MPC8275CZQQLDX [NXP]
32-BIT, 333MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516;型号: | MPC8275CZQQLDX |
厂家: | NXP |
描述: | 32-BIT, 333MHz, RISC PROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516 |
文件: | 总80页 (文件大小:536K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MPC8280EC
Rev. 1.8, 8/2007
Freescale Semiconductor
Technical Data
MPC8280
PowerQUICC™ II Family
Hardware Specifications
Contents
This document contains detailed information about power
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . 8
4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . 11
5. Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6. AC Electrical Characteristics . . . . . . . . . . . . . . . . . . 14
7. Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 23
8. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
9. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 72
10. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 76
11. Document Revision History . . . . . . . . . . . . . . . . . . . 76
considerations, DC/AC electrical characteristics, and AC timing
specifications for .13µm (HiP7) members of the
PowerQUICC™ II family of integrated communications
processors—the MPC8280, the MPC8275, and the MPC8270
(collectively called the MPC8280 throughout this document).
© Freescale Semiconductor, Inc., 2004, 2007. All rights reserved.
Overview
1 Overview
Table 1 shows the functionality supported by each device in the MPC8280 family.
Table 1. MPC8280 PowerQUICC II Family Functionality
Devices
Functionality
MPC8270
MPC8275
516 PBGA
MPC8280
480 TBGA
1
Package
480 TBGA 516 PBGA
Serial communications controllers (SCCs)
QUICC multi-channel controller (QMC)
Fast communication controllers (FCCs)
I-Cache (Kbyte)
4
—
3
4
—
3
4
—
3
4
—
3
16
16
3
16
16
3
16
16
3
16
16
3
D-Cache (Kbyte)
Ethernet (10/100)
UTOPIA II Ports
0
0
2
2
Multi-channel controllers (MCCs)
PCI bridge
1
1
1
2
Yes
—
—
1
Yes
—
—
1
Yes
—
—
1
Yes
Yes
Yes
1
Transmission convergence (TC) layer
Inverse multiplexing for ATM (IMA)
Universal serial bus (USB) 2.0 full/low rate
Security engine (SEC)
—
—
—
—
1
Refer to Table 2.
Devices in the MPC8280 family are available in four packages—the standard ZU and VV packages and the alternate
VR or ZQ packages—as shown in Table 2. Note that throughout this document references to the MPC8280 and the
MPC8270 are inclusive of VR and ZQ package devices unless otherwise specified. For more information on VR and
ZQ packages, contact your Freescale sales office. For package ordering information, refer to Section 10, “Ordering
Information.”
Table 2. HiP7 PowerQUICC II Device Packages
Code
ZU
VV
VR
ZQ
(Package)
(480 TBGA—Leaded) (480 TBGA—Lead Free) (516 PBGA—Lead free) (516 PBGA—Lead spheres)
MPC8280
MPC8270
MPC8280
MPC8270
MPC8275VR
MPC8270VR
MPC8275ZQ
MPC8270ZQ
Device
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
2
Freescale Semiconductor
Overview
Figure 1 shows the block diagram. Shaded portions are device-specific; refer to the notes below.
16 Kbytes
I-Cache
I-MMU
System Interface Unit
60x Bus
(SIU)
G2_LE Core
16 Kbytes
D-Cache
Bus Interface Unit
PCI Bus
32 bits, up to 66 MHz
60x-to-PCI
Bridge
D-MMU
or
60x-to-Local
Bridge
Local Bus
32 bits, up to 100 MHz
Communication Processor Module (CPM)
Memory Controller
Clock Counter
32 KB
Instruction
RAM
32 KB
Data
RAM
Timers
Interrupt
Controller
Serial
DMAs
Parallel I/O
32-bit RISC Microcontroller
and Program ROM
4 Virtual
IDMAs
System Functions
Baud Rate
Generators
IMA
1
Microcode
I2C
MCC1
MCC2 FCC1 FCC2 FCC3 SCC1 SCC2 SCC3 SCC4/ SMC1 SMC2
SPI
1
USB
TC Layer Hardware1
Time Slot Assigner
Serial Interface2
Non-Multiplexed
I/O
3 MII or RMII
Ports
2 UTOPIA
Ports3
8 TDM Ports2
Notes:
1
MPC8280 only (not on MPC8270, the VR package, nor the ZQ package)
MPC8280 has 2 serial interface (SI) blocks and 8 TDM ports. MPC8270 and the VR and ZQ packages have
only 1 SI block and 4 TDM ports (TDM2[A–D]).
2
3
MPC8280, MPC8275VR, MPC8275ZQ only (not on MPC8270, MPC8270VR, nor MPC8270ZQ)
Figure 1. MPC8280 Block Diagram
1.1 Features
The major features of the MPC8280 are as follows:
•
Dual-issue integer (G2_LE) core
— A core version of the EC603e microprocessor
— System core microprocessor supporting frequencies of 166–450 MHz
— Separate 16-Kbyte data and instruction caches:
– Four-way set associative
– Physically addressed
– LRU replacement algorithm
— Architecture-compliant memory management unit (MMU)
— Common on-chip processor (COP) test interface
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
3
Overview
— High-performance (SPEC95 benchmark at 450 MHz; 855 Dhrystones MIPS at 450 MHz)
— Supports bus snooping for data cache coherency
— Floating-point unit (FPU)
•
•
Separate power supply for internal logic and for I/O
Separate PLLs for G2_LE core and for the CPM
— G2_LE core and CPM can run at different frequencies for power/performance optimization
— Internal core/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 4.5:1, 5:1, 6:1, 7:1, 8:1 ratios
— Internal CPM/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1, 8:1 ratios
64-bit data and 32-bit address 60x bus
•
— Bus supports multiple master designs
— Supports single- and four-beat burst transfers
— 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
— Supports data parity or ECC and address parity
32-bit data and 18-bit address local bus
•
•
— Single-master bus, supports external slaves
— Eight-beat burst transfers
— 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
60x-to-PCI bridge
— Programmable host bridge and agent
— 32-bit data bus, 66.67/83.3/100 MHz, 3.3 V
— Synchronous and asynchronous 60x and PCI clock modes
— All internal address space available to external PCI host
— DMA for memory block transfers
— PCI-to-60x address remapping
•
PCI bridge
— PCI Specification Revision 2.2 compliant and supports frequencies up to 66 MHz
— On-chip arbitration
— Support for PCI-to-60x-memory and 60x-memory-to-PCI streaming
— PCI host bridge or peripheral capabilities
— Includes 4 DMA channels for the following transfers:
– PCI-to-60x to 60x-to-PCI
– 60x-to-PCI to PCI-to-60x
– PCI-to-60x to PCI-to-60x
– 60x-to-PCI to 60x-to-PCI
— Includes all of the configuration registers (which are automatically loaded from the EPROM and used
to configure the MPC8280) required by the PCI standard as well as message and doorbell registers
— Supports the I2O standard
— Hot-swap friendly (supports the hot swap specification as defined by PICMG 2.1 R1.0 August 3, 1998)
— Support for 66.67/83.33/100 MHz, 3.3 V specification
— 60x-PCI bus core logic that uses a buffer pool to allocate buffers for each port
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
4
Freescale Semiconductor
Overview
— Uses the local bus signals, removing need for additional pins
System interface unit (SIU)
•
— Clock synthesizer
— Reset controller
— Real-time clock (RTC) register
— Periodic interrupt timer
— Hardware bus monitor and software watchdog timer
— IEEE 1149.1 JTAG test access port
12-bank memory controller
•
— Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash and other user- definable
peripherals
— Byte write enables and selectable parity generation
— 32-bit address decodes with programmable bank size
— Three user-programmable machines, general-purpose chip-select machine, and page-mode pipeline
SDRAM machine
— Byte selects for 64-bus width (60x) and byte selects for 32-bus width (local)
— Dedicated interface logic for SDRAM
•
•
CPU core can be disabled and the device can be used in slave mode to an external core
Communications processor module (CPM)
— Embedded 32-bit communications processor (CP) uses a RISC architecture for flexible support for
communications protocols
— Interfaces to G2_LE core through an on-chip 32-Kbyte dual-port data RAM, an on-chip 32-Kbyte
dual-port instruction RAM and DMA controller
— Serial DMA channels for receive and transmit on all serial channels
— Parallel I/O registers with open-drain and interrupt capability
— Virtual DMA functionality executing memory-to-memory and memory-to-I/O transfers
— Three fast communications controllers supporting the following protocols:
– 10/100-Mbit Ethernet/IEEE 802.3 CDMA/CS interface through media independent interface (MII)
or reduced media independent interface (RMII)
– ATM—Full-duplex SAR protocols at 155 Mbps, through UTOPIA interface, AAL5, AAL1, AAL0
protocols, TM 4.0 CBR, VBR, UBR, ABR traffic types, up to 64 K external connections (no ATM
support for the MPC8270)
– Transparent
– HDLC—Up to T3 rates (clear channel)
– FCC2 can also be connected to the TC layer (MPC8280 only)
— Two multichannel controllers (MCCs) (one MCC on the MPC8270)
– Each MCC handles 128 serial, full-duplex, 64-Kbps data channels. Each MCC can be split into four
subgroups of 32 channels each.
– Almost any combination of subgroups can be multiplexed to single or multiple TDM interfaces up
to four TDM interfaces per MCC
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
5
Overview
— Four serial communications controllers (SCCs) identical to those on the MPC860, supporting the digital
portions of the following protocols:
– Ethernet/IEEE 802.3 CDMA/CS
– HDLC/SDLC and HDLC bus
– Universal asynchronous receiver transmitter (UART)
– Synchronous UART
– Binary synchronous (BISYNC) communications
– Transparent
— Universal serial bus (USB) controller
– Supports USB 2.0 full/low rate compatible
– USB host mode
– Supports control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– NRZI encoding/decoding with bit stuffing
– Supports both 12- and 1.5-Mbps data rates (automatic generation of preamble token and data rate
configuration). Note that low-speed operation requires an external hub.
– Flexible data buffers with multiple buffers per frame
– Supports local loopback mode for diagnostics (12 Mbps only)
– Supports USB slave mode
– Four independent endpoints support control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– CRC5 checking
– NRZI encoding/decoding with bit stuffing
– 12- or 1.5-Mbps data rate
– Flexible data buffers with multiple buffers per frame
– Automatic retransmission upon transmit error
— Two serial management controllers (SMCs), identical to those of the MPC860
– Provide management for BRI devices as general circuit interface (GCI) controllers in time-
division-multiplexed (TDM) channels
– Transparent
– UART (low-speed operation)
— One serial peripheral interface identical to the MPC860 SPI
— One inter-integrated circuit (I2C) controller (identical to the MPC860 I2C controller)
– Microwire compatible
– Multiple-master, single-master, and slave modes
— Up to eight TDM interfaces (four on the MPC8270)
– Supports two groups of four TDM channels for a total of eight TDMs (one group of four on the
MPC8270 and the MPC8275)
– 2,048 bytes of SI RAM
– Bit or byte resolution
– Independent transmit and receive routing, frame synchronization
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
6
Freescale Semiconductor
Operating Conditions
– Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN primary
rate, Freescale interchip digital link (IDL), general circuit interface (GCI), and user-defined TDM
serial interfaces
— Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs, SCCs,
SMCs, and serial channels
— Four independent 16-bit timers that can be interconnected as two 32-bit timers
•
•
Inverse multiplexing for ATM capabilities (IMA) (MPC8280 only).Supported by eight transfer transmission
convergence (TC) layers between the TDMs and FCC2.
Transmission convergence (TC) layer (MPC8280 only)
2 Operating Conditions
Table 3 shows the maximum electrical ratings.
1
Table 3. Absolute Maximum Ratings
Rating
Symbol
Value
Unit
2
Core supply voltage
VDD
VCCSYN
VDDH
VIN
-0.3 – 2.25
-0.3 – 2.25
-0.3 – 4.0
V
V
2
PLL supply voltage
3
I/O supply voltage
V
4
Input voltage
GND(-0.3) – 3.6
120
V
Junction temperature
T
°C
°C
j
Storage temperature range
T
(-55) – (+150)
STG
1
Absolute maximum ratings are stress ratings only; functional operation (see Table 4) at the maximums is not
guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage.
2
Caution: VDD/VCCSYN must not exceed VDDH by more than 0.4 V during normal operation. It is recommended
that VDD/VCCSYN should be raised before or simultaneous with VDDH during power-on reset. VDD/VCCSYN may
exceed VDDH by more than 0.4 V during power-on reset for no more than 100 ms.
3
4
Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no more than 100 mSec. VDDH
should not exceed VDD/VCCSYN by more than 2.5 V during normal operation.
Caution: VIN must not exceed VDDH by more than 2.5 V at any time, including during power-on reset.
Table 4 lists recommended operational voltage conditions.
Table 4. Recommended Operating Conditions
1
Rating
Symbol
Value
Unit
Core supply voltage
PLL supply voltage
I/O supply voltage
VDD
VCCSYN
VDDH
VIN
1.45 – 1.60
1.45 – 1.60
V
V
3.135 – 3.465
V
Input voltage
GND (-0.3) – 3.465
V
2
Junction temperature (maximum)
Ambient temperature
T
105
°C
°C
j
2
T
0–70
A
1
Caution: These are the recommended and tested operating conditions. Proper operation outside of these conditions
is not guaranteed.
2
Note that for extended temperature parts the range is (-40) – 105 .
T
T
j
A
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
7
DC Electrical Characteristics
This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is
advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages
to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic
voltage level (either GND or VCC).
Figure 2 shows the undershoot and overshoot voltage of the 60x and local bus memory interface of the MPC8280.
Note that in PCI mode the I/O interface is different.
4 V
GV + 5%
DD
V
V
GV
IH
DD
GND
GND – 0.3 V
IL
GND – 1.0 V
Not to exceed 10%
of t
SDRAM_CLK
Figure 2. Overshoot/Undershoot Voltage
3 DC Electrical Characteristics
Table 5 shows DC electrical characteristics.
1
Table 5. DC Electrical Characteristics
Characteristic Symbol
Min
Max
Unit
Input high voltage—
all inputs except TCK, TRST and PORESET
V
2.0
3.465
V
IH
2
Input low voltage
V
GND
2.4
GND
—
0.8
3.465
0.4
10
V
V
IL
CLKIN input high voltage
V
IHC
CLKIN input low voltage
V
I
V
ILC
IN
3
Input leakage current, V = VDDH
µA
µA
µA
µA
V
IN
3
Hi-Z (off state) leakage current, V = VDDH
I
—
10
IN
OZ
4
Signal low input current, V = 0.8 V
I
—
1
IL
L
Signal high input current, V = 2.0 V
I
—
1
IH
H
Output high voltage, I = –2 mA
V
2.4
—
OH
OH
except UTOPIA mode, and open drain pins
5
In UTOPIA mode (UTOPIA pins only): I = -8.0mA
OH
PA[0-31]
PB[4-31]
PC[0-31]
PD[4-31]
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
8
Freescale Semiconductor
DC Electrical Characteristics
1
Table 5. DC Electrical Characteristics (continued)
Characteristic
Symbol
Min
Max
Unit
5
In UTOPIA mode (UTOPIA pins only): I = 8.0mA
V
—
0.5
V
OL
OL
PA[0-31]
PB[4-31]
PC[0-31]
PD[4-31]
I
= 6.0mA
V
—
0.4
V
OL
OL
BR
BG
ABB/IRQ2
TS
A[0-31]
TT[0-4]
TBST
TSIZE[0–3]
AACK
ARTRY
DBG
DBB/IRQ3
D[0-63]
DP(0)/RSRV/EXT_BR2
DP(1)/IRQ1/EXT_BG2
DP(2)/TLBISYNC/IRQ2/EXT_DBG2
DP(3)/IRQ3/EXT_BR3/CKSTP_OUT
DP(4)/IRQ4/EXT_BG3/CORE_SREST
DP(5)/TBEN/EXT_DBG3/IRQ5/CINT
DP(6)/CSE(0)/IRQ6
DP(7)/CSE(1)/IRQ7
PSDVAL
TA
TEA
GBL/IRQ1
CI/BADDR29/IRQ2
WT/BADDR30/IRQ3
L2_HIT/IRQ4
CPU_BG/BADDR31/IRQ5/CINT
CPU_DBG
CPU_BR
IRQ0/NMI_OUT
IRQ7/INT_OUT/APE
PORESET
HRESET
SRESET
RSTCONF
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
9
DC Electrical Characteristics
1
Table 5. DC Electrical Characteristics (continued)
Characteristic
Symbol
Min
Max
Unit
I
= 5.3mA
V
—
0.4
V
OL
OL
CS[0-9]
CS(10)/BCTL1
CS(11)/AP(0)
BADDR[27–28]
ALE
BCTL0
PWE[0–7]/PSDDQM[0–7]/PBS[0–7]
PSDA10/PGPL0
PSDWE/PGPL1
POE/PSDRAS/PGPL2
PSDCAS/PGPL3
PGTA/PUPMWAIT/PGPL4/PPBS
PSDAMUX/PGPL5
LWE[0–3]LSDDQM[0–3]/LBS[0–3]/PCI_CFG[0–3]
LSDA10/LGPL0/PCI_MODCKH0
LSDWE/LGPL1/PCI_MODCKH1
LOE/LSDRAS/LGPL2/PCI_MODCKH2
LSDCAS/LGPL3/PCI_MODCKH3
LGTA/LUPMWAIT/LGPL4/LPBS
LSDAMUX/LGPL5/PCI_MODCK
LWR
MODCK[1–3]/AP[1–3]/TC[0–2]/BNKSEL[0–2]
I
= 3.2mA
OL
L_A14/PAR
L_A15/FRAME/SMI
L_A16/TRDY
L_A17/IRDY/CKSTP_OUT
L_A18/STOP
L_A19/DEVSEL
L_A20/IDSEL
L_A21/PERR
L_A22/SERR
L_A23/REQ0
L_A24/REQ1/HSEJSW
L_A25/GNT0
L_A26/GNT1/HSLED
L_A27/GNT2/HSENUM
L_A28/RST/CORE_SRESET
L_A29/INTA
L_A30/REQ2
L_A31
LCL_D[0-31]/AD[0-31]
LCL_DP[0-3]/C/BE[0-3]
PA[0–31]
PB[4–31]
PC[0–31]
PD[4–31]
TDO
QREQ
1
2
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC
current, either pull unused pins to GND or VDDH or configure them as outputs.
