in special modes, unimplemented in normal modes
NOTE
Writing to this registers when in special modes can alter functionality.
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
8.3.2.9
ATD Test Register 1 (ATDTEST1)
This register contains the SC bit used to enable special channel conversions.
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
U
U
U
U
U
U
U
SC
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-11. ATD Test Register 1 (ATDTEST1)
Read: Anytime, returns unpredictable values for Bit 7 and Bit 6
Write: Anytime
Table 8-14. ATDTEST1 Field Descriptions
Field
Description
0
SC
Special Channel Conversion Bit — If this bit is set, then special channel conversion can be selected using CC,
CB, and CA of ATDCTL5. Table 8-15 lists the coding.
0 Special channel conversions disabled
1 Special channel conversions enabled
Note: Always write remaining bits of ATDTEST1 (Bit7 to Bit1) zero when writing SC bit. Not doing so might result
in unpredictable ATD behavior.
Table 8-15. Special Channel Select Coding
SC
CC
CB
CA
Analog Input Channel
1
1
1
1
1
0
1
1
1
1
X
0
0
1
1
X
0
1
0
1
Reserved
VRH
VRL
(VRH+VRL) / 2
Reserved
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8.3.2.10 ATD Status Register 1 (ATDSTAT1)
This read-only register contains the Conversion Complete Flags.
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
W
CCF7
CCF6
CCF5
CCF4
CCF3
CCF2
CCF1
CCF0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 8-12. ATD Status Register 1 (ATDSTAT1)
Read: Anytime
Write: Anytime, no effect
Table 8-16. ATDSTAT1 Field Descriptions
Description
Field
7–0
CCF[7:0]
Conversion Complete Flag x (x = 7, 6, 5, 4, 3, 2, 1, 0) — A conversion complete flag is set at the end of each
conversion in a conversion sequence. The flags are associated with the conversion position in a sequence (and
also the result register number). Therefore, CCF0 is set when the first conversion in a sequence is complete and
the result is available in result register ATDDR0; CCF1 is set when the second conversion in a sequence is
complete and the result is available in ATDDR1, and so forth. A flag CCFx (x = 7, 6, 5, 4, 3, 2, 1, 0) is cleared
when one of the following occurs:
A) Write to ATDCTL5 (a new conversion sequence is started)
B) If AFFC = 0 and read of ATDSTAT1 followed by read of result register ATDDRx
C) If AFFC = 1 and read of result register ATDDRx
0 Conversion number x not completed
1 Conversion number x has completed, result ready in ATDDRx
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
8.3.2.11 ATD Input Enable Register (ATDDIEN)
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
W
IEN7
IEN6
IEN5
IEN4
IEN3
IEN2
IEN1
IEN0
Reset
0
0
0
0
0
0
0
0
Figure 8-13. ATD Input Enable Register (ATDDIEN)
Read: Anytime
Write: Anytime
Table 8-17. ATDDIEN Field Descriptions
Description
Field
7–0
IEN[7:0]
ATD Digital Input Enable on channel x (x = 7, 6, 5, 4, 3, 2, 1, 0) — This bit controls the digital input buffer from
the analog input pin (ANx) to PTADx data register.
0 Disable digital input buffer to PTADx
1 Enable digital input buffer to PTADx.
Note: Setting this bit will enable the corresponding digital input buffer continuously. If this bit is set while
simultaneously using it as an analog port, there is potentially increased power consumption because the
digital input buffer maybe in the linear region.
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8.3.2.12 Port Data Register (PORTAD)
The data port associated with the ATD is general purpose I/O. The port pins are shared with the analog
A/D inputs AN7–AN0.
Module Base + 0x000F
7
6
5
4
3
2
1
0
R
W
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
Reset
1
1
1
1
1
1
1
1
Pin
Function
AN7
AN6
AN5
AN4
AN3‘
AN2
AN1
AN0
= Unimplemented or Reserved
Figure 8-14. Port Data Register (PORTAD)
Read: Anytime
Write: Anytime, no effect
The A/D input channels may be used for general-purpose digital I/0.
Table 8-18. PORTAD Field Descriptions
Field
Description
A/D Channel x (ANx) Digital Input (x = 7, 6, 5, 4, 3, 2, 1, 0) — If the digital input buffer on the ANx pin is enabled
7
PTAD[7:0] (IENx = 1) read returns the logic level on ANx pin (signal potentials not meeting VIL or VIH specifications will have
an indeterminate value)).
If the digital input buffers are disabled (IENx = 0), read returns a “1”.
Reset sets all PORTAD bits to “1”.
8.3.2.13 ATD Conversion Result Registers (ATDDRHx/ATDDRLx)
The A/D conversion results are stored in 8 read-only result registers ATDDRHx/ATDDRLx. The result
data is formatted in the result registers based on two criteria. First there is left and right justification; this
selection is made using the DJM control bit in ATDCTL5. Second there is signed and unsigned data; this
selection is made using the DSGN control bit in ATDCTL5. Signed data is stored in 2’s complement
format and only exists in left justified format. Signed data selected for right justified format is ignored.
Read: Anytime
Write: Anytime, no effect in normal modes
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8.3.2.13.1
Left Justified Result Data
Module Base + 0x0010 = ATDDR0H, 0x0012 = ATDDR1H, 0x0014 = ATDDR2H, 0x0016 = ATDDR3H
0x0018 = ATDDR4H, 0x001A = ATDDR5H, 0x001C = ATDDR6H, 0x001E = ATDDR7H
7
6
5
4
3
2
1
0
R
W
BIT 9 MSB
BIT 7 MSB
BIT 8
BIT 6
BIT 7
BIT 5
BIT 6
BIT 4
BIT 5
BIT 3
BIT 4
BIT 2
BIT 3
BIT 1
BIT 2
BIT 0
10-bit data
8-bit data
Reset
0
0
0
0
0
0
0
0
Figure 8-15. Left Justified, ATD Conversion Result Register, High Byte (ATDDRxH)
Module Base + 0x0011 = ATDDR0L, 0x0013 = ATDDR1L, 0x0015 = ATDDR2L, 0x0017 = ATDDR3L
0x0019 = ATDDR4L, 0x001B = ATDDR5L, 0x001D = ATDDR6L, 0x001F = ATDDR7L
7
6
5
4
3
2
1
0
R
W
BIT 1
U
BIT 0
U
0
0
0
0
0
0
0
0
0
0
0
0
10-bit data
8-bit data
Reset
0
0
0
0
0
0
0
0
Figure 8-16. Left Justified, ATD Conversion Result Register, Low Byte (ATDDRxL)
8.3.2.13.2
Right Justified Result Data
Module Base + 0x0010 = ATDDR0H, 0x0012 = ATDDR1H, 0x0014 = ATDDR2H, 0x0016 = ATDDR3H
0x0018 = ATDDR4H, 0x001A = ATDDR5H, 0x001C = ATDDR6H, 0x001E = ATDDR7H
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
0
0
0
0
BIT 9 MSB
0
BIT 8
0
10-bit data
8-bit data
Reset
0
0
0
0
0
0
0
0
Figure 8-17. Right Justified, ATD Conversion Result Register, High Byte (ATDDRxH)
Module Base + 0x0011 = ATDDR0L, 0x0013 = ATDDR1L, 0x0015 = ATDDR2L, 0x0017 = ATDDR3L
0x0019 = ATDDR4L, 0x001B = ATDDR5L, 0x001D = ATDDR6L, 0x001F = ATDDR7L
7
6
5
4
3
2
1
0
R
W
BIT 7
BIT 7 MSB
BIT 6
BIT 6
BIT 5
BIT 5
BIT 4
BIT 4
BIT 3
BIT 3
BIT 2
BIT 2
BIT 1
BIT 1
BIT 0
BIT 0
10-bit data
8-bit data
Reset
0
0
0
0
0
0
0
0
Figure 8-18. Right Justified, ATD Conversion Result Register, Low Byte (ATDDRxL)
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Chapter 8 Analog-to-Digital Converter (ATD10B8C) Block Description
8.4
Functional Description
The ATD10B8C is structured in an analog and a digital sub-block.
8.4.1
Analog Sub-block
The analog sub-block contains all analog electronics required to perform a single conversion. Separate
power supplies V and V allow to isolate noise of other MCU circuitry from the analog sub-block.
DDA
SSA
8.4.1.1
Sample and Hold Machine
The sample and hold (S/H) machine accepts analog signals from the external surroundings and stores them
as capacitor charge on a storage node.
The sample process uses a two stage approach. During the first stage, the sample amplifier is used to
quickly charge the storage node.The second stage connects the input directly to the storage node to
complete the sample for high accuracy.
When not sampling, the sample and hold machine disables its own clocks. The analog electronics still draw
their quiescent current. The power down (ADPU) bit must be set to disable both the digital clocks and the
analog power consumption.
The input analog signals are unipolar and must fall within the potential range of V
to V
.
DDA
SSA
8.4.1.2
Analog Input Multiplexer
The analog input multiplexer connects one of the 8 external analog input channels to the sample and hold
machine.
8.4.1.3
Sample Buffer Amplifier
The sample amplifier is used to buffer the input analog signal so that the storage node can be quickly
charged to the sample potential.
8.4.1.4
Analog-to-Digital (A/D) Machine
The A/D machine performs analog-to-digital conversions. The resolution is program selectable at either 8
or 10 bits. The A/D machine uses a successive approximation architecture. It functions by comparing the
stored analog sample potential with a series of digitally generated analog potentials. By following a binary
search algorithm, the A/D machine locates the approximating potential that is nearest to the sampled
potential.
When not converting the A/D machine disables its own clocks. The analog electronics still draws quiescent
current. The power down (ADPU) bit must be set to disable both the digital clocks and the analog power
consumption.
Only analog input signals within the potential range of V to V (A/D reference potentials) will result
RL
RH
in a non-railed digital output codes.
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8.4.2
Digital Sub-block
This subsection explains some of the digital features in more detail. See 7 for all details.
8.4.2.1
External Trigger Input (ETRIG)
The external trigger feature allows the user to synchronize ATD conversions to the external environment
events rather than relying on software to signal the ATD module when ATD conversions are to take place.
The input signal (ATD channel 7) is programmable to be edge or level sensitive with polarity control.
Table 8-19 gives a brief description of the different combinations of control bits and their affect on the
external trigger function
.
Table 8-19. External Trigger Control Bits
ETRIGLE
ETRIGP
ETRIGE
SCAN
Description
X
X
0
0
Ignores external trigger. Performs one conversion sequence
and stops.
X
0
0
1
1
X
0
1
0
1
0
1
1
1
1
1
X
X
X
X
Ignores external trigger. Performs continuous conversion
sequences.
Falling edge triggered. Performs one conversion sequence
per trigger.
Rising edge triggered. Performs one conversion sequence
per trigger.
Trigger active low. Performs continuous conversions while
trigger is active.
Trigger active high. Performs continuous conversions while
trigger is active.
During a conversion, if additional active edges are detected the overrun error flag ETORF is set.
In either level or edge triggered modes, the first conversion begins when the trigger is received. In both
cases, the maximum latency time is one Bus Clock cycle plus any skew or delay introduced by the trigger
circuitry.
NOTE
The conversion results for the external trigger ATD channel 7 have no
meaning while external trigger mode is enabled.
Once ETRIGE is enabled, conversions cannot be started by a write to ATDCTL5, but rather must be
triggered externally.
If the level mode is active and the external trigger both de-asserts and re-asserts itself during a conversion
sequence, this does not constitute an overrun; therefore, the flag is not set. If the trigger is left asserted in
level mode while a sequence is completing, another sequence will be triggered immediately.
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8.4.2.2
General-Purpose Digital Port Operation
The channel pins can be multiplexed between analog and digital data. As analog inputs, they are
multiplexed and sampled to supply signals to the A/D converter. Alternatively they can be configured as
digital I/O signals with the port I/O data being held in PORTAD.
The analog/digital multiplex operation is performed in the pads. The pad is always connected to the analog
inputs of the ATD10B8C. The pad signal is buffered to the digital port registers. This buffer can be turned
on or off with the ATDDIEN register. This is important so that the buffer does not draw excess current
when analog potentials are presented at its input.
8.4.2.3
Low-Power Modes
The ATD10B8C can be configured for lower MCU power consumption in three different ways:
1. Stop Mode: This halts A/D conversion. Exit from Stop mode will resume A/D conversion, But due
to the recovery time the result of this conversion should be ignored.
2. Wait Mode with AWAI = 1: This halts A/D conversion. Exit from Wait mode will resume A/D
conversion, but due to the recovery time the result of this conversion should be ignored.
3. Writing ADPU = 0 (Note that all ATD registers remain accessible.): This aborts any A/D
conversion in progress.
NOTE
The reset value for the ADPU bit is zero. Therefore, when this module is
reset, it is reset into the power down state.
8.5
Initialization/Application Information
Setting up and starting an A/D conversion
8.5.1
The following describes a typical setup procedure for starting A/D conversions. It is highly recommended
to follow this procedure to avoid common mistakes.
Each step of the procedure will have a general remark and a typical example
8.5.1.1
Step 1
Power up the ATD and concurrently define other settings in ATDCTL2
Example: Write to ATDCTL2: ADPU=1 -> powers up the ATD, ASCIE=1 enable interrupt on finish of a
conversion sequence.
8.5.1.2
Step 2
Wait for the ATD Recovery Time tREC before you proceed with Step 3.
Example: Use the CPU in a branch loop to wait for a defined number of bus clocks.
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8.5.1.3
Step 3
Configure how many conversions you want to perform in one sequence and define other settings in
ATDCTL3.
Example: Write S4C=1 to do 4 conversions per sequence.
8.5.1.4
Step 4
Configure resolution, sampling time and ATD clock speed in ATDCTL4.
Example: Use default for resolution and sampling time by leaving SRES8, SMP1 and SMP0 clear. For a
bus clock of 40MHz write 9 to PR4-0, this gives an ATD clock of 0.5*40MHz/(9+1) = 2MHz which is
within the allowed range for f
.
ATDCLK
8.5.1.5
Step 5
Configure starting channel, single/multiple channel, continuous or single sequence and result data format
in ATDCTL5. Writing ATDCTL5 will start the conversion, so make sure your write ATDCTL5 in the last
step.
Example: Leave CC,CB,CA clear to start on channel AN0. Write MULT=1 to convert channel AN0 to
AN3 in a sequence (4 conversion per sequence selected in ATDCTL3).
8.5.2
Aborting an A/D conversion
Step 1
8.5.2.1
Disable the ATD Interrupt by writing ASCIE=0 in ATDCTL2. This will also abort any ongoing conversion
sequence.
It is important to clear the interrupt enable at this point, prior to step 3, as depending on the device clock
gating it may not always be possible to clear it or the SCF flag once the module is disabled (ADPU=0).
8.5.2.2
Step 2
Clear the SCF flag by writing a 1 in ATDSTAT0.
(Remaining flags will be cleared with the next start of a conversions, but SCF flag should be cleared to
avoid SCF interrupt.)
8.5.2.3
Step 3
Power down ATD by writing ADPU=0 in ATDCTL2.
8.6
Resets
At reset the ATD10B8C is in a power down state. The reset state of each individual bit is listed within
Section 8.3.2, “Register Descriptions” which details the registers and their bit-field.
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8.7
Interrupts
The interrupt requested by the ATD10B8C is listed in Table 8-20. Refer to MCU specification for related
vector address and priority.
Table 8-20. ATD10B8C Interrupt Vectors
CCR
Mask
Interrupt Source
Local Enable
Sequence complete interrupt
I bit
ASCIE in ATDCTL2
See Section 8.3.2, “Register Descriptions” for further details.
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Chapter 9
Clocks and Reset Generator (CRGV4) Block Description
9.1
Introduction
This specification describes the function of the clocks and reset generator (CRGV4).
9.1.1
Features
The main features of this block are:
•
•
Phase-locked loop (PLL) frequency multiplier
— Reference divider
— Automatic bandwidth control mode for low-jitter operation
— Automatic frequency lock detector
— CPU interrupt on entry or exit from locked condition
— Self-clock mode in absence of reference clock
System clock generator
— Clock quality check
— Clock switch for either oscillator- or PLL-based system clocks
— User selectable disabling of clocks during wait mode for reduced power consumption
Computer operating properly (COP) watchdog timer with time-out clear window
System reset generation from the following possible sources:
— Power-on reset
•
•
— Low voltage reset
Refer to the device overview section for availability of this feature.
— COP reset
— Loss of clock reset
— External pin reset
Real-time interrupt (RTI)
•
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Chapter 9 Clocks and Reset Generator (CRGV4) Block Description
9.1.2
Modes of Operation
This subsection lists and briefly describes all operating modes supported by the CRG.
•
Run mode
All functional parts of the CRG are running during normal run mode. If RTI or COP functionality
is required the individual bits of the associated rate select registers (COPCTL, RTICTL) have to be
set to a nonzero value.
•
•
Wait mode
This mode allows to disable the system and core clocks depending on the configuration of the
individual bits in the CLKSEL register.
Stop mode
Depending on the setting of the PSTP bit, stop mode can be differentiated between full stop mode
(PSTP = 0) and pseudo-stop mode (PSTP = 1).
— Full stop mode
The oscillator is disabled and thus all system and core clocks are stopped. The COP and the
RTI remain frozen.
— Pseudo-stop mode
The oscillator continues to run and most of the system and core clocks are stopped. If the
respective enable bits are set the COP and RTI will continue to run, else they remain frozen.
•
Self-clock mode
Self-clock mode will be entered if the clock monitor enable bit (CME) and the self-clock mode
enable bit (SCME) are both asserted and the clock monitor in the oscillator block detects a loss of
clock. As soon as self-clock mode is entered the CRGV4 starts to perform a clock quality check.
Self-clock mode remains active until the clock quality check indicates that the required quality of
the incoming clock signal is met (frequency and amplitude). Self-clock mode should be used for
safety purposes only. It provides reduced functionality to the MCU in case a loss of clock is causing
severe system conditions.
9.1.3
Block Diagram
Figure 9-1 shows a block diagram of the CRGV4.
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Power-on Reset
Voltage
Regulator
Low Voltage Reset 1
CRG
CM fail
RESET
System Reset
Reset
Generator
Clock
Monitor
XCLKS
Clock Quality
OSCCLK
Checker
Oscil-
lator
EXTAL
XTAL
Bus Clock
Core Clock
COP
RTI
Oscillator Clock
Registers
XFC
VDDPLL
VSSPLL
PLLCLK
Real-Time Interrupt
PLL Lock Interrupt
Clock and Reset
Control
PLL
Self-Clock Mode
Interrupt
1 Refer to the device overview section for availability of the low-voltage reset feature.
Figure 9-1. CRG Block Diagram
9.2
External Signal Description
This section lists and describes the signals that connect off chip.
9.2.1
VDDPLL, VSSPLL — PLL Operating Voltage, PLL Ground
These pins provides operating voltage (V
) and ground (V
) for the PLL circuitry. This allows
SSPLL
DDPLL
the supply voltage to the PLL to be independently bypassed. Even if PLL usage is not required V
DDPLL
and V
must be connected properly.
SSPLL
9.2.2
XFC — PLL Loop Filter Pin
A passive external loop filter must be placed on the XFC pin. The filter is a second-order, low-pass filter
to eliminate the VCO input ripple. The value of the external filter network and the reference frequency
determines the speed of the corrections and the stability of the PLL. Refer to the device overview chapter
for calculation of PLL loop filter (XFC) components. If PLL usage is not required the XFC pin must be
tied to V
.
DDPLL
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Chapter 9 Clocks and Reset Generator (CRGV4) Block Description
VDDPLL
CS
CP
MCU
RS
XFC
Figure 9-2. PLL Loop Filter Connections
9.2.3
RESET — Reset Pin
RESET is an active low bidirectional reset pin. As an input it initializes the MCU asynchronously to a
known start-up state. As an open-drain output it indicates that an system reset (internal to MCU) has been
triggered.
9.3
Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the CRGV4.
9.3.1
Module Memory Map
Table 9-1 gives an overview on all CRGV4 registers.
Table 9-1. CRGV4 Memory Map
Address
Offset
Use
Access
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
0x0008
0x0009
0x000A
0x000B
CRG Synthesizer Register (SYNR)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
CRG Reference Divider Register (REFDV)
CRG Test Flags Register (CTFLG)(1)
CRG Flags Register (CRGFLG)
CRG Interrupt Enable Register (CRGINT)
CRG Clock Select Register (CLKSEL)
CRG PLL Control Register (PLLCTL)
CRG RTI Control Register (RTICTL)
CRG COP Control Register (COPCTL)
CRG Force and Bypass Test Register (FORBYP)(2)
CRG Test Control Register (CTCTL)(3)
CRG COP Arm/Timer Reset (ARMCOP)
1. CTFLG is intended for factory test purposes only.
2. FORBYP is intended for factory test purposes only.
3. CTCTL is intended for factory test purposes only.
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NOTE
Register address = base address + address offset, where the base address is
defined at the MCU level and the address offset is defined at the module
level.
9.3.2
Register Descriptions
This section describes in address order all the CRGV4 registers and their individual bits.
Register
Name
Bit 7
6
5
SYN5
0
4
SYN4
0
3
2
1
Bit 0
0x0000
SYNR
R
0
0
SYN3
SYN2
SYN1
SYN0
W
0x0001
REFDV
R
0
0
0
0
REFDV3
0
REFDV2
0
REFDV1
0
REFDV0
0
W
0x0002
CTFLG
R
0
0
W
0x0003
CRGFLG
R
LOCK
0
TRACK
0
SCM
0
RTIF
RTIE
PORF
0
LVRF
0
LOCKIF
LOCKIE
ROAWAI
ACQ
SCMIF
SCMIE
RTIWAI
PCE
W
0x0004
CRGINT
R
W
0x0005
CLKSEL
R
PLLSEL
PSTP
PLLON
RTR6
SYSWAI
AUTO
PLLWAI
0
CWAI
PRE
COPWAI
SCME
RTR0
W
0x0006
PLLCTL
R
CME
0
W
0x0007
RTICTL
R
RTR5
0
RTR4
0
RTR3
0
RTR2
RTR1
W
0x0008
COPCTL
R
WCOP
RSBCK
CR2
CR1
CR0
W
0x0009
FORBYP
R
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x000A
CTCTL
W
= Unimplemented or Reserved
Figure 9-3. CRG Register Summary
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Register
Bit 7
6
5
4
3
2
1
Bit 0
Name
0x000B
R
0
0
0
0
0
0
0
0
ARMCOP
W
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
= Unimplemented or Reserved
Figure 9-3. CRG Register Summary (continued)
9.3.2.1
CRG Synthesizer Register (SYNR)
The SYNR register controls the multiplication factor of the PLL. If the PLL is on, the count in the loop
divider (SYNR) register effectively multiplies up the PLL clock (PLLCLK) from the reference frequency
by 2 x (SYNR+1). PLLCLK will not be below the minimum VCO frequency (f
).
SCM
(SYNR + 1)
PLLCLK = 2xOSCCLKx
---------------------------------
(REFDV + 1)
NOTE
If PLL is selected (PLLSEL=1), Bus Clock = PLLCLK / 2
Bus Clock must not exceed the maximum operating system frequency.
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
0
0
SYN5
SYNR
SYN3
SYN2
SYN1
SYN0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-4. CRG Synthesizer Register (SYNR)
Read: anytime
Write: anytime except if PLLSEL = 1
NOTE
Write to this register initializes the lock detector bit and the track detector
bit.
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9.3.2.2
CRG Reference Divider Register (REFDV)
The REFDV register provides a finer granularity for the PLL multiplier steps. The count in the reference
divider divides OSCCLK frequency by REFDV + 1.
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
0
0
0
0
REFDV3
REFDV2
REFDV1
REFDV0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-5. CRG Reference Divider Register (REFDV)
Read: anytime
Write: anytime except when PLLSEL = 1
NOTE
Write to this register initializes the lock detector bit and the track detector
bit.
9.3.2.3
Reserved Register (CTFLG)
This register is reserved for factory testing of the CRGV4 module and is not available in normal modes.
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-6. CRG Reserved Register (CTFLG)
Read: always reads 0x0000 in normal modes
Write: unimplemented in normal modes
NOTE
Writing to this register when in special mode can alter the CRGV4
functionality.
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9.3.2.4
CRG Flags Register (CRGFLG)
This register provides CRG status bits and flags.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
LOCK
TRACK
SCM
RTIF
PORF
LVRF
LOCKIF
SCMIF
Reset
0
Note 1
Note 2
0
0
0
0
0
1. PORF is set to 1 when a power-on reset occurs. Unaffected by system reset.
2. LVRF is set to 1 when a low-voltage reset occurs. Unaffected by system reset.
= Unimplemented or Reserved
Figure 9-7. CRG Flag Register (CRGFLG)
Read: anytime
Write: refer to each bit for individual write conditions
Table 9-2. CRGFLG Field Descriptions
Field
Description
7
RTIF
Real-Time Interrupt Flag — RTIF is set to 1 at the end of the RTI period. This flag can only be cleared by writing
a 1. Writing a 0 has no effect. If enabled (RTIE = 1), RTIF causes an interrupt request.
0 RTI time-out has not yet occurred.
1 RTI time-out has occurred.
6
Power-on Reset Flag — PORF is set to 1 when a power-on reset occurs. This flag can only be cleared by writing
a 1. Writing a 0 has no effect.
PORF
0 Power-on reset has not occurred.
1 Power-on reset has occurred.
5
Low-Voltage Reset Flag — If low voltage reset feature is not available (see the device overview chapter), LVRF
always reads 0. LVRF is set to 1 when a low voltage reset occurs. This flag can only be cleared by writing a 1.
Writing a 0 has no effect.
LVRF
0 Low voltage reset has not occurred.
1 Low voltage reset has occurred.
4
PLL Lock Interrupt Flag — LOCKIF is set to 1 when LOCK status bit changes. This flag can only be cleared by
writing a 1. Writing a 0 has no effect.If enabled (LOCKIE = 1), LOCKIF causes an interrupt request.
0 No change in LOCK bit.
LOCKIF
1 LOCK bit has changed.
3
Lock Status Bit — LOCK reflects the current state of PLL lock condition. This bit is cleared in self-clock mode.
Writes have no effect.
LOCK
0 PLL VCO is not within the desired tolerance of the target frequency.
1 PLL VCO is within the desired tolerance of the target frequency.
2
Track Status Bit — TRACK reflects the current state of PLL track condition. This bit is cleared in self-clock mode.
TRACK
Writes have no effect.
0 Acquisition mode status.
1 Tracking mode status.
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Table 9-2. CRGFLG Field Descriptions (continued)
Field
Description
1
Self-Clock Mode Interrupt Flag — SCMIF is set to 1 when SCM status bit changes. This flag can only be
cleared by writing a 1. Writing a 0 has no effect. If enabled (SCMIE=1), SCMIF causes an interrupt request.
0 No change in SCM bit.
SCMIF
1 SCM bit has changed.
0
SCM
Self-Clock Mode Status Bit — SCM reflects the current clocking mode. Writes have no effect.
0 MCU is operating normally with OSCCLK available.
1 MCU is operating in self-clock mode with OSCCLK in an unknown state. All clocks are derived from PLLCLK
running at its minimum frequency fSCM
.
9.3.2.5
CRG Interrupt Enable Register (CRGINT)
This register enables CRG interrupt requests.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
RTIE
LOCKIE
SCMIE
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-8. CRG Interrupt Enable Register (CRGINT)
Read: anytime
Write: anytime
Table 9-3. CRGINT Field Descriptions
Description
Field
7
Real-Time Interrupt Enable Bit
0 Interrupt requests from RTI are disabled.
RTIE
1 Interrupt will be requested whenever RTIF is set.
4
Lock Interrupt Enable Bit
LOCKIE
0 LOCK interrupt requests are disabled.
1 Interrupt will be requested whenever LOCKIF is set.
1
Self-Clock Mode Interrupt Enable Bit
SCMIE
0 SCM interrupt requests are disabled.
1 Interrupt will be requested whenever SCMIF is set.
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9.3.2.6
CRG Clock Select Register (CLKSEL)
This register controls CRG clock selection. Refer to Figure 9-17 for details on the effect of each bit.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
PLLSEL
PSTP
SYSWAI
ROAWAI
PLLWAI
CWAI
RTIWAI
COPWAI
Reset
0
0
0
0
0
0
0
0
Figure 9-9. CRG Clock Select Register (CLKSEL)
Read: anytime
Write: refer to each bit for individual write conditions
Table 9-4. CLKSEL Field Descriptions
Field
Description
7
PLL Select Bit — Write anytime. Writing a 1 when LOCK = 0 and AUTO = 1, or TRACK = 0 and AUTO = 0 has
no effect. This prevents the selection of an unstable PLLCLK as SYSCLK. PLLSEL bit is cleared when the MCU
enters self-clock mode, stop mode or wait mode with PLLWAI bit set.
PLLSEL
0 System clocks are derived from OSCCLK (Bus Clock = OSCCLK / 2).
1 System clocks are derived from PLLCLK (Bus Clock = PLLCLK / 2).
6
Pseudo-Stop Bit — Write: anytime — This bit controls the functionality of the oscillator during stop mode.
0 Oscillator is disabled in stop mode.
PSTP
1 Oscillator continues to run in stop mode (pseudo-stop). The oscillator amplitude is reduced. Refer to oscillator
block description for availability of a reduced oscillator amplitude.
Note: Pseudo-stop allows for faster stop recovery and reduces the mechanical stress and aging of the resonator
in case of frequent stop conditions at the expense of a slightly increased power consumption.
Note: Lower oscillator amplitude exhibits lower power consumption but could have adverse effects during any
electro-magnetic susceptibility (EMS) tests.
5
System Clocks Stop in Wait Mode Bit — Write: anytime
0 In wait mode, the system clocks continue to run.
1 In wait mode, the system clocks stop.
SYSWAI
Note: RTI and COP are not affected by SYSWAI bit.
4
Reduced Oscillator Amplitude in Wait Mode Bit — Write: anytime — Refer to oscillator block description
chapter for availability of a reduced oscillator amplitude. If no such feature exists in the oscillator block then
setting this bit to 1 will not have any effect on power consumption.
ROAWAI
0 Normal oscillator amplitude in wait mode.
1 Reduced oscillator amplitude in wait mode.
Note: Lower oscillator amplitude exhibits lower power consumption but could have adverse effects during any
electro-magnetic susceptibility (EMS) tests.
3
PLL Stops in Wait Mode Bit — Write: anytime — If PLLWAI is set, the CRGV4 will clear the PLLSEL bit before
entering wait mode. The PLLON bit remains set during wait mode but the PLL is powered down. Upon exiting
wait mode, the PLLSEL bit has to be set manually if PLL clock is required.
PLLWAI
While the PLLWAI bit is set the AUTO bit is set to 1 in order to allow the PLL to automatically lock on the selected
target frequency after exiting wait mode.
0 PLL keeps running in wait mode.
1 PLL stops in wait mode.
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Table 9-4. CLKSEL Field Descriptions (continued)
Field
Description
2
Core Stops in Wait Mode Bit — Write: anytime
0 Core clock keeps running in wait mode.
1 Core clock stops in wait mode.
CWAI
1
RTI Stops in Wait Mode Bit — Write: anytime
RTIWAI
0 RTI keeps running in wait mode.
1 RTI stops and initializes the RTI dividers whenever the part goes into wait mode.
0
COP Stops in Wait Mode Bit — Normal modes: Write once —Special modes: Write anytime
0 COP keeps running in wait mode.
COPWAI
1 COP stops and initializes the COP dividers whenever the part goes into wait mode.
9.3.2.7
CRG PLL Control Register (PLLCTL)
This register controls the PLL functionality.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
CME
PLLON
AUTO
ACQ
PRE
PCE
SCME
Reset
1
1
1
1
0
0
0
1
= Unimplemented or Reserved
Figure 9-10. CRG PLL Control Register (PLLCTL)
Read: anytime
Write: refer to each bit for individual write conditions
Table 9-5. PLLCTL Field Descriptions
Field
Description
7
Clock Monitor Enable Bit — CME enables the clock monitor. Write anytime except when SCM = 1.
CME
0 Clock monitor is disabled.
1 Clock monitor is enabled. Slow or stopped clocks will cause a clock monitor reset sequence or self-clock
mode.
Note: Operating with CME = 0 will not detect any loss of clock. In case of poor clock quality this could cause
unpredictable operation of the MCU.
Note: In Stop Mode (PSTP = 0) the clock monitor is disabled independently of the CME bit setting and any loss
of clock will not be detected.
6
Phase Lock Loop On Bit — PLLON turns on the PLL circuitry. In self-clock mode, the PLL is turned on, but the
PLLON bit reads the last latched value. Write anytime except when PLLSEL = 1.
0 PLL is turned off.
PLLON
1 PLL is turned on. If AUTO bit is set, the PLL will lock automatically.
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Table 9-5. PLLCTL Field Descriptions (continued)
Field
Description
5
Automatic Bandwidth Control Bit — AUTO selects either the high bandwidth (acquisition) mode or the low
bandwidth (tracking) mode depending on how close to the desired frequency the VCO is running. Write anytime
except when PLLWAI=1, because PLLWAI sets the AUTO bit to 1.
AUTO
0 Automatic mode control is disabled and the PLL is under software control, using ACQ bit.
1 Automatic mode control is enabled and ACQ bit has no effect.
4
ACQ
Acquisition Bit — Write anytime. If AUTO=1 this bit has no effect.
0 Low bandwidth filter is selected.
1 High bandwidth filter is selected.
2
PRE
RTI Enable during Pseudo-Stop Bit — PRE enables the RTI during pseudo-stop mode. Write anytime.
0 RTI stops running during pseudo-stop mode.
1 RTI continues running during pseudo-stop mode.
Note: If the PRE bit is cleared the RTI dividers will go static while pseudo-stop mode is active. The RTI dividers
will not initialize like in wait mode with RTIWAI bit set.
1
PCE
COP Enable during Pseudo-Stop Bit — PCE enables the COP during pseudo-stop mode. Write anytime.
0 COP stops running during pseudo-stop mode
1 COP continues running during pseudo-stop mode
Note: If the PCE bit is cleared the COP dividers will go static while pseudo-stop mode is active. The COP dividers
will not initialize like in wait mode with COPWAI bit set.
0
Self-Clock Mode Enable Bit — Normal modes: Write once —Special modes: Write anytime — SCME can not
be cleared while operating in self-clock mode (SCM=1).
SCME
0 Detection of crystal clock failure causes clock monitor reset (see Section 9.5.1, “Clock Monitor Reset”).
1 Detection of crystal clock failure forces the MCU in self-clock mode (see Section 9.4.7.2, “Self-Clock Mode”).
9.3.2.8
CRG RTI Control Register (RTICTL)
This register selects the timeout period for the real-time interrupt.
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
0
RTR6
RTR5
RTR4
RTR3
RTR2
RTR1
RTR0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-11. CRG RTI Control Register (RTICTL)
Read: anytime
Write: anytime
NOTE
A write to this register initializes the RTI counter.
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Table 9-6. RTICTL Field Descriptions
Field
Description
6:4
Real-Time Interrupt Prescale Rate Select Bits — These bits select the prescale rate for the RTI. See Table 9-7.
RTR[6:4]
3:0
RTR[3:0]
Real-Time Interrupt Modulus Counter Select Bits — These bits select the modulus counter target value to
provide additional granularity. Table 9-7 shows all possible divide values selectable by the RTICTL register. The
source clock for the RTI is OSCCLK.
Table 9-7. RTI Frequency Divide Rates
RTR[6:4] =
RTR[3:0]
000
(OFF)
001
010
011
100
101
110
111
(210
)
(211
)
(212
)
(213
)
(214
)
(215
)
(216
)
OFF*
OFF*
OFF*
OFF*
OFF*
OFF*
OFF*
OFF*
OFF*
OFF*
OFF*
OFF*
OFF*
OFF*
OFF*
OFF*
210
211
212
213
214
215
216
0000 (÷1)
0001 (÷2)
0010 (÷3)
0011 (÷4)
0100 (÷5)
0101 (÷6)
0110 (÷7)
0111 (÷8)
1000 (÷9)
1001 (÷10)
1010 (÷11)
1011 (÷12)
1100 (÷ 13)
1101 (÷14)
1110 (÷15)
1111 (÷ 16)
2x210
3x210
2x211
3x211
2x212
3x212
2x213
3x213
2x214
3x214
2x215
3x215
2x216
3x216
4x210
4x211
4x212
4x213
4x214
4x215
4x216
5x210
5x211
5x212
5x213
5x214
5x215
5x216
6x210
6x211
6x212
6x213
6x214
6x215
6x216
7x210
7x211
7x212
7x213
7x214
7x215
7x216
8x210
8x211
8x212
8x213
8x214
8x215
8x216
9x210
9x211
9x212
9x213
9x214
9x215
9x216
10x210
11x210
12x210
13x210
14x210
15x210
16x210
10x211
11x211
12x211
13x211
14x211
15x211
16x211
10x212
11x212
12x212
13x212
14x212
15x212
16x212
10x213
11x213
12x213
13x213
14x213
15x213
16x213
10x214
11x214
12x214
13x214
14x214
15x214
16x214
10x215
11x215
12x215
13x215
14x215
15x215
16x215
10x216
11x216
12x216
13x216
14x216
15x216
16x216
* Denotes the default value out of reset.This value should be used to disable the RTI to ensure future backwards compatibility.
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9.3.2.9
CRG COP Control Register (COPCTL)
This register controls the COP (computer operating properly) watchdog.
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
0
0
0
WCOP
RSBCK
CR2
CR1
CR0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-12. CRG COP Control Register (COPCTL)
Read: anytime
Write: WCOP, CR2, CR1, CR0: once in user mode, anytime in special mode
Write: RSBCK: once
Table 9-8. COPCTL Field Descriptions
Field
Description
7
Window COP Mode Bit — When set, a write to the ARMCOP register must occur in the last 25% of the selected
period. A write during the first 75% of the selected period will reset the part. As long as all writes occur during
this window, 0x0055 can be written as often as desired. As soon as 0x00AA is written after the 0x0055, the time-
out logic restarts and the user must wait until the next window before writing to ARMCOP. Table 9-9 shows the
exact duration of this window for the seven available COP rates.
WCOP
0 Normal COP operation
1 Window COP operation
6
COP and RTI Stop in Active BDM Mode Bit
RSBCK
0 Allows the COP and RTI to keep running in active BDM mode.
1 Stops the COP and RTI counters whenever the part is in active BDM mode.
2:0
CR[2:0]
COP Watchdog Timer Rate Select — These bits select the COP time-out rate (see Table 9-9). The COP time-
out period is OSCCLK period divided by CR[2:0] value. Writing a nonzero value to CR[2:0] enables the COP
counter and starts the time-out period. A COP counter time-out causes a system reset. This can be avoided by
periodically (before time-out) reinitializing the COP counter via the ARMCOP register.
(1)
Table 9-9. COP Watchdog Rates
OSCCLK
Cycles to Time Out
CR2
CR1
CR0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
COP disabled
214
216
218
220
222
223
224
1. OSCCLK cycles are referenced from the previous COP time-out reset
(writing 0x0055/0x00AA to the ARMCOP register)
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9.3.2.10 Reserved Register (FORBYP)
NOTE
This reserved register is designed for factory test purposes only, and is not
intended for general user access. Writing to this register when in special
modes can alter the CRG’s functionality.
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-13. Reserved Register (FORBYP)
Read: always read 0x0000 except in special modes
Write: only in special modes
9.3.2.11 Reserved Register (CTCTL)
NOTE
This reserved register is designed for factory test purposes only, and is not
intended for general user access. Writing to this register when in special test
modes can alter the CRG’s functionality.
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 9-14. Reserved Register (CTCTL)
Read: always read 0x0080 except in special modes
Write: only in special modes
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Chapter 9 Clocks and Reset Generator (CRGV4) Block Description
9.3.2.12 CRG COP Timer Arm/Reset Register (ARMCOP)
This register is used to restart the COP time-out period.
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Bit 7
0
Bit 6
0
Bit 5
0
Bit 4
0
Bit 3
0
Bit 2
0
Bit 1
0
Bit 0
0
Reset
Figure 9-15. ARMCOP Register Diagram
Read: always reads 0x0000
Write: anytime
When the COP is disabled (CR[2:0] = “000”) writing to this register has no effect.
When the COP is enabled by setting CR[2:0] nonzero, the following applies:
Writing any value other than 0x0055 or 0x00AA causes a COP reset. To restart the COP time-out
period you must write 0x0055 followed by a write of 0x00AA. Other instructions may be executed
between these writes but the sequence (0x0055, 0x00AA) must be completed prior to COP end of
time-out period to avoid a COP reset. Sequences of 0x0055 writes or sequences of 0x00AA writes
are allowed. When the WCOP bit is set, 0x0055 and 0x00AA writes must be done in the last 25%
of the selected time-out period; writing any value in the first 75% of the selected period will cause
a COP reset.
9.4
Functional Description
This section gives detailed informations on the internal operation of the design.
9.4.1
Phase Locked Loop (PLL)
The PLL is used to run the MCU from a different time base than the incoming OSCCLK. For increased
flexibility, OSCCLK can be divided in a range of 1 to 16 to generate the reference frequency. This offers
a finer multiplication granularity. The PLL can multiply this reference clock by a multiple of 2, 4, 6,...
126,128 based on the SYNR register.
[SYNR + 1]
PLLCLK = 2 × OSCCLK ×
---------------------------------
[REFDV + 1]
CAUTION
Although it is possible to set the two dividers to command a very high clock
frequency, do not exceed the specified bus frequency limit for the MCU.
If (PLLSEL = 1), Bus Clock = PLLCLK / 2
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The PLL is a frequency generator that operates in either acquisition mode or tracking mode, depending on
the difference between the output frequency and the target frequency. The PLL can change between
acquisition and tracking modes either automatically or manually.
The VCO has a minimum operating frequency, which corresponds to the self-clock mode frequency f
.
SCM
REFERENCE
LOCK
LOCK
DETECTOR
REFDV <3:0>
FEEDBACK
EXTAL
XTAL
REDUCED
CONSUMPTION
OSCILLATOR
OSCCLK
REFERENCE
PROGRAMMABLE
DIVIDER
VDDPLL/VSSPLL
UP
PDET
PHASE
DETECTOR
CPUMP
VCO
DOWN
CRYSTAL
MONITOR
VDDPLL
LOOP
PROGRAMMABLE
DIVIDER
LOOP
FILTER
XFC
PIN
supplied by:
SYN <5:0>
VDDPLL/VSSPLL
PLLCLK
VDD/VSS
Figure 9-16. PLL Functional Diagram
9.4.1.1
PLL Operation
The oscillator output clock signal (OSCCLK) is fed through the reference programmable divider and is
divided in a range of 1 to 16 (REFDV+1) to output the reference clock. The VCO output clock, (PLLCLK)
is fed back through the programmable loop divider and is divided in a range of 2 to 128 in increments of
[2 x (SYNR +1)] to output the feedback clock. See Figure 9-16.
The phase detector then compares the feedback clock, with the reference clock. Correction pulses are
generated based on the phase difference between the two signals. The loop filter then slightly alters the DC
voltage on the external filter capacitor connected to XFC pin, based on the width and direction of the
correction pulse. The filter can make fast or slow corrections depending on its mode, as described in the
next subsection. The values of the external filter network and the reference frequency determine the speed
of the corrections and the stability of the PLL.
9.4.1.2
Acquisition and Tracking Modes
The lock detector compares the frequencies of the feedback clock, and the reference clock. Therefore, the
speed of the lock detector is directly proportional to the final reference frequency. The circuit determines
the mode of the PLL and the lock condition based on this comparison.
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The PLL filter can be manually or automatically configured into one of two possible operating modes:
•
Acquisition mode
In acquisition mode, the filter can make large frequency corrections to the VCO. This mode is used
at PLL start-up or when the PLL has suffered a severe noise hit and the VCO frequency is far off
the desired frequency. When in acquisition mode, the TRACK status bit is cleared in the CRGFLG
register.
•
Tracking mode
In tracking mode, the filter makes only small corrections to the frequency of the VCO. PLL jitter
is much lower in tracking mode, but the response to noise is also slower. The PLL enters tracking
mode when the VCO frequency is nearly correct and the TRACK bit is set in the CRGFLG register.
The PLL can change the bandwidth or operational mode of the loop filter manually or automatically.
In automatic bandwidth control mode (AUTO = 1), the lock detector automatically switches between
acquisition and tracking modes. Automatic bandwidth control mode also is used to determine when the
PLL clock (PLLCLK) is safe to use as the source for the system and core clocks. If PLL LOCK interrupt
requests are enabled, the software can wait for an interrupt request and then check the LOCK bit. If CPU
interrupts are disabled, software can poll the LOCK bit continuously (during PLL start-up, usually) or at
periodic intervals. In either case, only when the LOCK bit is set, is the PLLCLK clock safe to use as the
source for the system and core clocks. If the PLL is selected as the source for the system and core clocks
and the LOCK bit is clear, the PLL has suffered a severe noise hit and the software must take appropriate
action, depending on the application.
The following conditions apply when the PLL is in automatic bandwidth control mode (AUTO = 1):
•
•
The TRACK bit is a read-only indicator of the mode of the filter.
The TRACK bit is set when the VCO frequency is within a certain tolerance, ∆ , and is clear when
trk
the VCO frequency is out of a certain tolerance, ∆ .
unt
•
•
The LOCK bit is a read-only indicator of the locked state of the PLL.
The LOCK bit is set when the VCO frequency is within a certain tolerance, ∆
, and is cleared
Lock
when the VCO frequency is out of a certain tolerance, ∆ .
unl
•
CPU interrupts can occur if enabled (LOCKIE = 1) when the lock condition changes, toggling the
LOCK bit.
The PLL can also operate in manual mode (AUTO = 0). Manual mode is used by systems that do not
require an indicator of the lock condition for proper operation. Such systems typically operate well below
the maximum system frequency (f ) and require fast start-up. The following conditions apply when in
sys
manual mode:
•
•
•
ACQ is a writable control bit that controls the mode of the filter. Before turning on the PLL in
manual mode, the ACQ bit should be asserted to configure the filter in acquisition mode.
After turning on the PLL by setting the PLLON bit software must wait a given time (t ) before
acq
entering tracking mode (ACQ = 0).
After entering tracking mode software must wait a given time (t ) before selecting the PLLCLK
al
as the source for system and core clocks (PLLSEL = 1).
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9.4.2
System Clocks Generator
PLLSEL or SCM
WAIT(CWAI,SYSWAI),
STOP
PHASE
LOCK
LOOP
1
0
PLLCLK
SYSCLK
Core Clock
WAIT(SYSWAI),
STOP
÷2
CLOCK PHASE
GENERATOR
Bus Clock
SCM
WAIT(RTIWAI),
STOP(PSTP,PRE),
RTI enable
EXTAL
1
RTI
OSCCLK
OSCILLATOR
0
WAIT(COPWAI),
STOP(PSTP,PCE),
COP enable
XTAL
COP
Clock
Monitor
WAIT(SYSWAI),
STOP
Oscillator
Clock
STOP(PSTP)
Gating
Condition
Oscillator
Clock
(running during
Pseudo-Stop Mode
= Clock Gate
Figure 9-17. System Clocks Generator
The clock generator creates the clocks used in the MCU (see Figure 9-17). The gating condition placed on
top of the individual clock gates indicates the dependencies of different modes (stop, wait) and the setting
of the respective configuration bits.
The peripheral modules use the bus clock. Some peripheral modules also use the oscillator clock. The
memory blocks use the bus clock. If the MCU enters self-clock mode (see Section 9.4.7.2, “Self-Clock
Mode”), oscillator clock source is switched to PLLCLK running at its minimum frequency f
. The bus
SCM
clock is used to generate the clock visible at the ECLK pin. The core clock signal is the clock for the CPU.
The core clock is twice the bus clock as shown in Figure 9-18. But note that a CPU cycle corresponds to
one bus clock.
PLL clock mode is selected with PLLSEL bit in the CLKSEL register. When selected, the PLL output
clock drives SYSCLK for the main system including the CPU and peripherals. The PLL cannot be turned
off by clearing the PLLON bit, if the PLL clock is selected. When PLLSEL is changed, it takes a maximum
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of 4 OSCCLK plus 4 PLLCLK cycles to make the transition. During the transition, all clocks freeze and
CPU activity ceases.
CORE CLOCK:
BUS CLOCK / ECLK
Figure 9-18. Core Clock and Bus Clock Relationship
9.4.3
Clock Monitor (CM)
If no OSCCLK edges are detected within a certain time, the clock monitor within the oscillator block
generates a clock monitor fail event. The CRGV4 then asserts self-clock mode or generates a system reset
depending on the state of SCME bit. If the clock monitor is disabled or the presence of clocks is detected
no failure is indicated by the oscillator block.The clock monitor function is enabled/disabled by the CME
control bit.
9.4.4
Clock Quality Checker
The clock monitor performs a coarse check on the incoming clock signal. The clock quality checker
provides a more accurate check in addition to the clock monitor.
A clock quality check is triggered by any of the following events:
•
•
•
•
Power-on reset (POR)
Low voltage reset (LVR)
Wake-up from full stop mode (exit full stop)
Clock monitor fail indication (CM fail)
1
A time window of 50000 VCO clock cycles is called check window.
A number greater equal than 4096 rising OSCCLK edges within a check window is called osc ok. Note that
osc ok immediately terminates the current check window. See Figure 9-19 as an example.
check window
3
1
2
49999 50000
VCO
clock
1 2 3 4 5
4096
OSCCLK
4095
osc ok
Figure 9-19. Check Window Example
1. VCO clock cycles are generated by the PLL when running at minimum frequency fSCM
.
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The sequence for clock quality check is shown in Figure 9-20.
CM fail
Clock OK
POR LVR
exit full stop
Clock Monitor Reset
Enter SCM
yes
num=50
no
num=0
SCM
active?
check window
num=num+1
yes
yes
no
no
no
osc ok
?
num<50
?
SCME=1
?
yes
yes
SCM
active?
Switch to OSCCLK
Exit SCM
no
Figure 9-20. Sequence for Clock Quality Check
NOTE
Remember that in parallel to additional actions caused by self-clock mode
1
or clock monitor reset handling the clock quality checker continues to
check the OSCCLK signal.
NOTE
The clock quality checker enables the PLL and the voltage regulator
(VREG) anytime a clock check has to be performed. An ongoing clock
quality check could also cause a running PLL (f
during pseudo-stop mode or wait mode
) and an active VREG
SCM
1. A Clock Monitor Reset will always set the SCME bit to logical’1’
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9.4.5
Computer Operating Properly Watchdog (COP)
WAIT(COPWAI),
STOP(PSTP,PCE),
COP enable
CR[2:0]
CR[2:0]
0:0:1
0:0:0
OSCCLK
÷
16384
0:1:0
0:1:1
1:0:0
1:0:1
1:1:0
1:1:1
÷
4
÷ 4
÷ 4
÷ 4
÷ 2
÷ 2
gating condition
= Clock Gate
COP TIMEOUT
Figure 9-21. Clock Chain for COP
The COP (free running watchdog timer) enables the user to check that a program is running and
sequencing properly. The COP is disabled out of reset. When the COP is being used, software is
responsible for keeping the COP from timing out. If the COP times out it is an indication that the software
is no longer being executed in the intended sequence; thus a system reset is initiated (see Section 9.5.2,
“Computer Operating Properly Watchdog (COP) Reset).” The COP runs with a gated OSCCLK (see
Section Figure 9-21., “Clock Chain for COP”). Three control bits in the COPCTL register allow selection
of seven COP time-out periods.
When COP is enabled, the program must write 0x0055 and 0x00AA (in this order) to the ARMCOP
register during the selected time-out period. As soon as this is done, the COP time-out period is restarted.
If the program fails to do this and the COP times out, the part will reset. Also, if any value other than
0x0055 or 0x00AA is written, the part is immediately reset.
Windowed COP operation is enabled by setting WCOP in the COPCTL register. In this mode, writes to
the ARMCOP register to clear the COP timer must occur in the last 25% of the selected time-out period.
A premature write will immediately reset the part.
If PCE bit is set, the COP will continue to run in pseudo-stop mode.
9.4.6
Real-Time Interrupt (RTI)
The RTI can be used to generate a hardware interrupt at a fixed periodic rate. If enabled (by setting
RTIE=1), this interrupt will occur at the rate selected by the RTICTL register. The RTI runs with a gated
OSCCLK (see Section Figure 9-22., “Clock Chain for RTI”). At the end of the RTI time-out period the
RTIF flag is set to 1 and a new RTI time-out period starts immediately.
A write to the RTICTL register restarts the RTI time-out period.
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If the PRE bit is set, the RTI will continue to run in pseudo-stop mode.
.
WAIT(RTIWAI),
STOP(PSTP,PRE),
RTI enable
OSCCLK
÷ 1024
RTR[6:4]
0:0:0
0:0:1
0:1:0
÷ 2
÷ 2
0:1:1
1:0:0
1:0:1
1:1:0
1:1:1
÷ 2
÷ 2
÷ 2
÷ 2
gating condition
= Clock Gate
RTI TIMEOUT
4-BIT MODULUS
COUNTER (RTR[3:0])
Figure 9-22. Clock Chain for RTI
9.4.7
Modes of Operation
Normal Mode
9.4.7.1
The CRGV4 block behaves as described within this specification in all normal modes.
9.4.7.2
Self-Clock Mode
The VCO has a minimum operating frequency, f
. If the external clock frequency is not available due
SCM
to a failure or due to long crystal start-up time, the bus clock and the core clock are derived from the VCO
running at minimum operating frequency; this mode of operation is called self-clock mode. This requires
CME = 1 and SCME = 1. If the MCU was clocked by the PLL clock prior to entering self-clock mode, the
PLLSEL bit will be cleared. If the external clock signal has stabilized again, the CRG will automatically
select OSCCLK to be the system clock and return to normal mode. See Section 9.4.4, “Clock Quality
Checker” for more information on entering and leaving self-clock mode.
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NOTE
In order to detect a potential clock loss, the CME bit should be always
enabled (CME=1).
If CME bit is disabled and the MCU is configured to run on PLL clock
(PLLCLK), a loss of external clock (OSCCLK) will not be detected and will
cause the system clock to drift towards the VCO’s minimum frequency
f
. As soon as the external clock is available again the system clock
SCM
ramps up to its PLL target frequency. If the MCU is running on external
clock any loss of clock will cause the system to go static.
9.4.8
Low-Power Operation in Run Mode
The RTI can be stopped by setting the associated rate select bits to 0.
The COP can be stopped by setting the associated rate select bits to 0.
9.4.9
Low-Power Operation in Wait Mode
The WAI instruction puts the MCU in a low power consumption stand-by mode depending on setting of
the individual bits in the CLKSEL register. All individual wait mode configuration bits can be superposed.
This provides enhanced granularity in reducing the level of power consumption during wait mode. Table 9-
10 lists the individual configuration bits and the parts of the MCU that are affected in wait mode.
Table 9-10. MCU Configuration During Wait Mode
PLLWAI
CWAI
SYSWAI
RTIWAI
COPWAI
ROAWAI
stopped
—
—
—
—
—
PLL
Core
—
—
—
—
—
stopped
stopped
stopped
—
—
—
—
—
—
—
—
—
—
—
—
System
RTI
stopped
—
—
—
stopped
—
—
COP
—
—
reduced(1)
Oscillator
1. Refer to oscillator block description for availability of a reduced oscillator amplitude.
After executing the WAI instruction the core requests the CRG to switch MCU into wait mode. The CRG
then checks whether the PLLWAI, CWAI and SYSWAI bits are asserted (see Figure 9-23). Depending on
the configuration the CRG switches the system and core clocks to OSCCLK by clearing the PLLSEL bit,
disables the PLL, disables the core clocks and finally disables the remaining system clocks. As soon as all
clocks are switched off wait mode is active.
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Core req’s
Wait Mode.
no
PLLWAI=1
?
yes
CWAI or
SYSWAI=1
?
Clear
PLLSEL,
Disable PLL
no
yes
Disable
core clocks
no
SYSWAI=1
?
yes
no
Disable
system clocks
Enter
Wait Mode
no
no
CME=1
?
INT
?
Wait Mode left
due to external
reset
yes
yes
Exit Wait w.
ext.RESET
CM fail
?
yes
Exit Wait w.
CMRESET
no
SCME=1
?
yes
Exit
Wait Mode
no
SCMIE=1
?
yes
Generate
SCM Interrupt
(Wakeup from Wait)
no
SCM=1
?
Exit
Wait Mode
yes
Enter
SCM
Enter
SCM
Continue w.
normal OP
Figure 9-23. Wait Mode Entry/Exit Sequence
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There are five different scenarios for the CRG to restart the MCU from wait mode:
•
•
•
•
•
External reset
Clock monitor reset
COP reset
Self-clock mode interrupt
Real-time interrupt (RTI)
If the MCU gets an external reset during wait mode active, the CRG asynchronously restores all
configuration bits in the register space to its default settings and starts the reset generator. After completing
the reset sequence processing begins by fetching the normal reset vector. Wait mode is exited and the MCU
is in run mode again.
If the clock monitor is enabled (CME=1) the MCU is able to leave wait mode when loss of
oscillator/external clock is detected by a clock monitor fail. If the SCME bit is not asserted the CRG
generates a clock monitor fail reset (CMRESET). The CRG’s behavior for CMRESET is the same
compared to external reset, but another reset vector is fetched after completion of the reset sequence. If the
SCME bit is asserted the CRG generates a SCM interrupt if enabled (SCMIE=1). After generating the
interrupt the CRG enters self-clock mode and starts the clock quality checker (see Section 9.4.4, “Clock
Quality Checker”). Then the MCU continues with normal operation.If the SCM interrupt is blocked by
SCMIE = 0, the SCMIF flag will be asserted and clock quality checks will be performed but the MCU will
not wake-up from wait mode.
If any other interrupt source (e.g. RTI) triggers exit from wait mode the MCU immediately continues with
normal operation. If the PLL has been powered-down during wait mode the PLLSEL bit is cleared and the
MCU runs on OSCCLK after leaving wait mode. The software must manually set the PLLSEL bit again,
in order to switch system and core clocks to the PLLCLK.
If wait mode is entered from self-clock mode, the CRG will continue to check the clock quality until clock
check is successful. The PLL and voltage regulator (VREG) will remain enabled.
Table 9-11 summarizes the outcome of a clock loss while in wait mode.
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Table 9-11. Outcome of Clock Loss in Wait Mode
CME
SCME
SCMIE
CRG Actions
0
X
X
Clock failure -->
No action, clock loss not detected.
1
1
0
1
X
0
Clock failure -->
CRG performs Clock Monitor Reset immediately
Clock failure -->
Scenario 1: OSCCLK recovers prior to exiting Wait Mode.
– MCU remains in Wait Mode,
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start Clock Quality Check,
– Set SCMIF interrupt flag.
Some time later OSCCLK recovers.
– CM no longer indicates a failure,
– 4096 OSCCLK cycles later Clock Quality Check indicates clock o.k.,
– SCM deactivated,
– PLL disabled depending on PLLWAI,
– VREG remains enabled (never gets disabled in Wait Mode).
– MCU remains in Wait Mode.
Some time later either a wakeup interrupt occurs (no SCM interrupt)
– Exit Wait Mode using OSCCLK as system clock (SYSCLK),
– Continue normal operation.
or an External Reset is applied.
– Exit Wait Mode using OSCCLK as system clock,
– Start reset sequence.
Scenario 2: OSCCLK does not recover prior to exiting Wait Mode.
– MCU remains in Wait Mode,
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start Clock Quality Check,
– Set SCMIF interrupt flag,
– Keep performing Clock Quality Checks (could continue infinitely)
while in Wait Mode.
Some time later either a wakeup interrupt occurs (no SCM interrupt)
– Exit Wait Mode in SCM using PLL clock (fSCM) as system clock,
– Continue to perform additional Clock Quality Checks until OSCCLK
is o.k. again.
or an External RESET is applied.
– Exit Wait Mode in SCM using PLL clock (fSCM) as system clock,
– Start reset sequence,
– Continue to perform additional Clock Quality Checks until OSCCLK
is o.k.again.
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Table 9-11. Outcome of Clock Loss in Wait Mode (continued)
CME
SCME
SCMIE
CRG Actions
1
1
1
Clock failure -->
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start Clock Quality Check,
– SCMIF set.
SCMIF generates Self-Clock Mode wakeup interrupt.
– Exit Wait Mode in SCM using PLL clock (fSCM) as system clock,
– Continue to perform a additional Clock Quality Checks until OSCCLK
is o.k. again.
9.4.10 Low-Power Operation in Stop Mode
All clocks are stopped in STOP mode, dependent of the setting of the PCE, PRE and PSTP bit. The
oscillator is disabled in STOP mode unless the PSTP bit is set. All counters and dividers remain frozen but
do not initialize. If the PRE or PCE bits are set, the RTI or COP continues to run in pseudo-stop mode. In
addition to disabling system and core clocks the CRG requests other functional units of the MCU (e.g.
voltage-regulator) to enter their individual power-saving modes (if available). This is the main difference
between pseudo-stop mode and wait mode.
After executing the STOP instruction the core requests the CRG to switch the MCU into stop mode. If the
PLLSEL bit remains set when entering stop mode, the CRG will switch the system and core clocks to
OSCCLK by clearing the PLLSEL bit. Then the CRG disables the PLL, disables the core clock and finally
disables the remaining system clocks. As soon as all clocks are switched off, stop mode is active.
If pseudo-stop mode (PSTP = 1) is entered from self-clock mode the CRG will continue to check the clock
quality until clock check is successful. The PLL and the voltage regulator (VREG) will remain enabled. If
full stop mode (PSTP = 0) is entered from self-clock mode an ongoing clock quality check will be stopped.
A complete timeout window check will be started when stop mode is exited again.
Wake-up from stop mode also depends on the setting of the PSTP bit.
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Core req’s
Stop Mode.
Clear
PLLSEL,
Disable PLL
Wait Mode left
due to external
Enter
Stop Mode
Exit Stop w.
ext.RESET
no
no
no
INT
?
no
yes
no
no
INT
?
CME=1
?
PSTP=1
?
yes
yes
yes
Clock
OK
?
CM fail
?
yes
Exit Stop w. no
SCME=1
?
CMRESET
yes
Exit Stop w.
CMRESET
no
SCME=1
?
yes
yes
Exit
Stop Mode
no
SCMIE=1
?
yes
Generate
SCM Interrupt
(Wakeup from Stop)
no
SCM=1
?
Exit
Stop Mode
Exit
Stop Mode
Exit
Stop Mode
yes
Enter
SCM
Enter
SCM
Enter
SCM
Continue w.
normal OP
Figure 9-24. Stop Mode Entry/Exit Sequence
9.4.10.1 Wake-Up from Pseudo-Stop (PSTP=1)
Wake-up from pseudo-stop is the same as wake-up from wait mode. There are also three different scenarios
for the CRG to restart the MCU from pseudo-stop mode:
•
•
•
External reset
Clock monitor fail
Wake-up interrupt
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If the MCU gets an external reset during pseudo-stop mode active, the CRG asynchronously restores all
configuration bits in the register space to its default settings and starts the reset generator. After completing
the reset sequence processing begins by fetching the normal reset vector. Pseudo-stop mode is exited and
the MCU is in run mode again.
If the clock monitor is enabled (CME = 1) the MCU is able to leave pseudo-stop mode when loss of
oscillator/external clock is detected by a clock monitor fail. If the SCME bit is not asserted the CRG
generates a clock monitor fail reset (CMRESET). The CRG’s behavior for CMRESET is the same
compared to external reset, but another reset vector is fetched after completion of the reset sequence. If the
SCME bit is asserted the CRG generates a SCM interrupt if enabled (SCMIE=1). After generating the
interrupt the CRG enters self-clock mode and starts the clock quality checker (see Section 9.4.4, “Clock
Quality Checker”). Then the MCU continues with normal operation. If the SCM interrupt is blocked by
SCMIE = 0, the SCMIF flag will be asserted but the CRG will not wake-up from pseudo-stop mode.
If any other interrupt source (e.g. RTI) triggers exit from pseudo-stop mode the MCU immediately
continues with normal operation. Because the PLL has been powered-down during stop mode the PLLSEL
bit is cleared and the MCU runs on OSCCLK after leaving stop mode. The software must set the PLLSEL
bit again, in order to switch system and core clocks to the PLLCLK.
Table 9-12 summarizes the outcome of a clock loss while in pseudo-stop mode.
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Table 9-12. Outcome of Clock Loss in Pseudo-Stop Mode
CME SCME SCMIE
CRG Actions
0
1
1
X
0
1
X
X
0
Clock failure -->
No action, clock loss not detected.
Clock failure -->
CRG performs Clock Monitor Reset immediately
Clock Monitor failure -->
Scenario 1: OSCCLK recovers prior to exiting Pseudo-Stop Mode.
– MCU remains in Pseudo-Stop Mode,
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start Clock Quality Check,
– Set SCMIF interrupt flag.
Some time later OSCCLK recovers.
– CM no longer indicates a failure,
– 4096 OSCCLK cycles later Clock Quality Check indicates clock o.k.,
– SCM deactivated,
– PLL disabled,
– VREG disabled.
– MCU remains in Pseudo-Stop Mode.
Some time later either a wakeup interrupt occurs (no SCM interrupt)
– Exit Pseudo-Stop Mode using OSCCLK as system clock (SYSCLK),
– Continue normal operation.
or an External Reset is applied.
– Exit Pseudo-Stop Mode using OSCCLK as system clock,
– Start reset sequence.
Scenario 2: OSCCLK does not recover prior to exiting Pseudo-Stop Mode.
– MCU remains in Pseudo-Stop Mode,
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start Clock Quality Check,
– Set SCMIF interrupt flag,
– Keep performing Clock Quality Checks (could continue infinitely)
while in Pseudo-Stop Mode.
Some time later either a wakeup interrupt occurs (no SCM interrupt)
– Exit Pseudo-Stop Mode in SCM using PLL clock (fSCM) as system clock
– Continue to perform additional Clock Quality Checks until OSCCLK
is o.k. again.
or an External RESET is applied.
– Exit Pseudo-Stop Mode in SCM using PLL clock (fSCM) as system clock
– Start reset sequence,
– Continue to perform additional Clock Quality Checks until OSCCLK
is o.k.again.
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Table 9-12. Outcome of Clock Loss in Pseudo-Stop Mode (continued)
CME SCME SCMIE
CRG Actions
1
1
1
Clock failure -->
– VREG enabled,
– PLL enabled,
– SCM activated,
– Start Clock Quality Check,
– SCMIF set.
SCMIF generates Self-Clock Mode wakeup interrupt.
– Exit Pseudo-Stop Mode in SCM using PLL clock (fSCM) as system clock,
– Continue to perform a additional Clock Quality Checks until OSCCLK
is o.k. again.
9.4.10.2 Wake-up from Full Stop (PSTP=0)
The MCU requires an external interrupt or an external reset in order to wake-up from stop mode.
If the MCU gets an external reset during full stop mode active, the CRG asynchronously restores all
configuration bits in the register space to its default settings and will perform a maximum of 50 clock
check_windows (see Section 9.4.4, “Clock Quality Checker”). After completing the clock quality check
the CRG starts the reset generator. After completing the reset sequence processing begins by fetching the
normal reset vector. Full stop mode is exited and the MCU is in run mode again.
If the MCU is woken-up by an interrupt, the CRG will also perform a maximum of 50 clock
check_windows (see Section 9.4.4, “Clock Quality Checker”). If the clock quality check is successful, the
CRG will release all system and core clocks and will continue with normal operation. If all clock checks
within the timeout-window are failing, the CRG will switch to self-clock mode or generate a clock monitor
reset (CMRESET) depending on the setting of the SCME bit.
Because the PLL has been powered-down during stop mode the PLLSEL bit is cleared and the MCU runs
on OSCCLK after leaving stop mode. The software must manually set the PLLSEL bit again, in order to
switch system and core clocks to the PLLCLK.
NOTE
In full stop mode, the clock monitor is disabled and any loss of clock will
not be detected.
9.5
Resets
This section describes how to reset the CRGV4 and how the CRGV4 itself controls the reset of the MCU.
It explains all special reset requirements. Because the reset generator for the MCU is part of the CRG, this
section also describes all automatic actions that occur during or as a result of individual reset conditions.
The reset values of registers and signals are provided in Section 9.3, “Memory Map and Register
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Definition.” All reset sources are listed in Table 9-13. Refer to the device overview chapter for related
vector addresses and priorities.
Table 9-13. Reset Summary
Reset Source
Local Enable
Power-on Reset
Low Voltage Reset
External Reset
None
None
None
Clock Monitor Reset
PLLCTL (CME=1, SCME=0)
COP Watchdog Reset COPCTL (CR[2:0] nonzero)
The reset sequence is initiated by any of the following events:
•
•
•
•
•
Low level is detected at the RESET pin (external reset).
Power on is detected.
Low voltage is detected.
COP watchdog times out.
Clock monitor failure is detected and self-clock mode was disabled (SCME = 0).
Upon detection of any reset event, an internal circuit drives the RESET pin low for 128 SYSCLK cycles
(see Figure 9-25). Because entry into reset is asynchronous it does not require a running SYSCLK.
However, the internal reset circuit of the CRGV4 cannot sequence out of current reset condition without a
running SYSCLK. The number of 128 SYSCLK cycles might be increased by n = 3 to 6 additional
SYSCLK cycles depending on the internal synchronization latency. After 128+n SYSCLK cycles the
RESET pin is released. The reset generator of the CRGV4 waits for additional 64 SYSCLK cycles and
then samples the RESET pin to determine the originating source. Table 9-14 shows which vector will be
fetched.
Table 9-14. Reset Vector Selection
Sampled RESET Pin
(64 Cycles After
Release)
Clock Monitor
Reset Pending
COP Reset
Pending
Vector Fetch
1
1
1
0
0
1
0
X
0
X
1
POR / LVR / External Reset
Clock Monitor Reset
COP Reset
X
POR / LVR / External Reset
with rise of RESET pin
NOTE
External circuitry connected to the RESET pin should not include a large
capacitance that would interfere with the ability of this signal to rise to a
valid logic 1 within 64 SYSCLK cycles after the low drive is released.
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The internal reset of the MCU remains asserted while the reset generator completes the 192 SYSCLK long
reset sequence. The reset generator circuitry always makes sure the internal reset is deasserted
synchronously after completion of the 192 SYSCLK cycles. In case the RESET pin is externally driven
low for more than these 192 SYSCLK cycles (external reset), the internal reset remains asserted too.
RESET
) (
) (
CRG drives RESET pin low
RESET pin
released
)
(
)
)
(
SYSCLK
(
128+n cycles
with n being
min 3 / max 6
cycles depending
on internal
64 cycles
possibly
SYSCLK
not
possibly
RESET
driven low
externally
running
synchronization
delay
Figure 9-25. RESET Timing
9.5.1
Clock Monitor Reset
The CRGV4 generates a clock monitor reset in case all of the following conditions are true:
•
•
•
Clock monitor is enabled (CME=1)
Loss of clock is detected
Self-clock mode is disabled (SCME=0)
The reset event asynchronously forces the configuration registers to their default settings (see Section 9.3,
“Memory Map and Register Definition”). In detail the CME and the SCME are reset to logical ‘1’ (which
doesn’t change the state of the CME bit, because it has already been set). As a consequence, the CRG
immediately enters self-clock mode and starts its internal reset sequence. In parallel the clock quality
check starts. As soon as clock quality check indicates a valid oscillator clock the CRG switches to
OSCCLK and leaves self-clock mode. Because the clock quality checker is running in parallel to the reset
generator, the CRG may leave self-clock mode while completing the internal reset sequence. When the
reset sequence is finished the CRG checks the internally latched state of the clock monitor fail circuit. If a
clock monitor fail is indicated processing begins by fetching the clock monitor reset vector.
9.5.2
Computer Operating Properly Watchdog (COP) Reset
When COP is enabled, the CRG expects sequential write of 0x0055 and 0x00AA (in this order) to the
ARMCOP register during the selected time-out period. As soon as this is done, the COP time-out period
restarts. If the program fails to do this the CRG will generate a reset. Also, if any value other than 0x0055
or 0x00AA is written, the CRG immediately generates a reset. In case windowed COP operation is enabled
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writes (0x0055 or 0x00AA) to the ARMCOP register must occur in the last 25% of the selected time-out
period. A premature write the CRG will immediately generate a reset.
As soon as the reset sequence is completed the reset generator checks the reset condition. If no clock
monitor failure is indicated and the latched state of the COP timeout is true, processing begins by fetching
the COP vector.
9.5.3
Power-On Reset, Low Voltage Reset
The on-chip voltage regulator detects when V to the MCU has reached a certain level and asserts power-
DD
on reset or low voltage reset or both. As soon as a power-on reset or low voltage reset is triggered the CRG
performs a quality check on the incoming clock signal. As soon as clock quality check indicates a valid
oscillator clock signal the reset sequence starts using the oscillator clock. If after 50 check windows the
clock quality check indicated a non-valid oscillator clock the reset sequence starts using self-clock mode.
Figure 9-26 and Figure 9-27 show the power-up sequence for cases when the RESET pin is tied to V
and when the RESET pin is held low.
DD
Clock Quality Check
(no Self-Clock Mode)
RESET
) (
Internal POR
) (
128 SYSCLK
Internal RESET
64 SYSCLK
) (
Figure 9-26. RESET Pin Tied to V (by a Pull-Up Resistor)
DD
Clock Quality Check
(no Self-Clock Mode)
RESET
) (
Internal POR
) (
128 SYSCLK
64 SYSCLK
Internal RESET
) (
Figure 9-27. RESET Pin Held Low Externally
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9.6
Interrupts
The interrupts/reset vectors requested by the CRG are listed in Table 9-15. Refer to the device overview
chapter for related vector addresses and priorities.
Table 9-15. CRG Interrupt Vectors
CCR
Interrupt Source
Local Enable
Mask
Real-time interrupt
LOCK interrupt
SCM interrupt
I bit
I bit
I bit
CRGINT (RTIE)
CRGINT (LOCKIE)
CRGINT (SCMIE)
9.6.1
Real-Time Interrupt
The CRGV4 generates a real-time interrupt when the selected interrupt time period elapses. RTI interrupts
are locally disabled by setting the RTIE bit to 0. The real-time interrupt flag (RTIF) is set to 1 when a
timeout occurs, and is cleared to 0 by writing a 1 to the RTIF bit.
The RTI continues to run during pseudo-stop mode if the PRE bit is set to 1. This feature can be used for
periodic wakeup from pseudo-stop if the RTI interrupt is enabled.
9.6.2
PLL Lock Interrupt
The CRGV4 generates a PLL lock interrupt when the LOCK condition of the PLL has changed, either
from a locked state to an unlocked state or vice versa. Lock interrupts are locally disabled by setting the
LOCKIE bit to 0. The PLL Lock interrupt flag (LOCKIF) is set to1 when the LOCK condition has
changed, and is cleared to 0 by writing a 1 to the LOCKIF bit.
9.6.3
Self-Clock Mode Interrupt
The CRGV4 generates a self-clock mode interrupt when the SCM condition of the system has changed,
either entered or exited self-clock mode. SCM conditions can only change if the self-clock mode enable
bit (SCME) is set to 1. SCM conditions are caused by a failing clock quality check after power-on reset
(POR) or low voltage reset (LVR) or recovery from full stop mode (PSTP = 0) or clock monitor failure.
