OT415 [NXP]

SNUBBERLESS TRIAC;


型号：	OT415
厂家：	NXP
描述：	SNUBBERLESS TRIAC 三端双向交流开关
文件：	总13页 (文件大小：229K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

OT415

3Q Hi-Com Triac

25 July 2014

Preliminary data sheet

1. General description

Planar passivated high commutation three quadrant triac in a SOT78D (TO-220AB)

internally insulated plastic package intended for use in circuits where high static and

dynamic dV/dt and high dI/dt can occur. This "series C" triac will commutate the full RMS

current at the maximum rated junction temperature without the aid of a snubber. This

device has high T_joperating capability and an internally isolated mounting base.

2. Features and benefits

3Q technology for improved noise immunity

High commutation capability with maximum false trigger immunity

High surge capability

•

High T_j(max)

Less sensitive gate for high noise immunity

Isolated mounting base with 2500 V (RMS) isolation

Planar passivated for voltage ruggedness and reliability

Triggering in three quadrants only

High immunity to false turn-on by dV/dt

3. Applications

Electronic thermostats (heating and cooling)

High power motor controls

Rectifier-fed DC inductive loads e.g. DC motors and solenoids

•

4. Quick reference data

Table 1.

Symbol

Quick reference data

Parameter

Conditions

Min

Typ

Max

Unit

V_DRM

repetitive peak off-

state voltage

600

I_TSM

non-repetitive peak on- full sine wave; T_j(init)= 25 °C;

140

state current

t_p= 20 ms; Fig. 4; Fig. 5

T_j

junction temperature

RMS on-state current

150

°C

I_T(RMS)

full sine wave; T_mb≤ 116 °C; Fig. 1;

Fig. 2; Fig. 3

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NXP Semiconductors

OT415

3Q Hi-Com Triac

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Static characteristics

I_GT

gate trigger current

V_D= 12 V; I_T= 0.1 A; T2+ G+;

T_j= 25 °C; Fig. 7

V_D= 12 V; I_T= 0.1 A; T2+ G-;

T_j= 25 °C; Fig. 7

V_D= 12 V; I_T= 0.1 A; T2- G-;

T_j= 25 °C; Fig. 7

5. Pinning information

Table 2.

Pinning information

Symbol Description

Simplified outline

Graphic symbol

main terminal 1

main terminal 2

gate

sym051

n.c.

mounting base; isolated

2 3

TO-220AB (SOT78D)

6. Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

Version

SOT78D

OT415

TO-220AB

plastic single-ended package; isolated heatsink mounted; 1

mounting hole; 3-lead TO-220

OT415

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OT415

3Q Hi-Com Triac

7. Limiting values

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_DRM

Parameter

Conditions

Min

Max

600

Unit

repetitive peak off-state voltage

RMS on-state current

I_T(RMS)

full sine wave; T_mb≤ 116 °C; Fig. 1;

Fig. 2; Fig. 3

I_TSM

non-repetitive peak on-state

current

full sine wave; T_j(init)= 25 °C;

t_p= 20 ms; Fig. 4; Fig. 5

140

153

full sine wave; T_j(init)= 25 °C;

t_p= 16.7 ms

I²t

I²t for fusing

A²s

A/µs

t_p= 10 ms; SIN

dI_T/dt

I_GM

rate of rise of on-state current

peak gate current

I_T= 20 A; I_G= 0.2 A; dI_G/dt = 0.2 A/µs

100

P_GM

P_G(AV)

T_stg

T_j

peak gate power

average gate power

storage temperature

junction temperature

over any 20 ms period

0.5

150

-40

°C

003aab813

003aab814

I_T(RMS)

(A)

I_T(RMS)

(A)

-50

10^-2

10^-1

100

150

T_mb(°C)

surge duration (s)

f = 50 Hz; T_mb= 116 °C

Fig. 2. RMS on-state current as a function of mounting

base temperature; maximum values

Fig. 1. RMS on-state current as a function of surge

duration; maximum values

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OT415

3Q Hi-Com Triac

003aab810

α= 180°

conduction form

P_tot

angle

factor

(W)

(degrees)

120°

90°

60°

30°

120

180

2.8

2.2

1.9

1.57

I_T(RMS)(A)

α = conduction angle

a = form factor = I_T(RMS)/ I_T(AV)

Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values

003aab811

160

I_TSM

(A)

120

TSM

1/f

= 25 °C max

j(init)

10²

10³

number of cycles (n)

f = 50 Hz

Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum

values

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OT415

3Q Hi-Com Triac

003aab812

10³

I_TSM

(A)

(1)

10²

TSM

j(init)

= 25 °C max

10^-5

10^-4

10^-3

10^-2

10^-1

t_p(s)

t_p≤ 20 ms

(1) dI_T/dt limit

Fig. 5. Non-repetitive peak on-state current as a function of pulse duration; maximum values

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OT415

3Q Hi-Com Triac

8. Thermal characteristics

Table 5.

Symbol

Thermal characteristics

Parameter

Conditions

Min

Typ

Max

Unit

R_th(j-mb)

thermal resistance

from junction to

mounting base

full cycle; Fig. 6

2.1

K/W

R_th(j-a)

thermal resistance

from junction to

ambient

in free air

K/W

003aab666

I_T

(A)

(1)

(2)

(3)

0.5

1.5

V_T(V)

V_o= 1.024 V; R_s= 0.021 Ω

(1) T_j= 125 °C; typical values

(2) T_j= 125 °C; maximum values

(3) T_j= 25 °C; maximum values

Fig. 6. On-state current as a function of on-state voltage

9. Isolation characteristics

Table 6.

Symbol

Isolation characteristics

Parameter

Conditions

Min

Typ

Max

Unit

V_isol(RMS)

RMS isolation voltage from all terminals to external heatsink;

sinusoidal waveform; clean and dust

free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %;

T_mb= 25 °C

2500

C_isol

isolation capacitance

from main terminal 2 to external

heatsink; f = 1 MHz; T_mb= 25 °C

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OT415

3Q Hi-Com Triac

10. Characteristics

Table 7.

Symbol

Characteristics

Parameter

Conditions

Min

Typ

Max

Unit

Static characteristics

I_GTgate trigger current

V_D= 12 V; I_T= 0.1 A; T2+ G+;

T_j= 25 °C; Fig. 7

V_D= 12 V; I_T= 0.1 A; T2+ G-;

T_j= 25 °C; Fig. 7

V_D= 12 V; I_T= 0.1 A; T2- G-;

T_j= 25 °C; Fig. 7

I_L

latching current

V_D= 12 V; I_G= 0.1 A; T2+ G+;

T_j= 25 °C; Fig. 8

V_D= 12 V; I_G= 0.1 A; T2+ G-;

T_j= 25 °C; Fig. 8

V_D= 12 V; I_G= 0.1 A; T2- G-;

T_j= 25 °C; Fig. 8

I_H

holding current

V_D= 12 V; T_j= 25 °C; Fig. 9

I_T= 18 A; T_j= 25 °C; Fig. 10

1.6

V_T

V_GT

on-state voltage

gate trigger voltage

1.3

0.8

V_D= 12 V; I_T= 0.1 A; T_j= 25 °C;

Fig. 11

V_D= 400 V; I_T= 0.1 A; T_j= 150 °C;

Fig. 11

0.25

0.4

I_D

off-state current

V_D= 600 V; T_j= 125 °C

V_D= 600 V; T_j= 150 °C

0.1

0.4

0.5

Dynamic characteristics

dV_D/dt

rate of rise of off-state V_DM= 402 V; T_j= 125 °C; (V_DM= 67%

500

300

V/µs

A/ms

voltage

of V_DRM); exponential waveform; gate

open circuit

V_DM= 402 V; T_j= 150 °C; (V_DM= 67%

of V_DRM); exponential waveform; gate

open circuit

dI_com/dt

rate of change of

V_D= 400 V; T_j= 125 °C; I_T(RMS)= 12 A;

dV_com/dt = 20 V/µs; (snubberless

condition); gate open circuit

commutating current

V_D= 400 V; T_j= 150 °C; I_T(RMS)= 12 A;

dV_com/dt = 20 V/µs; (snubberless

condition); gate open circuit

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OT415

3Q Hi-Com Triac

001aag166

001aag165

(1)

(2)

L(25°C)

GT(25°C)

(3)

- 50

100

150

100

150

T (°C)