TCK, TRST and PORESET have min VIH = 2.5V.
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
10
Freescale Semiconductor
Thermal Characteristics
3
4
The leakage current is measured for nominal VDDH,VCCSYN, and VDD.
for IIC interface does not match IIC standard, but does meet IIC standard for V and should not cause any compatibility
V
IL
OL
issue.
5
MPC8280, MPC8275VR, MPC8275ZQ only.
4 Thermal Characteristics
Table 6 describes thermal characteristics for both the packages. See Table 2 for information about a given device’s
package. For the discussions sections 4.1 and 4.5, PD = (VDD × IDD) + PI/O, where PI/O is the power dissipation of
the I/O drivers.
Table 6. Thermal Characteristics
Value
Characteristic
Symbol
Unit
Air Flow
480 TBGA
516 PBGA
Junction to ambient—
single-layer board
16
11
12
9
27
21
19
16
11
8
Natural convection
1
R
R
°C/W
°C/W
θJA
θJA
1 m/s
Junction to ambient—
four-layer board
Natural convection
1 m/s
—
2
Junction to board
R
R
6
°C/W
°C/W
°C/W
θJB
3
Junction to case
2
—
θJC
4
Junction-to-package top
Ψ
2
2
—
JT
1
2
Assumes no thermal vias.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
3
4
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
4.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the following equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (ºC)
RθJA = package junction-to-ambient thermal resistance (ºC/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation
of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor
of two (in the quantity TJ – TA) are possible.
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
11
Thermal Characteristics
4.2 Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance
and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (ºC/W)
RθJC = junction-to-case thermal resistance (ºC/W)
RθCA = case-to-ambient thermal resistance (ºC/W)
RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to affect the
case-to-ambient thermal resistance, RθCA. For instance, the user can change the air flow around the device, add a
heat sink, change the mounting arrangement on the printed circuit board, or change the thermal dissipation on the
printed circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks
where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most
packages, a better model is required.
4.3 Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two-resistor model
consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case thermal resistance
covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the top of the
package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is
conducted to the printed circuit board. It has been observed that the thermal performance of most plastic packages,
especially PBGA packages, is strongly dependent on the board temperature.
If the board temperature is known, an estimate of the junction temperature in the environment can be made using
the following equation:
TJ = TB + (RθJB × PD)
where:
RθJB = junction-to-board thermal resistance (ºC/W)
TB = board temperature (ºC)
PD = power dissipation in package
If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable
predictions of junction temperature can be made. For this method to work, the board and board mounting must be
similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a
power and a ground plane) and by attaching the thermal balls to the ground plane.
4.4 Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple two-resistor
model can be used with the thermal simulation of the application, or a more accurate and complex model of the
package can be used in the thermal simulation.
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
12
Freescale Semiconductor
Power Dissipation
4.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the thermal
characterization parameter (ΨJT) can be used to determine the junction temperature with a measurement of the
temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
Ψ
JT = thermal characterization parameter
TT = thermocouple temperature on top of package
PD = power dissipation in package
The thermal characterization parameter is measured per JEDEC JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the
thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and
over 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the case to avoid
measurement errors caused by cooling effects of the thermocouple wire.
4.6 Layout Practices
Each VDD and VDDH pin should be provided with a low-impedance path to the board’s power supplies. Each
ground pin should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct
groups of logic on chip. The VDD and VDDH power supplies should be bypassed to ground using by-pass
capacitors located as close as possible to the four sides of the package. For filtering high frequency noise, a capacitor
of 0.1uF on each VDD and VDDH pin is recommended. Further, for medium frequency noise, a total of 2 capacitors
of 47uF for VDD and 2 capacitors of 47uF for VDDH are also recommnded. The capacitor leads and associated
printed circuit traces connecting to chip VDD, VDDH and ground should be kept to less than half an inch per
capacitor lead. Boards should employ separate inner layers for power and GND planes.
All output pins on the MPC8280 have fast rise and fall times. Printed circuit (PC) trace interconnection length should
be minimized to minimize overdamped conditions and reflections caused by these fast output switching times. This
recommendation particularly applies to the address and data buses. Maximum PC trace lengths of six inches are
recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to the
PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher
capacitive loads because these loads create higher transient currents in the VDD and GND circuits. Pull up all
unused inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels
on the PLL supply pins.
5 Power Dissipation
Table 7 provides preliminary, estimated power dissipation for various configurations. Note that suitable thermal
management is required to ensure the junction temperature does not exceed the maximum specified value. Also note
that the I/O power should be included when determining whether to use a heat sink. For a complete list of possible
clock configurations, refer to Section 7, “Clock Configuration Modes.”
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
13
AC Electrical Characteristics
Table 7. Estimated Power Dissipation for Various Configurations
1
2, 3
P
(W)
INT
CPM
Multiplication
Factor
CPU
Multiplication
Factor
Bus
(MHz)
CPM
(MHz)
CPU
(MHz)
Vddl 1.5 Volts
Nominal
Maximum
66.67
66.67
66.67
66.67
83.33
83.33
83.33
100
2.5
2.5
3
166
166
200
233
250
250
292
300
300
3.5
4
233
266
266
300
333
375
417
400
450
0.95
1.0
1.0
1.05
1.1
4
1.05
1.05
1.25
1.3
3.5
3
4.5
4
1.15
1.35
1.4
3
4.5
5
3.5
3
1.45
1.5
1.55
1.6
4
100
3
4.5
1.55
1.65
1
2
3
Test temperature = 105° C
= I x V Watts
P
INT
DD
DD
Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds:
66.7 MHz = 0.45 W (nominal), 0.5 W (maximum)
83.3 MHz = 0.5W (nominal), 0.6 W (maximum)
100 MHz = 0.6 W (nominal), 0.7 W (maximum)
6 AC Electrical Characteristics
The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs and inputs for
66.67/83.33/100 MHz devices. Note that AC timings are based on a 50-pf load for MAX Delay and 10-pf load for
MIN delay. Typical output buffer impedances are shown in Table 8.
1
Table 8. Output Buffer Impedances
Output Buffers
Typical Impedance (Ω)
2
60x bus
45 or 27
Local bus
Memory controller
Parallel I/O
PCI
45
2
45 or 27
45
27
1
2
These are typical values at 65° C. Impedance may vary by ±25% with process and temperature.
On silicon revision 0.0 (mask #: 0K49M), selectable impedance is not available. Impedance is set at 45 Ω.
On all other revisions, impedance value is selected through the SIUMCR[20,21]. Refer to the MPC8280
PowerQUICC II Family Reference Manual.
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
14
Freescale Semiconductor
AC Electrical Characteristics
6.1 CPM AC Characteristics
Table 9 lists CPM output characteristics.
1
Table 9. AC Characteristics for CPM Outputs
Spec Number
Max Min
Characteristic Value (ns)
Maximum Delay
Minimum Delay
66 MHz 83 MHz 100 MHz 66 MHz 83 MHz 100 MHz
sp36a sp37a FCC outputs—internal clock (NMSI)
sp36b sp37b FCC outputs—external clock (NMSI)
6
8
5.5
8
5.5
8
0.5
2
0.5
2
0.5
2
sp38a sp39a SCC/SMC/SPI/I2C outputs—internal
clock (NMSI)
10
10
10
0
0
0
sp38b sp39b SCC/SMC/SPI/I2C outputs—external
clock (NMSI)
8
8
8
2
2
2
sp40
sp42
sp41 TDM outputs/SI
11
11
11
11
11
11
11
11
11
2.5
0.5
0.5
2.5
0.5
0.5
2.5
0.5
0.5
sp43 TIMER/IDMA outputs
sp42a sp43a PIO outputs
1
Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are
measured at the pin.
Table 10 lists CPM input characteristics.
NOTE: Rise/Fall Time on CPM Input Pins
The rise/fall time on CPM input pins should not exceed 5 ns. This should be
enforced especially on clock signals. Rise time refers to signal transitions from
10% to 90% of VCC; fall time refers to transitions from 90% to 10% of VCC.
1
Table 10. AC Characteristics for CPM Inputs
Spec Number
Setup Hold
Value (ns)
Characteristic
Setup
Hold
66 MHz
83 MHz 100 MHz 66 MHz 83 MHz 100 MHz
sp16a sp17a FCC inputs—internal clock (NMSI)
sp16b sp17b FCC inputs—external clock (NMSI)
6
2.5
6
6
2.5
6
6
2.5
6
0
2
0
0
2
0
0
2
0
sp18a sp19a SCC/SMC/SPI/I2C inputs—internal clock
(NMSI)
sp18b sp19b SCC/SMC/SPI/I2C inputs—external clock
(NMSI)
4
4
4
2
2
2
sp20
sp22
sp21 TDM inputs/SI
5
8
5
8
5
8
2.5
0.5
2.5
0.5
2.5
0.5
sp23 PIO/TIMER/IDMA inputs
1
Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are
measured at the pin.
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
15
AC Electrical Characteristics
NOTE
Although the specifications generally reference the rising edge of the clock, the
following AC timing diagrams also apply when the falling edge is the active edge.
Figure 3 shows the FCC internal clock.
BRG_OUT
sp17a
sp16a
FCC input signals
FCC output signals
sp36a/sp37a
Note: When GFMR[TCI] = 0
sp36a/sp37a
FCC output signals
Note: When GFMR.[TCI] = 1
Figure 3. FCC Internal Clock Diagram
Figure 4 shows the FCC external clock.
Serial ClKin
sp17b
sp16b
FCC input signals
sp36b/sp37b
FCC output signals
Note: When GFMR[TCI] = 0
sp36b/sp37b
FCC output signals
Note: When GFMR[TCI] = 1
Figure 4. FCC External Clock Diagram
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
16
Freescale Semiconductor
AC Electrical Characteristics
Figure 5 shows the SCC/SMC/SPI/I2C external clock.
Serial CLKin
sp19b
sp18b
SCC/SMC/SPI/I2C input signals
(See note)
sp38b/sp39b
SCC/SMC/SPI/I2C output signals
(See note)
Note: There are four possible timing conditions for SCC and SPI:
1. Input sampled on the rising edge and output driven on the rising edge (shown).
2. Input sampled on the rising edge and output driven on the falling edge.
3. Input sampled on the falling edge and output driven on the falling edge.
4. Input sampled on the falling edge and output driven on the rising edge.
2
Figure 5. SCC/SMC/SPI/I C External Clock Diagram
Figure 6 shows the SCC/SMC/SPI/I2C internal clock.
BRG_OUT
sp19a
sp18a
SCC/SMC/SPI/I2C input signals
(See note)
sp38a/sp39a
SCC/SMC/SPI/I2C output signals
(See note)
Note: There are four possible timing conditions for SCC and SPI:
1. Input sampled on the rising edge and output driven on the rising edge (shown).
2. Input sampled on the rising edge and output driven on the falling edge.
3. Input sampled on the falling edge and output driven on the falling edge.
4. Input sampled on the falling edge and output driven on the rising edge.
2
Figure 6. SCC/SMC/SPI/I C Internal Clock Diagram
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
17
AC Electrical Characteristics
Figure 7 shows TDM input and output signals.
Serial CLKin
sp20
sp21
TDM input signals
sp40/sp41
TDM output signals
Note: There are four possible TDM timing conditions:
1. Input sampled on the rising edge and output driven on the rising edge (shown).
2. Input sampled on the rising edge and output driven on the falling edge.
3. Input sampled on the falling edge and output driven on the falling edge.
4. Input sampled on the falling edge and output driven on the rising edge.
Figure 7. TDM Signal Diagram
Figure 8 shows PIO and timer signals.
Sys clk
sp23
sp22
PIO/IDMA/TIMER[TGATE assertion] input signals
(See note)
sp23
sp22
TIMER input signal [TGATE deassertion]
(See note)
sp42/sp43
IDMA output signals
sp42/sp43
sp42a/sp43a
TIMER(sp42/43)/ PIO(sp42a/sp43a)
output signals
Note: TGATE is asserted on the rising edge of the clock; it is deasserted on the falling edge.
Figure 8. PIO and Timer Signal Diagram
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
18
Freescale Semiconductor
AC Electrical Characteristics
6.2 SIU AC Characteristics
Note the following points about the SIU AC characteristics:
•
CLKIN jitter and duty cycle. The CLKIN input to the MPC8280 should not exceed +/– 150 psec of jitter
(peak-to-peak). This represents total input jitter—the combination of short term (cycle-to-cycle) and long
term (cumulative). The duty cycle of CLKIN should not exceed the ratio of 40:60. The rise/file time of
CLKIN should adhere to the typical SDRAM device AC clock requirement of 1 V/ns to meet SDRAM AC
specs.
•
•
Spread spectrum clocking. Is allowed with 1% input frequency down-spread at maximum 60 KHz
modulation rate regardless of input frequency.
PCI AC timing. The MPC8280 meets the timing requirements of PCI Specification Revision 2.2. Refer to
Sections 7.2 and 7.3 and “Note: Tval (Output Hold)” to determine if a specific clock configuration is
compliant.
•
Activating data pipelining (setting BRx[DR] in the memory controller) improves the AC timing.
Table 11 lists SIU input characteristics.
Table 11. AC Characteristics for SIU Inputs
1
Spec Number
Setup Hold
Value (ns)
Characteristic
Setup
Hold
66 MHz 83 MHz 100 MHz 66 MHz 83 MHz 100 MHz
sp11
sp10 AACK/TA/TS/DBG/BG/BR/ARTRY/
TEA
6
5
3.5
0.5
0.5
0.5
sp12
sp13
sp10 Data bus in normal mode
5
7
4
5
3.5
3.5
0.5
0.5
0.5
0.5
0.5
0.5
sp10 Data bus in ECC and PARITY modes
sp13a sp10 Pipeline mode—Data bus (with or without
ECC/PARITY)
5
7
4
5
4
4
2.5
3.5
2.5
3.5
0.5
0.5
—
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
sp14
sp14a sp10 Pipeline mode—DP pins
sp15 sp10 All other pins
sp10 DP pins
—
5
0.5
1
Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are
measured at the pin.
Table 12 lists SIU output characteristics.
Table 12. AC Characteristics for SIU Outputs
1
Spec Number
Value (ns)
Max
Min
Characteristic
Maximum Delay
Minimum Delay
66 MHz 83 MHz 100 MHz 66 MHz 83 MHz 100 MHz
sp31
sp32
sp30 PSDVAL/TEA/TA
7
8
6
5.5
5.5
5.5
1
1
1
1
1
1
sp30 ADD/ADD_atr./BADDR/CI/GBL/WT
6.5
6.5
2
sp33a sp30 Data bus
6.5
0.7
0.7
0.7
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
19
AC Electrical Characteristics
Spec Number
1
Table 12. AC Characteristics for SIU Outputs
Value (ns)
Max
Min
Characteristic
Maximum Delay
Minimum Delay
66 MHz 83 MHz 100 MHz 66 MHz 83 MHz 100 MHz
sp33b sp30 DP
6
6
6
7
5.5
5.5
5.5
7
5.5
5.5
5.5
7
1
1
1
1
1
1
1
1
1
1
1
1
sp34
sp35
sp30 Memory controller signals/ALE
sp30 All other signals
sp35a sp30 AP
1
2
Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are
measured at the pin.
To achieve 1 ns of hold time at 66, 83, or 100 MHz, a minimum loading of 20 pF is required.
Figure 9 shows the interaction of several bus signals.
CLKin
sp10
sp10
sp10
sp11
AACK/TA/TS/
DBG/BG/BR input signals
sp11a
ARTRY/TEA input signals
sp12
DATA bus normal mode
input signal
sp10
sp15
All other input signals
sp30
sp31
PSDVAL/TEA/TA output signals
sp32
sp30
sp30
sp30
ADD/ADD_atr/BADDR/CI/
GBL/WT output signals
sp33a
DATA bus output signals
sp35
All other output signals
sp35a
(except AP)
sp30
AP signals
Figure 9. Bus Signals
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
20
Freescale Semiconductor
AC Electrical Characteristics
Figure 10 shows signal behavior for all parity modes (including ECC, RMW parity, and standard parity).
CLKin
sp10
sp10
sp13
DATA bus, ECC, and PARITY mode
input signals
sp13a
Pipeline mode—
DATA bus, ECC, and PARITY mode
input signals
sp10
sp14
DP mode input signal
sp10
sp14a
Pipeline mode—
DP mode input signal
sp33b
sp30
DP mode output signal
Figure 10. Parity Mode Diagram
Figure 11 shows signal behavior in MEMC mode.
CLKin
V_CLK
sp34/sp30
Memory controller signals
Figure 11. MEMC Mode Diagram
NOTE
Generally, all MPC8280 bus and system output signals are driven from the rising
edge of the input clock (CLKin). Memory controller signals, however, trigger on
four points within a CLKin cycle. Each cycle is divided by four internal ticks: T1,
T2, T3, and T4. T1 always occurs at the rising edge, and T3 at the falling edge, of
CLKin. However, the spacing of T2 and T4 depends on the PLL clock ratio
selected, as shown in Table 13.
