MF3MODQ101DA8/06_技术文档

MF3ICD(H)Q1

MIFARE DESFire EV1 256B contactless smartcard IC

Rev. 3.0 — 5 November 2015

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COMPANY PUBLIC

1. General description

MIFARE DESFire EV1 256B (MF3ICD(H)Q1), is the future proof entry level product of the

well-established MIFARE DESFire family and is addressing applications with low memory

but high security and data integrity needs.

The MIFARE DESFire EV1 256B offers the same security and file creation features as the

higher memory family members (Ref. 1), but the number of applications and related files

on this product is limited due to its small memory plot.

This addresses the needs of account based systems and environments requiring only a

limited set of applications.

These applications include but are not limited to access management, public transport

ticketing, loyalty schemes and closed-loop payment.

It is fully compatible to all other members of the MIFARE DESFire EV1 family, offering the

same fast and highly secure data transmission, and is fully interoperable with existing

MIFARE DESFire infrastructure.

All MIFARE DESFire products are based on open global standards for both air interface

and implemented cryptographic methods. It is compliant to all 4 levels of ISO/IEC 14443A

and uses optional ISO/IEC 7816-4 commands, features an on-chip backup management

system and mutual three-pass authentication as well as encrypted communication.

The size of each file is defined at the moment of its creation, provides an automatic

anti-tear mechanism for all file types, guaranteeing transaction-oriented data integrity.

Data transfer rates from up to 848 Kbit/s can be achieved, allowing for fast data

transmission.

The main characteristics of the MIFARE DESFire family are denoted by the name

“DESFire”: “DES” indicates the high level of security using a hardware crypto

co-processor for either 3DES or AES-based data processing. “Fire” indicates its

outstanding position as a fast, innovative and highly reliable IC ideally suited to enable a

wide variety of different applications.

MF3ICD(H)Q1

NXP Semiconductors

MIFARE DESFire EV1 256B contactless smartcard IC

2. Features and benefits

2.1 RF interface: ISO/IEC 14443 Type A

 Contactless transmission of data and powered by the RF-field (no battery needed)

 Operating distance: up to 100 mm (depending on power provided by the PCD and

antenna geometry)

 Operating frequency: 13.56 MHz

 Fast data transfer: 106 kbit/s, 212 kbit/s, 424 kbit/s, 848 kbit/s

 High data integrity: 16/32 bit CRC, parity, bit coding, bit counting

 True deterministic anticollision

 7 bytes unique identifier (cascade level 2 according to ISO/IEC 14443-3 and option for

random ID)

 Uses ISO/IEC 14443-4 protocol

2.2 ISO/IEC 7816 compatibility

 Supports ISO/IEC 7816-3 APDU message structure

 Supports ISO/IEC 7816-4 INS code ‘A4’ for SELECT FILE

 Supports ISO/IEC 7816-4 INS code ‘B0’ for READ BINARY

 Supports ISO/IEC 7816-4 INS code ‘D6’ for UPDATE BINARY

 Supports ISO/IEC 7816-4 INS code ‘B2’ for READ RECORDS

 Supports ISO/IEC 7816-4 INS code ‘E2’ for APPEND RECORD

 Supports ISO/IEC 7816-4 INS code ‘84’ for GET CHALLENGE

 Supports ISO/IEC 7816-4 INS code ‘88’ for INTERNAL AUTHENTICATE

 Supports ISO/IEC 7816-4 INS code ‘82’ for EXTERNAL AUTHENTICATE

2.3 Non-volatile memory

 256 bytes application memory^{1, 2}

 Data retention of 10 years

 Write endurance typical 500 000 cycles

2.4 NV-memory organization

 Flexible file system

 Number of applications and files per application depending on available memory

 File types supported: standard data file, back-up data file, value file, linear record file

and cyclic record file

 File size is determined during creation

1. User application example: 1 Application, 2 AES keys, 1 Data file (256 bytes)

2. Also available in 2 KB, 4 KB and 8 KB. Refer to Ref. 1.

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2.5 Security

 Based on the same Common Criteria EAL4+ certified MIFARE DESFire EV1 platform

 Unique 7 bytes serial number for each device

 Optional “RANDOM” ID for enhance security and privacy

 Mutual three-pass authentication

 Mutual authentication according to ISO/IEC 7816-4

 1 card master key and up to 14 keys per application

 Hardware DES using 56/112/168 bit keys featuring key version, data authenticity by

8 byte CMAC

 Hardware AES using 128-bit keys featuring key version, data authenticity by 8 byte

