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MPX4115A [NXP]

Pressure Sensor, 5.1V, 15/115kPa, Sensor 6, Tray;
MPX4115A
型号： MPX4115A
厂家： NXP    NXP
描述：

Pressure Sensor, 5.1V, 15/115kPa, Sensor 6, Tray

传感器 换能器
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Pressure  
MPX4115A  
Rev 5, 1/2009  
Freescale Semiconductor  
Media Resistant, Integrated Silicon  
Pressure Sensor for Manifold  
Absolute Pressure, Altimeter or  
Barometer Applications On-Chip  
Signal Conditioned, Temperature  
Compensated and Calibrated  
MPX4115A  
Series  
INTEGRATED  
PRESSURE SENSOR  
15 to 115 kPa (2.2 to 16.7 psi)  
0.2 to 4.8 V Output  
Application Examples  
The MPX4115A series is designed to sense absolute air pressure in  
altimeter or barometer (BAP) applications. Freescale's BAP sensor integrates  
on-chip, bipolar op amp circuitry and thin film resistor networks to provide a  
high level analog output signal and temperature compensation. The small form  
factor and high reliability of on-chip integration makes the Freescale BAP  
sensor a logical and economical choice for application designers.  
• Altimeter  
• Barometer  
• Aviation Altimeters  
• Industrial Controls  
• Engine Control  
Features  
• Weather Stations and Weather  
Reporting Devices  
• 1.5% Maximum Error Over 0° to 85°C  
• Ideally Suited for Microprocessor Interfacing or Microcontroller-Based Systems  
• Temperature Compensated Over -40°C to +125°C  
• Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package  
• Available as Standard Fluorosilicone Gel (MPXA4115A, MPX4115A) or Media Resistant Gel (MPXAZ4115A)  
ORDERING INFORMATION  
# of Ports  
None Single  
Pressure Type  
Differential  
Package  
Options  
Case  
No.  
Device Name  
Device Marking  
Dual  
Gauge  
Absolute  
Unibody Package (MPX4115A Series)  
MPX4115A  
MPX4115AP  
MPX4115AS  
MPX4115A  
MPX4115AP  
MPX4115A  
Tray  
Tray  
Tray  
867-08  
867B-04  
867E-03  
•
•
•
•
•
•
Small Outline Package (Media Resistant Gel) (MPXAZ4115A Series)  
MPXAZ4115A6U  
MPXAZ4115AC6U  
MPXAZ4115A6T1  
MPXAZ4115A  
MPXAZ4115A  
MPXAZ4115A  
Rails  
Rails  
482  
482A  
482  
•
•
•
•
•
•
Tape and Reel  
Small Outline Package (MPXA4115A Series)  
MPXA4115AC6U  
MPXA4115A  
MPXA4115AP  
MPXA4115A  
MPXA4115A  
Rails  
Tray  
482A  
1369-01  
482  
•
•
•
•
•
•
MPXA4115AP  
MPXA4115A6T1  
MPXA4115A6U  
Tape and Reel  
Rails  
•
•
482  
© Freescale Semiconductor, Inc., 2006-2009. All rights reserved.  
Pressure  
UNIBODY PACKAGES  
MPX4115A  
CASE 867-08  
MPX4115AP  
CASE 867B-04  
MPX4115AS  
CASE 867E-03  
SMALL OUTLINE PACKAGES  
MPXA4115AP  
CASE 1369-01  
MPXAZ4115AC6U  
MPXA4115AC6U  
CASE 482A-01  
MPXAZ4115A6U/T1  
MPXA4115A6U/T1  
CASE 482-01  
MPX4115A  
Sensors  
2
Freescale Semiconductor  
Pressure  
Operating Characteristics  
Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in  
Figure 3 required to meet electrical specifications.)  
