MCZ33810EKR2 [NXP]
Engine controller, 4 low side driver, 4 pre driver, SPI, EFI, SOIC 32, Reel;
| 型号： | MCZ33810EKR2 |
| 厂家： | 
NXP |
| 描述： | Engine controller, 4 low side driver, 4 pre driver, SPI, EFI, SOIC 32, Reel 驱动 光电二极管 接口集成电路 |
| 文件： | 总40页 (文件大小：837K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Document Number: MC33810
Rev. 11.0, 8/2014
ale Semiconductor
Tccal Data
Automotive Engine Control IC
33810
The 33810 is an eight channel output driver IC intended for automotive engine
control applications. The IC consists of four integrated low-side drivers and four
low-side gate pre-drivers. The low-side drivers are suitable for driving fuel
injectors, solenoids, lamps, and relays. The four gate pre-drivers can function
either as ignition IGBT gate pre-drivers or as general purpose MOSFET gate
pre-drivers. This device is powered by SMARTMOS technology.
ENGINE CONTROL
When configured as ignition IGBT gate pre-drivers, additional features are
enabled such as spark duration, dwell time, and ignition coil current sense.
When configured as a general purpose gate pre-driver (GPGD), the 33810
provides external MOSFETs with short-circuit protection, inductive flyback
protection and diagnostics. The device is packaged in a 32 pin (0.65mm pitch)
exposed pad SOIC.
EK SUFFIX (Pb-FREE)
98ASA10556D
32 PIN SOICW -EP
Features
• Designed to operate over the range of 4.5 V VPWR 36 V
• Quad ignition IGBT or MOSFET gate pre-driver with parallel/SPI and/or PWM
control
Applications
• Quad injector driver with parallel/SPI control
• Interfaces directly to MCU using 3.3 V/5.0 V SPI protocol
• Injector driver current limit - 4.5 A max.
• Automotive
• Motorcycle engine control unit (ECU) and small
engine control
• PSI5 airbag system
• Central gateway/in-vehicle networking
• Braking and stability control
• Independent fault protection and diagnostics
• VPWR standby current 10 A max.
• Gasoline engine management
• Hybrid electric vehicle (HEV) inverter controller
VBAT
VBAT
33810
VBAT
VPWR
VDD
OUT0
OUT1
OUT2
OUT3
GND
FB0
VDD
VBAT
VBAT
MCU
VBAT
VBAT
VBAT
VBAT
MOSI
SCLK
CS
SI
SCLK
CS
GD0
MISO
ETPU
ETPU
ETPU
ETPU
GPIO
ETPU
ETPU
ETPU
SO
FB1
DIN0
DIN3
GIN0
GIN3
OUT EN
SPKDUR
NOMI
MAXI
GD1
FB2
GD2
FB3
GD3
RSP
RSN
Figure 1. MC33810 Simplified Application Diagram
© Freescale Semiconductor, Inc., 2006 - 2014. All rights reserved.
ERABLE PARTS
ORDERABLE PARTS
This section describes the part numbers available to be purchased along with their differences. Valid orderable part numbers are
provided on the web. To determine the orderable part numbers for this device, go to http://www.freescale.com and perform a part number
search for the following device numbers.
Table 1. Orderable Part Variations
Part Number
Notes
Temperature (T )
Package
A
(1)
MCZ33810EK
Notes
32 SOICW-EP
-40 °C to 125 °C
1. To order parts in Tape & Reel, add the R2 suffix to the part number.
33810
Analog Integrated Circuit Device Data
2
Freescale Semiconductor
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VPWR
VDD
VPWR, VDD
V8.0 Analog
V2.5 Logic
V
V
DD
DD
POR, Overvoltage
Undervoltage
~50 µA
~50 µA
CS
SI
LOGIC CONTROL
Oscillator
Bandgap
Bias
SCLK
OUTEN
~15 µA
~15 µA
SPI
INTERFACE
V2.5
OUT0
OUT1
OUT2
Outputs 0 to 3
VOC1
V
DD
SO
Gate Control
OUT3
75 µA
DIN0
Current Limit
Temperature Limit
Short/Open
PARALLEL
CONTROL
~50 µA
DIN1
DIN2
DIN3
+
–
R
S
~50 µA
~50 µA
~50 µA
lLimit
Exposed
Pad
PWM
CONTROLLER
+
–
SPI
NOMI,MAXI
DAC
SPARK DURATION
FB0
FB1
FB2
FB3
+
–
SPI
GIN0
GIN1
GIN2
GIN3
Open Secondary
~50 µA
100 µA
VOC
V
PWR
GPGD
Only
SPARK
DAC
~50 µA
~50 µA
Low V
Clamp
GPGD
Clamp
GATE DRIVE
CONTROL
GD0
GD1
GD2
GD3
~50 µA
VDD
+
NOMI
MAXI
–
DAC
~5 0µA
SPKDUR
RSP
RSN
+
–
DAC
NOMI
MAXI
Exposed Pad
GND
Figure 2. 33810 Simplified Internal Block Diagram
33810
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
CONNECTIONS
PIN CONNECTIONS
Transparent Top View
OUT2
FB2
GD2
MAXI
NOMI
RSN
OUT0
FB0
GD0
CS
SCLK
SI
SO
VDD
OUTEN
DIN0
DIN1
DIN2
DIN3
GD1
FB1
1
2
3
4
5
6
7
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
RSP
VPWR
GIN0
GIN1
GIN2
GIN3
SPKDUR
GD3
8
9
GND
10
11
12
13
14
15
16
FB3
OUT3
OUT1
Figure 3. 33810 Pin Connections
A functional description of each pin can be found in the Functional Pin Description section beginning on page 14.
Table 2. 33810 Pin Definitions
Pin Number
Pin Name Pin Function
Formal Name
Definition
OUT0, OUT1,
Output
Low-side Injector
Driver Output
These pins are the Open drain low-side injector driver outputs.
1, 16, 32, 17
OUT2, OUT3
In IGBT ignition gate pre-driver mode, these feedback inputs monitor the IGBT's
collector voltage to provide the spark duration timer control signal.
FB0, FB1,
Input
Feedback Voltage
Sense
2, 15, 31, 18
3, 14, 30,19
FB2, FB3
IGBT/GPGD outputs are controlled by GIN0 - 3. Pull-up and pull-down current
sources are used to provide a controlled slew rate to an external IGBT or MOSFET
connected as a low-side driver.
GD0, GD1,
Output
Gate Drive Output
GD2, GD3
The Chip Select input pin is an active low signal sent by the MCU to indicate the
device is being addressed. This input requires CMOS logic levels and has an
internal active pull-up current source.
4
5
CS
Input
Input
Chip Select
The SCLK input pin is used to clock the serial data on the SI and SO pins in and
out while being addressed by the CS.
SCLK
Serial Clock Input
The SI input pin is used to receive serial data from the MCU.
6
7
SI
Input
Serial Input Data
The SO output pin is used to transmit serial data from the device to the MCU.
SO
Output
Serial Output Data
The VDD input supply voltage determines the interface voltage levels between the
device and the MCU, and is used to supply power to the Serial Out buffer (SO),
SPKDUR buffer, MAXI, NOMI, and pull-up current source for the Chip Select (CS).
Digital Logic Supply
Voltage
8
VDD
Input
Input
The Output Enable pin (OUTEN) is an active low input. When the OUTEN pin is low,
the device outputs are active. The outputs are disabled when OUTEN is high.
9
10, 11, 12, 13
20
OUTEN
Output Enable
Driver Input 0, Driver
Input 1, Driver Input 2,
Driver Input 3
Active high input control for injector outputs OUT0 - 3. The parallel input data is
logically ORed with the corresponding SPI input data register contents.
DIN0,DIN1,
DIN2,DIN3
Input
This pin is the Spark Duration Output. This open drain output is low while feedback
inputs FB0 - 3 are above the programmed spark detection threshold.
SPKDUR
Output
Spark Duration Output
Gate Driver Input 0
Gate Driver Input 1
Gate Driver Input 2
Gate Driver Input 3
These pins are the active high input control for IGBT/GPGD outputs GD0 - 3. The
parallel input data is logically ORed with the corresponding SPI input data register
contents in GPGD mode only.
GIN0,GIN1,
GIN2,GIN3
24, 23, 22, 21
25
Input
Input
VPWR is the main voltage input for all internal analog bias circuitry.
VPWR
Analog Supply Voltage
33810
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
PIN CONNECTIONS
Table 2. 33810 Pin Definitions (continued)
Pin Number
Pin Name Pin Function
Formal Name
Definition
Resistor Sense
Positive
This pin is the Positive input of a current sense amplifier.
26
RSP
RSN
Input
Input
Resistor Sense
Negative
This pin is the Negative input of a current sense amplifier.
27
28
This pin is the Nominal Ignition Coil Current output flag. This output is asserted
when the IGBT Collector-Emitter current exceeds the level selected by the DAC.
Nominal Ignition Coil
Current
NOMI
Output
This pin is the Maximum Ignition Coil Current output flag. This output is asserted
when the IGBT Collector-Emitter current exceeds the selected level of the DAC.
This signal also latches off the gate pre-drive outputs when configured as a GPGD.
The MAXI current level is determined by the voltage drop across an external sense
resistor connected to pins RSP and RSN.
Maximum Ignition Coil
Current
29
MAXI
GND
Output
The exposed pad is the only ground reference for analog, digital and power ground
connections. As such, it must be soldered directly to a low-impedance ground plane
for both electrical and thermal considerations. For more information about this
package, see application note AN2409 on the Freescale web site,
www.freescale.com
Exposed Pad
(bottom of
package)
Ground
Ground
33810
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
CTRICAL CHARACTERISTICS
IMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Symbol
Ratings
Value
Unit
Notes
ELECTRICAL RATINGS
(1)
(1)
VPWR Supply Voltage
VDD Supply Voltage
V
-1.5 to 45
-0.3 to 7.0
VDC
VDC
PWR
V
DD
SPI Interface and Logic Input Voltage (CS, SI, SO, SCLK, OUTEN, DIN0 - DIN3,
GIN0 - GIN3, SPKDUR, NOMI, MAXI, RSP,RSN)
VIL
VIH
-0.3 to VDD
VDC
IGBT/GPGD Drain Voltage (VFB0 to VFB3
Injector Output Voltage (OUTx)
GPGD Output Voltage (GDx)
)
VFB
-1.5 to 60
-1.5 to 60
-0.3 to 10
VDC
VDC
VDC
V
OUTX
V
GDx
Output Clamp Energy (OUT0 to OUT3)(Single Pulse)
TJUNCTION = 150 °C, IOUT = 1.5 A
E
E
100
100
2.0
mJ
mJ
A
CLAMP
CLAMP
Output Clamp Energy (OUT0 to OUT3)(Continuous Pulse)
TJUNCTION = 125 °C, IOUT = 1.0 A (Max Injector frequency is 70 Hz)
Output Continuous Current (OUT0 to OUT3)
TJUNCTION = 150 °C
IOSSSS
Maximum Voltage for RSN and RSP inputs
Frequency of SPI Operation (VDD = 5.0 V)
V
-0.3 - VDD
6.0
VDC
RSX
–
MHz
ESD Voltage
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
2000
200
750
VESD1
VESD2
VESD3
(2), (3)
V
THERMAL RATINGS
Operating Temperature
Ambient
TA
TJ
TC
-40 to 125
-40 to 150
-40 to 125
C
Junction2
Case
Storage Temperature
T
-55 to 150
1.7
C
STG
Power Dissipation (T 25 C)
P
D
W
A
Peak Package Flow Temperature During Solder Mounting
EW Suffix
TSOLDER
C
245
Thermal Resistance
R
R
75
8.0
1.2
Junction-to-Ambient
Junction- to-Lead
Junction-to-Flag
JA
JL
C/W
R
JC
Notes
1. Exceeding these limits may cause malfunction or permanent damage to the device.
2. ESD data available upon request.
3. ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-002), the Machine Model (MM) (AEC-Q100-003), and
the Charge Device Model (CDM), Robotic (AEC-Q100-011).
