MMG3001NT1 [NXP]
40MHz - 3600MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, ROHS COMPLIANT, PLASTIC, CASE 1514-02, SOT-89, 3 PIN;
| 型号： | MMG3001NT1 |
| 厂家： | 
NXP |
| 描述： | 40MHz - 3600MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, ROHS COMPLIANT, PLASTIC, CASE 1514-02, SOT-89, 3 PIN 放大器 射频 微波 功率放大器 |
| 文件： | 总14页 (文件大小：386K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Document Number: MMG3001NT1
Rev. 9, 10/2014
Freescale Semiconductor
Technical Data
Heterojunction Bipolar Transistor
Technology (InGaP HBT)
Broadband High Linearity Amplifier
MMG3001NT1
The MMG3001NT1 is a general purpose amplifier that is internally input
and output matched. It is designed for a broad range of Class A, small--
signal, high linearity, general purpose applications. It is suitable for
applications with frequencies from 40 to 3600 MHz, such as cellular, PCS,
BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general small--signal RF.
40--3600 MHz, 20 dB
18.5 dBm
InGaP HBT GPA
Features
Frequency: 40--3600 MHz
P1dB: 18.5 dBm @ 900 MHz
Small--Signal Gain: 20 dB @ 900 MHz
Third Order Output Intercept Point: 32 dBm @ 900 MHz
Single Voltage Supply
Internally Matched to 50 Ohms
Cost--effective SOT--89 Surface Mount Plastic Package
In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7--inch Reel.
1
2
3
SOT--89
Table 1. Typical Performance (1)
Table 2. Maximum Ratings
Rating
Supply Voltage
Symbol
Value
Unit
V
900
2140 3500
Characteristic
Symbol MHz MHz MHz Unit
V
7
300
CC
CC
Small--Signal Gain
(S21)
G
20
18
16
dB
dB
dB
p
Supply Current
I
mA
dBm
C
RF Input Power
P
10
in
Input Return Loss
(S11)
IRL
-- 2 5
-- 2 2
-- 2 5
-- 1 8
-- 1 9
-- 1 7
Storage Temperature Range
Junction Temperature
T
stg
--65 to +150
150
T
J
C
Output Return Loss
(S22)
ORL
Power Output @1dB
Compression
P1dB
OIP3
18.5
32
18
31
15.5 dBm
28.5 dBm
Third Order Output
Intercept Point
1. V = 5.6 Vdc, T = 25C, 50 ohm system.
CC
A
Table 3. Thermal Characteristics
(2)
Characteristic
Symbol
Value
Unit
C/W
Thermal Resistance, Junction to Case
R
92.0
JC
Case Temperature 123C, 5.6 Vdc, 58 mA, no RF applied
2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
Freescale Semiconductor, Inc., 2004--2008, 2012, 2014. All rights reserved.
Table 4. Electrical Characteristics (V = 5.6 Vdc, 900 MHz, T = 25C, 50 ohm system, in Freescale Application Circuit)
CC
A
Characteristic
Symbol
Min
18
—
Typ
20
Max
—
Unit
dB
Small--Signal Gain (S21)
Input Return Loss (S11)
Output Return Loss (S22)
G
p
IRL
ORL
P1dB
OIP3
NF
-- 2 5
-- 2 2
18.5
32
—
dB
—
—
dB
Power Output @ 1dB Compression
Third Order Output Intercept Point
Noise Figure
—
—
dBm
dBm
dB
—
—
—
4.1
58
—
Supply Current
I
40
—
75
—
mA
V
CC
Supply Voltage
V
5.6
CC
Table 5. Functional Pin Description
Pin
2
Number
Pin Function
1
2
3
RF
in
Ground
RF /DC Supply
out
1
2
3
Figure 1. Functional Diagram
Table 6. ESD Protection Characteristics
Test Conditions/Test Methodology
Class
Human Body Model (per JESD 22--A114)
Machine Model (per EIA/JESD 22--A115)
Charge Device Model (per JESD 22--C101)
0
A
IV
Table 7. Moisture Sensitivity Level
Test Methodology
Rating
Package Peak Temperature
Unit
Per JESD 22--A113, IPC/JEDEC J--STD--020
1
260
C
MMG3001NT1
RF Device Data
Freescale Semiconductor, Inc.
