MC56F823XX [NXP]
This family of digital signal controllers (DSCs) is based on the 32-bit 56800EX core.;型号: | MC56F823XX |
厂家: | NXP |
描述: | This family of digital signal controllers (DSCs) is based on the 32-bit 56800EX core. |
文件: | 总68页 (文件大小:1128K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Document Number MC56F823XX
Rev. 4, 05/2020
NXP Semiconductors
Data Sheet: Technical Data
MC56F823XX
MC56F823xx
Supports MC56F82323VFM,
MC56F82316VLF, MC56F82313VLC
Features
• Communication interfaces
– Up to two high-speed queued SCI (QSCI) modules
with LIN slave functionality
– One queued SPI (QSPI) module
– One I2C/SMBus port
• This family of digital signal controllers (DSCs) is
based on the 32-bit 56800EX core. On a single chip,
each device combines the processing power of a DSP
and the functionality of an MCU, with a flexible set of
peripherals to support many target applications:
– Industrial control
• Timers
– One 16-bit quad timer (1 x 4 16-bit timer)
– Two Periodic Interval Timers (PITs)
– Home appliances
– Smart sensors
– Wireless charging
– Power distribution systems
– Motor control (ACIM, BLDC, PMSM, SR, stepper)
– Photovoltaic systems
• Security and integrity
– Cyclic Redundancy Check (CRC) generator
– Windowed Computer operating properly (COP)
watchdog
– External Watchdog Monitor (EWM)
– Circuit breaker
– Medical device/equipment
• Clocks
– Instrumentation
– Two on-chip relaxation oscillators: 8 MHz (400 kHz
at standby mode) and 200 kHz
– Crystal / resonator oscillator
• DSC based on 32-bit 56800EX core
– Up to 50 MIPS at 50 MHz core frequency
– DSP and MCU functionality in a unified, C-efficient
architecture
• System
– DMA controller
– Integrated power-on reset (POR) and low-voltage
interrupt (LVI) and brown-out reset module
– Inter-module crossbar connection
– JTAG/enhanced on-chip emulation (EOnCE) for
unobtrusive, real-time debugging
• On-chip memory
– Up to 32 KB flash memory
– Up to 6 KB data/program RAM
– On-chip flash memory and RAM can be mapped
into both program and data memory spaces
• Operating characteristics
• Analog
– Single supply: 3.0 V to 3.6 V
– 5 V–tolerant I/O (except for RESETB pin which is a
3.3 V pin only)
– Two high-speed, 5-channel, 12-bit ADCs with
dynamic x1, x2, and x4 programmable amplifier
– Three analog comparators with integrated 6-bit DAC
references
– Operation ambient temperature: -40°C to 105°C
– Up to two 12-bit digital-to-analog converters (DAC)
• 48-pin LQFP, 32-pin LQFP and 32-pin QFN packages
• One FlexPWM module with up to 6 PWM outputs
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Table of Contents
1
Overview............................................................................................3
6.1 Thermal handling ratings........................................................ 27
6.2 Moisture handling ratings........................................................27
6.3 ESD handling ratings.............................................................. 27
6.4 Voltage and current operating ratings..................................... 28
General............................................................................................... 29
7.1 General characteristics............................................................ 29
7.2 AC electrical characteristics....................................................30
7.3 Nonswitching electrical specifications....................................31
7.4 Switching specifications..........................................................37
7.5 Thermal specifications............................................................ 38
Peripheral operating requirements and behaviors..............................39
8.1 Core modules...........................................................................39
8.2 System modules.......................................................................40
8.3 Clock modules.........................................................................41
8.4 Memories and memory interfaces...........................................43
8.5 Analog..................................................................................... 45
8.6 Timer....................................................................................... 51
8.7 Communication interfaces.......................................................52
Design Considerations....................................................................... 57
9.1 Thermal design considerations................................................57
9.2 Electrical design considerations..............................................59
9.3 Power-on Reset design considerations....................................60
1.1 MC56F823xx Product Family.................................................3
1.2 56800EX 32-bit Digital Signal Controller (DSC) core...........3
1.3 Operation Parameters.............................................................. 4
1.4 On-Chip Memory and Memory Protection............................. 5
1.5 Interrupt Controller................................................................. 5
1.6 Peripheral highlights............................................................... 6
1.7 Block diagrams........................................................................11
MC56F823xx signal and pin descriptions..........................................14
2.1 Signal groups...........................................................................20
Ordering parts.....................................................................................21
3.1 Determining valid orderable parts...........................................21
Part identification...............................................................................21
4.1 Description.............................................................................. 21
4.2 Format..................................................................................... 21
4.3 Fields....................................................................................... 22
4.4 Example...................................................................................22
Terminology and guidelines...............................................................22
5.1 Definition: Operating requirement..........................................22
5.2 Definition: Operating behavior............................................... 23
5.3 Definition: Attribute................................................................23
5.4 Definition: Rating....................................................................23
5.5 Result of exceeding a rating....................................................24
5.6 Relationship between ratings and operating requirements......24
5.7 Guidelines for ratings and operating requirements................. 25
5.8 Definition: Typical value........................................................ 25
5.9 Typical value conditions......................................................... 26
Ratings................................................................................................27
7
2
3
4
8
5
9
10 Obtaining package dimensions.......................................................... 62
11 Pinout................................................................................................. 63
11.1 Signal Multiplexing and Pin Assignments..............................63
11.2 Pinout diagrams.......................................................................64
12 Product documentation.......................................................................66
13 Revision History.................................................................................67
6
MC56F823xx, Rev. 4, 05/2020
2
NXP Semiconductors
Overview
1 Overview
1.1 MC56F823xx Product Family
The following table is the comparsion of features among members of the family.
Table 1. MC56F823xx Family
Part Number
MC56F82
323VFM
316VLF
313VLC
Core frequency (MHz)
Flash memory (KB)
RAM (KB)
50
32
6
50
16
4
50
16
4
Interrupt Controller
Yes
1
Yes
1
Yes
1
Windowed Computer
Operating Properly (WCOP)
External Watchdog Monitor
(EWM)
1
1
1
Periodic Interrupt Timer (PIT)
2
1
2
1
2
1
Cyclic Redundancy Check
(CRC)
Quad Timer (TMR)
12-bit Cyclic ADC channels
PWM module :
1x4
2x3
6
1x4
2x5
6
1x4
2x3
6
Standard channel with input
capture1
12-bit DAC
0
2
0
DMA
Analog Comparators (CMP)
QSCI
Yes
Yes
Yes
2
4
2
1
2
1
QSPI
1
1
1
1
I2C/SMBus
1
39
1
26
GPIO
26
Package pin count
32 QFN
48 LQFP
32 LQFP
1. Input capture shares the pin with cooresponding PWM channels.
1.2 56800EX 32-bit Digital Signal Controller (DSC) core
• Efficient 32-bit 56800EX Digital Signal Processor (DSP) engine with modified dual
Harvard architecture:
• Three internal address buses
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
3
Overview
• Four internal data buses: two 32-bit primary buses, one 16-bit secondary data
bus, and one 16-bit instruction bus
• 32-bit data accesses
• Supports concurrent instruction fetches in the same cycle, and dual data accesses
in the same cycle
• 20 addressing modes
• As many as 50 million instructions per second (MIPS) at 50 MHz core frequency
• 162 basic instructions
• Instruction set supports both fractional arithmetic and integer arithmetic
• 32-bit internal primary data buses support 8-bit, 16-bit, and 32-bit data movement,
plus addition, subtraction, and logical operations
• Single-cycle 16 × 16-bit -> 32-bit and 32 x 32-bit -> 64-bit multiplier-accumulator
(MAC) with dual parallel moves
• 32-bit arithmetic and logic multi-bit shifter
• Four 36-bit accumulators, including extension bits
• Parallel instruction set with unique DSP addressing modes
• Hardware DO and REP loops
• Bit reverse address mode, which effectively supports DSP and Fast Fourier
Transform algorithms
• Full shadowing of the register stack for zero-overhead context saves and restores:
nine shadow registers correspond to nine address registers (R0, R1, R2, R3, R4, R5,
N, N3, M01)
• Instruction set supports both DSP and controller functions
• Controller-style addressing modes and instructions enable compact code
• Enhanced bit manipulation instruction set
• Efficient C compiler and local variable support
• Software subroutine and interrupt stack, with the stack's depth limited only by
memory
• Priority level setting for interrupt levels
• JTAG/Enhanced On-Chip Emulation (OnCE) for unobtrusive, real-time debugging
that is independent of processor speed
1.3 Operation Parameters
• Up to 50 MHz operation
• Operation ambient temperature:
-40 oC to 105oC
• Single 3.3 V power supply
• Supply range: VDD - VSS = 2.7 V to 3.6 V, VDDA - VSSA = 2.7 V to 3.6 V
MC56F823xx, Rev. 4, 05/2020
4
NXP Semiconductors
Overview
1.4 On-Chip Memory and Memory Protection
• Dual Harvard architecture permits as many as three simultaneous accesses to
program and data memory
• Internal flash memory with security and protection to prevent unauthorized access
• Memory resource protection (MRP) unit to protect supervisor programs and
resources from user programs
• Programming code can reside in flash memory during flash programming
• The dual-port RAM controller supports concurrent instruction fetches and data
accesses, or dual data accesses by the core.
• Concurrent accesses provide increased performance.
• The data and instruction arrive at the core in the same cycle, reducing latency.
• On-chip memory
• Up to 32 KB program/data flash memory
• Up to4 KB dual port data/program RAM
1.5 Interrupt Controller
• Five interrupt priority levels
• Three user-programmable priority levels for each interrupt source: level 0, level
1, level 2
• Unmaskable level 3 interrupts include illegal instruction, hardware stack
overflow, misaligned data access, SWI3 instruction
• Interrupt level 3 is highest priority and non-maskable. Its sources include:
• Illegal instructions
• Hardware stack overflow
• SWI instruction
• EOnce interrupts
• Misaligned data accesses
• Lowest-priority software interrupt: level LP
• Support for nested interrupts, so that a higher priority level interrupt request can
interrupt lower priority interrupt subroutine
• Masking of interrupt priority level is managed by the 56800EX core
• Two programmable fast interrupts that can be assigned to any interrupt source
• Notification to System Integration Module (SIM) to restart clock when in wait and
stop states
• Ability to relocate interrupt vector table
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
5
Peripheral highlights
1.6 Peripheral highlights
1.6.1 Flex Pulse Width Modulator (FlexPWM)
• Up to 100 MHz operation clock with PWM Resolution as fine as 10 ns
• PWM module contains four identical submodules, with two outputs per submodule
• 16 bits of resolution for center, edge-aligned, and asymmetrical PWMs
• PWM outputs can be configured as complementary output pairs or independent
outputs
• Dedicated time-base counter with period and frequency control per submodule
• Independent top and bottom deadtime insertion for each complementary pair
• Independent control of both edges of each PWM output
• Enhanced input capture and output compare functionality on each input:
• Channels not used for PWM generation can be used for buffered output compare
functions.
• Channels not used for PWM generation can be used for input capture functions.
• Enhanced dual edge capture functionality
• Synchronization of submodule to external hardware (or other PWM) is supported.
• Double-buffered PWM registers
• Integral reload rates from 1 to 16
• Half-cycle reload capability
• Multiple output trigger events can be generated per PWM cycle via hardware.
• Support for double-switching PWM outputs
• Up to eight fault inputs can be assigned to control multiple PWM outputs
• Programmable filters for fault inputs
• Independently programmable PWM output polarity
• Individual software control of each PWM output
• All outputs can be programmed to change simultaneously via a FORCE_OUT event.
• Option to supply the source for each complementary PWM signal pair from any of
the following:
• Crossbar module outputs
• External ADC input, taking into account values set in ADC high and low limit
registers
1.6.2 12-bit Analog-to-Digital Converter (Cyclic type)
• Two independent 12-bit analog-to-digital converters (ADCs):
• 2 x 5-channel external inputs
• Built-in x1, x2, x4 programmable gain pre-amplifier
MC56F823xx, Rev. 4, 05/2020
6
NXP Semiconductors
Peripheral highlights
• Maximum ADC clock frequency up to 10 MHz, having period as low as 100 ns
• Single conversion time of 10 ADC clock cycles
• Additional conversion time of 8 ADC clock cycles
• Support of analog inputs for single-ended and differential (including unipolar
differential) conversions
• Sequential and parallel scan modes. Parallel mode includes simultaneous and
independent scan modes.
• First 8 samples of each ADC have offset, limit and zero-crossing calculation
supported
• ADC conversions can be synchronized by any module connected to the internal
crossbar module, such as PWM, timer, GPIO, and comparator modules.
• Support for hardware-triggering and software-triggering conversions
• Support for a multi-triggering mode with a programmable number of conversions on
each trigger
• Each ADC has ability to scan and store up to 8 conversion results.
• Current injection protection
1.6.3 Periodic Interrupt Timer (PIT) Modules
• 16-bit counter with programmable count modulo
• PIT0 is master and PIT1 is slave (if synchronizing both PITs)
• The output signals of both PIT0 and PIT1 are internally connected to a peripheral
crossbar module
• Can run when the CPU is in Wait/Stop modes. Can also wake up the CPU from
Wait/Stop modes.
• In addition to its existing bus clock (up to 50 MHz), 3 alternate clock sources for the
counter clock are available:
• Crystal oscillator output
• 8 MHz / 400 kHz ROSC (relaxation oscillator output)
• On-chip low-power 200 kHz oscillator
1.6.4 Inter-Module Crossbar and AND-OR-INVERT logic
• Provides generalized connections between and among on-chip peripherals: ADCs,
12-bit DAC, comparators, quad-timers, FlexPWMs, EWM, and select I/O pins
• User-defined input/output pins for all modules connected to the crossbar
• DMA request and interrupt generation from the crossbar
• Write-once protection for all registers
• AND-OR-INVERT function provides a universal Boolean function generator that
uses a four-term sum-of-products expression, with each product term containing true
or complement values of the four selected inputs (A, B, C, D).
