MF3ICD8101DUD/01 [NXP]
IC SPECIALTY MICROPROCESSOR CIRCUIT, UUC, DIE PACKAGE, Microprocessor IC:Other;
| 型号： | MF3ICD8101DUD/01 |
| 厂家： | 
NXP |
| 描述： | IC SPECIALTY MICROPROCESSOR CIRCUIT, UUC, DIE PACKAGE, Microprocessor IC:Other 外围集成电路 |
| 文件： | 总12页 (文件大小：105K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MF3ICD8101
MIFARE DESFire contactless multi-application IC
BL-ID Doc. No.: 145610
Rev. 01.00 — 11 December 2007
Objective short data sheet
1. General description
NXP has developed the MIFARE DESFire (MF3ICD8101) to be used with Proximity
Coupling Devices (PCDs) according to ISO/IEC 14443 Type A. The transport protocol
complies to part ISO/IEC 14443-4. The MF3ICD8101 is primarily designed for secure
contactless transport applications and related loyalty programs.
2. Features
2.1 RF Interface: ISO/IEC 14443 Type A
Contactless transmission of data and powered by the RF-field (no battery needed)
Operating distance: Up to 100 mm (depending on antenna geometry)
Operating frequency: 13.56 MHz
Fast data transfer: 106 kbit, 212 kbit, 424 kbit, 848 kbit
High data integrity: 16-bit/32-bit CRC, parity, bit coding, bit counting; CMAC; MAC
True deterministic anticollision
7 byte unique identifier (cascade level two according to ISO/IEC 14443-3)
Uses ISO/IEC 14443-4 protocol
2.2 ISO/IEC 7816 compatibility (only software version 0.6 and higher)
Supports ISO/IEC 7816-3 APDU message Structure
Supports ISO/IEC 7816-4 INS code ‘A4’ SELECT
Supports ISO/IEC 7816-4 INS code ‘B0’ READ BINARY
Supports ISO/IEC 7816-4 INS code ‘D6’ UPDATE BINARY
Supports ISO/IEC 7816-4 INS code ‘B2’ for READ RECORDS
Supports ISO/IEC 7816-4 INS code ‘E2’ for APPEND RECORD
Supports ISO/IEC 7816-4 INS code ‘84’ for GET CHALLENGE
Supports ISO/IEC 7816-4 INS code ‘88’ for INTERNAL AUTHENTICATE
Supports ISO/IEC 7816-4 INS code ‘82’ for EXTERNAL AUTHENTICATE
2.3 Non-volatile memory
8 kB NV-Memory
Data retention of 10 years
Write endurance typical 500 000 cycles
MF3ICD8101
NXP Semiconductors
MIFARE DESFire contactless multi-application IC
2.4 NV-memory organization
Flexible file system
Up to 28 applications simultaneously on one PICC
Up to 32 files in each application
2.5 Security
Unique 7 byte serial number for each device
Mutual three pass authentication
Mutual authentication according to ISO/IEC 7816-4
Data encryption on RF-channel with replay attack protection:
Hardware DES using 56-bit, 112-bit and 168-bit keys featuring key version, data
authenticity by 8 byte CMAC
Hardware AES using 128-bit keys featuring key version, data authenticity by 8 byte
CMAC
Authentication on application level
Hardware exception sensors
Self-securing file system
Backward compatibility to MF3ICD4001: 4 byte MAC
3. Applications
Transport
Access control
Loyalty
Internet applications
4. Quick reference data
Table 1.
Symbol Parameter
Quick reference data [1][2]
Conditions
22 °C,
Min
Typ
Max
Unit
Ciss
input capacitance
14.96
17.0
19.04 pF
(LCR meter HP4258)
EEPROM write time
EEPROM data retention
EEPROM write endurance
input frequency
13.56 MHz, 2 V
tW
-
2.9
-
-
-
-
-
ms
tRET
NWE
fi
10
years
cycles
MHz
200000 500000
13.56
−
[1] Stresses above one or more of the values may cause permanent damage to the device
[2] Exposure to limiting values for extended periods may affect device reliability
MF3ICD8101_SDS_N_1
© NXP B.V. 2007. All rights reserved.