2
50 OHM TYPICAL CHARACTERISTICS
25
0
T
= 85C
C
25C
-- 10
-- 20
-- 30
20
15
10
S22
-- 4 0 C
S11
V
= 5.6 Vdc
V
= 5.6 Vdc
CC
CC
-- 4 0
0
1
2
3
4
0
1
2
3
4
f, FREQUENCY (GHz)
f, FREQUENCY (GHz)
Figure 2. Small--Signal Gain (S21) versus
Frequency
Figure 3. Input/Output Return Loss versus
Frequency
23
21
19
17
15
13
21
20
19
18
17
16
15
14
900 MHz
2140 MHz
2600 MHz
1960 MHz
3500 MHz
11
9
V
= 5.6 Vdc
18
V
= 5.6 Vdc
3
CC
CC
0.5
1
1.5
2
2.5
3.5
10
12
14
16
20
P
, OUTPUT POWER (dBm)
f, FREQUENCY (GHz)
out
Figure 4. Small--Signal Gain versus Output
Power
Figure 5. P1dB versus Frequency
33
100
80
30
27
60
40
20
0
24
21
18
V
= 5.6 Vdc
CC
100 kHz Tone Spacing
4.9
5
5.1
5.2
5.3
5.4
5.5
5.6
5.7
0
1
2
3
4
V
, COLLECTOR VOLTAGE (V)
f, FREQUENCY (GHz)
CC
Figure 6. Collector Current versus Collector
Voltage
Figure 7. Third Order Output Intercept Point
versus Frequency
MMG3001NT1
RF Device Data
Freescale Semiconductor, Inc.
3
50 OHM TYPICAL CHARACTERISTICS
36
36
V
= 5.6 Vdc
CC
f = 900 MHz
100 kHz Tone Spacing
8 Vdc Supply with 43 Ω Dropping Resistor
35
34
33
32
33
30
27
24
21
31
30
f = 900 MHz
100 kHz Tone Spacing
-- 4 0
-- 2 0
0
2 0
4 0
6 0
8 0
100
5.5
5.55
5.6
5.65
5.7
T, TEMPERATURE (_C)
V
, COLLECTOR VOLTAGE (V)
CC
Figure 9. Third Order Output Intercept Point
versus Case Temperature
Figure 8. Third Order Output Intercept Point
versus Collector Voltage
5
10
10
10
-- 3 0
-- 4 0
-- 5 0
4
3
-- 6 0
-- 7 0
-- 8 0
V
= 5.6 Vdc
CC
f = 900 MHz
100 kHz Tone Spacing
120
125
130
135
140
145
150
0
3
6
9
12
15
18
T , JUNCTION TEMPERATURE (C)
J
P
, OUTPUT POWER (dBm)
out
NOTE: The MTTF is calculated with V = 5.6 Vdc, I = 58 mA
Figure 10. Third Order Intermodulation Distortion
versus Output Power
CC
CC
Figure 11. MTTF versus Junction Temperature
-- 20
8
V
= 5.6 Vdc, f = 2140 MHz
CC
Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth
Input Signal PAR = 8.5 dB @ 0.01% Probability (CCDF)
-- 30
-- 40
6
4
-- 50
-- 60
-- 7 0
2
0
V
= 5.6 Vdc
3.5
CC
0
0.5
1
1.5
2
2.5
3
4
0
2
4
6
8
10
12
14
f, FREQUENCY (GHz)
P
, OUTPUT POWER (dBm)
out
Figure 12. Noise Figure versus Frequency
Figure 13. Single--Carrier W--CDMA Adjacent
Channel Power Ratio versus Output Power
MMG3001NT1
RF Device Data
Freescale Semiconductor, Inc.
4
50 OHM APPLICATION CIRCUIT: 40--800 MHz
V
SUPPLY
R1
C3
C4
C5
L1
RF
OUTPUT
RF
INPUT
DUT
V
Z3
Z4
Z1
Z2
Z5
C1
C2
CC
Z1, Z5
Z2
Z3
0.347 x 0.058 Microstrip
0.575 x 0.058 Microstrip
0.172 x 0.058 Microstrip
Z4
PCB
0.403 x 0.058 Microstrip
Getek Grade ML200C, 0.031, = 4.1
r
Figure 14. 50 Ohm Test Circuit Schematic
30
20
S21
R1
10
C5
C4
C3
0
L1
-- 10
-- 20
C2
C1
S22
-- 30
-- 4 0
MMG30XX
Rev 2
V
= 5.6 Vdc
S11
CC
0
200
400
f, FREQUENCY (MHz)
600
800
Figure 15. S21, S11 and S22 versus Frequency
Figure 16. 50 Ohm Test Circuit Component Layout
Table 8. 50 Ohm Test Circuit Component Designations and Values
Part
Description
0.01 F Chip Capacitors
Part Number
C0603C103J5RAC
C0603C102J5RAC
C0805C470J5RAC
BK2125HM471--T
RK73B2ATTE8R2J
Manufacturer
Kemet
C1, C2, C3
C4
C5
L1
1000 pF Chip Capacitor
47 pF Chip Capacitor
470 nH Chip Inductor
8.2 Ω Chip Resistor
Kemet
Kemet
Taiyo Yuden
KOA Speer
R1
Table 9. Supply Voltage versus R1 Values
Supply Voltage
R1 Value
6
7
8
9
10
76
11
93
12
V
6.9
24
41
59
110
Note: To provide V = 5.6 Vdc and I = 58 mA at the device.