33810
Analog Integrated Circuit Device Data
6
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics
Characteristics noted under conditions of 3.0 V VDD 5.5 V, 6.0 V VPWR 32 V, -40 C TC 125 C, and calibrated timers, unless
otherwise noted. Typical values reflect the parameter’s approx. average value with VPWR = 13 V, TA = 25 C.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
POWER INPUT (VDD, VPWR)
Supply Voltage
(4)
Fully Operational
Full Parameter Specification
VPWR(FO)
–
–
V
4.5
6.0
36
32
Supply Current
IVPWR(ON)
IVPWR(SS)
–
–
10.0
15
14.0
30
mA
All Outputs Disabled (Normal mode)
Sleep State Supply Current (Must have V 0.8 V for Sleep state),
DD
A
V
V
V
V
V
V
PWR = 32 V
(5)
(6)
(7)
Overvoltage Shutdown Threshold Voltage
VPWR(OV)
VPWR(OV-HYS)
VPWR(UV)
36.5
0.5
39
1.5
4.0
200
–
42
3.0
V
V
PWR
PWR
PWR
PWR
PWR
Overvoltage Shutdown Hysteresis Voltage
Undervoltage Shutdown Threshold Voltage
Undervoltage Shutdown Hysteresis Voltage
Low Operating Voltage (Low-voltage reported via the SPI)
3.0
4.4
V
VPWR(UV-HYS)
VPWR(LOV)
VDD
100
5.3
300
8.99
5.5
mV
V
VDD Supply Voltage
3.0
–
V
VDD Supply Current
IVDD
–
–
1.0
2.8
mA
V
Static condition and does not include VDD current out of device
(8)
VDD Supply Undervoltage (Sleep state) Threshold Voltage
VDD(UV)
0.8
2.5
INJECTOR DRIVER OUTPUTS (OUT 0:3)
Drain-to-Source ON Resistance
I
I
I
= 1.0 A, T = 125 C, VPWR = 13 V
OUT
OUT
OUT
J
–
–
–
–
0.2
–
0.3
–
–
RDS (ON)
= 1.0 A, T = 25 C, VPWR = 13 V
J
= 1.0 A, T = -40 C, VPWR = 13 V
J
Output Self Limiting Current
IOUT(LIM)
3.0
–
6.0
A
V
Output Fault Detection Voltage Threshold
Outputs Programmed OFF (Open Load)
Outputs Programmed ON (Short to Battery)
(9)
VOUT(FLT-TH)
2.0
2.5
3.0
Output OFF Open Load Detection Current
V
= 18 V, Outputs Programmed OFF
DRAIN
DRAIN
I(OFF)OCO
40
40
75
75
115
115
A
V
= 32 V, Outputs Programmed OFF (-40 °C)
Output ON Open Load Detection Current
I(ON)OCO
20
48
100
53
200
58
mA
V
Current less then specification value considered open
Output Clamp Voltage 1
VOC1
I
= 20 mA
D
Notes
4. These parameters are guaranteed by design but not production tested. Fully operational means driver outputs toggle as expected with input
toggling. SPI is guaranteed to be operational when VPWR > 4.5 V. SPI may not report correctly when VPWR < 4.5 V.
5. Overvoltage thresholds minimum and maximum include hysteresis.
6. Undervoltage thresholds minimum and maximum include hysteresis.
7. Device is functional provided TJ is less than 150 °C. Some table parameters may be out of specification.
8. Device in Sleep state, returns from Sleep state with Power On Reset.
9. Output fault detection thresholds with outputs programmed OFF. Output fault detect thresholds are the same for output open and shorts.
33810
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
CTRICAL CHARACTERISTICS
TIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions of 3.0 V VDD 5.5 V, 6.0 V VPWR 32 V, -40 C TC 125 C, and calibrated timers, unless
otherwise noted. Typical values reflect the parameter’s approx. average value with VPWR = 13 V, TA = 25 C.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
INJECTOR DRIVER OUTPUTS (OUT 0:3) (Continued)
Output Leakage Current
VDD = 5.0 V, V
Disabled
VDD = 5.0 V, V
Disabled
= 24 V, Open Load Detection Current
DRAIN
–
–
–
–
20
IOUT(LKG)
A
= VOC - 1.0 V, Open Load Detection Current
3000
DRAIN
VDD = 0 V, V
= 24 V, Sleep State
–
–
–
10
185
15
DRAIN
(10)
(10)
Overtemperature Shutdown
TLIM
155
5.0
C
C
Overtemperature Shutdown Hysteresis
TLIM(HYS)
10
IGNITION (IGBT) GATE DRIVER PARAMETERS (GD 0:3 FB0:3)
Gate Driver Output Voltage
IGD = 500 A
V
VGS(ON)
VGS(OFF)
4.8
0.0
7.0
0.375
9.0
0.5
IGD = -500 A
Sleep Mode Gate to Source Resistor
Sleep Mode FBx Pin Leakage Current
RGS(PULLDOWN)
100
–
200
–
300
1.0
K
A
IFBX(LKG)
VDD = 0 V, V
= 24 V,
FBx
Feedback Sense Current (FBx Input Current)
FBx = 32 V, Outputs Programmed OFF
IFBX(FLT-SNS)
–
–
1.0
A
Gate Drive Source Current (1.0 V
3.0)
IGATEDRIVE
RDS(ON)
650
500
780
–
950
A
GD
Gate Drive Turn OFF Resistance
1000
SOFT SHUTDOWN FUNCTION (VOLTAGES REFERENCED TO IGBT COLLECTOR)
Low Voltage Flyback Clamp
VLVC
VPWR +9.0 VPWR +11 VPWR +13
Driver Command OFF, Soft Shutdown Enabled, GDx = 2.0 V
V
V
Spark Duration Comparator Threshold (referenced to IC Ground Tab)
VTH-RISE
18
21
24
Rising Edge Relative to VPWR
Spark Duration Comparator Threshold (referenced to IC Ground Tab)
1.2
4.9
7.4
9.9
3.6
6.1
9.1
2.75
5.5
8.2
Falling Edge Relative to VPWR, Default = 5.5 V assuming ideal
external 10:1 voltage divider. Voltage measured at high end of
divider, not at pin. Tolerance of divider not included.
(11)
VTH-FALL
V
V
11.00
12.1
Open Secondary Comparator Threshold (referenced from primary to
rising edge relative to GND). No hysteresis with 10:1 voltage divider.
VTH-RISE
11.5
–
15.5
Notes
10. This parameter is guaranteed by design but not production tested.
11. Assuming ideal external 10:1 Voltage Divider. Tolerance of 10:1 Voltage Divider is not included. Voltage is measured on the high end of the divider
- not at the pin. 10:1 N.3.A 10:1 Voltage Divider is produced using two resistors with a 9:1 resistance ratio by the basic formula:
VOUT
VIN
R1
R1 + R2
-----------------
----------------------
=
Where R2 = 9XR1
33810
Analog Integrated Circuit Device Data
8
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions of 3.0 V VDD 5.5 V, 6.0 V VPWR 32 V, -40 C TC 125 C, and calibrated timers, unless
otherwise noted. Typical values reflect the parameter’s approx. average value with VPWR = 13 V, TA = 25 C.
Symbol
CURRENT SENSE COMPARATOR (RSP, RSN)
NOMI Trip Threshold Accuracy - Steady State Condition
Characteristic
Min
Typ
Max
Unit
Notes
3.0 A across 0.02 (RSP - RSN = 60 mV)
10.75 A across 0.04 (RSP - RSN = 430 mV)
NOMITRIPTA
-10
–
10
%
%
MAXI Trip Threshold Accuracy - Steady State Condition
6.0 A across 0.02 (RSP - RSN = 120 mV)
21 A across 0.04 (RSP - RSN = 840 mV)
–
-7.5
–
–
7.5
–
MAXI
MAXI
TRIPTA
MAXI Trip Point During Overlapping Dwell
-35
-50
–
–
+35
50
%
TRIPOD
Input Bias Current
RSP and RSN
I
µA
BIASRSX
Comparator Hysteresis Voltage
NOMI
MAXI
40
40
–
–
70
70
NOMI
MAXII
HYS
HYS
% of VT
(12)
(12)
Input Voltage Range (Maximum voltage between RSN and RSP)
VCMVR
0.0
–
–
2.0
0.3
V
V
CMVR
OVR
Ground Offset Voltage Range
Maximum offset between RSN pin and IC Ground (Exposed Pad)
VGND
-0.3
GENERAL PURPOSE GATE PRE-DRIVER PARAMETERS (GD0:3)
Gate Drive Sink and Source Current
IGD
1.0
2.0
5.0
mA
Gate Drive Output Voltage
IGD = 1.0 mA
4.8
0.0
7.0
0.2
9.0
0.5
V
V
V
GS(ON)
IGD = -1.0 mA
V
GS(OFF)
Short to Battery Fault Detection Voltage Threshold
V
= 5.0 V, Outputs Programmed ON
V
-35%
–
+35%
V
DD
DS(FLT-TH)
DS(FLT-TH)
Programmable from 0.5 V to 3.0 V in 0.5 V increments. (Table 15)
Open Fault Detection Voltage Threshold (referenced to IC ground tab)
V
2.0
50
48
2.5
75
53
3.0
120
58
V
A
V
V
= 5.0 V, Outputs Programmed OFF
DD
Output OFF Open Load Detection Current
FBx = 18 V, Outputs Programmed OFF
I
FBX(FLT-SNS)
Output Clamp Voltage
V
OC
Driver Command OFF, Clamp Enabled, VGATE = 2.0 V
DIGITAL INTERFACE
Input Logic High-voltage Thresholds
V
0.7 x VDD
GND - 0.3
100
–
–
–
–
VDD + 0.3
0.2 x VDD
400
V
V
IH
Input Logic Low-voltage Thresholds
Input Logic Voltage Hysteresis
Input Logic Capacitance
V
IL
V
mV
pF
HYS
C
–
20
IN
Sleep Mode Input Logic Current
I
-10
30
–
10
100
25
A
A
A
A
LOGIC_SS
V
= 0 V
DD
Input Logic Pull-down Current
0.8 to 5.0 V (DINX and GINX)
50
15
-50
ILOGIC_PD
ISI_PD
Input Logic Pull-down Current
0.8 to 5.0 V (SI)