CMAC

 Data encryption on RF-channel

 Authentication on application level

 Hardware exception sensors

 Self-securing file system

 Backward compatibility to MF3ICD40: 4 byte MAC, CRC 16

2.6 Special features

 Transaction-oriented automatic anti-tear mechanism

 Configurable ATS information for card personalization

 Backward compatibility mode to MF3ICD40

 Optional high input capacitance (70 pF) for small form factor design (MF3ICDHQ1)

3. Applications

 Public transport ticketing: Account based or Single Journey ticketing

 High secure access management

 Hospitality

 Event ticketing

 Loyalty

 Gift cards

 Smart Visitor Badges (SVB)

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4. Quick reference data

Table 1.

Quick reference data ^[1][2]

Parameter

Symbol

Conditions

Min

-

Typ

Max

-

Unit

MHz

pF

f_i

input frequency

13.56

17.0

69.0

[3][4]

C_i

input capacitance

MF3ICDQ1

14.96

64.00

19.04

74.00

MF3ICDHQ1

pF

EEPROM characteristics

t_ret

retention time

T_amb= 22 C

10

-

year

cycle

ms

N_endu(W)

t_cy(W)

write endurance

write cycle time

200000

-

500000

2.9

[1] Stresses above one or more of the values may cause permanent damage to the device.

[2] Exposure to limiting values for extended periods may affect device reliability.

[3] Measured with LCR meter.

[4]

T_amb= 22 C; f_i= 13.56 MHz; 2.8 V RMS

5. Ordering information

Table 2.

Ordering information

Type number

Package

Name

FFC

Description

Version

MF3ICDQ101DUD/06

8 inch wafer (sawn; 120 m thickness, on film

frame carrier; electronic fail die marking

-

according to SECSII format); see Ref. 4, 256B EEPROM, 17 pF

8 inch wafer (sawn; 120 m thickness, on film

frame carrier; electronic fail die marking

MF3ICDHQ101DUD/06 FFC

-

according to SECSII format); see Ref. 4, 256B EEPROM, 70 pF

8 inch wafer (sawn; 75 m thickness, on film

MF3ICDQ101DUF/06

FFC

frame carrier; electronic fail die marking

according to SECSII format); see Ref. 4, 256B EEPROM, 17 pF

8 inch wafer (sawn; 75 m thickness, on film

MF3ICDHQ101DUF/06 FFC

frame carrier; electronic fail die marking

according to SECSII format); see Ref. 4, 256B EEPROM, 70 pF

plastic leadless module carrier package; 35 mm

wide tape; see Ref. 5, 256B EEPROM, 17 pF

plastic leadless module carrier package; 35 mm

wide tape; see Ref. 5, 256B EEPROM, 70 pF

MF3MODQ101DA8/06

PLLMC^[1]

SOT500-4

MF3MODHQ101DA8/06 PLLMC^[1]

[1] This package is also known as MOA8.

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6. Block diagram

UART

ISO/IEC

14443A

TRUE RANDOM

NUMBER

GENERATOR

RF

CRYPTO

CO-PROCESSOR

INTERFACE

SECURITY

SENSORS

POWER ON

RESET

CPU

CRC

VOLTAGE

REGULATOR

CLOCK

INPUT FILTER

ROM

RAM

EEPROM

RESET

GENERATOR

001aah878

Fig 1. Block diagram of MF3ICD(H)Q1

7. Limiting values

Table 3.

In accordance with the Absolute Maximum Rating System (IEC 60134).

Limiting values ^[1][2]

Symbol

I_I

Parameter

Conditions

Min

Max

30

Unit

mA

input current

-

P_tot/pack

total power dissipation per

package

200

mW

T_stg

T_amb

V_ESD

I_lu

storage temperature

ambient temperature

electrostatic discharge voltage

latch-up current

55

25

2

125

C

kV

mA

70

-

[3]

100

-

[1] Stresses above one or more of the limiting values may cause permanent damage to the device.

[2] Exposure to limiting values for extended periods may affect device reliability.

[3] MIL Standard 883-C method 3015; human body model: C = 100 pF, R = 1.5 k.

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8. Functional description

8.1 Contactless energy and data transfer

In the MIFARE system, the MIFARE DESFire EV1 is connected to a coil consisting of a

few turns embedded in a standard ISO/IEC smart card (see Ref. 7). A battery is not

needed. When the card is positioned in the proximity of the PCD antenna, the high-speed

RF communication interface allows data to be transmitted up to 848 kbit/s.