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
21
AC Electrical Characteristics
Table 13. Tick Spacing for Memory Controller Signals
Tick Spacing (T1 Occurs at the Rising Edge of CLKin)
PLL Clock Ratio
T2
1/4 CLKin
T3
1/2 CLKin
T4
3/4 CLKin
1:2, 1:3, 1:4, 1:5, 1:6
1:2.5
1:3.5
3/10 CLKin
4/14 CLKin
1/2 CLKin
1/2 CLKin
8/10 CLKin
11/14 CLKin
Figure 12 is a representation of the information in Table 13.
CLKin
for 1:2, 1:3, 1:4, 1:5, 1:6
T1
T1
T1
T2
T3
T3
T3
T4
CLKin
CLKin
for 1:2.5
T2
T4
for 1:3.5
T2
T4
Figure 12. Internal Tick Spacing for Memory Controller Signals
NOTE
The UPM machine outputs change on the internal tick determined by the memory
controller programming; the AC specifications are relative to the internal tick. The
SDRAM and GPCM machine outputs change on CLKin’s rising edge.
6.3 JTAG Timings
Table 14 lists the JTAG timings.
1
Table 14. JTAG Timings
2
Parameter
Symbol
Min
Max
Unit
Notes
JTAG external clock frequency of operation
JTAG external clock cycle time
f
t
0
30
15
0
33.3
—
MHz
ns
JTG
JTG
JTAG external clock pulse width measured at 1.4V
JTAG external clock rise and fall times
t
—
ns
JTKHKL
6
t
and
5
ns
JTGR
t
JTGF
3
6
TRST assert time
Input setup times
t
25
—
ns
,
TRST
4
4
7
7
t
t
4
4
—
—
ns
ns
,
,
Boundary-scan data
TMS, TDI
JTDVKH
JTIVKH
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
22
Freescale Semiconductor
Clock Configuration Modes
1
Table 14. JTAG Timings (continued)
2
Parameter
Symbol
Min
Max
Unit
Notes
Input hold times
Output valid times
Output hold times
4
4
7
7
t
t
10
10
—
—
ns
ns
,
,
Boundary-scan data
TMS, TDI
JTDXKH
JTIXKH
5
5
7
7
t
t
—
—
10
10
ns
ns
,
.
Boundary-scan data
TDO
JTKLDV
JTKLOV
5
5
7
7
t
t
1
1
—
—
ns
ns
,
,
Boundary-scan data
TDO
JTKLDX
JTKLOX
JTAG external clock to output high impedance
Boundary-scan data
TDO
5
5
6
6
t
1
1
10
10
ns
ns
,
,
JTKLDZ
t
JTKLOZ
1
All outputs are measured from the midpoint voltage of the falling/rising edge of t
to the midpoint of the signal in question.
TCLK
The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load. Time-of-flight delays
must be added for trace lengths, vias, and connectors in the system.
2
The symbols used for timing specifications herein follow the pattern of t
(first two letters of functional block)(signal)(state) (reference)(state)
for inputs and t(
for outputs. For example, t
symbolizes JTAG
(first two letters of functional block)(reference)(state)(signal)(state)
JTDVKH
device timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the t
clock reference
JTG
(K) going to the high (H) state or setup time. Also, t
symbolizes JTAG timing (JT) with respect to the time data input
JTDXKH
signals (D) went invalid (X) relative to the t
clock reference (K) going to the high (H) state. Note that, in general, the clock
JTG
reference symbol representation is based on three letters representing the clock of a particular functional. For rise and fall
times, the latter convention is used with the appropriate letter: R (rise) or F (fall).
3
4
5
6
7
TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
Non-JTAG signal input timing with respect to t
.
TCLK
Non-JTAG signal output timing with respect to t
Guaranteed by design.
.
TCLK
Guaranteed by design and device characterization.
7 Clock Configuration Modes
The MPC8280 has three clocking modes: local, PCI host, and PCI agent. The clocking mode is set according to three
input pins—PCI_MODE, PCI_CFG[0], PCI_MODCK—as shown in Table 15.
Table 15. MPC8280 Clocking Modes
Pins
PCI Clock
Frequency Range
(MHZ)
Clocking Mode
Reference
1
PCI_MODE PCI_CFG[0] PCI_MODCK
1
0
0
0
0
—
0
—
0
Local bus
PCI host
—
Table 16
Table 17
Table 18
Table 19
Table 20
50–66
25–50
50–66
25–50
0
1
1
0
PCI agent
1
1
1
Determines PCI clock frequency range. Refer to Sections 7.2 and 7.3.
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
23
Clock Configuration Modes
In each clocking mode, the configuration of bus, core, PCI, and CPM frequencies is determined by seven bits during
the power-up reset—three hardware configuration pins (MODCK[1–3]) and four bits from hardware configuration
word[28–31] (MODCK_H). Both the PLLs and the dividers are set according to the selected MPC8280 clock
operation mode as described in the following sections.
7.1 Local Bus Mode
Table 16 lists clock configurations for the MPC8280 in local bus mode. The frequencies listed are for the purpose
of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not
exceed the frequency rating of the user’s device.
NOTE
Clock configurations change only after PORESET is asserted.
1
Table 16. Clock Configurations for Local Bus Mode
3
Bus Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
2
CPM
Multiplication
CPU
Multiplication
Mode
4
5
Factor
Factor
MODCK_H-MODCK[1:3]
Low
High
Low
High
Low
High
Default Modes (MODCK_H= 0000)
0000_000
0000_001
0000_010
0000_011
0000_100
0000_101
0000_110
0000_111
37.5
33.3
37.5
30.0
60.0
50.0
60.0
50.0
133.3
133.3
100.0
100.0
167.0
167.0
160.0
160.0
3
3
112.5
100.0
150.0
120.0
120.0
100.0
150.0
125.0
400.0
400.0
400.0
400.0
334.0
334.0
400.0
400.0
4
5
150.0
166.7
150.0
150.0
150.0
150.0
150.0
150.0
533.3
666.7
400.0
500.0
417.5
501.0
400.0
480.0
4
4
4
5
2
2.5
3
2
2.5
2.5
2.5
3
Full Configuration Modes
0001_000
0001_001
0001_010
0001_011
0001_100
50.0
50.0
50.0
167.0
167.0
145.8
2
2
2
100.0
100.0
100.0
334.0
334.0
291.7
4
5
6
200.0
250.0
300.0
668.0
835.0
875.0
Reserved
Reserved
0001_101
0001_110
1000_111
0001_111
0010_000
0010_001
37.5
33.3
33.3
33.3
133.3
133.3
133.3
133.3
3
3
3
3
112.5
400.0
400.0
400.0
400.0
4
5
150.0
166.7
183.3
200.0
533.3
666.7
733.3
800.0
100.0
100.0
100.0
5.5
6
Reserved
Reserved
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
24
Freescale Semiconductor
Clock Configuration Modes
1
Table 16. Clock Configurations for Local Bus Mode (continued)
3
Bus Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
2
CPM
Multiplication
CPU
Multiplication
Mode
4
5
Factor
Factor
MODCK_H-MODCK[1:3]
Low
High
Low
High
Low
High
0010_010
0010_011
0010_100
0010_101
0010_110
37.5
30.0
25.0
25.0
25.0
100.0
100.0
100.0
100.0
100.0
4
4
4
4
4
150.0
120.0
100.0
100.0
100.0
400.0
400.0
400.0
400.0
400.0
4
5
6
7
8
150.0
150.0
150.0
175.0
200.0
400.0
500.0
600.0
700.0
800.0
0010_111
0011_000
0011_001
0011_010
0011_011
Reserved
30.0
25.0
25.0
25.0
80.0
80.0
80.0
80.0
5
5
5
5
150.0
125.0
125.0
125.0
400.0
400.0
400.0
400.0
5
6
7
8
150.0
150.0
175.0
200.0
400.0
480.0
560.0
640.0
0011_100
0011_101
0011_110
0011_111
0100_000
Reserved
Reserved
25.0
25.0
25.0
66.7
66.7
66.7
6
6
6
150.0
400.0
400.0
400.0
6
7
8
150.0
175.0
200.0
400.0
466.7
533.3
150.0
150.0
0101_101
0101_110
0101_111
0110_000
0110_001
0110_010
75.0
60.0
50.0
50.0
50.0
50.0
167.0
167.0
167.0
167.0
167.0
167.0
2
2
2
2
2
2
150.0
120.0
100.0
100.0
100.0
100.0
334.0
334.0
334.0
334.0
334.0
334.0
2
2.5
3
166.7
166.7
200.0
250.0
250.0
250.0
334.0
417.5
501.0
584.5
668.0
751.5
3.5
4
4.5
0110_011
0110_100
0110_101
0110_110
0110_111
0111_000
Reserved
60.0
50.0
42.9
40.0
40.0
160.0
160.0
160.0
160.0
160.0
2.5
2.5
2.5
2.5
2.5
150.0
125.0
107.1
100.0
100.0
400.0
400.0
400.0
400.0
400.0
2.5
3
150.0
150.0
150.0
160.0
180.0
400.0
480.0
560.0
640.0
720.0
3.5
4
4.5
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
25
Clock Configuration Modes
1
Table 16. Clock Configurations for Local Bus Mode (continued)
3
Bus Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
2
CPM
Multiplication
CPU
Multiplication
Mode
4
5
Factor
Factor
MODCK_H-MODCK[1:3]
Low
High
Low
High
Low
High
0111_001
0111_010
0111_011
0111_100
0111_101
0111_110
0111_111
Reserved
Reserved
50.0
42.9
37.5
33.3
133.3
133.3
133.3
133.3
3
3
3
3
150.0
400.0
400.0
400.0
400.0
3
3.5
4
150.0
150.0
150.0
150.0
400.0
466.7
533.3
600.0
128.6
112.5
100.0
4.5
Reserved
1000_000
1000_001
1000_010
1000_011
1000_100
1000_101
1000_110
Reserved
Reserved
42.9
37.5
33.3
30.0
28.6
114.3
114.3
114.3
114.3
114.3
3.5
3.5
3.5
3.5
3.5
150.0
400.0
400.0
400.0
400.0
400.0
3.5
4
150.0
150.0
150.0
150.0
150.0
400.0
457.1
514.3
571.4
628.6
131.3
116.7
105.0
100.0
4.5
5
5.5
1100_000
1100_001
1100_010
Reserved
Reserved
Reserved
1101_000
Reserved
1
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table entry
guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of illustration only.
Users must select a mode and input bus frequency so that the resulting configuration does not violate the frequency rating of
the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is determined by the clock mode. For
modes with a CPU multiplication factor <= 3, the minimum CPU frequency is 150 MHz for commercial temperature devices
and 175 MHz for extended temperature devices. For modes with a CPU multiplication factor >= 3.5: for Rev0.1 the minimum
CPU frequency is 250 MHz; for RevA or later the minimum CPU frequency is 150 MHz for commercial temperature devices
and 175 MHz for extended temperature devices.
2
3
4
5
MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins.
60x and local bus frequency. Identical to CLKIN.
CPM multiplication factor = CPM clock/bus clock
CPU multiplication factor = Core PLL multiplication factor
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
26
Freescale Semiconductor
Clock Configuration Modes
7.2 PCI Host Mode
Table 17 and Table 18 show clock configurations for PCI host mode. The frequencies listed are for the purpose of
illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not
exceed the frequency rating of the user’s device. In addition, note the following:
NOTE: PCI_MODCK
In PCI mode only, PCI_MODCK comes from the LGPL5 pin and
MODCK_H[0–3] comes from {LGPL0, LGPL1, LGPL2, LGPL3}.
NOTE: Tval (Output Hold)
The minimum Tval = 2 ns when PCI_MODCK = 1, and the minimum Tval = 1 ns
when PCI_MODCK = 0. Therefore, designers should use clock configurations that
fit this condition to achieve PCI-compliant AC timing.
1, 2
Table 17. Clock Configurations for PCI Host Mode (PCI_MODCK=0)
4
Bus Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
PCI Clock
(MHz)
3
Mode
CPM
CPU
PCI
Multiplication
Multiplication
Division
Factor
5
6
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
Default Modes (MODCK_H=0000)
0000_000
0000_001
0000_010
0000_011
0000_100
0000_101
0000_110
0000_111
60.0 66.7
50.0 66.7
60.0 80.0
60.0 80.0
60.0 80.0
50.0 66.7
50.0 66.7
50.0 66.7
2
2
120.0 133.3
100.0 133.3
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
2.5
3
150.0 166.7
150.0 200.0
180.0 240.0
210.0 280.0
240.0 320.0
150.0 200.0
175.0 233.3
200.0 266.6
2
2
3
3
3
3
3
3
60.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
2.5
2.5
2.5
3
3
3.5
4
3
3.5
3
3.5
4
Full Configuration Modes
0001_000
0001_001
0001_010
0001_011
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
3
3
3
3
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
5
6
7
8
250.0 333.3
300.0 400.0
350.0 466.6
400.0 533.3
3
3
3
3
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
0010_000
0010_001
0010_010
0010_011
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
4
4
4
4
200.0 266.6
200.0 266.6
200.0 266.6
200.0 266.6
5
6
7
8
250.0 333.3
300.0 400.0
350.0 466.6
400.0 533.3
4
4
4
4
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
27
Clock Configuration Modes
Table 17. Clock Configurations for PCI Host Mode (PCI_MODCK=0)
1, 2
(continued)
4
Bus Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
PCI Clock
(MHz)
3
Mode
CPM
CPU
PCI
(MHz)
Multiplication
Multiplication
Division
Factor
5
6
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
0010_100
0010_101
0010_110
75.0 100.0
75.0 100.0
75.0 100.0
4
4
4
300.0 400.0
300.0 400.0
300.0 400.0
5
5.5
6
375.0 500.0
412.5 549.9
450.0 599.9
6
6
6
50.0 66.7
50.0 66.7
50.0 66.7
0011_000
0011_001
0011_010
0011_011
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
5
5
5
5
250.0 333.3
250.0 333.3
250.0 333.3
250.0 333.3
5
6
7
8
250.0 333.3
300.0 400.0
350.0 466.6
400.0 533.3
5
5
5
5
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
0100_000
0100_001
0100_010
0100_011
Reserved
50.0 66.7
50.0 66.7
50.0 66.7
6
6
6
300.0 400.0
300.0 400.0
300.0 400.0
6
7
8
300.0 400.0
350.0 466.6
400.0 533.3
6
6
6
50.0 66.7
50.0 66.7
50.0 66.7
0101_000
0101_001
0101_010
0101_011
0101_100
60.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
2
2
2
2
2
120.0 133.3
100.0 133.3
100.0 133.3
100.0 133.3
100.0 133.3
2.5
3
150.0 166.7
150.0 200.0
175.0 233.3
200.0 266.6
225.0 300.0
2
2
2
2
2
60.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
3.5
4
4.5
0110_000
0110_001
0110_010
0110_011
0110_100
0110_101
0110_110
60.0 80.0
60.0 80.0
60.0 80.0
60.0 80.0
60.0 80.0
60.0 80.0
60.0 80.0
2.5
2.5
2.5
2.5
2.5
2.5
2.5
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
2.5
3
150.0 200.0
180.0 240.0
210.0 280.0
240.0 320.0
270.0 360.0
300.0 400.0
360.0 480.0
3
3
3
3
3
3
3
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
3.5
4
4.5
5
6
0111_000
0111_001
0111_010
0111_011
Reserved
50.0 66.7
50.0 66.7
50.0 66.7
3
3
3
150.0 200.0
150.0 200.0
150.0 200.0
3
3.5
4
150.0 200.0
175.0 233.3
200.0 266.6
3
3
3
50.0 66.7
50.0 66.7
50.0 66.7
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
28
Freescale Semiconductor
Clock Configuration Modes
1, 2
Table 17. Clock Configurations for PCI Host Mode (PCI_MODCK=0)
(continued)
4
Bus Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
PCI Clock
(MHz)
3
Mode
CPM
CPU
PCI
Multiplication
Multiplication
Division
Factor
5
6
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
0111_100
50.0 66.7
3
150.0 200.0
4.5
225.0 300.0
3
50.0 66.7
1000_000
1000_001
1000_010
1000_011
1000_100
1000_101
1000_110
Reserved
66.7 88.9
66.7 88.9
66.7 88.9
66.7 88.9
66.7 88.9
66.7 88.9
3
3
3
3
3
3
200.0 266.6
200.0 266.6
200.0 266.6
200.0 266.6
200.0 266.6
200.0 266.6
3
3.5
4
200.0 266.6
233.3 311.1
266.7 355.5
300.0 400.0
400.0 533.3
433.3 577.7
4
4
4
4
4
4
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
4.5
6
6.5
1001_000
1001_001
1001_010
1001_011
1001_100
Reserved
Reserved
57.1 76.2
57.1 76.2
57.1 76.2
3.5
3.5
3.5
200.0 266.6
200.0 266.6
200.0 266.6
3.5
4
200.0 266.6
228.6 304.7
257.1 342.8
4
4
4
50.0 66.7
50.0 66.7
50.0 66.7
4.5
1001_101
1001_110
1001_111
85.7 114.3
85.7 114.3
85.7 114.3
3.5
3.5
3.5
300.0 400.0
300.0 400.0
300.0 400.0
5
5.5
6
428.6 571.4
471.4 628.5
514.3 685.6
6
6
6
50.0 66.7
50.0 66.7
50.0 66.7
1010_000
1010_001
1010_010
1010_011
1010_100
75.0 100.0
75.0 100.0
75.0 100.0
75.0 100.0
75.0 100.0
2
2
2
2
2
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
2
2.5
3
150.0 200.0
187.5 250.0
225.0 300.0
262.5 350.0
300.0 400.0
3
3
3
3
3
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
3.5
4
1011_000
1011_001
1011_010
1011_011
1011_100
1011_101
Reserved
80.0 106.7
80.0 106.7
80.0 106.7
80.0 106.7
80.0 106.7
2.5
2.5
2.5
2.5
2.5
200.0 266.6
200.0 266.6
200.0 266.6
200.0 266.6
200.0 266.6
2.5
3
200.0 266.6
240.0 320.0
280.0 373.3
320.0 426.6
360.0 480.0
4
4
4
4
4
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
3.5
4
4.5
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
29
Clock Configuration Modes
Table 17. Clock Configurations for PCI Host Mode (PCI_MODCK=0)
1, 2
(continued)
4
Bus Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
PCI Clock
(MHz)
3
Mode
CPM
CPU
PCI
(MHz)
Multiplication
Multiplication
Division
Factor
5
6
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
1101_000
1101_001
1101_010
1101_011
1101_100
100.0 133.3
100.0 133.3
100.0 133.3
100.0 133.3
100.0 133.3
2.5
2.5
2.5
2.5
2.5
250.0 333.3
250.0 333.3
250.0 333.3
250.0 333.3
250.0 333.3
3
3.5
4
300.0 400.0
350.0 466.6
400.0 533.3
450.0 599.9
500.0 666.6
5
5
5
5
5
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
4.5
5
1101_101
1101_110
125.0 166.7
125.0 166.7
2
2
250.0 333.3
250.0 333.3
3
4
375.0 500.0
500.0 666.6
5
5
50.0 66.7
50.0 66.7
1110_000
1110_001
1110_010
1110_011
1110_100
100.0 133.3
100.0 133.3
100.0 133.3
100.0 133.3
100.0 133.3
3
3
3
3
3
300.0 400.0
300.0 400.0
300.0 400.0
300.0 400.0
300.0 400.0
3.5
4
350.0 466.6
400.0 533.3
450.0 599.9
500.0 666.6
550.0 733.3
6
6
6
6
6
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
4.5
5
5.5
1100_000
1100_001
1100_010
Reserved
Reserved
Reserved
1
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table entry
guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of illustration only.