(1) T2- G-

(2) T2+ G-

Fig. 8. Normalized latching current as a function of

junction temperature

(3) T2+ G+

Fig. 7. Normalized gate trigger current as a function of

junction temperature

003aab666

001aag167

I_T

(A)

H(25°C)

(1)

(2)

(3)

- 50

0.5

1.5

100

150

T (°C)

V_T(V)

V_o= 1.024 V; R_s= 0.021 Ω

(1) T_j= 125 °C; typical values

Fig. 9. Normalized holding current as a function of

junction temperature

(2) T_j= 125 °C; maximum values

(3) T_j= 25 °C; maximum values

Fig. 10. On-state current as a function of on-state

voltage

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OT415

3Q Hi-Com Triac

001aag168

1.6

GT(25°C)

1.2

0.8

0.4

- 50

100

150

T (°C)

Fig. 11. Normalized gate trigger voltage as a function of junction temperature

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OT415

3Q Hi-Com Triac

11. Package outline

Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220

SOT78D

mounting

base

10 mm

scale

DIMENSIONS (mm are the original dimensions)

ref

UNIT

ref

4.7

4.3

1.40

1.25

0.9

0.6

1.4

1.1

1.72

1.32

0.6

0.4

16.0

15.2

10.3

9.7

14.0

12.8

3.7

3.5

2.6

2.2

3.0

2.7

6.5

2.54

3.0

0.2

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

07-04-04

07-07-10

SOT78D

TO-220

Fig. 12. Package outline TO-220AB (SOT78D)

OT415

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OT415

3Q Hi-Com Triac

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation -

lost profits, lost savings, business interruption, costs related to the removal

or replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

12. Legal information

12.1 Data sheet status

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Document

Product

Definition

status [1][2] status [3]

Objective

[short] data

sheet

Development This document contains data from

the objective specification for product

development.

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Preliminary

[short] data

sheet

Qualification This document contains data from the

preliminary specification.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Product

[short] data

sheet

Production

This document contains the product

specification.

[1] Please consult the most recently issued document before initiating or

completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the Internet at URL http://www.nxp.com.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

12.2 Definitions

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modifications or additions.

NXP Semiconductors does not give any representations or warranties as to

the accuracy or completeness of information included herein and shall have

no liability for the consequences of use of such information.

Customers are responsible for the design and operation of their

applications and products using NXP Semiconductors products, and NXP

Semiconductors accepts no liability for any assistance with applications or

customer product design. It is customer’s sole responsibility to determine

whether the NXP Semiconductors product is suitable and fit for the

customer’s applications and products planned, as well as for the planned

application and use of customer’s third party customer(s). Customers should

provide appropriate design and operating safeguards to minimize the risks

associated with their applications and products.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences

of use of such information.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default

in the customer’s applications or products, or the application or use by

customer’s third party customer(s). Customer is responsible for doing all

necessary testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications

and the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the

relevant full data sheet, which is available on request via the local NXP

Semiconductors sales office. In case of any inconsistency or conflict with the

short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product

is deemed to offer functions and qualities beyond those described in the

Product data sheet.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

12.3 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not give

any representations or warranties, expressed or implied, as to the accuracy

or completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

OT415

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NXP Semiconductors

OT415

3Q Hi-Com Triac

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor

tested in accordance with automotive testing or application requirements.

NXP Semiconductors accepts no liability for inclusion and/or use of non-

automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards,

customer (a) shall use the product without NXP Semiconductors’ warranty

of the product for such automotive applications, use and specifications, and

(b) whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

12.4 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-

CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight,

MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug,

TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP

Semiconductors N.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

OT415

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NXP Semiconductors

OT415

3Q Hi-Com Triac

13. Contents

General description ............................................... 1

Features and benefits ............................................1

Applications ........................................................... 1

Quick reference data ............................................. 1

Pinning information ...............................................2

Ordering information .............................................2

Limiting values .......................................................3

Thermal characteristics .........................................6

Isolation characteristics ........................................6

Characteristics .......................................................7

Package outline ................................................... 10

Legal information .................................................11

Data sheet status ............................................... 11

Definitions ...........................................................11

Disclaimers .........................................................11

Trademarks ........................................................ 12

12.1

12.2

12.3

12.4

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 July 2014

OT415

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Preliminary data sheet

25 July 2014

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OT415 [NXP]

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