Characteristic  
Symbol  
POP  
VS  
Min  
15  
Typ  
—
Max  
115  
Unit  
kPa  
Pressure Range(1)  
Supply Voltage(2)  
Supply Current  
4.85  
—
5.1  
5.35  
10  
Vdc  
Io  
7.0  
mAdc  
Vdc  
Minimum Pressure Offset  
@ VS = 5.1 Volts(3)  
(0 to 85°C)  
(0 to 85°C)  
(0 to 85°C)  
(0 to 85°C)  
Voff  
0.135  
0.204  
0.273  
Full Scale Output  
VFSO  
4.725  
4.521  
4.794  
4.59  
4.863  
4.659  
Vdc  
Vdc  
@ VS = 5.1 Volts(4)  
Full Scale Span  
VFSS  
@ VS = 5.1 Volts(5)  
Accuracy(6)  
—
V/P  
tR  
—
—
—
—
—
—
—
46  
±1.5  
—
%VFSS  
mV/kPa  
ms  
Sensitivity  
Response Time(7)  
1.0  
0.1  
20  
—
Output Source Current at Full Scale Output  
Warm-Up Time(8)  
lo+  
—
—
mAdc  
mSec  
%VFSS  
—
Offset Stability(9)  
—
±0.5  
—
1. 1.0 kPa (kiloPascal) equals 0.145 psi.  
2. Device is ratiometric within this specified excitation range.  
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.  
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.  
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the  
minimum rated pressure.  
6. Accuracy (error budget) consists of the following:  
Linearity:  
Output deviation from a straight line relationship with pressure over the specified pressure range.  
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to  
and from the minimum or maximum operating temperature points, with zero differential pressure applied.  
Pressure Hysteresis:  
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the  
minimum or maximum rated pressure, at 25°C.  
TcSpan:  
Output deviation over the temperature range of 0 to 85°C, relative to 25°C.  
TcOffset:  
Variation from Nominal:  
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.  
The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.  
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a  
specified step change in pressure.  
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.  
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.  
MPX4115A  
Sensors  
Freescale Semiconductor  
3
Pressure  
Maximum Ratings  
Table 2. MAXIMUM RATINGS(1)  
Rating  
Maximum Pressure (P1 > P2)  
Storage Temperature  
Symbol  
PMAX  
Tstg  
Value  
400  
Unit  
kPa  
°C  
-40 to +125  
-40 to +125  
Operating Temperature  
TA  
°C  
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.  
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.  
3 (Unibody)  
2 (Small Outline Package)  
VS  
Thin Film  
Temperature  
Compensation  
and  
Gain Stage #2  
and  
1 (Unibody)  
4 (Small Outline Package)  
Sensing  
Element  
VOUT  
Ground  
Reference  
Shift Circuitry  
Gain Stage #1  
Pins 4, 5, and 6 are NO CONNECTS  
for unibody package devices.  
2 (Unibody)  
3 (Small Outline Package)  
GND  
Pins 1, 5, 6, 7, and 8 are NO CONNECTS  
for small outline package devices.  
Figure 1. Fully Integrated Pressure Sensor Schematic  
for Unibody Package and Small Outline Package  
MPX4115A  
Sensors  
4
Freescale Semiconductor  
 
Pressure  
On-chip Temperature Compensation and Calibration  
Figure 2 illustrates an absolute sensing chip in the basic  
chip carrier (Case 867) and the small outline chip carrier  
(Case 482). A fluorosilicone gel isolates the die surface and  
wire bonds from the environment, while allowing the pressure  
signal to be transmitted to the sensor diaphragm. The  
MPX4115A series pressure sensor operating characteristics,  
and internal reliability and qualification tests are based on use  
of dry air as the pressure media. Media, other than dry air,  
may have adverse effects on sensor performance and long-  
term reliability. Contact the factory for information regarding  
media compatibility in your application.  
Figure 3 shows the recommended decoupling circuit for  
interfacing the output of the integrated sensor to the A/D input  
of a microprocessor or microcontroller. Proper decoupling of  
the power supply is recommended.  