For details on the clock quality check refer to Section 9.4.4, “Clock Quality Checker.” If the clock monitor
is enabled (CME = 1) a loss of external clock will also cause a SCM condition (SCME = 1).
SCM interrupts are locally disabled by setting the SCMIE bit to 0. The SCM interrupt flag (SCMIF) is set
to 1 when the SCM condition has changed, and is cleared to 0 by writing a 1 to the SCMIF bit.
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Freescale’s Scalable Controller Area Network
(S12MSCANV2)
10.1 Introduction
Freescale’s scalable controller area network (S12MSCANV2) definition is based on the MSCAN12
definition, which is the specific implementation of the MSCAN concept targeted for the M68HC12
microcontroller family.
The module is a communication controller implementing the CAN 2.0A/B protocol as defined in the
Bosch specification dated September 1991. For users to fully understand the MSCAN specification, it is
recommended that the Bosch specification be read first to familiarize the reader with the terms and
concepts contained within this document.
Though not exclusively intended for automotive applications, CAN protocol is designed to meet the
specific requirements of a vehicle serial data bus: real-time processing, reliable operation in the EMI
environment of a vehicle, cost-effectiveness, and required bandwidth.
MSCAN uses an advanced buffer arrangement resulting in predictable real-time behavior and simplified
application software.
10.1.1 Glossary
ACK: Acknowledge of CAN message
CAN: Controller Area Network
CRC: Cyclic Redundancy Code
EOF: End of Frame
FIFO: First-In-First-Out Memory
IFS: Inter-Frame Sequence
SOF: Start of Frame
CPU bus: CPU related read/write data bus
CAN bus: CAN protocol related serial bus
oscillator clock: Direct clock from external oscillator
bus clock: CPU bus realated clock
CAN clock: CAN protocol related clock
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10.1.2 Block Diagram
MSCAN
CANCLK
Oscillator Clock
Tq Clk
MUX
Presc.
Bus Clock
RXCAN
TXCAN
Receive/
Transmit
Engine
Transmit Interrupt Req.
Receive Interrupt Req.
Errors Interrupt Req.
Wake-Up Interrupt Req.
Message
Filtering
and
Control
and
Status
Buffering
Configuration
Registers
Wake-Up
Low Pass Filter
Figure 10-1. MSCAN Block Diagram
10.1.3 Features
The basic features of the MSCAN are as follows:
•
Implementation of the CAN protocol — Version 2.0A/B
— Standard and extended data frames
— Zero to eight bytes data length
1
— Programmable bit rate up to 1 Mbps
— Support for remote frames
•
•
•
Five receive buffers with FIFO storage scheme
Three transmit buffers with internal prioritization using a “local priority” concept
Flexible maskable identifier filter supports two full-size (32-bit) extended identifier filters, or four
16-bit filters, or eight 8-bit filters
•
•
•
•
Programmable wakeup functionality with integrated low-pass filter
Programmable loopback mode supports self-test operation
Programmable listen-only mode for monitoring of CAN bus
Separate signalling and interrupt capabilities for all CAN receiver and transmitter error states
(warning, error passive, bus-off)
•
•
•
•
Programmable MSCAN clock source either bus clock or oscillator clock
Internal timer for time-stamping of received and transmitted messages
Three low-power modes: sleep, power down, and MSCAN enable
Global initialization of configuration registers
1. Depending on the actual bit timing and the clock jitter of the PLL.
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10.1.4 Modes of Operation
The following modes of operation are specific to the MSCAN. See Section 10.4, “Functional Description,”
for details.
•
•
•
•
Listen-Only Mode
MSCAN Sleep Mode
MSCAN Initialization Mode
MSCAN Power Down Mode
10.2 External Signal Description
The MSCAN uses two external pins:
10.2.1 RXCAN — CAN Receiver Input Pin
RXCAN is the MSCAN receiver input pin.
10.2.2 TXCAN — CAN Transmitter Output Pin
TXCAN is the MSCAN transmitter output pin. The TXCAN output pin represents the logic level on the
CAN bus:
0 = Dominant state
1 = Recessive state
10.2.3 CAN System
A typical CAN system with MSCAN is shown in Figure 10-2. Each CAN station is connected physically
to the CAN bus lines through a transceiver device. The transceiver is capable of driving the large current
needed for the CAN bus and has current protection against defective CAN or defective stations.
CAN node 2
CAN node n
CAN node 1
MCU
CAN Controller
(MSCAN)
TXCAN
RXCAN
Transceiver
CAN_H
CAN_L
CAN Bus
Figure 10-2. CAN System
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10.3 Memory Map and Register Definition
This section provides a detailed description of all registers accessible in the MSCAN.
10.3.1 Module Memory Map
Figure 10-3 gives an overview on all registers and their individual bits in the MSCAN memory map. The
register address results from the addition of base address and address offset. The base address is
determined at the MCU level and can be found in the MCU memory map description. The address offset
is defined at the module level.
The MSCAN occupies 64 bytes in the memory space. The base address of the MSCAN module is
determined at the MCU level when the MCU is defined. The register decode map is fixed and begins at the
first address of the module address offset.
The detailed register descriptions follow in the order they appear in the register map.
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Register
Name
Bit 7
RXFRM
CANE
SJW1
6
5
4
3
2
1
Bit 0
0x0000
CANCTL0
R
RXACT
SYNCH
CSWAI
LOOPB
BRP5
TIME
WUPE
WUPM
BRP2
SLPRQ
SLPAK
INITRQ
INITAK
W
0x0001
CANCTL1
R
CLKSRC
SJW0
LISTEN
BRP4
W
0x0002
CANBTR0
R
BRP3
BRP1
TSEG11
OVRIF
OVRIE
TXE1
BRP0
TSEG10
RXF
W
0x0003
CANBTR1
R
SAMP
WUPIF
TSEG22
CSCIF
TSEG21
RSTAT1
TSEG20
RSTAT0
TSEG13
TSTAT1
TSEG12
TSTAT0
W
0x0004
CANRFLG
R
W
0x0005
CANRIER
R
WUPIE
0
CSCIE
0
RSTATE1 RSTATE0
TSTATE1
0
TSTATE0
TXE2
RXFIE
TXE0
W
0x0006
CANTFLG
R
0
0
0
0
0
0
0
0
0
0
W
0x0007
CANTIER
R
0
0
0
TXEIE2
TXEIE1
TXEIE0
W
0x0008
CANTARQ
R
0
0
0
ABTRQ2
ABTAK2
ABTRQ1
ABTAK1
ABTRQ0
ABTAK0
W
0x0009
CANTAAK
R
0
0
0
W
0x000A
CANTBSEL
R
0
0
0
TX2
TX1
TX0
W
0x000B
CANIDAC
R
0
0
0
IDHIT2
IDHIT1
IDHIT0
IDAM1
0
IDAM0
0
W
0x000C–0x000D
Reserved
R
0
0
0
0
0
0
W
0x000E
CANRXERR
R
RXERR7
TXERR7
RXERR6
TXERR6
RXERR5
TXERR5
RXERR4
TXERR4
RXERR3
TXERR3
RXERR2
TXERR2
RXERR1
TXERR1
RXERR0
TXERR0
W
0x000F
R
CANTXERR
W
= Unimplemented or Reserved
u = Unaffected
Figure 10-3. MSCAN Register Summary
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Register
Bit 7
AC7
AM7
AC7
AM7
6
5
4
3
2
1
Bit 0
AC0
AM0
AC0
AM0
Name
0x0010–0x0013
CANIDAR0–3
R
AC6
AM6
AC6
AM6
AC5
AM5
AC5
AM5
AC4
AM4
AC4
AM4
AC3
AM3
AC3
AM3
AC2
AM2
AC2
AM2
AC1
AM1
AC1
AM1
W
0x0014–0x0017
CANIDMRx
R
W
0x0018–0x001B
CANIDAR4–7
R
W
0x001C–0x001F
CANIDMR4–7
R
W
0x0020–0x002F
CANRXFG
R
See Section 10.3.3, “Programmer’s Model of Message Storage”
See Section 10.3.3, “Programmer’s Model of Message Storage”
W
0x0030–0x003F
CANTXFG
R
W
= Unimplemented or Reserved
u = Unaffected
Figure 10-3. MSCAN Register Summary (continued)
10.3.2 Register Descriptions
This section describes in detail all the registers and register bits in the MSCAN module. Each description
includes a standard register diagram with an associated figure number. Details of register bit and field
function follow the register diagrams, in bit order. All bits of all registers in this module are completely
synchronous to internal clocks during a register read.
10.3.2.1 MSCAN Control Register 0 (CANCTL0)
The CANCTL0 register provides various control bits of the MSCAN module as described below.
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
RXACT
SYNCH
RXFRM
CSWAI
TIME
WUPE
SLPRQ
INITRQ
Reset:
0
0
0
0
0
0
0
1
= Unimplemented
Figure 10-4. MSCAN Control Register 0 (CANCTL0)
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NOTE
The CANCTL0 register, except WUPE, INITRQ, and SLPRQ, is held in the
reset state when the initialization mode is active (INITRQ = 1 and
INITAK = 1). This register is writable again as soon as the initialization
mode is exited (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime when out of initialization mode; exceptions are read-only RXACT and SYNCH, RXFRM
(which is set by the module only), and INITRQ (which is also writable in initialization mode).
Table 10-1. CANCTL0 Register Field Descriptions
Field
Description
7
Received Frame Flag — This bit is read and clear only. It is set when a receiver has received a valid message
RXFRM(1) correctly, independently of the filter configuration. After it is set, it remains set until cleared by software or reset.
Clearing is done by writing a 1. Writing a 0 is ignored. This bit is not valid in loopback mode.
0 No valid message was received since last clearing this flag
1 A valid message was received since last clearing of this flag
6
Receiver Active Status — This read-only flag indicates the MSCAN is receiving a message. The flag is
controlled by the receiver front end. This bit is not valid in loopback mode.
0 MSCAN is transmitting or idle2
RXACT
1 MSCAN is receiving a message (including when arbitration is lost)(2)
5
CAN Stops in Wait Mode — Enabling this bit allows for lower power consumption in wait mode by disabling all
CSWAI(3) the clocks at the CPU bus interface to the MSCAN module.
0 The module is not affected during wait mode
1 The module ceases to be clocked during wait mode
4
Synchronized Status — This read-only flag indicates whether the MSCAN is synchronized to the CAN bus and
able to participate in the communication process. It is set and cleared by the MSCAN.
0 MSCAN is not synchronized to the CAN bus
SYNCH
1 MSCAN is synchronized to the CAN bus
3
Timer Enable — This bit activates an internal 16-bit wide free running timer which is clocked by the bit clock rate.
If the timer is enabled, a 16-bit time stamp will be assigned to each transmitted/received message within the
active TX/RX buffer. Right after the EOF of a valid message on the CAN bus, the time stamp is written to the
highest bytes (0x000E, 0x000F) in the appropriate buffer (see Section 10.3.3, “Programmer’s Model of Message
Storage”). The internal timer is reset (all bits set to 0) when disabled. This bit is held low in initialization mode.
0 Disable internal MSCAN timer
TIME
1 Enable internal MSCAN timer
2
Wake-Up Enable — This configuration bit allows the MSCAN to restart from sleep mode when traffic on CAN is
detected (see Section 10.4.5.4, “MSCAN Sleep Mode”).
WUPE(4)
0 Wake-up disabled — The MSCAN ignores traffic on CAN
1 Wake-up enabled — The MSCAN is able to restart
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Table 10-1. CANCTL0 Register Field Descriptions (continued)
Field
Description
1
Sleep Mode Request — This bit requests the MSCAN to enter sleep mode, which is an internal power saving
SLPRQ(5) mode (see Section 10.4.5.4, “MSCAN Sleep Mode”). The sleep mode request is serviced when the CAN bus is
idle, i.e., the module is not receiving a message and all transmit buffers are empty. The module indicates entry
to sleep mode by setting SLPAK = 1 (see Section 10.3.2.2, “MSCAN Control Register 1 (CANCTL1)”). SLPRQ
cannot be set while the WUPIF flag is set (see Section 10.3.2.5, “MSCAN Receiver Flag Register (CANRFLG)”).
Sleep mode will be active until SLPRQ is cleared by the CPU or, depending on the setting of WUPE, the MSCAN
detects activity on the CAN bus and clears SLPRQ itself.
0 Running — The MSCAN functions normally
1 Sleep mode request — The MSCAN enters sleep mode when CAN bus idle
0
Initialization Mode Request — When this bit is set by the CPU, the MSCAN skips to initialization mode (see
INITRQ(6),(7) Section 10.4.5.5, “MSCAN Initialization Mode”). Any ongoing transmission or reception is aborted and
synchronization to the CAN bus is lost. The module indicates entry to initialization mode by setting INITAK = 1
(Section 10.3.2.2, “MSCAN Control Register 1 (CANCTL1)”).
The following registers enter their hard reset state and restore their default values: CANCTL0(8), CANRFLG(9)
CANRIER(10), CANTFLG, CANTIER, CANTARQ, CANTAAK, and CANTBSEL.
The registers CANCTL1, CANBTR0, CANBTR1, CANIDAC, CANIDAR0-7, and CANIDMR0-7 can only be
written by the CPU when the MSCAN is in initialization mode (INITRQ = 1 and INITAK = 1). The values of the
error counters are not affected by initialization mode.
,
When this bit is cleared by the CPU, the MSCAN restarts and then tries to synchronize to the CAN bus. If the
MSCAN is not in bus-off state, it synchronizes after 11 consecutive recessive bits on the CAN bus; if the MSCAN
is in bus-off state, it continues to wait for 128 occurrences of 11 consecutive recessive bits.
Writing to otherbits in CANCTL0, CANRFLG, CANRIER, CANTFLG, or CANTIER must be done only after
initialization mode is exited, which is INITRQ = 0 and INITAK = 0.
0 Normal operation
1 MSCAN in initialization mode
1. The MSCAN must be in normal mode for this bit to become set.
2. See the Bosch CAN 2.0A/B specification for a detailed definition of transmitter and receiver states.
3. In order to protect from accidentally violating the CAN protocol, the TXCAN pin is immediately forced to a recessive state when
the CPU enters wait (CSWAI = 1) or stop mode (see Section 10.4.5.2, “Operation in Wait Mode” and Section 10.4.5.3,
“Operation in Stop Mode”).
4. The CPU has to make sure that the WUPE register and the WUPIE wake-up interrupt enable register (see Section 10.3.2.6,
“MSCAN Receiver Interrupt Enable Register (CANRIER)) is enabled, if the recovery mechanism from stop or wait is required.
5. The CPU cannot clear SLPRQ before the MSCAN has entered sleep mode (SLPRQ = 1 and SLPAK = 1).
6. The CPU cannot clear INITRQ before the MSCAN has entered initialization mode (INITRQ = 1 and INITAK = 1).
7. In order to protect from accidentally violating the CAN protocol, the TXCAN pin is immediately forced to a recessive state when
the initialization mode is requested by the CPU. Thus, the recommended procedure is to bring the MSCAN into sleep mode
(SLPRQ = 1 and SLPAK = 1) before requesting initialization mode.
8. Not including WUPE, INITRQ, and SLPRQ.
9. TSTAT1 and TSTAT0 are not affected by initialization mode.
10. RSTAT1 and RSTAT0 are not affected by initialization mode.
10.3.2.2 MSCAN Control Register 1 (CANCTL1)
The CANCTL1 register provides various control bits and handshake status information of the MSCAN
module as described below.
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Module Base + 0x0001
7
6
5
4
3
2
1
0
R
SLPAK
INITAK
CANE
W
CLKSRC
LOOPB
LISTEN
WUPM
Reset:
0
0
0
1
0
0
0
1
= Unimplemented
Figure 10-5. MSCAN Control Register 1 (CANCTL1)
Read: Anytime
Write: Anytime when INITRQ = 1 and INITAK = 1, except CANE which is write once in normal and
anytime in special system operation modes when the MSCAN is in initialization mode (INITRQ = 1 and
INITAK = 1).
Table 10-2. CANCTL1 Register Field Descriptions
Field
Description
7
MSCAN Enable
CANE
0 MSCAN module is disabled
1 MSCAN module is enabled
6
MSCAN Clock Source — This bit defines the clock source for the MSCAN module (only for systems with a clock
generation module; Section 10.4.3.2, “Clock System,” and Section Figure 10-42., “MSCAN Clocking Scheme,”).
0 MSCAN clock source is the oscillator clock
CLKSRC
1 MSCAN clock source is the bus clock
5
Loopback Self Test Mode — When this bit is set, the MSCAN performs an internal loopback which can be used
for self test operation. The bit stream output of the transmitter is fed back to the receiver internally. The RXCAN
input pin is ignored and the TXCAN output goes to the recessive state (logic 1). The MSCAN behaves as it does
normally when transmitting and treats its own transmitted message as a message received from a remote node.
In this state, the MSCAN ignores the bit sent during the ACK slot in the CAN frame acknowledge field to ensure
proper reception of its own message. Both transmit and receive interrupts are generated.
0 Loopback self test disabled
LOOPB
1 Loopback self test enabled
4
Listen Only Mode — This bit configures the MSCAN as a CAN bus monitor. When LISTEN is set, all valid CAN
messages with matching ID are received, but no acknowledgement or error frames are sent out (see
Section 10.4.4.4, “Listen-Only Mode”). In addition, the error counters are frozen. Listen only mode supports
applications which require “hot plugging” or throughput analysis. The MSCAN is unable to transmit any
messages when listen only mode is active.
LISTEN
0 Normal operation
1 Listen only mode activated
2
Wake-Up Mode — If WUPE in CANCTL0 is enabled, this bit defines whether the integrated low-pass filter is
applied to protect the MSCAN from spurious wake-up (see Section 10.4.5.4, “MSCAN Sleep Mode”).
0 MSCAN wakes up on any dominant level on the CAN bus
WUPM
1 MSCAN wakes up only in case of a dominant pulse on the CAN bus that has a length of Twup
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Table 10-2. CANCTL1 Register Field Descriptions (continued)
Field
Description
1
Sleep Mode Acknowledge — This flag indicates whether the MSCAN module has entered sleep mode (see
Section 10.4.5.4, “MSCAN Sleep Mode”). It is used as a handshake flag for the SLPRQ sleep mode request.
Sleep mode is active when SLPRQ = 1 and SLPAK = 1. Depending on the setting of WUPE, the MSCAN will
clear the flag if it detects activity on the CAN bus while in sleep mode.
SLPAK
0 Running — The MSCAN operates normally
1 Sleep mode active — The MSCAN has entered sleep mode
0
Initialization Mode Acknowledge — This flag indicates whether the MSCAN module is in initialization mode
(see Section 10.4.5.5, “MSCAN Initialization Mode”). It is used as a handshake flag for the INITRQ initialization
mode request. Initialization mode is active when INITRQ = 1 and INITAK = 1. The registers CANCTL1,
CANBTR0, CANBTR1, CANIDAC, CANIDAR0–CANIDAR7, and CANIDMR0–CANIDMR7 can be written only by
the CPU when the MSCAN is in initialization mode.
INITAK
0 Running — The MSCAN operates normally
1 Initialization mode active — The MSCAN has entered initialization mode
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10.3.2.3 MSCAN Bus Timing Register 0 (CANBTR0)
The CANBTR0 register configures various CAN bus timing parameters of the MSCAN module.
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
SJW1
SJW0
BRP5
BRP4
BRP3
BRP2
BRP1
BRP0
Reset:
0
0
0
0
0
0
0
0
Figure 10-6. MSCAN Bus Timing Register 0 (CANBTR0)
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 10-3. CANBTR0 Register Field Descriptions
Field
Description
7:6
SJW[1:0]
Synchronization Jump Width — The synchronization jump width defines the maximum number of time quanta
(Tq) clock cycles a bit can be shortened or lengthened to achieve resynchronization to data transitions on the
CAN bus (see Table 10-4).
5:0
Baud Rate Prescaler — These bits determine the time quanta (Tq) clock which is used to build up the bit timing
BRP[5:0]
(see Table 10-5).
Table 10-4. Synchronization Jump Width
SJW1
SJW0
Synchronization Jump Width
0
0
1
1
0
1
0
1
1 Tq clock cycle
2 Tq clock cycles
3 Tq clock cycles
4 Tq clock cycles
Table 10-5. Baud Rate Prescaler
BRP5
BRP4
BRP3
BRP2
BRP1
BRP0
Prescaler value (P)
0
0
0
0
:
0
0
0
0
:
0
0
0
0
:
0
0
0
0
:
0
0
1
1
:
0
1
0
1
:
1
2
3
4
:
1
1
1
1
1
1
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10.3.2.4 MSCAN Bus Timing Register 1 (CANBTR1)
The CANBTR1 register configures various CAN bus timing parameters of the MSCAN module.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
SAMP
TSEG22
TSEG21
TSEG20
TSEG13
TSEG12
TSEG11
TSEG10
Reset:
0
0
0
0
0
0
0
0
Figure 10-7. MSCAN Bus Timing Register 1 (CANBTR1)
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 10-6. CANBTR1 Register Field Descriptions
Field
Description
7
Sampling — This bit determines the number of CAN bus samples taken per bit time.
SAMP
0 One sample per bit.
1 Three samples per bit(1)
.
If SAMP = 0, the resulting bit value is equal to the value of the single bit positioned at the sample point. If
SAMP = 1, the resulting bit value is determined by using majority rule on the three total samples. For higher bit
rates, it is recommended that only one sample is taken per bit time (SAMP = 0).
6:4
Time Segment 2 — Time segments within the bit time fix the number of clock cycles per bit time and the location
TSEG2[2:0] of the sample point (see Figure 10-43). Time segment 2 (TSEG2) values are programmable as shown in
Table 10-7.
3:0
Time Segment 1 — Time segments within the bit time fix the number of clock cycles per bit time and the location
TSEG1[3:0] of the sample point (see Figure 10-43). Time segment 1 (TSEG1) values are programmable as shown in
Table 10-8.
1. In this case, PHASE_SEG1 must be at least 2 time quanta (Tq).
Table 10-7. Time Segment 2 Values
TSEG22
TSEG21
TSEG20
Time Segment 2
0
0
:
0
0
:
0
1
:
1 Tq clock cycle(1)
2 Tq clock cycles
:
1
1
1
1
0
1
7 Tq clock cycles
8 Tq clock cycles
1. This setting is not valid. Please refer to Table 10-34 for valid settings.
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Table 10-8. Time Segment 1 Values
TSEG13
TSEG12
TSEG11
TSEG10
Time segment 1
0
0
0
0
:
0
0
0
0
:
0
0
1
1
:
0
1
0
1
:
1 Tq clock cycle(1)
2 Tq clock cycles1
3 Tq clock cycles1
4 Tq clock cycles
:
1
1
1
1
1
1
0
1
15 Tq clock cycles
16 Tq clock cycles
1. This setting is not valid. Please refer to Table 10-34 for valid settings.
The bit time is determined by the oscillator frequency, the baud rate prescaler, and the number of time
quanta (Tq) clock cycles per bit (as shown in Table 10-7 and Table 10-8).
Eqn. 10-1
(Prescaler value)
-----------------------------------------------------
f
Bit Time=
• (1 + TimeSegment1 + TimeSegment2)
CANCLK
10.3.2.5 MSCAN Receiver Flag Register (CANRFLG)
A flag can be cleared only by software (writing a 1 to the corresponding bit position) when the condition
which caused the setting is no longer valid. Every flag has an associated interrupt enable bit in the
CANRIER register.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
RSTAT1
RSTAT0
TSTAT1
TSTAT0
WUPIF
CSCIF
OVRIF
RXF
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 10-8. MSCAN Receiver Flag Register (CANRFLG)
NOTE
1
The CANRFLG register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1). This register is writable again
as soon as the initialization mode is exited (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime when out of initialization mode, except RSTAT[1:0] and TSTAT[1:0] flags which are read-
only; write of 1 clears flag; write of 0 is ignored.
1. The RSTAT[1:0], TSTAT[1:0] bits are not affected by initialization mode.
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Table 10-9. CANRFLG Register Field Descriptions
Field
Description
7
Wake-Up Interrupt Flag — If the MSCAN detects CAN bus activity while in sleep mode (see Section 10.4.5.4,
“MSCAN Sleep Mode,”) and WUPE = 1 in CANTCTL0 (see Section 10.3.2.1, “MSCAN Control Register 0
(CANCTL0)”), the module will set WUPIF. If not masked, a wake-up interrupt is pending while this flag is set.
WUPIF
0
1
No wake-up activity observed while in sleep mode
MSCAN detected activity on the CAN bus and requested wake-up
6
CAN Status Change Interrupt Flag — This flag is set when the MSCAN changes its current CAN bus status
due to the actual value of the transmit error counter (TEC) and the receive error counter (REC). An additional 4-
bit (RSTAT[1:0], TSTAT[1:0]) status register, which is split into separate sections for TEC/REC, informs the system
on the actual CAN bus status (see Section 10.3.2.6, “MSCAN Receiver Interrupt Enable Register (CANRIER)”).
If not masked, an error interrupt is pending while this flag is set. CSCIF provides a blocking interrupt. That
guarantees that the receiver/transmitter status bits (RSTAT/TSTAT) are only updated when no CAN status change
interrupt is pending. If the TECs/RECs change their current value after the CSCIF is asserted, which would cause
an additional state change in the RSTAT/TSTAT bits, these bits keep their status until the current CSCIF interrupt
is cleared again.
CSCIF
0
1
No change in CAN bus status occurred since last interrupt
MSCAN changed current CAN bus status
5:4
Receiver Status Bits — The values of the error counters control the actual CAN bus status of the MSCAN. As
RSTAT[1:0] soon as the status change interrupt flag (CSCIF) is set, these bits indicate the appropriate receiver related CAN
bus status of the MSCAN. The coding for the bits RSTAT1, RSTAT0 is:
00
01
10
11
RxOK: 0 ≤ receive error counter ≤ 96
RxWRN: 96 < receive error counter ≤ 127
RxERR: 127 < receive error counter
Bus-off(1): transmit error counter > 255
3:2
Transmitter Status Bits — The values of the error counters control the actual CAN bus status of the MSCAN.
TSTAT[1:0] As soon as the status change interrupt flag (CSCIF) is set, these bits indicate the appropriate transmitter related
CAN bus status of the MSCAN. The coding for the bits TSTAT1, TSTAT0 is:
00
01
10
11
TxOK: 0 ≤ transmit error counter ≤ 96
TxWRN: 96 < transmit error counter ≤ 127
TxERR: 127 < transmit error counter ≤ 255
Bus-Off: transmit error counter > 255
1
Overrun Interrupt Flag — This flag is set when a data overrun condition occurs. If not masked, an error interrupt
OVRIF
is pending while this flag is set.
0
1
No data overrun condition
A data overrun detected
0
Receive Buffer Full Flag — RXF is set by the MSCAN when a new message is shifted in the receiver FIFO. This
flag indicates whether the shifted buffer is loaded with a correctly received message (matching identifier,
matching cyclic redundancy code (CRC) and no other errors detected). After the CPU has read that message
from the RxFG buffer in the receiver FIFO, the RXF flag must be cleared to release the buffer. A set RXF flag
prohibits the shifting of the next FIFO entry into the foreground buffer (RxFG). If not masked, a receive interrupt
is pending while this flag is set.
RXF(2)
0
1
No new message available within the RxFG
The receiver FIFO is not empty. A new message is available in the RxFG
1. Redundant Information for the most critical CAN bus status which is “bus-off”. This only occurs if the Tx error counter exceeds
a number of 255 errors. Bus-off affects the receiver state. As soon as the transmitter leaves its bus-off state the receiver state
skips to RxOK too. Refer also to TSTAT[1:0] coding in this register.
2. To ensure data integrity, do not read the receive buffer registers while the RXF flag is cleared. For MCUs with dual CPUs,
reading the receive buffer registers while the RXF flag is cleared may result in a CPU fault condition.
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10.3.2.6 MSCAN Receiver Interrupt Enable Register (CANRIER)
This register contains the interrupt enable bits for the interrupt flags described in the CANRFLG register.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
WUPIE
CSCIE
RSTATE1
RSTATE0
TSTATE1
TSTATE0
OVRIE
RXFIE
Reset:
0
0
0
0
0
0
0
0
Figure 10-9. MSCAN Receiver Interrupt Enable Register (CANRIER)
NOTE
The CANRIER register is held in the reset state when the initialization mode
is active (INITRQ=1 and INITAK=1). This register is writable when not in
initialization mode (INITRQ=0 and INITAK=0).
The RSTATE[1:0], TSTATE[1:0] bits are not affected by initialization
mode.
Read: Anytime
Write: Anytime when not in initialization mode
Table 10-10. CANRIER Register Field Descriptions
Field
Description
7
Wake-Up Interrupt Enable
WUPIE(1)
0
1
No interrupt request is generated from this event.
A wake-up event causes a Wake-Up interrupt request.
6
CAN Status Change Interrupt Enable
CSCIE
0
1
No interrupt request is generated from this event.
A CAN Status Change event causes an error interrupt request.
5:4
Receiver Status Change Enable — These RSTAT enable bits control the sensitivity level in which receiver state
RSTATE[1:0] changes are causing CSCIF interrupts. Independent of the chosen sensitivity level the RSTAT flags continue to
indicate the actual receiver state and are only updated if no CSCIF interrupt is pending.
00 Do not generate any CSCIF interrupt caused by receiver state changes.
01 Generate CSCIF interrupt only if the receiver enters or leaves “bus-off” state. Discard other receiver state
changes for generating CSCIF interrupt.
10 Generate CSCIF interrupt only if the receiver enters or leaves “RxErr” or “bus-off”(2) state. Discard other
receiver state changes for generating CSCIF interrupt.
11 Generate CSCIF interrupt on all state changes.
3:2
Transmitter Status Change Enable — These TSTAT enable bits control the sensitivity level in which transmitter
TSTATE[1:0] state changes are causing CSCIF interrupts. Independent of the chosen sensitivity level, the TSTAT flags
continue to indicate the actual transmitter state and are only updated if no CSCIF interrupt is pending.
00 Do not generate any CSCIF interrupt caused by transmitter state changes.
01 Generate CSCIF interrupt only if the transmitter enters or leaves “bus-off” state. Discard other transmitter
state changes for generating CSCIF interrupt.
10 Generate CSCIF interrupt only if the transmitter enters or leaves “TxErr” or “bus-off” state. Discard other
transmitter state changes for generating CSCIF interrupt.
11 Generate CSCIF interrupt on all state changes.
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Table 10-10. CANRIER Register Field Descriptions (continued)
Field
Description
1
Overrun Interrupt Enable
OVRIE
0
1
No interrupt request is generated from this event.
An overrun event causes an error interrupt request.
0
Receiver Full Interrupt Enable
RXFIE
0
1
No interrupt request is generated from this event.
A receive buffer full (successful message reception) event causes a receiver interrupt request.
1. WUPIE and WUPE (see Section 10.3.2.1, “MSCAN Control Register 0 (CANCTL0)”) must both be enabled if the recovery
mechanism from stop or wait is required.
2. Bus-off state is defined by the CAN standard (see Bosch CAN 2.0A/B protocol specification: for only transmitters. Because the
only possible state change for the transmitter from bus-off to TxOK also forces the receiver to skip its current state to RxOK,
the coding of the RXSTAT[1:0] flags define an additional bus-off state for the receiver (see Section 10.3.2.5, “MSCAN Receiver
Flag Register (CANRFLG)”).
10.3.2.7 MSCAN Transmitter Flag Register (CANTFLG)
The transmit buffer empty flags each have an associated interrupt enable bit in the CANTIER register.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
TXE2
TXE1
TXE0
Reset:
0
0
0
0
0
1
1
1
= Unimplemented
Figure 10-10. MSCAN Transmitter Flag Register (CANTFLG)
NOTE
The CANTFLG register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1). This register is writable when
not in initialization mode (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime for TXEx flags when not in initialization mode; write of 1 clears flag, write of 0 is ignored
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Table 10-11. CANTFLG Register Field Descriptions
Field
Description
2:0
TXE[2:0]
Transmitter Buffer Empty — This flag indicates that the associated transmit message buffer is empty, and thus
not scheduled for transmission. The CPU must clear the flag after a message is set up in the transmit buffer and
is due for transmission. The MSCAN sets the flag after the message is sent successfully. The flag is also set by
the MSCAN when the transmission request is successfully aborted due to a pending abort request (see
Section 10.3.2.9, “MSCAN Transmitter Message Abort Request Register (CANTARQ)”). If not masked, a
transmit interrupt is pending while this flag is set.
Clearing a TXEx flag also clears the corresponding ABTAKx (see Section 10.3.2.10, “MSCAN Transmitter
Message Abort Acknowledge Register (CANTAAK)”). When a TXEx flag is set, the corresponding ABTRQx bit
is cleared (see Section 10.3.2.9, “MSCAN Transmitter Message Abort Request Register (CANTARQ)”).
When listen-mode is active (see Section 10.3.2.2, “MSCAN Control Register 1 (CANCTL1)”) the TXEx flags
cannot be cleared and no transmission is started.
Read and write accesses to the transmit buffer will be blocked, if the corresponding TXEx bit is cleared
(TXEx = 0) and the buffer is scheduled for transmission.
0 The associated message buffer is full (loaded with a message due for transmission)
1 The associated message buffer is empty (not scheduled)
10.3.2.8 MSCAN Transmitter Interrupt Enable Register (CANTIER)
This register contains the interrupt enable bits for the transmit buffer empty interrupt flags.
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
TXEIE2
TXEIE1
TXEIE0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 10-11. MSCAN Transmitter Interrupt Enable Register (CANTIER)
NOTE
The CANTIER register is held in the reset state when the initialization mode
is active (INITRQ = 1 and INITAK = 1). This register is writable when not
in initialization mode (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime when not in initialization mode
Table 10-12. CANTIER Register Field Descriptions
Field
Description
2:0
Transmitter Empty Interrupt Enable
TXEIE[2:0] 0 No interrupt request is generated from this event.
1 A transmitter empty (transmit buffer available for transmission) event causes a transmitter empty interrupt
request.
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10.3.2.9 MSCAN Transmitter Message Abort Request Register (CANTARQ)
The CANTARQ register allows abort request of queued messages as described below.
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
ABTRQ2
ABTRQ1
ABTRQ0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 10-12. MSCAN Transmitter Message Abort Request Register (CANTARQ)
NOTE
The CANTARQ register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1). This register is writable when
not in initialization mode (INITRQ = 0 and INITAK = 0).
Read: Anytime
Write: Anytime when not in initialization mode
Table 10-13. CANTARQ Register Field Descriptions
Field
Description
Abort Request — The CPU sets the ABTRQx bit to request that a scheduled message buffer (TXEx = 0) be
2:0
ABTRQ[2:0] aborted. The MSCAN grants the request if the message has not already started transmission, or if the
transmission is not successful (lost arbitration or error). When a message is aborted, the associated TXE (see
Section 10.3.2.7, “MSCAN Transmitter Flag Register (CANTFLG)”) and abort acknowledge flags (ABTAK, see
Section 10.3.2.10, “MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)”) are set and a
transmit interrupt occurs if enabled. The CPU cannot reset ABTRQx. ABTRQx is reset whenever the associated
TXE flag is set.
0 No abort request
1 Abort request pending
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10.3.2.10 MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)
The CANTAAK register indicates the successful abort of a queued message, if requested by the
appropriate bits in the CANTARQ register.
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
ABTAK2
ABTAK1
ABTAK0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 10-13. MSCAN Transmitter Message Abort Acknowledge Register (CANTAAK)
NOTE
The CANTAAK register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK = 1).
Read: Anytime
Write: Unimplemented for ABTAKx flags
Table 10-14. CANTAAK Register Field Descriptions
Field
Description
Abort Acknowledge — This flag acknowledges that a message was aborted due to a pending abort request
2:0
ABTAK[2:0] from the CPU. After a particular message buffer is flagged empty, this flag can be used by the application
software to identify whether the message was aborted successfully or was sent anyway. The ABTAKx flag is
cleared whenever the corresponding TXE flag is cleared.
0 The message was not aborted.
1 The message was aborted.
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10.3.2.11 MSCAN Transmit Buffer Selection Register (CANTBSEL)
The CANTBSEL register allows the selection of the actual transmit message buffer, which then will be
accessible in the CANTXFG register space.
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
TX2
TX1
TX0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 10-14. MSCAN Transmit Buffer Selection Register (CANTBSEL)
NOTE
The CANTBSEL register is held in the reset state when the initialization
mode is active (INITRQ = 1 and INITAK=1). This register is writable when
not in initialization mode (INITRQ = 0 and INITAK = 0).
Read: Find the lowest ordered bit set to 1, all other bits will be read as 0
Write: Anytime when not in initialization mode
Table 10-15. CANTBSEL Register Field Descriptions
Field
Description
2:0
TX[2:0]
Transmit Buffer Select — The lowest numbered bit places the respective transmit buffer in the CANTXFG
register space (e.g., TX1 = 1 and TX0 = 1 selects transmit buffer TX0; TX1 = 1 and TX0 = 0 selects transmit
buffer TX1). Read and write accesses to the selected transmit buffer will be blocked, if the corresponding TXEx
bit is cleared and the buffer is scheduled for transmission (see Section 10.3.2.7, “MSCAN Transmitter Flag
Register (CANTFLG)”).
0 The associated message buffer is deselected
1 The associated message buffer is selected, if lowest numbered bit
The following gives a short programming example of the usage of the CANTBSEL register:
To get the next available transmit buffer, application software must read the CANTFLG register and write
this value back into the CANTBSEL register. In this example Tx buffers TX1 and TX2 are available. The
value read from CANTFLG is therefore 0b0000_0110. When writing this value back to CANTBSEL, the
Tx buffer TX1 is selected in the CANTXFG because the lowest numbered bit set to 1 is at bit position 1.
Reading back this value out of CANTBSEL results in 0b0000_0010, because only the lowest numbered
bit position set to 1 is presented. This mechanism eases the application software the selection of the next
available Tx buffer.
•
•
•
LDD CANTFLG; value read is 0b0000_0110
STD CANTBSEL; value written is 0b0000_0110
LDD CANTBSEL; value read is 0b0000_0010
If all transmit message buffers are deselected, no accesses are allowed to the CANTXFG registers.
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10.3.2.12 MSCAN Identifier Acceptance Control Register (CANIDAC)
The CANIDAC register is used for identifier acceptance control as described below.
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
W
0
0
0
IDHIT2
IDHIT1
IDHIT0
IDAM1
IDAM0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 10-15. MSCAN Identifier Acceptance Control Register (CANIDAC)
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1), except bits IDHITx, which are read-
only
Table 10-16. CANIDAC Register Field Descriptions
Field
Description
5:4
Identifier Acceptance Mode — The CPU sets these flags to define the identifier acceptance filter organization
IDAM[1:0] (see Section 10.4.3, “Identifier Acceptance Filter”). Table 10-17 summarizes the different settings. In filter closed
mode, no message is accepted such that the foreground buffer is never reloaded.
2:0
Identifier Acceptance Hit Indicator — The MSCAN sets these flags to indicate an identifier acceptance hit (see
IDHIT[2:0] Section 10.4.3, “Identifier Acceptance Filter”). Table 10-18 summarizes the different settings.
Table 10-17. Identifier Acceptance Mode Settings
IDAM1
IDAM0
Identifier Acceptance Mode
0
0
1
1
0
1
0
1
Two 32-bit acceptance filters
Four 16-bit acceptance filters
Eight 8-bit acceptance filters
Filter closed
Table 10-18. Identifier Acceptance Hit Indication
IDHIT2
IDHIT1
IDHIT0
Identifier Acceptance Hit
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Filter 0 hit
Filter 1 hit
Filter 2 hit
Filter 3 hit
Filter 4 hit
Filter 5 hit
Filter 6 hit
Filter 7 hit
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The IDHITx indicators are always related to the message in the foreground buffer (RxFG). When a
message gets shifted into the foreground buffer of the receiver FIFO the indicators are updated as well.
10.3.2.13 MSCAN Reserved Registers
These registers are reserved for factory testing of the MSCAN module and is not available in normal
system operation modes.
Module Base + 0x000C, 0x000D
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 10-16. MSCAN Reserved Registers
Read: Always read 0x0000 in normal system operation modes
Write: Unimplemented in normal system operation modes
NOTE
Writing to this register when in special modes can alter the MSCAN
functionality.
10.3.2.14 MSCAN Receive Error Counter (CANRXERR)
This register reflects the status of the MSCAN receive error counter.
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
W
RXERR7
RXERR6
RXERR5
RXERR4
RXERR3
RXERR2
RXERR1
RXERR0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 10-17. MSCAN Receive Error Counter (CANRXERR)
Read: Only when in sleep mode (SLPRQ = 1 and SLPAK = 1) or initialization mode (INITRQ = 1 and
INITAK = 1)
Write: Unimplemented
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NOTE
Reading this register when in any other mode other than sleep or
initialization mode may return an incorrect value. For MCUs with dual
CPUs, this may result in a CPU fault condition.
Writing to this register when in special modes can alter the MSCAN
functionality.
10.3.2.15 MSCAN Transmit Error Counter (CANTXERR)
This register reflects the status of the MSCAN transmit error counter.
Module Base + 0x000F
7
6
5
4
3
2
1
0
R
W
TXERR7
TXERR6
TXERR5
TXERR4
TXERR3
TXERR2
TXERR1
TXERR0
Reset:
0
0
0
0
0
0
0
0
= Unimplemented
Figure 10-18. MSCAN Transmit Error Counter (CANTXERR)
Read: Only when in sleep mode (SLPRQ = 1 and SLPAK = 1) or initialization mode (INITRQ = 1 and
INITAK = 1)
Write: Unimplemented
NOTE
Reading this register when in any other mode other than sleep or
initialization mode, may return an incorrect value. For MCUs with dual
CPUs, this may result in a CPU fault condition.
Writing to this register when in special modes can alter the MSCAN
functionality.
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10.3.2.16 MSCAN Identifier Acceptance Registers (CANIDAR0-7)
On reception, each message is written into the background receive buffer. The CPU is only signalled to
read the message if it passes the criteria in the identifier acceptance and identifier mask registers
(accepted); otherwise, the message is overwritten by the next message (dropped).
The acceptance registers of the MSCAN are applied on the IDR0–IDR3 registers (see Section 10.3.3.1,
“Identifier Registers (IDR0–IDR3)”) of incoming messages in a bit by bit manner (see Section 10.4.3,
“Identifier Acceptance Filter”).
For extended identifiers, all four acceptance and mask registers are applied. For standard identifiers, only
the first two (CANIDAR0/1, CANIDMR0/1) are applied.
Module Base + 0x0010 (CANIDAR0)
0x0011 (CANIDAR1)
0x0012 (CANIDAR2)
0x0013 (CANIDAR3)
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
Figure 10-19. MSCAN Identifier Acceptance Registers (First Bank) — CANIDAR0–CANIDAR3
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 10-19. CANIDAR0–CANIDAR3 Register Field Descriptions
Field
Description
7:0
AC[7:0]
Acceptance Code Bits — AC[7:0] comprise a user-defined sequence of bits with which the corresponding bits
of the related identifier register (IDRn) of the receive message buffer are compared. The result of this comparison
is then masked with the corresponding identifier mask register.
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Module Base + 0x0018 (CANIDAR4)
0x0019 (CANIDAR5)
0x001A (CANIDAR6)
0x001B (CANIDAR7)
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AC7
AC6
AC5
AC4
AC3
AC2
AC1
AC0
Reset
0
0
0
0
0
0
0
0
Figure 10-20. MSCAN Identifier Acceptance Registers (Second Bank) — CANIDAR4–CANIDAR7
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 10-20. CANIDAR4–CANIDAR7 Register Field Descriptions
Field
Description
7:0
AC[7:0]
Acceptance Code Bits — AC[7:0] comprise a user-defined sequence of bits with which the corresponding bits
of the related identifier register (IDRn) of the receive message buffer are compared. The result of this comparison
is then masked with the corresponding identifier mask register.
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10.3.2.17 MSCAN Identifier Mask Registers (CANIDMR0–CANIDMR7)
The identifier mask register specifies which of the corresponding bits in the identifier acceptance register
are relevant for acceptance filtering. To receive standard identifiers in 32 bit filter mode, it is required to
program the last three bits (AM[2:0]) in the mask registers CANIDMR1 and CANIDMR5 to “don’t care.”
To receive standard identifiers in 16 bit filter mode, it is required to program the last three bits (AM[2:0])
in the mask registers CANIDMR1, CANIDMR3, CANIDMR5, and CANIDMR7 to “don’t care.”
Module Base + 0x0014 (CANIDMR0)
0x0015 (CANIDMR1)
0x0016 (CANIDMR2)
0x0017 (CANIDMR3)
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
Figure 10-21. MSCAN Identifier Mask Registers (First Bank) — CANIDMR0–CANIDMR3
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 10-21. CANIDMR0–CANIDMR3 Register Field Descriptions
Field
Description
7:0
AM[7:0]
Acceptance Mask Bits — If a particular bit in this register is cleared, this indicates that the corresponding bit in
the identifier acceptance register must be the same as its identifier bit before a match is detected. The message
is accepted if all such bits match. If a bit is set, it indicates that the state of the corresponding bit in the identifier
acceptance register does not affect whether or not the message is accepted.
0 Match corresponding acceptance code register and identifier bits
1 Ignore corresponding acceptance code register bit
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Module Base + 0x001C (CANIDMR4)
0x001D (CANIDMR5)
0x001E (CANIDMR6)
0x001F (CANIDMR7)
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
R
W
AM7
AM6
AM5
AM4
AM3
AM2
AM1
AM0
Reset
0
0
0
0
0
0
0
0
Figure 10-22. MSCAN Identifier Mask Registers (Second Bank) — CANIDMR4–CANIDMR7
Read: Anytime
Write: Anytime in initialization mode (INITRQ = 1 and INITAK = 1)
Table 10-22. CANIDMR4–CANIDMR7 Register Field Descriptions
Field
Description
7:0
AM[7:0]
Acceptance Mask Bits — If a particular bit in this register is cleared, this indicates that the corresponding bit in
the identifier acceptance register must be the same as its identifier bit before a match is detected. The message
is accepted if all such bits match. If a bit is set, it indicates that the state of the corresponding bit in the identifier
acceptance register does not affect whether or not the message is accepted.
0 Match corresponding acceptance code register and identifier bits
1 Ignore corresponding acceptance code register bit
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10.3.3 Programmer’s Model of Message Storage
The following section details the organization of the receive and transmit message buffers and the
associated control registers.
To simplify the programmer interface, the receive and transmit message buffers have the same outline.
Each message buffer allocates 16 bytes in the memory map containing a 13 byte data structure.
An additional transmit buffer priority register (TBPR) is defined for the transmit buffers. Within the last
two bytes of this memory map, the MSCAN stores a special 16-bit time stamp, which is sampled from an
internal timer after successful transmission or reception of a message. This feature is only available for
transmit and receiver buffers, if the TIME bit is set (see Section 10.3.2.1, “MSCAN Control Register 0
(CANCTL0)”).
The time stamp register is written by the MSCAN. The CPU can only read these registers.
Table 10-23. Message Buffer Organization
Offset
Address
Register
Access
0x00X0
0x00X1
0x00X2
0x00X3
0x00X4
0x00X5
0x00X6
0x00X7
0x00X8
0x00X9
0x00XA
0x00XB
0x00XC
0x00XD
0x00XE
0x00XF
Identifier Register 0
Identifier Register 1
Identifier Register 2
Identifier Register 3
Data Segment Register 0
Data Segment Register 1
Data Segment Register 2
Data Segment Register 3
Data Segment Register 4
Data Segment Register 5
Data Segment Register 6
Data Segment Register 7
Data Length Register
Transmit Buffer Priority Register(1)
Time Stamp Register (High Byte)(2)
Time Stamp Register (Low Byte)(3)
1. Not applicable for receive buffers
2. Read-only for CPU
3. Read-only for CPU
Figure 10-23 shows the common 13-byte data structure of receive and transmit buffers for extended
identifiers. The mapping of standard identifiers into the IDR registers is shown in Figure 10-24.
1
All bits of the receive and transmit buffers are ‘x’ out of reset because of RAM-based implementation .
All reserved or unused bits of the receive and transmit buffers always read ‘x’.
1. Exception: The transmit priority registers are 0 out of reset.
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Register
Name
Bit 7
6
5
4
3
2
1
Bit0
R
0x00X0
IDR0
ID28
ID27
ID26
ID25
ID24
ID23
ID22
ID21
W
R
0x00X1
IDR1
ID20
ID14
ID6
ID19
ID13
ID5
ID18
ID12
ID4
SRR (=1)
ID11
ID3
IDE (=1)
ID10
ID2
ID17
ID9
ID16
ID8
ID15
ID7
W
R
0x00X2
IDR2
W
R
0x00X3
IDR3
ID1
ID0
RTR
DB0
DB0
DB0
DB0
DB0
DB0
DB0
DB0
DLC0
W
R
0x00X4
DSR0
DB7
DB7
DB7
DB7
DB7
DB7
DB7
DB7
DB6
DB6
DB6
DB6
DB6
DB6
DB6
DB6
DB5
DB5
DB5
DB5
DB5
DB5
DB5
DB5
DB4
DB4
DB4
DB4
DB4
DB4
DB4
DB4
DB3
DB3
DB3
DB3
DB3
DB3
DB3
DB3
DLC3
DB2
DB2
DB2
DB2
DB2
DB2
DB2
DB2
DLC2
DB1
DB1
DB1
DB1
DB1
DB1
DB1
DB1
DLC1
W
R
0x00X5
DSR1
W
R
0x00X6
DSR2
W
R
0x00X7
DSR3
W
R
0x00X8
DSR4
W
R
0x00X9
DSR5
W
R
0x00XA
DSR6
W
R
0x00XB
DSR7
W
R
0x00XC
DLR
W
= Unused, always read ‘x’
Figure 10-23. Receive/Transmit Message Buffer — Extended Identifier Mapping
Read: For transmit buffers, anytime when TXEx flag is set (see Section 10.3.2.7, “MSCAN Transmitter
Flag Register (CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see
Section 10.3.2.11, “MSCAN Transmit Buffer Selection Register (CANTBSEL)”). For receive buffers,
only when RXF flag is set (see Section 10.3.2.5, “MSCAN Receiver Flag Register (CANRFLG)”).
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Write: For transmit buffers, anytime when TXEx flag is set (see Section 10.3.2.7, “MSCAN Transmitter
Flag Register (CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see
Section 10.3.2.11, “MSCAN Transmit Buffer Selection Register (CANTBSEL)”). Unimplemented for
receive buffers.
Reset: Undefined (0x00XX) because of RAM-based implementation
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
IDR0
0x00X0
ID10
ID9
ID8
ID7
ID6
ID5
ID4
ID3
W
R
IDR1
0x00X1
ID2
ID1
ID0
RTR
IDE (=0)
W
R
IDR2
0x00X2
W
R
IDR3
0x00X3
W
= Unused, always read ‘x’
Figure 10-24. Receive/Transmit Message Buffer — Standard Identifier Mapping
10.3.3.1 Identifier Registers (IDR0–IDR3)
The identifier registers for an extended format identifier consist of a total of 32 bits; ID[28:0], SRR, IDE,
and RTR bits. The identifier registers for a standard format identifier consist of a total of 13 bits; ID[10:0],
RTR, and IDE bits.
10.3.3.1.1
IDR0–IDR3 for Extended Identifier Mapping
Module Base + 0x00X1
7
6
5
4
3
2
1
0
R
ID28
W
ID27
ID26
ID25
ID24
ID23
ID22
ID21
Reset:
x
x
x
x
x
x
x
x
Figure 10-25. Identifier Register 0 (IDR0) — Extended Identifier Mapping
Table 10-24. IDR0 Register Field Descriptions — Extended
Description
Field
7:0
ID[28:21]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
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Module Base + 0x00X1
7
6
5
4
3
2
1
0
R
ID20
W
ID19
ID18
SRR (=1)
IDE (=1)
ID17
ID16
ID15
Reset:
x
x
x
x
x
x
x
x
Figure 10-26. Identifier Register 1 (IDR1) — Extended Identifier Mapping
Table 10-25. IDR1 Register Field Descriptions — Extended
Description
Field
7:5
ID[20:18]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
4
Substitute Remote Request — This fixed recessive bit is used only in extended format. It must be set to 1 by
SRR
the user for transmission buffers and is stored as received on the CAN bus for receive buffers.
3
IDE
ID Extended — This flag indicates whether the extended or standard identifier format is applied in this buffer. In
the case of a receive buffer, the flag is set as received and indicates to the CPU how to process the buffer
identifier registers. In the case of a transmit buffer, the flag indicates to the MSCAN what type of identifier to send.
0 Standard format (11 bit)
1 Extended format (29 bit)
2:0
ID[17:15]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
Module Base + 0x00X2
7
6
5
4
3
2
1
0
R
ID14
W
ID13
ID12
ID11
ID10
ID9
ID8
ID7
Reset:
x
x
x
x
x
x
x
x
Figure 10-27. Identifier Register 2 (IDR2) — Extended Identifier Mapping
Table 10-26. IDR2 Register Field Descriptions — Extended
Description
Field
7:0
ID[14:7]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
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Module Base + 0x00X3
7
6
5
4
3
2
1
0
R
W
ID6
ID5
ID4
ID3
ID2
ID1
ID0
RTR
Reset:
x
x
x
x
x
x
x
x
Figure 10-28. Identifier Register 3 (IDR3) — Extended Identifier Mapping
Table 10-27. IDR3 Register Field Descriptions — Extended
Description
Field
7:1
ID[6:0]
Extended Format Identifier — The identifiers consist of 29 bits (ID[28:0]) for the extended format. ID28 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number.
0
Remote Transmission Request — This flag reflects the status of the remote transmission request bit in the
RTR
CAN frame. In the case of a receive buffer, it indicates the status of the received frame and supports the
transmission of an answering frame in software. In the case of a transmit buffer, this flag defines the setting of
the RTR bit to be sent.
0 Data frame
1 Remote frame
10.3.3.1.2
IDR0–IDR3 for Standard Identifier Mapping
Module Base + 0x00X0
7
6
5
4
3
2
1
0
R
ID10
W
ID9
ID8
ID7
ID6
ID5
ID4
ID3
Reset:
x
x
x
x
x
x
x
x
Figure 10-29. Identifier Register 0 — Standard Mapping
Table 10-28. IDR0 Register Field Descriptions — Standard
Description
Field
7:0
ID[10:3]
Standard Format Identifier — The identifiers consist of 11 bits (ID[10:0]) for the standard format. ID10 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number. See also ID bits in Table 10-29.
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Module Base + 0x00X1
7
6
5
4
3
2
1
0
R
ID2
W
ID1
ID0
RTR
IDE (=0)
Reset:
x
x
x
x
x
x
x
x
= Unused; always read ‘x’
Figure 10-30. Identifier Register 1 — Standard Mapping
Table 10-29. IDR1 Register Field Descriptions
Description
Field
7:5
ID[2:0]
Standard Format Identifier — The identifiers consist of 11 bits (ID[10:0]) for the standard format. ID10 is the
most significant bit and is transmitted first on the CAN bus during the arbitration procedure. The priority of an
identifier is defined to be highest for the smallest binary number. See also ID bits in Table 10-28.
4
Remote Transmission Request — This flag reflects the status of the Remote Transmission Request bit in the
RTR
CAN frame. In the case of a receive buffer, it indicates the status of the received frame and supports the
transmission of an answering frame in software. In the case of a transmit buffer, this flag defines the setting of
the RTR bit to be sent.
0 Data frame
1 Remote frame
3
IDE
ID Extended — This flag indicates whether the extended or standard identifier format is applied in this buffer. In
the case of a receive buffer, the flag is set as received and indicates to the CPU how to process the buffer
identifier registers. In the case of a transmit buffer, the flag indicates to the MSCAN what type of identifier to send.
0 Standard format (11 bit)
1 Extended format (29 bit)
Module Base + 0x00X2
7
6
5
4
3
2
1
0
R
W
Reset:
x
x
x
x
x
x
x
x
= Unused; always read ‘x’
Figure 10-31. Identifier Register 2 — Standard Mapping
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Module Base + 0x00X3
7
6
5
4
3
2
1
0
R
W
Reset:
x
x
x
x
x
x
x
x
= Unused; always read ‘x’
Figure 10-32. Identifier Register 3 — Standard Mapping
10.3.3.2 Data Segment Registers (DSR0-7)
The eight data segment registers, each with bits DB[7:0], contain the data to be transmitted or received.
The number of bytes to be transmitted or received is determined by the data length code in the
corresponding DLR register.
Module Base + 0x0004 (DSR0)
0x0005 (DSR1)
0x0006 (DSR2)
0x0007 (DSR3)
0x0008 (DSR4)
0x0009 (DSR5)
0x000A (DSR6)
0x000B (DSR7)
7
6
5
4
3
2
1
0
R
W
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
Reset:
x
x
x
x
x
x
x
x
Figure 10-33. Data Segment Registers (DSR0–DSR7) — Extended Identifier Mapping
Table 10-30. DSR0–DSR7 Register Field Descriptions
Field
Description
7:0
Data bits 7:0
DB[7:0]
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10.3.3.3 Data Length Register (DLR)
This register keeps the data length field of the CAN frame.
Module Base + 0x00XB
7
6
5
4
3
2
1
0
R
W
DLC3
DLC2
DLC1
DLC0
Reset:
x
x
x
x
x
x
x
x
= Unused; always read “x”
Figure 10-34. Data Length Register (DLR) — Extended Identifier Mapping
Table 10-31. DLR Register Field Descriptions
Description
Field
3:0
DLC[3:0]
Data Length Code Bits — The data length code contains the number of bytes (data byte count) of the respective
message. During the transmission of a remote frame, the data length code is transmitted as programmed while
the number of transmitted data bytes is always 0. The data byte count ranges from 0 to 8 for a data frame.
Table 10-32 shows the effect of setting the DLC bits.
Table 10-32. Data Length Codes
Data Length Code
Data Byte
Count
DLC3
DLC2
DLC1
DLC0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
1
1
1
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
0
1
2
3
4
5
6
7
8
10.3.3.4 Transmit Buffer Priority Register (TBPR)
This register defines the local priority of the associated message buffer. The local priority is used for the
internal prioritization process of the MSCAN and is defined to be highest for the smallest binary number.
The MSCAN implements the following internal prioritization mechanisms:
•
All transmission buffers with a cleared TXEx flag participate in the prioritization immediately
before the SOF (start of frame) is sent.
•
The transmission buffer with the lowest local priority field wins the prioritization.
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In cases of more than one buffer having the same lowest priority, the message buffer with the lower index
number wins.
Module Base + 0xXXXD
7
6
5
4
3
2
1
0
R
W
PRIO7
PRIO6
PRIO5
PRIO4
PRIO3
PRIO2
PRIO1
PRIO0
Reset:
0
0
0
0
0
0
0
0
Figure 10-35. Transmit Buffer Priority Register (TBPR)
Read: Anytime when TXEx flag is set (see Section 10.3.2.7, “MSCAN Transmitter Flag Register
(CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see Section 10.3.2.11,
“MSCAN Transmit Buffer Selection Register (CANTBSEL)”).
Write: Anytime when TXEx flag is set (see Section 10.3.2.7, “MSCAN Transmitter Flag Register
(CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see Section 10.3.2.11,
“MSCAN Transmit Buffer Selection Register (CANTBSEL)”).
10.3.3.5 Time Stamp Register (TSRH–TSRL)
If the TIME bit is enabled, the MSCAN will write a time stamp to the respective registers in the active
transmit or receive buffer right after the EOF of a valid message on the CAN bus (see Section 10.3.2.1,
“MSCAN Control Register 0 (CANCTL0)”). In case of a transmission, the CPU can only read the time
stamp after the respective transmit buffer has been flagged empty.
The timer value, which is used for stamping, is taken from a free running internal CAN bit clock. A timer
overrun is not indicated by the MSCAN. The timer is reset (all bits set to 0) during initialization mode. The
CPU can only read the time stamp registers.
Module Base + 0xXXXE
7
6
5
4
3
2
1
0
R
W
TSR15
TSR14
TSR13
TSR12
TSR11
TSR10
TSR9
TSR8
Reset:
x
x
x
x
x
x
x
x
Figure 10-36. Time Stamp Register — High Byte (TSRH)
Module Base + 0xXXXF
7
6
5
4
3
2
1
0
R
W
TSR7
TSR6
TSR5
TSR4
TSR3
TSR2
TSR1
TSR0
Reset:
x
x
x
x
x
x
x
x
Figure 10-37. Time Stamp Register — Low Byte (TSRL)
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Read: Anytime when TXEx flag is set (see Section 10.3.2.7, “MSCAN Transmitter Flag Register
(CANTFLG)”) and the corresponding transmit buffer is selected in CANTBSEL (see Section 10.3.2.11,
“MSCAN Transmit Buffer Selection Register (CANTBSEL)”).
Write: Unimplemented
10.4 Functional Description
10.4.1 General
This section provides a complete functional description of the MSCAN. It describes each of the features
and modes listed in the introduction.
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10.4.2 Message Storage
CAN
Receive / Transmit
Engine
CPU12
Memory Mapped
I/O
Rx0
Rx1
Rx2
MSCAN
Rx3
Rx4
RXF
CPU bus
Receiver
TXE0
Tx0
PRIO
TXE1
Tx1
CPU bus
MSCAN
PRIO
TXE2
Tx2
PRIO
Transmitter
Figure 10-38. User Model for Message Buffer Organization
MSCAN facilitates a sophisticated message storage system which addresses the requirements of a broad
range of network applications.
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10.4.2.1 Message Transmit Background
Modern application layer software is built upon two fundamental assumptions:
•
Any CAN node is able to send out a stream of scheduled messages without releasing the CAN bus
between the two messages. Such nodes arbitrate for the CAN bus immediately after sending the
previous message and only release the CAN bus in case of lost arbitration.
•
The internal message queue within any CAN node is organized such that the highest priority
message is sent out first, if more than one message is ready to be sent.
The behavior described in the bullets above cannot be achieved with a single transmit buffer. That buffer
must be reloaded immediately after the previous message is sent. This loading process lasts a finite amount
of time and must be completed within the inter-frame sequence (IFS) to be able to send an uninterrupted
stream of messages. Even if this is feasible for limited CAN bus speeds, it requires that the CPU reacts
with short latencies to the transmit interrupt.
A double buffer scheme de-couples the reloading of the transmit buffer from the actual message sending
and, therefore, reduces the reactiveness requirements of the CPU. Problems can arise if the sending of a
message is finished while the CPU re-loads the second buffer. No buffer would then be ready for
transmission, and the CAN bus would be released.
At least three transmit buffers are required to meet the first of the above requirements under all
circumstances. The MSCAN has three transmit buffers.
The second requirement calls for some sort of internal prioritization which the MSCAN implements with
the “local priority” concept described in Section 10.4.2.2, “Transmit Structures.”
10.4.2.2 Transmit Structures
The MSCAN triple transmit buffer scheme optimizes real-time performance by allowing multiple
messages to be set up in advance. The three buffers are arranged as shown in Figure 10-38.
All three buffers have a 13-byte data structure similar to the outline of the receive buffers (see
Section 10.3.3, “Programmer’s Model of Message Storage”). An additional Section 10.3.3.4, “Transmit
Buffer Priority Register (TBPR) contains an 8-bit local priority field (PRIO) (see Section 10.3.3.4,
“Transmit Buffer Priority Register (TBPR)”). The remaining two bytes are used for time stamping of a
message, if required (see Section 10.3.3.5, “Time Stamp Register (TSRH–TSRL)”).
To transmit a message, the CPU must identify an available transmit buffer, which is indicated by a set
transmitter buffer empty (TXEx) flag (see Section 10.3.2.7, “MSCAN Transmitter Flag Register
(CANTFLG)”). If a transmit buffer is available, the CPU must set a pointer to this buffer by writing to the
CANTBSEL register (see Section 10.3.2.11, “MSCAN Transmit Buffer Selection Register
(CANTBSEL)”). This makes the respective buffer accessible within the CANTXFG address space (see
Section 10.3.3, “Programmer’s Model of Message Storage”). The algorithmic feature associated with the
CANTBSEL register simplifies the transmit buffer selection. In addition, this scheme makes the handler
software simpler because only one address area is applicable for the transmit process, and the required
address space is minimized.
The CPU then stores the identifier, the control bits, and the data content into one of the transmit buffers.
Finally, the buffer is flagged as ready for transmission by clearing the associated TXE flag.
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The MSCAN then schedules the message for transmission and signals the successful transmission of the
buffer by setting the associated TXE flag. A transmit interrupt (see Section 10.4.7.2, “Transmit Interrupt”)
1
is generated when TXEx is set and can be used to drive the application software to re-load the buffer.
If more than one buffer is scheduled for transmission when the CAN bus becomes available for arbitration,
the MSCAN uses the local priority setting of the three buffers to determine the prioritization. For this
purpose, every transmit buffer has an 8-bit local priority field (PRIO). The application software programs
this field when the message is set up. The local priority reflects the priority of this particular message
relative to the set of messages being transmitted from this node. The lowest binary value of the PRIO field
is defined to be the highest priority. The internal scheduling process takes place whenever the MSCAN
arbitrates for the CAN bus. This is also the case after the occurrence of a transmission error.
When a high priority message is scheduled by the application software, it may become necessary to abort
a lower priority message in one of the three transmit buffers. Because messages that are already in
transmission cannot be aborted, the user must request the abort by setting the corresponding abort request
bit (ABTRQ) (see Section 10.3.2.9, “MSCAN Transmitter Message Abort Request Register
(CANTARQ)”.) The MSCAN then grants the request, if possible, by:
1. Setting the corresponding abort acknowledge flag (ABTAK) in the CANTAAK register.
2. Setting the associated TXE flag to release the buffer.
3. Generating a transmit interrupt. The transmit interrupt handler software can determine from the
setting of the ABTAK flag whether the message was aborted (ABTAK = 1) or sent (ABTAK = 0).
10.4.2.3 Receive Structures
The received messages are stored in a five stage input FIFO. The five message buffers are alternately
mapped into a single memory area (see Figure 10-38). The background receive buffer (RxBG) is
exclusively associated with the MSCAN, but the foreground receive buffer (RxFG) is addressable by the
CPU (see Figure 10-38). This scheme simplifies the handler software because only one address area is
applicable for the receive process.
All receive buffers have a size of 15 bytes to store the CAN control bits, the identifier (standard or
extended), the data contents, and a time stamp, if enabled (see Section 10.3.3, “Programmer’s Model of
Message Storage”).
The receiver full flag (RXF) (see Section 10.3.2.5, “MSCAN Receiver Flag Register (CANRFLG)”)
signals the status of the foreground receive buffer. When the buffer contains a correctly received message
with a matching identifier, this flag is set.
On reception, each message is checked to see whether it passes the filter (see Section 10.4.3, “Identifier
Acceptance Filter”) and simultaneously is written into the active RxBG. After successful reception of a
2
valid message, the MSCAN shifts the content of RxBG into the receiver FIFO , sets the RXF flag, and
3
generates a receive interrupt (see Section 10.4.7.3, “Receive Interrupt”) to the CPU . The user’s receive
handler must read the received message from the RxFG and then reset the RXF flag to acknowledge the
interrupt and to release the foreground buffer. A new message, which can follow immediately after the IFS
field of the CAN frame, is received into the next available RxBG. If the MSCAN receives an invalid
1. The transmit interrupt occurs only if not masked. A polling scheme can be applied on TXEx also.
2. Only if the RXF flag is not set.
3. The receive interrupt occurs only if not masked. A polling scheme can be applied on RXF also.
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message in its RxBG (wrong identifier, transmission errors, etc.) the actual contents of the buffer will be
over-written by the next message. The buffer will then not be shifted into the FIFO.
When the MSCAN module is transmitting, the MSCAN receives its own transmitted messages into the
background receive buffer, RxBG, but does not shift it into the receiver FIFO, generate a receive interrupt,
or acknowledge its own messages on the CAN bus. The exception to this rule is in loopback mode (see
Section 10.3.2.2, “MSCAN Control Register 1 (CANCTL1)”) where the MSCAN treats its own messages
exactly like all other incoming messages. The MSCAN receives its own transmitted messages in the event
that it loses arbitration. If arbitration is lost, the MSCAN must be prepared to become a receiver.
An overrun condition occurs when all receive message buffers in the FIFO are filled with correctly
received messages with accepted identifiers and another message is correctly received from the CAN bus
with an accepted identifier. The latter message is discarded and an error interrupt with overrun indication
is generated if enabled (see Section 10.4.7.5, “Error Interrupt”). The MSCAN remains able to transmit
messages while the receiver FIFO being filled, but all incoming messages are discarded. As soon as a
receive buffer in the FIFO is available again, new valid messages will be accepted.
10.4.3 Identifier Acceptance Filter
The MSCAN identifier acceptance registers (see Section 10.3.2.12, “MSCAN Identifier Acceptance
Control Register (CANIDAC)”) define the acceptable patterns of the standard or extended identifier
(ID[10:0] or ID[28:0]). Any of these bits can be marked ‘don’t care’ in the MSCAN identifier mask
registers (see Section 10.3.2.17, “MSCAN Identifier Mask Registers (CANIDMR0–CANIDMR7)”).
A filter hit is indicated to the application software by a set receive buffer full flag (RXF = 1) and three bits
in the CANIDAC register (see Section 10.3.2.12, “MSCAN Identifier Acceptance Control Register
(CANIDAC)”). These identifier hit flags (IDHIT[2:0]) clearly identify the filter section that caused the
acceptance. They simplify the application software’s task to identify the cause of the receiver interrupt. If
more than one hit occurs (two or more filters match), the lower hit has priority.
A very flexible programmable generic identifier acceptance filter has been introduced to reduce the CPU
interrupt loading. The filter is programmable to operate in four different modes (see Bosch CAN 2.0A/B
protocol specification):
•
Two identifier acceptance filters, each to be applied to:
— The full 29 bits of the extended identifier and to the following bits of the CAN 2.0B frame:
– Remote transmission request (RTR)
– Identifier extension (IDE)
– Substitute remote request (SRR)
1
— The 11 bits of the standard identifier plus the RTR and IDE bits of the CAN 2.0A/B messages .
This mode implements two filters for a full length CAN 2.0B compliant extended identifier.
Figure 10-39 shows how the first 32-bit filter bank (CANIDAR0–CANIDAR3,
CANIDMR0–CANIDMR3) produces a filter 0 hit. Similarly, the second filter bank
(CANIDAR4–CANIDAR7, CANIDMR4–CANIDMR7) produces a filter 1 hit.
•
Four identifier acceptance filters, each to be applied to
1. Although this mode can be used for standard identifiers, it is recommended to use the four or eight identifier acceptance
filters for standard identifiers
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— a) the 14 most significant bits of the extended identifier plus the SRR and IDE bits of CAN 2.0B
messages or
— b) the 11 bits of the standard identifier, the RTR and IDE bits of CAN 2.0A/B messages.
Figure 10-40 shows how the first 32-bit filter bank (CANIDAR0–CANIDA3,
CANIDMR0–3CANIDMR) produces filter 0 and 1 hits. Similarly, the second filter bank
(CANIDAR4–CANIDAR7, CANIDMR4–CANIDMR7) produces filter 2 and 3 hits.
•
•
Eight identifier acceptance filters, each to be applied to the first 8 bits of the identifier. This mode
implements eight independent filters for the first 8 bits of a CAN 2.0A/B compliant standard
identifier or a CAN 2.0B compliant extended identifier. Figure 10-41 shows how the first 32-bit
filter bank (CANIDAR0–CANIDAR3, CANIDMR0–CANIDMR3) produces filter 0 to 3 hits.
Similarly, the second filter bank (CANIDAR4–CANIDAR7, CANIDMR4–CANIDMR7)
produces filter 4 to 7 hits.
Closed filter. No CAN message is copied into the foreground buffer RxFG, and the RXF flag is
never set.
CAN 2.0B
Extended Identifier
ID28
ID10
IDR0
IDR0
ID21 ID20
ID3 ID2
IDR1
IDR1
ID15 ID14
IDR2
ID7 ID6
IDR3
RTR
CAN 2.0A/B
Standard Identifier
IDE
AM7
AC7
CANIDMR0
CANIDAR0
AM0 AM7
AC0 AC7
CANIDMR1
CANIDAR1
AM0 AM7
AC0 AC7
CANIDMR2
CANIDAR2
AM0 AM7
AC0 AC7
CANIDMR3
CANIDAR3
AM0
AC0
ID Accepted (Filter 0 Hit)
Figure 10-39. 32-bit Maskable Identifier Acceptance Filter
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CAN 2.0B
Extended Identifier
ID28
ID10
IDR0
IDR0
ID21 ID20
ID3 ID2
IDR1
IDR1
ID15 ID14
IDE
IDR2
ID7 ID6
IDR3
RTR
CAN 2.0A/B
Standard Identifier
AM7
AC7
CANIDMR0
CANIDAR0
AM0 AM7
AC0 AC7
CANIDMR1
CANIDAR1
AM0
AC0
ID Accepted (Filter 0 Hit)
AM7
AC7
CANIDMR2
CANIDAR2
AM0 AM7
AC0 AC7
CANIDMR3
AM0
AC0
CANIDAR3
ID Accepted (Filter 1 Hit)
Figure 10-40. 16-bit Maskable Identifier Acceptance Filters
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CAN 2.0B
Extended Identifier ID28
IDR0
IDR0
ID21 ID20
ID3 ID2
IDR1
IDR1
ID15 ID14
IDE
IDR2
ID7 ID6
IDR3
RTR
CAN 2.0A/B
ID10
Standard Identifier
AM7
AC7
CIDMR0
CIDAR0
AM0
AC0
ID Accepted (Filter 0 Hit)
AM7
AC7
CIDMR1
AM0
AC0
CIDAR1
ID Accepted (Filter 1 Hit)
AM7
AC7
CIDMR2
AM0
AC0
CIDAR2
ID Accepted (Filter 2 Hit)
AM7
AC7
CIDMR3
AM0
AC0
CIDAR3
ID Accepted (Filter 3 Hit)
Figure 10-41. 8-bit Maskable Identifier Acceptance Filters
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10.4.3.1 Protocol Violation Protection
The MSCAN protects the user from accidentally violating the CAN protocol through programming errors.
The protection logic implements the following features:
•
•
The receive and transmit error counters cannot be written or otherwise manipulated.
All registers which control the configuration of the MSCAN cannot be modified while the MSCAN
is on-line. The MSCAN has to be in Initialization Mode. The corresponding INITRQ/INITAK
handshake bits in the CANCTL0/CANCTL1 registers (see Section 10.3.2.1, “MSCAN Control
Register 0 (CANCTL0)”) serve as a lock to protect the following registers:
— MSCAN control 1 register (CANCTL1)
— MSCAN bus timing registers 0 and 1 (CANBTR0, CANBTR1)
— MSCAN identifier acceptance control register (CANIDAC)
— MSCAN identifier acceptance registers (CANIDAR0–CANIDAR7)
— MSCAN identifier mask registers (CANIDMR0–CANIDMR7)
•
•
The TXCAN pin is immediately forced to a recessive state when the MSCAN goes into the power
down mode or initialization mode (see Section 10.4.5.6, “MSCAN Power Down Mode,” and
Section 10.4.5.5, “MSCAN Initialization Mode”).