5.0
-30
Input Logic Pull-up Current on OUTEN
OUTEN = 0.0 V, VDD = 5.0 V
IOUTEN_PU
-100
Notes
12. This parameter is guaranteed by design, but not production tested.
33810
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
CTRICAL CHARACTERISTICS
TIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions of 3.0 V VDD 5.5 V, 6.0 V VPWR 32 V, -40 C TC 125 C, and calibrated timers, unless
otherwise noted. Typical values reflect the parameter’s approx. average value with VPWR = 13 V, TA = 25 C.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
DIGITAL INTERFACE (CONTINUED)
OUTEN Leakage Current to VDD
OUTEN = 5.0 V, VDD = 0 V
IOUTEN(LKG)
–
–
15
–
50
25
A
A
A
A
A
SCLK Pull-down Current
VSCLK = VDD
ISCLK
5.0
-10
-50
-30
Tri-state SO Output
0 to 5.0 V
ITRISO
10
CS Input Current
CS = VDD
ICS
–
50
CS Pull-up Current
CS = 0 V
ICS_PU
-50
-100
CS Leakage Current to VDD
CS = 5.0 V, VDD = 0 V
ICS(LKG)
CSO
–
–
–
20
–
50
–
A
pF
V
SO Input Capacitance in Tri-state Mode
SO High State Output Voltage
ISO-HIGH = -1.0 mA
VSO_HIGH
VDD - 0.4
–
SO Low State Output Voltage
ISO-LOW = 1.0 mA
VSO_LOW
–
–
0.4
V
NOMI, MAXI in V10 Mode Pull-down Current
NOMI, MAXI = 0.8 V, VDD = 5.0 V
IPD
30
70
100
A
SPKDUR Output Voltage
ISPKDUR = 1.0 mA
VSPKDUR_LO
ISPKDUR_PV
–
–
0.4
V
Output Pull-up Current for SPKDUR
30
50
100
A
NOMI, MAXI High State Output Voltage
INOMI-HIGH = -1.0 mA
VI_HIGH
VDD - 0.4
–
–
–
V
V
IMAXI-HIGH = -1.0 mA
NOMI, MAXI Low State Output Voltage
INOMI-LOW = 250 µA
VI_LOW
–
0.4
IMAXI-LOW = 250 µA
33810
Analog Integrated Circuit Device Data
10
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions of 3.0 V VDD 5.5 V, 6.0 V VPWR 32 V, -40 C TC 125 C, and calibrated timers, unless
otherwise noted. Where applicable, typical values reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25 C.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
POWER INPUT
Required Low State Duration on VPWR for Undervoltage Detect
tUV
1.0
1.0
–
–
–
–
s
s
VPWR 0.2 V
Required Low State Duration on VDD for Power On Reset
t
RESET
VDD 0.2 V
INJECTOR DRIVERS
Output ON Current Limit Fault Filter Timer (Short to Battery Fault)
Output ON Open Circuit Fault Filter Timer
Output Retry Timer
tSC
30
3.0
–
60
7.5
10
–
90
12
µs
ms
ms
µs
t(ON)OC
tREF
15
Output OFF Open Circuit Fault Filter Timer
t(OFF)OC
100
400
Output Slew Rate (No faster than 1.5 s from OFF to ON and ON to
OFF)
tSR(RISE)
1.0
5.0
10
V/s
RLOAD = 14 VLOAD = 14 V
Output Slew Rate
tSR(FALL)
1.0
–
5.0
1.0
1.0
10
5.0
5.0
V/s
µs
RLOAD = 14 VLOAD = 14 V
Propagation Delay (Input Rising Edge OR CS to Output Falling Edge)
Input at 50%VDD to Output voltage 90% of VLOAD
tPHL
Propagation Delay (Input Falling Edge OR CS to Output Rising Edge)
Input at 50%VDD to Output voltage 10% of VLOAD
tPLH
–
µs
IGNITION & GENERAL PURPOSE GATE PRE-DRIVER PARAMETERS
Propagation Delay (GINx Input Rising Edge OR CS to Output Rising
Edge)
tPLH
–
–
0.2
0.2
1.0
1.0
µs
µs
Input at 50%VDD to Output voltage 10% of VGS(ON)
Propagation Delay (Input Falling Edge OR CS to Output Falling Edge)
tPHL
Input at 50%VDD to Output voltage 90% of VGS(ON)
IGNITION PARAMETERS
Open Secondary Fault Timer Accuracy (uncalibrated)
Maximum Dwell Timer Accuracy (uncalibrated)
End of Spark Filter Accuracy (uncalibrated)
-35
-35
-35
–
–
–
35
35
35
%
%
%
(13)
Notes
13. This parameter is guaranteed by design, however, it is not production tested.
33810
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
CTRICAL CHARACTERISTICS
AMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions of 3.0 V VDD 5.5 V, 6.0 V VPWR 32 V, -40 C TC 125 C, and calibrated timers, unless
otherwise noted. Where applicable, typical values reflect the parameter’s approximate average value with VPWR = 13 V, TA = 25 C.
Symbol
GENERAL PURPOSE GATE PRE-DRIVER PARAMETERS
Short to Battery Fault Detection Filter Timer Accuracy
Characteristic
Min
Typ
Max
Unit
Notes
VDD = High, Outputs Programmed ON
Programmable from 30 µs to 960 µs in replicating increments
Tolerance of timer after using calibration command
Tolerance of timer before using calibration command
V
%
DS(FLT-TH)
-10
-35
–
–
+10
+35
Output OFF Open Circuit Fault Filter Timer
VDD = 5.0 V, Outputs OFF
t(OFF)OC
100
–
–
400
µs
Tolerance of timer before using calibration command
PWM Frequency 10 Hz to 1.28 kHz Tolerance After Using Calibration
Command
PWM Frequency 10 Hz to 1.28 kHz Tolerance Before Using
Calibration Command
PWM
PWM
FREQ
FREQ
-10%
10%
-35%
–
–
35%
3.0
Gate Driver Short Fault Duty Cycle
GD
1.0
%
SHRT_DC
SPI DIGITAL INTERFACE TIMING (14)
Falling Edge of CS to Rising Edge of SCLK
tLEAD
100
50
–
–
–
–
–
–
–
–
ns
ns
ns
ns
Required Setup Time
Falling Edge of SCLK to Rising Edge of CS
Required Setup Time
tLAG
SI to Rising Edge of SCLK
Required Setup Time
tSI(SU)
16
Rising Edge of SCLK to SI
Required Hold Time
tSI(HOLD)
20
(15)
(16)
(17)
(18)
(19)
SI, CS, SCLK Signal Rise Time
tR(SI)
tF(SI)
–
–
–
–
–
5.0
5.0
–
–
ns
ns
ns
ns
ns
SI, CS, SCLK Signal Fall Time
–
Time from Falling Edge of CS Low-impedance
Time from Rising Edge of CS to SO High-impedance
Time from Falling Edge of SCLK to SO Data Valid
tSO(EN)
tSO(DIS)
tVALID
55
55
55
–
25
Sequential Transfer Rate
tSTR
1.0
–
–
µs
Time required between data transfers
DIGITAL INTERFACE
Calibrated Timer Accuracy
tTIMER
tTIMER
–
–
–
–
10
35
%
%
Un-calibrated Timer Accuracy
Notes
14. These parameters are guaranteed by design. Production test equipment uses 1.0 MHz, 5.0 V SPI interface.
15. This parameter is guaranteed by design, however, it is not production tested.
16. Rise and Fall time of incoming SI, CS and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.
17. Time required for valid output status data to be available on SO pin.
18. Time required for output states data to be terminated at SO pin.
19. Time required to obtain valid data out from SO following the fall of SCLK with 200 pF load.
33810
Analog Integrated Circuit Device Data
12
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
CS
0.2 V
DD
t
t
LAG
LEAD
0.7 V
0.2 V
DD
DD
SCLK
SI
t
t
SI(SU)
SI(HOLD)
0.7 V
0.2 V
DD
DD
MSB IN
tSO(EN)
0.7 V
t
t
VALID
SO(DIS)
DD
DD
LSB OUT
SO
MSB OUT
0.2 V
Figure 4. SPI Timing Diagram
33810
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
CTIONAL DESCRIPTION
CTIONAL PIN DESCRIPTION
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
ANALOG SUPPLY VOLTAGE (VPWR)
The VPWR pin is the battery input to the 33810. The VPWR pin requires external reverse battery and transient protection. All IC analog
current and internal logic current is provided from the VPWR pin. With VDD applied to the IC, the application of VPWR performs a POR.
DIGITAL LOGIC SUPPLY VOLTAGE (VDD)
The VDD input pin is used to determine communication logic levels between the microprocessor and the 33810. Current from VDD is
used to drive SO output and the pull-up current for CS. VDD must be applied for Normal mode operation. Removing VDD from the IC places
the device in Sleep mode. With VPWR applied to the IC, the application of VDD performs a POR.
GROUND (GND)
The bottom pad or FLAG provides the only ground connection for the IC. The VPWR and VDD supplies are both referenced to the GND
pad. The GND pad is used for both de-coupling the power supplies as well as power ground for the output drivers. Although the silicon
die is epoxy attached to the top side of the pad, the pad must be grounded for proper electrical operation.
SERIAL CLOCK INPUT (SCLK)
The system clock (SCLK) pin clocks the internal shift register of the 33810. The SI data is latched into the input shift register on the
rising edge of SCLK signal. The SO pin shifts status bits out on the falling edge of SCLK. The SO data is available for the MCU to read
on the rising edge of SCLK. With CS in a logic high state, signals on the SCLK and SI pins are ignored and the SO pin is tri-state.
CHIP SELECT (CS)
The system MCU selects the 33810 to receive communication using the chip select (CS) pin. With the CS in a logic low state, command
words may be sent to the 33810 via the serial input (SI) pin, and status information is received by the MCU via the serial output (SO) pin.
The falling edge of CS enables the SO output and transfers status information into the SO buffer.
Rising edge of the CS initiates the following operation:
Disables the SO driver (high-impedance)
Activates the received command word, allowing the 33810 to activate/deactivate output drivers.
To avoid any spurious data, it is essential the high-to-low and low-to-high transitions of the CS signal occur only when SCLK is in a
logic low state. Internal to the 33810 device is an active pull-up to VDD on CS.
SERIAL INPUT DATA (SI)
The SI pin is used for serial instruction data input. SI information is latched into the input register on the rising edge of SCLK. A logic
high state present on SI programs a logic [1] in the command word on the rising edge of the CS signal. To program a complete word,
16 bits of information or multiples of eight there of must be entered into the device.
SERIAL OUTPUT DATA (SO)
The SO pin is the output from the shift register. The SO pin remains tri-stated until the CS pin transitions to a logic low state. All normal
operating drivers are reported as a logic [0], all faulted drivers are reported as a logic [1]. The negative transition of CS enables the SO
driver.
The SI/SO shifting of the data follows a first-in-first-out protocol, with both input and output words transferring the most significant bit
(MSB) first.
OUTPUT ENABLE (OUTEN)
The OUTEN pin is an active low input. When the OUTEN pin is low, all the device outputs are active. The outputs are all disabled when
OUTEN pin is high. SPI and parallel communications are still active in either state of OUTEN.
FEEDBACK VOLTAGE SENSOR (FB0-FB3)
The FBx pin has multiple functions for control and diagnostics of the external MOSFET/IGBT ignition gate driver. In Ignition (IGBT)
mode, the feedback inputs monitor the IGBT's collector voltage to provide the Spark Duration Timer control signal. The Spark Duration
Timer monitors this input to determine if the secondary clamp function should be activated. In secondary clamp mode, the IGBT's collector
voltage is internally clamped to VPWR +11 V.
