NZH30C,115 [NXP]
NZH series - Single Zener diodes SOD-123 2-Pin;
| 型号： | NZH30C,115 |
| 厂家： | 
NXP |
| 描述： | NZH series - Single Zener diodes SOD-123 2-Pin |
| 文件： | 总9页 (文件大小：92K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NZH series
Single Zener diodes
Rev. 01 — 27 January 2010
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted
Device (SMD) plastic package.
1.2 Features
Total power dissipation: ≤ 500 mW
Wide working voltage range
Small plastic package suitable for
surface-mounted design
Low differential resistance
1.3 Applications
General regulation functions
1.4 Quick reference data
Table 1.
Symbol
VF
Quick reference data
Parameter
Conditions
IF = 10 mA
Tamb ≤ 25 °C
Min
Typ
Max
0.9
500
1
Unit
V
[1]
[2]
[3]
forward voltage
-
-
-
-
-
-
Ptot
total power dissipation
mW
W
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm2.
[3] Device mounted on a ceramic PCB, Al2O3, standard footprint.
NZH series
NXP Semiconductors
Single Zener diodes
2. Pinning information
Table 2.
Pinning
Pin
1
Description
cathode
Simplified outline
Graphic symbol
[1]
2
anode
1
2
2
1
006aaa152
[1] The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
-
Description
plastic surface-mounted package; 2 leads
Version
NZH3V0B to
NZH30C[1]
SOD123F
[1] The series consists of 25 types with nominal working voltages from 3.0 V to 30 V.
4. Marking
Table 4.
Marking codes
Type number
NZH3V0B
NZH3V3A
NZH3V6B
NZH3V9B
NZH4V3B
NZH4V7B
NZH5V1B
NZH5V6B
NZH6V2B
NZH6V8B
NZH7V5C
NZH8V2B
NZH9V1B
Marking code
Type number
NZH10C
NZH11C
NZH12B
NZH13B
NZH15B
NZH16C
NZH18C
NZH20C
NZH22C
NZH24C
NZH27C
NZH30C
-
Marking code
CH
CJ
CW
CX
CY
D9
D1
D2
D3
D4
D5
D6
D7
DA
-
CK
CL
CM
CN
CP
CQ
CR
CS
CT
CU
CV
NZH_SER_1
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 27 January 2010
2 of 9
NZH series
NXP Semiconductors
Single Zener diodes
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
250
500
1
Unit
mA
mW
W
IF
forward current
-
[1]
[2]
Ptot
total power dissipation
Tamb ≤ 25 °C
-
-
Tj
junction temperature
ambient temperature
storage temperature
-
150
+150
+150
°C
Tamb
Tstg
−55
−65
°C
°C
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2] Device mounted on a ceramic PCB, Al2O3, standard footprint.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol Parameter
Conditions
Min
Typ
Max Unit
[1]
[2]
[3]
Rth(j-a)
thermal resistance from
junction to ambient
in free air
-
-
-
-
-
-
250
125
70
K/W
K/W
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[3] Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
[1]
VF
forward voltage
IF = 10 mA
-
-
0.9
V
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
Table 8.
Characteristics per type; NZH3V0B to NZH10C
Tj = 25 °C unless otherwise specified.
NZHxxx
Working voltage Maximum differential Reverse current
Diode
VZ (V);
IZ = 20 mA
resistance
rdif (Ω)
IR (μA)
capacitance
Cd (pF)[1]
Min
Max
IZ = 1 mA IZ = 20 mA Max
VR (V)
Max
450
450
450
450
3V0B
3V3A
3V6B
3V9B
2.85
3.16
3.42
3.71
3.15
3.38
3.78
4.10
1000
1000
1000
1000
80
70
60
50
50
20
5
1
1
1
1
5
NZH_SER_1
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 27 January 2010
3 of 9
NZH series
NXP Semiconductors
Single Zener diodes
Table 8.
Characteristics per type; NZH3V0B to NZH10C …continued
Tj = 25 °C unless otherwise specified.
