MPC859TZP133A [NXP]
PowerQUICC, 32 Bit Power Architecture, 133MHz, Communications Processor, 0 to 95C;
| 型号： | MPC859TZP133A |
| 厂家： | 
NXP |
| 描述： | PowerQUICC, 32 Bit Power Architecture, 133MHz, Communications Processor, 0 to 95C 外围集成电路 |
| 文件： | 总96页 (文件大小：1567K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MPC866EC
Rev. 2, 2/2006
Freescale Semiconductor
Technical Data
MPC866/MPC859
Hardware Specifications
Contents
This document contains detailed information on power
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3. Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 8
4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . 9
5. Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7. Thermal Calculation and Measurement . . . . . . . . . . 12
8. Power Supply and Power Sequencing . . . . . . . . . . . 15
9. Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
10. Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 16
11. IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 46
12. CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 48
13. UTOPIA AC Electrical Specifications . . . . . . . . . . . 72
14. FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 74
15. Mechanical Data and Ordering Information . . . . . . . 78
16. Document Revision History . . . . . . . . . . . . . . . . . . . 93
considerations, DC/AC electrical characteristics, and AC timing
specifications for the MPC866/859 family (refer to Table 1 for a
list of devices). The MPC866P is the superset device of the
MPC866/859 family.This document describes pertinent electrical
and physical characteristics of the MPC8245. For functional
characteristics of the processor, refer to the MPC866
PowerQUICC Family Users Manual (MPC866UM/D).
1 Overview
The MPC866/859 is a derivative of Freescale’s MPC860
PowerQUICC™ family of devices. It is a versatile single-chip
integrated microprocessor and peripheral combination that can be
used in a variety of controller applications and communications
and networking systems. The MPC866/859/859DSL provides
enhanced ATM functionality over that of other ATM-enabled
members of the MPC860 family.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
Features
Table 1 shows the functionality supported by the members of the MPC866/859 family.
2 Features
Table 1. MPC866 Family Functionality
Cache
Ethernet
Part
SCC
SMC
Instruction
Data
10T
10/100
MPC866P
16 Kbytes
4 Kbytes
16 Kbytes
4 Kbytes
4 Kbytes
4 KBytes
8 Kbytes
4 Kbytes
8 Kbytes
4 Kbytes
4 Kbytes
4 Kbytes
Up to 4
1
1
1
1
1
1
4
4
1
1
2
2
2
2
MPC866T
MPC859P
MPC859T
MPC859DSL
Up to 4
1
1
1
2
1
2
1
1
3
MPC852T
2
1
1
On the MPC859DSL, the SCC (SCC1) is for ethernet only. Also, the MPC859DSL does not support the Time Slot
Assigner (TSA).
2
3
On the MPC859DSL, the SMC (SMC1) is for UART only.
For more details on the MPC852T, please refer to the MPC852T Hardware Specifications.
The following list summarizes the key MPC866/859 features:
•
Embedded single-issue, 32-bit PowerPC™ core (implementing the PowerPC architecture) with
thirty-two 32-bit general-purpose registers (GPRs)
— The core performs branch prediction with conditional prefetch, without conditional execution
— 4- or 8-Kbyte data cache and 4- or 16-Kbyte instruction cache (see Table 1)
– 16-Kbyte instruction cache (MPC866P and MPC859P) is four-way, set-associative with 256 sets;
4-Kbyte instruction cache (MPC866T, MPC859T, and MPC859DSL) is two-way, set-associative
with 128 sets.
– 8-Kbyte data cache (MPC866P and MPC859P) is two-way, set-associative with 256 sets; 4-Kbyte
data cache(MPC866T, MPC859T, and MPC859DSL) is two-way, set-associative with 128 sets.
– Cache coherency for both instruction and data caches is maintained on 128-bit (4-word) cache
blocks
– Caches are physically addressed, implement a least recently used (LRU) replacement algorithm, and
are lockable on a cache block basis.
— MMUs with 32-entry TLB, fully associative instruction and data TLBs
— MMUs support multiple page sizes of 4, 16, and 512 Kbytes, and 8 Mbytes; 16 virtual address spaces
and 16 protection groups.
— Advanced on-chip-emulation debug mode
•
The MPC866/859 provides enhanced ATM functionality over that of the MPC860SAR. The MPC866/859
adds major new features available in 'enhanced SAR' (ESAR) mode, including the following:
— Improved operation, administration, and maintenance (OAM) support
— OAM performance monitoring (PM) support
— Multiple APC priority levels available to support a range of traffic pace requirements
MPC866/MPC859 Hardware Specifications, Rev. 2
2
Freescale Semiconductor
Features
— ATM port-to-port switching capability without the need for RAM-based microcode
— Simultaneous MII (10/100Base-T) and UTOPIA (half-duplex) capability
— Optional statistical cell counters per PHY
— UTOPIA level 2 compliant interface with added FIFO buffering to reduce the total cell transmission
time. (The earlier UTOPIA level 1 specification is also supported.)
– Multi-PHY support on the MPC866, MPC859P, and MPC859T
– Four PHY support on the MPC866/859
2
— Parameter RAM for both SPI and I C can be relocated without RAM-based microcode
— Supports full-duplex UTOPIA both master (ATM side) and slave (PHY side) operation using a 'split' bus
— AAL2/VBR functionality is ROM-resident.
•
•
•
Up to 32-bit data bus (dynamic bus sizing for 8, 16, and 32 bits)
Thirty-two address lines
Memory controller (eight banks)
— Contains complete dynamic RAM (DRAM) controller
— Each bank can be a chip select or RAS to support a DRAM bank
— Up to 30 wait states programmable per memory bank
— Glueless interface to page mode/EDO/SDRAM, SRAM, EPROMs, flash EPROMs, and other memory
devices.
— DRAM controller programmable to support most size and speed memory interfaces
— Four CAS lines, four WE lines, and one OE line
— Boot chip-select available at reset (options for 8-, 16-, or 32-bit memory)
— Variable block sizes (32 Kbytes–256 Mbytes)
— Selectable write protection
— On-chip bus arbitration logic
•
General-purpose timers
— Four 16-bit timers cascadable to be two 32-bit timers
— Gate mode can enable/disable counting
— Interrupt can be masked on reference match and event capture
Fast Ethernet controller (FEC)
•
•
— Simultaneous MII (10/100Base-T) and UTOPIA operation when using the UTOPIA multiplexed bus
System integration unit (SIU)
— Bus monitor
— Software watchdog
— Periodic interrupt timer (PIT)
— Low-power stop mode
— Clock synthesizer
— Decrementer and time base from the PowerPC architecture
— Reset controller
— IEEE 1149.1 test access port (JTAG)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
3
Features
•
Interrupts
— Seven external interrupt request (IRQ) lines
— Twelve port pins with interrupt capability
— The MPC866P and MPC866T have 23 internal interrupt sources; the MPC859P, MPC859T, and
MPC859DSL have 20 internal interrupt sources.
— Programmable priority between SCCs (MPC866P and MPC866T)
— Programmable highest priority request
Communications processor module (CPM)
— RISC controller
•
— Communication-specific commands (for example, GRACEFUL STOP TRANSMIT, ENTER HUNT MODE, and
RESTART TRANSMIT)
— Supports continuous mode transmission and reception on all serial channels
— Up to 8-Kbytes of dual-port RAM
— MPC866P and MPC866T have 16 serial DMA (SDMA) channels; MPC859P, MPC859T, and
MPC859DSL have 10 serial DMA (SDMA) channels.
— Three parallel I/O registers with open-drain capability
Four baud rate generators
•
•
— Independent (can be connected to any SCC or SMC)
— Allow changes during operation
— Autobaud support option
MPC866P and MPC866T have four SCCs (serial communication controller); MPC859P, MPC859T, and
MPC859DSL have one SCC; and SCC1 on MPC859DSL supports Ethernet only.
— Serial ATM capability on all SCCs
— Optional UTOPIA port on SCC4
— Ethernet/IEEE 802.3 optional on SCC1–4, supporting full 10-Mbps operation
— HDLC/SDLC
— HDLC bus (implements an HDLC-based local area network (LAN))
— Asynchronous HDLC to support PPP (point-to-point protocol)
— AppleTalk
— Universal asynchronous receiver transmitter (UART)
— Synchronous UART
— Serial infrared (IrDA)
— Binary synchronous communication (BISYNC)
— Totally transparent (bit streams)
— Totally transparent (frame based with optional cyclic redundancy check (CRC)
Two SMCs (serial management channels) (MPC859DSL has one SMC (SMC1) for UART.)
— UART
•
— Transparent
— General circuit interface (GCI) controller
— Can be connected to the time-division multiplexed (TDM) channels
MPC866/MPC859 Hardware Specifications, Rev. 2
4
Freescale Semiconductor
Features
•
•
•
One serial peripheral interface (SPI)
— Supports master and slave modes
— Supports multiple-master operation on the same bus
2
One inter-integrated circuit (I C) port
— Supports master and slave modes
— Multiple-master environment support
Time slot assigner (TSA) (MPC859DSL does not have TSA.)
— Allows SCCs and SMCs to run in multiplexed and/or non-multiplexed operation
— Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user-defined
— 1- or 8-bit resolution
— Allows independent transmit and receive routing, frame synchronization, and clocking
— Allows dynamic changes
— On MPC866P and MPC866T, can be internally connected to six serial channels (four SCCs and two
SMCs); on MPC859P and MPC859T, can be connected to three serial channels (one SCC and two
SMCs).
•
•
Parallel interface port (PIP)
— Centronics interface support
— Supports fast connection between compatible ports on MPC866/859 or MC68360
PCMCIA interface
— Master (socket) interface, compliant with PCI Local Bus Specification (Rev 2.1)
— Supports one or two PCMCIA sockets whether ESAR functionality is enabled
— Eight memory or I/O windows supported
Debug interface
•
— Eight comparators: four operate on instruction address, two operate on data address, and two operate on
data.
— Supports conditions: = ≠ < >
— Each watchpoint can generate a breakpoint internally
•
•
Normal high and normal low power modes to conserve power
1.8 V core and 3.3 V I/O operation with 5-V TTL compatibility; refer to Table 6 for a listing of the 5-V
tolerant pins.
•
•
357-pin plastic ball grid array (PBGA) package
Operation up to 133 MHz
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
5
Features
The MPC866/859 is comprised of three modules that each use a 32-bit internal bus: MPC8xx core, system
integration unit (SIU), and communication processor module (CPM). The MPC866P block diagram is shown in
Figure 1. The MPC859P/859T/859DSL block diagram is shown in Figure 2.
16-Kbyte
Instruction Cache
Instruction
Bus
System Interface Unit (SIU)
Unified
Bus
Memory Controller
Instruction MMU
32-Entry ITLB
Embedded
MPC8xx
Processor
Core
Internal
Bus Interface Bus Interface
Unit Unit
External
8-Kbyte
Data Cache
Load/Store
Bus
System Functions
Data MMU
32-Entry DTLB
PCMCIA/ATA Interface
Fast Ethernet
Controller
DMAs
FIFOs
4
Interrupt
8-Kbyte
16 Virtual
Serial
and
Parallel I/O
Timers Controllers Dual-Port RAM
10/100
Base-T
Media Access
Control
4 Baud Rate
Generators
32-Bit RISC Controller
and Program
2
Independent
DMA
Channels
ROM
Parallel Interface Port
and UTOPIA
Timers
MII
2
SCC1
SCC2
SCC3
SCC4
SMC1
SMC2
SPI
I C
TimeSlotAssigner
Serial Interface
Figure 1. MPC866P Block Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
6
Freescale Semiconductor
Features
†
4-Kbyte
Instruction
Bus
System Interface Unit (SIU)
Instruction Cache
Unified
Bus
Memory Controller
Instruction MMU
32-Entry ITLB
Embedded
MPC8xx
Processor
Core
Internal
Bus Interface Bus Interface
Unit Unit
External
†
4-Kbyte
Load/Store
Bus
Data Cache
System Functions
Data MMU
32-Entry DTLB
PCMCIA/ATA Interface
Fast Ethernet
Controller
DMAs
FIFOs
4
Interrupt
8-Kbyte
10 Virtual
Serial
Parallel I/O
Timers Controllers Dual-Port RAM
and
2
Independent
DMA
Channels
10/100
Base-T
Media Access
Control
4 Baud Rate
Generators
32-Bit RISC Controller
and Program
ROM
Parallel Interface Port
and UTOPIA
Timers
MII
2
SCC1
SMC1
SMC2*
SPI
I C
TimeSlotAssigner*
Serial Interface
†
The MPC859P has a 16-Kbyte instruction cache and a 8-Kbyte data cache.
* The MPC859DSL does not contain SMC2 nor the time slot assigner, and provides eight SDMA
controllers.
Figure 2. MPC859P/859T/MPC859DSL Block Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
7
Maximum Tolerated Ratings
3 Maximum Tolerated Ratings
This section provides the maximum tolerated voltage and temperature ranges for the MPC866/859. Table 2 shows
the maximum tolerated ratings, and Table 3 shows the operating temperatures.
Table 2. Maximum Tolerated Ratings
Rating
Symbol
Value
Unit
1
Supply voltage
VDDH
– 0.3 to 4.0
– 0.3 to 2.0
– 0.3 to 2.0
100
V
V
VDDL
VDDSYN
V
Difference between VDDL to VDDSYN
mV
V
2
Input voltage
Storage temperature range
V
GND – 0.3 to VDDH
–55 to +150
in
T
°C
stg
1
2
The power supply of the device must start its ramp from 0.0 V.
Functional operating conditions are provided with the DC electrical specifications in Table 6. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device. See page 15.
Caution: All inputs that tolerate 5 V cannot be more than 2.5 V greater than VDDH. This restriction applies to
power-up and normal operation (that is, if the MPC866/859 is unpowered, a voltage greater than 2.5 V must not be
applied to its inputs).
Table 3. Operating Temperatures
Rating
Symbol
Value
Unit
1
Temperature (standard)
T
0
°C
°C
°C
°C
A(min)
T
95
j(max)
Temperature (extended)
T
–40
100
A(min)
T
j(max)
1
Minimum temperatures are guaranteed as ambient temperature, T . Maximum temperatures are guaranteed as
A
junction temperature, T .
j
This device contains circuitry protecting against damage due to high-static voltage or electrical fields; however, it
is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages
to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic
voltage level (for example, either GND or V ).
DD
MPC866/MPC859 Hardware Specifications, Rev. 2
8
Freescale Semiconductor
Thermal Characteristics
4 Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC866/859.
Table 4. MPC866/859 Thermal Resistance Data
Environment
Single-layer board (1s)
Rating
Symbol
Value
Unit
1
2
Junction-to-ambient
Natural Convection
R
37
23
30
19
13
6
°C/W
θJA
3
3
3
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
R
θJMA
Airflow (200 ft/min)
R
R
θJMA
θJMA
4
Junction-to-board
R
θJB
θJC
5
Junction-to-case
R
6
Junction-to-package top
Natural Convection
Airflow (200 ft/min)
Ψ
2
JT
JT
Ψ
2
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2
3
4
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
6
Thermal characterization parameter indicating the temperature difference between package top and junction
temperature per JEDEC JESD51-2.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
9
Power Dissipation
5 Power Dissipation
Table 5 shows power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1
mode, where CPU frequency is twice the bus speed.