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
7
Peripheral highlights
1.6.5 Comparator
• Full rail-to-rail comparison range
• Support for high and low speed modes
• Selectable input source includes external pins and internal DACs
• Programmable output polarity
• 6-bit programmable DAC as a voltage reference per comparator
• Three programmable hysteresis levels
• Selectable interrupt on rising-edge, falling-edge, or toggle of a comparator output
1.6.6 12-bit Digital-to-Analog Converter
• 12-bit resolution
• Powerdown mode
• Automatic mode allows the DAC to automatically generate pre-programmed output
waveforms, including square, triangle, and sawtooth waveforms (for applications like
slope compensation)
• Programmable period, update rate, and range
• Output can be routed to an internal comparator, or optionally to an off-chip
destination
1.6.7 Quad Timer
• Four 16-bit up/down counters, with a programmable prescaler for each counter
• Operation modes: edge count, gated count, signed count, capture, compare, PWM,
signal shot, single pulse, pulse string, cascaded, quadrature decode
• Programmable input filter
• Counting start can be synchronized across counters
• Up to 100 MHz operation clock
1.6.8 Queued Serial Communications Interface (QSCI) modules
• Operating clock can be up to two times the CPU operating frequency
• Four-word-deep FIFOs available on both transmit and receive buffers
• Standard mark/space non-return-to-zero (NRZ) format
• 16-bit integer and 3-bit fractional baud rate selection
• Full-duplex or single-wire operation
• Programmable 8-bit or 9-bit data format
• Error detection capability
MC56F823xx, Rev. 4, 05/2020
8
NXP Semiconductors
Peripheral highlights
• Two receiver wakeup methods:
• Idle line
• Address mark
• 1/16 bit-time noise detection
• Up to 6.25 Mbit/s baud rate at 100 MHz operation clock
1.6.9 Queued Serial Peripheral Interface (QSPI) modules
• Maximum 12.5 Mbit/s baud rate
• Selectable baud rate clock sources for low baud rate communication
• Baud rate as low as the maximum Baud rate / 4096
• Full-duplex operation
• Master and slave modes
• Double-buffered operation with separate transmit and receive registers
• Four-word-deep FIFOs available on transmit and receive buffers
• Programmable length transmissions (2 bits to 16 bits)
• Programmable transmit and receive shift order (MSB as first bit transmitted)
1.6.10 Inter-Integrated Circuit (I2C)/System Management Bus
(SMBus) modules
• Compatible with I2C bus standard
• Support for System Management Bus (SMBus) specification, version 2
• Multi-master operation
• General call recognition
• 10-bit address extension
• Start/Repeat and Stop indication flags
• Support for dual slave addresses or configuration of a range of slave addresses
• Programmable glitch input filter with option to clock up to 100 MHz
1.6.11 Windowed Computer Operating Properly (COP) watchdog
• Programmable windowed timeout period
• Support for operation in all power modes: run mode, wait mode, stop mode
• Causes loss of reference reset 128 cycles after loss of reference clock to the PLL is
detected
• Selectable reference clock source in support of EN60730 and IEC61508
• Selectable clock sources:
• External crystal oscillator / external clock source
• On-chip low-power 200 kHz oscillator
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
9
Peripheral highlights
• System bus (IPBus up to 50 MHz)
• 8 MHz / 400 kHz ROSC
• Support for interrupt triggered when the counter reaches the timeout value
1.6.12 External Watchdog Monitor (EWM)
• Monitors external circuit as well as the software flow
• Programmable timeout period
• Interrupt capability prior to timeout
• Independent output (EWM_OUT_b) that places external circuit (but not CPU and
peripheral) in a safe mode when EWM timeout occurs
• Selectable reference clock source in support of EN60730 and IEC61508
• Wait mode and Stop mode operation is not supported.
• Selectable clock sources:
• External crystal oscillator / external clock source
• On-chip low-power 200 kHz oscillator
• System bus (IPBus up to 50 MHz)
• 8 MHz / 400 kHz ROSC
1.6.13 Power supervisor
• Power-on reset (POR) is released after VDD > 2.7 V during supply is ramped up;
CPU, peripherals, and JTAG/EOnCE controllers exit RESET state
• Brownout reset (VDD < 2.0 V)
• Critical warn low-voltage interrupt (LVI 2.2 V)
• Peripheral low-voltage warning interrupt (LVI 2.7 V)
1.6.14 Phase-locked loop
• Wide programmable output frequency: 200 MHz to 400 MHz
• Input reference clock frequency: 8 MHz to 16 MHz
• Detection of loss of lock and loss of reference clock
• Ability to power down
MC56F823xx, Rev. 4, 05/2020
10
NXP Semiconductors
Clock sources
1.6.15 Clock sources
1.6.15.1 On-chip oscillators
• Tunable 8 MHz relaxation oscillator with 400 kHz at standby mode (divide-by-two
output)
• 200 kHz low frequency clock as secondary clock source for COP, EWM, PIT
1.6.15.2 Crystal oscillator (MC56F82316 only)
• Support for both high ESR crystal oscillator (ESR greater than 100 Ω) and ceramic
resonator
• Operating frequency: 4–16 MHz
1.6.16 Cyclic Redundancy Check (CRC) Generator
• Hardware CRC generator circuit with 16-bit shift register
• High-speed hardware CRC calculation
• Programmable initial seed value
• CRC16-CCITT compliancy with x16 + x12 + x5 + 1 polynomial
• Error detection for all single, double, odd, and most multibit errors
• Option to transpose input data or output data (CRC result) bitwise, which is required
for certain CRC standards
1.6.17 General Purpose I/O (GPIO)
• 5 V tolerance (except RESET_B )
• Individual control of peripheral mode or GPIO mode for each pin
• Programmable push-pull or open drain output
• Configurable pullup or pulldown on all input pins
• All pins (except JTAG, RESET_B ) default to be GPIO inputs
• 2 mA / 9 mA capability
• Controllable output slew rate
1.7 Block diagrams
The 56800EX core is based on a modified dual Harvard-style architecture, consisting of
three execution units operating in parallel, and allowing as many as six operations per
instruction cycle. The MCU-style programming model and optimized instruction set
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
11
Clock sources
enable straightforward generation of efficient and compact code for the DSP and control
functions. The instruction set is also efficient for C compilers, to enable rapid
development of optimized control applications.
The device's basic architecture appears in Figure 1 and Figure 2. Figure 1 shows how the
56800EX system buses communicate with internal memories, and the IPBus interface
and the internal connections among the units of the 56800EX core. Figure 2 shows the
peripherals and control blocks connected to the IPBus bridge. See the specific device’s
Reference Manual for details.
DSP56800EX Core
Program Control Unit
ALU1
ALU2
Address
Generation
Unit
PC
LA
LA2
HWS0
HWS1
FIRA
Instruction
Decoder
R0
R1
(AGU)
R2
Interrupt
Unit
Program
Memory
M01
N3
R3
OMR
R4
SR
LC
LC2
R5
Looping
Unit
N
SP
FISR
XAB1
XAB2
PAB
Data/
Program
RAM
PDB
CDBW
CDBR
XDB2
A2
B2
C2
D2
A1
B1
C1
D1
Y1
Y0
X0
A0
B0
C0
D0
Bit-
Manipulation
Unit
IPBus
Interface
Data
Y
Enhanced
OnCE™
Arithmetic
Logic Unit
(ALU)
JTAG TAP
MAC and ALU Multi-Bit Shifter
Figure 1. 56800EX basic block diagram
MC56F823xx, Rev. 4, 05/2020
12
NXP Semiconductors
Clock sources
JTAG
Program Bus
Core Data Bus
EOnCE
56800EX CPU
Program
Controller
(PC)
Address
Generation
Unit (AGU)
Program/Data Flash
Up to 32KB
4
Secondary Data Bus
Arithmetic
Logic Unit
(ALU)
Bit
Manipulation
Unit
Data/Program RAM
Up to 6KB
DMA Controller
Interrupt Controller
Crystal OSC
Internal
8 MHz
Internal
200 kHz
Windowed
Watchdog (WCOP)
Power Management
Controller (PMC)
System Integration
Module (SIM)
Periodic Interrupt
Timer (PIT) 0, 1
CRC
PLL
Peripheral Bus
QSCI
0,1
I2C
0
QSPI
0
Quad Timer
eFlexPWM
EWM
Inter-Module
Crossbar B
AND-OR-INV
Logic
GPIO & Peripheral MUX
Inter-Module
Crossbar A
Package
Pins
DACB
12bit
Comparators with
6bit DAC A,B,C
ADC B
12bit
DACA
12bit
ADC A
12bit
Peripheral Bus
Figure 2. System diagram
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
13
MC56F823xx signal and pin descriptions
2 MC56F823xx signal and pin descriptions
After reset, each pin is configured for its primary function (listed first). Any alternative
functionality, shown in parentheses, must be programmed through the GPIO module
peripheral enable registers (GPIOx_PER) and the SIM module GPIO peripheral select
(GPSx) registers. All GPIO ports can be individually programmed as an input or output
(using bit manipulation).
• PWMA_FAULT0, PWMA_FAULT1, and similar signals are inputs used to disable
selected PWMA outputs, in cases where the fault conditions originate off-chip.
For the MC56F823xx products, which use 48-pin LQFP and 32-pin packages:
Table 2. Signal descriptions
Signal Name
48
LQFP
32
LQFP
Type
State
During
Reset
Signal Description
VDD
32
—
Supply
Supply
I/O Power — Supplies 3.3 V power to the chip I/O interface.
I/O Ground — Provide ground for the device I/O interface.
44
22
31
45
15
28
14
—
29
9
VSS
Supply
Supply
VDDA
Supply
Supply
Supply
Supply
Analog Power — Supplies 3.3 V power to the analog
modules. It must be connected to a clean analog power
supply.
VSSA
VCAP
16
10
Analog Ground — Supplies an analog ground to the analog
modules. It must be connected to a clean power supply.
19
43
—
On-chip
regulator
output
On-chip
regulator
output
Connect a 2.2 µF bypass capacitor between this pin and VSS
to stabilize the core voltage regulator output required for
proper device operation.
27
NOTE: For 32 LQFP package, connect a 4.7 µF bypass
capacitor between this pin and Vss since there is
only one VCAP pin.
TDI
48
46
1
32
30
1
Input
Input,
internal
pullup
Test Data Input — It is sampled on the rising edge of TCK
and has an internal pullup resistor. After reset, the default
state is TDI.
enabled
(GPIOD0)
Input/
Output
GPIO Port D0
TDO
Output
Output
Output
Test Data Output — It is driven in the shift-IR and shift-DR
controller states, and it changes on the falling edge of TCK.
After reset, the default state is TDO
(GPIOD1)
Input/
Output
GPIO Port D1
TCK
Input
Input,
internal
pullup
Test Clock Input — The pin is connected internally to a pullup
resistor. A Schmitt-trigger input is used for noise immunity.
After reset, the default state is TCK
enabled
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
14
NXP Semiconductors
MC56F823xx signal and pin descriptions
Table 2. Signal descriptions (continued)
Signal Name
48
LQFP
32
LQFP
Type
State
During
Reset
Signal Description
(GPIOD2)
Input/
GPIO Port D2
Output
TMS
47
31
Input
Input,
internal
pullup
Test Mode Select Input — It is sampled on the rising edge of
TCK and has an internal pullup resistor. After reset, the
default state is TMS.
enabled
NOTE: Always tie the TMS pin to VDD through a 2.2K
resistor if need to keep on-board debug capability.
Otherwise, directly tie to VDD
.
(GPIOD3)
Input/
GPIO Port D3
Output
RESET or
RESETB
2
2
Input
Input,
internal
pullup
Reset — A direct hardware reset on the processor. When
RESET is asserted low, the device is initialized and placed in
the reset state. A Schmitt-trigger input is used for noise
immunity. The internal reset signal is deasserted synchronous
with the internal clocks after a fixed number of internal clocks.
After reset, the default state is RESET. Recommended a
capacitor of up to 0.1 µF for filtering noise.
enabled
(GPIOD4)
Input/
Opendrain
Output
GPIO Port D4 RESET functionality is disabled in this mode
and the device can be reset only through POR, COP reset, or
software reset.
GPIOA0
9
6
7
Input/
Output
Input,
internal
pullup
GPIO Port A0
(ANA0&CMPA_I
N3)
Input
ANA0 is analog input to channel 0 of ADCA; CMPA_IN3 is
positive input 3 of analog comparator A. After reset, the
default state is GPIOA0.
enabled
(CMPC_O)
Output
Analog comparator C output
GPIOA1
10
Input/
Input,
GPIO Port A1: After reset, the default state is GPIOA1.
Output
internal
pullup
enabled
(ANA1&CMPA_I
N0)
Input
ANA1 is analog input to channel 1 of ADCA; CMPA_IN0 is
negative input 0 of analog comparator A. When used as an
analog input, the signal goes to ANA1 and CMPA_IN0. The
ADC control register configures this input as ANA1 or
CMPA_IN0.
GPIOA2
11
8
Input/
Input,
GPIO Port A2: After reset, the default state is GPIOA2.
Output
internal
pullup
enabled
(ANA2&VREFH
A&CMPA_IN1)
Input
ANA2 is analog input to channel 2 of ADCA; VREFHA is
analog reference high of ADCA; CMPA_IN1 is negative input
1 of analog comparator A. When used as an analog input, the
signal goes to both ANA2, VREFHA, and CMPA_IN1.
GPIOA3
12
8
—
—
Input/
Output
Input,
internal
pullup
GPIO Port A3: After reset, the default state is GPIOA3.
(ANA3&VREFL
A&CMPA_IN2)
Input
ANA3 is analog input to channel 3 of ADCA; VREFLA is
analog reference low of ADCA; CMPA_IN2 is negative input 2
of analog comparator A.
enabled
GPIOA4
Input/
Input,
GPIO Port A4: After reset, the default state is GPIOA4.
Output
internal
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
15
MC56F823xx signal and pin descriptions
Table 2. Signal descriptions (continued)
Signal Name
48
LQFP
32
LQFP
Type
State
During
Reset
Signal Description
pullup
enabled
(ANA4)
Input
ANA4 is Analog input to channel 4 of ADCA.
GPIOB0
17
11
Input/
Input,
GPIO Port B0: After reset, the default state is GPIOB0.
Output
internal
pullup
enabled
(ANB0&CMPB_I
N3)
Input
ANB0 is analog input to channel 0 of ADCB; CMPB_IN3 is
positive input 3 of analog comparator B. When used as an
analog input, the signal goes to ANB0 and CMPB_IN3. The
ADC control register configures this input as ANB0.
GPIOB1
18
12
Input/
Input,
GPIO Port B1: After reset, the default state is GPIOB1.
Output
internal
pullup
enabled
(ANB1&CMPB_I
N0)
Input
ANB1 is analog input to channel 1 of ADCB; CMPB_IN0 is
negative input 0 of analog comparator B. When used as an
analog input, the signal goes to ANB1 and CMPB_IN0. The
ADC control register configures this input as ANB1.
DACB_O
Analog
Output
12-bit digital-to-analog output
GPIOB2
20
21
13
—
Input/
Output
Input,
internal
pullup
GPIO Port B2: After reset, the default state is GPIOB2.
