NX3P190 [NXP]
Logic controlled high-side power switch; 逻辑控制的高端电源开关型号: | NX3P190 |
厂家: | NXP |
描述: | Logic controlled high-side power switch |
文件: | 总14页 (文件大小:993K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NX3P190
Logic controlled high-side power switch
Rev. 2 — 4 November 2011
Product data sheet
1. General description
The NX3P190 is a high-side load switch which features a low ON resistance P-channel
MOSFET that supports more than 500 mA of continuous current. Designed for operation
from 1.1 V to 3.6 V, it is used in power domain isolation applications to reduce power
dissipation and extend battery life. The enable logic includes integrated logic level
translation making the device compatible with lower voltage processors and controllers.
The NX3P190 is ideal for portable, battery operated applications due to low ground
current and ultra-low shutdown current.
2. Features and benefits
Wide supply voltage range from 1.1 V to 3.6 V
Very low ON resistance:
95 m (typical) at a supply voltage of 1.8 V
High noise immunity
Low-power mode when EN is LOW
Low ground current (2 A maximum)
1.2 V control logic at a supply voltage of 3.6 V
High current handling capability (500 mA continuous current)
ESD protection:
HBM JESD22-A114F Class 3A exceeds 4000 V
CDM AEC-Q100-011 revision B exceeds 500 V
Specified from 40 C to +85 C
3. Applications
Cell phone
Digital cameras and audio devices
Portable and battery-powered equipment
NX3P190
NXP Semiconductors
Logic controlled high-side power switch
4. Ordering information
Table 1.
Type number Package
Temperature range
40 C to +85 C
Ordering information
Name
Description
Version
NX3P190UK
WLCSP4
wafer level chip-size package; 4 bumps; body
0.76 0.76 0.51 mm. (Backside Coating
included)
NX3P190/NX3P191
5. Marking
Table 2.
Marking codes
Type number
NX3P190UK
Marking code
x0
6. Functional diagram
VIN
VOUT
LEVEL SHIFT AND
SLEW RATE CONTROL
EN
EN
R
pd
VIN
VOUT
001aao342
001aao343
Fig 1. Logic symbol
Fig 2. Logic diagram (simplified schematic)
7. Pinning information
7.1 Pinning
bump A1
index area
NX3P190
1
2
1
2
A
A
B
VIN
VOUT
B
EN
GND
001aao344
001aao345
Transparent top view
Transparent top view
Fig 3. Pin configuration for WLCSP4
Fig 4. Ball mapping for WLCSP4
NX3P190
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 4 November 2011
2 of 14
NX3P190
NXP Semiconductors
Logic controlled high-side power switch
7.2 Pin description
Table 3.
Symbol
VIN
Pin description
Pin
A1
B1
A2
B2
Description
input voltage
EN
enable input (active HIGH)
output voltage
VOUT
GND
ground (0 V)
8. Functional description
Table 4.
Function table[1]
Input EN
Switch
L
switch OFF
switch ON
H
[1] H = HIGH voltage level; L = LOW voltage level.
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
0.5
0.5
0.5
50
50
50
-
Max
+4.0
+4.0
VI(VIN)
-
Unit
V
[1]
[2]
[2]
VI
input voltage
input EN
input VIN
V
VSW
IIK
switch voltage
output VOUT
input EN: VI(EN) < 0.5 V
V
input clamping current
mA
mA
mA
mA
ISK
switch clamping current input VIN: VI(VIN) < 0.5 V
output VOUT: VO(VOUT) < 0.5 V
-
-
output VOUT: VO(VOUT) > VI(VIN) + 0.5 V
50
ISW
switch current
VSW > 0.5 V
Tamb = 25 C
Tamb = 85 C
-
1000
500
+125
mA
mA
C
-
Tj(max)
maximum junction
temperature
40
Tstg
Ptot
storage temperature
total power dissipation
65
+150
300
C
[3]
-
mW
[1] The minimum input voltage rating may be exceeded if the input current rating is observed.
[2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed.
[3] The (absolute) maximum power dissipation depends on the junction temperature Tj. Higher power dissipation is allowed in conjunction
with lower ambient temperatures. The conditions to determine the specified values are Tamb = 85 C and the use of a two layer PCB.
NX3P190
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 4 November 2011
3 of 14
NX3P190
NXP Semiconductors
Logic controlled high-side power switch
10. Recommended operating conditions
Table 6.
Recommended operating conditions
Conditions
Symbol Parameter
Min
1.1
Max
3.6
Unit
V
VI
input voltage
Tamb
ambient temperature
40
+85
C
11. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Typ
Unit
K/W
[1][2]
thermal resistance from junction to ambient
130
[1] The overall Rth(j-a) can vary depending on the board layout. To minimize the effective Rth(j-a), all pins must have a solid connection to
larger Cu layer areas e.g. to the power and ground layer. In multi-layer PCB applications, the second layer should be used to create a
large heat spreader area right below the device. If this layer is either ground or power, it should be connected with several vias to the top
layer connecting to the device ground or supply.Try not to use any solder-stop varnish under the chip.
