MC68HC05C9AFN [NXP]
8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PQCC44, PLASTIC, LCC-44;
| 型号： | MC68HC05C9AFN |
| 厂家： | 
NXP |
| 描述： | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PQCC44, PLASTIC, LCC-44 时钟 微控制器 外围集成电路 |
| 文件： | 总124页 (文件大小：745K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC68HC05C9A
MC68HCL05C9A
MC68HSC05C9A
Advance Information Data Sheet
M68HC08
Microcontrollers
MC68HC05C9A
Rev. 5.1
9/2005
freescale.com
This document contains certain information on a new product.Specifications and information herein are subject to change without notice.
Blank
MC68HC05C9A
MC68HCL05C9A
MC68HSC05C9A
Data Sheet
To provide the most up-to-date information, the revision of our documents on the World Wide Web will be
the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
http://www.freescale.com/
The following revision history table summarizes changes contained in this document. For your
convenience, the page number designators have been linked to the appropriate location.
Revision History
Revision
Level
Page
Number(s)
Date
Description
September
2005
5.1
Updated to meet Freescale identity guidelines.
Throughout
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
© Freescale Semiconductor, Inc., 2005. All rights reserved.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
3
Revision History
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
4
Freescale Semiconductor
List of Chapters
Chapter 1 General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Chapter 2 Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Chapter 3 Central Processor Unit (CPU). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Chapter 4 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Chapter 5 Resets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Chapter 6 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
Chapter 7 Input/Output Ports. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Chapter 8 Capture/Compare Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Chapter 9 Serial Communications Interface (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Chapter 10 Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Chapter 11 Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
Chapter 12 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Chapter 13 Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .101
Chapter 14 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
Appendix A MC68HCL05C9A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107
Appendix B MC68HSC05C9A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111
Appendix C Self-Check Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
Appendix D M68HC05Cx Family Feature Comparisons . . . . . . . . . . . . . . . . . . . . . . . . . .121
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
5
List of Chapters
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
6
Freescale Semiconductor
Table of Contents
Chapter 1
General Description
1.1
1.2
1.3
1.4
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Mask Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Software-Programmable Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Functional Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.5
1.5.1
1.5.2
1.5.3
1.5.4
1.5.5
1.5.6
1.5.7
1.5.8
1.5.9
1.5.10
VDD and VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
IRQ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
OSC1 and OSC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
TCAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
TCMP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PA0–PA7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PB0–PB7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PC0–PC7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PD0–PD5 and PD7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Chapter 2
Memory
2.1
2.2
2.3
2.4
2.5
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
RAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
ROM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
ROM Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
I/O Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Chapter 3
Central Processor Unit (CPU)
3.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.2
CPU Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Accumulator (A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Index Register (X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Program Counter (PC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Stack Pointer (SP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Condition Code Register (CCR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.2.1
3.2.2
3.2.3
3.2.4
3.2.5
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
7
Table of Contents
Chapter 4
Interrupts
4.1
4.2
4.3
4.4
4.5
4.6
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Non-Maskable Software Interrupt (SWI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
External Interrupt (IRQ or Port B) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Timer Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
SCI Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
SPI Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Chapter 5
Resets
5.1
5.2
5.3
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
RESET Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.4
5.4.1
5.4.2
Computer Operating Properly (COP) Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
COP Reset Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
COP Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.5
5.6
5.7
COP During Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
COP During Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Clock Monitor Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Chapter 6
Low-Power Modes
6.1
6.2
6.3
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Chapter 7
Input/Output Ports
7.1
7.2
7.3
7.4
7.5
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Port A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Port B. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Port C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Port D. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Chapter 8
Capture/Compare Timer
8.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.2
8.2.1
8.2.2
Timer Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Input Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Output Compare. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
8.3
Timer I/O Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Timer Control Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Timer Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Timer Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
8.3.1
8.3.2
8.3.3
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
8
Freescale Semiconductor
Table of Contents
8.3.4
8.3.5
8.3.6
Alternate Timer Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Input Capture Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Output Compare Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
8.4
8.5
Timer During Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Timer During Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Chapter 9
Serial Communications Interface (SCI)
9.1
9.2
9.3
9.4
9.5
9.6
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
SCI Receiver Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
SCI Transmitter Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Data Format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
9.7
9.7.1
9.7.2
Receiver Wakeup Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Idle Line Wakeup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Address Mark Wakeup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
9.8
9.9
Receive Data In (RDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Start Bit Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
9.10 Transmit Data Out (TDO). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
9.11 SCI I/O Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
9.11.1
9.11.2
9.11.3
9.11.4
9.11.5
SCI Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
SCI Control Register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
SCI Control Register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
SCI Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Baud Rate Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Chapter 10
Serial Peripheral Interface (SPI)
10.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
10.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
10.3 SPI Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
10.3.1
10.3.2
10.3.3
10.3.4
Master In/Slave Out (MISO). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Master Out/Slave In (MOSI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Serial Clock (SCK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Slave Select (SS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
10.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
10.5 SPI Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
10.5.1
10.5.2
10.5.3
Serial Peripheral Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Serial Peripheral Status Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Serial Peripheral Data I/O Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
9
Table of Contents
Chapter 11
Instruction Set
11.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
11.2 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
11.2.1
11.2.2
11.2.3
11.2.4
11.2.5
11.2.6
11.2.7
11.2.8
Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Immediate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Indexed, No Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Indexed, 8-Bit Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Indexed, 16-Bit Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Relative . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
11.3 Instruction Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
11.3.1
11.3.2
11.3.3
11.3.4
11.3.5
Register/Memory Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Jump/Branch Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Bit Manipulation Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Control Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
11.4 Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
11.5 Opcode Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Chapter 12
Electrical Specifications
12.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
12.2 Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
12.3 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
12.4 Power Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
12.5 5.0-Volt DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
12.6 3.3-Volt DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
12.7 5.0-Volt Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
12.8 3.3-Volt Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
12.9 5.0-Volt Serial Peripheral Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
12.10 3.3-Volt Serial Peripheral Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Chapter 13
Mechanical Specifications
13.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
13.2 40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03) . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
13.3 42-Pin Plastic Shrink Dual In-Line (SDIP) Package (Case 858-01). . . . . . . . . . . . . . . . . . . . . 102
13.4 44-Lead Plastic-Leaded Chip Carrier (PLCC) (Case 777-02) . . . . . . . . . . . . . . . . . . . . . . . . . 103
13.5 44-Lead Quad Flat Pack (QFP) (Case 824A-01). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
10
Freescale Semiconductor
Table of Contents
Chapter 14
Ordering Information
14.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
14.2 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Appendix A
MC68HCL05C9A
A.1
A.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
A.3
DC Electrical Characeristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
1.8–2.4-Volt Low-Power Output Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
1.8–2.4-Volt Input Pullup Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
2.5–3.6-Volt Low-Power Output Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
2.6–3.6-Volt Input Pullup Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Low-Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
A.3.1
A.3.2
A.3.3
A.3.4
A.3.5
Appendix B
MC68HSC05C9A
B.1
B.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
B.3
B.3.1
B.3.2
DC Electrical Characeristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
High-Speed Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Input Pullup Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
B.4
Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
4.5–5.5-Volt High-Speed Control Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
2.4–3.6-Volt High-Speed Control Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
4.5–5.5-Volt High-Speed Control Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
2.4–3.6-Volt High-Speed SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
B.4.1
B.4.2
B.4.3
B.4.4
Appendix C
Self-Check Mode
C.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
C.2
C.2.1
C.2.2
Self-Check Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Self-Check Tests. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Self-Check Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
Appendix D
M68HC05Cx Family Feature Comparisons
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
11
Table of Contents
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
12
Freescale Semiconductor
Chapter 1
General Description
1.1 Introduction
The MC68HC05C9A HCMOS (high-density complementary metal-oxide semiconductor) microcontroller
is a member of the M68HC05 Family. The MC68HC05C9A memory map consists of 15,936 bytes of user
ROM and 352 bytes of RAM. The MC68HC05C9A includes a serial communications interface, a serial
peripheral interface, and a 16-bit capture/compare timer.
1.2 Features
Features of the MC68HC05C9A include:
•
•
•
•
•
•
•
M68HC05 CPU
Mask programmable interrupt capability on port B
Software programmable external interrupt sensitivity
15,936 bytes of read-only memory (ROM)
352 bytes of random-access memory (RAM)
Memory mapped input/output (I/O)
31 bidirectional I/O lines with high current sink and source
on PC7
•
•
•
•
•
•
•
•
•
Asynchronous serial communications interface (SCI)
Synchronous serial peripheral interface (SPI)
16-Bit capture/compare timer
Computer operating properly (COP) watchdog timer and clock monitor
Power-saving wait and stop modes
On-chip crystal oscillator connections
Single 3.0 volts to 5.5 volts power supply requirement
ROM contents security(1) feature
Available packages:
–
–
–
–
40-pin dual in-line (DIP)
44-pin plastic leaded chip carrier (PLCC)
44-pin quad flat pack (QFP)
42-pin plastic shrink dual in-line (SDIP) packages
1.3 Mask Options
Eight mask options are available to select external interrupt capability (including an internal pullup device)
on each of the port B pins.
1. No security feature is absolutely secure. However, Freescale’s strategy is to make reading or copying the ROM difficult for
unauthorized users.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
13
General Description
SELF-CHECK ROM — 239 BYTES
USER ROM — 15,936 BYTES
USER RAM — 352 BYTES
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
ARITHMETIC LOGIC
UNIT
CPU CONTROL
ACCUMULATOR
IRQ
M68HC05
MCU
INDEX REGISTER
RESET
RESET
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
STACK POINTER
0
0 0 0 0 0 1 1
PROGRAM COUNTER
CONDITION CODE REGISTER
1
1 1 H I N C Z
CPU CLOCK
OSC1
OSC2
DIVIDE
BY TWO
INTERNAL
OSCILLATOR
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
INTERNAL CLOCK
COP
WATCHDOG
DIVIDE
BY FOUR
TIMER CLOCK
BAUD RATE
PD7
GENERATOR
CAPTURE/
SPI
SCI
TCAP
TCMP
PD5/SS
SS
COMPARE
TIMER
PD4/SCK
PD3/MOSI
PD2/MISO
PD1/TDO
PD0/RDI
SCK
MOSI
MISO
TDO
RDI
VDD
VSS
POWER
Figure 1-1. Block Diagram
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
14
Freescale Semiconductor
Software-Programmable Options
1.4 Software-Programmable Options
The option register (OR), shown in Figure 1-2, contains the programmable bits for these options:
•
•
Map two different areas of memory between RAM and ROM, one of 48 bytes and one of 128 bytes
Edge-triggered only or edge- and level-triggered external interrupt (IRQ pin and any port B pin
configured for interrupt)
This register must be written to by user software during operation of the microcontroller.
Address: $3FDF
Bit 7
RAM0
0
6
RAM1
0
5
0
4
0
3
0
2
0
1
IRQ
1
Bit 0
0
Read:
Write:
Reset:
0
0
0
0
0
= Unimplemented
Figure 1-2. Option Register
RAM0 — Random-Access Memory Control Bit 0
This read/write bit selects between RAM or ROM in location $0020 to $004F. This bit can be read or
written at any time.
1 = RAM selected
0 = ROM selected
RAM1— Random-Access Memory Control Bit 1
This read/write bit selects between RAM or ROM in location $0100 to $017F. This bit can be read or
written at any time.
1 = RAM selected
0 = EPROM selected
IRQ — Interrupt Request Bit
This bit selects between an edge-triggered only or edge- and level- triggered external interrupt. This
bit is set by reset, but can be cleared by software. This bit can be written only once.
1 = Edge and level interrupt option selected
0 = Edge-only interrupt option selected
1.5 Functional Pin Descriptions
Figure 1-3, Figure 1-4, Figure 1-5, and Figure 1-6 show the pin assignments for the available packages.
A functional description of the pins follows.
NOTE
A line over a signal name indicates an active low signal. For example,
RESET is active high and RESET is active low.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
15
General Description
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
1
RESET
IRQ
N/C
VDD
2
OSC1
OSC2
TCAP
PD7
3
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
VSS
4
5
6
TCMP
PD5/SS
PD4/SCK
PD3/MOSI
PD2/MISO
PD1/TDO
PD0/RDI
PC0
7
8
9
10
11
12
13
14
15
16
17
18
19
20
PC1
PC2
PC3
PC4
PC5
PC6
PC7
Figure 1-3. 40-Pin PDIP Pin Assignments
NOTE
If MC68HC705C9A devices are to be used in the same socket, pin 3 should
be tied to VDD
.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
16
Freescale Semiconductor
Functional Pin Descriptions
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
RESET
IRQ
N/C
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
PB0
PB1
PB2
PB3
N/C
PB4
PB5
PB6
PB7
VSS
1
VDD
2
OSC1
OSC2
TCAP
PD7
3
4
5
6
TCMP
PD5/SS
PD4/SCK
PD3/MOSI
PD2/MISO
PD1/TDO
PD0/RDI
PC0
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
PC1
PC2
N/C
PC3
PC4
PC5
PC6
PC7
Figure 1-4. 42-Pin SDIP Pin Assignments
NOTE
If MC68HC705C9A devices are to be used in the same socket, pin 3 should
be tied to VDD
.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
17
General Description
1
7
PA5
PA4
PA3
PA2
PA1
PA0
PB0
PB1
PB2
PB3
N/C
N/C
39
38
37
36
35
34
33
32
31
30
29
8
TCMP
9
PD5/SS
PD4/SCK
PD3/MOSI
PD2MISO
PD1/TDO
PD0/RDI
PC0
10
11
12
13
14
15
16
17
PC1
PC2
Figure 1-5. 44-Lead PLCC Pin Assignments
NOTE
The 44-pin PLCC pin assignment diagram is for compatibility with the
MC68HC705C9A. However, if MC68HC705C9A devices are to be used in
the same socket, pin 3 should be tied to VDD
.
For compatibility with MC68HC05C4A/C8A/C12A devices in 44-pin PLCC,
tie pins 17 and 18 together, and tie pins 39 and 40 together.
For compatibility with MC68HC705C8A 44-pin PLCC device, three sets of
pins should be tied together: pins 17 and 18, pins 39 and 40, and
pins 3, 4, and 44.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
18
Freescale Semiconductor
Functional Pin Descriptions
1
TCMP
PA6
PA5
PA4
PA3
PA2
PA1
PA0
PB0
PB1
PB2
PB3
33
32
31
30
29
28
27
26
25
24
23
2
PD5/SS
PD4/SCK
PD3/MOSI
PD2/MISO
PD1/TDO
PD0/RDI
PC0
3
4
5
6
7
8
9
PC1
10
11
PC2
PC3
Figure 1-6. 44-Pin QFP Pin Assignments
NOTE
If MC68HC705C9A devices are to be used in the same socket, pin 43
should be tied to VDD
.
1.5.1 V and V
DD
SS
Power is supplied to the MCU using these two pins. VDD is the positive supply and VSS is ground.
1.5.2 IRQ
This interrupt pin has an option that provides two different choices of interrupt triggering sensitivity.
The IRQ pin contains an internal Schmitt trigger as part of its input to improve noise immunity. Refer to
Chapter 4 Interrupts for more detail.
1.5.3 OSC1 and OSC2
These pins provide control input for an on-chip clock oscillator circuit. A crystal or ceramic resonator
connected to these pins provides a system clock. The internal frequency is one-half the crystal frequency.
1.5.4 RESET
As an input pin, this active low RESET pin is used to reset the MCU to a known startup state by pulling
RESET low. As an output pin, the RESET pin indicates that an internal MCU reset has occurred. The
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
19
General Description
RESET pin contains an internal Schmitt trigger as part of its input to improve noise immunity. Refer to
Chapter 5 Resets for more detail.
1.5.5 TCAP
This pin controls the input capture feature for the on-chip programmable timer. The TCAP pin contains an
internal Schmitt trigger as part of its input to improve noise immunity. Refer to Chapter 8
Capture/Compare Timer for more detail.
1.5.6 TCMP
The TCMP pin provides an output for the output compare feature of the on-chip programmable timer.
Refer to Chapter 8 Capture/Compare Timer for more detail.
1.5.7 PA0–PA7
These eight I/O lines comprise port A. The state of each pin is software programmable and all port A pins
are configured as inputs during reset. Refer to Chapter 7 Input/Output Ports for more detail.
1.5.8 PB0–PB7
These eight I/O lines comprise port B. The state of each pin is software programmable and all port B pins
are configured as inputs during reset. Port B has mask option register enabled pullup devices and
interrupt capability selectable for any pin. Refer to Chapter 7 Input/Output Ports for more detail.
1.5.9 PC0–PC7
These eight I/O lines comprise port C. The state of each pin is software programmable and all port C pins
are configured as inputs during reset. PC7 has high current sink and source capability. Refer to Chapter
7 Input/Output Ports for more detail.
1.5.10 PD0–PD5 and PD7
These seven I/O lines comprise port D. The state of each pin is software programmable and all port D
pins are configured as inputs during reset. Refer to Chapter 7 Input/Output Ports for more detail.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
20
Freescale Semiconductor
Chapter 2
Memory
2.1 Introduction
The microcontroller unit (MCU) has a 16-Kbyte memory map. The memory map consists of:
•
•
•
•
•
Input/output (I/O), control, and status registers
User random-access memory (RAM)
User read-only memory (ROM)
Self-check ROM
Reset and interrupt vectors
See Figure 2-1 and Figure 2-2.
Two control bits in the option register ($3FDF) allow the user to switch between RAM and ROM at any
time in two special areas of the memory map, $0020–$004F (48 bytes) and $0100–$017F (128 bytes).
2.2 RAM
The main user RAM consists of 176 bytes at $0050–$00FF. This RAM area is always present in the
memory map and includes a 64-byte stack area. The stack pointer can access 64 bytes of RAM in the
range $00FF down to $00C0.
NOTE
Using the stack area for data storage or temporary work locations requires
care to prevent it from being overwritten due to stacking from an interrupt
or subroutine call.
Two additional RAM areas are available at $0020–$004F (48 bytes) and $0100–$017F (128 bytes) (see
Figure 2-1 and Figure 2-2.) These may be accessed at any time by setting the RAM0 and RAM1 bits,
respectively, in the option register.
Refer to 1.4 Software-Programmable Options for additional information.
2.3 ROM
The user ROM consists of 48 bytes of page zero ROM from $0020 to $004F, 15,872 bytes of ROM from
$0100 to $3EFF, and 16 bytes of user vectors from $3FF0 to $3FFF.
2.4 ROM Security
A security feature has been incorporated into the MC68HC05C9A to help prevent external access to the
contents of the ROM in any mode of operation.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
21
Memory
$0000
$0000
$0001
$0002
$0003
$0004
$0005
$0006
$0007
$0008
$0009
$000A
$000B
$000C
$000D
$000E
$000F
$0010
$0011
$0012
$0013
$0014
$0015
$0016
$0017
$0018
$0019
$001A
$001B
$001C
$001D
$001E
$001F
PORT A DATA REGISTER
PORT B DATA REGISTER
PORT C DATA REGISTER
PORT D DATA REGISTER
PORT A DATA DIRECTION REGISTER
PORT B DATA DIRECTION REGISTER
PORT C DATA DIRECTION REGISTER
PORT D DATA DIRECTION REGISTER
UNUSED
I/O REGISTERS
32 BYTES
$001F
$0020
USER ROM
48 BYTES
RAM0 = 0
RAM
48 BYTES
RAM0 = 1
$004F
$0050
UNUSED
RAM
176 BYTES
SPI CONTROL REGISTER
SPI STATUS REGISTER
$00BF
$00C0
SPI DATA REGISTER
SCI BAUD RATE REGISTER
SCI CONTROL REGISTER 1
SCI CONTROL REGISTER 2
SCI STATUS REGISTER
STACK
64 BYTES
$00FF
$0100
USER ROM
128 BYTES
RAM
128 BYTES
SCI DATA REGISTER
TIMER CONTROL REGISTER
TIMER STATUS REGISTER
INPUT CAPTURE REGISTER (HIGH)
RAM1 = 0
RAM1 = 1
$017F
$0180
INPUT CAPTURE REGISTER (LOW)
OUTPUT COMPARE REGISTER (HIGH)
OUTPUT COMPARE REGISTER (LOW)
TIMER COUNTER REGISTER (HIGH)
TIMER COUNTER REGISTER (LOW)
ALTERNATE COUNTER REGISTER (HIGH)
ALTERNATE COUNTER REGISTER (LOW)
UNUSED
USER ROM
15,744 BYTES
COP RESET REGISTER
COP CONTROL REGISTER
UNUSED
$3EFF
$3F00
$3FF0
UNUSED (4 BYTES)
$3FF3
$3FF4
$3FF5
$3FF6
$3FF7
$3FF8
$3FF9
$3FFA
$3FFB
$3FFC
$3FFD
$3FFE
$3FFF
SELF-CHECK
ROM
AND VECTORS
239 BYTES
SPI VECTOR (HIGH)
SPI VECTOR (LOW)
SCI VECTOR (HIGH)
SCI VECTOR (LOW)
TIMER VECTOR (HIGH)
TIMER VECTOR (LOW)
IRQ VECTOR (HIGH)
$3FDF
$3FEF
$3FF0
OPTION REGISTER
IRQ VECTOR (LOW)
SWI VECTOR (HIGH)
SWI VECTOR (LOW)
USER ROM VECTORS
16 BYTES
RESET VECTOR (HIGH BYTE)
RESET VECTOR (LOW BYTE)
$3FFF
Figure 2-1. Memory Map
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
22
Freescale Semiconductor
I/O Registers
2.5 I/O Registers
Except for the option register, all I/O, control and status registers are located within one 32-byte block in
page zero of the address space ($0000–$001F). A summary of these registers is shown in Figure 2-2.
More detail about the contents of these registers is given in Figure 2-3.
Address
$0000
$0001
$0002
$0003
$0004
$0005
$0006
$0007
$0008
$0009
$000A
$000B
$000C
$000D
$000E
$000F
$0010
$0011
$0012
$0013
$0014
$0015
$0016
$0017
$0018
$0019
$001A
$001B
$001C
$001D
$001E
$001F
Register Name
Port A Data Register
Port B Data Register
Port C Data Register
Port D Data Register
Port A Data Direction Register
Port B Data Direction Register
Port C Data Direction Register
Port D Data Direction Register
Unused
Unused
Serial Peripheral Control Register
Serial Peripheral Status Register
Serial Peripheral Data Register
Baud Rate Register
Serial Communications Control Register 1
Serial Communications Control Register 2
Serial Communications Status Register
Serial Communications Data Register
Timer Control Register
Timer Status Register
Input Capture Register High
Input Capture Register Low
Output Compare Register High
Output Compare Register Low
Timer Register High
Timer Register Low
Alternate Timer Register High
Alternate Timer Register Low
Unused
COP Reset Register
COP Control Register
Reserved
Figure 2-2. I/O Register Summary
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
23
Memory
Addr.
Register Name
Bit 7
6
5
4
3
2
1
Bit 0
Read:
(PORTA) Write:
Port A Data Register
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
$0000
See page 41.
Reset:
Read:
Unaffected by reset
PB4 PB3
Unaffected by reset
PC4 PC3
Unaffected by reset
PD4 PD3
Unaffected by reset
Port B Data Register
PB7
PC7
PD7
PB6
PC6
PB5
PC5
PD5
PB2
PC2
PD2
PB1
PC1
PD1
PB0
PC0
PD0
$0001
$0002
$0003
$0004
$0005
$0006
(PORTB) Write:
See page 42.
Reset:
Read:
Port C Data Register
(PORTC) Write:
See page 42.