Objective short data sheet
Rev. 01.00 — 11 December 2007
2 of 12
MF3ICD8101
NXP Semiconductors
MIFARE DESFire contactless multi-application IC
5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Die on sawn wafer
Version
MF3ICD8101DUD/01
Wafer
-
6. Block diagram
UART
ISO/IEC
14443A
TRUE RANDOM
NUMBER
GENERATOR
RF
CRYPTO
CO-PROCESSORS
INTERFACE
SECURITY
SENSORS
POWER ON
RESET
CPU/LOGIC UNIT
CRC
VOLTAGE
REGULATOR
CLOCK
INPUT FILTER
ROM
RAM
EEPROM
RESET
GENERATOR
MF3ICD8101
001aah389
Fig 1. Block diagram
7. Limiting values
Table 3.
Limiting values [1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
II
Parameter
Conditions
Min
Max
30
Unit
mA
input current
-
-
Ptot (pack)
total power dissipation per
package
200
mW
Tstg
Toper
Vesd
Ilu
storage temperature
operating temperature
electrostatic discharge voltage
latch-up current
-55
-25
2
125
°C
°C
kV
mA
70
-
[3]
± 100
-
[1] Stresses above one or more of the limiting values may cause permanent damage to the device
[2] Exposure to limiting values for extended periods may affect device reliability
[3] MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 kΩ
MF3ICD8101_SDS_N_1
© NXP B.V. 2007. All rights reserved.
Objective short data sheet
Rev. 01.00 — 11 December 2007
3 of 12
MF3ICD8101
NXP Semiconductors
MIFARE DESFire contactless multi-application IC
8. Functional description
8.1 Contactless energy and data transfer
In the MIFARE system, the MF3ICD8101 is connected to a coil consisting of a few turns
embedded in a standard ISO/IEC smart card. No battery is needed. When the card is
positioned in the proximity of the PCD antenna, the high speed RF communication
interface allows to transmit data with up to 848 kbit/s.
8.2 Anticollision
An intelligent anticollision mechanism allows handling more than one PICC in the field
simultaneously. The anticollision algorithm selects each PICC individually and ensures
that the execution of a transaction with a selected PICC is performed correctly without
data corruption resulting from other PICCs in the field.
8.3 UID/serial number
The unique 7 byte serial number (UID) is programmed into a locked part of the
NV-memory which is reserved for the manufacturer. Due to security and system
requirements these bytes are write-protected after being programmed by the IC
manufacturer at production time. According to ISO/IEC 14443-3 during the first
anticollision loop the cascade tag will be returned 0x88 and the first 3 bytes of the UID,
SN0 to SN2 and BCC. The second anticollision loop will return bytes SN3 to SN6 and
BCC.
SN0 holds the Manufacturer ID for NXP (04h) according to ISO/IEC 14443-3 and
ISO/IEC 7816-6 AMD 1.
8.4 Memory organization
The 8 kB NV-memory is organized using a flexible file system. This file system allows a
maximum of 28 different applications on one single PICC. Each application provides up to
32 files. Every application is represented by it's 3 bytes Application IDentifier, AID.
Five different file types are supported.
A guideline to assign DESFire AIDs can be found in the application note “MIFARE
Application Directory, MAD”.
Each file can be created either at PICC initialization (card production / card printing), at
PICC personalization (vending machine) or in the field.
If a file or application becomes obsolete in operation, it can be permanently invalidated.
Commands which have impact on the file structure itself (e.g. creation or deletion of
applications, change of keys) activate an automatic rollback mechanism, which protects
the file structure from getting corrupted.
If this rollback is necessary, it is done without user interaction before carrying out further
commands.To ensure data integrity on application level, a transaction oriented backup is
implemented for all file types with backup. It is possible to mix file types with and without
backup within one application.
MF3ICD8101_SDS_N_1
© NXP B.V. 2007. All rights reserved.
Objective short data sheet
Rev. 01.00 — 11 December 2007
4 of 12
MF3ICD8101
NXP Semiconductors
MIFARE DESFire contactless multi-application IC
8.5 Available file types
The files within an application can be of different types as:
• Standard Data Files
• Backup Data Files
• Value Files with Backup
• Linear Record Files with Backup
• Cyclic Record Files with Backup
8.6 Security
The 7 byte UID is unchangeably programmed into each device during production. It
cannot be altered and ensures the uniqueness of each device.
The UID may be used to derive diversified keys for each ticket. Diversified PICC keys
contribute to gain an effective anti-cloning mechanism.
