MPXM2202GSTI [NXP]
MPXM2202GSTI;
| 型号： | MPXM2202GSTI |
| 厂家： | 
NXP |
| 描述： | MPXM2202GSTI |
| 文件： | 总18页 (文件大小：358K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pressure
MPX2202
Rev 6, 10/2008
Freescale Semiconductor
+
200 kPa On-Chip Temperature
MPX2202
Compensated Silicon
Pressure Sensors
Series
0 to 200 kPa (0 to 29 psi)
40 mV Full Scale
(Typical)
The MPX2202 devices series are silicon piezoresistive pressure sensor
providing a highly accurate and linear voltage output directly proportional to
the applied pressure. The sensor is a single monolithic silicon diaphragm with
the strain gauge and a thin-film resistor network integrated on-chip. The chip
is laser trimmed for precise span and offset calibration and temperature
compensation. They are designed for use in applications such as pump/
motor controllers, robotics, level indicators, medical diagnostics, pressure
switching, barometers, altimeters, etc.
Application Examples
•
•
•
•
•
•
•
Pump/Motor Controllers
Robotics
Level Indicators
Medical Diagnostics
Pressure Switching
Barometers
Features
• Temperature Compensated Over 0°C to +85°C
• Easy-to-Use Chip Carrier Package Options
• Available in Absolute, Differential and Gauge Configurations
• Ratiometric to Supply Voltage
Altimeters
• Available in Easy-to-Use Tape and Reel
ORDERING INFORMATION
# of Ports
Single
Pressure Type
Differential
Case
No.
Device Name
Device Marking
None
Dual
Gauge
Absolute
Unibody Package (MPX2202 Series)
MPX2202A
344
MPX2202A
MPX2202DP
MPX2202AP
MPX2202GP
MPX2202A
•
•
MPX2202DP
MPX2202AP
MPX2202GP
MPX2202ASX
344C
344B
344B
344F
•
•
•
•
•
•
•
•
•
•
Small Outline Package (MPXV2202 Series)
MPXV2202GP
1369
1351
482A
482A
MPXV2202GP
MPXV2202DP
MPXV2202G
MPXV2202G
•
MPXV2202DP
•
MPXV2202GC6TI
MPXV2202GC6U
•
•
•
•
MPAK Package (MPXM2202 Series)
MPXM2202D
1320
1320
MPXM2202D
MPXM2202D
MPXM2202A
MPXM2202GS
MPXM2202GS
MPXM2202AS
•
•
•
•
•
MPXM2202DT1
MPXM2202A
1320
•
•
MPXM2202GS
MPXM2202GST1
MPXM2202AS
1320A
1320A
1320A
•
•
•
•
•
© Freescale Semiconductor, Inc., 2005-2008. All rights reserved.
Pressure
UNIBODY PACKAGES
MPX2202ASX
CASE 344F-01
MPX2202A
CASE 344-15
MPX2202AP/GP
CASE 344B-01
MPX2202DP
CASE 344C-01
MPAK
SMALL OUTLINE PACKAGES
MPXV2202GP
CASE 1351-01
MPXV2202GP
CASE 1369-01
MPXV2202GP
CASE 482A-01
MPXM2202A
CASE 1320-02
MPXM2202GS/AS
CASE 1320A-02
MPX2202
Sensors
Freescale Semiconductor
2
Pressure
Operating Characteristics
Table 1. Operating Characteristics
(VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristics
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
-
200
16
kPa
Supply Voltage(2)
Supply Current
VS
—
10
Vdc
Io
—
6.0
40
-
mAdc
mV
Full Scale Span(3)
VFSS
38.5
41.5
Offset(4)
Voff
-1.0
-2.0
—
—
1.0
2.0
mV
MPX2202D, MPXM2202D/G Series
MPX2202A, MPXM2202A Series
Sensitivity
ΔV/ΔP
—
0.2
—
mV/kPa
%VFSS
Linearity(5)
—
-0.6
-1.0
—
—
0.4
1.0
MPXM2202D/G, MPX2202D Series
MPXM2202A, MPX2202A Series
Pressure Hysteresis(5) (0 to 200 kPa)
—
—
—
—
± 0.1
± 0.5
—
-
%VFSS
%VFSS
%VFSS
mV
Temperature Hysteresis(5) (-40°C to +125°C)
Temperature Effect on Full Scale Span(5)
-
TCVFSS
TCVoff
-2.0
-1.0
2.0
1.0
Temperature Effect on Offset(5)
Input Impedance
—
Zin
Zout
tR
1000
1400
—
—
—
2500
3000
—
Ω
Ω
Output Impedance
Response Time(6) (10% to 90%)
Warm-Up
1.0
ms
—
—
—
—
20
—
—
ms
Offset Stability(7)
±0.5
%VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure, at 25°C.
TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2202
Sensors
Freescale Semiconductor
3
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Max Value
Unit
kPa
°C
Maximum Pressure (P1 > P2)
Storage Temperature
400
-40 to 125
-40 to 125
Operating Temperature
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Voltage Output versus Applied Differential
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The absolute sensor has a built-in reference vacuum. The
output voltage will decrease as vacuum, relative to ambient,
is drawn on the pressure (P1) side.
(P1) side relative to the vacuum (P2) side. Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a block diagram of the internal circuitry
on the stand-alone pressure sensor chip.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
VS
3
Thin Film
2
4
+VOUT
–VOUT
Temperature
Compensation
and Calibration
Circuitry
Sensing
Element
1
GND
Figure 1. Temperature Compensated and Calibrated
Pressure Sensor Schematic
MPX2202
Sensors
4
Freescale Semiconductor
Pressure
On-Chip Temperature Compensation and Calibration
40
35
30
25
20
15
10
5
VS = 10 VDC
TA = 25°C
P1 > P2
TYP
Span
Range
(TYP)
MAX
MIN
0
-5
Offset
(TYP)
kPa
PSI
0
25
50
7.25
75
100 125
14.5
Pressure
150
21.75
175 200
29
Figure 2. Output vs. Pressure Differential
Figure 2 shows the output characteristics of the MPX2202
series at 25°C. The output is directly proportional to the
differential pressure and is essentially a straight line.
The effects of temperature on full scale span and offset are
very small and are shown under Operating Characteristics.
Absolute
Die
Differential/Gauge
Silicone Gel
Stainless Steel
Metal Cover
Silicone Gel
Die Coat
Die
Stainless Steel
Metal Cover
Die Coat
P1
P1
Epoxy
Case
Epoxy
Case
Wire Bond
Wire Bond
Lead Frame
Bond
Die
Lead Frame
Differential/Gauge Element
P2
Die
Bond
Absolute Element
P2
Figure 3. Cross Sectional Diagram (not to scale)
Figure 3 illustrates the differential/gauge die in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2202 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Least
Square
Deviation
Least Squares Fit
Exaggerated
Performance
Curve
Straight Line
Deviation
LINEARITY
End Point Straight
Line Fit
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 4) or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Offset
50
100
0
Pressure (% Full Scale)
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Figure 4. Linearity Specification Comparison
MPX2202
Sensors
Freescale Semiconductor
5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Table 3. Pressure (P1) Side Delineation
Part Number
Case Type
344
Pressure (P1) Side Identifier
MPX2202A
Stainless Steel Cap
MPX2202DP
Side with Part Marking
Side with Port Attached
Side with Port Attached
Side with Port Attached
Side with Part Marking
Side with Port Attached
Side with Part Marking
Side with Port Attached
Side with Part Marking
Side with Port Attached
344C
344B
344F
1369
MPX2202GP/AP
MPX2202ASX
MPX2202GP
MPX2202DP
1351
MPXV2202GP
1369
MPXV2202DP
1351
MPXV2202GC6TI/U
MPXM2202A/ATI/DT/DTI
MPXM2202GS/GSTI/AS/ASTI
482A
1320
1320A
MPX2202
Sensors
6
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
–A–
D 8 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
4
M
S
S
0.25 (0.010)
T
B
A
5
8
N
–B–
G
INCHES
MILLIMETERS
1
DIM
A
B
C
D
MIN
MAX
0.425
0.425
0.520
0.042
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
0.415
0.415
0.500
0.038
S
W
G
H
J
K
M
N
S
V
W
0.100 BSC
2.54 BSC
0.002
0.009
0.061
0
0.010
0.011
0.071
7
0.05
0.23
1.55
0
0.25
0.28
1.80
7
V
0.444
0.709
0.245
0.115
0.448
0.725
0.255
0.125
11.28
18.01
6.22
2.92
11.38
18.41
6.48
3.17
C
H
J
–T–
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A–01
ISSUE A
MPX2202
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
C
R
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
Z
1
4
2
3
INCHES
MILLIMETERS
B
-A-
DIM MIN MAX MIN
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
N
0.514
0.200
0.016
0.048
L
1
2
3
4
0.220
0.020
0.064
5.08
0.41
1.22
PIN 1
0.51
1.63
-T-
SEATING
PLANE
G
J
L
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
G
J
F
Y
M
N
R
Y
Z
30˚ NOM
30˚ NOM
D 4 PL
0.475
0.430
0.048
0.106
0.495 12.07
0.450 10.92
12.57
11.43
1.32
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
M
0.136 (0.005)
T
A
0.052
0.118
1.22
2.68
3.00
STYLE 1:
PIN 1. GROUND
STYLE 2:
PIN 1.