8.2 Anti-collision

An intelligent anti-collision mechanism allows more than one MIFARE DESFire EV1 in the

field to be handled simultaneously. The anti-collision algorithm selects each MIFARE

DESFire EV1 individually and ensures that the execution of a transaction with a selected

MIFARE DESFire EV1 is performed correctly without data corruption resulting from other

MIFARE DESFire EV1s in the field.

8.3 UID/serial number

The unique 7 byte (UID) is programmed into a locked part of the NV memory which is

reserved for the manufacturer. Due to security and system requirements these bytes are

write-protected after being programmed by the IC manufacturer at production time.

According to ISO/IEC 14443-3 (see Ref. 11) during the first anti-collision loop the cascade

tag returns a value of 88h and also the first 3 bytes of the UID, UID0 to UID2 and BCC.

The second anti-collision loop returns bytes UID3 to UID6 and BCC.

UID0 holds the manufacturer ID for NXP (04h) according to ISO/IEC 14443-3 and

ISO/IEC 7816-6 AMD 1.

MIFARE DESFire EV1 also allows Random ID to be used. In this case MIFARE DESFire

EV1 only uses a single anti-collision loop. The 3 byte random number is generated after

RF reset of the MIFARE DESFire EV1.

8.4 Memory organization

MF3ICD(H)Q1 has 480 bytes of physical NV memory. The NV memory is organized using

a flexible file system. This file system allows a limited number of different applications on

one MIFARE DESFire EV1. Each application can have multiple files. Every application is

represented by its 3 bytes Application IDentifier (AID).

Five different file types are supported; see Section 8.5.

A guideline to assign DESFire AIDs can be found in the application note MIFARE

Application Directory (MAD); see Ref. 8.

Each file can be created either at MIFARE DESFire EV1 initialization (card

production/card printing), at MIFARE DESFire EV1 personalization (vending machine) or

in the field.

If a file or application becomes obsolete in operation, it can be permanently invalidated.

Commands which have impact on the file structure itself (e.g. creation or deletion of

applications, change of keys) activate an automatic rollback mechanism, which protects

the file structure from being corrupted.

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If this rollback is necessary, it is done without user interaction before carrying out further

commands. To ensure data integrity on application level, a transaction-oriented backup is

implemented for all file types with backup. It is possible to mix file types with and without

backup within one application.

As the commands are the same with MF3ICD81, the command details are available in

Ref. 1. Only the memory size is different between the devices.

8.5 Available file types

The files within an application can be any of the following types:

• Standard data files

• Backup data files

• Value files with backup

• Linear record files with backup

• Cyclic record files with backup

8.6 Security

The 7 byte UID is fixed, programmed into each device during production. It cannot be

altered and ensures the uniqueness of each device.

The UID may be used to derive diversified keys for each ticket. Diversified MIFARE

DESFire EV1 keys contribute to gain an effective anti-cloning mechanism and increase

the security of the original key; see Ref. 6.

Prior to data transmission a mutual three-pass authentication can be done between

MIFARE DESFire EV1 and PCD depending on the configuration employing either 56-bit

DES (single DES, DES), 112-bit DES (triple DES, 3DES), 168-bit DES (3 key triple DES,

3K3DES) or AES. During the authentication, the level of security of all further commands

during the session is set. In addition, the communication settings of the file/application

result in the following options of secure communication between MIFARE DESFire EV1

and PCD:

• Plain data transfer (only possible within the backwards-compatible mode to

MF3ICD40)

• Plain data transfer with cryptographic checksum (MAC): Authentication with

backwards-compatible mode to MF3ICD40: 4 byte MAC, all other authentications

based on DES/3DES/AES: 8 byte CMAC

• Encrypted data transfer (secured by CRC before encryption): Authentication with

backwards-compatible mode to MF3ICD40: A 16-bit CRC is calculated over the

stream and attached. The resulting stream is encrypted using the chosen

cryptographic method. All other authentications-based DES/3DES/AES: A 32-bit CRC

is calculated over the stream and attached. The resulting stream is encrypted using

the chosen cryptographic method.

Find more information on the security concept of the product in Ref. 1. Be aware not all

levels of security are recommended. The recommended secure handling of the product

can be seen in Ref. 2 and in Ref. 10.