Figure 4 shows the sensor output signal relative to  
pressure input. Typical, minimum, and maximum output  
curves are shown for operation over a temperature range of  
0° to 85°C using the decoupling circuit shown in Figure 3.  
(The output will saturate outside of the specified pressure  
range.)  
Fluoro Silicone  
Gel Die Coat  
Stainless Steel  
Steel Cap  
Die  
Stainless Steel  
Metal Cover  
Fluoro Silicone  
Gel Die Coat  
Die  
P1  
P1  
Epoxy Plastic  
Case  
Wire Bond  
Thermoplastic  
Case  
Wire Bond  
Lead Frame  
Lead Frame  
Sealed Vacuum Reference  
Die  
Bond  
Absolute Element  
P2  
Die  
Bond  
Absolute Element  
Sealed Vacuum Reference  
Figure 2. Cross-Sectional Diagram (not to scale)  
+5.1 V  
Output  
Vout  
Vs  
IPS  
1.0 μF  
GND  
470 pF  
0.01 μF  
Figure 3. Recommended Power Supply Decoupling and Output Filtering  
(For output filtering recommendations, refer to Application Note AN1646.)  
5.0  
TRANSFER FUNCTION:  
4.5  
V
out = Vs* (.009*P-.095) ± Error  
MAX  
4.0  
VS = 5.1 Vdc  
3.5 TEMP = 0 to 85°C  
3.0  
2.5  
TYP  
2.0  
1.5  
1.0  
0.5  
MIN  
0
Pressure (ref. to sealed vacuum) in kPa  
Figure 4. Output versus Absolute Pressure  
MPX4115A  
Sensors  
Freescale Semiconductor  
5
Pressure  
Transfer Function (MPX4115A)  
Nominal Transfer Value:  
Vout = VS (P x 0.009 - 0.095)  
± (Pressure Error x Temp. Factor x 0.009 x VS)  
S = 5.1 V ± 0.25 Vdc  
V
Temperature Error Band  
MPX4115A Series  
4.0  
Temp  
Multiplier  
3.0  
- 40  
0 to 85  
+125  
3
1
3
Temperature  
Error  
Factor  
2.0  
1.0  
0.0  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
Temperature in °C  
NOTE: The Temperature Multiplier is a linear response from 0°C to-40°C and from 85°C to 125°C.  
Pressure Error Band  
Error Limits for Pressure  
3.0  
2.0  
1.0  
0.0  
Pressure (in kPa)  
20  
40  
60  
80  
100  
120  
-1.0  
-2.0  
-3.0  
Pressure  
Error (Max)  
±1.5 (kPa)  
15 to 115 (kPa)  
MPX4115A  
Sensors  
6
Freescale Semiconductor  
Pressure  
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE  
The two sides of the pressure sensor are designated as  
the Pressure (P1) side and the Vacuum (P2) side. The  
Pressure (P1) side is the side containing fluorosilicone gel,  
which protects the die from harsh media. The MPX pressure  
sensor is designed to operate with positive differential  
pressure applied, P1 > P2.  
The Pressure (P1) side may be identified by using the  
following table:  
Part Number  
MPX4115A  
Case Type  
Pressure (P1) Side Identifier  
Stainless Steel Cap  
867  
867B  
867E  
482  
MPX4115AP  
Side with Part Marking  
Side with Port Attached  
Side with Part Marking  
Side with Port Attached  
Side with Port Attached  
MPX4115AS  
MPXAZ4115A6U/T1, MPXA4115A6U/T1  
MPXAZ4115AC6U, MPXA4115AC6U  
MPXA4115AP  
482A  
1369  
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)  
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS  
Surface mount board layout is a critical portion of the total  
design. The footprint for the surface mount packages must be  
the correct size to ensure proper solder connection interface  
between the board and the package. With the correct  
footprint, the packages will self align when subjected to a  
solder reflow process. It is always recommended to design  
boards with a solder mask layer to avoid bridging and  
shorting between solder pads.  
