NT3H1101W0FHKH [NXP]
NT3H1101/NT3H1201 - NTAG I²C - Energy harvesting NFC Forum Type 2 Tag with field detection pin and I²C interface QFN 8-Pin;
| 型号： | NT3H1101W0FHKH |
| 厂家： | 
NXP |
| 描述： | NT3H1101/NT3H1201 - NTAG I²C - Energy harvesting NFC Forum Type 2 Tag with field detection pin and I²C interface QFN 8-Pin 外围集成电路 |
| 文件： | 总65页 (文件大小：1834K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NT3H1101/NT3H1201
NTAG I2C - Energy harvesting NFC Forum Type 2 Tag with
field detection pin and I2C interface
Rev. 3.3 — 15 July 2015
265433
Product data sheet
COMPANY PUBLIC
1. General description
NTAG I2C - The entry to the NFC world: simple and lowest cost.
The NTAG I2C is the first product of NXP’s NTAG family offering both contactless and
contact interfaces (see Figure 1). In addition to the passive NFC Forum compliant
contactless interface, the IC features an I2C contact interface, which can communicate
with a microcontroller if the NTAG I2C is powered from an external power supply. An
additional externally powered SRAM mapped into the memory allows a fast data transfer
between the RF and I2C interfaces and vice versa, without the write cycle limitations of the
EEPROM memory.
The NTAG I2C product features a configurable field detection pin, which provides a trigger
to an external device depending on the activities at the RF interface.
The NTAG I2C product can also supply power to external (low power) devices (e.g. a
microcontroller) via the embedded energy harvesting circuitry.
2
I C
Micro
controller
EEPROM
1
0
1
0
1
0
NFC
enabled
device
Energy Harvesting
Field detection
Data
Data
Energy
Energy
aaa-010357
Fig 1. Contactless and contact system
NT3H1101/NT3H1201
NXP Semiconductors
NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
2. Features and benefits
2.1 Key features
RF interface NFC Forum Type 2 Tag compliant
I2C interface
Configurable field detection pin based on open drain implementation that can be
triggered upon the following events:
RF field presence
First start of communication
Selection of the tag only
64 byte SRAM buffer for fast transfer of data (Pass-through mode) between the RF
and the I2C interfaces located outside the User Memory
Wake up signal at the field detect pin when:
New data has arrived from one interface
Data has been read by the receiving interface
Clear arbitration between RF and I2C interfaces:
First come, first serve strategy
Status flag bits to signal if one interface is busy writing to or reading data from the
EEPROM
Energy harvesting functionality to power external devices (e.g. microcontroller)
FAST READ command for faster data reading
2.2 RF interface
Contactless transmission of data
NFC Forum Type 2 Tag compliant (see Ref. 1)
Operating frequency of 13.56 MHz
Data transfer of 106 kbit/s
4 bytes (one page) written including all overhead in 4.8 ms via EEPROM or 0.8 ms via
SRAM (Pass-through mode)
Data integrity of 16-bit CRC, parity, bit coding, bit counting
Operating distance of up to 100 mm (depending on various parameters, such as field
strength and antenna geometry)
True anticollision
Unique 7 byte serial number (cascade level 2 according to ISO/IEC 14443-3
(see Ref. 2)
2.3 Memory
1904 bytes freely available with User Read/Write area (476 pages with 4 bytes per
pages) for the NTAG I2C 2k version
888 bytes freely available with User Read/Write area (222 pages with 4 bytes per
pages) for the NTAG I2C 1k version
Field programmable RF read-only locking function with static and dynamic lock bits
configurable from both I²C and NFC interfaces
64 bytes SRAM volatile memory without write endurance limitation
NT3H1101/1201
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
Data retention time of 20 years
Write endurance 500,000 cycles
2.4 I2C interface
I2C slave interface supports Standard (100 kHz) and Fast (up to 400 kHz) mode (see
Ref. 3)
16 bytes (one block) written in 4.5 ms (EEPROM) or 0.4 ms (SRAM - Pass-through
mode) including all overhead
RFID chip can be used as standard I2C EEPROM
2.5 Security
Manufacturer-programmed 7-byte UID for each device
Capability container with one time programmable bits
Field programmable read-only locking function per page for first 12 pages and per 16
(1k version) or 32 (2k version) pages for the extended memory section
2.6 Key benefits
The Pass-through mode allows fast download and upload of data from RF to I²C and
vice versa without the cycling limitation of EEPROM
NDEF message storage up to 1904 bytes (2k version) or up to 888 bytes (1k version)
The mapping of the SRAM inside the User Memory buffer allows dynamic update of
NDEF message content
3. Applications
With all its integrated features and functions the NTAG I2C is the ideal solution to enable a
contactless communication via an NFC device (e.g., NFC enabled mobile phone) to an
electronic device for:
Zero power configuration (late customization)
Smart customer interaction (e.g., easier after sales service, such as firmware update)
Advanced pairing (for e.g., WiFi or Blue tooth) for dynamic generation of sessions keys
Easier product customization and customer experience for the following applications:
Home automation
Home appliances
Consumer electronics
Healthcare
Printers
Smart meters
NT3H1101/1201
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.3 — 15 July 2015
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
NT3H1101W0FUG FFC
bumped
8 inch wafer, 150um thickness, on film frame carrier, electronic fail die
-
marking according to SECS-II format), Au bumps, 1k Bytes memory, 50pF
input capacitance
NT3H1201W0FUG FFC
bumped
8 inch wafer, 150um thickness, on film frame carrier, electronic fail die
-
marking according to SECS-II format), Au bumps, 2k Bytes memory, 50pF
input capacitance
NT3H1101W0FHK XQFN8
NT3H1201W0FHK XQFN8
NT3H1101W0FTT TSSOP8
NT3H1201W0FTT TSSOP8
Plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x SOT902-3
1.6 x 0.6mm; 1k bytes memory, 50pF input capacitance
Plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x SOT902-3
1.6 x 0.6mm; 2k bytes memory, 50pF input capacitance
Plastic thin shrink small outline package; 8 leads; body width 3 mm; 1k
bytes memory; 50pF input capacitance
SOT505-1
Plastic thin shrink small outline package; 8 leads; body width 3 mm; 2k
bytes memory; 50pF input capacitance
SOT505-1
5. Marking
Table 2.
Marking codes
Type number
Marking code
N12
NT3H1201FHK
NT3H1101FHK
NT3H1101W0FFT
NT3H1201W0FFT
N11
31101
31201
NT3H1101/1201
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
COMPANY PUBLIC
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
6. Block diagram
VCC
GND
Vout
2
POWER MANAGEMENT/
ENERGY HARVESTING
I C
SLAVE
LA
LB
DIGITAL CONTROL UNIT
MEMORY
SDA
SCL
ARBITER/STATUS
REGISTERS
RF
2
I C
INTERFACE
CONTROL
EEPROM
SRAM
ANTICOLLISION
MEMORY
COMMAND
INTERFACE
INTERPRETER
FD
aaa-010358
Fig 2. Block diagram
NT3H1101/1201
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
7. Pinning information
7.1 Pinning
7.1.1 XQFN8
A
LB
8
LA
1
7
6
5
VOUT
VCC
SDA
A
VSS
SCL
2
3
4
FD
Transparent top view
B
side view
aaa-010359
(1) Dimension A: 1.6 mm
(2) Dimension B: 0.5 mm
Fig 3. Pin configuration for XQFN8
7.1.2 TSSOP8
LA
VSS
SCL
FD
1
2
3
4
8
7
6
5
LB
VOUT
VCC
SDA
B
A
C
Transparent top view
Side view
aaa-017246
(1) Dimension A: 5.1 mm
(2) Dimension B: 3.1 mm
(3) Dimension C: 1.1 mm
Fig 4. Pin configuration for TSSOP8
NT3H1101/1201
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
7.2 Pin description
Table 3.
Pin description for XQFN8 and TSSOP8
Pin
1
Symbol
LA
Description
Antenna connection LA
2
VSS
SCL
FD
GND
Serial Clock I2C
3
4
Field detection
5
SDA
VCC
VOUT
LB
Serial data I2C
6
VCC in connection (external power supply)
Voltage out (energy harvesting)
Antenna connection LB
7
8
NXP recommends leaving the central pad of the XQFN8 package unconnected.
NT3H1101/1201
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
COMPANY PUBLIC
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
8. Functional description
8.1 Block description
NTAG I2C ICs consist of (see details below): 2016 bytes of EEPROM memory, 64 Bytes of
SRAM, a RF interface, Digital Control Unit (DCU), Power Management Unit (PMU) and an
I²C interface. Energy and data are transferred via an antenna consisting of a coil with a
few turns, which is directly connected to NTAG I2C IC.
• RF interface:
– modulator/demodulator
– rectifier
– clock regenerator
– Power-On Reset (POR)
– voltage regulator
• Anticollision: multiple cards may be selected and managed in sequence
• Command interpreter: processes memory access commands supported by the NTAG
I2C
• EEPROM interface
8.2 RF interface
The RF-interface is based on the ISO/IEC 14443 Type A standard.
This RF interface is passive and therefore requires to be supplied by an RF field (e.g. NFC
enabled device) at all times to be able to operate. It is not operating even if the NTAG I2C
is powered via its contact interface (Vcc).
Data transmission from the RF interface is only happening if RF field from an NFC
enabled device is available and adequate commands are sent to retrieve data from the
NTAG I2C.
For both directions of data communication, there is one start bit (start of communication)
at the beginning of each frame. Each byte is transmitted with an odd parity bit at the end.
The LSB of the byte with the lowest address of the selected block is transmitted first.
The maximum length of an NFC device to tag frame used in this product is 82 bits (7 data
bytes + 2 CRC bytes = 7×9 + 2×9 + 1 start bit).
The maximum length of a tag to NFC device frame (response to READ command) is 163
bits (16 data bytes + 2 CRC bytes = 16 9 + 2 9 + 1 start bit).
In addition the proprietary FAST_READ command has a variable response frame length,
which depends on the start and end address parameters. E.g. when reading the SRAM at
once the length of the response is 595 bits (64 data bytes + 2 CRC bytes = 64 9 + 2 9
+ 1 start bit). The overall maximum supported response frame length for FAST READ is
up to 9235 bits (1024 data bytes + 2 CRC bytes = 1024 9 + 2 9 + 1 start bit), but here
the maximum frame length supported by the NFC device must be taken into account
when issuing this command.
NT3H1101/1201
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
For a multi-byte parameter, the least significant byte is always transmitted first. For
example, when reading from the memory using the READ command, byte 0 from the
addressed block is transmitted first, followed by bytes 1 to byte 3 out of this block. The
same sequence continues for the next block and all subsequent blocks.
8.2.1 Data integrity
The following mechanisms are implemented in the contactless communication link
between the NFC device and the NTAG I²C IC to ensure very reliable data transmission:
• 16 bits CRC per block
• Parity bits for each byte
• Bit count checking
• Bit coding to distinguish between “1”, “0” and “no information”
• Channel monitoring (protocol sequence and bit stream analysis)
The commands are initiated by the NFC device and controlled by the Digital Control Unit
of the NTAG I2C IC. The command response depends on the state of the IC, and for
memory operations, also on the access conditions valid for the corresponding page.
