OM3105N [NXP]
Hybrid integrated circuits for inductive proximity detectors; 电感式接近探测器混合集成电路
| 型号： | OM3105N |
| 厂家： | 
NXP |
| 描述： | Hybrid integrated circuits for inductive proximity detectors |
| 文件： | 总8页 (文件大小：38K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
OM3105P
Hybrid integrated circuits for
inductive proximity detectors
January 1994
Preliminary specification
File under Discrete Semiconductors, SC17
Philips Semiconductors
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive
proximity detectors
OM3105P
FEATURES
DESCRIPTION
• Extra small dimensions (3 x 20 mm max.)
• Wide supply voltage range (6 to 35 V)
The OM3105P is a hybrid integrated circuit intended for
inductive proximity detectors in a tubular construction,
especially the M5 hollow stud. The circuit performs a make
function (version 1): when actuated, the current flows
through the load, which can be for example a LED or an
optocoupler. It is also possible to perform a break function
when using version OM3115P.
• Supply current typical 1.5 mA (output stage
switched off)
• High output current (250 mA max.)
• RC filter on the supply lines
• PNP output transistor protected against transients from
Available versions:
the inductive load
OM3105P: pnp output; make function
OM3115P: pnp output; break function
OM3105N: npn output; make function
OM3115N: npn output; break function
OM31.5./0: for external LED connection.
• Circuit protected against wrong polarity connection of
the supply voltage
• Electronic short-circuit protection
• Detection distance adjustable by a chip resistor (Rd),
type 1206
• Only a simple coil in one part is required; e.g. the
OM2860 requires a coil in two parts
• Hysteresis adjustable by a chip resistor (Rh), type 0603,
for using the OM3105P with other then M5 coils
• Status of the output is shown by a yellow or red LED
mounted on the substrate surface
• The OM3105P is also available without a LED, but with
an output pad for external LED connection
• A version with a NPN output transistor is available
(OM3105P).
QUICK REFERENCE DATA
SYMBOL
PARAMETER
DC supply voltage
CONDITIONS
TYP.
MAX.
35
UNIT
VB
IO
6
−
−
V
output current
VB = 24 V; Ts = 25 °C
250
5
mA
kHz
°C
fsw
Ts
operating switching frequency
operating substrate temperature
M5 coil
−20
+70
January 1994
2
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive
proximity detectors
OM3105P
MECHANICAL DATA
20 max
8
3
3
max
inductive
load
1
7
7.75 0.3
5
2
MSA936 - 1
4
6
Dimensions in mm.
Coil: Ø 0.063 mm Cu wire, 80 turns.
Potcore: 3.3 x 1.3 mm.
Fig.1 Outline and connections.
PAD INFORMATION
PAD NUMBER
DESCRIPTION
1
2
3
4
5
6
7
8
output
negative supply (−)
positive supply (+)
coil connection
coil connection
Rd resistor (type 1206) for adjusting the detection distance
Rt resistor (type 0603) for adjusting the stability with temperature variations
Rh resistor (type 0603) for adjusting the hysteresis
January 1994
3
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive
proximity detectors
OM3105P
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VB
IO
DC supply voltage
6
35
V
output current; Ts = 25 °C
storage temperature
−
250
mA
°C
°C
Tstg
Ts
−40
−20
+125
+70
operating substrate temperature
CHARACTERISTICS
VB = 24 V (DC); Ts = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
supply current
CONDITIONS
output stage ON
TYP.
MAX.
UNIT
IB
11
1.5
1
−
mA
mA
V
output stage OFF
IO = 250 mA
coil M5
−
Vd
d
voltage drop
1.5
−
detection distance
0.8
mm
MBD233
MBD235
1.0
1.0
d
d
(mm)
(mm)
d
off
d
d
off
on
0.9
0.9
d
on
0.8
20
0.8
0
20
40
60
80
( C)
6
12
18
24
30
(V)
V
B
o
T
s
Fig.3 Switching distance as a function of the DC
supply voltage.
Fig.2 Switching distance as a function of the
substrate temperature.
January 1994
4
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive
proximity detectors
OM3105P
MBD234
400
I
O max
(mA)
350
300
250
200
150
20
0
20
40
60
80
( C)
o
T
s
Fig.4 Overload protection as a function of the substrate temperature.
MOUNTING RECOMMENDATIONS
Potting recommendations
First cover the hybrid IC with about 0.5 mm of silicone
rubber, let it harden and with the parts inserted in the tube,
fill up the tube with epoxy.
General
If a protective cap is incorporated, it should be as thin as
possible, because its thickness “d” forms part of the
operating distance “S”.
A brass stud wall should not extend beyond the potcore.
The exact value of “S” with its spread is determined by a
number of variables, e.g.:
d
value of the adjustment resistor Rx,
the oscillator coil,
the metal of the actuator,
the material and shape of the housing.
Soldering recommendations
• Use normal 60/40 solder.
• Use a soldering iron with a fine point.
• Soldering time should be kept to a minimum, not
exceeding 2.5 s per soldering point (Tsld = 250 °C
maximum).
MSB318
• The substrate should preferably be pre-heated to a
temperature of 100 °C with a minimum of 80 °C and a
maximum of 125 °C.
Fig.5 Insertion of potcore in brass tube.
January 1994
5
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive
proximity detectors
OM3105P
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
January 1994
6
Philips Semiconductors
Preliminary specification
Hybrid integrated circuits for inductive
proximity detectors
OM3105P
NOTES
January 1994
7
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