The MSCAN enable bit (CANE) is writable only once in normal system operation modes, which
provides further protection against inadvertently disabling the MSCAN.
10.4.3.2 Clock System
Figure 10-42 shows the structure of the MSCAN clock generation circuitry.
MSCAN
Bus Clock
Time quanta clock (Tq)
CANCLK
Prescaler
(1 .. 64)
CLKSRC
CLKSRC
Oscillator Clock
Figure 10-42. MSCAN Clocking Scheme
The clock source bit (CLKSRC) in the CANCTL1 register (10.3.2.2/10-294) defines whether the internal
CANCLK is connected to the output of a crystal oscillator (oscillator clock) or to the bus clock.
The clock source has to be chosen such that the tight oscillator tolerance requirements (up to 0.4%) of the
CAN protocol are met. Additionally, for high CAN bus rates (1 Mbps), a 45% to 55% duty cycle of the
clock is required.
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If the bus clock is generated from a PLL, it is recommended to select the oscillator clock rather than the
bus clock due to jitter considerations, especially at the faster CAN bus rates.
For microcontrollers without a clock and reset generator (CRG), CANCLK is driven from the crystal
oscillator (oscillator clock).
A programmable prescaler generates the time quanta (Tq) clock from CANCLK. A time quantum is the
atomic unit of time handled by the MSCAN.
Eqn. 10-2
f
CANCLK
= -----------------------------------------------------
Tq
(Prescaler value)
A bit time is subdivided into three segments as described in the Bosch CAN specification. (see Figure 10-
43):
•
•
•
SYNC_SEG: This segment has a fixed length of one time quantum. Signal edges are expected to
happen within this section.
Time Segment 1: This segment includes the PROP_SEG and the PHASE_SEG1 of the CAN
standard. It can be programmed by setting the parameter TSEG1 to consist of 4 to 16 time quanta.
Time Segment 2: This segment represents the PHASE_SEG2 of the CAN standard. It can be
programmed by setting the TSEG2 parameter to be 2 to 8 time quanta long.
Eqn. 10-3
f
Tq
Bit Rate= --------------------------------------------------------------------------------
(number of Time Quanta)
NRZ Signal
Time Segment 1
Time Segment 2
(PHASE_SEG2)
SYNC_SEG
1
(PROP_SEG + PHASE_SEG1)
4 ... 16
2 ... 8
8 ... 25 Time Quanta
= 1 Bit Time
Transmit Point
Sample Point
(single or triple sampling)
Figure 10-43. Segments within the Bit Time
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Table 10-33. Time Segment Syntax
Syntax
Description
System expects transitions to occur on the CAN bus during this
period.
SYNC_SEG
A node in transmit mode transfers a new value to the CAN bus at
this point.
Transmit Point
Sample Point
A node in receive mode samples the CAN bus at this point. If the
three samples per bit option is selected, then this point marks the
position of the third sample.
The synchronization jump width (see the Bosch CAN specification for details) can be programmed in a
range of 1 to 4 time quanta by setting the SJW parameter.
The SYNC_SEG, TSEG1, TSEG2, and SJW parameters are set by programming the MSCAN bus timing
registers (CANBTR0, CANBTR1) (see Section 10.3.2.3, “MSCAN Bus Timing Register 0 (CANBTR0)”
and Section 10.3.2.4, “MSCAN Bus Timing Register 1 (CANBTR1)”).
Table 10-34 gives an overview of the CAN compliant segment settings and the related parameter values.
NOTE
It is the user’s responsibility to ensure the bit time settings are in compliance
with the CAN standard.
Table 10-34. CAN Standard Compliant Bit Time Segment Settings
Synchronization
Time Segment 1
TSEG1
Time Segment 2
TSEG2
SJW
Jump Width
5 .. 10
4 .. 11
5 .. 12
6 .. 13
7 .. 14
8 .. 15
9 .. 16
4 .. 9
3 .. 10
4 .. 11
5 .. 12
6 .. 13
7 .. 14
8 .. 15
2
3
4
5
6
7
8
1
2
3
4
5
6
7
1 .. 2
1 .. 3
1 .. 4
1 .. 4
1 .. 4
1 .. 4
1 .. 4
0 .. 1
0 .. 2
0 .. 3
0 .. 3
0 .. 3
0 .. 3
0 .. 3
10.4.4 Modes of Operation
10.4.4.1 Normal Modes
The MSCAN module behaves as described within this specification in all normal system operation modes.
10.4.4.2 Special Modes
The MSCAN module behaves as described within this specification in all special system operation modes.
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10.4.4.3 Emulation Modes
In all emulation modes, the MSCAN module behaves just like normal system operation modes as
described within this specification.
10.4.4.4 Listen-Only Mode
In an optional CAN bus monitoring mode (listen-only), the CAN node is able to receive valid data frames
and valid remote frames, but it sends only “recessive” bits on the CAN bus. In addition, it cannot start a
transmision. If the MAC sub-layer is required to send a “dominant” bit (ACK bit, overload flag, or active
error flag), the bit is rerouted internally so that the MAC sub-layer monitors this “dominant” bit, although
the CAN bus may remain in recessive state externally.
10.4.4.5 Security Modes
The MSCAN module has no security features.
10.4.5 Low-Power Options
If the MSCAN is disabled (CANE = 0), the MSCAN clocks are stopped for power saving.
If the MSCAN is enabled (CANE = 1), the MSCAN has two additional modes with reduced power
consumption, compared to normal mode: sleep and power down mode. In sleep mode, power consumption
is reduced by stopping all clocks except those to access the registers from the CPU side. In power down
mode, all clocks are stopped and no power is consumed.
Table 10-35 summarizes the combinations of MSCAN and CPU modes. A particular combination of
modes is entered by the given settings on the CSWAI and SLPRQ/SLPAK bits.
For all modes, an MSCAN wake-up interrupt can occur only if the MSCAN is in sleep mode (SLPRQ = 1
and SLPAK = 1), wake-up functionality is enabled (WUPE = 1), and the wake-up interrupt is enabled
(WUPIE = 1).
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Table 10-35. CPU vs. MSCAN Operating Modes
MSCAN Mode
Reduced Power Consumption
CPU Mode
Normal
Disabled
(CANE=0)
Sleep
Power Down
CSWAI = X(1)
SLPRQ = 0
SLPAK = 0
CSWAI = X
SLPRQ = 1
SLPAK = 1
CSWAI = X
SLPRQ = X
SLPAK = X
RUN
CSWAI = 0
SLPRQ = 0
SLPAK = 0
CSWAI = 0
SLPRQ = 1
SLPAK = 1
CSWAI = 1
SLPRQ = X
SLPAK = X
CSWAI = X
SLPRQ = X
SLPAK = X
WAIT
CSWAI = X
SLPRQ = X
SLPAK = X
CSWAI = X
SLPRQ = X
SLPAK = X
STOP
1. ‘X’ means don’t care.
10.4.5.1 Operation in Run Mode
As shown in Table 10-35, only MSCAN sleep mode is available as low power option when the CPU is in
run mode.
10.4.5.2 Operation in Wait Mode
The WAI instruction puts the MCU in a low power consumption stand-by mode. If the CSWAI bit is set,
additional power can be saved in power down mode because the CPU clocks are stopped. After leaving
this power down mode, the MSCAN restarts its internal controllers and enters normal mode again.
While the CPU is in wait mode, the MSCAN can be operated in normal mode and generate interrupts
(registers can be accessed via background debug mode). The MSCAN can also operate in any of the low-
power modes depending on the values of the SLPRQ/SLPAK and CSWAI bits as seen in Table 10-35.
10.4.5.3 Operation in Stop Mode
The STOP instruction puts the MCU in a low power consumption stand-by mode. In stop mode, the
MSCAN is set in power down mode regardless of the value of the SLPRQ/SLPAK and CSWAI bits
Table 10-35.
10.4.5.4 MSCAN Sleep Mode
The CPU can request the MSCAN to enter this low power mode by asserting the SLPRQ bit in the
CANCTL0 register. The time when the MSCAN enters sleep mode depends on a fixed synchronization
delay and its current activity:
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•
If there are one or more message buffers scheduled for transmission (TXEx = 0), the MSCAN will
continue to transmit until all transmit message buffers are empty (TXEx = 1, transmitted
successfully or aborted) and then goes into sleep mode.
•
•
If the MSCAN is receiving, it continues to receive and goes into sleep mode as soon as the CAN
bus next becomes idle.
If the MSCAN is neither transmitting nor receiving, it immediately goes into sleep mode.
Bus Clock Domain
CAN Clock Domain
SLPRQ
Flag
SYNC
SYNC
SLPRQ
sync.
SLPRQ
CPU
Sleep Request
SLPAK
Flag
sync.
SLPAK
SLPAK
MSCAN
in Sleep Mode
Figure 10-44. Sleep Request / Acknowledge Cycle
NOTE
The application software must avoid setting up a transmission (by clearing
one or more TXEx flag(s)) and immediately request sleep mode (by setting
SLPRQ). Whether the MSCAN starts transmitting or goes into sleep mode
directly depends on the exact sequence of operations.
If sleep mode is active, the SLPRQ and SLPAK bits are set (Figure 10-44). The application software must
use SLPAK as a handshake indication for the request (SLPRQ) to go into sleep mode.
When in sleep mode (SLPRQ = 1 and SLPAK = 1), the MSCAN stops its internal clocks. However, clocks
that allow register accesses from the CPU side continue to run.
If the MSCAN is in bus-off state, it stops counting the 128 occurrences of 11 consecutive recessive bits
due to the stopped clocks. The TXCAN pin remains in a recessive state. If RXF = 1, the message can be
read and RXF can be cleared. Shifting a new message into the foreground buffer of the receiver FIFO
(RxFG) does not take place while in sleep mode.
It is possible to access the transmit buffers and to clear the associated TXE flags. No message abort takes
place while in sleep mode.
If the WUPE bit in CANCLT0 is not asserted, the MSCAN will mask any activity it detects on CAN. The
RXCAN pin is therefore held internally in a recessive state. This locks the MSCAN in sleep mode
(Figure 10-45). WUPE must be set before entering sleep mode to take effect.
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The MSCAN is able to leave sleep mode (wake up) only when:
•
CAN bus activity occurs and WUPE = 1
or
•
the CPU clears the SLPRQ bit
NOTE
The CPU cannot clear the SLPRQ bit before sleep mode (SLPRQ = 1 and
SLPAK = 1) is active.
After wake-up, the MSCAN waits for 11 consecutive recessive bits to synchronize to the CAN bus. As a
consequence, if the MSCAN is woken-up by a CAN frame, this frame is not received.
The receive message buffers (RxFG and RxBG) contain messages if they were received before sleep mode
was entered. All pending actions will be executed upon wake-up; copying of RxBG into RxFG, message
aborts and message transmissions. If the MSCAN remains in bus-off state after sleep mode was exited, it
continues counting the 128 occurrences of 11 consecutive recessive bits.
CAN Activity
(CAN Activity & WUPE) | SLPRQ
Wait
StartUp
for Idle
CAN Activity
SLPRQ
CAN Activity &
Sleep
Idle
SLPRQ
(CAN Activity & WUPE) |
CAN Activity
CAN Activity &
SLPRQ
CAN Activity
Tx/Rx
Message
Active
CAN Activity
Figure 10-45. Simplified State Transitions for Entering/Leaving Sleep Mode
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10.4.5.5 MSCAN Initialization Mode
In initialization mode, any on-going transmission or reception is immediately aborted and synchronization
to the CAN bus is lost, potentially causing CAN protocol violations. To protect the CAN bus system from
fatal consequences of violations, the MSCAN immediately drives the TXCAN pin into a recessive state.
NOTE
The user is responsible for ensuring that the MSCAN is not active when
initialization mode is entered. The recommended procedure is to bring the
MSCAN into sleep mode (SLPRQ = 1 and SLPAK = 1) before setting the
INITRQ bit in the CANCTL0 register. Otherwise, the abort of an on-going
message can cause an error condition and can impact other CAN bus
devices.
In initialization mode, the MSCAN is stopped. However, interface registers remain accessible. This mode
is used to reset the CANCTL0, CANRFLG, CANRIER, CANTFLG, CANTIER, CANTARQ,
CANTAAK, and CANTBSEL registers to their default values. In addition, the MSCAN enables the
configuration of the CANBTR0, CANBTR1 bit timing registers; CANIDAC; and the CANIDAR,
CANIDMR message filters. See Section 10.3.2.1, “MSCAN Control Register 0 (CANCTL0),” for a
detailed description of the initialization mode.
Bus Clock Domain
CAN Clock Domain
INIT
Flag
SYNC
SYNC
INITRQ
sync.
INITRQ
CPU
Init Request
INITAK
Flag
sync.
INITAK
INITAK
Figure 10-46. Initialization Request/Acknowledge Cycle
Due to independent clock domains within the MSCAN, INITRQ must be synchronized to all domains by
using a special handshake mechanism. This handshake causes additional synchronization delay (see
Section Figure 10-46., “Initialization Request/Acknowledge Cycle”).
If there is no message transfer ongoing on the CAN bus, the minimum delay will be two additional bus
clocks and three additional CAN clocks. When all parts of the MSCAN are in initialization mode, the
INITAK flag is set. The application software must use INITAK as a handshake indication for the request
(INITRQ) to go into initialization mode.
NOTE
The CPU cannot clear INITRQ before initialization mode (INITRQ = 1 and
INITAK = 1) is active.
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10.4.5.6 MSCAN Power Down Mode
The MSCAN is in power down mode (Table 10-35) when
•
CPU is in stop mode
or
•
CPU is in wait mode and the CSWAI bit is set
When entering the power down mode, the MSCAN immediately stops all ongoing transmissions and
receptions, potentially causing CAN protocol violations. To protect the CAN bus system from fatal
consequences of violations to the above rule, the MSCAN immediately drives the TXCAN pin into a
recessive state.
NOTE
The user is responsible for ensuring that the MSCAN is not active when
power down mode is entered. The recommended procedure is to bring the
MSCAN into Sleep mode before the STOP or WAI instruction (if CSWAI
is set) is executed. Otherwise, the abort of an ongoing message can cause an
error condition and impact other CAN bus devices.
In power down mode, all clocks are stopped and no registers can be accessed. If the MSCAN was not in
sleep mode before power down mode became active, the module performs an internal recovery cycle after
powering up. This causes some fixed delay before the module enters normal mode again.
10.4.5.7 Programmable Wake-Up Function
The MSCAN can be programmed to wake up the MSCAN as soon as CAN bus activity is detected (see
control bit WUPE in Section 10.3.2.1, “MSCAN Control Register 0 (CANCTL0)”). The sensitivity to
existing CAN bus action can be modified by applying a low-pass filter function to the RXCAN input line
while in sleep mode (see control bit WUPM in Section 10.3.2.2, “MSCAN Control Register 1
(CANCTL1)”).
This feature can be used to protect the MSCAN from wake-up due to short glitches on the CAN bus lines.
Such glitches can result from—for example—electromagnetic interference within noisy environments.
10.4.6 Reset Initialization
The reset state of each individual bit is listed in Section 10.3.2, “Register Descriptions,” which details all
the registers and their bit-fields.
10.4.7 Interrupts
This section describes all interrupts originated by the MSCAN. It documents the enable bits and generated
flags. Each interrupt is listed and described separately.
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10.4.7.1 Description of Interrupt Operation
The MSCAN supports four interrupt vectors (see Table 10-36), any of which can be individually masked
(for details see sections from Section 10.3.2.6, “MSCAN Receiver Interrupt Enable Register
(CANRIER),” to Section 10.3.2.8, “MSCAN Transmitter Interrupt Enable Register (CANTIER)”).
NOTE
The dedicated interrupt vector addresses are defined in the Resets and
Interrupts chapter.
Table 10-36. Interrupt Vectors
Interrupt Source
CCR Mask
Local Enable
CANRIER (WUPIE)
Wake-Up Interrupt (WUPIF)
Error Interrupts Interrupt (CSCIF, OVRIF)
Receive Interrupt (RXF)
I bit
I bit
I bit
I bit
CANRIER (CSCIE, OVRIE)
CANRIER (RXFIE)
Transmit Interrupts (TXE[2:0])
CANTIER (TXEIE[2:0])
10.4.7.2 Transmit Interrupt
At least one of the three transmit buffers is empty (not scheduled) and can be loaded to schedule a message
for transmission. The TXEx flag of the empty message buffer is set.
10.4.7.3 Receive Interrupt
A message is successfully received and shifted into the foreground buffer (RxFG) of the receiver FIFO.
This interrupt is generated immediately after receiving the EOF symbol. The RXF flag is set. If there are
multiple messages in the receiver FIFO, the RXF flag is set as soon as the next message is shifted to the
foreground buffer.
10.4.7.4 Wake-Up Interrupt
A wake-up interrupt is generated if activity on the CAN bus occurs during MSCN internal sleep mode.
WUPE (see Section 10.3.2.1, “MSCAN Control Register 0 (CANCTL0)”) must be enabled.
10.4.7.5 Error Interrupt
An error interrupt is generated if an overrun of the receiver FIFO, error, warning, or bus-off condition
occurrs. Section 10.3.2.5, “MSCAN Receiver Flag Register (CANRFLG) indicates one of the following
conditions:
•
Overrun — An overrun condition of the receiver FIFO as described in Section 10.4.2.3, “Receive
Structures,” occurred.
•
CAN Status Change — The actual value of the transmit and receive error counters control the
CAN bus state of the MSCAN. As soon as the error counters skip into a critical range (Tx/Rx-
warning, Tx/Rx-error, bus-off) the MSCAN flags an error condition. The status change, which
caused the error condition, is indicated by the TSTAT and RSTAT flags (see Section 10.3.2.5,
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“MSCAN Receiver Flag Register (CANRFLG)” and Section 10.3.2.6, “MSCAN Receiver
Interrupt Enable Register (CANRIER)”).
10.4.7.6 Interrupt Acknowledge
Interrupts are directly associated with one or more status flags in either the Section 10.3.2.5, “MSCAN
Receiver Flag Register (CANRFLG)” or the Section 10.3.2.7, “MSCAN Transmitter Flag Register
(CANTFLG).” Interrupts are pending as long as one of the corresponding flags is set. The flags in
CANRFLG and CANTFLG must be reset within the interrupt handler to handshake the interrupt. The flags
are reset by writing a 1 to the corresponding bit position. A flag cannot be cleared if the respective
condition prevails.
NOTE
It must be guaranteed that the CPU clears only the bit causing the current
interrupt. For this reason, bit manipulation instructions (BSET) must not be
used to clear interrupt flags. These instructions may cause accidental
clearing of interrupt flags which are set after entering the current interrupt
service routine.
10.4.7.7 Recovery from Stop or Wait
The MSCAN can recover from stop or wait via the wake-up interrupt. This interrupt can only occur if the
MSCAN was in sleep mode (SLPRQ = 1 and SLPAK = 1) before entering power down mode, the wake-
up option is enabled (WUPE = 1), and the wake-up interrupt is enabled (WUPIE = 1).
10.5 Initialization/Application Information
10.5.1 MSCAN initialization
The procedure to initially start up the MSCAN module out of reset is as follows:
1. Assert CANE
2. Write to the configuration registers in initialization mode
3. Clear INITRQ to leave initialization mode and enter normal mode
If the configuration of registers which are writable in initialization mode needs to be changed only when
the MSCAN module is in normal mode:
1. Bring the module into sleep mode by setting SLPRQ and awaiting SLPAK to assert after the CAN
bus becomes idle.
2. Enter initialization mode: assert INITRQ and await INITAK
3. Write to the configuration registers in initialization mode
4. Clear INITRQ to leave initialization mode and continue in normal mode
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Chapter 11
Oscillator (OSCV2) Block Description
11.1 Introduction
The OSCV2 module provides two alternative oscillator concepts:
•
•
A low noise and low power Colpitts oscillator with amplitude limitation control (ALC)
A robust full swing Pierce oscillator with the possibility to feed in an external square wave
11.1.1 Features
The Colpitts OSCV2 option provides the following features:
•
Amplitude limitation control (ALC) loop:
— Low power consumption and low current induced RF emission
— Sinusoidal waveform with low RF emission
— Low crystal stress (an external damping resistor is not required)
— Normal and low amplitude mode for further reduction of power and emission
An external biasing resistor is not required
•
The Pierce OSC option provides the following features:
•
•
•
•
Wider high frequency operation range
No DC voltage applied across the crystal
Full rail-to-rail (2.5 V nominal) swing oscillation with low EM susceptibility
Fast start up
Common features:
•
•
Clock monitor (CM)
Operation from the V
2.5 V (nominal) supply rail
DDPLL
11.1.2 Modes of Operation
Two modes of operation exist:
•
Amplitude limitation controlled Colpitts oscillator mode suitable for power and emission critical
applications
•
Full swing Pierce oscillator mode that can also be used to feed in an externally generated square
wave suitable for high frequency operation and harsh environments
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Chapter 11 Oscillator (OSCV2) Block Description
11.2 External Signal Description
This section lists and describes the signals that connect off chip.
11.2.1 VDDPLL and VSSPLL — PLL Operating Voltage, PLL Ground
These pins provide the operating voltage (V
) and ground (V
) for the OSCV2 circuitry. This
DDPLL
SSPLL
allows the supply voltage to the OSCV2 to be independently bypassed.
11.2.2 EXTAL and XTAL — Clock/Crystal Source Pins
These pins provide the interface for either a crystal or a CMOS compatible clock to control the internal
clock generator circuitry. EXTAL is the external clock input or the input to the crystal oscillator amplifier.
XTAL is the output of the crystal oscillator amplifier. All the MCU internal system clocks are derived from
the EXTAL input frequency. In full stop mode (PSTP = 0) the EXTAL pin is pulled down by an internal
resistor of typical 200 kΩ.
NOTE
Freescale Semiconductor recommends an evaluation of the application
board and chosen resonator or crystal by the resonator or crystal supplier.
The Crystal circuit is changed from standard.
The Colpitts circuit is not suited for overtone resonators and crystals.
EXTAL
CDC*
Crystal or Ceramic
Resonator
C1
MCU
XTAL
C2
VSSPLL
* Due to the nature of a translated ground Colpitts oscillator
a DC voltage bias is applied to the crystal.
Please contact the crystal manufacturer for crystal DC bias
conditions and recommended capacitor value CDC.
Figure 11-1. Colpitts Oscillator Connections (XCLKS = 0)
NOTE
The Pierce circuit is not suited for overtone resonators and crystals without
a careful component selection.
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EXTAL
MCU
C3
Crystal or Ceramic
Resonator
RB
RS*
XTAL
C4
VSSPLL
* Rs can be zero (shorted) when used with higher frequency crystals.
Refer to manufacturer’s data.
Figure 11-2. Pierce Oscillator Connections (XCLKS = 1)
CMOS-Compatible
External Oscillator
(VDDPLL Level)
EXTAL
MCU
XTAL
Not Connected
Figure 11-3. External Clock Connections (XCLKS = 1)
11.2.3 XCLKS — Colpitts/Pierce Oscillator Selection Signal
The XCLKS is an input signal which controls whether a crystal in combination with the internal Colpitts
(low power) oscillator is used or whether the Pierce oscillator/external clock circuitry is used. The XCLKS
signal is sampled during reset with the rising edge of RESET. Table 11-1 lists the state coding of the
sampled XCLKS signal. Refer to the device overview chapter for polarity of the XCLKS pin.
Table 11-1. Clock Selection Based on XCLKS
XCLKS
Description
0
1
Colpitts oscillator selected
Pierce oscillator/external clock selected
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11.3 Memory Map and Register Definition
The CRG contains the registers and associated bits for controlling and monitoring the OSCV2 module.
11.4 Functional Description
The OSCV2 block has two external pins, EXTAL and XTAL. The oscillator input pin, EXTAL, is intended
to be connected to either a crystal or an external clock source. The selection of Colpitts oscillator or Pierce
oscillator/external clock depends on the XCLKS signal which is sampled during reset. The XTAL pin is
an output signal that provides crystal circuit feedback.
A buffered EXTAL signal, OSCCLK, becomes the internal reference clock. To improve noise immunity,
the oscillator is powered by the V
and V
power supply pins.
DDPLL
SSPLL
The Pierce oscillator can be used for higher frequencies compared to the low power Colpitts oscillator.
11.4.1 Amplitude Limitation Control (ALC)
The Colpitts oscillator is equipped with a feedback system which does not waste current by generating
harmonics. Its configuration is “Colpitts oscillator with translated ground.” The transconductor used is
driven by a current source under the control of a peak detector which will measure the amplitude of the
AC signal appearing on EXTAL node in order to implement an amplitude limitation control (ALC) loop.
The ALC loop is in charge of reducing the quiescent current in the transconductor as a result of an increase
in the oscillation amplitude. The oscillation amplitude can be limited to two values. The normal amplitude
which is intended for non power saving modes and a small amplitude which is intended for low power
operation modes. Please refer to the CRG block description chapter for the control and assignment of the
amplitude value to operation modes.
11.4.2 Clock Monitor (CM)
The clock monitor circuit is based on an internal resistor-capacitor (RC) time delay so that it can operate
without any MCU clocks. If no OSCCLK edges are detected within this RC time delay, the clock monitor
indicates a failure which asserts self clock mode or generates a system reset depending on the state of
SCME bit. If the clock monitor is disabled or the presence of clocks is detected no failure is indicated.The
clock monitor function is enabled/disabled by the CME control bit, described in the CRG block description
chapter.
11.5 Interrupts
OSCV2 contains a clock monitor, which can trigger an interrupt or reset. The control bits and status bits
for the clock monitor are described in the CRG block description chapter.
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Chapter 12
Pulse-Width Modulator (PWM8B4CRev 01.24) Block
Description
12.1 Introduction
The pulse width modulation (PWM) definition is based on the HC12 PWM definitions. The PWM8B4C
module contains the basic features from the HC11 with some of the enhancements incorporated on the
HC12, that is center aligned output mode and four available clock sources. The PWM8B4C module has
four channels with independent control of left and center aligned outputs on each channel.
Each of the PWM channels has a programmable period and duty cycle as well as a dedicated counter. A
flexible clock select scheme allows a total of four different clock sources to be used with the counters. Each
of the modulators can create independent continuous waveforms with software-selectable duty rates from
0% to 100%. The PWM outputs can be programmed as left aligned outputs or center aligned outputs
12.1.1 Features
•
•
•
•
•
Four independent PWM channels with programmable period and duty cycle
Dedicated counter for each PWM channel
Programmable PWM enable/disable for each channel
Software selection of PWM duty pulse polarity for each channel
Period and duty cycle are double buffered. Change takes effect when the end of the effective period
is reached (PWM counter reaches 0) or when the channel is disabled.
•
•
•
•
•
Programmable center or left aligned outputs on individual channels
Four 8-bit channel or two16-bit channel PWM resolution
Four clock sources (A, B, SA, and SB) provide for a wide range of frequencies.
Programmable clock select logic
Emergency shutdown
12.1.2 Modes of Operation
There is a software programmable option for low power consumption in wait mode that disables the input
clock to the prescaler.
In freeze mode there is a software programmable option to disable the input clock to the prescaler. This is
useful for emulation.
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12.1.3 Block Diagram
PWM8B4C
PWM Channels
Bus Clock
PWM Clock
Clock Select
Control
Channel 3
Period and Duty
PWM3
PWM2
PWM1
PWM0
Counter
Counter
Counter
Counter
Channel 2
Period and Duty
Enable
Channel 1
Period and Duty
Polarity
Alignment
Channel 0
Period and Duty
Figure 12-1. PWM8B4C Block Diagram
12.2 External Signal Description
The PWM8B4C module has a total of four external pins.
12.2.1 PWM3 — Pulse Width Modulator Channel 3 Pin
This pin serves as waveform output of PWM channel 3.
12.2.2 PWM2 — Pulse Width Modulator Channel 2 Pin
This pin serves as waveform output of PWM channel 2.
12.2.3 PWM1 — Pulse Width Modulator Channel 1 Pin
This pin serves as waveform output of PWM channel 1.
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12.2.4 PWM0 — Pulse Width Modulator Channel 0 Pin
This pin serves as waveform output of PWM channel 0.
12.3 Memory Map and Registers
This subsection describes in detail all the registers and register bits in the PWM8B4C module.
The special-purpose registers and register bit functions that would not normally be made available to
device end users, such as factory test control registers and reserved registers are clearly identified by means
of shading the appropriate portions of address maps and register diagrams. Notes explaining the reasons
for restricting access to the registers and functions are also explained in the individual register descriptions.
12.3.1 Module Memory Map
The following paragraphs describe the content of the registers in the PWM8B4C module. The base address
of the PWM8B4C module is determined at the MCU level when the MCU is defined. The register decode
map is fixed and begins at the first address of the module address offset.
Reserved bits within a register will always read as 0 and the write will be unimplemented. Unimplemented
functions are indicated by shading the bit.
Table 12-2 shows the memory map for the PWM8B4C module.
NOTE
Register address = base address + address offset, where the base address is
defined at the MCU level and the address offset is defined at the module
level.
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
12.3.2 Register Descriptions
The following paragraphs describe in detail all the registers and register bits in the PWM8B4C module.
Address
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
W
R
0
0
0x0000
PWME
PWME3
PWME2
PWME1
PWME0
0
0
0
0
0
0
0
0
0
0x0001
0x0002
PWMPOL
PWMCLK
PPOL3
PPOL2
PCLK2
PCKA2
CAE2
PPOL1
PCLK1
PCKA1
PPOL0
PCLK0
PCKA0
W
R
PCLK3
0
W
R
0x0003 PWMPRCLK
PCKB2
0
PCKB1
PCKB0
W
R
0x0004
0x0005
0x0006
PWMCAE
PWMCTL
PWMTST
CAE2
CAE1
0
CAE0
0
W
R
CON23
0
CON01
0
PSWAI
0
PFRZ
0
W
R
0
0
0
0
0
0
W
R
0
5
0
4
0
3
0
2
0x0007 PWMPRSC
0x0008 PWMSCLA
0x0009 PWMSCLB
0x000A PWMSCNTA
0x000B PWMSCNTB
0x000C PWMCNT0
0x000D PWMCNT1
0x000E PWMCNT2
0x000F PWMCNT3
W
R
Bit 7
6
1
Bit 0
W
R
Bit 7
0
6
0
5
0
4
0
3
0
2
0
1
0
Bit 0
0
W
R
W
R
0
0
0
0
0
0
0
0
W
R
Bit 7
0
6
0
6
0
6
0
6
0
5
0
5
0
5
0
5
0
4
0
4
0
4
0
4
0
3
0
3
0
3
0
3
0
2
0
2
0
2
0
2
0
1
0
1
0
1
0
1
0
Bit 0
0
W
R
Bit 7
0
Bit 0
0
W
R
Bit 7
0
Bit 0
0
W
R
Bit 7
0
Bit 0
0
W
R
0x0010
0x0011
Reserved
Reserved
W
R
W
R
0x0012 PWMPER0
Bit 7
6
5
4
3
2
1
Bit 0
W
= Unimplemented or Reserved
Figure 12-2. PWM Register Summary
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Address
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
W
R
0x0013 PWMPER1
0x0014 PWMPER2
0x0015 PWMPER3
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
Bit 7
6
6
5
5
4
4
3
3
2
2
1
1
Bit 0
Bit 0
W
R
W
R
0x0016
0x0017
Reserved
Reserved
W
R
W
R
0x0018 PWMDTY0
0x0019 PWMPER1
0x001A PWMPER2
0x001B PWMPER3
Bit 7
Bit 7
Bit 7
Bit 7
6
6
6
6
5
5
5
5
4
4
4
4
3
3
3
3
2
2
2
2
1
1
1
1
Bit 0
Bit 0
Bit 0
Bit 0
W
R
W
R
W
R
W
R
0x001C
0x001D
Reserved
Reserved
W
R
W
R
0
0
PWM5IN
0x001E PWMSDB
PWMIF
PWMIE
PWMLVL
PWM5INL PWM5ENA
W
PWMRSTRT
= Unimplemented or Reserved
Figure 12-2. PWM Register Summary (continued)
12.3.2.1 PWM Enable Register (PWME)
Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx
bits are set (PWMEx = 1), the associated PWM output is enabled immediately. However, the actual PWM
waveform is not available on the associated PWM output until its clock source begins its next cycle due to
the synchronization of PWMEx and the clock source.
NOTE
The first PWM cycle after enabling the channel can be irregular.
An exception to this is when channels are concatenated. After concatenated mode is enabled (CONxx bits
set in PWMCTL register), enabling/disabling the corresponding 16-bit PWM channel is controlled by the
low-order PWMEx bit. In this case, the high-order bytes PWMEx bits have no effect and their
corresponding PWM output lines are disabled.
While in run mode, if all PWM channels are disabled (PWME3–PWME0 = 0), the prescaler counter shuts
off for power savings.
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Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
0
0
PWME3
PWME2
PWME1
PWME0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-3. PWM Enable Register (PWME)
Read: anytime
Write: anytime
Table 12-1. PWME Field Descriptions
Description
Field
3
Pulse Width Channel 3 Enable
0 Pulse width channel 3 is disabled.
PWME3
1 Pulse width channel 3 is enabled. The pulse modulated signal becomes available at PWM, output bit 3 when
its clock source begins its next cycle.
2
Pulse Width Channel 2 Enable
PWME2
0 Pulse width channel 2 is disabled.
1 Pulse width channel 2 is enabled. The pulse modulated signal becomes available at PWM, output bit 2 when
its clock source begins its next cycle. If CON23 = 1, then bit has no effect and PWM output line 2 is disabled.
1
Pulse Width Channel 1 Enable
PWME1
0 Pulse width channel 1 is disabled.
1 Pulse width channel 1 is enabled. The pulse modulated signal becomes available at PWM, output bit 1 when
its clock source begins its next cycle.
0
Pulse Width Channel 0 Enable
PWME0
0 Pulse width channel 0 is disabled.
1 Pulse width channel 0 is enabled. The pulse modulated signal becomes available at PWM, output bit 0 when
its clock source begins its next cycle. If CON01 = 1, then bit has no effect and PWM output line 0 is disabled.
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
12.3.2.2 PWM Polarity Register (PWMPOL)
The starting polarity of each PWM channel waveform is determined by the associated PPOLx bit in the
PWMPOL register. If the polarity bit is 1, the PWM channel output is high at the beginning of the cycle
and then goes low when the duty count is reached. Conversely, if the polarity bit is 0 the output starts low
and then goes high when the duty count is reached.
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
0
0
PPOL3
PPOL2
PPOL1
PPOL0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-4. PWM Polarity Register (PWMPOL)
Read: anytime
Write: anytime
NOTE
PPOLx register bits can be written anytime. If the polarity is changed while
a PWM signal is being generated, a truncated or stretched pulse can occur
during the transition
Table 12-2. PWMPOL Field Descriptions
Description
Field
3
Pulse Width Channel 3 Polarity
PPOL3
0 PWM channel 3 output is low at the beginning of the period, then goes high when the duty count is reached.
1 PWM channel 3 output is high at the beginning of the period, then goes low when the duty count is reached.
2
Pulse Width Channel 2 Polarity
PPOL2
0 PWM channel 2 output is low at the beginning of the period, then goes high when the duty count is reached.
1 PWM channel 2 output is high at the beginning of the period, then goes low when the duty count is reached.
1
Pulse Width Channel 1 Polarity
PPOL1
0 PWM channel 1 output is low at the beginning of the period, then goes high when the duty count is reached.
1 PWM channel 1 output is high at the beginning of the period, then goes low when the duty count is reached.
0
Pulse Width Channel 0 Polarity
PPOL0
0 PWM channel 0 output is low at the beginning of the period, then goes high when the duty count is reached
1 PWM channel 0 output is high at the beginning of the period, then goes low when the duty count is reached.
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
12.3.2.3 PWM Clock Select Register (PWMCLK)
Each PWM channel has a choice of two clocks to use as the clock source for that channel as described
below.
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
0
0
PCLK3
PCLK2
PCLK1
PCLK0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-5. PWM Clock Select Register (PWMCLK)
Read: anytime
Write: anytime
NOTE
Register bits PCLK0 to PCLK3 can be written anytime. If a clock select is
changed while a PWM signal is being generated, a truncated or stretched
pulse can occur during the transition.
Table 12-3. PWMCLK Field Descriptions
Description
Field
3
Pulse Width Channel 3 Clock Select
PCLK3
0 Clock B is the clock source for PWM channel 3.
1 Clock SB is the clock source for PWM channel 3.
2
Pulse Width Channel 2 Clock Select
PCLK2
0 Clock B is the clock source for PWM channel 2.
1 Clock SB is the clock source for PWM channel 2.
1
Pulse Width Channel 1 Clock Select
PCLK1
0 Clock A is the clock source for PWM channel 1.
1 Clock SA is the clock source for PWM channel 1.
0
Pulse Width Channel 0 Clock Select
PCLK0
0 Clock A is the clock source for PWM channel 0.
1 Clock SA is the clock source for PWM channel 0.
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12.3.2.4 PWM Prescale Clock Select Register (PWMPRCLK)
This register selects the prescale clock source for clocks A and B independently.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
0
0
PCKB2
PCKB1
PCKB0
PCKA2
PCKA1
PCKA0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-6. PWM Prescaler Clock Select Register (PWMPRCLK)
Read: anytime
Write: anytime
NOTE
PCKB2–PCKB0 and PCKA2–PCKA0 register bits can be written anytime.
If the clock prescale is changed while a PWM signal is being generated, a
truncated or stretched pulse can occur during the transition.
Table 12-4. PWMPRCLK Field Descriptions
Description
Field
6–5
Prescaler Select for Clock B — Clock B is 1 of two clock sources which can be used for channels 2 or 3. These
PCKB[2:0] three bits determine the rate of clock B, as shown in Table 12-5.
2–0 Prescaler Select for Clock A — Clock A is 1 of two clock sources which can be used for channels 0, 1, 4, or 5.
PCKA[2:0] These three bits determine the rate of clock A, as shown in Table 12-6.
Table 12-5. Clock B Prescaler Selects
PCKB2
PCKB1
PCKB0
Value of Clock B
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Bus Clock
Bus Clock / 2
Bus Clock / 4
Bus Clock / 8
Bus Clock / 16
Bus Clock / 32
Bus Clock / 64
Bus Clock / 128
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
Table 12-6. Clock A Prescaler Selects
PCKA2
PCKA1
PCKA0
Value of Clock A
0
0
0
0
1
1
1
1
0
0
Bus Clock
Bus Clock / 2
Bus Clock / 4
Bus Clock / 8
Bus Clock / 16
Bus Clock / 32
Bus Clock / 64
Bus Clock / 128
0
1
1
0
0
1
1
1
0
1
0
1
0
1
12.3.2.5 PWM Center Align Enable Register (PWMCAE)
The PWMCAE register contains control bits for the selection of center aligned outputs or left aligned
outputs for each PWM channel. If the CAEx bit is set to a 1, the corresponding PWM output will be center
aligned. If the CAEx bit is cleared, the corresponding PWM output will be left aligned. Reference
Section 12.4.2.5, “Left Aligned Outputs,” and Section 12.4.2.6, “Center Aligned Outputs,” for a more
detailed description of the PWM output modes.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
0
0
CAE3
CAE2
CAE1
CAE0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-7. PWM Center Align Enable Register (PWMCAE)
Read: anytime
Write: anytime
NOTE
Write these bits only when the corresponding channel is disabled.
Table 12-7. PWMCAE Field Descriptions
Description
Field
3
Center Aligned Output Mode on Channel 3
1 Channel 3 operates in left aligned output mode.
1 Channel 3 operates in center aligned output mode.
CAE3
2
Center Aligned Output Mode on Channel 2
0 Channel 2 operates in left aligned output mode.
1 Channel 2 operates in center aligned output mode.
CAE2
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
Table 12-7. PWMCAE Field Descriptions (continued)
Field
Description
1
Center Aligned Output Mode on Channel 1
CAE1
0 Channel 1 operates in left aligned output mode.
1 Channel 1 operates in center aligned output mode.
0
Center Aligned Output Mode on Channel 0
0 Channel 0 operates in left aligned output mode.
1 Channel 0 operates in center aligned output mode.
CAE0
12.3.2.6 PWM Control Register (PWMCTL)
The PWMCTL register provides for various control of the PWM module.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
0
0
0
CON23
CON01
PSWAI
PFRZ
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-8. PWM Control Register (PWMCTL)
Read: anytime
Write: anytime
There are control bits for concatenation, each of which is used to concatenate a pair of PWM channels into
one 16-bit channel. When channels 2 and 3 are concatenated, channel 2 registers become the high-order
bytes of the double-byte channel. When channels 0 and 1 are concatenated, channel 0 registers become the
high-order bytes of the double-byte channel.
Reference Section 12.4.2.7, “PWM 16-Bit Functions,” for a more detailed description of the concatenation
PWM function.
NOTE
Change these bits only when both corresponding channels are disabled.
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
Table 12-8. PWMCTL Field Descriptions
Field
Description
5
Concatenate Channels 2 and 3
CON23
0 Channels 2 and 3 are separate 8-bit PWMs.
1 Channels 2 and 3 are concatenated to create one 16-bit PWM channel. Channel 2 becomes the high-order
byte and channel 3 becomes the low-order byte. Channel 3 output pin is used as the output for this 16-bit PWM
(bit 3 of port PWMP). Channel 3 clock select control bit determines the clock source, channel 3 polarity bit
determines the polarity, channel 3 enable bit enables the output and channel 3 center aligned enable bit
determines the output mode.
4
Concatenate Channels 0 and 1
CON01
0 Channels 0 and 1 are separate 8-bit PWMs.
1 Channels 0 and 1 are concatenated to create one 16-bit PWM channel. Channel 0 becomes the high-order
byte and channel 1 becomes the low-order byte. Channel 1 output pin is used as the output for this 16-bit PWM
(bit 1 of port PWMP). Channel 1 clock select control bit determines the clock source, channel 1 polarity bit
determines the polarity, channel 1 enable bit enables the output and channel 1 center aligned enable bit
determines the output mode.
3
PWM Stops in Wait Mode — Enabling this bit allows for lower power consumption in wait mode by disabling the
input clock to the prescaler.
PSWAI
0 Allow the clock to the prescaler to continue while in wait mode.
1 Stop the input clock to the prescaler whenever the MCU is in wait mode.
2
PWM Counters Stop in Freeze Mode — In freeze mode, there is an option to disable the input clock to the
prescaler by setting the PFRZ bit in the PWMCTL register. If this bit is set, whenever the MCU is in freeze mode
the input clock to the prescaler is disabled. This feature is useful during emulation as it allows the PWM function
to be suspended. In this way, the counters of the PWM can be stopped while in freeze mode so that after normal
program flow is continued, the counters are re-enabled to simulate real-time operations. Because the registers
remain accessible in this mode, to re-enable the prescaler clock, either disable the PFRZ bit or exit freeze mode.
0 Allow PWM to continue while in freeze mode.
PFRZ
1 Disable PWM input clock to the prescaler whenever the part is in freeze mode. This is useful for emulation.
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
12.3.2.7 Reserved Register (PWMTST)
This register is reserved for factory testing of the PWM module and is not available in normal modes.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-9. Reserved Register (PWMTST)
Read: always read 0x0000 in normal modes
Write: unimplemented in normal modes
NOTE
Writing to this register when in special modes can alter the PWM
functionality.
12.3.2.8 Reserved Register (PWMPRSC)
This register is reserved for factory testing of the PWM module and is not available in normal modes.
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-10. Reserved Register (PWMPRSC)
Read: always read 0x0000 in normal modes
Write: unimplemented in normal modes
NOTE
Writing to this register when in special modes can alter the PWM
functionality.
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
12.3.2.9 PWM Scale A Register (PWMSCLA)
PWMSCLA is the programmable scale value used in scaling clock A to generate clock SA. Clock SA is
generated by taking clock A, dividing it by the value in the PWMSCLA register and dividing that by two.
Clock SA = Clock A / (2 * PWMSCLA)
NOTE
When PWMSCLA = 0x0000, PWMSCLA value is considered a full scale
value of 256. Clock A is thus divided by 512.
Any value written to this register will cause the scale counter to load the new scale value (PWMSCLA).
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 12-11. PWM Scale A Register (PWMSCLA)
Read: anytime
Write: anytime (causes the scale counter to load the PWMSCLA value)
12.3.2.10 PWM Scale B Register (PWMSCLB)
PWMSCLB is the programmable scale value used in scaling clock B to generate clock SB. Clock SB is
generated by taking clock B, dividing it by the value in the PWMSCLB register and dividing that by two.
Clock SB = Clock B / (2 * PWMSCLB)
NOTE
When PWMSCLB = 0x0000, PWMSCLB value is considered a full scale
value of 256. Clock B is thus divided by 512.
Any value written to this register will cause the scale counter to load the new scale value (PWMSCLB).
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 12-12. PWM Scale B Register (PWMSCLB)
Read: anytime
Write: anytime (causes the scale counter to load the PWMSCLB value).
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
12.3.2.11 Reserved Registers (PWMSCNTx)
The registers PWMSCNTA and PWMSCNTB are reserved for factory testing of the PWM module and
are not available in normal modes.
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-13. Reserved Register (PWMSCNTA)
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-14. Reserved Register (PWMSCNTB)
Read: always read 0x0000 in normal modes
Write: unimplemented in normal modes
NOTE
Writing to these registers when in special modes can alter the PWM
functionality.
12.3.2.12 PWM Channel Counter Registers (PWMCNTx)
Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source.
The counter can be read at any time without affecting the count or the operation of the PWM channel. In
left aligned output mode, the counter counts from 0 to the value in the period register – 1. In center aligned
output mode, the counter counts from 0 up to the value in the period register and then back down to 0.
Any value written to the counter causes the counter to reset to 0x0000, the counter direction to be set to
up, the immediate load of both duty and period registers with values from the buffers, and the output to
change according to the polarity bit. The counter is also cleared at the end of the effective period (see
Section 12.4.2.5, “Left Aligned Outputs,” and Section 12.4.2.6, “Center Aligned Outputs,” for more
details). When the channel is disabled (PWMEx = 0), the PWMCNTx register does not count. When a
channel becomes enabled (PWMEx = 1), the associated PWM counter starts at the count in the
PWMCNTx register. For more detailed information on the operation of the counters, reference
Section 12.4.2.4, “PWM Timer Counters.”
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
In concatenated mode, writes to the 16-bit counter by using a 16-bit access or writes to either the low- or
high-order byte of the counter will reset the 16-bit counter. Reads of the 16-bit counter must be made by
16-bit access to maintain data coherency.
NOTE
Writing to the counter while the channel is enabled can cause an irregular
PWM cycle to occur.
Module Base + 0x000C
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Reset
Figure 12-15. PWM Channel Counter Registers (PWMCNT0)
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Reset
Figure 12-16. PWM Channel Counter Registers (PWMCNT1)
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Reset
Figure 12-17. PWM Channel Counter Registers (PWMCNT2)
Module Base + 0x000F
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Reset
Figure 12-18. PWM Channel Counter Registers (PWMCNT3)
Read: anytime
Write: anytime (any value written causes PWM counter to be reset to 0x0000).
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
12.3.2.13 PWM Channel Period Registers (PWMPERx)
There is a dedicated period register for each channel. The value in this register determines the period of
the associated PWM channel.
The period registers for each channel are double buffered so that if they change while the channel is
enabled, the change will NOT take effect until one of the following occurs:
•
•
•
The effective period ends
The counter is written (counter resets to 0x0000)
The channel is disabled
In this way, the output of the PWM will always be either the old waveform or the new waveform, not some
variation in between. If the channel is not enabled, then writes to the period register will go directly to the
latches as well as the buffer.
NOTE
Reads of this register return the most recent value written. Reads do not
necessarily return the value of the currently active period due to the double
buffering scheme.
Reference Section 12.4.2.3, “PWM Period and Duty,” for more information.
To calculate the output period, take the selected clock source period for the channel of interest (A, B, SA,
or SB) and multiply it by the value in the period register for that channel:
•
•
•
Left aligned output (CAEx = 0)
PWMx period = channel clock period * PWMPERx center aligned output (CAEx = 1)
PWMx period = channel clock period * (2 * PWMPERx)
For boundary case programming values, please refer to Section 12.4.2.8, “PWM Boundary Cases.”
Module Base + 0x0012
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 12-19. PWM Channel Period Registers (PWMPER0)
Module Base + 0x0013
7
6
5
4
3
2
1
0
R
Bit 7
W
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 12-20. PWM Channel Period Registers (PWMPER1)
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
Module Base + 0x0014
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 12-21. PWM Channel Period Registers (PWMPER2)
Module Base + 0x0015
7
6
5
4
3
2
1
0
R
Bit 7
W
6
5
4
3
2
1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 12-22. PWM Channel Period Registers (PWMPER3)
Read: anytime
Write: anytime
12.3.2.14 PWM Channel Duty Registers (PWMDTYx)
There is a dedicated duty register for each channel. The value in this register determines the duty of the
associated PWM channel. The duty value is compared to the counter and if it is equal to the counter value
a match occurs and the output changes state.
The duty registers for each channel are double buffered so that if they change while the channel is enabled,
the change will NOT take effect until one of the following occurs:
•
•
•
The effective period ends
The counter is written (counter resets to 0x0000)
The channel is disabled
In this way, the output of the PWM will always be either the old duty waveform or the new duty waveform,
not some variation in between. If the channel is not enabled, then writes to the duty register will go directly
to the latches as well as the buffer.
NOTE
Reads of this register return the most recent value written. Reads do not
necessarily return the value of the currently active duty due to the double
buffering scheme.
Reference Section 12.4.2.3, “PWM Period and Duty,” for more information.
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
NOTE
Depending on the polarity bit, the duty registers will contain the count of
either the high time or the low time. If the polarity bit is 1, the output starts
high and then goes low when the duty count is reached, so the duty registers
contain a count of the high time. If the polarity bit is 0, the output starts low
and then goes high when the duty count is reached, so the duty registers
contain a count of the low time.
To calculate the output duty cycle (high time as a % of period) for a particular channel:
•
•
•
Polarity = 0 (PPOLx = 0)
Duty cycle = [(PWMPERx–PWMDTYx)/PWMPERx] * 100%
Polarity = 1 (PPOLx = 1)
Duty cycle = [PWMDTYx / PWMPERx] * 100%
For boundary case programming values, please refer to Section 12.4.2.8, “PWM Boundary Cases.”
Module Base + 0x0018
7
6
5
4
3
2
1
0
R
Bit 7
W
6
5
4
3
2
1
Bit 0
Reset
1
1
1
1
1
1
1
1
Figure 12-23. PWM Channel Duty Registers (PWMDTY0)
Module Base + 0x0019
7
6
5
4
3
2
1
0
R
Bit 7
W
6
5
4
3
2
1
Bit 0
Reset
1
1
1
1
1
1
1
1
Figure 12-24. PWM Channel Duty Registers (PWMDTY1)
Module Base + 0x001A
7
6
5
4
3
2
1
0
R
Bit 7
W
6
5
4
3
2
1
Bit 0
Reset
1
1
1
1
1
1
1
1
Figure 12-25. PWM Channel Duty Registers (PWMDTY2)
Module Base + 0x001B
7
6
5
4
3
2
1
0
R
Bit 7
W
6
5
4
3
2
1
Bit 0
Reset
1
1
1
1
1
1
1
1
Figure 12-26. PWM Channel Duty Registers (PWMDTY3)
Read: anytime
Write: anytime
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
12.3.2.15 PWM Shutdown Register (PWMSDN)
The PWMSDN register provides for the shutdown functionality of the PWM module in the emergency
cases.
Module Base + 0x00E
7
6
5
4
3
2
1
0
R
W
0
PWM5ENA
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 12-27. PWM Shutdown Register (PWMSDN)
Read: anytime
Write: anytime
Table 12-9. PWMSDN Field Descriptions
Description
Field
0
PWM Emergency Shutdown Enable
PWM5ENA 0 PWM emergency feature disabled.
1 PWM emergency feature is enabled.
CAUTION
User Software must ensure that this bit remains clear
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12.4 Functional Description
12.4.1 PWM Clock Select
There are four available clocks called clock A, clock B, clock SA (scaled A), and clock SB (scaled B).
These four clocks are based on the bus clock.
Clock A and B can be software selected to be 1, 1/2, 1/4, 1/8,..., 1/64, 1/128 times the bus clock. Clock SA
uses clock A as an input and divides it further with a reloadable counter. Similarly, clock SB uses clock B
as an input and divides it further with a reloadable counter. The rates available for clock SA are software
selectable to be clock A divided by 2, 4, 6, 8, ..., or 512 in increments of divide by 2. Similar rates are
available for clock SB. Each PWM channel has the capability of selecting one of two clocks, either the
pre-scaled clock (clock A or B) or the scaled clock (clock SA or SB).
The block diagram in Figure 12-28 shows the four different clocks and how the scaled clocks are created.
12.4.1.1 Prescale
The input clock to the PWM prescaler is the bus clock. It can be disabled whenever the part is in freeze
mode by setting the PFRZ bit in the PWMCTL register. If this bit is set, whenever the MCU is in freeze
mode the input clock to the prescaler is disabled. This is useful for emulation in order to freeze the PWM.
The input clock can also be disabled when all six PWM channels are disabled (PWME5–PWME0 = 0)
This is useful for reducing power by disabling the prescale counter.
Clock A and clock B are scaled values of the input clock. The value is software selectable for both clock A
and clock B and has options of 1, 1/2, 1/4, 1/8, 1/16, 1/32, 1/64, or 1/128 times the bus clock. The value
selected for clock A is determined by the PCKA2, PCKA1, and PCKA0 bits in the PWMPRCLK register.
The value selected for clock B is determined by the PCKB2, PCKB1, and PCKB0 bits also in the
PWMPRCLK register.
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
Clock A
M
U
X
Clock to
PWM Ch 0
Clock A/2, A/4, A/6,....A/512
PCLK0
Count = 1
Load
8-Bit Down Counter
PWMSCLA
M
U
X
Clock to
PWM Ch 1
PCLK1
Clock SA
DIV 2
M
U
X
Clock to
PWM Ch 2
M
U
X
PCLK2
M
U
X
Clock to
PWM Ch 3
PCLK3
Clock B
Clock B/2, B/4, B/6,....B/512
M
U
X
Count = 1
Load
8-Bit Down Counter
PWMSCLB
Clock SB
DIV 2
PRESCALE
SCALE
CLOCK SELECT
Figure 12-28. PWM Clock Select Block Diagram
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12.4.1.2 Clock Scale
The scaled A clock uses clock A as an input and divides it further with a user programmable value and
then divides this by 2. The scaled B clock uses clock B as an input and divides it further with a user
programmable value and then divides this by 2. The rates available for clock SA are software selectable
to be clock A divided by 2, 4, 6, 8, ..., or 512 in increments of divide by 2. Similar rates are available for
clock SB.
Clock A is used as an input to an 8-bit down counter. This down counter loads a user programmable scale
value from the scale register (PWMSCLA). When the down counter reaches 1, two things happen; a pulse
is output and the 8-bit counter is re-loaded. The output signal from this circuit is further divided by two.
This gives a greater range with only a slight reduction in granularity. Clock SA equals clock A divided by
two times the value in the PWMSCLA register.
NOTE
Clock SA = Clock A / (2 * PWMSCLA)
When PWMSCLA = 0x0000, PWMSCLA value is considered a full scale
value of 256. Clock A is thus divided by 512.
Similarly, clock B is used as an input to an 8-bit down counter followed by a divide by two producing clock
SB. Thus, clock SB equals clock B divided by two times the value in the PWMSCLB register.
NOTE
Clock SB = Clock B / (2 * PWMSCLB)
When PWMSCLB = 0x0000, PWMSCLB value is considered a full scale
value of 256. Clock B is thus divided by 512.
As an example, consider the case in which the user writes 0x00FF into the PWMSCLA register. Clock A
for this case will be bus clock divided by 4. A pulse will occur at a rate of once every 255 x 4 bus cycles.
Passing this through the divide by two circuit produces a clock signal at a bus clock divided by 2040 rate.
Similarly, a value of 0x0001 in the PWMSCLA register when clock A is bus clock divided by 4 will
produce a bus clock divided by 8 rate.
Writing to PWMSCLA or PWMSCLB causes the associated 8-bit down counter to be re-loaded.
Otherwise, when changing rates the counter would have to count down to 0x0001 before counting at the
proper rate. Forcing the associated counter to re-load the scale register value every time PWMSCLA or
PWMSCLB is written prevents this.
NOTE
Writing to the scale registers while channels are operating can cause
irregularities in the PWM outputs.
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
12.4.1.3 Clock Select
Each PWM channel has the capability of selecting one of two clocks. For channels 0, and 1 the clock
choices are clock A or clock SA. For channels 2 and 3 the choices are clock B or clock SB. The clock
selection is done with the PCLKx control bits in the PWMCLK register.
NOTE
Changing clock control bits while channels are operating can cause
irregularities in the PWM outputs.
12.4.2 PWM Channel Timers
The main part of the PWM module are the actual timers. Each of the timer channels has a counter, a period
register and a duty register (each are 8 bit). The waveform output period is controlled by a match between
the period register and the value in the counter. The duty is controlled by a match between the duty register
and the counter value and causes the state of the output to change during the period. The starting polarity
of the output is also selectable on a per channel basis. Figure 12-29 shows a block diagram for PWM timer.
Clock Source
From Port PWMP
Data Register
8-Bit Counter
GATE
PWMCNTx
(clock edge sync)
8-Bit Compare =
up/down reset
M
U
X
M
U
X
T
Q
Q
PWMDTYx
To Pin
Driver
R
8-Bit Compare =
PWMPERx
PPOLx
T
Q
Q
CAEx
R
PWMEx
Figure 12-29. PWM Timer Channel Block Diagram
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
12.4.2.1 PWM Enable
Each PWM channel has an enable bit (PWMEx) to start its waveform output. When any of the PWMEx
bits are set (PWMEx = 1), the associated PWM output signal is enabled immediately. However, the actual
PWM waveform is not available on the associated PWM output until its clock source begins its next cycle
due to the synchronization of PWMEx and the clock source. An exception to this is when channels are
concatenated. Refer to Section 12.4.2.7, “PWM 16-Bit Functions,” for more detail.
NOTE
The first PWM cycle after enabling the channel can be irregular.
On the front end of the PWM timer, the clock is enabled to the PWM circuit by the PWMEx bit being high.
There is an edge-synchronizing circuit to guarantee that the clock will only be enabled or disabled at an
edge. When the channel is disabled (PWMEx = 0), the counter for the channel does not count.
12.4.2.2 PWM Polarity
Each channel has a polarity bit to allow starting a waveform cycle with a high or low signal. This is shown
on the block diagram as a mux select of either the Q output or the Q output of the PWM output flip-flop.
When one of the bits in the PWMPOL register is set, the associated PWM channel output is high at the
beginning of the waveform, then goes low when the duty count is reached. Conversely, if the polarity bit
is 0, the output starts low and then goes high when the duty count is reached.
12.4.2.3 PWM Period and Duty
Dedicated period and duty registers exist for each channel and are double buffered so that if they change
while the channel is enabled, the change will NOT take effect until one of the following occurs:
•
•
•
The effective period ends
The counter is written (counter resets to 0x0000)
The channel is disabled
In this way, the output of the PWM will always be either the old waveform or the new waveform, not some
variation in between. If the channel is not enabled, then writes to the period and duty registers will go
directly to the latches as well as the buffer.
A change in duty or period can be forced into effect “immediately” by writing the new value to the duty
and/or period registers and then writing to the counter. This forces the counter to reset and the new duty
and/or period values to be latched. In addition, because the counter is readable it is possible to know where
the count is with respect to the duty value and software can be used to make adjustments.
NOTE
When forcing a new period or duty into effect immediately, an irregular
PWM cycle can occur.
Depending on the polarity bit, the duty registers will contain the count of
either the high time or the low time.
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
12.4.2.4 PWM Timer Counters
Each channel has a dedicated 8-bit up/down counter which runs at the rate of the selected clock source
(reference Figure 12-28 for the available clock sources and rates). The counter compares to two registers,
a duty register and a period register as shown in Figure 12-29. When the PWM counter matches the duty
register the output flip-flop changes state causing the PWM waveform to also change state. A match
between the PWM counter and the period register behaves differently depending on what output mode is
selected as shown in Figure 12-29 and described in Section 12.4.2.5, “Left Aligned Outputs,” and
Section 12.4.2.6, “Center Aligned Outputs.”
Each channel counter can be read at anytime without affecting the count or the operation of the PWM
channel.
Any value written to the counter causes the counter to reset to 0x0000, the counter direction to be set to
up, the immediate load of both duty and period registers with values from the buffers, and the output to
change according to the polarity bit. When the channel is disabled (PWMEx = 0), the counter stops. When
a channel becomes enabled (PWMEx = 1), the associated PWM counter continues from the count in the
PWMCNTx register. This allows the waveform to resume when the channel is re-enabled. When the
channel is disabled, writing 0 to the period register will cause the counter to reset on the next selected
clock.
NOTE
If the user wants to start a new “clean” PWM waveform without any
“history” from the old waveform, the user must write to channel counter
(PWMCNTx) prior to enabling the PWM channel (PWMEx = 1).
Generally, writes to the counter are done prior to enabling a channel to start from a known state. However,
writing a counter can also be done while the PWM channel is enabled (counting). The effect is similar to
writing the counter when the channel is disabled except that the new period is started immediately with
the output set according to the polarity bit.
NOTE
Writing to the counter while the channel is enabled can cause an irregular
PWM cycle to occur.
The counter is cleared at the end of the effective period (see Section 12.4.2.5, “Left Aligned Outputs,” and
Section 12.4.2.6, “Center Aligned Outputs,” for more details).
Table 12-10. PWM Timer Counter Conditions
Counter Clears (0x0000)
Counter Counts
Counter Stops
When PWMCNTx register
written to any value
When PWM channel is
enabled (PWMEx = 1). Counts
from last value in PWMCNTx.
When PWM channel is
disabled (PWMEx = 0)
Effective period ends
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12.4.2.5 Left Aligned Outputs
The PWM timer provides the choice of two types of outputs, left aligned or center aligned outputs. They
are selected with the CAEx bits in the PWMCAE register. If the CAEx bit is cleared (CAEx = 0), the
corresponding PWM output will be left aligned.
In left aligned output mode, the 8-bit counter is configured as an up counter only. It compares to two
registers, a duty register and a period register as shown in the block diagram in Figure 12-29. When the
PWM counter matches the duty register the output flip-flop changes state causing the PWM waveform to
also change state. A match between the PWM counter and the period register resets the counter and the
output flip-flop as shown in Figure 12-29 as well as performing a load from the double buffer period and
duty register to the associated registers as described in Section 12.4.2.3, “PWM Period and Duty.” The
counter counts from 0 to the value in the period register – 1.
NOTE
Changing the PWM output mode from left aligned output to center aligned
output (or vice versa) while channels are operating can cause irregularities
in the PWM output. It is recommended to program the output mode before
enabling the PWM channel.
PPOLx = 0
PPOLx = 1
PWMDTYx
Period = PWMPERx
Figure 12-30. PWM Left Aligned Output Waveform
To calculate the output frequency in left aligned output mode for a particular channel, take the selected
clock source frequency for the channel (A, B, SA, or SB) and divide it by the value in the period register
for that channel.
•
•
PWMx frequency = clock (A, B, SA, or SB) / PWMPERx
PWMx duty cycle (high time as a% of period):
— Polarity = 0 (PPOLx = 0)
Duty cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100%
— Polarity = 1 (PPOLx = 1)
Duty cycle = [PWMDTYx / PWMPERx] * 100%
As an example of a left aligned output, consider the following case:
Clock source = bus clock, where bus clock = 10 MHz (100 ns period)
PPOLx = 0
PWMPERx = 4
PWMDTYx = 1
PWMx frequency = 10 MHz/4 = 2.5 MHz
PWMx period = 400 ns
PWMx duty cycle = 3/4 *100% = 75%
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
Shown below is the output waveform generated.
E = 100 ns
DUTY CYCLE = 75%
PERIOD = 400 ns
Figure 12-31. PWM Left Aligned Output Example Waveform
12.4.2.6 Center Aligned Outputs
For center aligned output mode selection, set the CAEx bit (CAEx = 1) in the PWMCAE register and the
corresponding PWM output will be center aligned.
The 8-bit counter operates as an up/down counter in this mode and is set to up whenever the counter is
equal to 0x0000. The counter compares to two registers, a duty register and a period register as shown in
the block diagram in Figure 12-29. When the PWM counter matches the duty register the output flip-flop
changes state causing the PWM waveform to also change state. A match between the PWM counter and
the period register changes the counter direction from an up-count to a down-count. When the PWM
counter decrements and matches the duty register again, the output flip-flop changes state causing the
PWM output to also change state. When the PWM counter decrements and reaches 0, the counter direction
changes from a down-count back to an up-count and a load from the double buffer period and duty
registers to the associated registers is performed as described in Section 12.4.2.3, “PWM Period and
Duty.” The counter counts from 0 up to the value in the period register and then back down to 0. Thus the
effective period is PWMPERx*2.
NOTE
Changing the PWM output mode from left aligned output to center aligned
output (or vice versa) while channels are operating can cause irregularities
in the PWM output. It is recommended to program the output mode before
enabling the PWM channel.
PPOLx = 0
PPOLx = 1
PWMDTYx
PWMPERx
PWMDTYx
PWMPERx
Period = PWMPERx*2
Figure 12-32. PWM Center Aligned Output Waveform
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
To calculate the output frequency in center aligned output mode for a particular channel, take the selected
clock source frequency for the channel (A, B, SA, or SB) and divide it by twice the value in the period
register for that channel.
•
•
PWMx frequency = clock (A, B, SA, or SB) / (2*PWMPERx)
PWMx duty cycle (high time as a% of period):
— Polarity = 0 (PPOLx = 0)
Duty cycle = [(PWMPERx-PWMDTYx)/PWMPERx] * 100%
— Polarity = 1 (PPOLx = 1)
Duty cycle = [PWMDTYx / PWMPERx] * 100%
As an example of a center aligned output, consider the following case:
Clock source = bus clock, where bus clock = 10 MHz (100 ns period)
PPOLx = 0
PWMPERx = 4
PWMDTYx = 1
PWMx frequency = 10 MHz/8 = 1.25 MHz
PWMx period = 800 ns
PWMx duty cycle = 3/4 *100% = 75%
Shown below is the output waveform generated.
E = 100 ns
E = 100 ns
DUTY CYCLE = 75%
PERIOD = 800 ns
Figure 12-33. PWM Center Aligned Output Example Waveform
12.4.2.7 PWM 16-Bit Functions
The PWM timer also has the option of generating 4-channels of 8-bits or 2-channels of 16-bits for greater
PWM resolution}. This 16-bit channel option is achieved through the concatenation of two 8-bit channels.
The PWMCTL register contains three control bits, each of which is used to concatenate a pair of PWM
channels into one 16-bit channel. Channels 2 and 3 are concatenated with the CON23 bit, and channels 0
and 1 are concatenated with the CON01 bit.
NOTE
Change these bits only when both corresponding channels are disabled.
When channels 2 and 3 are concatenated, channel 2 registers become the high-order bytes of the double
byte channel. When channels 0 and 1 are concatenated, channel 0 registers become the high-order bytes
of the double byte channel.
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
Clock Source 3
High
Low
PWMCNT2
PWCNT3
Period/Duty Compare
PWM3
Clock Source 1
High
Low
PWMCNT0
PWCNT1
Period/Duty Compare
PWM1
Figure 12-34. PWM 16-Bit Mode
When using the 16-bit concatenated mode, the clock source is determined by the low-order 8-bit channel
clock select control bits. That is channel 3 when channels 2 and 3 are concatenated, and channel 1 when
channels 0 and 1 are concatenated. The resulting PWM is output to the pins of the corresponding low-order
8-bit channel as also shown in Figure 12-34. The polarity of the resulting PWM output is controlled by the
PPOLx bit of the corresponding low-order 8-bit channel as well.
After concatenated mode is enabled (CONxx bits set in PWMCTL register), enabling/disabling the
corresponding 16-bit PWM channel is controlled by the low-order PWMEx bit. In this case, the high-order
bytes PWMEx bits have no effect and their corresponding PWM output is disabled.
In concatenated mode, writes to the 16-bit counter by using a 16-bit access or writes to either the low or
high-order byte of the counter will reset the 16-bit counter. Reads of the 16-bit counter must be made by
16-bit access to maintain data coherency.
Either left aligned or center aligned output mode can be used in concatenated mode and is controlled by
the low-order CAEx bit. The high-order CAEx bit has no effect.
Table 12-11 is used to summarize which channels are used to set the various control bits when in 16-bit
mode.
Table 12-11. 16-bit Concatenation Mode Summary
CONxx
PWMEx
PPOLx
PCLKx
CAEx
PWMx Output
CON23
CON01
PWME3
PWME1
PPOL3
PPOL1
PCLK3
PCLK1
CAE3
CAE1
PWM3
PWM1
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Chapter 12 Pulse-Width Modulator (PWM8B4CRev 01.24) Block Description
12.4.2.8 PWM Boundary Cases
Table 12-12 summarizes the boundary conditions for the PWM regardless of the output mode (left aligned
or center aligned) and 8-bit (normal) or 16-bit (concatenation):
Table 12-12. PWM Boundary Cases
PWMDTYx
PWMPERx
PPOLx
PWMx Output
0x0000
>0x0000
1
Always Low
(indicates no duty)
0x0000
(indicates no duty)
>0x0000
0
1
0
Always High
Always High
Always Low
XX
0x0000(1)
(indicates no period)
XX
0x00001
(indicates no period)
>= PWMPERx
>= PWMPERx
XX
1
0
Always High
Always Low
XX
1. Counter = 0x0000 and does not count.
12.5 Resets
The reset state of each individual bit is listed within the register description section (see Section 12.3,
“Memory Map and Registers,” which details the registers and their bit-fields. All special functions or
modes which are initialized during or just following reset are described within this section.
•
•
The 8-bit up/down counter is configured as an up counter out of reset.
All the channels are disabled and all the counters don’t count.
12.6 Interrupts
The PWM8B4C module interrupt is disabled when PWM5ENA is clear.
CAUTION
User Software must ensure that PWM5ENA remains clear
A description of the registers involved and affected due to this interrupt is explained in Section 12.3.2.15,
“PWM Shutdown Register (PWMSDN).”
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Chapter 13
Serial Communications Interface (S12SCIV2)
Block Description
13.1 Introduction
This block guide provide an overview of serial communication interface (SCI) module. The SCI allows
asynchronous serial communications with peripheral devices and other CPUs.
13.1.1 Glossary
IRQ — Interrupt Request
LSB — Least Significant Bit
MSB — Most Significant Bit
NRZ — Non-Return-to-Zero
RZI — Return-to-Zero-Inverted
RXD — Receive Pin
SCI — Serial Communication Interface
TXD — Transmit Pin
13.1.2 Features
The SCI includes these distinctive features:
•
•
•
•
•
•
•
Full-duplex operation
Standard mark/space non-return-to-zero (NRZ) format
13-bit baud rate selection
Programmable 8-bit or 9-bit data format
Separately enabled transmitter and receiver
Programmable transmitter output parity
Two receiver wake up methods:
— Idle line wake-up
— Address mark wake-up
•
Interrupt-driven operation with eight flags:
— Transmitter empty
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— Transmission complete
— Receiver full
— Idle receiver input
— Receiver overrun
— Noise error
— Framing error
— Parity error
•
•
•
Receiver framing error detection
Hardware parity checking
1/16 bit-time noise detection
13.1.3 Modes of Operation
The SCI operation is the same independent of device resource mapping and bus interface mode. Different
power modes are available to facilitate power saving.
13.1.3.1 Run Mode
Normal mode of operation.
13.1.3.2 Wait Mode
SCI operation in wait mode depends on the state of the SCISWAI bit in the SCI control register 1
(SCICR1).
•
•
If SCISWAI is clear, the SCI operates normally when the CPU is in wait mode.
If SCISWAI is set, SCI clock generation ceases and the SCI module enters a power-conservation
state when the CPU is in wait mode. Setting SCISWAI does not affect the state of the receiver
enable bit, RE, or the transmitter enable bit, TE.
•
If SCISWAI is set, any transmission or reception in progress stops at wait mode entry. The
transmission or reception resumes when either an internal or external interrupt brings the CPU out
of wait mode. Exiting wait mode by reset aborts any transmission or reception in progress and
resets the SCI.
13.1.3.3 Stop Mode
The SCI is inactive during stop mode for reduced power consumption. The STOP instruction does not
affect the SCI register states, but the SCI module clock will be disabled. The SCI operation resumes from
where it left off after an external interrupt brings the CPU out of stop mode. Exiting stop mode by reset
aborts any transmission or reception in progress and resets the SCI.
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13.1.4 Block Diagram
Figure 13-1 is a high level block diagram of the SCI module, showing the interaction of various functional
blocks.
SCI DATA REGISTER
IDLE IRQ
RX DATA IN
RECEIVE SHIFT REGISTER
BUS CLOCK
RDR/OR IRQ
RECEIVE & WAKE UP CONTROL
IRQ
TO CPU
DATA FORMAT CONTROL
÷16
BAUD
GENERATOR
TRANSMIT CONTROL
TDRE IRQ
TRANSMIT SHIFT REGISTER
TC IRQ
SCI DATA REGISTER
TXDATA OUT
Figure 13-1. SCI Block Diagram
13.2 External Signal Description
The SCI module has a total of two external pins:
13.2.1 TXD-SCI Transmit Pin
This pin serves as transmit data output of SCI.
13.2.2 RXD-SCI Receive Pin
This pin serves as receive data input of the SCI.
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13.3 Memory Map and Registers
This section provides a detailed description of all memory and registers.
13.3.1 Module Memory Map
The memory map for the SCI module is given below in Figure 13-2. The Address listed for each register
is the address offset. The total address for each register is the sum of the base address for the SCI module
and the address offset for each register.
Address
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
W
R
0
0
0
0x0000
SCIBDH
SBR12
SBR11
SBR10
SBR9
SBR8
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
SCIBDL
SCICR1
SCICR2
SCISR1
SCISR2
SCIDRH
SCIDRL
SBR7
SBR6
SBR5
RSRC
SBR4
M
SBR3
SBR2
ILT
SBR1
PE
SBR0
PT
W
R
LOOPS
SCISWAI
WAKE
W
R
TIE
TCIE
TC
RIE
ILIE
TE
RE
NF
RWU
FE
SBK
PF
W
R
TDRE
RDRF
IDLE
OR
W
R
0
0
0
0
0
0
0
0
RAF
0
BRK13
0
TXDIR
0
W
R
R8
T8
W
R
R7
T7
R6
T6
R5
T5
R4
T4
R3
T3
R2
T2
R1
T1
R0
T0
W
= Unimplemented or Reserved
Figure 13-2. SCI Register Summary
13.3.2 Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Writes to a reserved register location do not have any effect and
reads of these locations return a zero. Details of register bit and field function follow the register diagrams,
in bit order.