NT3H1101/1201
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
COMPANY PUBLIC
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
8.2.2 RF communication principle
POR
IDLE
HALT
REQA
WUPA
identification
and
WUPA
selection
procedure
READY 1
ANTICOLLISION
SELECT
cascade level 1
HLTA
ANTICOLLISION
READY 2
SELECT
cascade level 2
memory
operations
READ (16 Byte)
FAST_READ
ACTIVE
WRITE
SECTOR_SELECT
GET_VERSION
aaa-012797
Fig 5. RF communication principle of NTAG I2C
The overall RF communication principle is summarized in Figure 5.
8.2.2.1 IDLE state
After a power-on reset (POR), the NTAG I2C switches to the IDLE state. It only exits this
state when a REQA or a WUPA command is received from the NFC device. Any other
data received while in this state is interpreted as an error, and the NTAG I2C remains in
the IDLE state.
After a correctly executed HLTA command e.g., out of the ACTIVE state, the default
waiting state changes from the IDLE state to the HALT state. This state can then only be
exited with a WUPA command.
8.2.2.2 READY 1 state
In the READY 1 state, the NFC device resolves the first part of the UID (3 bytes) using the
ANTICOLLISION or SELECT commands in cascade level 1. This state is correctly exited
after execution of the following command:
• SELECT command from cascade level 1: the NFC device switches the NTAG I2C into
READY2 state where the second part of the UID is resolved.
NT3H1101/1201
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Product data sheet
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
8.2.2.3 READY 2 state
In the READY 2 state, the NTAG I2C supports the NFC device in resolving the second part
of its UID (4 bytes) with the cascade level 2 ANTICOLLISION command. This state is
usually exited using the cascade level 2 SELECT command.
Remark: The response of the NTAG I2C to the SELECT command is the Select
AcKnowledge (SAK) byte. In accordance with ISO/IEC 14443, this byte indicates if the
anticollision cascade procedure has finished. If finished, the NTAG I2C is now uniquely
selected and only this device will communicate with the NFC device even when other
contactless devices are present in the NFC device field.
8.2.2.4 ACTIVE state
All memory operations are operated in the ACTIVE state.
The ACTIVE state is exited with the HLTA command and upon reception, the NTAG I2C
transits to the HALT state. Any other data received when the device is in this state is
interpreted as an error. Depending on its previous state, the NTAG I2C returns to either to
the IDLE state or HALT state.
8.2.2.5 HALT state
HALT and IDLE states constitute the two wait states implemented in the NTAG I2C. An
already processed NTAG I2C can be set into the HALT state using the HLTA command. In
the anticollision phase, this state helps the NFC device distinguish between processed
tags and tags yet to be selected. The NTAG I2C can only exit this state upon execution of
the WUPA command. Any other data received when the device is in this state is
interpreted as an error, and NTAG I2C state remains unchanged.
8.3 Memory organization
The memory map is detailed in Table 4 (1k memory) and Table 5 (2k memory) from the
RF interface and in Table 6 (1k memory) and Table 7 (2k memory) from the I2C interface.
The SRAM memory is not mapped from the RF interface, because in the default settings
of the NTAG I2C the Pass-through mode is not enabled. Please refer to Section 11 for
examples of memory map from the RF interface with SRAM mapping.
The structure of manufacturing data, static lock bytes, capability container and user
memory pages (except of the user memory length) are compatible with other NTAG
products.
Any memory access which starts at a valid address and extends into an invalid access
region will return 00h value in the invalid region.
8.3.1 Memory map from RF interface
Memory access from the RF interface is organized in pages of 4 bytes each.
NT3H1101/1201
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Product data sheet
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
Table 4.
NTAG I2C 1k memory organization from the RF interface
Page address Byte number within a page
Sector
Access
address
conditions
Dec.
0
Hex.
00h
01h
02h
03h
04h
...
0
1
2
3
0
Serial number
Serial number
Internal
READ
READ
1
Internal
2
Static lock bytes
READ/R&W
READ&WRITE
3
Capability Container (CC)
4
...
15
0Fh
...
User memory
READ&WRITE
R&W/READ
n.a.
...
225
226
227
228
229
230
231
232
233
234
...
E1h
E2h
E3h
E4h
E5h
E6h
E7h
E8h
E9h
EAh
...
Dynamic lock bytes
00h
Invalid access - returns NAK
Configuration registers
see 8.3.11
n.a.
Invalid access - returns NAK
255
FFh
1
2
3
...
...
...
...
Invalid access - returns NAK
Invalid access - returns NAK
n.a.
n.a.
0
00h
...
Invalid access - returns NAK
Session registers
n.a.
see 8.3.11
n.a.
...
248
249
...
F8h
F9h
...
Invalid access - returns NAK
255
FFh
NT3H1101/1201
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
Table 5.
NTAG I2C 2k memory organization from the RF interface
Page address Byte number within a page
Sector
Access
address
conditions
Dec.
0
Hex.
00h
01h
02h
03h
04h
...
0
1
2
3
0
Serial number
Serial number
Internal
Capability Container (CC)
READ
READ
1
Internal
2
Static lock bytes
READ/R&W
READ&WRITE
3
4
...
15
...
0Fh
...
...
...
255
FFh
User memory
READ&WRITE
1
0
...
1
...
...
...
...
...
223
224
225
226
227
228
229
230
231
232
233
234
...
DFh
E0h
E1h
E2h
E3h
E4h
E5h
E6h
E7h
E8h
E9h
EAh
...
Dynamic lock bytes
00h
R&W/READ
Invalid access - returns NAK
n.a.
Configuration registers
see 8.3.11
n.a.
Invalid access - returns NAK
255
FFh
2
3
...
...
Invalid access - returns NAK
Invalid access - returns NAK
n.a.
n.a.
0
00h
...
...
248
249
...
F8h
F9h
...
Session registers
see 8.3.11
n.a.
Invalid access - returns NAK
255
FFh
8.3.2 Memory map from I²C interface
The memory access of NTAG I²C from the I²C interface is organized in blocks of 16 bytes
each.
NT3H1101/1201
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
Table 6.
NTAG I2C 1k memory organization from the I2C interface
Byte number within a block
I2C block
address
0
1
5
2
3
7
Access
conditions
4
6
8
9
10
14
11
15
Dec.
Hex.
12
13
0
00h
I2C addr.*
Serial number
R&W/READ
READ
Serial number
Internal
Internal
Static lock bytes
READ/R&W
READ&WRITE
Capability Container (CC)
1
01h
...
...
User memory
READ&WRITE
55
56
37h
38h
User memory
User memory
READ&WRITE
READ&WRITE
READ&WRITE
READ
Dynamic lock bytes
00h
00h
00h
00h
00h
57
58
39h
3Ah
Invalid access - returns NAK
n.a.
Configuration registers
see 8.3.11
READ
00h
00h
00h
00h
00h
00h
00h
00h
59
...
3Bh
...
Invalid access - returns NAK
n.a.
247
248
...
F7h
F8h
...
SRAM memory (64 bytes)
Invalid access - returns NAK
READ&WRITE
251
...
FBh
...
n.a.
254
FEh
Session registers
(requires READ register command)
see 8.3.11
00h
00h
00h
00h
00h
00h
00h
00h
READ
n.a.
...
...
Invalid access - returns NAK
Remark: * The byte 0 of block 0 is always read as 04h. Writing to this byte modifies the I2C
address.
NT3H1101/1201
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Product data sheet
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
Table 7.
NTAG I2C 2k memory organization from the I2C interface
Byte number within a block
I2C block
address
0
1
5
2
3
7
Access
conditions
4
6
8
9
10
14
11
15
Dec.
Hex.
12
13
0
00h
I2C addr.*
Serial number
R&W/READ
READ
Serial number
Internal
Internal
Static lock bytes
READ/R&W
READ&WRITE
Capability Container (CC)
1
01h
...
...
User memory
READ&WRITE
READ&WRITE
READ
119
120
77h
78h
Dynamic lock bytes
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
121
122
79h
7Ah
Invalid access - returns NAK
n.a.
Configuration registers
see 8.3.11
READ
00h
00h
00h
00h
00h
00h
00h
00h
127
...
7Bh
...
Invalid access - returns NAK
n.a.
247
248
...
F7h
F8h
...
SRAM memory (64 bytes)
Invalid access - returns NAK
READ&WRITE
251
...
FBh
...
n.a.
254
FEh
Session registers
(requires READ register command)
see 8.3.11
00h
00h
00h
00h
00h
00h
00h
00h
READ
n.a.
...
...
Invalid access - returns NAK
Remark: * The byte 0 of block 0 is always read as 04h. Writing to this byte modifies the I2C
address.
NT3H1101/1201
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
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8.3.3 EEPROM
The EEPROM is a non volatile memory that stores the 7 byte UID, the memory lock
conditions, IC configuration information and the 1904 bytes user data (888 byte user data
in case of the NTAG I2C 1k version).
8.3.4 SRAM
For frequently changing data, a volatile memory of 64 bytes with unlimited endurance is
built in. The 64 bytes are mapped in a similar way as done in the EEPROM, i.e., 64 bytes
are seen as 16 pages of 4 bytes.
The SRAM is only available if the tag is powered via the VCC pin.
The SRAM is located at the end of the memory space and it is always directly accessible
by the I2C host (addresses F8h to FBh). An RF reader cannot access the SRAM memory
in normal mode (i.e., outside the Pass-through mode). The SRAM is only accessible by
the RF reader if the SRAM is mirrored onto the EEPROM memory space.
With Memory Mirror enabled (SRAM_MIRROR_ON_OFF = 1b - see Section 11.2), the
SRAM can be mirrored in the User Memory (page 1 to page 116 - see Section 11.2) for
access from the RF side.
The Memory mirror must be enabled once both interfaces are ON as this feature is
disabled after each POR.
The register SRAM_MIRROR_BLOCK (see Table 14) indicates the address of the first
page of the SRAM buffer. In the case where the SRAM mirror is enabled and the READ
command is addressing blocks where the SRAM mirror is located, the SRAM mirror byte
values will be returned instead of the EEPROM byte values. Similarly, if the tag is not VCC
powered, the SRAM mirror is disabled and reading out the bytes related to the SRAM
mirror position would return the values from the EEPROM.
In the Pass-through mode (PTHRU_ON_OFF = 1b - see Section 8.3.11), the SRAM is
mirrored to the fixed address 240 - 255 for RF access (see Section 11) in the first memory
sector for NTAG I2C 1k and in the second memory sector for NTAG I2C 2k.
8.3.5 UID/serial number
The unique 7-byte serial number (UID) is programmed into the first 7 bytes of memory
covering page addresses 00h and 01h - see Figure 6. These bytes are programmed and
write protected in the production test.
SN0 holds the Manufacturer ID for NXP Semiconductors (04h) in accordance with
ISO/IEC 14443-3.
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MSB
0
LSB
0
0
0
0
1
0
0
manufacturer ID for NXP Semiconductors (04h)
page 0
UID0 UID1 UID2 UID3
page 1
page 2
byte
UID4 UID5 UID6 SAK
0
1
2
3
7 bytes UID
ATQA0
ATQA1
lock bytes
aaa-012802
Fig 6. UID/serial number
8.3.6 Static lock bytes
The bits of byte 2 and byte 3 of page 02h (via RF) or byte 10 and 11 address 0h (via I2C)
represent the field programmable, read-only locking mechanism (see Figure 7). Each
page from 03h (CC) to 0Fh can be individually locked by setting the corresponding locking
bit Lx to logic 1 to prevent further write access. After locking, the corresponding page
becomes read-only memory.