Table 5. Power Dissipation (P )
D
CPU
Frequency
1
2
Die Revision
Bus Mode
Typical
Maximum
Unit
0
1:1
2:1
50 MHz
66 MHz
66 MHz
80 MHz
100 MHz
133 MHz
110
150
140
170
210
260
140
180
160
200
250
320
mW
mW
mW
mW
mW
mW
1
2
Typical power dissipation at VDDL and VDDSYN is at 1.8 V. and VDDH is at 3.3 V.
Maximum power dissipation at VDDL and VDDSYN is at 1.9 V, and VDDH is at 3.465 V.
NOTE
Values in Table 5 represent VDDL based power dissipation and
do not include I/O power dissipation over VDDH. I/O power
dissipation varies widely by application due to buffer current,
depending on external circuitry. The VDDSYN power
dissipation is negligible.
6 DC Characteristics
Table 6 shows the DC electrical characteristics for the MPC866/859.
Table 6. DC Electrical Specifications
Characteristic
Symbol
VDDL (core)
Min
Max
Unit
Operating voltage
1.7
3.135
1.7
1.9
3.465
1.9
V
V
VDDH (I/O)
1
VDDSYN
V
Difference between
VDDL to VDDSYN
—
100
mV
Input high voltage (all inputs except EXTAL and
EXTCLK)
VIH
2.0
3.465
V
2
MPC866/MPC859 Hardware Specifications, Rev. 2
10
Freescale Semiconductor
DC Characteristics
Table 6. DC Electrical Specifications (continued)
Characteristic Symbol
Min
Max
Unit
Input low voltage
VIL
GND
0.7*(VDDH)
—
0.8
VDDH
100
V
V
EXTAL, EXTCLK input high voltage
VIHC
Input leakage current, Vin = 5.5V (except TMS, TRST,
DSCK and DSDI pins) for 5 Volts Tolerant Pins
I
I
I
µA
in
In
In
2
Input leakage current, Vin = VDDH (except TMS, TRST,
DSCK, and DSDI)
—
—
10
10
µA
µA
Input leakage current, Vin = 0 V (except TMS, TRST,
DSCK and DSDI pins)
3
Input capacitance
C
—
20
—
pF
V
in
Output high voltage, IOH = – 2.0 mA,
except XTAL, and Open drain pins
VOH
2.4
Output low voltage
VOL
—
0.5
V
• IOL = 2.0 mA (CLKOUT)
4
• IOL = 3.2 mA
• IOL = 5.3 mA
5
• IOL = 7.0 mA (TXD1/PA14, TXD2/PA12)
• IOL = 8.9 mA (TS, TA, TEA, BI, BB, HRESET, SRESET)
1
2
The difference between VDDL and VDDSYN can not be more than 100 m V.
The signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], TDI, TDO, TCK, TRST_B, TMS, MII_TXEN, MII_MDIO are 5 V
tolerant.
3
4
Input capacitance is periodically sampled.
A(0:31), TSIZ0/REG, TSIZ1, D(0:31), DP(0:3)/IRQ(3:6), RD/WR, BURST, RSV/IRQ2,
IP_B(0:1)/IWP(0:1)/VFLS(0:1), IP_B2/IOIS16_B/AT2, IP_B3/IWP2/VF2, IP_B4/LWP0/VF0, IP_B5/LWP1/VF1,
IP_B6/DSDI/AT0, IP_B7/PTR/AT3, RXD1 /PA15, RXD2/PA13, L1TXDB/PA11, L1RXDB/PA10, L1TXDA/PA9,
L1RXDA/PA8, TIN1/L1RCLKA/BRGO1/CLK1/PA7, BRGCLK1/TOUT1/CLK2/PA6,
TIN2/L1TCLKA/BRGO2/CLK3/PA5, TOUT2/CLK4/PA4, TIN3/BRGO3/CLK5/PA3,
BRGCLK2/L1RCLKB/TOUT3/CLK6/PA2, TIN4/BRGO4/CLK7/PA1, L1TCLKB/TOUT4/CLK8/PA0,
REJCT1/SPISEL/PB31, SPICLK/PB30, SPIMOSI/PB29, BRGO4/SPIMISO/PB28, BRGO1/I2CSDA/PB27,
BRGO2/I2CSCL/PB26, SMTXD1/PB25, SMRXD1/PB24, SMSYN1/SDACK1/PB23, SMSYN2/SDACK2/PB22,
SMTXD2/L1CLKOB/PB21, SMRXD2/L1CLKOA/PB20, L1ST1/RTS1/PB19, L1ST2/RTS2/PB18,
L1ST3/L1RQB/PB17, L1ST4/L1RQA/PB16, BRGO3/PB15, RSTRT1/PB14, L1ST1/RTS1/DREQ0/PC15,
L1ST2/RTS2/DREQ1/PC14, L1ST3/L1RQB/PC13, L1ST4/L1RQA/PC12, CTS1/PC11, TGATE1/CD1/PC10,
CTS2/PC9, TGATE2/CD2/PC8, CTS3/SDACK2/L1TSYNCB/PC7, CD3/L1RSYNCB/PC6,
CTS4/SDACK1/L1TSYNCA/PC5, CD4/L1RSYNCA/PC4, PD15/L1TSYNCA, PD14/L1RSYNCA, PD13/L1TSYNCB,
PD12/L1RSYNCB, PD11/RXD3, PD10/TXD3, PD9/RXD4, PD8/TXD4, PD5/REJECT2, PD6/RTS4, PD7/RTS3,
PD4/REJECT3, PD3, MII_MDC, MII_TX_ER, MII_EN, MII_MDIO, MII_TXD[0:3].
5
BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:5), CS(6)/CE(1)_B, CS(7)/CE(2)_B, WE0/BS_B0/IORD,
WE1/BS_B1/IOWR, WE2/BS_B2/PCOE, WE3/BS_B3/PCWE, BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A,
ALE_B/DSCK/AT1, OP(0:1), OP2/MODCK1/STS, OP3/MODCK2/DSDO, BADDR(28:30).
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
11
Thermal Calculation and Measurement
7 Thermal Calculation and Measurement
For the following discussions, P = (VDDL x IDDL) + PI/O, where PI/O is the power dissipation of the I/O drivers.
D
The VDDSYN power dissipation is negligible.
7.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:
T = T +(R
x P )
D
J
A
θJA
where:
T = ambient temperature (ºC)
A
R
= package junction-to-ambient thermal resistance (ºC/W)
θJA
P = power dissipation in package
D
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation
of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor
of two (in the quantity T -T ) are possible.
J
A
7.2 Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance
and a case-to-ambient thermal resistance:
R
= R
+ R
θJA
θJC θCA
where:
R
= junction-to-ambient thermal resistance (ºC/W)
= junction-to-case thermal resistance (ºC/W)
= case-to-ambient thermal resistance (ºC/W)
θJA
θJC
θCA
R
R
R
is device related and cannot be influenced by the user. The user adjusts the thermal environment to affect the
θJC
case-to-ambient thermal resistance, R
. For instance, the user can change the airflow around the device, add a
θCA
heat sink, change the mounting arrangement on the printed-circuit board, or change the thermal dissipation on the
printed-circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks
where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most
packages, a better model is required.
7.3 Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model that has demonstrated reasonable accuracy (about 20%) is a two-resistor model
consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case covers the situation
where a heat sink is used or where a substantial amount of heat is dissipated from the top of the package. The
junction-to-board thermal resistance describes the thermal performance when most of the heat is conducted to the
printed-circuit board. It has been observed that the thermal performance of most plastic packages and especially
PBGA packages is strongly dependent on the board temperature; see Figure 3.
MPC866/MPC859 Hardware Specifications, Rev. 2
12
Freescale Semiconductor
Thermal Calculation and Measurement
Figure 3. Effect of Board Temperature Rise on Thermal Behavior
If the board temperature is known, an estimate of the junction temperature in the environment can be made using
the following equation:
T = T +(R
x P )
D
J
B
θJB
where:
R
= junction-to-board thermal resistance (ºC/W)
θJB
T = board temperature ºC
B
P = power dissipation in package
D
If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable
predictions of junction temperature can be made. For this method to work, the board and board mounting must be
similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a
power and a ground plane) and vias attaching the thermal balls to the ground plane.
7.4 Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple two-resistor
model can be used with the thermal simulation of the application [2], or a more accurate and complex model of the
package can be used in the thermal simulation.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
13
Thermal Calculation and Measurement
7.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the thermal
characterization parameter (Ψ ) can be used to determine the junction temperature with a measurement of the
JT
temperature at the top center of the package case using the following equation:
T = T +(Ψ x P )
J
T
JT
D
where:
Ψ
= thermal characterization parameter
JT
T = thermocouple temperature on top of package
T
P = power dissipation in package
D
The thermal characterization parameter is measured per JESD51-2 specification published by JEDEC using a 40
gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned
so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple
junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the
package case to avoid measurement errors caused by cooling effects of the thermocouple wire.
7.6 References
Semiconductor Equipment and Materials International(415) 964-5111
805 East Middlefield Rd.
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) specifications800-854-7179 or
(Available from Global Engineering Documents)303-397-7956
JEDEC Specifications http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its
Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.
MPC866/MPC859 Hardware Specifications, Rev. 2
14
Freescale Semiconductor
Power Supply and Power Sequencing
8 Power Supply and Power Sequencing
This section provides design considerations for the MPC866/859 power supply. The MPC866/859 has a core voltage
(VDDL) and PLL voltage (VDDSYN) that operates at a lower voltage than the I/O voltage VDDH. The I/O section
of the MPC866/859 is supplied with 3.3 V across VDDH and V (GND).
SS
Signals PA[0:15], PB[14:31], PC[4:15], PD[3:15], TDI, TDO, TCK, TRST_B, TMS, MII_TXEN, and MII_MDIO
are 5-V tolerant. All inputs cannot be more than 2.5 V greater than VDDH. In addition, 5-V tolerant pins cannot
exceed 5.5 V and the remaining input pins cannot exceed 3.465 V. This restriction applies to power up/down and
normal operation.
One consequence of multiple power supplies is that when power is initially applied the voltage rails ramp up at
different rates. The rates depend on the nature of the power supply, the type of load on each power supply, and the
manner in which different voltages are derived. The following restrictions apply:
•
•
VDDL must not exceed VDDH during power up and power down.
VDDL must not exceed 1.9 V and VDDH must not exceed 3.465 V.
These cautions are necessary for the long term reliability of the part. If they are violated, the electrostatic discharge
(ESD) protection diodes are forward-biased and excessive current can flow through these diodes. If the system
power supply design does not control the voltage sequencing, the circuit shown in Figure 4 can be added to meet
these requirements. The MUR420 Schottky diodes control the maximum potential difference between the external
bus and core power supplies on powerup and the 1N5820 diodes regulate the maximum potential difference on
powerdown.
VDDH
VDDL
MUR420
1N5820
Figure 4. Example Voltage Sequencing Circuit
9 Layout Practices
Each V pin on the MPC866/859 should be provided with a low-impedance path to the board’s supply.
DD
Furthermore, each GND pin should be provided with a low-impedance path to ground. The power supply pins drive
distinct groups of logic on chip. The V power supply should be bypassed to ground using at least four 0.1 µF
DD
bypass capacitors located as close as possible to the four sides of the package. Each board designed should be
characterized and additional appropriate decoupling capacitors should be used if required. The capacitor leads and
associated printed-circuit traces connecting to chip V and GND should be kept to less than 1/2” per capacitor lead.
DD
At a minimum, a four-layer board employing two inner layers as V and GND planes should be used.
DD
All output pins on the MPC866/859 have fast rise and fall times. Printed-circuit (PC) trace interconnection length
should be minimized in order to minimize undershoot and reflections caused by these fast output switching times.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
15
Bus Signal Timing
This recommendation particularly applies to the address and data buses. Maximum PC trace lengths of 6” are
recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to the
PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher
capacitive loads because these loads create higher transient currents in the V and GND circuits. Pull up all unused
DD
inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels on the
PLL supply pins. For more information, please refer to Section 14.4.3, Clock Synthesizer Power (VDDSYN,
VSSSYN, VSSSYN1), in the MPC866 User’s Manual.
10 Bus Signal Timing
The maximum bus speed supported by the MPC866/859 is 66 MHz. Higher-speed parts must be operated in
half-speed bus mode (for example, an MPC866/859 used at 100 MHz must be configured for a 50-MHz bus).
Table 7 and Table 8 show the frequency ranges for standard part frequencies.
Table 7. Frequency Ranges for Standard Part Frequencies (1:1 Bus Mode)
Part Freq
50 MHz
66 MHz
Min
Max
Min
Max
Core
Bus
40
50
40
66.67
40
50
40
66.67
Table 8. Frequency Ranges for Standard Part Frequencies (2:1 Bus Mode)
50 MHz 66 MHz 100 MHz 133 MHz
Part
Freq
Min
Max
Min
Max
Min
Max
Min
Max
Core
40
50
40
66.67
40
100
40
133.34
Bus
20
25
20
33.33
20
50
20
66.67
Table 9 shows the timings for the MPC866/859 at 33, 40, 50, and 66 MHz bus operation. The timing for the
MPC866/859 bus shown in this table assumes a 50-pF load for maximum delays and a 0-pF load for minimum
delays. CLKOUT assumes a 100-pF load maximum delay.
