MPX4250D_技术文档

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip

signal conditioned, temperature compensated and calibrated

Rev. 8.0 — 25 July 2017

Data sheet: technical data

1 General description

The MPX4250D series piezoresistive transducer is a state-of-the-art monolithic silicon

pressure sensor designed for a wide range of applications, particularly those employing

a microcontroller or microprocessor with A/D inputs. This transducer combines advanced

micromachining techniques, thin-film metallization, and bipolar processing to provide an

accurate, high-level analog output signal that is proportional to the applied pressure. The

small form factor and high reliability of on-chip integration make the NXP sensor a logical

and economical choice for the automotive system engineer.

2 Features

• Differential and gauge applications available

• 1.4 % maximum error over 0 °C to 85 °C

• Patented silicon shear stress strain gauge

• Temperature compensated over –40 °C to +125 °C

• Offers reduction in weight and volume compared to existing hybrid modules

• Durable epoxy unibody element

• Available in two unibody packages

MPX4250D

98ASB42793B

CASE 867

MPX4250DP

98ASB42797B

CASE 867C

Figure 1.ꢀUnibody packages

3 Typical applications

• Ideally suited for microprocessor or microcontroller-based systems

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

4 Ordering information

Table 1.ꢀOrdering information

# of Ports

Single

Pressure type

Package

Options

Package

Name

Device

marking

Device name

None

Dual

Gauge

Differential

Absolute

MPX4250D

Tray

98ASB42793B

98ASB42797B

•

MPX4250D

MPX4250DP

•

MPX4250DP

5 Block diagram

V

CC

3

Sensing

Element

Gain Stage #2

Thin Film

Temperature

Compensation

and

and Ground

Reference

Shift

V

OUT

1

Circuitry

Gain Stage #1

Pins 4, 5 and 6 are NO CONNECTS.

2

GND

Figure 2.ꢀBlock diagram

6 Pinning information

6.1 Pinning

MPX4250D

1

2

3

4

5

6

Figure 3.ꢀPinning diagram

MPX4250D

All information provided in this document is subject to legal disclaimers.

Data sheet: technical data

Rev. 8.0 — 25 July 2017

2 / 14

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

6.2 Pin description

Table 2.ꢀPin descriptions

Symbol

V_OUT

GND

V_CC

Pin Description

1

2

3

4

5

6

Output voltage

Ground

Voltage supply

DNC

Do not connect to external circuitry or ground

DNC

7 Mechanical and electrical specifications

7.1 Maximum ratings

Table 3.ꢀMaximum ratings

Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Rating

Symbol

P_MAX

T_STG

Value

1000

Unit

kPa

°C

Maximum pressure (P1 > P2)

Storage temperature

Operating temperature

–40 to +125

T_A

°C

Figure 2 shows a block diagram of the internal circuitry integrated on a pressure sensor

chip.

7.2 Operating characteristics

Table 4.ꢀOperating characteristics

(V_CC= 5.1 Vdc, T_A= 25 °C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 5

required to meet electrical specifications.)

Symbol

P_OP

V_CC

I_o

Characteristic

Pressure range^[1]

Supply voltage^[2]

Min

0

Typ

—

Max

250

5.35

10

Unit

kPa

4.85

—

5.1

7.0

Vdc

Supply current

mAdc

Vdc

V_off

Minimum pressure offset^[3](0 °C to 85 °C)

Full scale output^[4](0 °C to 85 °C)

Full scale span^[5](0 °C to 85 °C)

Accuracy^[6](0 °C to 85 °C)

Sensitivity

0.139 0.204 0.269

4.844 4.909 4.974

V_FSO

V_FSS

—

Vdc

—

4.705

—

±1.4

—-

Vdc

%V_FSS

mV/kPa

ms

ΔV/ΔP

t_R

18.8

1.0

Response time^[7]

—-

I_o+

Output source current at full scale output

0.1

—-

mAdc

MPX4250D

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

3 / 14

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

Symbol

Characteristic

Min

—

Typ

20

Max

—-

Unit

ms

—

Warm-up time^[8]

Offset stability^[9]

—

±ꢀ0.5

—-

%V_FSS

[1] 1.0 kPa (kiloPascal) equals 0.145 psi.

[2] Device is ratiometric within this specified excitation range.