[2] Please rely on the measurement data given for a rough estimation of the Rth(j-a) in your application. The actual Rth(j-a) value may vary in
applications using different layer stacks and layouts
12. Static characteristics
Table 8.
Static characteristics
VI(VIN) = VI(EN) , unless otherwise specified; Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Tamb = 25 C
Min Typ Max
Tamb = 40 C to +85 C Unit
Min
Max
VIH
HIGH-level input EN input
voltage
VI(VIN) = 1.1 V to 1.3 V
VI(VIN) = 1.3 V to 1.8 V
VI(VIN) = 1.8 V to 3.6 V
EN input
-
-
-
-
-
-
-
-
-
1.0
1.2
1.2
-
-
-
V
V
V
VIL
LOW-level input
voltage
VI(VIN) = 1.1 V to 1.3 V
VI(VIN) = 1.3 V to 1.8 V
VI(VIN) = 1.8 V to 3.6 V
EN input
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.3
0.4
0.45
-
V
V
-
V
Rpd
pull-down
resistance
4
M
IGND
IOFF
ground current
VI(VIN) = 3.6 V; VOUT open;
see Figure 5 and Figure 6
-
-
-
-
-
2
-
A
A
power-off leakage VI(VIN) = 3.6 V; VI(EN) = GND;
current VO(VOUT) = GND; see Figure 8
0.1
-
2
NX3P190
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 4 November 2011
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NX3P190
NXP Semiconductors
Logic controlled high-side power switch
12.1 Graphs
001aao346
001aao347
0.9
1.0
I
GND
(μA)
I
GND
0.8
0.7
0.6
0.5
0.4
0.3
0.2
(μA)
0.8
0.6
0.4
0.2
-40
-10
20
50
80
110
(°C)
1.2
1.7
2.2
2.7
3.2
V
3.2
(V)
T
amb
I(VIN)
VI(VIN) = 1.8 V; VI(EN) = 1.8 V; ILOAD = 500 mA.
VI(EN) = VI(VIN); Tamb = 25 C; ILOAD = 500 mA.
Fig 5. Waveform showing the ground current versus
temperature
Fig 6. Waveform showing the ground current versus
input voltage on pin VIN
001aao348
12
I
GND
(μA)
V
= 3.6 V
I(VIN)
8
4
0
V
= 1.8 V
I(VIN)
0
1
2
3
4
V
(V)
I(EN)
Fig 7. Waveform showing the additional ground current versus input voltage
NX3P190
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 4 November 2011
5 of 14
NX3P190
NXP Semiconductors
Logic controlled high-side power switch
001aao349
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
I
OFF
(μA)
(1)
(2)
(3)
(4)
-40
-20
0
20
40
60
80
(°C)
100
T
amb
VI(EN) = GND.
(1)
VI(VIN) = 3.6 V.
(2) VI(VIN) = 2.5 V.
(3) VI(VIN) = 1.8 V.
(4)
VI(VIN) = 1.2 V.
Fig 8. Waveforms showing the power-off leakage current versus temperature
12.2 ON resistance
Table 9.
ON resistance
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Tamb = 25 C
Unit
Min
Typ[1]
Max
RON
ON resistance
VI(EN) = 1.5 V; ILOAD = 200 mA;
see Figure 9, Figure 10 and Figure 11
VI(VIN) = 1.2 V
VI(VIN) = 1.5 V
VI(VIN) = 1.8 V
VI(VIN) = 2.5 V
VI(VIN) = 3.6 V
-
-
-
-
-
150
110
95
-
m
m
m
m
m
-
130
75
-
-
65
[1] Typical values are measured at Tamb = 25 C.
NX3P190
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 4 November 2011
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NX3P190
NXP Semiconductors
Logic controlled high-side power switch
12.3 ON resistance test circuit and waveforms
V
SW
EN
V
IH
VIN
VOUT
V
I
LOAD
I
GND
001aao350
RON = VSW / ILOAD
.
Fig 9. Test circuit for measuring ON resistance
001aao352
001aao351
200
200
R
R
ON
ON
(mΩ)
(mΩ)
160
160
120
80
(1)
(1)
(2)
(3)
(4)
(5)
120
80
(2)
(3)
40
40
1.2
2.0
2.8
3.6
-40
-10
20
50
80
110
V
(V)
Tamb (°C)
I(VIN)
ILOAD = 100 mA.
I(VIN) = 1.2 V.