Reset:
Read:
Port D Data Register
(PORTD) Write:
See page 42.
Reset:
Read:
Port A Data Direction Register
DDRA7 DDRA6
DDRA5
DDRA4
DDRA3
DDRA2
DDRA1 DDRA0
(DDRA) Write:
See page 41.
Reset:
Read:
0
0
0
0
0
0
0
0
Port B Data Direction Register
DDRB7 DDRB6
DDRB5
DDRB4
DDRB3
DDRB2
DDRB1 DDRB0
(DDRB) Write:
See page 42.
Reset:
Read:
0
0
0
DDRC5
0
0
DDRC4
0
0
DDRC3
0
0
DDRC2
0
0
0
Port C Data Direction Register
DDRC7 DDRC6
DDRC1 DDRC0
(DDRC) Write:
See page 42.
Reset:
Read:
0
DDRC7
0
0
0
0
0
Port D Data Direction Register
DDRC5
0
DDRC4
0
DDRC3
0
DDRC2
0
DDRC1 DDRC0
$0007
$0008
$0009
(DDRD) Write:
See page 42.
Reset:
0
0
Unimplemented
Unimplemented
Read:
SPI Control Register
SPIE
0
SPE
DWOM
MSTR
CPOL
CPHA
SPR1
SPR0
$000A
$000B
$000C
(SPCR) Write:
See page 68.
Reset:
0
0
0
0
0
0
1
0
U
0
U
0
Read: SPIF
(SPSR) Write:
WCOL
MODF
SPI Status Register
See page 70.
Reset:
Read:
0
0
0
0
0
0
0
0
SPI Data Register
SPD7
SPD6
SPD5
SPD4
SPD3
SPD2
SPD1
SPD0
(SPDR) Write:
See page 71.
Reset:
Unaffected by reset
= Reserved
= Unimplemented
R
U = Unaffected
Figure 2-3. Input/Output Registers (Sheet 1 of 3)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
24
Freescale Semiconductor
I/O Registers
Addr.
Register Name
Bit 7
6
5
SCP1
0
4
SCP0
0
3
2
SCR2
U
1
Bit 0
SCR0
U
Read:
SCI Baud Rate Register
SCR1
U
$000D
BAUD Write:
See page 63.
Reset:
Read:
—
R8
U
—
T8
—
WAKE
U
SCI Control Register 1
M
$000E
$000F
$0010
$0011
$0012
$0013
$0014
$0015
$0016
$0017
$0018
(SCCR1) Write:
See page 59.
Reset:
Read:
U
0
U
0
0
0
SBK
0
SCI Control Register 2
TIE
TCIE
RIE
ILIE
TE
RE
RMW
(SCCR2) Write:
See page 60.
Reset:
0
0
0
0
0
0
0
Read: TDRE
(SCSR) Write:
TC
RDRF
IDLE
OR
NF
FE
SCI Status Register
See page 62.
Reset:
Read:
1
1
0
0
0
0
0
—
SCI Data Register
SCD7
SDC6
SCD5
SCD4
SCD3
SCD2
SCD1
SCD0
(SCDR) Write:
See page 59.
Reset:
Read:
Unaffected by reset
0
0
0
Timer Control Register
ICIE
OCIE
TOIE
IEDG
OLVL
(TCR) Write:
See page 47.
Reset:
Read:
0
0
0
0
0
0
0
0
0
U
0
0
0
ICF
OCF
TOF
Timer Status Register
(TSR) Write:
See page 48.
Reset:
U
U
U
0
0
0
0
0
Read: Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Input Capture Register High
(ICRH) Write:
See page 50.
Reset:
Unaffected by reset
Bit 4 Bit 3
Read: Bit 7
Bit 6
Bit 5
Bit 2
Bit 1
Bit 0
Input Capture Register Low
(ICRL) Write:
See page 50.
Reset:
Unaffected by reset
Bit 12 Bit 11
Unaffected by reset
Bit 4 Bit 3
Unaffected by reset
Read:
Bit 15
Output Compare Register
Bit 14
Bit 6
Bit 13
Bit 5
Bit 10
Bit 2
Bit 9
Bit 1
Bit 8
Bit 0
High (OCRH) Write:
See page 50.
Reset:
Read:
Bit 7
Output Compare Register
Low (OCRL) Write:
See page 50.
Reset:
Read: Bit 15
Bit 14
1
Bit 13
1
Bit 12
Bit 11
Bit 10
1
Bit 9
1
Bit 8
1
Timer Register High
(TRH) Write:
See page 49.
Reset:
1
1
1
= Unimplemented
R
= Reserved
U = Unaffected
Figure 2-3. Input/Output Registers (Sheet 2 of 3)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
25
Memory
Addr.
Register Name
Bit 7
6
5
4
3
2
1
Bit 0
Timer Register Low Read: Bit 7
(TRL)
See page 49.
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Write:
$0019
$001A
Reset:
Read: Bit 15
(ATRH) Write:
1
1
1
1
1
1
0
0
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Alternate Timer Register High
See page 49.
Reset:
1
1
1
1
1
1
1
1
Read: Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Alternate Timer Register Low
$001B
$001C
(ATRL) Write:
See page 49.
Reset:
1
1
1
1
1
1
0
0
Unimplemented
Read:
COP Reset Register
$001D
(COPRST) Write: Bit 7
See page 35.
Bit 6
Bit 5
Bit 4
0
Bit 3
0
Bit 2
0
Bit 1
0
Bit 0
0
Reset:
Read:
0
0
0
0
0
0
COP Control Register
COPF
U
CME
0
COPE
0
CM1
0
CM0
0
$001E
$001D
$001E
$001F
(COPCR) Write:
See page 36.
Reset:
0
0
0
Unimplemented
Unimplemented
Reserved
R
R
R
R
R
R
R
R
R
= Unimplemented
= Reserved
U = Unaffected
Figure 2-3. Input/Output Registers (Sheet 3 of 3)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
26
Freescale Semiconductor
Chapter 3
Central Processor Unit (CPU)
3.1 Introduction
This section contains information describing the basic programmer’s model and the registers contained
in the central processor unit (CPU).
3.2 CPU Registers
The microcontroller unit (MCU) contains five registers as shown in the programming model of Figure 3-1.
The interrupt stacking order is shown in Figure 3-2.
7
0
A
X
ACCUMULATOR
7
0
0
0
INDEX REGISTER
13
13
PC
1
PROGRAM COUNTER
STACK POINTER
7
0
0
0
0
0
0
1
SP
CCR
H
I
N
Z
C
CONDITION CODE REGISTER
Figure 3-1. Programming Model
7
0
CONDITION CODE REGISTER
ACCUMULATOR
INDEX REGISTER
PCH
STACK
1
1
1
I
N
T
R
E
T
U
R
N
INCREASING
MEMORY
ADDRESSES
E
R
R
U
P
T
DECREASING
MEMORY
ADDRESSES
PCL
UNSTACK
Figure 3-2. Interrupt Stacking Order
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
27
Central Processor Unit (CPU)
3.2.1 Accumulator (A)
The accumulator is a general-purpose 8-bit register used to hold operands and results of arithmetic
calculations or data manipulations.
3.2.2 Index Register (X)
The index register is an 8-bit register used for the indexed addressing value to create an effective
address. The index register may also be used as a temporary storage area.
3.2.3 Program Counter (PC)
The program counter is a 14-bit register that contains the address of the next byte to be fetched.
3.2.4 Stack Pointer (SP)
The stack pointer contains the address of the next free location on the stack. During an MCU reset or the
reset stack pointer (RSP) instruction, the stack pointer is set to location $0FF. The stack pointer is then
decremented as data is pushed onto the stack and incremented as data is pulled from the stack.
When accessing memory, the eight most significant bits are permanently set to 00000011. These eight
bits are appended to the six least significant register bits to produce an address within the range of $00FF
to $00C0. Subroutines and interrupts may use up to 64 (decimal) locations. If 64 locations are exceeded,
the stack pointer wraps around and loses the previously stored information. A subroutine call occupies
two locations on the stack; an interrupt uses five locations.
3.2.5 Condition Code Register (CCR)
The CCR is a 5-bit register in which four bits are used to indicate the results of the instruction just
executed, and the fifth bit indicates whether interrupts are masked. These bits can be individually tested
by a program, and specific actions can be taken as a result of their state. Each bit is explained here.
Half Carry (H)
This bit is set during ADD and ADC operations to indicate that a carry occurred between bits 3 and 4.
Interrupt (I)
When this bit is set, the timer, serial communications interface (SCI), serial peripheral interface (SPI),
and external interrupt are masked (disabled). If an interrupt occurs while this bit is set, the interrupt is
latched and processed as soon as the interrupt bit is cleared.
Negative (N)
When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was
negative.
Zero (Z)
When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was 0.
Carry/Borrow (C)
When set, this bit indicates that a carry or borrow out of the arithmetic logical unit (ALU) occurred
during the last arithmetic operation. This bit is also affected during bit test and branch instructions and
during shifts and rotates.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
28
Freescale Semiconductor
Chapter 4
Interrupts
4.1 Introduction
The MC68HC05C9A microcontroller unit (MCU) can be interrupted by five different sources: four
maskable hardware interrupts, and one non-maskable software interrupt:
•
•
•
•
•
External signal on the IRQ pin or port B pins
16-bit programmable timer
Serial communications interface (SCI)
Serial peripheral interface (SPI)
Software interrupt instruction (SWI)
Interrupts cause the processor to save register contents on the stack and to set the interrupt mask (I bit)
to prevent additional interrupts. The return from interrupt (RTI) instruction causes the register contents to
be recovered from the stack and normal processing to resume.
Unlike RESET, hardware interrupts do not cause the current instruction execution to be halted, but are
considered pending until the current instruction is complete.
NOTE
The current instruction is the one already fetched and being operated on.
When the current instruction is complete, the processor checks all pending hardware interrupts. If
interrupts are not masked (CCR I bit clear) and if the corresponding interrupt enable bit is set, the
processor proceeds with interrupt processing; otherwise, the next instruction is fetched and executed.
If an external interrupt and a timer, SCI, or SPI interrupt are pending at the end of an instruction execution,
the external interrupt is serviced first. The SWI is executed the same as any other instruction, regardless
of the I-bit state.
Table 4-1 shows the relative priority of all the possible interrupt sources. Figure 4-1 shows the interrupt
processing flow.
4.2 Non-Maskable Software Interrupt (SWI)
The SWI is an executable instruction and a non-maskable interrupt. It is executed regardless of the state
of the I bit in the CCR. If the I bit is 0 (interrupts enabled), SWI executes after interrupts which were
pending when the SWI was fetched, but before interrupts generated after the SWI was fetched. The
interrupt service routine address is specified by the contents of memory locations $3FFC and $3FFD.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
29
Interrupts
Table 4-1. Vector Addresses for Interrupts and Resets
Priority
(1 = Highest)
Vector
Address
Function
Source
Local Mask
Global Mask
Power-on reset
RESET pin
Reset
None
None
1
$3FFE–$3FFF
COP watchdog
Same priority
as instruction
Software interrupt (SWI)
External interrupt
User code
None
None
None
I bit
$3FFC–$3FFD
$3FFA–$3FFB
IRQ pin
Port B pins
ICF bit
2
ICIE bit
OCIE bit
TOIE bit
Timer interrupts
OCF bit
TOF bit
I bit
3
$3FF8–$3FF9
TDRE bit
TC bit
TCIE bit
SCI interrupts
SPI interrupts
RDRF bit
OR bit
I bit
I bit
4
5
$3FF6–$3FF7
$3FF4–$3FF5
RIE bit
ILIE bit
SPIE bit
IDLE bit
SPIF bit
MODF bit
4.3 External Interrupt (IRQ or Port B)
If the interrupt mask bit (I bit) of the CCR is set, all maskable interrupts (internal and external) are disabled.
Clearing the I bit enables interrupts. The interrupt request is latched immediately following the falling edge
of IRQ. It is then synchronized internally and serviced as specified by the contents of $3FFA and $3FFB.
When any of the port B pullups are enabled, each pin becomes an additional external interrupt source
which is executed identically to the IRQ pin. Port B interrupts follow the same edge/edge-level selection
as the IRQ pin. The branch instructions BIL and BIH also respond to the port B interrupts in the same way
as the IRQ pin. See 7.4 Port C.
Either a level-sensitive and edge-sensitive trigger or an edge-sensitive-only trigger operation is
selectable. The sensitivity is software-controlled by the IRQ bit in the option register ($3FDF).
NOTE
The internal interrupt latch is cleared in the first part of the interrupt service
routine; therefore, one external interrupt pulse can be latched and serviced
as soon as the I bit is cleared.
4.4 Timer Interrupt
Three different timer interrupt flags cause a timer interrupt whenever they are set and enabled. The
interrupt flags are in the timer status register (TSR), and the enable bits are in the timer control register
(TCR). Any of these interrupts will vector to the same interrupt service routine, located at the address
specified by the contents of memory locations $3FF8 and $3FF9.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
30
Freescale Semiconductor
SCI Interrupt
4.5 SCI Interrupt
Five different SCI interrupt flags cause an SCI interrupt whenever they are set and enabled. The interrupt
flags are in the SCI status register (SCSR), and the enable bits are in the SCI control register 2 (SCCR2).
Any of these interrupts will vector to the same interrupt service routine, located at the address specified
by the contents of memory locations $3FF6 and $3FF7.
4.6 SPI Interrupt
Two different SPI interrupt flags cause an SPI interrupt whenever they are set and enabled. The interrupt
flags are in the SPI status register (SPSR), and the enable bits are in the SPI control register (SPCR).
Either of these interrupts will vector to the same interrupt service routine, located at the address specified
by the contents of memory locations $3FF4 and $3FF5.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
31
Interrupts
FROM RESET
I BIT
IN CCR
SET?
Y
N
IRQ OR PORT B
EXTERNAL
INTERRUPT
Y
Y
Y
Y
CLEAR IRQ
REQUEST LATCH
N
INTERNAL
TIMER
INTERRUPT
N
INTERNAL
SCI
INTERRUPT
N
INTERNAL
SPI
INTERRUPT
N
STACK
PC, X, A, CCR
FETCH NEXT
INSTRUCTION
SET I BIT IN
CC REGISTER
LOAD PC FROM:
SWI
INSTRUCTION
?
Y
SWI: $3FFC–$3FFD
IRQ: $3FFA–$3FFB
TIMER: $3FF8–$3FF9
SCI: $3FF6–$3FF7
SPI: $3FF4–$3FF5
N
RTI
INSTRUCTION
?
Y
N
RESTORE REGISTERS
FROM STACK:
CCR, A, X, PC
EXECUTE
INSTRUCTION
Figure 4-1. Interrupt Flowchart
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
32
Freescale Semiconductor
Chapter 5
Resets
5.1 Introduction
The MC68HC05C9A microcontroller unit (MCU) can be reset four ways:
•
•
•
•
Initial power-on reset function
Active low input to the RESET pin
Computer operating properly (COP)
Clock monitor
A reset immediately stops the operation of the instruction being executed, initializes some control bits,
and loads the program counter with a user-defined reset vector address. Figure 5-1 is a block diagram of
the reset sources.
CLOCK MONITOR
COP WATCHDOG
VDD
POWER-ON RESET
STOP
R
RST
TO CPU AND
SUBSYSTEMS
RESET
D
Q
RESET
LATCH
INTERNAL CLOCK
Figure 5-1. Reset Sources
5.2 Power-On Reset (POR)
A power-on reset (POR) occurs when a positive transition is detected on VDD. The power-on reset is
strictly for power turn-on conditions and should not be used to detect a drop in the power supply voltage.
There is a 4064 internal processor clock cycle (tCYC) oscillator stabilization delay after the oscillator
becomes active. The RESET pin will output a logic 0 during the 4064-cycle delay. If the RESET pin is low
after the end of this 4064-cycle delay, the MCU will remain in the reset condition until RESET is driven
high externally.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
33
Resets
5.3 RESET Pin
The MCU is reset when a logic 0 is applied to the RESET input for a period of one and one-half machine
cycles (tRL). However, to differentiate between an external reset and an internal reset (generated from the
COP or clock monitor), any externally driven reset must be active (logic 0) for at least eight tcyc
.
t
VDDR
V
DD
(2)
OSC1
4064
t
CYC
t
CYC
INTERNAL
(1)
CLOCK
INTERNAL
ADDRESS
(1)
NEW
PC
NEW
PC
NEW
PC
NEW
PC
BUS
$3FFE
$3FFF
$3FFE $3FFE
$3FFE
$3FFE
PCH
$3FFF
PCL
INTERNAL
DATA
(1)
BUS
NEW
PCH
NEW
PCL
OP
CODE
OP
CODE
DUMMY
DUMMY
t
RL
NOTE 4
RESET
NOTE 3
Notes:
1. Internal timing signal and bus information are not available externally.
2. OSC1 line is not meant to represent frequency. It is meant to represent only time.
3. The next rising edge of the internal processor clock following the rising edge of RESET initiates the reset sequence.
4. RESET outputs VOL during 4064 power-on reset cycles.
Figure 5-2. Power-On Reset and RESET
5.4 Computer Operating Properly (COP) Reset
This device includes a watchdog COP feature which guards against program run-away failures. A timeout
of the COP timer generates a COP reset. The COP watchdog is a software error detection system that
automatically times out and resets the MCU if not cleared periodically by a program sequence.
The COP is controlled with two registers, one to reset the COP timer and the other to enable and control
COP and clock monitor functions.
Figure 5-3 shows a block diagram of the COP.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
34
Freescale Semiconductor
Computer Operating Properly (COP) Reset
CM1
CM0
INTERNAL
CPU
CLOCK
÷4
÷2 ÷2 ÷2 ÷2 ÷2 ÷2 ÷2 ÷2
÷2 ÷2 ÷2 ÷2 ÷2 ÷2 ÷2 ÷2
215
217
16-BIT TIMER SYSTEM
213
219
COP
221
÷4
÷2
÷2
÷2
÷2
÷2
÷2
COPRST
Figure 5-3. COP Block Diagram
5.4.1 COP Reset Register
The COP reset register (COPRST), shown in Figure 5-4, is a write-only register used to reset the COP.
Address: $001D
Bit 7
6
5
4
3
2
1
Bit 0
Read:
Write:
Reset:
Bit 7
0
Bit 6
0
Bit 5
0
Bit 4
0
Bit 3
0
Bit 2
0
Bit 1
0
Bit 0
0
= Unimplemented
Figure 5-4. COP Reset Register (COPRST)
The sequence required to reset the COP timer is:
•
•
Write $55 to the COP reset register
Write $AA to the COP reset register
Both write operations must occur in the order listed, but any number of instructions may be executed
between the two write operations provided that the COP does not time out between the two writes. The
elapsed time between software resets must not be greater than the COP timeout period. If the COP
should time out, a system reset will occur and the device will be re-initialized in the same fashion as a
power-on reset or reset.
Reading this register does not return valid data.
5.4.2 COP Control Register
The COP control register (COPCR), shown in Figure 5-5, performs these functions:
•
•
•
Enables clock monitor function
Enables COP function
Selects timeout duration of COP timer
And flags these conditions:
•
•
COP timeout
Clock monitor reset
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
35
Resets
Address: $001E
Bit 7
6
0
5
0
4
COPF
U
3
CME
0
2
COPE
0
1
CM1
0
Bit 0
CM0
0
Read:
Write:
Reset:
0
0
0
0
= Unimplemented
U = Undetermined
Figure 5-5. COP Control Register (COPCR)
COPF — Computer Operating Properly Flag
Reading the COP control register clears COPF.
1 = COP or clock monitor reset has occurred.
0 = No COP or clock monitor reset has occurred.
CME — Clock Monitor Enable Bit
This bit is readable any time, but may be written only once.
1 = Clock monitor enabled
0 = Clock monitor disabled
COPE — COP Enable Bit
This bit is readable any time. COPE, CM1, and CM0 together may be written with a single write, only
once, after reset. This bit is cleared by reset.
1 = COP enabled
0 = COP disabled
CM1 — COP Mode Bit 1
Used in conjunction with CM0 to establish the COP timeout period, this bit is readable any time. COPE,
CM1, and CM0 together may be written with a single write, only once, after reset. This bit is cleared by
reset. See Table 5-1 for timeout period options.
CM0 — COP Mode Bit 0
Used in conjunction with CM1 to establish the COP timeout period, this bit is readable any time. COPE,
CM1, and CM0 together may be written with a single write, only once, after reset. This bit is cleared by
reset. See Table 5-1 for timeout period options.
Bits 7–5 — Not Used
These bits always read as 0.
Table 5-1. COP Timeout Period
Timeout Period
(fOSC = 2.0 MHz)
Timeout Period
(fOSC = 4.0 MHz)
fOP/215 Divide By
CM1
CM0
0
0
1
1
0
1
0
1
1
4
32.77 ms
131.07 ms
524.29 ms
2.097 s
16.38 ms
65.54 ms
262.14 ms
1.048 s
16
64
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
36
Freescale Semiconductor
COP During Wait Mode
5.5 COP During Wait Mode
The COP will continue to operate normally during wait mode. The software must pull the device out of
wait mode periodically and reset the COP to prevent a system reset.
5.6 COP During Stop Mode
Stop mode disables the oscillator circuit and thereby turns the clock off for the entire device. The COP
counter will be reset when stop mode is entered. If a reset is used to exit stop mode, the COP counter will
be reset after the 4064 cycles of delay after stop mode. If an IRQ is used to exit stop mode, the COP
counter will not be reset after the 4064-cycle delay and will have that many cycles already counted when
control is returned to the program.
In the event that an inadvertent STOP instruction is executed, the COP will not provide a reset. The clock
monitor function provides protection for this situation.
5.7 Clock Monitor Reset
The clock monitor circuit can provide a system reset if the clock stops for any reason, including stop mode.
When the CME bit in the COP control register is set, the clock monitor detects the absence of the internal
bus clock for a certain period of time. The timeout period is dependent on the processing parameters and
varies from 5 µs to 100 µs, which implies that systems using a bus clock rate of 200 kHz or less should
not use the clock monitor.
If a slow or absent clock is detected, the clock monitor causes a system reset. The reset is issued to the
external system via the bidirectional RESET pin for four bus cycles if the clock is slow or until the clocks
recover in the case where the clocks are absent.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
37
Resets
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
38
Freescale Semiconductor
Chapter 6
Low-Power Modes
6.1 Introduction
This section describes the low-power stop and wait modes.
6.2 Stop Mode
The STOP instruction places the microcontroller unit (MCU) in its lowest-power consumption mode. In
stop mode, the internal oscillator is turned off, halting all internal processing, including timer operation.
During stop mode, the TCR bits are altered to remove any pending timer interrupt request and to disable
any further timer interrupts. The timer prescaler is cleared. The I bit in the condition code register (CCR)
is cleared to enable external interrupts. All other registers and memory remain unaltered. All input/output
(I/O) lines remain unchanged. The processor can be brought out of stop mode only by an external
interrupt or reset. See Figure 6-1.
(1)
OSC1
t
RL
RESET
t
LIH
(2)
(3)
IRQ
IRQ
t
4064 t
ILCH
CYC
INTERNAL
CLOCK
INTERNAL
ADDRESS
BUS
$3FFE
$3FFE
$3FFE
$3FFE
$3FFF
Notes:
1. Represents the internal gating of the OSC1 pin
2. IRQ pin edge-sensitive mask option
RESET OR INTERRUPT
VECTOR FETCH
3. IRQ pin level and edge-sensitive mask option
Figure 6-1. Stop Recovery Timing Diagram
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
39
Low-Power Modes
6.3 Wait Mode
The WAIT instruction places the MCU in a low-power consumption mode, but wait mode consumes more
power than stop mode. All central processor unit (CPU) action is suspended, but the timer, serial
communications interface (SCI), serial peripheral interface (SPI), and the oscillator remain active. Any
interrupt or reset will cause the MCU to exit wait mode.