Remark: For new authentications other than 0Ah, the init vector for the calculation of the
MAC is only reset to ‘00h’ after the authentication. So the init vector shall be remembered
during the whole transaction until a new authentication is calculated.
8.7 3 pass authentication
Prior to data transmission a mutual three pass authentication can be done between PICC
and PCD depending on the configuration employing either 56-bit DES (single DES, DES),
112-bit DES (triple DES, 3DES), 168-bit DES (3 key triple DES, 3K3DES) or AES. During
the authentication the security level of all further commands during the session is set.
Three pass authentication proves that both parties (PCD and PICC) are owner of a
common secret (DES, 3DES, 3K3DES. AES key). The result of a successful
authentication is a trusted link between both parties. The authentication command also
yields a session key that you can use to protect the data transmission channel.
MF3ICD8101_SDS_N_1
© NXP B.V. 2007. All rights reserved.
Objective short data sheet
Rev. 01.00 — 11 December 2007
5 of 12
MF3ICD8101
NXP Semiconductors
MIFARE DESFire contactless multi-application IC
9. DESFire command set
9.1 ISO/IEC 14443-3:
Table 4.
Command
REQA
ISO/IEC 14443-3
Description
REQA and ATQA are implemented fully
according to ISO/IEC 14443-3.
WUPA
WAKE-UP is implemented fully according to
ISO/IEC 14443-3.
ANTICOLLISION / SELECT Cascade Level 1 The ANTICOLLISION and SELECT commands
are implemented fully according to ISO/IEC
14443-3. The response is part 1 of the UID.
ANTICOLLISION / SELECT Cascade Level 2 The ANTICOLLISION and SELECT commands
are implemented fully according to ISO/IEC
14443-3. The response is part 2 of the UID.
9.2 ISO/IEC 14443-4:
Table 5.
Command
RATS
ISO/IEC 14443-4:
Description
The response to the RATS command identifies the PICC type to the PCD.
PPS
The PPS command allows an individual selection of the communication baud
rate between PCD and PICC. For DESFire it is possible to individually set the
communication baud rate independently for both directions i.e. DESFire
allows a non-symmetrical information interchange speed.
WTX
If the PICC needs more time than the defined FWT to respond to a PCD
command it will send a request for a waiting time extension.
9.3 MF3ICD8101 command set overview – security related commands:
Table 6.
Security related commands
Description
Command
Authenticate
In this procedure both, the PICC as well as the reader device, show in an
encrypted way that they possess the same secret which especially
means the same key. This procedure not only confirms that both entities
are permitted to do operations on each other but also creates a session
key which can be used to keep the further communication path secure.
As the name “session key” implicitly indicates, each time a new
authentication procedure is successfully completed a new key for further
cryptographic operations is generated.
Change KeySettings
Set Configuration
Changes the master key settings on PICC and application level.
Configures the card and pre personalizes the card with a key, defines if
the UID or the random ID is sent back during communication setup and
configures the ATS string.
Change Key
Changes any key stored on the PICC.
Get KeyVersion
Reads out the current key version of any key stored on the PICC.
Remark: All command & data frames are exchanged between PICC and PCD by using
block format as defined in ISO/IEC 14443-4.
MF3ICD8101_SDS_N_1
© NXP B.V. 2007. All rights reserved.
Objective short data sheet
Rev. 01.00 — 11 December 2007
6 of 12
MF3ICD8101
NXP Semiconductors
MIFARE DESFire contactless multi-application IC
9.4 MF3ICD8101 command set overview – PICC level commands:
Table 7.
PICC level commands
Command
Description
Create Application
Delete Application
Get Applications IDs
Free Memory
Creates new applications on the PICC.
Permanently deactivates applications on the PICC.
Returns the Application IDentifiers of all applications on a PICC.
Returns the free memory available on the card
Returns the DF names
GetDFNames
Get KeySettings
Gets information on the PICC and application master key settings. In
addition it returns the maximum number of keys which are configured
for the selected application.
Select Application
FormatPICC
Get Version
Selects one specific application for further access.
Releases the PICC user memory.
Returns manufacturing related data of the PICC.
Returns the UID.
GetCardUID
Remark: All command & data frames are exchanged between PICC and PCD by using
block format as defined in ISO/IEC 14443-4.
9.5 MF3ICD8101 command set overview – application level commands:
Table 8.