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8.7 Product identification

The MF3ICD(H)Q1 can be identified by using the Get Version command and observing

the response frames as following:

The first frame: contains hardware-related information:

byte 1: 0x04

byte 2: 0x01

byte 3: 0x01 for 17 pF or 0x02 for 70 pF

byte 4: 0x01

byte 5: 0x00

byte 6: 0x10

byte 7: 0x05

The second frame contains software-related information:

byte 1: 0x04

byte 2: 0x01

byte 3: 0x01

byte 4: 0x01

byte 5: 0x05

byte 6: 0x10

byte 7: 0x05

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9. DESFire command set

A detailed description of all commands is provided in Ref. 1.

9.1 ISO/IEC 14443-3

Table 4.

Command

REQA

ISO/IEC 14443-3

Description

REQA and ATQA are implemented fully

according to ISO/IEC 14443-3

WUPA

WUPA is implemented fully according to ISO/IEC

14443-3

ANTICOLLISION/SELECT Cascade Level 1

ANTICOLLISION/SELECT Cascade Level 2

ANTICOLLISION and SELECT commands are

implemented fully according to ISO/IEC 14443-3;

the response is part 1 of the UID

ANTICOLLISION and SELECT commands are

implemented fully according to ISO/IEC 14443-3;

the response is part 2 of the UID

HALT

brings MIFARE DESFire EV1 to the HALT state

9.2 ISO/IEC 14443-4

Table 5.

Command

RATS

ISO/IEC 14443-4

Description

identifies the MIFARE DESFire EV1 type to the PCD

PPS

allows individual selection of the communication baud rate between PCD and

MIFARE DESFire EV1; for DESFire it is possible to set different

communication baud rates for each direction i.e. DESFire allows a

non-symmetrical information interchange speed.

WTX

if the MIFARE DESFire EV1 needs more time than the defined FWT to

respond to a PCD command it requests a Waiting Time eXtension (WTX)

DESELECT

allows MIFARE DESFire EV1 to be brought to the HALT state

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9.3 MIFARE DESFire EV1 command set overview – security related

commands

Table 6.

Security related commands

Description

Command

Authenticate

MIFARE DESFire EV1 and the reader device show in an encrypted way

that they possess the same secret which especially means the same key;

this not only confirms that both entities are permitted to perform

operations on each other but also creates a session key which can be

used to keep the further communication path secure; as the name

“session key” implicitly indicates, each time a new authentication

procedure is successfully completed a new key for further cryptographic

operations is generated

Change KeySettings

Set Configuration

changes the master key settings on MIFARE DESFire EV1 and

application level

configures the card and pre-personalizes the card with a key, defines if

the UID or the random ID is sent back during communication setup and

configures the ATS string

Change Key

changes any key stored on the MIFARE DESFire EV1

Get Key Version

reads out the current key version of any key stored on the MIFARE

DESFire EV1

Remark: All command and data frames are exchanged between MIFARE DESFire EV1

and PCD by using block format as defined in ISO/IEC 14443-4.

9.4 MIFARE DESFire EV1 command set overview – MIFARE DESFire EV1

level commands

Table 7.

Level commands

Command

Description

Create Application

Delete Application

Get Applications IDs

creates new applications on the MIFARE DESFire EV1

permanently deactivates applications on the MIFARE DESFire EV1

returns the Application IDentifiers of all applications on a MIFARE

DESFire EV1

Free Memory

GetDFNames

Get KeySettings

returns the free memory available on the card

returns the DF names

gets information on the MIFARE DESFire EV1 and application master

key settings; in addition it returns the maximum number of keys which

are configured for the selected application

Select Application

FormatPICC

Get Version

selects one specific application for further access

releases the MF3ICD(H)Q1 user memory

returns manufacturing related data of the MIFARE DESFire EV1

returns the UID

GetCardUID

Remark: All command and data frames are exchanged between MIFARE DESFire EV1

and PCD by using block format as defined in ISO/IEC 14443-4.

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9.5 MIFARE DESFire EV1 command set overview – application level

commands

Table 8.