Table 9. Bus Operation Timings
33 MHz
40 MHz
50 MHz
66 MHz
Num
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B1 Bus Period (CLKOUT) See Table 7
B1a EXTCLK to CLKOUT phase skew
B1b CLKOUT frequency jitter peak-to-peak
B1c Frequency jitter on EXTCLK
—
– 2
—
—
+2
—
– 2
—
—
+2
—
– 2
—
—
+2
—
– 2
—
—
+2
ns
ns
ns
%
1
1
1
1
—
0.50
—
0.50
—
0.50
—
0.50
MPC866/MPC859 Hardware Specifications, Rev. 2
16
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz 50 MHz
66 MHz
Num
Characteristic
Unit
ns
Min
Max
Min
Max
Min
Max
Min
Max
B1d CLKOUT phase jitter peak-to-peak
—
4
—
4
—
4
—
4
for OSCLK ≥ 15 MHz
CLKOUT phase jitter peak-to-peak
for OSCLK < 15 MHz
—
5
—
5
—
5
—
5
ns
B2 CLKOUT pulse width low (MIN = 0.4 x 12.1
B1, MAX = 0.6 x B1)
18.2
18.2
10.0
10.0
15.0
15.0
8.0
8.0
12.0
12.0
6.1
6.1
9.1
9.1
ns
ns
B3 CLKOUT pulse width high (MIN = 0.4 x 12.1
B1, MAX = 0.6 x B1)
B4 CLKOUT rise time
B5 CLKOUT fall time
—
—
4.00
4.00
—
—
—
4.00
4.00
—
—
—
4.00
4.00
—
—
—
4.00
4.00
—
ns
ns
ns
B7 CLKOUT to A(0:31), BADDR(28:30),
RD/WR, BURST, D(0:31), DP(0:3)
output hold (MIN = 0.25 x B1)
7.60
6.30
5.00
3.80
B7a CLKOUT to TSIZ(0:1), REG, RSV,
AT(0:3), BDIP, PTR output hold (MIN =
0.25 x B1)
7.60
—
6.30
6.30
—
—
5.00
5.00
—
—
3.80
3.80
—
—
—
ns
ns
B7b CLKOUT to BR, BG, FRZ, VFLS(0:1), 7.60
VF(0:2), IWP(0:2), LWP(0:1), STS
—
—
—
output hold (MIN = 0.25 x B1)
B8 CLKOUT to A(0:31), BADDR(28:30)
RD/WR, BURST, D(0:31), DP(0:3),
valid (MAX = 0.25 x B1 + 6.3)
—
—
—
13.80
13.80
13.80
12.50
12.50
12.50
11.30
11.30
11.30
10.00 ns
10.00 ns
10.00 ns
B8a CLKOUT to TSIZ(0:1), REG, RSV,
AT(0:3), BDIP, PTR valid (MAX = 0.25
x B1 + 6.3)
—
—
—
B8b CLKOUT to BR, BG, VFLS(0:1),
VF(0:2), IWP(0:2), FRZ, LWP(0:1),
—
—
—
4
STS valid (MAX = 0.25 x B1 + 6.3)
B9 CLKOUT to A(0:31), BADDR(28:30),
RD/WR, BURST, D(0:31), DP(0:3),
TSIZ(0:1), REG, RSV, AT(0:3), PTR
High-Z (MAX = 0.25 x B1 + 6.3)
7.60 13.80 6.30 12.50 5.00 11.30 3.80 10.00 ns
B11 CLKOUT to TS, BB assertion (MAX =
0.25 x B1 + 6.0)
7.60 13.60 6.30 12.30 5.00 11.00 3.80
9.80
9.80
ns
ns
B11a CLKOUT to TA, BI assertion (when
driven by the memory controller or
2.50
9.30
2.50
9.30
2.50
9.30
2.50
PCMCIA interface) (MAX = 0.00 x B1 +
1
9.30 )
B12 CLKOUT to TS, BB negation (MAX =
0.25 x B1 + 4.8)
7.60 12.30 6.30 11.00 5.00
9.80
3.80
8.50
ns
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
17
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz 50 MHz
66 MHz
Num
Characteristic
Unit
Min
2.50
Max
Min
2.50
Max
Min
2.50
Max
Min
2.50
Max
B12a CLKOUT to TA, BI negation (when
driven by the memory controller or
PCMCIA interface) (MAX = 0.00 x B1 +
9.00)
9.00
9.00
9.00
9.00
ns
B13 CLKOUT to TS, BB High-Z (MIN = 0.25 7.60 21.60 6.30 20.30 5.00 19.00 3.80 14.00 ns
x B1)
B13a CLKOUT to TA, BI High-Z (when driven 2.50 15.00 2.50 15.00 2.50 15.00 2.50 15.00 ns
by the memory controller or PCMCIA
interface) (MIN = 0.00 x B1 + 2.5)
B14 CLKOUT to TEA assertion (MAX =
0.00 x B1 + 9.00)
2.50
9.00
2.50
9.00
2.50
9.00
2.50
9.00
ns
B15 CLKOUT to TEA High-Z (MIN = 0.00 x 2.50 15.00 2.50 15.00 2.50 15.00 2.50 15.00 ns
B1 + 2.50)
B16 TA, BI valid to CLKOUT (setup time)
(MIN = 0.00 x B1 + 6.00)
6.00
—
—
—
—
6.00
4.50
4.00
1.00
—
—
—
—
6.00
4.50
4.00
1.00
—
—
—
—
6.00
4.50
4.00
2.00
—
—
—
—
ns
ns
ns
ns
B16a TEA, KR, RETRY, CR valid to CLKOUT 4.50
(setup time) (MIN = 0.00 x B1 + 4.5)
B16b BB, BG, BR, valid to CLKOUT (setup
4.00
2
time) (4 MIN = 0.00 x B1 + 0.00 )
B17 CLKOUT to TA, TEA, BI, BB, BG, BR
valid (hold time) (MIN = 0.00 x B1 +
1.00
3
1.00 )
B17a CLKOUT to KR, RETRY, CR valid (hold 2.00
time) (MIN = 0.00 x B1 + 2.00)
—
—
2.00
6.00
—
—
2.00
6.00
—
—
2.00
6.00
—
—
ns
ns
B18 D(0:31), DP(0:3) valid to CLKOUT
6.00
1.00
4.00
2.00
4
rising edge (setup time) (MIN = 0.00
x B1 + 6.00)
B19 CLKOUT rising edge to D(0:31),
—
—
—
1.00
4.00
2.00
—
—
—
1.00
4.00
2.00
—
—
—
2.00
4.00
2.00
—
—
—
ns
ns
ns
4
DP(0:3) valid (hold time) (MIN = 0.00
5
x B1 + 1.00 )
B20 D(0:31), DP(0:3) valid to CLKOUT
6
falling edge (setup time) (MIN = 0.00
x B1 + 4.00)
B21 CLKOUT falling edge to D(0:31),
6
DP(0:3) valid (hold Time) (MIN = 0.00
x B1 + 2.00)
B22 CLKOUT rising edge to CS asserted
GPCM ACS = 00 (MAX = 0.25 x B1 +
6.3)
7.60 13.80 6.30 12.50 5.00 11.30 3.80 10.00 ns
B22a CLKOUT falling edge to CS asserted
GPCM ACS = 10, TRLX = 0 (MAX =
0.00 x B1 + 8.00)
—
8.00
—
8.00
—
8.00
—
8.00
ns
MPC866/MPC859 Hardware Specifications, Rev. 2
18
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz 50 MHz
Min Max Min Max Min Max
66 MHz
Min Max
Num
Characteristic
Unit
B22b CLKOUT falling edge to CS asserted
GPCM ACS = 11, TRLX = 0, EBDF = 0
(MAX = 0.25 x B1 + 6.3)
7.60 13.80 6.30 12.50 5.00 11.30 3.80 10.00 ns
B22c CLKOUT falling edge to CS asserted
GPCM ACS = 11, TRLX = 0, EBDF = 1
(MAX = 0.375 x B1 + 6.6)
10.90 18.00 10.90 16.00 7.00 14.10 5.20 12.30 ns
B23 CLKOUT rising edge to CS negated
GPCM read access, GPCM write
access ACS = 00, TRLX = 0 & CSNT =
0 (MAX = 0.00 x B1 + 8.00)
2.00
8.00
2.00
8.00
2.00
8.00
2.00
8.00
ns
B24 A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10, TRLX = 0
(MIN = 0.25 x B1 - 2.00)
5.60
—
—
4.30
—
—
3.00
8.00
—
—
1.80
5.60
—
—
ns
ns
B24a A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11, TRLX = 0
(MIN = 0.50 x B1 - 2.00)
13.20
10.50
B25 CLKOUT rising edge to OE, WE(0:3)
asserted (MAX = 0.00 x B1 + 9.00)
—
9.00
9.00
—
—
9.00
9.00
—
—
9.00
9.00
—
—
9.00
9.00
—
ns
ns
ns
B26 CLKOUT rising edge to OE negated
(MAX = 0.00 x B1 + 9.00)
2.00
35.90
2.00
29.30
2.00
23.00
2.00
16.90
B27 A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 10, TRLX = 1
(MIN = 1.25 x B1 - 2.00)
B27a A(0:31) and BADDR(28:30) to CS
asserted GPCM ACS = 11, TRLX = 1
(MIN = 1.50 x B1 - 2.00)
43.50
—
—
35.50
—
—
28.00
—
—
20.70
—
—
ns
ns
B28 CLKOUT rising edge to WE(0:3)
negated GPCM write access CSNT =
0 (MAX = 0.00 x B1 + 9.00)
9.00
9.00
9.00
9.00
B28a CLKOUT falling edge to WE(0:3)
negated GPCM write access TRLX =
0,1, CSNT = 1, EBDF = 0 (MAX = 0.25
x B1 + 6.80)
7.60 14.30 6.30 13.00 5.00 11.80 3.80 10.50 ns
B28b CLKOUT falling edge to CS negated
GPCM write access TRLX = 0,1,
—
14.30
—
13.00
—
11.80
—
10.50 ns
CSNT = 1, ACS = 10 or ACS = 11,
EBDF = 0 (MAX = 0.25 x B1 + 6.80)
B28c CLKOUT falling edge to WE(0:3)
negated GPCM write access TRLX =
0, CSNT = 1 write access TRLX = 0,1,
CSNT = 1, EBDF = 1 (MAX = 0.375 x
B1 + 6.6)
10.90 18.00 10.90 18.00 7.00 14.30 5.20 12.30 ns
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
19
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz 50 MHz
66 MHz
Num
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B28d CLKOUT falling edge to CS negated
GPCM write access TRLX = 0,1,
—
18.00
—
18.00
—
14.30
—
12.30 ns
CSNT = 1, ACS = 10, or ACS = 11,
EBDF = 1 (MAX = 0.375 x B1 + 6.6)
B29 WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access, CSNT = 0,
EBDF = 0 (MIN = 0.25 x B1 - 2.00)
5.60
—
—
4.30
—
—
3.00
8.00
—
—
1.80
5.60
—
—
ns
ns
B29a WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access, TRLX = 0,
CSNT = 1, EBDF = 0 (MIN = 0.50 x B1
– 2.00)
13.20
10.50
B29b CS negated to D(0:31), DP(0:3), High
Z GPCM write access, ACS = 00,
TRLX = 0,1 & CSNT = 0 (MIN = 0.25 x
B1– 2.00)
5.60
—
—
—
—
—
—
—
—
4.30
10.50
35.50
35.50
3.00
—
—
—
—
—
—
—
—
3.00
8.00
—
—
—
—
—
—
—
—
1.80
5.60
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
B29c CS negated to D(0:31), DP(0:3) High-Z 13.20
GPCM write access, TRLX = 0, CSNT
= 1, ACS = 10, or ACS = 11, EBDF = 0
(MIN = 0.50 x B1 – 2.00)
B29d WE(0:3) negated to D(0:31), DP(0:3)
High-Z GPCM write access, TRLX = 1,
CSNT = 1, EBDF = 0 (MIN = 1.50 x B1
– 2.00)
43.50
28.00
28.00
1.10
20.70
20.70
0.00
B29e CS negated to D(0:31), DP(0:3) High-Z 43.50
GPCM write access, TRLX = 1, CSNT
= 1, ACS = 10, or ACS = 11, EBDF = 0
(MIN = 1.50 x B1 – 2.00)
B29f WE(0:3) negated to D(0:31), DP(0:3)
High Z GPCM write access, TRLX = 0,
CSNT = 1, EBDF = 1 (MIN = 0.375 x
B1 – 6.30)
5.00
B29g CS negated to D(0:31), DP(0:3) High-Z 5.00
GPCM write access, TRLX = 0, CSNT
= 1 ACS = 10 or ACS = 11, EBDF = 1
(MIN = 0.375 x B1 – 6.30)
3.00
1.10
0.00
B29h WE(0:3) negated to D(0:31), DP(0:3)
High Z GPCM write access, TRLX = 1,
CSNT = 1, EBDF = 1 (MIN = 0.375 x
B1 – 3.30)
38.40
31.10
31.10
24.20
24.20
17.50
17.50
B29i CS negated to D(0:31), DP(0:3) High-Z 38.40
GPCM write access, TRLX = 1, CSNT
= 1, ACS = 10 or ACS = 11, EBDF = 1
(MIN = 0.375 x B1 – 3.30)
MPC866/MPC859 Hardware Specifications, Rev. 2
20
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz 50 MHz
66 MHz
Num
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B30 CS, WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
5.60
—
4.30
—
3.00
—
1.80
—
ns
7
access (MIN = 0.25 x B1 – 2.00)
B30a WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM, write
access, TRLX = 0, CSNT = 1, CS
negated to A(0:31) invalid GPCM write
access TRLX = 0, CSNT =1 ACS = 10,
or ACS == 11, EBDF = 0 (MIN = 0.50 x
B1 – 2.00)
13.20
—
—
—
10.50
—
—
—
8.00
—
—
—
5.60
20.70
2.70
—
—
—
ns
ns
ns
B30b WE(0:3) negated to A(0:31) invalid
GPCM BADDR(28:30) invalid GPCM
write access, TRLX = 1, CSNT = 1. CS
negated to A(0:31) invalid GPCM write
access TRLX = 1, CSNT = 1, ACS =
10, or ACS == 11 EBDF = 0 (MIN =
1.50 x B1 – 2.00)
43.50
35.50
28.00
B30c WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
access, TRLX = 0, CSNT = 1. CS
negated to A(0:31) invalid GPCM write
access, TRLX = 0, CSNT = 1 ACS =
10, ACS == 11, EBDF = 1 (MIN = 0.375
x B1 – 3.00)
8.40
6.40
4.50
B30d WE(0:3) negated to A(0:31),
BADDR(28:30) invalid GPCM write
access TRLX = 1, CSNT =1, CS
negated to A(0:31) invalid GPCM write
access TRLX = 1, CSNT = 1, ACS = 10
or 11, EBDF = 1
38.67
1.50
—
31.38
1.50
—
24.50
1.50
—
17.83
1.50
—
ns
ns
B31 CLKOUT falling edge to CS valid, as
requested by control bit CST4 in the
corresponding word in the UPM (MAX
= 0.00 X B1 + 6.00)
6.00
6.00
6.00
6.00
B31a CLKOUT falling edge to CS valid, as
requested by control bit CST1 in the
corresponding word in the UPM (MAX
= 0.25 x B1 + 6.80)
7.60 14.30 6.30 13.00 5.00 11.80 3.80 10.50 ns
B31b CLKOUT rising edge to CS valid, as
requested by control bit CST2 in the
corresponding word in the UPM (MAX
= 0.00 x B1 + 8.00)
1.50
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B31c CLKOUT rising edge to CS valid, as
requested by control bit CST3 in the
corresponding word in the UPM (MAX
= 0.25 x B1 + 6.30)
7.60 13.80 6.30 12.50 5.00 11.30 3.80 10.00 ns
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
21
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz 50 MHz
Min Max Min Max Min Max
13.30 18.00 11.30 16.00 9.40 14.10 7.60 12.30 ns
66 MHz
Min Max
Num
Characteristic
Unit
B31d CLKOUT falling edge to CS valid, as
requested by control bit CST1 in the
corresponding word in the UPM EBDF
= 1 (MAX = 0.375 x B1 + 6.6)
B32 CLKOUT falling edge to BS valid, as
requested by control bit BST4 in the
corresponding word in the UPM (MAX
= 0.00 x B1 + 6.00)
1.50
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B32a CLKOUT falling edge to BS valid, as
requested by control bit BST1 in the
corresponding word in the UPM, EBDF
= 0 (MAX = 0.25 x B1 + 6.80)
7.60 14.30 6.30 13.00 5.00 11.80 3.80 10.50 ns
B32b CLKOUT rising edge to BS valid, as
requested by control bit BST2 in the
corresponding word in the UPM (MAX