33810
Analog Integrated Circuit Device Data
14
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
In the GPGD mode, this input monitors the drain of an external MOSFET to provide short-circuit and open circuit detection by monitoring
the MOSFET's drain to source voltage. The filter timer and threshold voltage are easily programmed through SPI (See Table 21 and
Table 22 for SPI messages). In GPGD mode the FBx pin also provides a drain to gate clamp for fast turn OFF of inductive loads and
external MOSFET protection.
GATE DRIVER OUTPUT (GD0-GD3)
The GDX pins are the gate drive outputs for an external MOSFET or IGBT. Internal to the device is a Gate to Source resistor designed
to hold the external device in the OFF state while the device is in the POR or Sleep state.
LOW-SIDE INJECTOR DRIVER OUTPUT (OUT0 - OUT3)
OUT0 - OUT3 are the open drain low-side (Injector) driver outputs. The drain voltage is actively clamped during turn OFF of inductive
loads. These outputs can be connected in parallel for higher current loads provided the turn OFF energy rating is not exceeded.
RESISTOR SENSE POSITIVE (RSP)
Resistor Sense Positive - Positive input of a current sense amplifier. The ignition coil current is monitored by sensing the voltage across
an external resistor connected between RSP and RSN. The output of the current sense amplifier feeds the inputs of the NOMI and MAXI
comparators.
Note: RSN and RSP must be grounded in V10 mode.
RESISTOR SENSE NEGATIVE (RSN)
Resistor Sense Negative - Negative input of a current sense amplifier. The ignition coil current is monitored by sensing the voltage
across an external resistor connected to RSP and RSN. The output of the current sense amplifier feeds the inputs of the NOMI and MAXI
comparators.
Note: RSN and RSP must be grounded in V10 mode.
NOMINAL IGNITION COIL CURRENT (NOMI)
Nominal ignition coil current output flag. This output is asserted when the output current exceeds the level selected by the DAC. NOMI
can be configured as an input pin for V10 mode applications where the gate drive needs to be latched off by another device’s MAXI current
sense amplifier output. The NOMI input latches off gate drivers 5 and 6 when configured as a V10 mode ignition gate driver See Figure 11.
SPARK DURATION OUTPUT (SPKDUR)
SPKDUR is the Spark Duration output. This open drain output is low while feedback inputs FB0 through FB3 are above the programmed
Spark Detection Threshold. This output indicates an ignition flyback event. Each feedback input (FB0 - FB3) is logically ORed to drive the
SPKDUR output. There is a 50 A pull up current source connected internally to the SPKDUR pin.
MAXIMUM IGNITION COIL CURRENT (MAXI)
Maximum ignition coil current output flag. This output is asserted when the output ignition coil current exceeds the selected level of the
DAC. This signal also latches off the gate drive outputs when configured as an ignition gate driver. The MAXI current level is determined
by the voltage drop across an external sense resistor connected to pins RSP and RSN.
MAXI can be configured as an input pin for V10 applications where the gate drive needs to be latched off by another devices MAXI
current sense amplifier output. The MAXI input latches off gate drivers 7 and 8 when configured as ignition gate drive outputs (IGBTs) See
Figure 11.
DRIVER INPUT (DIN0-DIN3), GATE DRIVER INPUT (GIN0-GIN3)
Parallel input pins for OUT0-OUT3 low-side drivers and GD0-GD3 gate drivers. Each parallel input control pin is active high and has an
internal pull-down current sink. The parallel input data is logically ORed with the corresponding SPI input data register contents, except
for the Ignition mode IGBT drivers. They are only controlled by the parallel inputs GIN0-GIN3. In GPGD mode, GIN0-GIN3 are logically
ORed with SPI input data. All outputs are disabled when the OUTEN pin is high, regardless of the state of the command inputs.
33810
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
CTIONAL DESCRIPTION
CTIONAL INTERNAL BLOCK DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
MC33810 Functional Block Diagram
Power Supply
POR
Injector Drivers
Out1 - Out3
SPI Interface
Parallel Control Inputs
PWM Controller
NOMI/MAXI DAC
SPARKDUR DAC
Ignition Gate
Pre-drivers
GD0 - GD3
Power Supply
MCU Interface and Output Driver Control
Drivers
Figure 5. Functional Internal Block Diagram
POWER SUPPLY/POR
The 33810 is designed to operate from 4.5 V to 36 V on the VPWR pin. The VPWR pin supplies power to all internal regulators, analog,
and logic circuit blocks. The VDD supply is used for setting communication threshold levels and supplying power to the SO driver. This IC
architecture provides a low quiescent current Sleep mode. Applying VPWR and VDD to the device generates a Power On Reset (POR) and
place the device in the Normal state. The Power On Reset circuit incorporates a timer to prevent high frequency transients from causing
a POR.
MCU INTERFACE AND OUTPUT CONTROL
This component provides parallel input pins for OUT0-OUT3 low-side drivers and GD0-GD3 gate drivers. Each parallel input control
pin is active high and has an internal pull-down current sink. The parallel input data is logically ORed with the corresponding SPI input
data register contents. All outputs are disabled when the OUTEN pin is high, regardless of the state of the command inputs.
INJECTOR DRIVERS: OUT0 – OUT3
These pins are the open drain low-side (Injector) driver outputs. The drain voltage is actively clamped during turn OFF of inductive
loads. These outputs can be connected in parallel for higher current loads, provided the turn OFF energy rating is not exceeded.
IGNITION GATE PRE-DRIVERS: GD0 – GD3
These pins are the gate drive outputs for an external MOSFET or IGBT. Internal to the device is a Gate to Source resistor designed to
hold the external device in the OFF state while the device is in the POR or Sleep state.
33810
Analog Integrated Circuit Device Data
16
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
MODES OF OPERATION
FUNCTIONAL DEVICE OPERATION
MODES OF OPERATION
POWER SUPPLY
The 33810 is designed to operate from 4.5 V to 36 V on the VPWR pin. The VPWR pin supplies power to all internal regulators, analog
and logic circuit blocks. The VDD supply is used for setting communication threshold levels and supplying power to the SO driver. This IC
architecture provides flexible microprocessor interfacing and low quiescent current Sleep mode.
POWER ON RESET (POR)
Applying VPWR and VDD to the device generates a Power On Reset (POR) and place the device in the Normal State. The Power On
Reset circuit incorporates a filter to prevent high frequency transients from causing a POR.
All outputs are disabled when the OUTEN input pin is high regardless of the SPI control registers or the logic level on the parallel input
pins. With the OUTEN pin high, SPI messages may be sent and received by the device. Upon enabling the device (OUTEN low), outputs
are activated based on the state of the command register or parallel input.
Table 6. Operational States
VPWR
VDD
OUTEN
OUTPUTS
OFF
STATE
Power Off
POR
L
L
L
H
L
X
X
X
OFF
H
OFF
Sleep
H
X
X
X
OFF
OFF
OFF
POR
POR
Sleep
H
L
H
H
H
H
L
Active
OFF
Normal
Normal
H
SLEEP STATE
Sleep state is entered when the VDD supply voltage is removed from the VDD pin. In Sleep state, all outputs are OFF. Applying VDD
forces the device to exit the Sleep state and generates a POR.
NORMAL STATE
The default Normal state is entered when power is applied to the VPWR and VDD pins. Control register settings from a Power On Reset
(POR) are as follows:
• All outputs OFF
• IGNITION gate driver mode enabled (IGBT Ignition mode).
• PWM frequency and duty cycle control disabled.
• OFF state open load detection enabled (LSD)
• MAXI dac set to 14 A, NOMI DAC set to 5.5 A
• Spark detect level VIL DAC set to VPWR +5.5 V
• Open secondary timer set to 100 s
• Dwell timer set 32 ms
• Soft shutdown disabled
• Low-voltage flyback clamp disabled
• Dwell overlap MAXI offset disabled
33810
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
CTIONAL DEVICE OPERATION
ES OF OPERATION
MODES OF OPERATION
In Normal state, the 33810 gate driver has three modes of operation, Ignition mode, GPGD mode and V10 mode.The operating mode
of each gate driver may be set individually and is programmed using the Mode Select command.
MODE SELECT COMMAND
The Mode Select command is used to set the operating mode for the GDx gate driver outputs, over/undervoltage operation and to
enable V10 mode and the PWM generators. The Mode Select command programmable features are listed below.
• Ignition/GPGD mode select (gate drivers)
• V10 mode enable
• Over/Undervoltage operation for all drivers
• GPGD PWM controller enable
IGNITION/GPGD MODE SELECT
The Ignition/GPGD mode select bits determine independently, the operating mode of each of the GDx gate driver outputs. Bits 8, 9, 10,
11 correspond to GD0, GD1, GD2, and GD3 respectively. Setting the bit to a logic 0 sets the GDx driver to the Ignition mode. Setting the
bit to a logic [1] commands the GDX driver to the GPGD mode and disables the ignition features for that particular gate driver (except the
MAXI current shutdown feature). Further information on GDx gate driver in Ignition mode and GPGD mode is provided later in this section
of the data sheet.
V10 MODE ENABLE BIT
The V10 Enable bit allows the user to configure the device for 10 cylinder applications. When the V10 mode is enabled, the device
configures the NOMI pin and MAXI pin as digital inputs rather than outputs. The new MAXI input pin receives the MAXI shutdown signal
for GD0 and GD2 and the new NOMI input pin receives the MAXI shutdown signal for GD1 and GD3. Further information on V10 mode
is provided in the V10 application section.
Note: RSN and RSP must be grounded in V10 mode.
OVER/UNDERVOLTAGE SHUTDOWN/RETRY BIT
The Over/Undervoltage Shutdown/Retry bit allows the user to select the global over and undervoltage fault strategy for all the outputs.
In an overvoltage or undervoltage condition on the VPWR pin, all outputs are commanded OFF. The Over/Undervoltage control bit sets
the operation of the outputs when returning from over/under voltage. Setting the Over/Undervoltage bit to logic [1] forces all outputs to
remain OFF when VPWR returns to normal level. To turn the output ON again, the corresponding input pin or SPI bit must be reactivated.
Setting the Over/Undervoltage bit to logic [0] commands all outputs to resume their previous state when VPWR returns to normal level.
Table 7. below provides the output state when returning from over or undervoltage.
Table 7. Overvoltage/Undervoltage Truth Table
Over/
GINx DINx
Input Pin
OUTEN
State When Returning
SPI Bit
Undervoltage
Control Bit
Input pin
From Over/Undervoltage
X
X
X
0
X
1
1
0
0
0
0
OFF
OFF
OFF
ON
X
0
0*
0*
0*
X
1
1
X
ON
* Default setting
Note: The SPI bit does not control the Gate Driver outputs in the Ignition mode, only in the GPGD mode.
An undervoltage condition on VDD results in the global shutdown of all outputs and reset of all internal control registers. The VDD
undervoltage threshold is between 0.8 V and 2.8 V
PWM ENABLE BIT
X
Gate Driver outputs programmed as GPGDs may be used as low frequency PWM outputs. The PWM generators are enabled via bits
0 through 3 in the Mode Select command. Bits 0 through 3 correspond to outputs GD0 through GD3, respectively. Once the frequency
and duty cycle are programmed through the PWM Frequency & DC command, the PWM output may be turned ON and OFF through the
PWM enable bit. Further information on PWM control is provided in the GPGD mode section of this data sheet.
