N74F241N,602 [NXP]
74F241 - Octal buffer (3-state) DIP 20-Pin;
| 型号： | N74F241N,602 |
| 厂家： | 
NXP |
| 描述： | 74F241 - Octal buffer (3-state) DIP 20-Pin 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总10页 (文件大小：88K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
74F241
Octal buffer (3-state)
Product data
2004 Feb 25
Supersedes data of 2002 Mar 18
Philips
Semiconductors
Philips Semiconductors
Product data
Octal buffer
74F241
FEATURES
• Octal bus interface
DESCRIPTION
The 74F241 is an octal buffer that is ideal for driving bus lines of
buffer memory address registers. The outputs are all capable of
sinking 64 mA and sourcing up to 15 mA. The device features two
output enables, each controlling four of the 3-state outputs.
• 3-state buffer outputs sink 64 mA
• 15 mA source current
TYPE
TYPICAL PROPAGATION DELAY
4.0 ns
TYPICAL SUPPLY CURRENT (TOTAL)
74F241
53 mA
ORDERING INFORMATION
ORDER CODE
COMMERCIAL RANGE
DESCRIPTION
PKG DWG #
V
CC
= 5 V ±10%, T = 0 °C to +70 °C
amb
20-pin plastic DIP
20-pin plastic SOL
N74F241N
N74F241D
SOT146-1
SOT163-1
INPUT AND OUTPUT LOADING AND FAN OUT TABLE
74F (U.L.)
HIGH/LOW
LOAD VALUE
HIGH/LOW
PINS
DESCRIPTION
Ian, Ibn
OEa, OEb
Yan, Ybn
Data inputs
1.0/2.67
1.0/1.67
20 µA/1.6 mA
20 µA/1 mA
Output enable input
Data outputs
750/106.7
15 mA/64 mA
Note to input and output loading and fan out table
One (1.0) FAST unit load is defined as: 20 µA in the HIGH state and 0.6 mA in the LOW state.
PIN CONFIGURATION
LOGIC SYMBOL
OEa
Ia0
1
2
3
4
5
6
7
8
9
20
V
CC
2
4
6
8
17 15 13
11
19 OEb
18 Ya0
17 Ib0
16 Ya1
15 Ib1
14 Ya2
13 Ib2
12 Ya3
11 Ib3
Yb0
Ia1
Ia0 Ia1 Ia2 Ia3 Ib0 Ib1 Ib2 Ib3
Yb1
Ia2
1
OEa
OEb
19
Yb2
Ia3
Ya0 Ya1 Ya2 Ya3 Yb0 Yb1 Yb2 Yb3
Yb3
18 16 14 12
3
5
7
9
GND 10
V
= Pin 20
CC
GND = Pin 10
SF00324
SF00325
2
2004 Feb 25
Philips Semiconductors
Product data
Octal buffer
74F241
IEC/IEEE SYMBOL
LOGIC DIAGRAM
1
EN1
EN2
17
15
3
2
18
16
Ib0
Ib1
Yb0
Ia0
Ya0
Ya1
19
5
4
Yb1
2
4
18
16
14
12
Ia1
2D
1
13
7
6
14
12
6
8
Ib2
Ib3
Yb2
Ia2
Ya2
Ya3
11
10
9
8
17
3
5
Yb3
Ia3
2
15
1
7
9
13
11
OEb
OEa
V
= Pin 20
CC
GND = Pin 10
SF00326
SF00327
FUNCTION TABLE
INPUTS
OUTPUTS
Ya Yb
OEa
Ia
L
OEb
Ib
L
L
H
H
L
L
H
Z
L
H
Z
L
H
H
X
H
X
NOTES:
H = High voltage level
L
X
Z
=
=
=
Low voltage level
Don’t care
High impedance “off” state
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
V
Supply voltage
V
CC
V
IN
–0.5 to +7.0
–0.5 to +7.0
–30 to +5
Input voltage
Input current
V
I
IN
mA
V
V
Voltage applied to output in high output state
Current applied to output in low output state
Operating free air temperature range
Storage temperature range
–0.5 to V
128
OUT
OUT
CC
I
mA
°C
°C
T
amb
0 to +70
T
stg
–65 to +150
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
UNIT
MIN
NOM
MAX
V
Supply voltage
4.5
2.0
5.0
5.5
V
V
CC
IH
IL
V
V
High-level input voltage
Low-level input voltage
Input clamp current
0.8
–18
–15
64
V
I
I
I
mA
mA
mA
°C
Ik
High-level output current
Low-level output current
OH
OL
T
amb
Operating free air temperature range
0
+70
3
2004 Feb 25
Philips Semiconductors
Product data
Octal buffer
74F241
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
1
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
UNIT
2
MIN
2.4
2.7
2.0
2.0
TYP
MAX
V
±10%V
±5%V
CC
I
= –3 mA
OH
V
= MIN; V
IL
3.4
V
CC
CC
V
High-level output voltage
Low-level output voltage
= MAX; V
MIN
=
OH
IH
±10%V
V
CC
CC
I
= –15 mA
OH
±5%V
V
V
CC
= MIN; V
IL
±10%V
0.50
V
CC
V
OL
I
= MAX
= MAX; V
MIN
=
OL
IH
±5%V
0.42
0.50
–1.2
100
20
V
V
CC
V
Input clamp voltage
V
CC
V
CC
V
CC
= MIN; I = I
IK
–0.73
IK
I
I
I
Input current at maximum input voltage
High-level input current
OEa,
= MAX; V = 7.0 V
µA
µA
I
I
= MAX; V = 2.7 V
IH
I
–1.0
–1.6
50
mA
mA
µA
OEb
I
I
Low-level input current
V
CC
V
CC
= MAX; V = 0.5 V
I
IL
Ian, Ibn
Off-state output current,
high-level voltage applied
= MAX, V = 2.7 V
OZH
O
Off-state output current,
low-level voltage applied
I
I
V
V
= MAX, V = 0.5 V
–50
µA
OZL
CC
O
3
Short-circuit output current
= MAX
–100
–225
60
mA
mA
mA
mA
OS
CC
I
40
60
65
CCH
I
Supply current (total)
V
CC
= MAX
I
90
CC
CCL
I
90
CCZ
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V = 5 V, T = 25 °C.