During wait mode, the I bit in the CCR is cleared to enable interrupts. All other registers, memory, and I/O
lines remain in their previous state. The timer, SCI, and SPI may be enabled to allow a periodic exit from
the wait mode.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
40
Freescale Semiconductor
Chapter 7
Input/Output Ports
7.1 Introduction
This section briefly describes the 31 input/output (I/O) lines arranged as one 7-bit and three 8-bit ports.
All of these port pins are programmable as either inputs or outputs under software control of the data
direction registers.
NOTE
To avoid a glitch on the output pins, write data to the I/O port data register
before writing a 1 to the corresponding data direction register.
7.2 Port A
Port A is an 8-bit bidirectional port which does not share any of its pins with other subsystems. The port
A data register is at $0000 and the data direction register (DDR) is at $0004. The contents of the port A
data register are indeterminate at initial power-up and must be initialized by user software. Reset does
not affect the data registers, but clears the data direction registers, thereby returning the ports to inputs.
Writing a 1 to a DDR bit sets the corresponding port bit to output mode. A block diagram of the port logic
is shown in Figure 7-1.
DATA DIRECTION
REGISTER BIT
INTERNAL
I/O
LATCHED OUTPUT
HC05
OUTPUT
PIN
DATA BIT
CONNECTIONS
INPUT
REG.
BIT
INPUT
I/O
Figure 7-1. Port A I/O Circuit
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
41
Input/Output Ports
7.3 Port B
Port B is an 8-bit bidirectional port. The port B data register is at $0001 and the data direction register
(DDR) is at $0005. The contents of the port B data register are indeterminate at initial powerup and must
be initialized by user software. Reset does not affect the data registers, but clears the data direction
registers, thereby returning the ports to inputs. Writing a one to a DDR bit sets the corresponding port pin
to output mode. Each of the port B pins has an optional external interrupt capability that can be enabled
by mask option.
The interrupt option also enables a pullup device when the pin is configured as an input. The edge or
edge- and level-sensitivity of the IRQ pin will also pertain to the enabled port B pins. Care needs to be
taken when using port B pins that have the pullup enabled. Before switching from an output to an input,
the data should be preconditioned to a 1 to prevent an interrupt from occurring. The port B logic is shown
in Figure 7-2.
7.4 Port C
Port C is an 8-bit bidirectional port. The port C data register is at $0002 and the data direction register
(DDR) is at $0006. The contents of the port C data register are indeterminate at initial powerup and must
be initialized by user software. Reset does not affect the data registers, but clears the data direction
registers, thereby returning the ports to inputs. Writing a 1 to a DDR bit sets the corresponding port bit to
output mode. PC7 has a high current sink and source capability. Figure 7-1 is also applicable to port C.
7.5 Port D
Port D is a 7-bit bidirectional port. Four of its pins are shared with the SPI subsystem and two more are
shared with the SCI subsystem. The port D data register is at $0003 and the data direction register is at
$0007. The contents of the port D data register are indeterminate at initial powerup and must be initialized
by user software. During reset all seven bits become valid input ports because the DDR bits are cleared
and the special function output drivers associated with the SCI and SPI subsystems are disabled, thereby
returning the ports to inputs. Writing a 1 to a DDR bit sets the corresponding port bit to output mode.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
42
Freescale Semiconductor
Port D
VDD
VDD
DISABLED
ENABLED
PORT B EXTERNAL INTERRUPT
MASK OPTION
READ $0005
WRITE $0005
RESET
DATA DIRECTION
REGISTER B
BIT DDRB7
PORT B DATA
REGISTER
BIT PB7
WRITE $0001
READ $0001
PBX
EDGE ONLY
SOFTWARE CONTROLLED OPTION
EDGE AND LEVEL
VDD
D
C
Q
Q
EXTERNAL
INTERRUPT
REQUEST
FROM OTHER
PORT B PINS
R
I BIT
FROM CCR
IRQ
RESET
EXTERNAL INTERRUPT VECTOR FETCH
Figure 7-2. Port B I/O Logic
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
43
Input/Output Ports
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
44
Freescale Semiconductor
Chapter 8
Capture/Compare Timer
8.1 Introduction
This section describes the operation of the 16-bit capture/compare timer. Figure 8-1 shows the structure
of the capture/compare subsystem.
INTERNAL BUS
INTERNAL
PROCESSOR
CLOCK
HIGH LOW
BYTE BYTE
8-BIT
BUFFER
÷4
HIGH LOW
BYTE BYTE
OUTPUT
COMPARE
REGISTER
HIGH
BYTE
$16
$17
LOW
BYTE
INPUT
CAPTURE
REGISTER
16-BIT FREE
RUNNING
COUNTER
$14
$15
$18
$19
COUNTER
ALTERNATE
REGISTER
$1A
$1B
EDGE
DETECT
CIRCUIT
OVERFLOW
DETECT
CIRCUIT
OUTPUT
COMPARE
CIRCUIT
D
CLK
Q
OUTPUT
LEVEL
REG.
TIMER
STATUS
REG.
$13
ICF OCF TOF
C
RESET
TIMER
CONTROL
REG.
$12
ICIE OCIE TOIE IEDG OLVL
OUTPUT EDGE
LEVEL INPUT
(TCMP) (TCAP)
INTERRUPT CIRCUIT
Figure 8-1. Capture/Compare Timer Block Diagram
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
45
Capture/Compare Timer
8.2 Timer Operation
The core of the capture/compare timer is a 16-bit free-running counter. The counter provides the timing
reference for the input capture and output compare functions. The input capture and output compare
functions provide a means to latch the times at which external events occur, to measure input waveforms,
and to generate output waveforms and timing delays. Software can read the value in the 16-bit
free-running counter at any time without affecting the counter sequence.
Because of the 16-bit timer architecture, the input/output (I/O) registers for the input capture and output
compare functions are pairs of 8-bit registers.
Because the counter is 16 bits long and preceded by a fixed divide-by-4 prescaler, the counter rolls over
every 262,144 internal clock cycles. Timer resolution with a 4-MHz crystal is 2 µs.
8.2.1 Input Capture
The input capture function is a means to record the time at which an external event occurs. When the
input capture circuitry detects an active edge on the TCAP pin, it latches the contents of the timer registers
into the input capture registers. The polarity of the active edge is programmable.
Latching values into the input capture registers at successive edges of the same polarity measures the
period of the input signal on the TCAP pin. Latching values into the input capture registers at successive
edges of opposite polarity measures the pulse width of the signal.
8.2.2 Output Compare
The output compare function is a means of generating an output signal when the 16-bit counter reaches
a selected value. Software writes the selected value into the output compare registers. On every fourth
internal clock cycle the output compare circuitry compares the value of the counter to the value written in
the output compare registers. When a match occurs, the timer transfers the programmable output level
bit (OLVL) from the timer control register to the TCMP pin.
The programmer can use the output compare register to measure time periods, to generate timing delays,
or to generate a pulse of specific duration or a pulse train of specific frequency and duty cycle on the
TCMP pin.
8.3 Timer I/O Registers
These I/O registers control and monitor timer operation:
•
•
•
•
•
•
Timer control register (TCR)
Timer status register (TSR)
Timer registers (TRH and TRL)
Alternate timer registers (ATRH and ATRL)
Input capture registers (ICRH and ICRL)
Output compare registers (OCRH and OCRL)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
46
Freescale Semiconductor
Timer I/O Registers
8.3.1 Timer Control Register
The timer control register (TCR), shown in Figure 8-2, performs these functions:
•
•
•
•
•
Enables input capture interrupts
Enables output compare interrupts
Enables timer overflow interrupts
Controls the active edge polarity of the TCAP signal
Controls the active level of the TCMP output
Address: $0012
Bit 7
ICIE
0
6
OCIE
0
5
TOIE
0
4
0
3
0
2
0
1
IEDG
U
Bit 0
OLVL
0
Read:
Write:
Reset:
0
0
0
= Unimplemented
U = Undetermined
Figure 8-2. Timer Control Register (TCR)
ICIE — Input Capture Interrupt Enable Bit
This read/write bit enables interrupts caused by an active signal on the TCAP pin. Reset clears the
ICIE bit.
1 = Input capture interrupts enabled
0 = Input capture interrupts disabled
OCIE — Output Compare Interrupt Enable Bit
This read/write bit enables interrupts caused by an active signal on the TCMP pin. Reset clears the
OCIE bit.
1 = Output compare interrupts enabled
0 = Output compare interrupts disabled
TOIE — Timer Overflow Interrupt Enable Bit
This read/write bit enables interrupts caused by a timer overflow. Reset clears the TOIE bit.
1 = Timer overflow interrupts enabled
0 = Timer overflow interrupts disabled
IEDG — Input Edge Bit
The state of this read/write bit determines whether a positive or negative transition on the TCAP pin
triggers a transfer of the contents of the timer register to the input capture register. Resets have no
effect on the IEDG bit.
1 = Positive edge (low to high transition) triggers input capture.
0 = Negative edge (high to low transition) triggers input capture.
OLVL — Output Level Bit
The state of this read/write bit determines whether a logic 1 or logic 0 appears on the TCMP pin when
a successful output compare occurs. Reset clears the OLVL bit.
1 = TCMP goes high on output compare.
0 = TCMP goes low on output compare.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
47
Capture/Compare Timer
8.3.2 Timer Status Register
The timer status register (TSR), shown in Figure 8-3, contains flags to signal these conditions:
•
•
•
An active signal on the TCAP pin, transferring the contents of the timer registers to the input
capture registers
A match between the 16-bit counter and the output compare registers, transferring the OLVL bit to
the TCMP pin
A timer roll over from $FFFF to $0000
Address: $0013
Bit 7
ICF
6
5
4
0
3
0
2
0
1
0
Bit 0
0
Read:
Write:
Reset:
OCF
TOF
U
U
U
0
0
0
0
0
= Unimplemented
U = Unaffected
Figure 8-3. Timer Status Register
ICF — Input Capture Flag
The ICF bit is set automatically when an edge of the selected polarity occurs on the TCAP pin. Clear
the ICF bit by reading the timer status register with ICF set and then reading the low byte ($0015) of
the input capture registers. Resets have no effect on ICF.
OCF — Output Compare Flag
The OCF bit is set automatically when the value of the timer registers matches the contents of the
output compare registers. Clear the OCF bit by reading the timer status register with OCF set and then
reading the low byte ($0017) of the output compare registers. Resets have no effect on OCF.
TOF — Timer Overflow Flag
The TOF bit is set automatically when the 16-bit counter rolls over from $FFFF to $0000. Clear the
TOF bit by reading the timer status register with TOF set, and then reading the low byte ($0019) of the
timer registers. Resets have no effect on TOF.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
48
Freescale Semiconductor
Timer I/O Registers
8.3.3 Timer Registers
The timer registers (TRH and TRL), shown in Figure 8-4, contain the current high and low bytes of the
16-bit counter. Reading TRH before reading TRL causes TRL to be latched until TRL is read. Reading
TRL after reading the timer status register clears the timer overflow flag (TOF). Writing to the timer
registers has no effect.
Address: $0018 — TRH
Bit 7
6
5
4
3
2
1
Bit 0
Bit 8
Read:
Write
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Reset:
1
1
1
1
1
1
1
1
Address: $0019 — TRL
Bit 7
6
5
4
3
2
1
Bit 0
Bit 0
Read:
Write:
Reset:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
1
1
1
1
1
1
0
0
= Unimplemented
Figure 8-4. Timer Registers (TRH and TRL)
8.3.4 Alternate Timer Registers
The alternate timer registers (ATRH and ATRL), shown in Figure 8-5, contain the current high and low
bytes of the 16-bit counter. Reading ATRH before reading ATRL causes ATRL to be latched until ATRL
is read. Reading ATRL has no effect on the timer overflow flag (TOF). Writing to the alternate timer
registers has no effect.
Address: $001A — ATRH
Bit 7
6
5
4
3
2
1
Bit 0
Bit 8
Read:
Write:
Reset:
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
1
1
1
1
1
1
1
1
Address: $001B — ATRL
Bit 7
6
5
4
3
2
1
Bit 0
Bit 0
Read:
Write:
Reset:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
1
1
1
1
1
1
0
0
= Unimplemented
Figure 8-5. Alternate Timer Registers (ATRH and ATRL)
NOTE
To prevent interrupts from occurring between readings of ATRH and ATRL,
set the interrupt flag in the condition code register before reading ATRH,
and clear the flag after reading ATRL.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
49
Capture/Compare Timer
8.3.5 Input Capture Registers
When a selected edge occurs on the TCAP pin, the current high and low bytes of the 16-bit counter are
latched into the input capture registers. Reading ICRH before reading ICRL inhibits further capture until
ICRL is read. Reading ICRL after reading the status register clears the input capture flag (ICF). Writing to
the input capture registers has no effect.
Address: $0014 — ICRH
Bit 7
6
5
4
3
2
1
Bit 0
Bit 8
Read:
Write:
Reset:
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Unaffected by reset
Address: $0015 — ICRL
Bit 7
6
5
4
3
2
1
Bit 0
Read:
Write:
Reset:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Unaffected by reset
= Unimplemented
Figure 8-6. Input Capture Registers (ICRH and ICRL)
NOTE
To prevent interrupts from occurring between readings of ICRH and ICRL,
set the interrupt flag in the condition code register before reading ICRH, and
clear the flag after reading ICRL.
8.3.6 Output Compare Registers
When the value of the 16-bit counter matches the value in the output compare registers, the planned
TCMP pin action takes place. Writing to OCRH before writing to OCRL inhibits timer compares until OCRL
is written. Reading or writing to OCRL after the timer status register clears the output compare flag (OCF).
Address: $0016 — OCRH
Bit 7
6
5
4
3
2
1
Bit 0
Write:
Read:
Reset:
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Unaffected by reset
Address: $0017 — OCRL
Bit 7
6
5
4
3
2
1
Bit 0
Bit 0
Write:
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Read:
Reset:
Unaffected by reset
Figure 8-7. Output Compare Registers (OCRH and OCRL)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
50
Freescale Semiconductor
Timer During Wait Mode
To prevent OCF from being set between the time it is read and the time the output compare registers are
updated, use this procedure:
1. Disable interrupts by setting the I bit in the CCR.
2. Write to OCRH. Compares are now inhibited until OCRL is written.
3. Clear bit OCF by reading timer status register (TSR).
4. Enable the output compare function by writing to OCRL.
5. Enable interrupts by clearing the I bit in the CCR.
8.4 Timer During Wait Mode
The central processor unit (CPU) clock halts during wait mode, but the timer remains active. If interrupts
are enabled, a timer interrupt will cause the processor to exit wait mode.
8.5 Timer During Stop Mode
In stop mode, the timer stops counting and holds the last count value if STOP is exited by an interrupt. If
STOP is exited by reset, the counters are forced to $FFFC. During STOP, if at least one valid input
capture edge occurs at the TCAP pins, the input capture detect circuit is armed. This does not set any
timer flags or wake up the microcontroller unit (MCU). But if an interrupt is used to exit stop mode, there
is an active input capture flag and data from the first valid edge that occurred during the stop mode. If
reset is used to exit stop mode, then no input capture flag or data remains, even if a valid input capture
edge occurred.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
51
Capture/Compare Timer
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
52
Freescale Semiconductor
Chapter 9
Serial Communications Interface (SCI)
9.1 Introduction
This section describes the on-chip asynchronous serial communications interface (SCI). The SCI allows
full-duplex, asynchronous, RS232 or RS422 serial communication between the microcontroller unit
(MCU) and remote devices, including other MCUs. The transmitter and receiver of the SCI operate
independently, although they use the same baud rate generator.
9.2 Features
Features of the SCI include:
•
•
•
•
•
•
Standard mark/space non-return-to-zero format
Full-duplex operation
32 programmable baud rates
Programmable 8-bit or 9-bit character length
Separately enabled transmitter and receiver
Two receiver wakeup methods:
–
–
Idle line wakeup
Address mark wakeup
•
Interrupt-driven operation capability with five interrupt flags:
–
–
–
–
–
Transmitter data register empty
Transmission complete
Transmission data register full
Receiver overrun
Idle receiver input
•
•
Receiver framing error detection
1/16 bit-time noise detection
NOTE
The serial communications data register (SCI SCDR) is controlled by the
internal R/W signal. It is the transmit data register when written to and the
receive data register when read.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
53
Serial Communications Interface (SCI)
INTERNAL BUS
SCI INTERRUPT
+
TRANSMIT
DATA
REGISTER
RECEIVE
DATA
REGISTER
$0011
$0011
$000F
SCCR2
&
&
&
&
TIE
TCIE
RIE
ILIE
TE
RE
SBK
RWU
7
6
5
4
3
2
1
0
TRANSMIT
DATA SHIFT
REGISTER
RECEIVE
DATA SHIFT
REGISTER
TDO
PIN
RDI
PIN
+
5
SCSR
$0010
1
7
6
4
3
2
TRDE
TC
RDRF IDLE
OR
NF
FE
WAKEUP
UNIT
7
TE
SBK
FLAG
CONTROL
TRANSMITTER
CONTROL
RECEIVER
CONTROL
RECEIVER
CLOCK
7
R8
6
T8
5
4
M
3
WAKE
2
1
0
SCCR1
$000E
Figure 9-1. Serial Communications Interface Block Diagram
9.3 SCI Receiver Features
Features of the SCI receiver include:
•
•
•
•
•
•
Receiver wakeup function (idle line or address bit)
Idle line detection
Framing error detection
Noise detection
Overrun detection
Receiver data register full flag
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
54
Freescale Semiconductor
SCI Transmitter Features
9.4 SCI Transmitter Features
Features of the SCI transmitter include:
•
•
•
Transmit data register empty flag
Transmit complete flag
Send break
9.5 Functional Description
A block diagram of the SCI is shown in Figure 9-1. Option bits in serial control register1 (SCCR1) select
the wakeup method (WAKE bit) and data word length (M bit) of the SCI. SCCR2 provides control bits that
individually enable the transmitter and receiver, enable system interrupts, and provide the wakeup enable
bit (RWU) and the send break code bit (SBK). Control bits in the baud rate register (BAUD) allow the user
to select one of 32 different baud rates for the transmitter and receiver.
Data transmission is initiated by writing to the serial communications data register (SCDR). Provided the
transmitter is enabled, data stored in the SCDR is transferred to the transmit data shift register. This
transfer of data sets the transmit data register empty flag (TDRE) in the SCI status register (SCSR) and
generates an interrupt (if transmitter interrupts are enabled). The transfer of data to the transmit data shift
register is synchronized with the bit rate clock (see Figure 9-2). All data is transmitted least significant bit
first. Upon completion of data transmission, the transmission complete flag (TC) in the SCSR is set
(provided no pending data, preamble, or break is to be sent) and an interrupt is generated (if the transmit
complete interrupt is enabled). If the transmitter is disabled, and the data, preamble, or break (in the
transmit data shift register) has been sent, the TC bit will be set also. This will also generate an interrupt
if the transmission complete interrupt enable bit (TCIE) is set. If the transmitter is disabled during a
transmission, the character being transmitted will be completed before the transmitter gives up control of
the TDO pin.
SCP0–SCP1
SCR0–SCR2
SCI TRANS
CLOCK (TX)
SCI PRESCALER
SELECT
CONTROL
SCI RATE
SELECT
CONTROL
OSC FREQ
(fOSC
SCI RECEIVE
CLOCK (RT)
BUS FREQ
(fOP
÷ 2
÷ 16
)
)
N
M
Figure 9-2. Rate Generator Division
When SCDR is read, it contains the last data byte received, provided that the receiver is enabled. The
receive data register full flag bit (RDRF) in the SCSR is set to indicate that a data byte has been
transferred from the input serial shift register to the SCDR; this will cause an interrupt if the receiver
interrupt is enabled. The data transfer from the input serial shift register to the SCDR is synchronized by
the receiver bit rate clock. The OR (overrun), NF (noise), or FE (framing) error flags in the SCSR may be
set if data reception errors occurred.
An idle line interrupt is generated if the idle line interrupt is enabled and the IDLE bit (which detects idle
line transmission) in SCSR is set. This allows a receiver that is not in the wakeup mode to detect the end
of a message, or the preamble of a new message, or to re-synchronize with the transmitter. A valid
character must be received before the idle line condition or the IDLE bit will not be set and idle line
interrupt will not be generated.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
55
Serial Communications Interface (SCI)
9.6 Data Format
Receive data or transmit data is the serial data that is transferred to the internal data bus from the receive
data input pin (RDI) or from the internal bus to the transmit data output pin (TDO). The non-return-to-zero
(NRZ) data format shown in Figure 9-3 is used and must meet these criteria:
•
•
•
•
The idle line is brought to a logic 1 state prior to transmission/ reception of a character.
A start bit (logic 0) is used to indicate the start of a frame.
The data is transmitted and received least significant bit first.
A stop bit (logic 1) is used to indicate the end of a frame. A frame consists of a start bit, a character
of eight or nine data bits, and a stop bit.
•
A break is defined as the transmission or reception of a low (logic 0) for at least one complete frame
time.
CONTROL BIT M SELECTS
8- OR 9-BIT DATA
IDLE LINE
0
1
2
3
4
5
6
7
8
0
START
STOP
START
Figure 9-3. Data Format
9.7 Receiver Wakeup Operation
The receiver logic hardware also supports a receiver wakeup function which is intended for systems
having more than one receiver. With this function a transmitting device directs messages to an individual
receiver or group of receivers by passing addressing information as the initial byte(s) of each message.
The wakeup function allows receivers not addressed to remain in a dormant state for the remainder of the
unwanted message. This eliminates any further software overhead to service the remaining characters of
the unwanted message and thus improves system performance.
The receiver is placed in wakeup mode by setting the receiver wakeup bit (RWU) in the SCCR2 register.
While RWU is set, all of the receiver-related status flags (RDRF, IDLE, OR, NF, and FE) are inhibited
(cannot become set).
NOTE
The idle line detect function is inhibited while the RWU bit is set. Although
RWU may be cleared by a software write to SCCR2, it would be unusual to
do so.
Normally, RWU is set by software and is cleared automatically in hardware by one of these methods: idle
line wakeup or address mark wakeup.
9.7.1 Idle Line Wakeup
In idle line wakeup mode, a dormant receiver wakes up as soon as the RDI line becomes idle. Idle is
defined as a continuous logic high level on the RDI line for 10 (or 11) full bit times. Systems using this
type of wakeup must provide at least one character time of idle between messages to wake up sleeping
receivers, but must not allow any idle time between characters within a message.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
56
Freescale Semiconductor
Receive Data In (RDI)
9.7.2 Address Mark Wakeup
In address mark wakeup, the most significant bit (MSB) in a character is used to indicate whether it is an
address (logic 1) or data (logic 0) character. Sleeping receivers will wake up whenever an address
character is received. Systems using this method for wakeup would set the MSB of the first character of
each message and leave it clear for all other characters in the message. Idle periods may be present
within messages and no idle time is required between messages for this wakeup method.