The three least significant bits of lock byte 0 are the block-locking bits. Bit 2 controls
pages 0Ah to 0Fh (via RF), bit 1 controls pages 04h to 09h (via RF) and bit 0 controls
page 03h (CC). Once the block-locking bits are set, the locking configuration for the
corresponding memory area is frozen.
MSB
LSB
MSB
LSB
L
7
L
6
L
5
L
4
L
BL
BL
BL
CC
L
15
L
14
L
13
L
12
L
11
L
10
L
9
L
8
CC 15-10 9-4
page 2
0
1
2
3
lock byte 0
lock byte 1
Lx locks page x to read-only
BLx blocks further locking for the memory area x
aaa-006983
Fig 7. Static lock bytes 0 and 1
For example, if BL15-10 is set to logic 1, then bits L15 to L10 (lock byte 1, bit[7:2]) can no
longer be changed. The static locking and block-locking bits are set by the bytes 2 and 3
of the WRITE command to page 02h. The contents of the lock bytes are bit-wise OR’ed
and the result then becomes the new content of the lock bytes.
This process is irreversible from RF perspective. If a bit is set to logic 1, it cannot be
changed back to logic 0. From I²C perspective, the bits can be reset to 0b by writing bytes
10 and 11 of block 0. I²C address is coded in byte 0 of block 0 and may be changed
unintentionally.
The contents of bytes 0 and 1 of page 02h are unaffected by the corresponding data bytes
of the WRITE.
The default value of the static lock bytes is 00 00h.
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8.3.7 Dynamic Lock Bytes
To lock the pages of NTAG I2C starting at page address 10h and onwards, the dynamic
lock bytes are used. The dynamic lock bytes are located at page E2h sector 0 (NTAG I2C
1k) or address E0h sector 1 (NTAG I2C 2k). The three lock bytes cover the memory area
of 830 data bytes (NTAG I2C 1k) or 1846 data bytes (NTAG I2C 2k). The granularity is 16
pages for NTAG I2C 1k (see Figure 8) and 32 pages for NTAG I2C 2k (see Figure 9)
compared to a single page for the first 48 bytes (see Figure 7).
Remark: Set all bits marked with RFUI to 0 when writing to the dynamic lock bytes.
MSB
LSB
MSB
LSB
bit 7
6
5
4
3
2
1
0
bit 7
6
5
4
3
2
1
0
1
3
page 226 (E2h)
0
2
MSB
LSB
bit 7
6
5
4
3
2
1
0
aaa-008092
Fig 8. NTAG I2C 1k Dynamic lock bytes 0, 1 and 2
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MSB
LSB
MSB
LSB
bit 7
6
5
4
3
2
1
0
bit 7
6
5
4
3
2
1
0
page 224 (E0h)
0
1
2
3
MSB
LSB
Block Locking (BL) bits
bit 7
6
5
4
3
2
1
0
aaa-012803
Fig 9. NTAG I2C 2k Dynamic lock bytes 0, 1 and 2
The default value of the dynamic lock bytes is 00 00 00h. The value of Byte 3 is always
00h when read.
Reading the 3 bytes for the dynamic lock bytes and the Byte 3 (00h) from RF interface
(address E2h sector 0 (NTAG I2C 1k) or E0h sector 1 (NTAG I2C 2k) or from I2C (address
38h (NTAG I2C 1k) or 78h (NTAG I2C 2k)) will also return a fixed value for the next 12
bytes of 00h.
Like for the static lock bytes, this process of modifying the dynamic lock bytes is
irreversible from RF perspective. If a bit is set to logic 1, it cannot be changed back to
logic 0. From I²C perspective, the bits can be reset to 0b.
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8.3.8 Capability Container (CC bytes)
The Capability Container CC (page 03h) is programmed during the IC production
according to the NFC Forum Type 2 Tag specification (see Ref. 1). These bytes may be
bit-wise modified by a WRITE command from the I²C or RF interface. Once set to 1b, it is
only possible to reset it to 0b from I²C perspective. I²C address (byte 0) and static lock
bytes (byte 10 and byte 11) are coded in block 0 and may be changed unintentionally.
See examples for NTAG I2C 1k version in Figure 10 and for NTAG I2C 2k version in
Figure 11.
2
page 3
2 3
Example NTAG I C 1k version
byte
0
1
default value (initialized state)
CC bytes
byte E1h 10h 6Dh 00h
11100001 00010000 01101101 00000000
write command to page 3
CC bytes
00000000 00000000 00000000 00001111
result in page 3 (read-only state)
11100001 00010000 01101101 00001111
aaa-012804
Fig 10. CC bytes of NTAG I2C 1k version
2
page 3
Example NTAG I C 2k version
byte
0
1
2
3
default value (initialized state)
CC bytes
data E1h 10h EAh 00h
11100001 00010000 11101010 00000000
write command to page 3
CC bytes
00000000 00000000 00000000 00001111
result in page 3 (read-only state)
11100001 00010000 11101010 00001111
aaa-012805
Fig 11. CC bytes of NTAG I2C 2k version
The default values of the CC bytes at delivery are defined in Section 8.3.10.
8.3.9 User Memory pages
Pages 04h to E1h via the RF interface - Block 01h to 37h, plus the first 8 bytes of block
38h via the I2C interface are the user memory read/write areas for NTAG I2C 1k version.
Pages 04h (sector 0) to DFh (sector 1) via the RF interface - Block 1h to 77h via the I2C
interface are the user memory read/write areas for NTAG I2C 2k version.
The default values of the data pages at delivery are defined in Section 8.3.10.
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8.3.10 Memory content at delivery
The capability container in page 03h and the page 04h and 05h of NTAG I2C is
pre-programmed to the initialized state according to the NFC Forum Type 2 Tag
specification (see Ref. 1) as defined in Table 8 (NTAG I2C 1k version) and Table 9 (NTAG
I2C 2k version). This content is READ only from the RF side and READ&WRITE from the
I²C side.
The User memory contains an empty NDEF TLV.
Remark: The default content of the data pages from page 05h onwards is not defined at
delivery.
Table 8.
Memory content at delivery NTAG I2C 1k version
Byte number within page
Page Address
0
1
2
3
03h
04h
05h
E1h
03h
00h
10h
00h
00h
6Dh
FEh
00h
00h
00h
00h
Table 9.
Memory content at delivery NTAG I2C 2k version
Byte number within page
Page Address
0
1
2
3
03h
04h
05h
E1h
03h
00h
10h
00h
00h
EAh
FEh
00h
00h
00h
00h
8.3.11 NTAG I2C configuration and session registers
NTAG I2C functionalities can be configured and read in two separate locations depending
if the configurations shall be effective within the communication session (session
registers) or by default after Power On Reset (POR) (configuration bits).
The configuration registers of pages E8h to E9h (sector 0 - see Table 10, or 1 - see
Table 11, depending if it is for NTAG I²C 1k or 2k) via the RF interface or block 3Ah or 7Ah
(depending if it is for NTAG I²C 1k or 2k) via the I2C interface are used to configure the
default functionalities of the NTAG I2C. Those bit values are stored in the EEPROM and
represent the default settings to be effective after POR. Their values can be read & written
by both interfaces when applicable and when not locked by the register lock bits (see
REG_LOCK in Table 13).
Table 10. Configuration registers NTAG I²C 1k
RF address
(sector 0)
I2C Address
Byte number
Dec
Hex
Dec
Hex
0
1
2
3
232
E8h
58
3Ah
NC_REG
LAST_NDEF_BLOCK SRAM_MIRROR_
BLOCK
WDT_LS
233
E9h
WDT_MS
I2C_CLOCK_STR
REG_LOCK
00h fixed
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Table 11. Configuration registers NTAG I²C 2k
RF address
(sector 1)
I2C Address
Byte number
Dec
Hex
Dec
Hex
0
1
2
3
232
E8h
122
7Ah
NC_REG
LAST_NDEF_BLOCK SRAM_MIRROR_
BLOCK
WDT_LS
233
E9h
WDT_MS
I2C_CLOCK_STR
REG_LOCK
00h fixed
The session registers Pages F8h to F9h (sector 3) via the RF interface or block FEh via
I2C, see Table 12, are used to configure or monitor the values of the current
communication session. Those bits can only be read via the RF interface but both read
and written via the I2C interface.
Table 12. Session registers NTAG I²C 1k and 2k
RF address
(sector 3)
I2C Address
Byte number
Dec
Hex
Dec
Hex
0
1
2
3
248
F8h
254
FEh
NC_REG
LAST_NDEF_BLOCK SRAM_MIRROR
_BLOCK
WDT_LS
249
F9h
WDT_MS
I2C_CLOCK_STR
NS_REG
00h fixed
Both the session and the configuration bits have the same register except the
REG_LOCK bits, which are only available in the configuration bits and the NS_REG bits
which are only available in the session registers. After POR, the configuration bits are
loaded into the session registers. During the communication session, the values can be
changed, but the related effect will only be visible within the communication session for
the session registers or after POR for the configuration bits. After POR, the registers
values will be again brought back to the default configuration values.
All registers and configuration default values, access conditions and descriptions are
defined in Table 13 and Table 14.
Reading and writing the session registers via I²C can only be done via the READ and
WRITE registers operation - see Section 9.8.
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Table 13. Configuration bytes
Bit
Field
Access
via RF
Access
via I²C
Default
values
Description
Configuration register: NC_REG
7
I2C_RST_ON_OFF
R&W
R&W
0b
enables soft reset through I²C repeated start -
see Section 9.3
6
5
READ
R&W
R&W
R&W
0b
reserved for future use - keep at 0b
RFU
FD_OFF
00b
defines the event upon which the signal output
on the FD pin is brought up
00b… if the field is switched off
01b… if the field is switched off or the tag is set
to the HALT state
10b… if the field is switched off or the last page
of the NDEF message has been read (defined
in LAST_NDEF_BLOCK)
4
11b... (if FD_ON = 11b) if the field is switched off
or if last data is read by I²C (in Pass-through
mode RF ---> I²C) or last data is written by I²C
(in Pass-through mode I²C---> RF)
11b... (if FD_ON = 00b or 01b or 10b) if the field
is switched off
See Section 8.4 for more details
3
2
FD_ON
R&W
R&W
00b
defines the event upon which the signal output
on the FD pin is brought down
00b… if the field is switched on
01b... by first valid start of communication (SoC)
10b... by selection of the tag
11b (in Pass-through mode RF-->I²C) if the data
is ready to be read from the I²C interface
11b (in Pass-through mode I²C--> RF) if the
data is read by the RF interface
See Section 8.4for more details
1
0
RFU
READ
R&W
R&W
R&W
0b
1b
reserved for future use - keep at 0b
TRANSFER_DIR
defines the data flow direction for the data
transfer
0b… From I²C to RF interface
1b… From RF to I²C interface
In case the Pass-through mode is not enabled
0b… no WRITE access from the RF side
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Table 13. …continuedConfiguration bytes
Bit
Field
Access
via RF
Access
via I²C
Default
values
Description
Configuration register: LAST_NDEF_BLOCK
R&W R&W 00h
7-0 LAST_NDEF_BLOCK
Address of last BLOCK (16bytes) of NDEF
message from I²C addressing. An RF read of
the last page of the I2C block, specified by
LAST_NDEF_BLOCK sets the register
NDEF_DATA_READ to 1b and triggers
FD_OFF if FD_OFF is set to 10b
01h is page 04h (first page of the User Memory)
from RF addressing
02h is page 08h
03h is page 0Ch
………
37h is page DCh - memory sector 0 (last
possible page of User memory for NTAG I²C 1k)
......