[3] Offset (V_off) is defined as the output voltage at the minimum rated pressure.

[4] Full scale output (V_FSO) is defined as the output voltage at the maximum or full rated pressure.

[5] Full scale span (V_FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the

output voltage at the minimum rated pressure.

[6] Accuracy (error budget) consists of the following:

•

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.

Temperature hysteresis: Output deviation at any temperature within the operating temperature range, after the

temperature is cycled to and from the minimum or maximum operating temperature points, with zero pressure applied.

•

Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and

from the minimum or maximum rated pressure, at 25 °C.

•

TcSpan: Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C.

TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 °C to 85 °C, relative

to 25 °C.

Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of V_FSS, at 25 °C.

[7] Response time is defined as the time for the incremental change in the output to go from 10 % to 90 % of its final value

when subjected to a specified step change in pressure.

[8] Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has

been stabilized.

[9] Offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling

with bias test.

8 On-chip temperature compensation and calibration

Figure 4 illustrates the differential/gauge pressure sensing chip in the basic chip carrier

(98ASB42793B). A fluorosilicone gel isolates the die surface and wire bonds from

the environment, while allowing the pressure signal to be transmitted to the sensor

diaphragm.

The MPX4250D series pressure sensor operating characteristics and internal reliability

and qualification tests are based on use of dry air as the pressure media. Media, other

than dry air, may have adverse effects on sensor performance and long-term reliability.

Contact the factory for information regarding media compatibility in your application.

Figure 5 shows the recommended decoupling circuit for interfacing the output of the

integrated sensor to the A/D input of a microprocessor or microcontroller.

Figure 6 shows the sensor output signal relative to pressure input. Typical, minimum, and

maximum output curves are shown for operation over a temperature range of 0 °C to 85

°C using the decoupling circuit shown in Figure 5. The output will saturate outside of the

specified pressure range.

Fluoro silicone

Stainless steel

die coat

metal cover

Die

P1

Wire bond

Epoxy case

RTV die bond

Lead frame

P2

Figure 4.ꢀCross sectional diagram (not to scale)

ꢁ

MPX4250D

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

4 / 14

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

+5.1 V

Output

V

out

V

CC

IPS

1.0 µF

GND

470 pF

0.01 µF

For additional output filtering, please refer to Application Note AN1535

Figure 5.ꢀRecommended power supply decoupling and output filtering

ꢁ

5.0

4.5

Transfer Function:

V

out

V

CC

= V

× (P × 0.00369 + 0.04) ± Error

= 5.1 Vdc

CC

4.0

3.5

3.0

Temperature = 0 °C to 85 °C

TYP

2.5

2.0

1.5

1.0

MAX

MIN

0.5

0

Pressure in kPa

Figure 6.ꢀOutput versus differential pressure

ꢁ

Nominal transfer value:

V

= V

CC

= 5.1 ± 0.25 Vdc

× (P × 0.00369 + 0.04) ± (Pressure Error × Temp. Factor × 0.00369 × V )

CC

OUT

CC

Figure 7.ꢀTransfer function

ꢁ

4.0

3.0

2.0

1.0

0.0

Temp °C Multiplier

3

1

3

–40

0 to 85

+125

Temperature

error

factor

–40

–20

0

20

40

60

80

100

120

140

Temperature in °C

Note: The temperature multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C.

Figure 8.ꢀTemperature error band

ꢁ

MPX4250D

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

5 / 14

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

Figure 9.ꢀPressure error band

9 Package information

9.1 Package description

Figure 10.ꢀPackage name 98ASB42793B, Case 867-08, Issue N

ꢁ

MPX4250D

All information provided in this document is subject to legal disclaimers.

Data sheet: technical data

Rev. 8.0 — 25 July 2017

6 / 14

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

Figure 11.ꢀPackage name 98ASB42797B, Case 867C-05, Issue H

MPX4250D

All information provided in this document is subject to legal disclaimers.

Data sheet: technical data

Rev. 8.0 — 25 July 2017

7 / 14

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

MPX4250D

All information provided in this document is subject to legal disclaimers.

Data sheet: technical data

Rev. 8.0 — 25 July 2017

8 / 14

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

Figure 12.ꢀPackage name 98ASB42796B, Case 867B-04, Issue J

MPX4250D

All information provided in this document is subject to legal disclaimers.