(ANB2&VERFH
B&CMPC_IN3)
Input
ANB2 is snalog input to channel 2 of ADCB; VREFHB is
analog reference high of ADCB; CMPC_IN3 is positive input 3
of analog comparator C. When used as an analog input, the
signal goes to both ANB2 and CMPC_IN3.
enabled
GPIOB3
Input/
Input,
GPIO Port B3: After reset, the default state is GPIOB3.
Output
internal
pullup
enabled
(ANB3&VREFL
B&CMPC_IN0)
Input
ANB3 is analog input to channel 3 of ADCB; VREFLB is
analog reference low of ADCB; CMPC_IN0 is negative input 0
of analog comparator C.
GPIOB4
14
3
—
—
Input/
Output
Input,
internal
pullup
GPIO Port B4: After reset, the default state is GPIOB4.
(ANB4&CMPC_
IN1)
Input
ANB4 is analog input to channel 4 of ADCB; CMPC_IN1 is
negative input 1 of analog comparator C.
enabled
GPIOC0
Input/
Input,
GPIO Port C0: After reset, the default state is GPIOC0.
Output
internal
pullup
enabled
(EXTAL)
Analog
Input
The external crystal oscillator input (EXTAL) connects the
internal crystal oscillator input to an external crystal or
ceramic resonator.
(CLKIN0)
Input
External clock input 01
GPIOC1
4
5
—
3
Input/
Output
Input,
internal
pullup
GPIO Port C1: After reset, the default state is GPIOC1.
(XTAL)
Input
The external crystal oscillator output (XTAL) connects the
internal crystal oscillator output to an external crystal or
ceramic resonator.
enabled
GPIOC2
Input/
Input,
GPIO Port C2: After reset, the default state is GPIOC2.
Output
internal
pullup
enabled
(TXD0)
Output
SCI0 transmit data output or transmit/receive in singlewire
operation
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
16
NXP Semiconductors
MC56F823xx signal and pin descriptions
Table 2. Signal descriptions (continued)
Signal Name
48
LQFP
32
LQFP
Type
State
During
Reset
Signal Description
(XB_OUT11)
(XB_IN2)
Output
Crossbar module output 11
Input
Crossbar module input 2
(CLKO0)
Output
Buffered clock output 0: the clock source is selected by
clockout select (CLKOSEL) bits in the clock output select
register (CLKOUT) of the SIM.
GPIOC3
6
4
Input/
Input,
GPIO Port C3: After reset, the default state is GPIOC3.
Output
internal
pullup
enabled
(TA0)
Input/
Output
Quad timer module A channel 0 input/output
(CMPA_O)
(RXD0)
Output
Input
Analog comparator A output
SCI0 receive data input
(CLKIN1)
GPIOC4
Input
External clock input 1
7
5
Input/
Input,
GPIO Port C4: After reset, the default state is GPIOC4.
Output
internal
pullup
enabled
(TA1)
Input/
Output
Quad timer module A channel 1 input/output
(CMPB_O)
(XB_IN6)
Output
Input
Analog comparator B output
Crossbar module input 6
(EWM_OUT_B)
GPIOC5
Output
External Watchdog Module output
GPIO Port C5: After reset, the default state is GPIOC5.
13
23
—
Input/
Output
Input,
internal
pullup
(DACA_O)
Analog
Output
12-bit digital-to-analog output
enabled
(XB_IN7)
Input
Crossbar module input 7
GPIOC6
15
Input/
Input,
GPIO Port C6: After reset, the default state is GPIOC6.
Output
internal
pullup
enabled
(TA2)
Input/
Output
Quad timer module A channel 2 input/output
(XB_IN3)
Input
Crossbar module input 3
(CMP_REF)
Analog
Input
Positive input 3 of analog comparator A and B and C.
(SS0_B)
GPIOC7
(SS0_B)
(TXD0)
Input/
Output
In slave mode, SS0_B indicates to the SPI module 0 that the
current transfer is to be received.
24
—
Input/
Output
Input,
GPIO Port C7: After reset, the default state is GPIOC7.
internal
pullup
enable
Input/
Output
In slave mode, SS0_B indicates to the SPI module 0 that the
current transfer is to be received.
Output
SCI0 transmit data output or transmit/receive in singlewire
operation
(XB_IN8)
Input
Crossbar module input 8
GPIOC8
25
16
Input/
Input,
GPIO Port C8: After reset, the default state is GPIOC8.
Output
internal
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
17
MC56F823xx signal and pin descriptions
Table 2. Signal descriptions (continued)
Signal Name
48
LQFP
32
LQFP
Type
State
During
Reset
Signal Description
pullup
enabled
(MISO0)
Input/
Output
Master in/slave out for SPI0 — In master mode, MISO0 pin is
the data input. In slave mode, MISO0 pin is the data output.
The MISO line of a slave device is placed in the high-
impedance state if the slave device is not selected.
(RXD0)
Input
SCI0 receive data input
(XB_IN9)
(XB_OUT6)
GPIOC9
Input
Crossbar module input 9
Output
Crossbar module output 6
26
17
Input/
Input,
GPIO Port C9: After reset, the default state is GPIOC9.
Output
internal
pullup
enabled
(SCLK0)
Input/
Output
SPI0 serial clock. In master mode, SCLK0 pin is an output,
clocking slaved listeners. In slave mode, SCLK0 pin is the
data clock input.
(XB_IN4)
(TXD0)
Input
Crossbar module input 4
Output
SCI0 transmit data output or transmit/receive in single wire
operation
(XB_OUT8)
Output
Crossbar module output 8
GPIOC10
27
18
Input/
Input,
GPIO Port C10: After reset, the default state is GPIOC10.
Output
intemrnal
pullup
enabled
(MOSI0)
Input/
Output
Master out/slave in for SPI0 — In master mode, MOSI0 pin is
the data output. In slave mode, MOSI0 pin is the data input.
(XB_IN5)
(MISO0)
Input
Crossbar module input 5
Input/
Output
Master in/slave out for SPI0 — In master mode, MISO0 pin is
the data input. In slave mode, MISO0 pin is the data output.
The MISO line of a slave device is placed in the high-
impedance state if the slave device is not selected.
(XB_OUT9)
Output
Crossbar module output 9
GPIOC11
29
30
—
—
Input/
Output
Input,
internal
pullup
GPIO Port C11: After reset, the default state is GPIOC11.
(SCL0)
Input/
Open-drain
Output
I2C0 serial clock
enabled
(TXD1)
Output
SCI1 transmit data output or transmit/receive in single wire
operation
GPIOC12
Input/
Input,
GPIO Port C12: After reset, the default state is GPIOC12.
Output
internal
pullup
enabled
(SDA0)
Input/
I2C0 serial data line
Open-drain
Output
(RXD1)
Input
SCI1 receive data input
GPIOC13
37
—
Input/
Input,
GPIO Port C13: After reset, the default state is GPIOC13.
Output
internal
pullup
enabled
(TA3)
Input/
Output
Quad timer module A channel 3 input/output
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
18
NXP Semiconductors
MC56F823xx signal and pin descriptions
Table 2. Signal descriptions (continued)
Signal Name
48
LQFP
32
LQFP
Type
State
During
Reset
Signal Description
(XB_IN6)
Input
Crossbar module input 6
(EWM_OUT_B)
GPIOC14
Output
External Watchdog Module output
41
—
Input/
Input,
GPIO Port C14: After reset, the default state is GPIOC14.
Output
internal
pullup
enabled
(SDA0)
Input/
Open-drain
Output
I2C0 serial data line
(XB_OUT4)
Output
Input
Crossbar module output 4
Disable PWMA output 4
(PWM_FAULT4
)
GPIOC15
42
—
Input/
Output
Input,
internal
pullup
GPIO Port C15: After reset, the default state is GPIOC15.
I2C0 serial clock
(SCL0)
Input/
Open-drain
Output
enabled
(XB_OUT5)
Output
Input
Crossbar module output 5
Disable PWMA output 5
(PWM_FAULT5
)
GPIOE0
33
34
35
36
39
21
22
23
24
25
Input/
Output
Input,
internal
pullup
GPIO Port E0: After reset, the default state is GPIOE0.
PWM module A , submodule 0, output B or input capture B
GPIO Port E1: After reset, the default state is GPIOE1.
PWM module A , submodule 0, output A or input capture A
GPIO Port E2: After reset, the default state is GPIOE2.
PWM module A , submodule 1, output B or input capture B
GPIO Port E3: After reset, the default state is GPIOE3.
PWM module A , submodule 1, output A or input capture A
GPIO Port E4: After reset, the default state is GPIOE4.
PWM module A , submodule 2, output B or input capture B
(PWMA_0B)
GPIOE1
Input/
Output
enabled
Input/
Output
Input,
internal
pullup
(PWMA_0A)
GPIOE2
Input/
Output
enabled
Input/
Output
Input,
internal
pullup
(PWMA_1B)
GPIOE3
Input/
Output
enabled
Input/
Output
Input,
internal
pullup
(PWM_1A)
GPIOE4
Input/
Output
enabled
Input/
Output
Input,
internal
pullup
(PWMA_2B)
Input/
Output
enabled
(XB_IN2)
Input
Crossbar module input 2
GPIOE5
40
26
Input/
Input,
GPIO Port E5: After reset, the default state is GPIOE5.
Output
internal
pullup
enabled
(PWMA_2A)
(XB_IN3)
Input/
Output
PWM module A , submodule 2, output A or input capture A
Crossbar module input 3
Input
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
19
MC56F823xx signal and pin descriptions
Table 2. Signal descriptions (continued)
Signal Name
GPIOF0
48
LQFP
32
LQFP
Type
State
During
Reset
Signal Description
28
—
Input/
Output
Input,
internal
pullup
GPIO Port F0: After reset, the default state is GPIOF0.
Crossbar module input 6
(XB_IN6)
(SCLK1)
Input
enabled
Input/
Output
SPI1 serial clock — In master mode, SCLK1 pin is an output,
clocking slaved listeners. In slave mode, SCLK1 pin is the
data clock input 0.
GPIOF1
38
—
—
Input/
Output
Input,
internal
pullup
GPIO Port F1: After reset, the default state is GPIOF1.
(CLKO1)
Output
Buffered clock output 1: the clock source is selected by
clockout select (CLKOSEL) bits in the clock output select
register (CLKOUT) of the SIM.
enabled
(XB_IN7)
Input
Crossbar module input 7
GPIOF2
19
Input/
Input,
GPIO Port F2: After reset, the default state is GPIOF2.
Output
internal
pullup
enabled
(SCL0)
Input/
Open-
drain
I2C0 serial clock
Output
(XB_OUT6)
(MISO1)
Output
Crossbar module output 6
Input/
Output
Master in/slave out for SPI1 —In master mode, MISO1 pin is
the data input. In slave mode, MISO1 pin is the data output.
The MISO line of a slave device is placed in the high-
impedance state if the slave device is not selected.
GPIOF3
—
20
Input/
Input,
GPIO Port F3: After reset, the default state is GPIOF3.
Output
internal
pullup
enabled
(SDA0)
Input/
Open-drain
Output
I2C0 serial data line
(XB_OUT7)
(MOSI1)
Output
Crossbar module output 7
Input/
Output
Master out/slave in for SPI1— In master mode, MOSI1 pin is
the data output. In slave mode, MOSI1 pin is the data input.
1. If CLKIN is selected as the device’s external clock input, then both the GPS_C0 bit (in GPS1) and the EXT_SEL bit (in
OCCS oscillator control register (OSCTL)) must be set. Also, the crystal oscillator should be powered down.
2.1 Signal groups
The input and output signals of the MC56F8F823xx are organized into functional groups,
as detailed in the following table.
MC56F823xx, Rev. 4, 05/2020
20
NXP Semiconductors
Ordering parts
Table 3. Functional Group Pin Allocations
Functional Group
Number of Pins
32LQFP
48LQFP
Power Inputs (VDD, VDDA), Power output( VCAP
)
3
3
5
4
Ground (VSS, VSSA
Reset
)
1
1
Queued Serial Peripheral Interface (QSPI0 and QSPI1) ports
Queued Serial Communications Interface (QSCI0 and QSCI1) ports
Inter-Integrated Circuit Interface (I2C0) ports
12-bit Analog-to-Digital Converter inputs
Analog Comparator inputs/outputs
4
5
4
7
2
4
6
10
9/3
2
5/2
0
12-bit Digital-to-Analog output
Quad Timer Module (TMRA and TMRB) ports
Inter-Module Crossbar inputs/outputs
3
4
8/4
1/1
4
12/6
2/2
4
Clock inputs/outputs
JTAG / Enhanced On-Chip Emulation (EOnCE)
3 Ordering parts
3.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to nxp.com and perform a part number search for the
following device numbers: MC56F82
4 Part identification
4.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
4.2 Format
Part numbers for this device have the following format: Q 56F8 2 C F P T PP N
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
21
Terminology and guidelines
4.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Description
Values
Q
Qualification status
• MC = Fully qualified, general market flow
• PC = Prequalification
56F8
DSC family with flash memory and DSP56800/
DSP56800E/DSP56800EX core
• 56F8
2
DSC subfamily
• 2
C
F
Maximum CPU frequency (MHz)
Primary program flash memory size
• 3 = 50 MHz
• 1 = 16 KB
• 2 = 32 KB
P
Pin count
• 3 = 32
• 6 = 48
T
Temperature range (°C)
Package identifier
• V = –40 to 105
PP
• LC = 32LQFP
• FM = 32QFN
• LF = 48LQFP
N
Packaging type
• R = Tape and reel
• (Blank) = Trays
4.4 Example
This is an example part number: MC56F82316VLH
5 Terminology and guidelines
5.1 Definition: Operating requirement
An operating requirement is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
5.1.1 Example
This is an example of an operating requirement:
MC56F823xx, Rev. 4, 05/2020
22
NXP Semiconductors
Terminology and guidelines
Symbol
Description
Min.
Max.
Unit
VDD
1.0 V core supply
voltage
0.9
1.1
V
5.2 Definition: Operating behavior
Unless otherwise specified, an operating behavior is a specified value or range of values
for a technical characteristic that are guaranteed during operation if you meet the
operating requirements and any other specified conditions.
5.2.1 Example
This is an example of an operating behavior:
Symbol
Description
Min.
Max.
Unit
IWP
Digital I/O weak pullup/ 10
pulldown current
130
µA
5.3 Definition: Attribute
An attribute is a specified value or range of values for a technical characteristic that are
guaranteed, regardless of whether you meet the operating requirements.
5.3.1 Example
This is an example of an attribute:
Symbol
Description
Min.
Max.
Unit
CIN_D
Input capacitance:
digital pins
—
7
pF
5.4 Definition: Rating
A rating is a minimum or maximum value of a technical characteristic that, if exceeded,
may cause permanent chip failure:
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
23
Terminology and guidelines
• Operating ratings apply during operation of the chip.