CC
amb
3. Not more than one output should be shorted at a time. For testing I , the use of high-speed test apparatus and/or sample-and-hold
OS
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged
shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In
any sequence of parameter tests, I tests should be performed last.
OS
4
2004 Feb 25
Philips Semiconductors
Product data
Octal buffer
74F241
AC ELECTRICAL CHARACTERISTICS
LIMITS
T
amb
= +25 °C
T
amb
= 0 °C to +70 °C
SYMBOL
PARAMETER
TEST
V
CC
= +5.0 V
V
CC
= +5.0 V ± 10%
UNIT
CONDITION
C = 50 pF; R = 500 Ω
C = 50 pF; R = 500 Ω
L L
L
L
MIN
TYP
MAX
MIN
MAX
t
t
Propagation delay
Ian, Ibn to Yn
2.5
2.5
4.0
4.0
5.2
5.2
2.5
2.5
6.2
6.5
PLH
PHL
Waveform 1
Waveform 2, 3
Waveform 2, 3
ns
ns
ns
t
t
Output enable time
to high or low level
2.0
2.0
4.0
5.0
5.7
7.0
2.0
2.0
6.7
8.0
PZH
PZL
t
t
Output disable time
from high or low level
2.0
2.0
4.0
4.0
6.0
6.0
2.0
2.0
7.0
7.0
PHZ
PLZ
NOTES:
1. | t actual – t actual| for any output compared to any other output where N and M are either LH or HL.
PN
PM
5
2004 Feb 25
Philips Semiconductors
Product data
Octal buffer
74F241
AC WAVEFORMS
OEn
OEb
Ian, Ibn
V
V
M
M
V
t
V
M
M
t
t
PHL
PLH
t
PZL
PLZ
3.5V
Yn
V
V
V
M
M
M
Yn, Yn
SF00329
V
+0.3V
OL
SF00331
Waveform 1. Propagation delay
Waveform 3. 3-state output enable time to low level and output
disable time from low level
OEn
OEb
V
V
M
M
V
-0.3V
0V
Notes to AC waveforms
OH
t
t
PHZ
PZH
1. For all waveforms, V = 1.5 V.
M
Yn, Yn
V
M
SF00330
Waveform 2. 3-state output enable time to high level
and output disable time from high level
TEST CIRCUIT AND WAVEFORMS
V
CC
t
AMP (V)
0 V
w
7.0 V
90%
90%
NEGATIVE
PULSE
V
V
M
R
M
L
V
V
OUT
IN
10%
10%
PULSE
GENERATOR
D.U.T.
t
t )
t
t )
THL ( f
TLH ( r
R
C
R
L
T
L
t
t )
t
t )
TLH ( r
THL ( f
AMP (V)
0 V
90%
M
90%
POSITIVE
PULSE
V
V
M
Test Circuit for Open Collector Outputs
10%
10%
t
SWITCH POSITION
TEST
w
SWITCH
closed
closed
open
Input Pulse Definition
t
t
PLZ
PZL
All other
DEFINITIONS:
R
=
=
=
Load resistor;
L
INPUT PULSE REQUIREMENTS
see AC electrical characteristics for value.
Load capacitance includes jig and probe capacitance;
see AC electrical characteristics for value.
Termination resistance should be equal to Z
pulse generators.
family
C
L
V
M
rep. rate
t
w
t
t
THL
amplitude
TLH
R
T
of
OUT
2.5 ns 2.5 ns
500 ns
74F
3.0 V
1.5 V 1 MHz
SF00128
6
2004 Feb 25
Philips Semiconductors
Product data
Octal buffer
74F241
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
7
2004 Feb 25
Philips Semiconductors
Product data
Octal buffer
74F241
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
8
2004 Feb 25
Philips Semiconductors
Product data
Octal buffer
74F241
REVISION HISTORY
Rev
Date
Description
_4
20040225
Product data (9397 750 12965); supersedes data sheet 74F240_241_241A_3 of 2002 Mar 18
(9397 750 09571).
Modifications:
• Delete all references to 74F241A (product discontinued).
• Separate 74F240 and 74F241 into standalone data sheets.
_3
20020318
Product data (9397 750 09571); supersedes previous version.
9
2004 Feb 25
Philips Semiconductors
Product data
Octal buffer
74F241
Data sheet status
Product
status
Definitions
[1]
Level
Data sheet status
[2] [3]
I
Objective data
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
Production
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limitingvaluesdefinition— Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
viaaCustomerProduct/ProcessChangeNotification(CPCN).PhilipsSemiconductorsassumesnoresponsibilityorliabilityfortheuseofanyoftheseproducts,conveys
nolicenseortitleunderanypatent, copyright, ormaskworkrighttotheseproducts, andmakesnorepresentationsorwarrantiesthattheseproductsarefreefrompatent,
copyright, or mask work right infringement, unless otherwise specified.
Koninklijke Philips Electronics N.V. 2004
Contact information
All rights reserved. Printed in U.S.A.
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 02-04
9397 750 12965
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
Document order number:
Philips
Semiconductors
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