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13.3.2.1 SCI Baud Rate Registers (SCIBDH and SCHBDL)
Module Base + 0x_0000
7
6
5
4
3
2
1
0
R
W
0
0
0
SBR12
SBR11
SBR10
SBR9
SBR8
Reset
0
0
0
0
0
0
0
0
Module Base + 0x_0001
7
6
5
4
3
2
1
0
R
SBR7
W
SBR6
SBR5
SBR4
SBR3
SBR2
SBR1
SBR0
Reset
0
0
0
0
0
1
0
0
= Unimplemented or Reserved
Figure 13-3. SCI Baud Rate Registers (SCIBDH and SCIBDL)
The SCI Baud Rate Register is used by the counter to determine the baud rate of the SCI. The formula for
calculating the baud rate is:
SCI baud rate = SCI module clock / (16 x BR)
where:
BR is the content of the SCI baud rate registers, bits SBR12 through SBR0. The baud rate registers
can contain a value from 1 to 8191.
Read: Anytime. If only SCIBDH is written to, a read will not return the correct data until SCIBDL is
written to as well, following a write to SCIBDH.
Write: Anytime
Table 13-1. SCIBDH AND SCIBDL Field Descriptions
Field
Description
4–0
7–0
SBR[12:0]
SCI Baud Rate Bits — The baud rate for the SCI is determined by these 13 bits.
Note: The baud rate generator is disabled until the TE bit or the RE bit is set for the first time after reset. The
baud rate generator is disabled when BR = 0.
Writing to SCIBDH has no effect without writing to SCIBDL, since writing to SCIBDH puts the data in a
temporary location until SCIBDL is written to.
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13.3.2.2 SCI Control Register 1 (SCICR1)
Module Base + 0x_0002
7
6
5
4
3
2
1
0
R
W
LOOPS
SCISWAI
RSRC
M
WAKE
ILT
PE
PT
Reset
0
0
0
0
0
0
0
0
Figure 13-4. SCI Control Register 1 (SCICR1)
Read: Anytime
Write: Anytime
Table 13-2. SCICR1 Field Descriptions
Description
Field
7
Loop Select Bit — LOOPS enables loop operation. In loop operation, the RXD pin is disconnected from the SCI
and the transmitter output is internally connected to the receiver input. Both the transmitter and the receiver must
be enabled to use the loop function.See Table 13-3.
LOOPS
0 Normal operation enabled
1 Loop operation enabled
Note: The receiver input is determined by the RSRC bit.
6
SCI Stop in Wait Mode Bit — SCISWAI disables the SCI in wait mode.
SCISWAI 0 SCI enabled in wait mode
1 SCI disabled in wait mode
5
Receiver Source Bit — When LOOPS = 1, the RSRC bit determines the source for the receiver shift register
RSRC
input.
0 Receiver input internally connected to transmitter output
1 Receiver input connected externally to transmitter
4
M
Data Format Mode Bit — MODE determines whether data characters are eight or nine bits long.
0 One start bit, eight data bits, one stop bit
1 One start bit, nine data bits, one stop bit
3
Wakeup Condition Bit — WAKE determines which condition wakes up the SCI: a logic 1 (address mark) in the
WAKE
most significant bit position of a received data character or an idle condition on the RXD.
0 Idle line wakeup
1 Address mark wakeup
2
ILT
Idle Line Type Bit — ILT determines when the receiver starts counting logic 1s as idle character bits. The
counting begins either after the start bit or after the stop bit. If the count begins after the start bit, then a string of
logic 1s preceding the stop bit may cause false recognition of an idle character. Beginning the count after the
stop bit avoids false idle character recognition, but requires properly synchronized transmissions.
0 Idle character bit count begins after start bit
1 Idle character bit count begins after stop bit
1
Parity Enable Bit — PE enables the parity function. When enabled, the parity function inserts a parity bit in the
PE
most significant bit position.
0 Parity function disabled
1 Parity function enabled
0
Parity Type Bit — PT determines whether the SCI generates and checks for even parity or odd parity. With even
PT
parity, an even number of 1s clears the parity bit and an odd number of 1s sets the parity bit. With odd parity, an
odd number of 1s clears the parity bit and an even number of 1s sets the parity bit.
0 Even parity
1 Odd parity
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Table 13-3. Loop Functions
LOOPS RSRC
Function
0
1
1
x
0
1
Normal operation
Loop mode with Rx input internally connected to Tx output
Single-wire mode with Rx input connected to TXD
13.3.2.3 SCI Control Register 2 (SCICR2)
Module Base + 0x_0003
7
6
5
4
3
2
1
0
R
W
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SBK
Reset
0
0
0
0
0
0
0
0
Figure 13-5. SCI Control Register 2 (SCICR2)
Read: Anytime
Write: Anytime
Table 13-4. SCICR2 Field Descriptions
Description
Field
7
Transmitter Interrupt Enable Bit — TIE enables the transmit data register empty flag, TDRE, to generate
TIE
interrupt requests.
0 TDRE interrupt requests disabled
1 TDRE interrupt requests enabled
6
Transmission Complete Interrupt Enable Bit — TCIE enables the transmission complete flag, TC, to generate
TCIE
interrupt requests.
0 TC interrupt requests disabled
1 TC interrupt requests enabled
5
RIE
Receiver Full Interrupt Enable Bit — RIE enables the receive data register full flag, RDRF, or the overrun flag,
OR, to generate interrupt requests.
0 RDRF and OR interrupt requests disabled
1 RDRF and OR interrupt requests enabled
4
ILIE
Idle Line Interrupt Enable Bit — ILIE enables the idle line flag, IDLE, to generate interrupt requests.
0 IDLE interrupt requests disabled
1 IDLE interrupt requests enabled
3
Transmitter Enable Bit — TE enables the SCI transmitter and configures the TXD pin as being controlled by
TE
the SCI. The TE bit can be used to queue an idle preamble.
0 Transmitter disabled
1 Transmitter enabled
2
RE
Receiver Enable Bit — RE enables the SCI receiver.
0 Receiver disabled
1 Receiver enabled
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Table 13-4. SCICR2 Field Descriptions (continued)
Field
Description
1
Receiver Wakeup Bit — Standby state
RWU
0 Normal operation.
1 RWU enables the wakeup function and inhibits further receiver interrupt requests. Normally, hardware wakes
the receiver by automatically clearing RWU.
0
Send Break Bit — Toggling SBK sends one break character (10 or 11 logic 0s, respectively 13 or 14 logics 0s
SBK
if BRK13 is set). Toggling implies clearing the SBK bit before the break character has finished transmitting. As
long as SBK is set, the transmitter continues to send complete break characters (10 or 11 bits, respectively 13
or 14 bits).
0 No break characters
1 Transmit break characters
13.3.2.4 SCI Status Register 1 (SCISR1)
The SCISR1 and SCISR2 registers provides inputs to the MCU for generation of SCI interrupts. Also,
these registers can be polled by the MCU to check the status of these bits. The flag-clearing procedures
require that the status register be read followed by a read or write to the SCI Data Register.It is permissible
to execute other instructions between the two steps as long as it does not compromise the handling of I/O,
but the order of operations is important for flag clearing.
Module Base + 0x_0004
7
6
5
4
3
2
1
0
R
W
TDRE
TC
RDRF
IDLE
OR
NF
FE
PF
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-6. SCI Status Register 1 (SCISR1)
Read: Anytime
Write: Has no meaning or effect
Table 13-5. SCISR1 Field Descriptions
Description
Field
7
Transmit Data Register Empty Flag — TDRE is set when the transmit shift register receives a byte from the
SCI data register. When TDRE is 1, the transmit data register (SCIDRH/L) is empty and can receive a new value
to transmit.Clear TDRE by reading SCI status register 1 (SCISR1), with TDRE set and then writing to SCI data
register low (SCIDRL).
TDRE
0 No byte transferred to transmit shift register
1 Byte transferred to transmit shift register; transmit data register empty
6
TC
Transmit Complete Flag — TC is set low when there is a transmission in progress or when a preamble or break
character is loaded. TC is set high when the TDRE flag is set and no data, preamble, or break character is being
transmitted.When TC is set, the TXD out signal becomes idle (logic 1). Clear TC by reading SCI status register
1 (SCISR1) with TC set and then writing to SCI data register low (SCIDRL). TC is cleared automatically when
data, preamble, or break is queued and ready to be sent. TC is cleared in the event of a simultaneous set and
clear of the TC flag (transmission not complete).
0 Transmission in progress
1 No transmission in progress
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Table 13-5. SCISR1 Field Descriptions (continued)
Field
Description
5
Receive Data Register Full Flag — RDRF is set when the data in the receive shift register transfers to the SCI
data register. Clear RDRF by reading SCI status register 1 (SCISR1) with RDRF set and then reading SCI data
register low (SCIDRL).
RDRF
0 Data not available in SCI data register
1 Received data available in SCI data register
4
IDLE
Idle Line Flag — IDLE is set when 10 consecutive logic 1s (if M=0) or 11 consecutive logic 1s (if M=1) appear
on the receiver input. Once the IDLE flag is cleared, a valid frame must again set the RDRF flag before an idle
condition can set the IDLE flag.Clear IDLE by reading SCI status register 1 (SCISR1) with IDLE set and then
reading SCI data register low (SCIDRL).
0 Receiver input is either active now or has never become active since the IDLE flag was last cleared
1 Receiver input has become idle
Note: When the receiver wakeup bit (RWU) is set, an idle line condition does not set the IDLE flag.
3
Overrun Flag — OR is set when software fails to read the SCI data register before the receive shift register
OR
receives the next frame. The OR bit is set immediately after the stop bit has been completely received for the
second frame. The data in the shift register is lost, but the data already in the SCI data registers is not affected.
Clear OR by reading SCI status register 1 (SCISR1) with OR set and then reading SCI data register low
(SCIDRL).
0 No overrun
1 Overrun
Note: OR flag may read back as set when RDRF flag is clear. This may happen if the following sequence of
events occurs:
1. After the first frame is received, read status register SCISR1 (returns RDRF set and OR flag clear);
2. Receive second frame without reading the first frame in the data register (the second frame is not
received and OR flag is set);
3. Read data register SCIDRL (returns first frame and clears RDRF flag in the status register);
4. Read status register SCISR1 (returns RDRF clear and OR set).
Event 3 may be at exactly the same time as event 2 or any time after. When this happens, a dummy
SCIDRL read following event 4 will be required to clear the OR flag if further frames are to be received.
2
Noise Flag — NF is set when the SCI detects noise on the receiver input. NF bit is set during the same cycle as
NF
the RDRF flag but does not get set in the case of an overrun. Clear NF by reading SCI status register 1(SCISR1),
and then reading SCI data register low (SCIDRL).
0 No noise
1 Noise
1
Framing Error Flag — FE is set when a logic 0 is accepted as the stop bit. FE bit is set during the same cycle
FE
as the RDRF flag but does not get set in the case of an overrun. FE inhibits further data reception until it is
cleared. Clear FE by reading SCI status register 1 (SCISR1) with FE set and then reading the SCI data register
low (SCIDRL).
0 No framing error
1 Framing error
0
Parity Error Flag — PF is set when the parity enable bit (PE) is set and the parity of the received data does not
PF
match the parity type bit (PT). PF bit is set during the same cycle as the RDRF flag but does not get set in the
case of an overrun. Clear PF by reading SCI status register 1 (SCISR1), and then reading SCI data register low
(SCIDRL).
0 No parity error
1 Parity error
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13.3.2.5 SCI Status Register 2 (SCISR2)
Module Base + 0x_0005
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
RAF
BK13
TXDIR
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 13-7. SCI Status Register 2 (SCISR2)
Read: Anytime
Write: Anytime; writing accesses SCI status register 2; writing to any bits except TXDIR and BRK13
(SCISR2[1] & [2]) has no effect
Table 13-6. SCISR2 Field Descriptions
Field
Description
2
Break Transmit Character Length — This bit determines whether the transmit break character is 10 or 11 bit
respectively 13 or 14 bits long. The detection of a framing error is not affected by this bit.
0 Break Character is 10 or 11 bit long
BK13
1 Break character is 13 or 14 bit long
1
Transmitter Pin Data Direction in Single-Wire Mode. — This bit determines whether the TXD pin is going to
be used as an input or output, in the Single-Wire mode of operation. This bit is only relevant in the Single-Wire
mode of operation.
TXDIR
0 TXD pin to be used as an input in Single-Wire mode
1 TXD pin to be used as an output in Single-Wire mode
0
RAF
Receiver Active Flag — RAF is set when the receiver detects a logic 0 during the RT1 time period of the start
bit search. RAF is cleared when the receiver detects an idle character.
0 No reception in progress
1 Reception in progress
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13.3.2.6 SCI Data Registers (SCIDRH and SCIDRL)
Module Base + 0x_0006
7
6
5
4
3
2
1
0
R
W
R8
0
0
0
0
0
0
T8
Reset
0
0
0
0
0
0
0
0
Module Base + 0x_0007
7
6
5
4
3
2
1
0
R
W
R7
T7
0
R6
R5
R4
R3
R2
R1
R0
T6
0
T5
0
T4
0
T3
0
T2
0
T1
0
T0
0
Reset
= Unimplemented or Reserved
Figure 13-8. SCI Data Registers (SCIDRH and SCIDRL)
Read: Anytime; reading accesses SCI receive data register
Write: Anytime; writing accesses SCI transmit data register; writing to R8 has no effect
Table 13-7. SCIDRH AND SCIDRL Field Descriptions
Field
Description
7
Received Bit 8 — R8 is the ninth data bit received when the SCI is configured for 9-bit data format (M = 1).
R8
6
Transmit Bit 8 — T8 is the ninth data bit transmitted when the SCI is configured for 9-bit data format (M = 1).
T8
7–0
R[7:0]
T[7:0]
Received Bits — Received bits seven through zero for 9-bit or 8-bit data formats
Transmit Bits — Transmit bits seven through zero for 9-bit or 8-bit formats
NOTE
If the value of T8 is the same as in the previous transmission, T8 does not
have to be rewritten.The same value is transmitted until T8 is rewritten
In 8-bit data format, only SCI data register low (SCIDRL) needs to be
accessed.
When transmitting in 9-bit data format and using 8-bit write instructions,
write first to SCI data register high (SCIDRH), then SCIDRL.
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13.4 Functional Description
This section provides a complete functional description of the SCI block, detailing the operation of the
design from the end user perspective in a number of subsections.
Figure 13-9 shows the structure of the SCI module. The SCI allows full duplex, asynchronous, NRZ serial
communication between the CPU and remote devices, including other CPUs. The SCI transmitter and
receiver operate independently, although they use the same baud rate generator. The CPU monitors the
status of the SCI, writes the data to be transmitted, and processes received data.
SCI DATA
REGISTER
R8
RECEIVE
SHIFT REGISTER
NF
RXD
FE
PF
RE
RWU
RECEIVE
AND WAKEUP
CONTROL
RAF
IDLE
RDRF
OR
ILIE
LOOPS
RSRC
SBR12–SBR0
M
WAKE
ILT
BUS
CLOCK
BAUD RATE
GENERATOR
RIE
DATA FORMAT
CONTROL
IRQ
PE
PT
TO CPU
TE
TRANSMIT
CONTROL
÷16
LOOPS
SBK
TIE
TDRE
TC
RSRC
TRANSMIT
SHIFT REGISTER
T8
TCIE
SCI DATA
REGISTER
TXD
Figure 13-9. SCI Block Diagram
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13.4.1 Data Format
The SCI uses the standard NRZ mark/space data format illustrated in Figure 13-10 below.
PARITY
OR DATA
BIT
8-BIT DATA FORMAT
BIT M IN SCICR1 CLEAR
NEXT
START
BIT
START
BIT
STOP
BIT
BIT 0
BIT 0
BIT 1
BIT 1
BIT 2
BIT 3
BIT 4
BIT 5
BIT 6
BIT 7
PARITY
OR DATA
BIT
9-BIT DATA FORMAT
BIT M IN SCICR1 SET
NEXT
START
BIT
START
BIT
STOP
BIT
BIT 2
BIT 3
BIT 4
BIT 5
BIT 6
BIT 7
BIT 8
Figure 13-10. SCI Data Formats
Each data character is contained in a frame that includes a start bit, eight or nine data bits, and a stop bit.
Clearing the M bit in SCI control register 1 configures the SCI for 8-bit data characters.A frame with eight
data bits has a total of 10 bits. Setting the M bit configures the SCI for nine-bit data characters. A frame
with nine data bits has a total of 11 bits
Table 13-8. Example of 8-Bit Data Formats
Start
Bit
Data
Bits
Address
Bits
Parity
Bits
Stop
Bit
1
1
1
8
7
7
0
0
1(1)
0
1
0
1
1
1
1. The address bit identifies the frame as an address character. See
Section 13.4.4.6, “Receiver Wakeup”.
When the SCI is configured for 9-bit data characters, the ninth data bit is the T8 bit in SCI data register
high (SCIDRH). It remains unchanged after transmission and can be used repeatedly without rewriting it.
A frame with nine data bits has a total of 11 bits.
Table 13-9. Example of 9-Bit Data Formats
Start
Bit
Data
Bits
Address
Bits
Parity
Bits
Stop
Bit
1
1
1
9
8
8
0
0
1(1)
0
1
0
1
1
1
1. The address bit identifies the frame as an address character. See
Section 13.4.4.6, “Receiver Wakeup”.
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13.4.2 Baud Rate Generation
A 13-bit modulus counter in the baud rate generator derives the baud rate for both the receiver and the
transmitter. The value from 0 to 8191 written to the SBR12–SBR0 bits determines the module clock
divisor. The SBR bits are in the SCI baud rate registers (SCIBDH and SCIBDL). The baud rate clock is
synchronized with the bus clock and drives the receiver. The baud rate clock divided by 16 drives the
transmitter. The receiver has an acquisition rate of 16 samples per bit time.
Baud rate generation is subject to one source of error:
Integer division of the module clock may not give the exact target frequency.
Table 13-10 lists some examples of achieving target baud rates with a module clock frequency of 25 MHz
SCI baud rate = SCI module clock / (16 * SCIBR[12:0])
Table 13-10. Baud Rates (Example: Module Clock = 25 MHz)
Bits
SBR[12-0]
Receiver
Clock (Hz)
Transmitter
Clock (Hz)
Target Baud
Rate
Error
(%)
41
81
609,756.1
308,642.0
153,374.2
76,687.1
38,402.5
19,201.2
9600.6
38,109.8
19,290.1
9585.9
4792.9
2400.2
1200.1
600.0
38,400
19,200
9600
4800
2400
1200
600
.76
.47
.16
.15
.01
.01
.00
.00
163
326
651
1302
2604
5208
4800.0
300.0
300
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13.4.3 Transmitter
INTERNAL BUS
BUS
÷ 16
BAUD DIVIDER
CLOCK
SCI DATA REGISTERS
SBR12–SBR0
11-BIT TRANSMIT SHIFT REGISTER
TXD
H
8
7
6
5
4
3
2
1
0
L
M
TO
RXD
LOOP
CONTROL
T8
PE
PT
PARITY
GENERATION
LOOPS
RSRC
TRANSMITTER CONTROL
TDRE
TIE
TE
SBK
TDRE INTERRUPT REQUEST
TC INTERRUPT REQUEST
TC
TCIE
Figure 13-11. Transmitter Block Diagram
13.4.3.1 Transmitter Character Length
The SCI transmitter can accommodate either 8-bit or 9-bit data characters. The state of the M bit in SCI
control register 1 (SCICR1) determines the length of data characters. When transmitting 9-bit data, bit T8
in SCI data register high (SCIDRH) is the ninth bit (bit 8).
13.4.3.2 Character Transmission
To transmit data, the MCU writes the data bits to the SCI data registers (SCIDRH/SCIDRL), which in turn
are transferred to the transmitter shift register. The transmit shift register then shifts a frame out through
the Tx output signal, after it has prefaced them with a start bit and appended them with a stop bit. The SCI
data registers (SCIDRH and SCIDRL) are the write-only buffers between the internal data bus and the
transmit shift register.
The SCI also sets a flag, the transmit data register empty flag (TDRE), every time it transfers data from the
buffer (SCIDRH/L) to the transmitter shift register.The transmit driver routine may respond to this flag by
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writing another byte to the Transmitter buffer (SCIDRH/SCIDRL), while the shift register is still shifting
out the first byte.
To initiate an SCI transmission:
1. Configure the SCI:
a) Select a baud rate. Write this value to the SCI baud registers (SCIBDH/L) to begin the baud
rate generator. Remember that the baud rate generator is disabled when the baud rate is zero.
Writing to the SCIBDH has no effect without also writing to SCIBDL.
b) Write to SCICR1 to configure word length, parity, and other configuration bits
(LOOPS,RSRC,M,WAKE,ILT,PE,PT).
c) Enable the transmitter, interrupts, receive, and wake up as required, by writing to the SCICR2
register bits (TIE,TCIE,RIE,ILIE,TE,RE,RWU,SBK). A preamble or idle character will now
be shifted out of the transmitter shift register.
2. Transmit Procedure for Each Byte:
a. Poll the TDRE flag by reading the SCISR1 or responding to the TDRE interrupt. Keep in mind
that the TDRE bit resets to one.
d) If the TDRE flag is set, write the data to be transmitted to SCIDRH/L, where the ninth bit is
written to the T8 bit in SCIDRH if the SCI is in 9-bit data format. A new transmission will not
result until the TDRE flag has been cleared.
3. Repeat step 2 for each subsequent transmission.
NOTE
The TDRE flag is set when the shift register is loaded with the next data to
be transmitted from SCIDRH/L, which happens, generally speaking, a little
over half-way through the stop bit of the previous frame. Specifically, this
transfer occurs 9/16ths of a bit time AFTER the start of the stop bit of the
previous frame.
Writing the TE bit from 0 to a 1 automatically loads the transmit shift register with a preamble of 10 logic
1s (if M = 0) or 11 logic 1s (if M = 1). After the preamble shifts out, control logic transfers the data from
the SCI data register into the transmit shift register. A logic 0 start bit automatically goes into the least
significant bit position of the transmit shift register. A logic 1 stop bit goes into the most significant bit
position.
Hardware supports odd or even parity. When parity is enabled, the most significant bit (msb) of the data
character is the parity bit.
The transmit data register empty flag, TDRE, in SCI status register 1 (SCISR1) becomes set when the SCI
data register transfers a byte to the transmit shift register. The TDRE flag indicates that the SCI data
register can accept new data from the internal data bus. If the transmit interrupt enable bit, TIE, in SCI
control register 2 (SCICR2) is also set, the TDRE flag generates a transmitter interrupt request.
When the transmit shift register is not transmitting a frame, the Tx output signal goes to the idle condition,
logic 1. If at any time software clears the TE bit in SCI control register 2 (SCICR2), the transmitter enable
signal goes low and the transmit signal goes idle.
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If software clears TE while a transmission is in progress (TC = 0), the frame in the transmit shift register
continues to shift out. To avoid accidentally cutting off the last frame in a message, always wait for TDRE
to go high after the last frame before clearing TE.
To separate messages with preambles with minimum idle line time, use this sequence between messages:
1. Write the last byte of the first message to SCIDRH/L.
2. Wait for the TDRE flag to go high, indicating the transfer of the last frame to the transmit shift
register.
3. Queue a preamble by clearing and then setting the TE bit.
4. Write the first byte of the second message to SCIDRH/L.
13.4.3.3 Break Characters
Writing a logic 1 to the send break bit, SBK, in SCI control register 2 (SCICR2) loads the transmit shift
register with a break character. A break character contains all logic 0s and has no start, stop, or parity bit.
Break character length depends on the M bit in SCI control register 1 (SCICR1). As long as SBK is at
logic 1, transmitter logic continuously loads break characters into the transmit shift register. After software
clears the SBK bit, the shift register finishes transmitting the last break character and then transmits at least
one logic 1. The automatic logic 1 at the end of a break character guarantees the recognition of the start bit
of the next frame.
The SCI recognizes a break character when a start bit is followed by eight or nine logic 0 data bits and a
logic 0 where the stop bit should be. Receiving a break character has these effects on SCI registers:
•
•
•
•
Sets the framing error flag, FE
Sets the receive data register full flag, RDRF
Clears the SCI data registers (SCIDRH/L)
May set the overrun flag, OR, noise flag, NF, parity error flag, PE, or the receiver active flag, RAF
(see Section 13.3.2.4, “SCI Status Register 1 (SCISR1)” and Section 13.3.2.5, “SCI Status
Register 2 (SCISR2)”
13.4.3.4 Idle Characters
An idle character contains all logic 1s and has no start, stop, or parity bit. Idle character length depends on
the M bit in SCI control register 1 (SCICR1). The preamble is a synchronizing idle character that begins
the first transmission initiated after writing the TE bit from 0 to 1.
If the TE bit is cleared during a transmission, the Tx output signal becomes idle after completion of the
transmission in progress. Clearing and then setting the TE bit during a transmission queues an idle
character to be sent after the frame currently being transmitted.
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NOTE
When queueing an idle character, return the TE bit to logic 1 before the stop
bit of the current frame shifts out through the Tx output signal. Setting TE
after the stop bit appears on Tx output signal causes data previously written
to the SCI data register to be lost. Toggle the TE bit for a queued idle
character while the TDRE flag is set and immediately before writing the
next byte to the SCI data register.
NOTE
If the TE bit is clear and the transmission is complete, the SCI is not the
master of the TXD pin
13.4.4 Receiver
INTERNAL BUS
SBR12–SBR0
SCI DATA REGISTER
BUS
CLOCK
BAUD DIVIDER
11-BIT RECEIVE SHIFT REGISTER
DATA
RECOVERY
H
8
7
6
5
4
3
2
1
0
L
RXD
LOOP
CONTROL
FROM TXD
RE
RAF
LOOPS
RSRC
FE
M
RWU
NF
PE
WAKE
ILT
WAKEUP
LOGIC
PE
PT
R8
PARITY
CHECKING
IDLE
IDLE INTERRUPT REQUEST
ILIE
RDRF
OR
RDRF/OR INTERRUPT REQUEST
RIE
Figure 13-12. SCI Receiver Block Diagram
13.4.4.1 Receiver Character Length
The SCI receiver can accommodate either 8-bit or 9-bit data characters. The state of the M bit in SCI
control register 1 (SCICR1) determines the length of data characters. When receiving 9-bit data, bit R8 in
SCI data register high (SCIDRH) is the ninth bit (bit 8).
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13.4.4.2 Character Reception
During an SCI reception, the receive shift register shifts a frame in from the Rx input signal. The SCI data
register is the read-only buffer between the internal data bus and the receive shift register.
After a complete frame shifts into the receive shift register, the data portion of the frame transfers to the
SCI data register. The receive data register full flag, RDRF, in SCI status register 1 (SCISR1) becomes set,
indicating that the received byte can be read. If the receive interrupt enable bit, RIE, in SCI control
register 2 (SCICR2) is also set, the RDRF flag generates an RDRF interrupt request.
13.4.4.3 Data Sampling
The receiver samples the Rx input signal at the RT clock rate. The RT clock is an internal signal with a
frequency 16 times the baud rate. To adjust for baud rate mismatch, the RT clock (see Figure 13-13) is re-
synchronized:
•
•
After every start bit
After the receiver detects a data bit change from logic 1 to logic 0 (after the majority of data bit
samples at RT8, RT9, and RT10 returns a valid logic 1 and the majority of the next RT8, RT9, and
RT10 samples returns a valid logic 0)
To locate the start bit, data recovery logic does an asynchronous search for a logic 0 preceded by three
logic 1s.When the falling edge of a possible start bit occurs, the RT clock begins to count to 16.
START BIT
LSB
Rx Input Signal
SAMPLES
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
START BIT
QUALIFICATION
START BIT
VERIFICATION
DATA
SAMPLING
RT CLOCK
RT CLOCK COUNT
RESET RT CLOCK
Figure 13-13. Receiver Data Sampling
To verify the start bit and to detect noise, data recovery logic takes samples at RT3, RT5, and RT7.
Table 13-11 summarizes the results of the start bit verification samples.
Table 13-11. Start Bit Verification
RT3, RT5, and RT7 Samples
Start Bit Verification
Noise Flag
000
001
010
011
Yes
Yes
Yes
No
0
1
1
0
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Table 13-11. Start Bit Verification
RT3, RT5, and RT7 Samples
Start Bit Verification
Noise Flag
100
101
110
111
Yes
No
No
No
1
0
0
0
If start bit verification is not successful, the RT clock is reset and a new search for a start bit begins.
To determine the value of a data bit and to detect noise, recovery logic takes samples at RT8, RT9, and
RT10. Table 13-12 summarizes the results of the data bit samples.
Table 13-12. Data Bit Recovery
RT8, RT9, and RT10 Samples
Data Bit Determination
Noise Flag
000
001
010
011
100
101
110
111
0
0
0
1
0
1
1
1
0
1
1
1
1
1
1
0
NOTE
The RT8, RT9, and RT10 samples do not affect start bit verification. If any
or all of the RT8, RT9, and RT10 start bit samples are logic 1s following a
successful start bit verification, the noise flag (NF) is set and the receiver
assumes that the bit is a start bit (logic 0).
To verify a stop bit and to detect noise, recovery logic takes samples at RT8, RT9, and RT10. Table 13-13
summarizes the results of the stop bit samples.
Table 13-13. Stop Bit Recovery
RT8, RT9, and RT10 Samples
Framing Error Flag
Noise Flag
000
001
010
011
100
101
110
111
1
1
1
0
1
0
0
0
0
1
1
1
1
1
1
0
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In Figure 13-14 the verification samples RT3 and RT5 determine that the first low detected was noise and
not the beginning of a start bit. The RT clock is reset and the start bit search begins again. The noise flag
is not set because the noise occurred before the start bit was found.
START BIT
LSB
Rx Input Signal
SAMPLES
1
1
1
0
1
1
1
0
0
0
0
0
0
0
RT CLOCK
RT CLOCK COUNT
RESET RT CLOCK
Figure 13-14. Start Bit Search Example 1
In Figure 13-15, verification sample at RT3 is high. The RT3 sample sets the noise flag. Although the
perceived bit time is misaligned, the data samples RT8, RT9, and RT10 are within the bit time and data
recovery is successful.
PERCEIVED START BIT
ACTUAL START BIT
LSB
Rx Input Signal
SAMPLES
1
1
1
1
1
0
1
0
0
0
0 0
RT CLOCK
RT CLOCK COUNT
RESET RT CLOCK
Figure 13-15. Start Bit Search Example 2
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In Figure 13-16, a large burst of noise is perceived as the beginning of a start bit, although the test sample
at RT5 is high. The RT5 sample sets the noise flag. Although this is a worst-case misalignment of perceived
bit time, the data samples RT8, RT9, and RT10 are within the bit time and data recovery is successful.
PERCEIVED START BIT
ACTUAL START BIT
LSB
Rx input Signal
SAMPLES
1
1
1
0
0
1
0
0
0
0
RT CLOCK
RT CLOCK COUNT
RESET RT CLOCK
Figure 13-16. Start Bit Search Example 3
Figure 13-17 shows the effect of noise early in the start bit time. Although this noise does not affect proper
synchronization with the start bit time, it does set the noise flag.
PERCEIVED AND ACTUAL START BIT
0
LSB
Rx Input Signal
SAMPLES
1
1
1
1
1
1
1
1
1
0
1
RT CLOCK
RT CLOCK COUNT
RESET RT CLOCK
Figure 13-17. Start Bit Search Example 4
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Figure 13-18 shows a burst of noise near the beginning of the start bit that resets the RT clock. The sample
after the reset is low but is not preceded by three high samples that would qualify as a falling edge.
Depending on the timing of the start bit search and on the data, the frame may be missed entirely or it may
set the framing error flag.
START BIT
NO START BIT FOUND
LSB
Rx Input Signal
SAMPLES
1
1
1
1
1
1
1
1
1
0
0
1
1
0
0
0
0
0
0
0
0
RT CLOCK
RT CLOCK COUNT
RESET RT CLOCK
Figure 13-18. Start Bit Search Example 5
In Figure 13-19, a noise burst makes the majority of data samples RT8, RT9, and RT10 high. This sets the
noise flag but does not reset the RT clock. In start bits only, the RT8, RT9, and RT10 data samples are
ignored.
START BIT
LSB
Rx Input Signal
SAMPLES
1
1
1
1
1
1
1
1
1
0
0
0
0
1
0
1
RT CLOCK
RT CLOCK COUNT
RESET RT CLOCK
Figure 13-19. Start Bit Search Example 6
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13.4.4.4 Framing Errors
If the data recovery logic does not detect a logic 1 where the stop bit should be in an incoming frame, it
sets the framing error flag, FE, in SCI status register 1 (SCISR1). A break character also sets the FE flag
because a break character has no stop bit. The FE flag is set at the same time that the RDRF flag is set.
13.4.4.5 Baud Rate Tolerance
A transmitting device may be operating at a baud rate below or above the receiver baud rate. Accumulated
bit time misalignment can cause one of the three stop bit data samples (RT8, RT9, and RT10) to fall outside
the actual stop bit.A noise error will occur if the RT8, RT9, and RT10 samples are not all the same logical
values. A framing error will occur if the receiver clock is misaligned in such a way that the majority of the
RT8, RT9, and RT10 stop bit samples are a logic zero.
As the receiver samples an incoming frame, it re-synchronizes the RT clock on any valid falling edge
within the frame. Re synchronization within frames will correct a misalignment between transmitter bit
times and receiver bit times.
13.4.4.5.1
Slow Data Tolerance
Figure 13-20 shows how much a slow received frame can be misaligned without causing a noise error or
a framing error. The slow stop bit begins at RT8 instead of RT1 but arrives in time for the stop bit data
samples at RT8, RT9, and RT10.
MSB
STOP
RECEIVER
RT CLOCK
DATA
SAMPLES
Figure 13-20. Slow Data
Let’s take RTr as receiver RT clock and RTt as transmitter RT clock.
For an 8-bit data character, it takes the receiver 9 bit times x 16 RTr cycles +7 RTr cycles =151 RTr cycles
to start data sampling of the stop bit.
With the misaligned character shown in Figure 13-20, the receiver counts 151 RTr cycles at the point when
the count of the transmitting device is 9 bit times x 16 RTt cycles = 144 RTt cycles.
The maximum percent difference between the receiver count and the transmitter count of a slow 8-bit data
character with no errors is:
((151 – 144) / 151) x 100 = 4.63%
For a 9-bit data character, it takes the receiver 10 bit times x 16 RTr cycles + 7 RTr cycles = 167 RTr cycles
to start data sampling of the stop bit.
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With the misaligned character shown in Figure 13-20, the receiver counts 167 RTr cycles at the point when
the count of the transmitting device is 10 bit times x 16 RTt cycles = 160 RTt cycles.
The maximum percent difference between the receiver count and the transmitter count of a slow 9-bit
character with no errors is:
((167 – 160) / 167) X 100 = 4.19%
13.4.4.5.2
Fast Data Tolerance
Figure 13-21 shows how much a fast received frame can be misaligned. The fast stop bit ends at RT10
instead of RT16 but is still sampled at RT8, RT9, and RT10.
STOP
IDLE OR NEXT FRAME
RECEIVER
RT CLOCK
DATA
SAMPLES
Figure 13-21. Fast Data
For an 8-bit data character, it takes the receiver 9 bit times x 16 RTr cycles + 10 RTr cycles = 154 RTr cycles
to finish data sampling of the stop bit.
With the misaligned character shown in Figure 13-21, the receiver counts 154 RTr cycles at the point when
the count of the transmitting device is 10 bit times x 16 RTt cycles = 160 RTt cycles.
The maximum percent difference between the receiver count and the transmitter count of a fast 8-bit
character with no errors is:
((160 – 154) / 160) x 100 = 3.75%
For a 9-bit data character, it takes the receiver 10 bit times x 16 RTr cycles + 10 RTr cycles = 170 RTr cycles
to finish data sampling of the stop bit.
With the misaligned character shown in Figure 13-21, the receiver counts 170 RTr cycles at the point when
the count of the transmitting device is 11 bit times x 16 RTt cycles = 176 RTt cycles.
The maximum percent difference between the receiver count and the transmitter count of a fast 9-bit
character with no errors is:
((176 – 170) / 176) x 100 = 3.40%
13.4.4.6 Receiver Wakeup
To enable the SCI to ignore transmissions intended only for other receivers in multiple-receiver systems,
the receiver can be put into a standby state. Setting the receiver wakeup bit, RWU, in SCI control register
2 (SCICR2) puts the receiver into standby state during which receiver interrupts are disabled.The SCI will
still load the receive data into the SCIDRH/L registers, but it will not set the RDRF flag.
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The transmitting device can address messages to selected receivers by including addressing information in
the initial frame or frames of each message.
The WAKE bit in SCI control register 1 (SCICR1) determines how the SCI is brought out of the standby
state to process an incoming message. The WAKE bit enables either idle line wakeup or address mark
wakeup.
13.4.4.6.1
Idle Input Line Wakeup (WAKE = 0)
In this wakeup method, an idle condition on the Rx Input signal clears the RWU bit and wakes up the SCI.
The initial frame or frames of every message contain addressing information. All receivers evaluate the
addressing information, and receivers for which the message is addressed process the frames that follow.
Any receiver for which a message is not addressed can set its RWU bit and return to the standby state. The
RWU bit remains set and the receiver remains on standby until another idle character appears on the Rx
Input signal.
Idle line wakeup requires that messages be separated by at least one idle character and that no message
contains idle characters.
The idle character that wakes a receiver does not set the receiver idle bit, IDLE, or the receive data register
full flag, RDRF.
The idle line type bit, ILT, determines whether the receiver begins counting logic 1s as idle character bits
after the start bit or after the stop bit. ILT is in SCI control register 1 (SCICR1).
13.4.4.6.2
Address Mark Wakeup (WAKE = 1)
In this wakeup method, a logic 1 in the most significant bit (msb) position of a frame clears the RWU bit
and wakes up the SCI. The logic 1 in the msb position marks a frame as an address frame that contains
addressing information. All receivers evaluate the addressing information, and the receivers for which the
message is addressed process the frames that follow.Any receiver for which a message is not addressed can
set its RWU bit and return to the standby state. The RWU bit remains set and the receiver remains on
standby until another address frame appears on the Rx Input signal.
The logic 1 msb of an address frame clears the receiver’s RWU bit before the stop bit is received and sets
the RDRF flag.
Address mark wakeup allows messages to contain idle characters but requires that the msb be reserved for
use in address frames.{sci_wake}
NOTE
With the WAKE bit clear, setting the RWU bit after the Rx Input signal has
been idle can cause the receiver to wake up immediately.
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13.4.5 Single-Wire Operation
Normally, the SCI uses two pins for transmitting and receiving. In single-wire operation, the RXD pin is
disconnected from the SCI. The SCI uses the TXD pin for both receiving and transmitting.
Tx OUTPUT SIGNAL
TRANSMITTER
Tx INPUT SIGNAL
RECEIVER
RXD
Figure 13-22. Single-Wire Operation (LOOPS = 1, RSRC = 1)
Enable single-wire operation by setting the LOOPS bit and the receiver source bit, RSRC, in SCI control
register 1 (SCICR1). Setting the LOOPS bit disables the path from the Rx Input signal to the receiver.
Setting the RSRC bit connects the receiver input to the output of the TXD pin driver. Both the transmitter
and receiver must be enabled (TE = 1 and RE = 1).The TXDIR bit (SCISR2[1]) determines whether the
TXD pin is going to be used as an input (TXDIR = 0) or an output (TXDIR = 1) in this mode of operation.
13.4.6 Loop Operation
In loop operation the transmitter output goes to the receiver input. The Rx Input signal is disconnected
from the SCI
.
Tx OUTPUT SIGNAL
TRANSMITTER
RECEIVER
RXD
Figure 13-23. Loop Operation (LOOPS = 1, RSRC = 0)
Enable loop operation by setting the LOOPS bit and clearing the RSRC bit in SCI control register 1
(SCICR1). Setting the LOOPS bit disables the path from the Rx Input signal to the receiver. Clearing the
RSRC bit connects the transmitter output to the receiver input. Both the transmitter and receiver must be
enabled (TE = 1 and RE = 1).
13.5 Initialization Information
13.5.1 Reset Initialization
The reset state of each individual bit is listed in Section 13.3, “Memory Map and Registers” which details
the registers and their bit fields. All special functions or modes which are initialized during or just
following reset are described within this section.
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13.5.2 Interrupt Operation
13.5.2.1 System Level Interrupt Sources
There are five interrupt sources that can generate an SCI interrupt in to the CPU. They are listed in
Table 13-14.
Table 13-14. SCI Interrupt Source
Interrupt Source
Flag
Local Enable
Transmitter
Transmitter
Receiver
TDRE
TC
TIE
TCIE
RIE
RDRF
OR
Receiver
IDLE
ILIE
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13.5.2.2 Interrupt Descriptions
The SCI only originates interrupt requests. The following is a description of how the SCI makes a request
and how the MCU should acknowledge that request. The interrupt vector offset and interrupt number are
chip dependent. The SCI only has a single interrupt line (SCI Interrupt Signal, active high operation) and
all the following interrupts, when generated, are ORed together and issued through that port.
13.5.2.2.1
TDRE Description
The TDRE interrupt is set high by the SCI when the transmit shift register receives a byte from the SCI
data register. A TDRE interrupt indicates that the transmit data register (SCIDRH/L) is empty and that a
new byte can be written to the SCIDRH/L for transmission.Clear TDRE by reading SCI status register 1
with TDRE set and then writing to SCI data register low (SCIDRL).
13.5.2.2.2
TC Description
The TC interrupt is set by the SCI when a transmission has been completed.A TC interrupt indicates that
there is no transmission in progress. TC is set high when the TDRE flag is set and no data, preamble, or
break character is being transmitted. When TC is set, the TXD pin becomes idle (logic 1). Clear TC by
reading SCI status register 1 (SCISR1) with TC set and then writing to SCI data register low (SCIDRL).TC
is cleared automatically when data, preamble, or break is queued and ready to be sent.
13.5.2.2.3
RDRF Description
The RDRF interrupt is set when the data in the receive shift register transfers to the SCI data register. A
RDRF interrupt indicates that the received data has been transferred to the SCI data register and that the
byte can now be read by the MCU. The RDRF interrupt is cleared by reading the SCI status register one
(SCISR1) and then reading SCI data register low (SCIDRL).
13.5.2.2.4
OR Description
The OR interrupt is set when software fails to read the SCI data register before the receive shift register
receives the next frame. The newly acquired data in the shift register will be lost in this case, but the data
already in the SCI data registers is not affected. The OR interrupt is cleared by reading the SCI status
register one (SCISR1) and then reading SCI data register low (SCIDRL).
13.5.2.3 IDLE Description
The IDLE interrupt is set when 10 consecutive logic 1s (if M = 0) or 11 consecutive logic 1s (if M = 1)
appear on the receiver input. Once the IDLE is cleared, a valid frame must again set the RDRF flag before
an idle condition can set the IDLE flag. Clear IDLE by reading SCI status register 1 (SCISR1) with IDLE
set and then reading SCI data register low (SCIDRL).
13.5.3 Recovery from Wait Mode
The SCI interrupt request can be used to bring the CPU out of wait mode.
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Chapter 14
Serial Peripheral Interface (SPIV3) Block Description
14.1 Introduction
The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral
devices. Software can poll the SPI status flags or the SPI operation can be interrupt driven.
14.1.1 Features
The SPIV3 includes these distinctive features:
•
•
•
•
•
•
•
Master mode and slave mode
Bidirectional mode
Slave select output
Mode fault error flag with CPU interrupt capability
Double-buffered data register
Serial clock with programmable polarity and phase
Control of SPI operation during wait mode
14.1.2 Modes of Operation
The SPI functions in three modes, run, wait, and stop.
•
Run Mode
This is the basic mode of operation.
•
Wait Mode
SPI operation in wait mode is a configurable low power mode, controlled by the SPISWAI bit
located in the SPICR2 register. In wait mode, if the SPISWAI bit is clear, the SPI operates like in
Run Mode. If the SPISWAI bit is set, the SPI goes into a power conservative state, with the SPI
clock generation turned off. If the SPI is configured as a master, any transmission in progress stops,
but is resumed after CPU goes into Run Mode. If the SPI is configured as a slave, reception and
transmission of a byte continues, so that the slave stays synchronized to the master.
•
Stop Mode
The SPI is inactive in stop mode for reduced power consumption. If the SPI is configured as a
master, any transmission in progress stops, but is resumed after CPU goes into run mode. If the SPI
is configured as a slave, reception and transmission of a byte continues, so that the slave stays
synchronized to the master.
This is a high level description only, detailed descriptions of operating modes are contained in
Section 14.4, “Functional Description.”
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Chapter 14 Serial Peripheral Interface (SPIV3) Block Description
14.1.3 Block Diagram
Figure 14-1 gives an overview on the SPI architecture. The main parts of the SPI are status, control, and
data registers, shifter logic, baud rate generator, master/slave control logic, and port control logic.
SPI
2
SPI Control Register 1
BIDIROE
2
SPI Control Register 2
SPC0
SPI Status Register
Slave
CPOL
CPHA
MOSI
Control
SPIF MODF SPTEF
Interrupt Control
Phase +
Polarity
Control
SCK in
Slave Baud Rate
SPI
Interrupt
Master Baud Rate
Phase +
Polarity
Control
SCK out
Request
Port
Control
Logic
SCK
SS
Baud Rate Generator
Counter
Master
Control
Shift
Clock
Sample
Clock
Baud Rate
Bus Clock
Clock Select
Prescaler
SPPR
3
3
SPR
Shifter
SPI Baud Rate Register
data in
LSBFE=1
LSBFE=0
8
8
LSBFE=1
LSBFE=0
MSB
SPI Data Register
LSB
data out
LSBFE=0
LSBFE=1
Figure 14-1. SPI Block Diagram
14.2 External Signal Description
This section lists the name and description of all ports including inputs and outputs that do, or may, connect
off chip. The SPIV3 module has a total of four external pins.
14.2.1 MOSI — Master Out/Slave In Pin
This pin is used to transmit data out of the SPI module when it is configured as a master and receive data
when it is configured as slave.
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14.2.2 MISO — Master In/Slave Out Pin
This pin is used to transmit data out of the SPI module when it is configured as a slave and receive data
when it is configured as master.
14.2.3
SS — Slave Select Pin
This pin is used to output the select signal from the SPI module to another peripheral with which a data
transfer is to take place when its configured as a master and its used as an input to receive the slave select
signal when the SPI is configured as slave.
14.2.4 SCK — Serial Clock Pin
This pin is used to output the clock with respect to which the SPI transfers data or receive clock in case of
slave.
14.3 Memory Map and Register Definition
This section provides a detailed description of address space and registers used by the SPI.
The memory map for the SPIV3 is given below in Table 14-1. The address listed for each register is the
sum of a base address and an address offset. The base address is defined at the SoC level and the address
offset is defined at the module level. Reads from the reserved bits return zeros and writes to the reserved
bits have no effect.
14.3.1 Module Memory Map
Table 14-1. SPIV3 Memory Map
Address
Use
Access
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
SPI Control Register 1 (SPICR1)
SPI Control Register 2 (SPICR2)
SPI Baud Rate Register (SPIBR)
SPI Status Register (SPISR)
Reserved
R/W
R/W(1)
R/W1
R(2)
2,(3)
—
SPI Data Register (SPIDR)
Reserved
R/W
2,3
—
2,3
Reserved
—
1. Certain bits are non-writable.
2. Writes to this register are ignored.
3. Reading from this register returns all zeros.
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Chapter 14 Serial Peripheral Interface (SPIV3) Block Description
14.3.2 Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Details of register bit and field function follow the register
diagrams, in bit order.
Name
7
6
5
4
3
2
1
0
0x0000
SPICR1
R
SPIE
SPE
SPTIE
MSTR
CPOL
CPHA
SSOE
LSBFE
W
0x0001
SPICR2
R
0
0
0
0
0
MODFEN BIDIROE
SPISWAI
SPC0
W
0x0002
SPIBR
R
0
SPPR2
0
SPPR1
SPTEF
SPPR0
SPR2
0
SPR1
0
SPR0
0
W
0x0003
SPISR
R
SPIF
MODF
0
3
W
0x0004
Reserved
R
W
0x0005
SPIDR
R
Bit 7
6
5
4
2
2
Bit 0
W
0x0006
R
Reserved
W
0x0007
R
Reserved
W
= Unimplemented or Reserved
Figure 14-2. SPI Register Summary
14.3.2.1 SPI Control Register 1 (SPICR1)
Module Base 0x0000
7
6
5
4
3
2
1
0
R
W
SPIE
SPE
SPTIE
MSTR
CPOL
CPHA
1
SSOE
LSBFE
Reset
0
0
0
0
0
0
0
Figure 14-3. SPI Control Register 1 (SPICR1)
Read: anytime
Write: anytime
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Table 14-2. SPICR1 Field Descriptions
Field
Description
7
SPI Interrupt Enable Bit — This bit enables SPI interrupt requests, if SPIF or MODF status flag is set.
SPIE
0 SPI interrupts disabled.
1 SPI interrupts enabled.
6
SPE
SPI System Enable Bit — This bit enables the SPI system and dedicates the SPI port pins to SPI system
functions. If SPE is cleared, SPI is disabled and forced into idle state, status bits in SPISR register are reset.
0 SPI disabled (lower power consumption).
1 SPI enabled, port pins are dedicated to SPI functions.
5
SPI Transmit Interrupt Enable — This bit enables SPI interrupt requests, if SPTEF flag is set.
0 SPTEF interrupt disabled.
SPTIE
1 SPTEF interrupt enabled.
4
SPI Master/Slave Mode Select Bit — This bit selects, if the SPI operates in master or slave mode. Switching
the SPI from master to slave or vice versa forces the SPI system into idle state.
0 SPI is in slave mode
MSTR
1 SPI is in master mode
3
SPI Clock Polarity Bit — This bit selects an inverted or non-inverted SPI clock. To transmit data between SPI
modules, the SPI modules must have identical CPOL values. In master mode, a change of this bit will abort a
transmission in progress and force the SPI system into idle state.
CPOL
0 Active-high clocks selected. In idle state SCK is low.
1 Active-low clocks selected. In idle state SCK is high.
2
SPI Clock Phase Bit — This bit is used to select the SPI clock format. In master mode, a change of this bit will
abort a transmission in progress and force the SPI system into idle state.
CPHA
0 Sampling of data occurs at odd edges (1,3,5,...,15) of the SCK clock
1 Sampling of data occurs at even edges (2,4,6,...,16) of the SCK clock
1
Slave Select Output Enable — The SS output feature is enabled only in master mode, if MODFEN is set, by
asserting the SSOE as shown in Table 14-3. In master mode, a change of this bit will abort a transmission in
progress and force the SPI system into idle state.
SSOE
0
LSB-First Enable — This bit does not affect the position of the MSB and LSB in the data register. Reads and
writes of the data register always have the MSB in bit 7. In master mode, a change of this bit will abort a
transmission in progress and force the SPI system into idle state.
LSBFE
0 Data is transferred most significant bit first.
1 Data is transferred least significant bit first.
Table 14-3. SS Input / Output Selection
MODFEN
SSOE
Master Mode
Slave Mode
0
0
1
1
0
1
0
1
SS not used by SPI
SS not used by SPI
SS input
SS input
SS input
SS input
SS input with MODF feature
SS is slave select output
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14.3.2.2 SPI Control Register 2 (SPICR2)
Module Base 0x0001
7
6
5
4
3
2
1
0
R
W
0
0
0
0
MODFEN
BIDIROE
SPISWAI
SPC0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 14-4. SPI Control Register 2 (SPICR2)
Read: anytime
Write: anytime; writes to the reserved bits have no effect
Table 14-4. SPICR2 Field Descriptions
Field
Description
Mode Fault Enable Bit — This bit allows the MODF failure being detected. If the SPI is in master mode and
4
MODFEN MODFEN is cleared, then the SS port pin is not used by the SPI. In slave mode, the SS is available only as an
input regardless of the value of MODFEN. For an overview on the impact of the MODFEN bit on the SS port pin
configuration refer to Table 14-3. In master mode, a change of this bit will abort a transmission in progress and
force the SPI system into idle state.
0 SS port pin is not used by the SPI
1 SS port pin with MODF feature
3
Output Enable in the Bidirectional Mode of Operation — This bit controls the MOSI and MISO output buffer
BIDIROE of the SPI, when in bidirectional mode of operation (SPC0 is set). In master mode this bit controls the output
buffer of the MOSI port, in slave mode it controls the output buffer of the MISO port. In master mode, with SPC0
set, a change of this bit will abort a transmission in progress and force the SPI into idle state.
0 Output buffer disabled
1 Output buffer enabled
1
SPI Stop in Wait Mode Bit — This bit is used for power conservation while in wait mode.
SPISWAI 0 SPI clock operates normally in wait mode
1 Stop SPI clock generation when in wait mode
0
Serial Pin Control Bit 0 — This bit enables bidirectional pin configurations as shown in Table 14-5. In master
SPC0
mode, a change of this bit will abort a transmission in progress and force the SPI system into idle state
Table 14-5. Bidirectional Pin Configurations
Pin Mode
SPC0
BIDIROE
MISO
MOSI
Master Mode of Operation
Normal
0
1
X
Master In
Master Out
Master In
Bidirectional
0
1
MISO not used by SPI
Master I/O
Slave Mode of Operation
Slave Out
Normal
0
X
Slave In
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Table 14-5. Bidirectional Pin Configurations (continued)
Pin Mode
SPC0
BIDIROE
MISO
MOSI
Bidirectional
1
0
1
Slave In
MOSI not used by SPI
Slave I/O
14.3.2.3 SPI Baud Rate Register (SPIBR)
Module Base 0x0002
7
6
5
4
3
2
1
0
R
W
0
0
SPPR2
SPPR1
SPPR0
SPR2
0
SPR1
0
SPR0
Reset
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 14-5. SPI Baud Rate Register (SPIBR)
Read: anytime
Write: anytime; writes to the reserved bits have no effect
Table 14-6. SPIBR Field Descriptions
Field
Description
SPI Baud Rate Preselection Bits — These bits specify the SPI baud rates as shown in Table 14-7. In master
6:4
SPPR[2:0] mode, a change of these bits will abort a transmission in progress and force the SPI system into idle state.
2:0
SPI Baud Rate Selection Bits — These bits specify the SPI baud rates as shown in Table 14-7. In master mode,
SPR[2:0}
a change of these bits will abort a transmission in progress and force the SPI system into idle state.
The baud rate divisor equation is as follows:
(SPR + 1)
BaudRateDivisor = (SPPR + 1) • 2
The baud rate can be calculated with the following equation:
Baud Rate = BusClock ⁄ BaudRateDivisor
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Table 14-7. Example SPI Baud Rate Selection (25 MHz Bus Clock)
Baud Rate
Divisor
SPPR2
SPPR1
SPPR0
SPR2
SPR1
SPR0
Baud Rate
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
2
4
12.5 MHz
6.25 MHz
8
3.125 MHz
1.5625 MHz
781.25 kHz
390.63 kHz
195.31 kHz
97.66 kHz
6.25 MHz
16
32
64
128
256
4
8
3.125 MHz
1.5625 MHz
781.25 kHz
390.63 kHz
195.31 kHz
97.66 kHz
48.83 kHz
4.16667 MHz
2.08333 MHz
1.04167 MHz
520.83 kHz
260.42 kHz
130.21 kHz
65.10 kHz
32.55 kHz
3.125 MHz
1.5625 MHz
781.25 kHz
390.63 kHz
195.31 kHz
97.66 kHz
48.83 kHz
24.41 kHz
2.5 MHz
16
32
64
128
256
512
6
12
24
48
96
192
384
768
8
16
32
64
128
256
512
1024
10
20
1.25 MHz
40
625 kHz
80
312.5 kHz
156.25 kHz
78.13 kHz
39.06 kHz
160
320
640
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Table 14-7. Example SPI Baud Rate Selection (25 MHz Bus Clock) (continued)
Baud Rate
Divisor
SPPR2
SPPR1
SPPR0
SPR2
SPR1
SPR0
Baud Rate
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1280
12
19.53 kHz
2.08333 MHz
1.04167 MHz
520.83 kHz
260.42 kHz
130.21 kHz
65.10 kHz
24
48
96
192
384
768
1536
14
32.55 kHz
16.28 kHz
1.78571 MHz
892.86 kHz
446.43 kHz
223.21 kHz
111.61 kHz
55.80 kHz
28
56
112
224
448
896
1792
16
27.90 kHz
13.95 kHz
1.5625 MHz
781.25 kHz
390.63 kHz
195.31 kHz
97.66 kHz
32
64
128
256
512
1024
2048
48.83 kHz
24.41 kHz
12.21 kHz
NOTE
In slave mode of SPI S-clock speed DIV2 is not supported.
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14.3.2.4 SPI Status Register (SPISR)
Module Base 0x0003
7
6
5
4
3
2
1
0
R
W
SPIF
0
SPTEF
MODF
0
0
0
0
Reset
0
0
1
0
0
0
0
0
= Unimplemented or Reserved
Figure 14-6. SPI Status Register (SPISR)
Read: anytime
Write: has no effect
Table 14-8. SPISR Field Descriptions
Description
Field
7
SPIF Interrupt Flag — This bit is set after a received data byte has been transferred into the SPI Data Register.
SPIF
This bit is cleared by reading the SPISR register (with SPIF set) followed by a read access to the SPI Data
Register.
0 Transfer not yet complete
1 New data copied to SPIDR
5
SPI Transmit Empty Interrupt Flag — If set, this bit indicates that the transmit data register is empty. To clear
this bit and place data into the transmit data register, SPISR has to be read with SPTEF = 1, followed by a write
to SPIDR. Any write to the SPI Data Register without reading SPTEF = 1, is effectively ignored.
0 SPI Data register not empty
SPTEF
1 SPI Data register empty
4
Mode Fault Flag — This bit is set if the SS input becomes low while the SPI is configured as a master and mode
fault detection is enabled, MODFEN bit of SPICR2 register is set. Refer to MODFEN bit description in
Section 14.3.2.2, “SPI Control Register 2 (SPICR2).” The flag is cleared automatically by a read of the SPI Status
Register (with MODF set) followed by a write to the SPI Control Register 1.
0 Mode fault has not occurred.
MODF
1 Mode fault has occurred.
14.3.2.5 SPI Data Register (SPIDR)
Module Base 0x0005
7
6
5
4
3
2
1
0
R
W
Bit 7
6
5
4
3
2
2
Bit 0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 14-7. SPI Data Register (SPIDR)
Read: anytime; normally read only after SPIF is set
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Write: anytime
The SPI Data Register is both the input and output register for SPI data. A write to this register allows a
data byte to be queued and transmitted. For a SPI configured as a master, a queued data byte is transmitted
immediately after the previous transmission has completed. The SPI Transmitter Empty Flag SPTEF in
the SPISR register indicates when the SPI Data Register is ready to accept new data.
Reading the data can occur anytime from after the SPIF is set to before the end of the next transfer. If the
SPIF is not serviced by the end of the successive transfers, those data bytes are lost and the data within the
SPIDR retains the first byte until SPIF is serviced.
14.4 Functional Description
The SPI module allows a duplex, synchronous, serial communication between the MCU and peripheral
devices. Software can poll the SPI status flags or SPI operation can be interrupt driven.
The SPI system is enabled by setting the SPI enable (SPE) bit in SPI Control Register 1. While SPE bit is
set, the four associated SPI port pins are dedicated to the SPI function as:
•
•
•
•
Slave select (SS)
Serial clock (SCK)
Master out/slave in (MOSI)
Master in/slave out (MISO)
The main element of the SPI system is the SPI Data Register. The 8-bit data register in the master and the
8-bit data register in the slave are linked by the MOSI and MISO pins to form a distributed 16-bit register.
When a data transfer operation is performed, this 16-bit register is serially shifted eight bit positions by the
S-clock from the master, so data is exchanged between the master and the slave. Data written to the master
SPI Data Register becomes the output data for the slave, and data read from the master SPI Data Register
after a transfer operation is the input data from the slave.
A read of SPISR with SPTEF = 1 followed by a write to SPIDR puts data into the transmit data register.
When a transfer is complete, received data is moved into the receive data register. Data may be read from
this double-buffered system any time before the next transfer has completed. This 8-bit data register acts
as the SPI receive data register for reads and as the SPI transmit data register for writes. A single SPI
register address is used for reading data from the read data buffer and for writing data to the transmit data
register.
The clock phase control bit (CPHA) and a clock polarity control bit (CPOL) in the SPI Control Register 1
(SPICR1) select one of four possible clock formats to be used by the SPI system. The CPOL bit simply
selects a non-inverted or inverted clock. The CPHA bit is used to accommodate two fundamentally
different protocols by sampling data on odd numbered SCK edges or on even numbered SCK edges (see
Section 14.4.3, “Transmission Formats”).
The SPI can be configured to operate as a master or as a slave. When the MSTR bit in SPI Control
Register1 is set, master mode is selected, when the MSTR bit is clear, slave mode is selected.
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Chapter 14 Serial Peripheral Interface (SPIV3) Block Description
14.4.1 Master Mode
The SPI operates in master mode when the MSTR bit is set. Only a master SPI module can initiate
transmissions. A transmission begins by writing to the master SPI Data Register. If the shift register is
empty, the byte immediately transfers to the shift register. The byte begins shifting out on the MOSI pin
under the control of the serial clock.
•
S-clock
The SPR2, SPR1, and SPR0 baud rate selection bits in conjunction with the SPPR2, SPPR1, and
SPPR0 baud rate preselection bits in the SPI Baud Rate register control the baud rate generator and
determine the speed of the transmission. The SCK pin is the SPI clock output. Through the SCK
pin, the baud rate generator of the master controls the shift register of the slave peripheral.
•
•
MOSI and MISO Pins
In master mode, the function of the serial data output pin (MOSI) and the serial data input pin
(MISO) is determined by the SPC0 and BIDIROE control bits.
SS Pin
If MODFEN and SSOE bit are set, the SS pin is configured as slave select output. The SS output
becomes low during each transmission and is high when the SPI is in idle state.
If MODFEN is set and SSOE is cleared, the SS pin is configured as input for detecting mode fault
error. If the SS input becomes low this indicates a mode fault error where another master tries to
drive the MOSI and SCK lines. In this case, the SPI immediately switches to slave mode, by
clearing the MSTR bit and also disables the slave output buffer MISO (or SISO in bidirectional
mode). So the result is that all outputs are disabled and SCK, MOSI and MISO are inputs. If a
transmission is in progress when the mode fault occurs, the transmission is aborted and the SPI is
forced into idle state.
This mode fault error also sets the mode fault (MODF) flag in the SPI Status Register (SPISR). If the SPI
interrupt enable bit (SPIE) is set when the MODF flag gets set, then an SPI interrupt sequence is also
requested.
When a write to the SPI Data Register in the master occurs, there is a half SCK-cycle delay. After the delay,
SCK is started within the master. The rest of the transfer operation differs slightly, depending on the clock
format specified by the SPI clock phase bit, CPHA, in SPI Control Register 1 (see Section 14.4.3,
“Transmission Formats”).
NOTE
A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0,
BIDIROE with SPC0 set, SPPR2–SPPR0 and SPR2–SPR0 in master mode
will abort a transmission in progress and force the SPI into idle state. The
remote slave cannot detect this, therefore the master has to ensure that the
remote slave is set back to idle state.
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14.4.2 Slave Mode
The SPI operates in slave mode when the MSTR bit in SPI Control Register1 is clear.
•
SCK Clock
In slave mode, SCK is the SPI clock input from the master.
MISO and MOSI Pins
•
In slave mode, the function of the serial data output pin (MISO) and serial data input pin (MOSI)
is determined by the SPC0 bit and BIDIROE bit in SPI Control Register 2.
•
SS Pin
The SS pin is the slave select input. Before a data transmission occurs, the SS pin of the slave SPI
must be low. SS must remain low until the transmission is complete. If SS goes high, the SPI is
forced into idle state.
The SS input also controls the serial data output pin, if SS is high (not selected), the serial data
output pin is high impedance, and, if SS is low the first bit in the SPI Data Register is driven out of
the serial data output pin. Also, if the slave is not selected (SS is high), then the SCK input is
ignored and no internal shifting of the SPI shift register takes place.
Although the SPI is capable of duplex operation, some SPI peripherals are capable of only receiving SPI
data in a slave mode. For these simpler devices, there is no serial data out pin.
NOTE
When peripherals with duplex capability are used, take care not to
simultaneously enable two receivers whose serial outputs drive the same
system slave’s serial data output line.
As long as no more than one slave device drives the system slave’s serial data output line, it is possible for
several slaves to receive the same transmission from a master, although the master would not receive return
information from all of the receiving slaves.
If the CPHA bit in SPI Control Register 1 is clear, odd numbered edges on the SCK input cause the data
at the serial data input pin to be latched. Even numbered edges cause the value previously latched from the
serial data input pin to shift into the LSB or MSB of the SPI shift register, depending on the LSBFE bit.
If the CPHA bit is set, even numbered edges on the SCK input cause the data at the serial data input pin to
be latched. Odd numbered edges cause the value previously latched from the serial data input pin to shift
into the LSB or MSB of the SPI shift register, depending on the LSBFE bit.
When CPHA is set, the first edge is used to get the first data bit onto the serial data output pin. When CPHA
is clear and the SS input is low (slave selected), the first bit of the SPI data is driven out of the serial data
output pin. After the eighth shift, the transfer is considered complete and the received data is transferred
into the SPI Data Register. To indicate transfer is complete, the SPIF flag in the SPI Status Register is set.
NOTE
A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0 and
BIDIROE with SPC0 set in slave mode will corrupt a transmission in
progress and has to be avoided.
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14.4.3 Transmission Formats
During an SPI transmission, data is transmitted (shifted out serially) and received (shifted in serially)
simultaneously. The serial clock (SCK) synchronizes shifting and sampling of the information on the two
serial data lines. A slave select line allows selection of an individual slave SPI device, slave devices that
are not selected do not interfere with SPI bus activities. Optionally, on a master SPI device, the slave select
line can be used to indicate multiple-master bus contention.
MASTER SPI
SLAVE SPI
MISO
MOSI
MISO
MOSI
SHIFT REGISTER
SHIFT REGISTER
SCK
SS
SCK
SS
BAUD RATE
GENERATOR
V
DD
Figure 14-8. Master/Slave Transfer Block Diagram
14.4.3.1 Clock Phase and Polarity Controls
Using two bits in the SPI Control Register1, software selects one of four combinations of serial clock phase
and polarity.
The CPOL clock polarity control bit specifies an active high or low clock and has no significant effect on
the transmission format.
The CPHA clock phase control bit selects one of two fundamentally different transmission formats.
Clock phase and polarity should be identical for the master SPI device and the communicating slave
device. In some cases, the phase and polarity are changed between transmissions to allow a master device
to communicate with peripheral slaves having different requirements.
14.4.3.2 CPHA = 0 Transfer Format
The first edge on the SCK line is used to clock the first data bit of the slave into the master and the first
data bit of the master into the slave. In some peripherals, the first bit of the slave’s data is available at the
slave’s data out pin as soon as the slave is selected. In this format, the first SCK edge is issued a half cycle
after SS has become low.
A half SCK cycle later, the second edge appears on the SCK line. When this second edge occurs, the value
previously latched from the serial data input pin is shifted into the LSB or MSB of the shift register,
depending on LSBFE bit.
After this second edge, the next bit of the SPI master data is transmitted out of the serial data output pin of
the master to the serial input pin on the slave. This process continues for a total of 16 edges on the SCK
line, with data being latched on odd numbered edges and shifted on even numbered edges.
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Data reception is double buffered. Data is shifted serially into the SPI shift register during the transfer and
is transferred to the parallel SPI Data Register after the last bit is shifted in.
After the 16th (last) SCK edge:
•
Data that was previously in the master SPI Data Register should now be in the slave data register
and the data that was in the slave data register should be in the master.
•
The SPIF flag in the SPI Status Register is set indicating that the transfer is complete.
Figure 14-9 is a timing diagram of an SPI transfer where CPHA = 0. SCK waveforms are shown for
CPOL = 0 and CPOL = 1. The diagram may be interpreted as a master or slave timing diagram because
the SCK, MISO, and MOSI pins are connected directly between the master and the slave. The MISO signal
is the output from the slave and the MOSI signal is the output from the master. The SS pin of the master
must be either high or reconfigured as a general-purpose output not affecting the SPI.
End of Idle State
SCK Edge Nr.
Begin of Idle State
Begin
3
End
Transfer
1
2
4
5
6
7
8
9
10 11 12 13 14 15 16
SCK (CPOL = 0)
SCK (CPOL = 1)
SAMPLE I
MOSI/MISO
CHANGE O
MOSI pin
CHANGE O
MISO pin
SEL SS (O)
Master only
SEL SS (I)
tL
tT
tI
tL
MSB first (LSBFE = 0): MSB
LSB first (LSBFE = 1): LSB
Bit 6
Bit 1
Bit 5
Bit 2
Bit 4
Bit 3
Bit 3
Bit 4
Bit 2
Bit 5
Bit 1
Bit 6
LSB Minimum 1/2 SCK
for t , t , t
L
MSB
T
l
t = Minimum leading time before the first SCK edge
L
t = Minimum trailing time after the last SCK edge
T
t = Minimum idling time between transfers (minimum SS high time)
I
t , t , and t are guaranteed for the master mode and required for the slave mode.
L
T
I
Figure 14-9. SPI Clock Format 0 (CPHA = 0)
In slave mode, if the SS line is not deasserted between the successive transmissions then the content of the
SPI Data Register is not transmitted, instead the last received byte is transmitted. If the SS line is deasserted
for at least minimum idle time (half SCK cycle) between successive transmissions then the content of the
SPI Data Register is transmitted.
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In master mode, with slave select output enabled the SS line is always deasserted and reasserted between
successive transfers for at least minimum idle time.
14.4.3.3 CPHA = 1 Transfer Format
Some peripherals require the first SCK edge before the first data bit becomes available at the data out pin,
the second edge clocks data into the system. In this format, the first SCK edge is issued by setting the
CPHA bit at the beginning of the 8-cycle transfer operation.
The first edge of SCK occurs immediately after the half SCK clock cycle synchronization delay. This first
edge commands the slave to transfer its first data bit to the serial data input pin of the master.
A half SCK cycle later, the second edge appears on the SCK pin. This is the latching edge for both the
master and slave.
When the third edge occurs, the value previously latched from the serial data input pin is shifted into the
LSB or MSB of the SPI shift register, depending on LSBFE bit. After this edge, the next bit of the master
data is coupled out of the serial data output pin of the master to the serial input pin on the slave.
This process continues for a total of 16 edges on the SCK line with data being latched on even numbered
edges and shifting taking place on odd numbered edges.
Data reception is double buffered, data is serially shifted into the SPI shift register during the transfer and
is transferred to the parallel SPI Data Register after the last bit is shifted in.
After the 16th SCK edge:
•
Data that was previously in the SPI Data Register of the master is now in the data register of the
slave, and data that was in the data register of the slave is in the master.
•
The SPIF flag bit in SPISR is set indicating that the transfer is complete.
Figure 14-10 shows two clocking variations for CPHA = 1. The diagram may be interpreted as a master or
slave timing diagram because the SCK, MISO, and MOSI pins are connected directly between the master
and the slave. The MISO signal is the output from the slave, and the MOSI signal is the output from the
master. The SS line is the slave select input to the slave. The SS pin of the master must be either high or
reconfigured as a general-purpose output not affecting the SPI.
The SS line can remain active low between successive transfers (can be tied low at all times). This format
is sometimes preferred in systems having a single fixed master and a single slave that drive the MISO data
line.
•
Back-to-back transfers in master mode
In master mode, if a transmission has completed and a new data byte is available in the SPI Data Register,
this byte is send out immediately without a trailing and minimum idle time.
The SPI interrupt request flag (SPIF) is common to both the master and slave modes. SPIF gets set one
half SCK cycle after the last SCK edge.
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End of Idle State
SCK Edge Nr.
Begin
4
End
Begin of Idle State
Transfer
1
2
3
5
6
7
8
9
10 11 12 13 14 15 16
SCK (CPOL = 0)
SCK (CPOL = 1)
SAMPLE I
MOSI/MISO
CHANGE O
MOSI pin
CHANGE O
MISO pin
SEL SS (O)
Master only
SEL SS (I)
tL
tT
tI
tL
MSB first (LSBFE = 0): MSB
LSB first (LSBFE = 1): LSB
Bit 6
Bit 1
Bit 5
Bit 2
Bit 4
Bit 3
Bit 3
Bit 4
Bit 2
Bit 5
Bit 1
Bit 6
LSB Minimum 1/2 SCK
for t , t , t
L
MSB
T
l
t = Minimum leading time before the first SCK edge, not required for back to back transfers
L
t = Minimum trailing time after the last SCK edge
T
t = Minimum idling time between transfers (minimum SS high time), not required for back to back transfers
I
Figure 14-10. SPI Clock Format 1 (CPHA = 1)
14.4.4 SPI Baud Rate Generation
Baud rate generation consists of a series of divider stages. Six bits in the SPI Baud Rate register (SPPR2,
SPPR1, SPPR0, SPR2, SPR1, and SPR0) determine the divisor to the SPI module clock which results in
the SPI baud rate.
The SPI clock rate is determined by the product of the value in the baud rate preselection bits
(SPPR2–SPPR0) and the value in the baud rate selection bits (SPR2–SPR0). The module clock divisor
equation is shown in Figure 14-11
When all bits are clear (the default condition), the SPI module clock is divided by 2. When the selection
bits (SPR2–SPR0) are 001 and the preselection bits (SPPR2–SPPR0) are 000, the module clock divisor
becomes 4. When the selection bits are 010, the module clock divisor becomes 8 etc.
When the preselection bits are 001, the divisor determined by the selection bits is multiplied by 2. When
the preselection bits are 010, the divisor is multiplied by 3, etc. See Table 14-7 for baud rate calculations
for all bit conditions, based on a 25-MHz bus clock. The two sets of selects allows the clock to be divided
by a non-power of two to achieve other baud rates such as divide by 6, divide by 10, etc.
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The baud rate generator is activated only when the SPI is in the master mode and a serial transfer is taking
place. In the other cases, the divider is disabled to decrease I current.
DD
(SPR + 1)
BaudRateDivisor = (SPPR + 1) • 2
Figure 14-11. Baud Rate Divisor Equation
14.4.5 Special Features
14.4.5.1 SS Output
The SS output feature automatically drives the SS pin low during transmission to select external devices
and drives it high during idle to deselect external devices. When SS output is selected, the SS output pin
is connected to the SS input pin of the external device.
The SS output is available only in master mode during normal SPI operation by asserting SSOE and
MODFEN bit as shown in Table 14-3.
The mode fault feature is disabled while SS output is enabled.
NOTE
Care must be taken when using the SS output feature in a multimaster
system because the mode fault feature is not available for detecting system
errors between masters.
14.4.5.2 Bidirectional Mode (MOSI or MISO)
The bidirectional mode is selected when the SPC0 bit is set in SPI Control Register 2 (see Table 14-9). In
this mode, the SPI uses only one serial data pin for the interface with external device(s). The MSTR bit
decides which pin to use. The MOSI pin becomes the serial data I/O (MOMI) pin for the master mode, and
the MISO pin becomes serial data I/O (SISO) pin for the slave mode. The MISO pin in master mode and
MOSI pin in slave mode are not used by the SPI.