77h is page DCh - memory sector 1 (last page
possible of the User Memory for NTAG I²C 2k)
Configuration register: SRAM_MIRROR_BLOCK
7-0 SRAM_MIRROR_
BLOCK
R&W
R&W
F8h
Address of first BLOCK (16bytes) of SRAM
buffer when mirrored into the User memory from
I²C addressing
01h is page 04h (first page of the User Memory)
from RF addressing
02h is page 08h
03h is page 0Ch
………
34h is page D0h - memory sector 0 (last
possible page of User memory for NTAG I²C 1k)
......
74h is page D0h - memory sector 1 (last page
possible of the User Memory for NTAG I²C 2k)
Configuration register: WDT_LS
R&W 48h
7-0 WDT_LS
R&W
Least Significant byte of watchdog time
control register
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Table 13. …continuedConfiguration bytes
Bit
Field
Access
via RF
Access
via I²C
Default
values
Description
Configuration register: WDT_MS
7-0 WDT_MS
R&W
R&W
08h
Most Significant byte of watchdog time
control register.
When writing WDT_MS byte, the content of
WDT_MS and WDT_LS gets active for the
watchdog timer.
Configuration register: I2C_CLOCK_STR
7-1 RFU
READ
R&W
READ
R&W
0...0b
1b
reserved for future use, all 7 bits locked to 0b
0
I2C_CLOCK_STR
Enables (1b) or disable (0b) the I²C clock
stretching
Configuration register: REG_LOCK
7-2 RFU
READ
READ
R&W
000000b reserved for future use, all 6 bits locked to 0b
1
REG_LOCK_I2C
R&W
0b
0b… Enable writing of the configuration bytes
via I²C
1b… Disable writing of the configuration bytes
via I²C
Once set to 1b, cannot be reset to 0b anymore.
0
REG_LOCK_RF
R&W
R&W
0b
0b… Enable writing of the configuration bytes
via RF
1b… Disable writing of the configuration bytes
via RF
Once set to 1b, cannot be reset to 0b anymore.
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Table 14. Session register bytes
Bit
Field
Access
via RF
Access
via I²C
Default
values
Description
Session register: NC_REG
7
6
I2C_RST_ON_OFF
READ
READ
R&W
R&W
-
see configuration bytes description
0b
1b… enables data transfer via the SRAM buffer
(Pass-through mode)
PTHRU_ON_OFF
5
4
3
2
1
FD_OFF
FD_ON
READ
READ
R&W
R&W
-
see configuration bytes description
SRAM_MIRROR_
ON_OFF
READ
READ
R&W
R&W
0b
1b enables SRAM mirroring
0
PTHRU_DIR
see configuration bytes description
Session register: LAST_NDEF_BLOCK
READ R&W see configuration bytes description
7-0 LAST_NDEF_
BLOCK
-
Session register: SRAM_MIRROR_BLOCK
7-0 SRAM_MIRROR_
BLOCK
READ
R&W
-
see configuration bytes description
Session register: WDT_LS
R&W
7-0 WDT_LS
READ
-
see configuration bytes description
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Table 14. …continuedSession register bytes
Bit
Field
Access
via RF
Access
via I²C
Default
values
Description
Session register: WDT_MS
R&W see configuration bytes description
7-0 WDT_MS
7-1 RFU
READ
-
Session register: I2C_CLOCK_STR
READ
READ
READ
READ
-
reserved for future use, all 7 bits locked to 0b
See configuration bytes description
0
I2C_CLOCK_STR
Session register: NS_REG
7
NDEF_DATA_READ
READ
READ
0b
1b… all data bytes read from the address
specified in LAST_NDEF_BLOCK. value is
reset to 0b when read
6
5
4
3
2
READ
READ
READ
READ
READ
R&W
0b
0b
0b
0b
0b
1b… Memory access is locked to the I²C
interface
I2C_LOCKED
RF_LOCKED
READ
READ
READ
R&W
1b… Memory access is locked to the RF
interface
SRAM_I2C_READY
SRAM_RF_READY
EEPROM_WR_ERR
1b… data is ready in SRAM buffer to be read by
I2C
1b… data is ready in SRAM buffer to be read by
RF
1b… HV voltage error during EEPROM write or
erase cycle
Needs to be written back via I²C to 0b to be
cleared
1
0
EEPROM_WR_BUSY
RF_FIELD_PRESENT
READ
READ
READ
READ
0b
0b
1b… EEPROM write cycle in progress - access
to EEPROM disabled
0b… EEPROM access possible
1b… RF field is detected
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8.4 Configurable Field Detection Pin
The field detection feature provides the capability to trigger an external device (e.g.
Controller) or switch on the connected circuitry by an external power management unit
depending on activities on the RF interface.
The conditions for the activation of the field detection signal (FD_ON) can be:
• The presence of the RF field
• The detection of a valid command (Start of Communication)
• The selection of the IC.
The conditions for the de-activation of the field detection signal (FD_OFF) can be:
• The absence of the RF field
• The detection of the HALT state
• The RF interface has read the last part of the NDEF message defined with
LAST_NDEF_BLOCK
All the various combinations of configurations are described in Table 13 and illustrated in
Figure 12, Figure 13 and Figure 14 for all various combination of the filed detection signal
configuration.
The field detection pin can also be used as a handshake mechanism in the Pass-through
mode to signal to the external microcontroller if
• New data are written to SRAM on the RF interface
• Data written to SRAM from the microcontroller are read via the RF interface.
See Section 11 for more information on this handshake mechanism.
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ON
RF field
OFF
HIGH
LOW
FD pin
RF_FIELD_PRESENT
0
1
0
FD_ON = 00b
FD_OFF = 00b
01h
t
Event
aaa-017239
Fig 12. Illustration of the field detection feature when configured for simple field
detection
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ON
RF field
OFF
HIGH
LOW
FD pin
RF_FIELD_PRESENT
0
1
0
FD_ON = 01b
FD_OFF = 01b
15h
t
Event
aaa-017242
Fig 13. Illustration of the field detection feature when configured for first valid start of
communication detection
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ON
RF field
OFF
HIGH
LOW
FD pin
RF_FIELD_PRESENT
0
1
0
FD_ON = 10b
FD_OFF = 10b
29h
t
Event
aaa-017243
Fig 14. Illustration of the field detection feature when configured for selection of the tag
detection
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8.5 Watchdog timer
In order to allow the I²C interface to perform all necessary commands (READ, WRITE...),
the memory access remains locked to the I²C interface until the register I2C_LOCKED is
cleared by the host - see Table 14.
In order however to avoid that the memory stays 'locked' to the I²C for a long period of
time, it is possible to program a watchdog timer to unlock the I2C host from the tag, so that
the RF reader can access the tag after a period of time of inactivity. The host itself will not
be notified of this event directly, but the NS_REG register is updated accordingly (the
register bit I2C_LOCKED will be cleared - see Table 14).
The default value is set to 20 ms (848h), but the watch dog timer can be freely set from
0001h (9.43 s) up to FFFFh (617.995 ms). The timer starts ticking when the
communication between the NTAG I2C and the I2C interface starts. In case the
communication with the I2C is still going on after the watchdog timer expires, the
communication will continue until the communication has completed. Then the status
register I2C_LOCKED will be immediately cleared.
In the case where the communication with the I2C interface has completed before the end
of the timer and the status register I2C_LOCKED was not cleared by the host, it will be
cleared at the end of the watchdog timer.
The watchdog timer is only effective if the VCC pin is powered and will be reset and
stopped if the NTAG I2C is not VCC powered or if the register status I2C_LOCKED is set
to 0b and RF_LOCKED is set to 1b.
8.6 Energy harvesting
The NTAG I2C provides the capability to supply external low power devices with energy
generated from the RF field of a NFC device.
The voltage and current from the energy harvesting depend on various parameters, such
as the strength of the RF field, the tag antenna size, or the distance from the NFC device.
At room temperature, NTAG I2C could provide typically 5 mA at 2 V on the VOUT pin with
an NFC Phone.
Operating NTAG I2C in energy harvesting mode requires a number of precautions:
• A significant capacitor is needed to guarantee operation during RF communication.
The total capacitor between VOUT and GND shall be in the range of 150nF to 200 nF.
• If NTAG I2C also powers the I2C bus, then VCC must be connected to VOUT, and
pull-up resistors on the SCL and SDA pins must be sized to control SCL and SDA sink
current when those lines are pulled low by NTAG I2C or the I2C host
• If NTAG I2C also powers the Field Detect bus, then the pull-up resistor on the Field
Detect line must be sized to control the sink current into the Field Detect pin when
NTAG I2C pulls it low
• The NFC reader device communicating with NTAG I2C shall apply polling cycles
including an RF Field Off condition of at least 5.1 ms as defined in NFC Forum Activity
specification (see Ref. 4, chapter 6).
Note that increasing the output current on the Vout decreases the RF communication
range.
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9. I²C commands
For details about I2C interface refer to Ref. 3.
SCL
SDA
Start
Condition
SDA
Input
SDA
Change
Stop
Condition
SCL
SDA
1
2
3
7
8
9
MSB
ACK
Start
Condition
SCL
1
2
3
7
8
9
SDA
MSB
ACK
Stop
Condition
001aao231
Fig 15. I2C bus protocol
The NTAG I2C supports the I2C protocol. This protocol is summarized in Figure 15. Any
device that sends data onto the bus is defined as a transmitter, and any device that reads
the data from the bus is defined as a receiver. The device that controls the data transfer is
known as the “bus master”, and the other as the “slave” device. A data transfer can only
be initiated by the bus master, which will also provide the serial clock for synchronization.
The NTAG I2C is always a slave in all communications.
9.1 Start condition
Start is identified by a falling edge of Serial Data (SDA), while Serial Clock (SCL) is stable
in the high state. A Start condition must precede any data transfer command. The NTAG
I2C continuously monitors SDA (except during a Write cycle) and SCL for a Start
condition, and will not respond unless one is given.
9.2 Stop condition
Stop is identified by a rising edge of SDA while SCL is stable and driven high. A Stop
condition terminates communication between the NTAG I2C and the bus master. A Stop
condition at the end of a Write command triggers the internal Write cycle.
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9.3 Soft reset feature
In the case where the I2C interface is constantly powered on, NTAG I2C can trigger a reset
of the I2C interface via its soft reset feature- see Table 13.
When this feature is enabled, if the microcontroller does not issue a stop condition
between two start conditions, this situation will trigger a reset of the I2C interface and
hence may hamper the communication via the I2C interface.
9.4 Acknowledge bit (ACK)
The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter,
whether it is the bus master or slave device, releases Serial Data (SDA) after sending
eight bits of data. During the 9th clock pulse period, the receiver pulls Serial Data (SDA)
low to acknowledge the receipt of the eight data bits.
9.5 Data input
During data input, the NTAG I2C samples SDA on the rising edge of SCL. For correct
device operation, SDA must be stable during the rising edge of SCL, and the SDA signal
must change only when SCL is driven low.