Application level commands
Description
Command
Get FileIDs
Returns the File IDentifiers of all active files within the currently selected
application.
Get FileSettings
Get information on the properties of a specific file.
Change FileSettings Changes the access parameters of an existing file.
Create StdDataFile
Creates files for the storage of plain unformatted user data within an
existing application on the PICC.
Create
BackupDataFile
Creates files for the storage of plain unformatted user data within an
existing application on the PICC, additionally supporting the feature of an
integrated backup mechanism.
Create ValueFile
Creates files for the storage and manipulation of 32-bit signed integer
values within an existing application on the PICC.
Create
LinearRecordFile
Creates files for multiple storage of structural similar data, for example for
loyalty programs, within an existing application on the PICC. Once the file is
filled completely with data records, further writing to the file is not possible
unless it is cleared.
Create
CyclicRecordFile
Creates files for multiple storage of structural similar data, for example for
logging transactions, within an existing application on the PICC. Once the
file is filled completely with data records, the PICC automatically overwrites
the oldest record with the latest written one. This wrap is fully transparent
for the PCD.
DeleteFile
Permanently deactivates a file within the file directory of the currently
selected application.
Remark: All command & data frames are exchanged between PICC and PCD by using
block format as defined in ISO/IEC 14443-4.
MF3ICD8101_SDS_N_1
© NXP B.V. 2007. All rights reserved.
Objective short data sheet
Rev. 01.00 — 11 December 2007
7 of 12
MF3ICD8101
NXP Semiconductors
MIFARE DESFire contactless multi-application IC
9.6 MF3ICD8101 command set overview – data manipulation commands:
Table 9.
Data manipulation commands
Description
Command
Read Data
Write Data
Get Value
Credit
Reads data from Standard Data Files or Backup Data Files.
Writes data to Standard Data Files or Backup Data Files.
Reads the currently stored value from Value Files.
Increases a value stored in a Value File.
Debit
Decreases a value stored in a Value File.
Limited Credit
Allows a limited increase of a value stored in a Value File without
having full Credit permissions to the file.
Write Record
Writes data to a record in a Cyclic or Linear Record File.
Read Records
Reads out a set of complete records from a Cyclic or Linear Record
File.
Clear RecordFile
Resets a Cyclic or Linear Record File to empty state.
Commit Transaction
Validates all previous write access’ on Backup Data Files, Value
Files and Record Files within one application.
Abort Transaction
Invalidates all previous write access’ on Backup Data Files, Value
Files and Record Files within one application.
Remark: All command & data frames are exchanged between PICC and PCD by using
block format as defined in ISO/IEC 14443-4.
9.7 MF3ICD8101 command set- ISO/IEC 7816 APDU commands:
The MF3ICD8101 provides the following command set according to ISO/IEC 7816-4
clause 6:
– INS code ‘A4’ SELECT
– INS code ‘B0’ READ BINARY
– INS code ‘D6’ UPDATE BINARY
– INS code ‘B2’ READ RECORDS
– INS code ‘E2’ APPEND RECORD
– INS code ‘84’ GET CHALLENGE
– INS code ‘88’ INTERNAL AUTHENTICATE
– INS code ‘82’ EXTERNAL AUTHENTICATE
9.7.1 ISO/IEC 7816-4 APDU message structure:
DESFire supports the APDU message structure according to ISO/IEC 7816-4 for
– an optional wrapping of the native DESFire APDU format
– for the additionally implemented ISO/IEC 7816-4 commands
MF3ICD8101_SDS_N_1
© NXP B.V. 2007. All rights reserved.
Objective short data sheet
Rev. 01.00 — 11 December 2007
8 of 12
MF3ICD8101
NXP Semiconductors
MIFARE DESFire contactless multi-application IC
10. Abbreviations
Table 10. Abbreviations
Acronym
AES
Description
Advanced Encryption Standard
Application IDentifier
AID
APDU
ATS
Application Protocol Data Unit
Answer to Select
CMAC
CRC
DES
Cryptic Message Authentication Code
Cyclic Redundancy Check
Digital Encryption Standard
Dedicated File
DF
EEPROM
FWT
INS
Electrically Erasable Programmable Read-Only Memory
Frame Waiting Time
Instructions
MAC
MAD
NV
Message Authentication Code
MIFARE Application Directory
Non Volatile Memory
PCD
PICC
PPS
Proximity Coupling Device
Proximity Integrated Circuit Card
Protocol Parameter Selection
Request Answer To Select
Request Answer
RATS
REQA
RF
Radio Frequency
UID
Unique Identifier
WTX
WUPA
Waiting Time Extension
Wake Up Protocol A
MF3ICD8101_SDS_N_1
© NXP B.V. 2007. All rights reserved.