• Handling ratings apply when the chip is not powered.
5.4.1 Example
This is an example of an operating rating:
Symbol
Description
Min.
Max.
Unit
VDD
1.0 V core supply
voltage
–0.3
1.2
V
5.5 Result of exceeding a rating
40
30
The likelihood of permanent chip failure increases rapidly as
soon as a characteristic begins to exceed one of its operating ratings.
20
10
0
Operating rating
Measured characteristic
MC56F823xx, Rev. 4, 05/2020
24
NXP Semiconductors
Terminology and guidelines
5.6 Relationship between ratings and operating requirements
Fatal range
Degraded operating range
Normal operating range
Degraded operating range
Fatal range
Expected permanent failure
- No permanent failure
- No permanent failure
- Correct operation
- No permanent failure
Expected permanent failure
- Possible decreased life
- Possible incorrect operation
- Possible decreased life
- Possible incorrect operation
–∞
∞
Operating (power on)
Fatal range
Handling range
Fatal range
Expected permanent failure
No permanent failure
Expected permanent failure
–∞
∞
Handling (power off)
5.7 Guidelines for ratings and operating requirements
Follow these guidelines for ratings and operating requirements:
• Never exceed any of the chip’s ratings.
• During normal operation, don’t exceed any of the chip’s operating requirements.
• If you must exceed an operating requirement at times other than during normal
operation (for example, during power sequencing), limit the duration as much as
possible.
5.8 Definition: Typical value
A typical value is a specified value for a technical characteristic that:
• Lies within the range of values specified by the operating behavior
• Given the typical manufacturing process, is representative of that characteristic
during operation when you meet the typical-value conditions or other specified
conditions
Typical values are provided as design guidelines and are neither tested nor guaranteed.
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
25
Terminology and guidelines
5.8.1 Example 1
This is an example of an operating behavior that includes a typical value:
Symbol
Description
Min.
Typ.
Max.
Unit
IWP
Digital I/O weak
pullup/pulldown
current
10
70
130
µA
5.8.2 Example 2
This is an example of a chart that shows typical values for various voltage and
temperature conditions:
5000
4500
4000
TJ
3500
150 °C
3000
105 °C
2500
25 °C
2000
–40 °C
1500
1000
500
0
0.90
0.95
1.00
1.05
1.10
VDD (V)
5.9 Typical value conditions
Typical values assume you meet the following conditions (or other conditions as
specified):
Symbol
Description
Ambient temperature
3.3 V supply voltage
Value
Unit
TA
25
°C
V
VDD
3.3
MC56F823xx, Rev. 4, 05/2020
26
NXP Semiconductors
Ratings
6 Ratings
6.1 Thermal handling ratings
Symbol
TSTG
Description
Min.
–55
—
Max.
150
Unit
°C
Notes
Storage temperature
Solder temperature, lead-free
1
2
TSDR
260
°C
1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
6.2 Moisture handling ratings
Symbol
Description
Min.
Max.
Unit
Notes
MSL
Moisture sensitivity level
—
3
—
1
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
6.3 ESD handling ratings
Although damage from electrostatic discharge (ESD) is much less common on these
devices than on early CMOS circuits, use normal handling precautions to avoid exposure
to static discharge. Qualification tests are performed to ensure that these devices can
withstand exposure to reasonable levels of static without suffering any permanent
damage.
All ESD testing is in conformity with AEC-Q100 Stress Test Qualification. During the
device qualification ESD stresses were performed for the human body model (HBM), the
machine model (MM), and the charge device model (CDM).
All latch-up testing is in conformity with AEC-Q100 Stress Test Qualification.
A device is defined as a failure if after exposure to ESD pulses, the device no longer
meets the device specification. Complete DC parametric and functional testing is
performed as per the applicable device specification at room temperature followed by hot
temperature, unless specified otherwise in the device specification.
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
27
Ratings
Table 4. ESD/Latch-up Protection
Characteristic1
Min
–2000
–200
–500
–100
Max
+2000
+200
+500
+100
Unit
V
ESD for Human Body Model (HBM)
ESD for Machine Model (MM)
V
ESD for Charge Device Model (CDM)
V
Latch-up current at TA= 85°C (ILAT
)
mA
1. Parameter is achieved by design characterization on a small sample size from typical devices under typical conditions
unless otherwise noted.
6.4 Voltage and current operating ratings
Absolute maximum ratings are stress ratings only, and functional operation at the
maxima is not guaranteed. Stress beyond the limits specified in Table 5 may affect device
reliability or cause permanent damage to the device.
NOTE
If the voltage difference between VDD and VDDA or VSS and
VSSA is too large, then the device can malfunction or be
permanently damaged. The restrictions are:
• At all times, it is recommended that the voltage
difference of VDD - VSS be within +/-200 mV of the
voltage difference of VDDA - VSSA, including power
ramp up and ramp down; see additional requirements in
Table 6. Failure to do this recommendation may result in a
harmful leakage current through the substrate, between the
VDD/VSS and VDDA/VSSA pad cells. This harmful
leakage current could prevent the device from operating
after power up.
• At all times, to avoid permanent damage to the part, the
voltage difference between VDD and VDDA must
absolutely be limited to 0.3 V; see Table 5.
• At all times, to avoid permanent damage to the part, the
voltage difference between VSS and VSSA must
absolutely be limited to 0.3 V; see Table 5.
Table 5. Absolute Maximum Ratings (VSS = 0 V, VSSA = 0 V)
Characteristic
Supply Voltage Range
Analog Supply Voltage Range
Symbol
VDD
Notes1
Min
-0.3
-0.3
Max
4.0
Unit
V
VDDA
4.0
V
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
28
NXP Semiconductors
General
Table 5. Absolute Maximum Ratings (VSS = 0 V, VSSA = 0 V) (continued)
Characteristic
ADC High Voltage Reference
Symbol
VREFHx
ΔVDD
ΔVSS
VIN
Notes1
Min
-0.3
-0.3
-0.3
-0.3
-0.3
-0.4
-0.3
—
Max
4.0
0.3
0.3
5.5
4.0
4.0
4.0
-5.0
20.0
25
Unit
V
Voltage difference VDD to VDDA
Voltage difference VSS to VSSA
Digital Input Voltage Range
V
V
Pin Group 1
Pin Group 2
Pin Group 4
Pin Group 3
V
RESET Input Voltage Range
VIN_RESET
VOSC
VINA
V
Oscillator Input Voltage Range
V
Analog Input Voltage Range
V
Input clamp current, per pin (VIN < VSS - 0.3 V), 2, 3
Output clamp current, per pin4
VIC
mA
mA
mA
VOC
—
Contiguous pin DC injection current—regional limit sum
of 16 contiguous pins
IICont
-25
Output Voltage Range (normal push-pull mode)
Output Voltage Range (open drain mode)
RESET Output Voltage Range
VOUT
Pin Group 1, 2
Pin Group 1
Pin Group 2
-0.3
-0.3
-0.3
4.0
5.5
4.0
V
V
V
VOUTOD
VOUTOD_RE
SET
DAC Output Voltage Range
Ambient Temperature
VOUT_DAC
Pin Group 5
V temperature
V temperature
-0.3
-40
-40
-55
4.0
105
125
150
V
TA
Tj
°C
°C
°C
Junction Temperature
Storage Temperature Range (Extended Industrial)
TSTG
1. Default Mode
• Pin Group 1: GPIO, TDI, TDO, TMS, TCK
• Pin Group 2: RESET
• Pin Group 3: ADC and Comparator Analog Inputs
• Pin Group 4: XTAL, EXTAL
• Pin Group 5: DAC analog output
2. Continuous clamp current
3. All 5 volt tolerant digital I/O pins are internally clamped to VSS through a ESD protection diode. There is no diode
connection to VDD. If VIN greater than VDIO_MIN (= VSS–0.3 V) is observed, then there is no need to provide current
limiting resistors at the pads. If this limit cannot be observed, then a current limiting resistor is required.
4. I/O is configured as push-pull mode.
7 General
7.1 General characteristics
The device is fabricated in high-density, low-power CMOS with 5 V–tolerant TTL-
compatible digital inputs, except 3.3 V for RESET . The term “5 V–tolerant” refers to the
capability of an I/O pin, built on a 3.3 V–compatible process technology, to withstand a
voltage up to 5.5 V without damaging the device.
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
29
General
5 V–tolerant I/O is desirable because many systems have a mixture of devices designed
for 3.3 V and 5 V power supplies. In such systems, a bus may carry both 3.3 V– and 5 V–
compatible I/O voltage levels . This 5 V–tolerant capability therefore offers the power
savings of 3.3 V I/O levels combined with the ability to receive 5 V levels without
damage.
Absolute maximum ratings in Table 5 are stress ratings only, and functional operation at
the maximum is not guaranteed. Stress beyond these ratings may affect device reliability
or cause permanent damage to the device.
Unless otherwise stated, all specifications within this chapter apply to the temperature
range specified in Table 5 over the following supply ranges: VSS=VSSA=0V,
VDD=VDDA=3.0V to 3.6V, CL≤50 pF, fOP=50MHz.
CAUTION
This device contains protective circuitry to guard against
damage due to high static voltage or electrical fields. However,
normal precautions are advised to avoid application of any
voltages higher than maximum-rated voltages to this high-
impedance circuit. Reliability of operation is enhanced if
unused inputs are tied to an appropriate voltage level.
7.2 AC electrical characteristics
Tests are conducted using the input levels specified in the section "Voltage and current
operating behaviors". Unless otherwise specified, propagation delays are measured from
the 50% to the 50% point, and rise and fall times are measured between the 10% and 90%
points, as shown in Figure 3.
Low
High
V
IH
90%
50%
10%
Midpoint1
Fall Time
Input Signal
V
IL
Rise Time
The midpoint is V + (V – V )/2.
IL
IH
IL
Figure 3. Input signal measurement references
Figure 4 shows the definitions of the following signal states:
• Active state, when a bus or signal is driven, and enters a low impedance state
• Tri-stated, when a bus or signal is placed in a high impedance state
• Data Valid state, when a signal level has reached VOL or VOH
• Data Invalid state, when a signal level is in transition between VOL and VOH
MC56F823xx, Rev. 4, 05/2020
30
NXP Semiconductors
General
Data1 Valid
Data1
Data2 Valid
Data2
Data3 Valid
Data3
Data
Data Invalid State
Tri-stated
Data Active
Data Active
Figure 4. Signal states
7.3 Nonswitching electrical specifications
7.3.1 Voltage and current operating requirements
This section includes information about recommended operating conditions.
NOTE
Recommended VDD ramp rate is less than 200 ms.
Table 6. Recommended Operating Conditions (VREFLx=0V, VSSA=0V, VSS=0V)
Characteristic
Symbol
VDD, VDDA
VREFHA
VREFHB
ΔVDD
ΔVSS
Notes1
Min
2.7
Typ
Max
3.6
Unit
V
Supply voltage
3.3
ADC (Cyclic) Reference Voltage High
VDDA-0.6
VDDA
V
Voltage difference VDD to VDDA
Voltage difference VSS to VSSA
Input Voltage High (digital inputs)
RESET Input Voltage High
-0.1
0
0
0.1
0.1
V
V
V
V
V
V
-0.1
VIH
Pin Group 1
Pin Group 2
0.7 x VDD
0.7 x VDD
5.5
VIH_RESET
VIL
—
VDD
Input Voltage Low (digital inputs)
Oscillator Input Voltage High
XTAL driven by an external clock source
Oscillator Input Voltage Low
Pin Groups 1, 2
Pin Group 4
0.3 x VDD
VDD + 0.3
VIHOSC
2.0
VILOSC
IOH
Pin Group 4
-0.3
0.8
V
Output Source Current High (at VOH min.)
• Programmed for low drive strength
Pin Group 1
Pin Group 1
—
—
-2
-9
mA
• Programmed for high drive strength
Output Source Current Low (at VOL max.)2, 3
• Programmed for low drive strength
IOL
Pin Groups 1, 2
Pin Groups 1, 2
—
—
2
9
mA
• Programmed for high drive strength
1. Default Mode
• Pin Group 1: GPIO, TDI, TDO, TMS, TCK
• Pin Group 2: RESET
• Pin Group 3: ADC and Comparator Analog Inputs
• Pin Group 4: XTAL, EXTAL
• Pin Group 5: DAC analog output
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
31
General
2. Total IO sink current and total IO source current are limited to 75 mA each
3. Contiguous pin DC injection current of regional limit—including sum of negative injection currents or sum of positive
injection currents of 16 contiguous pins—is 25 mA.
7.3.2 LVD and POR operating requirements
Table 7. PMC Low-Voltage Detection (LVD) and Power-On Reset (POR) Parameters
Characteristic
Symbol
POR
Min
Typ
2.0
Max
Unit
V
POR Assert Voltage1
POR Release Voltage2
LVI_2p7 Threshold Voltage
LVI_2p2 Threshold Voltage
POR
2.7
V
2.73
2.23
V
V
1. During 3.3-volt VDD power supply ramp down
2. During 3.3-volt VDD power supply ramp up (gated by LVI_2p7)
7.3.3 Voltage and current operating behaviors
The following table provides information about power supply requirements and I/O pin
characteristics.
Table 8. DC Electrical Characteristics at Recommended Operating Conditions
Characteristic
Output Voltage High
Output Voltage Low
Symbol
VOH
Notes 1
Min
VDD - 0.5
—
Typ
—
Max
—
Unit
V
Test Conditions
IOH = IOHmax
Pin Group 1
VOL
Pin Groups
1, 2
—
0.5
V
IOL = IOLmax
Digital Input Current High
IIH
Pin Group 1
Pin Group 2
—
0
+/- 2.5
µA
VIN = 2.4 V to 5.5 V
VIN = 2.4 V to VDD
pull-up enabled or
disabled
Comparator Input Current
High
IIHC
IIHOSC
IIL
Pin Group 3
Pin Group 3
—
—
0
0
+/- 2
+/- 2
µA
µA
µA
VIN = VDDA
VIN = VDDA
VIN = 0V
Oscillator Input Current
High
Digital Input Current Low
Pin Groups
1, 2
—
0
+/- 0.5
2, 3
pull-up disabled
Internal Pull-Up
Resistance
RPull-Up
RPull-Down
IILC
20
20
—
—
—
—
0
50
50
kΩ
kΩ
µA
µA
—
Internal Pull-Down
Resistance
—
Comparator Input Current
Low
Pin Group 3
Pin Group 3
+/- 2
+/- 2
VIN = 0V
VIN = 0V
Oscillator Input Current
Low
IILOSC
0
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
32
NXP Semiconductors
General
Table 8. DC Electrical Characteristics at Recommended Operating Conditions (continued)
Characteristic
Symbol
Notes 1
Min
Typ
Max
Unit
Test Conditions
DAC Output Voltage
Range
VDAC
Pin Group 5
Typically
—
Typically
VDDA -
V
RLD = 3 kΩ || CLD = 400 pF
VSSA
+
40mV
40mV
Output Current 2, 3
IOZ
Pin Groups
1, 2
—
0
+/- 1
µA
V
—
—
High Impedance State
Schmitt Trigger Input
Hysteresis
VHYS
Pin Groups 0.06 × VDD
1, 2
—
—
1. Default Mode
• Pin Group 1: GPIO, TDI, TDO, TMS, TCK
• Pin Group 2: RESET
• Pin Group 3: ADC and Comparator Analog Inputs
• Pin Group 4: XTAL, EXTAL
• Pin Group 5: DAC
2. See the following figure "IIN/IOZ vs. VIN (typical; pull-up disabled) (design simulation)" .
3. To minimize the excessive leakage ( > 1 μA) current from digital pin, input signal should NOT stay between 1.1 V and 0.9
× VDD for prolonged time.