9.8 Receive Data In (RDI)
Receive data is the serial data that is applied through the input line and the SCI to the internal bus. The
receiver circuitry clocks the input at a rate equal to 16 times the baud rate. This time is referred to as the
RT rate in Figure 9-4 and as the receiver clock in Figure 9-6.
16X INTERNAL SAMPLING CLOCK
RT CLOCK EDGES FOR ALL THREE EXAMPLES
3RT
1RT
START
2RT
4RT
5RT
6RT 7RT
IDLE
RDI
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
START
NOISE
1
RDI
RDI
1
0
0
0
0
NOISE
START
1
1
1
0
1
1
1
1
0
0
0
Figure 9-4. SCI Examples of Start Bit Sampling Techniques
The receiver clock generator is controlled by the baud rate register; however, the SCI is synchronized by
the start bit, independent of the transmitter.
Once a valid start bit is detected, the start bit, each data bit, and the stop bit are sampled three times at
RT intervals 8RT, 9RT, and 10RT
(1RT is the position where the bit is expected to start), as shown in Figure 9-5. The value of the bit is
determined by voting logic which takes the value of the majority of the samples. A noise flag is set when
all three samples on a valid start bit or data bit or the stop bit do not agree.
PREVIOUS BIT
SAMPLES
NEXT BIT
RDI
16RT 1RT
8RT
9RT
10RT
16RT 1RT
Figure 9-5. SCI Sampling Technique Used on All Bits
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
57
Serial Communications Interface (SCI)
9.9 Start Bit Detection
When the input (idle) line is detected low, it is tested for three more sample times (referred to as the start
edge verification samples in Figure 9-4). If at least two of these three verification samples detect a logic
0, a valid start bit has been detected; otherwise, the line is assumed to be idle. A noise flag is set if all
three verification samples do not detect a logic 0. Thus, a valid start bit could be assumed with a set noise
flag present.
If a framing error has occurred without detection of a break (10 0s for 8-bit format or 11 0s for 9-bit format),
the circuit continues to operate as if there actually was a stop bit, and the start edge will be placed
artificially. The last bit received in the data shift register is inverted to a logic 1, and the three logic 1 start
qualifiers (shown in Figure 9-4) are forced into the sample shift register during the interval when detection
of a start bit is anticipated (see Figure 9-6); therefore, the start bit will be accepted no sooner than it is
anticipated.
DATA
EXPECTED STOP
DATA
ARTIFICIAL EDGE
START BIT
RDI
DATA SAMPLES
a) Case 1: Receive Line Low During Artificial Edge
DATA
EXPECTED STOP
START EDGE
DATA
RDI
START BIT
DATA SAMPLES
b) Case 2: Receive Line High During Expected Start Edge
Figure 9-6. SCI Artificial Start Following a Frame Error
If the receiver detects that a break (RDRF = 1, FE = 1, receiver data register = $003B) produced the
framing error, the start bit will not be artificially induced and the receiver must actually detect a logic 1
before the start bit can be recognized (see Figure 9-7).
EXPECTED STOP
BREAK
DETECTED AS VALID START EDGE
START BIT
RDI
START START EDGE
QUALIFIERS VERIFICATION
SAMPLES
DATA SAMPLES
Figure 9-7. SCI Start Bit Following a Break
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
58
Freescale Semiconductor
Transmit Data Out (TDO)
9.10 Transmit Data Out (TDO)
Transmit data is the serial data from the internal data bus that is applied through the SCI to the output
line. Data format is as discussed in 9.6 Data Format and shown in Figure 9-3. The transmitter generates
a bit time by using a derivative of the RT clock, thus producing a transmission rate equal to 1/16th that of
the receiver sample clock.
9.11 SCI I/O Registers
These I/O registers control and monitor SCI operation:
•
•
•
•
SCI data register (SCDR)
SCI control register 1 (SCCR1)
SCI control register 2 (SCCR2)
SCI status register (SCSR)
9.11.1 SCI Data Register
The SCI data register (SCDR), shown in Figure 9-8, is the buffer for characters received and for
characters transmitted.
Address: $0011
Bit 7
6
5
4
3
2
1
Bit 0
Read:
Write:
Reset:
SCD7
SDC6
SCD5
SCD4
SCD3
SCD2
SCD1
SCD0
Unaffected by reset
Figure 9-8. SCI Data Register (SCDR)
9.11.2 SCI Control Register 1
The SCI control register 1 (SCCR1), shown in Figure 9-9, has these functions:
•
•
•
Stores ninth SCI data bit received and ninth SCI data bit transmitted
Controls SCI character length
Controls SCI wakeup method
Address: $000E
Bit 7
R8
U
6
5
0
4
M
U
3
WAKE
U
2
0
1
0
Bit 0
Read:
Write:
Reset:
T8
U
0
= Unimplemented
U = Undetermined
Figure 9-9. SCI Control Register 1 (SCCR1)
R8 — Bit 8 (Received)
When the SCI is receiving 9-bit characters, R8 is the ninth bit of the received character. R8 receives
the ninth bit at the same time that the SCDR receives the other eight bits. Resets have no effect on the
R8 bit.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
59
Serial Communications Interface (SCI)
T8 — Bit 8 (Transmitted)
When the SCI is transmitting 9-bit characters, T8 is the ninth bit of the transmitted character. T8 is
loaded into the transmit shift register at the same time that the SCDR is loaded into the transmit
register. Resets have no effect on the T8 bit.
M — Character Length Bit
This read/write bit determines whether SCI characters are 8 bits long or 9 bits long. The ninth bit can
be used as an extra stop bit, as a receiver wakeup signal, or as a mark or space parity bit. Resets have
no effect on the M bit.
1 = 9-bit SCI characters
0 = 8-bit SCI characters
WAKE — Wakeup Method Bit
This read/write bit determines which condition wakes up the SCI: a logic 1 (address mark) in the most
significant bit (MSB) position of a received character or an idle condition on the PD0/RDI pin. Resets
have no effect on the WAKE bit.
1 = Address mark wakeup
0 = Idle line wakeup
9.11.3 SCI Control Register 2
SCI control register 2 (SCCR2), shown in Figure 9-10, has these functions:
•
•
•
•
•
•
Enables the SCI receiver and SCI receiver interrupts
Enables the SCI transmitter and SCI transmitter interrupts
Enables SCI receiver idle interrupts
Enables SCI transmission complete interrupts
Enables SCI wakeup
Transmits SCI break characters
Address: $000F
Bit 7
TIE
0
6
TCIE
0
5
RIE
0
4
ILIE
0
3
TE
0
2
RE
0
1
RWU
0
Bit 0
SBK
0
Read:
Write:
Reset:
Figure 9-10. SCI Control Register 2 (SCCR2)
TIE — Transmit Interrupt Enable Bit
This read/write bit enables SCI interrupt requests when the TDRE flag becomes set. Resets clear the
TIE bit.
1 = TDRE interrupt requests enabled
0 = TDRE interrupt requests disabled
TCIE — Transmission Complete Interrupt Enable Bit
This read/write bit enables SCI interrupt requests when the TC flag becomes set. Resets clear the
TCIE bit.
1 = TC interrupt requests enabled
0 = TC interrupt requests disabled
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
60
Freescale Semiconductor
SCI I/O Registers
RIE — Receiver Interrupt Enable Bit
This read/write bit enables SCI interrupt requests when the RDRF flag or the OR flag becomes set.
Resets clear the RIE bit.
1 = RDRF interrupt requests enabled
0 = RDRF interrupt requests disabled
ILIE — Idle Line Interrupt Enable Bit
This read/write bit enables SCI interrupt requests when the IDLE bit becomes set. Resets clear the
ILIE bit.
1 = IDLE interrupt requests enabled
0 = IDLE interrupt requests disabled
TE — Transmitter Enable Bit
Setting this read/write bit begins the transmission by sending a preamble of 10 or 11 logic 1s from the
transmit shift register to the PD1/TDO pin. Resets clear the TE bit.
1 = Transmission enabled
0 = Transmission disabled
RE — Receiver Enable Bit
Setting this read/write bit enables the receiver. Clearing the RE bit disables the receiver and receiver
interrupts but does not affect the receiver interrupt flags. Resets clear the RE bit.
1 = Receiver enabled
0 = Receiver disabled
RWU — Receiver Wakeup Enable Bit
This read/write bit puts the receiver in a standby state. Typically, data transmitted to the receiver clears
the RWU bit and returns the receiver to normal operation. The WAKE bit in SCCR1 determines
whether an idle input or an address mark brings the receiver out of standby state. Reset clears the
RWU bit.
1 = Standby state
0 = Normal operation
SBK — Send Break Bit
Setting this read/write bit continuously transmits break codes in the form of 10-bit or 11-bit groups of
logic 0s. Clearing the SBK bit stops the break codes and transmits a logic 1 as a start bit. Reset clears
the SBK bit.
1 = Break codes being transmitted
0 = No break codes being transmitted
9.11.4 SCI Status Register
•
•
•
•
•
•
•
The SCI status register (SCSR), shown in Figure 9-11, contains flags to signal these conditions:
Transfer of SCDR data to transmit shift register complete
Transmission complete
Transfer of receive shift register data SCDR complete
Receiver input idle
Noisy data
Framing error
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
61
Serial Communications Interface (SCI)
Address:
$0010
Bit 7
6
5
4
3
2
1
Bit 0
—
Read:
Write:
Reset:
TDRE
TC
RDRF
IDLE
OR
NF
FE
1
1
0
0
0
0
0
= Unimplemented
Figure 9-11. SCI Status Register (SCSR)
TDRE — Transmit Data Register Empty Flag
This clearable, read-only flag is set when the data in the SCDR transfers to the transmit shift register.
TDRE generates an interrupt request if the TIE bit in SCCR2 is also set. Clear the TDRE bit by reading
the SCSR with TDRE set and then writing to the SCDR. Reset sets the TDRE bit. Software must
initialize the TDRE bit to logic 0 to avoid an instant interrupt request when turning the transmitter on.
1 = SCDR data transferred to transmit shift register
0 = SCDR data not transferred to transmit shift register
TC — Transmission Complete Flag
This clearable, read-only flag is set when the TDRE bit is set, and no data, preamble, or break
character is being transmitted. TDRE generates an interrupt request if the TCIE bit in SCCR2 is also
set. Clear the TC bit by reading the SCSR with TC set, and then writing to the SCDR. Reset sets the
TC bit. Software must initialize the TC bit to logic 0 to avoid an instant interrupt request when turning
the transmitter on.
1 = No transmission in progress
0 = Transmission in progress
RDRF — Receive Data Register Full Flag
This clearable, read-only flag is set when the data in the receive shift register transfers to the SCI data
register. RDRF generates an interrupt request if the RIE bit in the SCCR2 is also set. Clear the RDRF
bit by reading the SCSR with RDRF set and then reading the SCDR.
1 = Received data available in SCDR
0 = Received data not available in SCDR
IDLE — Receiver Idle Flag
This clearable, read-only flag is set when 10 or 11 consecutive logic 1s appear on the receiver input.
IDLE generates an interrupt request if the ILIE bit in the SCCR2 is also set. Clear the ILIE bit by reading
the SCSR with IDLE set and then reading the SCDR.
1 = Receiver input idle
0 = Receiver input not idle
OR — Receiver Overrun Flag
This clearable, read-only flag is set if the SCDR is not read before the receive shift register receives
the next word. OR generates an interrupt request if the RIE bit in the SCCR2 is also set. The data in
the shift register is lost, but the data already in the SCDR is not affected. Clear the OR bit by reading
the SCSR with OR set and then reading the SCDR.
1 = Receive shift register full and RDRF = 1
0 = No receiver overrun
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
62
Freescale Semiconductor
SCI I/O Registers
NF — Receiver Noise Flag
This clearable, read-only flag is set when noise is detected in data received in the SCI data register.
Clear the NF bit by reading the SCSR and then reading the SCDR.
1 = Noise detected in SCDR
0 = No noise detected in SCDR
FE — Receiver Framing Error Flag
This clearable, read-only flag is set when there is a logic 0 where a stop bit should be in the character
shifted into the receive shift register. If the received word causes both a framing error and an overrun
error, the OR flag is set and the FE flag is not set. Clear the FE bit by reading the SCSR and then
reading the SCDR.
1 = Framing error
0 = No framing error
9.11.5 Baud Rate Register
The baud rate register (BAUD), shown in Figure 9-12, selects the baud rate for both the receiver and the
transmitter.
Address: $000D
Bit 7
6
5
SCP1
0
4
3
2
SCR2
U
1
SCR1
U
Bit 0
SCR0
U
Read:
Write:
Reset:
SCP0
—
—
0
—
= Unimplemented
U = Unaffected
Figure 9-12. Baud Rate Register (BAUD)
SCP1 — SCP0–SCI Prescaler Select Bits
These read/write bits control prescaling of the baud rate generator clock, as shown in Table 9-1. Reset
clears both SCP1 and SCP0.
Table 9-1. Baud Rate Generator Clock Prescaling
SCP1 and SCP0
Baud Rate Generator Clock
Internal clock ÷ 1
0 0
0 1
1 0
1 1
Internal clock ÷ 3
Internal clock ÷ 4
Internal clock ÷ 13
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
63
Serial Communications Interface (SCI)
SCR2 — SCR0–SCI Baud Rate Select Bits
These read/write bits select the SCI baud rate, as shown in Table 9-2. Resets have no effect on the
SCR2–SCR0 bits.
Table 9-2. Baud Rate Selection
SCR2, SCR1, and SCR0
SCI Baud Rate (Baud)
Prescaled clock ÷ 1
Prescaled clock ÷ 2
Prescaled clock ÷ 4
Prescaled clock ÷ 8
Prescaled clock ÷ 16
Prescaled clock ÷ 32
Prescaled clock ÷ 64
Prescaled clock ÷ 128
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
64
Freescale Semiconductor
Chapter 10
Serial Peripheral Interface (SPI)
10.1 Introduction
The serial peripheral interface (SPI) is an interface built into the device which allows several M68HC05
microcontroller units (MCU), or M68HC05 MCU plus peripheral devices, to be interconnected within a
single printed circuit board. In an SPI, separate wires are required for data and clock. In the SPI format,
the clock is not included in the data stream and must be furnished as a separate signal. An SPI system
may be configured in one containing one master MCU and several slave MCUs or in a system in which
an MCU is capable of being a master or a slave.
10.2 Features
SPI features include:
•
•
•
•
•
•
•
•
•
Full-duplex, 4-wire synchronous transfers
Master or slave operation
Bus frequency divided by 2 (maximum) master bit frequency
Bus frequency (maximum) slave bit frequency
Four programmable master bit rates
Programmable clock polarity and phase
End-of-transmission interrupt flag
Write collision flag protection
Master-master mode fault protection capability
10.3 SPI Signal Description
The four basic signals (MOSI, MISO, SCK, and SS) are described here. Each signal function is described
for both the master and slave modes.
NOTE
Any SPI output line has to have its corresponding data direction register bit
set. If this bit is clear, the line is disconnected from the SPI logic and
becomes a general-purpose input line. When the SPI is enabled, any SPI
input line is forced to act as an input regardless of what is in the
corresponding data direction register bit.
10.3.1 Master In/Slave Out (MISO)
The MISO line is configured as an input in a master device and as an output in a slave device. It is one
of the two lines that transfer serial data in one direction, with the most significant bit sent first. The MISO
line of a slave device is placed in the high-impedance state if the slave is not selected.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
65
Serial Peripheral Interface (SPI)
SS
CPOL = 0
CPHA = 0
SCK
CPOL = 0
CPHA = 1
SCK
SCK
SCK
CPOL = 1
CPHA = 0
CPOL = 1
CPHA = 1
MISO/MOSI
MSB
6
5
4
3
2
1
0
INTERNAL STROBE FOR DATA CAPTURE (ALL MODES)
Figure 10-1. Data Clock Timing Diagram
10.3.2 Master Out/Slave In (MOSI)
The MOSI line is configured as an output in a master device and as an input in a slave device. It is one
of the two lines that transfer serial data in one direction with the most significant bit sent first.
10.3.3 Serial Clock (SCK)
The master clock is used to synchronize data movement both in and out of the device through its MOSI
and MISO lines. The master and slave devices are capable of exchanging a byte of information during a
sequence of eight clock cycles. Since SCK is generated by the master device, this line becomes an input
on a slave device.
As shown in Figure 10-1, four possible timing relationships may be chosen by using control bits CPOL
and CPHA in the serial peripheral control register (SPCR). Both master and slave devices must operate
with the same timing. The master device always places data on the MOSI line a half cycle before the clock
edge (SCK), in order for the slave device to latch the data.
Two bits (SPR0 and SPR1) in the SPCR of the master device select the clock rate. In a slave device,
SPR0 and SPR1 have no effect on the operation of the SPI.
10.3.4 Slave Select (SS)
The slave select (SS) input line is used to select a slave device. It has to be low prior to data transactions
and must stay low for the duration of the transaction.The SS line on the master must be tied high. In
master mode, if the SS pin is pulled low during a transmission, a mode fault error flag (MODF) is set in
the SPSR. In master mode the SS pin can be selected as a general-purpose output by writing a 1 in bit 5
of the port D data direction register, thus disabling the mode fault circuit.
When CPHA = 0, the shift clock is the OR of SS with SCK. In this clock phase mode, SS must go high
between successive characters in an SPI message. When CPHA = 1, SS may be left low for several SPI
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
66
Freescale Semiconductor
Functional Description
characters. In cases where there is only one SPI slave MCU, its SS line could be tied to VSS as long as
CPHA = 1 clock modes are used.
10.4 Functional Description
Figure 10-2 shows a block diagram of the serial peripheral interface circuitry. When a master device
transmits data to a slave via the MOSI line, the slave device responds by sending data to the master
device via the master’s MISO line. This implies full duplex transmission with both data out and data in
synchronized with the same clock signal. Thus, the byte transmitted is replaced by the byte received and
eliminates the need for separate transmit-empty and receive-full status bits. A single status bit (SPIF) is
used to signify that the input/output (I/O) operation has been completed.
The SPI is double buffered on read, but not on write. If a write is performed during data transfer, the
transfer occurs uninterrupted, and the write will be unsuccessful. This condition will cause the write
collision (WCOL) status bit in the SPSR to be set. After a data byte is shifted, the SPIF flag of the SPSR
is set.
In the master mode, the SCK pin is an output. It idles high or low, depending on the CPOL bit in the SPCR,
until data is written to the shift register, at which point eight clocks are generated to shift the eight bits of
data and then SCK goes idle again.
S
PD2/
MISO
M
M
SPI SHIFT REGISTER
PD3/
MOSI
S
7
6 5 4 3 2 1 0
INTERNAL DATA BUS
SPDR ($000C)
INTERNAL
CLOCK
(XTAL ÷2)
SPIE
SPE
SPIF
WCOL
MODF
MSTR
DIVIDER
SPI
CONTROL
SPI INTERRUPT REQUEST
PD5/
SS
÷ 2 ÷ 4 ÷ 16 ÷ 32
SPI
SPI CLOCK (MASTER)
CLOCK
LOGIC
SELECT
CLOCK
MASTER
PD4/
SCK
SPI
CLOCK
SLAVE
SPR1 SPR0
MSTR CPHA CPOL
7
6
5
4
3
2
1
0
SPI CONTROL REGISTER (SPCR) SPIE
SPE
DWOM MSTR CPOL CPHA SPR1 SPR2 $000A
SPI STATUS REGISTER (SPSR) SPIF WCOL
SPI DATA REGISTER (SPDR) BIT 7 BIT 6
0
MODF
BIT 4
0
0
0
0
$000B
BIT 5
BIT 3
BIT 2
BIT 1
BIT 0 $000C
Figure 10-2. Serial Peripheral Interface Block Diagram
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
67
Serial Peripheral Interface (SPI)
In a slave mode, the slave select start logic receives a logic low at the SS pin and a clock at the SCK pin.
Thus, the slave is synchronized with the master. Data from the master is received serially at the MOSI
line and loads the 8-bit shift register. After the 8-bit shift register is loaded, its data is parallel transferred
to the read buffer. During a write cycle, data is written into the shift register, then the slave waits for a clock
train from the master to shift the data out on the slave’s MISO line.
Figure 10-3 illustrates the MOSI, MISO, SCK, and SS master-slave interconnections.
PD3/MOSI
SPI SHIFT REGISTER
SPI SHIFT REGISTER
PD2/MISO
PD5/SS
7
6
5
4
3
2
1
0
7 6 5 4 3 2 1 0
I/O PORT
SPDR ($000C)
SPDR ($000C)
PD4/SCK
MASTER MCU
SLAVE MCU
Figure 10-3. Serial Peripheral Interface
Master-Slave Interconnection
10.5 SPI Registers
This subsection describes the three registers in the SPI which provide control, status, and data storage
functions. These registers are:
•
•
•
Serial peripheral control register (SPCR)
Serial peripheral status register (SPSR)
Serial peripheral data I/O register (SPDR)
10.5.1 Serial Peripheral Control Register
The SPI control register (SPCR), shown in Figure 10-4, controls these functions:
•
•
•
•
•
•
Enables SPI interrupts
Enables the SPI system
Selects between standard CMOS or open drain outputs for port D
Selects between master mode and slave mode
Controls the clock/data relationship between master and slave
Determines the idle level of the clock pin
Address: $000A
Bit 7
SPIE
0
6
SPE
0
5
DWOM
0
4
MSTR
0
3
CPOL
0
2
CPHA
1
1
SPR1
U
Bit 0
SPR0
U
Read:
Write:
Reset:
U = Undetermined
Figure 10-4. SPI Control Register (SPCR)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
68
Freescale Semiconductor
SPI Registers
SPIE — Serial Peripheral Interrupt Enable Bit
This read/write bit enables SPI interrupts. Reset clears the SPIE bit.
1 = SPI interrupts enabled
0 = SPI interrupts disabled
SPE — Serial Peripheral System Enable Bit
This read/write bit enables the SPI. Reset clears the SPE bit.
1 = SPI system enabled
0 = SPI system disabled
DWOM — Port D Wire-OR Mode Option Bit
This read/write bit disables the high side driver transistors on port D outputs so that port D outputs
become open-drain drivers. DWOM affects all seven port D pins together.
1 = Port D outputs act as open-drain outputs.
0 = Port D outputs are normal CMOS outputs.
MSTR — Master Mode Select Bit
This read/write bit selects master mode operation or slave mode operation. Reset clears the MSTR bit.
1 = Master mode
0 = Slave mode
CPOL — Clock Polarity Bit
When the clock polarity bit is cleared and data is not being transferred, a steady state low value is
produced at the SCK pin of the master device. Conversely, if this bit is set, the SCK pin will idle high.
This bit is also used in conjunction with the clock phase control bit to produce the desired clock-data
relationship between master and slave. See Figure 10-1.
CPHA — Clock Phase Bit
The clock phase bit, in conjunction with the CPOL bit, controls the clock-data relationship between
master and slave. The CPOL bit can be thought of as simply inserting an inverter in series with the
SCK line. The CPHA bit selects one of two fundamentally different clocking protocols. When
CPHA = 0, the shift clock is the OR of SCK with SS. As soon as SS goes low, the transaction begins
and the first edge on SCK invokes the first data sample. When CPHA=1, the SS pin may be thought
of as a simple output enable control. See Figure 10-1.
SPR1 and SPR0 — SPI Clock Rate Select Bits
These read/write bits select one of four master mode serial clock rates, as shown in Table 10-1. They
have no effect in slave mode.