33810
Analog Integrated Circuit Device Data
18
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
MODES OF OPERATION
IGNITION (IGBT) GATE DRIVER MODE
The MC33810 contains dedicated circuitry necessary for automotive ignition control systems. Each gate driver may be individually
configured as an Ignition Gate Driver with the following features:
• Spark duration signal
• Open secondary timer
• Soft shutdown control
• Low-voltage flyback clamp
• Ignition ignition coil current measurement
• MAXI output and control
• NOMI output
• Maximum dwell timer
In the Ignition Mode, several control strategies are in place to control the IGBT for enhanced system performance. Information acquired
from the FBx pin allows the device to produce a Spark Duration signal output (SPKDUR) and detect open secondary ignition coils. Based
on the FBx signal and Spark Command register settings, the device performs the appropriate gate control (Low-voltage Flyback Clamp,
Soft Shutdown) and produces the SPKDUR output.
The FBx pin is connected to the collector of the IGBT through an external 9:1 resistor divider network. The recommended values for the
resistor divider network is 36 k and 4.02 k, with the 36 k resistor connected from the IGBT collector to the FBx pin and the 4.02 K resistor
connected from the FBx pin to ground.
Additional controls to the gate driver are achieved by sensing the current through the external IGBT. The Resistor Sense Positive (RSP)
and Resistor Sense Negative (RSN) inputs are use to measure the voltage across an external 20 mor 40 m current sense resistor. A
gain select bit in the Spark Command SPI Command messages should be set to a logic [1] (gain of 2) when using a 20 m current sense
resistor. When using a 40 m current sense resistor, the gain select bit should be set to a logic [0] (gain of 1 is the default value).
The ignition coil current is compared with the output of the DACs which have been programmed via the SPI Commands. The
comparison generates the Nominal Current signal (NOMI) and the Maximum Current signal (MAXI). Both signals have a low output when
the ignition coil current is below the programmed DAC value and a high output when the current is above the programmed DAC value.
When the GDx output is shutdown because of the control strategy, the output may be activated again by toggling the input control.
SPARK COMMAND
The Spark Command is an Ignition mode command used to program the parameters for the Ignition mode features listed below:
• End spark threshold (EndSparkTh bits)
• Open secondary fault timer (OSFLT bits)
• Secondary clamp (secondary clamp bit)
• Soft shutdown enable (SoftShutDn bit)
• Ignition ignition coil current amplifier gain (Gain Sel bit)
• Overlapping dwell disable (Overlap Dwell Disable bit)
• Maximum dwell enable (MaxDwellEn bit)
• Maximum dwell timer (MaxDwellTimer bits)
• End of spark filter timer value
Spark Command address and data bits are listed in Table 21
NOTE: Gate driver outputs programmed to be GPGDs are not affected by the Spark commands.
SPARK DURATION SIGNAL
The Spark Duration is defined as the beginning of current flow to the end of current flow across the spark plug gap. Because the
extremely high-voltage ignition coil secondary output is difficult to monitor, corresponding lower voltage signals generated on the ignition
coil primary are often used. The FBx pins monitor the ignition coil primary voltage (IGBT Collector) through a 10 to 1 voltage divider. When
the IGBT is disabled, the rise in the FBx signal indicates a sparkout condition is occurring at the spark plug gap.
The device considers the initial thresholds for spark duration to be VIH = VPWR + 21 V for rising edge as measured on the collector of
the IGBT. The spark duration falling edge reference is programmable via SPI through the End Spark Threshold bits 0 and 1 (See Table 8).
Figure 5 illustrates a typical ignition event with Dwell Time and Spark Duration indicated.
33810
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
CTIONAL DEVICE OPERATION
ES OF OPERATION
Ignition Coil Current,
5.0 A/div
Channel 1: GINx IGBT Gate Drive
Channel 2: IGBT Collector Voltage
Channel 3: IGBT Current @ 5.0 A/Div
SPKDUR~3.0 ms
DWELL Time
Figure 6. Ignition Coil Charge and Spark Event
VPWR = 16.0 V
Default settings
Begin spark threshold VIH = VPWR + 21 V
End spark threshold VIL = VPWR +5.5 V
The pulse width of the SPKDUR signal is measured by the MCU timer/input capture port to determine the actual spark duration. Spark
Duration information is then used by the MCU spark control algorithm to optimize the Dwell Time.
Table 8. End Spark Threshold
Spark Command Bit<b1,b0>
End Spark Threshold (VIL)
VPWR + 2.75
00
01
10
11
VPWR + 5.5
VPWR + 8.2
VPWR + 11.0
OPEN SECONDARY TIMER
A fault due to open in the ignition coil secondary circuit can be determined by waveforms established on the ignition coil primary during
a spark event. The spark event is initiated by the turn OFF of the IGBT. The voltage on the collector of the IGBT rises up to the IGBT’s
internal collector to gate clamp voltage (typically 400 volts). Collector to gate clamp events normally last 5.0 s to 50 s. In an open ignition
coil secondary fault condition, the collector to gate clamp event lasts much longer. The oscilloscope waveform in Figure 7 and Figure 8
compares a normal spark signature with an open secondary fault condition signature.
33810
Analog Integrated Circuit Device Data
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Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
MODES OF OPERATION
Figure 7. Normal Spark Event
Figure 8. Open Secondary Spark Event
The Open Secondary timer is initiated on the rising edge of the ignition coil primary spark signal and terminated on the falling edge. The
rising edge Open Secondary threshold is VIH = 135 V at primary, no hysteresis. The falling edge Open Secondary threshold is VIL = 135 V.
Collector to gate clamp durations lasting longer than the selected Open Secondary Fault Time interval (Table 9) indicate a failed spark
event. When the Open Secondary Fault Time is exceeded and the low-voltage clamp is enabled, the GDx output activates the low-voltage
clamp shown in Figure 9. The Logic for this low-voltage clamp is defined in Figure 9
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Analog Integrated Circuit Device Data
Freescale Semiconductor
21
CTIONAL DEVICE OPERATION
ES OF OPERATION
Table 9. Open Secondary Timer
Open Secondary Fault Timer
Spark Command Bits<b3,b2>
OSFLT (s)
00
01
10
11
10
20
50
100
LOW-VOLTAGE CLAMP
The low-voltage clamp is an internal clamp circuit which biases the IGBT's gate voltage in order to control the collector to emitter voltage
to VPWR +11 V. This technique is used to dissipate the energy stored in the ignition coil over a longer period of time than if the internal
IGBT clamp were used.
In the Open Secondary Fault condition, all of the stored energy in the ignition coil is dissipated by the IGBT. This fault condition requires
the use of a higher energy rated IGBT than would otherwise be needed. The low-voltage clamp spreads out the energy dissipation over
a longer period of time, thus allowing the use of a lower energy rated IGBTs. The internal low-voltage clamp is connected between the
IGBT's collector (through an external resistor) and the IGBT's gate. The energy stored in the ignition coil is dissipated by the IGBT, not
the internal clamp. The internal clamp only provides the bias to the IGBT.
Several logical signals are required as inputs to activate the GDx Low-voltage Clamp feature. The GDx Low-voltage Clamp feature may
be disabled through bit 4 of the Spark Command message.
+
–
SPI
FB0
FB1
FB2
FB3
+
–
SPARK DURATION
Open Secondary
SPI
100 µA
53 V
VPWR
13 V
SPI input
GPGD
Clamp
Low V
Clamp
GATE DRIVE
CONTROL
GD0
GD1
GD2
GD3
Figure 9. Low-voltage Clamp
33810
Analog Integrated Circuit Device Data
Freescale Semiconductor
22
FUNCTIONAL DEVICE OPERATION
MODES OF OPERATION
OSFLT_En
IGN Mode
OSFLT
Activate
Low-voltage
Clamp
MaxDwell
MaxDwellEn
SoftShutDnEn
IGN Mode
VPWR
overVOLTAGE
OUTEN
Figure 10. Low-voltage Clamp Logic
SOFT SHUTDOWN ENABLE
The Soft Shutdown feature is enabled via the SPI by asserting control bit 5 in the Spark Command message. When enabled, the
following events initiate a soft shutdown control of the gate driver.
• OUTEN = High (Outputs Disabled)
• Overvoltage on VPWR pin
• Max dwell time
Soft shutdown is designed to prevent an ignition spark while turning off the external IGBT. The low-voltage clamp is activated to provide
the mechanism for a soft shutdown.
GAIN SELECT BIT
The ignition coil current comparators are used to compare the programmed NOMI and MAXI DAC value with voltage across the external
current sense resistor. When selecting a gain of two, the ignition coil current sense resistor must be reduced from 40 m to 20 m
OVERLAPPING DWELL ENABLE BIT
Overlapping dwell occurs when two or more Ignition mode drivers are commanded ON at the same time. In this condition with the
Overlapping Dwell Bit enabled, the MAXI DAC threshold value is increased as a percentage of the nominal programmed value. The
percent increase is determined by bit 5 through bit 7 of the DAC Command.
Table 10. Overlapping Dwell Compensation
DAC Command Bits<b7,b6,b5>
Overlap Compensation (%)
000
001
010
011
100
101
110
111
0%
7%
15%
24%
35% (default)
47%
63%
80%
MAXIMUM DWELL ENABLE BIT
Bit 8, the Maximum Dwell Enable bit, allows the user to enable the Maximum Dwell Gate Turnoff feature. When the Max Dwell bit is
programmed as logic 0 (disabled), the device does not perform a low-voltage clamp due to Max Dwell (See Figure ).
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CTIONAL DEVICE OPERATION
ES OF OPERATION
MAXIMUM DWELL GATE TURN OFF FEATURE
In automotive ignition systems, dwell time is defined as the duration of time an ignition coil is allowed to charge. The 33810 starts the
measure of time from the gate drive ON command. If the dwell time is greater than the Max Dwell Timer setting (Table 11), the offending
ignition gate driver is commanded OFF. The Max Dwell Gate Turn OFF feature may be disabled via bit 8 of the Spark Command. When
the feature is disabled, the Max Dwell fault bits are always logic 0. The Max Dwell Timer feature pertains to Ignition mode only and does
not affect gate drivers configured as GPGDs.
The Max Dwell gate turn OFF signal is a logically ANDed with the Soft Shutdown bit to activate a Low-voltage Active Clamp (See
Figure ).
Table 11. Maximum Dwell Timer
Spark Command Bit<b11,b10,b9>
MAX Dwell Timer MaxDwell (ms)
000
001
010
011
100
101
110
111
2
4
8
16
32 (default)
64
64
64
DAC COMMAND (DIGITAL TO ANALOG CONVERSION COMMAND)
The DAC command is an Ignition mode command which sets the nominal ignition coil current (NOMI) and maximum ignition coil current
(MAXI) DAC values. Bits 0 through 4 set the NOMI threshold value and bits 8 through 11 set the MAXI threshold values. The DAC
command and default values are listed in the SPI Command Summary Table 21. The NOMI output is used by the MCU as a variable in
dwell and spark control algorithms.
NOMI DAC BITS
The NOMI output signal is generated by comparing the external current sense resistor differential voltage (Resistor Sense Positive,
Resistor Sense Negative) with the SPI programmed NOMI DAC value. When the NOMI event occurs, the NOMI output pin is asserted
(high). The NOMI output is only a flag to the MCU and it’s output does not affect the gate driver.