V (volt)
Figure 5. IIN/IOZ vs. VIN (typical; pull-up disabled) (design simulation)
7.3.4 Power mode transition operating behaviors
Parameters listed are guaranteed by design.
NOTE
All address and data buses described here are internal.
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
33
General
Table 9. Reset, stop, wait, and interrupt timing
Characteristic
Symbol
Typical Min
Typical
Max
Unit
See
Figure
Minimum RESET Assertion Duration
tRA
tRDA
tIF
161
865 x TOSC + 8 x T
361.3
—
ns
ns
ns
—
—
—
RESET deassertion to First Address Fetch
Delay from Interrupt Assertion to Fetch of first
instruction (exiting Stop)
570.9
1. If the RESET pin filter is enabled by setting the RST_FLT bit in the SIM_CTRL register to 1, the minimum pulse assertion
must be greater than 21 ns. Recommended a capacitor of up to 0.1 µF on RESET.
NOTE
In Table 9, T = system clock cycle and TOSC = oscillator clock
cycle. For an operating frequency of 50MHz, T=20 ns. At 4
MHz (used coming out of reset and stop modes), T=250 ns.
Table 10. Power mode transition behavior
Symbol
Description
Min
Max
Unit Notes1
TPOR
After a POR event, the amount of delay from when VDD reaches
2.7 V to when the first instruction executes (over the operating
temperature range).
199
225
µs
STOP mode to RUN mode
LPS mode to LPRUN mode
VLPS mode to VLPRUN mode
WAIT mode to RUN mode
6.79
240.9
1424
0.570
237.2
1413
7.27.31
551
µs
µs
µs
µs
µs
µs
2
3
4
5
3
4
1459
0.620
554
LPWAIT mode to LPRUN mode
VLPWAIT mode to VLPRUN mode
1500
1. Wakeup times are measured from GPIO toggle for wakeup till GPIO toggle at the wakeup interrupt subroutine from
respective stop/wait mode.
2. Clock configuration: CPU clock=4 MHz. System clock source is 8 MHz IRC in normal mode.
3. CPU clock = 200 KHz and 8 MHz IRC on standby. Exit by an interrupt on PORTC GPIO.
4. Using 64 KHz external clock; CPU Clock = 32KHz. Exit by an interrupt on PortC GPIO.
5. Clock configuration: CPU and system clocks= 50 MHz. Bus Clock = 50 MHz. .Exit by interrupt on PORTC GPIO
7.3.5 Power consumption operating behaviors
Table 11. Current Consumption (mA)
Mode
Maximum
Frequency
Conditions
Typical at
3.3 V, 25°C
Maximum
at 3.6 V,
105°C
1
1
IDD
IDDA IDD
IDDA
RUN
50 MHz
• 50 MHz Core and Peripheral clock
27.6
9.9
43.5 13.2
• Regulators are in full regulation
• Relaxation Oscillator on
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
34
NXP Semiconductors
General
Table 11. Current Consumption (mA) (continued)
Mode
Maximum
Frequency
Conditions
Typical at
3.3 V, 25°C
Maximum
at 3.6 V,
105°C
1
1
IDD
IDDA IDD
IDDA
• PLL powered on
• Continuous MAC instructions with fetches from Program
Flash
• All peripheral modules enabled. TMRs and SCIs using 1X
peripheral clock
• ADC/DAC (only one 12-bit DAC and all 6-bit DACs)
powered on and clocked
• Comparator powered on
WAIT
50 MHz
• 50 MHz Core and Peripheral clock
• Regulators are in full regulation
• Relaxation Oscillator on
24.0
—
41.3
—
• PLL powered on
• Processor Core in WAIT state
• All Peripheral modules enabled.
• TMRs and SCIs using 1X Clock
• ADC/DAC (single 12-bit DAC, all 6-bit DACs), Comparator
powered off
STOP
4 MHz
2 MHz
• 4 MHz Device Clock
• Regulators are in full regulation
• Relaxation Oscillator on
6.3
—
19.4
11.1
—
• PLL powered off
• Processor Core in STOP state
• All peripheral module and core clocks are off
• ADC/DAC/Comparator powered off
LPRUN
(LsRUN)
• 200 kHz Device Clock from Relaxation Oscillator's (ROSC) 2.8
low speed clock
3.1
4.0
• ROSC in standby mode
• Regulators are in standby
• PLL disabled
• Repeat NOP instructions
• All peripheral modules enabled, except cyclic ADCs. One
12-bit DAC and all 6-bit DACs enabled.
• Simple loop with running from platform instruction buffer
LPWAIT
(LsWAIT)
2 MHz
• 200 kHz Device Clock from Relaxation Oscillator's (ROSC) 2.7
low speed clock
3.1
11.1
4.0
• ROSC in standby mode
• Regulators are in standby
• PLL disabled
• All peripheral modules enabled, except cyclic ADCs. One
12-bit DAC and all 6-bit DACs enabled.1
• Processor core in wait mode
LPSTOP
(LsSTOP)
2 MHz
• 200 kHz Device Clock from Relaxation Oscillator's (ROSC) 1.2
low speed clock
—
9.1
—
• ROSC in standby mode
• Regulators are in standby
• PLL disabled
• Only PITs and COP enabled; other peripheral modules
disabled and clocks gated off1
• Processor core in stop mode
VLPRUN
200 kHz
• 32 kHz Device Clock
Table continues on the next page...
0.7
—
7.5
—
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
35
General
Table 11. Current Consumption (mA) (continued)
Mode
Maximum
Frequency
Conditions
Typical at
3.3 V, 25°C
Maximum
at 3.6 V,
105°C
1
1
IDD
IDDA IDD
IDDA
• Clocked by a 32 kHz external clock source
• Oscillator in power down
• All ROSCs disabled
• Large regulator is in standby
• Small regulator is disabled
• PLL disabled
• Repeat NOP instructions
• All peripheral modules, except COP and EWM, disabled
and clocks gated off
• Simple loop running from platform instruction buffer
VLPWAIT
200 kHz
• 32 kHz Device Clock
0.7
—
7.5
—
• Clocked by a 32 kHz external clock source
• Oscillator in power down
• All ROSCs disabled
• Large regulator is in standby
• Small regulator is disabled
• PLL disabled
• All peripheral modules, except COP, disabled and clocks
gated off
• Processor core in wait mode
VLPSTOP
200 kHz
• 32 kHz Device Clock
0.7
—
7.5
—
• Clocked by a 32 kHz external clock source
• Oscillator in power down
• All ROSCs disabled
• Large regulator is in standby.
• Small regulator is disabled.
• PLL disabled
• All peripheral modules, except COP, disabled and clocks
gated off
• Processor core in stop mode
1. No output switching, all ports configured as inputs, all inputs low, no DC loads.
7.3.6 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
1. Go to www.nxp.com.
2. Perform a keyword search for “EMC design.”
MC56F823xx, Rev. 4, 05/2020
36
NXP Semiconductors
General
7.3.7 Capacitance attributes
Table 12. Capacitance attributes
Description
Symbol
CIN
Min.
—
Typ.
10
Max.
—
Unit
Input capacitance
Output capacitance
pF
pF
COUT
—
10
—
7.4 Switching specifications
7.4.1 Device clock specifications
Table 13. Device clock specifications
Symbol
Description
Min.
Max.
Unit
Notes
Normal run mode
fSYSCLK
Device (system and core) clock frequency
• using relaxation oscillator
0.001
0
50
50
50
MHz
MHz
• using external clock source
fBUS
Bus clock
—
7.4.2 General switching timing
Table 14. Switching timing
Symbol Description
GPIO pin interrupt pulse width1
Min
Max
Unit
Notes
1.5
IP Bus
Clock
Cycles
2
Synchronous path
Port rise and fall time (high drive strength), slew disabled,
2.7V ≤ VDD ≤ 3.6V
5.5
1.5
8.2
3.2
15.1
6.8
ns
ns
ns
ns
3
4
3
4
Port rise and fall time (high drive strength), slew enabled,
2.7V ≤ VDD ≤ 3.6V
Port rise and fall time (low drive strength), slew disabled, 2.7V
≤ VDD ≤ 3.6V
17.8
9.2
Port rise and fall time (low drive strength), slew enabled, 2.7V
≤ VDD ≤ 3.6V
1. Applies to a pin only when it is configured as GPIO and configured to cause an interrupt by appropriately programming
GPIOn_IPOLR and GPIOn_IENR.
2. The greater synchronous and asynchronous timing must be met.
3. 75 pF load
4. 15 pF load
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
37
General
7.5 Thermal specifications
7.5.1 Thermal operating requirements
Table 15. Thermal operating requirements
Symbol
TJ
Description
Min
–40
–40
Max
125
105
Unit
°C
Die junction temperature
Ambient temperature
TA
°C
7.5.2 Thermal attributes
This section provides information about operating temperature range, power dissipation,
and package thermal resistance. Power dissipation on I/O pins is usually small compared
to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-
determined rather than being controlled by the MCU design. To account for PI/O in power
calculations, determine the difference between actual pin voltage and VSS or VDD and
multiply by the pin current for each I/O pin. Except in cases of unusually high pin current
(heavy loads), the difference between pin voltage and VSS or VDD is very small.
See Thermal design considerations for more detail on thermal design considerations.
Board type
Symbol
Description
32 QFN
32 LQFP
48 LQFP
Unit
Notes
Single-layer
(1s)
RθJA
Thermal
96
33
80
27
83
70
°C/W
,
resistance,
junction to
ambient
(natural
convection)
Four-layer
(2s2p)
RθJA
Thermal
55
70
49
46
57
39
°C/W
°C/W
°C/W
1,
resistance,
junction to
ambient
(natural
convection)
Single-layer
(1s)
RθJMA
Thermal
1,2
1,2
resistance,
junction to
ambient (200
ft./min. air
speed)
Four-layer
(2s2p)
RθJMA
Thermal
resistance,
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
38
NXP Semiconductors
Peripheral operating requirements and behaviors
Board type
Symbol
Description
32 QFN
32 LQFP
48 LQFP
Unit
Notes
junction to
ambient (200
ft./min. air
speed)
—
—
—
RθJB
Thermal
resistance,
junction to
board
12
31
23
°C/W
RθJC
Thermal
resistance,
junction to
case
1.8
6
22
5
17
3
°C/W
°C/W
ΨJT
Thermal
characterizati
on parameter,
junction to
package top
outside
center
(natural
convection)
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental Conditions
—Forced Convection (Moving Air) with the board horizontal.
8 Peripheral operating requirements and behaviors
8.1 Core modules
8.1.1 JTAG timing
Table 16. JTAG timing
Characteristic
Symbol
Min
Max
Unit
See
Figure
TCK frequency of operation
TCK clock pulse width
fOP
tPW
tDS
tDH
tDV
tTS
DC
50
5
SYS_CLK/ 8
MHz
ns
Figure 6
Figure 6
Figure 7
Figure 7
Figure 7
Figure 7
—
—
—
30
30
TMS, TDI data set-up time
TMS, TDI data hold time
TCK low to TDO data valid
TCK low to TDO tri-state
ns
5
ns
—
—
ns
ns
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
39
System modules
1/f
OP
t
t
PW
PW
V
IH
V
V
V
M
M
TCK
(Input)
IL
V
= V + (V – V )/2
IL IH IL
M
Figure 6. Test clock input timing diagram
TCK
(Input)
t
t
DH
DS
TDI
TMS
Input Data Valid
(Input)
t
DV
TDO
(Output)
Output Data Valid
t
TS
TDO
(Output)
Figure 7. Test access port timing diagram
8.2 System modules
8.2.1 Voltage regulator specifications
The voltage regulator supplies approximately 1.2 V to the device's core logic. For proper
operations, the voltage regulator requires an external 2.2 µF capacitor on each VCAP pin.
Ceramic and tantalum capacitors tend to provide better performance tolerances. The
output voltage can be measured directly on the VCAP pin. The specifications for this
regulator are shown in Table 17.
Table 17. Regulator 1.2 V parameters
Characteristic
Output Voltage 1
Short Circuit Current 2
Symbol
VCAP
ISS
Min
—
Typ
1.22
600
—
Max
—
Unit
V
—
—
mA
Short Circuit Tolerance (VCAP shorted to ground)
TRSC
—
30
minute
1. Value is after trim
2. Guaranteed by design
MC56F823xx, Rev. 4, 05/2020
40
NXP Semiconductors
System modules
Table 18. Bandgap electrical specifications
Characteristic
Symbol
Min
Typ
Max
Unit
Reference Voltage (after trim)
VREF
—
1.211
—
V
1. Typical value is trimmed at 25℃. There could be 50 mV variation due to temperature change.
8.3 Clock modules
8.3.1 External clock operation timing
Parameters listed are guaranteed by design.
Table 19. External clock operation timing requirements
Characteristic
Symbol
fosc
Min
Typ
Max
Unit
MHz
ns
Frequency of operation (external clock driver)1
Clock pulse width2
—
—
50
tPW
8
External clock input rise time3
External clock input fall time4
trise
—
—
—
—
—
—
1
ns
tfall
1
—
ns
Input high voltage overdrive by an external clock
Input low voltage overdrive by an external clock
Vih
0.85×VDD
—
V
Vil
0.3×VDD
V
1. See the "External clock timing" figure for details on using the recommended connection of an external clock driver.
2. The chip may not function if the high or low pulse width is smaller than 6.25 ns.
3. External clock input rise time is measured from 10% to 90%.
4. External clock input fall time is measured from 90% to 10%.
V
IH
External
Clock
90%
50%
10%
90%
50%
10%
t
V
IL
t
fall
rise
t
t
PW
PW
Note: The midpoint is V + (V – V )/2.