0.100 TYP 8X  
2.54  
0.660  
16.76  
0.060 TYP 8X  
1.52  
0.300  
7.62  
inch  
0.100 TYP 8X  
2.54  
mm SCALE 2:1  
Figure 5. SOP Footprint (Case 482)  
MPX4115A  
Sensors  
Freescale Semiconductor  
7
Pressure  
PACKAGE DIMENSIONS  
-A-  
D 8 PL  
0.25 (0.010)  
4
1
M
S
S
A
T
B
5
-B-  
8
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
G
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
INCHES  
MIN MAX  
MILLIMETERS  
S
N
DIM  
A
B
C
D
G
H
J
K
M
N
MIN  
10.54  
10.54  
5.38  
MAX  
10.79  
10.79  
5.84  
0.415 0.425  
0.415 0.425  
0.212 0.230  
0.038 0.042  
0.100 BSC  
0.96  
1.07  
2.54 BSC  
0.002 0.010  
0.009 0.011  
0.061 0.071  
0.05  
0.23  
1.55  
0˚  
0.25  
0.28  
1.80  
7˚  
H
C
J
0˚  
7˚  
-T-  
0.405 0.415  
0.709 0.725  
10.29  
18.01  
10.54  
18.41  
SEATING  
PLANE  
S
PIN 1 IDENTIFIER  
K
M
CASE 482-01  
ISSUE O  
SMALL OUTLINE PACKAGE  
-A-  
D 8 PL  
0.25 (0.010)  
4
1
M
S
S
A
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
T
B
5
-B-  
8
N
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
G
INCHES  
MIN MAX  
MILLIMETERS  
DIM  
A
B
C
D
G
H
J
K
M
N
MIN  
10.54  
10.54  
12.70  
0.96  
MAX  
10.79  
10.79  
13.21  
1.07  
S
0.415 0.425  
0.415 0.425  
0.500 0.520  
0.038 0.042  
0.100 BSC  
W
2.54 BSC  
0.002 0.010  
0.009 0.011  
0.061 0.071  
0.05  
0.23  
1.55  
0˚  
0.25  
0.28  
1.80  
7˚  
V
0˚  
7˚  
C
0.444 0.448  
0.709 0.725  
0.245 0.255  
0.115 0.125  
11.28  
18.01  
6.22  
2.92  
11.38  
18.41  
6.48  
3.17  
S
V
W
H
J
-T-  
SEATING  
PLANE  
PIN 1 IDENTIFIER  
M
K
CASE 482A-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPX4115A  
Sensors  
Freescale Semiconductor  
8
Pressure  
PACKAGE DIMENSIONS  
C
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
R
POSITIVE PRESSURE  
(P1)  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD  
STOP RING. MOLD STOP RING NOT TO EXCEED  
16.00 (0.630).  
M
B
-A-  
INCHES  
DIM MIN MAX MIN  
MILLIMETERS  
N
L
MAX  
16.00  
13.56  
5.59  
A
B
C
D
F
0.595  
0.630 15.11  
0.534 13.06  
PIN 1  
1
2
3
4
5
6
0.514  
0.200  
0.027  
0.048  
SEATING  
PLANE  
-T-  
0.220  
0.033  
0.064  
5.08  
0.68  
1.22  
0.84  
1.63  
G
J
S
G
J
L
M
N
R
S
0.100 BSC  
2.54 BSC  
F
0.014  
0.695  
0.016 0.36  
0.725 17.65  
0.40  
18.42  
D 6 PL  
0.136 (0.005)  
30˚ NOM  
30˚ NOM  
M
M
T A  
0.475  
0.430  
0.090  
0.495 12.07  
0.450 10.92  
12.57  
11.43  
2.66  
0.105  
2.29  
STYLE 1:  
PIN 1. VOUT  
2. GROUND  
STYLE 2:  
PIN 1. OPEN  
2. GROUND  
STYLE 3:  