NZHxxx
Working voltage Maximum differential Reverse current
Diode
VZ (V);
IZ = 20 mA
resistance
rdif (Ω)
IR (μA)
capacitance
Cd (pF)[1]
Min
Max
IZ = 1 mA IZ = 20 mA Max
VR (V)
Max
450
300
300
300
200
200
150
150
150
90
4V3B
4V7B
5V1B
5V6B
6V2B
6V8B
7V5C
8V2B
9V1B
10C
4.17
4.55
4.94
5.45
5.96
6.49
7.29
8.02
8.85
9.70
4.43
4.80
5.20
5.73
6.27
6.83
7.67
8.36
9.23
10.20
1000
900
800
500
300
150
120
120
120
120
40
25
20
13
10
8
5
1
5
1
5
1.5
2.5
3
5
5
2
3.5
4
8
0.5
0.5
0.5
0.2
8
5
8
6
8
7
[1] f = 1 MHz; VR = 0 V
Table 9.
Characteristics per type; NZH11C to NZH20C
Tj = 25 °C unless otherwise specified.
NZHxxx
Working voltage Maximum differential
Reverse current
Diode
VZ (V);
IZ = 10 mA
resistance
rdif (Ω)
IR (μA)
capacitance
Cd (pF)[1]
Min
Max
IZ = 1 mA
120
IZ = 10 mA Max
VR (V)
8
Max
85
85
80
75
75
70
60
11C
12B
13B
15B
16C
18C
20C
10.82
11.44
12.35
14.25
15.69
17.42
19.23
11.38
12.03
13.65
15.75
16.51
18.33
20.22
10
12
14
16
18
23
28
0.04
0.04
0.04
0.04
0.04
0.04
0.04
110
9
110
10
11
110
150
12
13
15
150
200
[1] f = 1 MHz; VR = 0 V
Table 10. Characteristics per type; NZH22C to NZH30C
Tj = 25 °C unless otherwise specified.
NZHxxx
Working voltage Maximum differential
Reverse current
Diode
VZ (V);
IZ = 5 mA
resistance
rdif (Ω)
IR (μA)
capacitance
Cd (pF)[1]
Min
Max
IZ = 1 mA
200
IZ = 5 mA Max
VR (V)
17
Max
60
22C
24C
27C
30C
21.08
23.12
25.63
28.50
22.17
24.31
26.95
31.50
30
35
45
55
0.04
0.04
0.04
0.04
200
19
55
250
21
50
250
23
50
[1] f = 1 MHz; VR = 0 V
NZH_SER_1
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 27 January 2010
4 of 9
NZH series
NXP Semiconductors
Single Zener diodes
mbg781
300
I
F
(mA)
200
100
0
0.6
0.8
1
V
F
(V)
Tj = 25 °C
Fig 1. Forward current as a function of forward voltage; typical values
006aac010
006aac011
50
30
V
(V) = 3.0
Z(nom)
I
Z
I
Z
(mA)
(mA)
3.3
3.6
3.9
25
40
20
15
10
5
9.1
5.1 6.2
5.6 6.8
7.5
13
15
16
V
(V) = 12
Z(nom)
30
20
10
0
8.2
0
7.5
0
2
4
6
8
10
10.0
12.5
15.0
17.5
V
(V)
V (V)
Z
Z
Tj = 25 °C
Tj = 25 °C
Fig 2. Working current as a function of working
voltage; typical values
Fig 3. Working current as a function of working
voltage; typical values
NZH_SER_1
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 27 January 2010
5 of 9
NZH series
NXP Semiconductors
Single Zener diodes
8. Package outline
1.7
1.5
1.2
1.0
1
0.55
0.35
3.6 2.7
3.4 2.5
2
0.70
0.55
0.25
0.10
Dimensions in mm
04-11-29
Fig 4. Package outline SOD123F
9. Packing information
Table 11. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
Packing quantity
3000
10000
NZH3V0B to
NZH30C[2]
SOD123F 4 mm pitch, 8 mm tape and reel
-115
-135
[1] For further information and the availability of packing methods, see Section 13.
[2] The series consists of 25 types with nominal working voltages from 3.0 V to 30 V.
10. Soldering
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 5. Reflow soldering footprint SOD123F
NZH_SER_1
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 27 January 2010
6 of 9
NZH series
NXP Semiconductors
Single Zener diodes
11. Revision history
Table 12. Revision history
Document ID
Release date
20100127
Data sheet status
Change notice
Supersedes
NZH_SER_1
Product data sheet
-
-
NZH_SER_1
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 27 January 2010
7 of 9
NZH series
NXP Semiconductors
Single Zener diodes
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NZH_SER_1
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 27 January 2010
8 of 9
NZH series
NXP Semiconductors
Single Zener diodes
14. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
5
6
7
8
9
10
11
12
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12.1
12.2
12.3
12.4
13
14
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 January 2010
Document identifier: NZH_SER_1
相关型号：
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