IL
IH
IL
Figure 8. External clock timing
8.3.2 Phase-Locked Loop timing
Table 20. Phase-Locked Loop timing
Characteristic
PLL input reference frequency1
PLL output frequency2
Symbol
fref
Min
8
Typ
8
Max
Unit
MHz
MHz
16
fop
200
—
400
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
41
System modules
Table 20. Phase-Locked Loop timing (continued)
Characteristic
Symbol
tplls
Min
35.5
40
Typ
Max
73.2
60
Unit
µs
PLL lock time3
Allowed Duty Cycle of input reference
tdc
50
%
1. An externally supplied reference clock should be as free as possible from any phase jitter for the PLL to work correctly.
The PLL is optimized for 8 MHz input.
2. The frequency of the core system clock cannot exceed 50 MHz.
3. This is the time required after the PLL is enabled to ensure reliable operation.
8.3.3 External crystal or resonator requirement
Table 21. Crystal or resonator requirement
Characteristic
Symbol
Min
Typ
Max
Unit
Frequency of operation
fXOSC
4
8
16
MHz
8.3.4 RC Oscillator Timing
Table 22. RC Oscillator Electrical Specifications
Characteristic
Symbol
Min
Typ
Max
Unit
8 MHz Output Frequency1
Run Mode
0°C to 105°C
7.84
7.76
—
8
8
8.16
8.24
—
MHz
MHz
kHz
-40°C to 105°C
-40°C to 105°C
Standby Mode (IRC
trimmed @ 8 MHz)
405
8 MHz Frequency Variation over 25°C
RUN Mode
0°C to 105°C
1.5
1.5
2
3
%
%
-40°C to 105°C
200 kHz Output Frequency1
RUN Mode
-40°C to 105°C
194
200
206
%
200 kHz Output Frequency Variation over 25°C
RUN Mode
0°C to 85°C
1.5
1.5
0.12
10
2
3
%
%
-40°C to 105°C
8 MHz output2
200 kHz output3
Stabilization Time
Output Duty Cycle
tstab
µs
µs
%
48
50
52
1. Frequency after factory trim
2. Standby to run mode transition
3. Power down to run mode transition
MC56F823xx, Rev. 4, 05/2020
42
NXP Semiconductors
System modules
Figure 9. RC Oscillator Temperature Variation (Typical) After Trim (Preliminary)
8.4 Memories and memory interfaces
8.4.1 Flash electrical specifications
This section describes the electrical characteristics of the flash memory module.
8.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 23. NVM program/erase timing specifications
Symbol Description
Min.
Typ.
Max.
Unit
Notes
thvpgm4
Longword Program high-voltage time
—
7.5
18
μs
—
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
43
System modules
Table 23. NVM program/erase timing specifications (continued)
Symbol Description
Min.
—
Typ.
13
Max.
113
Unit
ms
Notes
thversscr Sector Erase high-voltage time
1
1
thversall
Erase All high-voltage time
—
52
452
ms
1. Maximum time based on expectations at cycling end-of-life.
8.4.1.2 Flash timing specifications — commands
Table 24. Flash command timing specifications
Symbol Description
Min.
—
—
—
—
—
—
—
—
—
—
Typ.
—
Max.
60
Unit
μs
Notes
trd1sec1k Read 1s Section execution time (flash sector)
1
1
tpgmchk
trdrsrc
tpgm4
Program Check execution time
Read Resource execution time
Program Longword execution time
Erase Flash Sector execution time
Read 1s All Blocks execution time
Read Once execution time
—
45
μs
—
30
μs
1
65
14
—
145
114
0.9
25
μs
—
2
tersscr
trd1all
ms
ms
μs
1
trdonce
—
1
tpgmonce Program Once execution time
65
70
—
—
μs
—
2
tersall
Erase All Blocks execution time
575
30
ms
μs
tvfykey
Verify Backdoor Access Key execution time
1
1. Assumes 25 MHz flash clock frequency.
2. Maximum times for erase parameters based on expectations at cycling end-of-life.
8.4.1.3 Flash high voltage current behaviors
Table 25. Flash high voltage current behaviors
Symbol
Description
Min.
Typ.
Max.
Unit
IDD_PGM
Average current adder during high voltage
flash programming operation
—
2.5
6.0
mA
IDD_ERS
Average current adder during high voltage
flash erase operation
—
1.5
4.0
mA
8.4.1.4 Reliability specifications
Table 26. NVM reliability specifications
Symbol Description
Min.
Program Flash
Typ.1
Max.
Unit
Notes
tnvmretp10k Data retention after up to 10 K cycles
tnvmretp1k Data retention after up to 1 K cycles
nnvmcycp Cycling endurance
5
50
—
—
—
years
years
cycles
—
—
2
20
100
50 K
10 K
MC56F823xx, Rev. 4, 05/2020
44
NXP Semiconductors
System modules
1. Typical data retention values are based on measured response accelerated at high temperature and derated to a constant
25 °C use profile. Engineering Bulletin EB618 does not apply to this technology. Typical endurance defined in Engineering
Bulletin EB619.
2. Cycling endurance represents number of program/erase cycles at –40 °C ≤ Tj ≤ 125 °C.
8.5 Analog
8.5.1 12-bit Cyclic Analog-to-Digital Converter (ADC) Parameters
Table 27. 12-bit ADC Electrical Specifications
Characteristic
Symbol
Min
Typ
Max
Unit
Recommended Operating Conditions
Supply Voltage1
VDDA
Vrefhx
fADCCLK
RAD
3
3.3
3.6
VDDA
10
V
V
VREFH (in external reference mode)
ADC Conversion Clock2
Conversion Range3
VDDA-0.6
0.1
MHz
V
VREFH – VREFL
VREFH
Fully Differential
– (VREFH – VREFL
VREFL
)
Single Ended/Unipolar
Input Voltage Range (per input)4
External Reference
VADIN
V
VREFL
0
VREFH
VDDA
Internal Reference
Timing and Power
Conversion Time5
tADC
8
ADC Clock
Cycles
ADC Power-Up Time (from adc_pdn)
ADC RUN Current (per ADC block)
tADPU
13
ADC Clock
Cycles
IADRUN
1.8
0.1
mA
µA
ADC Powerdown Current (adc_pdn
enabled)
IADPWRDWN
VREFH Current (in external mode)
Accuracy (DC or Absolute)
Integral non-Linearity6
Differential non-Linearity6
Monotonicity
IVREFH
190
225
µA
INL
+/- 1.5
+/- 0.5
+/- 2.2
+/- 0.8
LSB7
LSB7
DNL
GUARANTEED
Offset8
VOFFSET
mV
+/- 8
Fully Differential
+/- 12
Single Ended/Unipolar
Gain Error
EGAIN
0.996 to1.004 0.990 to 1.010
AC Specifications9
Signal to Noise Ratio
Total Harmonic Distortion
SNR
THD
66
75
dB
dB
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
45
System modules
Table 27. 12-bit ADC Electrical Specifications (continued)
Characteristic
Symbol
SFDR
Min
Typ
77
Max
Unit
dB
Spurious Free Dynamic Range
Signal to Noise plus Distortion
Effective Number of Bits
Gain = 1x (Fully Differential/Unipolar)
Gain = 2x (Fully Differential/Unipolar)
Gain = 4x (Fully Differential/Unipolar)
Gain = 1x (Single Ended)
Gain = 2x (Single Ended)
Gain = 4x (Single Ended)
Variation across channels10
ADC Inputs
SINAD
ENOB
66
dB
—
bits
10.6
—
10.3
10.6
10.4
10.2
0.1
Input Leakage Current
IIN
1
nA
mV/°C
V
Temperature sensor slope
Temperature sensor voltage at 25 °C
Disturbance
TSLOPE
VTEMP25
1.3
0.82
Input Injection Current 11
Channel to Channel Crosstalk12
Memory Crosstalk13
IINJ
+/-3
mA
dB
dB
pF
ISOXTLK
MEMXTLK
CADI
-82
-71
Input Capacitance
4.8
Sampling Capacitor
1. The ADC functions up to VDDA = 2.7 V. When VDDA is below 3.0 V, ADC specifications are not guaranteed
2. ADC clock duty cycle is 45% ~ 55%
3. Conversion range is defined for x1 gain setting. For x2 and x4 the range is 1/2 and 1/4, respectively.
4. In unipolar mode, positive input must be ensured to be always greater than negative input.
5. First conversion takes 10 clock cycles.
6. INL/DNL is measured from VIN = VREFL to VIN = VREFH using Histogram method at x1 gain setting
7. Least Significant Bit = 0.806 mV at 3.3 V VDDA, x1 gain Setting
8. Offset measured at 2048 code
9. Measured converting a 1 kHz input full scale sine wave
10. When code runs from internal RAM
11. The current that can be injected into or sourced from an unselected ADC input without affecting the performance of the
ADC
12. Any off-channel with 50 kHz full-scale input to the channel being sampled with DC input (isolation crosstalk)
13. From a previously sampled channel with 50 kHz full-scale input to the channel being sampled with DC input (memory
crosstalk).
8.5.1.1 Equivalent circuit for ADC inputs
The following figure shows the ADC input circuit during sample and hold. S1 and S2 are
always opened/closed at non-overlapping phases, and both S1 and S2 are dependent on
the ADC clock frequency. The following equation gives equivalent input impedance
when the input is selected.
MC56F823xx, Rev. 4, 05/2020
46
NXP Semiconductors
System modules
1
100 ohm
+
ohm
50
+
-12
(ADC ClockRate) x 4.8x10
C1
Channel Mux
equivalent resistance
100Ohms
S1
50 ESD
Resistor
Analog Input
C1
C1
S1
S1
S/H
1
2
S1
S2
S2
(VREFHx - VREFLx ) / 2
C1
1. Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling =
1.8pF
2. Parasitic capacitance due to the chip bond pad, ESD protection devices and signal
routing = 2.04pF
3. S1 and S2 switch phases are non-overlapping and depend on the ADC clock
frequency
S1
S2
Figure 10. Equivalent circuit for A/D loading
8.5.2 12-bit Digital-to-Analog Converter (DAC) parameters
Table 28. DAC parameters
Parameter
Conditions/Comments
Symbol
Min
Typ
Max
Unit
DC Specifications
Resolution
Settling time1
12
—
12
1
12
bits
µs
At output load
RLD = 3 kΩ
CLD = 400 pF
Power-up time
Time from release of PWRDWN
signal until DACOUT signal is valid
tDAPU
—
—
—
11
µs
Accuracy
Range of input digital words: INL
Integral non-linearity2
+/- 3
+/- 4
LSB3
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
47
System modules
Parameter
Table 28. DAC parameters (continued)
Conditions/Comments
Symbol
Min
Typ
Max
Unit
410 to 3891 ($19A - $F33)
5% to 95% of full range
Range of input digital words:
410 to 3891 ($19A - $F33)
5% to 95% of full range
Differential non-
linearity2
DNL
—
+/- 0.8
+/- 0.9
LSB3
Monotonicity
Offset error2
> 6 sigma monotonicity,
< 3.4 ppm non-monotonicity
Range of input digital words:
410 to 3891 ($19A - $F33)
5% to 95% of full range
guaranteed
+/- 25
—
VOFFSET
—
—
+ /- 43
+/- 1.5
mV
Gain error2
Range of input digital words: 410 to
3891 ($19A - $F33) 5% to 95% of
full range
EGAIN
+/- 0.5
—
%
V
DAC Output
Output voltage range Within 40 mV of either VSSA or VDDA
VOUT
VSSA
0.04 V
+
VDDA - 0.04
V
AC Specifications
SNR
Signal-to-noise ratio
—
—
85
—
—
dB
dB
Spurious free dynamic
range
SFDR
-72
Effective number of bits
ENOB
—
11
—
bits
1. Settling time is swing range from VSSA to VDDA
2. No guaranteed specification within 5% of VDDA or VSSA
3. LSB = 0.806 mV
8.5.3 CMP and 6-bit DAC electrical specifications
Table 29. Comparator and 6-bit DAC electrical specifications
Symbol
VDD
Description
Min.
2.7
—
Typ.
—
Max.
3.6
—
Unit
V
Supply voltage
IDDHS
IDDLS
VAIN
Supply current, High-speed mode (EN=1, PMODE=1)
Supply current, low-speed mode (EN=1, PMODE=0)
Analog input voltage
300
36
μA
μA
V
—
—
VSS
—
—
VDD
20
VAIO
Analog input offset voltage
Analog comparator hysteresis
• CR0[HYSTCTR] = 001
—
mV
VH
—
—
—
—
5
13
48
mV
mV
mV
mV
• CR0[HYSTCTR] = 01
25
55
80
• CR0[HYSTCTR] = 102
105
148
• CR0[HYSTCTR] = 112
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
48
NXP Semiconductors
System modules
Table 29. Comparator and 6-bit DAC electrical specifications (continued)
Symbol
VCMPOh
VCMPOl
tDHS
Description
Output high
Output low
Min.
VDD – 0.5
—
Typ.
—
Max.
—
Unit
V
—
0.5
50
V
Propagation delay, high-speed mode (EN=1,
PMODE=1)
—
25
ns
tDLS
Propagation delay, low-speed mode (EN=1,
PMODE=0)3
—
60
200
ns
Analog comparator initialization delay4
—
—
40
7
—
—
μs
μA
V
IDAC6b
6-bit DAC current adder (enabled)
6-bit DAC reference inputs, Vin1 and Vin2
VDDA
—
VDD
There are two reference input options selectable (via
VRSEL control bit). The reference options must fall
within this range.
INL
6-bit DAC integral non-linearity
6-bit DAC differential non-linearity
–0.5
–0.3
—
—
0.5
0.3
LSB5
LSB
DNL
1. Measured with input voltage range limited to 0 to VDD
2. Measured with input voltage range limited to 0.7≤Vin≤VDD-0.8
3. Input voltage range: 0.1VDD≤Vin≤0.9VDD, step = 100mV, across all temperature. Does not include PCB and PAD delay.
4. Comparator initialization delay is defined as the time between software writes to change control inputs (Writes to DACEN,
VRSEL, PSEL, MSEL, VOSEL) and the comparator output settling to a stable level.
5. 1 LSB = Vreference/64
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
49
System modules
0.08
0.07
0.06
0.05
0.04
0.03
HYSTCTR
Setting
00
01
10
11
0.02
0.01
0
0.1
0.4
0.7
1
1.3
1.6
1.9
2.2
2.5
2.8
3.1
Vin level (V)
Figure 11. Typical hysteresis vs. Vin level (VDD = 3.3 V, PMODE = 0)
MC56F823xx, Rev. 4, 05/2020
50
NXP Semiconductors
Timer
0.18
0.16
0.14
0.12
HYSTCTR
Setting
0.1
00
01
10
11
0.08
0.06
0.04
0.02
0
0.1
0.4
0.7
1
1.3
1.6
1.9
2.2
2.5
2.8
3.1
Vin level (V)
Figure 12. Typical hysteresis vs. Vin level (VDD = 3.3 V, PMODE = 1)
8.6 Timer
8.6.1 Quad Timer timing
Parameters listed are guaranteed by design.