CC
CC
MMG3001NT1
RF Device Data
Freescale Semiconductor, Inc.
5
50 OHM APPLICATION CIRCUIT: 800--3600 MHz
V
SUPPLY
R1
C3
C4
C5
L1
RF
OUTPUT
RF
INPUT
DUT
V
Z3
Z4
Z1
Z2
Z5
C1
C2
CC
Z1, Z5
Z2
Z3
0.347 x 0.058 Microstrip
0.575 x 0.058 Microstrip
0.172 x 0.058 Microstrip
Z4
PCB
0.403 x 0.058 Microstrip
Getek Grade ML200C, 0.031, = 4.1
r
Figure 17. 50 Ohm Test Circuit Schematic
20
10
S21
R1
C5
C4
C3
V
= 5.6 Vdc
CC
0
-- 10
-- 20
L1
C2
C1
S22
S11
MMG30XX
Rev 2
-- 3 0
3800
800
1300
1800
2300
2800
3300
f, FREQUENCY (MHz)
Figure 18. S21, S11 and S22 versus Frequency
Figure 19. 50 Ohm Test Circuit Component Layout
Table 10. 50 Ohm Test Circuit Component Designations and Values
Part
Description
39 pF Chip Capacitors
Part Number
C0805C390J5RAC
C0603C103J5RAC
C0603C102J5RAC
C0805C470J5RAC
HK160856NJ--T
Manufacturer
Kemet
C1, C2
C3
0.01 F Chip Capacitor
1000 pF Chip Capacitor
47 pF Chip Capacitor
56 nH Chip Inductor
8.2 Ω Chip Resistor
Kemet
C4
Kemet
C5
Kemet
L1
Taiyo Yuden
KOA Speer
R1
RK73B2ATTE8R2J
MMG3001NT1
RF Device Data
Freescale Semiconductor, Inc.
6
50 OHM TYPICAL CHARACTERISTICS
Table 11. Common Emitter S--Parameters (V = 5.6 Vdc, T = 25C, 50 Ohm System)
CC
A
S
S
S
S
22
11
21
12
f
MHz
|S
|
11
|S
|
21
|S
|
12
|S |
22
100
150
0.01837
0.00937
0.02263
0.02049
0.02015
0.01939
0.0212
0.158
10.80154
10.61985
11.06276
10.97614
10.93416
10.89886
10.85777
10.81348
10.76682
10.71841
10.67367
10.61782
10.56473
10.50489
10.44613
10.38955
10.32195
10.26867
10.19351
10.13374
10.05555
9.98381
9.90685
9.83535
9.76304
9.68157
9.60628
9.52474
9.45514
9.36984
9.29518
9.2159
176.164
173.508
170.083
167.952
165.552
163.145
160.903
158.599
156.269
154.026
151.767
149.477
147.215
144.98
0.06918
0.06785
0.07095
0.07046
0.07052
0.07044
0.07055
0.07053
0.07056
0.07058
0.07057
0.07066
0.07064
0.07073
0.07084
0.07089
0.07106
0.07101
0.07128
0.07142
0.07148
0.07156
0.07171
0.07179
0.07197
0.07208
0.07224
0.07243
0.07269
0.0728
0.196
0.04789
0.05071
0.07322
0.06689
0.07111
0.07696
0.08093
0.08609
0.09084
0.09479
0.09752
0.1016
11.134
--92.445
96.518
101.715
91.299
77.961
71.36
--0.796
--2.253
--2.513
--2.899
--3.499
--3.885
--4.455
--4.766
--5.297
--5.783
--6.195
--6.702