STYLE 3:
VCC
PIN 1. GND
2. -VOUT
3. VS
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
2. - SUPPLY
3. + SUPPLY
4. GROUND
4. +VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
NOTES:
SEATING
PLANE
-A-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-T-
U
L
R
INCHES
DIM MIN MAX
MILLIMETERS
H
MIN
29.08
17.40
7.75
MAX
29.85
18.16
8.26
A
B
C
D
F
1.145
0.685
0.305
0.016
0.048
1.175
0.715
0.325
0.020
0.064
N
B
PORT #1
-Q-
POSITIVE
PRESSURE
(P1)
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
0.100 BSC
2.54 BSC
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.230
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.250
0.240
4.62
0.36
17.65
7.37
10.67
3.89
3.89
5.84
5.59
4.93
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.10
1
2 3 4
PIN 1
K
-P-
S
M
S
0.25 (0.010)
T
Q
J
F
0.910 BSC
23.11 BSC
G
C
D 4 PL
M
S
S
0.13 (0.005)
T
S
Q
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2202
Sensors
Freescale Semiconductor
8
Pressure
PACKAGE DIMENSIONS
NOTES:
-A-
U
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
V
PORT #1
W
L
R
H
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
29.08 29.85
17.40 18.16
10.29 11.05
PORT #2
PORT #1
PORT #2
VACUUM
(P2)
POSITIVE PRESSURE
(P1)
A
B
C
D
F
1.145
0.685
0.405
0.016
0.048
1.175
0.715
0.435
0.020
0.064
N
-Q-
0.41
1.22
0.51
1.63
G
H
J
K
L
N
P
Q
R
S
U
V
W
0.100 BSC
2.54 BSC
SEATING
PLANE
SEATING
PLANE
B
0.182
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.194
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
4.62
0.36
4.93
0.41
1
2 3 4
17.65 18.42
7.37 7.62
10.67 11.18
PIN 1
K
-P-
M
S
0.25 (0.010)
T
Q
3.89
3.89
1.60
5.59
4.04
4.04
2.11
6.10
-T-
-T-
S
F
J
G
C
0.910 BSC
23.11 BSC
D 4 PL
0.248
0.310
0.278
0.330
6.30
7.87
7.06
8.38
M
S
S
0.13 (0.005)
T
S
Q
4. - OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
NOTES:
-T-
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
C
A
U
-Q-
E
INCHES
MILLIMETERS
DIM MIN MAX MIN
MAX
28.45
19.30
16.51
0.51
A
B
C
D
E
F
1.080
1.120 27.43
0.760 18.80
0.650 16.00
0.740
0.630
0.016
0.160
0.048
0.020
0.180
0.064
0.41
4.06
1.22
N
S
B
V
4.57
1.63
G
J
0.100 BSC
2.54 BSC
R
0.014
0.220
0.070
0.150
0.150
0.440
0.695
0.840
0.182
0.016
0.240
0.080
0.160
0.160
0.36
5.59
1.78
3.81
3.81
0.41
6.10
K
N
P
Q
R
S
U
V
PORT #1
PIN 1
2.03
4.06
POSITIVE
-P-
PRESSURE
(P1)
M
M
T Q
0.25 (0.010)
4
3
2
1
4.06
0.460 11.18
0.725 17.65
0.860 21.34
11.68
18.42
21.84
4.92
K
0.194
4.62
F
J
G
STYLE 1:
D 4 PL
0.13 (0.005)
PIN 1. GROUND
2. V (+) OUT
3. V SUPPLY
4. V (-) OUT
M
S
S
T
P
Q
CASE 344F-01
ISSUE B
UNIBODY PACKAGE
MPX2202
Sensors
Freescale Semiconductor
9
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2202
10
Sensors
Freescale Semiconductor
Pressure
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2202
11
Sensors
Freescale Semiconductor
Pressure
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2202
12
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2202
13
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1320-02
ISSUE B
MPAK
MPX2202
14
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1320-02
ISSUE B
MPAK
MPX2202
15
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PIN 4
PIN 1
CASE 1320A-02
ISSUE A
MPAK
MPX2202
16
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1320A-02
ISSUE A
MPAK
MPX2202
17
Sensors
Freescale Semiconductor
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MPX2202
Rev. 6
10/2008
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