Table 10-1. SPI Clock Rate Selection
SPR1 and SPR0
SPI Clock Rate
Internal clock ÷ 2
Internal clock ÷ 4
Internal clock ÷ 16
Internal clock ÷ 32
0 0
0 1
1 0
1 1
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
69
Serial Peripheral Interface (SPI)
10.5.2 Serial Peripheral Status Register
The SPI status register (SPSR), shown in Figure 10-5, contains flags to signal these conditions:
•
•
•
SPI transmission complete
Write collision
Mode fault
Address: $000B
Bit 7
6
5
0
4
3
0
2
0
1
0
Bit 0
0
Read:
Write:
Reset:
SPIF
WCOL
MODF
0
0
0
0
0
0
0
0
= Unimplemented
Figure 10-5. SPI Status Register
SPIF — SPI Transfer Complete Flag
The serial peripheral data transfer flag bit is set upon completion of data transfer between the
processor and external device. If SPIF goes high, and if SPIE is set, a serial peripheral interrupt is
generated. Clearing the SPIF bit is accomplished by reading the SPSR (with SPIF set) followed by an
access of the SPDR. Following the initial transfer, unless SPSR is read (with SPIF set) first, attempts
to write to SPDR are inhibited.
WCOL — Write Collision Bit
The write collision bit is set when an attempt is made to write to the serial peripheral data register while
data transfer is taking place. If CPHA is 0, a transfer is said to begin when SS goes low and the transfer
ends when SS goes high after eight clock cycles on SCK. When CPHA is 1, a transfer is said to begin
the first time SCK becomes active while SS is low and the transfer ends when the SPIF flag gets set.
Clearing the WCOL bit is accomplished by reading the SPSR (with WCOL set) followed by an access
to SPDR.
MODF — Mode Fault Flag
The mode fault flag indicates that there may have been a multi-master conflict for system control and
allows a proper exit from system operation to a reset or default system state. The MODF bit is normally
clear, and is set only when the master device has its SS pin pulled low. Setting the MODF bit affects
the internal serial peripheral interface system in these ways:
1. An SPI interrupt is generated if SPIE = 1.
2. The SPE bit is cleared. This disables the SPI.
3. The MSTR bit is cleared, thus forcing the device into the slave mode.
Clearing the MODF bit is accomplished by reading the SPSR (with MODF set), followed by a write to
the SPCR. Control bits SPE and MSTR may be restored by user software to their original state during
this clearing sequence or after the MODF bit has been cleared. It is also necessary to restore DDRD
after a mode fault.
Bits 5 and 3–0 — Not Implemented
These bits always read 0.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
70
Freescale Semiconductor
SPI Registers
10.5.3 Serial Peripheral Data I/O Register
The serial peripheral data I/O register (SPDR), shown in Figure 10-6, is used to transmit and receive data
on the serial bus. Only a write to this register will initiate transmission/reception of another byte and this
will only occur in the master device. At the completion of transmitting a byte of data, the SPIF status bit is
set in both the master and slave devices.
When the user reads the serial peripheral data I/O register, a buffer is actually being read. The first SPIF
must be cleared by the time a second transfer of the data from the shift register to the read buffer is
initiated or an overrun condition will exist. In cases of overrun, the byte which causes the overrun is lost.
A write to the serial peripheral data I/O register is not buffered and places data directly into the shift
register for transmission.
Address: $000C
Bit 7
6
5
4
3
2
1
Bit 0
Read:
Write:
Reset:
SPD7
SPD6
SPD5
SPD4
SPD3
SPD2
SPD1
SPD0
Unaffected by reset
Figure 10-6. SPI Data Register (SPDR)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
71
Serial Peripheral Interface (SPI)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
72
Freescale Semiconductor
Chapter 11
Instruction Set
11.1 Introduction
The microcontroller unit (MCU) instruction set has 62 instructions and uses eight addressing modes. The
instructions include all those of the M146805 CMOS (complementary metal-oxide semiconductor) Family
plus one more: the unsigned multiply (MUL) instruction. The MUL instruction allows unsigned
multiplication of the contents of the accumulator (A) and the index register (X). The high-order product is
stored in the index register, and the low-order product is stored in the accumulator.
11.2 Addressing Modes
The central processor unit (CPU) uses eight addressing modes for flexibility in accessing data. The
addressing modes provide eight different ways for the CPU to find the data required to execute an
instruction. The eight addressing modes are:
•
•
•
•
•
•
•
•
Inherent
Immediate
Direct
Extended
Indexed, no offset
Indexed, 8-bit offset
Indexed, 16-bit offset
Relative
11.2.1 Inherent
Inherent instructions are those that have no operand, such as return from interrupt (RTI) and stop (STOP).
Some of the inherent instructions act on data in the CPU registers, such as set carry flag (SEC) and
increment accumulator (INCA). Inherent instructions require no operand address and are one byte long.
11.2.2 Immediate
Immediate instructions are those that contain a value to be used in an operation with the value in the
accumulator or index register. Immediate instructions require no operand address and are two bytes long.
The opcode is the first byte, and the immediate data value is the second byte.
11.2.3 Direct
Direct instructions can access any of the first 256 memory locations with two bytes. The first byte is the
opcode, and the second is the low byte of the operand address. In direct addressing, the CPU
automatically uses $00 as the high byte of the operand address.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
73
Instruction Set
11.2.4 Extended
Extended instructions use three bytes and can access any address in memory. The first byte is the
opcode; the second and third bytes are the high and low bytes of the operand address.
When using the Freescale assembler, the programmer does not need to specify whether an instruction is
direct or extended. The assembler automatically selects the shortest form of the instruction.
11.2.5 Indexed, No Offset
Indexed instructions with no offset are 1-byte instructions that can access data with variable addresses
within the first 256 memory locations. The index register contains the low byte of the effective address of
the operand. The CPU automatically uses $00 as the high byte, so these instructions can address
locations $0000–$00FF.
Indexed, no offset instructions are often used to move a pointer through a table or to hold the address of
a frequently used random-access memory (RAM) or input/output (I/O) location.
11.2.6 Indexed, 8-Bit Offset
Indexed, 8-bit offset instructions are 2-byte instructions that can access data with variable addresses
within the first 511 memory locations. The CPU adds the unsigned byte in the index register to the
unsigned byte following the opcode. The sum is the effective address of the operand. These instructions
can access locations $0000–$01FE.
Indexed 8-bit offset instructions are useful for selecting the kth element in an n-element table. The table
can begin anywhere within the first 256 memory locations and could extend as far as location 510
($01FE). The k value is typically in the index register, and the address of the beginning of the table is in
the byte following the opcode.
11.2.7 Indexed, 16-Bit Offset
Indexed, 16-bit offset instructions are 3-byte instructions that can access data with variable addresses at
any location in memory. The CPU adds the unsigned byte in the index register to the two unsigned bytes
following the opcode. The sum is the effective address of the operand. The first byte after the opcode is
the high byte of the 16-bit offset; the second byte is the low byte of the offset.
Indexed, 16-bit offset instructions are useful for selecting the kth element in an n-element table anywhere
in memory.
As with direct and extended addressing, the Freescale assembler determines the shortest form of
indexed addressing.
11.2.8 Relative
Relative addressing is only for branch instructions. If the branch condition is true, the CPU finds the
effective branch destination by adding the signed byte following the opcode to the contents of the program
counter. If the branch condition is not true, the CPU goes to the next instruction. The offset is a signed,
two’s complement byte that gives a branching range of –128 to +127 bytes from the address of the next
location after the branch instruction.
When using the Freescale assembler, the programmer does not need to calculate the offset, because the
assembler determines the proper offset and verifies that it is within the span of the branch.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
74
Freescale Semiconductor
Instruction Types
11.3 Instruction Types
The MCU instructions fall into these five categories:
•
•
•
•
•
Register/memory instructions
Read-modify-write instructions
Jump/branch instructions
Bit manipulation instructions
Control instructions
11.3.1 Register/Memory Instructions
These instructions operate on central processor unit (CPU) registers and memory locations. Most of them
use two operands. One operand is in either the accumulator or the index register. The CPU finds the other
operand in memory.
Table 11-1. Register/Memory Instructions
Instruction
Add Memory Byte and Carry Bit to Accumulator
Add Memory Byte to Accumulator
AND Memory Byte with Accumulator
Bit Test Accumulator
Mnemonic
ADC
ADD
AND
BIT
Compare Accumulator
CMP
CPX
EOR
LDA
Compare Index Register with Memory Byte
EXCLUSIVE OR Accumulator with Memory Byte
Load Accumulator with Memory Byte
Load Index Register with Memory Byte
Multiply
LDX
MUL
ORA
SBC
STA
OR Accumulator with Memory Byte
Subtract Memory Byte and Carry Bit from Accumulator
Store Accumulator in Memory
Store Index Register in Memory
STX
Subtract Memory Byte from Accumulator
SUB
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
75
Instruction Set
11.3.2 Read-Modify-Write Instructions
These instructions read a memory location or a register, modify its contents, and write the modified value
back to the memory location or to the register.
NOTE
Do not use read-modify-write operations on write-only registers.
Table 11-2. Read-Modify-Write Instructions
Instruction
Arithmetic Shift Left (Same as LSL)
Arithmetic Shift Right
Mnemonic
ASL
ASR
BCLR(1)
Bit Clear
BSET(1)
CLR
COM
DEC
INC
Bit Set
Clear Register
Complement (One’s Complement)
Decrement
Increment
Logical Shift Left (Same as ASL)
Logical Shift Right
LSL
LSR
Negate (Two’s Complement)
Rotate Left through Carry Bit
Rotate Right through Carry Bit
Test for Negative or Zero
NEG
ROL
ROR
TST(2)
1. Unlike other read-modify-write instructions, BCLR and
BSET use only direct addressing.
2. TST is an exception to the read-modify-write sequence
because it does not write a replacement value.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
76
Freescale Semiconductor
Instruction Types
11.3.3 Jump/Branch Instructions
Jump instructions allow the CPU to interrupt the normal sequence of the program counter. The
unconditional jump instruction (JMP) and the jump-to-subroutine instruction (JSR) have no register
operand. Branch instructions allow the CPU to interrupt the normal sequence of the program counter
when a test condition is met. If the test condition is not met, the branch is not performed.
The BRCLR and BRSET instructions cause a branch based on the state of any readable bit in the first
256 memory locations. These 3-byte instructions use a combination of direct addressing and relative
addressing. The direct address of the byte to be tested is in the byte following the opcode. The third byte
is the signed offset byte. The CPU finds the effective branch destination by adding the third byte to the
program counter if the specified bit tests true. The bit to be tested and its condition (set or clear) is part of
the opcode. The span of branching is from –128 to +127 from the address of the next location after the
branch instruction. The CPU also transfers the tested bit to the carry/borrow bit of the condition code
register.
Table 11-3. Jump and Branch Instructions
Instruction
Branch if Carry Bit Clear
Branch if Carry Bit Set
Branch if Equal
Mnemonic
BCC
BCS
BEQ
BHCC
BHCS
BHI
Branch if Half-Carry Bit Clear
Branch if Half-Carry Bit Set
Branch if Higher
Branch if Higher or Same
Branch if IRQ Pin High
Branch if IRQ Pin Low
Branch if Lower
BHS
BIH
BIL
BLO
Branch if Lower or Same
Branch if Interrupt Mask Clear
Branch if Minus
BLS
BMC
BMI
Branch if Interrupt Mask Set
Branch if Not Equal
Branch if Plus
BMS
BNE
BPL
Branch Always
BRA
Branch if Bit Clear
BRCLR
BRN
BRSET
BSR
Branch Never
Branch if Bit Set
Branch to Subroutine
Unconditional Jump
Jump to Subroutine
JMP
JSR
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
77
Instruction Set
11.3.4 Bit Manipulation Instructions
The CPU can set or clear any writable bit in the first 256 bytes of memory, which includes I/O registers
and on-chip RAM locations. The CPU can also test and branch based on the state of any bit in any of the
first 256 memory locations.
Table 11-4. Bit Manipulation Instructions
Instruction
Mnemonic
BCLR
Bit Clear
Branch if Bit Clear
Branch if Bit Set
Bit Set
BRCLR
BRSET
BSET
11.3.5 Control Instructions
These instructions act on CPU registers and control CPU operation during program execution.
Table 11-5. Control Instructions
Instruction
Mnemonic
CLC
CLI
Clear Carry Bit
Clear Interrupt Mask
No Operation
NOP
RSP
RTI
Reset Stack Pointer
Return from Interrupt
Return from Subroutine
Set Carry Bit
RTS
SEC
SEI
Set Interrupt Mask
Stop Oscillator and Enable IRQ Pin
Software Interrupt
STOP
SWI
Transfer Accumulator to Index Register
Transfer Index Register to Accumulator
Stop CPU Clock and Enable Interrupts
TAX
TXA
WAIT
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
78
Freescale Semiconductor
Instruction Set Summary
11.4 Instruction Set Summary
Table 11-6. Instruction Set Summary (Sheet 1 of 6)
Effect
Source
Form
on CCR
Operation
Description
H I N Z C
ii
dd
hh ll
ee ff
ff
ADC #opr
IMM
DIR
EXT
IX2
IX1
IX
A9
B9
C9
D9
E9
F9
2
3
4
5
4
3
ADC opr
ADC opr
ADC opr,X
ADC opr,X
ADC ,X
Add with Carry
Add without Carry
Logical AND
A ← (A) + (M) + (C)
ꢀ —
ꢀ —
— —
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ii
dd
hh ll
ee ff
ff
ADD #opr
ADD opr
ADD opr
ADD opr,X
ADD opr,X
ADD ,X
IMM
DIR
EXT CB
IX2
IX1
IX
AB
BB
2
3
4
5
4
3
A ← (A) + (M)
A ← (A) ∧ (M)
ꢀ
DB
EB
FB
ii
dd
hh ll
ee ff
ff
AND #opr
AND opr
AND opr
AND opr,X
AND opr,X
AND ,X
IMM
DIR
EXT
IX2
IX1
IX
A4
B4
C4
D4
E4
F4
2
3
4
5
4
3
ꢀ —
dd
ASL opr
ASLA
ASLX
ASL opr,X
ASL ,X
DIR
INH
INH
IX1
IX
38
48
58
68
78
5
3
3
6
5
Arithmetic Shift Left (Same as LSL)
C
0
— —
— —
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
b7
b7
b0
b0
ff
dd
ASR opr
ASRA
ASRX
ASR opr,X
ASR ,X
DIR
INH
INH
IX1
IX
37
47
57
67
77
5
3
3
6
5
C
Arithmetic Shift Right
ff
BCC rel
Branch if Carry Bit Clear
PC ← (PC) + 2 + rel ? C = 0
— — — — — REL
24 rr
3
DIR (b0) 11 dd
DIR (b1) 13 dd
DIR (b2) 15 dd
DIR (b3) 17 dd
DIR (b4) 19 dd
DIR (b5) 1B dd
DIR (b6) 1D dd
DIR (b7) 1F dd
5
5
5
5
5
5
5
5
BCLR n opr
Clear Bit n
Mn ← 0
— — — — —
BCS rel
BEQ rel
BHCC rel
BHCS rel
BHI rel
Branch if Carry Bit Set (Same as BLO)
Branch if Equal
PC ← (PC) + 2 + rel ? C = 1
PC ← (PC) + 2 + rel ? Z = 1
PC ← (PC) + 2 + rel ? H = 0
PC ← (PC) + 2 + rel ? H = 1
— — — — — REL
— — — — — REL
— — — — — REL
— — — — — REL
25 rr
27 rr
28 rr
29 rr
22 rr
24 rr
2F rr
2E rr
3
3
3
3
3
3
3
3
Branch if Half-Carry Bit Clear
Branch if Half-Carry Bit Set
Branch if Higher
PC ← (PC) + 2 + rel ? C ∨ Z = 0 — — — — — REL
PC ← (PC) + 2 + rel ? C = 0 — — — — — REL
BHS rel
BIH rel
Branch if Higher or Same
Branch if IRQ Pin High
Branch if IRQ Pin Low
PC ← (PC) + 2 + rel ? IRQ = 1 — — — — — REL
PC ← (PC) + 2 + rel ? IRQ = 0 — — — — — REL
BIL rel
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
79
Instruction Set
Table 11-6. Instruction Set Summary (Sheet 2 of 6)
Effect
Source
Form
on CCR
Operation
Description
H I N Z C
ii
dd
hh ll
ee ff
ff
BIT #opr
BIT opr
BIT opr
BIT opr,X
BIT opr,X
BIT ,X
IMM
DIR
EXT
IX2
IX1
IX
A5
B5
C5
D5
E5
F5
2
3
4
5
4
3
Bit Test Accumulator with Memory Byte
(A) ∧ (M)
— — ꢀ ꢀ —
BLO rel
BLS rel
BMC rel
BMI rel
BMS rel
BNE rel
BPL rel
BRA rel
Branch if Lower (Same as BCS)
Branch if Lower or Same
Branch if Interrupt Mask Clear
Branch if Minus
PC ← (PC) + 2 + rel ? C = 1
— — — — — REL
25 rr
23 rr
2C rr
2B rr
2D rr
26 rr
2A rr
20 rr
3
3
3
3
3
3
3
3
PC ← (PC) + 2 + rel ? C ∨ Z = 1 — — — — — REL
PC ← (PC) + 2 + rel ? I = 0
PC ← (PC) + 2 + rel ? N = 1
PC ← (PC) + 2 + rel ? I = 1
PC ← (PC) + 2 + rel ? Z = 0
PC ← (PC) + 2 + rel ? N = 0
PC ← (PC) + 2 + rel ? 1 = 1
— — — — — REL
— — — — — REL
— — — — — REL
— — — — — REL
— — — — — REL
— — — — — REL
Branch if Interrupt Mask Set
Branch if Not Equal
Branch if Plus
Branch Always
DIR (b0) 01 dd rr
DIR (b1) 03 dd rr
DIR (b2) 05 dd rr
DIR (b3) 07 dd rr
DIR (b4) 09 dd rr
DIR (b5) 0B dd rr
DIR (b6) 0D dd rr
DIR (b7) 0F dd rr
5
5
5
5
5
5
5
5
BRCLR n opr rel Branch if Bit n Clear
PC ← (PC) + 2 + rel ? Mn = 0 — — — — ꢀ
BRN rel
Branch Never
PC ← (PC) + 2 + rel ? 1 = 0
— — — — — REL
21 rr
3
DIR (b0) 00 dd rr
DIR (b1) 02 dd rr
DIR (b2) 04 dd rr
DIR (b3) 06 dd rr
DIR (b4) 08 dd rr
DIR (b5) 0A dd rr
DIR (b6) 0C dd rr
DIR (b7) 0E dd rr
5
5
5
5
5
5
5
5
BRSET n opr rel Branch if Bit n Set
PC ← (PC) + 2 + rel ? Mn = 1 — — — — ꢀ
DIR (b0) 10 dd
DIR (b1) 12 dd
DIR (b2) 14 dd
DIR (b3) 16 dd
DIR (b4) 18 dd