Data sheet: technical data

Rev. 8.0 — 25 July 2017

9 / 14

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

10 Revision history

Table 5.ꢀRevision history

Document ID

MPX4250D v.8.0

Modifications:

Release date

Data sheet status

Change notice

Supercedes

20170725

Technical data

—

MPX4250 v.7.0

• The format of this data sheet has been redesigned to comply with the new identity guidelines of

NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• Revised "MPX4250" to "MPX4250D."

• Updated the document title from "Integrated Silicon Pressure Sensor Manifold Absolute

Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated" to

"20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated."

• Added Figure 1 "Unibody packages" in Section 2 "Features".

• Updated Table 1 "Ordering information" in Section 4 "Ordering information".

• Revised Figure 2 "Block diagram " in Section 5 "Block diagram" as follows:

– Changed V_Sto V_CC

– Revised the note to read "Pins 4, 5 and 6 are NO CONNECTS"

• Added pinning illustration as Figure 3 "Pinning diagram" in Section 6.1 "Pinning".

• Added pin descriptions in Table 2 "Pin descriptions" in Section 6.2 "Pin description".

• Changed V_Sto V_CCin the description and within the body of Table 4 "Operating characteristics"

in Section 7.2 "Operating characteristics".

• Updated the figures in Section 8 "On-chip temperature compensation and calibration" as

follows:

– Figure 4 "Cross sectional diagram (not to scale)"

– Figure 5 "Recommended power supply decoupling and output filtering"

– Figure 6 "Output versus differential pressure"

– Figure 7 "Transfer function"

– Figure 9 "Pressure error band"

• Updated the figures and figure titles in Section 9.1 "Package description" as follows:

– Figure 10 "Package name 98ASB42793B, Case 867-08, Issue N"

– Figure 11 "Package name 98ASB42797B, Case 867C-05, Issue H"

– Figure 12 "Package name 98ASB42796B, Case 867B-04, Issue J"

MPX4250 v.7.0

20090131

Technical data

—

MPX4250 v.6.0

MPX4250D

All information provided in this document is subject to legal disclaimers.

Data sheet: technical data

Rev. 8.0 — 25 July 2017

10 / 14

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

11 Legal information

11.1 Data sheet status

Document status^[1][2]

Product status^[3]

Definition

[short] Data sheet: product_preview

Development

This document contains certain information on a product under development.

NXP reserves the right to change or discontinue this product without notice.

{short] Data sheet: advance information

[short] Data sheet: technical data

Qualification

Production

This document contains information on a new product. Specifications and

information herein are subject to change without notice.

This document contains the product specification. NXP Semiconductors

reserves the right to change the detail specifications as may be required to

permit improvements in the design of its products.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple

devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

11.2 Definitions

to the publication hereof.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes

modifications or additions. NXP Semiconductors does not give any

no representation or warranty that such applications will be suitable

representations or warranties as to the accuracy or completeness of

for the specified use without further testing or modification. Customers

information included herein and shall have no liability for the consequences

are responsible for the design and operation of their applications and

of use of such information.

products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

Short data sheet — A short data sheet is an extract from a full data sheet

design. It is customer’s sole responsibility to determine whether the NXP

with the same product type number(s) and title. A short data sheet is

Semiconductors product is suitable and fit for the customer’s applications

intended for quick reference only and should not be relied upon to contain

and products planned, as well as for the planned application and use of

detailed and full information. For detailed and full information see the

customer’s third party customer(s). Customers should provide appropriate

relevant full data sheet, which is available on request via the local NXP

design and operating safeguards to minimize the risks associated with

Semiconductors sales office. In case of any inconsistency or conflict with the

their applications and products. NXP Semiconductors does not accept any

short data sheet, the full data sheet shall prevail.

liability related to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications or products, or

the application or use by customer’s third party customer(s). Customer is

Product specification — The information and data provided in a

technical data data sheet shall define the specification of the product as

responsible for doing all necessary testing for the customer’s applications

agreed between NXP Semiconductors and its customer, unless NXP

and products using NXP Semiconductors products in order to avoid a

Semiconductors and customer have explicitly agreed otherwise in writing.