When using a 20 m resistor as the current sense resistor, the gain select of the differential amplifier connected to RSP and RSN
should be set to a gain of 2 via the SPI Command Message Spark command (Command 0100, hex 4), Control bit 6 =1. When using a
40 mresistor as the current sense resistor, the gain select of the differential amplifier connected to RSP and RSN, should be set to a
gain of 1 via the SPI Command Message Spark Command (Command 0100, hex 4), Control bit 6 = 0. This is also the default value. The
NOMI output provides a means to alert the MCU when the ignition coil primary current equals the value programmed into the NOMI DAC.
In V10 mode, the NOMI pin is reconfigured as a MAXI input pin from a third MC33810 device in the system. In this mode, a NOMI input
has effectively the same control as an internal MAXI signal. Further information is provided in the V10 mode application section of this
data sheet.
33810
Analog Integrated Circuit Device Data
24
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
MODES OF OPERATION
Table 12. Nominal Current DAC Select
Differential Voltage Differential Voltage
(mV) RS = 20 m
(mV) RS = 40 m
DAC Command Bits<4,3,2,1,0> NOMI Current (A)
(Gain = 2)
(Gain = 1)
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
10000
10001
10010
10011
10100
10101
10110
10111
11000
11001
11010
11011
11100
11101
11110
11111
3.00
3.25
3.50
3.75
4.00
4.25
4.50
4.75
5.00
5.25
5.50
5.75
6.00
6.25
6.50
6.75
7.00
7.25
7.50
7.75
8.00
8.25
8.50
8.75
9.00
9.25
9.50
9.75
10.00
10.25
10.50
10.75
60
120
130
140
150
160
170
180
190
200
210
220
230
240
250
260
270
280
290
300
310
320
330
340
350
360
370
380
390
400
410
420
430
65
70
75
80
85
90
95
100
105
110
115
120
125
130
135
140
145
150
155
160
165
170
175
180
185
190
195
200
205
210
215
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Freescale Semiconductor
25
CTIONAL DEVICE OPERATION
ES OF OPERATION
MAXI DAC BITS
The MAXI control block provides a means to shut off all the ignition coil drivers if the current reaches a SPI programmable maximum
level. Control is achieved by comparing the output of the current sense amplifier with a SPI programmed DAC value. The MAXI comparator
disables all gate drivers configured as ignition drivers when the DAC MAXI setting is exceeded. When a MAXI event occurs, the MAXI bit
in the fault status register is set and the MAXI pin is asserted (high).
When using a 20 m resistor as the current sense resistor, the gain select of the differential amplifier connected to RSP and RSN
should be set to a gain of 2 via the SPI Command Message Spark command (Command 0100,
hex 4), Control bit 6 =1. When using a 40 mresistor as the current sense resistor, the gain select of the differential amplifier connected
to RSP and RSN should be set to a gain of 1 via the SPI Command Message Spark command (Command 0100,
hex 4), Control bit 6 = 0. This is also the default value. The MAXI fault bit in the SPI Fault Status register is cleared when the MAXI condition
no longer exists and the SPI fault status register was read by the MCU.
In V10 mode, the MAXI pin is configured as an input to receive the MAXI signal from a second MC33810 device in the system. In this
mode, an input MAXI signal has effectively the same control as an internal MAXI signal. Further information is provided in the V10 mode
application section of this specification.
Table 13. Maximum Current DAC Select
Differential Voltage Differential Voltage
DAC Command Bit<b11,b10,b9,b8> MAXI Current (A)
(mV) RS = 20 m
(mV) RS = 40 m
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
6.0
7.0
120
140
160
180
200
220
240
260
280
300
320
340
360
380
400
420
240
280
320
360
400
440
480
520
560
600
640
680
720
760
800
840
8.0
9.0
10.0
11.0
12.0
13.0
14.0
15.0
16.0
17.0
18.0
19.0
20.0
21.0
END OF SPARK FILTER BITS
The ringing at the end of the spark signatures waveform can cause erroneous detection of the End of Spark event. To eliminate the
effect of this ringing, a low pass filter with variable time values can be selected. Four time values for the low pass filter are provided with
a zero value, indicating no low pass filtering is to be used. The End of Spark Filter bits specify a 0, 4 µs, 16 µs, or 32 µs time interval to
sample the spark ignition coil primary current to ignore the ringing at the end of spark.
Table 14. End of Spark Filter Time Select
End of Spark Filter Bits<1, 0>
Filter Time (µs)
00
01
10
11
0.0
4.0
16.0
32.0
33810
Analog Integrated Circuit Device Data
26
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
MODES OF OPERATION
GENERAL PURPOSE GATE PRE-DRIVER MODE
Each gate driver can be individually configured as a General Purpose Gate Pre-driver (GPGD) and controlled from the parallel GINx
input pins, SPI Driver ON/OFF command, or may be programmed through the SPI for a specific frequency and duty cycle output (PWM).
In GPGD mode, the gate drivers have the following features:
• Gate driver for discrete external MOSFET
• OFF state open load detect
• ON state short-circuit protection
• Programmable drain threshold and duration timer for short fault detection
• PWM frequency/duty cycle controller
In GPGD mode, the GDx output is a current controlled output driver with slew rate control, gate to source clamp, passive pull-down
resistor, and a drain to gate clamp for switching inductive loads.
Driver ON/OFF Command
For the Driver ON/OFF Command, bits 4 through 7 control gate drivers are Mode Select Command programmed as GPGD. A logic [1]
in bits 4 through 7 commands the specific output ON. A logic [0] in the appropriate bit location commands the specific output OFF. SPI
control bits for the integrated LSD output drivers are also contained in the Driver ON/OFF command. Further information on LSD control
is provided in the Low-side Injector Driver section of the data sheet.
Note that gate drivers programmed to Ignition mode have parallel input control only and cannot be turned OFF and ON via SPI
commands.
GPGD Short Threshold Voltage Command
Each GPGD is capable of detecting an open load in the OFF state and shorted load in the ON state. All faults are reported through the
SPI communication. For open load detection, a current source is placed between the FBx pin and ground of the IC. An open load fault is
reported when the FBx voltage is less than the 2.5 V threshold. Open load fault detect threshold is set internally to 2.5 V and may not be
programmed. A shorted load fault is reported when the FBx pin voltage is greater than the programmed short threshold voltage.
The short to battery fault threshold voltage of the external MOSFET is programmed via the GPGD Short Threshold Voltage command.
Table 15 illustrates the bit pattern to select a particular threshold. Drain voltages less than the selected threshold are considered normal
operation. Drain voltages greater than the selected threshold voltage are considered faulted.
Table 15. FBx Fault Threshold Select
GPGD VDS FLT Bits
FBx Fault Threshold Select
000
001
010
011
100
101
110
111
0.5V
1.0V
1.5V
2.0 (default)
2.5V
3.0V
No Change
No Change
GPGD SHORT TIMER COMMAND
The GPGD Short Timer command allows the user to select the duration of time the drain voltage is allowed to be greater than the
programed threshold voltage without causing shutdown. External MOSFETS with drain voltages greater than the programed threshold for
longer than the Fault Duration Timer are shutdown. Timer durations are listed in Table 16.
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CTIONAL DEVICE OPERATION
ES OF OPERATION
Table 16. FBx Short Fault Timer
GPGD FLT Timer Bits
Fault Timer Select
30 µs
000
001
010
011
100
101
110
111
60 µs
120 µs
240 µs (default)
480 µs
960 µs
No Change
No Change
Notes
20. Tolerance on this fault timer setting is ±10% after using the Calibration Command.
GPGD FAULT OPERATION COMMAND
The GPGD Fault Operation command sets the operating parameters for the gate drivers under faulted conditions. A short fault is said
to be “detected” when the drain source voltage, VDS of the external MOSFET, exceeds the SPI programmed short threshold voltage. The
short fault is said to be “declared” when the VDS overvoltage lasts longer than the SPI programmed “fault timer.” (short duration time >
fault timer programmed value).
Each gate driver is individually set to either restore to the pre-fault state or shut down when a short fault is declared. By setting the
Retry/Shutdown bit in the GPGD Fault Operation Command to logic 1, the specific output tries to go back to the pre-fault state when the
fault is no longer declared, after a programmed “inhibit time”.
The retry strategy causes the output to try to return to the pre-fault state on a 1% duty cycle basis. For example: If the fault timer is set
to 120s and a fault is declared (drain voltage greater than the programmed threshold for greater than 120 s), the GDx output driver is
forced OFF for 12 ms. After 12 ms has elapsed, if the inputs, GINx or SPI, have not tried to shut off the particular GDx output in the interim,
the GDx output tries to set the external driver ON again (the pre-fault state). A continued declared fault on the output would result in another
12 ms shutdown period. By setting the Retry/Shutdown bit in the GPGD Fault Operation Command to logic 0, the specific output shuts
down and remains OFF when the short fault is declared. Only a reissue of the turn ON command, via SPI or GINx, forces the output to try
to turn ON again.
In the event a GPGD is selected as a PWM controller and a short occurs on the output, the output retry strategy forces the output to a
1.0% duty cycle, based on the fault timer setting. For example: If the fault timer is set to 120 s and a fault is detected (drain voltage greater
than programmed threshold), the PWM output is commanded OFF for 12 ms and commanded ON again at the next PWM cycle.
Care should be taken to select a fault timer is shorter than the minimum duty cycle ON time of the PWM controller. Selecting a longer
fault time allows the PWM controller to continue to drive the external MOSFET into a shorted load.
PWM FREQUENCY/DUTY CYCLE COMMAND
The PWMx Freq & Duty Cycle command is use to program the GDx outputs with a frequency and duty cycle. Table 17 defines the user
selectable output frequency. The frequency and duty cycle may be updated at any time using the PWM Freq&DC command, however,
the update only begins on the next PWM rising edge.
Once the PWM Freq & DC registers are programmed and the PWM controller is enabled through the Mode Command, the PWM
outputs are turned ON and OFF via the GINx pin or the SPI GPGD ON/OFF Command control bit. All parallel and serial ON and OFF
command updates to the PWM controller are synchronous with the rising edge of the previous PWM period.
The truth table for GDx control in GPGD mode is provided in Table 9. The duty cycle of the PWM outputs is controlled by bits 0-6,
inclusive. The duty cycle value is 1.0% per binary count from 1-100 with counts of 101-127 defaulting to 100%. For example, sending SPI
command 101001000001100 would set GD1, PWM output to 10 Hz and 12% duty cycle.
33810
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Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
MODES OF OPERATION
.
Table 17. Frequency Select
PWM Freq&DC Command Bit<b9,b8,b7>
Frequency Hz
10 Hz (default)
20 Hz
000
001
010
011
100
101
110
111
40 Hz
80 Hz
160 Hz
320 Hz
640 Hz
1.28 kHz
Notes: Tolerance on selected frequency is ±10% after using the Calibration command. Shorts to battery and open load faults are not detected for frequency
and duty cycle combinations inconsistent with fault timers.
Table 18. Pre-driver GDx Output Control
Mode Command Driver ON/OFF
PWMx
Enable Bit
GINx
Terminal
GDx Output
IGN/GP Bit
GPGD Bit
1
1
1
1
1
0
0
1
X
1
X
0
0
1
1
0
1
X
1
X
OFF
ON
ON
Freq/DC
Freq/DC
V10 MODE
V10 mode provides a method for monitoring 10 ignition events while using only two current sense resistors. This is achieved using three
MC33810 devices. Two MC33810 devices are programmed as Normal Ignition mode outputs and one is programmed as a V10 Ignition
mode output. The ignition gate driver outputs are partitioned into two banks of five outputs each (See Figure 11). Each bank contains one
or two driver(s) from the V10 device.