Users must select a mode and input bus frequency so that the resulting configuration does not violate the frequency rating of
the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is determined by the clock mode. For
modes with a CPU multiplication factor <= 3, the minimum CPU frequency is 150 MHz for commercial temperature devices
and 175 MHz for extended temperature devices. For modes with a CPU multiplication factor >= 3.5: for Rev0.1 the minimum
CPU frequency is 250 MHz; for RevA or later the minimum CPU frequency is 150 MHz for commercial temperature devices
and 175 MHz for extended temperature devices.
2
3
4
5
6
As Table 15 shows, PCI_MODCK determines the PCI clock frequency range. Refer to Table 18 for lower configurations.
MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins.
60x and local bus frequency. Identical to CLKIN.
CPM multiplication factor = CPM clock/bus clock
CPU multiplication factor = Core PLL multiplication factor
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
30
Freescale Semiconductor
Clock Configuration Modes
1, 2
Table 18. Clock Configurations for PCI Host Mode (PCI_MODCK=1)
4
Bus Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
PCI Clock
(MHz)
3
Mode
CPM
CPU
PCI
Multiplication
Multiplication
Division
Factor
5
6
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
Default Modes (MODCK_H=0000)
0000_000
0000_001
0000_010
0000_011
0000_100
0000_101
0000_110
0000_111
60.0 100.0
50.0 100.0
60.0 120.0
60.0 120.0
60.0 120.0
50.0 100.0
50.0 100.0
50.0 100.0
2
2
120.0 200.0
100.0 200.0
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
2.5
3
150.0 250.0
150.0 300.0
180.0 360.0
210.0 420.0
240.0 480.0
150.0 300.0
175.0 350.0
200.0 400.0
4
4
6
6
6
6
6
6
30.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
2.5
2.5
2.5
3
3
3.5
4
3
3
3.5
4
3
Full Configuration Modes
0001_000
0001_001
0001_010
0001_011
50.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
3
3
3
3
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
5
6
7
8
250.0 500.0
300.0 600.0
350.0 700.0
400.0 800.0
6
6
6
6
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
0010_000
0010_001
0010_010
0010_011
50.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
4
4
4
4
200.0 400.0
200.0 400.0
200.0 400.0
200.0 400.0
5
6
7
8
250.0 500.0
300.0 600.0
350.0 700.0
400.0 800.0
8
8
8
8
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
0010_100
0010_101
0010_110
37.5 75.0
37.5 75.0
37.5 75.0
4
4
4
150.0 300.0
150.0 300.0
150.0 300.0
5
5.5
6
187.5 375.0
206.3 412.5
225.0 450.0
6
6
6
25.0 50.0
25.0 50.0
25.0 50.0
0011_000
0011_001
0011_010
0011_011
30.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
5
5
5
5
150.0 250.0
125.0 250.0
125.0 250.0
125.0 250.0
5
6
7
8
150.0 250.0
150.0 300.0
175.0 350.0
200.0 400.0
5
5
5
5
30.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
0100_000
0100_001
0100_010
Reserved
25.0 50.0
25.0 50.0
6
6
150.0 300.0
150.0 300.0
6
7
150.0 300.0
175.0 350.0
6
6
25.0 50.0
25.0 50.0
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
31
Clock Configuration Modes
Table 18. Clock Configurations for PCI Host Mode (PCI_MODCK=1)
1, 2
(continued)
4
Bus Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
PCI Clock
(MHz)
3
Mode
CPM
CPU
PCI
(MHz)
Multiplication
Multiplication
Division
Factor
5
6
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
0100_011
25.0 50.0
6
150.0 300.0
8
200.0 400.0
6
25.0 50.0
0101_000
0101_001
0101_010
0101_011
0101_100
60.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
2
2
2
2
2
120.0 200.0
100.0 200.0
100.0 200.0
100.0 200.0
100.0 200.0
2.5
3
150.0 250.0
150.0 300.0
175.0 350.0
200.0 400.0
225.0 450.0
4
4
4
4
4
30.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
3.5
4
4.5
0110_000
0110_001
0110_010
0110_011
0110_100
0110_101
0110_110
60.0 120.0
60.0 120.0
60.0 120.0
60.0 120.0
60.0 120.0
60.0 120.0
60.0 120.0
2.5
2.5
2.5
2.5
2.5
2.5
2.5
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
2.5
3
150.0 300.0
180.0 360.0
210.0 420.0
240.0 480.0
270.0 540.0
300.0 600.0
360.0 720.0
6
6
6
6
6
6
6
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
3.5
4
4.5
5
6
0111_000
0111_001
0111_010
0111_011
0111_100
Reserved
50.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
3
3
3
3
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
3
150.0 300.0
175.0 350.0
200.0 400.0
225.0 450.0
6
6
6
6
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
3.5
4
4.5
1000_000
1000_001
1000_010
1000_011
1000_100
1000_101
1000_110
Reserved
66.7 133.3
66.7 133.3
66.7 133.3
66.7 133.3
66.7 133.3
66.7 133.3
3
3
3
3
3
3
200.0 400.0
200.0 400.0
200.0 400.0
200.0 400.0
200.0 400.0
200.0 400.0
3
3.5
4
200.0 400.0
233.3 466.7
266.7 533.3
300.0 600.0
400.0 800.0
433.3 866.7
8
8
8
8
8
8
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
4.5
6
6.5
1001_000
1001_001
Reserved
Reserved
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
32
Freescale Semiconductor
Clock Configuration Modes
1, 2
Table 18. Clock Configurations for PCI Host Mode (PCI_MODCK=1)
(continued)
4
Bus Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
PCI Clock
(MHz)
3
Mode
CPM
CPU
PCI
Multiplication
Multiplication
Division
Factor
5
6
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
1001_010
1001_011
1001_100
57.1 114.3
57.1 114.3
57.1 114.3
3.5
3.5
3.5
200.0 400.0
200.0 400.0
200.0 400.0
3.5
4
200.0 400.0
228.6 457.1
257.1 514.3
8
8
8
25.0 50.0
25.0 50.0
25.0 50.0
4.5
1001_101
1001_110
1001_111
42.9 85.7
42.9 85.7
42.9 85.7
3.5
3.5
3.5
150.0 300.0
150.0 300.0
150.0 300.0
5
5.5
6
214.3 428.6
235.7 471.4
257.1 514.3
6
6
6
25.0 50.0
25.0 50.0
25.0 50.0
1010_000
1010_001
1010_010
1010_011
1010_100
75.0 150.0
75.0 150.0
75.0 150.0
75.0 150.0
75.0 150.0
2
2
2
2
2
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
2
2.5
3
150.0 300.0
187.5 375.0
225.0 450.0
262.5 525.0
300.0 600.0
6
6
6
6
6
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
3.5
4
1011_000
1011_001
1011_010
1011_011
1011_100
1011_101
Reserved
80.0 160.0
80.0 160.0
80.0 160.0
80.0 160.0
80.0 160.0
2.5
2.5
2.5
2.5
2.5
200.0 400.0
200.0 400.0
200.0 400.0
200.0 400.0
200.0 400.0
2.5
3
200.0 400.0
240.0 480.0
280.0 560.0
320.0 640.0
360.0 720.0
8
8
8
8
8
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
3.5
4
4.5
1101_000
1101_001
1101_010
1101_011
1101_100
50.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
2.5
2.5
2.5
2.5
2.5
125.0 250.0
125.0 250.0
125.0 250.0
125.0 250.0
125.0 250.0
3
3.5
4
150.0 300.0
175.0 350.0
200.0 400.0
225.0 450.0
250.0 500.0
5
5
5
5
5
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
4.5
5
1101_101
1101_110
62.5 125.0
62.5 125.0
2
2
125.0 250.0
125.0 250.0
3
4
187.5 375.0
250.0 500.0
5
5
25.0 50.0
25.0 50.0
1110_000
1110_001
50.0 100.0
50.0 100.0
3
3
150.0 300.0
150.0 300.0
3.5
4
175.0 350.0
200.0 400.0
6
6
25.0 50.0
25.0 50.0
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
33
Clock Configuration Modes
Table 18. Clock Configurations for PCI Host Mode (PCI_MODCK=1)
1, 2
(continued)
4
Bus Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
PCI Clock
(MHz)
3
Mode
CPM
CPU
PCI
(MHz)
Multiplication
Multiplication
Division
Factor
5
6
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
1110_010
1110_011
1110_100
50.0 100.0
50.0 100.0
50.0 100.0
3
3
3
150.0 300.0
150.0 300.0
150.0 300.0
4.5
5
225.0 450.0
250.0 500.0
275.0 550.0
6
6
6
25.0 50.0
25.0 50.0
25.0 50.0
5.5
1100_000
1100_001
1100_010
Reserved
Reserved
Reserved
1
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table entry
guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of illustration only.
Users must select a mode and input bus frequency so that the resulting configuration does not violate the frequency rating of
the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is determined by the clock mode. For
modes with a CPU multiplication factor <= 3, the minimum CPU frequency is 150 MHz for commercial temperature devices and
175 MHz for extended temperature devices. For modes with a CPU multiplication factor >= 3.5: for Rev0.1 the minimum CPU
frequency is 250 MHz; for RevA or later the minimum CPU frequency is 150 MHz for commercial temperature devices and 175
MHz for extended temperature devices.
2
3
4
5
6
As Table 15 shows, PCI_MODCK determines the PCI clock frequency range. Refer to Table 17 for higher configurations.
MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins.
60x and local bus frequency. Identical to CLKIN.
CPM multiplication factor = CPM clock/bus clock
CPU multiplication factor = Core PLL multiplication factor
7.3 PCI Agent Mode
Table 19 and Table 20 show configurations for PCI agent mode. The frequencies listed are for the purpose of
illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not
exceed the frequency rating of the user’s device. In addition, note the following:
NOTE: PCI_MODCK
In PCI mode only, PCI_MODCK comes from the LGPL5 pin and
MODCK_H[0–3] comes from {LGPL0, LGPL1, LGPL2, LGPL3}.
NOTE: Tval (Output Hold)
The minimum Tval = 2 ns when PCI_MODCK = 1, and the minimum Tval = 1 ns
when PCI_MODCK = 0. Therefore, designers should use clock configurations that
fit this condition to achieve PCI-compliant AC timing.
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
34
Freescale Semiconductor
Clock Configuration Modes
1, 2
Table 19. Clock Configurations for PCI Agent Mode (PCI_MODCK=0)
PCI Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
Bus Clock
(MHz)
3
Mode
CPM
CPU
Bus
Multiplication
Multiplication
Division
Factor
4
5
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
Default Modes (MODCK_H=0000
0000_000
0000_001
0000_010
0000_011
0000_100
0000_101
0000_110
0000_111
60.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
2
2
3
3
3
3
4
4
120.0 133.3
100.0 133.3
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
200.0 266.6
200.0 266.6
2.5
3
150.0 166.7
150.0 200.0
150.0 200.0
200.0 266.6
180.0 240.0
210.0 280.0
233.3 311.1
240.0 320.0
2
2
60.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
60.0 80.0
60.0 80.0
66.7 88.9
80.0 106.7
3
3
4
3
3
2.5
2.5
3
3.5
3.5
3
2.5
Full Configuration Modes
0001_001
0001_010
0001_011
0001_100
60.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
2
2
2
2
120.0 133.3
100.0 133.3
100.0 133.3
100.0 133.3
5
6
7
8
150.0 166.7
150.0 200.0
175.0 233.3
200.0 266.6
4
4
4
4
30.0 33.3
25.0 33.3
25.0 33.3
25.0 33.3
0010_001
0010_010
0010_011
0010_100
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
3
3
3
3
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
3
3.5
4
180.0 240.0
210.0 280.0
240.0 320.0
270.0 360.0
2.5
2.5
2.5
2.5
60.0 80.0
60.0 80.0
60.0 80.0
60.0 80.0
4.5
0011_000
0011_001
0011_010
0011_011
0011_100
Reserved
Reserved
Reserved
Reserved
Reserved
0100_000
0100_001
0100_010
0100_011
0100_100
Reserved
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
3
3
3
3
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
3
3.5
4
150.0 200.0
175.0 200.0
200.0 266.6
225.0 300.0
3
3
3
3
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
4.5
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
35
Clock Configuration Modes
Table 19. Clock Configurations for PCI Agent Mode (PCI_MODCK=0)
1, 2
(continued)
PCI Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
Bus Clock
(MHz)
3
Mode
CPM
CPU
Bus
Multiplication
Multiplication
Division
Factor
4
5
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
0101_000
0101_001
0101_010
0101_011
0101_100
0101_101
0101_110
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
5
5
5
5
5
5
5
250.0 333.3
250.0 333.3
250.0 333.3
250.0 333.3
250.0 333.3
250.0 333.3
250.0 333.3
2.5
3
250.0 333.3
300.0 400.0
350.0 466.6
400.0 533.3
450.0 599.9
500.0 666.6
550.0 733.3
2.5
2.5
2.5
2.5
2.5
2.5
2.5
100.0 133.3
100.0 133.3
100.0 133.3
100.0 133.3
100.0 133.3
100.0 133.3
100.0 133.3
3.5
4
4.5
5
5.5
0110_000
0110_001
0110_010
0110_011
0110_100
Reserved
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
4
4
4
4
200.0 266.6
200.0 266.6
200.0 266.6
200.0 266.6
3
3.5
4
200.0 266.6
233.3 311.1
266.7 355.5
300.0 400.0
3
3
3
3
66.7 88.9
66.7 88.9
66.7 88.9
66.7 88.9
4.5
0111_000
0111_001
0111_010
0111_011
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
3
3
3
3
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
2
2.5
3
150.0 200.0
187.5 250.0
225.0 300.0
262.5 350.0
2
2
2
2
75.0 100.0
75.0 100.0
75.0 100.0
75.0 100.0
3.5
1000_000
1000_001
1000_010
1000_011
1000_100
1000_101
Reserved
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
3
3
3
3
3
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
150.0 200.0
2.5
3
150.0 166.7
180.0 240.0
210.0 280.0
240.0 320.0
270.0 360.0
2.5
2.5
2.5
2.5
2.5
60.0 80.0
60.0 80.0
60.0 80.0
60.0 80.0
60.0 80.0
3.5
4
4.5
1001_000
1001_001
1001_010
1001_011
1001_100
Reserved
Reserved
Reserved
4
50.0 66.7
50.0 66.7
4
4
200.0 266.6
200.0 266.6
200.0 266.6
225.0 300.0
4
4
50.0 66.7
50.0 66.7
4.5
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
36
Freescale Semiconductor
Clock Configuration Modes
1, 2
Table 19. Clock Configurations for PCI Agent Mode (PCI_MODCK=0)
(continued)
PCI Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
Bus Clock
(MHz)
3
Mode
CPM
CPU
Bus
Multiplication
Multiplication
Division
Factor
4
5
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
1010_000
1010_001
1010_010
1010_011
1010_100
Reserved
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
4
4
4
4
200.0 266.6
200.0 266.6
200.0 266.6
200.0 266.6
3
3.5
4
200.0 266.6
233.3 311.1
266.7 355.5
300.0 400.0
3
3
3
3
66.7 88.9
66.7 88.9
66.7 88.9
66.7 88.9
4.5
1011_000
1011_001
1011_010
1011_011
1011_100
Reserved
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
4
4
4
4
200.0 266.6
200.0 266.6
200.0 266.6
200.0 266.6
2.5
3
200.0 266.6
240.0 320.0
280.0 373.3
320.0 426.6
2.5
2.5
2.5
2.5
80.0 106.7
80.0 106.7
80.0 106.7
80.0 106.7
3.5
4
1100_101
1100_110
1100_111
1101_000
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
6
6
6
6
300.0 400.0
300.0 400.0
300.0 400.0
300.0 400.0
4
4.5
5
400.0 533.3
450.0 599.9
500.0 666.6
550.0 733.3
3
3
3
3
100.0 133.3
100.0 133.3
100.0 133.3
100.0 133.3
5.5
1101_001
1101_010
1101_011
1101_100
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
6
6
6
6
300.0 400.0
300.0 400.0
300.0 400.0
300.0 400.0
3.5
4
420.0 559.9
480.0 639.9
540.0 719.9
600.0 799.9
2.5
2.5
2.5
2.5
120.0 160.0
120.0 160.0
120.0 160.0
120.0 160.0
4.5
5
1110_000
1110_001
1110_010
1110_011
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
5
5
5
5
250.0 333.3
250.0 333.3
250.0 333.3
250.0 333.3
2.5
3
312.5 416.6
375.0 500.0
437.5 583.3
500.0 666.6
2
2
2
2
125.0 166.7
125.0 166.7
125.0 166.7
125.0 166.7
3.5
4
1110_100
1110_101
1110_110
1110_111
50.0 66.7
50.0 66.7
50.0 66.7
50.0 66.7
5
5
5
5
250.0 333.3
250.0 333.3
250.0 333.3
250.0 333.3
4
4.5
5
333.3 444.4
375.0 500.0
416.7 555.5
458.3 611.1
3
3
3
3
83.3 111.1
83.3 111.1
83.3 111.1
83.3 111.1
5.5
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
37
Clock Configuration Modes
Table 19. Clock Configurations for PCI Agent Mode (PCI_MODCK=0)
1, 2
(continued)
PCI Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
Bus Clock
(MHz)
3
Mode
CPM
CPU
Bus
Multiplication
Multiplication
Division
Factor
4
5
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
1100_000
1100_001
1100_010
Reserved
Reserved
Reserved
1
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table entry
guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of illustration only.