9.6 Addressing
To start communication between a bus master and the NTAG I2C slave device, the bus
master must initiate a Start condition. Following this initiation, the bus master sends the
device address. The NTAG I2C address from I2C consists of a 7-bit device identifier (see
Table 15 for default value).
The 8th bit is the Read/Write bit (RW). This bit is set to 1 for Read and 0 for Write
operations.
If a match occurs on the device address, the NTAG I2C gives an acknowledgment on SDA
during the 9th bit time. If the NTAG I2C does not match the device select code, it deselects
itself from the bus and clear the register I2C_LOCKED (see Table 12).
Table 15. Default NTAG I2C address from I2C
Device address
R/W
b0
b7
b6
b5
b4
b3
b2
b1
Value
1[1]
0[1]
1[1]
0[1]
1 [1]
0 [1]
1 [1]
1/0
[1] Initial values - can be changed.
The I2C address of the NTAG I2C (byte 0 - block 0h) can only be modified by the I2C
interface. Both interfaces have no READ access to this address and a READ command
from the RF or I²C interface to this byte will only return 04h (manufacturer ID for NXP
Semiconductors - see Figure 6).
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9.7 READ and WRITE Operation
Write:
Host
Tag
Start
7 bits SA and ‘0’
MEMA
D0
D1
D15
Stop
A
A
A
A
A
Read:
Start
Host
Tag
7 bits SA and ‘0’
MEMA
Stop
Start
7 bits SA and ‘1’
A
A
A
Stop
A
A
A
D0
D1
D15
aaa-012811
Fig 16. I2C READ and WRITE operation
NT3H1101/NT3H1201
NXP Semiconductors
NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
The READ and WRITE operation handle always 16 bytes to be read or written (one block
- see Table 7)
For the READ operation (see Figure 16), following a Start condition, the bus master/host
sends the NTAG I2C slave address code (SA - 7 bits) with the Read/Write bit (RW) reset to
0. The NTAG I2C acknowledges this (A), and waits for one address byte (MEMA), which
should correspond to the address of the block of memory (SRAM or EEPROM) that is
intended to be read. The NTAG I2C responds to a valid address byte with an acknowledge
(A). A Stop condition can be then issued. Then the host again issues a start condition
followed by the NTAG I2C slave address with the Read/Write bit set to 1b. When
I2C_CLOCK_STR is set to 0b, a pause of at least 50 s shall be kept before this start
condition. The NTAG I2C acknowledges this (A) and sends the first byte of data read
(D0).The bus master/host acknowledges it (A) and the NTAG I2C will subsequently
transmit the following 15 bytes of memory read with an acknowledge from the host after
every byte. After the last byte of memory data has been transmitted by the NTAG I2C, the
bus master/host will acknowledge it and issue a Stop condition.
For the WRITE operation (see Figure 16), following a Start condition, the bus master/host
sends the NTAG I2C slave address code (SA - 7 bits) with the Read/Write bit (RW) reset to
0. The NTAG I2C acknowledges this (A), and waits for one address byte (MEMA), which
should correspond to the address of the block of memory (SRAM or EEPROM) that is
intended to be written. The NTAG I2C responds to a valid address byte with an
acknowledge (A) and, in the case of a WRITE operation, the bus master/host starts
transmitting each 16 bytes (D0...D15) that shall be written at the specified address with an
acknowledge of the NTAG I²C after each byte (A). After the last byte acknowledge from
the NTAG I²C, the bus master/host issues a Stop condition.
The memory address accessible via the READ and WRITE operations can only
correspond to the EEPROM or SRAM (respectively 00h to 3Ah or F8h to FBh for NTAG
I²C 1k and 00h to 7Ah or F8h to FBh for NTAG I²C 2k).
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9.8 WRITE and READ register operation
In order to modify or read the session register bytes (see Table 14), NTAG I²C requires the WRITE and READ register
operation (see Figure 17).
Write:
Host
Tag
Start
7 bits SA and ‘0’
MEMA
REGA
MASK
REGDAT
Stop
A
A
A
A
A
Read:
Start
Host
Tag
7 bits SA and ‘0’
MEMA
REGA
Stop
Start
7 bits SA and ‘1’
A
Stop
A
A
A
A
REGDAT
aaa-012812
Fig 17. WRITE and READ register operation
NT3H1101/NT3H1201
NXP Semiconductors
NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
For the READ register operation, following a Start condition the bus master/host sends the
NTAG I²C slave address code (SA - 7 bits) with the Read/Write bit (RW) reset to 0. The
NTAG I2C acknowledges this (A), and waits for one address byte (MEMA) which
corresponds to the address of the block of memory with the session register bytes (FEh).
The NTAG I2C responds to the address byte with an acknowledge (A). Then the bus
master/host issues a register address (REGA), which corresponds to the address of the
targeted byte inside the block FEh (00h, 01h...to 07h) and then waits for the Stop
condition.
Then the bus master/host again issues a start condition followed by the NTAG I²C slave
address with the Read/Write bit set to 1b. The NTAG I²C acknowledges this (A), and
sends the selected byte of session register data (REGDAT) within the block FEh. The bus
master/host will acknowledge it and issue a Stop condition.
For the WRITE register operation, following a Start condition, the bus master/host sends
the NTAG I²C slave address code (SA - 7 bits) with the Read/Write bit (RW) reset to 0.
The NTAG I2C acknowledges this (A), and waits for one address byte (MEMA), which
corresponds to the address of the block of memory within the session register bytes
(FEh). After the NTAG I2C acknowledge (A), the bus master/host issues a register
address (REGA), which corresponds to the address of the targeted byte inside the block
FEh (00h, 01h...to 07h). After acknowledgement (A) by NTAG I2C, the bus master/host
issues a MASK byte that defines exactly which bits shall be modified by a 1b bit value at
the corresponding bit position. Following the NTAG I²C acknowledge (A), the new register
data (one byte - REGDAT) to be written is transmitted by the bus master/host. The NTAG
I²C acknowledges it (A), and the bus master/host issues a stop condition.
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10. RF Command
NTAG activation follows the ISO/IEC 14443 Type A specification. After NTAG I2C has
been selected, it can either be deactivated using the ISO/IEC 14443 HALT command, or
NTAG commands (e.g., READ or WRITE) can be performed. For more details about the
card activation refer to Ref. 2.
10.1 NTAG I2C command overview
All available commands for NTAG I2C are shown in Table 16.
Table 16. Command overview
Command[1]
ISO/IEC 14443
NFC FORUM
Command code
(hexadecimal)
Request
REQA
SENS_REQ
ALL_REQ
SDD_REQ CL1
SEL_REQ CL1
SDD_REQ CL2
SEL_REQ CL2
SLP_REQ
-
26h (7 bit)
52h (7 bit)
93h 20h
93h 70h
95h 20h
95h 70h
50h 00h
60h
Wake-up
WUPA
Anticollision CL1
Select CL1
Anticollision CL2
Select CL2
Halt
Anticollision CL1
Select CL1
Anticollision CL2
Select CL2
HLTA
GET_VERSION
READ
-
-
-
-
READ
30h
FAST_READ
WRITE
-
3Ah
WRITE
A2h
SECTOR_SELECT
SECTOR_SELECT C2h
[1] Unless otherwise specified, all commands use the coding and framing as described in Ref. 1.
10.2 Timing
The command and response timing shown in this document are not to scale and values
are rounded to 1 s.
All given command and response times refer to the data frames, including start of
communication and end of communication. They do not include the encoding (like the
Miller pulses). An NFC device data frame contains the start of communication (1
“start bit”) and the end of communication (one logic 0 + 1 bit length of unmodulated
carrier). An NFC tag data frame contains the start of communication (1 “start bit”) and the
end of communication (1 bit length of no subcarrier).
The minimum command response time is specified according to Ref. 1 as an integer n,
which specifies the NFC device to NFC tag frame delay time. The frame delay time from
NFC tag to NFC device is at least 87 s. The maximum command response time is
specified as a time-out value. Depending on the command, the TACK value specified for
command responses defines the NFC device to NFC tag frame delay time. It does it for
either the 4-bit ACK value specified or for a data frame.
All timing can be measured according to the ISO/IEC 14443-3 frame specification as
shown for the Frame Delay Time in Figure 18. For more details refer to Ref. 2.
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last data bit transmitted by the NFC device
FDT = (n* 128 + 84)/fc
first modulation of the NFC TAG
128/fc
logic „1“
256/fc
end of communication (E)
128/fc
start of
communication (S)
FDT = (n* 128 + 20)/fc
128/fc
logic „0“
256/fc
128/fc
start of
end of communication (E)
communication (S)
aaa-006986
Fig 18. Frame Delay Time (from NFC device to NFC tag), TACK and TNAK
Remark: Due to the coding of commands, the measured timings usually excludes (a part
of) the end of communication. Consider this factor when comparing the specified with the
measured times.
10.3 NTAG ACK and NAK
NTAG uses a 4 bit ACK / NAK as shown in Table 17.
Table 17. ACK and NAK values
Code (4-bit)
ACK/NAK
Ah
0h
1h
3h
7h
Acknowledge (ACK)
NAK for invalid argument (i.e. invalid page address)
NAK for parity or CRC error
NAK for Arbiter locked to I²C
NAK for EEPROM write error
10.4 ATQA and SAK responses
NTAG I2C replies to a REQA or WUPA command with the ATQA value shown in Table 18.
It replies to a Select CL2 command with the SAK value shown in Table 19. The 2-byte
ATQA value is transmitted with the least significant byte first (44h).
Table 18. ATQA response of the NTAG I2C
Bit number
Sales type
Hex value
16 15 14 13 12 11 10 9
8
7
6
5
4
3
2
1
NTAG I2C
00 44h
0
0
0
0
0
0
0
0
0
1
0
0
0
1
0
0
Table 19. SAK response of the NTAG I2C
Bit number
Sales type
Hex value
8
7
6
5
4
3
2
1
NTAG I2C
00h
0
0
0
0
0
0
0
0
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Remark: The ATQA coding in bits 7 and 8 indicate the UID size according to
ISO/IEC 14443 independent from the settings of the UID usage.
Remark: The bit numbering in the ISO/IEC 14443 specification starts with LSB = bit 1 and
not with LSB = bit 0. So 1 byte counts bit 1 to bit 8 instead of bit 0 to bit 7.
10.5 GET_VERSION
The GET_VERSION command is used to retrieve information about the NTAG family, the
product version, storage size and other product data required to identify the specific NTAG
I2C.
This command is also available on other NTAG products to have a common way of
identifying products across platforms and evolution steps.
The GET_VERSION command has no arguments and returns the version information for
the specific NTAG I2C type. The command structure is shown in Figure 19 and Table 20.
Table 21 shows the required timing.
NFC device
Cmd
CRC
Data
868 µs
CRC
NTAG ,,ACK''
T
T
ACK
NAK
283 µs
NAK
NTAG ,,NAK''
57 µs
T
TimeOut
Time out
aaa-006987
Fig 19. GET_VERSION command
Table 20. GET_VERSION command
Name
Cmd
CRC
Data
NAK
Code
Description
Length
60h
Get product version
1 byte
2 bytes
8 bytes
4-bit
-
CRC according to Ref. 1
Product version information
see Section 10.3
-
see Table 17
Table 21. GET_VERSION timing
These times exclude the end of communication of the NFC device.