Table 14-9. Normal Mode and Bidirectional Mode
When SPE = 1
Master Mode MSTR = 1
Slave Mode MSTR = 0
Serial Out
Serial In
MOSI
MISO
MOSI
MISO
MOMI
Normal Mode
SPC0 = 0
SPI
SPI
Serial Out
Serial In
Serial In
SPI
Serial Out
BIDIROE
Bidirectional Mode
SPC0 = 1
SPI
BIDIROE
Serial In
Serial Out
SISO
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The direction of each serial I/O pin depends on the BIDIROE bit. If the pin is configured as an output,
serial data from the shift register is driven out on the pin. The same pin is also the serial input to the shift
register.
The SCK is output for the master mode and input for the slave mode.
The SS is the input or output for the master mode, and it is always the input for the slave mode.
The bidirectional mode does not affect SCK and SS functions.
NOTE
In bidirectional master mode, with mode fault enabled, both data pins MISO
and MOSI can be occupied by the SPI, though MOSI is normally used for
transmissions in bidirectional mode and MISO is not used by the SPI. If a
mode fault occurs, the SPI is automatically switched to slave mode, in this
case MISO becomes occupied by the SPI and MOSI is not used. This has to
be considered, if the MISO pin is used for other purpose.
14.4.6 Error Conditions
The SPI has one error condition:
•
Mode fault error
14.4.6.1 Mode Fault Error
If the SS input becomes low while the SPI is configured as a master, it indicates a system error where more
than one master may be trying to drive the MOSI and SCK lines simultaneously. This condition is not
permitted in normal operation, the MODF bit in the SPI Status Register is set automatically provided the
MODFEN bit is set.
In the special case where the SPI is in master mode and MODFEN bit is cleared, the SS pin is not used by
the SPI. In this special case, the mode fault error function is inhibited and MODF remains cleared. In case
the SPI system is configured as a slave, the SS pin is a dedicated input pin. Mode fault error doesn’t occur
in slave mode.
If a mode fault error occurs the SPI is switched to slave mode, with the exception that the slave output
buffer is disabled. So SCK, MISO and MOSI pins are forced to be high impedance inputs to avoid any
possibility of conflict with another output driver. A transmission in progress is aborted and the SPI is
forced into idle state.
If the mode fault error occurs in the bidirectional mode for a SPI system configured in master mode, output
enable of the MOMI (MOSI in bidirectional mode) is cleared if it was set. No mode fault error occurs in
the bidirectional mode for SPI system configured in slave mode.
The mode fault flag is cleared automatically by a read of the SPI Status Register (with MODF set) followed
by a write to SPI Control Register 1. If the mode fault flag is cleared, the SPI becomes a normal master or
slave again.
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14.4.7 Operation in Run Mode
In run mode with the SPI system enable (SPE) bit in the SPI control register clear, the SPI system is in a
low-power, disabled state. SPI registers remain accessible, but clocks to the core of this module are
disabled.
14.4.8 Operation in Wait Mode
SPI operation in wait mode depends upon the state of the SPISWAI bit in SPI Control Register 2.
•
•
If SPISWAI is clear, the SPI operates normally when the CPU is in wait mode
If SPISWAI is set, SPI clock generation ceases and the SPI module enters a power conservation
state when the CPU is in wait mode.
— If SPISWAI is set and the SPI is configured for master, any transmission and reception in
progress stops at wait mode entry. The transmission and reception resumes when the SPI exits
wait mode.
— If SPISWAI is set and the SPI is configured as a slave, any transmission and reception in
progress continues if the SCK continues to be driven from the master. This keeps the slave
synchronized to the master and the SCK.
If the master transmits several bytes while the slave is in wait mode, the slave will continue to
send out bytes consistent with the operation mode at the start of wait mode (i.e. If the slave is
currently sending its SPIDR to the master, it will continue to send the same byte. Else if the
slave is currently sending the last received byte from the master, it will continue to send each
previous master byte).
NOTE
Care must be taken when expecting data from a master while the slave is in
wait or stop mode. Even though the shift register will continue to operate,
the rest of the SPI is shut down (i.e. a SPIF interrupt will not be generated
until exiting stop or wait mode). Also, the byte from the shift register will
not be copied into the SPIDR register until after the slave SPI has exited wait
or stop mode. A SPIF flag and SPIDR copy is only generated if wait mode
is entered or exited during a tranmission. If the slave enters wait mode in idle
mode and exits wait mode in idle mode, neither a SPIF nor a SPIDR copy
will occur.
14.4.9 Operation in Stop Mode
Stop mode is dependent on the system. The SPI enters stop mode when the module clock is disabled (held
high or low). If the SPI is in master mode and exchanging data when the CPU enters stop mode, the
transmission is frozen until the CPU exits stop mode. After stop, data to and from the external SPI is
exchanged correctly. In slave mode, the SPI will stay synchronized with the master.
The stop mode is not dependent on the SPISWAI bit.
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14.5 Reset
The reset values of registers and signals are described in the Memory Map and Registers section (see
Section 14.3, “Memory Map and Register Definition”) which details the registers and their bit-fields.
•
If a data transmission occurs in slave mode after reset without a write to SPIDR, it will transmit
garbage, or the byte last received from the master before the reset.
•
Reading from the SPIDR after reset will always read a byte of zeros.
14.6 Interrupts
The SPIV3 only originates interrupt requests when SPI is enabled (SPE bit in SPICR1 set). The following
is a description of how the SPIV3 makes a request and how the MCU should acknowledge that request.
The interrupt vector offset and interrupt priority are chip dependent.
The interrupt flags MODF, SPIF and SPTEF are logically ORed to generate an interrupt request.
14.6.1 MODF
MODF occurs when the master detects an error on the SS pin. The master SPI must be configured for the
MODF feature (see Table 14-3). After MODF is set, the current transfer is aborted and the following bit is
changed:
•
MSTR = 0, The master bit in SPICR1 resets.
The MODF interrupt is reflected in the status register MODF flag. Clearing the flag will also clear the
interrupt. This interrupt will stay active while the MODF flag is set. MODF has an automatic clearing
process which is described in Section 14.3.2.4, “SPI Status Register (SPISR).”
14.6.2 SPIF
SPIF occurs when new data has been received and copied to the SPI Data Register. After SPIF is set, it
does not clear until it is serviced. SPIF has an automatic clearing process which is described in
Section 14.3.2.4, “SPI Status Register (SPISR).” In the event that the SPIF is not serviced before the end
of the next transfer (i.e. SPIF remains active throughout another transfer), the latter transfers will be
ignored and no new data will be copied into the SPIDR.
14.6.3 SPTEF
SPTEF occurs when the SPI Data Register is ready to accept new data. After SPTEF is set, it does not clear
until it is serviced. SPTEF has an automatic clearing process which is described in Section 14.3.2.4, “SPI
Status Register (SPISR).”
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Chapter 15
Timer Module (TIM16B6C)
Table 15-1. TIM_16B4C Revision History
Version
Number
Effective
Date
Description of Changes
01.01
01.02
Feb 06, 2006 Corrected typo for TSCR1 (instead was named TSCR2)
May 21, 2010 -in 15.3.2.8/15-440,add Table 15-10
-in 15.3.2.11/15-443,TCRE bit description part,add Note
-in 15.4.3/15-451,add Figure 15-29
15.1 Introduction
The basic timer consists of a 16-bit, software-programmable counter driven by a seven-stage
programmable prescaler.
This timer can be used for many purposes, including input waveform measurements while simultaneously
generating an output waveform. Pulse widths can vary from microseconds to many seconds.
This timer contains 6 complete input capture/output compare channels and one pulse accumulator. The
input capture function is used to detect a selected transition edge and record the time. The output compare
function is used for generating output signals or for timer software delays. The 16-bit pulse accumulator
is used to operate as a simple event counter or a gated time accumulator. The pulse accumulator shares
timer channel 7 when in event mode.
A full access for the counter registers or the input capture/output compare registers should take place in
one clock cycle. Accessing high byte and low byte separately for all of these registers may not yield the
same result as accessing them in one word.
15.1.1 Features
The TIM16B6C includes these distinctive features:
•
•
•
•
Six input capture/output compare channels.
Clock prescaling.
16-bit counter.
16-bit pulse accumulator.
15.1.2 Modes of Operation
Stop:
Timer is off because clocks are stopped.
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Freeze:
Wait:
Timer counter keep on running, unless TSFRZ in TSCR (0x0006) is set to 1.
Counters keep on running, unless TSWAI in TSCR (0x0006) is set to 1.
Normal: Timer counter keep on running, unless TEN in TSCR (0x0006) is cleared to 0.
15.1.3 Block Diagrams
Prescaler
Bus clock
16-bit counter
Channel 2
Input capture
Output compare
Timer overflow
interrupt
IOC2
IOC3
Timer channel 2
interrupt
Channel 3
Input capture
Output compare
Registers
Channel 4
Input capture
Output compare
IOC4
IOC5
Channel 5
Input capture
Output compare
Timer channel 7
interrupt
Channel 6
Input capture
Output compare
IOC6
IOC7
PA overflow
interrupt
Channel 7
16-bit
Input capture
Output compare
Pulse accumulator
PA input
interrupt
Figure 15-1. TIM16B6C Block Diagram
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TIMCLK (Timer clock)
CLK1
CLK0
4:1 MUX
Clock select
(PAMOD)
Prescaled clock
(PCLK)
Edge detector
PT7
Interrupt
PACNT
MUX
Divide by 64
M clock
Figure 15-2. 16-Bit Pulse Accumulator Block Diagram
16-bit Main Timer
PTn
Edge detector
Set CnF Interrupt
TCn Input Capture Reg.
Figure 15-3. Interrupt Flag Setting
Pulse
Accumulator
Pad
Channel 7 Output Compare
OM7
OL7
OC7M7
Figure 15-4. Channel 7 Output Compare/Pulse Accumulator Logic
NOTE
For more information see the respective functional descriptions in
Section 15.4, “Functional Description,” of this document.
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15.2 External Signal Description
The TIM16B6C module has a total of eight external pins.
15.2.1 IOC7 — Input Capture and Output Compare Channel 7 Pin
This pin serves as input capture or output compare for channel 7. This can also be configured as pulse
accumulator input.
15.2.2 IOC6 — Input Capture and Output Compare Channel 6 Pin
This pin serves as input capture or output compare for channel 6.
15.2.3 IOC5 — Input Capture and Output Compare Channel 5 Pin
This pin serves as input capture or output compare for channel 5.
15.2.4 IOC4 — Input Capture and Output Compare Channel 4 Pin
This pin serves as input capture or output compare for channel 4. Pin
15.2.5 IOC3 — Input Capture and Output Compare Channel 3 Pin
This pin serves as input capture or output compare for channel 3.
15.2.6 IOC2 — Input Capture and Output Compare Channel 2 Pin
This pin serves as input capture or output compare for channel 2.
NOTE
For the description of interrupts see Section 15.6, “Interrupts”.
15.3 Memory Map and Registers
This section provides a detailed description of all memory and registers.
15.3.1 Module Memory Map
The following paragraphs describe the content of the registers in the TIM16B6C module.
The memory map for the TIM16B6C module is given below in Figure 15-5. The address listed for each
register is the address offset. The total address for each register is the sum of the base address for the
TIM16B6C module and the address offset for each register.
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15.3.2 Register Descriptions
This section consists of register descriptions in address order. Each description includes a standard register
diagram with an associated figure number. Details of register bit and field function follow the register
diagrams, in bit order.
Address Name
Bit 7
6
5
4
3
2
1
Bit 0
R
W
R
0x0000
TIOS
IOS7
IOS6
IOS5
IOS4
IOS3
IOS2
0
0
0
0
0
0
0
0
0x0001 CFORC
W
R
FOC7
FOC6
FOC5
FOC4
FOC3
FOC2
0x0002
0x0003
OC7M
OC7D
OC7M7
OC7D7
TCNT15
TCNT7
TEN
OC7M6
OC7D6
TCNT14
TCNT6
TSWAI
TOV6
OC7M5
OC7D5
TCNT13
TCNT5
TSFRZ
TOV5
OC7M4
OC7D4
TCNT12
TCNT4
TFFCA
TOV4
OC7M3
OC7D3
TCNT11
OC7M2
OC7D2
TCNT10
W
R
W
R
0x0004 TCNTH
TCNT9
TCNT8
W
R
0x0005
0x0006
0x0007
0x0008
0x0009
0x000A
0x000B
0x000C
TCNTL
TSCR1
TTOV
TCNT3
0
TCNT2
0
TCNT1
0
TCNT0
0
W
R
W
R
TOV7
OM7
TOV3
OM5
TOV2
OL5
W
R
TCTL1
TCTL2
TCTL3
TCTL4
TIE
OL7
OM6
OL6
OM4
OL4
W
R
OM3
OL3
OM2
OL2
W
R
EDG7B
EDG3B
C7I
EDG7A
EDG3A
EDG6B
EDG2B
EDG6A
EDG2A
EDG5B
EDG5A
EDG4B
EDG4A
W
R
W
R
C6I
0
C5I
0
C4I
0
C3I
C2I
C1I
C0I
W
R
0x000D TSCR2
TOI
TCRE
PR2
PR1
PR0
W
R
0x000E
0x000F
TFLG1
TFLG2
C7F
C6F
0
C5F
0
C4F
0
C3F
0
C2F
0
W
R
0
0
TOF
W
= Unimplemented or Reserved
Figure 15-5. TIM16B6C Register Summary
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Chapter 15 Timer Module (TIM16B6C)
Address Name
Bit 7
6
5
4
3
2
1
Bit 0
R
W
R
0x0010–
Reserved
0x0013
Bit 15
Bit 14
Bit 6
Bit 13
Bit 5
Bit 12
Bit 4
Bit 11
Bit 3
Bit 10
Bit 2
Bit 9
Bit 1
Bit 8
Bit 0
W
R
0x0014– TCxH–
0x001F
TCxL
Bit 7
0
W
R
0x0020
0x0021
PACTL
PAFLG
PAEN
0
PAMOD
0
PEDGE
0
CLK1
0
CLK0
0
PAOVI
PAOVF
PACNT9
PACNT1
PAI
W
R
0
PAIF
W
R
0x0022 PACNTH
0x0023 PACNTL
PACNT15 PACNT14 PACNT13 PACNT12 PACNT11 PACNT10
PACNT8
PACNT0
W
R
PACNT7
PACNT6
PACNT5
PACNT4
PACNT3
PACNT2
W
R
0x0024–
Reserved
0x002F
W
= Unimplemented or Reserved
Figure 15-5. TIM16B6C Register Summary (continued)
15.3.2.1 Timer Input Capture/Output Compare Select (TIOS)
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
IOS7
IOS6
IOS5
IOS4
IOS3
IOS2
Reset
0
0
0
0
0
0
0
0
Figure 15-6. Timer Input Capture/Output Compare Select (TIOS)
Read: Anytime
Write: Anytime
Table 15-2. TIOS Field Descriptions
Description
Field
7:2
IOS[7:2]
Input Capture or Output Compare Channel Configuration
0 The corresponding channel acts as an input capture.
1 The corresponding channel acts as an output compare.
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Chapter 15 Timer Module (TIM16B6C)
15.3.2.2 Timer Compare Force Register (CFORC)
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
FOC7
0
FOC6
0
FOC5
0
FOC4
0
FOC3
0
FOC2
0
Reset
0
0
Figure 15-7. Timer Compare Force Register (CFORC)
Read: Anytime but will always return 0x0000 (1 state is transient)
Write: Anytime
Table 15-3. CFORC Field Descriptions
Field
Description
7:2
FOC[7:2]
Force Output Compare Action for Channel 7:2— A write to this register with the corresponding data bit(s) set
causes the action which is programmed for output compare “x” to occur immediately. The action taken is the
same as if a successful comparison had just taken place with the TCx register except the interrupt flag does not
get set.
Note: A successful channel 7 output compare overrides any channel 6:2 compares. If forced output compare on
any channel occurs at the same time as the successful output compare then forced output compare action
will take precedence and interrupt flag won’t get set.
15.3.2.3 Output Compare 7 Mask Register (OC7M)
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
OC7M7
OC7M6
OC7M5
OC7M4
OC7M3
OC7M2
Reset
0
0
0
0
0
0
0
0
Figure 15-8. Output Compare 7 Mask Register (OC7M)
Read: Anytime
Write: Anytime
Table 15-4. OC7M Field Descriptions
Description
Field
7:2
Output Compare 7 Mask — Setting the OC7Mx (x ranges from 2 to 6) will set the corresponding port to be an
OC7M[7:2] output port when the corresponding TIOSx (x ranges from 2 to 6) bit is set to be an output compare.
Note: A successful channel 7 output compare overrides any channel 6:2 compares. For each OC7M bit that is
set, the output compare action reflects the corresponding OC7D bit.
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Chapter 15 Timer Module (TIM16B6C)
15.3.2.4 Output Compare 7 Data Register (OC7D)
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
OC7D7
OC7D6
OC7D5
OC7D4
OC7D3
OC7D2
Reset
0
0
0
0
0
0
0
0
Figure 15-9. Output Compare 7 Data Register (OC7D)
Read: Anytime
Write: Anytime
Table 15-5. OC7D Field Descriptions
Description
Field
7:2
Output Compare 7 Data — A channel 7 output compare can cause bits in the output compare 7 data register
OC7D[7:2] to transfer to the timer port data register depending on the output compare 7 mask register.
15.3.2.5 Timer Count Register (TCNT)
Module Base + 0x0004
15
14
13
12
11
10
9
9
R
W
TCNT15
TCNT14
TCNT13
TCNT12
TCNT11
TCNT10
TCNT9
TCNT8
Reset
0
0
0
0
0
0
0
0
Figure 15-10. Timer Count Register High (TCNTH)
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
TCNT7
TCNT6
TCNT5
TCNT4
TCNT3
TCNT2
TCNT1
TCNT0
Reset
0
0
0
0
0
0
0
0
Figure 15-11. Timer Count Register Low (TCNTL)
The 16-bit main timer is an up counter.
A full access for the counter register should take place in one clock cycle. A separate read/write for high
byte and low byte will give a different result than accessing them as a word.
Read: Anytime
Write: Has no meaning or effect in the normal mode; only writable in special modes (test_mode = 1).
The period of the first count after a write to the TCNT registers may be a different size because the write
is not synchronized with the prescaler clock.
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Chapter 15 Timer Module (TIM16B6C)
15.3.2.6 Timer System Control Register 1 (TSCR1)
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
0
0
0
TEN
TSWAI
TSFRZ
TFFCA
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 15-12. Timer System Control Register 1 (TSCR1)
Read: Anytime
Write: Anytime
Table 15-6. TSCR1 Field Descriptions
Description
Field
7
Timer Enable
TEN
0 Disables the main timer, including the counter. Can be used for reducing power consumption.
1 Allows the timer to function normally.
If for any reason the timer is not active, there is no ÷64 clock for the pulse accumulator because the ÷64 is
generated by the timer prescaler.
6
Timer Module Stops While in Wait
TSWAI
0 Allows the timer module to continue running during wait.
1 Disables the timer module when the MCU is in the wait mode. Timer interrupts cannot be used to get the MCU
out of wait.
TSWAI also affects pulse accumulator.
5
Timer Stops While in Freeze Mode
TSFRZ
0 Allows the timer counter to continue running while in freeze mode.
1 Disables the timer counter whenever the MCU is in freeze mode. This is useful for emulation.
TSFRZ does not stop the pulse accumulator.
4
Timer Fast Flag Clear All
TFFCA
0 Allows the timer flag clearing to function normally.
1 For TFLG1(0x000E), a read from an input capture or a write to the output compare channel (0x0010–0x001F)
causes the corresponding channel flag, CnF, to be cleared. For TFLG2 (0x000F), any access to the TCNT
register (0x0004, 0x0005) clears the TOF flag. Any access to the PACNT registers (0x0022, 0x0023) clears
the PAOVF and PAIF flags in the PAFLG register (0x0021). This has the advantage of eliminating software
overhead in a separate clear sequence. Extra care is required to avoid accidental flag clearing due to
unintended accesses.
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Chapter 15 Timer Module (TIM16B6C)
15.3.2.7 Timer Toggle On Overflow Register 1 (TTOV)
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
TOV7
TOV6
TOV5
TOV4
TOV3
TOV2
Reset
0
0
0
0
0
0
0
0
Figure 15-13. Timer Toggle On Overflow Register 1 (TTOV)
Read: Anytime
Write: Anytime
Table 15-7. TTOV Field Descriptions
Description
Field
7:2
TOV[7:2]
Toggle On Overflow Bits — TOVx toggles output compare pin on overflow. This feature only takes effect when
in output compare mode. When set, it takes precedence over forced output compare but not channel 7 override
events.
0 Toggle output compare pin on overflow feature disabled.
1 Toggle output compare pin on overflow feature enabled.
15.3.2.8 Timer Control Register 1/Timer Control Register 2 (TCTL1/TCTL2)
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
OM7
OL7
OM6
OL6
OM5
OL5
OM4
OL4
Reset
0
0
0
0
0
0
0
0
Figure 15-14. Timer Control Register 1 (TCTL1)
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
OM3
W
OL3
OM2
OL2
Reset
0
0
0
0
0
0
0
0
Figure 15-15. Timer Control Register 2 (TCTL2)
Read: Anytime
Write: Anytime
440
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Chapter 15 Timer Module (TIM16B6C)
Table 15-8. TCTL1/TCTL2 Field Descriptions
Description
Field
7:2
OMx
Output Mode — These control bits are encoded to specify the output action to be taken as a result of a
successful OCx compare. When either OMx or OLx is 1, the pin associated with OCx becomes an output tied to
OCx.
Note: To enable output action by OMx bits on timer port, the corresponding bit in OC7M should be cleared.
7:2
OLx
Output Level — These control bits are encoded to specify the output action to be taken as a result of a
successful OCx compare. When either OMx or OLx is 1, the pin associated with OCx becomes an output tied to
OCx.
Note: To enable output action by OLx bits on timer port, the corresponding bit in OC7M should be cleared.
Table 15-9. Compare Result Output Action
OMx
OLx
Action
0
0
1
1
0
1
0
1
Timer disconnected from output pin logic
Toggle OCx output line
Clear OCx output line to zero
Set OCx output line to one
To operate the 16-bit pulse accumulator independently of input capture or output compare 7 and 0
respectively the user must set the corresponding bits IOSx = 1, OMx = 0 and OLx = 0. OC7M7 in the
OC7M register must also be cleared. To enable output action using the OM7 and OL7 bits on the timer
port,the corresponding bit OC7M7 in the OC7M register must also be cleared. The settings for these bits
can be seen in Table 15-10
Table 15-10. The OC7 and OCx event priority
OC7M7=0
OC7M7=1
OC7Mx=1
TC7=TCx TC7>TCx
OC7Mx=0
TC7=TCx TC7>TCx
OC7Mx=1
TC7=TCx TC7>TCx
OC7Mx=0
TC7=TCx TC7>TCx
IOCx=OC7Dx IOCx=OC7Dx
IOC7=OM7/O +OMx/OLx
IOCx=OMx/OLx
IOC7=OM7/OL7
IOCx=OC7Dx IOCx=OC7Dx
IOC7=OC7D7 +OMx/OLx
IOC7=OC7D7
IOCx=OMx/OLx
IOC7=OC7D7
L7
IOC7=OM7/O
L7
Note: in Table 15-10, the IOS7 and IOSx should be set to 1
IOSx is the register TIOS bit x,
OC7Mx is the register OC7M bit x,
TCx is timer Input Capture/Output Compare register,
IOCx is channel x,
OMx/OLx is the register TCTL1/TCTL2,
OC7Dx is the register OC7D bit x.
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Chapter 15 Timer Module (TIM16B6C)
IOCx = OC7Dx+ OMx/OLx, means that both OC7 event and OCx event will change channel x value.
15.3.2.9 Timer Control Register 3/Timer Control Register 4 (TCTL3 and TCTL4)
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
EDG7B
EDG7A
EDG6B
EDG6A
EDG5B
EDG5A
EDG4B
EDG4A
Reset
0
0
0
0
0
0
0
0
Figure 15-16. Timer Control Register 3 (TCTL3)
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
EDG3B
W
EDG3A
EDG2B
EDG2A
Reset
0
0
0
0
0
0
0
0
Figure 15-17. Timer Control Register 4 (TCTL4)
Read: Anytime
Write: Anytime.
Table 15-11. TCTL3/TCTL4 Field Descriptions
Description
Field
7:0
Input Capture Edge Control — These six pairs of control bits configure the input capture edge detector circuits.
EDGnB
EDGnA
Table 15-12. Edge Detector Circuit Configuration
EDGnB
EDGnA
Configuration
0
0
1
1
0
1
0
1
Capture disabled
Capture on rising edges only
Capture on falling edges only
Capture on any edge (rising or falling)
442
MC9S12Q128
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Chapter 15 Timer Module (TIM16B6C)
15.3.2.10 Timer Interrupt Enable Register (TIE)
Module Base + 0x000C
7
6
5
4
3
2
1
0
R
W
C7I
C6I
C5I
C4I
C3I
C2I
C1I
C0I
Reset
0
0
0
0
0
0
0
0
Figure 15-18. Timer Interrupt Enable Register (TIE)
Read: Anytime
Write: Anytime.
CAUTION
User software must ensure that C1I and C0I remain clear.
Table 15-13. TIE Field Descriptions
Description
Field
7:0
C7I:C0I
Input Capture/Output Compare “x” Interrupt Enable — The bits in TIE correspond bit-for-bit with the bits in
the TFLG1 status register. If cleared, the corresponding flag is disabled from causing a hardware interrupt. If set,
the corresponding flag is enabled to cause a interrupt.
15.3.2.11 Timer System Control Register 2 (TSCR2)
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
W
0
0
0
TOI
TCRE
PR2
PR1
PR0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 15-19. Timer System Control Register 2 (TSCR2)
Read: Anytime
Write: Anytime.
Freescale Semiconductor
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Chapter 15 Timer Module (TIM16B6C)
Table 15-14. TSCR2 Field Descriptions
Description
Field
7
TOI
Timer Overflow Interrupt Enable
0 Interrupt inhibited.
1 Hardware interrupt requested when TOF flag set.
3
Timer Counter Reset Enable — This bit allows the timer counter to be reset by a successful output compare 7
event. This mode of operation is similar to an up-counting modulus counter.
0 Counter reset inhibited and counter free runs.
TCRE
1 Counter reset by a successful output compare 7.
Note: If TC7 = 0x0000 and TCRE = 1, TCNT stays at 0x0000 continuously. If TC7 = 0xFFFF and TCRE = 1, TOF
will never be set when TCNT is reset from 0xFFFF to 0x0000. TCRE=1 and TC7!=0, the TCNT cycle
period is TC7 x "prescaler counter width" + "1 Bus Clock", for a more detailed explanation please refer to
Section 15.4.3, “Output Compare
2
Timer Prescaler Select — These three bits select the frequency of the timer prescaler clock derived from the
PR[2:0]
Bus Clock as shown in Table 15-15.
Table 15-15. Timer Clock Selection
PR2
PR1
PR0
Timer Clock
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Bus Clock / 1
Bus Clock / 2
Bus Clock / 4
Bus Clock / 8
Bus Clock / 16
Bus Clock / 32
Bus Clock / 64
Bus Clock / 128
NOTE
The newly selected prescale factor will not take effect until the next
synchronized edge where all prescale counter stages equal zero.
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MC9S12Q128
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Chapter 15 Timer Module (TIM16B6C)
15.3.2.12 Main Timer Interrupt Flag 1 (TFLG1)
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
W
C7F
C6F
C5F
C4F
C3F
C2F
Reset
0
0
0
0
0
0
0
0
Figure 15-20. Main Timer Interrupt Flag 1 (TFLG1)
Read: Anytime
Write: Used in the clearing mechanism (set bits cause corresponding bits to be cleared). Writing a zero
will not affect current status of the bit.
Table 15-16. TRLG1 Field Descriptions
Field
Description
7:2
Input Capture/Output Compare Channel “x” Flag — These flags are set when an input capture or output
C[7:2]F
compare event occurs. Clear a channel flag by writing one to it.
When TFFCA bit in TSCR register is set, a read from an input capture or a write into an output compare channel
(0x0010–0x001F) will cause the corresponding channel flag CxF to be cleared.
15.3.2.13 Main Timer Interrupt Flag 2 (TFLG2)
Module Base + 0x000F
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
TOF
Reset
0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 15-21. Main Timer Interrupt Flag 2 (TFLG2)
TFLG2 indicates when interrupt conditions have occurred. To clear a bit in the flag register, write the bit
to one.
Read: Anytime
Write: Used in clearing mechanism (set bits cause corresponding bits to be cleared).
Any access to TCNT will clear TFLG2 register if the TFFCA bit in TSCR register is set.
Table 15-17. TRLG2 Field Descriptions
Field
Description
7
Timer Overflow Flag — Set when 16-bit free-running timer overflows from 0xFFFF to 0x0000. This bit is cleared
TOF
automatically by a write to the TFLG2 register with bit 7 set. (See also TCRE control bit explanation.)
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Chapter 15 Timer Module (TIM16B6C)
15.3.2.14 Timer Input Capture/Output Compare Registers High and Low 2–7
(TCxH and TCxL)
Module Base + 0x0014 = TC2H
0x0016 = TC3H
0x0018 = TC4H
0x001A = TC5H
0x001C = TC6H
0x001E = TC7H
15
14
13
12
11
10
9
0
R
Bit 15
W
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Reset
0
0
0
0
0
0
0
0
Figure 15-22. Timer Input Capture/Output Compare Register x High (TCxH)
Module Base + 0x0015 = TC2L
0x0017 = TC3L
0x0019 = TC4L
0x001B = TC5L
0x001D = TC6L
0x001F = TC7L
7
6
5
4
3
2
1
0
R
Bit 7
W
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
0
0
0
0
0
0
0
0
Figure 15-23. Timer Input Capture/Output Compare Register x Low (TCxL)
Depending on the TIOS bit for the corresponding channel, these registers are used to latch the value of the
free-running counter when a defined transition is sensed by the corresponding input capture edge detector
or to trigger an output action for output compare.
Read: Anytime
Write: Anytime for output compare function.Writes to these registers have no meaning or effect during
input capture. All timer input capture/output compare registers are reset to 0x0000.
NOTE
Read/Write access in byte mode for high byte should takes place before low
byte otherwise it will give a different result.
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MC9S12Q128
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Chapter 15 Timer Module (TIM16B6C)
15.3.2.15 16-Bit Pulse Accumulator Control Register (PACTL)
Module Base + 0x0020
7
6
5
4
3
2
1
0
R
W
0
PAEN
PAMOD
PEDGE
CLK1
CLK0
PAOVI
PAI
Reset
0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 15-24. 16-Bit Pulse Accumulator Control Register (PACTL)
When PAEN is set, the PACT is enabled.The PACT shares the input pin with IOC7.
Read: Any time
Write: Any time
Table 15-18. PACTL Field Descriptions
Field
Description
6
Pulse Accumulator System Enable — PAEN is independent from TEN. With timer disabled, the pulse
accumulator can function unless pulse accumulator is disabled.
0 16-Bit Pulse Accumulator system disabled.
PAEN
1 Pulse Accumulator system enabled.
5
Pulse Accumulator Mode — This bit is active only when the Pulse Accumulator is enabled (PAEN = 1). See
PAMOD
Table 15-19.
0 Event counter mode.
1 Gated time accumulation mode.
4
Pulse Accumulator Edge Control — This bit is active only when the Pulse Accumulator is enabled (PAEN = 1).
For PAMOD bit = 0 (event counter mode). See Table 15-19.
PEDGE
0 Falling edges on IOC7 pin cause the count to be incremented.
1 Rising edges on IOC7 pin cause the count to be incremented.
For PAMOD bit = 1 (gated time accumulation mode).
0 IOC7 input pin high enables M (bus clock) divided by 64 clock to Pulse Accumulator and the trailing falling
edge on IOC7 sets the PAIF flag.
1 IOC7 input pin low enables M (bus clock) divided by 64 clock to Pulse Accumulator and the trailing rising edge
on IOC7 sets the PAIF flag.
3:2
Clock Select Bits — Refer to Table 15-20.
CLK[1:0]
1
Pulse Accumulator Overflow Interrupt Enable
0 Interrupt inhibited.
PAOVI
1 Interrupt requested if PAOVF is set.
0
PAI
Pulse Accumulator Input Interrupt Enable
0 Interrupt inhibited.
1 Interrupt requested if PAIF is set.
Freescale Semiconductor
MC9S12Q128
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Table 15-19. Pin Action
PAMOD
PEDGE
Pin Action
0
0
1
1
0
1
0
1
Falling edge
Rising edge
Div. by 64 clock enabled with pin high level
Div. by 64 clock enabled with pin low level
NOTE
If the timer is not active (TEN = 0 in TSCR), there is no divide-by-64
because the ÷64 clock is generated by the timer prescaler.
Table 15-20. Timer Clock Selection
CLK1
CLK0
Timer Clock
0
0
1
1
0
1
0
1
Use timer prescaler clock as timer counter clock
Use PACLK as input to timer counter clock
Use PACLK/256 as timer counter clock frequency
Use PACLK/65536 as timer counter clock frequency
For the description of PACLK please refer Figure 15-24.
If the pulse accumulator is disabled (PAEN = 0), the prescaler clock from the timer is always used as an
input clock to the timer counter. The change from one selected clock to the other happens immediately
after these bits are written.
15.3.2.16 Pulse Accumulator Flag Register (PAFLG)
Module Base + 0x0021
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
PAOVF
PAIF
Reset
0
0
0
0
0
0
0
0
Unimplemented or Reserved
Figure 15-25. Pulse Accumulator Flag Register (PAFLG)
Read: Anytime
Write: Anytime
When the TFFCA bit in the TSCR register is set, any access to the PACNT register will clear all the flags
in the PAFLG register.
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Table 15-21. PAFLG Field Descriptions
Description
Field
1
Pulse Accumulator Overflow Flag — Set when the 16-bit pulse accumulator overflows from 0xFFFF to 0x0000.
PAOVF
This bit is cleared automatically by a write to the PAFLG register with bit 1 set.
0
PAIF
Pulse Accumulator Input edge Flag — Set when the selected edge is detected at the IOC7 input pin.In event
mode the event edge triggers PAIF and in gated time accumulation mode the trailing edge of the gate signal at
the IOC7 input pin triggers PAIF.
This bit is cleared by a write to the PAFLG register with bit 0 set.
Any access to the PACNT register will clear all the flags in this register when TFFCA bit in register TSCR(0x0006)
is set.
15.3.2.17 Pulse Accumulators Count Registers (PACNT)
Module Base + 0x0022
15
14
13
12
11
10
9
0
R
W
PACNT15
PACNT14
PACNT13
PACNT12
PACNT11
PACNT10
PACNT9
PACNT8
Reset
0
0
0
0
0
0
0
0
Figure 15-26. Pulse Accumulator Count Register High (PACNTH)
Module Base + 0x0023
7
6
5
4
3
2
1
0
R
PACNT7
W
PACNT6
PACNT5
PACNT4
PACNT3
PACNT2
PACNT1
PACNT0
Reset
0
0
0
0
0
0
0
0
Figure 15-27. Pulse Accumulator Count Register Low (PACNTL)
Read: Anytime
Write: Anytime
These registers contain the number of active input edges on its input pin since the last reset.
When PACNT overflows from 0xFFFF to 0x0000, the Interrupt flag PAOVF in PAFLG (0x0021) is set.
Full count register access should take place in one clock cycle. A separate read/write for high byte and low
byte will give a different result than accessing them as a word.
NOTE
Reading the pulse accumulator counter registers immediately after an active
edge on the pulse accumulator input pin may miss the last count because the
input has to be synchronized with the bus clock first.
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Chapter 15 Timer Module (TIM16B6C)
15.4 Functional Description
This section provides a complete functional description of the timer TIM16B6C block. Please refer to the
detailed timer block diagram in Figure 15-28 as necessary.
Bus Clock
CLK[1:0]
Channel 7 output
compare
PR[2:1:0]
PACLK
PACLK/256
PACLK/65536
MUX
TCRE
PRESCALER
CxI
TCNT(hi):TCNT(lo)
16-BIT COUNTER
CxF
CLEAR COUNTER
TOF
TOI
INTERRUPT
LOGIC
TOF
TE
CHANNEL 2
16-BIT COMPARATOR
TC2
C2F
C2F
CH. 2CAPTURE
OM:OL2
IOC2 PIN
LOGIC
IOC2 PIN
TOV2
CH. 2COMPARE
EDGE
DETECT
EDG0A EDG0B
IOC2
C3F
CHANNEL 3
16-BIT COMPARATOR
TC3
C3F
CH. 3 CAPTURE
CH. 3 COMPARE
OM:OL2
TOV2
IOC3 PIN
LOGIC
IOC3 PIN
EDGE
DETECT
EDG1A EDG1B
CHANNEL4
IOC3
C7F
CHANNEL7
16-BIT COMPARATOR
TC7
C7F
CH.7 CAPTURE
PA INPUT
IOC7 PIN
LOGIC
OM:O73
TOV7
IOC7 PIN
CH. 7 COMPARE
EDG7A
EDG7B
EDGE
DETECT
IOC7
PAOVF
PACNT(hi):PACNT(lo)
PEDGE
PAE
EDGE
DETECT
PACLK/65536
PACLK/256
16-BIT COUNTER
PACLK
TEN
INTERRUPT
REQUEST
INTERRUPT
LOGIC
PAIF
DIVIDE-BY-64
Bus Clock
PAOVI
PAOVF
PAI
PAIF
PAOVF
PAOVI
Figure 15-28. Detailed Timer Block Diagram
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15.4.1 Prescaler
The prescaler divides the bus clock by 1, 2, 4, 8, 16, 32, 64, or 128. The prescaler select bits, PR[2:0], select
the prescaler divisor. PR[2:0] are in timer system control register 2 (TSCR2).
15.4.2 Input Capture
Clearing the I/O (input/output) select bit, IOSx, configures channel x as an input capture channel. The
input capture function captures the time at which an external event occurs. When an active edge occurs on
the pin of an input capture channel, the timer transfers the value in the timer counter into the timer channel
registers, TCx.
The minimum pulse width for the input capture input is greater than two bus clocks.
An input capture on channel x sets the CxF flag. The CxI bit enables the CxF flag to generate interrupt
requests.
15.4.3 Output Compare
Setting the I/O select bit, IOSx, configures channel x as an output compare channel. The output compare
function can generate a periodic pulse with a programmable polarity, duration, and frequency. When the
timer counter reaches the value in the channel registers of an output compare channel, the timer can set,
clear, or toggle the channel pin. An output compare on channel x sets the CxF flag. The CxI bit enables the
CxF flag to generate interrupt requests.
The output mode and level bits, OMx and OLx, select set, clear, toggle on output compare. Clearing both
OMx and OLx disconnects the pin from the output logic.
Setting a force output compare bit, FOCx, causes an output compare on channel x. A forced output
compare does not set the channel flag.
A successful output compare on channel 7 overrides output compares on all other output compare
channels. The output compare 7 mask register masks the bits in the output compare 7 data register. The
timer counter reset enable bit, TCRE, enables channel 7 output compares to reset the timer counter. A
channel 7 output compare can reset the timer counter even if the IOC7 pin is being used as the pulse
accumulator input.
Writing to the timer port bit of an output compare pin does not affect the pin state. The value written is
stored in an internal latch. When the pin becomes available for general-purpose output, the last value
written to the bit appears at the pin.
When TCRE is set and TC7 is not equal to 0, then TCNT will cycle from 0 to TC7. When TCNT reaches
TC7 value, it will last only one bus cycle then reset to 0.
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Note: in Figure 15-29,if PR[2:0] is equal to 0, one prescaler counter equal to one bus clock
Figure 15-29. The TCNT cycle diagram under TCRE=1 condition
prescaler
counter
1 bus
clock
TC7
0
1
-----
TC7-1
TC7
0
TC7 event
TC7 event
15.4.4 Pulse Accumulator
The pulse accumulator (PACNT) is a 16-bit counter that can operate in two modes:
Event counter mode — Counting edges of selected polarity on the pulse accumulator input pin, PAI.
Gated time accumulation mode — Counting pulses from a divide-by-64 clock. The PAMOD bit selects the
mode of operation.
The minimum pulse width for the PAI input is greater than two bus clocks.
15.4.5 Event Counter Mode
Clearing the PAMOD bit configures the PACNT for event counter operation. An active edge on the IOC7
pin increments the pulse accumulator counter. The PEDGE bit selects falling edges or rising edges to
increment the count.
NOTE
The PACNT input and timer channel 7 use the same pin IOC7. To use the
IOC7, disconnect it from the output logic by clearing the channel 7 output
mode and output level bits, OM7 and OL7. Also clear the channel 7 output
compare 7 mask bit, OC7M7.
The Pulse Accumulator counter register reflect the number of active input edges on the PACNT input pin
since the last reset.
The PAOVF bit is set when the accumulator rolls over from 0xFFFF to 0x0000. The pulse accumulator
overflow interrupt enable bit, PAOVI, enables the PAOVF flag to generate interrupt requests.
NOTE
The pulse accumulator counter can operate in event counter mode even
when the timer enable bit, TEN, is clear.
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15.4.6 Gated Time Accumulation Mode
Setting the PAMOD bit configures the pulse accumulator for gated time accumulation operation. An active
level on the PACNT input pin enables a divided-by-64 clock to drive the pulse accumulator. The PEDGE
bit selects low levels or high levels to enable the divided-by-64 clock.
The trailing edge of the active level at the IOC7 pin sets the PAIF. The PAI bit enables the PAIF flag to
generate interrupt requests.
The pulse accumulator counter register reflect the number of pulses from the divided-by-64 clock since the
last reset.
NOTE
The timer prescaler generates the divided-by-64 clock. If the timer is not
active, there is no divided-by-64 clock.
15.5 Resets
The reset state of each individual bit is listed within Section 15.3, “Memory Map and Registers” which
details the registers and their bit fields.
15.6 Interrupts
This section describes interrupts originated by the TIM16B6C block. Table 15-22 lists the interrupts
generated by the TIM16B6C to communicate with the MCU.
Table 15-22. TIM16B8CV1 Interrupts
Offset
Interrupt
Vector1
Priority1
Source
Description
(1)
C[7:2]F
PAOVI
—
—
—
—
—
—
Timer Channel 7–2
Active high timer channel interrupts 7–0
Pulse Accumulator
Input
Active high pulse accumulator input interrupt
PAOVF
—
—
—
—
—
—
Pulse Accumulator
Overflow
Pulse accumulator overflow interrupt
Timer Overflow interrupt
TOF
Timer Overflow
1. Chip dependent.
The TIM16B6C uses a total of 9 interrupt vectors. The interrupt vector offsets and interrupt numbers are
chip dependent.
15.6.1 Channel [7:2] Interrupt (C[7:2]F)
This active high outputs will be asserted by the module to request a timer channel 7–2 interrupt to be
serviced by the system controller.
CAUTION
User software must ensure that C1I and C0I remain clear.
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15.6.2 Pulse Accumulator Input Interrupt (PAOVI)
This active high output will be asserted by the module to request a timer pulse accumulator input interrupt
to be serviced by the system controller.
15.6.3 Pulse Accumulator Overflow Interrupt (PAOVF)
This active high output will be asserted by the module to request a timer pulse accumulator overflow
interrupt to be serviced by the system controller.
15.6.4 Timer Overflow Interrupt (TOF)
This active high output will be asserted by the module to request a timer overflow interrupt to be serviced
by the system controller.
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Chapter 16
Dual Output Voltage Regulator (VREG3V3V2)
Block Description
16.1 Introduction
The VREG3V3V2 is a dual output voltage regulator providing two separate 2.5 V (typical) supplies
differing in the amount of current that can be sourced. The regulator input voltage range is from 3.3 V up
to 5 V (typical).
16.1.1 Features
The block VREG3V3V2 includes these distinctive features:
•
Two parallel, linear voltage regulators
— Bandgap reference
•
•
•
Low-voltage detect (LVD) with low-voltage interrupt (LVI)
Power-on reset (POR)
Low-voltage reset (LVR)
16.1.2 Modes of Operation
There are three modes VREG3V3V2 can operate in:
•
•
•
Full-performance mode (FPM) (MCU is not in stop mode)
The regulator is active, providing the nominal supply voltage of 2.5 V with full current sourcing
capability at both outputs. Features LVD (low-voltage detect), LVR (low-voltage reset), and POR
(power-on reset) are available.
Reduced-power mode (RPM) (MCU is in stop mode)
The purpose is to reduce power consumption of the device. The output voltage may degrade to a
lower value than in full-performance mode, additionally the current sourcing capability is
substantially reduced. Only the POR is available in this mode, LVD and LVR are disabled.
Shutdown mode
Controlled by V
(see device overview chapter for connectivity of V
).
REGEN
REGEN
This mode is characterized by minimum power consumption. The regulator outputs are in a high
impedance state, only the POR feature is available, LVD and LVR are disabled.
This mode must be used to disable the chip internal regulator VREG3V3V2, i.e., to bypass the
VREG3V3V2 to use external supplies.
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Chapter 16 Dual Output Voltage Regulator (VREG3V3V2) Block Description
16.1.3 Block Diagram
Figure 16-1 shows the function principle of VREG3V3V2 by means of a block diagram. The regulator
core REG consists of two parallel sub-blocks, REG1 and REG2, providing two independent output
voltages.
VDDPLL
VSSPLL
REG2
VDDR
VDDA
VDD
REG1
LVR
LVD
POR
VSS
LVR
POR
VSSA
VREGEN
CTRL
LVI
REG: Regulator Core
LVD: Low Voltage Detect
CTRL: Regulator Control
LVR: Low Voltage Reset
POR: Power-on Reset
PIN
Figure 16-1. VREG3V3 Block Diagram
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16.2 External Signal Description
Due to the nature of VREG3V3V2 being a voltage regulator providing the chip internal power supply
voltages most signals are power supply signals connected to pads.
Table 16-1 shows all signals of VREG3V3V2 associated with pins.
Table 16-1. VREG3V3V2 — Signal Properties
Name
Port
Function
Reset State
Pull Up
VDDR
VDDA
—
—
—
—
—
—
—
—
VREG3V3V2 power input (positive supply)
VREG3V3V2 quiet input (positive supply)
VREG3V3V2 quiet input (ground)
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
VSSA
VDD
VREG3V3V2 primary output (positive supply)
VREG3V3V2 primary output (ground)
VREG3V3V2 secondary output (positive supply)
VREG3V3V2 secondary output (ground)
VREG3V3V2 (Optional) Regulator Enable
VSS
VDDPLL
VSSPLL
REGEN (optional)
V
NOTE
Check device overview chapter for connectivity of the signals.
16.2.1 VDDR — Regulator Power Input
Signal V
is the power input of VREG3V3V2. All currents sourced into the regulator loads flow
DDR
through this pin. A chip external decoupling capacitor (100 nF...220 nF, X7R ceramic) between V
and
pin.
DDR
V
can smoothen ripple on V
.
SSR
DDR
For entering Shutdown Mode, pin V
should also be tied to ground on devices without a V
REGEN
DDR
16.2.2 VDDA, VSSA — Regulator Reference Supply
Signals V
/V
which are supposed to be relatively quiet are used to supply the analog parts of the
DDA SSA
regulator. Internal precision reference circuits are supplied from these signals. A chip external decoupling
capacitor (100 nF...220 nF, X7R ceramic) between V
supply.
and V
can further improve the quality of this
DDA
SSA
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16.2.3 VDD, VSS — Regulator Output1 (Core Logic)
Signals V /V are the primary outputs of VREG3V3V2 that provide the power supply for the core
DD SS
logic. These signals are connected to device pins to allow external decoupling capacitors (100 nF...220 nF,
X7R ceramic).
In Shutdown Mode an external supply at V /V can replace the voltage regulator.
DD SS
16.2.4 VDDPLL, VSSPLL — Regulator Output2 (PLL)
Signals V
/V
are the secondary outputs of VREG3V3V2 that provide the power supply for the
DDPLL SSPLL
PLL and oscillator. These signals are connected to device pins to allow external decoupling capacitors
(100 nF...220 nF, X7R ceramic).
In Shutdown Mode an external supply at V
/V
can replace the voltage regulator.
DDPLL SSPLL
16.2.5 VREGEN — Optional Regulator Enable
This optional signal is used to shutdown VREG3V3V2. In that case V /V and V
/V
must
DD SS
DDPLL SSPLL
be provided externally. Shutdown Mode is entered with V
being low. If V
is high, the
REGEN
REGEN
VREG3V3V2 is either in Full Performance Mode or in Reduced Power Mode.
For the connectivity of V
see device overview chapter.
REGEN
NOTE
Switching from FPM or RPM to shutdown of VREG3V3V2 and vice versa
is not supported while the MCU is powered.
16.3 Memory Map and Register Definition
This subsection provides a detailed description of all registers accessible in VREG3V3V2.
16.3.1 Module Memory Map
Figure 16-2 provides an overview of all used registers.
Table 16-2. VREG3V3V2 Memory Map
Address
Offset
Use
Access
R/W
0x0000
VREG3V3V2 Control Register (VREGCTRL)
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16.3.2 Register Descriptions
The following paragraphs describe, in address order, all the VREG3V3V2 registers and their individual
bits.
16.3.2.1 VREG3V3V2 — Control Register (VREGCTRL)
The VREGCTRL register allows to separately enable features of VREG3V3V2.
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
LVDS
LVIE
LVIF
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 16-2. VREG3V3 — Control Register (VREGCTRL)
Table 16-3. MCCTL1 Field Descriptions
Description
Field
2
Low-Voltage Detect Status Bit — This read-only status bit reflects the input voltage. Writes have no effect.
0 Input voltage VDDA is above level VLVID or RPM or shutdown mode.
1 Input voltage VDDA is below level VLVIA and FPM.
LVDS
1
Low-Voltage Interrupt Enable Bit
LVIE
0 Interrupt request is disabled.
1 Interrupt will be requested whenever LVIF is set.
0
LVIF
Low-Voltage Interrupt Flag — LVIF is set to 1 when LVDS status bit changes. This flag can only be cleared by
writing a 1. Writing a 0 has no effect. If enabled (LVIE = 1), LVIF causes an interrupt request.
0 No change in LVDS bit.
1 LVDS bit has changed.
NOTE
On entering the Reduced Power Mode the LVIF is not cleared by the
VREG3V3V2.
16.4 Functional Description
Block VREG3V3V2 is a voltage regulator as depicted in Figure 16-1. The regulator functional elements
are the regulator core (REG), a low-voltage detect module (LVD), a power-on reset module (POR) and a
low-voltage reset module (LVR). There is also the regulator control block (CTRL) which represents the
interface to the digital core logic but also manages the operating modes of VREG3V3V2.
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16.4.1 REG — Regulator Core
VREG3V3V2, respectively its regulator core has two parallel, independent regulation loops (REG1 and
REG2) that differ only in the amount of current that can be sourced to the connected loads. Therefore, only
REG1 providing the supply at V /V is explained. The principle is also valid for REG2.
DD SS
The regulator is a linear series regulator with a bandgap reference in its Full Performance Mode and a
voltage clamp in Reduced Power Mode. All load currents flow from input V
to V or V
, the
DDR
SS
SSPLL
reference circuits are connected to V
and V
.
DDA
SSA
16.4.2 Full-Performance Mode
In Full Performance Mode, a fraction of the output voltage (V ) and the bandgap reference voltage are
DD
fed to an operational amplifier. The amplified input voltage difference controls the gate of an output driver
which basically is a large NMOS transistor connected to the output.
16.4.3 Reduced-Power Mode
In Reduced Power Mode, the driver gate is connected to a buffered fraction of the input voltage (V
The operational amplifier and the bandgap are disabled to reduce power consumption.
).
DDR
16.4.4 LVD — Low-Voltage Detect
sub-block LVD is responsible for generating the low-voltage interrupt (LVI). LVD monitors the input
voltage (V –V ) and continuously updates the status flag LVDS. Interrupt flag LVIF is set whenever
DDA
SSA
status flag LVDS changes its value. The LVD is available in FPM and is inactive in Reduced Power Mode
and Shutdown Mode.
16.4.5 POR — Power-On Reset
This functional block monitors output V . If V is below V , signal POR is high, if it exceeds
PORD
DD
DD
V
, the signal goes low. The transition to low forces the CPU in the power-on sequence.
PORD
Due to its role during chip power-up this module must be active in all operating modes of VREG3V3V2.
16.4.6 LVR — Low-Voltage Reset
Block LVR monitors the primary output voltage V . If it drops below the assertion level (V
) signal
LVRA
DD
LVR asserts and when rising above the deassertion level (V
) signal LVR negates again. The LVR
LVRD
function is available only in Full Performance Mode.
16.4.7 CTRL — Regulator Control
This part contains the register block of VREG3V3V2 and further digital functionality needed to control
the operating modes. CTRL also represents the interface to the digital core logic.
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16.5 Resets
This subsection describes how VREG3V3V2 controls the reset of the MCU.The reset values of registers
and signals are provided in Section 16.3, “Memory Map and Register Definition”. Possible reset sources
are listed in Table 16-4.
Table 16-4. VREG3V3V2 — Reset Sources
Reset Source
Power-on reset
Local Enable
Always active
Available only in Full Performance Mode
Low-voltage reset
16.5.1 Power-On Reset
During chip power-up the digital core may not work if its supply voltage V is below the POR
DD
deassertion level (V
). Therefore, signal POR which forces the other blocks of the device into reset is
PORD
kept high until V exceeds V
. Then POR becomes low and the reset generator of the device
DD
PORD
continues the start-up sequence. The power-on reset is active in all operation modes of VREG3V3V2.
16.5.2 Low-Voltage Reset
For details on low-voltage reset see Section 16.4.6, “LVR — Low-Voltage Reset”.
16.6 Interrupts
This subsection describes all interrupts originated by VREG3V3V2.
The interrupt vectors requested by VREG3V3V2 are listed in Table 16-5. Vector addresses and interrupt
priorities are defined at MCU level.
Table 16-5. VREG3V3V2 — Interrupt Vectors
Interrupt Source
Local Enable
Low Voltage Interrupt (LVI)
LVIE = 1; Available only in Full Performance Mode
16.6.1 LVI — Low-Voltage Interrupt
In FPM VREG3V3V2 monitors the input voltage V
. Whenever V
drops below level V
the
DDA
DDA
LVIA
status bit LVDS is set to 1. Vice versa, LVDS is reset to 0 when V
rises above level V
. An
DDA
LVID
interrupt, indicated by flag LVIF = 1, is triggered by any change of the status bit LVDS if interrupt enable
bit LVIE = 1.
NOTE
On entering the Reduced Power Mode, the LVIF is not cleared by the
VREG3V3V2.
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Chapter 17
32 Kbyte Flash Module (S12FTS32KV1)
17.1 Introduction
The FTS32K module implements a 32 Kbyte Flash (nonvolatile) memory. The Flash memory contains one
array of 32 Kbytes organized as 512 rows of 64 bytes with an erase sector size of eight rows (512 bytes).
The Flash array may be read as either bytes, aligned words, or misaligned words. Read access time is one
bus cycle for byte and aligned word, and two bus cycles for misaligned words.
The Flash array is ideal for program and data storage for single-supply applications allowing for field
reprogramming without requiring external voltage sources for program or erase. Program and erase
functions are controlled by a command driven interface. The Flash module supports both mass erase and
sector erase. An erased bit reads 1 and a programmed bit reads 0. The high voltage required to program
and erase is generated internally. It is not possible to read from a Flash array while it is being erased or
programmed.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
17.1.1 Glossary
Command Write Sequence — A three-step MCU instruction sequence to program, erase, or erase verify
the Flash array memory.
17.1.2 Features
•
•
•
•
•
•
•
•
32 Kbytes of Flash memory comprised of one 32 Kbyte array divided into 64 sectors of 512 bytes
Automated program and erase algorithm
Interrupts on Flash command completion and command buffer empty
Fast sector erase and word program operation
2-stage command pipeline for faster multi-word program times
Flexible protection scheme to prevent accidental program or erase
Single power supply for Flash program and erase operations
Security feature to prevent unauthorized access to the Flash array memory
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Chapter 17 32 Kbyte Flash Module (S12FTS32KV1)
17.1.3 Modes of Operation
See Section 17.4.2, “Operating Modes” for a description of the Flash module operating modes. For
program and erase operations, refer to Section 17.4.1, “Flash Command Operations”.
17.1.4 Block Diagram
Figure 17-1 shows a block diagram of the FTS32K module.
FTS32K
Flash
Interface
Command
Complete
Command Pipeline
Interrupt
Flash Array
cmd1
addr1
data1
cmd2
addr2
data2
16K * 16 Bits
Command
Buffer Empty
Interrupt
sector 0
sector 1
Registers
Protection
Security
sector 63
Oscillator
Clock
Clock
Divider
FCLK
Figure 17-1. FTS32K Block Diagram
17.2 External Signal Description
The FTS32K module contains no signals that connect off-chip.
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Chapter 17 32 Kbyte Flash Module (S12FTS32KV1)
17.3 Memory Map and Registers
This section describes the FTS32K memory map and registers.
17.3.1 Module Memory Map
The FTS32K memory map is shown in Figure 17-2. The HCS12 architecture places the Flash array
addresses between 0x4000 and 0xFFFF, which corresponds to three 16 Kbyte pages. The content of the
HCS12 Core PPAGE register is used to map the logical middle page ranging from address 0x8000 to
1
0xBFFF to any physical 16K byte page in the Flash array memory. The FPROT register (see Section
17.3.2.5) can be set to globally protect the entire Flash array. Three separate areas, one starting from the
Flash array starting address (called lower) towards higher addresses, one growing downward from the
Flash array end address (called higher), and the remaining addresses, can be activated for protection. The
Flash array addresses covered by these protectable regions are shown in Figure 17-2. The higher address
area is mainly targeted to hold the boot loader code since it covers the vector space. The lower address area
can be used for EEPROM emulation in an MCU without an EEPROM module since it can be left
unprotected while the remaining addresses are protected from program or erase. Default protection
settings as well as security information that allows the MCU to restrict access to the Flash module are
stored in the Flash configuration field described in Table 17-1.
Table 17-1. Flash Configuration Field
Size
Flash Address
Description
(bytes)
0xFF00–0xFF07
0xFF08–0xFF0C
0xFF0D
8
5
1
Backdoor Key to unlock security
Reserved
Flash Protection byte
Refer to Section 17.3.2.5, “Flash Protection Register (FPROT)”
0xFF0E
0xFF0F
1
1
Reserved
Flash Security/Options byte
Refer to Section 17.3.2.2, “Flash Security Register (FSEC)”
1. By placing 0x3E/0x3F in the HCS12 Core PPAGE register, the bottom/top fixed 16 Kbyte pages can be seen twice in the MCU
memory map.
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MODULE BASE + 0x0000
Flash Registers
16 bytes
MODULE BASE + 0x000F
FLASH_START = 0x4000
0x4200
0x4400
Flash Protected Low Sectors
512 bytes, 1, 2, 4 Kbytes
0x4800
0x5000
0x3E
Flash Array
0x8000
16K PAGED
MEMORY
003E
0x3F
0xC000
Flash Protected High Sectors
2, 4, 8, 16 Kbytes
0xE000
0xF000
0x3F
0xF800
FLASH_END = 0xFFFF
0xFF00–0xFF0F (Flash Configuration Field)
Note: 0x3E–0x3F correspond to the PPAGE register content
Figure 17-2. Flash Memory Map
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Table 17-2. Flash Array Memory Map Summary
MCU Address
Range
Protectable
Low Range
Protectable
High Range
Array Relative
Address(1)
PPAGE
0x4000–0x7FFF
Unpaged
(0x3E)
0x4000–0x43FF
0x4000–0x47FF
0x4000–0x4FFF
0x4000–0x5FFF
0x8000–0x83FF
0x8000–0x87FF
0x8000–0x8FFF
0x8000–0x9FFF
N.A.
N.A.
0x18000–0x1BFFF
0x18000–0x1BFFF
0x1C000–0x1FFFF
0x1C000–0x1FFFF
0x8000–0xBFFF
0x3E
0x3F
N.A.
0xB800–0xBFFF
0xB000–0xBFFF
0xA000–0xBFFF
0x8000–0xBFFF
0xF800–0xFFFF
0xF000–0xFFFF
0xE000–0xFFFF
0xC000–0xFFFF
0xC000–0xFFFF
Unpaged
(0x3F)
N.A.
1. Inside Flash block.
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17.3.2 Register Descriptions
The Flash module contains a set of 16 control and status registers located between module base + 0x0000
and 0x000F. A summary of the Flash module registers is given in Figure 17-3. Detailed descriptions of
each register bit are provided.
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
W
R
FDIVLD
0x0000
FCLKDIV
PRDIV8
KEYEN0
FDIV5
NV5
FDIV4
NV4
FDIV3
NV3
FDIV2
NV2
FDIV1
SEC1
FDIV0
SEC0
KEYEN1
0
0x0001
FSEC
W
R
0x0002
0
0
0
0
0
0
0
0
0
0
RESERVED1
W
(1)
R
W
R
0
0
0x0003
FCNFG
CBEIE
CCIE
KEYACC
FPHDIS
PVIOL
0x0004
FPROT
FPOPEN
NV6
FPHS1
FPHS0
0
FPLDIS
BLANK
FPLS1
FPLS0
DONE
W
R
CCIF
0x0005
FSTAT
CBEIF
0
ACCERR
0
FAIL
0
W
R
0
0
0x0006
FCMD
CMDB6
0
CMDB5
0
CMDB2
0
CMDB0
0
W
R
0
0
0
0
0x0007
RESERVED21
W
R
0
0x0008
FABHI
FADDRHI1
W
R
0x0009
FABLO
FADDRLO1
W
R
0x000A
FDHI
FDATAHI1
W
R
0x000B
FDLO
FDATALO1
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x000C
RESERVED31
W
R
0x000D
RESERVED41
W
R
0x000E
RESERVED51
W
R
0x000F
RESERVED61
W
= Unimplemented or Reserved
Figure 17-3. Flash Register Summary
1. Intended for factory test purposes only.
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17.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
FDIVLD
PRDIV8
FDIV5
FDIV4
FDIV3
FDIV2
FDIV1
FDIV0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-4. Flash Clock Divider Register (FCLKDIV)
All bits in the FCLKDIV register are readable, bits 6–0 are write once and bit 7 is not writable.
Table 17-3. FCLKDIV Field Descriptions
Field
Description
7
Clock Divider Loaded
FDIVLD
0 FCLKDIV register has not been written
1 FCLKDIV register has been written to since the last reset
6
Enable Prescalar by 8
PRDIV8
0 The oscillator clock is directly fed into the Flash clock divider
1 The oscillator clock is divided by 8 before feeding into the Flash clock divider
5–0
Clock Divider Bits — The combination of PRDIV8 and FDIV[5:0] must divide the oscillator clock down to a
FDIV[5:0] frequency of 150 kHz – 200 kHz. The maximum divide ratio is 512. Refer to Section 17.4.1.1, “Writing the
FCLKDIV Register” for more information.
17.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
KEYEN1
KEYEN0
NV5
NV4
NV3
NV2
SEC1
SEC0
Reset
F
F
F
F
F
F
F
F
= Unimplemented or Reserved
Figure 17-5. Flash Security Register (FSEC)
All bits in the FSEC register are readable but not writable.
The FSEC register is loaded from the Flash configuration field at 0xFF0F during the reset sequence,
indicated by F in Figure 17-5.
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Table 17-4. FSEC Field Descriptions
Field
Description
7–6
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of the backdoor key access
KEYEN[1:0] to the Flash module as shown in Table 17-5.
5–2
Nonvolatile Flag Bits — The NV[5:2] bits are available to the user as nonvolatile flags.
NV[5:2]
1–0
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 17-6. If the
SEC[1:0]
Flash module is unsecured using backdoor key access, the SEC[1:0] bits are forced to 1:0.
Table 17-5. Flash KEYEN States
KEYEN[1:0]
Status of Backdoor Key Access
00
01(1)
10
DISABLED
DISABLED
ENABLED
DISABLED
11
1. Preferred KEYEN state to disable Backdoor Key Access.
Table 17-6. Flash Security States
SEC[1:0]
Status of Security
00
01(1)
10
Secured
Secured
Unsecured
11
Secured
1. Preferred SEC state to set MCU to secured state.
The security function in the Flash module is described in Section 17.4.3, “Flash Module Security”.
17.3.2.3 RESERVED1
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-6. RESERVED1
All bits read 0 and are not writable.
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17.3.2.4 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash interrupts and gates the security backdoor key writes.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
CBEIE
CCIE
KEYACC
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-7. Flash Configuration Register (FCNFG)
CBEIE, CCIE, and KEYACC are readable and writable while remaining bits read 0 and are not writable.
KEYACC is only writable if the KEYEN bit in the FSEC register is set to the enabled state (see Section
17.3.2.2).
Table 17-7. FCNFG Field Descriptions
Field
Description
7
Command Buffer Empty Interrupt Enable — The CBEIE bit enables the interrupts in case of an empty
command buffer in the Flash module.
CBEIE
0 Command Buffer Empty interrupts disabled
1 An interrupt will be requested whenever the CBEIF flag is set (see Section 17.3.2.6)
6
Command Complete Interrupt Enable — The CCIE bit enables the interrupts in case of all commands being
completed in the Flash module.
CCIE
0 Command Complete interrupts disabled
1 An interrupt will be requested whenever the CCIF flag is set (see Section 17.3.2.6)
5
Enable Security Key Writing.
KEYACC
0 Flash writes are interpreted as the start of a command write sequence
1 Writes to the Flash array are interpreted as a backdoor key while reads of the Flash array return invalid data
17.3.2.5 Flash Protection Register (FPROT)
The FPROT register defines which Flash sectors are protected against program or erase.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
FPOPEN
NV6
FPHDIS
FPHS1
FPHS0
FPLDIS
FPLS1
FPLS0
Reset
F
F
F
F
F
F
F
F
Figure 17-8. Flash Protection Register (FPROT)
The FPROT register is readable in normal and special modes. FPOPEN can only be written from a 1 to a 0.
FPLS[1:0] can be written anytime until FPLDIS is cleared. FPHS[1:0] can be written anytime until
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FPHDIS is cleared. The FPROT register is loaded from Flash address 0xFF0D during the reset sequence,
indicated by F in Figure 17-8.
To change the Flash protection that will be loaded on reset, the upper sector of the Flash array must be
unprotected, then the Flash protection byte located at Flash address 0xFF0D must be written to.
A protected Flash sector is disabled by FPHDIS and FPLDIS while the size of the protected sector is
defined by FPHS[1:0] and FPLS[1:0] in the FPROT register.
Trying to alter any of the protected areas will result in a protect violation error and the PVIOL flag will be
set in the FSTAT register (see Section 17.3.2.6). A mass erase of the whole Flash array is only possible
when protection is fully disabled by setting the FPOPEN, FPLDIS, and FPHDIS bits. An attempt to mass
erase a Flash array while protection is enabled will set the PVIOL flag in the FSTAT register.
Table 17-8. FPROT Field Descriptions
Field
Description
7
Protection Function for Program or Erase — It is possible using the FPOPEN bit to either select address
FPOPEN ranges to be protected using FPHDIS, FPLDIS, FPHS[1:0] and FPLS[1:0] or to select the same ranges to be
unprotected. When FPOPEN is set, FPxDIS enables the ranges to be protected, whereby clearing FPxDIS
enables protection for the range specified by the corresponding FPxS[1:0] bits. When FPOPEN is cleared,
FPxDIS defines unprotected ranges as specified by the corresponding FPxS[1:0] bits. In this case, setting
FPxDIS enables protection. Thus the effective polarity of the FPxDIS bits is swapped by the FPOPEN bit as
shown in Table 17-9. This function allows the main part of the Flash array to be protected while a small range
can remain unprotected for EEPROM emulation.
0 The FPHDIS and FPLDIS bits define Flash address ranges to be unprotected
1 The FPHDIS and FPLDIS bits define Flash address ranges to be protected
6
Nonvolatile Flag Bit — The NV6 bit should remain in the erased state for future enhancements.
NV6
5
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in the higher space of the Flash address map.
0 Protection/unprotection enabled
FPHDIS
1 Protection/unprotection disabled
4–3
Flash Protection Higher Address Size — The FPHS[1:0] bits determine the size of the protected/unprotected
FPHS[1:0] sector as shown in Table 17-10. The FPHS[1:0] bits can only be written to while the FPHDIS bit is set.
2
Flash Protection Lower Address Range Disable — The FPLDIS bit determines whether there is a
protected/unprotected sector in the lower space of the Flash address map.
0 Protection/unprotection enabled
FPLDIS
1 Protection/unprotection disabled
1–0
Flash Protection Lower Address Size — The FPLS[1:0] bits determine the size of the protected/unprotected
FPLS[1:0] sector as shown in Table 17-11. The FPLS[1:0] bits can only be written to while the FPLDIS bit is set.
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Table 17-9. Flash Protection Function
FPOPEN FPHDIS FPHS[1] FPHS[0] FPLDIS FPLS[1] FPLS[0]
Function(1)
No protection
1
1
1
1
0
0
0
0
1
1
0
0
1
0
1
0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
1
0
1
0
1
1
0
0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Protect low range
Protect high range
Protect high and low ranges
Full Flash array protected
Unprotected high range
Unprotected low range
Unprotected high and low ranges
1. For range sizes refer to Table 17-10 and or Table 17-11.
Table 17-10. Flash Protection Higher Address Range
FPHS[1:0]
Address Range
Range Size
00
01
10
11
0xF800–0xFFFF
0xF000–0xFFFF
0xE000–0xFFFF
0xC000–0xFFFF
2 Kbytes
4 Kbytes
8 Kbytes
16 Kbytes
Table 17-11. Flash Protection Lower Address Range
FPLS[1:0]
Address Range
Range Size
00
01
10
11
0x4000–0x41FF
0x4000–0x43FF
0x4000–0x47FF
0x4000–0x4FFF
512 bytes
1 Kbyte
2 Kbytes
4 Kbytes
Figure 17-9 illustrates all possible protection scenarios. Although the protection scheme is loaded from the
Flash array after reset, it is allowed to change in normal modes. This protection scheme can be used by
applications requiring re-programming in single chip mode while providing as much protection as possible
if no re-programming is required.
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FPHDIS = 1
FPLDIS = 1
FPHDIS = 1
FPLDIS = 0
6
FPHDIS = 0
FPLDIS = 1
5
FPHDIS = 0
FPLDIS = 0
4
Scenario
7
0xFFFF
Scenario
3
2
1
0
0xFFFF
Protected Flash
Figure 17-9. Flash Protection Scenarios
17.3.2.5.1
Flash Protection Restrictions
The general guideline is that protection can only be added, not removed. All valid transitions between
Flash protection scenarios are specified in Table 17-12. Any attempt to write an invalid scenario to the
FPROT register will be ignored and the FPROT register will remain unchanged. The contents of the
FPROT register reflect the active protection scenario.
Table 17-12. Flash Protection Scenario Transitions
From
To Protection Scenario(1)
Protection
Scenario
0
1
2
3
4
5
6
7
0
1
2
3
4
5
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
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Table 17-12. Flash Protection Scenario Transitions
From
To Protection Scenario(1)
Protection
Scenario
0
1
2
3
4
5
6
7
6
7
X
X
X
X
X
X
X
X
X
X
X
X
1. Allowed transitions marked with X.
17.3.2.6 Flash Status Register (FSTAT)
The FSTAT register defines the status of the Flash command controller and the results of command
execution.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
CCIF
0
BLANK
DONE
CBEIF
PVIOL
ACCERR
FAIL
Reset
1
1
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 17-10. Flash Status Register (FSTAT)
In normal modes, bits CBEIF, PVIOL, and ACCERR are readable and writable, bits CCIF and BLANK
are readable and not writable, remaining bits, including FAIL and DONE, read 0 and are not writable. In
special modes, FAIL is readable and writable while DONE is readable but not writable. FAIL must be clear
in special modes when starting a command write sequence.
Table 17-13. FSTAT Field Descriptions
Field
Description
7
Command Buffer Empty Interrupt Flag — The CBEIF flag indicates that the address, data and command
buffers are empty so that a new command write sequence can be started. The CBEIF flag is cleared by writing
a 1 to CBEIF. Writing a 0 to the CBEIF flag has no effect on CBEIF. Writing a 0 to CBEIF after writing an aligned
word to the Flash address space but before CBEIF is cleared will abort a command write sequence and cause
the ACCERR flag in the FSTAT register to be set. Writing a 0 to CBEIF outside of a command write sequence
will not set the ACCERR flag. The CBEIF flag is used together with the CBEIE bit in the FCNFG register to
generate an interrupt request (see Figure 17-26).
CBEIF
0 Buffers are full
1 Buffers are ready to accept a new command
6
Command Complete Interrupt Flag — The CCIF flag indicates that there are no more commands pending. The
CCIF flag is cleared when CBEIF is clear and sets automatically upon completion of all active and pending
commands. The CCIF flag does not set when an active commands completes and a pending command is
fetched from the command buffer. Writing to the CCIF flag has no effect. The CCIF flag is used together with the
CCIE bit in the FCNFG register to generate an interrupt request (see Figure 17-26).
0 Command in progress
CCIF
1 All commands are completed
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Table 17-13. FSTAT Field Descriptions
Field
Description
5
Protection Violation — The PVIOL flag indicates an attempt was made to program or erase an address in a
protected Flash array memory area. The PVIOL flag is cleared by writing a 1 to PVIOL. Writing a 0 to the PVIOL
flag has no effect on PVIOL. While PVIOL is set, it is not possible to launch another command.
0 No protection violation detected
PVIOL
1 Protection violation has occurred
4
Access Error — The ACCERR flag indicates an illegal access to the Flash array caused by either a violation of
ACCERR the command write sequence, issuing an illegal command (illegal combination of the CMDBx bits in the FCMD
register) or the execution of a CPU STOP instruction while a command is executing (CCIF=0). The ACCERR flag
is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR flag has no effect on ACCERR. While ACCERR
is set, it is not possible to launch another command.
0 No access error detected
1 Access error has occurred
2
Flash Array Has Been Verified as Erased — The BLANK flag indicates that an erase verify command has
checked the Flash array and found it to be erased. The BLANK flag is cleared by hardware when CBEIF is
cleared as part of a new valid command write sequence. Writing to the BLANK flag has no effect on BLANK.
0 If an erase verify command has been requested, and the CCIF flag is set, then a 0 in BLANK indicates the
array is not erased
BLANK
1 Flash array verifies as erased
1
FAIL
Flag Indicating a Failed Flash Operation — In special modes, the FAIL flag will set if the erase verify operation
fails (Flash array verified as not erased). Writing a 0 to the FAIL flag has no effect on FAIL. The FAIL flag is cleared
by writing a 1 to FAIL. While FAIL is set, it is not possible to launch another command.
0 Flash operation completed without error
1 Flash operation failed
0
Flag Indicating a Failed Operation is not Active — In special modes, the DONE flag will clear if a program,
erase, or erase verify operation is active.
