P308G002A4 [NXP]
TRANSISTOR SMALL SIGNAL, FET, PLASTIC, SOT-500, 2 PIN, FET General Purpose Small Signal;型号: | P308G002A4 |
厂家: | NXP |
描述: | TRANSISTOR SMALL SIGNAL, FET, PLASTIC, SOT-500, 2 PIN, FET General Purpose Small Signal 光电二极管 |
文件: | 总8页 (文件大小:40K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
P304/P308/P310G002 family
Smart eID
Rev. 01 — 29 July 2008
Product short data sheet
1. General description
1.1 Smart eID family approach
The Smart eID family members feature a modular set of devices with:
• 4 KB to 10 KB EEPROM
• Secured triple-DES coprocessor
• ISO/IEC 14443 type A Contactless Interface Unit (CIU)
• EEPROM with minimum 100000 cycles endurance and minimum 20 years retention
time
• Pre-installed applications compliant to ICAO document 9303
• Command set compliant to ISO/IEC 7816-4
• Compliant to ISO/IEC 18013-3 (using BAP in configuration 1)
1.2 Smart eID family properties
Smart eID is designed to complement general-purpose smart card controllers in the NXP
Semiconductors range of identification products for eGovernment applications. It is an
“all-in” functionality product supporting ISO/IEC 7816 data structures, including those
defined in ICAO document 9303. Smart eID is designed for low-end configurations in
identification cards, driving licences or other eGovernment applications. The learning
curve for implementers is quick, as the product is based on well-known standards. By
using Smart eID, applications can be developed and validated within days. The Smart eID
family can be regarded as low-end products due to their limited memory size. Triple-DES
symmetric cryptography and the ISO/IEC 14443 type A contactless interface are
supported.
The file system allows the creation of pre-configured applications that provide data groups
within the application. Access to these data groups can be according to one of three
modes: completely open (“LDS” – according to the Logical Data Structure defined in ICAO
document 9303), protected with Basic Access Control and Secure Messaging (“BAC” – as
defined in ICAO document 9303). A third configuration provides an additional mechanism
to update data groups after issuing the electronic document to the holder as well as a
feature to protect against cloning. These additional features make Smart eID particularly
useful for ID cards, driving licences, and other eGovernment applications.
Compliance to existing MRTD (Machine Readable Travel Document) inspection
equipment can be obtained by configuration settings according to ICAO document 9303.
For driving licence applications, it can be configured to comply with ISO/IEC 18013-3,
using BAP (Basic Access Protocol) security in configuration 1.
P304/P308/P310G002 family
NXP Semiconductors
Smart eID
1.3 Naming convention
Table 1.
Naming convention
P3xxG002zz Smart eID platform
xx
zz
amount of non-volatile memory in KB, increasing count for further product options
package type
1.4 Architecture overview
Every member of the Smart eID product family consists of hardware and software
components. The overall deliverable is a module for integration into a contactless smart
card or other contactless device. This module comes pre-configured with application
software and is ready to be personalized by NXP Semiconductors direct or indirect
customers.
1.4.1 Hardware platform
Every member of the Smart eID product family uses a proven, NXP-developed smart card
processor as the physical basis for its implementation. Chips are packaged in standard
modules ready to be bonded to an antenna coil and embedded in contactless cards.
NXP Semiconductors reserves the right to change aspects of manufacturing technology,
including, but not limited to: silicon chip design, silicon die size, choice of silicon
technology, silicon chip packaging. All aspects of the hardware platform relevant to NXP
Semiconductors direct or indirect customers are documented in the full data sheet and
other documents available for the Smart eID product family and its individual members.
2. Features
2.1 Standard family features
I EEPROM: choice of 4 KB, 8 KB, 10 KB
N Data retention time: 20 years minimum
N Endurance: 100000 cycles minimum
I ISO/IEC 7816 LDS-compatible file system implementation supporting open access,
BAC and BAC plus operating modes
I Configurable authentication and security settings to match customer system
requirements
I Configurable access conditions for elementary files
I Possible activation of the UPDATE BINARY command in BAC plus operating mode
I Life cycle management system
I ISO/IEC 7816-4 compliant subset of the commands for file manipulation
I Proprietary commands for easier personalization and transport key exchange
I Flexible support for one fixed functionality ID capable application
I Flexible file system based on ICAO LDS structure
P304_P308_P310G002_FAM_SDS_1
© NXP B.V. 2008. All rights reserved.