= 0.00 x B1 + 8.00)
1.50
8.00
1.50
8.00
1.50
8.00
1.50
8.00
ns
B32c CLKOUT rising edge to BS valid, as
requested by control bit BST3 in the
corresponding word in the UPM (MAX
= 0.25 x B1 + 6.80)
7.60 14.30 6.30 13.00 5.00 11.80 3.80 10.50 ns
13.30 18.00 11.30 16.00 9.40 14.10 7.60 12.30 ns
B32d CLKOUT falling edge to BS valid- as
requested by control bit BST1 in the
corresponding word in the UPM, EBDF
= 1 (MAX = 0.375 x B1 + 6.60)
B33 CLKOUT falling edge to GPL valid, as 1.50
requested by control bit GxT4 in the
corresponding word in the UPM (MAX
= 0.00 x B1 + 6.00)
6.00
1.50
6.00
1.50
6.00
1.50
6.00
ns
B33a CLKOUT rising edge to GPL valid, as
requested by control bit GxT3 in the
corresponding word in the UPM (MAX
= 0.25 x B1 + 6.80)
7.60 14.30 6.30 13.00 5.00 11.80 3.80 10.50 ns
B34 A(0:31), BADDR(28:30), and D(0:31)
to CS valid, as requested by control bit
CST4 in the corresponding word in the
UPM (MIN = 0.25 x B1 - 2.00)
5.60
13.20
20.70
—
—
—
4.30
10.50
16.70
—
—
—
3.00
8.00
—
—
—
1.80
5.60
9.40
—
—
—
ns
ns
ns
B34a A(0:31), BADDR(28:30), and D(0:31)
to CS valid, as requested by control bit
CST1 in the corresponding word in the
UPM (MIN = 0.50 x B1 – 2.00)
B34b A(0:31), BADDR(28:30), and D(0:31)
to CS valid, as requested by CST2 in
the corresponding word in UPM (MIN =
0.75 x B1 – 2.00)
13.00
MPC866/MPC859 Hardware Specifications, Rev. 2
22
Freescale Semiconductor
Bus Signal Timing
Table 9. Bus Operation Timings (continued)
33 MHz 40 MHz 50 MHz
66 MHz
Num
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
B35 A(0:31), BADDR(28:30) to CS valid, as 5.60
requested by control bit BST4 in the
corresponding word in the UPM (MIN =
0.25 x B1 – 2.00)
—
4.30
10.50
16.70
4.30
—
3.00
—
1.80
—
ns
B35a A(0:31), BADDR(28:30), and D(0:31)
to BS valid, as Requested by BST1 in
the corresponding word in the UPM
(MIN = 0.50 x B1 – 2.00)
13.20
20.70
5.60
—
—
—
—
—
—
8.00
—
—
—
5.60
9.40
1.80
—
—
—
ns
ns
ns
B35b A(0:31), BADDR(28:30), and D(0:31)
to BS valid, as requested by control bit
BST2 in the corresponding word in the
UPM (MIN = 0.75 x B1 – 2.00)
13.00
3.00
B36 A(0:31), BADDR(28:30), and D(0:31)
to GPL valid as requested by control bit
GxT4 in the corresponding word in the
UPM (MIN = 0.25 x B1 – 2.00)
B37 UPWAIT valid to CLKOUT falling
6.00
1.00
—
—
—
—
6.00
1.00
7.00
7.00
—
—
—
—
6.00
1.00
7.00
7.00
—
—
—
—
6.00
1.00
7.00
7.00
—
—
—
—
ns
ns
ns
ns
8
edge (MIN = 0.00 x B1 + 6.00)
B38 CLKOUT falling edge to UPWAIT
8
valid (MIN = 0.00 x B1 + 1.00)
9
B39 AS valid to CLKOUT rising edge (MIN 7.00
= 0.00 x B1 + 7.00)
B40 A(0:31), TSIZ(0:1), RD/WR, BURST,
valid to CLKOUT rising edge (MIN =
0.00 x B1 + 7.00)
7.00
B41 TS valid to CLKOUT rising edge (setup 7.00
time) (MIN = 0.00 x B1 + 7.00)
—
—
7.00
2.00
—
—
—
7.00
2.00
—
—
—
7.00
2.00
—
—
—
ns
ns
ns
B42 CLKOUT rising edge to TS valid (hold 2.00
time) (MIN = 0.00 x B1 + 2.00)
B43 AS negation to memory controller
signals negation (MAX = TBD)
—
TBD
TBD
TBD
TBD
1
2
For part speeds above 50 MHz, use 9.80 ns for B11a.
The timing required for BR input is relevant when the MPC866/859 is selected to work with the internal bus arbiter.
The timing for BG input is relevant when the MPC866/859 is selected to work with the external bus arbiter.
3
4
For part speeds above 50 MHz, use 2 ns for B17.
The D(0:31) and DP(0:3) input timings B18 and B19 refer to the rising edge of CLKOUT, in which the TA input signal
is asserted.
5
6
For part speeds above 50 MHz, use 2 ns for B19.
The D(0:31) and DP(0:3) input timings B20 and B21 refer to the falling edge of CLKOUT. This timing is valid only for
read accesses controlled by chip-selects under control of the UPM in the memory controller, for data beats, where
DLT3 = 1 in the UPM RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.)
7
The timing B30 refers to CS when ACS = 00 and to WE(0:3) when CSNT = 0.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
23
Bus Signal Timing
8
The signal UPWAIT is considered asynchronous to CLKOUT and synchronized internally. The timings specified in
B37 and B38 are specified to enable the freeze of the UPM output signals as described in Figure 20.
9
The AS signal is considered asynchronous to CLKOUT. The timing B39 is specified in order to allow the behavior
specified in Figure 23.
Figure 5 shows the control timing diagram.
2.0 V
2.0 V
CLKOUT
0.8 V
0.8 V
A
B
2.0 V
0.8 V
2.0 V
0.8 V
Outputs
Outputs
Inputs
A
B
2.0 V
0.8 V
2.0 V
0.8 V
D
C
2.0 V
0.8 V
2.0 V
0.8 V
D
C
2.0 V
0.8 V
2.0 V
0.8 V
Inputs
A
B
C
D
Maximum output delay specification
Minimum output hold time
Minimum input setup time specification
Minimum input hold time specification
Figure 5. Control Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
24
Freescale Semiconductor
Bus Signal Timing
Figure 6 shows the timing for the external clock.
CLKOUT
B1
B1
B3
B2
B4
B5
Figure 6. External Clock Timing
Figure 7 shows the timing for the synchronous output signals.
CLKOUT
B8
B7
B9
B9
Output
Signals
B8a
B8b
B7a
B7b
Output
Signals
Output
Signals
Figure 7. Synchronous Output Signals Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
25
Bus Signal Timing
Figure 8 shows the timing for the synchronous active pull-up and open-drain output signals.
CLKOUT
B13
B11
B12
B12a
B15
TS, BB
TA, BI
TEA
B13a
B11a
B14
Figure 8. Synchronous Active Pull-Up Resistor and Open-Drain Output Signals Timing
Figure 9 shows the timing for the synchronous input signals.
CLKOUT
B16
B17
TA, BI
B16a
B17a
TEA, KR,
RETRY, CR
B16b
B17
BB, BG, BR
Figure 9. Synchronous Input Signals Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
26
Freescale Semiconductor
Bus Signal Timing
Figure 10 shows normal case timing for input data. It also applies to normal read accesses under the control of the
UPM in the memory controller.
CLKOUT
B16
B17
TA
B18
B19
D[0:31],
DP[0:3]
Figure 10. Input Data Timing in Normal Case
Figure 11 shows the timing for the input data controlled by the UPM for data beats where DLT3 = 1 in the UPM
RAM words. (This is only the case where data is latched on the falling edge of CLKOUT.)
CLKOUT
TA
B20
B21
D[0:31],
DP[0:3]
Figure 11. Input Data Timing when Controlled by UPM in the Memory Controller and DLT3 = 1
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
27
Bus Signal Timing
Figure 12 through Figure 15 show the timing for the external bus read controlled by various GPCM factors.
CLKOUT
B11
B8
B12
TS
A[0:31]
CSx
B22
B23
B25
B26
B19
OE
B28
WE[0:3]
B18
D[0:31],
DP[0:3]
Figure 12. External Bus Read Timing (GPCM Controlled—ACS = 00)
MPC866/MPC859 Hardware Specifications, Rev. 2
28
Freescale Semiconductor
Bus Signal Timing
CLKOUT
TS
B11
B8
B12
A[0:31]
CSx
B23
B22a
B24
B25
B26
B19
OE
B18
D[0:31],
DP[0:3]
Figure 13. External Bus Read Timing (GPCM Controlled—TRLX = 0 or 1, ACS = 10)
CLKOUT
TS
B11
B8
B12
B22b
B22c
A[0:31]
CSx
B23
B24a
B25
B26
B19
OE
B18
D[0:31],
DP[0:3]
Figure 14. External Bus Read Timing (GPCM Controlled—TRLX = 0 or 1, ACS = 11)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
29
Bus Signal Timing
CLKOUT
B11
B12
TS
A[0:31]
CSx
B8
B23
B22a
B27
B26
B19
OE
B27a
B22b B22c
B18
D[0:31],
DP[0:3]
Figure 15. External Bus Read Timing (GPCM Controlled—TRLX = 0 or 1, ACS = 10, ACS = 11)
MPC866/MPC859 Hardware Specifications, Rev. 2
30
Freescale Semiconductor
Bus Signal Timing
Figure 16 through Figure 18 show the timing for the external bus write controlled by various GPCM factors.
CLKOUT
TS
B11
B8
B12
B30
A[0:31]
CSx
B22
B23
B25
B28
WE[0:3]
OE
B26
B29b
B29
B8
B9
D[0:31],
DP[0:3]
Figure 16. External Bus Write Timing (GPCM Controlled—TRLX = 0 or 1, CSNT = 0)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
31
Bus Signal Timing
CLKOUT
TS
B11
B8
B12
B30a B30c
B23
A[0:31]
CSx
B22
B28b B28d
B25
B29c B29g
WE[0:3]
OE
B26
B29a B29f
B28a B28c
B8
B9
D[0:31],
DP[0:3]
Figure 17. External Bus Write Timing (GPCM Controlled—TRLX = 0, CSNT = 1)
MPC866/MPC859 Hardware Specifications, Rev. 2
32
Freescale Semiconductor
Bus Signal Timing
CLKOUT
TS
B11
B12
B8
B30b B30d
A[0:31]
CSx
B22
B28b B28d
B23
B25
B29e B29i
B29d B29h
WE[0:3]
OE
B26
B29b
B8
B28a B28c
B9
D[0:31],
DP[0:3]
Figure 18. External Bus Write Timing (GPCM Controlled—TRLX = 1, CSNT = 1)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
33
Bus Signal Timing
Figure 19 shows the timing for the external bus controlled by the UPM.
CLKOUT
B8
A[0:31]
B31a
B31d
B31c
B31
B31b
CSx
B34
B34a
B34b
B32a B32d
B32c
B33a
B32
B32b
BS_A[0:3],
BS_B[0:3]
B35 B36
B35b
B35a
B33
GPL_A[0:5],
GPL_B[0:5]
Figure 19. External Bus Timing (UPM Controlled Signals)
MPC866/MPC859 Hardware Specifications, Rev. 2
34
Freescale Semiconductor
Bus Signal Timing
Figure 20 shows the timing for the asynchronous asserted UPWAIT signal controlled by the UPM.
CLKOUT
UPWAIT
CSx
B37
B38
BS_A[0:3],
BS_B[0:3]
GPL_A[0:5],
GPL_B[0:5]
Figure 20. Asynchronous UPWAIT Asserted Detection in UPM Handled Cycles Timing
Figure 21 shows the timing for the asynchronous negated UPWAIT signal controlled by the UPM.
CLKOUT
B37
UPWAIT
B38
CSx
BS_A[0:3],
BS_B[0:3]
GPL_A[0:5],
GPL_B[0:5]
Figure 21. Asynchronous UPWAIT Negated Detection in UPM Handled Cycles Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
35
Bus Signal Timing
Figure 22 shows the timing for the synchronous external master access controlled by the GPCM.
CLKOUT
B41
B40
B42
TS
A[0:31],
TSIZ[0:1],
R/W, BURST
B22
CSx
Figure 22. Synchronous External Master Access Timing (GPCM Handled ACS = 00)
MPC866/MPC859 Hardware Specifications, Rev. 2
36
Freescale Semiconductor
Bus Signal Timing
Figure 23 shows the timing for the asynchronous external master memory access controlled by the GPCM.
CLKOUT
AS
B39
B40
A[0:31],
TSIZ[0:1],
R/W
B22
CSx
Figure 23. Asynchronous External Master Memory Access Timing (GPCM Controlled—ACS = 00)
Figure 24 shows the timing for the asynchronous external master control signals negation.
AS
B43
CSx, WE[0:3],
OE, GPLx,
BS[0:3]
Figure 24. Asynchronous External Master—Control Signals Negation Timing
Table 10 shows the interrupt timing for the MPC866/859.
Table 10. Interrupt Timing
All Frequencies
1
Num
Characteristic
Unit
Min
Max
I39 IRQx valid to CLKOUT rising edge (setup time)
I40 IRQx hold time after CLKOUT
I41 IRQx pulse width low
6.00
2.00
3.00
3.00
—
—
—
—
—
ns
ns
ns
ns
—
I42 IRQx pulse width high
I43 IRQx edge-to-edge time
4xT
CLOCKOUT
1
The timings I39 and I40 describe the testing conditions under which the IRQ lines are tested when being defined as
level sensitive. The IRQ lines are synchronized internally and do not have to be asserted or negated with reference
to the CLKOUT.
The timings I41, I42, and I43 are specified to allow the correct function of the IRQ lines detection circuitry, and has
no direct relation with the total system interrupt latency that the MPC866/859 is able to support.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
37
Bus Signal Timing
Figure 25 shows the interrupt detection timing for the external level-sensitive lines.
CLKOUT
I39
I40
IRQx
Figure 25. Interrupt Detection Timing for External Level Sensitive Lines
Figure 26 shows the interrupt detection timing for the external edge-sensitive lines.
CLKOUT
I41
I42
IRQx
I43
I43
Figure 26. Interrupt Detection Timing for External Edge Sensitive Lines
Table 11 shows the PCMCIA timing for the MPC866/859.