TACK/NAK min
TACK/NAK max
TTimeOut
GET_VERSION
n=9[1]
TTimeOut
5 ms
[1] Refer to Section 10.2 “Timing”.
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Table 22. GET_VERSION response for NTAG I²C 1k and 2k
Byte no. Description NTAG I²C 1k NTAG I²C 2k Interpretation
0
1
2
3
4
5
6
7
fixed Header
00h
04h
04h
05h
02h
01h
13h
03h
00h
04h
04h
05h
02h
01h
15h
03h
vendor ID
NXP Semiconductors
product type
NTAG
product subtype
major product version
minor product version
storage size
50 pF I2C, Field detection
2
V1
see following information
ISO/IEC 14443-3 compliant
protocol type
The most significant 7 bits of the storage size byte are interpreted as an unsigned integer
value n. As a result, it codes the total available user memory size as 2n. If the least
significant bit is 0b, the user memory size is exactly 2n. If the least significant bit is 1b, the
user memory size is between 2n and 2n+1
.
The user memory for NTAG I²C 1k is 888 bytes. This memory size is between 512 bytes
and 1024 bytes. Therefore, the most significant 7 bits of the value 13h, are interpreted as
9d, and the least significant bit is 1b.
The user memory for NTAG I²C 2k is 1904 bytes. This memory size is between 1024
bytes and 2048 bytes. Therefore, the most significant 7 bits of the value 15h, are
interpreted as 10d, and the least significant bit is 1b.
10.6 READ
The READ command requires a start page address, and returns the 16 bytes of four
NTAG I2C pages. For example, if address (Addr) is 03h then pages 03h, 04h, 05h, 06h are
returned. Special conditions apply if the READ command address is near the end of the
accessible memory area. For details on those cases and the command structure refer to
Figure 20 and Table 23.
Table 24 shows the required timing.
NFC device
Cmd
Addr
CRC
Data
CRC
NTAG ,,ACK''
T
T
ACK
NAK
368 µs
1548 µs
NAK
NTAG ,,NAK''
57 µs
T
TimeOut
Time out
aaa-006988
Fig 20. READ command
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Table 23. READ command
Name
Cmd
Addr
CRC
Data
NAK
Code
Description
Length
1 byte
30h
read four pages
-
start page address
CRC according to Ref. 1
1 byte
-
2 bytes
-
Data content of the addressed pages 16 bytes
see Table 17
see Section 10.3
4-bit
Table 24. READ timing
These times exclude the end of communication of the NFC device.
TACK/NAK min
TACK/NAK max
TTimeOut
READ
n=9[1]
TTimeOut
5 ms
[1] Refer to Section 10.2 “Timing”.
In the initial state of NTAG I2C, all memory pages are allowed as Addr parameter to the
READ command:
• Page address from 00h to E2h and E8h for NTAG I²C 1k
• Page address from 00h to FFh (sector 0), from page 00h to E0h and E8h (sector 1) for
NTAG I²C 2k
• SRAM buffer address when Pass-through mode is enabled
Addressing a start memory page beyond the limits above results in a NAK response from
NTAG I2C.
In case a READ command addressing start with a valid memory area but extends over an
invalid memory area, the content of the invalid memory area will be reported as 00h.
10.7 FAST_READ
The FAST_READ command requires a start page address and an end page address and
returns all n*4 bytes of the addressed pages. For example, if the start address is 03h and
the end address is 07h, then pages 03h, 04h, 05h, 06h and 07h are returned.
For details on those cases and the command structure, refer to Figure 21 and Table 25.
Table 26 shows the required timing.
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NFC device
Cmd StartAddr EndAddr
CRC
Data
CRC
NTAG ,,ACK''
T
T
ACK
NAK
453 µs
depending on nr of read pages
NAK
57 µs
NTAG ,,NAK''
T
TimeOut
Time out
aaa-006989
Fig 21. FAST_READ command
Table 25. FAST_READ command
Name
Cmd
Code
Description
Length
1 byte
1 byte
1 byte
2 bytes
3Ah
read multiple pages
start page address
end page address
StartAddr
EndAddr
CRC
-
-
-
CRC according to Ref. 1
Data
-
data content of the addressed pages n*4 bytes
NAK
see Table 17
see Section 10.3
4-bit
Table 26. FAST_READ timing
These times exclude the end of communication of the NFC device.
TACK/NAK min
TACK/NAK max
TTimeOut
FAST_READ
n=9[1]
TTimeOut
5 ms
[1] Refer to Section 10.2 “Timing”.
In the initial state of NTAG I2C, all memory pages are allowed as StartAddr parameter to
the FAST_READ command:
• Page address from 00h to E2h and E8h for NTAG I²C 1k
• Page address from 00h to FFh (sector 0), from page 00h to E0h and E8h (sector 1) for
NTAG I²C 2k
• SRAM buffer address when Pass-through mode is enabled
If the start addressed memory page (StartAddr) is outside of accessible area, NTAG I2C
replies a NAK.
In case the FAST_READ command starts with a valid memory area but extends over an
invalid memory area, the content of the invalid memory area will be reported as 00h.
The EndAddr parameter must be equal to or higher than the StartAddr.
Remark: The FAST_READ command is able to read out the entire memory of one sector
with one command. Nevertheless, the receive buffer of the NFC device must be able to
handle the requested amount of data as no chaining is possible.
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10.8 WRITE
NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
The WRITE command requires a block address, and writes 4 bytes of data into the
addressed NTAG I2C page. The WRITE command is shown in Figure 22 and Table 27.
Table 28 shows the required timing.
NFC device Cmd Addr
NTAG ,,ACK''
Data
CRC
ACK
T
T
ACK
NAK
708 µs
57 µs
NTAG ,,NAK''
NAK
57 µs
T
TimeOut
Time out
aaa-006990
Fig 22. WRITE command
Table 27. WRITE command
Name
Cmd
Addr
CRC
Data
NAK
Code
Description
Length
A2h
write one page
page address
CRC according to Ref. 1
data
1 byte
1 byte
2 bytes
4 bytes
4-bit
-
-
-
see Table 17
see Section 10.3
Table 28. WRITE timing
These times exclude the end of communication of the NFC device.
TACK/NAK min
n=9[1]
TACK/NAK max
TTimeOut
10 ms
WRITE
TTimeOut
[1] Refer to Section 10.2 “Timing”.
In the initial state of NTAG I2C, the following memory pages are valid Addr parameters to
the WRITE command:
• Page address from 02h to E2h, E8h and E9h (sector 0) for NTAG I²C 1k
• Page address from 02h to FFh (sector 0), from 00h to E0h, E8h and E9h (sector 1) for
NTAG I²C 2k
• SRAM buffer addresses when Pass-through mode is enabled
Addressing a memory page beyond the limits above results in a NAK response from
NTAG I2C.
Pages that are locked against writing cannot be reprogrammed using any write command.
The locking mechanisms include static and dynamic lock bits, as well as the locking of the
configuration pages.
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
10.9 SECTOR SELECT
The SECTOR SELECT command consists of two commands packet: the first one is the
SECTOR SELECT command (C2h), FFh and CRC. Upon an ACK answer from the Tag,
the second command packet needs to be issued with the related sector address to be
accessed and 3 bytes RFU.
To successfully access to the requested memory sector, the tag shall issue a passive
ACK, which is sending NO REPLY for more than 1ms after the CRC of the second
command set.
The SECTOR SELECT command is shown in Figure 23 and Table 29.
Table 30 shows the required timing.
NFC device Cmd FFh
CRC
SECTOR SELECT packet 1
ACK
2
NTAG I C ,,ACK''
T
T
368 µs
ACK
NAK
57 µs
NAK
2
NTAG I C ,,NAK''
57 µs
Time out
T
TimeOut
SECTOR SELECT packet 2
NFC device
SecNo 00h 00h 00h
CRC
Passive ACK
(no reply)
2
NTAG I C ,,ACK''
>1ms
537 µs
NAK
57 µs
2
(any reply)
<1ms
NTAG I C ,,NAK''
aaa-014051
Fig 23. SECTOR_SELECT command
Table 29. SECTOR_SELECT command
Name
Cmd
Code
Description
Length
C2h
sector select
1 byte
1 byte
2 bytes
1 byte
FFh
-
-
-
CRC
SecNo
CRC according to Ref. 1
Memory sector to be selected
(00h-FEh)
NAK
see Table 17
see Section 10.3
4-bit
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
Table 30. SECTOR_SELECT timing
These times exclude the end of communication of the NFC device.
TACK/NAK min
TACK/NAK max
TTimeOut
SECTOR SELECT
n=9[1]
TTimeOut
10 ms
[1] Refer to Section 10.2 “Timing”.
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
11. Communication and arbitration between RF and I²C interface
If both interfaces are powered by their corresponding source, only one interface shall
have access according to the "first-come, first-serve" principle.
In NS_REG, the two status bits I2C_LOCKED and RF_LOCKED reflect the status of the
NTAG I²C memory access and indicate which interface is locking the memory access. At
power on, both bits are 0, setting the arbitration in idle mode.
In the case arbiter locks to the I²C interface, an RF reader still can access the session
registers. If the ISO state machine is in ACTIVE state, only the SECTOR SELECT
command is allowed. But any other command requiring EEPROM access like READ or
WRITE is handled as an illegal command and replied to with a special NAK value.
In the case where the memory access is locked to the RF interface, the I²C host still can
access the NFC register, by issuing a 'Register READ/WRITE' command. All other read or
write commands will be replied to with a NACK to the I²C host.
11.1 Non-Pass-through mode
PTHRU_ON_OFF = 0b (see Table 14) indicates non-Pass-through mode.
11.1.1 I²C interface access
If the tag is in the IDLE or HALT state (RF state after POR or HALT-command) and the
correct I²C slave address of NTAG I²C is specified following the START condition, the bit
I2C_LOCKED will be automatically set to 1b. If I2C_LOCKED = 1b, the I²C interface has
access to the tag memory and the tag will respond with a NACK to any memory
READ/WRITE command on the RF interface other than reading the register bytes
command during this time.
I2C_LOCKED must be either reset to 0b at the end of the I²C sequence or wait until the
end of the watch dog timer.
11.1.2 RF interface access
The arbitration will allow the RF interface read and write accesses to EEPROM only when
I2C_LOCKED is set to 0b.
RF_LOCKED is automatically set to 1b if the tag receives a valid command (EEPROM
Access Commands) on the RF interface. If RF_LOCKED = 1b, the tag is locked to the RF
interface and will not respond to any command from the I²C interface other than READ
register command (see Table 14).
RF_LOCKED is automatically set to 0b in one of the following conditions
• At POR or if the RF field is switched off
• If the tag is set to the HALT state with a HALT command on the RF interface
• If the memory access command is finished on the RF interface
When the RF interface has read the last page of the NDEF message specified in
LAST_NDEF_BLOCK (see Table 13 and Table 14) the bit NDEF_DATA_READ - in the
register NS_REG see Table 14 - is set to 1b and indicates to the I²C interface that, for
example, new NDEF data can be written.
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11.2 SRAM buffer mapping with Memory Mirror enabled
With SRAM_MIRROR_ON_OFF= 1b, the SRAM buffer mirroring is enabled. This mode
cannot be combined with the Pass-through mode (see Section 11.3).