--7.082
--7.625
--8.108
--8.539
--8.95
--49.334
--17.196
--28.31
200
250
300
--35.935
--41.106
--47.831
--52.772
--57.016
--60.897
--65.139
--69.112
--72.747
--76.469
--80.336
--84.309
--88.629
--93.045
--97.401
--101.389
--106.494
--111.339
--115.996
--120.553
--125.245
--129.596
--133.849
--138.332
--140.027
--143.203
--146.041
--149.267
--152.506
--155.031
--157.889
--160.786
--163.24
--165.666
--168.355
--170.838
--173.6
350
400
450
0.02169
0.02447
0.02643
0.02857
0.03094
0.03356
0.03495
0.03599
0.03675
0.0378
63.516
55.112
49.889
47.303
43.937
42.055
40.001
38.298
36.713
34.449
35.697
34.93
500
550
600
650
700
0.10489
0.10746
0.11046
0.11345
0.11524
0.11712
0.11971
0.12057
0.12293
0.12475
0.12702
0.12882
0.13202
0.13502
0.13836
0.14227
0.13499
0.13808
0.14111
0.14376
0.14728
0.14882
0.15301
0.15553
0.1587
750
800
142.748
140.536
138.333
136.075
133.939
131.742
129.606
127.42
850
900
950
0.04014
0.03975
0.04101
0.0413
1000
1050
1100
1150
1200
1250
1300
1350
1400
1450
1500
1550
1600
1650
1700
1750
1800
1850
1900
1950
2000
2050
2100
2150
2200
2250
--9.497
--10.015
--10.588
--10.989
-- 11 . 5 1
--12.025
--12.554
--13.057
--13.606
--14.151
--14.685
--15.204
--15.823
--16.372
--16.955
--17.538
--18.047
--18.59
--19.216
--19.75
--20.324
--20.966
--21.435
--22.217
--22.79
--23.41
35.048
34.972
36.31
0.04078
0.04045
0.04005
0.03952
0.03786
0.03796
0.03675
0.03229
0.03309
0.03475
0.0367
38.732
39.914
43.011
44.538
46.354
48.792
27.259
25.231
23.271
22.494
21.485
21.793
21.332
21.941
20.661
17.824
20.129
18.841
18.596
18.599
19.388
19.789
125.299
123.178
121.077
118.951
116.874
114.777
112.739
110.697
108.724
106.764
104.763
102.811
100.821
98.873
0.07296
0.07327
0.07341
0.07361
0.07373
0.07383
0.07407
0.07433
0.07451
0.07482
0.07498
0.07512
0.07543
0.0756
0.03803
0.03976
0.04035
0.04093
0.0409
9.15729
9.07502
9.00137
8.92666
8.84934
8.75854
8.69148
8.6161
96.931
0.04127
0.04055
0.04148
0.04198
0.04249
0.04309
0.04316
95.008
0.1617
93.046
0.1659
91.185
0.16929
0.17351
0.17715
0.18032
0.18422
8.5446
89.293
8.47505
8.39794
8.32788
87.398
--176.054
--178.865
178.51
85.501
83.624
(continued)
MMG3001NT1
RF Device Data
Freescale Semiconductor, Inc.