Table 11. PCMCIA Timing
33 MHz
40 MHz
50 MHz
66 MHz
Num
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
A(0:31), REG valid to PCMCIA
P44 Strobe asserted (MIN = 0.75 x B1
– 2.00)
20.70
—
16.70
—
13.00
—
9.40
—
ns
1
A(0:31), REG valid to ALE
negation (MIN = 1.00 x B1 – 2.00)
28.30
—
23.00
6.30
7.30
6.30
6.30
—
18.00
5.00
6.00
5.00
5.00
—
13.20
3.80
4.80
3.80
3.80
—
ns
P45
P46
P47
P48
P49
1
CLKOUT to REG valid (MAX = 0.25 7.60
x B1 + 8.00)
15.60
—
14.30
—
13.00
—
11.80 ns
CLKOUT to REG invalid (MIN =
0.25 x B1 + 1.00)
8.60
7.60
7.60
—
ns
CLKOUT to CE1, CE2 asserted
(MAX = 0.25 x B1 + 8.00)
15.60
15.60
14.30
14.30
13.00
13.00
11.80 ns
11.80 ns
CLKOUT to CE1, CE2 negated
(MAX = 0.25 x B1 + 8.00)
MPC866/MPC859 Hardware Specifications, Rev. 2
38
Freescale Semiconductor
Bus Signal Timing
Table 11. PCMCIA Timing (continued)
33 MHz 40 MHz
50 MHz
66 MHz
Num
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
CLKOUT to PCOE, IORD, PCWE,
—
11.00
—
11.00
—
11.00
—
11.00 ns
P50 IOWR assert time (MAX = 0.00 x
B1 + 11.00)
CLKOUT to PCOE, IORD, PCWE,
P51 IOWR negate time (MAX = 0.00 x
B1 + 11.00)
2.00
11.00
2.00
11.00
2.00
11.00
2.00
11.00 ns
CLKOUT to ALE assert time (MAX
= 0.25 x B1 + 6.30)
7.60
—
13.80
15.60
—
6.30
—
12.50
14.30
—
5.00
—
11.30
13.00
—
3.80
—
10.00 ns
11.80 ns
P52
CLKOUT to ALE negate time (MAX
= 0.25 x B1 + 8.00)
P53
PCWE, IOWR negated to D(0:31)
5.60
8.00
4.30
8.00
3.00
8.00
1.80
8.00
—
—
ns
ns
P54
1
invalid (MIN = 0.25 x B1 – 2.00)
WAITA and WAITB valid to
—
—
—
1
P55 CLKOUT rising edge (MIN = 0.00
x B1 + 8.00)
CLKOUT rising edge to WAITA and 2.00
P56 WAITB invalid (MIN = 0.00 x B1 +
—
2.00
—
2.00
—
2.00
—
ns
1
2.00)
1
PSST = 1. Otherwise, add PSST times cycle time.
PSHT = 0. Otherwise, add PSHT times cycle time.
These synchronous timings define when the WAITx signals are detected in order to freeze (or relieve) the PCMCIA
current cycle. The WAITx assertion will be effective only if it is detected 2 cycles before the PSL timer expiration. See
PCMCIA Interface in the MPC866 PowerQUICC User’s Manual.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
39
Bus Signal Timing
Figure 27 shows the PCMCIA access cycle timing for the external bus read.
CLKOUT
TS
P44
A[0:31]
P46
P48
P45
P47
P49
P51
P52
REG
CE1/CE2
PCOE, IORD
ALE
P50
P53
P52
B18
B19
D[0:31]
Figure 27. PCMCIA Access Cycles Timing External Bus Read
MPC866/MPC859 Hardware Specifications, Rev. 2
40
Freescale Semiconductor
Bus Signal Timing
Figure 28 shows the PCMCIA access cycle timing for the external bus write.
CLKOUT
TS
P44
A[0:31]
P46
P48
P45
P47
P49
P51
P52
B9
REG
CE1/CE2
PCWE, IOWR
ALE
P50
P53
B8
P54
P52
D[0:31]
Figure 28. PCMCIA Access Cycles Timing External Bus Write
Figure 29 shows the PCMCIA WAIT signals detection timing.
CLKOUT
P55
P56
WAITx
Figure 29. PCMCIA WAIT Signals Detection Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
41
Bus Signal Timing
Table 12 shows the PCMCIA port timing for the MPC866/859.
Table 12. PCMCIA Port Timing
33 MHz 40 MHz
50 MHz
66 MHz
Num
Characteristic
Unit
Min
Max
Min
Max
Min
Max
Min
Max
CLKOUT to OPx, valid (MAX = 0.00 x B1
+ 19.00)
—
19.00
—
19.00
—
19.00
—
19.00 ns
P57
P58
P59
P60
1
HRESET negated to OPx drive (MIN = 25.70
0.75 x B1 + 3.00)
—
—
—
21.70
5.00
1.00
—
—
—
18.00
5.00
1.00
—
—
—
14.40
5.00
1.00
—
—
—
ns
ns
ns
IP_Xx valid to CLKOUT rising edge (MIN 5.00
= 0.00 x B1 + 5.00)
CLKOUT rising edge to IP_Xx invalid
(MIN = 0.00 x B1 + 1.00)
1.00
1
OP2 and OP3 only.
Figure 30 shows the PCMCIA output port timing for the MPC866/859.
CLKOUT
P57
Output
Signals
HRESET
P58
OP2, OP3
Figure 30. PCMCIA Output Port Timing
Figure 31 shows the PCMCIA output port timing for the MPC866/859.
CLKOUT
P59
P60
Input
Signals
Figure 31. PCMCIA Input Port Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
42
Freescale Semiconductor
Bus Signal Timing
Table 13 shows the debug port timing for the MPC866/859.
Table 13. Debug Port Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
D61 DSCK cycle time
3xT
—
—
CLOCKOUT
D62 DSCK clock pulse width
D63 DSCK rise and fall times
D64 DSDI input data setup time
D65 DSDI data hold time
1.25xT
CLOCKOUT
0.00
8.00
5.00
0.00
0.00
3.00
—
ns
ns
ns
ns
ns
—
D66 DSCK low to DSDO data valid
D67 DSCK low to DSDO invalid
15.00
2.00
Figure 32 shows the input timing for the debug port clock.
DSCK
D61
D61
D62
D62
D63
D63
Figure 32. Debug Port Clock Input Timing
Figure 33 shows the timing for the debug port.
DSCK
D64
D65
DSDI
D66
D67
DSDO
Figure 33. Debug Port Timings
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
43
Bus Signal Timing
Table 14 shows the reset timing for the MPC866/859.
Table 14. Reset Timing
33 MHz 40 MHz
Min Max Min Max
50 MHz
Min Max
66 MHz
Min Max
Num
Characteristic
Unit
CLKOUT to HRESET high impedance
(MAX = 0.00 x B1 + 20.00)
—
20.00
20.00
—
20.00 —
20.00 —
20.00 —
20.00 —
20.00 ns
20.00 ns
R69
R70
CLKOUT to SRESET high impedance
(MAX = 0.00 x B1 + 20.00)
—
—
RSTCONF pulse width (MIN = 17.00 x 515.20 —
B1)
425.00 —
340.00 —
257.60 —
ns
R71
R72
—
—
—
—
—
—
—
—
—
—
ns
Configuration data to HRESET rising
504.50 —
425.00 —
350.00 —
277.30 —
R73 edge setup time (MIN = 15.00 x B1 +
50.00)
Configuration data to RSTCONF rising 350.00 —
R74 edge setup time (MIN = 0.00 x B1 +
350.00)
350.00 —
350.00 —
350.00 —
ns
ns
ns
Configuration data hold time after
R75 RSTCONF negation (MIN = 0.00 x B1 +
0.00)
0.00
0.00
—
—
0.00
0.00
—
—
—
0.00
0.00
—
—
0.00
0.00
—
—
Configuration data hold time after
R76 HRESET negation (MIN = 0.00 x B1 +
0.00)
—
HRESET and RSTCONF asserted to
R77 data out drive (MAX = 0.00 x B1 +
25.00)
25.00
25.00 —
25.00 —
25.00 ns
RSTCONF negated to data out high
R78
—
—
25.00
25.00
—
—
25.00 —
25.00 —
25.00 —
25.00 —
25.00 ns
25.00 ns
impedance (MAX = 0.00 x B1 + 25.00)
CLKOUT of last rising edge before chip
R79 three-states HRESET to data out high
impedance (MAX = 0.00 x B1 + 25.00)
R80 DSDI, DSCK setup (MIN = 3.00 x B1)
90.90
—
—
75.00
0.00
—
—
60.00
0.00
—
—
45.50
0.00
—
—
ns
ns
DSDI, DSCK hold time (MIN = 0.00 x B1 0.00
+ 0.00)
R81
SRESET negated to CLKOUT rising
242.40 —
200.00 —
160.00 —
121.20 —
ns
R82 edge for DSDI and DSCK sample (MIN
= 8.00 x B1)
MPC866/MPC859 Hardware Specifications, Rev. 2
44
Freescale Semiconductor
Bus Signal Timing
Figure 34 shows the reset timing for the data bus configuration.
HRESET
R71
R76
RSTCONF
R73
R74
R75
D[0:31] (IN)
Figure 34. Reset Timing—Configuration from Data Bus
Figure 35 shows the reset timing for the data bus weak drive during configuration.
CLKOUT
R69
HRESET
R79
RSTCONF
R77
R78
D[0:31] (OUT)
(Weak)
Figure 35. Reset Timing—Data Bus Weak Drive During Configuration
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
45
IEEE 1149.1 Electrical Specifications
Figure 36 shows the reset timing for the debug port configuration.
CLKOUT
R70
R82
R80
SRESET
R80
R81
R81
DSCK, DSDI
Figure 36. Reset Timing—Debug Port Configuration
11 IEEE 1149.1 Electrical Specifications
Table 15 shows the JTAG timings for the MPC866/859 shown in Figure 37 through Figure 40.
Table 15. JTAG Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
J82
TCK cycle time
100.00
40.00
0.00
5.00
25.00
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
J83
J84
J85
J86
J87
J88
J89
J90
J91
J92
J93
J94
J95
J96
TCK clock pulse width measured at 1.5 V
TCK rise and fall times
10.00
—
TMS, TDI data setup time
TMS, TDI data hold time
—
TCK low to TDO data valid
27.00
—
TCK low to TDO data invalid
0.00
—
TCK low to TDO high impedance
TRST assert time
20.00
—
100.00
40.00
—
TRST setup time to TCK low
—
TCK falling edge to output valid
TCK falling edge to output valid out of high impedance
TCK falling edge to output high impedance
Boundary scan input valid to TCK rising edge
TCK rising edge to boundary scan input invalid
50.00
50.00
50.00
—
—
—
50.00
50.00
—
MPC866/MPC859 Hardware Specifications, Rev. 2
46
Freescale Semiconductor
IEEE 1149.1 Electrical Specifications
TCK
J82
J83
J82
J83
J84
J84
Figure 37. JTAG Test Clock Input Timing
TCK
J85
J86
TMS, TDI
J87
J88
J89
TDO
Figure 38. JTAG Test Access Port Timing Diagram
TCK
J91
J90
TRST
Figure 39. JTAG TRST Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
47
CPM Electrical Characteristics
TCK
J92
J93
J94
Output
Signals
Output
Signals
J95
J96
Output
Signals
Figure 40. Boundary Scan (JTAG) Timing Diagram
12 CPM Electrical Characteristics
This section provides the AC and DC electrical specifications for the communications processor module (CPM) of
the MPC866/859.
12.1 PIP/PIO AC Electrical Specifications
Table 16 shows the PIP/PIO AC timings as shown in Figure 41 through Figure 45.
Table 16. PIP/PIO Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
21
22
23
24
25
26
27
28
29
30
31
Data-in setup time to STBI low
0
2.5 – t3
1.5
—
—
—
—
—
—
2
ns
clk
clk
ns
clk
clk
clk
clk
ns
ns
ns
1
Data-In hold time to STBI high
STBI pulse width
STBO pulse width
1 clk – 5ns
Data-out setup time to STBO low
Data-out hold time from STBO high
STBI low to STBO low (Rx interlock)
STBI low to STBO high (Tx interlock)
Data-in setup time to clock high
Data-in hold time from clock high
Clock low to data-out valid (CPU writes data, control, or direction)
2
5
—
2
—
—
—
25
15
7.5
—
1
t3 = Specification 23
MPC866/MPC859 Hardware Specifications, Rev. 2
48
Freescale Semiconductor
CPM Electrical Characteristics
DATA-IN
STBI
21
22
23
27
24
STBO
Figure 41. PIP Rx (Interlock Mode) Timing Diagram
DATA-OUT
25
26
24
STBO
(Output)
28
23
STBI
(Input)
Figure 42. PIP Tx (Interlock Mode) Timing Diagram
DATA-IN
21
22
23
24
STBI
(Input)
STBO
(Output)
Figure 43. PIP Rx (Pulse Mode) Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
49
CPM Electrical Characteristics
DATA-OUT
25
26
24
23
STBO
(Output)
STBI
(Input)
Figure 44. PIP TX (Pulse Mode) Timing Diagram
CLKO
DATA-IN
29
30
31
DATA-OUT
Figure 45. Parallel I/O Data-In/Data-Out Timing Diagram
12.2 Port C Interrupt AC Electrical Specifications
Table 17 shows timings for port C interrupts.
Table 17. Port C Interrupt Timing
33.34 MHz
Num
Characteristic
Unit
Min
Max
35
36
Port C interrupt pulse width low (edge-triggered mode)
Port C interrupt minimum time between active edges
55
55
—
—
ns
ns
Figure 46 shows the port C interrupt detection timing.
MPC866/MPC859 Hardware Specifications, Rev. 2
50
Freescale Semiconductor
CPM Electrical Characteristics
36
Port C
(Input)
35
Figure 46. Port C Interrupt Detection Timing
12.3 IDMA Controller AC Electrical Specifications
Table 18 shows the IDMA controller timings as shown in Figure 47 through Figure 50.
Table 18. IDMA Controller Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
40
41
42
43
44
45
46
DREQ setup time to clock high
7
3
—
—
12
12
20
15
—
ns
ns
ns
ns
ns
ns
ns
DREQ hold time from clock high
SDACK assertion delay from clock high
SDACK negation delay from clock low
—
—
—
—
7
SDACK negation delay from TA low
SDACK negation delay from clock high
TA assertion to falling edge of the clock setup time (applies to external TA)
CLKO
(Output)
41
40
DREQ
(Input)
Figure 47. IDMA External Requests Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
51
CPM Electrical Characteristics
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
43
DATA
46
TA
(Input)
SDACK
Figure 48. SDACK Timing Diagram—Peripheral Write, Externally-Generated TA
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
44
DATA
TA
(Output)
SDACK
Figure 49. SDACK Timing Diagram—Peripheral Write, Internally-Generated TA
MPC866/MPC859 Hardware Specifications, Rev. 2
52
Freescale Semiconductor
CPM Electrical Characteristics
CLKO
(Output)
TS
(Output)
R/W
(Output)
42
45
DATA
TA
(Output)
SDACK
Figure 50. SDACK Timing Diagram—Peripheral Read, Internally-Generated TA
12.4 Baud Rate Generator AC Electrical Specifications
Table 19 shows the baud rate generator timings as shown in Figure 51.