DIR (b5) 1A dd
DIR (b6) 1C dd
DIR (b7) 1E dd
5
5
5
5
5
5
5
5
BSET n opr
Set Bit n
Mn ← 1
— — — — —
PC ← (PC) + 2; push (PCL)
SP ← (SP) – 1; push (PCH)
SP ← (SP) – 1
BSR rel
Branch to Subroutine
— — — — — REL AD rr
6
PC ← (PC) + rel
CLC
CLI
Clear Carry Bit
C ← 0
I ← 0
— — — — 0
— 0 — — —
INH
INH
98
2
2
Clear Interrupt Mask
9A
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
80
Freescale Semiconductor
Instruction Set Summary
Table 11-6. Instruction Set Summary (Sheet 3 of 6)
Effect
Source
Form
on CCR
Operation
Description
H I N Z C
dd
ff
CLR opr
CLRA
CLRX
CLR opr,X
CLR ,X
M ← $00
A ← $00
X ← $00
M ← $00
M ← $00
DIR
INH
INH
IX1
IX
3F
4F
5F
6F
7F
5
3
3
6
5
Clear Byte
— — 0 1 —
ii
dd
hh ll
ee ff
ff
CMP #opr
CMP opr
CMP opr
CMP opr,X
CMP opr,X
CMP ,X
IMM
DIR
EXT
IX2
IX1
IX
A1
B1
C1
D1
E1
F1
2
3
4
5
4
3
Compare Accumulator with Memory Byte
Complement Byte (One’s Complement)
Compare Index Register with Memory Byte
Decrement Byte
(A) – (M)
— —
— —
— —
— —
— —
— —
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
1
ꢀ
dd
ff
COM opr
COMA
COMX
COM opr,X
COM ,X
M ← (M) = $FF – (M)
A ← (A) = $FF – (A)
X ← (X) = $FF – (X)
M ← (M) = $FF – (M)
M ← (M) = $FF – (M)
DIR
INH
INH
IX1
IX
33
43
53
63
73
5
3
3
6
5
ii
dd
hh ll
ee ff
ff
CPX #opr
CPX opr
CPX opr
CPX opr,X
CPX opr,X
CPX ,X
IMM
DIR
EXT
IX2
IX1
IX
A3
B3
C3
D3
E3
F3
2
3
4
5
4
3
(X) – (M)
dd
ff
DEC opr
DECA
DECX
DEC opr,X
DEC ,X
M ← (M) – 1
A ← (A) – 1
X ← (X) – 1
M ← (M) – 1
M ← (M) – 1
DIR
INH
INH
IX1
IX
3A
4A
5A
6A
7A
5
3
3
6
5
ꢀ —
ꢀ —
ꢀ —
ii
dd
hh ll
ee ff
ff
EOR #opr
EOR opr
EOR opr
EOR opr,X
EOR opr,X
EOR ,X
IMM
DIR
EXT
IX2
IX1
IX
A8
B8
C8
D8
E8
F8
2
3
4
5
4
3
EXCLUSIVE OR Accumulator with Memory
Byte
A ← (A) ⊕ (M)
dd
ff
INC opr
INCA
INCX
INC opr,X
INC ,X
M ← (M) + 1
A ← (A) + 1
X ← (X) + 1
M ← (M) + 1
M ← (M) + 1
DIR
INH
INH
IX1
IX
3C
4C
5C
6C
7C
5
3
3
6
5
Increment Byte
dd
hh ll
ee ff
ff
JMP opr
JMP opr
JMP opr,X
JMP opr,X
JMP ,X
DIR
EXT CC
IX2
IX1
IX
BC
2
3
4
3
2
Unconditional Jump
Jump to Subroutine
PC ← Jump Address
— — — — —
— — — — —
DC
EC
FC
dd
hh ll
ee ff
ff
JSR opr
JSR opr
JSR opr,X
JSR opr,X
JSR ,X
DIR
EXT CD
IX2
IX1
IX
BD
5
6
7
6
5
PC ← (PC) + n (n = 1, 2, or 3)
Push (PCL); SP ← (SP) – 1
Push (PCH); SP ← (SP) – 1
PC ← Effective Address
DD
ED
FD
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
81
Instruction Set
Table 11-6. Instruction Set Summary (Sheet 4 of 6)
Effect
Source
Form
on CCR
Operation
Description
H I N Z C
ii
dd
hh ll
ee ff
ff
LDA #opr
LDA opr
LDA opr
LDA opr,X
LDA opr,X
LDA ,X
IMM
DIR
EXT
IX2
IX1
IX
A6
B6
C6
D6
E6
F6
2
3
4
5
4
3
Load Accumulator with Memory Byte
A ← (M)
— —
ꢀ
ꢀ
ꢀ —
ii
dd
hh ll
ee ff
ff
LDX #opr
LDX opr
LDX opr
LDX opr,X
LDX opr,X
LDX ,X
IMM
DIR
EXT CE
IX2
IX1
IX
AE
BE
2
3
4
5
4
3
Load Index Register with Memory Byte
Logical Shift Left (Same as ASL)
X ← (M)
— —
ꢀ —
DE
EE
FE
dd
LSL opr
LSLA
LSLX
LSL opr,X
LSL ,X
DIR
INH
INH
IX1
IX
38
48
58
68
78
5
3
3
6
5
C
0
— — ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
b7
b0
ff
dd
LSR opr
LSRA
LSRX
LSR opr,X
LSR ,X
DIR
INH
INH
IX1
IX
34
44
54
64
74
5
3
3
6
5
0
C
Logical Shift Right
Unsigned Multiply
— — 0
b7
b0
ff
1
1
MUL
X : A ← (X) × (A)
0 — — — 0
INH
42
dd
ff
NEG opr
NEGA
NEGX
NEG opr,X
NEG ,X
M ← –(M) = $00 – (M)
A ← –(A) = $00 – (A)
X ← –(X) = $00 – (X)
M ← –(M) = $00 – (M)
M ← –(M) = $00 – (M)
DIR
INH
INH
IX1
IX
30
40
50
60
70
5
3
3
6
5
Negate Byte (Two’s Complement)
No Operation
— — ꢀ ꢀ ꢀ
NOP
— — — — —
INH
9D
2
ii
dd
hh ll
ee ff
ff
ORA #opr
ORA opr
ORA opr
ORA opr,X
ORA opr,X
ORA ,X
IMM
DIR
EXT CA
IX2
IX1
IX
AA
BA
2
3
4
5
4
3
Logical OR Accumulator with Memory
Rotate Byte Left through Carry Bit
A ← (A) ∨ (M)
— —
ꢀ
ꢀ —
DA
EA
FA
dd
ROL opr
ROLA
ROLX
ROL opr,X
ROL ,X
DIR
INH
INH
IX1
IX
39
49
59
69
79
5
3
3
6
5
C
— —
— —
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
b7
b0
ff
dd
ROR opr
RORA
RORX
ROR opr,X
ROR ,X
DIR
INH
INH
IX1
IX
36
46
56
66
76
5
3
3
6
5
C
Rotate Byte Right through Carry Bit
Reset Stack Pointer
b7
b0
ff
RSP
SP ← $00FF
— — — — —
INH
9C
2
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
82
Freescale Semiconductor
Instruction Set Summary
Table 11-6. Instruction Set Summary (Sheet 5 of 6)
Effect
Source
Form
on CCR
Operation
Description
H I N Z C
SP ← (SP) + 1; Pull (CCR)
SP ← (SP) + 1; Pull (A)
SP ← (SP) + 1; Pull (X)
SP ← (SP) + 1; Pull (PCH)
SP ← (SP) + 1; Pull (PCL)
RTI
Return from Interrupt
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
INH
INH
80
81
9
6
SP ← (SP) + 1; Pull (PCH)
SP ← (SP) + 1; Pull (PCL)
RTS
Return from Subroutine
— — — — —
ii
dd
hh ll
ee ff
ff
SBC #opr
SBC opr
SBC opr
SBC opr,X
SBC opr,X
SBC ,X
IMM
DIR
EXT
IX2
IX1
IX
A2
B2
C2
D2
E2
F2
2
3
4
5
4
3
Subtract Memory Byte and Carry Bit from
Accumulator
A ← (A) – (M) – (C)
— — ꢀ ꢀ ꢀ
SEC
SEI
Set Carry Bit
C ← 1
I ← 1
— — — — 1
— 1 — — —
INH
INH
99
2
2
Set Interrupt Mask
9B
dd
hh ll
ee ff
ff
STA opr
STA opr
STA opr,X
STA opr,X
STA ,X
DIR
EXT
IX2
IX1
IX
B7
C7
D7
E7
F7
4
5
6
5
4
Store Accumulator in Memory
Stop Oscillator and Enable IRQ Pin
Store Index Register In Memory
M ← (A)
— — ꢀ ꢀ —
STOP
— 0 — — —
INH
8E
2
dd
hh ll
ee ff
ff
STX opr
STX opr
STX opr,X
STX opr,X
STX ,X
DIR
EXT
IX2
IX1
IX
BF
CF
DF
EF
FF
4
5
6
5
4
M ← (X)
— —
— —
ꢀ
ꢀ
ꢀ —
ii
dd
hh ll
ee ff
ff
SUB #opr
SUB opr
SUB opr
SUB opr,X
SUB opr,X
SUB ,X
IMM
DIR
EXT
IX2
IX1
IX
A0
B0
C0
D0
E0
F0
2
3
4
5
4
3
Subtract Memory Byte from Accumulator
A ← (A) – (M)
ꢀ ꢀ
PC ← (PC) + 1; Push (PCL)
SP ← (SP) – 1; Push (PCH)
SP ← (SP) – 1; Push (X)
SP ← (SP) – 1; Push (A)
SP ← (SP) – 1; Push (CCR)
SP ← (SP) – 1; I ← 1
1
0
SWI
TAX
Software Interrupt
— 1 — — —
— — — — —
INH
83
PCH ← Interrupt Vector High Byte
PCL ← Interrupt Vector Low Byte
Transfer Accumulator to Index Register
Test Memory Byte for Negative or Zero
X ← (A)
INH
97
2
dd
ff
TST opr
TSTA
TSTX
DIR
INH
INH
IX1
IX
3D
4D
5D
6D
7D
4
3
3
5
4
(M) – $00
— — ꢀ ꢀ —
TST opr,X
TST ,X
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
83
Instruction Set
Table 11-6. Instruction Set Summary (Sheet 6 of 6)
Effect
Source
Form
on CCR
Operation
Description
H I N Z C
TXA
Transfer Index Register to Accumulator
Stop CPU Clock and Enable Interrupts
A ← (X)
— — — — —
— 0 — — —
INH
INH
9F
8F
2
2
WAIT
A
C
Accumulator
Carry/borrow flag
opr
PC
Operand (one or two bytes)
Program counter
CCR Condition code register
PCH Program counter high byte
PCL Program counter low byte
REL Relative addressing mode
dd
Direct address of operand
dd rr
DIR
ee ff
EXT
ff
Direct address of operand and relative offset of branch instruction
Direct addressing mode
High and low bytes of offset in indexed, 16-bit offset addressing
Extended addressing mode
Offset byte in indexed, 8-bit offset addressing
Half-carry flag
rel
rr
SP
X
Relative program counter offset byte
Relative program counter offset byte
Stack pointer
Index register
H
Z
Zero flag
hh ll
I
High and low bytes of operand address in extended addressing
Interrupt mask
#
∧
Immediate value
Logical AND
ii
Immediate operand byte
∨
Logical OR
IMM
INH
IX
IX1
IX2
M
Immediate addressing mode
Inherent addressing mode
Indexed, no offset addressing mode
Indexed, 8-bit offset addressing mode
Indexed, 16-bit offset addressing mode
Memory location
⊕
( )
–( )
←
?
Logical EXCLUSIVE OR
Contents of
Negation (two’s complement)
Loaded with
If
:
ꢀ
Concatenated with
Set or cleared
N
Negative flag
n
Any bit
—
Not affected
11.5 Opcode Map
See Table 11-7.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
84
Freescale Semiconductor
Table 11-7. Opcode Map
Bit Manipulation Branch
Read-Modify-Write
Control
Register/Memory
DIR
DIR
REL
DIR
3
INH
INH
IX1
IX
7
INH
INH
IMM
A
DIR
B
EXT
IX2
IX1
E
IX
F
MSB
LSB
MSB
LSB
0
1
2
4
5
6
8
9
C
D
5
5
3
5
3
3
6
5
9
2
3
4
5
4
3
BRSET0
BSET0
BRA
NEG
NEGA
NEGX
NEG
NEG
RTI
SUB
SUB
SUB
SUB
SUB
SUB
CMP
SBC
CPX
AND
BIT
0
1
0
3
DIR 2
5
DIR 2
5
REL 2
3
DIR 1
INH 1
INH 2
IX1 1
IX 1
INH
6
2
2
2
2
2
2
2
IMM 2
2
DIR 3
3
EXT 3
4
IX2 2
5
IX1 1
4
IX
3
BRCLR0
BCLR0
BRN
RTS
CMP
CMP
CMP
CMP
CMP
1
2
3
DIR 2
5
DIR 2
5
REL
3
1
INH
IMM 2
2
DIR 3
3
EXT 3
4
IX2 2
5
IX1 1
4
IX
3
11
BRSET1
BSET1
BHI
MUL
SBC
SBC
SBC
SBC
CPX
AND
BIT
SBC
CPX
AND
BIT
2
3
DIR 2
5
DIR 2
5
REL
3
1
5
INH
3
IMM 2
2
DIR 3
3
EXT 3
4
IX2 2
5
IX1 1
4
IX
3
3
6
5
10
SWI
INH
BRCLR1
BCLR1
BLS
COM
COMA
COMX
COM
COM
LSR
CPX
CPX
CPX
3
3
3
DIR 2
5
DIR 2
5
REL 2
3
DIR 1
5
INH 1
3
INH 2
3
IX1 1
6
IX 1
5
IMM 2
2
DIR 3
3
EXT 3
4
IX2 2
5
IX1 1
4
IX
3
BRSET2
BSET2
BCC
LSR
LSRA
LSRX
LSR
AND
AND
AND
4
4
3
DIR 2
5
DIR 2
5
REL 2
3
DIR 1
INH 1
INH 2
IX1 1
IX
IMM 2
2
DIR 3
3
EXT 3
4
IX2 2
5
IX1 1
4
IX
3
BRCLR2
BCLR2 BCS/BLO
BIT
BIT
BIT
5
5
3
DIR 2
5
DIR 2
5
REL
3
IMM 2
2
DIR 3
3
EXT 3
4
IX2 2
5
IX1 1
4
IX
3
5
3
3
6
5
BRSET3
BSET3
BNE
ROR
RORA
RORX
ROR
ROR
ASR
LDA
LDA
LDA
LDA
STA
EOR
ADC
ORA
ADD
JMP
JSR
LDX
STX
LDA
STA
EOR
ADC
ORA
ADD
JMP
JSR
LDX
STX
LDA
STA
6
6
3
DIR 2
5
DIR 2
5
REL 2
3
DIR 1
5
INH 1
3
INH 2
3
IX1 1
6
IX
5
IMM 2
DIR 3
4
EXT 3
5
IX2 2
6
IX1 1
5
IX
4
2
BRCLR3
BCLR3
BEQ
ASR
ASRA
ASRX
ASR
TAX
STA
STA
7
7
3
DIR 2
5
DIR 2
5
REL 2
3
DIR 1
5
INH 1
3
INH 2
3
IX1 1
6
IX
5
1
1
1
1
1
1
1
INH
2
2
2
DIR 3
3
EXT 3
4
IX2 2
5
IX1 1
4
IX
3
BRSET4
BSET4
BHCC
ASL/LSL ASLA/LSLA ASLX/LSLX ASL/LSL ASL/LSL
CLC
EOR
EOR
EOR
EOR
ADC
ORA
ADD
JMP
JSR
LDX
STX
8
8
3
DIR 2
5
DIR 2
5
REL 2
3
DIR 1
5
INH 1
3
INH 2
3
IX1 1
6
IX
5
INH 2
2
IMM 2
2
DIR 3
3
EXT 3
4
IX2 2
5
IX1 1
4
IX
3
BRCLR4
BCLR4
BHCS
ROL
ROLA
ROLX
ROL
ROL
DEC
SEC
ADC
ADC
ADC
9
9
3
DIR 2
5
DIR 2
5
REL 2
3
DIR 1
5
INH 1
3
INH 2
3
IX1 1
6
IX
5
INH 2
2
IMM 2
2
DIR 3
3
EXT 3
4
IX2 2
5
IX1 1
4
IX
3
BRSET5
BSET5
BPL
DEC
DECA
DECX
DEC
CLI
ORA
ORA
ORA
A
B
C
D
E
F
A
B
C
D
E
F
3
DIR 2
5
DIR 2
5
REL 2
3
DIR 1
INH 1
INH 2
IX1 1
IX
INH 2
2
IMM 2
2
DIR 3
3
EXT 3
4
IX2 2
5
IX1 1
4
IX
3
BRCLR5
BCLR5
BMI
SEI
ADD
ADD
ADD
3
DIR 2
5
DIR 2
5
REL
3
INH 2
2
IMM 2
DIR 3
2
EXT 3
3
IX2 2
4
IX1 1
3
IX
2
5
3
3
6
5
BRSET6
BSET6
BMC
INC
INCA
INCX
INC
TST
INC
TST
RSP
INH
JMP
JMP
3
DIR 2
5
DIR 2
5
REL 2
3
DIR 1
4
INH 1
3
INH 2
3
IX1 1
5
IX
4
2
6
DIR 3
5
EXT 3
6
IX2 2
7
IX1 1
6
IX
5
2
BRCLR6
BCLR6
BMS
TST
TSTA
TSTX
NOP
BSR
JSR
JSR
3
DIR 2
5
DIR 2
5
REL 2
3
DIR 1
INH 1
INH 2
IX1 1
IX
INH 2
REL 2
2
DIR 3
3
EXT 3
4
IX2 2
5
IX1 1
4
IX
3
2
BRSET7
BSET7
BIL
STOP
LDX
LDX
LDX
3
DIR 2
5
DIR 2
5
REL
3
1
INH
2
2
2
IMM 2
DIR 3
4
EXT 3
5
IX2 2
6
IX1 1
5
IX
4
5
3
3
6
5
BRCLR7
BCLR7
BIH
CLR
DIR 1
CLRA
INH 1
CLRX
INH 2
CLR
CLR
WAIT
TXA
INH
STX
STX
3
DIR 2
DIR 2
REL 2
IX1 1
IX 1
INH 1
2
DIR 3
EXT 3
IX2 2
IX1 1
IX
MSB
INH = Inherent
IMM = Immediate
DIR = Direct
REL = Relative
IX = Indexed, No Offset
IX1 = Indexed, 8-Bit Offset
IX2 = Indexed, 16-Bit Offset
0
MSB of Opcode in Hexadecimal
LSB
5
Number of Cycles
BRSET0 Opcode Mnemonic
LSB of Opcode in Hexadecimal
0
EXT = Extended
3
DIR Number of Bytes/Addressing Mode
Instruction Set
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
86
Freescale Semiconductor
Chapter 12
Electrical Specifications
12.1 Maximum Ratings
Maximum ratings are the extreme limits to which the microcontroller unit (MCU) can be exposed without
permanently damaging it.
The MCU contains circuitry to protect the inputs against damage from high static voltages; however, do
not apply voltages higher than those shown in the table here. Keep VIn and VOut within the range
VSS ≤ (VIn or VOut) ≤ VDD. Connect unused inputs to the appropriate voltage level, either VSS or VDD
.
Rating
Symbol
Value
Unit
Supply voltage
VDD
–0.3 to +7.0
V
Input voltage
Normal operation
VIn
VSS –0.3 to VDD + 0.3
V
Self-check mode (IRQ pin only)
VTST
VSS –0.3 to 2 x VDD + 0.3
Current drain per pin
(Excluding VDD and VSS
I
25
mA
)
Storage temperature range
TSTG
–65 to +150
°C
NOTE
This device is not guaranteed to operate properly at the maximum ratings.
Refer to 12.5 5.0-Volt DC Electrical Characteristics for guaranteed
operating conditions.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
87
Electrical Specifications
12.2 Operating Temperature
Characteristic
Symbol
Value
Unit
Operating temperature range
MC68HC05C9AP, FN, B, FB
MC68HC05C9AMP, MFN, MB, MFB
TL to TH
0 to +70
–40 to +125
T
°C
A
12.3 Thermal Characteristics
Characteristic
Symbol
θJA
Value
60
Unit
°C/W
°C/W
°C/W
°C/W
Thermal resistance plastic dual in-line (PDIP)
Thermal resistance plastic-leaded chip carrier (PLCC)
Thermal resistance quad flat pack (QFP)
Thermal resistance plastic shrink DIP (SDIP)
θJA
70
θJA
95
θJA
60
VDD
R2
SEE TABLE
TEST
POINT
C
SEE TABLE
R1
SEE TABLE
VDD = 4.5 V
Pins
R1
R2
C
PA7–PA0
3.26 Ω
2.38 Ω
50 pF
PB7–PB0
PC7–PC0
PD5–PD0, PD7
VDD = 3.0 V
Pins
R1
R2
C
PA7–PA0
10.91 Ω
6.32 Ω
50 pF
PB7–PB0
PC7–PC0
PD5–PD0, PD7
Figure 12-1. Test Load
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
88
Freescale Semiconductor
Power Considerations
12.4 Power Considerations
The average chip-junction temperature, TJ, in °C, can be obtained from:
TJ = TA + (PD × θJA)
where:
(1)
TA = Ambient temperature, °C
θ
JA = Package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD × VDD watts (chip internal power)
PI/O = Power dissipation on input and output pins (user determined)
For most applications, PI/O « PINT and can be neglected.
The following is an approximate relationship between PD and TJ (neglecting PJ):
PD = K ÷ (TJ + 273°C)
(2)
(3)
Solving equations (1) and (2) for K gives:
K = PD × (TA + 273°C) + θJA × (PD)2
where K is a constant pertaining to the particular part. K can be determined from equation (3) by
measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be
obtained by solving equations (1) and (2) iteratively for any value of TA.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
89
Electrical Specifications
12.5 5.0-Volt DC Electrical Characteristics
Characteristic(1) (2)
Symbol
Min
Typ
Max
Unit
Output voltage
ILoad = 10.0 µA
ILoad = –10.0 µA
VOL
VOH
—
DD–0.1
—
—
0.1
—
V
V
Output high voltage
(ILoad = –0.8 mA) PA7–PA0, PB7–PB0, PC6–PC0,
VDD–0.8
VDD–0.8
VDD–0.8
TCMP, PD7, PD0
(ILoad = –1.6 mA) PD5–PD1
(ILoad = –5.0 mA) PC7
VOH
—
—
—
—
—
—
V
V
Output low voltage
(ILoad = 1.6 mA) PA7–PA0, PB7–PB0, PC6–PC0,
PD7, PD5–PD0, TCMP
(ILoad = 10 mA) PC7
VOL
—
—
—
—
0.4
0.4
Input high voltage
PA7–PA0, PB7–PB0, PC7–PC0, PD7,
PD5–PD0, TCAP, IRQ, RESET, OSC1
VIH
0.7 × VDD
VDD
—
—
V
V
Input low voltage
PA7–PA0, PB7–PB0, PC7–PC0, PD7,
PD5–PD0, TCAP, IRQ, RESET, OSC1
VIL
VSS
0.2 × VDD
Supply current (4.5–5.5 Vdc @ fOP = 2.1 MHz)
Run(3)
Wait(4)
Stop(5)
25°C
0 to 70°C
–40 to +125°C
—
—
3.5
1.0
5.25
3.25
mA
mA
IDD
—
—
—
1.0
2.0
7.0
20.0
40.0
50.0
µA
µA
µA
I/O ports hi-z leakage current
PA7–PA0, PB7–PB0 (without pullup)
PC7–PC0, PD7, PD5–PD0
IOZ
—
1.0
10
µA
Input current
RESET, IRQ, OSC1, TCAP, PD7, PD5–PD0
IIn
—
5
0.5
—
1
µA
µA
Input pullup current(6)
PB7–PB0 (with pullup)
IIn
60
Capacitance
Ports (as input or output)
RESET, IRQ, OSC1, TCAP, PD7, PD5, PD0
COut
CIn
—
—
—
—
12
8
pF
1. VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = –40 to +125°C, unless otherwise noted
2. Typical values reflect measurements taken on average processed devices at the midpoint of voltage range, 25°C only.
3. Run (operating) IDD measured using external square wave clock source; all I/O pins configured as inputs, port B = VDD
,
all other inputs VIL = 0.2 V, VIH = VDD –0.2 V; no dc loads; less than 50 pF on all outputs; CL = 20 pF on OSC2
4. Wait IDD measured using external square wave clock source; all I/O pins configured as inputs, port B = VDD, all other
inputs VIL = 0.2 V, VIH = VDD –0.2 V; no dc loads; less than 50 pF on all outputs; CL = 20 pF on OSC2. Wait IDD is
affected linearly by the OSC2 capacitance.
5. Stop IDD measured with OSC1 = 0.2 V; all I/O pins configured as inputs, port B = VDD, all other inputs VIL = 0.2 V,
VIH = VDD –0.2 V
6. Input pullup current measured with VIL = 0.2 V
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
90
Freescale Semiconductor
3.3-Volt DC Electrical Characteristics
12.6 3.3-Volt DC Electrical Characteristics
Characteristic(1) (2)
Symbol
Min
Typ
Max
Unit
Output voltage
ILoad = 10.0 µA
ILoad = –10.0 µA
VOL
VOH
—
DD–0.1
—
—
0.1
—
V
V
Output high voltage
(ILoad = –0.2 mA) PA7–PA0, PB7–PB0, PC6–PC0,
VDD–0.3
VDD–0.3
VDD–0.3
TCMP, PD7, PD0
(ILoad = –0.4 mA) PD5–PD1
(ILoad = –1.5 mA) PC7
VOH
—
—
—
—
—
—
V
V
Output low voltage
(ILoad = 0.4 mA) PA7–PA0, PB7–PB0, PC6–PC0,
PD7, PD5–PD0, TCMP
(ILoad = 6 mA) PC7
VOL
—
—
—
—
0.3
0.3
Input high voltage
PA7–PA0, PB7–PB0, PC7–PC0, PD7,
PD5–PD0, TCAP, IRQ, RESET, OSC1
VIH
0.7 × VDD
VDD
—
—
V
V
Input low voltage
PA7–PA0, PB7–PB0, PC7–PC0, PD7,
PD5–PD0, TCAP, IRQ, RESET, OSC1
VIL
VSS
0.2 × VDD
Supply current (3.0–3.6 Vdc @ fOP = 1.0 MHz)
Run(3)
Wait(4)
Stop(5)
25°C
0 to 70°C
–40 to +125°C
—
—
1.0
500
1.6
900
mA
µA
IDD
—
—
—
1.0
1.0
2.5
8
16
20
µA
µA
µA
I/O ports hi-z leakage current
PA7–PA0, PB7–PB0 (without pullup)
PC7–PC0, PD7, PD5–PD0
IOZ
—
1.0
10
µA
Input current
RESET, IRQ, OSC1, TCAP, PD7, PD5–PD0
IIn
—
0.5
—
1
µA
µA
Input pullup current(6)
PB7–PB0 (with pullup)
IIn
0.5
20
Capacitance
Ports (as input or output)
RESET, IRQ, OSC1, TCAP, PD7, PD5, PD0
COut
CIn
—
—
—
—
12
8
pF
1. VDD = 3.3 Vdc 0.3 Vdc, VSS = 0 Vdc, TA = –40 to +125°C, unless otherwise noted
2. Typical values reflect measurements taken on average processed devices at the midpoint of voltage range, 25°C only.
3. Run (operating) IDD measured using external square wave clock source; all I/O pins configured as inputs, port B = VDD
,
all other inputs VIL = 0.2 V, VIH = VDD –0.2 V; no dc loads; less than 50 pF on all outputs; CL = 20 pF on OSC2
4. Wait IDD measured using external square wave clock source; all I/O pins configured as inputs, port B = VDD, all other
inputs VIL = 0.2 V, VIH = VDD –0.2 V; no dc loads; less than 50 pF on all outputs; CL = 20 pF on OSC2. Wait IDD is
affected linearly by the OSC2 capacitance.