Users must select a mode and input bus frequency so that the resulting configuration does not violate the frequency rating of
the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is determined by the clock mode. For
modes with a CPU multiplication factor <= 3, the minimum CPU frequency is 150 MHz for commercial temperature devices and
175 MHz for extended temperature devices. For modes with a CPU multiplication factor >= 3.5: for Rev0.1 the minimum CPU
frequency is 250 MHz; for RevA or later the minimum CPU frequency is 150 MHz for commercial temperature devices and 175
MHz for extended temperature devices.
2
3
4
5
As shown in Table 15, PCI_MODCK determines the PCI clock frequency range. Refer to Table 20 for lower configurations.
MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins.
CPM multiplication factor = CPM clock/PCI clock
CPU multiplication factor = Core PLL multiplication factor
1, 2
Table 20. Clock Configurations for PCI Agent Mode (PCI_MODCK=1)
PCI Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
Bus Clock
(MHz)
3
Mode
CPM
CPU
Bus
Multiplication
Multiplication
Division
Factor
4
5
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
Default Modes (MODCK_H=0000)
0000_000
0000_001
0000_010
0000_011
0000_100
0000_101
0000_110
0000_111
30.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
4
4
6
6
6
6
8
8
120.0 200.0
100.0 200.0
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
200.0 400.0
200.0 400.0
2.5
3
150.0 250.0
150.0 300.0
150.0 300.0
200.0 400.0
180.0 360.0
210.0 420.0
233.3 466.7
240.0 480.0
2
2
60.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
60.0 120.0
60.0 120.0
66.7 133.3
80.0 160.0
3
3
4
3
3
2.5
2.5
3
3.5
3.5
3
2.5
Full Configuration Modes
0001_001
0001_010
0001_011
0001_100
30.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
4
4
4
4
120.0 200.0
100.0 200.0
100.0 200.0
100.0 200.0
5
6
7
8
150.0 250.0
150.0 300.0
175.0 350.0
200.0 400.0
4
4
4
4
30.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
38
Freescale Semiconductor
Clock Configuration Modes
1, 2
Table 20. Clock Configurations for PCI Agent Mode (PCI_MODCK=1)
(continued)
PCI Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
Bus Clock
(MHz)
3
Mode
CPM
CPU
Bus
Multiplication
Multiplication
Division
Factor
4
5
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
0010_001
0010_010
0010_011
0010_100
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
6
6
6
6
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
3
3.5
4
180.0 360.0
210.0 420.0
240.0 480.0
270.0 540.0
2.5
2.5
2.5
2.5
60.0 120.0
60.0 120.0
60.0 120.0
60.0 120.0
4.5
0011_000
0011_001
0011_010
0011_011
0011_100
Reserved
37.5 50.0
32.1 50.0
28.1 50.0
25.0 50.0
4
4
4
4
150.0 200.0
128.6 200.0
112.5 200.0
100.0 200.0
3
3.5
4
150.0 200.0
150.0 233.3
150.0 266.7
150.0 300.0
3
3
3
3
50.0 66.7
42.9 66.7
37.5 66.7
33.3 66.7
4.5
0100_000
0100_001
0100_010
0100_011
0100_100
Reserved
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
6
6
6
6
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
3
3.5
4
150.0 300.0
175.0 350.0
200.0 400.0
225.0 450.0
3
3
3
3
50.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
4.5
0101_000
0101_001
0101_010
0101_011
0101_100
0101_101
0101_110
30.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
5
5
5
5
5
5
5
150.0 250.0
125.0 250.0
125.0 250.0
125.0 250.0
125.0 250.0
125.0 250.0
125.0 250.0
2.5
3
150.0 250.0
150.0 300.0
175.0 350.0
200.0 400.0
225.0 450.0
250.0 500.0
275.0 550.0
2.5
2.5
2.5
2.5
2.5
2.5
2.5
60.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
50.0 100.0
3.5
4
4.5
5
5.5
0110_000
0110_001
0110_010
0110_011
0110_100
Reserved
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
8
8
8
8
200.0 400.0
200.0 400.0
200.0 400.0
200.0 400.0
3
3.5
4
200.0 400.0
233.3 466.7
266.7 533.3
300.0 600.0
3
3
3
3
66.7 133.3
66.7 133.3
66.7 133.3
66.7 133.3
4.5
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
39
Clock Configuration Modes
Table 20. Clock Configurations for PCI Agent Mode (PCI_MODCK=1)
1, 2
(continued)
PCI Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
Bus Clock
(MHz)
3
Mode
CPM
CPU
Bus
Multiplication
Multiplication
Division
Factor
4
5
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
0111_000
0111_001
0111_010
0111_011
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
6
6
6
6
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
2
2.5
3
150.0 300.0
187.5 375.0
225.0 450.0
262.5 525.0
2
2
2
2
75.0 150.0
75.0 150.0
75.0 150.0
75.0 150.0
3.5
1000_000
1000_001
1000_010
1000_011
1000_100
1000_101
Reserved
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
6
6
6
6
6
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
2.5
3
150.0 300.0
180.0 360.0
210.0 420.0
240.0 480.0
270.0 540.0
2.5
2.5
2.5
2.5
2.5
60.0 120.0
60.0 120.0
60.0 120.0
60.0 120.0
60.0 120.0
3.5
4
4.5
1001_000
1001_001
1001_010
1001_011
1001_100
Reserved
Reserved
Reserved
4
25.0 50.0
25.0 50.0
8
8
200.0 400.0
200.0 400.0
200.0 400.0
225.0 450.0
4
4
50.0 100.0
50.0 100.0
4.5
1010_000
1010_001
1010_010
1010_011
1010_100
Reserved
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
8
8
8
8
200.0 400.0
200.0 400.0
200.0 400.0
200.0 400.0
3
3.5
4
200.0 400.0
233.3 466.7
266.7 533.3
300.0 600.0
3
3
3
3
66.7 133.3
66.7 133.3
66.7 133.3
66.7 133.3
4.5
1011_000
1011_001
1011_010
1011_011
1011_100
Reserved
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
8
8
8
8
200.0 400.0
200.0 400.0
200.0 400.0
200.0 400.0
2.5
3
200.0 400.0
240.0 480.0
280.0 560.0
320.0 640.0
2.5
2.5
2.5
2.5
80.0 160.0
80.0 160.0
80.0 160.0
80.0 160.0
3.5
4
1100_101
1100_110
25.0 50.0
25.0 50.0
6
6
150.0 300.0
150.0 300.0
4
200.0 400.0
225.0 450.0
3
3
50.0 100.0
50.0 100.0
4.5
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
40
Freescale Semiconductor
Clock Configuration Modes
1, 2
Table 20. Clock Configurations for PCI Agent Mode (PCI_MODCK=1)
(continued)
PCI Clock
(MHz)
CPM Clock
(MHz)
CPU Clock
(MHz)
Bus Clock
(MHz)
3
Mode
CPM
CPU
Bus
Multiplication
Multiplication
Division
Factor
4
5
MODCK_H-
MODCK[1-3]
Factor
Factor
Low High
Low High
Low High
Low High
1100_111
1101_000
25.0 50.0
25.0 50.0
6
6
150.0 300.0
150.0 300.0
5
250.0 500.0
275.0 550.0
3
3
50.0 100.0
50.0 100.0
5.5
1101_001
1101_010
1101_011
1101_100
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
6
6
6
6
150.0 300.0
150.0 300.0
150.0 300.0
150.0 300.0
3.5
4
210.0 420.0
240.0 480.0
270.0 540.0
300.0 600.0
2.5
2.5
2.5
2.5
60.0 120.0
60.0 120.0
60.0 120.0
60.0 120.0
4.5
5
1110_000
1110_001
1110_010
1110_011
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
5
5
5
5
125.0 250.0
125.0 250.0
125.0 250.0
125.0 250.0
2.5
3
156.3 312.5
187.5 375.0
218.8 437.5
250.0 500.0
2
2
2
2
62.5 125.0
62.5 125.0
62.5 125.0
62.5 125.0
3.5
4
1110_100
1110_101
1110_110
1110_111
25.0 50.0
25.0 50.0
25.0 50.0
25.0 50.0
5
5
5
5
125.0 250.0
125.0 250.0
125.0 250.0
125.0 250.0
4
4.5
5
166.7 333.3
187.5 375.0
208.3 416.7
229.2 458.3
3
3
3
3
41.7 83.3
41.7 83.3
41.7 83.3
41.7 83.3
5.5
1100_000
1100_001
1100_010
Reserved
Reserved
Reserved
1
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table entry
guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of illustration only.
Users must select a mode and input bus frequency so that the resulting configuration does not violate the frequency rating of
the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is determined by the clock mode. For
modes with a CPU multiplication factor <= 3, the minimum CPU frequency is 150 MHz for commercial temperature devices
and 175 MHz for extended temperature devices. For modes with a CPU multiplication factor >= 3.5: for Rev0.1 the minimum
CPU frequency is 250 MHz; for RevA or later the minimum CPU frequency is 150 MHz for commercial temperature devices
and 175 MHz for extended temperature devices.
2
3
4
5
As shown in Table 15, PCI_MODCK determines the PCI clock range. Refer to Table 19 for higher range configurations.
MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins.
CPM multiplication factor = CPM clock/PCI clock
CPU multiplication factor = Core PLL multiplication factor
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
41
Pinout
8 Pinout
This section provides the pin assignments and pinout lists for both HiP7 PowerQUICC II packages.
8.1 ZU and VV Packages—MPC8280 and MPC8270
The following figures and table represent the standard 480 TBGA package. For information on the alternate
package, refer to Section 8.2, “VR and ZQ Packages—MPC8275 and MPC8270,” on page -57.
Figure 13 shows the pinout of the ZU and VV packages as viewed from the top surface.
1
2
3
4
5 6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
A
B
A
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
K
K
L
L
M
N
M
N
P
P
R
R
T
T
U
U
V
V
W
Y
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AA
AB
AC
AD
AE
AF
AG
AH
AJ
1
2
3
4
5 6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
Not to Scale
Figure 13. Pinout of the 480 TBGA Package (View from Top)
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
42
Freescale Semiconductor
Pinout
Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
View
Pressure Sensitive
Copper Heat Spreader
(Oxidized for Insulation)
Adhesive
Etched
Cavity
Die
Attach
Polymide Tape
Die
Glob-Top Filled Area
Soldermask
Glob-Top Dam
Copper Traces
1.27 mm Pitch
Wire Bonds
Figure 14. Side View of the TBGA Package
Table 21 shows the pinout list of the MPC8280 and MPC8270. Table 22 defines conventions and acronyms used in
Table 21.