Drivers in the V10 device are grouped in twos (GD0&GD2, GD1&GD3). Current from each V10 mode IGBT group is monitored by the
appropriate Normal mode device (See Figure 11). The MAXI signal from one Normal mode device is ported to the V10 mode MAXI input
pin. Likewise the MAXI signal from the second Normal mode device is ported to the V10 mode NOMI input pin. The V10 mode NOMI/MAXI
inputs are used as MAXI shutdown signals for the appropriate ignition gate drive group.
V10 mode contains the same features as Ignition mode gate drivers with the following exceptions:
• NOMI/MAXI configured as input pins
• MAXI shutdown for GPGD disabled
• NOMI/MAXI comparators disabled
In V10 mode, Spark command bits 7 and 8 (Gain Select, Overlapping Dwell) are disabled. These two features are achieved through
the Normal mode devices. RSN and RSP must be grounded in V10 mode.
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CTIONAL DEVICE OPERATION
ES OF OPERATION
Bank 1
IC 3 “Child”
GO
Bank 2
IC 1 “Parent”
IC 2 “Parent”
GO0
GO1
GO2
GO3
GO0
GO1
GO2
GO3
GIN0
Gate Drive 0
GIN1
Gate Drive 1
GIN2
Gate Drive 2
GIN3
Gate Drive 3
GIN0
0
GIN0
IGBT1
4
IGBT1
(0-3)
IGBT2
Gate Drive 0
GO1
6
GIN1
GIN2
GIN1
IGBT1
5
Gate Drive 1
GO
IGBT 2
(0-3)
2
GIN2
Gate Drive 2
GO3
GIN3
GIN3
IGBT2
7
Gate Drive 3
4 GIN
(0-3)
4
4
GIN (0-3)
GIN (0-3)
NOMI
LOGIC
LOGIC
NOMI
NOMI
LOGIC
MAXI
MAXI
MAXI
RSP1
RSP
RSP2
VtNI
NOMI
Comparator
Child
VtNI
NOMI
disabled
Ign 1
VtNI
Comparator
Inputs Tied
to GND
Ign 2
RS1
NOMI
Comparator
RS2
VtMI
MAXI
VtMI
MAXI
disabled
VtMI
MAXI
Logic
Buffer
Logic
Buffer
Comparator
Comparator
Logic
Buffer
Logic
Buffer
Logic
Buffer
Logic
Buffer
MAXI
NOMI
NOMI
MAXI
MAXI
NOMI
NOMI1 to uP
MAXI1 to uP
MAXI2 to uP
NOMI2 to uP
Note: For “child” input NOMI is for channel 1 and 3, input MAXI is for channel 0 and 2
Figure 11. V10 Mode
LOW-SIDE INJECTOR DRIVER
The four open drain low-side injector drivers are designed to control various automotive loads such as injectors, solenoids, lamps,
relays and unipolar stepper motors. Each driver includes OFF and ON state open load detection, short-circuit protection and diagnostics.
The injector drivers are individually controlled through the ON/OFF SPI input command Table 21 or parallel input pins DIN0 to DIN3. Serial
and parallel control of the output state is determined by the logical OR of the SPI serial bit and the DINx parallel input pins. All four outputs
are disabled when the OUTEN input pin is high regardless of the state of the SPI control bit or the state of the DINx pin. All four injector
drivers are not affected by the selection of the gate driver’s three modes of operation (Ignition mode, GPGD mode, V10 mode).
ON/OFF CONTROL COMMAND
To program the individual output of the 33810 ON or OFF, a 16-bit serial stream of data is entered into the SI pin. The first four bits of
the control word are used to identify the ON/OFF command. Bit 0 through bit 3 of the ON/OFF Control command turn ON or OFF the
specific output driver.
33810
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Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
MODES OF OPERATION
INJECTOR DRIVER FAULT COMMANDS
Fault protection strategies for the injector drivers are programmed by the SPI LSD Fault Command. Bit 8 through 11 determine the type
of short circuit protection to be used, bits 0 through 7 set the open load strategy.
Short-circuit protection consists of three strategies. All strategies utilize current limiting as an active element to protect the output driver
from failure.The TLIM and Timer options are used to enhance the short circuit protection strategy of the Injector drivers. The timer protection
scheme uses a low duty cycle in the event of a short-circuit. The TLIM protection circuit uses the junction temperature of the output driver
to determine the fault. Both methods may be used together or individually.
TIMER PROTECTION
The first protection scheme uses a low ON to OFF duty cycle to protect the output driver. The low duty cycle allows the device to cool
so the maximum junction temperatures are not exceeded. During a short condition, the device enters current limit. The driver shuts down
for short conditions lasting longer than the current limit timer (~60 s).
TEMPERATURE LIMIT (TLIM
)
The second scheme senses the temperature of the individual output driver. During a short event, the device enters current limit and
remains in current limit until the output driver temperature limit is exceeded (TLIM). At this point, the device shuts down until the junction
temperature falls below the hysteresis temperature value. The TLIM hysteresis value is listed in the previous specification tables.
The third method combines both protection schemes into one. During a short event, the device enters the current limit. The output driver
shuts down for short conditions lasting longer than the current limit timer. In the event the output driver temperature is higher than maximum
specified temperature, the output shuts down. The Shutdown/Retry bit allows the user to determine how the drivers responds to each short
circuit strategy. Table 19. provides fault operation for all three strategies.
Outputs may be used in parallel to drive higher current loads, provided the turn-off energy of the load does not exceed the energy rating
of a single output driver (100 mJ maximum).
Table 19. Injector Driver (OUTx) Fault Operation
ShutdnRetry
Bit 11
Fault Timer
Bit 9
TLIM Bit 10
Operation During Short Fault
Timer only, outputs retry on period
OUT0-OUT3 = 60 s ON, ~10 ms OFF
1
1
0
1
X
0
T
only, outputs retry on T hysteresis
LIM
LIM
Timer and T , outputs retry on period and driver temperature
LIM
below threshold
1
1
1
OUT0-OUT3 = 60 s ON, ~10 ms OFF
Timer only, outputs do not retry on period
OUT0-OUT3 = 60 s ON, OFF
0
0
0
0
1
1
X
0
1
T
only, outputs do not retry on TLim hysteresis
LIM
Timer and T , outputs do not retry on period or T
LIM
OUT0-OUT3 = 60 s ON, OFF
LIM
OUTPUT DRIVER DIAGNOSTICS.
Short to battery, Temperature Limit (TLIM) and open load faults are reported through the All Status Response message Table 22.
OFF OPEN LOAD PULL-DOWN CURRENT ENABLE BITS
An open load on the output driver is detected by the voltage level on the drain of the MOSFET in the OFF state. Internal to the device
is a 75 A pull-down current sink. In the event of an open load, the drain voltage is pulled low. When the voltage crosses the threshold,
an open load is detected. The pull-down current source may be disabled by bit 0 through bit 3 in the LSD Fault Command. With the driver
OFF and the OFF open load bit disabled, the OFF open load fault status bit is a logic [0].
ON OPEN LOAD ENABLE BITS
The ON state open load enable bit allows the user to determine an ON state open load. When the ON state open load bit disabled, the
ON state Fault bit is always logic [0]. ON open load is determined by monitoring the current through the OUTx MOSFET. In the ON state,
currents less than 20 mA to 200 mA are considered open.
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CTIONAL DEVICE OPERATION
ES OF OPERATION
Table 20. InjectorDriver Diagnostics
Fault
Program State
Fault Bits
OFF State Open Load
Pull Dwn
ON State Open Load
En Bit
Output STB STG OUTx Batt Short OUTx OFF Open OUTx ON Open
Driver ON/OFF
Fault Reported
OPEN
Fault
Fault
Fault
No Fault
0
0
0
1
1
1
X
X
X
X
X
X
OFF
OFF
OFF
OFF
OFF
OFF
STB
0
0
0
No Fault
STG
OPEN
STB
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
No Fault
No Fault
Open Load
Open Load
STG
OPEN
Short to Batt
No Fault
X
X
X
X
X
X
0
0
0
1
1
1
ON
ON
ON
ON
ON
ON
STB
STG
1
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
No Fault
OPEN
STB
Short to Batt
Open Load
Open Load
STG
OPEN
CLOCK CALIBRATION COMMAND
In cases where an accurate time base is required, the user must calibrate the internal timers using the Clock Calibration command
(refer to Table 21). After the 33810 device receives the Calibration command, the device expects to receive a 32 s logic [0] calibration
pulse on the CS pin. The pulse is used to calibrate the internal clock. Any SPI message may be sent during the 32 s calibration chip
select. Because the oscillator frequency may shift up to 35% with temperature, calibration is required for an accurate time base. The
Calibration command should be used to update the device on a periodic basis.
SPI COMMAND SUMMARY
The SPI commands are defined as 16 bits with 4 address control bits and 12 command data bits. There are 12 separate commands
used to set operational parameters of device. The operational parameters are stored internally in 16-bit registers. Table 21 defines the
commands and default state of the internal registers at POR. SPI commands may be sent to the device at any time in Normal state.
Messages sent are acted upon on the rising edge of the CS input.
.
