MFRX85201HD/RRFFO [NXP]
IC SPECIALTY TELECOM CIRCUIT, PQCC48, 7 X 7 MM, 1.20 MM HEIGHT, PLASTIC, SOT995-1, QFN-48, Telecom IC:Other;
| 型号： | MFRX85201HD/RRFFO |
| 厂家： | 
NXP |
| 描述： | IC SPECIALTY TELECOM CIRCUIT, PQCC48, 7 X 7 MM, 1.20 MM HEIGHT, PLASTIC, SOT995-1, QFN-48, Telecom IC:Other 电信 电信集成电路 |
| 文件： | 总8页 (文件大小：142K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MFRX852
Secure contactless reader solution
Rev. 3 — 13 November 2009
181530
Product short data sheet
PUBLIC
1. General description
The MFRX852 is a new highly integrated security reader module for contactless
communication at 13.56 MHz. It combines a completely integrated Secure Application
Module (SAM), data processing and modulation/demodulation for high security passive
contactless communication methods and protocols at 13.56 MHz.
The MFRX852 supports the following contactless protocols and features:
• all layers of the ISO/IEC 14443 including the type A and type B communication
scheme
• contactless T=CL protocol for MIFARE DESFire communication
• contactless communication using higher baud rates
The MFRX852 is primarily designed for secure transport applications and related loyalty
programs. Other possible applications are for example, general secure reader
applications, Automatic Fare Collection (AFC) terminals, value checkers, ePassport
readers and security handheld readers.
It supports the MIFARE Mini, MIFARE 1K, MIFARE 4K security algorithm to authenticate
MIFARE Mini, MIFARE 1K, MIFARE 4K products. In addition, DES/3DES and AES
security algorithms are supported to authenticate NXP MIFARE DESFire and MIFARE
DESFire EV1 products. Additional immunity against security attacks is provided by the
high integration of security processor and contactless interface into a single module
package.
Reduced complexity of security reader design, hardware and software development is
achieved by high integration of several hardware components into one small module
package of 7 mm × 7 mm.
2. Features
2.1 General
I Hard reset with low power function
I User-programmable reader start-up configuration
I Power-down mode per software
I Integrated oscillator to connect 13.56 MHz
I 3.3 V to 5 V operation power supply
I CRC coprocessor
I Internal self-test
MFRX852
NXP Semiconductors
Secure contactless reader solution
2.1.1 Contactless interface
I Highly integrated analog circuitry to demodulate and decode responses
I Buffered output drivers for connecting to an antenna with the minimum number of
external components
I Supports ISO/IEC 14443A/MIFARE and ISO/IEC 14443B
I Supports contactless communication with higher baud rates up to 848 kbaud
I Support of MFIN/MFOUT
I Internal power supply for the smart card IC connected via MFIN/MFOUT
I Bit- and byte-oriented framing
2.2 Host interface
I T=1 communication protocol as defined in ISO/IEC 7816-3
I Automatic detection of host processor interface type
2.3 Key storage memory
I 10 years data retention
I
Write endurance of 100 000 cycles
I 128 key entries (1 SAM master key entry)
I Up to 3 key versions for each entry
I Key cache (8 entries) for accelerating key access
2.4 Security
I Unique serial number for each SAM device
I Hardware (3)DES coprocessor
I Hardware AES coprocessor
I Hardware MIFARE Mini, MIFARE 1K, MIFARE 4K crypto coprocessor
2.5 SAM functions
I Support of multiple CIDs/logical channels in parallel, separated by hardware firewall
I Generate session key to support DESFire "Authenticate" commands
I Generate session key to support secured host communication
I Verify (3)DES generated 4 byte and 8 byte MACs based on session key (optional)
I Create (3)DES generated 4 byte and 8 byte MACs based on session key (optional)
I Verify AES generated 8 byte MACs based on session key (optional)
I Create AES generated 8 byte MACs based on session key (optional)
I Decipher and verify (3)DES or AES enciphered data based on session key (optional)
I Encipher plain data using (3)DES or AES based on session key (optional)
I Secure update of all keys stored in the SAM
I Mutual three pass authentication between SAM and SAM controller
I Key usage counters
I (3)DES or AES based key diversification
MFRX852_SDS_30
© NXP B.V. 2009. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3 — 13 November 2009
181530
2 of 8
MFRX852
NXP Semiconductors
Secure contactless reader solution
3. Quick reference data
Table 1.
Symbol
VDD
Quick reference data
Parameter
Conditions
Min Typ Max Unit
supply voltage
3
-
5.5
V
V
V
VDD(CVDD)
VDD(PVDD)
CVDD supply voltage
PVDD supply voltage
GND = 0 V
2.7 2.8 3.3
[1]
VDD(PVDD) ≤ VDDA = VDDD = VDD(TVDD)
;
1.6
1.6
-
-
3.6
3.6
VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V;
GND = 0 V
VDD(SVDD)
Ipd
SVDD supply voltage
power-down current
VSSA = VSSD = VSS(PVSS) = VSS(TVSS) = 0 V;
GND = 0 V
V
[2]
[2]
hard power-down; VDD(PVDD) = 2.8 V
soft power-down; VDD(VDDCO) = 0 V;
-
-
-
-
10.5 µA
10
µA
VDD(CVDD) = 2.8 V; RF level detector on
IDD(SVDD)
ICC
SVDD supply current
supply current
VDD(SVDD) = 2.8 V
-
-
-
6.5 30
mA
mA
[3]
-
40
[4][5][6]
IDD(VIN)
VIN supply current
Tamb = −30 °C to +80 °C, 40 Ω typical TX load
70
120 mA
impedance
[7]
Tamb
ambient temperature
HLQFN48R
−25
-
+85 °C
[1] VDD(PVDD) must always be the same or lower voltage than VDD(CVDD)
.