Table 30. Timer timing
Characteristic
Timer input period
Symbol
PIN
Min1
2T + 10
1T + 5
2T-2
Max
—
Unit
ns
See Figure
Figure 13
Figure 13
Figure 13
Figure 13
Timer input high/low period
Timer output period
PINHL
POUT
—
ns
—
ns
Timer output high/low period
POUTHL
1T-2
—
ns
1. T = clock cycle. For 50 MHz operation, T = 20 ns.
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
51
Timer
Timer Inputs
P
P
INHL
INHL
P
IN
Timer Outputs
P
P
OUTHL
OUTHL
P
OUT
Figure 13. Timer timing
8.7 Communication interfaces
8.7.1 Queued Serial Peripheral Interface (SPI) timing
Parameters listed are guaranteed by design.
Table 31. SPI timing
Characteristic
Cycle time
Master
Symbol
Min
Max
Unit
See Figure
Figure 14
Figure 15
Figure 16
Figure 17
Figure 17
tC
60
60
—
—
ns
ns
Slave
Enable lead time
Master
tELD
tELG
tCH
—
—
—
ns
ns
20
Slave
Enable lag time
Master
Figure 17
—
—
—
ns
ns
20
Slave
Clock (SCK) high time
Master
Figure 14
Figure 15
Figure 16
Figure 17
Figure 17
—
—
ns
ns
Slave
Clock (SCK) low time
tCL
28
28
—
—
ns
ns
Master
Slave
Data set-up time required for inputs
Master
tDS
Figure 14
Figure 15
20
—
ns
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
52
NXP Semiconductors
Timer
Table 31. SPI timing (continued)
Characteristic
Symbol
Min
Max
Unit
See Figure
Slave
1
—
ns
Figure 16
Figure 17
Figure 14
Data hold time required for inputs
tDH
1
3
—
—
ns
ns
Master
Slave
Figure 15
Figure 16
Figure 17
Figure 17
Access time (time to data active
from high-impedance state)
tA
5
5
—
—
ns
ns
Slave
Disable time (hold time to high-
impedance state)
tD
Figure 17
Slave
Data valid for outputs
Master
tDV
Figure 14
Figure 15
Figure 16
Figure 17
Figure 14
Figure 15
Figure 16
Figure 17
Figure 14
Figure 15
Figure 16
Figure 17
Figure 14
Figure 15
Figure 16
Figure 17
—
—
ns
ns
Slave (after enable edge)
Data invalid
Master
tDI
tR
tF
0
0
—
—
ns
ns
Slave
Rise time
Master
Slave
—
—
1
1
ns
ns
Fall time
Master
Slave
—
—
1
1
ns
ns
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
53
Timer
SS
(Input)
SS is held high on master
t
C
t
R
t
F
t
CL
SCLK (CPOL = 0)
(Output)
t
CH
t
F
t
R
t
CL
SCLK (CPOL = 1)
(Output)
t
t
DH
CH
t
DS
MISO
(Input)
MSB in
t
Bits 14–1
LSB in
t (ref)
DI
t
DI
DV
MOSI
(Output)
Master MSB out
Bits 14–1
Master LSB out
t
t
R
F
Figure 14. SPI master timing (CPHA = 0)
SS
(Input)
SS is held High on master
t
C
t
F
t
R
t
CL
SCLK (CPOL = 0)
(Output)
t
CH
t
F
t
CL
SCLK (CPOL = 1)
(Output)
t
CH
t
DS
t
R
t
DH
MISO
(Input)
MSB in
t
Bits 14–1
LSB in
t
(ref)
DI
t
DV
t (ref)
DV
DI
MOSI
(Output)
Master MSB out
Bits 14– 1
Master LSB out
t
t
R
F
Figure 15. SPI master timing (CPHA = 1)
MC56F823xx, Rev. 4, 05/2020
54
NXP Semiconductors
Timer
SS
(Input)
t
C
t
F
t
ELG
t
CL
t
R
SCLK (CPOL = 0)
(Input)
t
CH
t
ELD
t
CL
SCLK (CPOL = 1)
(Input)
t
CH
t
F
t
t
A
R
t
D
MISO
(Output)
Slave MSB out
Bits 14–1
Slave LSB out
t
t
DS
DV
t
t
DI
DI
t
DH
MOSI
(Input)
MSB in
Bits 14–1
LSB in
Figure 16. SPI slave timing (CPHA = 0)
SS
(Input)
t
F
t
C
t
R
t
CL
SCLK (CPOL = 0)
(Input)
t
CH
t
ELG
t
ELD
t
CL
SCLK (CPOL = 1)
(Input)
t
t
DV
CH
t
R
t
t
D
t
A
F
MISO
(Output)
Slave MSB out
Bits 14–1
Slave LSB out
t
t
DV
DS
t
DI
t
DH
MOSI
(Input)
MSB in
Bits 14–1
LSB in
Figure 17. SPI slave timing (CPHA = 1)
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
55
Timer
8.7.2 Queued Serial Communication Interface (SCI) timing
Parameters listed are guaranteed by design.
Table 32. SCI timing
Characteristic
Baud rate1
Symbol
BR
Min
—
Max
Unit
Mbit/s
μs
See Figure
—
(fMAX/16)
1.04/BR
1.04/BR
RXD pulse width
TXD pulse width
RXDPW
TXDPW
0.965/BR
0.965/BR
Figure 18
Figure 19
μs
LIN Slave Mode
Deviation of slave node clock from nominal FTOL_UNSYNCH
clock rate before synchronization
-14
14
2
%
%
—
—
Deviation of slave node clock relative to
the master node clock after
synchronization
FTOL_SYNCH
-2
Minimum break character length
TBREAK
13
11
—
—
Master
node bit
periods
—
—
Slave node
bit periods
1. fMAX is the frequency of operation of the SCI clock in MHz, which can be selected as the bus clock (max.)50 MHz.
RXD
SCI receive
data pin
RXD
PW
(Input)
Figure 18. RXD pulse width
TXD
SCI transmit
data pin
TXD
PW
(output)
Figure 19. TXD pulse width
8.7.3 Inter-Integrated Circuit Interface (I2C) timing
Table 33. I 2C timing
Characteristic
Symbol
Standard Mode
Minimum Maximum
100
Fast Mode
Unit
Minimum
Maximum
400
SCL Clock Frequency
fSCL
0
0
kHz
µs
Hold time (repeated) START condition.
After this period, the first clock pulse is
generated.
tHD; STA
4
—
0.6
—
LOW period of the SCL clock
tLOW
4.7
—
1.3
—
µs
Table continues on the next page...
MC56F823xx, Rev. 4, 05/2020
56
NXP Semiconductors
Design Considerations
Table 33. I 2C timing (continued)
Characteristic
Symbol
Standard Mode
Minimum Maximum
Fast Mode
Unit
Minimum
0.6
Maximum
HIGH period of the SCL clock
tHIGH
4
—
—
—
µs
µs
Set-up time for a repeated START
condition
tSU; STA
4.7
—
0.6
Data hold time for I2C bus devices
tHD; DAT
tSU; DAT
tr
01
2504
—
3.452
—
03
1002, 5
0.91
—
µs
ns
ns
Data set-up time
5,
Rise time of SDA and SCL signals
1000
20 +0.1Cb
300
6
5,
Fall time of SDA and SCL signals
Set-up time for STOP condition
tf
—
300
20 +0.1Cb
300
ns
6
tSU; STO
tBUF
4
—
—
0.6
1.3
—
—
µs
µs
Bus free time between STOP and
START condition
4.7
Pulse width of spikes that must be
suppressed by the input filter
tSP
N/A
N/A
0
50
ns
1. The master mode I2C deasserts ACK of an address byte simultaneously with the falling edge of SCL. If no slaves
acknowledge this address byte, then a negative hold time can result, depending on the edge rates of the SDA and SCL
lines.
2. The maximum tHD; DAT must be met only if the device does not stretch the LOW period (tLOW) of the SCL signal.
3. Input signal Slew = 10 ns and Output Load = 50 pF.
4. Set-up time in slave-transmitter mode is 1 IP Bus clock period, if the TX FIFO is empty.
5. A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement tSU; DAT ≥ 250 ns must
then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such a
device does stretch the LOW period of the SCL signal, then it must output the next data bit to the SDA line trmax + tSU; DAT
= 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification) before the SCL line is released.
6. Cb = total capacitance of the one bus line in pF.
SDA
tSU; DAT
tf
tr
tBUF
tf
tr
tHD; STA
tSP
tLOW
SCL
tSU; STA
tSU; STO
HD; STA
S
SR
P
S
tHD; DAT
tHIGH
Figure 20. Timing definition for fast and standard mode devices on the I2C bus
9 Design Considerations
9.1 Thermal design considerations
An estimate of the chip junction temperature (TJ) can be obtained from the equation:
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
57
Design Considerations
TJ = TA + (RΘJA × PD)
where
TA = Ambient temperature for the package (°C)
RΘJA = Junction-to-ambient thermal resistance (°C/W)
PD = Power dissipation in the package (W).
The junction-to-ambient thermal resistance is an industry-standard value that provides a
quick and easy estimation of thermal performance. Unfortunately, there are two values in
common usage: the value determined on a single-layer board and the value obtained on a
board with two planes. For packages such as the PBGA, these values can be different by
a factor of two. Which TJ value is closer to the application depends on the power
dissipated by other components on the board.
• The TJ value obtained on a single layer board is appropriate for a tightly packed
printed circuit board.
• The TJ value obtained on a board with the internal planes is usually appropriate if the
board has low-power dissipation and if the components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-
case thermal resistance and a case-to-ambient thermal resistance:
RΘJA = RΘJC + RΘCA
where
RΘJA = Package junction-to-ambient thermal resistance (°C/W)
RΘJC = Package junction-to-case thermal resistance (°C/W)
RΘCA = Package case-to-ambient thermal resistance (°C/W).
RΘJC is device related and cannot be adjusted. You control the thermal environment to
change the case to ambient thermal resistance, RΘCA. For instance, you can change the
size of the heat sink, the air flow around the device, the interface material, the mounting
arrangement on printed circuit board, or change the thermal dissipation on the printed
circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat
sinks are not used, the thermal characterization parameter (ΨJT) can be used to
determine the junction temperature with a measurement of the temperature at the top
center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where
MC56F823xx, Rev. 4, 05/2020
58
NXP Semiconductors
Design Considerations
TT = Thermocouple temperature on top of package (°C/W)
ΨJT = hermal characterization parameter (°C/W)
PD = Power dissipation in package (W).
The thermal characterization parameter is measured per JESD51–2 specification using a
40-gauge type T thermocouple epoxied to the top center of the package case. The
thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over
about 1 mm of wire extending from the junction. The thermocouple wire is placed flat
against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
To determine the junction temperature of the device in the application when heat
sinks are used, the junction temperature is determined from a thermocouple inserted at
the interface between the case of the package and the interface material. A clearance slot
or hole is normally required in the heat sink. Minimizing the size of the clearance is
important to minimize the change in thermal performance caused by removing part of the
thermal interface to the heat sink. Because of the experimental difficulties with this
technique, many engineers measure the heat sink temperature and then back-calculate the
case temperature using a separate measurement of the thermal resistance of the interface.
From this case temperature, the junction temperature is determined from the junction-to-
case thermal resistance.
9.2 Electrical design considerations
CAUTION
This device contains protective circuitry to guard against
damage due to high static voltage or electrical fields. However,
take normal precautions to avoid application of any voltages
higher than maximum-rated voltages to this high-impedance
circuit. Reliability of operation is enhanced if unused inputs are
tied to an appropriate voltage level.
Use the following list of considerations to assure correct operation of the device:
• Provide a low-impedance path from the board power supply to each VDD pin on the
device and from the board ground to each VSS (GND) pin.
• The minimum bypass requirement is to place 0.01–0.1 µF capacitors positioned as
near as possible to the package supply pins. The recommended bypass configuration
is to place one bypass capacitor on each of the VDD/VSS pairs, including VDDA/VSSA
.
Ceramic and tantalum capacitors tend to provide better tolerances.
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
59
Design Considerations
• Ensure that capacitor leads and associated printed circuit traces that connect to the
chip VDD and VSS (GND) pins are as short as possible.
• Bypass the VDD and VSS with approximately 100 µF, plus the number of 0.1 µF
ceramic capacitors.
• PCB trace lengths should be minimal for high-frequency signals.
• Consider all device loads as well as parasitic capacitance due to PCB traces when
calculating capacitance. This is especially critical in systems with higher capacitive
loads that could create higher transient currents in the VDD and VSS circuits.
• Take special care to minimize noise levels on the VREF, VDDA, and VSSA pins.
• Using separate power planes for VDD and VDDA and separate ground planes for VSS
and VSSA are recommended. Connect the separate analog and digital power and
ground planes as near as possible to power supply outputs. If an analog circuit and
digital circuit are powered by the same power supply, then connect a small inductor
or ferrite bead in serial with VDDA. Traces of VSS and VSSA should be shorted
together.
• Physically separate analog components from noisy digital components by ground
planes. Do not place an analog trace in parallel with digital traces. Place an analog
ground trace around an analog signal trace to isolate it from digital traces.
• Because the flash memory is programmed through the JTAG/EOnCE port, SPI, SCI,
or I2C, the designer should provide an interface to this port if in-circuit flash
programming is desired.
• If desired, connect an external RC circuit to the RESET pin. The resistor value
should be in the range of 4.7 kΩ–10 kΩ; the capacitor value should be in the range of
0.1 µF–4.7 µF.
• Configuring the RESET pin to GPIO output in normal operation in a high-noise
environment may help to improve the performance of noise transient immunity.
• Add a 2.2 kΩ external pullup on the TMS pin of the JTAG port to keep EOnCE in a
reset state during normal operation if JTAG converter is not present. Furthermore,
configure TMS, TDI, TDO and TCK to GPIO if operation environment is very noisy.
• During reset and after reset but before I/O initialization, all the GPIO pins are at tri-
state.
• To eliminate PCB trace impedance effect, each ADC input should have a no less than
33 pF 10Ω RC filter.
9.3 Power-on Reset design considerations
MC56F823xx, Rev. 4, 05/2020
60
NXP Semiconductors
Design Considerations
9.3.1 Improper power-up sequence between VDD/VSS and VDDA/
VSSA:
It is recommended that VDD be kept within 100 mV of VDDA at all times, including
power ramp-up and ramp-down. Failure to keep VDD within 100 mV of VDDA may
cause a leakage current through the substrate, between the VDD and VDDA pad cells.