5. Stop IDD measured with OSC1 = 0.2 V; all I/O pins configured as inputs, port B = VDD, all other inputs VIL = 0.2 V,
VIH = VDD –0.2 V
6. Input pullup current measured with VIL = 0.2 V
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
91
Electrical Specifications
VDD = 5.5 V
T = –40° to 85°
5.00 mA
4.00 mA
3.00 mA
2.00 mA
1.00 mA
50 mA
STOP IDD
0.5 MHz
1.0 MHz
1.5 MHz
2.0 MHz
INTERNAL CLOCK FREQUENCY (XTAL ÷ 2)
Figure 12-2. Maximum Supply Current versus Internal Clock Frequency, VDD = 5.5 V
VDD = 3.6 V
T = –40° to 85°
1.50 mA
1.00 mA
500 mA
STOP IDD
0.5 MHz
1.0 MHz
Figure 12-3. Maximum Supply Current versus Internal Clock Frequency, VDD = 3.6 V
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
92
Freescale Semiconductor
5.0-Volt Control Timing
12.7 5.0-Volt Control Timing
Characteristic(1)
Symbol
Min
Max
Unit
Frequency of operation
Crystal
External clock
fOSC
—
dc
4.2
4.2
MHz
Internal operating frequency (fOSC ÷ 2)
fOP
—
dc
2.1
2.1
MHz
Crystal
External clock
Cycle time
tcyc
tOXOV
tILCH
tRL
480
—
—
100
100
—
ns
ms
ms
tcyc
Crystal oscillator startup time
Stop recovery startup time (crystal oscillator)
RESET pulse width
—
1.5
Timer
Resolution(2)
Input capture pulse width
Input capture pulse period
tRESL
tTH, tTL
tTLTL
4.0
—
—
—
tcyc
ns
tcyc
125
(3)
Interrupt pulse width low (edge-triggered)
Interrupt pulse period
tILIH
tILIL
125
—
—
—
ns
tcyc
ns
(4)
OSC1 pulse width
tOH, tOL
90
1. VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = –40 to +125°C, unless otherwise noted
2. Because a 2-bit prescaler in the timer must count four internal cycles (tCYC), this is the limiting minimum factor in deter-
mining the timer resolution.
3. The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt
service routine plus 24 tCYC
4. The minimum tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus
19 tCYC
.
.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
93
Electrical Specifications
12.8 3.3-Volt Control Timing
(1)
Symbol
Min
Max
Unit
Characteristic
Frequency of operation
Crystal
External clock
fOSC
—
dc
2.0
2.0
MHz
Internal operating frequency (fOSC ÷ 2)
fOP
—
dc
1.0
1.0
MHz
Crystal
External clock
Cycle time
tcyc
tOXOV
tILCH
tRL
1000
—
—
100
100
—
ns
ms
ms
tcyc
Crystal oscillator start-up time
Stop recovery start-up time (crystal oscillator)
RESET pulse width
—
1.5
Timer
Resolution(2)
Input capture pulse width
Input capture pulse period
tRESL
tTH, tTL
tTLTL
4.0
—
—
—
tcyc
ns
tcyc
125
(3)
Interrupt pulse width low (edge-triggered)
Interrupt pulse period
tILIH
tILIL
250
—
—
—
ns
tcyc
ns
(4)
OSC1 pulse width
tOH, tOL
200
1. VDD = 3.3 Vdc 0.3 Vdc, VSS = 0 Vdc, TA = –40 to +125°C, unless otherwise noted
2. Because a 2-bit prescaler in the timer must count four internal cycles (tCYC), this is the limiting minimum factor in deter-
mining the timer resolution.
3. The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt
service routine plus 24 tCYC
.
4. The minimum tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus
19 tCYC
.
(1)
(1)
(1)
tTH
tTL
tTLTL
TCAP PIN
1. Refer to timer resolution data in 12.7 5.0-Volt Control Timing and 12.8 3.3-Volt Control Timing.
Figure 12-4. TCAP Timing Relationships
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
94
Freescale Semiconductor
3.3-Volt Control Timing
tILIL
tILIH
IRQ PIN
a. Edge-Sensitive Trigger Condition. The minimum pulse width (tILIH) is either 125 ns (fOP = 2.1 MHz)
or 250 ns (fOP = 1 MHz). The period tILIL should not be less than the number of tCYC cycles it takes to
execute the interrupt service routine plus 19 tCYC cycles.
tILIH
IRQ1
.
.
.
NORMALLY
USED WITH
WIRED-OR
IRQN
CONNECTION
IRQ
(INTERNAL)
b. Level-Sensitive Trigger Condition. If after servicing an interrupt the IRQ remains low,
the next interrupt is recognized.
Figure 12-5. External Interrupt Timing
OSC(1)
RESET
IRQ(2)
tRL
tILIH
4064 tCYC
IRQ(3)
INTERNAL
CLOCK
$3FFE
$3FFE
$3FFE
$3FFE
$3FFE
$3FFF4
Notes:
RESET OR INTERRUPT
VECTOR FETCH
1. Represents the internal clocking of the OSC1 pin
2. IRQ pin edge-sensitive mask option
3. IRQ pin level- and edge-sensitive mask option
4. RESET vector address shown for timing example
Figure 12-6. Stop Recovery Timing Diagram
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
95
Electrical Specifications
NOTE 1
VDD
OSC1 PIN(2)
4064 tCYC
INTERNAL
CLOCK(3)
INTERNAL
$3FFE
$3FFE
$3FFE
$3FFE
$3FFE
$3FFE
$3FFF
ADDRESS BUS(3)
INTERNAL
NEW
PCH
NEW
PCL
DATA BUS(3)
NOTE 4
RESET PIN
Notes:
1. Power-on reset threshold is typically between 1 V and 2 V.
2. OSC1 line is meant to represent time only, not frequency.
3. Internal clock, internal address bus, and internal data bus are not available externally.
4. RESET outputs VOL during 4064 POR cycles.
Figure 12-7. Power-On Reset Timing Diagram
INTERNAL
CLOCK(1)
INTERNAL
$3FFE
$3FFE
$3FFE
$3FFE
$3FFF
NEW PC
OP
ADDRESS BUS(1)
INTERNAL
NEW
PCH
NEW
PCL
DATA BUS(1)
CODE
RESET(2)
tRL
Notes:
1. Internal clock, internal address bus, and internal data bus are not available externally.
2. The next rising edge of the internal clock after the rising edge of RESET initiates the reset sequence.
Figure 12-8. External Reset Timing
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
96
Freescale Semiconductor
5.0-Volt Serial Peripheral Interface Timing
12.9 5.0-Volt Serial Peripheral Interface Timing
Characteristic(1)
No.
Symbol
Min
Max
Unit
Operating frequency
Master
Slave
fOP(M)
fOP(S)
fOP
MHz
dc
dc
0.5
2.1
Cycle time
Master
Slave
tCYC(M)
tCYC(S)
tCYC
ns
1
2
3
4
5
6
7
2.0
480
—
—
Enable lead time
Master
Slave
Note(2)
240
tLead(M)
tLead(S)
—
—
ns
ns
ns
ns
ns
ns
Enable lag time
Master
Slave
Note(2)
720
tLag(M)
tLag(S)
—
—
Clock (SCK) high time
Master
Slave
tW(SCKH)M
tW(SCKH)S
340
190
—
—
Clock (SCK) low time
Master
Slave
tW(SCKL)M
tW(SCKL)S
340
190
—
—
Data setup time (inputs)
Master
Slave
tSU(M)
tSU(S)
100
100
—
—
Data hold time (inputs)
Master
Slave
tH(M)
tH(S)
100
100
—
—
Slave access time (time to data active from
high-impedance state)
tA
8
9
0
120
240
ns
ns
tDIS
Slave disable time (hold time to high-impedance state)
—
Data Valid
tV(M)
tV(S)
Master (before capture edge)
Slave (after enable edge)(3)
tCYC(M)
ns
10
11
12
13
0.25
—
—
240
Data hold time (outputs)
Master (after capture edge)
Slave (after enable edge)
tHO(M)
tHO(S)
tCYC(M)
ns
0.25
0
—
—
Rise time (20% VDD to 70% VDD, CL = 200 pF)
SPI outputs (SCK, MOSI, and MISO)
SPI inputs (SCK, MOSI, MISO, and SS)
tRM
tRS
—
—
100
2.0
ns
µs
Fall time (70% VDD to 20% VDD, CL = 200 pF)
SPI outputs (SCK, MOSI, and MISO)
SPI inputs (SCK, MOSI, MISO, and SS)
tFM
tFS
—
—
100
2.0
ns
µs
1. VDD = 5.0 Vdc 10%; VSS = 0 Vdc, TA = –40 to +125°C, unless otherwise noted. Refer to Figure 12-9 and Figure 12-10
for timing diagrams.
2. Signal production depends on software.
3. Assumes 200 pF load on all SPI pins
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
97
Electrical Specifications
12.10 3.3-Volt Serial Peripheral Interface Timing
Characteristic(1)
No.
Symbol
Min
Max
Unit
Operating frequency
Master
Slave
fOP(M)
fOP(S)
fOP
MHz
dc
dc
0.5
1.0
Cycle time
Master
Slave
tCYC(M)
tCYC(S)
tCYC
ns
1
2
3
4
5
6
7
2.0
1.0
—
—
Enable lead time
Master
Slave
tLead(M)
tLead(S)
Note 2
500
—
—
ns
ns
ns
ns
ns
ns
Enable lag time
Master
Slave
tLag(M)
tLag(S)
Note 2
1.5
—
—
Clock (SCK) high time
Master
Slave
tW(SCKH)M
tW(SCKH)S
720
400
—
—
Clock (SCK) low time
Master
Slave
tW(SCKL)M
tW(SCKL)S
720
400
—
—
Data setup time (inputs)
Master
Slave
tSU(M)
tSU(S)
200
200
—
—
Data hold time (inputs)
Master
Slave
t
200
200
—
—
H(M)
tH(S)
Slave access time (time to data active
from high-impedance state)
tA
8
9
0
250
500
ns
ns
tDIS
Slave disable time (hold time to high-impedance state)
—
Data valid
tV(M)
tV(S)
Master (before capture edge)
Slave (after enable edge)(3)
tCYC(M)
ns
10
11
12
13
0.25
—
—
500
Data hold time (outputs)
Master (after capture edge)
Slave (after enable edge)
tHO(M)
tHO(S)
tCYC(M)
ns
0.25
0
—
—
Rise time (20% VDD to 70% VDD, CL = 200 pF)
SPI outputs (SCK, MOSI, and MISO)
SPI inputs (SCK, MOSI, MISO, and SS)
tRM
tRS
—
—
200
2.0
ns
µs
Fall time (70% VDD to 20% VDD, CL = 200 pF)
SPI outputs (SCK, MOSI, and MISO)
SPI inputs (SCK, MOSI, MISO, and SS)
tFM
tFS
—
—
200
2.0
ns
µs
1. VDD = 3.3 Vdc 0.3 Vdc; VSS = 0 Vdc, TA = –40 to +125°C, unless otherwise noted. Refer to Figure 12-9 and
Figure 12-10 for timing diagrams.
2. Signal production depends on software.
3. Assumes 200 pF load on all SPI pins
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
98
Freescale Semiconductor
3.3-Volt Serial Peripheral Interface Timing
SS
INPUT
SS pin of master held high.
1
12
13
12
13
5
4
SCK (CPOL = 0)
OUTPUT
NOTE
4
5
12
SCK (CPOL = 1)
OUTPUT
NOTE
6
7
MISO
INPUT
MSB IN
BITS 6–1
BITS 6–1
LSB IN
10 (ref)
11
MASTER MSB OUT
10
11 (ref)
MOSI
OUTPUT
MASTER LSB OUT
12
13
Note: This first clock edge is generated internally, but is not seen at the SCK pin.
a) SPI Master Timing (CPHA = 0)
SS
INPUT
SS pin of master held high.
1
13
12
12
SCK (CPOL = 0)
OUTPUT
5
4
NOTE
NOTE
4
5
13
SCK (CPOL = 1)
OUTPUT
6
7
MISO
INPUT
MSB IN
BITS 6–1
BITS 6–1
LSB IN
10 (ref)
MOSI
11
MASTER MSB OUT
10
11
MASTER LSB OUT
12
OUTPUT
13
Note: This last clock edge is generated internally, but is not seen at the SCK pin.
b) SPI Master Timing (CPHA = 1)
Figure 12-9. SPI Master Timing Diagram
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
99
Electrical Specifications
SS
INPUT
1
13
12
3
SCK (CPOL = 0)
INPUT
5
4
4
5
2
SCK (CPOL = 1)
INPUT
8
12
11
13
9
MISO
INPUT
SLAVE MSB OUT
BITS 6–1
BITS 6–1
SLAVE LSB OUT
NOTE
10
6
7
11
MOSI
OUTPUT
MSB IN
LSB IN
Note: Not defined but normally MSB of character just received
a) SPI Slave Timing (CPHA = 0)
SS
INPUT
1
13
12
SCK (CPOL = 0)
INPUT
5
4
4
5
2
3
SCK (CPOL = 1)
INPUT
10
SLAVE MSB OUT
12
13
9
8
MISO
OUTPUT
NOTE
BITS 6–1
BITS 6–1
SLAVE LSB OUT
10
6
7
11
MOSI
INPUT
MSB IN
LSB IN
Note: Not defined but normally LSB of character previously transmitted
a) SPI Slave Timing (CPHA = 1)
Figure 12-10. SPI Slave Timing Diagram
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
100
Freescale Semiconductor
Chapter 13
Mechanical Specifications
13.1 Introduction
This section describes the dimensions of the plastic dual in-line package (DIP), plastic shrink dual in-line
package (SDIP), plastic-leaded chip carrier (PLCC), and quad flat pack (QFP) MCU packages.
Package dimensions available at the time of this publication are provided in this section.
To make sure that you have the latest case outline specifications, contact one of the following:
•
•
Local Freescale Sales Office
World Wide Web at http://www.freescale.com
Follow World Wide Web on-line instructions to retrieve the current mechanical specifications.
13.2 40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03)
NOTES:
1. POSITION TOLERANCE OF LEADS (D), SHALL
BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITIONS, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
40
21
20
B
1
MILLIMETERS
INCHES
DIM
MIN
MAX
MIN
MAX
A
B
C
D
F
51.69
13.72
3.94
52.45
14.22
5.08
2.035
0.540
0.155
0.014
0.040
2.065
0.560
0.200
0.022
0.060
L
A
C
0.36
0.56
N
1.02
1.52
2.54 BSC
0.100 BSC
G
H
J
J
1.65
0.20
2.92
2.16
0.38
3.43
0.065
0.008
0.115
0.085
0.015
0.135
K
SEATING
PLANE
M
H
G
F
D
K
L
15.24 BSC
0.600 BSC
0°
0.51
1°
1.02
0°
0.020
1°
0.040
M
N
Figure 13-1. 40-Pin Plastic DIP Package (Case 711-03)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
101
Mechanical Specifications
13.3 42-Pin Plastic Shrink Dual In-Line (SDIP) Package (Case 858-01)
-A-
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
42
1
22
21
-B-
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
INCHES
MIN MAX
MILLIMETERS
MIN MAX
L
DIM
A
B
C
D
F
1.435 1.465 36.45 37.21
0.540 0.560 13.72 14.22
H
C
0.155 0.200
0.014 0.022
0.032 0.046
0.070 BSC
3.94
0.36
0.81
5.08
0.56
1.17
G
H
J
1.778 BSC
7.62 BSC
0.300 BSC
-T-
SEATING
PLANE
0.008 0.015
0.115 0.135
0.600 BSC
0.20
2.92
0.38
3.43
K
L
N
G
15.24 BSC
M
F
M
N
0° 15°
0.020 0.040
0°
0.51
15°
1.02
K
J 42 PL
0.25 (0.010)
D 42 PL
M
S
B
M
S
A
T
0.25 (0.010)
T
Figure 13-2. 42-Pin Plastic SDIP Package (Case 858-01)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
102
Freescale Semiconductor
44-Lead Plastic-Leaded Chip Carrier (PLCC) (Case 777-02)
13.4 44-Lead Plastic-Leaded Chip Carrier (PLCC) (Case 777-02)
M
S
S
N
0.007(0.180)
T
L-M
B
D
-N-
YBRK
-M-
M
S
S
0.007(0.180)
T
L-M
N
U
Z
-L-
V
X
G1
0.010 (0.25)
W
D
44
1
S
S
S
N
T
L-M
VIEW D-D
M
M
S
S
S
S
A
R
0.007(0.180)
0.007(0.180)
T
T
L-M
L-M
N
N
M
S
S
N
0.007(0.180)
T
L-M
H
Z
J
K1
E
0.004 (0.10)
G
K
C
SEATING
PLANE
-T-
G1
F
VIEW S
S
S
N
S
M
S
S
0.010 (0.25)
T
L-M
0.007(0.180)
T
L-M
N
VIEW S
NOTES:
INCHES
MILLIMETERS
1. DATUMS -L-, -M-, AND -N- ARE DETERMINED
WHERE TOP OF LEAD SHOLDERS EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSION R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE DETER-
DIM
A
MIN
MAX
MIN
17.40
17.40
4.20
MAX
17.65
17.65
4.57
0.685
0.685
0.165
0.090
0.013
0.695
0.695
0.180
0.110
0.019
B
C
E
2.29
2.79
F
0.33
0.48
G
H
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.650
0.650
0.032
0.66
0.51
0.81
J
K
0.64
R
0.656
0.656
0.048
0.048
0.056
0.020
10°
16.51
16.51
1.07
16.66
16.66
1.21
1.21
1.42
0.50
10°
U
MINED
V
0.042
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY EXCLUSIVE OF THE MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
7. DIMINSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTUSION(S) SHALL NOT CAUSE THE H
DIMINSION TO BE GREATER THAN 0.037
(0.940104). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMINISION TO SMALLER
THAN 0.025 (0.635).
W
X
0.042
0.042
1.07
1.07
Y
2°
0.610
2°
15.50
1.02
Z
G1
K1
0.630
16.00
0.040
Figure 13-3. 44-Lead PLCC (Case 777-02)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
103
Mechanical Specifications
13.5 44-Lead Quad Flat Pack (QFP) (Case 824A-01)
L
33
23
34
22
B
B
-A,B,D-
-A-
-B-
L
B
V
DETAIL A
DETAIL A
44
12
1
11
F
-D-
A
C
BASE METAL
M
S
S
S
0.20 (0.008)
A-B
A-B
D
0.05 (0.002) A-B
S
J
N
M
S
0.20 (0.008)
D
H
D
M
S
S
D
0.20 (0.008)
C
A-B
M
DETAIL C
SECTION B–B
E
C
DATUM
PLANE
-H-
-C-
SEATING
PLANE
0.01 (0.004)
H
G
M
MILLIMETERS
MIN MAX
INCHES
MIN MAX
NOTES:
DIM
A
B
C
D
E
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
9.90 10.10
9.90 10.10
0.390 0.398
0.390 0.398
0.083 0.096
0.012 0.018
0.079 0.083
0.012 0.016
0.031 BSC
M
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE ĆHĆ IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS ĆAĆ, ĆBĆ AND ĆDĆ TO BE DETERMINED AT
DATUM PLANE ĆHĆ.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE ĆCĆ.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCHAND ARE DETERMINED
AT DATUM PLANE ĆHĆ.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
2.10
0.30
2.00
0.30
2.45
0.45
2.10
0.40
T
F
0.80 BSC
G
H
J
Ċ
0.25
0.23
0.95
Ċ
0.010
DATUM
-H-
PLANE
0.13
0.65
0.005 0.009
0.026 0.037
0.315 REF
R
K
L
8.00 REF
M
N
Q
R
S
5°
0.13
10°
0.17
7°
5°
0.005 0.007
0° 7°
10°
0°
0.13
K
0.30
0.005 0.012
Q
W
12.95 13.45
0.510 0.530
T
0.13
0°
Ċ
Ċ
0.005
0°
Ċ
Ċ
X
U
V
12.95 13.45
Ċ
0.510 0.530
0.016
W
X
0.40
1.6 REF
Ċ
0.063 REF
DETAIL C
Figure 13-4. 44-Lead QFP (Case 824A-01)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
104
Freescale Semiconductor
Chapter 14
Ordering Information
14.1 Introduction
This section contains ordering information for the available package types.
14.2 MC Order Numbers
Table 14-1 shows the MC order numbers for the available package types.
Table 14-1. MC Order Numbers
Temperature
Package Type
Range
Order Number
0°C to 70°C
–40°C to 125°C
0°C to 70°C
MC68HC05C9AP
MC68HC05C9AMP
MC68HC05C9AB
40-pin plastic dual in-line package (DIP)
42-pin shrink dual in-line package (SDIP)
44-lead plastic-leaded chip carrier (PLCC)
44-pin quad flat pack (QFP)
–40°C to 125°C
0°C to 70°C
MC68HC05C9AMB
MC68HC05C9AFN
MC68HC05C9AMFN
MC68HC05C9AFB
MC68HC05C9AMFB
–40°C to 125°C
0°C to 70°C
–40°C to 125°C
1. P = Plastic dual in-line package (PDIP)
2. B = Shrink dual in-line package (SDIP)
3. FN = Plastic-leaded chip carrier (PLCC)
4. FB = Quad flat pack (QFP)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
105
Ordering Information
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
106
Freescale Semiconductor
Appendix A
MC68HCL05C9A
A.1 Introduction
Appendix A describes the MC68HCL05C9A, a low-power version of the MC68HC05C9A. The technical
data applying to the MC68HC05C9A applies to the MC68HCL05C9 with the exceptions given in this
appendix.
A.2 Operating Temperature
The data shown here replaces the corresponding data in 12.2 Operating Temperature.
Rating
Symbol
Value
Unit
Operating temperature range
MC68HCL05C9AP, FN, B, FB(1)
TL to TH
0 to +70
TA
°C
1. P = Plastic dual in-line package (PDIP)
FN = Plastic-leaded chip carrier (PLCC)
B = Shrink dual in-line package (SDIP)
FB = Quad flat pack (QFP)
A.3 DC Electrical Characeristics
The data in 12.5 5.0-Volt DC Electrical Characteristics and 12.6 3.3-Volt DC Electrical Characteristics
applies to the MC68HCL05C9A with the exceptions given here.