With the memory mirror enabled, the SRAM is now mapped into the user memory from
the RF interface perspective using the SRAM mirror lower page address specified in
SRAM_MIRROR_BLOCK byte (Table 13 and Table 14). See Table 31 (NTAG I²C 1k) and
Table 32 (NTAG I²C 2k) for an illustration of this SRAM memory mapping when
SRAM_MIRROR_BLOCK is set to 01h. The SRAM buffer will be then available in two
locations: inside the user memory and at the end of the first or second memory sector
(respectively NTAG I²C 1k or NTAG I²C 2k).
The tag must be VCC powered to make this mode work, because without VCC, the SRAM
will not be accessible via RF powered only.
When mapping the SRAM buffer to the user memory, the user shall be aware that all data
written into the SRAM part of the user memory will be lost once the NTAG I²C is no longer
powered from the I²C side (as SRAM is a volatile memory).
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Table 31. Illustration of the SRAM memory addressing via the RF interface (with
SRAM_MIRROR_ON_OFF set to 1b and SRAM_MIRROR_BLOCK set to 01h) for
the NTAG I2C 1k
Page address
Byte number within a page
Sector
Access
address
conditions
Dec.
0
Hex.
00h
01h
02h
03h
04h
...
0
1
2
3
0
Serial number
Serial number
Internal
READ
READ
1
Internal
2
Static lock bytes
READ/R&W
READ&WRITE
3
Capability Container (CC)
4
...
SRAM memory (16 blocks)
READ&WRITE
19
13h
...
...
User memory
READ&WRITE
R&W/READ
225
226
227
228
229
230
231
232
233
234
...
E1h
E2h
E3h
E4h
E5h
E6h
E7h
E8h
E9h
EAh
...
Dynamic lock bytes
00h
Invalid access - returns NAK
n.a.
Configuration registers
see 8.3.11
n.a.
Invalid access - returns NAK
255
FFh
1
2
3
...
...
...
...
Invalid access - returns NAK
Invalid access - returns NAK
n.a.
n.a.
0
00h
...
Invalid access - returns NAK
Session registers
n.a.
see 8.3.11
n.a.
...
248
249
...
F8h
F9h
...
Invalid access - returns NAK
255
FFh
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Table 32. Illustration of the SRAM memory addressing via the RF interface (with
SRAM_MIRROR_ON_OFF set to 1b and SRAM_MIRROR_BLOCK set to 01h) for
the NTAG I2C 2k
Page address
Byte number within a page
Sector
Access
address
conditions
Dec.
0
Hex.
00h
01h
02h
03h
04h
...
0
1
2
3
0
Serial number
Serial number
Internal
READ
READ
1
Internal
2
Static lock bytes
READ/R&W
READ&WRITE
3
Capability Container (CC)
4
...
SRAM memory (16 blocks)
READ&WRITE
19
...
13h
...
...
...
255
FFh
1
0
...
User memory
READ&WRITE
1
...
...
...
...
...
223
224
225
226
227
228
229
230
231
232
233
234
...
DFh
E0h
E1h
E2h
E3h
E4h
E5h
E6h
E7h
E8h
E9h
EAh
...
Dynamic lock bytes
00h
R&W/READ
Invalid access - returns NAK
n.a.
Configuration registers
see 8.3.11
n.a.
Invalid access - returns NAK
255
FFh
2
3
...
...
Invalid access - returns NAK
Invalid access - returns NAK
n.a.
n.a.
0
00h
...
...
248
249
...
F8h
F9h
...
Session registers
see 8.3.11
n.a.
Invalid access - returns NAK
255
FFh
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11.3 Pass-through mode
PTHRU_ON_OFF = 1b (see Table 14) enables and indicates Pass-through mode.
To handle large amount of data transfer from one interface to the other, NTAG I²C offers
the Pass-through mode where data is transferred via a 64 byte SRAM buffer. This buffer
offers fast write access and unlimited write endurance as well as an easy handshake
mechanism between the two interfaces.
This buffer is mapped directly at the end of the sector 0 (NTAG I²C 1k) or sector 1 (NTAG
I²C 2k) of the memory (from the RF interface perspective).
In both cases, the principle of access to the SRAM buffer via the RF and I²C interface is
exactly the same (see Section 11.3.2 and Section 11.3.3).
The data flow direction must be set with the PTHRU_DIR bit (see Table 14) within the
current communication session with the session registers (in this case, it can only be set
via the I²C interfaces) or for the configuration bits after POR (in this case both RF and I²C
interface can set it). This Pass-through direction settings avoids locking the memory
access during the data transfer from one interface to the SRAM buffer.
The Pass-through mode can only be enabled via I²C interface when both interfaces are
powered. The PTHRU_ON_OFF bit, located in the session registers NC_REG (see
Section 8.3.11), needs to be set to 1b. In case one interface powers off, the Pass-through
mode is disabled automatically.
11.3.1 SRAM buffer mapping
In Pass-through mode, the SRAM is mirrored to pages F0h to FFh sector 0 for the NTAG
I²C 1k - see Table 33 - or sector 1 for the NTAG I²C 2k - see Table 34 - outside the user
memory.
The last page/block of the SRAM buffer (page 16) is used as the terminator page. Once
the terminator page/block in the respective interfaces is read/written, the control would be
transferred to other interface (RF/I²C) - see Section 11.3.2 and Section 11.3.3 for more
details.
Accordingly, the application can align on the Reader & Host side to transfer 16/32/48/64
bytes of data in one Pass-through step by only using the last blocks/page of the SRAM
buffer.
When using FAST_READ to read the SRAM buffer from RF, the EndAddr input of the
FAST_READ command has to be always set to FFh.
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Table 33. Illustration of the SRAM memory addressing via the RF interface in Pass-through
mode (PTHRU_ON_OFF set to 1b) for the NTAG I2C 1k
Page address
Byte number within a page
Sector
Access
address
conditions
Dec.
0
Hex.
00h
01h
02h
03h
04h
...
0
1
2
3
0
Serial number
Serial number
Internal
READ
READ
1
Internal
2
Static lock bytes
READ/R&W
READ&WRITE
3
Capability Container (CC)
4
...
15
0Fh
...
User memory
READ&WRITE
R&W/READ
n.a.
...
225
226
227
228
229
230
231
232
233
234
...
E1h
E2h
E3h
E4h
E5h
E6h
E7h
E8h
E9h
EAh
...
Dynamic lock bytes
00h
Invalid access - returns NAK
Configuration registers
see 8.3.11
n.a.
Invalid access - returns NAK
240
...
F0h
...
SRAM memory (16 pages)
READ&WRITE
255
FFh
1
2
3
...
...
...
...
Invalid access - returns NAK
Invalid access - returns NAK
n.a.
n.a.
0
00h
...
Invalid access - returns NAK
Session registers
n.a.
see 8.3.11
n.a.
...
248
249
...
F8h
F9h
...
Invalid access - returns NAK
255
FFh
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Table 34. Illustration of the SRAM memory addressing via the RF interface in Pass-through
mode (PTHRU_ON_OFF set to 1b) for the NTAG I2C 2k
Page address
Byte number within a page
Sector
Access
address
conditions
Dec.
0
Hex.
00h
01h
02h
03h
04h
...
0
1
2
3
0
Serial number
Serial number
Internal
Capability Container (CC)
READ
READ
1
Internal
2
Static lock bytes
READ/R&W
READ&WRITE
3
4
...
19
...
13h
...
...
...
255
FFh
User memory
READ&WRITE
1
0
...
1
...
...
...
...
...
223
224
225
226
227
228
229
230
231
232
233
234
...
DFh
E0h
E1h
E2h
E3h
E4h
E5h
E6h
E7h
E8h
E9h
EAh
...
Dynamic lock bytes
00h
R&W/READ
Invalid access - returns NAK
n.a.
Configuration registers
see 8.3.11
n.a.
Invalid access - returns NAK
240
...
F0h
...
SRAM (16 pages)
READ&WRITE
255
FFh
2
3
...
...
Invalid access - returns NAK
Invalid access - returns NAK
n.a.
n.a.
0
00h
...
...
248
249
...
F8h
F9h
...
Session registers
see 8.3.11
n.a.
Invalid access - returns NAK
255
FFh
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11.3.2 RF to I²C Data transfer
If the RF interface is enabled (RF_LOCKED = 1b) and data is written to the terminator
block/page of the SRAM via the RF interface, at the end of the WRITE command, bit
SRAM_I2C_READY is set to 1b and bit RF_LOCKED is set to 0b automatically, and the
NTAG I²C is locked to the I²C interface.
To signal to the host that data is ready to be read following mechanisms are in place:
• The host polls/reads bit SRAM_I2C_READY from NS_REG (see Table 14) to know if
data is ready in SRAM
• A trigger on the FD pin indicates to the host that data is ready to be read from SRAM.
This feature can be enabled by programming bits 5:2 (FD_OFF, FD_ON) of the
NC_REG appropriately (see Table 13)
This is illustrated in the Figure 24.
If the tag is addressed with the correct I²C slave address, the I2C_LOCKED bit is
automatically set to 1b (according to the interface arbitration). After a READ from the
terminator page of the SRAM, bit SRAM_I2C_READY and bit I2C_LOCKED are
automatically reset to 0b, and the tag returns to the arbitration idle mode where, for
example, further data from the RF interface can be transferred.
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ON
RF field
OFF
HIGH
LOW
FD pin
0
0
0
1
1
0
1
0
1
0
I2C_LOCKED
1
0
RF_LOCKED
SRAM_I2C_READY
RF_FIELD_PRESENT
0
PTHRU_ON_OFF = 0b,
FD_ON = 11b, FD_OFF = 11b
SRAM_MIRROR_ON_OFF = 0b
PTHRU_DIR = 1b
3Dh
7Dh
01h
t
Event
more data available?
aaa-017244
Fig 24. Illustration of the Field detection feature in combination with the Pass-through mode
for data transfer from RF to I²C
11.3.3 I²C to RF Data transfer
If the I²C interface is enabled (I2C_LOCKED is 1b) and data is written to the terminator
page of the SRAM via the I²C interface, at the end of the WRITE command, bit
SRAM_RF_READY is set to 1b and bit I2C_LOCKED is automatically reset to 0b to set
the tag in the arbitration idle state.
The RF_LOCKED bit is then automatically set to 1b (according to the interface
arbitration). After a READ or FAST_READ command involving the terminator block/page
of the SRAM, bit SRAM_RF_READY and bit RF_LOCKED are automatically reset to 0b
allowing the I²C interface to further write data into the SRAM buffer.
To signal to the host that further data is ready to be written, the following mechanisms are
in place:
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• The RF interface polls/reads the bit SRAM_RF_READY from NS_REG (see Table 14)
to know if new data has been written by the I²C interface in the SRAM
• A trigger on the FD pin indicates to the host that data has been read from SRAM by
the RF interface. This feature can be enabled by programming bits 5:2 (FD_OFF,
FD_ON) of the NC_REG appropriately (see Table 13)
The above mechanism is illustrated in the Figure 25.
ON
RF field
OFF
HIGH
LOW
FD pin
0
0
0
1
1
0
1
1
1
0
0
0
I2C_LOCKED
RF_LOCKED
SRAM_RF_READY
RF_FIELD_PRESENT
0
PTHRU_ON_OFF = 0b,
FD_ON = 11b, FD_OFF = 11b
SRAM_MIRROR_ON_OFF = 0b
PTHRU_DIR = 1b
3Ch
7Ch
01h
t
Event
more data available?
aaa-017245
Fig 25. Illustration of the Field detection signal feature in combination with Pass-through mode
for data transfer from I²C to RF
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12. Limiting values
Exceeding the limits of one or more values in reference may cause permanent damage to
the device. Exposure to limiting values for extended periods may affect device reliability.