This leakage current could prevent operation of the device after it powers up. The voltage
difference between VDD and VDDA must be limited to below 0.3 V at all times, to avoid
permanent damage to the part (See Table 5). Also see Table 6.
9.3.2 Unnecessary protection circuit:
In many circuit designs, it is a general practice to add external clamping diodes on each
analog input pin; see diode D1 and D2 in Figure 21, to prevent the surge voltage from
damaging the analog input.
Reg3
DC
Reg1
DC
3.3V
12V
200V ~300V
+
+
+
DC
DC
C4
C2
C3
C5
C6
Reg2
DC
3.3V
DC
C1
R6
R5
R4
VDD
VDDA
MC56F8xxxx
ADC_IN
R2
D1
D2
R1
C7
C8
R3
RESET
VSS
+
D1 and D2 are unnecessary,
because all analog
VSSA
inputs already have the
internal current injection
protection circuit.
Figure 21. Protection Circuit Example
This device uses the 5V tolerance I/O. When the pin is configured to digital input, it can
accept 5V input. See Table 5. When the pin is configured to analog input, the internal
integrated current injection protection circuit is enabled. The current injection protection
circuit performs the same functions as external clamp diode D1 and D2 in Figure 21. As
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
61
Obtaining package dimensions
long as the source or sink current for each analog pin is less than 3 mA, then there is no
damage to the device. See Table 27. Therefore, D1 and D2 clamping diodes are not
recommended to be used.
9.3.3 Heavy capacitive load on power supply output:
In some applications, the low cost DC/DC converter may not regulate the output voltage
well before it reaches the regulation point, which is roughly around 2.5V to 2.7V.
However, the device might exit power-on reset at around 2.3V. If the initialization code
enables the PLL to run the DSC at full speed right after reset, then the high current will
be pulled by DSC from the supply, which can cause the supply voltage to drop below the
operation voltage; see the captured graph (Figure 22). This can cause the DSC fail to start
up.
Figure 22. Supply Voltage Drop
A recommended initialization sequence during power-up is:
1. After POR is released, run a few hundred NOP instructions from the internal
relaxation oscillator; this gives time for the supply voltage to stabilize.
2. Configure the peripherals (except the ADC) to the desired settings; the ADC should
stay in low power mode.
3. Power up the PLL.
4. After the PLL locks, switch the clock from PLL prescale to postscale.
5. Configure the ADC.
10 Obtaining package dimensions
Package dimensions are provided in package drawings.
MC56F823xx, Rev. 4, 05/2020
62
NXP Semiconductors
Pinout
To find a package drawing, go to nxp.com and perform a keyword search for the
drawing's document number:
Drawing for package
32LQFP
Document number to be used
98ASH70029A
32QFN
98ASA00473D
48-pin LQFP
98ASH00962A
11 Pinout
11.1 Signal Multiplexing and Pin Assignments
The following table shows the signals available on each pin and the locations of these
pins on the devices supported by this document. The SIM's GPS registers are responsible
for selecting which ALT functionality is available on most pins.
NOTE
• The RESETB pin is a 3.3 V pin only.
• If the GPIOC1 pin is used as GPIO, the XOSC should be
powered down.
• Not all CMPD pins are available on 48 LQFP.
NOTE
DAC and CMPC signals are not available on 32 LQFP package.
48
32
Pin Name
Default
ALT0
ALT1
ALT2
ALT3
LQFP LQFP
—
—
1
19
20
1
GPIOF2
GPIOF3
TCK
GPIOF2
GPIOF3
TCK
SCL0
SDA0
GPIOD2
GPIOD4
EXTAL
XTAL
TXD0
TA0
XB_OUT6
XB_OUT7
2
2
RESETB
GPIOC0
GPIOC1
GPIOC2
GPIOC3
GPIOC4
GPIOA4
GPIOA0
GPIOA1
GPIOA2
RESETB
GPIOC0
GPIOC1
GPIOC2
GPIOC3
GPIOC4
GPIOA4
GPIOA0
GPIOA1
GPIOA2
3
—
—
3
CLKIN0
4
5
XB_OUT11
CMPA_O
CMPB_O
XB_IN2
RXD0
CLKO0
CLKIN1
6
4
7
5
TA1
XB_IN6
EWM_OUT_B
8
—
6
ANA4
9
ANA0&CMPA_IN3
ANA1&CMPA_IN0
CMPC_O
10
11
7
8
ANA2&VREFHA&CMPA_
IN1
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
63
Pinout
48
32
Pin Name
Default
ALT0
ALT1
ALT2
ALT3
LQFP LQFP
12
—
GPIOA3
GPIOA3
ANA3&VREFLA&CMPA_
IN2
13
14
15
16
17
18
19
20
—
—
9
GPIOC5
GPIOB4
VDDA
GPIOC5
GPIOB4
VDDA
DACA_O
XB_IN7
ANB4&CMPC_IN1
10
11
12
—
13
VSSA
VSSA
GPIOB0
GPIOB1
VCAP
GPIOB0
GPIOB1
VCAP
ANB0&CMPB_IN3
ANB1&CMPB_IN0
DACB_O
GPIOB2
GPIOB2
ANB2&VERFHB&CMPC_
IN3
21
—
GPIOB3
GPIOB3
ANB3&VREFLB&CMPC_
IN0
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
14
15
—
16
17
18
—
—
—
—
—
21
22
23
24
—
—
25
26
—
—
27
28
29
30
31
32
VSS
VSS
GPIOC6
GPIOC7
GPIOC8
GPIOC9
GPIOC6
GPIOC7
GPIOC8
GPIOC9
GPIOC10
GPIOF0
GPIOC11
GPIOC12
VSS
TA2
XB_IN3
TXD0
CMP_REF
XB_IN8
XB_IN9
TXD0
SS0_B
SS0_B
MISO0
SCLK0
MOSI0
XB_IN6
RXD0
XB_OUT6
XB_OUT8
XB_OUT9
XB_IN4
XB_IN5
GPIOC10
GPIOF0
GPIOC11
GPIOC12
VSS
MISO0
SCL0
SDA0
TXD1
RXD1
VDD
VDD
GPIOE0
GPIOE1
GPIOE2
GPIOE3
GPIOC13
GPIOF1
GPIOE4
GPIOE5
GPIOC14
GPIOC15
VCAP
GPIOE0
GPIOE1
GPIOE2
GPIOE3
GPIOC13
GPIOF1
GPIOE4
GPIOE5
GPIOC14
GPIOC15
VCAP
PWM_0B
PWM_0A
PWM_1B
PWM_1A
TA3
XB_IN6
EWM_OUT_B
CLKO1
PWM_2B
PWM_2A
SDA0
XB_IN7
XB_IN2
XB_IN3
XB_OUT4
XB_OUT5
PWM_FAULT4
PWM_FAULT5
SCL0
VDD
VDD
VSS
VSS
TDO
TDO
GPIOD1
GPIOD3
GPIOD0
TMS
TMS
TDI
TDI
MC56F823xx, Rev. 4, 05/2020
64
NXP Semiconductors
Pinout
11.2 Pinout diagrams
The following diagrams show pinouts for the packages. For each pin, the diagrams show
the default function. However, many signals may be multiplexed onto a single pin.
GPIOE3
GPIOE2
GPIOE1
GPIOE0
VDD
36
35
34
33
32
31
30
29
28
27
26
25
TCK
RESETB
GPIOC0
GPIOC1
GPIOC2
GPIOC3
GPIOC4
GPIOA4
GPIOA0
GPIOA1
GPIOA2
GPIOA3
1
2
3
4
5
VSS
6
GPIOC12
GPIOC11
GPIOF0
GPIOC10
GPIOC9
GPIOC8
7
8
9
10
11
12
Figure 23. 48-pin LQFP
NOTE
The RESETB pin is a 3.3 V pin only.
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
65
Product documentation
GPIOE3
GPIOE2
GPIOE1
GPIOE0
GPIOF3
GPIOF2
GPIOC10
GPIOC9
TCK
RESETB
GPIOC2
GPIOC3
GPIOC4
GPIOA0
GPIOA1
GPIOA2
24
23
22
21
20
19
1
2
3
4
5
6
7
8
18
17
Figure 24. 32-pin LQFP and QFN
NOTE
The RESETB pin is a 3.3 V pin only.
12 Product documentation
The documents listed in Table 34 are required for a complete description and to
successfully design using the device. Documentation is available from local NXP
distributors, NXP sales offices, or online at www.nxp.com.
Table 34. Device documentation
Topic
Description
Document Number
DSP56800E/DSP56800EX
Reference Manual
Detailed description of the 56800EX family architecture, 32-bit
digital signal controller core processor, and the instruction set
DSP56800ERM
MC56F823xx Reference Manual Detailed functional description and programming model
MC56F823XXRM
MC56F823XX
MC56F823xx Data Sheet
Electrical and timing specifications, pin descriptions, and
package information (this document)
MC56F82xxx Errata
Details any chip issues that might be present
MC56F82xxx_Errata
MC56F823xx, Rev. 4, 05/2020
66
NXP Semiconductors
Revision History
13 Revision History
The following table summarizes changes to this document since the release of the
previous version.
Table 35. Revision History
Rev. No.
Date
Substantial Changes
2
10/2013
11/2013
First public release
2.1
• In Table 2, added DACB_O signal description.
• In Obtaining package dimensions, changed 32-QFN's document number from
'98ARE10566D' to '98ASA00473D'.
2.2
3.0
4
03/2016 -
05/2016
• In "12-bit ADC Electrical Specifications" table, corrected Max Gain Error to 0.990 to
1.010.
• In "Part identification" section, in "part number fields" table, added the 32QFN package
identifier.
• In "Electrical design considerations" section, added additional section "Power-on Reset
design considerations".
• Added new section "Power-on Reset design considerations".
• In "Peripheral highlights" section, added
• Periodic Interrupt Timer (PIT) Modules
• External Watchdog Monitor (EWM)
09/2016
• Removed PDB (Programmable Delay Block) mentions, because PDBs are not present
in these devices.
• Moved "Signal groups" section under "MC56F823xx signal and pin descriptions"
section.
• In "Voltage and current operating ratings" section: updated note; in "Absolute Maximum
Ratings" table, added Junction Temperature row, fixed broken footnotes.
• In "Power consumption operating behaviors" section, in "Current Consumption" table:
fixed broken footnotes; removed a footnote (#2).
• In "Relaxation Oscillator Timing" section, in "Relaxation Oscillator Electrical
Specifications" table: fixed broken footnotes, corrected and combined 2 footnotes.
05/2020
• Some updates in "Signal descriptions" table, e.g. VCAP description.
• In "Voltage and current operating requirements" table, updated the note.
• In "DC Electrical Characteristics at Recommended Operating Conditions" table, added
a new row for IIL and some footnotes (also with a new figure).
• In "SCI timing" table, typo fix for the Unit of pulse width.
• Thorough updates in "Power-on Reset design considerations" section, the second sub-
section now named as "Unnecessary protection circuit" and contents clarified.
• In "Signal Multiplexing and Pin Assignments" section, typo fix in the "Not all CMPD pins
…" item.
• Some updates in the "Power supervisor" section.
• Minor editorial updates.
MC56F823xx, Rev. 4, 05/2020
NXP Semiconductors
67
Information in this document is provided solely to enable system and software implementers to use
NXP products. There are no express or implied copyright licenses granted hereunder to design or
fabricate any integrated circuits based on the information in this document. NXP reserves the right to
make changes without further notice to any products herein.
How to Reach Us:
Home Page:
nxp.com
Web Support:
nxp.com/support
NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any
particular purpose, nor does NXP assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without limitation
consequential or incidental damages. "Typical" parameters that may be provided in NXP data sheets
and/or specifications can and do vary in different applications, and actual performance may vary over
time. All operating parameters, including "typicals," must be validated for each customer application
by customer's technical experts. NXP does not convey any license under its patent rights nor the
rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be
found at the following address: nxp.com/SalesTermsandConditions.
While NXP has implemented advanced security features, all products may be subject to unidentified
vulnerabilities. Customers are responsible for the design and operation of their applications and
products to reduce the effect of these vulnerabilities on customer's applications and products, and
NXP accepts no liability for any vulnerability that is discovered. Customers should implement
appropriate design and operating safeguards to minimize the risks associated with their applications
and products.
NXP, the NXP logo, NXP SECURE CONNECTIONS FOR A SMARTER WORLD, COOLFLUX,
EMBRACE, GREENCHIP, HITAG, I2C BUS, ICODE, JCOP, LIFE VIBES, MIFARE, MIFARE
CLASSIC, MIFARE DESFire, MIFARE PLUS, MIFARE FLEX, MANTIS, MIFARE ULTRALIGHT,
MIFARE4MOBILE, MIGLO, NTAG, ROADLINK, SMARTLX, SMARTMX, STARPLUG, TOPFET,
TRENCHMOS, UCODE, Freescale, the Freescale logo, AltiVec, C‑5, CodeTEST, CodeWarrior,
ColdFire, ColdFire+, C‑Ware, the Energy Efficient Solutions logo, Kinetis, Layerscape, MagniV,
mobileGT, PEG, PowerQUICC, Processor Expert, QorIQ, QorIQ Qonverge, Ready Play, SafeAssure,
the SafeAssure logo, StarCore, Symphony, VortiQa, Vybrid, Airfast, BeeKit, BeeStack, CoreNet,
Flexis, MXC, Platform in a Package, QUICC Engine, SMARTMOS, Tower, TurboLink, UMEMS, eIQ,
Immersiv3D, EdgeLock, and EdgeScale are trademarks of NXP B.V. All other product or service
names are the property of their respective owners. AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11,
Artisan, big.LITTLE, Cordio, CoreLink, CoreSight, Cortex, DesignStart, DynamIQ, Jazelle, Keil, Mali,
Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore, Socrates, Thumb, TrustZone, ULINK,
ULINK2, ULINK-ME, ULINK-PLUS, ULINKpro, µVision, Versatile are trademarks or registered
trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. The related technology
may be protected by any or all of patents, copyrights, designs and trade secrets. All rights reserved.
Oracle and Java are registered trademarks of Oracle and/or its affiliates. The Power Architecture and
Power.org word marks and the Power and Power.org logos and related marks are trademarks and
service marks licensed by Power.org.
© 2013–2020 NXP B.V.
Document Number MC56F823XX
Revision 4, 05/2020
相关型号:
MC56F823XXRM
This family of digital signal controllers (DSCs) is based on the 32-bit 56800EX core.
NXP
©2020 ICPDF网 联系我们和版权申明