Table 21. SPI Command Message Set and Default State
Command
Control Address Bits
Command Bits
hex
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Read Registers
Command
<0000>
Internal Register Address
0
0
0
0
0
1
0
1
0
0
0
0
0
All Status Command
SPI Check Command
0
0
0
0
0
0
0
0
0
0
1
1
0
1
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
<0000>
<0>
V10
<0>
OVR/
UNDR
Vtg
<0>
<0>
<0>
<0>
IGN/GP Mode Select
PWM3 PWM2 PWM1 PWM0
Mode Select Command
LSD Fault Command
1
2
0
0
0
0
0
1
1
0
X
X
En
EN
EN
EN
EN
Set to IGN Mode
Disab
Disab Disab Disab Disab
<10X>
<1>
<1>
<1>
<1>
<1>
<1>
<1>
<1>
LSD Fault Operation
Shutdown,Tlim,Timer
OUT3 OUT2 OUT1 OUT0 OUT3 OUT2 OUT1 OUT0
ON
ON
ON
ON
OFF
OFF
OFF
OFF
X
X
Open Open Open Open Open Open Open Open
Retry on Timer
and No Tlim
Load
Load
Load
Load
Load
Load
Load LoadE
Enabl Enabl Enabl Enabl Enabl Enabl Enabl nabl
<0000>
GPGD
Driver ON/OFF
Command
<0000>
OUTx Driver
OFF
OFF
3
0
0
1
1
X
X
X
(IGNORED IN IGNITION
0 = OFF, 1 = ON
MODE)
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FUNCTIONAL DEVICE OPERATION
MODES OF OPERATION
Table 21. SPI Command Message Set and Default State (continued)
Command
Control Address Bits
Command Bits
hex
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
<100>
<0>
Max
Dwell
En
<0>
Over
lap
<0>
Gain
Sel
<0>
Soft
Shut
<0>
<11>
Open
<01>
Max Dwell Timer
Open
End Spark
Threshold
ed
2
Spark Command
4
0
1
0
0
MaxDwell
Secondary
OSFLT
Default=32 ms
Dwell Gain Dn En Clmp
Disab Disab
= 1
Disab Disab
=100 s
VPWR +5.5 V
(In Ignition Mode Only)
<01>
End Spark
Filter
X
End Spark Filter
DAC Command
5
0
1
0
1
X
X
X
X
X
X
X
X
X
4.0 s
<100>
<1000>
MAXI DAC Threshold
MAXI=14 A
<01010>
6
7
8
9
0
0
1
1
1
1
0
0
1
1
0
0
0
1
0
1
NOMI DAC Threshold
NOMI=5.5 A
Overlap Setting
Overlap 50%
<011>
<011>
Short to Batt V
<011>
<011>
GPGD Short Threshold
Voltage Command
Short to Batt V
Short to Batt V
Short to Batt V
FB3
FB2
FB1
FB0
V
= 2.0 V
V
= 2.0 V
V
= 2.0 V
V
= 2.0 V
TH
TH
TH
TH
<011>
<011>
Short to Batt t
Timer = 240 s
<011>
<011>
GPGD Short Duration
Timer Command
Short to Batt t
Timer = 240 s
Short to Batt t
Timer = 240 s
Short to Batt t
FB3
FB2
FB1
FB0
Timer = 240 s
<1111>
Retry/Shutdown Bit
Retry on Fault
<0000>
Shutdown Drivers on MAXI
Disabled
GPGD Fault Operation
Select Command
X
X
X
X
<00>
<000>
<0000000>
PWM0 to PWM3 Freq &
DC Command
PWMx
A
1
0
1
0
PWM Frequency
PWM Duty Cycle
Address
PWM0
10 Hz
0% Duty Cycle
INVALID COMMAND
INVALID COMMAND
INVALID COMMAND
B
C
D
1
1
1
0
1
1
1
0
0
1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Clock Calibration
Command
E
F
1
1
1
1
1
1
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
INVALID COMMAND
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33
CTIONAL DEVICE OPERATION
ES OF OPERATION
SPI RESPONSE REGISTERS
Fault reporting is accomplished through the SPI interface. All logic [1]s received by the MCU via the SO pin indicate faults. All logic [0]s
received by the MCU via the SO pin indicate no faults. Timing between two write words must be greater than the fault timer to allow
adequate time to sense and report the proper fault status.
Table 22. SPI Response Messages
15
14
13
0
12
0
11
1
10
1
9
0
8
1
7
0
6
0
5
0
4
0
3
1
2
0
1
1
0
0
Next SO Response to:
SPI Check Command
0
0
Next SO Response to
HEX1 to HEX A
Commands and Read
All Status Command
ALL STATUS
IGN3
Fault
IGN2
Fault
IGN1
Fault
IGN0
Fault
GP3
Fault
GP2
Fault
GP1
Fault
GP0
Fault
OUT3 OUT2 OUT1 OUT0
Fault Fault Fault Fault
Reset
COR
SOR
NMF
RESPONSE
Next SO Response to
READ REGISTER
COMMAND
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Address <0000>
All Status Register
0 = No Fault, 1 = Fault
IGN3
Fault
IGN2
Fault
IGN1
Fault
IGN0
Fault
GP3
Fault
GP2
Fault
GP1
Fault
GP0
Fault
OUT3 OUT2 OUT1 OUT0
Reset
COR
SOR
NMF
Fault
Fault
Fault
Fault
Address <0001>
OUT1, OUT0 Fault
Register
OUT1 OUT1 OUT1
OUT0 OUT0 OUT0
OUT1
TLIM
Fault
OUT0
TLIM
Fault
Over
Low
Battery OFF
ON
Battery OFF
ON
Reset
Reset
Reset
COR
COR
COR
0
0
0
0
0
0
0
0
0
0
0
0
voltage Voltage
Short
Fault
Open
Fault
Open
Fault
Short
Fault
Open
Fault
Open
Fault
0 = No Fault, 1 = Fault
Address <0010>
OUT3, OUT2 Fault
Register
OUT3 OUT3 OUT3
OUT2 OUT2 OUT2
OUT3
TLIM
Fault
OUT2
TLIM
Fault
Over
voltage Voltage
Low
Battery OFF
ON
Open
Fault
Battery OFF
ON
Open
Fault
Short
Fault
Open
Fault
Short
Fault
Open
Fault
0 = No Fault, 1 = Fault
Address <0011>
GPGD Mode Fault
Register
GP3
Short
GP3
Open
GP2
Short
GP2
Open
GP1
Short
GP1
Open
GP0
Short
GP0
Open
Over
voltage Voltage
Low
Circuit Load Circuit Load Circuit Load Circuit Load
Fault
Fault
Fault
Fault
Fault
Fault
Fault
Fault
0 = No Fault, 1 = Fault
IGN3
Max
IGN3
Open
IGN2
Max
IGN2
Open
IGN1
Max
IGN1
Open
IGN0
Max
IGN0
Open
Address <0100>
IGN Mode Fault Register
0 = No Fault, 1 = Fault
IGN3
MAXI
Fault
IGN2
MAXI
Fault
IGN1
MAXI
Fault
IGN0
MAXI
Fault
Over
Low
Reset
Reset
Reset
Reset
Reset
COR
COR
COR
COR
COR
voltage Voltage
Dwell Second
Dwell Second
Dwell Second
Dwell Second
Fault
Fault
Fault
Fault
Fault
Fault
Fault
Fault
Address <0101>
Mode Command
Register
Over
voltage Voltage
Low
V10
En
OVR
Vtg
PWM3 PWM2 PWM1 PWM0
EN EN EN EN
IGN/GPGD Mode Select
X
X
OUT3 OUT2 OUT1 OUT0 OUT3 OUT2 OUT1 OUT0
Address <0110>
LSD Fault Command
Register
Over
voltage Voltage
Low
LSD Fault Operation
Shutdown,Tlim,Timer
ON
Open
Load
ON
Open
Load
ON
Open
Load
ON
Open
Load
OFF
Open
Load
OFF
Open
Load
OFF
Open
Load
OFF
Open
Load
X
X
Address <0111>
Drvr ON/OFF Command
Reg
Over
voltage Voltage
Low
(21)
(21)
X
X
X
GPGD
OUTx Driver
Address <1000>
Spark Command
Register
Max
Dwell
En
Soft
Shut
Open
Over
voltage Voltage
Low
Max Dwell Timer
MaxDwell
Overla Gain
p Dwell
Open
Secondary
End Spark
Threshold
ed
2
Sel
Dn En Clmp
Address <1001>
End Spark Filter
Register
End Spark
Filter
Over
Low
Reset
Reset
COR
COR
X
X
X
X
X
X
X
X
X
X
voltage Voltage
Address <1010>
DAC Command Register
Over
voltage Voltage
Low
MAXI DAC Threshold
Overlap Setting
NOMI DAC Threshold
Notes
21. These bits refer to command ON or OFF state in the command registers, not the state of the respective output lines. These bits are not to be
confused with the Ignition mode state which is controlled only by the parallel inputs. Their state is not reflected in these bits.
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Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
MODES OF OPERATION
Table 22. SPI Response Messages (continued)
15
14
13
12
11
1
10
1
9
0
8
1
7
0
6
0
5
0
4
0
3
1
2
0
1
1
0
0
Next SO Response to:
SPI Check Command
0
0
0
0
Address <1011>
GPGD FBx Short to
Battery Threshold
Voltage Register
Over
Low
Reset
COR
Short to Batt V
Short to Batt V
Short to Batt V
Short to Batt V
FB0
FB3
FB2
FB1
voltage Voltage
Address <1100>
GPGD FBx Short to
Battery Threshold Timer
Register
Over
Low
Reset
Reset
Reset
Reset
COR
COR
COR
COR
Short to Batt t
Short to Batt t
Short to Batt t
Short to Batt t
FB0
FB3
FB2
FB1
voltage Voltage
Address <1101>
GPGD Fault Operation
Register
Over
voltage Voltage
Low
Retry/Shutdown Bit
X
X
X
X
Shutdown Drivers on MAXI
Address <1110>
PWM Freq&DC Register
(last channel
Over
voltage Voltage
Low
PWMx
Address
PWM Frequency
PWM Duty Cycle
programmed)
Address <1111>
Revision ID, Trim, Clock
Cal.
CAL
Too
HI
CAL
Too
LOW
TRIM
Parity
Error
TRIM
Lock
Out
Over
voltage Voltage
Low
3
REV 2
ID 1
0
X
X
X
X
Legend
COR = Command Out of Range
SOR = Supply Out of Range
NMF = Set When Faults Occur on V10 Mode MAXI and NOMI Inputs and V10 Mode Ignition Driver are OFF.
33810
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35
KAGING
KAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below.
33810
Analog Integrated Circuit Device Data
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Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
.
33810
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Freescale Semiconductor
37
KAGING
KAGE DIMENSIONS
33810
Analog Integrated Circuit Device Data
38
Freescale Semiconductor
REVISION HISTORY
PACKAGE DIMENSIONS
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
10/2007
•
Initial Release
Fixed several typos throughout document
3.0
•
•
Changed Static Electrical Characteristics, Table 3, Digital Interface, OUTEN Leakage Current to V
maximum from
DD,
10 to 50 A.
Reworded Table 15.
Added Table 16 back (it was inadvertently deleted.
Added “Ignition &” to tile in Table 4.
2/2008
8/2008
4.0
5.0
•
•
•
•
•
Updated package drawing.
Parameter changes to Gate Drive Source Current, Spark Duration Comparator Threshold, NOMI Trip Threshold Ac-
curacy, MAXI Trip Point During Overlapping Dwell, Comparator Hysteresis Voltage, Short to Battery Fault Detection
Voltage Threshold, Output OFF Open Load Detection Current, and Input Logic-voltage Hysteresis.
•
•
•
•
Made change to End of Spark Filter Time Select
Changed orderable Part Number from PCZ33810EK/R2 to MCZ33810EK/R2 on Page 1.
Revised Exposed Pad pin definition in Table 1, page 3.
12/2008
6.0
Changed Package outline drawing to 98ASA10556D.
•
•
Changed introduction paragraph to Tables 3 and 4 from “9.0 V VPWR 18 V” to “6.0 V VPWR 32 V”
7/2010
7.0
Changed Gate Driver Parameters of V
from 5.0 to 4.8.
GS(ON)
•
•
Changed Table 3 Characteristics from 18 V to 32 V for: I
I
and I
7/2010
2/2011
8.0
9.0
VPWR(SS), (OFF)OCO FBX(FLT-SNS)
Changed See Output OFF Open Load Detection Current on page 7 from 100 A to 115 A for the maximum value.
•
•
Corrected Table 14, End of Spark Filter Time Select.
Corrected Table 21, SPI Command Message Set and Default State (Command: End Spark Filter).
4/2011
4/2013
10.0
11.0
•
No technical changes. Revised back page. Updated document properties. Added SMARTMOS sentence to first para-
graph.
•
•
•
•
•
Updated format and back page
Added Ordering Information section
Substituted general purpose gate driver/pre-driver with GPGD throughout the document.
Corrected End Spark Filter SPI response register address (1001, not 0101)
Corrected hex to binary conversion (C is 1100, not 1001)
8/2014
33810
Analog Integrated Circuit Device Data
Freescale Semiconductor
39
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Document Number: MC33810
Rev. 11.0
8/2014
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