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
BR
BG
W5
F4
E2
E3
G1
H5
H2
H1
J5
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
J4
A6
J3
A7
J2
A8
J1
A9
K4
K3
K2
K1
L5
L4
L3
L2
A10
A11
A12
A13
A14
A15
A16
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
43
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
A17
L1
M5
N5
N4
N3
N2
N1
P4
P3
P2
P1
R1
R3
R5
R4
F1
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
TT0
TT1
G4
G3
G2
F2
TT2
TT3
TT4
TBST
TSIZ0
TSIZ1
TSIZ2
TSIZ3
AACK
ARTRY
DBG
D3
C1
E4
D2
F5
F3
E1
V1
V2
B20
A18
A16
A13
DBB/IRQ3
D0
D1
D2
D3
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
44
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
D4
E12
D9
D5
D6
A6
D7
B5
D8
A20
E17
B15
B13
A11
E9
D9
D10
D11
D12
D13
D14
D15
D16
D17
D18
D19
D20
D21
D22
D23
D24
D25
D26
D27
D28
D29
D30
D31
D32
D33
D34
D35
D36
B7
B4
D19
D17
D15
C13
B11
A8
A5
C5
C19
C17
C15
D13
C11
B8
A4
E6
E18
B17
A15
A12
D11
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
45
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
D37
C8
E7
D38
D39
D40
D41
D42
D43
D44
D45
D46
D47
D48
D49
D50
D51
D52
D53
D54
D55
D56
D57
D58
D59
D60
D61
D62
D63
A3
D18
A17
A14
B12
A10
D8
B6
C4
C18
E16
B14
C12
B10
A7
C6
D5
B18
B16
E14
D12
C10
E8
D6
C2
DP0/RSRV/EXT_BR2
B22
A22
E21
D21
C21
B21
IRQ1/DP1/EXT_BG2
IRQ2/DP2/TLBISYNC/EXT_DBG2
IRQ3/DP3/CKSTP_OUT/EXT_BR3
IRQ4/DP4/CORE_SRESET/EXT_BG3
IRQ5/CINT/DP5/TBEN/EXT_DBG3
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
46
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
IRQ6/DP6/CSE0
MPC8280 only
A21
E20
V3
IRQ7/DP7/CSE1
PSDVAL
TA
C22
V5
TEA
GBL/IRQ1
W1
U2
CI/BADDR29/IRQ2
WT/BADDR30/IRQ3
U3
L2_HIT/IRQ4
Y4
CPU_BG/BADDR31/IRQ5/CINT
U4
CPU_DBG
R2
CPU_BR
Y3
CS0
F25
C29
E27
E28
F26
F27
F28
G25
D29
E29
F29
G28
T5
CS1
CS2
CS3
CS4
CS5
CS6
CS7
CS8
CS9
CS10/BCTL1
CS11/AP0
BADDR27
BADDR28
U1
ALE
T2
BCTL0
A27
C25
E24
D24
C24
B26
PWE0/PSDDQM0/PBS0
PWE1/PSDDQM1/PBS1
PWE2/PSDDQM2/PBS2
PWE3/PSDDQM3/PBS3
PWE4/PSDDQM4/PBS4
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
47
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
PWE5/PSDDQM5/PBS5
MPC8280 only
A26
B25
A25
E23
B24
A24
B23
A23
D22
H28
H27
H26
G29
D27
C28
E26
D25
C26
B27
D28
N27
T29
R27
R26
R29
R28
W29
P28
N26
AA27
P29
AA26
N25
PWE6/PSDDQM6/PBS6
PWE7/PSDDQM7/PBS7
PSDA10/PGPL0
PSDWE/PGPL1
POE/PSDRAS/PGPL2
PSDCAS/PGPL3
PGTA/PUPMWAIT/PGPL4/PPBS
PSDAMUX/PGPL5
LWE0/LSDDQM0/LBS0/PCI_CFG0
LWE1/LSDDQM1/LBS1/PCI_CFG1
LWE2/LSDDQM2/LBS2/PCI_CFG2
LWE3/LSDDQM3/LBS3/PCI_CFG3
LSDA10/LGPL0/PCI_MODCKH0
LSDWE/LGPL1/PCI_MODCKH1
LOE/LSDRAS/LGPL2/PCI_MODCKH2
LSDCAS/LGPL3/PCI_MODCKH3
LGTA/LUPMWAIT/LGPL4/LPBS
LGPL5/LSDAMUX/PCI_MODCK
LWR
L_A14/PAR
L_A15/FRAME/SMI
L_A16/TRDY
L_A17/IRDY/CKSTP_OUT
L_A18/STOP
L_A19/DEVSEL
L_A20/IDSEL
L_A21/PERR
L_A22/SERR
L_A23/REQ0
L_A24/REQ1/HSEJSW
L_A25/GNT0
L_A26/GNT1/HSLED
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
48
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
L_A27/GNT2/HSENUM
MPC8280 only
AA25
AB29
AB28
P25
AB27
H29
J29
L_A28/RST/CORE_SRESET
L_A29/INTA
L_A30/REQ2
L_A31/DLLOUT
LCL_D0/AD0
LCL_D1/AD1
LCL_D2/AD2
J28
LCL_D3/AD3
J27
LCL_D4/AD4
J26
LCL_D5/AD5
J25
LCL_D6/AD6
K25
L29
LCL_D7/AD7
LCL_D8/AD8
L27
LCL_D9/AD9
L26
LCL_D10/AD10
LCL_D11/AD11
LCL_D12/AD12
LCL_D13/AD13
LCL_D14/AD14
LCL_D15/AD15
LCL_D16/AD16
LCL_D17/AD17
LCL_D18/AD18
LCL_D19/AD19
LCL_D20/AD20
LCL_D21/AD21
LCL_D22/AD22
LCL_D23/AD23
LCL_D24/AD24
LCL_D25/AD25
LCL_D26/AD26
LCL_D27/AD27
L25
M29
M28
M27
M26
N29
T25
U27
U26
U25
V29
V28
V27
V26
W27
W26
W25
Y29
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
49
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
LCL_D28/AD28
MPC8280 only
Y28
Y25
AA29
AA28
L28
N28
T28
W28
T1
LCL_D29/AD29
LCL_D30/AD30
LCL_D31/AD31
LCL_DP0/C0/BE0
LCL_DP1/C1/BE1
LCL_DP2/C2/BE2
LCL_DP3/C3/BE3
IRQ0/NMI_OUT
IRQ7/INT_OUT/APE
D1
1
TRST
AH3
AG5
AJ3
AE6
AF5
AB4
AG6
AH5
AF6
AA3
AJ4
W2
TCK
TMS
TDI
TDO
TRIS
1
PORESET
HRESET
SRESET
QREQ
RSTCONF
MODCK1/AP1/TC0/BNKSEL0
MODCK2/AP2/TC1/BNKSEL1
MODCK3/AP3/TC2/BNKSEL2
CLKIN1
W3
W4
AH4
2
PA0/RESTART1/DREQ3
PA1/REJECT1/DONE3
PA2/CLK20/DACK3
PA3/CLK19/DACK4/L1RXD1A2
PA4/REJECT2/DONE4
PA5/RESTART2/DREQ4
FCC2_UTM_TXADDR2
AC29
AC25
AE28
2
2
2
FCC2_UTM_TXADDR1
FCC2_UTM_TXADDR0
FCC2_UTM_RXADDR0
FCC2_UTM_RXADDR1
AG29
AG28
AG26
2
2
FCC2_UTM_RXADDR2/FCC1_UT_RX
PRTY
2
2
PA6/FCC2_RXADDR3
L1RSYNCA1
AE24
PA7/SMSYN2/FCC2_TXADDR3
L1TSYNCA1/L1GNTA1
AH25
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
50
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
L1RXD0A1/L1RXDA1
2
2
PA8/SMRXD2/FCC2_TXADDR4
PA9/SMTXD2
AF23
L1TXD0A1
AH23
AE22
AH22
2
2
PA10/MSNUM5
FCC1_UT8_RXD0/FCC1_UT16_RXD8
FCC1_UT8_RXD1/FCC1_UT16_RXD9
PA11/MSNUM4
2
PA12/MSNUM3
FCC1_UT8_RXD2/
FCC1_UT16_RXD10
AJ21
2
PA13/MSNUM2
FCC1_UT8_RXD3/
FCC1_UT16_RXD11
AH20
AG19
2
PA14/FCC1_MII_HDLC_RXD3
PA15/FCC1_MII_HDLC_RXD2
FCC1_UT8_RXD4/
FCC1_UT16_RXD12
2
2
2
FCC1_UT8_RXD5/
FCC1_UT16_RXD13
AF18
AF17
AE16
PA16/FCC1_MII_HDLC_RXD1/
FCCI_RMII_RXD1
FCC1_UT8_RXD6/
FCC1_UT16_RXD14
PA17/FCC1_MII_HDLC_RXD0/
FCC1_MII_TRAN_RXD/
FCCI_RMII_RXD0
FCC1_UT8_RXD7/
FCC1_UT16_RXD15
2
PA18/FCC1_MII_HDLC_TXD0/
FCC1_MII_TRAN_TXD/
FCC1_UT8_TXD7/FCC1_UT16_TXD15
FCC1_UT8_TXD6/FCC1_UT16_TXD14
AJ16
FCC1_RMII_TXD0
2
PA19/FCC1_MII_HDLC_TXD1/
FCC1_RMII_TXD1
AG15
2
PA20/FCC1_MII_HDLC_TXD2
PA21/FCC1_MII_HDLC_TXD3
PA22
FCC1_UT8_TXD5/FCC1_UT16_TXD13
FCC1_UT8_TXD4/FCC1_UT16_TXD12
FCC1_UT8_TXD3/FCC1_UT16_TXD11
FCC1_UT8_TXD2/FCC1_UT16_TXD10
FCC1_UT8_TXD1/FCC1_UT16_TXD9
FCC1_UT8_TXD0/FCC1_UT16_TXD8
AJ13
AE13
AF12
2
2
2
PA23
AG11
2
PA24/MSNUM1
AH9
2
PA25/MSNUM0
AJ8
2
PA26/FCC1_RMII_RX_ER
FCC1_UTM_RXCLAV/
FCC1_UTS_RXCLAV
AH7
2
2
PA27/FCC1_MII_RX_DV/
FCC1_RMII_CRS_DV
FCC1_UT_RXSOC
AF7
PA28/FCC1_MII_TX_EN/
FCC1_RMII_TX_EN
FCC1_UTM_RXENB/
FCC1_UTS_RXENB
AD5
2
PA29/FCC1_MII_TX_ER
FCC1_UT_TXSOC
AF1
AD3
2
2
PA30/FCC1_MII_CRS/FCC1_RTS
FCC1_UTM_TXCLAV/
FCC1_UTS_TXCLAV
PA31/FCC1_MII_COL
FCC1_UTM_TXENB/
FCC1_UTS_TXENB
AB5
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
51
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
FCC2_UT8_RXD0
2
2
2
PB4/FCC3_MII_HDLC_TXD3/
L1RSYNCA2/FCC3_RTS
AD28
AD26
AD25
PB5/FCC3_MII_HDLC_TXD2/
L1TSYNCA2/L1GNTA2
FCC2_UT8_RXD1
FCC2_UT8_RXD2
PB6/FCC3_MII_HDLC_TXD1/
FCC3_RMII_TXD1/
L1RXDA2/L1RXD0A2
2
2
2
PB7/FCC3_MII_HDLC_TXD0/
FCC3_RMII_TXD0/
FCC3_TXD/L1TXDA2/L1TXD0A2
FCC2_UT8_RXD3
AE26
PB8/FCC3_MII_HDLC_RXD0/
FCC3_RMII_RXD0/
FCC3_RXD/TXD3
FCC2_UT8_TXD3/L1RSYNCD1
AH27
PB9/FCC3_MII_HDLC_RXD1/
FCC3_RMII_RXD1/L1TXD2A2
FCC2_UT8_TXD2/L1TSYNCD1/
L1GNTD1
AG24
2
PB10/FCC3_MII_HDLC_RXD2
PB11/FCC3_MII_HDLC_RXD3
PB12/FCC3_MII_CRS/TXD2
PB13/FCC3_MII_COL/L1TXD1A2
FCC2_UT8_TXD1/L1RXDD1
FCC2_UT8_TXD0/L1TXDD1
L1CLKOB1/L1RSYNCC1
AH24
2
AJ24
2
2
2
AG22
AH21
AG20
L1RQB1/L1TSYNCC1/L1GNTC1
PB14/FCC3_MII_RMII_TX_EN//RXD3 L1RXDC1
PB15/FCC3_MII_TX_ER/RXD2 L1TXDC1
PB16/FCC3_MII_RMII_RX_ER/CLK18 L1CLKOA1
2
AF19
2
AJ18
AJ17
2
PB17/FCC3_MII_RX_DV/CLK17/
FCC3_RMII_CRS_DV
L1RQA1
2
PB18/FCC2_MII_HDLC_RXD3/
L1CLKOD2/L1RXD2A2
FCC2_UT8_RXD4
FCC2_UT8_RXD5
FCC2_UT8_RXD6/L1TXD1A1
AE14
AF13
2
PB19FCC2_MII_HDLC_RXD2/
L1RQD2/L1RXD3A2
2
PB20/FCC2_MII_HDLC_RMII_RXD1/
L1RSYNCD2
AG12
2
PB21//FCC2_MII_HDLC_RMII_RXD0/ FCC2_UT8_RXD7/L1TXD2A1
FCC2_TRAN_RXD/L1TSYNCD2/
L1GNTD2
AH11
AH16
AE15
2
2
PB22/FCC2_MII_HDLC_TXD0/
FCC2_TXD/FCC2_RMII_TXD0/
L1RXDD2
FCC2_UT8_TXD7/L1RXD1A1
FCC2_UT8_TXD6/L1RXD2A1
FCC2_UT8_TXD5/L1RXD3A1
PB23/FCC2_MII_HDLC_TXD1/
L1RXD2A1/L1TXDD2/
FCC2_RMII_TXD1
2
PB24/FCC2_MII_HDLC_TXD2/
L1RSYNCC2
AJ9
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
52
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
2
PB25/FCC2_MII_HDLC_TXD3/
L1TSYNCC2/L1GNTC2
FCC2_UT8_TXD4/L1TXD3A1
AE9
2
PB26/FCC2_MII_CRS/L1RXDC2
PB27/FCC2_MII_COL/L1TXDC2
FCC2_UT8_TXD1
FCC2_UT8_TXD0
AJ7
2
AH6
AE3
2
PB28/FCC2_MII_RX_ER/
FCC2_RMII_RX_ER/FCC2_RTS/
L1TSYNCB2/L1GNTB2/TXD1
2
2
2
PB29/L1RSYNCB2/FCC2_MII_TX_EN/ FCC2_UTM_RXCLAV/
AE2
AC5
AC4
FCC2_RMII_TX_EN
FCC2_UTS_RXCLAV
PB30/FCC2_MII_RX_DV/
FCC2_UT_TXSOC
FCC2_RMII_CRS_DV/L1RXDB2
PB31/FCC2_MII_TX_ER/L1TXDB2
FCC2_UT_RXSOC
2
PC0/DREQ1/BRGO7/SMSYN2/
L1CLKOA2
AB26
2
2
2
PC1/DREQ2/BRGO6/L1RQA2/ SPISEL
PC2/FCC3_CD/DONE2
AD29
AE29
AE27
FCC2_UT8_TXD3
FCC2_UT8_TXD2
PC3/FCC3_CTS/DACK2/CTS4/
USB_RP
2
2
PC4/SI2_L1ST4/FCC2_CD
PC5/SI2_L1ST3/FCC2_CTS
PC6/FCC1_CD
FCC2_UTM_RXENB/
FCC2_UTS_RXENB
AF27
AF24
FCC2_UTM_TXCLAV/
FCC2_UTS_TXCLAV
2
2
2
L1CLKOC1/FCC1_UTM_RXADDR2/
FCC1_UTS_RXADDR2/
FCC1_UTM_RXCLAV1
AJ26
PC7/FCC1_CTS
L1RQC1/FCC1_UTM_TXADDR2/
FCC1_UTS_TXADDR2/
FCC1_UTM_TXCLAV1
AJ25
PC8/CD4/RENA4/SI2_L1ST2/CTS3/
USBRN
FCC1_UT16_TXD0
FCC1_UT16_TXD1
AF22
AE21
AF20
2
2
PC9/CTS4/CLSN4/SI2_L1ST1/
L1TSYNCA2/L1GNTA2/USB_RP
PC10/CD3/RENA3
FCC1_UT16_TXD2/SI1_L1ST4/
FCC2_UT8_RXD3
2
2
PC11/CTS3/CLSN3/L1TXD3A2
PC12/CD2/RENA2
L1CLKOD1/FCC2_UT8_RXD2
AE19
AE18
SI1_L1ST3/FCC1_UTM_RXADDR1/
FCC1_UTS_RXADDR1
2
PC13/CTS2/CLSN2
L1RQD1/FCC1_UTM_TXADDR1/
FCC1_UTS_TXADDR1
AH18
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
53
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
PC14/CD1/RENA1
MPC8280 only
2
2
FCC1_UTM_RXADDR0/
FCC1_UTS_RXADDR0
AH17
PC15/CTS1/CLSN1/SMTXD2
FCC1_UTM_TXADDR0/
FCC1_UTS_TXADDR0
AG16
2
PC16/CLK16/TIN4
AF15
2
PC17/CLK15/TIN3/BRGO8
PC18/CLK14/TGATE2
AJ15
2
AH14
AG13
AH12
2
2
PC19/CLK13/BRGO7/SPICLK
PC20/CLK12/TGATE1/USB_OE
PC21/CLK11/BRGO6
2
AJ11
2
PC22/CLK10/DONE1/FCC1_UT_TXPRTY
PC23/CLK9/BRGO5/DACK1
PC24/CLK8/TOUT4
AG10
2
AE10
2
FCC2_UT8_TXD3
FCC2_UT8_TXD2
AF9
AE8
2
PC25/CLK7/BRGO4
2
PC26/CLK6/TOUT3/TMCLK
AJ6
2
PC27/FCC3_TXD/FCC3_MII_TXD0/
FCC3_RMII_TXD0/CLK5/BRGO3
AG2
2
PC28/CLK4/TIN1/TOUT2/CTS2/CLSN2/
FCC2_RXADDR4
AF3
2
2
2
PC29/CLK3/TIN2/BRGO2/CTS1/CLSN1
PC30/CLK2/TOUT1
AF2
AE1
FCC2_UT8_TXD3
PC31/CLK1/BRGO1
AD1
AC28
AD27
2
2
PD4/BRGO8/FCC3_RTS/SMRXD2
PD5/DONE1
L1TSYNCD1/L1GNTD1
FCC1_UT16_TXD3
FCC1_UT16_TXD4
2
PD6/DACK1
AF29
AF28
2
PD7/SMSYN1/FCC1_TXCLAV2
FCC1_UTM_TXADDR3/
FCC1_UTS_TXADDR3/
FCC2_UTM_TXADDR4
FCC2_UTS_TXADDR1
2
PD8/SMRXD1/BRGO5
PD9/SMTXD1/BRGO3
PD10/L1CLKOB2/BRGO4
PD11/L1RQB2
FCC2_UT_TXPRTY
AG25
AH26
2
FCC2_UT_RXPRTY
2
FCC2_UT8_RXD1/L1RSYNCB1
AJ27
AJ23
2
FCC2_UT8_RXD0/L1TSYNCB1/
L1GNTB1
2
PD12
PD13
SI1_L1ST2/L1RXDB1
SI1_L1ST1/L1TXDB1
AG23
2
AJ22
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
54
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
FCC1_UT16_RXD0
2
PD14/L1CLKOC2/I2CSCL
PD15/L1RQC2/I2CSDA
PD16/SPIMISO
AE20
2
FCC1_UT16_RXD1
AJ20
2
FCC1_UT_TXPRTY/L1TSYNCC1/
L1GNTC1
AG18
2
PD17/BRGO2/SPIMOSI
PD18/SPICLK
FCC1_UT_RXPRTY
AG17
2
2
FCC1_UTM_RXADDR4/
FCC1_UTS_RXADDR4/
FCC1_UTM_RXCLAV3/
FCC2_UTM_RXADDR3/
FCC2_UTS_RXADDR0
AF16
PD19/SPISEL/BRGO1
FCC1_UTM_TXADDR4/
FCC1_UTS_TXADDR4/
FCC1_UTM_TXCLAV3/
FCC2_UTM_TXADDR3/
FCC2_UTS_TXADDR0
AH15
2
PD20/RTS4/TENA4/L1RSYNCA2/
USB_TP
FCC1_UT16_RXD2
FCC1_UT16_RXD3
FCC1_UT16_TXD5
AJ14
2
PD21/TXD4/L1RXD0A2/L1RXDA2/
USB_TN
AH13
2
2
PD22/RXD4L1TXD0A2/L1TXDA2/
USB_RXD
AJ12
PD23/RTS3/TENA3
PD24/TXD3
FCC1_UT16_RXD4/L1RSYNCD1
FCC1_UT16_RXD5/L1RXDD1
FCC1_UT16_TXD6/L1TXDD1
FCC1_UT16_RXD6/L1RSYNCC1
FCC1_UT16_RXD7/L1RXDC1
FCC1_UT16_TXD7/L1TXDC1
AE12
AF10
2
2
PD25/RXD3
AG9
AH8
AG7
2
PD26/RTS2/TENA2
PD27/TXD2
2
2
PD28/RXD2
AE4
2
PD29/RTS1/TENA1
FCC1_UTM_RXADDR3/
FCC1_UTS_RXADDR3/
FCC1_UTM_RXCLAV2/
FCC2_UTM_RXADDR4/
FCC2_UTS_RXADDR1
AG1
2
2
PD30/TXD1
FCC2_UTM_TXENB/
FCC2_UTS_TXENB
AD4
AD2
PD31/RXD1
VCCSYN
VCCSYN1
CLKIN2
AB3
B9
AE11
U5
3
SPARE4
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
55
Pinout
Table 21. MPC8280 and MPC8270 (ZU and VV Packages) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
4
PCI_MODE
AF25
V4
3
SPARE6
5
No connect
I/O power
AA1, AG4
AG21, AG14, AG8, AJ1, AJ2,
AH1, AH2, AG3, AF4, AE5, AC27,
Y27, T27, P27, K26, G27, AE25,
AF26, AG27, AH28, AH29, AJ28,
AJ29, C7, C14, C16, C20, C23,
E10, A28, A29, B28, B29, C27,
D26, E25, H3, M4, T3, AA4, A1,
A2, B1, B2, C3, D4, E5
Core power
Ground
U28, U29, K28, K29, A9, A19,
B19, M1, M2, Y1, Y2, AC1, AC2,
AH19, AJ19, AH10, AJ10, AJ5
6
7
AA5, AB1 , AB2 , AF21, AF14,
AF8, AE7, AF11, AE17, AE23,
AC26, AB25, Y26, V25, T26, R25,
P26, M25, K27, H25, G26, D7,
D10, D14, D16, D20, D23, C9,
E11, E13, E15, E19, E22, B3, G5,
H4, K5, M3, P5, T4, Y5, AA2, AC3
1
2
Should be tied to VDDH via a 2K Ω external pull-up resistor.