PIN 1. OPEN  
2. GROUND  
3. VCC  
4. V1  
5. V2  
3. -VOUT  
4. VSUPPLY  
5. +VOUT  
6. OPEN  
3. +VOUT  
4. +VSUPPLY  
5. -VOUT  
6. VEX  
6. OPEN  
CASE 867-08  
ISSUE N  
BASIC ELEMENT  
MPX4115A  
Sensors  
Freescale Semiconductor  
9
Pressure  
PACKAGE DIMENSIONS  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
A
C
2. CONTROLLING DIMENSION: INCH.  
INCHES  
DIM MIN MAX  
0.720 17.53  
0.255 6.22  
0.820 19.81  
MILLIMETERS  
MIN  
MAX  
18.28  
6.48  
A
B
C
D
E
F
0.690  
0.245  
0.780  
0.027  
0.178  
0.048  
-B-  
V
20.82  
0.84  
4.72  
PIN 1  
0.033  
0.186  
0.064  
0.69  
4.52  
1.22  
1.63  
PORT #1  
POSITIVE  
PRESSURE  
(P1)  
6
5
4
3
2
1
G
J
K
N
S
V
0.100 BSC  
2.54 BSC  
0.014  
0.345  
0.300  
0.220  
0.182  
0.016  
0.375  
0.310  
0.240  
0.194  
0.36  
8.76  
7.62  
5.59  
4.62  
0.41  
9.53  
7.87  
6.10  
4.93  
K
S
J
G
F
STYLE 1:  
PIN 1. VOUT  
N
E
D 6 PL  
2. GROUND  
3. VCC  
4. V1  
5. V2  
6. VEX  
-T-  
M
M
B
0.13 (0.005)  
T
CASE 867E-O3  
ISSUE D  
STOVE PIPE PORT (AS)  
MPX4115A  
10  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 867B-04  
ISSUE G  
PORTED (AP)  
MPX4115A  
11  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 867B-04  
ISSUE G  
PORTED (AP)  
MPX4115A  
12  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
2 PLACES 4 TIPS  
0.008 (0.20) C A  
B
E
A
GAGE  
PLANE  
e
5
8
4
1
e/2  
.014 (0.35)  
θ
L
A1  
D
F
DETAIL G  
NOTES:  
1. CONTROLLING DIMENSION: INCH.  
8X b  
0.004 (0.1)  
2. INTERPRET DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994.  
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE  
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)  
PER SIDE.  
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.  
M
C
A
B
E1  
B
INCHES  
DIM MIN MAX  
0.300  
A1 0.002  
MILLIMETERS  
MIN  
7.11  
MAX  
7.62  
0.25  
N
T
∅
A
0.330  
0.010  
0.042  
0.485  
K
0.05  
0.96  
b
D
E
0.038  
0.465  
0.717 BSC  
1.07  
12.32  
11.81  
18.21 BSC  
E1 0.465  
0.485  
11.81  
2.54 BSC  
12.32  
A
M
e
F
K
L
M
N
P
T
θ
0.100 BSC  
0.245  
0.120  
0.061  
0.270  
0.080  
0.009  
0.115  
0˚  
0.255  
0.130  
0.071  
0.290  
0.090  
0.011  
0.125  
7˚  
6.22  
3.05  
1.55  
6.86  
2.03  
0.23  
2.92  
0˚  
6.47  
3.30  
1.80  
7.36  
2.28  
0.28  
3.17  
7˚  
8X  
0.004 (0.1)  
P
DETAIL G  
SEATING  
PLANE  
C
CASE 1369-01  
ISSUE O  
SMALL OUTLINE PACKAGE  
MPX4115A  
Sensors  
Freescale Semiconductor  
13  
How to Reach Us:  
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www.freescale.com  
Web Support:  
http://www.freescale.com/support  
USA/Europe or Locations Not Listed:  
Freescale Semiconductor, Inc.  
Technical Information Center, EL516  
2100 East Elliot Road  
Tempe, Arizona 85284  
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MPX4115A  
Rev. 5  
1/2009  

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