DONE
0 Flash operation is active
1 Flash operation is not active
17.3.2.7 Flash Command Register (FCMD)
The FCMD register defines the Flash commands.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
0
0
0
CMDB6
CMDB5
CMDB2
CMDB0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-11. Flash Command Register (FCMD)
Bits CMDB6, CMDB5, CMDB2, and CMDB0 are readable and writable during a command write
sequence while bits 7, 4, 3, and 1 read 0 and are not writable.
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Table 17-14. FCMD Field Descriptions
Field
Description
6, 5, 2, 0
Valid Flash commands are shown in Table 17-15. An attempt to execute any command other than those listed in
CMDB[6:5] Table 17-15 will set the ACCERR bit in the FSTAT register (see Section 17.3.2.6).
CMDB[2]
CMDB[0]
Table 17-15. Valid Flash Command List
CMDB
NVM Command
0x05
0x20
0x40
0x41
Erase verify
Word program
Sector erase
Mass erase
17.3.2.8 RESERVED2
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-12. RESERVED2
All bits read 0 and are not writable.
17.3.2.9 Flash Address Register (FADDR)
FADDRHI and FADDRLO are the Flash address registers.
\
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
0
0
FABHI
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-13. Flash Address High Register (FADDRHI)
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Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
FABLO
Reset
0
0
0
0
0
0
0
0
Figure 17-14. Flash Address Low Register (FADDRLO)
In normal modes, all FABHI and FABLO bits read 0 and are not writable. In special modes, the FABHI
and FABLO bits are readable and writable. For sector erase, the MCU address bits [8:0] are ignored. For
mass erase, any address within the Flash array is valid to start the command.
17.3.2.10 Flash Data Register (FDATA)
FDATAHI and FDATALO are the Flash data registers.
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
FDHI
Reset
0
0
0
0
0
0
0
0
Figure 17-15. Flash Data High Register (FDATAHI)
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
FDLO
W
Reset
0
0
0
0
0
0
0
0
Figure 17-16. Flash Data Low Register (FDATALO)
In normal modes, all FDATAHI and FDATALO bits read 0 and are not writable. In special modes, all
FDATAHI and FDATALO bits are readable and writable when writing to an address within the Flash
address range.
17.3.2.11 RESERVED3
This register is reserved for factory testing and is not accessible to the user.
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Module Base + 0x000C
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-17. RESERVED3
All bits read 0 and are not writable.
17.3.2.12 RESERVED4
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-18. RESERVED4
All bits read 0 and are not writable.
17.3.2.13 RESERVED5
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-19. RESERVED5
All bits read 0 and are not writable.
17.3.2.14 RESERVED6
This register is reserved for factory testing and is not accessible to the user.
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Module Base + 0x000F
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 17-20. RESERVED6
All bits read 0 and are not writable.
17.4 Functional Description
17.4.1 Flash Command Operations
Write operations are used for the program, erase, and erase verify algorithms described in this section. The
program and erase algorithms are controlled by a state machine whose timebase FCLK is derived from the
oscillator clock via a programmable divider. The FCMD register as well as the associated FADDR and
FDATA registers operate as a buffer and a register (2-stage FIFO) so that a new command along with the
necessary data and address can be stored to the buffer while the previous command is still in progress. This
pipelined operation allows a time optimization when programming more than one word on a specific row,
as the high voltage generation can be kept active in between two programming commands. The pipelined
operation also allows a simplification of command launching. Buffer empty as well as command
completion are signalled by flags in the FSTAT register with corresponding interrupts generated, if
enabled.
The next sections describe:
•
•
•
•
How to write the FCLKDIV register
Command write sequence used to program, erase or erase verify the Flash array
Valid Flash commands
Errors resulting from illegal Flash operations
17.4.1.1 Writing the FCLKDIV Register
Prior to issuing any Flash command after a reset, it is first necessary to write the FCLKDIV register to
divide the oscillator clock down to within the 150-kHz to 200-kHz range. Since the program and erase
timings are also a function of the bus clock, the FCLKDIV determination must take this information into
account.
If we define:
•
•
•
FCLK as the clock of the Flash timing control block
Tbus as the period of the bus clock
INT(x) as taking the integer part of x (e.g., INT(4.323) = 4),
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then FCLKDIV register bits PRDIV8 and FDIV[5:0] are to be set as described in Figure 17-21.
For example, if the oscillator clock frequency is 950 kHz and the bus clock is 10 MHz, FCLKDIV bits
FDIV[5:0] should be set to 4 (000100) and bit PRDIV8 set to 0. The resulting FCLK is then 190 kHz. As
a result, the Flash algorithm timings are increased over optimum target by:
(200 – 190) ⁄ 200 × 100 = 5%
Command execution time will increase proportionally with the period of FCLK.
CAUTION
Because of the impact of clock synchronization on the accuracy of the
functional timings, programming or erasing the Flash array cannot be
performed if the bus clock runs at less than 1 MHz. Programming or erasing
the Flash array with an input clock < 150 kHz should be avoided. Setting
FCLKDIV to a value such that FCLK < 150 kHz can destroy the Flash array
due to overstress. Setting FCLKDIV to a value such that (1/FCLK + Tbus)
< 5µs can result in incomplete programming or erasure of the Flash array
cells.
If the FCLKDIV register is written, the bit FDIVLD is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written
to, the Flash command loaded during a command write sequence will not execute and the ACCERR flag
in the FSTAT register will set.
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START
no
Tbus < 1ms?
yes
ALL COMMANDS IMPOSSIBLE
PRDIV8=0 (reset)
no
oscillator_clock
12.8MHz?
yes
PRDIV8=1
PRDCLK=oscillator_clock/8
PRDCLK=oscillator_clock
no
PRDCLK[MHz]*(5+Tbus[ms])
an integer?
FDIV[5:0]=INT(PRDCLK[MHz]*(5+Tbus[ms]))
yes
FDIV[5:0]=PRDCLK[MHz]*(5+Tbus[ms])-1
TRY TO DECREASE Tbus
FCLK=(PRDCLK)/(1+FDIV[5:0])
yes
1/FCLK[MHz] + Tbus[ms] > 5
AND
END
FCLK > 0.15MHz
?
no
yes
FDIV[5:0] > 4?
no
ALL COMMANDS IMPOSSIBLE
Figure 17-21. PRDIV8 and FDIV Bits Determination Procedure
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17.4.1.2 Command Write Sequence
The Flash command controller is used to supervise the command write sequence to execute program,
erase, and erase verify algorithms.
Before starting a command write sequence, the ACCERR and PVIOL flags in the FSTAT register must be
clear and the CBEIF flag should be tested to determine the state of the address, data, and command buffers.
If the CBEIF flag is set, indicating the buffers are empty, a new command write sequence can be started.
If the CBEIF flag is clear, indicating the buffers are not available, a new command write sequence will
overwrite the contents of the address, data, and command buffers.
A command write sequence consists of three steps which must be strictly adhered to with writes to the
Flash module not permitted between the steps. However, Flash register and array reads are allowed during
a command write sequence. The basic command write sequence is as follows:
1. Write to a valid address in the Flash array memory.
2. Write a valid command to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the command.
The address written in step 1 will be stored in the FADDR registers and the data will be stored in the
FDATA registers. When the CBEIF flag is cleared in step 3, the CCIF flag is cleared by the Flash command
controller indicating that the command was successfully launched. For all command write sequences, the
CBEIF flag will set after the CCIF flag is cleared indicating that the address, data, and command buffers
are ready for a new command write sequence to begin. A buffered command will wait for the active
operation to be completed before being launched. Once a command is launched, the completion of the
command operation is indicated by the setting of the CCIF flag in the FSTAT register. The CCIF flag will
set upon completion of all active and buffered commands.
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17.4.1.3 Valid Flash Commands
Table 17-16 summarizes the valid Flash commands along with the effects of the commands on the Flash
array.
Table 17-16. Valid Flash Commands
FCMD
Meaning
Function on Flash Array
Verify all bytes in the Flash array are erased.
0x05
Erase
Verify
If the Flash array is erased, the BLANK bit will set in the FSTAT register upon command completion.
0x20
0x40
Program
Program a word (2 bytes) in the Flash array.
Sector
Erase
Erase all 512 bytes in a sector of the Flash array.
0x41
Mass
Erase
Erase all bytes in the Flash array.
A mass erase of the full Flash array is only possible when FPLDIS, FPHDIS, and FPOPEN bits in
the FPROT register are set prior to launching the command.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
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17.4.1.3.1
Erase Verify Command
The erase verify operation will verify that a Flash array is erased.
An example flow to execute the erase verify operation is shown in Figure 17-22. The erase verify command
write sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the erase verify command.
The address and data written will be ignored.
2. Write the erase verify command, 0x05, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the erase verify
command.
After launching the erase verify command, the CCIF flag in the FSTAT register will set after the operation
has completed unless a new command write sequence has been buffered. Upon completion of the erase
verify operation, the BLANK flag in the FSTAT register will be set if all addresses in the Flash array are
verified to be erased. If any address in the Flash array is not erased, the erase verify operation will terminate
and the BLANK flag in the FSTAT register will remain clear.
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START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
Written
Check
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Array Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Erase Verify Command 0x05
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
no
CCIF
Set?
yes
Erase Verify
Status
BLANK
Set?
yes
Flash Array
Erased
Flash Array
EXIT
EXIT
Not Erased
Figure 17-22. Example Erase Verify Command Flow
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17.4.1.3.2
Program Command
The program operation will program a previously erased word in the Flash array using an embedded
algorithm.
An example flow to execute the program operation is shown in Figure 17-23. The program command write
sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the program command. The
data written will be programmed to the Flash array address written.
2. Write the program command, 0x20, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the program
command.
If a word to be programmed is in a protected area of the Flash array, the PVIOL flag in the FSTAT register
will set and the program command will not launch. Once the program command has successfully launched,
the CCIF flag in the FSTAT register will set after the program operation has completed unless a new
command write sequence has been buffered. By executing a new program command write sequence on
sequential words after the CBEIF flag in the FSTAT register has been set, up to 55% faster programming
time per word can be effectively achieved than by waiting for the CCIF flag to set after each program
operation.
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START
Read: FCLKDIV register
Clock Register
Written
Check
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Address
and program Data
1.
2.
3.
Write: FCMD register
Program Command 0x20
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Buffer Empty
Check
no
CBEIF
Set?
yes
Sequential
Programming
Decision
yes
Next
Word?
no
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 17-23. Example Program Command Flow
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17.4.1.3.3
Sector Erase Command
The sector erase operation will erase all addresses in a 512 byte sector of the Flash array using an
embedded algorithm.
An example flow to execute the sector erase operation is shown in Figure 17-24. The sector erase
command write sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the sector erase command.
The Flash address written determines the sector to be erased while MCU address bits [8:0] and the
data written are ignored.
2. Write the sector erase command, 0x40, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the sector erase
command.
If a Flash sector to be erased is in a protected area of the Flash array, the PVIOL flag in the FSTAT register
will set and the sector erase command will not launch. Once the sector erase command has successfully
launched, the CCIF flag in the FSTAT register will set after the sector erase operation has completed unless
a new command write sequence has been buffered.
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START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
Written
Check
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Sector Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Sector Erase Command 0x40
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 17-24. Example Sector Erase Command Flow
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17.4.1.3.4
Mass Erase Command
The mass erase operation will erase all addresses in a Flash array using an embedded algorithm.
An example flow to execute the mass erase operation is shown in Figure 17-25. The mass erase command
write sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the mass erase command.
The address and data written will be ignored.
2. Write the mass erase command, 0x41, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the mass erase
command.
If a Flash array to be erased contains any protected area, the PVIOL flag in the FSTAT register will set and
the mass erase command will not launch. Once the mass erase command has successfully launched, the
CCIF flag in the FSTAT register will set after the mass erase operation has completed unless a new
command write sequence has been buffered.
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START
Read: FCLKDIV register
Clock Register
Written
Check
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Block Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Mass Erase Command 0x41
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 17-25. Example Mass Erase Command Flow
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17.4.1.4 Illegal Flash Operations
17.4.1.4.1
Access Error
The ACCERR flag in the FSTAT register will be set during the command write sequence if any of the
following illegal Flash operations are performed causing the command write sequence to immediately
abort:
1. Writing to the Flash address space before initializing the FCLKDIV register
2. Writing a misaligned word or a byte to the valid Flash address space
3. Writing to the Flash address space while CBEIF is not set
4. Writing a second word to the Flash address space before executing a program or erase command
on the previously written word
5. Writing to any Flash register other than FCMD after writing a word to the Flash address space
6. Writing a second command to the FCMD register before executing the previously written
command
7. Writing an invalid command to the FCMD register
8. Writing to any Flash register other than FSTAT (to clear CBEIF) after writing to the FCMD register
9. The part enters stop mode and a program or erase command is in progress. The command is aborted
and any pending command is killed
10. When security is enabled, a command other than mass erase originating from a non-secure memory
or from the background debug mode is written to the FCMD register
11. A 0 is written to the CBEIF bit in the FSTAT register to abort a command write sequence.
The ACCERR flag will not be set if any Flash register is read during the command write sequence. If the
Flash array is read during execution of an algorithm (CCIF=0), the Flash module will return invalid data
and the ACCERR flag will not be set. If an ACCERR flag is set in the FSTAT register, the Flash command
controller is locked. It is not possible to launch another command until the ACCERR flag is cleared.
17.4.1.4.2
Protection Violation
The PVIOL flag in the FSTAT register will be set during the command write sequence after the word write
to the Flash address space if any of the following illegal Flash operations are performed, causing the
command write sequence to immediately abort:
1. Writing a Flash address to program in a protected area of the Flash array (see Section 17.3.2.5).
2. Writing a Flash address to erase in a protected area of the Flash array.
3. Writing the mass erase command to the FCMD register while any protection is enabled.
If the PVIOL flag is set, the Flash command controller is locked. It is not possible to launch another
command until the PVIOL flag is cleared.
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17.4.2 Operating Modes
17.4.2.1 Wait Mode
If the MCU enters wait mode while a Flash command is active (CCIF = 0), that command and any buffered
command will be completed.
The Flash module can recover the MCU from wait mode if the interrupts are enabled (see Section 17.4.5).
17.4.2.2 Stop Mode
If the MCU enters stop mode while a Flash command is active (CCIF = 0), that command will be aborted
and the data being programmed or erased is lost. The high voltage circuitry to the Flash array will be
switched off when entering stop mode. CCIF and ACCERR flags will be set. Upon exit from stop mode,
the CBEIF flag will be set and any buffered command will not be executed. The ACCERR flag must be
cleared before returning to normal operation.
NOTE
As active Flash commands are immediately aborted when the MCU enters
stop mode, it is strongly recommended that the user does not use the STOP
instruction during program and erase execution.
17.4.2.3 Background Debug Mode
In background debug mode (BDM), the FPROT register is writable. If the MCU is unsecured, then all
Flash commands listed in Table 17-16 can be executed. If the MCU is secured and is in special single chip
mode, the only possible command to execute is mass erase.
17.4.3 Flash Module Security
The Flash module provides the necessary security information to the MCU. After each reset, the Flash
module determines the security state of the MCU as defined in Section 17.3.2.2, “Flash Security Register
(FSEC)”.
The contents of the Flash security/options byte at address 0xFF0F in the Flash configuration field must be
changed directly by programming address 0xFF0F when the device is unsecured and the higher address
sector is unprotected. If the Flash security/options byte is left in the secure state, any reset will cause the
MCU to return to the secure operating mode.
17.4.3.1 Unsecuring the MCU using Backdoor Key Access
The MCU may only be unsecured by using the backdoor key access feature which requires knowledge of
the contents of the backdoor key (four 16-bit words programmed at addresses 0xFF00–0xFF07). If
KEYEN[1:0] = 1:0 and the KEYACC bit is set, a write to a backdoor key address in the Flash array triggers
a comparison between the written data and the backdoor key data stored in the Flash array. If all four words
of data are written to the correct addresses in the correct order and the data matches the backdoor key
stored in the Flash array, the MCU will be unsecured. The data must be written to the backdoor key
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addresses sequentially staring with 0xFF00-0xFF01 and ending with 0xFF06–0xFF07. The values 0x0000
and 0xFFFF are not permitted as keys. When the KEYACC bit is set, reads of the Flash array will return
invalid data.
The user code stored in the Flash array must have a method of receiving the backdoor key from an external
stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If KEYEN[1:0] = 1:0 in the FSEC register, the MCU can be unsecured by the backdoor key access
sequence described below:
1. Set the KEYACC bit in the FCNFG register
2. Write the correct four 16-bit words to Flash addresses 0xFF00–0xFF07 sequentially starting with
0xFF00
3. Clear the KEYACC bit in the FCNFG register
4. If all four 16-bit words match the backdoor key stored in Flash addresses 0xFF00–0xFF07, the
MCU is unsecured and bits SEC[1:0] in the FSEC register are forced to the unsecure state of 1:0
The backdoor key access sequence is monitored by the internal security state machine. An illegal operation
during the backdoor key access sequence will cause the security state machine to lock, leaving the MCU
in the secured state. A reset of the MCU will cause the security state machine to exit the lock state and
allow a new backdoor key access sequence to be attempted. The following illegal operations will lock the
security state machine:
1. If any of the four 16-bit words does not match the backdoor key programmed in the Flash array
2. If the four 16-bit words are written in the wrong sequence
3. If more than four 16-bit words are written
4. If any of the four 16-bit words written are 0x0000 or 0xFFFF
5. If the KEYACC bit does not remain set while the four 16-bit words are written
After the backdoor key access sequence has been correctly matched, the MCU will be unsecured. The
Flash security byte can be programmed to the unsecure state, if desired.
In the unsecure state, the user has full control of the contents of the four word backdoor key by
programming bytes 0xFF00–0xFF07 of the Flash configuration field.
The security as defined in the Flash security/options byte at address 0xFF0F is not changed by using the
backdoor key access sequence to unsecure. The backdoor key stored in addresses 0xFF00–0xFF07 is
unaffected by the backdoor key access sequence. After the next reset sequence, the security state of the
Flash module is determined by the Flash security/options byte at address 0xFF0F. The backdoor key access
sequence has no effect on the program and erase protection defined in the FPROT register.
It is not possible to unsecure the MCU in special single chip mode by executing the backdoor key access
sequence in background debug mode.
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17.4.4 Flash Reset Sequence
On each reset, the Flash module executes a reset sequence to hold CPU activity while loading the following
registers from the Flash array memory according to Table 17-1:
•
•
FPROT — Flash Protection Register (see Section 17.3.2.5)
FSEC — Flash Security Register (see Section 17.3.2.2)
17.4.4.1 Reset While Flash Command Active
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/array being erased is not guaranteed.
17.4.5 Interrupts
The Flash module can generate an interrupt when all Flash commands have completed execution or the
Flash address, data, and command buffers are empty.
Table 17-17. Flash Interrupt Sources
Interrupt Source
Interrupt Flag
Local Enable
Global (CCR) Mask
Flash Address, Data, and Command
Buffers are empty
CBEIF
(FSTAT register)
CBEIE
I Bit
All Flash commands have completed
execution
CCIF
(FSTAT register)
CCIE
I Bit
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
17.4.5.1 Description of Interrupt Operation
Figure 17-26 shows the logic used for generating interrupts.
The Flash module uses the CBEIF and CCIF flags in combination with the enable bits CBIE and CCIE to
discriminate for the generation of interrupts.
CBEIF
CBEIE
FLASH INTERRUPT REQUEST
CCIF
CCIE
Figure 17-26. Flash Interrupt Implementation
For a detailed description of these register bits, refer to Section 17.3.2.4, “Flash Configuration Register
(FCNFG)” and Section 17.3.2.6, “Flash Status Register (FSTAT)”.
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Chapter 18
64 Kbyte Flash Module (S12FTS64KV4)
18.1 Introduction
The FTS64K module implements a 64 Kbyte Flash (nonvolatile) memory. The Flash memory contains one
array of 64 Kbytes organized as 512 rows of 128 bytes with an erase sector size of eight rows (1024 bytes).
The Flash array may be read as either bytes, aligned words, or misaligned words. Read access time is one
bus cycle for byte and aligned word, and two bus cycles for misaligned words.
The Flash array is ideal for program and data storage for single-supply applications allowing for field
reprogramming without requiring external voltage sources for program or erase. Program and erase
functions are controlled by a command driven interface. The Flash module supports both mass erase and
sector erase. An erased bit reads 1 and a programmed bit reads 0. The high voltage required to program
and erase is generated internally. It is not possible to read from a Flash array while it is being erased or
programmed.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
18.1.1 Glossary
Command Write Sequence — A three-step MCU instruction sequence to program, erase, or erase verify
the Flash array memory.
18.1.2 Features
•
•
•
•
•
•
•
•
64 Kbytes of Flash memory comprised of one 64 Kbyte array divided into 64 sectors of 1024 bytes
Automated program and erase algorithm
Interrupts on Flash command completion and command buffer empty
Fast sector erase and word program operation
2-stage command pipeline for faster multi-word program times
Flexible protection scheme to prevent accidental program or erase
Single power supply for Flash program and erase operations
Security feature to prevent unauthorized access to the Flash array memory
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18.1.3 Modes of Operation
See Section 18.4.2, “Operating Modes” for a description of the Flash module operating modes. For
program and erase operations, refer to Section 18.4.1, “Flash Command Operations”.
18.1.4 Block Diagram
Figure 18-1 shows a block diagram of the FTS64K module.
FTS64K
Flash
Interface
Command
Complete
Command Pipeline
Interrupt
Flash Array
cmd1
addr1
data1
cmd2
addr2
data2
32K * 16 Bits
Command
Buffer Empty
Interrupt
sector 0
sector 1
Registers
Protection
Security
sector 63
Oscillator
Clock
Clock
Divider
FCLK
Figure 18-1. FTS64K Block Diagram
18.2 External Signal Description
The FTS64K module contains no signals that connect off-chip.
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Chapter 18 64 Kbyte Flash Module (S12FTS64KV4)
18.3 Memory Map and Registers
This section describes the FTS64K memory map and registers.
18.3.1 Module Memory Map
The FTS64K memory map is shown in Figure 18-2. The HCS12 architecture places the Flash array
addresses between 0x4000 and 0xFFFF, which corresponds to three 16 Kbyte pages. The content of the
HCS12 Core PPAGE register is used to map the logical middle page ranging from address 0x8000 to
1
0xBFFF to any physical 16K byte page in the Flash array memory. The FPROT register (see Section
18.3.2.5) can be set to globally protect the entire Flash array. Three separate areas, one starting from the
Flash array starting address (called lower) towards higher addresses, one growing downward from the
Flash array end address (called higher), and the remaining addresses, can be activated for protection. The
Flash array addresses covered by these protectable regions are shown in Figure 18-2. The higher address
area is mainly targeted to hold the boot loader code since it covers the vector space. The lower address area
can be used for EEPROM emulation in an MCU without an EEPROM module since it can be left
unprotected while the remaining addresses are protected from program or erase. Default protection
settings as well as security information that allows the MCU to restrict access to the Flash module are
stored in the Flash configuration field described in Table 18-1.
Table 18-1. Flash Configuration Field
Size
Flash Address
Description
(bytes)
0xFF00–0xFF07
0xFF08–0xFF0C
0xFF0D
8
5
1
Backdoor Key to unlock security
Reserved
Flash Protection byte
Refer to Section 18.3.2.5, “Flash Protection Register (FPROT)”
0xFF0E
0xFF0F
1
1
Reserved
Flash Security/Options byte
Refer to Section 18.3.2.2, “Flash Security Register (FSEC)”
1. By placing 0x3E/0x3F in the HCS12 Core PPAGE register, the bottom/top fixed 16 Kbyte pages can be seen twice in the MCU
memory map.
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MODULE BASE + 0x0000
Flash Registers
16 bytes
MODULE BASE + 0x000F
FLASH_START = 0x4000
0x4400
0x4800
Flash Protected Low Sectors
1, 2, 4, 8 Kbytes
0x5000
0x6000
0x3E
Flash Array
0x8000
16K PAGED
MEMORY
0x3C 0x3D 003E 0x3F
0xC000
Flash Protected High Sectors
2, 4, 8, 16 Kbytes
0xE000
0xF000
0x3F
0xF800
FLASH_END = 0xFFFF
0xFF00–0xFF0F (Flash Configuration Field)
Note: 0x3C–0x3F correspond to the PPAGE register content
Figure 18-2. Flash Memory Map
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Table 18-2. Flash Array Memory Map Summary
MCU Address
Range
Protectable
Low Range
Protectable
High Range
Array Relative
Address(1)
PPAGE
0x0000–0x3FFF(2)
Unpaged
(0x3D)
N.A.
N.A.
0x14000–0x17FFF
0x4000–0x7FFF
Unpaged
(0x3E)
0x4000–0x43FF
0x4000–0x47FF
0x4000–0x4FFF
0x4000–0x5FFF
N.A.
N.A.
0x18000–0x1BFFF
0x8000–0xBFFF
0x3C
0x3D
0x3E
N.A.
N.A.
N.A.
0x10000–0x13FFF
0x14000–0x17FFF
0x18000–0x1BFFF
N.A.
0x8000–0x83FF
0x8000–0x87FF
0x8000–0x8FFF
0x8000–0x9FFF
N.A.
0x3F
0xB800–0xBFFF
0xB000–0xBFFF
0xA000–0xBFFF
0x8000–0xBFFF
0xF800–0xFFFF
0xF000–0xFFFF
0xE000–0xFFFF
0xC000–0xFFFF
0x1C000–0x1FFFF
0x1C000–0x1FFFF
0xC000–0xFFFF
Unpaged
(0x3F)
N.A.
1. Inside Flash block.
2. If allowed by MCU.
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18.3.2 Register Descriptions
The Flash module contains a set of 16 control and status registers located between module base + 0x0000
and 0x000F. A summary of the Flash module registers is given in Figure 18-3. Detailed descriptions of
each register bit are provided.
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
W
R
FDIVLD
0x0000
FCLKDIV
PRDIV8
KEYEN0
FDIV5
NV5
FDIV4
NV4
FDIV3
NV3
FDIV2
NV2
FDIV1
SEC1
FDIV0
SEC0
KEYEN1
0
0x0001
FSEC
W
R
0x0002
0
0
0
0
0
0
0
0
0
0
RESERVED1
W
(1)
R
W
R
0
0
0x0003
FCNFG
CBEIE
CCIE
KEYACC
FPHDIS
PVIOL
0x0004
FPROT
FPOPEN
NV6
FPHS1
FPHS0
0
FPLDIS
BLANK
FPLS1
FPLS0
DONE
W
R
CCIF
0x0005
FSTAT
CBEIF
0
ACCERR
0
FAIL
0
W
R
0
0
0x0006
FCMD
CMDB6
0
CMDB5
0
CMDB2
0
CMDB0
0
W
R
0
0
0
0
0x0007
RESERVED21
W
R
0x0008
FABHI
FADDRHI1
W
R
0x0009
FABLO
FADDRLO1
W
R
0x000A
FDHI
FDATAHI1
W
R
0x000B
FDLO
FDATALO1
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x000C
RESERVED31
W
R
0x000D
RESERVED41
W
R
0x000E
RESERVED51
W
R
0x000F
RESERVED61
W
= Unimplemented or Reserved
Figure 18-3. Flash Register Summary
1. Intended for factory test purposes only.
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18.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
FDIVLD
PRDIV8
FDIV5
FDIV4
FDIV3
FDIV2
FDIV1
FDIV0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-4. Flash Clock Divider Register (FCLKDIV)
All bits in the FCLKDIV register are readable, bits 6–0 are write once and bit 7 is not writable.
Table 18-3. FCLKDIV Field Descriptions
Field
Description
7
Clock Divider Loaded
FDIVLD
0 FCLKDIV register has not been written
1 FCLKDIV register has been written to since the last reset
6
Enable Prescalar by 8
PRDIV8
0 The oscillator clock is directly fed into the Flash clock divider
1 The oscillator clock is divided by 8 before feeding into the Flash clock divider
5–0
Clock Divider Bits — The combination of PRDIV8 and FDIV[5:0] must divide the oscillator clock down to a
FDIV[5:0] frequency of 150 kHz – 200 kHz. The maximum divide ratio is 512. Refer to Section 18.4.1.1, “Writing the
FCLKDIV Register” for more information.
18.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
KEYEN1
KEYEN0
NV5
NV4
NV3
NV2
SEC1
SEC0
Reset
F
F
F
F
F
F
F
F
= Unimplemented or Reserved
Figure 18-5. Flash Security Register (FSEC)
All bits in the FSEC register are readable but not writable.
The FSEC register is loaded from the Flash configuration field at 0xFF0F during the reset sequence,
indicated by F in Figure 18-5.
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Table 18-4. FSEC Field Descriptions
Field
Description
7–6
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of the backdoor key access
KEYEN[1:0] to the Flash module as shown in Table 18-5.
5–2
Nonvolatile Flag Bits — The NV[5:2] bits are available to the user as nonvolatile flags.
NV[5:2]
1–0
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 18-6. If the
SEC[1:0]
Flash module is unsecured using backdoor key access, the SEC[1:0] bits are forced to 1:0.
Table 18-5. Flash KEYEN States
KEYEN[1:0]
Status of Backdoor Key Access
00
01(1)
10
DISABLED
DISABLED
ENABLED
DISABLED
11
1. Preferred KEYEN state to disable Backdoor Key Access.
Table 18-6. Flash Security States
SEC[1:0]
Status of Security
00
01(1)
10
Secured
Secured
Unsecured
11
Secured
1. Preferred SEC state to set MCU to secured state.
The security function in the Flash module is described in Section 18.4.3, “Flash Module Security”.
18.3.2.3 RESERVED1
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-6. RESERVED1
All bits read 0 and are not writable.
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18.3.2.4 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash interrupts and gates the security backdoor key writes.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
CBEIE
CCIE
KEYACC
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-7. Flash Configuration Register (FCNFG)
CBEIE, CCIE, and KEYACC are readable and writable while remaining bits read 0 and are not writable.
KEYACC is only writable if the KEYEN bit in the FSEC register is set to the enabled state (see Section
18.3.2.2).
Table 18-7. FCNFG Field Descriptions
Field
Description
7
Command Buffer Empty Interrupt Enable — The CBEIE bit enables the interrupts in case of an empty
command buffer in the Flash module.
CBEIE
0 Command Buffer Empty interrupts disabled
1 An interrupt will be requested whenever the CBEIF flag is set (see Section 18.3.2.6)
6
Command Complete Interrupt Enable — The CCIE bit enables the interrupts in case of all commands being
completed in the Flash module.
CCIE
0 Command Complete interrupts disabled
1 An interrupt will be requested whenever the CCIF flag is set (see Section 18.3.2.6)
5
Enable Security Key Writing.
KEYACC
0 Flash writes are interpreted as the start of a command write sequence
1 Writes to the Flash array are interpreted as a backdoor key while reads of the Flash array return invalid data
18.3.2.5 Flash Protection Register (FPROT)
The FPROT register defines which Flash sectors are protected against program or erase.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
FPOPEN
NV6
FPHDIS
FPHS1
FPHS0
FPLDIS
FPLS1
FPLS0
Reset
F
F
F
F
F
F
F
F
Figure 18-8. Flash Protection Register (FPROT)
The FPROT register is readable in normal and special modes. FPOPEN can only be written from a 1 to a 0.
FPLS[1:0] can be written anytime until FPLDIS is cleared. FPHS[1:0] can be written anytime until
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FPHDIS is cleared. The FPROT register is loaded from Flash address 0xFF0D during the reset sequence,
indicated by F in Figure 18-8.
To change the Flash protection that will be loaded on reset, the upper sector of the Flash array must be
unprotected, then the Flash protection byte located at Flash address 0xFF0D must be written to.
A protected Flash sector is disabled by FPHDIS and FPLDIS while the size of the protected sector is
defined by FPHS[1:0] and FPLS[1:0] in the FPROT register.
Trying to alter any of the protected areas will result in a protect violation error and the PVIOL flag will be
set in the FSTAT register (see Section 18.3.2.6). A mass erase of the whole Flash array is only possible
when protection is fully disabled by setting the FPOPEN, FPLDIS, and FPHDIS bits. An attempt to mass
erase a Flash array while protection is enabled will set the PVIOL flag in the FSTAT register.
Table 18-8. FPROT Field Descriptions
Field
Description
7
Protection Function for Program or Erase — It is possible using the FPOPEN bit to either select address
FPOPEN ranges to be protected using FPHDIS, FPLDIS, FPHS[1:0] and FPLS[1:0] or to select the same ranges to be
unprotected. When FPOPEN is set, FPxDIS enables the ranges to be protected, whereby clearing FPxDIS
enables protection for the range specified by the corresponding FPxS[1:0] bits. When FPOPEN is cleared,
FPxDIS defines unprotected ranges as specified by the corresponding FPxS[1:0] bits. In this case, setting
FPxDIS enables protection. Thus the effective polarity of the FPxDIS bits is swapped by the FPOPEN bit as
shown in Table 18-9. This function allows the main part of the Flash array to be protected while a small range
can remain unprotected for EEPROM emulation.
0 The FPHDIS and FPLDIS bits define Flash address ranges to be unprotected
1 The FPHDIS and FPLDIS bits define Flash address ranges to be protected
6
Nonvolatile Flag Bit — The NV6 bit should remain in the erased state for future enhancements.
NV6
5
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in the higher space of the Flash address map.
0 Protection/unprotection enabled
FPHDIS
1 Protection/unprotection disabled
4–3
Flash Protection Higher Address Size — The FPHS[1:0] bits determine the size of the protected/unprotected
FPHS[1:0] sector as shown in Table 18-10. The FPHS[1:0] bits can only be written to while the FPHDIS bit is set.
2
Flash Protection Lower Address Range Disable — The FPLDIS bit determines whether there is a
protected/unprotected sector in the lower space of the Flash address map.
0 Protection/unprotection enabled
FPLDIS
1 Protection/unprotection disabled
1–0
Flash Protection Lower Address Size — The FPLS[1:0] bits determine the size of the protected/unprotected
FPLS[1:0] sector as shown in Table 18-11. The FPLS[1:0] bits can only be written to while the FPLDIS bit is set.
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Table 18-9. Flash Protection Function
FPOPEN FPHDIS FPHS[1] FPHS[0] FPLDIS FPLS[1] FPLS[0]
Function(1)
No protection
1
1
1
1
0
0
0
0
1
1
0
0
1
0
1
0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
1
0
1
0
1
1
0
0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Protect low range
Protect high range
Protect high and low ranges
Full Flash array protected
Unprotected high range
Unprotected low range
Unprotected high and low ranges
1. For range sizes refer to Table 18-10 and Table 18-11 or .
Table 18-10. Flash Protection Higher Address Range
FPHS[1:0]
Address Range
Range Size
00
01
10
11
0xF800–0xFFFF
0xF000–0xFFFF
0xE000–0xFFFF
0xC000–0xFFFF
2 Kbytes
4 Kbytes
8 Kbytes
16 Kbytes
Table 18-11. Flash Protection Lower Address Range
FPLS[1:0]
Address Range
Range Size
00
01
10
11
0x4000–0x43FF
0x4000–0x47FF
0x4000–0x4FFF
0x4000–0x5FFF
1 Kbyte
2 Kbytes
4 Kbytes
8 Kbytes
Figure 18-9 illustrates all possible protection scenarios. Although the protection scheme is loaded from the
Flash array after reset, it is allowed to change in normal modes. This protection scheme can be used by
applications requiring re-programming in single chip mode while providing as much protection as possible
if no re-programming is required.
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FPHDIS = 1
FPLDIS = 1
FPHDIS = 1
FPLDIS = 0
6
FPHDIS = 0
FPLDIS = 1
5
FPHDIS = 0
FPLDIS = 0
4
Scenario
7
0xFFFF
Scenario
3
2
1
0
0xFFFF
Protected Flash
Figure 18-9. Flash Protection Scenarios
18.3.2.5.1
Flash Protection Restrictions
The general guideline is that protection can only be added, not removed. All valid transitions between
Flash protection scenarios are specified in Table 18-12. Any attempt to write an invalid scenario to the
FPROT register will be ignored and the FPROT register will remain unchanged. The contents of the
FPROT register reflect the active protection scenario.
Table 18-12. Flash Protection Scenario Transitions
From
To Protection Scenario(1)
Protection
Scenario
0
1
2
3
4
5
6
7
0
1
2
3
4
5
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
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Chapter 18 64 Kbyte Flash Module (S12FTS64KV4)
Table 18-12. Flash Protection Scenario Transitions
From
To Protection Scenario(1)
Protection
Scenario
0
1
2
3
4
5
6
7
6
7
X
X
X
X
X
X
X
X
X
X
X
X
1. Allowed transitions marked with X.
18.3.2.6 Flash Status Register (FSTAT)
The FSTAT register defines the status of the Flash command controller and the results of command
execution.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
CCIF
0
BLANK
DONE
CBEIF
PVIOL
ACCERR
FAIL
Reset
1
1
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 18-10. Flash Status Register (FSTAT)
In normal modes, bits CBEIF, PVIOL, and ACCERR are readable and writable, bits CCIF and BLANK
are readable and not writable, remaining bits, including FAIL and DONE, read 0 and are not writable. In
special modes, FAIL is readable and writable while DONE is readable but not writable. FAIL must be clear
in special modes when starting a command write sequence.
Table 18-13. FSTAT Field Descriptions
Field
Description
7
Command Buffer Empty Interrupt Flag — The CBEIF flag indicates that the address, data and command
buffers are empty so that a new command write sequence can be started. The CBEIF flag is cleared by writing
a 1 to CBEIF. Writing a 0 to the CBEIF flag has no effect on CBEIF. Writing a 0 to CBEIF after writing an aligned
word to the Flash address space but before CBEIF is cleared will abort a command write sequence and cause
the ACCERR flag in the FSTAT register to be set. Writing a 0 to CBEIF outside of a command write sequence
will not set the ACCERR flag. The CBEIF flag is used together with the CBEIE bit in the FCNFG register to
generate an interrupt request (see Figure 18-26).
CBEIF
0 Buffers are full
1 Buffers are ready to accept a new command
6
Command Complete Interrupt Flag — The CCIF flag indicates that there are no more commands pending. The
CCIF flag is cleared when CBEIF is clear and sets automatically upon completion of all active and pending
commands. The CCIF flag does not set when an active commands completes and a pending command is
fetched from the command buffer. Writing to the CCIF flag has no effect. The CCIF flag is used together with the
CCIE bit in the FCNFG register to generate an interrupt request (see Figure 18-26).
0 Command in progress
CCIF
1 All commands are completed
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Table 18-13. FSTAT Field Descriptions
Field
Description
5
Protection Violation — The PVIOL flag indicates an attempt was made to program or erase an address in a
protected Flash array memory area. The PVIOL flag is cleared by writing a 1 to PVIOL. Writing a 0 to the PVIOL
flag has no effect on PVIOL. While PVIOL is set, it is not possible to launch another command.
0 No protection violation detected
PVIOL
1 Protection violation has occurred
4
Access Error — The ACCERR flag indicates an illegal access to the Flash array caused by either a violation of
ACCERR the command write sequence, issuing an illegal command (illegal combination of the CMDBx bits in the FCMD
register) or the execution of a CPU STOP instruction while a command is executing (CCIF=0). The ACCERR flag
is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR flag has no effect on ACCERR. While ACCERR
is set, it is not possible to launch another command.
0 No access error detected
1 Access error has occurred
2
Flash Array Has Been Verified as Erased — The BLANK flag indicates that an erase verify command has
checked the Flash array and found it to be erased. The BLANK flag is cleared by hardware when CBEIF is
cleared as part of a new valid command write sequence. Writing to the BLANK flag has no effect on BLANK.
0 If an erase verify command has been requested, and the CCIF flag is set, then a 0 in BLANK indicates the
array is not erased
BLANK
1 Flash array verifies as erased
1
FAIL
Flag Indicating a Failed Flash Operation — In special modes, the FAIL flag will set if the erase verify operation
fails (Flash array verified as not erased). Writing a 0 to the FAIL flag has no effect on FAIL. The FAIL flag is cleared
by writing a 1 to FAIL. While FAIL is set, it is not possible to launch another command.
0 Flash operation completed without error
1 Flash operation failed
0
Flag Indicating a Failed Operation is not Active — In special modes, the DONE flag will clear if a program,
erase, or erase verify operation is active.
DONE
0 Flash operation is active
1 Flash operation is not active
18.3.2.7 Flash Command Register (FCMD)
The FCMD register defines the Flash commands.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
0
0
0
CMDB6
CMDB5
CMDB2
CMDB0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-11. Flash Command Register (FCMD)
Bits CMDB6, CMDB5, CMDB2, and CMDB0 are readable and writable during a command write
sequence while bits 7, 4, 3, and 1 read 0 and are not writable.
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Table 18-14. FCMD Field Descriptions
Field
Description
6, 5, 2, 0
Valid Flash commands are shown in Table 18-15. An attempt to execute any command other than those listed in
CMDB[6:5] Table 18-15 will set the ACCERR bit in the FSTAT register (see Section 18.3.2.6).
CMDB[2]
CMDB[0]
Table 18-15. Valid Flash Command List
CMDB
NVM Command
0x05
0x20
0x40
0x41
Erase verify
Word program
Sector erase
Mass erase
18.3.2.8 RESERVED2
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-12. RESERVED2
All bits read 0 and are not writable.
18.3.2.9 Flash Address Register (FADDR)
FADDRHI and FADDRLO are the Flash address registers.
\
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
0
FABHI
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-13. Flash Address High Register (FADDRHI)
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Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
FABLO
Reset
0
0
0
0
0
0
0
0
Figure 18-14. Flash Address Low Register (FADDRLO)
In normal modes, all FABHI and FABLO bits read 0 and are not writable. In special modes, the FABHI
and FABLO bits are readable and writable. For sector erase, the MCU address bits [9:0] are ignored. For
mass erase, any address within the Flash array is valid to start the command.
18.3.2.10 Flash Data Register (FDATA)
FDATAHI and FDATALO are the Flash data registers.
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
FDHI
Reset
0
0
0
0
0
0
0
0
Figure 18-15. Flash Data High Register (FDATAHI)
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
FDLO
W
Reset
0
0
0
0
0
0
0
0
Figure 18-16. Flash Data Low Register (FDATALO)
In normal modes, all FDATAHI and FDATALO bits read 0 and are not writable. In special modes, all
FDATAHI and FDATALO bits are readable and writable when writing to an address within the Flash
address range.
18.3.2.11 RESERVED3
This register is reserved for factory testing and is not accessible to the user.
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Module Base + 0x000C
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-17. RESERVED3
All bits read 0 and are not writable.
18.3.2.12 RESERVED4
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-18. RESERVED4
All bits read 0 and are not writable.
18.3.2.13 RESERVED5
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-19. RESERVED5
All bits read 0 and are not writable.
18.3.2.14 RESERVED6
This register is reserved for factory testing and is not accessible to the user.
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Module Base + 0x000F
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 18-20. RESERVED6
All bits read 0 and are not writable.
18.4 Functional Description
18.4.1 Flash Command Operations
Write operations are used for the program, erase, and erase verify algorithms described in this section. The
program and erase algorithms are controlled by a state machine whose timebase FCLK is derived from the
oscillator clock via a programmable divider. The FCMD register as well as the associated FADDR and
FDATA registers operate as a buffer and a register (2-stage FIFO) so that a new command along with the
necessary data and address can be stored to the buffer while the previous command is still in progress. This
pipelined operation allows a time optimization when programming more than one word on a specific row,
as the high voltage generation can be kept active in between two programming commands. The pipelined
operation also allows a simplification of command launching. Buffer empty as well as command
completion are signalled by flags in the FSTAT register with corresponding interrupts generated, if
enabled.
The next sections describe:
•
•
•
•
How to write the FCLKDIV register
Command write sequence used to program, erase or erase verify the Flash array
Valid Flash commands
Errors resulting from illegal Flash operations
18.4.1.1 Writing the FCLKDIV Register
Prior to issuing any Flash command after a reset, it is first necessary to write the FCLKDIV register to
divide the oscillator clock down to within the 150-kHz to 200-kHz range. Since the program and erase
timings are also a function of the bus clock, the FCLKDIV determination must take this information into
account.
If we define:
•
•
•
FCLK as the clock of the Flash timing control block
Tbus as the period of the bus clock
INT(x) as taking the integer part of x (e.g., INT(4.323) = 4),
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then FCLKDIV register bits PRDIV8 and FDIV[5:0] are to be set as described in Figure 18-21.
For example, if the oscillator clock frequency is 950 kHz and the bus clock is 10 MHz, FCLKDIV bits
FDIV[5:0] should be set to 4 (000100) and bit PRDIV8 set to 0. The resulting FCLK is then 190 kHz. As
a result, the Flash algorithm timings are increased over optimum target by:
(200 – 190) ⁄ 200 × 100 = 5%
Command execution time will increase proportionally with the period of FCLK.
CAUTION
Because of the impact of clock synchronization on the accuracy of the
functional timings, programming or erasing the Flash array cannot be
performed if the bus clock runs at less than 1 MHz. Programming or erasing
the Flash array with an input clock < 150 kHz should be avoided. Setting
FCLKDIV to a value such that FCLK < 150 kHz can destroy the Flash array
due to overstress. Setting FCLKDIV to a value such that (1/FCLK + Tbus)
< 5µs can result in incomplete programming or erasure of the Flash array
cells.
If the FCLKDIV register is written, the bit FDIVLD is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written
to, the Flash command loaded during a command write sequence will not execute and the ACCERR flag
in the FSTAT register will set.
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START
no
Tbus < 1µs?
ALL COMMANDS IMPOSSIBLE
yes
PRDIV8=0 (reset)
no
oscillator_clock
12.8MHz?
yes
PRDIV8=1
PRDCLK=oscillator_clock/8
PRDCLK=oscillator_clock
no
PRDCLK[MHz]*(5+Tbus[µs])
an integer?
FDIV[5:0]=INT(PRDCLK[MHz]*(5+Tbus[µs]))
yes
FDIV[5:0]=PRDCLK[MHz]*(5+Tbus[µs])-1
TRY TO DECREASE Tbus
FCLK=(PRDCLK)/(1+FDIV[5:0])
yes
1/FCLK[MHz] + Tbus[µs] > 5
END
AND
FCLK > 0.15MHz
?
no
yes
FDIV[5:0] > 4?
no
ALL COMMANDS IMPOSSIBLE
Figure 18-21. PRDIV8 and FDIV Bits Determination Procedure
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18.4.1.2 Command Write Sequence
The Flash command controller is used to supervise the command write sequence to execute program,
erase, and erase verify algorithms.
Before starting a command write sequence, the ACCERR and PVIOL flags in the FSTAT register must be
clear and the CBEIF flag should be tested to determine the state of the address, data, and command buffers.
If the CBEIF flag is set, indicating the buffers are empty, a new command write sequence can be started.
If the CBEIF flag is clear, indicating the buffers are not available, a new command write sequence will
overwrite the contents of the address, data, and command buffers.
A command write sequence consists of three steps which must be strictly adhered to with writes to the
Flash module not permitted between the steps. However, Flash register and array reads are allowed during
a command write sequence. The basic command write sequence is as follows:
1. Write to a valid address in the Flash array memory.
2. Write a valid command to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the command.
The address written in step 1 will be stored in the FADDR registers and the data will be stored in the
FDATA registers. When the CBEIF flag is cleared in step 3, the CCIF flag is cleared by the Flash command
controller indicating that the command was successfully launched. For all command write sequences, the
CBEIF flag will set after the CCIF flag is cleared indicating that the address, data, and command buffers
are ready for a new command write sequence to begin. A buffered command will wait for the active
operation to be completed before being launched. Once a command is launched, the completion of the
command operation is indicated by the setting of the CCIF flag in the FSTAT register. The CCIF flag will
set upon completion of all active and buffered commands.
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18.4.1.3 Valid Flash Commands
Table 18-16 summarizes the valid Flash commands along with the effects of the commands on the Flash
array.
Table 18-16. Valid Flash Commands
FCMD
Meaning
Function on Flash Array
Verify all bytes in the Flash array are erased.
0x05
Erase
Verify
If the Flash array is erased, the BLANK bit will set in the FSTAT register upon command completion.
0x20
0x40
Program
Program a word (2 bytes) in the Flash array.
Sector
Erase
Erase all 1024 bytes in a sector of the Flash array.
0x41
Mass
Erase
Erase all bytes in the Flash array.
A mass erase of the full Flash array is only possible when FPLDIS, FPHDIS, and FPOPEN bits in
the FPROT register are set prior to launching the command.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
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18.4.1.3.1
Erase Verify Command
The erase verify operation will verify that a Flash array is erased.
An example flow to execute the erase verify operation is shown in Figure 18-22. The erase verify command
write sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the erase verify command.
The address and data written will be ignored.
2. Write the erase verify command, 0x05, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the erase verify
command.
After launching the erase verify command, the CCIF flag in the FSTAT register will set after the operation
has completed unless a new command write sequence has been buffered. Upon completion of the erase
verify operation, the BLANK flag in the FSTAT register will be set if all addresses in the Flash array are
verified to be erased. If any address in the Flash array is not erased, the erase verify operation will terminate
and the BLANK flag in the FSTAT register will remain clear.
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START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
Written
Check
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Array Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Erase Verify Command 0x05
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
no
CCIF
Set?
yes
Erase Verify
Status
BLANK
Set?
yes
Flash Array
Erased
Flash Array
EXIT
EXIT
Not Erased
Figure 18-22. Example Erase Verify Command Flow
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18.4.1.3.2
Program Command
The program operation will program a previously erased word in the Flash array using an embedded
algorithm.
An example flow to execute the program operation is shown in Figure 18-23. The program command write
sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the program command. The
data written will be programmed to the Flash array address written.
2. Write the program command, 0x20, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the program
command.
If a word to be programmed is in a protected area of the Flash array, the PVIOL flag in the FSTAT register
will set and the program command will not launch. Once the program command has successfully launched,
the CCIF flag in the FSTAT register will set after the program operation has completed unless a new
command write sequence has been buffered. By executing a new program command write sequence on
sequential words after the CBEIF flag in the FSTAT register has been set, up to 55% faster programming
time per word can be effectively achieved than by waiting for the CCIF flag to set after each program
operation.
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START
Read: FCLKDIV register
Clock Register
Written
Check
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Address
and program Data
1.
2.
3.
Write: FCMD register
Program Command 0x20
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Buffer Empty
Check
no
CBEIF
Set?
yes
Sequential
Programming
Decision
yes
Next
Word?
no
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 18-23. Example Program Command Flow
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18.4.1.3.3
Sector Erase Command
The sector erase operation will erase all addresses in a 1024 byte sector of the Flash array using an
embedded algorithm.
An example flow to execute the sector erase operation is shown in Figure 18-24. The sector erase
command write sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the sector erase command.
The Flash address written determines the sector to be erased while MCU address bits [9:0] and the
data written are ignored.
2. Write the sector erase command, 0x40, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the sector erase
command.
If a Flash sector to be erased is in a protected area of the Flash array, the PVIOL flag in the FSTAT register
will set and the sector erase command will not launch. Once the sector erase command has successfully
launched, the CCIF flag in the FSTAT register will set after the sector erase operation has completed unless
a new command write sequence has been buffered.
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START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
Written
Check
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Sector Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Sector Erase Command 0x40
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 18-24. Example Sector Erase Command Flow
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18.4.1.3.4
Mass Erase Command
The mass erase operation will erase all addresses in a Flash array using an embedded algorithm.
An example flow to execute the mass erase operation is shown in Figure 18-25. The mass erase command
write sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the mass erase command.
The address and data written will be ignored.
2. Write the mass erase command, 0x41, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the mass erase
command.
If a Flash array to be erased contains any protected area, the PVIOL flag in the FSTAT register will set and
the mass erase command will not launch. Once the mass erase command has successfully launched, the
CCIF flag in the FSTAT register will set after the mass erase operation has completed unless a new
command write sequence has been buffered.
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START
Read: FCLKDIV register
Clock Register
Written
Check
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Block Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Mass Erase Command 0x41
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 18-25. Example Mass Erase Command Flow
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18.4.1.4 Illegal Flash Operations
18.4.1.4.1
Access Error
The ACCERR flag in the FSTAT register will be set during the command write sequence if any of the
following illegal Flash operations are performed causing the command write sequence to immediately
abort:
1. Writing to the Flash address space before initializing the FCLKDIV register
2. Writing a misaligned word or a byte to the valid Flash address space
3. Writing to the Flash address space while CBEIF is not set
4. Writing a second word to the Flash address space before executing a program or erase command
on the previously written word
5. Writing to any Flash register other than FCMD after writing a word to the Flash address space
6. Writing a second command to the FCMD register before executing the previously written
command
7. Writing an invalid command to the FCMD register
8. Writing to any Flash register other than FSTAT (to clear CBEIF) after writing to the FCMD register
9. The part enters stop mode and a program or erase command is in progress. The command is aborted
and any pending command is killed
10. When security is enabled, a command other than mass erase originating from a non-secure memory
or from the background debug mode is written to the FCMD register
11. A 0 is written to the CBEIF bit in the FSTAT register to abort a command write sequence.
The ACCERR flag will not be set if any Flash register is read during the command write sequence. If the
Flash array is read during execution of an algorithm (CCIF=0), the Flash module will return invalid data
and the ACCERR flag will not be set. If an ACCERR flag is set in the FSTAT register, the Flash command
controller is locked. It is not possible to launch another command until the ACCERR flag is cleared.
18.4.1.4.2
Protection Violation
The PVIOL flag in the FSTAT register will be set during the command write sequence after the word write
to the Flash address space if any of the following illegal Flash operations are performed, causing the
command write sequence to immediately abort:
1. Writing a Flash address to program in a protected area of the Flash array (see Section 18.3.2.5).
2. Writing a Flash address to erase in a protected area of the Flash array.
3. Writing the mass erase command to the FCMD register while any protection is enabled.
If the PVIOL flag is set, the Flash command controller is locked. It is not possible to launch another
command until the PVIOL flag is cleared.
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18.4.2 Operating Modes
18.4.2.1 Wait Mode
If the MCU enters wait mode while a Flash command is active (CCIF = 0), that command and any buffered
command will be completed.
The Flash module can recover the MCU from wait mode if the interrupts are enabled (see Section 18.4.5).
18.4.2.2 Stop Mode
If the MCU enters stop mode while a Flash command is active (CCIF = 0), that command will be aborted
and the data being programmed or erased is lost. The high voltage circuitry to the Flash array will be
switched off when entering stop mode. CCIF and ACCERR flags will be set. Upon exit from stop mode,
the CBEIF flag will be set and any buffered command will not be executed. The ACCERR flag must be
cleared before returning to normal operation.
NOTE
As active Flash commands are immediately aborted when the MCU enters
stop mode, it is strongly recommended that the user does not use the STOP
instruction during program and erase execution.
18.4.2.3 Background Debug Mode
In background debug mode (BDM), the FPROT register is writable. If the MCU is unsecured, then all
Flash commands listed in Table 18-16 can be executed. If the MCU is secured and is in special single chip
mode, the only possible command to execute is mass erase.
18.4.3 Flash Module Security
The Flash module provides the necessary security information to the MCU. After each reset, the Flash
module determines the security state of the MCU as defined in Section 18.3.2.2, “Flash Security Register
(FSEC)”.
The contents of the Flash security/options byte at address 0xFF0F in the Flash configuration field must be
changed directly by programming address 0xFF0F when the device is unsecured and the higher address
sector is unprotected. If the Flash security/options byte is left in the secure state, any reset will cause the
MCU to return to the secure operating mode.
18.4.3.1 Unsecuring the MCU using Backdoor Key Access
The MCU may only be unsecured by using the backdoor key access feature which requires knowledge of
the contents of the backdoor key (four 16-bit words programmed at addresses 0xFF00–0xFF07). If
KEYEN[1:0] = 1:0 and the KEYACC bit is set, a write to a backdoor key address in the Flash array triggers
a comparison between the written data and the backdoor key data stored in the Flash array. If all four words
of data are written to the correct addresses in the correct order and the data matches the backdoor key
stored in the Flash array, the MCU will be unsecured. The data must be written to the backdoor key
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addresses sequentially staring with 0xFF00-0xFF01 and ending with 0xFF06–0xFF07. The values 0x0000
and 0xFFFF are not permitted as keys. When the KEYACC bit is set, reads of the Flash array will return
invalid data.
The user code stored in the Flash array must have a method of receiving the backdoor key from an external
stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If KEYEN[1:0] = 1:0 in the FSEC register, the MCU can be unsecured by the backdoor key access
sequence described below:
1. Set the KEYACC bit in the FCNFG register
2. Write the correct four 16-bit words to Flash addresses 0xFF00–0xFF07 sequentially starting with
0xFF00
3. Clear the KEYACC bit in the FCNFG register
4. If all four 16-bit words match the backdoor key stored in Flash addresses 0xFF00–0xFF07, the
MCU is unsecured and bits SEC[1:0] in the FSEC register are forced to the unsecure state of 1:0
The backdoor key access sequence is monitored by the internal security state machine. An illegal operation
during the backdoor key access sequence will cause the security state machine to lock, leaving the MCU
in the secured state. A reset of the MCU will cause the security state machine to exit the lock state and
allow a new backdoor key access sequence to be attempted. The following illegal operations will lock the
security state machine:
1. If any of the four 16-bit words does not match the backdoor key programmed in the Flash array
2. If the four 16-bit words are written in the wrong sequence
3. If more than four 16-bit words are written
4. If any of the four 16-bit words written are 0x0000 or 0xFFFF
5. If the KEYACC bit does not remain set while the four 16-bit words are written
After the backdoor key access sequence has been correctly matched, the MCU will be unsecured. The
Flash security byte can be programmed to the unsecure state, if desired.
In the unsecure state, the user has full control of the contents of the four word backdoor key by
programming bytes 0xFF00–0xFF07 of the Flash configuration field.
The security as defined in the Flash security/options byte at address 0xFF0F is not changed by using the
backdoor key access sequence to unsecure. The backdoor key stored in addresses 0xFF00–0xFF07 is
unaffected by the backdoor key access sequence. After the next reset sequence, the security state of the
Flash module is determined by the Flash security/options byte at address 0xFF0F. The backdoor key access
sequence has no effect on the program and erase protection defined in the FPROT register.
It is not possible to unsecure the MCU in special single chip mode by executing the backdoor key access
sequence in background debug mode.
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Chapter 18 64 Kbyte Flash Module (S12FTS64KV4)
18.4.4 Flash Reset Sequence
On each reset, the Flash module executes a reset sequence to hold CPU activity while loading the following
registers from the Flash array memory according to Table 18-1:
•
•
FPROT — Flash Protection Register (see Section 18.3.2.5)
FSEC — Flash Security Register (see Section 18.3.2.2)
18.4.4.1 Reset While Flash Command Active
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/array being erased is not guaranteed.
18.4.5 Interrupts
The Flash module can generate an interrupt when all Flash commands have completed execution or the
Flash address, data, and command buffers are empty.
Table 18-17. Flash Interrupt Sources
Interrupt Source
Interrupt Flag
Local Enable
Global (CCR) Mask
Flash Address, Data, and Command
Buffers are empty
CBEIF
(FSTAT register)
CBEIE
I Bit
All Flash commands have completed
execution
CCIF
(FSTAT register)
CCIE
I Bit
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
18.4.5.1 Description of Interrupt Operation
Figure 18-26 shows the logic used for generating interrupts.
The Flash module uses the CBEIF and CCIF flags in combination with the enable bits CBIE and CCIE to
discriminate for the generation of interrupts.
CBEIF
CBEIE
FLASH INTERRUPT REQUEST
CCIF
CCIE
Figure 18-26. Flash Interrupt Implementation
For a detailed description of these register bits, refer to Section 18.3.2.4, “Flash Configuration Register
(FCNFG)” and Section 18.3.2.6, “Flash Status Register (FSTAT)”.
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Chapter 19
96 Kbyte Flash Module (S12FTS96KV1)
19.1 Introduction
The FTS96K module implements a 96 Kbyte Flash (nonvolatile) memory. The Flash memory contains one
array of 96 Kbytes organized as 768 rows of 128 bytes with an erase sector size of eight rows (1024 bytes).
The Flash array may be read as either bytes, aligned words, or misaligned words. Read access time is one
bus cycle for byte and aligned word, and two bus cycles for misaligned words.
The Flash array is ideal for program and data storage for single-supply applications allowing for field
reprogramming without requiring external voltage sources for program or erase. Program and erase
functions are controlled by a command driven interface. The Flash module supports both mass erase and
sector erase. An erased bit reads 1 and a programmed bit reads 0. The high voltage required to program
and erase is generated internally. It is not possible to read from a Flash array while it is being erased or
programmed.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
19.1.1 Glossary
Command Write Sequence — A three-step MCU instruction sequence to program, erase, or erase verify
the Flash array memory.
19.1.2 Features
•
•
•
•
•
•
•
•
96 Kbytes of Flash memory comprised of one 96 Kbyte array divided into 96 sectors of 1024 bytes
Automated program and erase algorithm
Interrupts on Flash command completion and command buffer empty
Fast sector erase and word program operation
2-stage command pipeline for faster multi-word program times
Flexible protection scheme to prevent accidental program or erase
Single power supply for Flash program and erase operations
Security feature to prevent unauthorized access to the Flash array memory
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Chapter 19 96 Kbyte Flash Module (S12FTS96KV1)
19.1.3 Modes of Operation
See Section 19.4.2, “Operating Modes” for a description of the Flash module operating modes. For
program and erase operations, refer to Section 19.4.1, “Flash Command Operations”.
19.1.4 Block Diagram
Figure 19-1 shows a block diagram of the FTS96K module.
FTS96K
Flash
Interface
Command
Complete
Command Pipeline
Interrupt
Flash Array
cmd1
addr1
data1
cmd2
addr2
data2
48K * 16 Bits
Command
Buffer Empty
Interrupt
sector 0
sector 1
Registers
Protection
Security
sector 95
Oscillator
Clock
Clock
Divider
FCLK
Figure 19-1. FTS96K Block Diagram
19.2 External Signal Description
The FTS96K module contains no signals that connect off-chip.
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Chapter 19 96 Kbyte Flash Module (S12FTS96KV1)
19.3 Memory Map and Registers
This section describes the FTS96K memory map and registers.
19.3.1 Module Memory Map
The FTS96K memory map is shown in Figure 19-2. The HCS12 architecture places the Flash array
addresses between 0x4000 and 0xFFFF, which corresponds to three 16 Kbyte pages. The content of the
HCS12 Core PPAGE register is used to map the logical middle page ranging from address 0x8000 to
1
0xBFFF to any physical 16K byte page in the Flash array memory. The FPROT register (see Section
19.3.2.5) can be set to globally protect the entire Flash array. Three separate areas, one starting from the
Flash array starting address (called lower) towards higher addresses, one growing downward from the
Flash array end address (called higher), and the remaining addresses, can be activated for protection. The
Flash array addresses covered by these protectable regions are shown in Figure 19-2. The higher address
area is mainly targeted to hold the boot loader code since it covers the vector space. The lower address area
can be used for EEPROM emulation in an MCU without an EEPROM module since it can be left
unprotected while the remaining addresses are protected from program or erase. Default protection
settings as well as security information that allows the MCU to restrict access to the Flash module are
stored in the Flash configuration field described in Table 19-1.
Table 19-1. Flash Configuration Field
Size
Flash Address
Description
(bytes)
0xFF00–0xFF07
0xFF08–0xFF0C
0xFF0D
8
5
1
Backdoor Key to unlock security
Reserved
Flash Protection byte
Refer to Section 19.3.2.5, “Flash Protection Register (FPROT)”
0xFF0E
0xFF0F
1
1
Reserved
Flash Security/Options byte
Refer to Section 19.3.2.2, “Flash Security Register (FSEC)”
1. By placing 0x3E/0x3F in the HCS12 Core PPAGE register, the bottom/top fixed 16 Kbyte pages can be seen twice in the MCU
memory map.
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Chapter 19 96 Kbyte Flash Module (S12FTS96KV1)
MODULE BASE + 0x0000
Flash Registers
16 bytes
MODULE BASE + 0x000F
FLASH_START = 0x4000
0x4400
0x4800
Flash Protected Low Sectors
1, 2, 4, 8 Kbytes
0x5000
0x6000
0x3E
Flash Array
0x8000
16K PAGED
MEMORY
0x3C 0x3D
0x3A 0x3B
003E
0x3F
0xC000
Flash Protected High Sectors
2, 4, 8, 16 Kbytes
0xE000
0xF000
0x3F
0xF800
FLASH_END = 0xFFFF
0xFF00–0xFF0F (Flash Configuration Field)
Note: 0x3A–0x3F correspond to the PPAGE register content
Figure 19-2. Flash Memory Map
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Table 19-2. Flash Array Memory Map Summary
MCU Address
Range
Protectable
Low Range
Protectable
High Range
Array Relative
Address(1)
PPAGE
0x0000–0x3FFF(2)
Unpaged
(0x3D)
N.A.
N.A.
0x14000–0x17FFF
0x4000–0x7FFF
Unpaged
(0x3E)
0x4000–0x43FF
0x4000–0x47FF
0x4000–0x4FFF
0x4000–0x5FFF
N.A.
N.A.
0x18000–0x1BFFF
0x8000–0xBFFF
0x3A
0x3B
0x3C
0x3D
0x3E
N.A.
N.A.
N.A.
N.A.
N.A.
0x08000–0x0BFFF
0x0C000–0x0FFFF
0x10000–0x13FFF
0x14000–0x17FFF
0x18000–0x1BFFF
N.A.
N.A.
N.A.
0x8000–0x83FF
0x8000–0x87FF
0x8000–0x8FFF
0x8000–0x9FFF
N.A.
0x3F
0xB800–0xBFFF
0xB000–0xBFFF
0xA000–0xBFFF
0x8000–0xBFFF
0xF800–0xFFFF
0xF000–0xFFFF
0xE000–0xFFFF
0xC000–0xFFFF
0x1C000–0x1FFFF
0x1C000–0x1FFFF
0xC000–0xFFFF
Unpaged
(0x3F)
N.A.
1. Inside Flash block.
2. If allowed by MCU.
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Chapter 19 96 Kbyte Flash Module (S12FTS96KV1)
19.3.2 Register Descriptions
The Flash module contains a set of 16 control and status registers located between module base + 0x0000
and 0x000F. A summary of the Flash module registers is given in Figure 19-3. Detailed descriptions of
each register bit are provided.
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
W
R
FDIVLD
0x0000
FCLKDIV
PRDIV8
KEYEN0
FDIV5
NV5
FDIV4
NV4
FDIV3
NV3
FDIV2
NV2
FDIV1
SEC1
FDIV0
SEC0
KEYEN1
0
0x0001
FSEC
W
R
0x0002
0
0
0
0
0
0
0
0
0
0
RESERVED1
W
(1)
R
W
R
0
0
0x0003
FCNFG
CBEIE
CCIE
KEYACC
FPHDIS
PVIOL
0x0004
FPROT
FPOPEN
NV6
FPHS1
FPHS0
0
FPLDIS
BLANK
FPLS1
FPLS0
DONE
W
R
CCIF
0x0005
FSTAT
CBEIF
0
ACCERR
0
FAIL
0
W
R
0
0
0x0006
FCMD
CMDB6
0
CMDB5
0
CMDB2
0
CMDB0
0
W
R
0
0
0
0x0007
RESERVED21
W
R
0x0008
FABHI
FADDRHI1
W
R
0x0009
FABLO
FDHI
FADDRLO1
W
R
0x000A
FDATAHI1
W
R
0x000B
FDLO
FDATALO1
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x000C
RESERVED31
W
R
0x000D
RESERVED41
W
R
0x000E
RESERVED51
W
R
0x000F
RESERVED61
W
= Unimplemented or Reserved
Figure 19-3. Flash Register Summary
1. Intended for factory test purposes only.
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Chapter 19 96 Kbyte Flash Module (S12FTS96KV1)
19.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
FDIVLD
PRDIV8
FDIV5
FDIV4
FDIV3
FDIV2
FDIV1
FDIV0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 19-4. Flash Clock Divider Register (FCLKDIV)
All bits in the FCLKDIV register are readable, bits 6–0 are write once and bit 7 is not writable.
Table 19-3. FCLKDIV Field Descriptions
Field
Description
7
Clock Divider Loaded
FDIVLD
0 FCLKDIV register has not been written
1 FCLKDIV register has been written to since the last reset
6
Enable Prescalar by 8
PRDIV8
0 The oscillator clock is directly fed into the Flash clock divider
1 The oscillator clock is divided by 8 before feeding into the Flash clock divider
5–0
Clock Divider Bits — The combination of PRDIV8 and FDIV[5:0] must divide the oscillator clock down to a
FDIV[5:0] frequency of 150 kHz – 200 kHz. The maximum divide ratio is 512. Refer to Section 19.4.1.1, “Writing the
FCLKDIV Register” for more information.
19.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
KEYEN1
KEYEN0
NV5
NV4
NV3
NV2
SEC1
SEC0
Reset
F
F
F
F
F
F
F
F
= Unimplemented or Reserved
Figure 19-5. Flash Security Register (FSEC)
All bits in the FSEC register are readable but not writable.
The FSEC register is loaded from the Flash configuration field at 0xFF0F during the reset sequence,
indicated by F in Figure 19-5.
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Chapter 19 96 Kbyte Flash Module (S12FTS96KV1)
Table 19-4. FSEC Field Descriptions
Field
Description
7–6
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of the backdoor key access
KEYEN[1:0] to the Flash module as shown in Table 19-5.
5–2
Nonvolatile Flag Bits — The NV[5:2] bits are available to the user as nonvolatile flags.
NV[5:2]
1–0
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 19-6. If the
SEC[1:0]
Flash module is unsecured using backdoor key access, the SEC[1:0] bits are forced to 1:0.
Table 19-5. Flash KEYEN States
KEYEN[1:0]
Status of Backdoor Key Access
00
01(1)
10
DISABLED
DISABLED
ENABLED
DISABLED
11
1. Preferred KEYEN state to disable Backdoor Key Access.
Table 19-6. Flash Security States
SEC[1:0]
Status of Security
00
01(1)
10
Secured
Secured
Unsecured
11
Secured
1. Preferred SEC state to set MCU to secured state.
The security function in the Flash module is described in Section 19.4.3, “Flash Module Security”.
19.3.2.3 RESERVED1
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 19-6. RESERVED1
All bits read 0 and are not writable.
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19.3.2.4 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash interrupts and gates the security backdoor key writes.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
CBEIE
CCIE
KEYACC
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 19-7. Flash Configuration Register (FCNFG)
CBEIE, CCIE, and KEYACC are readable and writable while remaining bits read 0 and are not writable.
KEYACC is only writable if the KEYEN bit in the FSEC register is set to the enabled state (see Section
19.3.2.2).
Table 19-7. FCNFG Field Descriptions
Field
Description
7
Command Buffer Empty Interrupt Enable — The CBEIE bit enables the interrupts in case of an empty
command buffer in the Flash module.
CBEIE
0 Command Buffer Empty interrupts disabled
1 An interrupt will be requested whenever the CBEIF flag is set (see Section 19.3.2.6)
6
Command Complete Interrupt Enable — The CCIE bit enables the interrupts in case of all commands being
completed in the Flash module.
CCIE
0 Command Complete interrupts disabled
1 An interrupt will be requested whenever the CCIF flag is set (see Section 19.3.2.6)
5
Enable Security Key Writing.
KEYACC
0 Flash writes are interpreted as the start of a command write sequence
1 Writes to the Flash array are interpreted as a backdoor key while reads of the Flash array return invalid data
19.3.2.5 Flash Protection Register (FPROT)
The FPROT register defines which Flash sectors are protected against program or erase.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
FPOPEN
NV6
FPHDIS
FPHS1
FPHS0
FPLDIS
FPLS1
FPLS0
Reset
F
F
F
F
F
F
F
F
Figure 19-8. Flash Protection Register (FPROT)
The FPROT register is readable in normal and special modes. FPOPEN can only be written from a 1 to a 0.
FPLS[1:0] can be written anytime until FPLDIS is cleared. FPHS[1:0] can be written anytime until
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Chapter 19 96 Kbyte Flash Module (S12FTS96KV1)
FPHDIS is cleared. The FPROT register is loaded from Flash address 0xFF0D during the reset sequence,
indicated by F in Figure 19-8.
To change the Flash protection that will be loaded on reset, the upper sector of the Flash array must be
unprotected, then the Flash protection byte located at Flash address 0xFF0D must be written to.
A protected Flash sector is disabled by FPHDIS and FPLDIS while the size of the protected sector is
defined by FPHS[1:0] and FPLS[1:0] in the FPROT register.
Trying to alter any of the protected areas will result in a protect violation error and the PVIOL flag will be
set in the FSTAT register (see Section 19.3.2.6). A mass erase of the whole Flash array is only possible
when protection is fully disabled by setting the FPOPEN, FPLDIS, and FPHDIS bits. An attempt to mass
erase a Flash array while protection is enabled will set the PVIOL flag in the FSTAT register.
Table 19-8. FPROT Field Descriptions
Field
Description
7
Protection Function for Program or Erase — It is possible using the FPOPEN bit to either select address
FPOPEN ranges to be protected using FPHDIS, FPLDIS, FPHS[1:0] and FPLS[1:0] or to select the same ranges to be
unprotected. When FPOPEN is set, FPxDIS enables the ranges to be protected, whereby clearing FPxDIS
enables protection for the range specified by the corresponding FPxS[1:0] bits. When FPOPEN is cleared,
FPxDIS defines unprotected ranges as specified by the corresponding FPxS[1:0] bits. In this case, setting
FPxDIS enables protection. Thus the effective polarity of the FPxDIS bits is swapped by the FPOPEN bit as
shown in Table 19-9. This function allows the main part of the Flash array to be protected while a small range
can remain unprotected for EEPROM emulation.
0 The FPHDIS and FPLDIS bits define Flash address ranges to be unprotected
1 The FPHDIS and FPLDIS bits define Flash address ranges to be protected
6
Nonvolatile Flag Bit — The NV6 bit should remain in the erased state for future enhancements.
NV6
5
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in the higher space of the Flash address map.
0 Protection/unprotection enabled
FPHDIS
1 Protection/unprotection disabled
4–3
Flash Protection Higher Address Size — The FPHS[1:0] bits determine the size of the protected/unprotected
FPHS[1:0] sector as shown in Table 19-10. The FPHS[1:0] bits can only be written to while the FPHDIS bit is set.
2
Flash Protection Lower Address Range Disable — The FPLDIS bit determines whether there is a
protected/unprotected sector in the lower space of the Flash address map.
0 Protection/unprotection enabled
FPLDIS
1 Protection/unprotection disabled
1–0
Flash Protection Lower Address Size — The FPLS[1:0] bits determine the size of the protected/unprotected
FPLS[1:0] sector as shown in Table 19-11. The FPLS[1:0] bits can only be written to while the FPLDIS bit is set.