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
3
4
5
6
Must be pulled down or left floating.
If PCI is not desired, must be pulled up or left floating.
Sphere is not connected to die.
GNDSYN (AB1): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate
ground signal on the MPC8280. New designs must connect AB1 to GND and follow the suggestions in Section 4.6,
“Layout Practices.” Old designs in which the MPC8280 is used as a drop-in replacement can leave the pin connected
to GND with the noise filtering capacitors.
7
XFC (AB2) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8280 because there is no need for
external capacitor to operate the PLL. New designs should connect AB2 (XFC) pin to GND. Old designs in which the
MPC8280 is used as a drop-in replacement can leave the pin connected to the current capacitor.
Symbols used in Table 21 are described in Table 22.
Table 22. Symbol Legend
Symbol
OVERBAR
Meaning
Signals with overbars, such as TA, are active low.
UTM
UTS
Indicates that a signal is part of the UTOPIA master interface.
Indicates that a signal is part of the UTOPIA slave interface.
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
56
Freescale Semiconductor
Pinout
Table 22. Symbol Legend (continued)
Meaning
Symbol
UT8
UT16
MII
Indicates that a signal is part of the 8-bit UTOPIA interface.
Indicates that a signal is part of the 16-bit UTOPIA interface.
Indicates that a signal is part of the media independent interface.
Indicates that a signal is part of the reduced media independent interface.
RMII
8.2 VR and ZQ Packages—MPC8275 and MPC8270
The following figures and table represent the alternate 516 PBGA package. For information on the standard package
for the MPC8280 and the MPC8270, refer to Section 8.1, “ZU and VV Packages—MPC8280 and MPC8270,” on
page -42.
Figure 15 shows the pinout of the VR and ZQ packages as viewed from the top surface.
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
57
Pinout
1
2
3
4
5 6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
A
B
A
B
C
C
D
D
E
E
F
F
G
G
H
H
J
J
K
K
L
L
M
N
M
N
P
P
R
R
T
T
U
U
V
V
W
Y
W
Y
AA
AB
AC
AD
AE
AF
AA
AB
AC
AD
AE
AF
1
2
3
4
5 6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
Not to Scale
Figure 15. Pinout of the 516 PBGA Package (View from Top)
Figure 16 shows the side profile of the PBGA package to indicate the direction of the top surface view.
Wire bonds
Ball bond
Die
attach
Transfer molding compound
Plated substrate via
Screen-printed
solder mask
Cu substrate traces
DIE
BT resin glass epoxy
1 mm pitch
Figure 16. Side View of the PBGA Package Remove
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
58
Freescale Semiconductor
Pinout
NOTE: Temperature Reflow for the VR Package
In the VR package, sphere composition is lead-free (refer to Table 2). This requires
higher temperature reflow than what is required for other PowerQUICC II
packages. Users should consult “Freescale PowerQUICC II™ Pb-Free Packaging
Information” (MPC8250PBFREEPKG) available at www.freescale.com.
Table 23 shows the pinout list of the MPC8275 and MPC8270. Table 22 defines conventions and acronyms used in
Table 23.
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
BR
C16
D2
C1
D1
D5
E8
C4
B4
A4
D7
D8
C6
B5
B6
C7
C8
A6
D9
F11
B7
B8
C9
A7
B9
E11
A8
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
59
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
TT0
TT1
TT2
TT3
TT4
TBST
TSIZ0
TSIZ1
TSIZ2
TSIZ3
AACK
ARTRY
DBG
DBB/IRQ3
D0
D11
B10
C11
A9
B11
C12
D12
A10
B12
B13
E7
B3
F8
A3
C3
F5
E3
E2
E1
E4
D3
C2
A14
C15
W4
Y1
D1
D2
V1
D3
P4
D4
N3
D5
K5
D6
J4
D7
G1
AB1
D8
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
60
Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
D9
U4
U2
N6
N1
L1
D10
D11
D12
D13
D14
D15
D16
D17
D18
D19
D20
D21
D22
D23
D24
D25
D26
D27
D28
D29
D30
D31
D32
D33
D34
D35
D36
D37
D38
D39
D40
D41
J5
G3
AA2
W1
T3
T1
M2
K2
J1
G4
U5
T5
P5
P3
M3
K3
H2
G5
AA1
V2
U1
P2
M4
K4
H3
F2
Y2
U3
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
61
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
D42
D43
D44
D45
D46
D47
D48
D49
D50
D51
D52
D53
D54
D55
D56
D57
D58
D59
D60
D61
D62
D63
T2
N2
M5
K1
H4
F1
W2
T4
R3
N4
M1
J2
H5
F3
V3
R5
R2
N5
L2
J3
H1
F4
DP0/RSRV/EXT_BR2
IRQ1/DP1/EXT_BG2
IRQ2/DP2/TLBISYNC/EXT_DBG2
IRQ3/DP3/CKSTP_OUT/EXT_BR3
IRQ4/DP4/CORE_SRESET/EXT_BG3
IRQ5/CINT/DP5/TBEN/EXT_DBG3
IRQ6/DP6/CSE0
AB3
W5
AC2
AA3
AD1
AC1
AB2
Y3
IRQ7/DP7/CSE1
PSDVAL
D15
Y4
TA
TEA
D16
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
62
Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
GBL/IRQ1
E15
D14
E14
A17
B14
F13
B17
AC6
AD6
AE6
AB7
AF7
AC7
AD7
AF8
AE8
AD8
AC8
AB8
C13
A12
D13
AF4
AA5
AE4
AD4
AF3
AB4
AE3
AF2
AD3
AE2
AD2
CI/BADDR29/IRQ2
WT/BADDR30/IRQ3
L2_HIT/IRQ4
CPU_BG/BADDR31/IRQ5/CINT
CPU_DBG
CPU_BR
CS0
CS1
CS2
CS3
CS4
CS5
CS6
CS7
CS8
CS9
CS10/BCTL1
CS11/AP0
BADDR27
BADDR28
ALE
BCTL0
PWE0/PSDDQM0/PBS0
PWE1/PSDDQM1/PBS1
PWE2/PSDDQM2/PBS2
PWE3/PSDDQM3/PBS3
PWE4/PSDDQM4/PBS4
PWE5/PSDDQM5/PBS5
PWE6/PSDDQM6/PBS6
PWE7/PSDDQM7/PBS7
PSDA10/PGPL0
PSDWE/PGPL1
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
63
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
POE/PSDRAS/PGPL2
PSDCAS/PGPL3
AE1
AC3
PGTA/PUPMWAIT/PGPL4/PPBS
PSDAMUX/PGPL5
W6
AA4
LWE0/LSDDQM0/LBS0/PCI_CFG0
LWE1/LSDDQM1/LBS1/PCI_CFG1
LWE2/LSDDQM2/LBS2/PCI_CFG2
LWE3/LSDDQM3/LBS3/PCI_CFG3
LSDA10/LGPL0/PCI_MODCKH0
LSDWE/LGPL1/PCI_MODCKH1
LOE/LSDRAS/LGPL2/PCI_MODCKH2
LSDCAS/LGPL3/PCI_MODCKH3
LGTA/LUPMWAIT/LGPL4/LPBS
LGPL5/LSDAMUX/PCI_MODCK
LWR
AC9
AD9
AE9
AF9
AB6
AF5
AE5
AD5
AC5
AB5
AF6
L_A14/PAR
AE13
AD15
AF16
AF15
AE15
AE14
AC17
AD14
AF13
AE20
AC14
AC19
AD13
AF21
AF22
AE21
AB14
AD20
L_A15/FRAME/SMI
L_A16/TRDY
L_A17/IRDY/CKSTP_OUT
L_A18/STOP
L_A19/DEVSEL
L_A20/IDSEL
L_A21/PERR
L_A22/SERR
L_A23/REQ0
L_A24/REQ1/HSEJSW
L_A25/GNT0
L_A26/GNT1/HSLED
L_A27/GNT2/HSENUM
L_A28/RST/CORE_SRESET
L_A29/INTA
L_A30/REQ2
L_A31/DLLOUT
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
64
Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
LCL_D0/AD0
MPC8275 only
AB9
LCL_D1/AD1
AB10
AC10
AD10
AE10
AF10
AF11
AB12
AB11
AF12
AE11
AC13
AC12
AB13
AD12
AF14
AF17
AE16
AD16
AC16
AB16
AF18
AE17
AD17
AB17
AE18
AD18
AC18
AE19
AF20
AD19
AB18
AE12
LCL_D2/AD2
LCL_D3/AD3
LCL_D4/AD4
LCL_D5/AD5
LCL_D6/AD6
LCL_D7/AD7
LCL_D8/AD8
LCL_D9/AD9
LCL_D10/AD10
LCL_D11/AD11
LCL_D12/AD12
LCL_D13/AD13
LCL_D14/AD14
LCL_D15/AD15
LCL_D16/AD16
LCL_D17/AD17
LCL_D18/AD18
LCL_D19/AD19
LCL_D20/AD20
LCL_D21/AD21
LCL_D22/AD22
LCL_D23/AD23
LCL_D24/AD24
LCL_D25/AD25
LCL_D26/AD26
LCL_D27/AD27
LCL_D28/AD28
LCL_D29/AD29
LCL_D30/AD30
LCL_D31/AD31
LCL_DP0/C0/BE0
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
65
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
LCL_DP1/C1/BE1
LCL_DP2/C2/BE2
LCL_DP3/C3/BE3
IRQ0/NMI_OUT
AA13
AC15
AF19
A11
E5
IRQ7/INT_OUT/APE
1
TRST
F22
A24
C24
A25
B24
C19
B25
D24
E23
D18
E24
B16
F16
A15
G22
TCK
TMS
TDI
TDO
TRIS
1
PORESET
HRESET
SRESET
QREQ
RSTCONF
MODCK1/AP1/TC0/BNKSEL0
MODCK2/AP2/TC1/BNKSEL1
MODCK3/AP3/TC2/BNKSEL2
CLKIN1
2
PA0/RESTART1/DREQ3
PA1/REJECT1/DONE3
PA2/CLK20/DACK3
PA3/CLK19/DACK4/L1RXD1A2
PA4/REJECT2/DONE4
PA5/RESTART2/DREQ4
PA6
FCC2_UTM_TXADDR2
AC20
AC21
2
FCC2_UTM_TXADDR1
FCC2_UTM_TXADDR0
FCC2_UTM_RXADDR0
FCC2_UTM_RXADDR1
FCC2_UTM_RXADDR2
FCC2_UT_RXADDR3
FCC2_UT_TXADDR3
FCC2_UT_TXADDR4
2
2
2
2
AF25
AE24
AA21
AD25
AC24
2
2
2
PA7/SMSYN2
AA22
AA23
PA8/SMRXD2
2
PA9/SMTXD2
Y26
W22
W23
2
PA10/MSNUM5
FCC1_UT8_RXD0/FCC1_UT16_RXD8
FCC1_UT8_RXD1/FCC1_UT16_RXD9
2
PA11/MSNUM4
2
PA12/MSNUM3
FCC1_UT8_RXD2/
FCC1_UT16_RXD10
V26
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
66
Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
PA13/MSNUM2
MPC8275 only
FCC1_UT8_RXD3/
2
2
2
2
V25
T22
T25
FCC1_UT16_RXD11
PA14/FCC1_MII_HDLC_RXD3
PA15/FCC1_MII_HDLC_RXD2
FCC1_UT8_RXD4/
FCC1_UT16_RXD12
/FCC1_UT8_RXD5/
FCC1_UT16_RXD13
PA16/FCC1_MII_HDLC_RXD1/
FCC1_RMII_RXD1
FCC1_UT8_RXD6/
FCC1_UT16_RXD14
R24
2
2
PA17/FCC_MII_HDLC_RXD0/
FCC1_MII_TRAN_RXD/
FCCI_RMII_RXD0
FCC1_UT8_RXD7/
FCC1_UT16_RXD15
P22
PA18/FCC1_MII_HDLC_TXD0/
FCC1_MIITRAN_TXD/
FCC1_RMII_TXD0
FCC1_UT8_TXD7/FCC1_UT16_TXD15
FCC1_UT8_TXD6/FCC1_UT16_TXD14
N26
2
2
PA19/FCC1_MII_HDLC_TXD1/
FCC1_RMII_TXD1
N23
PA20/FCC1_MII_HDLC_TXD2
PA21/FCC1_MII_HDLC_TXD3
PA22
FCC1_UT8_TXD5/FCC1_UT16_TXD13
FCC1_UT8_TXD4/FCC1_UT16_TXD12
FCC1_UT8_TXD3/FCC1_UT16_TXD11
FCC1_UT8_TXD2/FCC1_UT16_TXD10
FCC1_UT8_TXD1/FCC1_UT16_TXD9
FCC1_UT8_TXD0/FCC1_UT16_TXD8
K26
2
2
L23
K23
H26
2
PA23
2
PA24/MSNUM1
F25
2
PA25/MSNUM0
D26
D25
2
2
2
PA26/FCC1_MII_RMII_RX_ER/
FCC1_UTM_RXCLAV/
FCC1_UTS_RXCLAV
PA27/FCC1_MII_RX_DV/
FCC1_RMII_CRS_DV
FCC1_UT_RXSOC
C25
C22
PA28/FCC1_MII_TX_EN/
FCC1_RMII_TX_EN
FCC1_UTM_RXENB/
FCC1_UTS_RXENB
2
2
PA29/FCC1_MII_TX_ER
FCC1_UT_TXSOC
B21
A20
PA30/FCC1_MII_CRS/FCC1_RTS
FCC1_UTM_TXCLAV/
FCC1_UTS_TXCLAV
2
PA31/FCC1_MII_COL
FCC1_UTM_TXENB/
FCC1_UTS_TXENB
A19
2
2
2
PB4/FCC3_MII_HDLC_TXD3/
L1RSYNCA2/FCC3_RTS
FCC2_UT8_RXD0
FCC2_UT8_RXD1
FCC2_UT8_RXD2
AD21
AD22
AC22
PB5/FCC3_MII_HDLC_TXD2/
L1TSYNCA2/L1GNTA2
PB6/FCC3_MII_HDLC_TXD1/
FCC3_RMII_TXD1/
L1RXDA2/L1RXD0A2
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
67
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
FCC2_UT8_RXD3
2
2
2
PB7/FCC3_MII_HDLC_TXD0/
FCC3_RMII_TXD0/
AE26
AB23
FCC3_TXD/L1TXDA2/L1TXD0A2
PB8/FCC3_MII_HDLC_RXD0/
FCC3_RMII_RXD0/
FCC3_RXD/TXD3
FCC2_UT8_TXD3
FCC2_UT8_TXD2
PB9/FCC3_MII_HDLC_RXD1/
FCC3_RMII_RXD1/L1TXD2A2
AC26
2
PB10/FCC3_MII_HDLC_RXD2
PB11/FCC3_MII_HDLC_RXD3
PB12/FCC3_MII_CRS/TXD2
FCC2_UT8_TXD1
FCC2_UT8_TXD0
AB26
AA25
2
2
W26
W25
2
PB13/FCC3_MII_COL/L1TXD1A2
PB14/FCC3_MII_RMII_TX_EN/RXD3
PB15/FCC3_MII_TX_ER/RXD2
PB16/FCC3_MII_RMII_RX_ER/CLK18
2
V24
U24
R22
R23
2
2
2
PB17/FCC3_MII_RX_DV/CLK17/
FCC3_RMII_CRS_DV
2
PB18/FCC2_MII_HDLC_RXD3/
L1CLKOD2/L1RXD2A2
FCC2_UT8_RXD4
FCC2_UT8_RXD5
FCC2_UT8_RXD6
FCC2_UT8_RXD7
M23
2
PB19FCC2_MII_HDLC_RXD2/
L1RQD2/L1RXD3A2
L24
2
PB20/FCC2_MII_HDLC_RMII_RXD1/
L1RSYNCD2
K24
2
2
PB21//FCC2_MII_HDLC_RMII_RXD0/
FCC2_TRAN_RXD/L1TSYNCD2/
L1GNTD2
L21
PB22/FCC2_MII_HDLC_RMII_TXD0/
FCC2_TXD/FCC2_RMII_TXD0/
L1RXDD2
FCC2_UT8_TXD7
FCC2_UT8_TXD6
P25
2
PB23/FCC2_MII_HDLC_TXD1/
L1RXD2A1/L1TXDD2/
FCC2_RMII_TXD1
N25
2
2
PB24/FCC2_MII_HDLC_TXD2/
L1RSYNCC2
FCC2_UT8_TXD5
FCC2_UT8_TXD4
E26
PB25/FCC2_MII_HDLC_TXD3/
L1TSYNCC2/L1GNTC2
H23
2
2
2
PB26/FCC2_MII_CRS/L1RXDC2
PB27/FCC2_MII_COL/L1TXDC2
FCC2_UT8_TXD1
FCC2_UT8_TXD0
C26
B26
A22
PB28/FCC2_MII_RX_ER/FCC2_RMII_RX_ER/
FCC2_RTS/L1TSYNCB2/L1GNTB2/TXD1
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
68
Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
PB29/L1RSYNCB2/
MPC8275 only
FCC2_UTM_RXCLAV/
2
2
2
A21
E20
C20
FCC2_MII_TX_EN/FCC2_RMII_TX_EN
FCC2_UTS_RXCLAV
PB30/FCC2_MII_RX_DV/L1RXDB2/
FCC2_RMII_CRS_DV
FCC2_UT_TXSOC
PB31/FCC2_MII_TX_ER/L1TXDB2
FCC2_UT_RXSOC
2
PC0/DREQ1/BRGO7/SMSYN2/
L1CLKOA2
AE22
2
2
2
PC1/DREQ2/SPISEL/BRGO6/L1RQA2
PC2/FCC3_CD/DONE2
AA19
AF24
AE25
FCC2_UT8_TXD3
FCC2_UT8_TXD2
PC3/FCC3_CTS/DACK2/CTS4/
USB_RP
2
2
PC4/SI2_L1ST4/FCC2_CD
PC5/SI2_L1ST3/FCC2_CTS
PC6/FCC1_CD
FCC2_UTM_RXENB/
FCC2_UTS_RXENB
AB22
FCC2_UTM_TXCLAV/
FCC2_UTS_TXCLAV
AC25
2
FCC1_UTM_RXADDR2/
FCC1_UTS_RXADDR2/
FCC1_UTM_RXCLAV1
AB25
AA24
2
PC7/FCC1_CTS
FCC1_UTM_TXADDR2/
FCC1_UTS_TXADDR2/
FCC1_UTM_TXCLAV1
2
PC8/CD4/RENA4/SI2_L1ST2/CTS3/
USB_RN
FCC1_UT16_TXD0
Y24
2
PC9/CTS4/CLSN4/SI2_L1ST1/
L1TSYNCA2/L1GNTA2/USB_RP
FCC1_UT16_TXD1
U22
2
2
PC10/CD3/RENA3
FCC1_UT16_TXD2/FCC2_UT8_RXD3
FCC2_UT8_RXD2
V23
U23
PC11/CTS3/CLSN3/L1TXD3A2
PC12/CD2/RENA2
2
FCC1_UTM_RXADDR1/
FCC1_UTS_RXADDR1
T26
2
PC13/CTS2/CLSN2
FCC1_UTM_TXADDR1/
FCC1_UTS_TXADDR1
R26
P26
P24
2
2
2
PC14/CD1/RENA1
FCC1_UTM_RXADDR0/
FCC1_UTS_RXADDR0
PC15/CTS1/CLSN1/SMTXD2
FCC1_UTM_TXADDR0/
FCC1_UTS_TXADDR0
PC16/CLK16/TIN4
M26
2
PC17/CLK15/TIN3/BRGO8
PC18/CLK14/TGATE2
L26
2
M24
2
PC19/CLK13/BRGO7/SPICLK
L22
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
Freescale Semiconductor
69
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
2
PC20/CLK12/TGATE1/USB_OE
PC21/CLK11/BRGO6
K25
2
J25
2
PC22/CLK10/DONE1
FCC1_UT_TXPRTY
G26
2
2
PC23/CLK9/BRGO5/DACK1
PC24/CLK8/TOUT4
F26
FCC2_UT8_TXD3
FCC2_UT8_TXD2
G24
2
PC25/CLK7/BRGO4
E25
G23
2
PC26/CLK6/TOUT3/TMCLK
2
PC27/FCC3_TXD/FCC3_MII_TXD0/
FCC3_RMII_TXD0/CLK5/BRGO3
B23
2
2
2
2