default of the applications and the products or of the application or use by

In no event however, shall an agreement be valid in which the NXP

customer’s third party customer(s). NXP does not accept any liability in this

Semiconductors product is deemed to offer functions and qualities beyond

respect.

those described in the technical data data sheet.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

11.3 Disclaimers

Limited warranty and liability — Information in this document is believed

Characteristics sections of this document is not warranted. Constant or

to be accurate and reliable. However, NXP Semiconductors does not

repeated exposure to limiting values will permanently and irreversibly affect

give any representations or warranties, expressed or implied, as to the

accuracy or completeness of such information and shall have no liability

the quality and reliability of the device.

for the consequences of use of such information. NXP Semiconductors

takes no responsibility for the content in this document if provided by an

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

information source outside of NXP Semiconductors. In no event shall NXP

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

Semiconductors be liable for any indirect, incidental, punitive, special or

agreed in a valid written individual agreement. In case an individual

consequential damages (including - without limitation - lost profits, lost

agreement is concluded only the terms and conditions of the respective

savings, business interruption, costs related to the removal or replacement

agreement shall apply. NXP Semiconductors hereby expressly objects to

of any products or rework charges) whether or not such damages are based

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

on tort (including negligence), warranty, breach of contract or any other

legal theory. Notwithstanding any damages that customer might incur for

any reason whatsoever, NXP Semiconductors’ aggregate and cumulative

liability towards customer for the products described herein shall be limited

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or

in accordance with the Terms and conditions of commercial sale of NXP

the grant, conveyance or implication of any license under any copyrights,

Semiconductors.

patents or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

MPX4250D

All information provided in this document is subject to legal disclaimers.

Data sheet: technical data

Rev. 8.0 — 25 July 2017

11 / 14

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

applications. Unless otherwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer's own

risk.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

11.4 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Freescale — is a trademark of NXP B.V.

NXP — is a trademark of NXP B.V.

MPX4250D

All information provided in this document is subject to legal disclaimers.

Data sheet: technical data

Rev. 8.0 — 25 July 2017

12 / 14

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

Tables

Tab. 1.

Tab. 2.

Tab. 3.

Ordering information ..........................................2

Pin descriptions .................................................3

Maximum ratings ...............................................3

Tab. 4.

Tab. 5.

Operating characteristics ...................................3

Revision history ...............................................10

Figures

Fig. 1.

Fig. 2.

Fig. 3.

Fig. 4.

Fig. 5.

Unibody packages .............................................1

Fig. 8.

Fig. 9.

Temperature error band ....................................5

Pressure error band ..........................................6

Block diagram ................................................... 2

Pinning diagram ................................................ 2

Cross sectional diagram (not to scale) ..............4

Recommended power supply decoupling

and output filtering ............................................ 5

Output versus differential pressure ................... 5

Transfer function ............................................... 5

Fig. 10. Package name 98ASB42793B, Case

867-08, Issue N ................................................ 6

Fig. 11. Package name 98ASB42797B, Case

867C-05, Issue H ..............................................7

Fig. 12. Package name 98ASB42796B, Case

867B-04, Issue J ...............................................8

Fig. 6.

Fig. 7.

MPX4250D

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

13 / 14

NXP Semiconductors

MPX4250D

0 to 250 kPa, Differential, gauge pressure sensor, on-chip signal conditioned, temperature compensated

and calibrated

Contents

1

2

3

4

5

6

6.1

6.2

7

7.1

7.2

8

General description ............................................ 1

Features ............................................................... 1

Typical applications ............................................1

Ordering information .......................................... 2

Block diagram ..................................................... 2

Pinning information ............................................ 2

Pinning ...............................................................2

Pin description ...................................................3

Mechanical and electrical specifications .......... 3

Maximum ratings ............................................... 3

Operating characteristics ...................................3

On-chip temperature compensation and

calibration ............................................................ 4

Package information ...........................................6

Package description .......................................... 6

Revision history ................................................ 10

Legal information ..............................................11

9

9.1

10

11

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 July 2017

Document identifier: MPX4250D


型号：	MPX4250D
厂家：	NXP
描述：	Pressure Sensor, 5.1V, 0/250kPa, Sensor 6, Tray 传感器换能器
文件：	总14页 (文件大小：500K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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