OM2070B [NXP]
Wideband amplifier module; 宽带放大器器模块
| 型号： | OM2070B |
| 厂家： | 
NXP |
| 描述： | Wideband amplifier module |
| 文件： | 总7页 (文件大小：43K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
OM2070B
Wideband amplifier module
1995 Nov 29
Product specification
Supersedes data of October 1991
File under Discrete Semiconductors, SC16
Philips Semiconductors
Product specification
Wideband amplifier module
OM2070B
DESCRIPTION
A three-stage wideband amplifier in hybrid integrated circuit form on a thin-film substrate. The device is intended for use
in mast-head booster amplifiers, as an amplifier in MATV and CATV systems and as a general purpose amplifier for VHF
and UHF applications.
PINNING
PIN
DESCRIPTION
input
pin 1 identification
1
2
3
4
5
6
7
8
9
handbook, halfpage
common (−)
common (−)
common (−)
common (−)
supply (+)
1
common (−)
common (−)
output/supply (+)
9
8
7
6
5
4
3
2
1
MLA418
Fig.1 Simplified outline.
QUICK REFERENCE DATA
SYMBOL PARAMETER
CONDITIONS
MIN.
40
TYP.
MAX. UNIT
f
frequency range
−
860
MHz
Ω
ZS, ZL
GT
source and load impedance
−
−
−
75
30
1
−
−
−
2
transducer gain = S21
dB
dB
∆GT
flatness of frequency response
output voltage (RMS value)
Vo(rms)
dim = −60 dB;
3rd order intermodulation (3-tone)
VHF
UHF
−
113
112
4.8
12
−
dBµV
dBµV
dB
−
−
F
noise figure
−
−
VB
Tamb
DC supply voltage
10.8
−20
13.2
+70
V
ambient operating temperature
−
°C
1995 Nov 29
2
Philips Semiconductors
Product specification
Wideband amplifier module
OM2070B
CIRCUIT DIAGRAM AND PRINTED-CIRCUIT BOARD
C1
C3
R8
C6
R3
R13
9
R1
R6
R11
C2
C4
TR1
TR2
TR3
1
R2
R4
R5
R7
R9
R10
R12 R14
C5
2,3,4,5
7,8
6
MGA201
Fig.2 Circuit diagram.
1
9
1
(9x)
TOP VIEW
L
75 Ω
track
75 Ω
track
C
C
MGA202
BOTTOM VIEW
L > 5 µH; e.g. catalogue No. 3122 108 20150, or 27 turns enamelled 0.3 mm copper wire wound on a ferrite core with a diameter of 1.6 mm.
C > 220 pF ceramic capacitor.
Fig.3 Printed-circuit board holes and tracks.
1995 Nov 29
3
Philips Semiconductors
Product specification
Wideband amplifier module
OM2070B
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VB
PARAMETER
MIN.
MAX.
15
UNIT
DC supply voltage
−
−
V
PIM
peak incident powers on pins 1 and 8
ambient operating temperature
storage temperature
100
mW
°C
Tamb
Tstg
−20
−40
+70
+125
°C
CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Measuring conditions
Tamb
VB
ZS
ambient operating temperature
DC supply voltage
−
−
−
−
−
25
12
75
75
75
−
−
−
−
−
°C
V
source impedance
Ω
Ω
Ω
ZL
load impedance
Z0
characteristic impedance of
HF connections
f
frequency range
40
−
860
MHz
Performance
IB
supply current
−
100
30
1
−
mA
dB
dB
2
GT
transducer gain = S21
28
−
33
−
∆GT
flatness of frequency response
individual maximum VSWR
individual maximum VSWR
back attenuation
VSWRin
VSWRout
input; note 1
−
2.7
1.9
45
35
−
output; note 1
f = 100 MHz
f = 860 MHz
−
−
2
S12
−
−
dB
dB
−
−
Vo(rms)
output voltage (RMS value)
dim = −60 dB;
3rd order intermodulation (3-tone)
VHF
UHF
111
110
−
113
112
4.8
−
−
−
dBµV
dBµV
dB
F
Operating conditions
noise figure
Tamb
VB
f
ambient operating temperature
−20
−
+70
13.2
860
−
°C
V
DC supply voltage
frequency range
source impedance
load impedance
10.8 12
40
−
−
MHz
Ω
ZS
ZL
75
75
−
−
Ω
Note
1. Highest value (for sample) occurring in the frequency range.
1995 Nov 29
4
Philips Semiconductors
Product specification
Wideband amplifier module
OM2070B
MCD445
MCD444
32
32
handbook, halfpage
handbook, halfpage
S
21
2
S
21
(dB)
(dB)
(1)
(2)
30
30
(3)
28
0
28
0
500
1000
500
1000
f (MHz)
f (MHz)
(1) Maximum gain.
(2) Average gain.
(3) Minimum gain.
Gain over entire frequency range.
Z0 = 75 Ω.
Fig.4 Transducer gain as a function of frequency.
Fig.5 Power gain.
1995 Nov 29
5
Philips Semiconductors
Product specification
Wideband amplifier module
OM2070B
MOUNTING
Dip or wave soldering
The module should preferably be mounted on a
double-sided printed-circuit board, see Fig.3.
Input and output should be connected to 75 Ω tracks.
The connection to the common pins should be as close to
the seating plane as possible.
The maximum permissible temperature for the solder is
260 °C. It must not be in contact with the joint for more than
5 s.
The total contact time of successive solder waves must not
exceed 5 s.
The device may be mounted against the printed-circuit
board, but the temperature of the device must not exceed
125 °C.
SOLDERING
Hand soldering
If the printed-circuit board has been pre-heated, forced
cooling may be necessary immediately after soldering to
keep the temperature below the allowable limit.
The maximum contact time for a soldering iron
temperature of 260 °C up to the seating plane is 5 s.
PACKAGE OUTLINE
pin 1 identification
5
max
27 max
21 max
1
4.5
3.0
9
8
7
6
5
4
3
2
1
0.5
0.25
2.54
(9x)
MLA417
3 max
Dimensions in mm.
Fig.6 Resin coated encapsulation.
1995 Nov 29
6
Philips Semiconductors
Product specification
Wideband amplifier module
OM2070B
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 Nov 29
7
相关型号：
©2020 ICPDF网 联系我们和版权申明