Objective short data sheet
Rev. 01.00 — 11 December 2007
9 of 12
MF3ICD8101
NXP Semiconductors
MIFARE DESFire contactless multi-application IC
11. Revision history
Table 11. Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
MF3ICD8101_SDS_N_1 20071211
Objective short data sheet
-
-
• Initial version
MF3ICD8101_SDS_N_1
© NXP B.V. 2007. All rights reserved.
Objective short data sheet
Rev. 01.00 — 11 December 2007
10 of 12
MF3ICD8101
NXP Semiconductors
MIFARE DESFire contactless multi-application IC
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
MIFARE — is a trademark of NXP B.V.
DESFire — is a trademark of NXP B.V.
13. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
MF3ICD8101_SDS_N_1
© NXP B.V. 2007. All rights reserved.
Objective short data sheet
Rev. 01.00 — 11 December 2007
11 of 12
MF3ICD8101
NXP Semiconductors
MIFARE DESFire contactless multi-application IC
14. Tables
Table 1. Quick reference data [1][2] . . . . . . . . . . . . . . . . . .2
Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .3
Table 3. Limiting values [1][2]. . . . . . . . . . . . . . . . . . . . . . .3
Table 4. ISO/IEC 14443-3 . . . . . . . . . . . . . . . . . . . . . . . .6
Table 5. ISO/IEC 14443-4: . . . . . . . . . . . . . . . . . . . . . . . .6
Table 6. Security related commands . . . . . . . . . . . . . . . .6
Table 7. PICC level commands . . . . . . . . . . . . . . . . . . . . 7
Table 8. Application level commands . . . . . . . . . . . . . . . 7
Table 9. Data manipulation commands . . . . . . . . . . . . . . 8
Table 10. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 11. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
15. Figures
Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
16. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
9.6
9.7
MF3ICD8101 command set overview –
data manipulation commands:. . . . . . . . . . . . . 8
MF3ICD8101 command set- ISO/IEC 7816
APDU commands: . . . . . . . . . . . . . . . . . . . . . . 8
ISO/IEC 7816-4 APDU message structure:. . . 8
2
2.1
2.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
RF Interface: ISO/IEC 14443 Type A . . . . . . . 1
ISO/IEC 7816 compatibility (only software
version 0.6 and higher). . . . . . . . . . . . . . . . . . . 1
Non - volatile memory. . . . . . . . . . . . . . . . . . . . 1
NV-memory organization . . . . . . . . . . . . . . . . . 2
Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
9.7.1
10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . 10
2.3
2.4
2.5
11
12
Legal information . . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3
4
5
6
7
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
12.1
12.2
12.3
12.4
13
14
15
16
Contact information . . . . . . . . . . . . . . . . . . . . 12
Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8
Functional description . . . . . . . . . . . . . . . . . . . 4
Contactless energy and data transfer. . . . . . . . 4
Anticollision. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
UID/serial number. . . . . . . . . . . . . . . . . . . . . . . 4
Memory organization . . . . . . . . . . . . . . . . . . . . 4
Available file types . . . . . . . . . . . . . . . . . . . . . . 5
Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 pass authentication . . . . . . . . . . . . . . . . . . . . 5
8.1
8.2
8.3
8.4
8.5
8.6
8.7
9
DESFire command set. . . . . . . . . . . . . . . . . . . . 6
ISO/IEC 14443-3: . . . . . . . . . . . . . . . . . . . . . . . 6
ISO/IEC 14443-4: . . . . . . . . . . . . . . . . . . . . . . . 6
MF3ICD8101 command set overview –
9.1
9.2
9.3
security related commands: . . . . . . . . . . . . . . . 6
MF3ICD8101 command set overview –
PICC level commands: . . . . . . . . . . . . . . . . . . . 7
MF3ICD8101 command set overview –
9.4
9.5
application level commands: . . . . . . . . . . . . . . 7
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 December 2007
Document identifier: MF3ICD8101_SDS_N_1
相关型号：
©2020 ICPDF网 联系我们和版权申明