Application level commands

Description

Command

Get FileIDs

returns the File IDentifiers of all active files within the currently selected

application

Get FileSettings

gets information on the properties of a specific file

Change FileSettings changes the access parameters of an existing file

Create StdDataFile

creates files for the storage of plain unformatted user data within an

existing application on the MIFARE DESFire EV1

Create

BackupDataFile

creates files for the storage of plain unformatted user data within an

existing application on the MIFARE DESFire EV1, additionally supporting

the feature of an integrated backup mechanism

Create ValueFile

creates files for the storage and manipulation of 32-bit signed integer

values within an existing application on the MIFARE DESFire EV1

Create

LinearRecordFile

creates files for multiple storage of similar structural data, for example,

loyalty programs within an existing application on the MIFARE DESFire

EV1; once the file is filled completely with data records, further writing to

the file is not possible unless it is cleared

Create

CyclicRecordFile

creates files for multiple storage of similar structural data, for example,

logging transactions within an existing application on the MIFARE DESFire

EV1; once the file is filled completely with data records, the MIFARE

DESFire EV1 automatically overwrites the oldest record with the latest

written one (this wrap is fully transparent for the PCD)

DeleteFile

permanently deactivates a file within the file directory of the currently

selected application

Remark: All command and data frames are exchanged between MIFARE DESFire EV1

and PCD by using block format as defined in ISO/IEC 14443-4.

9.6 MIFARE DESFire EV1 command set overview – data manipulation

commands

Table 9.

Data manipulation commands

Description

Command

Read Data

Write Data

Get Value

Credit

reads data from Standard Data files or Backup Data files

writes data to Standard Data files or Backup Data files

reads the currently stored value from Value files

increases a value stored in a Value file

Debit

decreases a value stored in a Value file

Limited Credit

allows a limited increase of a value stored in a Value file without

having full Credit permissions to the file

Write Record

writes data to a record in a Cyclic or Linear Record file

Read Records

reads out a set of complete records from a Cyclic or Linear Record

file

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Table 9.

Data manipulation commands …continued

Command

Description

Clear RecordFile

Commit Transaction

resets a Cyclic or Linear Record file to empty state

validates all previous write accesses on Backup Data files, Value

files and Record files within one application

Abort Transaction

invalidates all previous write accesses on Backup Data files, Value

files and Record files within one application

Remark: All command and data frames are exchanged between MIFARE DESFire EV1

and PCD by using block format as defined in ISO/IEC 14443-4.

9.7 MIFARE DESFire EV1 command set - ISO/IEC 7816 APDU commands

The MIFARE DESFire EV1 provides the following commands according to

ISO/IEC 7816-4:

– INS code ‘A4’ SELECT

– INS code ‘B0’ READ BINARY

– INS code ‘D6’ UPDATE BINARY

– INS code ‘B2’ READ RECORDS

– INS code ‘E2’ APPEND RECORD

– INS code ‘84’ GET CHALLENGE

– INS code ‘88’ INTERNAL AUTHENTICATE

– INS code ‘82’ EXTERNAL AUTHENTICATE

9.7.1 ISO/IEC 7816-4 APDU message structure

DESFire supports the APDU message structure according to ISO/IEC 7816-4 for:

– an optional wrapping of the native DESFire APDU format

– additionally implemented ISO/IEC 7816-4 commands

Find more information on the ISO/IEC 7816-4 commands in Ref. 1.

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10. Abbreviations

Table 10. Abbreviations

Acronym

AES

AID

Description

Advanced Encryption Standard

Application IDentifier

APDU

ATS

Application Protocol Data Unit

Answer to Select

CC

Common Criteria

CMAC

CRC

DES

DF

Cryptic Message Authentication Code

Cyclic Redundancy Check

Digital Encryption Standard

Dedicated File

EAL

Evaluation Assurance Level

Electrically Erasable Programmable Read-Only Memory

Frame Waiting Time

EEPROM

FWT

ID

IDentifier

INS

Instructions

LCR

MAC

MAD

NV

inductance, Capacitance, Resistance

Message Authentication Code

MIFARE Application Directory

Non-Volatile Memory

PCD

PPS

RATS

REQA

RF

Proximity Coupling Device

Protocol Parameter Selection

Request Answer To Select

Request Answer

Radio Frequency

UID

Unique IDentifier

WTX

WUPA

Waiting Time eXtension

Wake Up Protocol A

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11. References

[1] Data sheet — MF3ICD81 MIFARE DESFire EV1 Functional Specification,

document number: 13403**³.

[2] Data sheet — MF3ICD81 Guidance, Delivery and Operation Manual, document

number: 1469**.

[3] Data sheet — Specification addendum MF3ICD81, document number: 1673**.

[4] Data sheet — MF3ICD8101 Sawn bumped 120 m wafer addendum, document

number: 1318**.

[5] Data sheet — MF3MOD81 Contactless chip card module, document number:

1439**.

[6] Application note — MIFARE DESFire - Implementation hints and examples,

document number: 0945**.

[7] Application note — Card Coil Design Notes for MIFARE DESFire EV1, document

number: 1713**.