Table 19. Baud Rate Generator Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
50
51
52
BRGO rise and fall time
BRGO duty cycle
BRGO cycle
—
40
40
10
60
—
ns
%
ns
50
50
BRGOX
51
51
52
Figure 51. Baud Rate Generator Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
53
CPM Electrical Characteristics
12.5 Timer AC Electrical Specifications
Table 20 shows the general-purpose timer timings as shown in Figure 52.
Table 20. Timer Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
61
62
63
64
65
TIN/TGATE rise and fall time
TIN/TGATE low time
10
1
—
—
—
—
25
ns
clk
clk
clk
ns
TIN/TGATE high time
TIN/TGATE cycle time
CLKO low to TOUT valid
2
3
3
CLKO
60
61
63
62
TIN/TGATE
(Input)
61
64
65
TOUT
(Output)
Figure 52. CPM General-Purpose Timers Timing Diagram
12.6 Serial Interface AC Electrical Specifications
Table 21 shows the serial interface timings as shown in Figure 53 through Figure 57.
Table 21. SI Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
1, 2
70
71
L1RCLK, L1TCLK frequency (DSC = 0)
L1RCLK, L1TCLK width low (DSC = 0)
L1RCLK, L1TCLK width high (DSC = 0)
—
SYNCCLK/2.5
MHz
ns
2
P + 10
P + 10
—
—
—
3
71a
72
ns
L1TXD, L1ST(1–4), L1RQ, L1CLKO rise/fall time
15.00
—
ns
73
L1RSYNC, L1TSYNC valid to L1CLK edge (SYNC
setup time)
20.00
ns
MPC866/MPC859 Hardware Specifications, Rev. 2
54
Freescale Semiconductor
CPM Electrical Characteristics
Table 21. SI Timing (continued)
All Frequencies
Num
Characteristic
Unit
Min
Max
74
L1CLK edge to L1RSYNC, L1TSYNC, invalid
(SYNC hold time)
35.00
—
ns
75
76
L1RSYNC, L1TSYNC rise/fall time
—
15.00
ns
ns
L1RXD valid to L1CLK edge (L1RXD setup time)
L1CLK edge to L1RXD invalid (L1RXD hold time)
17.00
13.00
10.00
10.00
10.00
10.00
10.00
0.00
—
77
—
ns
4
78
L1CLK edge to L1ST(1–4) valid
45.00
ns
78A
79
L1SYNC valid to L1ST(1–4) valid
L1CLK edge to L1ST(1–4) invalid
L1CLK edge to L1TXD valid
45.00
ns
45.00
ns
80
55.00
ns
4
80A
81
L1TSYNC valid to L1TXD valid
55.00
ns
L1CLK edge to L1TXD high impedance
L1RCLK, L1TCLK frequency (DSC =1)
L1RCLK, L1TCLK width low (DSC =1)
42.00
ns
82
—
16.00 or SYNCCLK/2
MHz
ns
83
P + 10
P + 10
—
—
—
3
83a
84
L1RCLK, L1TCLK width high (DSC = 1)
ns
L1CLK edge to L1CLKO valid (DSC = 1)
30.00
—
ns
4
85
L1RQ valid before falling edge of L1TSYNC
1.00
L1TCLK
ns
2
86
L1GR setup time
42.00
42.00
—
—
87
L1GR hold time
—
ns
88
L1CLK edge to L1SYNC valid (FSD = 00) CNT =
0000, BYT = 0, DSC = 0)
0.00
ns
1
2
3
4
The ratio SyncCLK/L1RCLK must be greater than 2.5/1.
These specs are valid for IDL mode only.
Where P = 1/CLKOUT. Thus, for a 25-MHz CLKO1 rate, P = 40 ns.
These strobes and TxD on the first bit of the frame become valid after L1CLK edge or L1SYNC, whichever is later.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
55
CPM Electrical Characteristics
L1RCLK
(FE=0, CE=0)
(Input)
71
70
71a
72
L1RCLK
(FE=1, CE=1)
(Input)
RFSD=1
75
74
L1RSYNC
(Input)
73
77
L1RXD
(Input)
BIT0
76
78
79
L1ST(4-1)
(Output)
Figure 53. SI Receive Timing Diagram with Normal Clocking (DSC = 0)
MPC866/MPC859 Hardware Specifications, Rev. 2
56
Freescale Semiconductor
CPM Electrical Characteristics
L1RCLK
(FE=1, CE=1)
(Input)
72
83a
82
L1RCLK
(FE=0, CE=0)
(Input)
RFSD=1
75
L1RSYNC
(Input)
73
74
77
L1RXD
(Input)
BIT0
76
78
79
L1ST(4-1)
(Output)
84
L1CLKO
(Output)
Figure 54. SI Receive Timing with Double-Speed Clocking (DSC = 1)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
57
CPM Electrical Characteristics
L1TCLK
(FE=0, CE=0)
(Input)
71
70
72
L1TCLK
(FE=1, CE=1)
(Input)
73
TFSD=0
75
74
L1TSYNC
(Input)
80a
BIT0
80
81
L1TXD
(Output)
79
78
L1ST(4-1)
(Output)
Figure 55. SI Transmit Timing Diagram (DSC = 0)
MPC866/MPC859 Hardware Specifications, Rev. 2
58
Freescale Semiconductor
CPM Electrical Characteristics
L1RCLK
(FE=0, CE=0)
(Input)
72
83a
82
L1RCLK
(FE=1, CE=1)
(Input)
TFSD=0
75
L1RSYNC
(Input)
73
74
81
L1TXD
(Output)
BIT0
80
78a
79
L1ST(4-1)
(Output)
78
84
L1CLKO
(Output)
Figure 56. SI Transmit Timing with Double Speed Clocking (DSC = 1)
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
59
CPM Electrical Characteristics
Figure 57. IDL Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
60
Freescale Semiconductor
CPM Electrical Characteristics
12.7 SCC in NMSI Mode Electrical Specifications
Table 22 shows the NMSI external clock timings.
Table 22. NMSI External Clock Timings
All Frequencies
Num
Characteristic
Unit
Min
Max
1
100
101
102
103
104
105
106
107
108
RCLK1 and TCLK1 width high
1/SYNCCLK
—
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
RCLK1 and TCLK1 width low
1/SYNCCLK +5
RCLK1 and TCLK1 rise/fall time
—
15.00
50.00
50.00
—
TXD1 active delay (from TCLK1 falling edge)
RTS1 active/inactive delay (from TCLK1 falling edge)
CTS1 setup time to TCLK1 rising edge
RXD1 setup time to RCLK1 rising edge
0.00
0.00
5.00
5.00
5.00
5.00
—
2
RXD1 hold time from RCLK1 rising edge
—
CD1 setup time to RCLK1 rising edge
—
1
2
The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater than or equal to 2.25/1.
Also applies to CD and CTS hold time when they are used as an external sync signal.
Table 23 shows the NMSI internal clock timings.
Table 23. NMSI Internal Clock Timings
All Frequencies
Num
Characteristic
Unit
Min
Max
1
100
102
103
104
105
106
107
108
RCLK1 and TCLK1 frequency
0.00
—
SYNCCLK/3
MHz
ns
RCLK1 and TCLK1 rise/fall time
—
30.00
30.00
—
TXD1 active delay (from TCLK1 falling edge)
RTS1 active/inactive delay (from TCLK1 falling edge)
CTS1 setup time to TCLK1 rising edge
RXD1 setup time to RCLK1 rising edge
0.00
0.00
40.00
40.00
0.00
40.00
ns
ns
ns
—
ns
2
RXD1 hold time from RCLK1 rising edge
—
ns
CD1 setup time to RCLK1 rising edge
—
ns
1
2
The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater or equal to 3/1.
Also applies to CD and CTS hold time when they are used as an external sync signals.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
61
CPM Electrical Characteristics
Figure 58 through Figure 60 show the NMSI timings.
RCLK1
102
102
101
106
100
RxD1
(Input)
107
108
CD1
(Input)
107
CD1
(SYNC Input)
Figure 58. SCC NMSI Receive Timing Diagram
TCLK1
102
102
101
100
TxD1
(Output)
103
105
RTS1
(Output)
104
104
CTS1
(Input)
107
CTS1
(SYNC Input)
Figure 59. SCC NMSI Transmit Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
62
Freescale Semiconductor
CPM Electrical Characteristics
TCLK1
102
102
101
100
TxD1
(Output)
103
RTS1
(Output)
104
107
104
105
CTS1
(Echo Input)
Figure 60. HDLC Bus Timing Diagram
12.8 Ethernet Electrical Specifications
Table 24 shows the Ethernet timings as shown in Figure 61 through Figure 65.
Table 24. Ethernet Timing
All Frequencies
Unit
Num
Characteristic
Min
Max
120 CLSN width high
121 RCLK1 rise/fall time
122 RCLK1 width low
123 RCLK1 clock period
124 RXD1 setup time
125 RXD1 hold time
40
—
—
15
—
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
40
80
20
5
1
120
—
—
126 RENA active delay (from RCLK1 rising edge of the last data bit)
127 RENA width low
10
100
—
—
—
128 TCLK1 rise/fall time
15
—
129 TCLK1 width low
40
99
—
1
130 TCLK1 clock period
101
50
50
50
131 TXD1 active delay (from TCLK1 rising edge)
132 TXD1 inactive delay (from TCLK1 rising edge)
133 TENA active delay (from TCLK1 rising edge)
6.5
10
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
63
CPM Electrical Characteristics
Table 24. Ethernet Timing (continued)
Characteristic
All Frequencies
Num
Unit
Min
Max
134 TENA inactive delay (from TCLK1 rising edge)
135 RSTRT active delay (from TCLK1 falling edge)
136 RSTRT inactive delay (from TCLK1 falling edge)
137 REJECT width low
10
10
10
1
50
50
50
—
ns
ns
ns
CLK
ns
2
138 CLKO1 low to SDACK asserted
—
—
20
20
2
139 CLKO1 low to SDACK negated
ns
1
2
The ratios SyncCLK/RCLK1 and SyncCLK/TCLK1 must be greater or equal to 2/1.
SDACK is asserted whenever the SDMA writes the incoming frame DA into memory.
CLSN(CTS1)
(Input)
120
Figure 61. Ethernet Collision Timing Diagram
RCLK1
121
121
124
123
Last Bit
RxD1
(Input)
125
126
127
RENA(CD1)
(Input)
Figure 62. Ethernet Receive Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
64
Freescale Semiconductor
CPM Electrical Characteristics
TCLK1
128
128
129
131
121
TxD1
(Output)
132
133
134
TENA(RTS1)
(Input)
RENA(CD1)
(Input)
Notes:
1. Transmit clock invert (TCI) bit in GSMR is set.
2. If RENA is deasserted before TENA, or RENA is not asserted at all during transmit, then the
CSL bit is set in the buffer descriptor at the end of the frame transmission.
Figure 63. Ethernet Transmit Timing Diagram
RCLK1
RxD1
(Input)
0
1
1
BIT1
125
BIT2
136
Start Frame Delimiter
RSTRT
(Output)
Figure 64. CAM Interface Receive Start Timing Diagram
REJECT
137
Figure 65. CAM Interface REJECT Timing Diagram
12.9 SMC Transparent AC Electrical Specifications
Table 25 shows the SMC transparent timings as shown in Figure 66.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
65
CPM Electrical Characteristics
Table 25. SMC Transparent Timing
Characteristic
All Frequencies
Num
Unit
Min
Max
1
150
151
151A
152
153
154
155
SMCLK clock period
SMCLK width low
SMCLK width high
SMCLK rise/fall time
100
50
50
—
—
—
—
15
50
—
—
ns
ns
ns
ns
ns
ns
ns
SMTXD active delay (from SMCLK falling edge)
SMRXD/SMSYNC setup time
10
20
5
RXD1/SMSYNC hold time
1
Sync CLK must be at least twice as fast as SMCLK.
SMCLK
152
152
151
151A
150
SMTXD
(Output)
NOTE 1
154
153
155
SMSYNC
154
155
SMRXD
(Input)
NOTE:
1. This delay is equal to an integer number of character-length clocks.
Figure 66. SMC Transparent Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
66
Freescale Semiconductor
CPM Electrical Characteristics
12.10SPI Master AC Electrical Specifications
Table 26 shows the SPI master timings as shown in Figure 67 and Figure 68.
Table 26. SPI Master Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
160
161
162
163
164
165
166
167
MASTER cycle time
4
2
1024
512
—
t
t
cyc
cyc
MASTER clock (SCK) high or low time
MASTER data setup time (inputs)
Master data hold time (inputs)
Master data valid (after SCK edge)
Master data hold time (outputs)
Rise time output
15
0
ns
ns
ns
ns
ns
ns
—
—
0
10
—
—
—
15
Fall time output
15
SPICLK
(CI=0)
(Output)
161
163
167
166
166
167
161
160
SPICLK
(CI=1)
(Output)
162
SPIMISO
(Input)
msb
167
Data
165
lsb
msb
164
166
SPIMOSI
(Output)
msb
Data
lsb
msb
Figure 67. SPI Master (CP = 0) Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
67
CPM Electrical Characteristics
SPICLK
(CI=0)
(Output)
161
167
166
166
167
161
160
SPICLK
(CI=1)
(Output)
163
162
SPIMISO
(Input)
msb
167
Data
165
lsb
msb
164
166
SPIMOSI
(Output)
msb
Data
lsb
msb
Figure 68. SPI Master (CP = 1) Timing Diagram
12.11SPI Slave AC Electrical Specifications
Table 27 shows the SPI slave timings as shown in Figure 69 and Figure 70.
Table 27. SPI Slave Timing
All Frequencies
Num
Characteristic
Unit
Min
Max
170
171
172
173
174
175
176
177
Slave cycle time
2
—
—
—
—
—
—
—
50
t
cyc
Slave enable lead time
Slave enable lag time
15
15
1
ns
ns
Slave clock (SPICLK) high or low time
Slave sequential transfer delay (does not require deselect)
Slave data setup time (inputs)
t
cyc
cyc
1
t
20
20
—
ns
ns
ns
Slave data hold time (inputs)
Slave access time
MPC866/MPC859 Hardware Specifications, Rev. 2
68
Freescale Semiconductor
CPM Electrical Characteristics
SPISEL
(Input)
172
171
174
SPICLK
(CI=0)
(Input)
173
182
181
173
170
SPICLK
(CI=1)
(Input)
177
181
182
180
178
Undef
SPIMISO
(Output)
msb
176
Data
lsb
msb
msb
175
179
181 182
lsb
SPIMOSI
(Input)
msb
Data
Figure 69. SPI Slave (CP = 0) Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
69
CPM Electrical Characteristics
SPISEL
(Input)
172
174
171
170
SPICLK
(CI=0)
(Input)
173
182
181
173
181
SPICLK
(CI=1)
(Input)
177
182
180
178
SPIMISO
(Output)
msb
msb
msb
Undef
175
Data
lsb
179
176
181 182
Data
SPIMOSI
(Input)
msb
lsb
Figure 70. SPI Slave (CP = 1) Timing Diagram
12.12I2C AC Electrical Specifications
MPC866/MPC859 Hardware Specifications, Rev. 2
70
Freescale Semiconductor
CPM Electrical Characteristics
2
Table 28 shows the I C (SCL < 100 kHz) timings.