VI(EN) = VI(VIN); Tamb = 25 C.
(1) ILOAD = 10 mA.
(1)
V
(2) VI(VIN) = 1.8 V.
(3) VI(VIN) = 3.6 V.
(2) ILOAD = 100 mA.
(3) ILOAD = 250 mA.
(4)
ILOAD = 350 mA.
(5) ILOAD = 500 mA.
Fig 10. Waveform showing the ON resistance versus
temperature
Fig 11. Waveform showing the ON resistance versus
input voltage
NX3P190
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 4 November 2011
7 of 14
NX3P190
NXP Semiconductors
Logic controlled high-side power switch
13. Dynamic characteristics
Table 10. Dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit see Figure 13.
Symbol
Parameter
Conditions
Tamb = 25 C
Unit
Min
Typ
Max
[1]
ten
enable time
EN to VOUT; see Figure 12
VI(VIN) = 1.8 V
-
-
2.5
1.8
-
-
s
s
VI(VIN) = 3.6 V
[1] ten is the same as tPZH
.
13.1 Waveform and test circuits
V
I
EN input
V
M
GND
t
t
PZH
PHZ
V
OH
V
Y
VOUT output
V
X
GND
001aao353
Measurement points are given in Table 11.
Logic level: VOH is the typical output voltage that occurs with the output load.
Fig 12. Switching times
Table 11. Measurement points
Supply voltage
VI(VIN)
EN Input
VM
Output
VX
VY
1.1 V to 3.6 V
0.5 VI(EN)
0.1 VOH
0.9 VOH
NX3P190
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 4 November 2011
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NXP Semiconductors
Logic controlled high-side power switch
EN
VOUT
VIN
G
V
I
V
C
L
I
LOAD
EXT
001aao354
Test data is given in Table 12.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
VEXT = External voltage for measuring switching times.
Fig 13. Test circuit for measuring switching times
Table 12. Test data
Supply voltage
VEXT
EN Input
VI(EN)
Load
CL
ILOAD
1.1 V to 3.6 V
1.5 V
1 F
200 mA
001aao355
001aao356
VI(VIN) = 1.8 V; VI(EN) = 3.6 V; CL = 1 F; ILOAD = 200 mA.
VI(VIN) = 1.8 V; VI(EN) = 3.6 V; CL = 4.7 F;
ILOAD = 200 mA.
Fig 14. Waveform showing the enable time versus
inrush current
Fig 15. Waveform showing the enable time versus
inrush current
NX3P190
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 4 November 2011
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NXP Semiconductors
Logic controlled high-side power switch
14. Package outline
WLCSP4: wafer level chip-size package.
4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included)
NX3P190/NX3P191
A
B
E
D
A
2
ball A1
index area
A
A
1
detail X
e
C
v
w
C A
C
B
b
y
B
A
e
1
2
ball A1
index area
X
0
2 mm
scale
y
Dimensions
Unit
A
A
1
A
2
b
D
E
e
v
w
max 0.54 0.22 0.32 0.29 0.81 0.81
mm nom 0.51 0.20 0.31 0.26 0.76 0.76 0.40 0.025 0.025 0.03
min
0.48 0.18 0.30 0.23 0.71 0.71
nx3p190_191_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
11-05-24
11-06-09
NX3P190/NX3P191
Fig 16. Package outline WLCSP4 (NX3P190/NX3P191)
NX3P190
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 4 November 2011
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NXP Semiconductors
Logic controlled high-side power switch
15. Abbreviations
Table 13. Abbreviations
Acronym
CDM
Description
Charged Device Model
ESD
ElectroStatic Discharge
HBM
Human Body Model
MOSFET
Metal-Oxide Semiconductor Field Effect Transistor
16. Revision history
Table 14. Revision history
Document ID
NX3P190 v.2
Modifications:
NX3P190 v.1
Release date
20111104
Data sheet status
Change notice
Supersedes
Product data sheet
-
NX3P190 v.1
• Legal pages updated.
20110822 Product data sheet
-
-
NX3P190
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 4 November 2011
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Logic controlled high-side power switch
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
17.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
17.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
NX3P190
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Product data sheet
Rev. 2 — 4 November 2011
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NX3P190
NXP Semiconductors
Logic controlled high-side power switch
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NX3P190
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Product data sheet
Rev. 2 — 4 November 2011
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Logic controlled high-side power switch
19. Contents
1
2
3
4
5
6
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
9
10
11
12
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ON resistance. . . . . . . . . . . . . . . . . . . . . . . . . . 6
ON resistance test circuit and waveforms . . . . 7
12.1
12.2
12.3
13
13.1
14
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Waveform and test circuits . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
15
16
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
17.1
17.2
17.3
17.4
18
19
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 4 November 2011
Document identifier: NX3P190
相关型号:
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