[8] Application note — MIFARE Application Directory, document number: 0018**.

[9] Application note — MIFARE ISO/IEC 14443 PICC Selection, document number:

1308**.

[10] Application note — End to end system security risk considerations for

implementing contactless cards, document number: 1550**.

[11] ISO/IEC Standard — ISO/IEC 14443 Identification cards - Contactless integrated

circuit cards - Proximity cards.

3. ** ... BU-ID document version number

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12. Revision history

Table 11. Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

MF3ICDQ1_MF3ICDHQ1_ 20151105

SDS

Product short data sheet

-

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13. Legal information

13.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

13.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

13.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

MF3ICD(H)Q1

All information provided in this document is subject to legal disclaimers.

Product short data sheet

COMPANY PUBLIC

Rev. 3.0 — 5 November 2015

351330

16 of 18

MF3ICD(H)Q1

NXP Semiconductors

MIFARE DESFire EV1 256B contactless smartcard IC

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Licenses

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

ICs with DPA Countermeasures functionality

NXP ICs containing functionality

implementing countermeasures to

Differential Power Analysis and Simple

Power Analysis are produced and sold

under applicable license from

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Cryptography Research, Inc.

13.5 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

MIFARE — is a trademark of NXP Semiconductors N.V.

DESFire — is a trademark of NXP Semiconductors N.V.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

MF3ICD(H)Q1

All information provided in this document is subject to legal disclaimers.

Product short data sheet

COMPANY PUBLIC

Rev. 3.0 — 5 November 2015

351330

17 of 18

MF3ICD(H)Q1

NXP Semiconductors

MIFARE DESFire EV1 256B contactless smartcard IC

15. Contents

1

General description. . . . . . . . . . . . . . . . . . . . . . 1

15

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2

Features and benefits . . . . . . . . . . . . . . . . . . . . 2

RF interface: ISO/IEC 14443 Type A . . . . . . . . 2

ISO/IEC 7816 compatibility . . . . . . . . . . . . . . . 2

Non-volatile memory. . . . . . . . . . . . . . . . . . . . . 2

NV-memory organization . . . . . . . . . . . . . . . . . 2

Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Special features . . . . . . . . . . . . . . . . . . . . . . . . 3

2.1

2.2

2.3

2.4

2.5

2.6

3

4

5

6

7

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Quick reference data . . . . . . . . . . . . . . . . . . . . . 4

Ordering information. . . . . . . . . . . . . . . . . . . . . 4

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

8

Functional description . . . . . . . . . . . . . . . . . . . 6

Contactless energy and data transfer. . . . . . . . 6

Anti-collision . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

UID/serial number. . . . . . . . . . . . . . . . . . . . . . . 6

Memory organization . . . . . . . . . . . . . . . . . . . . 6

Available file types . . . . . . . . . . . . . . . . . . . . . . 7

Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Product identification . . . . . . . . . . . . . . . . . . . . 8

8.1

8.2

8.3

8.4

8.5

8.6

8.7

9

DESFire command set. . . . . . . . . . . . . . . . . . . . 9

ISO/IEC 14443-3 . . . . . . . . . . . . . . . . . . . . . . . 9

ISO/IEC 14443-4 . . . . . . . . . . . . . . . . . . . . . . . 9

MIFARE DESFire EV1 command set overview –

security related commands. . . . . . . . . . . . . . . 10

MIFARE DESFire EV1 command set overview –

MIFARE DESFire EV1 level commands. . . . . 10

MIFARE DESFire EV1 command set overview –

application level commands . . . . . . . . . . . . . . 11

MIFARE DESFire EV1 command set overview –

data manipulation commands. . . . . . . . . . . . . 11

MIFARE DESFire EV1 command set - ISO/IEC

7816 APDU commands . . . . . . . . . . . . . . . . . 12

ISO/IEC 7816-4 APDU message structure. . . 12

9.1

9.2

9.3

9.4

9.5

9.6

9.7

9.7.1

10

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13

References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15

11

12

13

Legal information. . . . . . . . . . . . . . . . . . . . . . . 16

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17

13.1

13.2

13.3

13.4

13.5

14

Contact information. . . . . . . . . . . . . . . . . . . . . 17

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 5 November 2015

351330


型号：	MF3MODQ101DA8/06
厂家：	NXP
描述：	SPECIALTY CONSUMER CIRCUIT 商用集成电路
文件：	总18页 (文件大小：106K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MF3MODQ101DA8/06 [NXP]

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