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Table 19-9. Flash Protection Function
FPOPEN FPHDIS FPHS[1] FPHS[0] FPLDIS FPLS[1] FPLS[0]
Function(1)
No protection
1
1
1
1
0
0
0
0
1
1
0
0
1
0
1
0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
1
0
1
0
1
1
0
0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Protect low range
Protect high range
Protect high and low ranges
Full Flash array protected
Unprotected high range
Unprotected low range
Unprotected high and low ranges
1. For range sizes refer to Table 19-10 and Table 19-11 or .
Table 19-10. Flash Protection Higher Address Range
FPHS[1:0]
Address Range
Range Size
00
01
10
11
0xF800–0xFFFF
0xF000–0xFFFF
0xE000–0xFFFF
0xC000–0xFFFF
2 Kbytes
4 Kbytes
8 Kbytes
16 Kbytes
Table 19-11. Flash Protection Lower Address Range
FPLS[1:0]
Address Range
Range Size
00
01
10
11
0x4000–0x43FF
0x4000–0x47FF
0x4000–0x4FFF
0x4000–0x5FFF
1 Kbyte
2 Kbytes
4 Kbytes
8 Kbytes
Figure 19-9 illustrates all possible protection scenarios. Although the protection scheme is loaded from the
Flash array after reset, it is allowed to change in normal modes. This protection scheme can be used by
applications requiring re-programming in single chip mode while providing as much protection as possible
if no re-programming is required.
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FPHDIS = 1
FPLDIS = 1
FPHDIS = 1
FPLDIS = 0
6
FPHDIS = 0
FPLDIS = 1
5
FPHDIS = 0
FPLDIS = 0
4
Scenario
7
0xFFFF
Scenario
3
2
1
0
0xFFFF
Protected Flash
Figure 19-9. Flash Protection Scenarios
19.3.2.5.1
Flash Protection Restrictions
The general guideline is that protection can only be added, not removed. All valid transitions between
Flash protection scenarios are specified in Table 19-12. Any attempt to write an invalid scenario to the
FPROT register will be ignored and the FPROT register will remain unchanged. The contents of the
FPROT register reflect the active protection scenario.
Table 19-12. Flash Protection Scenario Transitions
From
To Protection Scenario(1)
Protection
Scenario
0
1
2
3
4
5
6
7
0
1
2
3
4
5
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
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Chapter 19 96 Kbyte Flash Module (S12FTS96KV1)
Table 19-12. Flash Protection Scenario Transitions
From
To Protection Scenario(1)
Protection
Scenario
0
1
2
3
4
5
6
7
6
7
X
X
X
X
X
X
X
X
X
X
X
X
1. Allowed transitions marked with X.
19.3.2.6 Flash Status Register (FSTAT)
The FSTAT register defines the status of the Flash command controller and the results of command
execution.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
CCIF
0
BLANK
DONE
CBEIF
PVIOL
ACCERR
FAIL
Reset
1
1
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 19-10. Flash Status Register (FSTAT)
In normal modes, bits CBEIF, PVIOL, and ACCERR are readable and writable, bits CCIF and BLANK
are readable and not writable, remaining bits, including FAIL and DONE, read 0 and are not writable. In
special modes, FAIL is readable and writable while DONE is readable but not writable. FAIL must be clear
in special modes when starting a command write sequence.
Table 19-13. FSTAT Field Descriptions
Field
Description
7
Command Buffer Empty Interrupt Flag — The CBEIF flag indicates that the address, data and command
buffers are empty so that a new command write sequence can be started. The CBEIF flag is cleared by writing
a 1 to CBEIF. Writing a 0 to the CBEIF flag has no effect on CBEIF. Writing a 0 to CBEIF after writing an aligned
word to the Flash address space but before CBEIF is cleared will abort a command write sequence and cause
the ACCERR flag in the FSTAT register to be set. Writing a 0 to CBEIF outside of a command write sequence
will not set the ACCERR flag. The CBEIF flag is used together with the CBEIE bit in the FCNFG register to
generate an interrupt request (see Figure 19-26).
CBEIF
0 Buffers are full
1 Buffers are ready to accept a new command
6
Command Complete Interrupt Flag — The CCIF flag indicates that there are no more commands pending. The
CCIF flag is cleared when CBEIF is clear and sets automatically upon completion of all active and pending
commands. The CCIF flag does not set when an active commands completes and a pending command is
fetched from the command buffer. Writing to the CCIF flag has no effect. The CCIF flag is used together with the
CCIE bit in the FCNFG register to generate an interrupt request (see Figure 19-26).
0 Command in progress
CCIF
1 All commands are completed
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Table 19-13. FSTAT Field Descriptions
Field
Description
5
Protection Violation — The PVIOL flag indicates an attempt was made to program or erase an address in a
protected Flash array memory area. The PVIOL flag is cleared by writing a 1 to PVIOL. Writing a 0 to the PVIOL
flag has no effect on PVIOL. While PVIOL is set, it is not possible to launch another command.
0 No protection violation detected
PVIOL
1 Protection violation has occurred
4
Access Error — The ACCERR flag indicates an illegal access to the Flash array caused by either a violation of
ACCERR the command write sequence, issuing an illegal command (illegal combination of the CMDBx bits in the FCMD
register) or the execution of a CPU STOP instruction while a command is executing (CCIF=0). The ACCERR flag
is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR flag has no effect on ACCERR. While ACCERR
is set, it is not possible to launch another command.
0 No access error detected
1 Access error has occurred
2
Flash Array Has Been Verified as Erased — The BLANK flag indicates that an erase verify command has
checked the Flash array and found it to be erased. The BLANK flag is cleared by hardware when CBEIF is
cleared as part of a new valid command write sequence. Writing to the BLANK flag has no effect on BLANK.
0 If an erase verify command has been requested, and the CCIF flag is set, then a 0 in BLANK indicates the
array is not erased
BLANK
1 Flash array verifies as erased
1
FAIL
Flag Indicating a Failed Flash Operation — In special modes, the FAIL flag will set if the erase verify operation
fails (Flash array verified as not erased). Writing a 0 to the FAIL flag has no effect on FAIL. The FAIL flag is cleared
by writing a 1 to FAIL. While FAIL is set, it is not possible to launch another command.
0 Flash operation completed without error
1 Flash operation failed
0
Flag Indicating a Failed Operation is not Active — In special modes, the DONE flag will clear if a program,
erase, or erase verify operation is active.
DONE
0 Flash operation is active
1 Flash operation is not active
19.3.2.7 Flash Command Register (FCMD)
The FCMD register defines the Flash commands.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
0
0
0
CMDB6
CMDB5
CMDB2
CMDB0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 19-11. Flash Command Register (FCMD)
Bits CMDB6, CMDB5, CMDB2, and CMDB0 are readable and writable during a command write
sequence while bits 7, 4, 3, and 1 read 0 and are not writable.
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Table 19-14. FCMD Field Descriptions
Field
Description
6, 5, 2, 0
Valid Flash commands are shown in Table 19-15. An attempt to execute any command other than those listed in
CMDB[6:5] Table 19-15 will set the ACCERR bit in the FSTAT register (see Section 19.3.2.6).
CMDB[2]
CMDB[0]
Table 19-15. Valid Flash Command List
CMDB
NVM Command
0x05
0x20
0x40
0x41
Erase verify
Word program
Sector erase
Mass erase
19.3.2.8 RESERVED2
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 19-12. RESERVED2
All bits read 0 and are not writable.
19.3.2.9 Flash Address Register (FADDR)
FADDRHI and FADDRLO are the Flash address registers.
\
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
FABHI
Reset
0
0
0
0
0
0
0
0
Figure 19-13. Flash Address High Register (FADDRHI)
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Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
FABLO
Reset
0
0
0
0
0
0
0
0
Figure 19-14. Flash Address Low Register (FADDRLO)
In normal modes, all FABHI and FABLO bits read 0 and are not writable. In special modes, the FABHI
and FABLO bits are readable and writable. For sector erase, the MCU address bits [9:0] are ignored. For
mass erase, any address within the Flash array is valid to start the command.
19.3.2.10 Flash Data Register (FDATA)
FDATAHI and FDATALO are the Flash data registers.
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
FDHI
Reset
0
0
0
0
0
0
0
0
Figure 19-15. Flash Data High Register (FDATAHI)
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
FDLO
W
Reset
0
0
0
0
0
0
0
0
Figure 19-16. Flash Data Low Register (FDATALO)
In normal modes, all FDATAHI and FDATALO bits read 0 and are not writable. In special modes, all
FDATAHI and FDATALO bits are readable and writable when writing to an address within the Flash
address range.
19.3.2.11 RESERVED3
This register is reserved for factory testing and is not accessible to the user.
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Module Base + 0x000C
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 19-17. RESERVED3
All bits read 0 and are not writable.
19.3.2.12 RESERVED4
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 19-18. RESERVED4
All bits read 0 and are not writable.
19.3.2.13 RESERVED5
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 19-19. RESERVED5
All bits read 0 and are not writable.
19.3.2.14 RESERVED6
This register is reserved for factory testing and is not accessible to the user.
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Module Base + 0x000F
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 19-20. RESERVED6
All bits read 0 and are not writable.
19.4 Functional Description
19.4.1 Flash Command Operations
Write operations are used for the program, erase, and erase verify algorithms described in this section. The
program and erase algorithms are controlled by a state machine whose timebase FCLK is derived from the
oscillator clock via a programmable divider. The FCMD register as well as the associated FADDR and
FDATA registers operate as a buffer and a register (2-stage FIFO) so that a new command along with the
necessary data and address can be stored to the buffer while the previous command is still in progress. This
pipelined operation allows a time optimization when programming more than one word on a specific row,
as the high voltage generation can be kept active in between two programming commands. The pipelined
operation also allows a simplification of command launching. Buffer empty as well as command
completion are signalled by flags in the FSTAT register with corresponding interrupts generated, if
enabled.
The next sections describe:
•
•
•
•
How to write the FCLKDIV register
Command write sequence used to program, erase or erase verify the Flash array
Valid Flash commands
Errors resulting from illegal Flash operations
19.4.1.1 Writing the FCLKDIV Register
Prior to issuing any Flash command after a reset, it is first necessary to write the FCLKDIV register to
divide the oscillator clock down to within the 150-kHz to 200-kHz range. Since the program and erase
timings are also a function of the bus clock, the FCLKDIV determination must take this information into
account.
If we define:
•
•
•
FCLK as the clock of the Flash timing control block
Tbus as the period of the bus clock
INT(x) as taking the integer part of x (e.g., INT(4.323) = 4),
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then FCLKDIV register bits PRDIV8 and FDIV[5:0] are to be set as described in Figure 19-21.
For example, if the oscillator clock frequency is 950 kHz and the bus clock is 10 MHz, FCLKDIV bits
FDIV[5:0] should be set to 4 (000100) and bit PRDIV8 set to 0. The resulting FCLK is then 190 kHz. As
a result, the Flash algorithm timings are increased over optimum target by:
(200 – 190) ⁄ 200 × 100 = 5%
Command execution time will increase proportionally with the period of FCLK.
CAUTION
Because of the impact of clock synchronization on the accuracy of the
functional timings, programming or erasing the Flash array cannot be
performed if the bus clock runs at less than 1 MHz. Programming or erasing
the Flash array with an input clock < 150 kHz should be avoided. Setting
FCLKDIV to a value such that FCLK < 150 kHz can destroy the Flash array
due to overstress. Setting FCLKDIV to a value such that (1/FCLK + Tbus)
< 5µs can result in incomplete programming or erasure of the Flash array
cells.
If the FCLKDIV register is written, the bit FDIVLD is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written
to, the Flash command loaded during a command write sequence will not execute and the ACCERR flag
in the FSTAT register will set.
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START
no
Tbus < 1µs?
ALL COMMANDS IMPOSSIBLE
yes
PRDIV8=0 (reset)
no
oscillator_clock
12.8MHz?
yes
PRDIV8=1
PRDCLK=oscillator_clock/8
PRDCLK=oscillator_clock
no
PRDCLK[MHz]*(5+Tbus[µs])
an integer?
FDIV[5:0]=INT(PRDCLK[MHz]*(5+Tbus[µs]))
yes
FDIV[5:0]=PRDCLK[MHz]*(5+Tbus[µs])-1
TRY TO DECREASE Tbus
FCLK=(PRDCLK)/(1+FDIV[5:0])
yes
1/FCLK[MHz] + Tbus[µs] > 5
END
AND
FCLK > 0.15MHz
?
no
yes
FDIV[5:0] > 4?
no
ALL COMMANDS IMPOSSIBLE
Figure 19-21. PRDIV8 and FDIV Bits Determination Procedure
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19.4.1.2 Command Write Sequence
The Flash command controller is used to supervise the command write sequence to execute program,
erase, and erase verify algorithms.
Before starting a command write sequence, the ACCERR and PVIOL flags in the FSTAT register must be
clear and the CBEIF flag should be tested to determine the state of the address, data, and command buffers.
If the CBEIF flag is set, indicating the buffers are empty, a new command write sequence can be started.
If the CBEIF flag is clear, indicating the buffers are not available, a new command write sequence will
overwrite the contents of the address, data, and command buffers.
A command write sequence consists of three steps which must be strictly adhered to with writes to the
Flash module not permitted between the steps. However, Flash register and array reads are allowed during
a command write sequence. The basic command write sequence is as follows:
1. Write to a valid address in the Flash array memory.
2. Write a valid command to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the command.
The address written in step 1 will be stored in the FADDR registers and the data will be stored in the
FDATA registers. When the CBEIF flag is cleared in step 3, the CCIF flag is cleared by the Flash command
controller indicating that the command was successfully launched. For all command write sequences, the
CBEIF flag will set after the CCIF flag is cleared indicating that the address, data, and command buffers
are ready for a new command write sequence to begin. A buffered command will wait for the active
operation to be completed before being launched. Once a command is launched, the completion of the
command operation is indicated by the setting of the CCIF flag in the FSTAT register. The CCIF flag will
set upon completion of all active and buffered commands.
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19.4.1.3 Valid Flash Commands
Table 19-16 summarizes the valid Flash commands along with the effects of the commands on the Flash
array.
Table 19-16. Valid Flash Commands
FCMD
Meaning
Function on Flash Array
Verify all bytes in the Flash array are erased.
0x05
Erase
Verify
If the Flash array is erased, the BLANK bit will set in the FSTAT register upon command completion.
0x20
0x40
Program
Program a word (2 bytes) in the Flash array.
Sector
Erase
Erase all 1024 bytes in a sector of the Flash array.
0x41
Mass
Erase
Erase all bytes in the Flash array.
A mass erase of the full Flash array is only possible when FPLDIS, FPHDIS, and FPOPEN bits in
the FPROT register are set prior to launching the command.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
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19.4.1.3.1
Erase Verify Command
The erase verify operation will verify that a Flash array is erased.
An example flow to execute the erase verify operation is shown in Figure 19-22. The erase verify command
write sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the erase verify command.
The address and data written will be ignored.
2. Write the erase verify command, 0x05, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the erase verify
command.
After launching the erase verify command, the CCIF flag in the FSTAT register will set after the operation
has completed unless a new command write sequence has been buffered. Upon completion of the erase
verify operation, the BLANK flag in the FSTAT register will be set if all addresses in the Flash array are
verified to be erased. If any address in the Flash array is not erased, the erase verify operation will terminate
and the BLANK flag in the FSTAT register will remain clear.
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START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
Written
Check
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Array Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Erase Verify Command 0x05
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
no
CCIF
Set?
yes
Erase Verify
Status
BLANK
Set?
yes
Flash Array
Erased
Flash Array
EXIT
EXIT
Not Erased
Figure 19-22. Example Erase Verify Command Flow
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19.4.1.3.2
Program Command
The program operation will program a previously erased word in the Flash array using an embedded
algorithm.
An example flow to execute the program operation is shown in Figure 19-23. The program command write
sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the program command. The
data written will be programmed to the Flash array address written.
2. Write the program command, 0x20, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the program
command.
If a word to be programmed is in a protected area of the Flash array, the PVIOL flag in the FSTAT register
will set and the program command will not launch. Once the program command has successfully launched,
the CCIF flag in the FSTAT register will set after the program operation has completed unless a new
command write sequence has been buffered. By executing a new program command write sequence on
sequential words after the CBEIF flag in the FSTAT register has been set, up to 55% faster programming
time per word can be effectively achieved than by waiting for the CCIF flag to set after each program
operation.
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START
Read: FCLKDIV register
Clock Register
Written
Check
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Address
and program Data
1.
2.
3.
Write: FCMD register
Program Command 0x20
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Buffer Empty
Check
no
CBEIF
Set?
yes
Sequential
Programming
Decision
yes
Next
Word?
no
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 19-23. Example Program Command Flow
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19.4.1.3.3
Sector Erase Command
The sector erase operation will erase all addresses in a 1024 byte sector of the Flash array using an
embedded algorithm.
An example flow to execute the sector erase operation is shown in Figure 19-24. The sector erase
command write sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the sector erase command.
The Flash address written determines the sector to be erased while MCU address bits [9:0] and the
data written are ignored.
2. Write the sector erase command, 0x40, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the sector erase
command.
If a Flash sector to be erased is in a protected area of the Flash array, the PVIOL flag in the FSTAT register
will set and the sector erase command will not launch. Once the sector erase command has successfully
launched, the CCIF flag in the FSTAT register will set after the sector erase operation has completed unless
a new command write sequence has been buffered.
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START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
Written
Check
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Sector Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Sector Erase Command 0x40
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 19-24. Example Sector Erase Command Flow
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19.4.1.3.4
Mass Erase Command
The mass erase operation will erase all addresses in a Flash array using an embedded algorithm.
An example flow to execute the mass erase operation is shown in Figure 19-25. The mass erase command
write sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the mass erase command.
The address and data written will be ignored.
2. Write the mass erase command, 0x41, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the mass erase
command.
If a Flash array to be erased contains any protected area, the PVIOL flag in the FSTAT register will set and
the mass erase command will not launch. Once the mass erase command has successfully launched, the
CCIF flag in the FSTAT register will set after the mass erase operation has completed unless a new
command write sequence has been buffered.
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START
Read: FCLKDIV register
Clock Register
Written
Check
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Block Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Mass Erase Command 0x41
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 19-25. Example Mass Erase Command Flow
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19.4.1.4 Illegal Flash Operations
19.4.1.4.1
Access Error
The ACCERR flag in the FSTAT register will be set during the command write sequence if any of the
following illegal Flash operations are performed causing the command write sequence to immediately
abort:
1. Writing to the Flash address space before initializing the FCLKDIV register
2. Writing a misaligned word or a byte to the valid Flash address space
3. Writing to the Flash address space while CBEIF is not set
4. Writing a second word to the Flash address space before executing a program or erase command
on the previously written word
5. Writing to any Flash register other than FCMD after writing a word to the Flash address space
6. Writing a second command to the FCMD register before executing the previously written
command
7. Writing an invalid command to the FCMD register
8. Writing to any Flash register other than FSTAT (to clear CBEIF) after writing to the FCMD register
9. The part enters stop mode and a program or erase command is in progress. The command is aborted
and any pending command is killed
10. When security is enabled, a command other than mass erase originating from a non-secure memory
or from the background debug mode is written to the FCMD register
11. A 0 is written to the CBEIF bit in the FSTAT register to abort a command write sequence.
The ACCERR flag will not be set if any Flash register is read during the command write sequence. If the
Flash array is read during execution of an algorithm (CCIF=0), the Flash module will return invalid data
and the ACCERR flag will not be set. If an ACCERR flag is set in the FSTAT register, the Flash command
controller is locked. It is not possible to launch another command until the ACCERR flag is cleared.
19.4.1.4.2
Protection Violation
The PVIOL flag in the FSTAT register will be set during the command write sequence after the word write
to the Flash address space if any of the following illegal Flash operations are performed, causing the
command write sequence to immediately abort:
1. Writing a Flash address to program in a protected area of the Flash array (see Section 19.3.2.5).
2. Writing a Flash address to erase in a protected area of the Flash array.
3. Writing the mass erase command to the FCMD register while any protection is enabled.
If the PVIOL flag is set, the Flash command controller is locked. It is not possible to launch another
command until the PVIOL flag is cleared.
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19.4.2 Operating Modes
19.4.2.1 Wait Mode
If the MCU enters wait mode while a Flash command is active (CCIF = 0), that command and any buffered
command will be completed.
The Flash module can recover the MCU from wait mode if the interrupts are enabled (see Section 19.4.5).
19.4.2.2 Stop Mode
If the MCU enters stop mode while a Flash command is active (CCIF = 0), that command will be aborted
and the data being programmed or erased is lost. The high voltage circuitry to the Flash array will be
switched off when entering stop mode. CCIF and ACCERR flags will be set. Upon exit from stop mode,
the CBEIF flag will be set and any buffered command will not be executed. The ACCERR flag must be
cleared before returning to normal operation.
NOTE
As active Flash commands are immediately aborted when the MCU enters
stop mode, it is strongly recommended that the user does not use the STOP
instruction during program and erase execution.
19.4.2.3 Background Debug Mode
In background debug mode (BDM), the FPROT register is writable. If the MCU is unsecured, then all
Flash commands listed in Table 19-16 can be executed. If the MCU is secured and is in special single chip
mode, the only possible command to execute is mass erase.
19.4.3 Flash Module Security
The Flash module provides the necessary security information to the MCU. After each reset, the Flash
module determines the security state of the MCU as defined in Section 19.3.2.2, “Flash Security Register
(FSEC)”.
The contents of the Flash security/options byte at address 0xFF0F in the Flash configuration field must be
changed directly by programming address 0xFF0F when the device is unsecured and the higher address
sector is unprotected. If the Flash security/options byte is left in the secure state, any reset will cause the
MCU to return to the secure operating mode.
19.4.3.1 Unsecuring the MCU using Backdoor Key Access
The MCU may only be unsecured by using the backdoor key access feature which requires knowledge of
the contents of the backdoor key (four 16-bit words programmed at addresses 0xFF00–0xFF07). If
KEYEN[1:0] = 1:0 and the KEYACC bit is set, a write to a backdoor key address in the Flash array triggers
a comparison between the written data and the backdoor key data stored in the Flash array. If all four words
of data are written to the correct addresses in the correct order and the data matches the backdoor key
stored in the Flash array, the MCU will be unsecured. The data must be written to the backdoor key
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Chapter 19 96 Kbyte Flash Module (S12FTS96KV1)
addresses sequentially staring with 0xFF00-0xFF01 and ending with 0xFF06–0xFF07. The values 0x0000
and 0xFFFF are not permitted as keys. When the KEYACC bit is set, reads of the Flash array will return
invalid data.
The user code stored in the Flash array must have a method of receiving the backdoor key from an external
stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If KEYEN[1:0] = 1:0 in the FSEC register, the MCU can be unsecured by the backdoor key access
sequence described below:
1. Set the KEYACC bit in the FCNFG register
2. Write the correct four 16-bit words to Flash addresses 0xFF00–0xFF07 sequentially starting with
0xFF00
3. Clear the KEYACC bit in the FCNFG register
4. If all four 16-bit words match the backdoor key stored in Flash addresses 0xFF00–0xFF07, the
MCU is unsecured and bits SEC[1:0] in the FSEC register are forced to the unsecure state of 1:0
The backdoor key access sequence is monitored by the internal security state machine. An illegal operation
during the backdoor key access sequence will cause the security state machine to lock, leaving the MCU
in the secured state. A reset of the MCU will cause the security state machine to exit the lock state and
allow a new backdoor key access sequence to be attempted. The following illegal operations will lock the
security state machine:
1. If any of the four 16-bit words does not match the backdoor key programmed in the Flash array
2. If the four 16-bit words are written in the wrong sequence
3. If more than four 16-bit words are written
4. If any of the four 16-bit words written are 0x0000 or 0xFFFF
5. If the KEYACC bit does not remain set while the four 16-bit words are written
After the backdoor key access sequence has been correctly matched, the MCU will be unsecured. The
Flash security byte can be programmed to the unsecure state, if desired.
In the unsecure state, the user has full control of the contents of the four word backdoor key by
programming bytes 0xFF00–0xFF07 of the Flash configuration field.
The security as defined in the Flash security/options byte at address 0xFF0F is not changed by using the
backdoor key access sequence to unsecure. The backdoor key stored in addresses 0xFF00–0xFF07 is
unaffected by the backdoor key access sequence. After the next reset sequence, the security state of the
Flash module is determined by the Flash security/options byte at address 0xFF0F. The backdoor key access
sequence has no effect on the program and erase protection defined in the FPROT register.
It is not possible to unsecure the MCU in special single chip mode by executing the backdoor key access
sequence in background debug mode.
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Chapter 19 96 Kbyte Flash Module (S12FTS96KV1)
19.4.4 Flash Reset Sequence
On each reset, the Flash module executes a reset sequence to hold CPU activity while loading the following
registers from the Flash array memory according to Table 19-1:
•
•
FPROT — Flash Protection Register (see Section 19.3.2.5)
FSEC — Flash Security Register (see Section 19.3.2.2)
19.4.4.1 Reset While Flash Command Active
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/array being erased is not guaranteed.
19.4.5 Interrupts
The Flash module can generate an interrupt when all Flash commands have completed execution or the
Flash address, data, and command buffers are empty.
Table 19-17. Flash Interrupt Sources
Interrupt Source
Interrupt Flag
Local Enable
Global (CCR) Mask
Flash Address, Data, and Command
Buffers are empty
CBEIF
(FSTAT register)
CBEIE
I Bit
All Flash commands have completed
execution
CCIF
(FSTAT register)
CCIE
I Bit
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
19.4.5.1 Description of Interrupt Operation
Figure 19-26 shows the logic used for generating interrupts.
The Flash module uses the CBEIF and CCIF flags in combination with the enable bits CBIE and CCIE to
discriminate for the generation of interrupts.
CBEIF
CBEIE
FLASH INTERRUPT REQUEST
CCIF
CCIE
Figure 19-26. Flash Interrupt Implementation
For a detailed description of these register bits, refer to Section 19.3.2.4, “Flash Configuration Register
(FCNFG)” and Section 19.3.2.6, “Flash Status Register (FSTAT)”.
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Chapter 20
128 Kbyte Flash Module (S12FTS128K1V1)
20.1 Introduction
The FTS128K1 module implements a 128 Kbyte Flash (nonvolatile) memory. The Flash memory contains
one array of 128 Kbytes organized as 1024 rows of 128 bytes with an erase sector size of eight rows (1024
bytes). The Flash array may be read as either bytes, aligned words, or misaligned words. Read access time
is one bus cycle for byte and aligned word, and two bus cycles for misaligned words.
The Flash array is ideal for program and data storage for single-supply applications allowing for field
reprogramming without requiring external voltage sources for program or erase. Program and erase
functions are controlled by a command driven interface. The Flash module supports both mass erase and
sector erase. An erased bit reads 1 and a programmed bit reads 0. The high voltage required to program
and erase is generated internally. It is not possible to read from a Flash array while it is being erased or
programmed.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
20.1.1 Glossary
Command Write Sequence — A three-step MCU instruction sequence to program, erase, or erase verify
the Flash array memory.
20.1.2 Features
•
128 Kbytes of Flash memory comprised of one 128 Kbyte array divided into 128 sectors of 1024
bytes
•
•
•
•
•
•
•
Automated program and erase algorithm
Interrupts on Flash command completion and command buffer empty
Fast sector erase and word program operation
2-stage command pipeline for faster multi-word program times
Flexible protection scheme to prevent accidental program or erase
Single power supply for Flash program and erase operations
Security feature to prevent unauthorized access to the Flash array memory
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Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1)
20.1.3 Modes of Operation
See Section 20.4.2, “Operating Modes” for a description of the Flash module operating modes. For
program and erase operations, refer to Section 20.4.1, “Flash Command Operations”.
20.1.4 Block Diagram
Figure 20-1 shows a block diagram of the FTS128K1 module.
FTS128K1
Flash
Interface
Command
Complete
Command Pipeline
Interrupt
Flash Array
cmd1
addr1
data1
cmd2
addr2
data2
64K * 16 Bits
Command
Buffer Empty
Interrupt
sector 0
sector 1
Registers
Protection
Security
sector 127
Oscillator
Clock
Clock
Divider
FCLK
Figure 20-1. FTS128K1 Block Diagram
20.2 External Signal Description
The FTS128K1 module contains no signals that connect off-chip.
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20.3 Memory Map and Registers
This section describes the FTS128K1 memory map and registers.
20.3.1 Module Memory Map
The FTS128K1 memory map is shown in Figure 20-2. The HCS12 architecture places the Flash array
addresses between 0x4000 and 0xFFFF, which corresponds to three 16 Kbyte pages. The content of the
HCS12 Core PPAGE register is used to map the logical middle page ranging from address 0x8000 to
1
0xBFFF to any physical 16K byte page in the Flash array memory. The FPROT register (see Section
20.3.2.5) can be set to globally protect the entire Flash array. Three separate areas, one starting from the
Flash array starting address (called lower) towards higher addresses, one growing downward from the
Flash array end address (called higher), and the remaining addresses, can be activated for protection. The
Flash array addresses covered by these protectable regions are shown in Figure 20-2. The higher address
area is mainly targeted to hold the boot loader code since it covers the vector space. The lower address area
can be used for EEPROM emulation in an MCU without an EEPROM module since it can be left
unprotected while the remaining addresses are protected from program or erase. Default protection
settings as well as security information that allows the MCU to restrict access to the Flash module are
stored in the Flash configuration field described in Table 20-1.
Table 20-1. Flash Configuration Field
Size
Flash Address
Description
(bytes)
0xFF00–0xFF07
0xFF08–0xFF0C
0xFF0D
8
5
1
Backdoor Key to unlock security
Reserved
Flash Protection byte
Refer to Section 20.3.2.5, “Flash Protection Register (FPROT)”
0xFF0E
0xFF0F
1
1
Reserved
Flash Security/Options byte
Refer to Section 20.3.2.2, “Flash Security Register (FSEC)”
1. By placing 0x3E/0x3F in the HCS12 Core PPAGE register, the bottom/top fixed 16 Kbyte pages can be seen twice in the MCU
memory map.
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Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1)
MODULE BASE + 0x0000
Flash Registers
16 bytes
MODULE BASE + 0x000F
FLASH_START = 0x4000
0x4400
0x4800
Flash Protected Low Sectors
1, 2, 4, 8 Kbytes
0x5000
0x6000
0x3E
Flash Array
0x8000
16K PAGED
MEMORY
0x38 0x39 0x3A 0x3B 0x3C 0x3D 003E 0x3F
0xC000
Flash Protected High Sectors
2, 4, 8, 16 Kbytes
0xE000
0x3F
0xF000
0xF800
FLASH_END = 0xFFFF
0xFF00–0xFF0F (Flash Configuration Field)
Note: 0x38–0x3F correspond to the PPAGE register content
Figure 20-2. Flash Memory Map
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Table 20-2. Flash Array Memory Map Summary
MCU Address
Range
Protectable
Low Range
Protectable
High Range
Array Relative
Address(1)
PPAGE
0x0000–0x3FFF(2)
Unpaged
(0x3D)
N.A.
N.A.
0x14000–0x17FFF
0x4000–0x7FFF
Unpaged
(0x3E)
0x4000–0x43FF
0x4000–0x47FF
0x4000–0x4FFF
0x4000–0x5FFF
N.A.
N.A.
0x18000–0x1BFFF
0x8000–0xBFFF
0x38
0x39
0x3A
0x3B
0x3C
0x3D
0x3E
N.A.
N.A.
N.A.
N.A.
N.A.
N.A.
N.A.
0x00000–0x03FFF
0x04000–0x07FFF
0x08000–0x0BFFF
0x0C000–0x0FFFF
0x10000–0x13FFF
0x14000–0x17FFF
0x18000–0x1BFFF
N.A.
N.A.
N.A.
N.A.
N.A.
0x8000–0x83FF
0x8000–0x87FF
0x8000–0x8FFF
0x8000–0x9FFF
N.A.
0x3F
0xB800–0xBFFF
0xB000–0xBFFF
0xA000–0xBFFF
0x8000–0xBFFF
0xF800–0xFFFF
0xF000–0xFFFF
0xE000–0xFFFF
0xC000–0xFFFF
0x1C000–0x1FFFF
0x1C000–0x1FFFF
0xC000–0xFFFF
Unpaged
(0x3F)
N.A.
1. Inside Flash block.
2. If allowed by MCU.
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20.3.2 Register Descriptions
The Flash module contains a set of 16 control and status registers located between module base + 0x0000
and 0x000F. A summary of the Flash module registers is given in Figure 20-3. Detailed descriptions of
each register bit are provided.
Register
Name
Bit 7
6
5
4
3
2
1
Bit 0
R
W
R
FDIVLD
0x0000
FCLKDIV
PRDIV8
KEYEN0
FDIV5
NV5
FDIV4
NV4
FDIV3
NV3
FDIV2
NV2
FDIV1
SEC1
FDIV0
SEC0
KEYEN1
0
0x0001
FSEC
W
R
0x0002
0
0
0
0
0
0
0
0
0
0
RESERVED1
W
(1)
R
W
R
0
0
0x0003
FCNFG
CBEIE
CCIE
KEYACC
FPHDIS
PVIOL
0x0004
FPROT
FPOPEN
NV6
FPHS1
FPHS0
0
FPLDIS
BLANK
FPLS1
FPLS0
DONE
W
R
CCIF
0x0005
FSTAT
CBEIF
0
ACCERR
0
FAIL
0
W
R
0
0
0x0006
FCMD
CMDB6
0
CMDB5
0
CMDB2
0
CMDB0
0
W
R
0
0
0
0x0007
RESERVED21
W
R
0x0008
FABHI
FADDRHI1
W
R
0x0009
FABLO
FDHI
FADDRLO1
W
R
0x000A
FDATAHI1
W
R
0x000B
FDLO
FDATALO1
W
R
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x000C
RESERVED31
W
R
0x000D
RESERVED41
W
R
0x000E
RESERVED51
W
R
0x000F
RESERVED61
W
= Unimplemented or Reserved
Figure 20-3. Flash Register Summary
1. Intended for factory test purposes only.
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20.3.2.1 Flash Clock Divider Register (FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
Module Base + 0x0000
7
6
5
4
3
2
1
0
R
W
FDIVLD
PRDIV8
FDIV5
FDIV4
FDIV3
FDIV2
FDIV1
FDIV0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 20-4. Flash Clock Divider Register (FCLKDIV)
All bits in the FCLKDIV register are readable, bits 6–0 are write once and bit 7 is not writable.
Table 20-3. FCLKDIV Field Descriptions
Field
Description
7
Clock Divider Loaded
FDIVLD
0 FCLKDIV register has not been written
1 FCLKDIV register has been written to since the last reset
6
Enable Prescalar by 8
PRDIV8
0 The oscillator clock is directly fed into the Flash clock divider
1 The oscillator clock is divided by 8 before feeding into the Flash clock divider
5–0
Clock Divider Bits — The combination of PRDIV8 and FDIV[5:0] must divide the oscillator clock down to a
FDIV[5:0] frequency of 150 kHz – 200 kHz. The maximum divide ratio is 512. Refer to Section 20.4.1.1, “Writing the
FCLKDIV Register” for more information.
20.3.2.2 Flash Security Register (FSEC)
The FSEC register holds all bits associated with the security of the MCU and Flash module.
Module Base + 0x0001
7
6
5
4
3
2
1
0
R
W
KEYEN1
KEYEN0
NV5
NV4
NV3
NV2
SEC1
SEC0
Reset
F
F
F
F
F
F
F
F
= Unimplemented or Reserved
Figure 20-5. Flash Security Register (FSEC)
All bits in the FSEC register are readable but not writable.
The FSEC register is loaded from the Flash configuration field at 0xFF0F during the reset sequence,
indicated by F in Figure 20-5.
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Table 20-4. FSEC Field Descriptions
Field
Description
7–6
Backdoor Key Security Enable Bits — The KEYEN[1:0] bits define the enabling of the backdoor key access
KEYEN[1:0] to the Flash module as shown in Table 20-5.
5–2
Nonvolatile Flag Bits — The NV[5:2] bits are available to the user as nonvolatile flags.
NV[5:2]
1–0
Flash Security Bits — The SEC[1:0] bits define the security state of the MCU as shown in Table 20-6. If the
SEC[1:0]
Flash module is unsecured using backdoor key access, the SEC[1:0] bits are forced to 1:0.
Table 20-5. Flash KEYEN States
KEYEN[1:0]
Status of Backdoor Key Access
00
01(1)
10
DISABLED
DISABLED
ENABLED
DISABLED
11
1. Preferred KEYEN state to disable Backdoor Key Access.
Table 20-6. Flash Security States
SEC[1:0]
Status of Security
00
01(1)
10
Secured
Secured
Unsecured
11
Secured
1. Preferred SEC state to set MCU to secured state.
The security function in the Flash module is described in Section 20.4.3, “Flash Module Security”.
20.3.2.3 RESERVED1
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x0002
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 20-6. RESERVED1
All bits read 0 and are not writable.
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Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1)
20.3.2.4 Flash Configuration Register (FCNFG)
The FCNFG register enables the Flash interrupts and gates the security backdoor key writes.
Module Base + 0x0003
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
CBEIE
CCIE
KEYACC
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 20-7. Flash Configuration Register (FCNFG)
CBEIE, CCIE, and KEYACC are readable and writable while remaining bits read 0 and are not writable.
KEYACC is only writable if the KEYEN bit in the FSEC register is set to the enabled state (see Section
20.3.2.2).
Table 20-7. FCNFG Field Descriptions
Field
Description
7
Command Buffer Empty Interrupt Enable — The CBEIE bit enables the interrupts in case of an empty
command buffer in the Flash module.
CBEIE
0 Command Buffer Empty interrupts disabled
1 An interrupt will be requested whenever the CBEIF flag is set (see Section 20.3.2.6)
6
Command Complete Interrupt Enable — The CCIE bit enables the interrupts in case of all commands being
completed in the Flash module.
CCIE
0 Command Complete interrupts disabled
1 An interrupt will be requested whenever the CCIF flag is set (see Section 20.3.2.6)
5
Enable Security Key Writing.
KEYACC
0 Flash writes are interpreted as the start of a command write sequence
1 Writes to the Flash array are interpreted as a backdoor key while reads of the Flash array return invalid data
20.3.2.5 Flash Protection Register (FPROT)
The FPROT register defines which Flash sectors are protected against program or erase.
Module Base + 0x0004
7
6
5
4
3
2
1
0
R
W
FPOPEN
NV6
FPHDIS
FPHS1
FPHS0
FPLDIS
FPLS1
FPLS0
Reset
F
F
F
F
F
F
F
F
Figure 20-8. Flash Protection Register (FPROT)
The FPROT register is readable in normal and special modes. FPOPEN can only be written from a 1 to a 0.
FPLS[1:0] can be written anytime until FPLDIS is cleared. FPHS[1:0] can be written anytime until
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FPHDIS is cleared. The FPROT register is loaded from Flash address 0xFF0D during the reset sequence,
indicated by F in Figure 20-8.
To change the Flash protection that will be loaded on reset, the upper sector of the Flash array must be
unprotected, then the Flash protection byte located at Flash address 0xFF0D must be written to.
A protected Flash sector is disabled by FPHDIS and FPLDIS while the size of the protected sector is
defined by FPHS[1:0] and FPLS[1:0] in the FPROT register.
Trying to alter any of the protected areas will result in a protect violation error and the PVIOL flag will be
set in the FSTAT register (see Section 20.3.2.6). A mass erase of the whole Flash array is only possible
when protection is fully disabled by setting the FPOPEN, FPLDIS, and FPHDIS bits. An attempt to mass
erase a Flash array while protection is enabled will set the PVIOL flag in the FSTAT register.
Table 20-8. FPROT Field Descriptions
Field
Description
7
Protection Function for Program or Erase — It is possible using the FPOPEN bit to either select address
FPOPEN ranges to be protected using FPHDIS, FPLDIS, FPHS[1:0] and FPLS[1:0] or to select the same ranges to be
unprotected. When FPOPEN is set, FPxDIS enables the ranges to be protected, whereby clearing FPxDIS
enables protection for the range specified by the corresponding FPxS[1:0] bits. When FPOPEN is cleared,
FPxDIS defines unprotected ranges as specified by the corresponding FPxS[1:0] bits. In this case, setting
FPxDIS enables protection. Thus the effective polarity of the FPxDIS bits is swapped by the FPOPEN bit as
shown in Table 20-9. This function allows the main part of the Flash array to be protected while a small range
can remain unprotected for EEPROM emulation.
0 The FPHDIS and FPLDIS bits define Flash address ranges to be unprotected
1 The FPHDIS and FPLDIS bits define Flash address ranges to be protected
6
Nonvolatile Flag Bit — The NV6 bit should remain in the erased state for future enhancements.
NV6
5
Flash Protection Higher Address Range Disable — The FPHDIS bit determines whether there is a
protected/unprotected area in the higher space of the Flash address map.
0 Protection/unprotection enabled
FPHDIS
1 Protection/unprotection disabled
4–3
Flash Protection Higher Address Size — The FPHS[1:0] bits determine the size of the protected/unprotected
FPHS[1:0] sector as shown in Table 20-10. The FPHS[1:0] bits can only be written to while the FPHDIS bit is set.
2
Flash Protection Lower Address Range Disable — The FPLDIS bit determines whether there is a
protected/unprotected sector in the lower space of the Flash address map.
0 Protection/unprotection enabled
FPLDIS
1 Protection/unprotection disabled
1–0
Flash Protection Lower Address Size — The FPLS[1:0] bits determine the size of the protected/unprotected
FPLS[1:0] sector as shown in Table 20-11. The FPLS[1:0] bits can only be written to while the FPLDIS bit is set.
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Table 20-9. Flash Protection Function
FPOPEN FPHDIS FPHS[1] FPHS[0] FPLDIS FPLS[1] FPLS[0]
Function(1)
No protection
1
1
1
1
0
0
0
0
1
1
0
0
1
0
1
0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
1
0
1
0
1
1
0
0
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Protect low range
Protect high range
Protect high and low ranges
Full Flash array protected
Unprotected high range
Unprotected low range
Unprotected high and low ranges
1. For range sizes refer to Table 20-10 and Table 20-11 or .
Table 20-10. Flash Protection Higher Address Range
FPHS[1:0]
Address Range
Range Size
00
01
10
11
0xF800–0xFFFF
0xF000–0xFFFF
0xE000–0xFFFF
0xC000–0xFFFF
2 Kbytes
4 Kbytes
8 Kbytes
16 Kbytes
Table 20-11. Flash Protection Lower Address Range
FPLS[1:0]
Address Range
Range Size
00
01
10
11
0x4000–0x43FF
0x4000–0x47FF
0x4000–0x4FFF
0x4000–0x5FFF
1 Kbyte
2 Kbytes
4 Kbytes
8 Kbytes
Figure 20-9 illustrates all possible protection scenarios. Although the protection scheme is loaded from the
Flash array after reset, it is allowed to change in normal modes. This protection scheme can be used by
applications requiring re-programming in single chip mode while providing as much protection as possible
if no re-programming is required.
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FPHDIS = 1
FPLDIS = 1
7
FPHDIS = 1
FPHDIS = 0
FPLDIS = 1
5
FPHDIS = 0
FPLDIS = 0
4
FPLDIS = 0
6
Scenario
0xFFFF
Scenario
3
2
1
0
0xFFFF
Protected Flash
Figure 20-9. Flash Protection Scenarios
20.3.2.5.1
Flash Protection Restrictions
The general guideline is that protection can only be added, not removed. All valid transitions between
Flash protection scenarios are specified in Table 20-12. Any attempt to write an invalid scenario to the
FPROT register will be ignored and the FPROT register will remain unchanged. The contents of the
FPROT register reflect the active protection scenario.
Table 20-12. Flash Protection Scenario Transitions
From
To Protection Scenario(1)
Protection
Scenario
0
1
2
3
4
5
6
7
0
1
2
3
4
5
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
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Table 20-12. Flash Protection Scenario Transitions
From
To Protection Scenario(1)
Protection
Scenario
0
1
2
3
4
5
6
7
6
7
X
X
X
X
X
X
X
X
X
X
X
X
1. Allowed transitions marked with X.
20.3.2.6 Flash Status Register (FSTAT)
The FSTAT register defines the status of the Flash command controller and the results of command
execution.
Module Base + 0x0005
7
6
5
4
3
2
1
0
R
W
CCIF
0
BLANK
DONE
CBEIF
PVIOL
ACCERR
FAIL
Reset
1
1
0
0
0
0
0
1
= Unimplemented or Reserved
Figure 20-10. Flash Status Register (FSTAT)
In normal modes, bits CBEIF, PVIOL, and ACCERR are readable and writable, bits CCIF and BLANK
are readable and not writable, remaining bits, including FAIL and DONE, read 0 and are not writable. In
special modes, FAIL is readable and writable while DONE is readable but not writable. FAIL must be clear
in special modes when starting a command write sequence.
Table 20-13. FSTAT Field Descriptions
Field
Description
7
Command Buffer Empty Interrupt Flag — The CBEIF flag indicates that the address, data and command
buffers are empty so that a new command write sequence can be started. The CBEIF flag is cleared by writing
a 1 to CBEIF. Writing a 0 to the CBEIF flag has no effect on CBEIF. Writing a 0 to CBEIF after writing an aligned
word to the Flash address space but before CBEIF is cleared will abort a command write sequence and cause
the ACCERR flag in the FSTAT register to be set. Writing a 0 to CBEIF outside of a command write sequence
will not set the ACCERR flag. The CBEIF flag is used together with the CBEIE bit in the FCNFG register to
generate an interrupt request (see Figure 20-26).
CBEIF
0 Buffers are full
1 Buffers are ready to accept a new command
6
Command Complete Interrupt Flag — The CCIF flag indicates that there are no more commands pending. The
CCIF flag is cleared when CBEIF is clear and sets automatically upon completion of all active and pending
commands. The CCIF flag does not set when an active commands completes and a pending command is
fetched from the command buffer. Writing to the CCIF flag has no effect. The CCIF flag is used together with the
CCIE bit in the FCNFG register to generate an interrupt request (see Figure 20-26).
0 Command in progress
CCIF
1 All commands are completed
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Table 20-13. FSTAT Field Descriptions
Field
Description
5
Protection Violation — The PVIOL flag indicates an attempt was made to program or erase an address in a
protected Flash array memory area. The PVIOL flag is cleared by writing a 1 to PVIOL. Writing a 0 to the PVIOL
flag has no effect on PVIOL. While PVIOL is set, it is not possible to launch another command.
0 No protection violation detected
PVIOL
1 Protection violation has occurred
4
Access Error — The ACCERR flag indicates an illegal access to the Flash array caused by either a violation of
ACCERR the command write sequence, issuing an illegal command (illegal combination of the CMDBx bits in the FCMD
register) or the execution of a CPU STOP instruction while a command is executing (CCIF=0). The ACCERR flag
is cleared by writing a 1 to ACCERR. Writing a 0 to the ACCERR flag has no effect on ACCERR. While ACCERR
is set, it is not possible to launch another command.
0 No access error detected
1 Access error has occurred
2
Flash Array Has Been Verified as Erased — The BLANK flag indicates that an erase verify command has
checked the Flash array and found it to be erased. The BLANK flag is cleared by hardware when CBEIF is
cleared as part of a new valid command write sequence. Writing to the BLANK flag has no effect on BLANK.
0 If an erase verify command has been requested, and the CCIF flag is set, then a 0 in BLANK indicates the
array is not erased
BLANK
1 Flash array verifies as erased
1
FAIL
Flag Indicating a Failed Flash Operation — In special modes, the FAIL flag will set if the erase verify operation
fails (Flash array verified as not erased). Writing a 0 to the FAIL flag has no effect on FAIL. The FAIL flag is cleared
by writing a 1 to FAIL. While FAIL is set, it is not possible to launch another command.
0 Flash operation completed without error
1 Flash operation failed
0
Flag Indicating a Failed Operation is not Active — In special modes, the DONE flag will clear if a program,
erase, or erase verify operation is active.
DONE
0 Flash operation is active
1 Flash operation is not active
20.3.2.7 Flash Command Register (FCMD)
The FCMD register defines the Flash commands.
Module Base + 0x0006
7
6
5
4
3
2
1
0
R
W
0
0
0
0
CMDB6
CMDB5
CMDB2
CMDB0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 20-11. Flash Command Register (FCMD)
Bits CMDB6, CMDB5, CMDB2, and CMDB0 are readable and writable during a command write
sequence while bits 7, 4, 3, and 1 read 0 and are not writable.
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Table 20-14. FCMD Field Descriptions
Field
Description
6, 5, 2, 0
Valid Flash commands are shown in Table 20-15. An attempt to execute any command other than those listed in
CMDB[6:5] Table 20-15 will set the ACCERR bit in the FSTAT register (see Section 20.3.2.6).
CMDB[2]
CMDB[0]
Table 20-15. Valid Flash Command List
CMDB
NVM Command
0x05
0x20
0x40
0x41
Erase verify
Word program
Sector erase
Mass erase
20.3.2.8 RESERVED2
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x0007
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 20-12. RESERVED2
All bits read 0 and are not writable.
20.3.2.9 Flash Address Register (FADDR)
FADDRHI and FADDRLO are the Flash address registers.
\
Module Base + 0x0008
7
6
5
4
3
2
1
0
R
W
FABHI
Reset
0
0
0
0
0
0
0
0
Figure 20-13. Flash Address High Register (FADDRHI)
\
\
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Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1)
Module Base + 0x0009
7
6
5
4
3
2
1
0
R
W
FABLO
Reset
0
0
0
0
0
0
0
0
Figure 20-14. Flash Address Low Register (FADDRLO)
In normal modes, all FABHI and FABLO bits read 0 and are not writable. In special modes, the FABHI
and FABLO bits are readable and writable. For sector erase, the MCU address bits [9:0] are ignored. For
mass erase, any address within the Flash array is valid to start the command.
20.3.2.10 Flash Data Register (FDATA)
FDATAHI and FDATALO are the Flash data registers.
Module Base + 0x000A
7
6
5
4
3
2
1
0
R
W
FDHI
Reset
0
0
0
0
0
0
0
0
Figure 20-15. Flash Data High Register (FDATAHI)
Module Base + 0x000B
7
6
5
4
3
2
1
0
R
FDLO
W
Reset
0
0
0
0
0
0
0
0
Figure 20-16. Flash Data Low Register (FDATALO)
In normal modes, all FDATAHI and FDATALO bits read 0 and are not writable. In special modes, all
FDATAHI and FDATALO bits are readable and writable when writing to an address within the Flash
address range.
20.3.2.11 RESERVED3
This register is reserved for factory testing and is not accessible to the user.
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Module Base + 0x000C
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 20-17. RESERVED3
All bits read 0 and are not writable.
20.3.2.12 RESERVED4
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x000D
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 20-18. RESERVED4
All bits read 0 and are not writable.
20.3.2.13 RESERVED5
This register is reserved for factory testing and is not accessible to the user.
Module Base + 0x000E
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 20-19. RESERVED5
All bits read 0 and are not writable.
20.3.2.14 RESERVED6
This register is reserved for factory testing and is not accessible to the user.
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Module Base + 0x000F
7
6
5
4
3
2
1
0
R
W
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
= Unimplemented or Reserved
Figure 20-20. RESERVED6
All bits read 0 and are not writable.
20.4 Functional Description
20.4.1 Flash Command Operations
Write operations are used for the program, erase, and erase verify algorithms described in this section. The
program and erase algorithms are controlled by a state machine whose timebase FCLK is derived from the
oscillator clock via a programmable divider. The FCMD register as well as the associated FADDR and
FDATA registers operate as a buffer and a register (2-stage FIFO) so that a new command along with the
necessary data and address can be stored to the buffer while the previous command is still in progress. This
pipelined operation allows a time optimization when programming more than one word on a specific row,
as the high voltage generation can be kept active in between two programming commands. The pipelined
operation also allows a simplification of command launching. Buffer empty as well as command
completion are signalled by flags in the FSTAT register with corresponding interrupts generated, if
enabled.
The next sections describe:
•
•
•
•
How to write the FCLKDIV register
Command write sequence used to program, erase or erase verify the Flash array
Valid Flash commands
Errors resulting from illegal Flash operations
20.4.1.1 Writing the FCLKDIV Register
Prior to issuing any Flash command after a reset, it is first necessary to write the FCLKDIV register to
divide the oscillator clock down to within the 150-kHz to 200-kHz range. Since the program and erase
timings are also a function of the bus clock, the FCLKDIV determination must take this information into
account.
If we define:
•
•
•
FCLK as the clock of the Flash timing control block
Tbus as the period of the bus clock
INT(x) as taking the integer part of x (e.g., INT(4.323) = 4),
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then FCLKDIV register bits PRDIV8 and FDIV[5:0] are to be set as described in Figure 20-21.
For example, if the oscillator clock frequency is 950 kHz and the bus clock is 10 MHz, FCLKDIV bits
FDIV[5:0] should be set to 4 (000100) and bit PRDIV8 set to 0. The resulting FCLK is then 190 kHz. As
a result, the Flash algorithm timings are increased over optimum target by:
(200 – 190) ⁄ 200 × 100 = 5%
Command execution time will increase proportionally with the period of FCLK.
CAUTION
Because of the impact of clock synchronization on the accuracy of the
functional timings, programming or erasing the Flash array cannot be
performed if the bus clock runs at less than 1 MHz. Programming or erasing
the Flash array with an input clock < 150 kHz should be avoided. Setting
FCLKDIV to a value such that FCLK < 150 kHz can destroy the Flash array
due to overstress. Setting FCLKDIV to a value such that (1/FCLK + Tbus)
< 5µs can result in incomplete programming or erasure of the Flash array
cells.
If the FCLKDIV register is written, the bit FDIVLD is set automatically. If the FDIVLD bit is 0, the
FCLKDIV register has not been written since the last reset. If the FCLKDIV register has not been written
to, the Flash command loaded during a command write sequence will not execute and the ACCERR flag
in the FSTAT register will set.
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Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1)
START
no
Tbus < 1µs?
ALL COMMANDS IMPOSSIBLE
yes
PRDIV8=0 (reset)
no
oscillator_clock
12.8MHz?
yes
PRDIV8=1
PRDCLK=oscillator_clock/8
PRDCLK=oscillator_clock
no
PRDCLK[MHz]*(5+Tbus[µs])
an integer?
FDIV[5:0]=INT(PRDCLK[MHz]*(5+Tbus[µs]))
yes
FDIV[5:0]=PRDCLK[MHz]*(5+Tbus[µs])-1
TRY TO DECREASE Tbus
FCLK=(PRDCLK)/(1+FDIV[5:0])
yes
1/FCLK[MHz] + Tbus[µs] > 5
END
AND
FCLK > 0.15MHz
?
no
yes
FDIV[5:0] > 4?
no
ALL COMMANDS IMPOSSIBLE
Figure 20-21. PRDIV8 and FDIV Bits Determination Procedure
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20.4.1.2 Command Write Sequence
The Flash command controller is used to supervise the command write sequence to execute program,
erase, and erase verify algorithms.
Before starting a command write sequence, the ACCERR and PVIOL flags in the FSTAT register must be
clear and the CBEIF flag should be tested to determine the state of the address, data, and command buffers.
If the CBEIF flag is set, indicating the buffers are empty, a new command write sequence can be started.
If the CBEIF flag is clear, indicating the buffers are not available, a new command write sequence will
overwrite the contents of the address, data, and command buffers.
A command write sequence consists of three steps which must be strictly adhered to with writes to the
Flash module not permitted between the steps. However, Flash register and array reads are allowed during
a command write sequence. The basic command write sequence is as follows:
1. Write to a valid address in the Flash array memory.
2. Write a valid command to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the command.
The address written in step 1 will be stored in the FADDR registers and the data will be stored in the
FDATA registers. When the CBEIF flag is cleared in step 3, the CCIF flag is cleared by the Flash command
controller indicating that the command was successfully launched. For all command write sequences, the
CBEIF flag will set after the CCIF flag is cleared indicating that the address, data, and command buffers
are ready for a new command write sequence to begin. A buffered command will wait for the active
operation to be completed before being launched. Once a command is launched, the completion of the
command operation is indicated by the setting of the CCIF flag in the FSTAT register. The CCIF flag will
set upon completion of all active and buffered commands.
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20.4.1.3 Valid Flash Commands
Table 20-16 summarizes the valid Flash commands along with the effects of the commands on the Flash
array.
Table 20-16. Valid Flash Commands
FCMD
Meaning
Function on Flash Array
Verify all bytes in the Flash array are erased.
0x05
Erase
Verify
If the Flash array is erased, the BLANK bit will set in the FSTAT register upon command completion.
0x20
0x40
Program
Program a word (2 bytes) in the Flash array.
Sector
Erase
Erase all 1024 bytes in a sector of the Flash array.
0x41
Mass
Erase
Erase all bytes in the Flash array.
A mass erase of the full Flash array is only possible when FPLDIS, FPHDIS, and FPOPEN bits in
the FPROT register are set prior to launching the command.
CAUTION
A Flash word must be in the erased state before being programmed.
Cumulative programming of bits within a Flash word is not allowed.
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20.4.1.3.1
Erase Verify Command
The erase verify operation will verify that a Flash array is erased.
An example flow to execute the erase verify operation is shown in Figure 20-22. The erase verify command
write sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the erase verify command.
The address and data written will be ignored.
2. Write the erase verify command, 0x05, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the erase verify
command.
After launching the erase verify command, the CCIF flag in the FSTAT register will set after the operation
has completed unless a new command write sequence has been buffered. Upon completion of the erase
verify operation, the BLANK flag in the FSTAT register will be set if all addresses in the Flash array are
verified to be erased. If any address in the Flash array is not erased, the erase verify operation will terminate
and the BLANK flag in the FSTAT register will remain clear.
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Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1)
START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
Written
Check
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Array Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Erase Verify Command 0x05
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
no
CCIF
Set?
yes
Erase Verify
Status
BLANK
Set?
yes
Flash Array
Erased
Flash Array
EXIT
EXIT
Not Erased
Figure 20-22. Example Erase Verify Command Flow
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20.4.1.3.2
Program Command
The program operation will program a previously erased word in the Flash array using an embedded
algorithm.
An example flow to execute the program operation is shown in Figure 20-23. The program command write
sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the program command. The
data written will be programmed to the Flash array address written.
2. Write the program command, 0x20, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the program
command.
If a word to be programmed is in a protected area of the Flash array, the PVIOL flag in the FSTAT register
will set and the program command will not launch. Once the program command has successfully launched,
the CCIF flag in the FSTAT register will set after the program operation has completed unless a new
command write sequence has been buffered. By executing a new program command write sequence on
sequential words after the CBEIF flag in the FSTAT register has been set, up to 55% faster programming
time per word can be effectively achieved than by waiting for the CCIF flag to set after each program
operation.
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Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1)
START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
Written
Check
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Address
and program Data
1.
2.
3.
Write: FCMD register
Program Command 0x20
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Buffer Empty
Check
no
CBEIF
Set?
yes
Sequential
Programming
Decision
yes
Next
Word?
no
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 20-23. Example Program Command Flow
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20.4.1.3.3
Sector Erase Command
The sector erase operation will erase all addresses in a 1024 byte sector of the Flash array using an
embedded algorithm.
An example flow to execute the sector erase operation is shown in Figure 20-24. The sector erase
command write sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the sector erase command.
The Flash address written determines the sector to be erased while MCU address bits [9:0] and the
data written are ignored.
2. Write the sector erase command, 0x40, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the sector erase
command.
If a Flash sector to be erased is in a protected area of the Flash array, the PVIOL flag in the FSTAT register
will set and the sector erase command will not launch. Once the sector erase command has successfully
launched, the CCIF flag in the FSTAT register will set after the sector erase operation has completed unless
a new command write sequence has been buffered.
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Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1)
START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
Written
Check
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Sector Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Sector Erase Command 0x40
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 20-24. Example Sector Erase Command Flow
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20.4.1.3.4
Mass Erase Command
The mass erase operation will erase all addresses in a Flash array using an embedded algorithm.
An example flow to execute the mass erase operation is shown in Figure 20-25. The mass erase command
write sequence is as follows:
1. Write to a Flash array address to start the command write sequence for the mass erase command.
The address and data written will be ignored.
2. Write the mass erase command, 0x41, to the FCMD register.
3. Clear the CBEIF flag in the FSTAT register by writing a 1 to CBEIF to launch the mass erase
command.
If a Flash array to be erased contains any protected area, the PVIOL flag in the FSTAT register will set and
the mass erase command will not launch. Once the mass erase command has successfully launched, the
CCIF flag in the FSTAT register will set after the mass erase operation has completed unless a new
command write sequence has been buffered.
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Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1)
START
Read: FCLKDIV register
Clock Register
NOTE: FCLKDIV needs to
be set once after each reset.
FDIVLD
Set?
no
Written
Check
yes
Write: FCLKDIV register
Read: FSTAT register
Address, Data,
Command
Buffer Empty Check
CBEIF
Set?
no
yes
ACCERR/
PVIOL
Set?
yes
Access Error and
Protection Violation
Check
Write: FSTAT register
Clear ACCERR/PVIOL 0x30
no
Write: Flash Block Address
and Dummy Data
1.
2.
3.
Write: FCMD register
Mass Erase Command 0x41
Write: FSTAT register
Clear CBEIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion
Check
no
CCIF
Set?
yes
EXIT
Figure 20-25. Example Mass Erase Command Flow
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20.4.1.4 Illegal Flash Operations
20.4.1.4.1
Access Error
The ACCERR flag in the FSTAT register will be set during the command write sequence if any of the
following illegal Flash operations are performed causing the command write sequence to immediately
abort:
1. Writing to the Flash address space before initializing the FCLKDIV register
2. Writing a misaligned word or a byte to the valid Flash address space
3. Writing to the Flash address space while CBEIF is not set
4. Writing a second word to the Flash address space before executing a program or erase command
on the previously written word
5. Writing to any Flash register other than FCMD after writing a word to the Flash address space
6. Writing a second command to the FCMD register before executing the previously written
command
7. Writing an invalid command to the FCMD register
8. Writing to any Flash register other than FSTAT (to clear CBEIF) after writing to the FCMD register
9. The part enters stop mode and a program or erase command is in progress. The command is aborted
and any pending command is killed
10. When security is enabled, a command other than mass erase originating from a non-secure memory
or from the background debug mode is written to the FCMD register
11. A 0 is written to the CBEIF bit in the FSTAT register to abort a command write sequence.
The ACCERR flag will not be set if any Flash register is read during the command write sequence. If the
Flash array is read during execution of an algorithm (CCIF=0), the Flash module will return invalid data
and the ACCERR flag will not be set. If an ACCERR flag is set in the FSTAT register, the Flash command
controller is locked. It is not possible to launch another command until the ACCERR flag is cleared.
20.4.1.4.2
Protection Violation
The PVIOL flag in the FSTAT register will be set during the command write sequence after the word write
to the Flash address space if any of the following illegal Flash operations are performed, causing the
command write sequence to immediately abort:
1. Writing a Flash address to program in a protected area of the Flash array (see Section 20.3.2.5).
2. Writing a Flash address to erase in a protected area of the Flash array.
3. Writing the mass erase command to the FCMD register while any protection is enabled.
If the PVIOL flag is set, the Flash command controller is locked. It is not possible to launch another
command until the PVIOL flag is cleared.
Freescale Semiconductor
MC9S12Q128
Rev 1.10
595
Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1)
20.4.2 Operating Modes
20.4.2.1 Wait Mode
If the MCU enters wait mode while a Flash command is active (CCIF = 0), that command and any buffered
command will be completed.
The Flash module can recover the MCU from wait mode if the interrupts are enabled (see Section 20.4.5).
20.4.2.2 Stop Mode
If the MCU enters stop mode while a Flash command is active (CCIF = 0), that command will be aborted
and the data being programmed or erased is lost. The high voltage circuitry to the Flash array will be
switched off when entering stop mode. CCIF and ACCERR flags will be set. Upon exit from stop mode,
the CBEIF flag will be set and any buffered command will not be executed. The ACCERR flag must be
cleared before returning to normal operation.
NOTE
As active Flash commands are immediately aborted when the MCU enters
stop mode, it is strongly recommended that the user does not use the STOP
instruction during program and erase execution.
20.4.2.3 Background Debug Mode
In background debug mode (BDM), the FPROT register is writable. If the MCU is unsecured, then all
Flash commands listed in Table 20-16 can be executed. If the MCU is secured and is in special single chip
mode, the only possible command to execute is mass erase.
20.4.3 Flash Module Security
The Flash module provides the necessary security information to the MCU. After each reset, the Flash
module determines the security state of the MCU as defined in Section 20.3.2.2, “Flash Security Register
(FSEC)”.
The contents of the Flash security/options byte at address 0xFF0F in the Flash configuration field must be
changed directly by programming address 0xFF0F when the device is unsecured and the higher address
sector is unprotected. If the Flash security/options byte is left in the secure state, any reset will cause the
MCU to return to the secure operating mode.
20.4.3.1 Unsecuring the MCU using Backdoor Key Access
The MCU may only be unsecured by using the backdoor key access feature which requires knowledge of
the contents of the backdoor key (four 16-bit words programmed at addresses 0xFF00–0xFF07). If
KEYEN[1:0] = 1:0 and the KEYACC bit is set, a write to a backdoor key address in the Flash array triggers
a comparison between the written data and the backdoor key data stored in the Flash array. If all four words
of data are written to the correct addresses in the correct order and the data matches the backdoor key
stored in the Flash array, the MCU will be unsecured. The data must be written to the backdoor key
596
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1)
addresses sequentially staring with 0xFF00-0xFF01 and ending with 0xFF06–0xFF07. The values 0x0000
and 0xFFFF are not permitted as keys. When the KEYACC bit is set, reads of the Flash array will return
invalid data.
The user code stored in the Flash array must have a method of receiving the backdoor key from an external
stimulus. This external stimulus would typically be through one of the on-chip serial ports.
If KEYEN[1:0] = 1:0 in the FSEC register, the MCU can be unsecured by the backdoor key access
sequence described below:
1. Set the KEYACC bit in the FCNFG register
2. Write the correct four 16-bit words to Flash addresses 0xFF00–0xFF07 sequentially starting with
0xFF00
3. Clear the KEYACC bit in the FCNFG register
4. If all four 16-bit words match the backdoor key stored in Flash addresses 0xFF00–0xFF07, the
MCU is unsecured and bits SEC[1:0] in the FSEC register are forced to the unsecure state of 1:0
The backdoor key access sequence is monitored by the internal security state machine. An illegal operation
during the backdoor key access sequence will cause the security state machine to lock, leaving the MCU
in the secured state. A reset of the MCU will cause the security state machine to exit the lock state and
allow a new backdoor key access sequence to be attempted. The following illegal operations will lock the
security state machine:
1. If any of the four 16-bit words does not match the backdoor key programmed in the Flash array
2. If the four 16-bit words are written in the wrong sequence
3. If more than four 16-bit words are written
4. If any of the four 16-bit words written are 0x0000 or 0xFFFF
5. If the KEYACC bit does not remain set while the four 16-bit words are written
After the backdoor key access sequence has been correctly matched, the MCU will be unsecured. The
Flash security byte can be programmed to the unsecure state, if desired.
In the unsecure state, the user has full control of the contents of the four word backdoor key by
programming bytes 0xFF00–0xFF07 of the Flash configuration field.
The security as defined in the Flash security/options byte at address 0xFF0F is not changed by using the
backdoor key access sequence to unsecure. The backdoor key stored in addresses 0xFF00–0xFF07 is
unaffected by the backdoor key access sequence. After the next reset sequence, the security state of the
Flash module is determined by the Flash security/options byte at address 0xFF0F. The backdoor key access
sequence has no effect on the program and erase protection defined in the FPROT register.
It is not possible to unsecure the MCU in special single chip mode by executing the backdoor key access
sequence in background debug mode.
Freescale Semiconductor
MC9S12Q128
Rev 1.10
597
Chapter 20 128 Kbyte Flash Module (S12FTS128K1V1)
20.4.4 Flash Reset Sequence
On each reset, the Flash module executes a reset sequence to hold CPU activity while loading the following
registers from the Flash array memory according to Table 20-1:
•
•
FPROT — Flash Protection Register (see Section 20.3.2.5)
FSEC — Flash Security Register (see Section 20.3.2.2)
20.4.4.1 Reset While Flash Command Active
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector/array being erased is not guaranteed.
20.4.5 Interrupts
The Flash module can generate an interrupt when all Flash commands have completed execution or the
Flash address, data, and command buffers are empty.
Table 20-17. Flash Interrupt Sources
Interrupt Source
Interrupt Flag
Local Enable
Global (CCR) Mask
Flash Address, Data, and Command
Buffers are empty
CBEIF
(FSTAT register)
CBEIE
I Bit
All Flash commands have completed
execution
CCIF
(FSTAT register)
CCIE
I Bit
NOTE
Vector addresses and their relative interrupt priority are determined at the
MCU level.
20.4.5.1 Description of Interrupt Operation
Figure 20-26 shows the logic used for generating interrupts.
The Flash module uses the CBEIF and CCIF flags in combination with the enable bits CBIE and CCIE to
discriminate for the generation of interrupts.
CBEIF
CBEIE
FLASH INTERRUPT REQUEST
CCIF
CCIE
Figure 20-26. Flash Interrupt Implementation
For a detailed description of these register bits, refer to Section 20.3.2.4, “Flash Configuration Register
(FCNFG)” and Section 20.3.2.6, “Flash Status Register (FSTAT)”.
598
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
Appendix A
Electrical Characteristics
A.1
General
NOTE
The electrical characteristics given in this section are preliminary and
should be used as a guide only. Values cannot be guaranteed by Freescale
and are subject to change without notice.
The parts are specified and tested over the 5V and 3.3V ranges. For the
intermediate range, generally the electrical specifications for the 3.3V range
apply, but the parts are not tested in production test in the intermediate
range.
This supplement contains the most accurate electrical information for the MC9S12Q128 microcontrollers
available at the time of publication. The information should be considered PRELIMINARY and is subject
to change.
This introduction is intended to give an overview on several common topics like power supply, current
injection etc.
A.1.1
Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods. To give the
customer a better understanding the following classification is used and the parameters are tagged
accordingly in the tables where appropriate.
NOTE
This classification will be added at a later release of the specification
P: Those parameters are guaranteed during production testing on each individual device.
C: Those parameters are achieved by the design characterization by measuring a statistically relevant
sample size across process variations. They are regularly verified by production monitors.
T: Those parameters are achieved by design characterization on a small sample size from typical
devices. All values shown in the typical column are within this category.
D: Those parameters are derived mainly from simulations.
A.1.2
Power Supply
The MC9S12Q128 members utilize several pins to supply power to the I/O ports, A/D converter, oscillator
and PLL as well as the internal logic.
The V
The V
The V
, V
, V
, V
pair supplies the A/D converter.
pair supplies the I/O pins
pair supplies the internal voltage regulator.
DDA
DDX
DDR
SSA
SSX
SSR
Freescale Semiconductor
MC9S12Q128
Rev 1.10
599
Appendix A Electrical Characteristics
V
V
V
V
V
, V , V
and V
are the supply pins for the digital logic.
DD1
SS1
DD2
SS2
, V
and V
supply the oscillator and the PLL.
are internally connected by metal.
SS2
DDPLL
SSPLL
SS1
and V
are internally connected by metal.
DD1
DD2
, V
, V
as well as V , V
V
are connected by anti-parallel diodes for ESD
DDA
DDX
DDR
SSA
SSX, SSR
protection.
NOTE
In the following context VDD5 is used for either V
, V
, and V
;
DDX
DDA
DDR
V
is used for either V , V , and V
unless otherwise noted.
SS5
SSA
SSR
SSX
IDD5 denotes the sum of the currents flowing into the V
, V
, and
DDX
DDA
V
pins.
DDR
V
V
is used for V
, V
, and V
, V is used for V , V , and
DDPLL SS SS1 SS2
DD
DD1 DD2
.
SSPLL
I
is used for the sum of the currents flowing into V
and V
.
DD
DD1
DD2
A.1.3
Pins
There are four groups of functional pins.
A.1.3.1
5V I/O Pins
Those I/O pins have a nominal level of 5V. This class of pins is comprised of all port I/O pins, the analog
inputs, BKGD pin, and the RESET inputs.The internal structure of all those pins is identical; however
some of the functionality may be disabled. For example, pull-up and pull-down resistors may be disabled
permanently.
A.1.3.2
Analog Reference
This class is made up by the two V and V pins. In 48- and 52-pin package versions the V pad is
RH
RL
RL
bonded to the V
pin.
SSA
A.1.3.3
Oscillator
The pins XFC, EXTAL, XTAL dedicated to the oscillator have a nominal 2.5V level. They are supplied by
V
.
DDPLL
A.1.3.4
TEST
This pin is used for production testing only.
A.1.4
Current Injection
Power supply must maintain regulation within operating V
or V range during instantaneous and
DD
DD5
operating maximum current conditions. If positive injection current (V > V
) is greater than I
, the
in
DD5
DD5
600
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
injection current may flow out of V
and could result in external power supply going out of regulation.
DD5
Insure external V
load will shunt current greater than maximum injection current. This will be the
DD5
greatest risk when the MCU is not consuming power; e.g. if no system clock is present, or if clock rate is
very low which would reduce overall power consumption.
A.1.5
Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only. A functional operation under or outside those maxima
is not guaranteed. Stress beyond those limits may affect the reliability or cause permanent damage of the
device.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V
or V
).
SS5
DD5
Table A-1. Absolute Maximum Ratings
Num
Rating
Symbol
Min
Max
Unit
1
2
3
4
5
6
7
8
9
I/O, Regulator and Analog Supply Voltage
Digital Logic Supply Voltage(1)
PLL Supply Voltage 1
VDD5
VDD
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
6.5
3.0
3.0
0.3
0.3
6.5
6.5
3.0
10.0
V
V
V
V
V
V
V
V
V
VDDPLL
Voltage difference VDDX to VDDR and VDDA
Voltage difference VSSX to VSSR and VSSA
Digital I/O Input Voltage
∆
VDDX
∆
VSSX
VIN
VRH, VRL
VILV
Analog Reference
XFC, EXTAL, XTAL inputs
TEST input
VTEST
Instantaneous Maximum Current
10
11
12
ID
–25
–25
+25
+25
0
mA
mA
mA
Single pin limit for all digital I/O pins (2)
Instantaneous Maximum Current
IDL
IDT
Single pin limit for XFC, EXTAL, XTAL(3)
Instantaneous Maximum Current
Single pin limit for TEST(4)
–0.25
13
14
15
Operating Temperature Range (packaged)
Operating Temperature Range (junction)
Storage Temperature Range
TA
TJ
– 40
– 40
– 65
125
140
155
°C
°C
°C
Tstg
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The absolute
maximum ratings apply when the device is powered from an external source.
2. All digital I/O pins are internally clamped to VSSX and VDDX, VSSR and VDDR or VSSA and VDDA
3. These pins are internally clamped to VSSPLL and VDDPLL
.