7
50 OHM TYPICAL CHARACTERISTICS
Table 11. Common Emitter S--Parameters (V = 5.6 Vdc, T = 25C, 50 Ohm System) (continued)
CC
A
S
S
S
S
22
11
21
12
f
MHz
|S
|
11
|S
|
21
|S
|
12
|S |
22
2300
2350
2400
2450
2500
2550
2600
2650
2700
2750
2800
2850
2900
2950
3000
3050
3100
3150
3200
3250
3300
3350
3400
3450
3500
3550
3600
0.04326
0.04285
0.0428
21.542
23.93
8.24837
8.17883
8.10402
8.0349
81.777
79.926
78.094
76.296
74.438
72.648
70.815
69.011
67.13
0.07591
0.0761
--24.034
--24.632
--25.226
--25.841
--26.474
--27.199
--27.904
--28.528
--29.281
--29.943
--30.741
--31.392
--32.182
--32.903
--33.641
--34.4
0.1871
0.19081
0.19358
0.19769
0.20079
0.20422
0.20869
0.21293
0.21614
0.22114
0.226
175.803
173.166
170.371
167.872
164.997
162.204
159.371
156.39
25.661
28.349
30.594
32.718
35.498
39.668
40.736
44.129
47.509
51.043
53.041
57.415
59.701
61.593
64.102
65.235
65.884
66.564
66.702
65.787
65.869
65.731
65.097
65.299
64.978
0.07638
0.07665
0.07693
0.07715
0.07744
0.07768
0.07806
0.07826
0.0785
0.04222
0.04157
0.04062
0.04117
0.0407
7.96381
7.89112
7.83503
7.76263
7.68838
7.62088
7.55264
7.48275
7.41535
7.34593
7.28251
7.21536
7.1502
0.04099
0.04248
0.04329
0.04466
0.04661
0.04876
0.04991
0.05208
0.05426
0.05536
0.05758
0.06021
0.06243
0.06498
0.06832
0.07049
0.07294
0.07565
0.07682
153.567
150.373
147.517
144.417
141.675
138.661
136.002
133.272
130.712
128.119
125.669
123.284
120.844
118.633
116.391
114.187
112.291
110.431
108.662
65.378
63.561
61.767
60.019
58.235
56.493
54.703
52.913
51.15
0.07867
0.07893
0.07915
0.07945
0.07976
0.07989
0.08017
0.08027
0.08054
0.08071
0.08097
0.08112
0.08128
0.08144
0.08171
0.08186
0.23048
0.23581
0.24106
0.24698
0.25213
0.25854
0.26426
0.27078
0.27729
0.28468
0.29005
0.29718
0.3026
--35.181
--35.962
--36.771
--37.539
--38.36
7.08162
7.01653
6.94732
6.88222
6.81808
6.75612
6.69433
6.63494
6.57111
6.51018
49.405
47.655
45.916
44.235
42.521
40.809
39.085
37.382
35.707
--39.051
--39.867
--40.621
--41.453
--42.369
--43.091
0.30819
0.31389
0.31878
MMG3001NT1
RF Device Data
Freescale Semiconductor, Inc.
8
1.7
7.62
0.305 diameter
2.49
3.48
0.58
5.33
2.54
1.27
1.27
0.86
0.64
3.86
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
USED IN PCB LAYOUT DESIGN.
Recommended Solder Stencil
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL
AND RF PERFORMANCE.
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
PITCH.
Figure 20. Recommended Mounting Configuration
001N
( )
YYWW
Figure 21. Product Marking
MMG3001NT1
RF Device Data
Freescale Semiconductor, Inc.
9
PACKAGE DIMENSIONS
MMG3001NT1
RF Device Data
Freescale Semiconductor, Inc.
10
MMG3001NT1
RF Device Data
Freescale Semiconductor, Inc.
11
MMG3001NT1
RF Device Data
Freescale Semiconductor, Inc.
12
PRODUCT DOCUMENTATION AND SOFTWARE
Refer to the following resources to aid your design process.
Application Notes
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
AN3100: General Purpose Amplifier and MMIC Biasing
Software
.s2p File
For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software &
Tools on the part’s Product Summary page to download the respective tool.
FAILURE ANALYSIS
At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In
cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third
party vendors with moderate success. For updates contact your local Freescale Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
5
Mar. 2007
Corrected and updated Part Numbers in Tables 8 and 10, Component Designations and Values, to RoHS
compliant part numbers, pp. 6, 7
6
7
July 2007
Mar. 2008
Replaced Case Outline 1514--01 with 1514--02, Issue D, pp. 1, 11--13. Case updated to add missing
dimension for Pin 1 and Pin 3.
Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,
p. 1
Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis
(ACPR) unit of measure to dBc, p. 5
Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected
frequency values from GHz to MHz, pp. 8, 9
8
Feb. 2012
Corrected temperature at which ThetaJC is measured from 25C to 123C and added “no RF applied” to
Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no
RF signal applied, p. 1
Table 6, ESD Protection Characteristics, removed the word “Minimum” after the ESD class rating. ESD
ratings are characterized during new product development but are not 100% tested during production. ESD
ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive
devices, p. 3
Removed I bias callout from applicable graphs and Table 11, Common Emitter S--Parameters heading as
CC
bias is not a controlled value, pp. 4--9
Added .s2p File availability to Product Software, p. 14
9
Oct. 2014
Added Fig. 21, Product Marking, p. 9
Added Failure Analysis information, p. 13
MMG3001NT1
RF Device Data
Freescale Semiconductor, Inc.
13
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information in this document.
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E 2004--2008, 2012, 2014 Freescale Semiconductor, Inc.
Document Number: MMG3001NT1
Rev. 9, 10/2014
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