2
Table 28. I C Timing (SCL < 100 kHz)
All Frequencies
Num
Characteristic
Unit
Min
Max
200
200
202
203
204
205
206
207
208
209
210
211
SCL clock frequency (slave)
SCL clock frequency (master)
0
100
100
—
kHz
kHz
μs
μs
μs
μs
μs
μs
ns
1
1.5
4.7
4.7
4.0
4.7
4.0
0
Bus free time between transmissions
Low period of SCL
—
High period of SCL
—
Start condition setup time
Start condition hold time
Data hold time
—
—
—
Data setup time
250
—
—
SDL/SCL rise time
1
μs
ns
SDL/SCL fall time
—
300
—
Stop condition setup time
4.7
μs
1
SCL frequency is given by SCL = BRGCLK_frequency / ((BRG register + 3) * pre_scaler * 2).
The ratio SyncClk/(BRGCLK/pre_scaler) must be greater or equal to 4/1.
2
Table 29 shows the I C (SCL > 100 kHz) timings.
2
Table 29. I C Timing (SCL > 100 kHz)
All Frequencies
Num
Characteristic
Expression
Unit
Min
Max
200
200
202
203
204
205
206
207
208
209
210
211
SCL clock frequency (slave)
SCL clock frequency (master)
fSCL
fSCL
—
0
BRGCLK/48
Hz
Hz
s
1
BRGCLK/16512
1/(2.2 * fSCL)
1/(2.2 * fSCL)
1/(2.2 * fSCL)
1/(2.2 * fSCL)
1/(2.2 * fSCL)
0
BRGCLK/48
Bus free time between transmissions
Low period of SCL
—
—
—
s
High period of SCL
—
—
s
Start condition setup time
Start condition hold time
Data hold time
—
—
s
—
—
s
—
—
—
s
Data setup time
—
1/(40 * fSCL)
—
s
SDL/SCL rise time
—
1/(10 * fSCL)
1/(33 * fSCL)
—
s
SDL/SCL fall time
—
—
s
Stop condition setup time
—
1/2(2.2 * fSCL)
s
1
SCL frequency is given by SCL = BrgClk_frequency / ((BRG register + 3) * pre_scaler * 2).
The ratio SyncClk/(Brg_Clk/pre_scaler) must be greater or equal to 4/1.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
71
UTOPIA AC Electrical Specifications
2
Figure 71 shows the I C bus timing.
SDA
202
203
204
208
205
207
SCL
206
209
210
211
2
Figure 71. I C Bus Timing Diagram
13 UTOPIA AC Electrical Specifications
Table 30 through Table 32 show the AC electrical specifications for the UTOPIA interface.
Table 30. UTOPIA Master (Muxed Mode) Electrical Specifications
Num
Signal Characteristic
Direction
Min
Max
Unit
U1
UtpClk rise/fall time (Internal clock option)
Output
—
50
—
2
4
ns
%
Duty cycle
Frequency
50
33
16
MHz
ns
U2
UTPB, SOC, RxEnb, TxEnb, RxAddr, and TxAddr-active
delay (and PHREQ and PHSEL active delay in MPHY mode)
Output
U3
U4
UTPB, SOC, Rxclav and Txclav setup time
UTPB, SOC, Rxclav and Txclav hold time
Input
Input
4
1
—
—
ns
ns
Table 31. UTOPIA Master (Split Bus Mode) Electrical Specifications
Num
Signal Characteristic
Direction
Min
Max
Unit
U1
UtpClk rise/fall time (Internal clock option)
Output
—
50
—
2
4
ns
%
Duty cycle
Frequency
50
33
16
MHz
ns
U2
UTPB, SOC, RxEnb, TxEnb, RxAddr and TxAddr active
delay (PHREQ and PHSEL active delay in MPHY mode)
Output
U3
U4
UTPB_Aux, SOC_Aux, Rxclav, and Txclav setup time
UTPB_Aux, SOC_Aux, Rxclav, and Txclav hold time
Input
Input
4
1
—
—
ns
ns
MPC866/MPC859 Hardware Specifications, Rev. 2
72
Freescale Semiconductor
UTOPIA AC Electrical Specifications
Table 32. UTOPIA Slave (Split Bus Mode) Electrical Specifications
Num
Signal Characteristic
Direction
Min
Max
Unit
U1
UtpClk rise/fall time (external clock option)
Duty cycle
Input
—
40
—
2
4
ns
%
60
33
16
—
Frequency
MHz
ns
U2
U3
UTPB, SOC, Rxclav and Txclav active delay
Output
Input
UTPB_AUX, SOC_Aux, RxEnb, TxEnb, RxAddr, and TxAddr
setup time
4
ns
U4
UTPB_AUX, SOC_Aux, RxEnb, TxEnb, RxAddr, and TxAddr
hold time
Input
1
—
ns
Figure 72 shows signal timings during UTOPIA receive operations.
U1
U1
UtpClk
U2
PHREQn
U3
U4
RxClav
RxEnb
HighZ at MPHY
HighZ at MPHY
U2
UTPB
SOC
U3
U4
Figure 72. UTOPIA Receive Timing
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
73
FEC Electrical Characteristics
Figure 73 shows signal timings during UTOPIA transmit operations.
U1
U1
UtpClk
U2
PHSELn
TxClav
U3
U4
HighZ at MPHY
High-Z at MPHY
U2
TxEnb
UTPB
SOC
U2
Figure 73. UTOPIA Transmit Timing
14 FEC Electrical Characteristics
This section provides the AC electrical specifications for the fast Ethernet controller (FEC). Note that the timing
specifications for the MII signals are independent of system clock frequency (part speed designation). Also, MII
signals use TTL signal levels compatible with devices operating at either 5.0 or 3.3 V.
14.1 MII Receive Signal Timing (MII_RXD [3:0], MII_RX_DV,
MII_RX_ER, MII_RX_CLK)
The receiver functions correctly up to a MII_RX_CLK maximum frequency of 25 MHz + 1%. There is no minimum
frequency requirement. In addition, the processor clock frequency must exceed the MII_RX_CLK frequency – 1%.
Table 33 shows the timings for MII receive signal.
Table 33. MII Receive Signal Timing
Num
Characteristic
Min
Max
Unit
M1
M2
M3
M4
MII_RXD[3:0], MII_RX_DV, MII_RX_ER to MII_RX_CLK setup
MII_RX_CLK to MII_RXD[3:0], MII_RX_DV, MII_RX_ER hold
MII_RX_CLK pulse width high
5
—
—
ns
5
ns
35%
35%
65%
65%
MII_RX_CLK period
MII_RX_CLK period
MII_RX_CLK pulse width low
Figure 74 shows the timings for MII receive signal.
MPC866/MPC859 Hardware Specifications, Rev. 2
74
Freescale Semiconductor
FEC Electrical Characteristics
M3
MII_RX_CLK (input)
M4
MII_RXD[3:0] (inputs)
MII_RX_DV
MII_RX_ER
M1
M2
Figure 74. MII Receive Signal Timing Diagram
14.2 MII Transmit Signal Timing (MII_TXD[3:0], MII_TX_EN,
MII_TX_ER, MII_TX_CLK)
The transmitter functions correctly up to a MII_TX_CLK maximum frequency of 25 MHz +1%. There is no
minimum frequency requirement. In addition, the processor clock frequency must exceed the MII_TX_CLK
frequency - 1%.
Table 34 shows information on the MII transmit signal timing.
Table 34. MII Transmit Signal Timing
Num
Characteristic
Min
Max
Unit
M5
MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER
invalid
5
—
ns
M6
MII_TX_CLK to MII_TXD[3:0], MII_TX_EN, MII_TX_ER
valid
—
25
—
M7
M8
MII_TX_CLK pulse width high
MII_TX_CLK pulse width low
35%
35%
65%
65%
MII_TX_CLK period
MII_TX_CLK period
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
75
FEC Electrical Characteristics
Figure 75 shows the MII transmit signal timing diagram.
M7
MII_TX_CLK (input)
M5
M8
MII_TXD[3:0] (outputs)
MII_TX_EN
MII_TX_ER
M6
Figure 75. MII Transmit Signal Timing Diagram
14.3 MII Async Inputs Signal Timing (MII_CRS, MII_COL)
Table 35 shows the timing for on the MII async inputs signal.
Table 35. MII Async Inputs Signal Timing
Num
Characteristic
Min
Max
Unit
M9
MII_CRS, MII_COL minimum pulse width
1.5
—
MII_TX_CLK period
Figure 76 shows the MII asynchronous inputs signal timing diagram.
MII_CRS, MII_COL
M9
Figure 76. MII Async Inputs Timing Diagram
14.4 MII Serial Management Channel Timing (MII_MDIO, MII_MDC)
Table 36 shows the timing for the MII serial management channel signal. The FEC functions correctly with a
maximum MDC frequency in excess of 2.5 MHz. The exact upper bound is under investigation.
Table 36. MII Serial Management Channel Timing
Num
Characteristic
Min
Max
Unit
M10
MII_MDC falling edge to MII_MDIO output invalid (minimum
propagation delay)
0
—
ns
M11
M12
MII_MDC falling edge to MII_MDIO output valid (maximum
propagation delay)
—
25
—
ns
ns
MII_MDIO (input) to MII_MDC rising edge setup
10
MPC866/MPC859 Hardware Specifications, Rev. 2
76
Freescale Semiconductor
FEC Electrical Characteristics
Table 36. MII Serial Management Channel Timing
Num
Characteristic
Min
Max
Unit
M13
M14
M15
MII_MDIO (input) to MII_MDC rising edge hold
MII_MDC pulse width high
0
—
ns
40%
40%
60%
60%
MII_MDC period
MII_MDC period
MII_MDC pulse width low
Figure 77 shows the MII serial management channel timing diagram.
M14
MM15
MII_MDC (output)
MII_MDIO (output)
M10
M11
MII_MDIO (input)
M12
M13
Figure 77. MII Serial Management Channel Timing Diagram
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
77
Mechanical Data and Ordering Information
15 Mechanical Data and Ordering Information
Table 37 shows information on the MPC866/859 derivative devices.
Table 37. MPC866/859 Derivatives
Number
of
SCCs
Cache Size
Ethernet
Support
Multi-Channel
HDLC Support
Device
ATM Support
1
Instruction
Data
MPC866T
MPC866P
MPC859T
4
4
10/100 Mbps
10/100 Mbps
10/100 Mbps
10/100 Mbps
Yes
Yes
Yes
No
Yes
4 Kbyte
16 Kbyte
4 Kbyte
4 Kbyte
4 Kbytes
8 Kbytes
4 Kbytes
4 Kbytes
Yes
Yes
1 (SCC1)
MPC859DSL 1 (SCC1)
Up to 4 addresses
1
Serial communications controller (SCC).
Table 38 identifies the packages and operating frequencies orderable for the MPC866/859 derivative devices.
Table 38. MPC866/859 Package/Frequency Orderable
Package Type
Plastic ball grid array
(ZP suffix)
Non lead free
Temperature (Tj)
Frequency (MHz)
Order Number
0° to 95°C
50
66
MPC859DSLZP50A
MPC859DSLZP66A
100
MPC859PZP100A
MPC859TZP100A
MPC866PZP100A
MPC866TZP100A
133
MPC859PZP133A
MPC859TZP133A
MPC866PZP133A
MPC866TZP133A
Plastic ball grid array
(CZP suffix)
Non lead free
–40° to 100°C
50
66
MPC859DSLCZP50A
MPC859DSLCZP66A
100
MPC859PCZP100A
MPC859TCZP100A
MPC866PCZP100A
MPC866TCZP100A
MPC866/MPC859 Hardware Specifications, Rev. 2
78
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 38. MPC866/859 Package/Frequency Orderable (continued)
Plastic ball grid array
(VR suffix)
Lead free
0° to 95°C
50
66
MPC859DSLVR50A
MPC859DSLVR66A
100
MPC859PVR100A
MPC859TVR100A
MPC866PVR100A
MPC866TVR100A
133
MPC859PVR133A
MPC859TVR133A
MPC866PVR133A
MPC866TVR133A
Plastic ball grid array
(CVR suffix)
Lead free
–40° to 100°C
50
66
MPC859DSLCVR50A
MPC859DSLCVR66A
100
MPC859PCVR100A
MPC859TCVR100A
MPC866PCVR100A
MPC866TCVR100A
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
79
Mechanical Data and Ordering Information
15.1 Pin Assignments
Figure 78 shows the top view pinout of the PBGA package. For additional information, see the MPC866
PowerQUICC Family User’s Manual.
NOTE: This is the top view of the device.
W
V
U
T
PD10 PD8
PD14 PD13 PD9
PA0 PB14 PD15
PD3
IRQ7 D0
D4
D1
D2
D3
D5
VDDL
D20
D6
D7
D29
DP1
DP2 CLKOUT IPA3
VSSSYN1
N/C
PD6 M_Tx_EN IRQ0 D13
D27
D10
D14
D18
D24
D28
DP3
DP0
PD4
PD5 IRQ1
D8
D23
D17
D11
D9
D16
D15
D19
D22
D21
D25
D26
D31
D30 IPA5 IPA4 IPA2
IPA6 IPA0 IPA1 IPA7
N/C VSSSYN
N/C VDDSYN
PA1
PC6
PC5 PC4 PD11
PA2 PB15 PD12
PD7 VDDH D12
VDDH
R
P
N
M
L
VDDH
WAIT_B WAIT_A
VDDL RSTCONF
VDDL
PORESET
SRESET
PA4 PB17 PA3 VDDL
PB19 PA5 PB18 PB16
GND
GND
XTAL
TEXP
HRESET
EXTCLK EXTAL
PA7
PC8
PA6
PC7
BADDR28
MODCK2
OP0
BADDR29 VDDL
OP1 MODCK1
PB22 PC9
PA8 PB20
AS
K
J
PC10 PA9 PB23 PB21
PC11 PB24 PA10 PB25
GND
BADDR30 IPB6 ALEA IRQ4
IPB5 IPB1 IPB2 ALEB
M_COL IRQ2 IPB0 IPB7
H
G
F
VDDL M_MDIO TDI
TCK
TRST TMS TDO PA11
PB26 PC12 PA12 VDDL
PB27 PC13 PA13 PB29
PB28 PC14 PA14 PC15
BR
VDDL
CS3
IRQ6 IPB4 IPB3
GND
GND
TS
BI
IRQ3 BURST
VDDH
VDDH
CS6
E
D
C
B
A
BG
BB
A8
A9
N/C
A12
A13
N/C
A16
A17
A15
A20
A21
A19
A24
A23
A25
A18 BSA0 GPLA0 N/C
CS2 GPLA5 BDIP TEA
PB30 PA15 PB31
A3
A6
A26 TSIZ1 BSA1 WE0 GPLA1 GPLA3 CS7
CS0
TA GPLA4
A0
19
A1
A4
A10
A22 TSIZ0 BSA3 M_CRS WE2 GPLA2 CS5 CE1A WR GPLB4
A2
18
A5
17
A7
16
A11
15
A14
14
A27
13
A29
12
A30
11
A28
10
A31 VDDL BSA2 WE1 WE3 CS4 CE2A CS1
9
8
7
6
5
4
3
2
1
Figure 78. Pinout of the PBGA Package
MPC866/MPC859 Hardware Specifications, Rev. 2
80
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39 contains a list of the MPC866 input and output signals and shows multiplexing and pin assignments.