Table 35. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1][2][3]
Symbol
II
Parameter
Conditions
Min
Max
40
Unit
mA
C
kV
V
input current LA - LB
storage temperature
electrostatic discharge voltage
Voltage on the FD pin
Voltage on the SDA line
Voltage on the SCL line
-
Tstg
55
+125
-
[3]
VESD
VFD
VSDA
VSCL
2
-
3.6
3.6
3.6
-
V
-
V
[1] Stresses above one or more of the limiting values may cause permanent damage to the device.
[2] Exposure to limiting values for extended periods may affect device reliability.
[3] ANSI/ESDA/JEDEC JS-001; Human body model: C = 100 pF, R = 1.5 k.
13. Characteristics
13.1 Electrical characteristics
Table 36. Characteristics
Symbol
Parameter
Conditions
Min
44
-
Typ
50
Max
56
Unit
Ci
input capacitance
input frequency
operating temperature
LA - LB
pF
fi
13.56
-
-
MHz
C
Toper
40
+95
Energy harvesting characteristics
Vout
voltage generated at the Vout
pin
-
-
3.2
V
I²C interface characteristics
VCC
IDD
supply voltage
supply current
NTAG I²C supplied via VCC only
1.7 [1]
-
3.6
-
V
155
A
EEPROM characteristics
tret
retention time
full operating temperature range
full operating temperature range
20
-
-
-
-
year
Nendu(W)
write endurance
500000
cycle
[1] A minimum supply voltage of 1.8 V is required, when RF field is present.
NT3H1101/1201
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Product data sheet
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14. Package outline
XQFN8: plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.6 x 1.6 x 0.5 mm
SOT902-3
X
D
B
A
E
terminal 1
index area
A
A
1
detail X
e
e
C
v
C
C
A
B
L
y
1
y
w
C
4
b
3
2
5
6
7
e
e
1
1
1
terminal 1
index area
8
metal area
not for soldering
0
1
2 mm
scale
Dimensions
Unit
A
A
1
b
D
E
e
e
L
v
w
y
y
1
1
max 0.5 0.05 0.25 1.65 1.65
0.45
mm nom
min
0.20 1.60 1.60 0.6 0.5 0.40 0.1 0.05 0.05 0.05
0.00 0.15 1.55 1.55 0.35
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
sot902-3_po
References
Outline
version
European
projection
Issue date
IEC
- - -
JEDEC
JEITA
- - -
11-08-16
11-08-18
SOT902-3
MO-255
Fig 26. Package outline SOT902-3 (XQFN8)
NT3H1101/1201
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NTAG I2C - Energy harvesting Type 2 Tag with I2C interface
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
A
(A )
2
A
3
A
1
pin 1 index
θ
L
p
L
1
4
detail X
e
w M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.05
0.95
0.80
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
5.1
4.7
0.7
0.4
0.70
0.35
6°
0°
mm
1.1
0.65
0.25
0.94
0.1
0.1
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-04-09
03-02-18
SOT505-1
Fig 27. Package outline SOT501-1 (TSSOP8)
NT3H1101/1201
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Table 37. Pin description
Pin no.
Symbol
LA
Description
1
2
3
4
5
6
7
8
Antenna connection LA
VSS
SCL
FD
GND
Serial Clock I2C
Field detection
Serial data I2C
SDA
VCC
Vout
VCC in connection (external power supply)
Voltage out (energy harvesting)
Antenna connection LB
LB
15. Abbreviations
Table 38. Abbreviations
Acronym
Description
Power On Reset
POR
16. References
[1] NFC Forum - Type 2 Tag Operation V1.2
Technical Specification
[2] ISO/IEC 14443 - Identification cards - Contactless integrated circuit cards -
Proximity cards
International Standard
[3] I2C-bus specification and user manual
NXP standard UM10204
[4] NFC Forum - Activity V1.1
Technical Specification
NT3H1101/1201
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Product data sheet
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17. Revision history
Table 39. Revision history
Document ID
Release date
20150715
Data sheet status
Change notice
Supersedes
NT3H1101_1201 v. 3.3
Modifications:
Product data sheet
-
NT3H1101_1201 v. 3.2
• Table 1 “Ordering information”: updated
• Capacitor value for energy harvesting corrected
• Table 35 “Limiting values”: updated
• Table 36 “Characteristics”: updated
NT3H1101_1201 v. 3.2
Modifications:
20150325
Product data sheet
-
NT3H1101_1201 v. 3.1
NT3H1101_1201 v. 3.0
• Table 1 “Ordering information”: updated
• Table 2 “Marking codes”: updated
• Section 7.1: Figure 4 added
• Section 14 “Package outline”: Figure 27 added
• General update
NT3H1101_1201 v. 3.1
Modifications:
20141009
Product data sheet
-
• Section 8.6 “Energy harvesting”: updated
• Section 10.5 “GET_VERSION”: updated
• Figure 24 and Figure 25: updated
• Section 12 “Limiting values” and Section 13 “Characteristics”: remark removed
NT3H1101_1201 v. 3.0
Modifications:
20140806
Product data sheet
-
NT3H1101_1201 v. 2.3
• Section 8.6 “Energy harvesting” updated
• Section 16 “References”: updated
• Data sheet status changed to “Product data sheet”
NT3H1101_1201 v. 2.3
Modifications:
20140708
Objective data sheet
-
NT3H1201_1101 v. 2.2
• Figures updated
• General update
NT3H1101_1201 v. 2.2
Modifications:
20140306
Objective data sheet
-
-
NT3H1201_1101 v. 2.1
NT3H1201_1101 v. 2.0
NT3H1201 v. 1.4
• General updates
20131218
NT3H1101_1201 v. 2.1
Modifications:
Objective data sheet
• Section 4 “Ordering information”: type number corrected
20131212 Objective data sheet
NT3H1101_1201 v. 2.0
Modifications:
• Additional description for the Field detection functionality for Pass-through mode
• General update
NT3H1201 v. 1.4
Modifications:
20130802
Objective data sheet
-
NT3H1201 v. 1.3
• Update for 1k memory version and RF commands
NT3H1201 v. 1.3
Modifications:
20130613
• Pinning package update
20130425 Objective data sheet
Objective data sheet
-
-
NT3H1201 v. 1.0
-
NT3H1201 v. 1.0
NT3H1101/1201
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18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
18.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
NT3H1101/1201
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Product data sheet
COMPANY PUBLIC
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
18.4 Licenses
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Purchase of NXP ICs with NFC technology
Purchase of an NXP Semiconductors IC that complies with one of the Near
Field Communication (NFC) standards ISO/IEC 18092 and ISO/IEC 21481
does not convey an implied license under any patent right infringed by
implementation of any of those standards.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
18.5 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP Semiconductors N.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NT3H1101/1201
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Product data sheet
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20. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
9.3
9.4
9.5
9.6
9.7
9.8
Soft reset feature . . . . . . . . . . . . . . . . . . . . . . 34
Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . 34
Data input. . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Addressing. . . . . . . . . . . . . . . . . . . . . . . . . . . 34
READ and WRITE Operation. . . . . . . . . . . . . 35
WRITE and READ register operation . . . . . . 37
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
RF interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
I2C interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1
2.2
2.3
2.4
2.5
2.6
10
RF Command . . . . . . . . . . . . . . . . . . . . . . . . . 39
NTAG I2C command overview . . . . . . . . . . . . 39
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
NTAG ACK and NAK . . . . . . . . . . . . . . . . . . 40
ATQA and SAK responses. . . . . . . . . . . . . . . 40
GET_VERSION . . . . . . . . . . . . . . . . . . . . . . . 41
READ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
FAST_READ . . . . . . . . . . . . . . . . . . . . . . . . . 43
WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
SECTOR SELECT. . . . . . . . . . . . . . . . . . . . . 46
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
3
4
5
6
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information. . . . . . . . . . . . . . . . . . . . . 4
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7
7.1
7.1.1
7.1.2
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 6
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
XQFN8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
TSSOP8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
11
Communication and arbitration between
RF and I²C interface . . . . . . . . . . . . . . . . . . . . 48
Non-Pass-through mode . . . . . . . . . . . . . . . . 48
I²C interface access . . . . . . . . . . . . . . . . . . . . 48
RF interface access . . . . . . . . . . . . . . . . . . . . 48
SRAM buffer mapping with Memory Mirror
enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Pass-through mode . . . . . . . . . . . . . . . . . . . . 52
SRAM buffer mapping . . . . . . . . . . . . . . . . . . 52
RF to I²C Data transfer . . . . . . . . . . . . . . . . . 55
I²C to RF Data transfer . . . . . . . . . . . . . . . . . 56
8
8.1
8.2
Functional description . . . . . . . . . . . . . . . . . . . 8
Block description . . . . . . . . . . . . . . . . . . . . . . . 8
RF interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Data integrity. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
RF communication principle . . . . . . . . . . . . . . 10
IDLE state. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
READY 1 state . . . . . . . . . . . . . . . . . . . . . . . . 10
READY 2 state . . . . . . . . . . . . . . . . . . . . . . . . 11
ACTIVE state . . . . . . . . . . . . . . . . . . . . . . . . . 11
HALT state . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Memory organization . . . . . . . . . . . . . . . . . . . 11
Memory map from RF interface . . . . . . . . . . . 11
Memory map from I²C interface . . . . . . . . . . . 13
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
UID/serial number. . . . . . . . . . . . . . . . . . . . . . 16
Static lock bytes . . . . . . . . . . . . . . . . . . . . . . . 17
Dynamic Lock Bytes. . . . . . . . . . . . . . . . . . . . 18
Capability Container (CC bytes) . . . . . . . . . . . 20
User Memory pages . . . . . . . . . . . . . . . . . . . . 20
Memory content at delivery . . . . . . . . . . . . . . 21
NTAG I2C configuration and session
11.1
11.1.1
11.1.2
11.2
8.2.1
8.2.2
8.2.2.1
8.2.2.2
8.2.2.3
8.2.2.4
8.2.2.5
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.3.5
8.3.6
8.3.7
8.3.8
8.3.9
8.3.10
8.3.11
11.3
11.3.1
11.3.2
11.3.3
12
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 58
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 58
Electrical characteristics . . . . . . . . . . . . . . . . 58
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 59
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 61
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Revision history . . . . . . . . . . . . . . . . . . . . . . . 62
13
13.1
14
15
16
17
18
Legal information . . . . . . . . . . . . . . . . . . . . . . 63
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 63
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Licenses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 64
18.1
18.2
18.3
18.4
18.5
registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Configurable Field Detection Pin . . . . . . . . . . 28
Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 32
Energy harvesting. . . . . . . . . . . . . . . . . . . . . . 32
8.4
8.5
8.6
19
20
Contact information . . . . . . . . . . . . . . . . . . . . 64
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
9
9.1
9.2
I²C commands . . . . . . . . . . . . . . . . . . . . . . . . . 33
Start condition. . . . . . . . . . . . . . . . . . . . . . . . . 33
Stop condition. . . . . . . . . . . . . . . . . . . . . . . . . 33
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
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Date of release: 15 July 2015
265433
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