A.3.1 1.8–2.4-Volt Low-Power Output Voltage
Characteristic(1)
Symbol
Min
Typ
Max
Unit
Output high voltage
(ILoad = –0.1 mA) PA7–PA0, PB7–PB0, PC6–PC0,
VDD –0.3
VDD –0.3
VDD –0.3
TCMP, PD7, PD0
(ILoad = –0.2 mA) PD5–PD1
(ILoad = –0.75 mA) PC7
VOH
—
—
—
—
—
—
V
Output low voltage
(ILoad = 0.2 mA) PA7–PA0, PB7–PB0, PC6–PC0, PD7,
PD5–PD0, TCMP
(ILoad = 2.0 mA) PC7
VOL
V
—
—
—
—
0.3
0.3
1. VDD = 1.8–2.4 Vdc
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
107
MC68HCL05C9A
A.3.2 1.8–2.4-Volt Input Pullup Current
Characteristic(1)
Symbol
Min
Typ
Max
Unit
Input pullup current
PB7–PB0 (with pullup)
IIn
0.45
1.5
6.5
µA
1. VDD = 1.8–2.4 Vdc
A.3.3 2.5–3.6-Volt Low-Power Output Voltage
Characteristic
Symbol
Min
Typ
Max
Unit
Output high voltage(1)
(ILoad = –0.2 mA) PA7–PA0, PB7–PB0, PC6–PC0,
TCMP, PD7, PD0
(ILoad = –0.4 mA) PD5–PD1
(ILoad = –1.5 mA) PC7
VDD – 0.3
VDD – 0.3
VDD – 0.3
VOH
—
—
—
—
—
—
V
Output low voltage
(ILOAD = 0.4 mA) PA7–PA0, PB7–PB0, PC6–PC0, PD7,
VOL
V
PD5–PD0, TCMP
(ILOAD = 5.0 mA) PC7
—
—
—
—
0.3
0.3
1. VDD = 2.5–3.6 Vdc
A.3.4 2.6–3.6-Volt Input Pullup Current
Characteristic(1)
Symbol
Min
Typ
Max
Unit
Input pullup current
PB7–PB0 (with pullup)
IIn
1
5
16
µA
1. VDD = 2.5–3.6 Vdc
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
108
Freescale Semiconductor
DC Electrical Characeristics
A.3.5 Low-Power Supply Current
Characteristic(1)
Symbol
Min
Typ
Max
Unit
Supply current (4.5–5.5 Vdc @ fBus = 2.1 MHz)
Run(2)
Wait(3)
Stop(4)
—
—
3.5
1.6
4.25
2.25
mA
mA
IDD
—
—
1
2
15
25
µA
µA
25°C
0°C to +70°C (standard)
Supply current (2.4–3.6 Vdc @ fBus = 1.0 MHz)
Run(2)
Wait(3)
Stop(4)
—
—
1.00
0.7
1.4
1.0
mA
mA
IDD
IDD
IDD
—
—
1
1
5
10
µA
µA
25 °C
0 °C to +70 °C (standard)
Supply current (2.5–3.6 Vdc @ fBus = 500 kHz)
Run(2)
Wait(3)
Stop(4)
—
—
500
300
750
500
µA
µA
—
—
1
1
5
10
µA
µA
25 °C
0 °C to +70 °C (standard)
Supply current (1.8–2.4 Vdc @ fBus = 500 kHz)
Run(2)
Wait(3)
Stop(4)
—
—
300
250
600
400
µA
µA
—
—
1
1
2
5
µA
µA
25 °C
0 °C to +70 °C (standard)
1. Typical values reflect measurements taken on average processed devices at the midpoint of voltage range, 25°C only.
2. Run (operating) IDD measured using external square wave clock source; all I/O pins configured as inputs,
port B = VDD, all other inputs VIL = 0.2 V, VIH = VDD –0.2 V; no DC loads; less than 50 pF on all outputs;
CL = 20 pF on OSC2
3. Wait IDD measured using external square wave clock source; all I/O pins configured as inputs, port B = VDD, all other
inputs VIL = 0.2 V, VIH = VDD–0.2 V; no DC loads; less than 50 pF on all outputs; CL = 20 pF on OSC2. Wait IDD is affected
linearly by the OSC2 capacitance.
4. Stop IDD measured with OSC1 = 0.2 V; all I/O pins configured as inputs, Port B = VDD, all other inputs VIL = 0.2 V,
VIH = VDD–0.2 V
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
109
MC68HCL05C9A
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
110
Freescale Semiconductor
Appendix B
MC68HSC05C9A
B.1 Introduction
Appendix B describes the MC68HSC05C9A, a high-speed version of the MC68HC05C9A. The technical
data applying to the MC68HC05C9A applies to the MC68HSC05C9A with the exceptions given in this
appendix.
B.2 Operating Temperature
The data shown here replaces the corresponding data in 12.2 Operating Temperature.
Rating
Symbol
Value
Unit
Operating temperature range(1)
MC68HSC05C9AP, FN, B, FB
TL to TH
0 to +70
TA
°C
–40 to +85
MC68HSC05C9ACP, CFN, CB, CFB
1. P = Plastic dual in-line package (PDIP)
FN = Plastic-leaded chip carrier (PLCC)
C = Extended temperature range (–40°C to +85°C)
B = Shrink dual in-line package (SDIP)
FB = Quad flat pack (QFP)
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
111
MC68HSC05C9A
B.3 DC Electrical Characeristics
The data in 12.5 5.0-Volt DC Electrical Characteristics and 12.6 3.3-Volt DC Electrical Characteristics
applies to the MC68HSC05C9A with the exceptions given here.
B.3.1 High-Speed Supply Current
Characteristic(1)
Symbol
Min
Typ
Max
Unit
Supply current (4.5–5.5 Vdc @ fBus = 4.0 MHz)
Run(2)
Wait(3)
Stop(4)
—
—
7.00
2.00
11.0
6.50
mA
mA
IDD
—
—
—
1
1.0
7.0
20
40
50
µA
µA
µA
25°C
0°C to 70°C (standard)
–40°C to 85°C (standard)
Supply current (2.4–3.6 Vdc @ fBus = 2.0 MHz)
Run(2)
Wait(3)
Stop(4)
—
—
2.50
1.00
4.00
2.00
mA
mA
IDD
—
—
—
1
1.0
2.5
8
16
20
µA
µA
µA
25°C
0°C to 70°C (standard)
–40°C to 85°C (standard)
1. Typical values reflect measurements taken on average processed devices at the midpoint of voltage range, 25°C only.
2. Run (operating) IDD measured using external square wave clock source; all I/O pins configured as inputs, port B = VDD, all
other inputs VIL = 0.2 V, VIH = VDD–0.2 V; no dc loads; less than 50 pF on all outputs; CL = 20 pF on OSC2
3. Wait IDD measured using external square wave clock source; all I/O pins configured as inputs, Port B = VDD, all other
inputs VIL = 0.2 V, VIH = VDD –0.2 V; no dc loads; less than 50 pF on all outputs; CL = 20 pF on OSC2. Wait IDD is affected
linearly by the OSC2 capacitance
4. Stop IDD measured with OSC1 = 0.2 V; all I/O pins configured as inputs, port B = VDD, all other inputs VIL = 0.2 V,
VIH = VDD–0.2 V
B.3.2 Input Pullup Current
Characteristic
Symbol
Min
Typ
Max
Unit
Input pullup current (VDD = 4.5–5.5 V)
PB7–PB0 (with pullup)
IIn
5
15
60
µA
Input pullup current (VDD = 2.4–3.6 V)
PB7–PB0 (with pullup)
IIn
1
5
16
µA
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
112
Freescale Semiconductor
Control Timing
B.4 Control Timing
The data in 12.7 5.0-Volt Control Timing and 12.8 3.3-Volt Control Timing applies to the MC68HSC05C9A
with the exceptions given here.
B.4.1 4.5–5.5-Volt High-Speed Control Timing
Characteristic(1)
Symbol
Min
Max
Unit
Oscillator frequency
Crystal
External clock
fOSC
—
dc
8.2
8.2
MHz
Internal operating frequency (fOSC ÷ 2)
Crystal
fOP
—
dc
4.1
4.1
MHz
External clock
tcyc
Cycle time
244
—
100
100
—
ns
ms
ms
tcyc
tOXOV
tILCH
Crystal oscillator startup time
Stop recovery startup time
RESET pulse width
Timer
Resolution(2)
Input capture pulse width
Input capture pulse width
t
1.5
RL
tRESL
tTH or tTL
tTHT
tILIH
tILIL
tcyc
ns
tcyc
4.0
64
Note(3)
—
—
—
l
Interrupt pulse width low (edge-triggered)
Interrupt pulse period
64
—
—
—
ns
Note(4)
50
tcyc
tOH or tOL
OSC1 pulse width
ns
1. VDD = 4.5–5.5 Vdc
2. Because a 2-bit prescaler in the timer must count four internal cycles (tcyc), this is the limiting minimum factor in determining
the timer resolution.
3. The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt service
routine plus 24 tcyc
4. The minimum tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus
19 tcyc
.
.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
113
MC68HSC05C9A
B.4.2 2.4–3.6-Volt High-Speed Control Timing
Characteristic(1)
Symbol
Min
Max
Unit
Oscillator frequency
Crystal
External Clock
fOSC
—
dc
4.2
4.2
MHz
Internal operating frequency (fOSC ÷ 2)
Crystal
fOP
—
dc
2.1
2.1
MHz
External clock
tcyc
tOXOV
tILCH
tRL
Cycle time
480
—
—
100
100
—
ns
ms
ms
tcyc
Crystal oscillator startup time
Stop recovery startup time
RESET pulse width
Timer
—
1.5
tRESL
tTH or tTL
tTHTL
Resolution(2)
Input capture pulse width
Input capture pulse width
tcyc
ns
tcyc
4.0
125
Note(3)
—
—
—
tILIH
tILIL
Interrupt pulse width low (edge-triggered)
Interrupt pulse period
125
—
—
—
ns
Note(4)
90
tcyc
tOH or tOL
OSC1 pulse width
ns
1. VDD = 2.4–3.6 Vdc
2. Because a 2-bit prescaler in the timer must count four internal cycles (tcyc), this is the limiting minimum factor in determining
the timer resolution.
3. The minimum period tTLTL should not be less than the number of cycle times it takes to execute the capture interrupt service
routine plus 24 tcyc
4. The minimum tILIL should not be less than the number of cycle times it takes to execute the interrupt service routine plus
19 tcyc
.
.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
114
Freescale Semiconductor
Control Timing
B.4.3 4.5–5.5-Volt High-Speed Control Timing
Characteristic(1)
Num
Symbol
Min
Max
Unit
Operating frequency
Master
Slave
fOP(M)
fOP(S)
fOP
MHz
dc
dc
0.5
4.1
Cycle time
Master
Slave
tcyc(M)
tcyc(S)
tcyc
ns
1
2
3
4
5
6
7
2.0
244
—
—
Enable lead time
Master
Slave
Note(2)
122
tLead(M)
tLead(S)
—
—
ns
ns
ns
ns
ns
ns
Enable lag time
Master
Slave
Note(2)
366
tLag(M)
tLag(S)
—
—
Clock (SCK) high time
Master
Slave
tW(SCKH)M
tW(SCKH)S
166
93
—
—
Clock (SCK) low time
Master
Slave
tW(SCKL)M
tW(SCKL)S
166
93
—
—
Data setup time (inputs)
Master
Slave
tSU(M)
tSU(S)
49
49
—
—
Data hold time (inputs)
Master
Slave
tH(M)
tH(S)
49
49
—
—
Slave access time (time to data active from
high-impedance state)
tA
8
9
0
61
ns
ns
tDIS
Slave disable time (hold time to high-impedance state)
—
122
Data valid
tV(M)
tV(S)
Master (before capture edge)
Slave (after enable edge)(3)
tcyc(M)
ns
10
11
12
13
0.25
—
—
122
Data hold time (outputs)
Master (after capture edge)
Slave (after enable edge)
tHO(M)
tHO(S)
tcyc(M)
ns
0.25
0
—
—
Rise time (20% VDD to 70% VDD, CL = 200 pF)
SPI outputs (SCK, MOSI, and MISO)
SPI inputs (SCK, MOSI, MISO, and SS)
tRM
tRS
—
—
50
1.0
ns
µs
Fall time (70% VDD to 20% VDD, CL = 200 pF)
SPI outputs (SCK, MOSI, and MISO)
SPI inputs (SCK, MOSI, MISO, and SS)
tFM
tFS
—
—
50
1.0
ns
µs
1. VDD = 4.5–5.5 Vdc
2. Signal production depends on software.
3. Assumes 200 pF load on all SPI pins
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
115
MC68HSC05C9A
B.4.4 2.4–3.6-Volt High-Speed SPI Timing
Characteristic(1)
Num
Symbol
Min
Max
Unit
Operating frequency
Master
Slave
fOP(M)
fOP(S)
fOP
MHz
dc
dc
0.5
2.1
Cycle time
Master
Slave
tcyc(M)
tcyc(S)
tcyc
ns
1
2
3
4
5
6
7
2.0
480
—
—
Enable lead time
Master
Slave
Note(2)
240
tLead(M)
tLead(S)
—
—
ns
ns
ns
ns
ns
ns
Enable lag time
Master
Slave
Note(2)
720
tLag(M)
tLag(S)
—
—
Clock (SCK) high time
Master
Slave
tW(SCKH)M
tW(SCKH)S
340
190
—
—
Clock (SCK) low time
Master
Slave
tW(SCKL)M
tW(SCKL)S
340
190
—
—
Data setup time (inputs)
Master
Slave
tSU(M)
tSU(S)
100
100
—
—
Data hold time (inputs)
Master
Slave
tH(M)
tH(S)
100
100
—
—
Slave access time (time to data active from
high-impedance state)
tA
8
9
0
120
240
ns
ns
tDIS
Slave disable time (hold time to high-impedance state)
—
Data valid
tV(M)
tV(S)
Master (before capture edge)
Slave (after enable edge)(3)
tcyc(M)
ns
10
11
12
13
0.25
—
—
240
Data hold time (outputs)
Master (after capture edge)
Slave (after enable edge)
tHO(M)
tHO(S)
tcyc(M)
ns
0.25
0
—
—
Rise time (20% VDD to 70% VDD, CL = 200 pF)
SPI outputs (SCK, MOSI, and MISO)
SPI inputs (SCK, MOSI, MISO, and SS)
tRM
tRS
—
—
100
2.0
ns
µs
Fall time (70% VDD to 20% VDD, CL = 200 pF)
SPI outputs (SCK, MOSI, and MISO)
SPI inputs (SCK, MOSI, MISO, and SS)
tFM
tFS
—
—
100
2.0
ns
µs
1. VDD = 2.4–3.6 Vdc
2. Signal production depends on software.
3. Assumes 200 pF load on all SPI pins
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
116
Freescale Semiconductor
Appendix C
Self-Check Mode
C.1 Introduction
This appendix describes the self-check mode.
C.2 Self-Check Mode
Self-check mode is entered upon the rising edge of RESET if the IRQ pin is at Vtst and the TCAP pin is
at logic 1.
C.2.1 Self-Check Tests
The self-check read-only memory (ROM) at mask ROM location $3F00–$3FEF determines if the
microcontroller unit (MCU) is functioning properly.
These tests are performed:
1. Input/output (I/O) — Functional test of ports A, B, and C
2. Random-access memory (RAM) — Counter test for each RAM byte
3. Timer — Test of counter register and OCF bit
4. Serial communications interface (SCI) — Transmission test; checks for RDRF, TDRE, TC, and FE
flags
5. ROM — Exclusive OR with odd ones parity result
6. Serial peripheral interface (SPI) — Transmission test; checks for SPIF and WCOL flags
The self-check circuit is shown in Figure C-1.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
117
Self-Check Mode
V
V
DD
DD
10 V
V
DD
MC34064
MC68HC05C9A
4.7 kΩ
RESET
V
DD
1
2
3
4
5
40
39
38
37
36
IRQ
NC
OSC1
OSC2
TCAP
PD7
4 MHz
PA7
PA6
10 MΩ
20 pF
V
DD
PA5
PA4
PA3
PA2
PA1
PA0
PB0
PB1
TCMP
6
35
34
33
32
31
30
29
28
20 pF
10K
PD5/SS
7
1 MΩ
PD4/SCK
PD3/MOSI
PD2/MISO
PD1/TDO
PD0/RDI
PC0
8
9
10
11
12
13
PB2
PB3
PC1
PC2
14
15
27
26
CMOS
BUFFER
(MC74HC125)
PB4
PB5
PB6
PB7
PC3
16
17
18
19
20
25
24
PC4
PC5
PC6
PC7
23
22
21
V
SS
V
DD
Notes:
1. VDD = 5.0 V
2. TCMP = NC
Figure C-1. Self-Check Circuit Schematic
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
118
Freescale Semiconductor
Self-Check Mode
C.2.2 Self-Check Results
Table C-1 shows the LED codes that indicate self-check test results.
Table C-1. LED Codes
PC3
Off
Off
Off
Off
Off
Off
PC2
On
On
On
Off
Off
Off
PC1
On
Off
Off
On
On
Off
PC0
Off
On
Off
On
Off
On
Remarks
I/O failure
RAM failure
Timer failure
SCI failure
ROM failure
SPI failure
Flashing
All others
No failure
Device failure
Perform these steps to activate the self-check tests:
1. Apply 10 V (2 x VDD) to the IRQ pin.
2. Apply a logic 1 to the TCAP pin.
3. Apply a logic 0 to the RESET pin.
The self-check tests begin on the rising edge of the RESET pin.
RESET must be held low for 4064 cycles after power-on reset (POR), or for a time, tRL, for any other reset.
For the value of tRL, see 12.7 5.0-Volt Control Timing and 12.8 3.3-Volt Control Timing.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
119
Self-Check Mode
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
120
Freescale Semiconductor
Appendix D
M68HC05Cx Family Feature Comparisons
Refer to Table D-1 for a comparison of the features for all the M68HC05C Family members.
MC68HC05C9A Advance Information Data Sheet, Rev. 5.1
Freescale Semiconductor
121
Table D-1. M68HC05Cx Family Feature Comparisons
C4
4160
—
C4A
4160
—
705C4A
—
C8
7744
—
C8A
7744
—
705C8
—
705C8A
—
C12
12,096
—
C12A
12,096
—
C9
15,760–15,936
—
C9A
15,760–15,936
—
705C9
—
705C9A
—
USER ROM
USER EPROM
4160
7596–7740
7596–7740
15,760–15,936
12,096–15,936
CODE
SECURITY
NO
YES
176
YES
176
NO
YES
176
YES
YES
NO
YES
176
NO
YES
NO
YES
RAM
176
176
176–304
176–304
176
176–352
176–352
176–352
176–352
OPTION
REGISTER
(IRQ/RAM/
SEC)
$1FDF
(IRQ/RAM/
SEC)
$1FDF
(IRQ/SEC)
$1FDF
(IRQ/RAM/SEC)
$3FDF
(IRQ/RAM)
$3FDF
(IRQ/RAM)
$3FDF
(IRQ/RAM)
$3FDF
(IRQ/RAM)
NO
NO
NO
NO
NO
NO
NO
NO
NO
NO
NO
NO
NO
NO
MASK OPTION
REGISTER(S)
$1FF0–$1FF1
NO
NO
$1FF0–$1FF1
NO
NO
NO
NO
NO
$3FF0–$3FF1
PORTB
KEYSCAN
(PULLUP/
YES
MASK
OPTION
YES
MOR SELECT-
ABLE
YES
MASK
OPTION
YES
MOR
SELECTABLE
YES
MASK
OPTION
YES
MASK
OPTION
YES
MASK
OPTION
YES
MOR
SELECTABLE
INTERRUPT)
HIGH
CURRENT
HIGH
CURRENT
HIGH
CURRENT
HIGH
CURRENT
HIGH
CURRENT
HIGH
CURRENT
HIGH
CURRENT
HIGH
CURRENT
PC7 DRIVE
PORT D
STANDARD
PD7, 5–0
INPUT ONLY INPUT ONLY INPUT ONLY INPUT ONLY INPUT ONLY
STANDARD
PD7, 5–0
STANDARD
STANDARD
STANDARD
PD7, 5–0
BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL
PD7, 5–0
BIDIREC-
TIONAL
PD7, 5–0
PD7, 5–0
PD7, 5–0
PD7, 5–0
INPUT ONLY
PD7, 5–0
INPUT ONLY
PD7, 5–0
INPUT ONLY
PD7, 5–0
INPUT ONLY
PD7, 5–0
PD7, 5–0
COP
NO
—
YES
YES
NO
—
YES
YES
TWO TYPES
YES
YES
YES
YES
YES
TWO TYPES
MASK
OPTION
MASK
OPTION
SOFTWARE+
MOR
MASK
OPTION
MASK
OPTION
SOFTWARE+
MOR
COP ENABLE
MOR
SOFTWARE
SOFTWARE
SOFTWARE
SOFTWARE
64 ms
(@4 MHz
OSC)
64 ms
(@4 MHz
OSC)
SOFTWARE+
MOR
SELECTABLE
SOFTWARE+
MOR
SELECTABLE
64 ms SOFTWARE
(@4 MHz OSC) SELECTABLE
64 ms
64 ms
SOFTWARE
(@4 MHz OSC) (@4MHz OSC) SELECTABLE
SOFTWARE
SELECTABLE
SOFTWARE
SELECTABLE
COP TIMEOUT
COP CLEAR
—
—
WRITE $55/$AA
TO $001D
OR
WRITE $55/$AA
TO $001D
OR
WRITE $55/$AA
CLR $1FF0
WRITE $55/$AA WRITE $55/$AA WRITE $55/$AA
TO $001D
—
CLR $1FF0
NO
CLR $1FF0
NO
—
CLR $3FF0
NO
CLR $3FF0
NO
TO $001D
TO $001D
TO $001D
CLR $1FF0
CLR $3FF0
CLOCK
MONITOR
YES
(C9A MODE)
NO
NO
NO
NO
NO
NO
YES
YES
YES
YES
YES
PROGRAM-
MABLE
COP/CLOCK
MONITOR
POR/COP/
CLOCK
MONITOR
POR/COP/
CLOCK
MONITOR
POR/COP/
CLOCK
MONITOR
POR/C9A COP/
CLOCK
MONITOR
ACTIVE
RESET
COP/CLOCK
MONITOR
NO
NO
NO
NO
MOR
SELECTABLE
(C12A MODE)
MASK
OPTION
MASK
OPTION
MASK
OPTION
MASK
OPTION
STOP DISABLE
Notes:
NO
NO
NO
NO
NO
NO
NO
NO
1. The expanded RAM map (from $30–$4F and $100–$15F) available on the OTP devices MC68HC705C8 and MC68HC705C8A is not available on the ROM devices MC68HC05C8 and MC68HC05C8A.
2. The programmable COP available on the MC68HC705C8 and MC68HC705C8A is not available on the MC68HC05C8A. For ROM compatibility, use the non-programmable COP.
blank
RoHS-compliant and/or Pb- free versions of Freescale products have the functionality
and electrical characteristics of their non-RoHS-compliant and/or non-Pb- free
counterparts. For further information, see http://www.freescale.com or contact your
Freescale sales representative.
How to Reach Us:
Home Page:
www.freescale.com
For information on Freescale.s Environmental Products program, go to
http://www.freescale.com/epp.
E-mail:
support@freescale.com
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, CH370
1300 N. Alma School Road
Chandler, Arizona 85224
+1-800-521-6274 or +1-480-768-2130
support@freescale.com
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
support@freescale.com
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
support.japan@freescale.com
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
support.asia@freescale.com
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Semiconductor was negligent regarding the design or manufacture of the part.
Denver, Colorado 80217
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
1-800-441-2447 or 303-675-2140
Fax: 303-675-2150
© Freescale Semiconductor, Inc. 2005. All rights reserved.
LDCForFreescaleSemiconductor@hibbertgroup.com
MC68HC05C9A
Rev. 5.1, 9/2005
相关型号：
©2020 ICPDF网 联系我们和版权申明