MPX2053D [NXP]
Pressure Sensor, 10V, 0/50kPa, Sensor 4, Tray;
| 型号： | MPX2053D |
| 厂家： | 
NXP |
| 描述： | Pressure Sensor, 10V, 0/50kPa, Sensor 4, Tray 传感器 换能器 |
| 文件： | 总17页 (文件大小：382K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pressure
MPX2053
Rev 9, 10/2012
Freescale Semiconductor
Data Sheet: Technical Data
50 kPa On-Chip Temperature
Compensated and Calibrated
Silicon Pressure Sensors
The MPX2053 series devices are silicon piezoresistive pressure sensors
that provide a highly accurate and linear voltage output directly proportional to the
applied pressure. A single, monolithic silicon diaphragm with the strain gauge and
an integrated thin-film resistor network. Precise span and offset calibration with
temperature compensation are achieved by laser trimming.
MPX2053
Series
0 to 50 kPa (0 to 7.25 psi)
40 mV Full Scale
(Typical)
Application Examples
Features
•
•
•
•
•
•
Pump/Motor Control
Robotics
•
•
•
•
•
•
Temperature Compensated Over 0C to +85C
Easy-to-Use Chip Carrier Package Options
Ratiometric to Supply Voltage
Level Detectors
Medical Diagnostics
Pressure Switching
Blood Pressure Measurement
Gauge Ported and Non Ported Options
Available in Easy-to-Use Tape & Reel
Differential and Gauge Pressure Options
ORDERING INFORMATION
# of Ports
Single
Pressure Type
Differential
Device Name
Case No.
Device Marking
None
Dual
Gauge
Absolute
Small Outline Package (MPXV2053G Series)
MPXV2053GP
MPXV2053DP
1369
1351
•
•
•
MPXV2053GP
MPXV2053DP
•
•
•
Unibody Package (MPX2053 Series)
MPX2053D
MPX2053DP
MPX2053GP
344
•
•
•
MPX2053D
MPX2053DP
MPX2053GP
344C
344B
•
MPAK Package (MPXM2053 Series)
MPXM2053D
1320
1320
•
•
•
•
MPXM2053D
MPXM2053D
MPXM2053GS
MPXM2053GS
MPXM2053DT1
MPXM2053GS
MPXM2053GST1
1320A
1320A
•
•
•
•
© 2005-2009, 2012 Freescale Semiconductor Inc. All rights reserved.
Pressure
UNIBODY PACKAGES
MPX2053D
MPX2053GP
MPX2053DP
CASE 344-15
CASE 344B-01
CASE 344C-01
SMALL OUTLINE PACKAGES
MPXV2053GP
CASE 1369-01
MPXV2053DP
CASE 1351-01
MPAK PACKAGES
MPXM2053GS/GST1
CASE 1320A-02
MPXM2053D/DT1
CASE 1320-02
MPX2053
Sensors
Freescale Semiconductor, Inc.
2
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
POP
VS
Min
0
Typ
—
Max
50
Units
kPa
VDC
mAdc
mV
Pressure Range(1)
Supply Voltage(2)
Supply Current
Full Scale Span(3)
Offset(4)
—
10
16
IO
—
6.0
40
—
VFS
—
38.5
–1.0
V/P
–0.6
—
41.5
1.0
0.8
0.4
—
—
mV
Sensitivity
—
—
—
Non-Linearity
—
—
%VFS
%VFS
%VFS
%VFS
mV
Pressure Hysteresis (0 to 50 kPa)
Temperature Hysteresis (-40° to 125°C)
Temperature Coefficient of Full Scale
Temperature Coefficient of Offset
Input Impedance
—
0.1
0.5
—
—
—
—
TCVFS
TCVOFF
ZIN
–2.0
–1.0
1000
1400
—
2.0
1.0
2500
3000
—
—
—
Output Impedance
ZOUT
tR
—
Response Time(5) (10% to 90%)
Warm-Up Time
1.0
20
ms
—
—
—
ms
Offset Stability(6)
—
—
0.5
—
%VFS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
6. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Max Value
16
Unit
V
Supply Voltage
Pressure (P1 > P2)
200
kPa
C
Storage Temperature
Operating Temperature Range
–40 to +125
–40 to +125
C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX2053
Sensors
Freescale Semiconductor, Inc.
3
Pressure
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
3
Thin Film
X-ducer
Sensing
Element
2
4
Temperature
Compensation
and
Vout+
Vout-
Calibration
1
GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
Voltage Output versus Applied Differential Pressure
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side relative to the vacuum side. Similarly, output voltage
increases as increasing vacuum is applied to the vacuum
side relative to the pressure side.
On-Chip Temperature Compensation and Calibration
Figure 2 shows the minimum, maximum and typical output
characteristics of the MPX2053 series at 25C. The output is
directly proportional to the differential pressure and is
essentially a straight line.
A silicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
40
35
30
25
20
15
10
5
VS = 10 Vdc
TA = 25C
TYP
SPAN
RANGE
(TYP)
MAX
MIN
0
-5
OFFSET
(TYP)
0
12.5
1.8
25
3.6
37.5
5.4
50
7.25
kPa
PSI
Figure 2. Output vs. Pressure Differential
MPX2053
Sensors
Freescale Semiconductor, Inc.
4
Pressure
LINEARITY
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. The
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 3) or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Least
Square
Deviation
Least Squares Fit
Exaggerated
Performance
Straight Line
End Point
Straight Line Fit
OFFSET
0
50
100
Pressure (% Full scale)
Figure 3. Linearity Specification Comparison
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Refer to application note AN3728, for more information
regarding media compatibility.
The MPX2053 series pressure sensor operating
characteristics and internal reliability and qualification tests
Stainless Steel
Metal Cover
Silicone
Die Coat
Die
P1
P2
Epoxy
Case
Wire Bond
RTV Die
Bond
Lead Frame
Figure 4. Unibody Package — Cross-Sectional Diagram (Not to Scale)
MPX2053
Sensors
Freescale Semiconductor, Inc.
5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
C
R
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
Z
1
4
2
3
INCHES
MILLIMETERS
B
-A-
DIM MIN MAX MIN
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
N
0.514
0.200
0.016
0.048
L
1
2
3
4
0.220
0.020
0.064
5.08
0.41
1.22
PIN 1
0.51
1.63
-T-
SEATING
PLANE
G
J
L
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
G
J
F
4 PL
Y
M
N
R
Y
Z
30˚ NOM
30˚ NOM
D
0.475
0.430
0.048
0.106
0.495 12.07
0.450 10.92
12.57
11.43
1.32
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
M
0.136 (0.005)
T A
0.052
0.118
1.22
2.68
3.00
STYLE 1:
PIN 1. GROUND
STYLE 2:
PIN 1.
STYLE 3:
VCC
PIN 1. GND
2. -VOUT
3. VS
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
2. - SUPPLY
3. + SUPPLY
4. GROUND
4. +VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
NOTES:
SEATING
PLANE
-A-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-T-
U
L
R
INCHES
DIM MIN MAX
MILLIMETERS
H
MIN
29.08
17.40
7.75
MAX
29.85
18.16
8.26
A
B
C
D
F
1.145
0.685
0.305
0.016
0.048
1.175
0.715
0.325
0.020
0.064
N
B
PORT #1
-Q-
POSITIVE
PRESSURE
(P1)
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC
2.54 BSC
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.250
0.240
4.62
0.36
17.65
7.37
10.67
3.89
3.89
5.84
5.59
4.93
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.10
1
2 3 4
PIN 1
K
-P-
S
M
S
0.25 (0.010)
T Q
J
F
0.910 BSC
23.11 BSC
G
D
C
4 PL
M
S
S
0.13 (0.005)
T
S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2053
Sensors
Freescale Semiconductor, Inc.
6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
-A-
U
V
PORT #1
2. CONTROLLING DIMENSION: INCH.
W
L
R
H
INCHES
DIM MIN MAX
MILLIMETERS
PORT #2
MIN MAX
29.08 29.85
17.40 18.16
10.29 11.05
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
A
B
C
D
F
1.145
0.685
0.405
0.016
0.048
1.175
0.715
0.435
0.020
0.064
N
-Q-
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
V
W
0.100 BSC
2.54 BSC
SEATING
PLANE
SEATING
PLANE
B
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
4.62
0.36
4.93
0.41
1
2 3 4
17.65 18.42
7.37 7.62
10.67 11.18
PIN 1
K
-P-
M
S
0.25 (0.010)
T Q
3.89
3.89
1.60
5.59
4.04
4.04
2.11
6.10
-T-
-T-
S
F
J
G
C
0.910 BSC
23.11 BSC
D
4 PL
0.248
0.310
0.278
0.330
6.30
7.87
7.06
8.38
M
S
S
0.13 (0.005)
T S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
MPX2053
Sensors
Freescale Semiconductor, Inc.
7
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2053
Sensors
Freescale Semiconductor, Inc.
8
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2053
Sensors
Freescale Semiconductor, Inc.
9
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE D
SMALL OUTLINE PACKAGE
MPX2053
Sensors
Freescale Semiconductor, Inc.
10
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE D
SMALL OUTLINE PACKAGE
MPX2053
Sensors
Freescale Semiconductor, Inc.
11
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1320-02
ISSUE B
MPX2053
12
Sensors
Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1320-02
ISSUE B
MPX2053
13
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
PIN 4
PIN 1
PAGE 1 OF 2
CASE 1320A-02
ISSUE A
MPX2053
14
Sensors
Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1320A-02
ISSUE A
MPX2053
15
Sensors
Freescale Semiconductor, Inc.
Pressure
Table 3. Revision History
Revision Revision
Description of changes
• Deleted references to device number MPXV2053GVP throughout the document
number
date
9
10/2012
MPX2053
Sensors
Freescale Semiconductor, Inc.
16
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© 2012 Freescale Semiconductor, Inc.
MPX2053
Rev. 9
10/2012
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