Table 39. Pin Assignments
Name
Pin Number
Type
Bidirectional
A[0:31]
B19, B18, A18, C16, B17, A17, B16, A16, D15, C15, B15, A15,
C14, B14, A14, D12, C13, B13, D9, D11, C12, B12, B10, B11, C11, Three-state
D10, C10, A13, A10, A12, A11, A9
TSIZ0
REG
B9
Bidirectional
Three-state
TSIZ1
RD/WR
BURST
BDIP
C9
B2
F1
D2
Bidirectional
Three-state
Bidirectional
Three-state
Bidirectional
Three-state
Output
GPL_B5
TS
F3
C2
Bidirectional
Active Pull-up
TA
Bidirectional
Active Pull-up
TEA
BI
D1
E3
Open-drain
Bidirectional
Active Pull-up
IRQ2
RSV
H3
K1
Bidirectional
Three-state
IRQ4
Bidirectional
Three-state
KR
RETRY
SPKROUT
CR
F2
Input
IRQ3
D[0:31]
W14, W12, W11, W10, W13, W9, W7, W6, U13, T11, V11, U11,
T13, V13, V10, T10, U10, T12, V9, U9, V8, U8, T9, U12, V7, T8,
U7, V12, V6, W5, U6, T7
Bidirectional
Three-state
DP0
V3
V5
W4
V4
Bidirectional
Three-state
IRQ3
DP1
Bidirectional
Three-state
IRQ4
DP2
Bidirectional
Three-state
IRQ5
DP3
Bidirectional
Three-state
IRQ6
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
81
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Pin Number
Name
Type
Bidirectional
BR
BG
BB
G4
E2
E1
Bidirectional
Bidirectional
Active Pull-up
FRZ
G3
Bidirectional
IRQ6
IRQ0
IRQ1
V14
U14
W15
Input
Input
Input
M_TX_CLK
IRQ7
CS[0:5]
C3, A2, D4, E4, A4, B4
D5
Output
Output
CS6
CE1_B
CS7
C4
C7
Output
Output
CE2_B
WE0
BS_B0
IORD
WE1
A6
B6
A5
Output
Output
Output
BS_B1
IOWR
WE2
BS_B2
PCOE
WE3
BS_B3
PCWE
BS_A[0:3]
D8, C8, A7, B8
D7
Output
Output
GPL_A0
GPL_B0
OE
C6
Output
GPL_A1
GPL_B1
GPL_A[2:3]
GPL_B[2:3]
CS[2–3]
B5, C5
C1
Output
UPWAITA
GPL_A4
Bidirectional
MPC866/MPC859 Hardware Specifications, Rev. 2
82
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
UPWAITB
Pin Number
Type
Bidirectional
B1
GPL_B4
GPL_A5
PORESET
RSTCONF
HRESET
SRESET
XTAL
D3
R2
P3
N4
P2
P1
N1
W3
N2
N3
K2
Output
Input
Input
Open-drain
Open-drain
Analog Output
Analog Input (3.3V only)
Output
EXTAL
CLKOUT
EXTCLK
TEXP
Input (3.3V only)
Output
ALE_A
Output
MII-TXD1
CE1_A
B3
A3
R3
Output
Output
Input
MII-TXD2
CE2_A
MII-TXD3
WAIT_A
2
SOC_Split
WAIT_B
R4
T5
Input
Input
IP_A0
2
2
UTPB_Split0
MII-RXD3
IP_A1
T4
U3
Input
Input
UTPB_Split1
MII-RXD2
IP_A2
IOIS16_A
UTPB_Split2
MII-RXD1
2
2
2
IP_A3
W2
U4
Input
Input
UTPB_Split3
MII-RXD0
IP_A4
UTPB_Split4
MII-RXCLK
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
83
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
IP_A5
U5
T6
Input
Input
Input
2
UTPB_Split5
MII-RXERR
IP_A6
2
UTPB_Split6
MII-TXERR
IP_A7
T3
2
UTPB_Split7
MII-RXDV
ALE_B
J1
Bidirectional
Three-state
DSCK/AT1
IP_B[0:1]
IWP[0:1]
VFLS[0:1]
H2, J3
Bidirectional
IP_B2
IOIS16_B
AT2
J2
Bidirectional
Three-state
IP_B3
IWP2
VF2
G1
G2
J4
Bidirectional
Bidirectional
Bidirectional
IP_B4
LWP0
VF0
IP_B5
LWP1
VF1
IP_B6
DSDI
AT0
K3
H1
L4
Bidirectional
Three-state
IP_B7
PTR
AT3
Bidirectional
Three-state
OP0
Bidirectional
MII-TXD0
2
UtpClk_Split
OP1
L2
L1
Output
OP2
Bidirectional
MODCK1
STS
MPC866/MPC859 Hardware Specifications, Rev. 2
84
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
Bidirectional
OP3
M4
K4
MODCK2
DSDO
BADDR30
REG
Output
BADDR[28:29]
AS
M3, M2
L3
Output
Input
PA15
RXD1
RXD4
C18
Bidirectional
PA14
TXD1
TXD4
D17
Bidirectional
(Optional: Open-drain)
PA13
E17
F17
G16
Bidirectional
RXD2
PA12
TXD2
Bidirectional
(Optional: Open-drain)
PA11
Bidirectional
(Optional: Open-drain)
L1TXDB
RXD3
PA10
J17
Bidirectional
(Optional: Open-drain)
L1RXDB
TXD3
PA9
K18
Bidirectional
(Optional: Open-drain)
L1TXDA
RXD4
PA8
L17
Bidirectional
(Optional: Open-drain)
L1RXDA
TXD4
PA7
M19
Bidirectional
CLK1
L1RCLKA
BRGO1
TIN1
PA6
M17
Bidirectional
CLK2
TOUT1
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
85
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
Bidirectional
PA5
N18
CLK3
L1TCLKA
BRGO2
TIN2
PA4
P19
P17
Bidirectional
Bidirectional
CLK4
TOUT2
PA3
CLK5
BRGO3
TIN3
PA2
R18
T19
U19
Bidirectional
Bidirectional
Bidirectional
CLK6
TOUT3
L1RCLKB
PA1
CLK7
BRGO4
TIN4
PA0
CLK8
TOUT4
L1TCLKB
PB31
C17
C19
Bidirectional
(Optional: Open-drain)
SPISEL
REJECT1
PB30
Bidirectional
(Optional: Open-drain)
SPICLK
RSTRT2
PB29
E16
D19
Bidirectional
(Optional: Open-drain)
SPIMOSI
PB28
Bidirectional
(Optional: Open-drain)
SPIMISO
BRGO4
PB27
E19
F19
Bidirectional
(Optional: Open-drain)
I2CSDA
BRGO1
PB26
Bidirectional
(Optional: Open-drain)
I2CSCL
BRGO2
MPC866/MPC859 Hardware Specifications, Rev. 2
86
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
Bidirectional
PB25
J16
J18
K17
2
(Optional: Open-drain)
RXADDR3
SMTXD1
PB24
Bidirectional
(Optional: Open-drain)
2
TXADDR3
SMRXD1
PB23
Bidirectional
(Optional: Open-drain)
2
TXADDR2
SDACK1
SMSYN1
PB22
L19
K16
Bidirectional
(Optional: Open-drain)
2
TXADDR4
SDACK2
SMSYN2
PB21
Bidirectional
(Optional: Open-drain)
SMTXD2
L1CLKOB
1
PHSEL1
2
TXADDR1
PB20
L16
Bidirectional
(Optional: Open-drain)
SMRXD2
L1CLKOA
1
PHSEL0
2
TXADDR0
PB19
RTS1
L1ST1
N19
N17
Bidirectional
(Optional: Open-drain)
PB18
Bidirectional
(Optional: Open-drain)
2
RXADDR4
RTS2
L1ST2
PB17
P18
Bidirectional
(Optional: Open-drain)
L1RQb
L1ST3
RTS3
1
PHREQ1
2
RXADDR1
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
87
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
PB16
N16
Bidirectional
(Optional: Open-drain)
L1RQa
L1ST4
RTS4
1
PHREQ0
2
RXADDR0
PB15
R17
Bidirectional
BRGO3
TxClav
RxClav
PB14
U18
D16
Bidirectional
Bidirectional
2
RXADDR2
RSTRT1
PC15
DREQ0
RTS1
L1ST1
RxClav
TxClav
PC14
D18
E18
F18
Bidirectional
Bidirectional
Bidirectional
DREQ1
RTS2
L1ST2
PC13
L1RQb
L1ST3
RTS3
PC12
L1RQa
L1ST4
RTS4
PC11
CTS1
J19
Bidirectional
Bidirectional
PC10
K19
CD1
TGATE1
PC9
L18
Bidirectional
Bidirectional
CTS2
PC8
M18
CD2
TGATE2
MPC866/MPC859 Hardware Specifications, Rev. 2
88
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
Bidirectional
PC7
M16
CTS3
L1TSYNCB
SDACK2
PC6
R19
T18
Bidirectional
Bidirectional
CD3
L1RSYNCB
PC5
CTS4
L1TSYNCA
SDACK1
PC4
T17
U17
Bidirectional
Bidirectional
CD4
L1RSYNCA
PD15
L1TSYNCA
MII-RXD3
UTPB0
PD14
V19
V18
R16
T16
W18
Bidirectional
Bidirectional
Bidirectional
Bidirectional
Bidirectional
L1RSYNCA
MII-RXD2
UTPB1
PD13
L1TSYNCB
MII-RXD1
UTPB2
PD12
L1RSYNCB
MII-MDC
UTPB3
PD11
RXD3
MII-TXERR
RXENB
PD10
TXD3
MII-RXD0
TXENB
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
89
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Name
Pin Number
Type
Bidirectional
PD9
V17
W17
T15
V16
U15
U16
W16
RXD4
MII-TXD0
UTPCLK
PD8
Bidirectional
Bidirectional
Bidirectional
Bidirectional
Bidirectional
Bidirectional
TXD4
MII-MDC
MII-RXCLK
PD7
RTS3
MII-RXERR
UTPB4
PD6
RTS4
MII-RXDV
UTPB5
PD5
REJECT2
MII-TXD3
UTPB6
PD4
REJECT3
MII-TXD2
UTPB7
PD3
REJECT4
MII-TXD1
SOC
TMS
G18
H17
Input
Input
TDI
DSDI
TCK
H16
Input
DSCK
TRST
G19
G17
Input
TDO
Output
DSDO
MII_CRS
MII_MDIO
MII_TXEN
B7
Input
H18
V15
Bidirectional
Output
MPC866/MPC859 Hardware Specifications, Rev. 2
90
Freescale Semiconductor
Mechanical Data and Ordering Information
Table 39. Pin Assignments (continued)
Pin Number
Name
MII_COL
Type
H4
V1
Input
VSSSYN1
PLL analog VDD and
GND
VSSSYN
VDDSYN
GND
U1
T1
Power
Power
Power
F6, F7, F8, F9, F10, F11, F12, F13, F14, G6, G7, G8, G9, G10,
G11, G12, G13, G14, H6, H7, H8, H9, H10, H11, H12, H13, H14,
J6, J7, J8, J9, J10, J11, J12, J13, J14, K6, K7, K8, K9, K10, K11,
K12, K13, K14, L6, L7, L8, L9, L10, L11, L12, L13, L14, M6, M7,
M8, M9, M10, M11, M12, M13, M14, N6, N7, N8, N9, N10, N11,
N12, N13, N14, P6, P7, P8, P9, P10, P11, P12, P13, P14
VDDL
VDDH
A8, M1, W8, H19, F4, F16, P4, P16, R1
Power
Power
E5, E6, E7, E8, E9, E10, E11, E12, E13, E14, E15, F5, F15, G5,
G15, H5, H15, J5, J15, K5, K15, L5, L15, M5, M15, N5, N15, P5,
P15, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, T14
N/C
D6, D13, D14, U2, V2, T2
No-connect
1
2
Classic SAR mode only
ESAR mode only
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
91
Mechanical Data and Ordering Information
15.2 Mechanical Dimensions of the PBGA Package
For more information on the printed-circuit board layout of the PBGA package, including thermal via design and
suggested pad layout, please refer to Plastic Ball Grid Array Application Note (order number: AN1231/D) available
from your local Freescale sales office. Figure 79 shows the mechanical dimensions of the PBGA package.
Note: Solder sphere composition for MPC866XZP, MPC859PZP, MPC859DSLZP, and MPC859TZP
is 62%Sn 36%Pb 2%Ag
Figure 79. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
MPC866/MPC859 Hardware Specifications, Rev. 2
92
Freescale Semiconductor
Document Revision History
16 Document Revision History
Table 40 lists significant changes between revisions of this document.
Table 40. Document Revision History
Revision
Number
Date
Substantive Changes
0
1
5/2002
11/2002
4/2003
Initial revision
Added the 5-V tolerant pins, new package dimensions, and other changes.
1.1
Added the Spec. B1d and changed spec. B1a. Added the Note Solder sphere
composition for MPC866XZP, MPC859DSLZP, and MPC859TZP is 62%Sn 36%Pb
2%Ag to Figure 15-79.
1.2
1.3
1.4
4/2003
5/2003
Added the MPC859P.
Changed the SPI Master Timing Specs. 162 and 164.
7-8/2003
• Added TxClav and RxClav to PB15 and PC15. Changed B28a through B28d and
B29b to show that TRLX can be 0 or 1.
• Added nontechnical reformatting.
1.5
2
3/14/2005
2/10/2006
• Updated document template.
• Updated orderable parts table.
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
93
Document Revision History
THIS PAGE INTENTIONALLY LEFT BLANK
MPC866/MPC859 Hardware Specifications, Rev. 2
94
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Document Revision History
THIS PAGE INTENTIONALLY LEFT BLANK
MPC866/MPC859 Hardware Specifications, Rev. 2
Freescale Semiconductor
95
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MPC866EC
Rev. 2
2/2006
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