PC28/CLK4/TIN1/TOUT2/CTS2/CLSN2
PC29/CLK3/TIN2/BRGO2/CTS1/CLSN1
PC30/CLK2/TOUT1
FCC2_UT_RXADDR4
FCC2_UT8_TXD3
E22
E21
D21
B20
PC31/CLK1/BRGO1
2
2
2
2
PD4/BRGO8/FCC3_RTS/SMRXD2
PD5/DONE1
AF23
AE23
AB21
FCC1_UT16_TXD3
FCC1_UT16_TXD4
PD6/DACK1
PD7/SMSYN1/FCC1_TXCLAV2
FCC1_UTM_TXADDR3/
FCC1_UTS_TXADDR3/
FCC2_UTM_TXADDR4
FCC2_UTS_TXADDR1
AD23
2
PD8/SMRXD1/BRGO5
PD9/SMTXD1/BRGO3
PD10/L1CLKOB2/BRGO4
PD11/L1RQB2
FCC2_UT_TXPRTY
FCC2_UT_RXPRTY
FCC2_UT8_RXD1
AD26
2
Y22
2
AB24
2
FCC2_UT8_RXD0
L1GNTB1
Y23
2
PD12
AA26
2
PD13
W24
2
PD14/L1CLKOC2/I2CSCL
PD15/L1RQC2/I2CSDA
PD16/SPIMISO
PD17/BRGO2/SPIMOSI
PD18/SPICLK
FCC1_UT16_RXD0
FCC1_UT16_RXD1
FCC1_UT_TXPRTY
FCC1_UT_RXPRTY
V22
U26
2
2
T23
2
R25
P23
2
FCC1_UTM_RXADDR4/
FCC1_UTS_RXADDR4/
FCC1_UTM_RXCLAV3/
FCC2_UTM_RXADDR3/
FCC2_UTS_RXADDR0
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
70
Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
PD19/SPISEL/BRGO1
MPC8275 only
FCC1_UTM_TXADDR4/
2
N22
FCC1_UTS_TXADDR4/
FCC1_UTM_TXCLAV3/
FCC2_UTM_TXADDR3/
FCC2_UTS_TXADDR0
2
PD20/RTS4/TENA4/L1RSYNCA2/
USB_TP
FCC1_UT16_RXD2
FCC1_UT16_RXD3
FCC1_UT16_TXD5
M25
2
PD21/TXD4/L1RXD0A2/L1RXDA2/
USB_TN
L25
J26
2
PD22/RXD4L1TXD0A2/L1TXDA2/
USB_RXD
2
PD23/RTS3/TENA3
PD24/TXD3
FCC1_UT16_RXD4
FCC1_UT16_RXD5
FCC1_UT16_TXD6
FCC1_UT16_RXD6
FCC1_UT16_RXD7
FCC1_UT16_TXD7
K22
G25
H24
2
2
PD25/RXD3
2
PD26/RTS2/TENA2
PD27/TXD2
F24
2
H22
B22
D22
2
2
PD28/RXD2
PD29/RTS1/TENA1
FCC1_UTM_RXADDR3/
FCC1_UTS_RXADDR3/
FCC1_UTM_RXCLAV2/
FCC2_UTM_RXADDR4/
FCC2_UTS_RXADDR1
2
2
PD30/TXD1
FCC2_UTM_TXENB/
FCC2_UTS_TXENB
C21
PD31/RXD1
VCCSYN
VCCSYN1
CLKIN2
E19
D19
K6
K21
3
SPARE4
C14
4
PCI_MODE
AD24
B15
3
SPARE6
5
No connect
E17, C23
I/O power
E6, F6, H6, L5, L6, P6, T6, U6, V5,
Y5, AA6, AA8, AA10, AA11, AA14,
AA16, AA17, AB19, AB20, W21,
U21, T21, P21, N21, M22, J22, H21,
F21, F19, F17, E16, F14, E13, E12,
F10, E10, E9
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
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71
Package Description
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
Core Power
L3, V4, W3, AC11, AD11, AB15,
U25, T24, J24, H25, F23, B19, D17,
C17, D10, C10
6
7
Ground
B18 , A18 , A2, B1, B2, A5, C5,
C18, D4, D6, G2, L4, P1, R1, R4,
AC4, AE7, AC23, Y25, N24, J23,
A23, D23, D20, E18, A13, A16, K10,
K11, K12, K13, K14, K15, K16, K17,
L10, L11, L12, L13, L14, L15, L16,
L17, M10, M11, M12, M13, M14,
M15, M16, M17, N10, N11, N12,
N13, N14, N15, N16, N17, P10, P11,
P12, P13, P14, P15, P16, P17, R10,
R11,R12, R13, R14, R15, R16, R17,
T10, T11, T12, T13, T14, T15, T16,
T17, U10, U11, U12, U13, U14, U15,
U16, U17
1
2
Should be tied to VDDH via a 2K Ω external pull-up resistor.
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC
current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
3
4
5
6
Must be pulled down or left floating.
If PCI is not desired, must be pulled up or left floating.
Sphere is not connected to die.
GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate ground
signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in Section 4.6, “Layout
Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to
GND with the noise filtering capacitors.
7
XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no need for
external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in which the
MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor.
9 Package Description
The following sections provide the package parameters and mechanical dimensions.
9.1 Package Parameters
Package parameters are provided in Table 24.
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Package Description
Table 24. Package Parameters
Outline
(mm)
Pitch
(mm)
Nominal Unmounted
Package
Devices
MPC8280
Type
Interconnects
Height (mm)
ZU
37.5 × 37.5
37.5 × 37.5
27 × 27
TBGA
480
1.27
1.27
1
1.55
MPC8270
VV
VR
ZQ
MPC8280
MPC8270
TBGA
PBGA
PBGA
480
516
516
1.55
2.25
2.25
MPC8275VR
MPC8270VR
MPC8275ZQ
MPC8270ZQ
27 × 27
1
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Package Description
9.2 Mechanical Dimensions
Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA (ZU/VV)
package. Refer to Table 2.
Notes:
1. Dimensions and Tolerancing per ASME
Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter, parallel to
primary data A.
4. Primary data A and the seating plane are
defined by the spherical crowns of the
solder balls.
Millimeters
Dim
Min
Max
A
1.45
0.60
0.85
0.25
0.65
1.65
A1
A2
A3
b
0.70
0.95
—
0.85
D
37.50 BSC
35.56 REF
1.27 BSC
37.50 BSC
35.56 REF
D1
e
E
E1
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
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Freescale Semiconductor
Package Description
Figure 18 provides the mechanical dimensions and bottom surface nomenclature of the 516 PBGA (VR/ZQ)
packages.
Figure 18. Mechanical Dimensions and Bottom Surface Nomenclature—516 PBGA
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
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75
Ordering Information
10 Ordering Information
Figure 19 provides an example of the Freescale part numbering nomenclature for the MPC8280. In addition to the
processor frequency, the part numbering scheme also consists of a part modifier that indicates any enhancement(s)
in the part from the original production design. Each part number also contains a revision code that refers to the die
mask revision number and is specified in the part numbering scheme for identification purposes only. For more
information, contact your local Freescale sales office.
MPC 82XX C ZU XXX X
Die Revision Level
Product Code
Device Number
Processor Frequency
(CPU/CPM/Bus)
Temperature Range
Package
Blank = 0 to 105
T
T
j
A
C = (-40) – 105
T
T
j
ZU = 480 TBGA Lead Spheres
VV = 480 TBGA Lead-Free Spheres
VR = 516 PBGA Lead-Free Spheres
ZQ = 516 PBGA Lead Spheres
A
Figure 19. Freescale Part Number Key
11 Document Revision History
Table 25. Document Revision History
Revision
Date
Substantive Changes
1.8
1.7
07/2007 • Updated the entire document, adding information on the VV package.
12/2006 • Section 6, “AC Electrical Characteristics,” removed deratings statement and clarified AC
timing descriptions.
1.6
05/2006 • Table 11: Added text to clarify that Data Bus Parity is not supported at 66 Mhz.
• Table 11: Added text to clarify that Data Bus ECC is supported at 66 Mhz
• Table 11: Added note to DP pins to show it is not supported at 66 MHz
• Table 12: Added note to support 1 ns hold time
1.5
1.4
03/2006 • Added Section 6.3, “JTAG Timings”
11/2005 • In Section 6.2, “SIU AC Characteristics”, modified the note on CLKIN Jitter and Duty Cycle.
• Modified Figure 17 to display all text.
1.3
01/2005 • Modification for correct display of assertion level (“overbar”) for some signals
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Document Revision History
Table 25. Document Revision History (continued)
Substantive Changes
Revision
Date
1.2
12/2004 • Section 2: removed voltage tracking note
• Table 3: Note 2 updated regarding VDD/VCCSYN relationship to VDDH during power-on reset
• Table 5: Note 2 updated to reflect VIH=2.5 for TCK, TRST, PORESET; request for external
pullup removed.
• Table 5: Note 4 added regarding IIC compatibility
• Section 4.2: New information about jumper-to-case thermal resistance
• Section 4.3: New information about jumper-to-board thermal resistance
• Section 4.4: New information about estimation with simulation
• Section 4.6: Updated description of layout practices
• Section 6: Added sentence providing derating factor
• Section 6.1, “CPM AC Characteristics”: added Note: Rise/Fall Time on CPM Input Pins
• Table 9: updated values for following specs: sp42, sp43, sp42a
• Table 10: updated values for following specs: sp16b, sp18b, sp20, sp22
• Section 6.2: added spread sprectrum clocking note
• Table 11: combined specs sp11 and sp11a
• Sections 7.2, 7.3: unit of ns added to Tval notes
• Section 7, “Clock Configuration Modes”: Updated all table footnotes reflect updated CPU Fmin
of 150 MHz commercial temp devices, 175 MHz extended temp; CPM Fmin of 120 MHz.
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
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Document Revision History
Table 25. Document Revision History (continued)
Substantive Changes
Revision
Date
1.0
2/2004 • Removal of “Advance Information” and “Preliminary.” The MPC8280 is fully qualified.
• Table 1: New
• Figure 1: Modification to note 2
• Section 1.1: Core frequency range is 166–450 MHz
• Addition of ZQ (516 PBGA with Lead spheres) package references
• Table 4: VDD and VCCSYN modified to 1.45–1.60 V
• Note following Table 4: Modified
• Table 5: Addition of note 2 regarding TRST and PORESET (see VIH row of Table 5)
• Table 5: Changed I for 60x signals to 6.0 mA
OL
• Table 5: Moved QREQ to V : I = 3.2 mA
OL OL
• Table 5: Addition of critical interrupt (CINT) to IRQ5 for V (I = 6.0mA)
OL OL
• Table 6: Addition of Ψ and note 4
JT
• Sections 4.1–4.5: New
• Table 7: Modified power values (+ 150mW to each)
• Table 8: Addition of note 2. Changed PCI impedance to 27 Ω.
• Table 9: Changes to sp36b, SP38a, sp38b, sp37a, sp39a, sp40 and sp41
• Table 10: Changes to sp16a, sp18a, sp20 and sp21
• Section 6.2: Addition of Note: CLKIN Jitter and Duty Cycle
• Table 11: Changes to sp13 @ 66 and 83 MHz, sp14 @ 83 MHz
• Table 12: Change to sp30 (data bus signals). Changes to sp33b. Removal of note 2.
• Table 16 through Table 20: Modification of note 1 regarding CPU and CPM Fmin. Modification
to corresponding values in tables.
• Table 21: Addition of note 1 to TRST (AH3) and PORESET (AG6)
• Table 21: Addition of RXD3 to CPM port pin PB14. Previously omitted.
• Table 21: Addition of critical interrupt (CINT) to B21 and U4. Previously omitted.
• Table 21: Addition of note 5 to ‘No connect’ (AA1, AG4)
• Addition of “Note: Temperature Reflow for the VR Package" on page 59
• Table 23: Addition of note 1 to TRST (F22) and PORESET (B25)
• Table 23: Addition of previously omitted signals that are multiplexed with CPM port pins:
PA6—FCC2_UT_RXADDR3
PA7—FCC2_UT_TXADDR3
PA8—FCC2_UT_TXADDR4
PB14—RXD3
PC19—SPICLK
PC22—FCC1_UT_TXPRTY
PC28—FCC2_UT_RXADDR4
• Table 23: Removal of serial interface 1 (SI1) signals from port pins (see note 2 in Figure 1):
PA[6–9], PB[8–17, 20–25], PC[6–7, 10–13], PD[4, 10–13, 16, 23–28]
• Table 23: Addition of critical interrupt (CINT) to AC1 and B14. Previously omitted.
• Table 23: Addition of note 5 to ‘No connect’ (E17, C23)
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
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Document Revision History
Table 25. Document Revision History (continued)
Substantive Changes
Revision
Date
0.3
6/2003 • Removal of notes stating “no local bus” on VR-package devices. The MPC8270VR and the
MPC8275VR have local bus support.
• References to “G2 core” changed to “G2_LE core.” Refer to the G2 Core Reference Manual
(G2CORERM/D).
• Addition of VCCSYN to “Note” below Table 4, and to note 3 of Table 5
• Figure 2: New
• Table 5: Addition of note 1
• Table 6: Addition of θ and θ . Modifications to ZU package values.
JB
JC
• Table 7: Addition of various configurations, Modification of values. Addition of note 3.
• Table 9: Addition of 66 MHZ and 100 MHz values. Addition of sp42a/sp43a.
• Table 10: Addition of 66 MHZ and 100 MHz values
• Table 12: sp30 values. sp33b @100 MHz value. Removal of previous note 2. Modification of
current note 2.
• Figure 5, Figure 6, Figure 7, and Figure 8: Addition of notes
• Section 6.2: Addition of note on PCI timing
• Table 16, Table 17, Table 18, Table 19, Table 20: Addition of note 1 concerning minimum
operating frequencies
• Addition of statement before clock tables about selection of clock configuration and input
frequency
• Table 21 and Table 23: Addition of note 1 to CPM pins
0.2
0.1
11/2002 Table 23, “VR Pinout”: Addition of C18 to the Ground (GND) pin list (page 63)
—
Initial public release
MPC8280 PowerQUICC™ II Family Hardware Specifications, Rev. 1.8
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79
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Document Number: MPC8280EC
Rev. 1.8
8/2007
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