[2] Ipd soft power-down and Ipd hard power-down are the total currents for all supplies.
[3] ICC depends on the overall load at the digital pins.
[4] IDD(VIN) depends on the external circuit connected to pins TX1 and TX2.
[5] During typical circuit operation the overall current is below 100 mA.
[6] Typical value using a complementary driver configuration and an antenna matched to 40 Ω between TX1 and TX2 at 13.56 MHz.
[7] In still air with exposed pad soldered on a 4-layer JEDEC printed-circuit board.
4. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
MFRX85201HD/rrffo[1] HLQFN48R plastic thermal enhanced low profile quad flat package; no leads;
SOT995-1
48 terminals; resin based; body 7 × 7 × 1.2 mm
[1] rr = ROM code, ff = fab. key, o = MIFARE option.
MFRX852_SDS_30
© NXP B.V. 2009. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3 — 13 November 2009
181530
3 of 8
MFRX852
NXP Semiconductors
Secure contactless reader solution
5. Block diagram
The MFRX852 main components are the SAM: P5DF072, and the MFRC523 reader IC;
see Figure 1. The P5DF072 contains software to directly control the MFRC523 reader IC
and a command set for acting, beside the classic SAM functionality, as a contactless
security reader module.
The MFRX852 also provides the functionality to connect an external analog front-end
based on the MFIN/MFOUT protocol pins.
T=CL
MF
P5DF072
MFRC523
(ISO/IEC 14443
READER IC)
HOST
CONTROLLER
(SECURE
APPLICATION
MODULE)
MFRX852 MODULE
MFIN/
MFOUT
001aaj602
Fig 1. Block diagram of MFRX852
6. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDD
Parameter
Conditions
Min
Max
Unit
V
supply voltage
−0.3
−0.5
−0.5
−0.5
−0.5
-
+6.5
+4.0
+4.0
+4.0
+6.0
700
VDD(PVDD)
VDD(CVDD)
VDD(SVDD)
PVDD supply voltage
CVDD supply voltage
SVDD supply voltage
V
V
V
VDD(VDDCO) VDDCO supply voltage
V
Ptot
IO
total power dissipation
output current
per package; VDDD in shortcut mode
maximum current at TX1 and TX2
mW
mA
°C
°C
V
−100
-
100
Tj
junction temperature
storage temperature
100
Tstg
VESD
+5
+45
2000
200
electrostatic discharge
voltage
HBM; 1500 Ω, 100 pF; JESD22-A114-B
MM; 0.75 µH, 200 pF; JESD22-A114-A
-
-
V
MFRX852_SDS_30
© NXP B.V. 2009. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3 — 13 November 2009
181530
4 of 8
MFRX852
NXP Semiconductors
Secure contactless reader solution
7. Revision history
Table 4.
Revision history
Release date
Document ID
Data sheet status
Change notice
Supersedes
MFRX852_SDS_30 20091113
Product short data sheet
-
-
MFRX852_SDS_30
© NXP B.V. 2009. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3 — 13 November 2009
181530
5 of 8
MFRX852
NXP Semiconductors
Secure contactless reader solution
8. Legal information
8.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
8.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
8.3
Disclaimers
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
8.4
Licenses
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Purchase of NXP ICs with ISO/IEC 14443 type B functionality
This NXP Semiconductors IC is ISO/IEC 14443 Type B
software enabled and is licensed under Innovatron’s
Contactless Card patents license for ISO/IEC 14443 B.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
The license includes the right to use the IC in systems
and/or end-user equipment.
RATP/Innovatron
Technology
8.5
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
I2C-bus — logo is a trademark of NXP B.V.
MIFARE — is a trademark of NXP B.V.
DESFire — is a trademark of NXP B.V.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
MFRX852_SDS_30
© NXP B.V. 2009. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3 — 13 November 2009
181530
6 of 8
MFRX852
NXP Semiconductors
Secure contactless reader solution
9. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
MFRX852_SDS_30
© NXP B.V. 2009. All rights reserved.
Product short data sheet
PUBLIC
Rev. 3 — 13 November 2009
181530
7 of 8
MFRX852
NXP Semiconductors
Secure contactless reader solution
10. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Contactless interface . . . . . . . . . . . . . . . . . . . . 2
Host interface . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Key storage memory. . . . . . . . . . . . . . . . . . . . . 2
Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
SAM functions. . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.1
2.1.1
2.2
2.3
2.4
2.5
3
4
5
6
7
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5
8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8.1
8.2
8.3
8.4
8.5
9
Contact information. . . . . . . . . . . . . . . . . . . . . . 7
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 November 2009
181530
Document identifier: MFRX852_SDS_30
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