4. This pin is clamped low to VSSX, but not clamped high. This pin must be tied low in applications.
Freescale Semiconductor
MC9S12Q128
Rev 1.10
601
Appendix A Electrical Characteristics
A.1.6
ESD Protection and Latch-up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 Stress test qualification for Automotive Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM), the Machine Model (MM) and the Charge Device Model.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Table A-2. ESD and Latch-up Test Conditions
Model
Description
Symbol
Value
Unit
Human Body
Series Resistance
R1
C
1500
100
Ohm
pF
Storage Capacitance
Number of Pulse per pin
Positive
Negative
—
—
3
3
Machine
Latch-up
Series Resistance
R1
C
0
Ohm
pF
Storage Capacitance
Number of Pulse per pin
200
Positive
Negative
—
—
3
3
Minimum input voltage limit
Maximum input voltage limit
—
—
–2.5
7.5
V
V
Table A-3. ESD and Latch-Up Protection Characteristics
Num
C
Rating
Human Body Model (HBM)
Symbol
Min
Max
Unit
1
2
3
C
C
C
VHBM
VMM
2000
200
—
—
—
V
V
V
Machine Model (MM)
Charge Device Model (CDM)
Latch-up Current at 125°C
VCDM
500
4
5
C
C
Positive
Negative
ILAT
+100
–100
—
—
mA
mA
Latch-up Current at 27°C
Positive
Negative
ILAT
+200
–200
—
—
602
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
A.1.7
Operating Conditions
This chapter describes the operating conditions of the devices. Unless otherwise noted those conditions
apply to all the following data.
NOTE
Instead of specifying ambient temperature all parameters are specified for
the more meaningful silicon junction temperature. For power dissipation
calculations refer to Section A.1.8, “Power Dissipation and Thermal
Characteristics”
.
Table A-4. Operating Conditions
Rating
Symbol
Min
Typ
Max
Unit
I/O, Regulator and Analog Supply Voltage
Digital Logic Supply Voltage (1)
PLL Supply Voltage 1
VDD5
VDD
2.97
2.35
2.35
–0.1
–0.1
0.25
–40
5
2.5
2.5
0
5.5
2.75
2.75
0.1
V
V
VDDPLL
V
Voltage Difference VDDX to VDDA
Voltage Difference VSSX to VSSR and VSSA
Bus Frequency
∆
V
VDDX
∆
0
0.1
V
VSSX
(2)
fbus
—
—
16
MHz
°C
Operating Junction Temperature Range
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The operating
TJ
140
conditions apply when this regulator is disabled and the device is powered from an external source.
Using an external regulator, with the internal voltage regulator disabled, an external LVR must be provided.
2. Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper operation.
Freescale Semiconductor
MC9S12Q128
Rev 1.10
603
Appendix A Electrical Characteristics
A.1.8
Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T ) in °C can be
J
obtained from:
T
T
T
P
= T + (P • Θ
)
J
A
D
JA
= Junction Temperature, [°C]
J
= Ambient Temperature, [°C]
A
D
= Total Chip Power Dissipation, [W]
= Package Thermal Resistance, [°C/W]
Θ
JA
The total power dissipation can be calculated from:
P
P
= P
+ P
D
INT
IO
= Chip Internal Power Dissipation, [W]
INT
Two cases with internal voltage regulator enabled and disabled must be considered:
1. Internal Voltage Regulator disabled
P
= I
⋅ V
+ I
⋅ V
+ I
⋅ V
INT
DD DD DDPLL DDPLL DDA DDA
2
P
=
R
⋅ I
DSON IO
∑
IO
i
i
Which is the sum of all output currents on I/O ports associated with V
and V
.
DDX
DDM
For R
is valid:
DSON
V
OL
R
= -----------;for outputs driven low
DSON
I
OL
respectively
V
– V
DD5
OH
R
= -----------------------------------;for outputs driven high
DSON
I
OH
2. Internal voltage regulator enabled
P
= I
⋅ V
+ I
⋅ V
INT
DDR DDR DDA DDA
I
is the current shown in Table A-8 and not the overall current flowing into VDDR, which
DDR
additionally contains the current flowing into the external loads with output high.
2
P
=
R
⋅ I
DSON IO
∑
IO
i
i
Which is the sum of all output currents on I/O ports associated with V
and V
.
DDX
DDR
604
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
(1)
Table A-5. Thermal Package Characteristics
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
T
Thermal Resistance LQFP48, single layer PCB(2)
θJA
—
—
—
69
oC/W
Thermal Resistance LQFP48, double sided PCB
with 2 internal planes(3)
2
T
θJA
—
53
oC/W
3
4
5
6
T
T
T
T
Junction to Board LQFP48
θJB
θJC
ΨJT
θJA
—
—
—
—
—
—
—
—
30
20
4
oC/W
oC/W
oC/W
oC/W
Junction to Case LQFP48
Junction to Package Top LQFP48
Thermal Resistance LQFP52, single sided PCB
65
Thermal Resistance LQFP52, double sided PCB
with 2 internal planes
7
T
θJA
—
—
49
oC/W
8
9
T
T
T
T
Junction to Board LQFP52
θJB
θJC
ΨJT
θJA
—
—
—
—
—
—
—
—
31
17
3
oC/W
oC/W
oC/W
oC/W
Junction to Case LQFP52
10
11
Junction to Package Top LQFP52
Thermal Resistance QFP 80, single sided PCB
52
Thermal Resistance QFP 80, double sided PCB
with 2 internal planes
12
T
θJA
—
—
42
oC/W
13
14
15
T
T
T
Junction to Board QFP80
Junction to Case QFP80
θJB
θJC
ΨJT
—
—
—
—
—
—
28
18
4
oC/W
oC/W
oC/W
Junction to Package Top QFP80
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
Freescale Semiconductor
MC9S12Q128
Rev 1.10
605
Appendix A Electrical Characteristics
A.1.9
I/O Characteristics
This section describes the characteristics of all I/O pins. All parameters are not always applicable, e.g. not
all pins feature pull up/down resistances.
Table A-6. 5V I/O Characteristics
Conditions are 4.5< VDDX <5.5V Temperature from –40˚C to +140˚C, unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
P Input High Voltage
T Input High Voltage
P Input Low Voltage
T Input Low Voltage
C Input Hysteresis
VIH
VIH
0.65*VDD5
—
—
—
—
VDD5 + 0.3
0.35*VDD5
—
V
V
2
VIL
—
—
V
VIL
VSS5 - 0.3
—
V
3
4
VHYS
250
—
mV
Input Leakage Current (pins in high ohmic input mode)(1)
Vin = VDD5 or VSS5
P
C
P
C
P
P
C
P
C
Iin
—
—
—
—
—
—
—
—
—
1
—
µA
V
Output High Voltage (pins in output mode)
5
6
VOH
VOH
VOL
VOL
IPUL
IPUH
IPDH
VDD5 – 0.8
Partial Drive I
= –2mA
OH
Output High Voltage (pins in output mode)
Full Drive IOH = –10mA
VDD5 – 0.8
—
V
Output Low Voltage (pins in output mode)
Partial Drive IOL = +2mA
7
—
—
0.8
0.8
–130
—
V
Output Low Voltage (pins in output mode)
8
V
Full Drive I
= +10mA
OL
Internal Pull Up Device Current,
tested at VIL Max.
9
—
µA
µA
µA
Internal Pull Up Device Current,
tested at VIH Min.
10
11
12
–10
—
Internal Pull Down Device Current,
tested at VIH Min.
130
Internal Pull Down Device Current,
tested at VIL Max.
IPDL
Cin
10
—
—
7
—
—
µA
13 D Input Capacitance
Injection current(2)
pf
14
T
Single Pin limit
Total Device Limit. Sum of all injected currents
IICS
IICP
–2.5
–25
—
—
2.5
25
mΑ
15
16
P Port P, J Interrupt Input Pulse filtered(3)
P Port P, J Interrupt Input Pulse passed3
tPIGN
tPVAL
—
—
—
3
µs
µs
10
—
1. Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each
8 C to 12 C in the tempearture range from 50 C to 125 C.
2. Refer to Section A.1.4, “Current Injection”, for more details
3. Parameter only applies in STOP or Pseudo STOP mode.
606
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-7. 3.3V I/O Characteristics
Conditions are VDDX=3.3V +/-10%, Temperature from –40˚C to +140˚C, unless otherwise noted
Num C
Rating
Symbol
Min
Typ
Max
Unit
1
P Input High Voltage
VIH
VIH
0.65*VDD5
—
—
—
VDD5 + 0.3
0.35*VDD5
—
V
V
T Input High Voltage
P Input Low Voltage
T Input Low Voltage
C Input Hysteresis
—
—
2
VIL
—
V
VIL
VSS5 – 0.3
—
—
V
3
4
VHYS
250
—
mV
Input Leakage Current (pins in high ohmic input mode)(1)
Vin = VDD5 or VSS5
P
C
P
C
P
Iin
–1
VDD5 – 0.4
VDD5 – 0.4
—
—
—
—
—
—
1
µA
V
Output High Voltage (pins in output mode)
5
6
7
VOH
VOH
VOL
VOL
—
Partial Drive I
= –0.75mA
OH
Output High Voltage (pins in output mode)
Full Drive I = –4mA
—
V
OH
Output Low Voltage (pins in output mode)
Partial Drive I = +0.9mA
0.4
0.4
V
OL
Output Low Voltage (pins in output mode)
Full Drive I = +4.75mA
8
9
—
V
OL
P Internal Pull Up Device Current, tested at VIL Max.
IPUL
IPUH
IPDH
IPDL
Cin
—
-6
—
6
—
—
—
—
7
–60
—
µA
µA
µA
µA
πΦ
10 C Internal Pull Up Device Current, tested at VIH Min.
11 P Internal Pull Down Device Current, tested at VIH Min.
12 C Internal Pull Down Device Current, tested at VIL Max.
11 D Input Capacitance
60
—
—
—
Injection current(2)
12
T
Single Pin limit
Total Device Limit. Sum of all injected currents
IICS
IICP
–2.5
–25
—
2.5
25
µΑ
13 P Port P, J Interrupt Input Pulse filtered(3)
14 P Port P, J Interrupt Input Pulse passed3
tPIGN
tPVAL
—
—
—
3
µs
µs
10
—
1. Maximum leakage current occurs at maximum operating temperature. Current decreases by approximately one-half for each
8 C to 12 C in the tempearture range from 50 C to 125 C.
2. Refer to Section A.1.4, “Current Injection”, for more details
3. Parameter only applies in STOP or Pseudo STOP mode.
A.1.10 Supply Currents
This section describes the current consumption characteristics of the device as well as the conditions for
the measurements.
A.1.10.1 Measurement Conditions
All measurements are without output loads. Unless otherwise noted the currents are measured in single
chip mode, internal voltage regulator enabled and at 16MHz bus frequency using a 4MHz oscillator.
Freescale Semiconductor
MC9S12Q128
Rev 1.10
607
Appendix A Electrical Characteristics
A.1.10.2 Additional Remarks
In expanded modes the currents flowing in the system are highly dependent on the load at the address, data
and control signals as well as on the duty cycle of those signals. No generally applicable numbers can be
given. A very good estimate is to take the single chip currents and add the currents due to the external loads.
Table A-8. Supply Current Characteristics for MC9S12Q32
Conditions are shown in Table A-4 with internal regulator enabled unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
P
Run Supply Current Single Chip
Wait Supply current
IDD5
—
—
35
mA
P
P
C
All modules enabled
—
—
—
30
8
2
3
IDDW
mA
V
DDR<4.9V, only RTI enabled2
3.5
2.5
VDDR>4.9V, only RTI enabled
Pseudo Stop Current (RTI and COP disabled)2 3
C
P
C
P
C
P
C
P
–40°C
27°C
85°C
—
—
—
—
—
—
—
—
340
360
500
550
590
720
780
1100
—
450
—
1450
—
1900
—
4500
(1)
"C" Temp Option 100˚C
105°C
"V" Temp Option 120˚C
125°C
"M" Temp Option 140°C
IDDPS
µA
Pseudo Stop Current (RTI and COP enabled)(2) (3)
C
C
C
C
C
–40°C
27°C
—
—
—
—
—
540
700
750
880
1300
—
—
—
—
—
1
4
5
IDDPS
µA
µA
85°C
105°C
125°C
Stop Current 3
C
P
C
P
C
P
C
P
–40°C
27°C
85°C
—
—
—
—
—
—
—
—
10
20
—
80
—
1000
—
1400
—
100
140
170
300
350
520
1
"C" Temp Option 100˚C
105°C
"V" Temp Option 120˚C
125°C
"M" Temp Option 140°C
IDDS
4000
1. STOP current measured in production test at increased junction temperature, hence for Temp Option "C" the test is carried
out at 100˚C although the Temperature specification is 85˚C. Similarly for "v" and "M" options the temperature used in test lies
15˚C above the temperature option specification.
2. PLL off
3. At those low power dissipation levels TJ = TA can be assumed
608
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-9. Supply Current Characteristics for Other Family Members
Conditions are shown in Table A-4 with internal regulator enabled unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
P
Run Supply Current Single Chip,
Wait Supply current
IDD5
—
—
45
mA
P
P
C
All modules enabled
—
—
—
—
2.5
3.5
33
8
—
2
6
IDDW
mA
VDDR<4.9V, only RTI enabled2
VDDR>4.9V, only RTI enabled
Pseudo Stop Current (RTI and COP disabled)23
C
P
C
P
C
P
C
P
–40°C
27°C
85°C
—
—
—
—
—
—
—
—
190
200
300
400
450
600
650
1000
—
250
—
1400
—
1900
—
4800
(1)
"C" Temp Option 100˚C
105°C
"V" Temp Option 120˚C
125°C
"M" Temp Option 140°C
IDDPS
µA
Pseudo Stop Current (RTI and COP enabled)(2) (3)
C
C
C
C
C
–40°C
27°C
—
—
—
—
—
370
500
590
780
1200
—
—
—
—
—
1
4
5
IDDPS
µA
µA
85°C
105°C
125°C
Stop Current 3
C
P
C
P
C
P
C
P
–40°C
27°C
85°C
—
—
—
—
—
—
—
—
12
25
—
100
—
1200
—
1700
—
4500
130
160
200
350
400
600
1
"C" Temp Option 100˚C
105°C
"V" Temp Option 120˚C
125°C
"M" Temp Option 140°C
IDDS
1. STOP current measured in production test at increased junction temperature, hence for Temp Option "C" the test is carried out
at 100˚C although the Temperature specification is 85˚C. Similarly for "v" and "M" options the temperature used in test lies
15˚C above the temperature option specification.
2. PLL off
3. At those low power dissipation levels TJ = TA can be assumed
Freescale Semiconductor
MC9S12Q128
Rev 1.10
609
Appendix A Electrical Characteristics
A.2
ATD Characteristics
This section describes the characteristics of the analog-to-digital converter.
V
is not available as a separate pin in the 48- and 52-pin versions. In this case the internal V pad is
RL
RL
bonded to the V
pin.
SSA
The ATD is specified and tested for both the 3.3V and 5V range. For ranges between 3.3V and 5V the ATD
accuracy is generally the same as in the 3.3V range but is not tested in this range in production test.
A.2.1
ATD Operating Characteristics In 5V Range
The Table A-10 shows conditions under which the ATD operates.
The following constraints exist to obtain full-scale, full range results: V
This constraint exists since the sample buffer amplifier can not drive beyond the power supply levels that
≤ V ≤ V ≤ V ≤ V .
DDA
SSA
RL
IN
RH
it ties to. If the input level goes outside of this range it will effectively be clipped.
Table A-10. ATD Operating Characteristics
Conditions are shown in Table A-4 unless otherwise noted. Supply Voltage 5V-10% <= VDDA <=5V+10%
Num
C
Rating
Symbol
Min
Typ
Max
Unit
Reference Potential
1
D
Low
High
VRL
VRH
VSSA
VDDA/2
—
—
VDDA/2
VDDA
V
V
2
3
C
D
Differential Reference Voltage(1)
ATD Clock Frequency
V
RH-VRL
4.75
0.5
5.0
—
5.25
2.0
V
fATDCLK
MHz
ATD 10-Bit Conversion Period
4
5
D
D
Clock Cycles(2) NCONV10
14
7
—
—
28
14
Cycles
µs
Conv, Time at 2.0MHz ATD Clock fATDCLK TCONV10
ATD 8-Bit Conversion Period
ClockCycles2 NCONV10
12
6
—
—
26
13
Cycles
µs
Conv, Time at 2.0MHz ATD Clock fATDCLK TCONV10
5
6
D
P
Recovery Time (VDDA=5.0 Volts)
tREC
—
—
—
—
20
µs
Reference Supply current
IREF
0.375
mA
1. Full accuracy is not guaranteed when differential voltage is less than 4.75V
2. The minimum time assumes a final sample period of 2 ATD clocks cycles while the maximum time assumes a final sample
period of 16 ATD clocks.
610
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
A.2.2
ATD Operating Characteristics In 3.3V Range
The Table A-11 shows conditions under which the ATD operates.
The following constraints exist to obtain full-scale, full range results: V
This constraint exists since the sample buffer amplifier can not drive beyond the power supply levels that
≤ V ≤ V ≤ V ≤ V .
DDA
SSA
RL
IN
RH
it ties to. If the input level goes outside of this range it will effectively be clipped
Table A-11. ATD Operating Characteristics
Conditions are shown in Table A-4 unless otherwise noted; Supply Voltage 3.3V-10% <= VDDA <= 3.3V+10%
Num
C
Rating
Symbol
Min
Typ
Max
Unit
Reference Potential
1
D
Low
High
VRL
VRH
VSSA
VDDA/2
—
—
VDDA/2
VDDA
V
V
2
3
C Differential Reference Voltage
D ATD Clock Frequency
V
RH-VRL
3.0
0.5
3.3
—
3.6
2.0
V
fATDCLK
MHz
ATD 10-Bit Conversion Period
D
4
5
Clock Cycles(1) NCONV10
14
7
—
—
28
14
Cycles
µs
Conv, Time at 2.0MHz ATD Clock fATDCLK TCONV10
ATD 8-Bit Conversion Period
D
Clock Cycles1 NCONV8
12
6
—
—
26
13
Cycles
µs
Conv, Time at 2.0MHz ATD Clock fATDCLK TCONV8
6
7
D Recovery Time (VDDA=3.3 Volts)
tREC
—
—
—
—
20
µs
P Reference Supply current
IREF
0.250
mA
1. The minimum time assumes a final sample period of 2 ATD clocks cycles while the maximum time assumes a final sample
period of 16 ATD clocks.
A.2.3
Factors Influencing Accuracy
Three factors — source resistance, source capacitance and current injection — have an influence on the
accuracy of the ATD.
A.2.3.1
Source Resistance
Due to the input pin leakage current as specified in Table A-6 in conjunction with the source resistance
there will be a voltage drop from the signal source to the ATD input. The maximum source resistance R
specifies results in an error of less than 1/2 LSB (2.5mV) at the maximum leakage current. If device or
S
operating conditions are less than worst case or leakage-induced error is acceptable, larger values of source
resistance is allowable.
A.2.3.2
Source Capacitance
When sampling an additional internal capacitor is switched to the input. This can cause a voltage drop due
to charge sharing with the external and the pin capacitance. For a maximum sampling error of the input
voltage ≤ 1LSB, then the external filter capacitor, C ≥ 1024 * (C – C ).
f
INS
INN
Freescale Semiconductor
MC9S12Q128
Rev 1.10
611
Appendix A Electrical Characteristics
A.2.3.3
Current Injection
There are two cases to consider.
1. A current is injected into the channel being converted. The channel being stressed has conversion
values of $3FF ($FF in 8-bit mode) for analog inputs greater than V and $000 for values less
RH
than V unless the current is higher than specified as disruptive conditions.
RL
2. Current is injected into pins in the neighborhood of the channel being converted. A portion of this
current is picked up by the channel (coupling ratio K), This additional current impacts the accuracy
of the conversion depending on the source resistance.
The additional input voltage error on the converted channel can be calculated as V
= K * R *
S
ERR
I
, with I being the sum of the currents injected into the two pins adjacent to the converted
INJ
INJ
channel.
Table 20-18. ATD Electrical Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Max input Source Resistance
Total Input Capacitance
Symbol
Min
Typ
Max
Unit
RS
1
C
—
—
1
KΩ
Non Sampling
Sampling
CINN
CINS
2
T
—
—
—
—
10
15
pF
Disruptive Analog Input Current
INA
Kp
Kn
3
4
5
C
C
C
–2.5
—
—
—
—
2.5
10-4
10-2
mA
A/A
A/A
Coupling Ratio positive current injection
Coupling Ratio negative current injection
—
A.2.4
ATD Accuracy (5V Range)
Table A-12 specifies the ATD conversion performance excluding any errors due to current injection, input
capacitance and source resistance
.
Table A-12. ATD Conversion Performance
Conditions are shown in Table A-4 unless otherwise noted
VREF = VRH – VRL = 5.12V. Resulting to one 8 bit count = 20mV and one 10 bit count = 5mV
fATDCLK = 2.0MHz
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
3
4
5
6
7
8
P
P
P
P
P
P
P
P
10-Bit Resolution
LSB
DNL
INL
AE
—
–1
5
—
1
mV
10-Bit Differential Nonlinearity
10-Bit Integral Nonlinearity
10-Bit Absolute Error(1)
8-Bit Resolution
—
—
—
20
—
0.5
1
Counts
Counts
Counts
mV
–2
2
-2.5
—
2.5
—
LSB
DNL
INL
AE
8-Bit Differential Nonlinearity
8-Bit Integral Nonlinearity
8-Bit Absolute Error1
–0.5
–1.0
-1.5
0.5
1.0
1.5
Counts
Counts
Counts
1. These values include quantization error which is inherently 1/2 count for any A/D converter.
612
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
A.2.5
ATD Accuracy (3.3V Range)
Table A-13 specifies the ATD conversion performance excluding any errors due to current injection, input
capacitance and source resistance.
Table A-13. ATD Conversion Performance
Conditions are shown in Table A-4 unless otherwise noted
VREF = VRH - VRL = 3.328V. Resulting to one 8 bit count = 13mV and one 10 bit count = 3.25mV
fATDCLK = 2.0MHz
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
3
4
5
6
7
8
P
P
P
P
P
P
P
P
10-Bit Resolution
LSB
DNL
INL
AE
—
3.25
—
—
1.5
3.5
5
mV
10-Bit Differential Nonlinearity
10-Bit Integral Nonlinearity
10-Bit Absolute Error(1)
8-Bit Resolution
–1.5
–3.5
–5
Counts
Counts
Counts
mV
1.5
2.5
13
—
LSB
DNL
INL
AE
—
—
8-Bit Differential Nonlinearity
8-Bit Integral Nonlinearity
8-Bit Absolute Error1
–0.5
–1.5
–2.0
0.5
1.5
2.0
Counts
Counts
Counts
1
1.5
1. These values include the quantization error which is inherently 1/2 count for any A/D converter.
For the following definitions see also Figure A-1.
Differential Non-Linearity (DNL) is defined as the difference between two adjacent switching steps.
V – V
i
i – 1
DNL(i) =
– 1
--------------------------
1LSB
The Integral Non-Linearity (INL) is defined as the sum of all DNLs:
n
V – V
n
0
INL(n) =
DNL(i) =
– n
--------------------
∑
1LSB
i = 1
Freescale Semiconductor
MC9S12Q128
Rev 1.10
613
Appendix A Electrical Characteristics
DNL
10-Bit Absolute Error Boundary
LSB
Vi-1
Vi
$3FF
$3FE
$3FD
$3FC
$3FB
$3FA
$3F9
$3F8
$3F7
$3F6
$3F5
$3F4
$3F3
8-Bit Absolute Error Boundary
$FF
$FE
$FD
2
9
8
7
6
5
4
3
2
1
0
Ideal Transfer Curve
10-Bit Transfer Curve
1
8-Bit Transfer Curve
3.25 6.5 9.75 13 16.25 19.5 22.75 26 29.25
3286 3289 3292 3295 3299 3302 3305 3309 3312 3315 3318 3321 3324 3328
Vin
mV
Figure A-1. ATD Accuracy Definitions
NOTE
Figure A-1 shows only definitions, for specification values refer to Table A-
12.
614
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
A.3
MSCAN
Table A-14. MSCAN Wake-up Pulse Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
P MSCAN Wake-up dominant pulse filtered
P MSCAN Wake-up dominant pulse pass
tWUP
tWUP
—
5
—
—
2
us
us
—
A.4
Reset, Oscillator and PLL
This section summarizes the electrical characteristics of the various startup scenarios for Oscillator and
Phase-Locked-Loop (PLL).
A.4.1
Startup
Table A-15 summarizes several startup characteristics explained in this section. Detailed description of the
startup behavior can be found in the Clock and Reset Generator (CRG) Block User Guide.
Table A-15. Startup Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
3
4
T
T
POR release level
POR assert level
VPORR
VPORA
PWRSTL
nRST
—
0.97
2
—
—
—
—
2.07
—
V
V
D
D
Reset input pulse width, minimum input time
Startup from Reset
—
tosc
nosc
192
196
Interrupt pulse width, IRQ edge-sensitive
mode
5
6
D
D
PWIRQ
tWRS
20
—
—
—
—
ns
Wait recovery startup time
14
tcyc
A.4.1.1
POR
The release level V
and the assert level V
are derived from the V supply. They are also valid
PORA DD
PORR
if the device is powered externally. After releasing the POR reset the oscillator and the clock quality check
are started. If after a time t no valid oscillation is detected, the MCU will start using the internal self
CQOUT
clock. The fastest startup time possible is given by n
.
uposc
A.4.1.2
LVR
The release level V
and the assert level V
are derived from the V supply. They are also valid
LVRA DD
LVRR
if the device is powered externally. After releasing the LVR reset the oscillator and the clock quality check
are started. If after a time t no valid oscillation is detected, the MCU will start using the internal self
CQOUT
clock. The fastest startup time possible is given by n
.
uposc
Freescale Semiconductor
MC9S12Q128
Rev 1.10
615
Appendix A Electrical Characteristics
A.4.1.3
SRAM Data Retention
Provided an appropriate external reset signal is applied to the MCU, preventing the CPU from executing
code when V
is out of specification limits, the SRAM contents integrity is guaranteed if after the reset
DD5
the PORF bit in the CRG Flags Register has not been set.
A.4.1.4
External Reset
When external reset is asserted for a time greater than PW
the CRG module generates an internal
RSTL
reset, and the CPU starts fetching the reset vector without doing a clock quality check, if there was an
oscillation before reset.
A.4.1.5
Stop Recovery
Out of STOP the controller can be woken up by an external interrupt. A clock quality check as after POR
is performed before releasing the clocks to the system.
A.4.1.6
Pseudo Stop and Wait Recovery
The recovery from Pseudo STOP and Wait are essentially the same since the oscillator was not stopped in
both modes. In Pseudo Stop Mode the voltage regulator is switched to reduced performance mode to
reduce power consumption. The returning out of pseudo stop to full performance takes t . The controller
vup
can be woken up by internal or external interrupts.After t in Wait or t + t in Pseudo Stop the CPU
wrs
vup
wrs
starts fetching the interrupt vector.
A.4.2
Oscillator
The device features an internal Colpitts and Pierce oscillator. The selection of Colpitts oscillator or Pierce
oscillator/external clock depends on the XCLKS signal which is sampled during reset. Pierce
oscillator/external clock mode allows the input of a square wave. Before asserting the oscillator to the
internal system clocks the quality of the oscillation is checked for each start from either power-on, STOP
or oscillator fail. t
specifies the maximum time before switching to the internal self clock mode after
CQOUT
POR or STOP if a proper oscillation is not detected. The quality check also determines the minimum
oscillator start-up time t . The device also features a clock monitor. A Clock Monitor Failure is
UPOSC
asserted if the frequency of the incoming clock signal is below the Assert Frequency f
CMFA.
616
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-16. Oscillator Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1a
1b
2
C
C
P
C
D
P
P
D
D
D
D
D
Crystal oscillator range (Colpitts)
Crystal oscillator range (Pierce) (1) 4
Startup Current
fOSC
fOSC
0.5
0.5
100
—
—
—
—
8(2)
—
100
—
—
—
—
—
7
16
40
MHz
MHz
µA
iOSC
—
3
Oscillator start-up time (Colpitts)
Clock Quality check time-out
tUPOSC
tCQOUT
fCMFA
fEXT
100(3)
2.5
200
50
ms
s
4
0.45
50
5
Clock Monitor Failure Assert Frequency
External square wave input frequency (4)
External square wave pulse width low
External square wave pulse width high
External square wave rise time
External square wave fall time
KHz
MHz
ns
6
0.5
9.5
9.5
—
7
tEXTL
tEXTH
tEXTR
tEXTF
CIN
—
8
—
ns
9
1
ns
10
11
—
1
ns
Input Capacitance (EXTAL, XTAL pins)
—
—
pF
DC Operating Bias in Colpitts Configuration
on EXTAL Pin
12
13
C
VDCBIAS
—
1.1
—
V
EXTAL Pin Input High Voltage4
0.75*
VDDPLL
P
T
P
VIH,EXTAL
VIH,EXTAL
VIl,EXTAL
—
—
—
—
V
V
V
EXTAL Pin Input High Voltage4
EXTAL Pin Input Low Voltage4
—
—
VDDPLL+0.3
0.25*
VDDPLL
14
15
T
EXTAL Pin Input Low Voltage4
EXTAL Pin Input Hysteresis4
VIl,EXTAL
VSSPLL-0.3
—
—
—
—
V
C
VHYS,EXTAL
250
mV
1. Depending on the crystal a damping series resistor might be necessary
2. fosc = 4MHz, C = 22pF.
3. Maximum value is for extreme cases using high Q, low frequency crystals
4. Only valid if Pierce Oscillator/external clock selected (XCLKS = 0 during reset)
Freescale Semiconductor
MC9S12Q128
Rev 1.10
617
Appendix A Electrical Characteristics
A.4.3
Phase Locked Loop
The oscillator provides the reference clock for the PLL. The PLL´s Voltage Controlled Oscillator (VCO)
is also the system clock source in self clock mode.
A.4.3.1
XFC Component Selection
This section describes the selection of the XFC components to achieve a good filter characteristics.
Cp
VDDPLL
R
Cs
XFC Pin
Phase
KF
VCO
KV
fref
fvco
fosc
1
D
refdv+1
Detector
fcmp
Loop Divider
1
1
2
synr+1
Figure A-2. Basic PLL Functional Diagram
The following procedure can be used to calculate the resistance and capacitance values using typical values
for K , f and i from Table A-17.
1
1
ch
The grey boxes show the calculation for f
= 50MHz and f = 1MHz. E.g., these frequencies are used
ref
VCO
for f
= 4MHz and a 16MHz bus clock.
OSC
The VCO Gain at the desired VCO frequency is approximated by:
(f1 – fvco
-----------------------
K1 ⋅ 1V
)
(60 – 50)
---------------------
–100
K = K ⋅ e
= -90.48MHz/V
= –100 ⋅ e
V
1
The phase detector relationship is given by:
K = – i ⋅ K
V
= 316.7Hz/Ω
Φ
ch
i is the current in tracking mode.
ch
618
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
The loop bandwidth f should be chosen to fulfill the Gardner’s stability criteria by at least a factor of 10,
C
typical values are 50. ζ = 0.9 ensures a good transient response.
f
2 ⋅ ζ ⋅ f
1
10
ref
ref
f <
⋅
→ f < ------------;(ζ = 0.9)
------------------------------------------ -----
C
C
4 ⋅ 10
fC < 25kHz
2
⎛
⎞
π ⋅ ζ + 1 + ζ
⎝
⎠
And finally the frequency relationship is defined as
f
VCO
n = ------------- = 2 ⋅ (s y n r + 1 )
= 50
f
ref
With the above values the resistance can be calculated. The example is shown for a loop bandwidth
f =10kHz:
C
2 ⋅ π ⋅ n ⋅ f
C
= 2*π*50*10kHz/(316.7Hz/Ω)=9.9kΩ=~10kΩ
R = ----------------------------
K
Φ
The capacitance C can now be calculated as:
s
2
0.516
2 ⋅ ζ
= 5.19nF =~ 4.7nF
Cp = 470pF
C =
≈ --------------;(ζ = 0.9)
---------------------
s
f ⋅ R
π ⋅ f ⋅ R
C
C
The capacitance C should be chosen in the range of:
p
C ⁄ 20 ≤ C ≤ C ⁄ 10
s
p
s
A.4.3.2
Jitter Information
The basic functionality of the PLL is shown in Figure A-3. With each transition of the clock f , the
cmp
deviation from the reference clock f is measured and input voltage to the VCO is adjusted accordingly.
ref
The adjustment is done continuously with no abrupt changes in the clock output frequency. Noise, voltage,
temperature and other factors cause slight variations in the control loop resulting in a clock jitter. This jitter
affects the real minimum and maximum clock periods as illustrated in Figure A-4.
Freescale Semiconductor
MC9S12Q128
Rev 1.10
619
Appendix A Electrical Characteristics
1
2
3
N-1
N
0
t
min1
t
nom
t
max1
t
minN
t
maxN
Figure A-3. Jitter Definitions
The relative deviation of t
is at its maximum for one clock period, and decreases towards zero for larger
nom
number of clock periods (N).
Defining the jitter as:
t
(N)
t
(N)
min
⎛
⎞
⎟
⎠
max
J(N) = max 1 –
, 1 –
--------------------
---------------------
⎜
N ⋅ t
N ⋅ t
⎝
nom
nom
For N < 100, the following equation is a good fit for the maximum jitter:
j
1
J(N) =
+ j
2
--------
N
J(N)
1
5
10
20
N
Figure A-4. Maximum Bus Clock Jitter Approximation
This is very important to notice with respect to timers, serial modules where a pre-scaler will eliminate the
effect of the jitter to a large extent.
620
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-17. PLL Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
1
2
P Self Clock Mode frequency
D VCO locking range
fSCM
fVCO
1
8
—
—
5.5
50
MHz
MHz
Lock Detector transition from Acquisition to Tracking
mode
(1)
3
D
|∆trk|
3
—
4
%
1
4
5
D Lock Detection
|∆Lock|
|∆unl|
0
—
—
1.5
2.5
%
1
D Un-Lock Detection
0.5
%
Lock Detector transition from Tracking to Acquisition
mode
1
6
D
|∆unt|
6
—
8
%
7
8
9
C PLLON Total Stabilization delay (Auto Mode) (2)
D PLLON Acquisition mode stabilization delay 2
D PLLON Tracking mode stabilization delay 2
tstab
tacq
tal
—
—
—
—
—
—
—
—
—
0.5
0.3
0.2
-100
60
—
—
ms
ms
—
ms
10 D Fitting parameter VCO loop gain
11 D Fitting parameter VCO loop frequency
12 D Charge pump current acquisition mode
13 D Charge pump current tracking mode
14 C Jitter fit parameter 12
K1
f1
—
MHz/V
MHz
µA
—
| ich
| ich
j1
|
|
38.5
3.5
—
—
—
µA
1.1
0.13
%
15 C Jitter fit parameter 22
j2
—
%
1. % deviation from target frequency
2. fOSC = 4MHz, fBUS = 16MHz equivalent fVCO = 50MHz: REFDV = #$03, SYNR = #$018, Cs = 4.7nF, Cp = 470pF, Rs = 10KΩ.
A.5
NVM, Flash, and EEPROM
NVM Timing
A.5.1
The time base for all NVM program or erase operations is derived from the oscillator. A minimum
oscillator frequency f is required for performing program or erase operations. The NVM modules
NVMOSC
do not have any means to monitor the frequency and will not prevent program or erase operation at
frequencies above or below the specified minimum. Attempting to program or erase the NVM modules at
a lower frequency a full program or erase transition is not assured.
The Flash program and erase operations are timed using a clock derived from the oscillator using the
FCLKDIV and ECLKDIV registers respectively. The frequency of this clock must be set within the limits
specified as f
.
NVMOP
The minimum program and erase times shown in Table A-18 are calculated for maximum f
and
NVMOP
maximum f . The maximum times are calculated for minimum f
and a f of 2MHz.
bus
NVMOP
bus
Freescale Semiconductor
MC9S12Q128
Rev 1.10
621
Appendix A Electrical Characteristics
A.5.1.1
Single Word Programming
The programming time for single word programming is dependant on the bus frequency as a well as on the
frequency f¨
and can be calculated according to the following formula.
NVMOP
1
1
t
= 9 ⋅
+ 25 ⋅
---------------------
----------
swpgm
f
f
NVMOP
bus
A.5.1.2
Row Programming
Generally the time to program a consecutive word can be calculated as:
1
1
t
= 4 ⋅
+ 9 ⋅
---------------------
----------
bwpgm
f
f
NVMOP
bus
For theQ16 and Q32 device flash arrays, where up to 32 words in a row can be programmed consecutively
by keeping the command pipeline filled, the time to program a whole row is:
t
= t
+ 31 ⋅ t
swpgm bwpgm
brpgm
For the Q64,Q96 and Q128 device flash arrays, where up to 64 words in a row can be programmed
consecutively by keeping the command pipeline filled, the time to program a whole row is:
t
= t
+ 63 ⋅ t
bwpgm
brpgm
swpgm
Row programming is more than 2 times faster than single word programming.
A.5.1.3
Sector Erase
Erasing either a 512 byte or 1024 byte Flash sector takes:
1
t
≈ 4000 ⋅
---------------------
era
f
NVMOP
The setup times can be ignored for this operation.
A.5.1.4
Mass Erase
Erasing a NVM block takes:
1
t
≈ 20000 ⋅
---------------------
mass
f
NVMOP
This is independent of sector size.
The setup times can be ignored for this operation.
622
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
Table A-18. NVM Timing Characteristics
Conditions are shown in Table A-4 unless otherwise noted
Num
C
Rating
External Oscillator Clock
Symbol
Min
Typ
Max
Unit
1
2
3
4
5
6
6
7
8
9
9
D
D
D
P
D
D
D
P
P
D
D
fNVMOSC
fNVMBUS
fNVMOP
tswpgm
tbwpgm
tbrpgm
tbrpgm
tera
0.5
1
—
—
—
—
—
—
—
—
—
—
—
50(1)
MHz
MHz
kHz
µs
Bus frequency for Programming or Erase Operations
Operating Frequency
150
200
74.5(3)
313
Single Word Programming Time
Flash Burst Programming consecutive word
Flash Burst Programming Time for 32 Word row
Flash Burst Programming Time for 64 Word row
Sector Erase Time
46(2)
20.42
678.42
1331.22
20(4)
1004
11(5)
11(8)
µs
1035.53
2027.53
26.73
µs
µs
ms
ms
Mass Erase Time
tmass
1333
(7)
Blank Check Time Flash per block
t check
32778(6)
65546(9)
t
cyc
Blank Check Time Flash per block
t check
7tcyc
1. Restrictions for oscillator in crystal mode apply!
2. Minimum Programming times are achieved under maximum NVM operating frequency f NVMOP and maximum bus frequency
fbus
.
3. Maximum Erase and Programming times are achieved under particular combinations of f NVMOP and bus frequency f bus. Refer
to formulae in Sections A.3.1.1 - A.3.1.4 for guidance.
4. Minimum Erase times are achieved under maximum NVM operating frequency f NVMOP
.
5. Minimum time, if first word in the array is not blank (512 byte sector size).
6. Maximum time to complete check on an erased block (512 byte sector size)
7. Where tcyc is the system bus clock period.
8. Minimum time, if first word in the array is not blank (1024 byte sector size)
9. Maximum time to complete check on an erased block (1024 byte sector size).
Freescale Semiconductor
MC9S12Q128
Rev 1.10
623
Appendix A Electrical Characteristics
A.5.2
NVM Reliability
The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process
monitors and burn-in to screen early life failures. The program/erase cycle count on the sector is
incremented every time a sector or mass erase event is executed.
(1)
Table A-19. NVM Reliability Characteristics
Conditions are shown in Table A-4. unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
Flash Reliability Characteristics
1
2
3
4
C Data retention after 10,000 program/erase cycles at an
tFLRET
15
100(2)
1002
—
—
—
—
Years
average junction temperature of TJavg ≤ 85°C
C Data retention with <100 program/erase cycles at an
average junction temperature TJavg ≤ 85°C
C Number of program/erase cycles
(–40°C ≤ TJ ≤ 0°C)
C Number of program/erase cycles
20
nFL
10,000
10,000
—
Cycles
100,000(3)
(0°C ≤ TJ ≤ 140°C)
1. TJavg will not exeed 85°C considering a typical temperature profile over the lifetime of a consumer, industrial or automotive
application.
2. Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to
25°C using the Arrhenius equation. For additional information on how Freescale defines Typical Data Retention, please refer
to Engineering Bulletin EB618.
3. Spec table quotes typical endurance evaluated at 25°C for this product family, typical endurance at various temperature can
be estimated using the graph below. For additional information on how Freescale defines Typical Endurance, please refer to
Engineering Bulletin EB619.
624
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
Figure A-5. Typical Endurance vs Temperature
500
450
400
350
300
250
200
150
100
50
0
60
80
120
-40
-20
0
20
40
100
140
Operating Temperature T [°C]
J
------ Flash
A.6
SPI
This section provides electrical parametrics and ratings for the SPI.
In Table A-20 the measurement conditions are listed.
Table A-20. Measurement Conditions
Description
Value
Unit
Drive mode
Full drive mode
50
—
pF
V
Load capacitance CLOAD, on all outputs
Thresholds for delay measurement points
(20% / 80%) VDDX
A.6.1
Master Mode
In Figure A-6 the timing diagram for master mode with transmission format CPHA=0 is depicted.
Freescale Semiconductor
MC9S12Q128
Rev 1.10
625
Appendix A Electrical Characteristics
SS1
(OUTPUT)
2
1
12
12
13
13
3
SCK
(CPOL = 0)
(OUTPUT)
4
4
SCK
(CPOL = 1)
(OUTPUT)
5
6
MISO
(INPUT)
MSB IN2
LSB IN
BIT 6 . . . 1
10
9
11
MOSI
(OUTPUT)
MSB OUT2
BIT 6 . . . 1
LSB OUT
1. If configured as an output.
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure A-6. SPI Master Timing (CPHA=0)
In Figure A-7 the timing diagram for master mode with transmission format CPHA=1 is depicted.
SS1
(OUTPUT)
1
12
12
13
13
3
2
SCK
(CPOL = 0)
(OUTPUT)
4
4
SCK
(CPOL = 1)
(OUTPUT)
5
6
MISO
(INPUT)
MSB IN2
BIT 6 . . . 1
11
BIT 6 . . . 1
LSB IN
9
MOSI
(OUTPUT)
MASTER MSB OUT2
PORT DATA
MASTER LSB OUT
PORT DATA
1. If configured as output
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
Figure A-7. SPI Master Timing (CPHA=1)
626
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
In Table A-21 the timing characteristics for master mode are listed.
Table A-21. SPI Master Mode Timing Characteristics
Num
C
Characteristic
SCK Frequency
Symbol
Min
Typ
Max
Unit
1
1
P
P
D
D
D
D
D
D
D
D
D
D
fsck
tsck
tlead
tlag
twsck
tsu
1/2048
2
—
—
1/2
2048
—
fbus
tbus
tsck
tsck
tsck
ns
SCK Period
2
Enable Lead Time
—
—
—
8
1/2
1/2
1/2
—
3
Enable Lag Time
—
4
Clock (SCK) High or Low Time
Data Setup Time (Inputs)
Data Hold Time (Inputs)
Data Valid after SCK Edge
Data Valid after SS fall (CPHA=0)
Data Hold Time (Outputs)
Rise and Fall Time Inputs
Rise and Fall Time Outputs
—
5
—
6
thi
8
—
—
ns
9
tvsck
tvss
tho
—
—
20
—
—
—
30
15
—
ns
10
11
12
13
—
ns
—
ns
trfi
—
8
ns
trfo
—
8
ns
A.6.2
Slave Mode
In Figure A-8 the timing diagram for slave mode with transmission format CPHA=0 is depicted.
SS
(INPUT)
1
12
12
13
13
3
SCK
(CPOL = 0)
(INPUT)
4
4
2
SCK
(CPOL = 1)
(INPUT)
10
7
8
9
11
11
MISO
(OUTPUT)
see
note
SEE
NOTE
BIT 6 . . . 1
SLAVE LSB OUT
SLAVE MSB
6
5
MOSI
(INPUT)
BIT 6 . . . 1
MSB IN
LSB IN
NOTE: Not defined!
Figure A-8. SPI Slave Timing (CPHA=0)
Freescale Semiconductor
MC9S12Q128
Rev 1.10
627
Appendix A Electrical Characteristics
In Figure A-9 the timing diagram for slave mode with transmission format CPHA=1 is depicted.
SS
(INPUT)
3
1
12
13
13
2
SCK
(CPOL = 0)
(INPUT)
4
4
12
11
SCK
(CPOL = 1)
(INPUT)
8
9
MISO
(OUTPUT)
see
note
BIT 6 . . . 1
SLAVE
5
MSB OUT
6
SLAVE LSB OUT
LSB IN
7
MOSI
(INPUT)
MSB IN
BIT 6 . . . 1
NOTE: Not defined!
Figure A-9. SPI Slave Timing (CPHA=1)
In Table A-22 the timing characteristics for slave mode are listed.
Table A-22. SPI Slave Mode Timing Characteristics
Num
C
Characteristic
Symbol
Min
Typ
Max
Unit
1
1
2
3
4
5
6
7
8
D
P
D
D
D
D
D
D
D
SCK Frequency
SCK Period
fsck
tsck
tlead
tlag
twsck
tsu
DC
4
—
—
—
—
—
—
—
—
—
1/4
∞
fbus
tbus
tbus
tbus
tbus
ns
Enable Lead Time
4
—
—
—
—
—
20
22
Enable Lag Time
4
Clock (SCK) High or Low Time
Data Setup Time (Inputs)
Data Hold Time (Inputs)
Slave Access Time (time to data active)
Slave MISO Disable Time
Data Valid after SCK Edge
4
8
thi
8
ns
ta
—
—
ns
ns
tdis
30 + tbus
9
D
tvsck
—
—
ns
(1)
1
10
11
12
13
D
D
D
D
Data Valid after SS fall
tvss
tho
trfi
—
20
—
—
—
—
—
—
30 + tbus
ns
ns
ns
ns
Data Hold Time (Outputs)
Rise and Fall Time Inputs
Rise and Fall Time Outputs
—
8
trfo
8
1. tbus added due to internal synchronization delay
628
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix A Electrical Characteristics
A.7
Voltage Regulator
A.7.1
Voltage Regulator Operating Conditions
Table A-23. Voltage Regulator Electrical Parameters
Num
C
Characteristic
Input Voltages
Symbol
Min
Typ
Max
Unit
1
P
VVDDR, A
2.97
—
5.5
V
Output Voltage Core
3
4
P
P
VDD
2.35
2.5
2.75
V
Full Performance Mode
Low Voltage Interrupt(1)
Assert Level (xL45J mask set)
Assert Level (other mask sets)
Deassert Level (xL45J mask set)
Deassert Level (other mask sets)
VLVIA
VLVIA
VLVID
VLVID
4.30
4.00
4.42
4.15
4.53
4.37
4.65
4.52
4.77
4.66
4.89
4.77
V
V
V
V
Low Voltage Reset(2) (3)
,
5
7
P
C
Assert Level (xL45J mask set)
Assert Level (other mask sets)
VLVRA
2.25
2.25
2.3
2.35
—
—
V
Power-on Reset(4)
Assert Level
VPORA
VPORD
0.97
—
—
—
—
2.05
V
V
Deassert Level
1. Monitors VDDA, active only in Full Performance Mode. Indicates I/O & ADC performance degradation due to low supply voltage.
2. Monitors VDD, active only in Full Performance Mode. MCU is monitored by the POR in RPM (see Figure A-10)
3. Digital functionality is guaranteed in the range between VDD(min) and VLVRA(min).
4. Monitors VDD. Active in all modes.
A.7.2
Chip Power-up and LVI/LVR Graphical Explanation
Voltage regulator sub modules LVI (low voltage interrupt), POR (power-on reset) and LVR (low voltage
reset) handle chip power-up or drops of the supply voltage. Their function is described in Figure A-10.
Freescale Semiconductor
MC9S12Q128
Rev 1.10
629
Appendix A Electrical Characteristics
V
VDDA
VLVID
VLVIA
VDD
VLVRD
VLVRA
VPORD
t
LVI
LVI enabled
LVI disabled due to LVR
POR
LVR
Figure A-10. Voltage Regulator — Chip Power-up and Voltage Drops (not scaled)
A.7.3
Output Loads
Resistive Loads
A.7.3.1
The on-chip voltage regulator is intended to supply the internal logic and oscillator circuits allows no
external DC loads.
A.7.3.2
Capacitive Loads
The capacitive loads are specified in Table A-24. Ceramic capacitors with X7R dielectricum are required.
Table A-24. Voltage Regulator — Capacitive Loads
Num
Characteristic
Symbol
Min
Typical
Max
Unit
1
2
V
V
DD external capacitive load
DDPLL external capacitive load
CDDext
400
90
440
220
12000
5000
nF
nF
CDDPLLext
630
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix B Emulation Information
Appendix B
Emulation Information
B.1
General
For emulation, external addressing of a 128K memory map is required. This is provided in a 112 LQFP
package version of the MC9S12C128 which includes the 3 necessary extra external address bus signals via
Port K. This package version is for emulation only and not provided as a general production package.
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
PW3/KWP3/PP3
PW2/KWP2/PP2
PW1/KWP1/PP1
/PW0/KWP0/PP0
NC
1
VRH
VDDA
2
3
NC
PAD07/AN07
NC
4
5
XADDR16/PK2
XADDR15/PK1
XADDR14/PK0
IOC0/PT0
6
PAD06/AN06
NC
7
8
PAD05/AN05
NC
9
IOC1/PT1
IOC2/PT2
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
PAD04/AN04
NC
IOC3/PT3
VDD1
PAD03/AN03
NC
MC9S12C128
VSS1
IOC4/PT4
PAD02/AN02
NC
IOC5/PT5
IOC6/PT6
PAD01/AN01
NC
IOC7/PT7
NC
PAD00/AN00
VSS2
VDD2
NC
NC
PA7/ADDR15/DATA15
PA6/ADDR14/DATA14
PA5/ADDR13/DATA13
PA4/ADDR12/DATA12
PA3/ADDR11/DATA11
PA2/ADDR10/DATA10
PA1/ADDR9/DATA9
PA0/ADDR8/DATA8
NC
MODC/TAGHI/BKGD
ADDR0/DATA0/PB0
ADDR1/DATA1/PB1
ADDR2/DATA2/PB2
ADDR3/DATA3/PB3
ADDR4/DATA4/PB4
Signals shown in Bold are available only in the 112 Pin Package. Pins marked "NC" are not connected
Figure B-1. Pin Assignments in 112-Pin LQFP
Freescale Semiconductor
MC9S12Q128
Rev 1.10
631
Appendix B Emulation Information
B.1.1
PK[2:0] / XADDR[16:14]
PK2-PK0 provide the expanded address XADDR[16:14] for the external bus.
Refer to the S12 Core user guide for detailed information about external address page access.
Internal Pull
Resistor
Pin Name
Function 1
Pin Name
Function 2
Power Domain
Description
Reset
State
CTRL
PK[2:0]
XADDR[16:14]
VDDX
PUPKE
Up
Port K I/O Pins
The reset state of DDRK in the S12_CORE is $00, configuring the pins as inputs.
The reset state of PUPKE in the PUCR register of the S12_CORE is "1" enabling the internal pullup
resistors at PortK[2:0].
In this reset state the pull-up resistors provide a defined state and prevent a floating input, thereby
preventing unnecessary current consumption at the input stage.
632
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix C Package Information
Appendix C
Package Information
C.1
General
This section provides the physical dimensions of the packages 48LQFP, 52LQFP, 80QFP.
Freescale Semiconductor
MC9S12Q128
Rev 1.10
633
Appendix C Package Information
C.1.1
80-Pin QFP Package
L
60
41
61
40
B
B
P
-A-
-B-
L
V
B
-A-,-B-,-D-
DETAIL A
DETAIL A
21
80
F
1
20
-D-
A
M
S
S
S
0.20
H
A-B
D
D
0.05 A-B
J
N
S
M
S
0.20
C A-B
D
M
E
DETAIL C
M
S
S
D
0.20
C
A-B
SECTION B-B
VIEW ROTATED 90
C
DATUM
PLANE
-H-
°
-C-
SEATING
PLANE
0.10
H
M
G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
MILLIMETERS
DIM MIN
MAX
14.10
14.10
2.45
A
B
C
D
E
F
G
H
J
13.90
13.90
2.15
0.22
2.00
0.22
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING LINE.
4. DATUMS -A-, -B- AND -D- TO BE
DETERMINED AT DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -C-.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
U
0.38
2.40
T
0.33
0.65 BSC
DATUM
PLANE
---
0.13
0.65
0.25
0.23
0.95
-H-
R
K
L
12.35 REF
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR
THE FOOT.
M
N
P
Q
R
S
T
U
V
W
X
5
0.13
10
0.17
°
°
0.325 BSC
0
K
7
Q
°
°
W
0.13
16.95
0.13
0
0.30
17.45
---
X
DETAIL C
---
°
16.95
0.35
17.45
0.45
1.6 REF
Figure C-1. 80-Pin QFP Mechanical Dimensions (Case no. 841B)
634
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix C Package Information
C.1.2
52-Pin LQFP Package
4X
4X 13 TIPS
0.20 (0.008) H L-M
N
0.20 (0.008) T L-M N
-X-
X=L, M, N
52
40
C
L
1
39
AB
AB
G
3X VIEW Y
-L-
-M-
B1
B
V
VIEW Y
BASE METAL
F
PLATING
V1
13
27
J
U
14
26
-N-
D
A1
M
S
S
N
0.13 (0.005)
T
L-M
S1
SECTION AB-AB
ROTATED 90 ° CLOCKWISE
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER
DATUMPLANE-H-ISLOCATEDATBOTTOMOFLEADANDISCOINCIDENT
WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4X θ2
4X θ3
C
2. DATUMS -L-, -M- AND -N- TO BE DETERMINED AT DATUM PLANE -H-.
DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -T-.
DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLEPROTRUSIONIS0.25(0.010)PERSIDE. DIMENSIONSAAND
B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM
PLANE -H-
0.10 (0.004)
T
-H-
-T-
SEATING
PLANE
DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUMSPACE BETWEEN PROTRUSION AND ADJACENT LEAD
OR PROTRUSION 0.07 (0.003).
VIEW AA
S
0.05 (0.002)
MILLIMETERS
DIM MIN MAX
10.00 BSC
INCHES
MIN MAX
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
W
2X R R1
θ1
A
A1
B
5.00 BSC
10.00 BSC
5.00 BSC
0.25 (0.010)
C2
B1
C
θ
---
0.05
1.30
0.20
0.45
0.22
1.70
---
0.067
GAGE PLANE
C1
C2
D
E
F
0.20 0.002 0.008
1.50 0.051
0.40 0.008
0.75 0.018
0.35 0.009
0.059
0.016
0.030
0.014
K
E
C1
G
J
K
R1
S
0.65 BSC
0.07
0.50 REF
0.08
12.00 BSC
6.00 BSC
0.09 0.16 0.004
0.026 BSC
0.20 0.003
0.20 0.003
0.008
0.020 REF
VIEW AA
Z
0.008
0.472 BSC
0.236 BSC
0.006
S1
U
V
12.00 BSC
6.00 BSC
0.20 REF
1.00 REF
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
V1
W
Z
θ
0
0
12
12
7
0
0
12
12
7
°
°
°
°
°
°
---
REF
---
REF
θ1
θ2
θ3
°
°
REF
REF
°
°
Figure C-2. 52-Pin LQFP Mechanical Dimensions (Case no. 848D-03)
Freescale Semiconductor
MC9S12Q128
Rev 1.10
635
Appendix C Package Information
C.1.3
48-Pin LQFP Package
4X
NOTES:
0.200 AB T-U Z
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
DETAIL Y
9
A
P
A1
48
37
4. DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
5. DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE AC.
1
36
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 PER SIDE. DIMENSIONS
AANDBDOINCLUDEMOLDMISMATCHAND
ARE DETERMINED AT DATUM PLANE AB.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
T
U
B
V
AE
AE
B1
V1
12
25
MILLIMETERS
DIM MIN MAX
13
24
Z
A
A1
B
B1
C
D
E
F
G
H
J
K
L
M
N
P
7.000 BSC
3.500 BSC
7.000 BSC
S1
T, U, Z
3.500 BSC
1.400 1.600
0.170 0.270
1.350 1.450
0.170 0.230
0.500 BSC
0.050 0.150
0.090 0.200
0.500 0.700
S
DETAIL Y
4X
0.200 AC T-U Z
0
7
° °
0.080 AC
12 REF
°
G
AB
AC
0.090 0.160
0.250 BSC
0.150 0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
R
S
S1
V
V1
W
AA
AD
°
M
BASE METAL
TOP & BOTTOM
R
N
J
E
C
H
F
D
M
0.080
AC T-U Z
SECTION AE-AE
W
°
L
K
DETAIL AD
AA
Figure C-3. 48-Pin LQFP Mechanical Dimensions (Case no. 932-03 issue F)
636
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix D Derivative Differences
Appendix D
Derivative Differences
The Device User Guide provides information about the MC9S12Q-Family.
The Q-Family offers an extensive range of package, temperature and speed options.
Table D-1. shows a feature overview of the Q family members.
Table D-1. List of MC9S12Q and MC3S12Q Family members
(1)
Flash ROM RAM
Package
Device
CAN
SCI
SPI
A/D
PWM
Timer
I/O
48LQFP
52LQFP
80QFP
MC9S12Q128
MC9S12Q128
MC9S12Q128
MC9S12Q96
MC9S12Q96
MC9S12Q96
MC9S12Q64
MC9S12Q64
MC9S12Q32
MC9S12Q32
MC3S12Q128
MC3S12Q128
MC3S12Q128
MC3S12Q96
MC3S12Q96
MC3S12Q96
MC3S12Q64
MC3S12Q64
MC3S12Q32
MC3S12Q32
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
8ch
4ch
4ch
4ch
4ch
4ch
4ch
—
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
6ch
31
128K
96K
—
—
4K
3K
35
60
31
35
60
31
35
31
35
31
35
60
31
35
60
31
35
31
35
48LQFP
52LQFP
80QFP
48LQFP
52LQFP
48LQFP
52LQFP
48LQFP
52LQFP
80QFP
64K
32K
—
—
2K
1K
—
—
—
4ch
4ch
4ch
4ch
4ch
4ch
—
—
—
128K
96K
4K
3K
48LQFP
52LQFP
80QFP
48LQFP
52LQFP
48LQFP
52LQFP
—
—
64K
32K
2K
1K
—
—
—
1. Includes 2 input only pins (IRQ and XIRQ)
Freescale Semiconductor
MC9S12Q128
Rev 1.10
637
Appendix E Ordering Information
Appendix E
Ordering Information
Temperature Options
MC9S12 Q32
C FU
16
C = -40˚C to 85˚C
V = -40˚C to 105˚C
M = -40˚C to 125˚C
Package Options
FU = 80QFP
Speed Option
Package Option
Temperature Option
Device Title
PB = 52LQFP
FA = 48LQFP
Speed Options
Controller Family
8 = 8MHz bus
16 = 16MHz bus
Figure E-1. Order Part number Coding
Table E-1. MC9S12Q128 Part Number Coding
(2)
(1)
I/O
,
Mask
set
Part Number
Temp.
Package
Speed Die Type Flash RAM
(3)
MC9S12Q128CFA16 XL09S/XM66G -40˚C, 85˚C
MC9S12Q128CPB16 XL09S/XM66G -40˚C, 85˚C
MC9S12Q128CFU16 XL09S/XM66G -40˚C, 85˚C
48LQFP
52LQFP
80QFP
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
8MHz
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
128K
128K
128K
128K
128K
128K
128K
128K
128K
128K
128K
128K
128K
128K
128K
128K
128K
128K
96K
4K
4K
4K
4K
4K
4K
4K
4K
4K
4K
4K
4K
4K
4K
4K
4K
4K
4K
3K
3K
3K
3K
3K
3K
3K
31
35
60
31
35
60
31
35
60
31
35
60
31
35
60
31
35
60
31
35
60
31
35
60
31
MC9S12Q128VFA16 XL09S/XM66G -40˚C,105˚C 48LQFP
MC9S12Q128VPB16 XL09S/XM66G -40˚C,105˚C 52LQFP
MC9S12Q128VFU16 XL09S/XM66G -40˚C, 105˚C
80QFP
MC9S12Q128MFA16 XL09S/XM66G -40˚C,125˚C 48LQFP
MC9S12Q128MPB16 XL09S/XM66G -40˚C,125˚C 52LQFP
MC9S12Q128MFU16 XL09S/XM66G -40˚C, 125˚C
MC9S12Q128CFA8 XL09S/XM66G -40˚C, 85˚C
MC9S12Q128CPB8 XL09S/XM66G -40˚C, 85˚C
MC9S12Q128CFU8 XL09S/XM66G -40˚C, 85˚C
80QFP
48LQFP
52LQFP
80QFP
8MHz
8MHz
MC9S12Q128VFA8 XL09S/XM66G -40˚C,105˚C 48LQFP
MC9S12Q128VPB8 XL09S/XM66G -40˚C,105˚C 52LQFP
8MHz
8MHz
MC9S12Q128VFU8 XL09S/XM66G -40˚C, 105˚C
80QFP
8MHz
MC9S12Q128MFA8 XL09S/XM66G -40˚C,125˚C 48LQFP
MC9S12Q128MPB8 XL09S/XM66G -40˚C,125˚C 52LQFP
8MHz
8MHz
MC9S12Q128MFU8 XL09S/XM66G -40˚C, 125˚C
MC9S12Q96CFA16 XL09S/XM66G -40˚C, 85˚C
MC9S12Q96CPB16 XL09S/XM66G -40˚C, 85˚C
MC9S12Q96CFU16 XL09S/XM66G -40˚C, 85˚C
80QFP
48LQFP
52LQFP
80QFP
8MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
96K
96K
MC9S12Q96VFA16 XL09S/XM66G -40˚C,105˚C 48LQFP
MC9S12Q96VPB16 XL09S/XM66G -40˚C,105˚C 52LQFP
96K
96K
MC9S12Q96VFU16 XL09S/XM66G -40˚C, 105˚C
80QFP
96K
MC9S12Q96MFA16 XL09S/XM66G -40˚C,125˚C 48LQFP
96K
638
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix E Ordering Information
(2)
(1)
I/O
,
Mask
set
Part Number
Temp.
Package
Speed Die Type Flash RAM
(3)
MC9S12Q96MPB16 XL09S/XM66G -40˚C,125˚C 52LQFP
16MHz
16MHz
8MHz
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C32 die
96K
96K
96K
96K
96K
96K
96K
96K
96K
96K
96K
64K
64K
64K
64K
64K
64K
64K
64K
64K
64K
64K
64K
32K
32K
32K
32K
32K
32K
32K
32K
32K
32K
32K
32K
128K
128K
128K
128K
128K
128K
128K
128K
3K
3K
3K
3K
3K
3K
3K
3K
3K
3K
3K
2K
2K
2K
2K
2K
2K
2K
2K
2K
2K
2K
2K
1K
1K
1K
1K
1K
1K
1K
1K
1K
1K
1K
1K
4K
4K
4K
4K
4K
4K
4K
4K
35
60
31
35
60
31
35
60
31
35
60
31
35
31
35
31
35
31
35
31
35
31
35
31
35
31
35
31
35
31
35
31
35
31
35
31
35
60
31
35
60
31
35
MC9S12Q96MFU16 XL09S/XM66G -40˚C, 125˚C
MC9S12Q96CFA8 XL09S/XM66G -40˚C, 85˚C
MC9S12Q96CPB8 XL09S/XM66G -40˚C, 85˚C
MC9S12Q96CFU8 XL09S/XM66G -40˚C, 85˚C
80QFP
48LQFP
52LQFP
80QFP
8MHz
8MHz
MC9S12Q96VFA8 XL09S/XM66G -40˚C,105˚C 48LQFP
MC9S12Q96VPB8 XL09S/XM66G -40˚C,105˚C 52LQFP
8MHz
8MHz
MC9S12Q96VFU8 XL09S/XM66G -40˚C, 105˚C
80QFP
8MHz
MC9S12Q96MFA8 XL09S/XM66G -40˚C,125˚C 48LQFP
MC9S12Q96MPB8 XL09S/XM66G -40˚C,125˚C 52LQFP
8MHz
8MHz
MC9S12Q96MFU8 XL09S/XM66G -40˚C, 125˚C
MC9S12Q64CFA16 XL09S/XM66G -40˚C, 85˚C
MC9S12Q64CPB16 XL09S/XM66G -40˚C, 85˚C
80QFP
48LQFP
52LQFP
8MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
8MHz
MC9S12Q64VFA16 XL09S/XM66G -40˚C,105˚C 48LQFP
MC9S12Q64VPB16 XL09S/XM66G -40˚C,105˚C 52LQFP
MC9S12Q64MFA16 XL09S/XM66G -40˚C,125˚C 48LQFP
MC9S12Q64MPB16 XL09S/XM66G -40˚C,125˚C 52LQFP
MC9S12Q64CFA8 XL09S/XM66G -40˚C, 85˚C
MC9S12Q64CPB8 XL09S/XM66G -40˚C, 85˚C
48LQFP
52LQFP
8MHz
MC9S12Q64VFA8 XL09S/XM66G -40˚C,105˚C 48LQFP
MC9S12Q64VPB8 XL09S/XM66G -40˚C,105˚C 52LQFP
MC9S12Q64MFA8 XL09S/XM66G -40˚C,125˚C 48LQFP
MC9S12Q64MPB8 XL09S/XM66G -40˚C,125˚C 52LQFP
8MHz
8MHz
8MHz
8MHz
MC9S12Q32CFA16 xL45J / xM34C -40˚C, 85˚C
MC9S12Q32CPB16 xL45J / xM34C -40˚C, 85˚C
48LQFP
52LQFP
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
8MHz
C32 die
MC9S12Q32VFA16 xL45J / xM34C -40˚C,105˚C 48LQFP
MC9S12Q32VPB16 xL45J / xM34C -40˚C,105˚C 52LQFP
MC9S12Q32MFA16 xL45J / xM34C -40˚C,125˚C 48LQFP
MC9S12Q32MPB16 xL45J / xM34C -40˚C,125˚C 52LQFP
C32 die
C32 die
C32 die
C32 die
MC9S12Q32CFA8 xL45J / xM34C -40˚C, 85˚C
MC9S12Q32CPB8 xL45J / xM34C -40˚C, 85˚C
48LQFP
52LQFP
C32 die
8MHz
C32 die
MC9S12Q32VFA8 xL45J / xM34C -40˚C,105˚C 48LQFP
MC9S12Q32VPB8 xL45J / xM34C -40˚C,105˚C 52LQFP
MC9S12Q32MFA8 xL45J / xM34C -40˚C,125˚C 48LQFP
MC9S12Q32MPB8 xL45J / xM34C -40˚C,125˚C 52LQFP
8MHz
C32 die
8MHz
C32 die
8MHz
C32 die
8MHz
C32 die
MC3S12Q128CFA16 XL09S/XM66G -40˚C, 85˚C
MC3S12Q128CPB16 XL09S/XM66G -40˚C, 85˚C
MC3S12Q128CFU16 XL09S/XM66G -40˚C, 85˚C
48LQFP
52LQFP
80QFP
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
MC3S12Q128VFA16 XL09S/XM66G -40˚C,105˚C 48LQFP
MC3S12Q128VPB16 XL09S/XM66G -40˚C,105˚C 52LQFP
MC3S12Q128VFU16 XL09S/XM66G -40˚C, 105˚C
80QFP
MC3S12Q128MFA16 XL09S/XM66G -40˚C,125˚C 48LQFP
MC3S12Q128MPB16 XL09S/XM66G -40˚C,125˚C 52LQFP
Freescale Semiconductor
MC9S12Q128
Rev 1.10
639
Appendix E Ordering Information
(2)
(1)
I/O
,
Mask
set
Part Number
Temp.
Package
Speed Die Type Flash RAM
(3)
MC3S12Q128MFU16 XL09S/XM66G -40˚C, 125˚C
MC3S12Q128CFA8 XL09S/XM66G -40˚C, 85˚C
MC3S12Q128CPB8 XL09S/XM66G -40˚C, 85˚C
MC3S12Q128CFU8 XL09S/XM66G -40˚C, 85˚C
80QFP
48LQFP
52LQFP
80QFP
16MHz
8MHz
8MHz
8MHz
8MHz
8MHz
8MHz
8MHz
8MHz
8MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
8MHz
8MHz
8MHz
8MHz
8MHz
8MHz
8MHz
8MHz
8MHz
16MHz
16MHz
16MHz
16MHz
16MHz
16MHz
8MHz
8MHz
8MHz
8MHz
8MHz
8MHz
16MHz
16MHz
16MHz
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C128 die
C32 die
128K
128K
128K
128K
128K
128K
128K
128K
128K
128K
96K
96K
96K
96K
96K
96K
96K
96K
96K
96K
96K
96K
96K
96K
96K
96K
96K
96K
64K
64K
64K
64K
64K
64K
64K
64K
64K
64K
64K
64K
32K
32K
32K
4K
4K
4K
4K
4K
4K
4K
4K
4K
4K
3K
3K
3K
3K
3K
3K
3K
3K
3K
3K
3K
3K
3K
3K
3K
3K
3K
3K
2K
2K
2K
2K
2K
2K
2K
2K
2K
2K
2K
2K
1K
1K
1K
60
31
35
60
31
35
60
31
35
60
31
35
60
31
35
60
31
35
60
31
35
60
31
35
60
31
35
60
31
35
31
35
31
35
31
35
31
35
31
35
31
35
31
MC3S12Q128VFA8 XL09S/XM66G -40˚C,105˚C 48LQFP
MC3S12Q128VPB8 XL09S/XM66G -40˚C,105˚C 52LQFP
MC3S12Q128VFU8 XL09S/XM66G -40˚C, 105˚C
80QFP
MC3S12Q128MFA8 XL09S/XM66G -40˚C,125˚C 48LQFP
MC3S12Q128MPB8 XL09S/XM66G -40˚C,125˚C 52LQFP
MC3S12Q128MFU8 XL09S/XM66G -40˚C, 125˚C
MC3S12Q96CFA16 XL09S/XM66G -40˚C, 85˚C
MC3S12Q96CPB16 XL09S/XM66G -40˚C, 85˚C
MC3S12Q96CFU16 XL09S/XM66G -40˚C, 85˚C
80QFP
48LQFP
52LQFP
80QFP
MC3S12Q96VFA16 XL09S/XM66G -40˚C,105˚C 48LQFP
MC3S12Q96VPB16 XL09S/XM66G -40˚C,105˚C 52LQFP
MC3S12Q96VFU16 XL09S/XM66G -40˚C, 105˚C
80QFP
MC3S12Q96MFA16 XL09S/XM66G -40˚C,125˚C 48LQFP
MC3S12Q96MPB16 XL09S/XM66G -40˚C,125˚C 52LQFP
MC3S12Q96MFU16 XL09S/XM66G -40˚C, 125˚C
MC3S12Q96CFA8 XL09S/XM66G -40˚C, 85˚C
MC3S12Q96CPB8 XL09S/XM66G -40˚C, 85˚C
MC3S12Q96CFU8 XL09S/XM66G -40˚C, 85˚C
80QFP
48LQFP
52LQFP
80QFP
MC3S12Q96VFA8 XL09S/XM66G -40˚C,105˚C 48LQFP
MC3S12Q96VPB8 XL09S/XM66G -40˚C,105˚C 52LQFP
MC3S12Q96VFU8 XL09S/XM66G -40˚C, 105˚C
80QFP
MC3S12Q96MFA8 XL09S/XM66G -40˚C,125˚C 48LQFP
MC3S12Q96MPB8 XL09S/XM66G -40˚C,125˚C 52LQFP
MC3S12Q96MFU8 XL09S/XM66G -40˚C, 125˚C
MC3S12Q64CFA16 XL09S/XM66G -40˚C, 85˚C
MC3S12Q64CPB16 XL09S/XM66G -40˚C, 85˚C
80QFP
48LQFP
52LQFP
MC3S12Q64VFA16 XL09S/XM66G -40˚C,105˚C 48LQFP
MC3S12Q64VPB16 XL09S/XM66G -40˚C,105˚C 52LQFP
MC3S12Q64MFA16 XL09S/XM66G -40˚C,125˚C 48LQFP
MC3S12Q64MPB16 XL09S/XM66G -40˚C,125˚C 52LQFP
MC3S12Q64CFA8 XL09S/XM66G -40˚C, 85˚C
MC3S12Q64CPB8 XL09S/XM66G -40˚C, 85˚C
48LQFP
52LQFP
MC3S12Q64VFA8 XL09S/XM66G -40˚C,105˚C 48LQFP
MC3S12Q64VPB8 XL09S/XM66G -40˚C,105˚C 52LQFP
MC3S12Q64MFA8 XL09S/XM66G -40˚C,125˚C 48LQFP
MC3S12Q64MPB8 XL09S/XM66G -40˚C,125˚C 52LQFP
MC3S12Q32CFA16 xL45J / xM34C -40˚C, 85˚C
MC3S12Q32CPB16 xL45J / xM34C -40˚C, 85˚C
48LQFP
52LQFP
C32 die
MC3S12Q32VFA16 xL45J / xM34C -40˚C,105˚C 48LQFP
C32 die
640
MC9S12Q128
Rev 1.10
Freescale Semiconductor
Appendix E Ordering Information
(2)
(1)
I/O
,
Mask
set
Part Number
Temp.
Package
Speed Die Type Flash RAM
(3)
MC3S12Q32VPB16 xL45J / xM34C -40˚C,105˚C 52LQFP
MC3S12Q32MFA16 xL45J / xM34C -40˚C,125˚C 48LQFP
MC3S12Q32MPB16 xL45J / xM34C -40˚C,125˚C 52LQFP
16MHz
16MHz
16MHz
8MHz
8MHz
8MHz
8MHz
8MHz
8MHz
C32 die
C32 die
C32 die
C32 die
C32 die
C32 die
C32 die
C32 die
C32 die
32K
32K
32K
32K
32K
32K
32K
32K
32K
1K
1K
1K
1K
1K
1K
1K
1K
1K
35
31
35
31
35
31
35
31
35
MC3S12Q32CFA8 xL45J / xM34C -40˚C, 85˚C
MC3S12Q32CPB8 xL45J / xM34C -40˚C, 85˚C
48LQFP
52LQFP
MC3S12Q32VFA8 xL45J / xM34C -40˚C,105˚C 48LQFP
MC3S12Q32VPB8 xL45J / xM34C -40˚C,105˚C 52LQFP
MC3S12Q32MFA8 xL45J / xM34C -40˚C,125˚C 48LQFP
MC3S12Q32MPB8 xL45J / xM34C -40˚C,125˚C 52LQFP
1. XL09S denotes all minor revisions of L09S maskset
XL45J denotes all minor revisions of L45J maskset
Maskset dependent errata can be accessed at
http://e-www.motorola.com/wbapp/sps/site/prod_summary.jsp
2. All Q-Family derivatives feature 1 CAN, 1 SCI, 1 SPI, an 8-channel A/D, and a 6 channel timer. The Q128 and Q96
also feature a 4 channel PWM. The Q64 and Q32 do not feature a PWM.
3. I/O is the sum of ports able to act as digital input or output.
Freescale Semiconductor
MC9S12Q128
Rev 1.10
641
Appendix E Ordering Information
642
MC9S12Q128
Rev 1.10
Freescale Semiconductor
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© Freescale Semiconductor, Inc. 2006. All rights reserved.
MC9S12Q128
Rev 1.10
05/2010
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