Product short data sheet
Rev. 01 — 29 July 2008
2 of 8
P304/P308/P310G002 family
NXP Semiconductors
Smart eID
2.2 Product-specific family features
I P304G002 and P308G002:
N 7-byte unique identifier (cascade level two according to ISO/IEC 14443-3)
I P310G002:
N 4-byte unique identifier
N With MIFARE 4 KB emulation
2.3 Security features
I Support for ICAO BAC and ISO/IEC 8013-3 in BAP configuration 1
I Self-securing file system
I Data encryption on RF channel with replay attack protection
I Hardware DES using 112-bit keys, featuring key version
I Data authenticity by 8 bytes CMAC
I Authentication on application level
I Hardware exception sensors
2.4 RF interface: ISO/IEC 14443 type A
I Contactless transmission of data and powered by the RF field (no battery needed)
I Operating distance: up to 100 mm (depending on antenna geometry)
I Operating frequency: 13.56 MHz
I Fast data transfer: 106 kbit/s, 212 kbit/s, 424 kbit/s
I High data integrity: 16-bit CRC, parity, bit coding, bit counting; CMAC; MAC
I True deterministic anticollision mechanism
I Compliant to ISO/IEC 14443-4 type A protocol
2.5 Supported command set
I SELECT FILE
I READ BINARY
I UPDATE BINARY
I GET CHALLENGE
I MUTUAL AUTHENTICATE
I GET DATA
I INTERNAL AUTHENTICATE
I CREATE FILE
I ACTIVATE FILE
I LOAD IMAGE (proprietary)
I VERIFY IMAGE (proprietary)
P304_P308_P310G002_FAM_SDS_1
© NXP B.V. 2008. All rights reserved.
Product short data sheet
Rev. 01 — 29 July 2008
3 of 8
P304/P308/P310G002 family
NXP Semiconductors
Smart eID
3. Applications
I Driving licence
I eGovernment
I National identity card
I Corporate card
I Vehicle registration sticker
4. Quick reference data
Table 2.
Symbol Parameter
Ciss input capacitance
Quick reference data
Conditions
Min
Typ
Max Unit
measured on pads LA and LB;
test frequency at 17.4 MHz;
-
13.5
-
pF
T
amb = 25 °C; VDD = 0 V
operating frequency measured on pads LA and LB;
amb = 25 °C
foper
-
13.56 -
MHz
T
5. Ordering information
Table 3.
Ordering information
Type number Package[1]
Name
Description
Version
SOT500-2
P304G002A4
P308G002A4
P310G002A4
PLLMC[2] plastic leadless module carrier package; 35 mm
wide tape
[1] For further package options, please contact your local NXP sales representative or to the NXP
Semiconductors sales department. To obtain NXP Semiconductors sales office addresses, please e-mail
salesaddresses@nxp.com.
[2] This package is also known as MOB4.
Table 4.
Product types and features
Product
type
EEPROM MIFARE 4 KB Coprocessor
ISO/IEC 7816 Interface option
IO pads
(KB)
emulation
DES
yes
yes
yes
AES
no
P304G002
P308G002
P310G002
4
no
2
2
2
contactless interface
contactless interface
contactless interface
8
no
no
10
yes
no
P304_P308_P310G002_FAM_SDS_1
© NXP B.V. 2008. All rights reserved.
Product short data sheet
Rev. 01 — 29 July 2008
4 of 8
P304/P308/P310G002 family
NXP Semiconductors
Smart eID
6. Functional diagram
Data stored in Smart eID EEPROM
File system
Applications - ICAO 9303 based
Operating system
LA
LB
Smart eID hardware
loop antenna
(size and proportions
not to scale)
Smart eID
physical module
Smart eID
logical content
001aai433
Fig 1. Functional diagram of P304/P308/P310G002 family
7. Limiting values
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
SS (ground = 0 V).
Symbol Parameter
Limiting values
V
Conditions
Min
Max
Unit
[1]
Vesd
electrostatic discharge
voltage
pads VDD, VSS, CLK,
RST_N, IO1, IO2, IO3
-
±4.0
kV
[1]
[2]
[3]
pads LA, LB
-
-
-
±2.0
kV
W
Ptot
Tstg
total power dissipation
storage temperature
1
-
°C
[1] MIL Standard 883-D method 3015; human body model; C = 100 pF, R = 1.5 kΩ; Tamb = −25 °C to +85 °C.
[2] Depending on appropriate thermal resistance of the package.
[3] Depending on delivery type, refer to NXP Semiconductors General Specification for 8 inch Wafers and to
NXP Semiconductors Contact & Dual Interface Chip Card Module Specification.
P304_P308_P310G002_FAM_SDS_1
© NXP B.V. 2008. All rights reserved.
Product short data sheet
Rev. 01 — 29 July 2008
5 of 8
P304/P308/P310G002 family
NXP Semiconductors
Smart eID
8. Abbreviations
Table 6.
Abbreviations
Description
Acronym
AES
BAC
BAP
CMAC
CRC
DES
eID
Advanced Encryption Standard
Basic Access Control
Basic Access Protocol
Cryptographic MAC
Cyclic Redundancy Check
Data Encryption Standard
electronic Identity Document
Electrically Erasable Programmable Read-Only Memory
Film Frame Carrier
EEPROM
FFC
ICAO
IEC
International Civil Aviation Organization
International Electrotechnical Commission
Input Output
IO
ISO
International Standardization Organization
1024 bytes
KB
LDS
Logical Data Structure
MAC
RF
Message Authentication Code
Radio Frequency
9. Revision history
Table 7.
Revision history
Document ID
Release date Data sheet status
Change notice
Supersedes
P304_P308_P310G002_FAM_SDS_1 20080729
Product short data sheet
-
-
P304_P308_P310G002_FAM_SDS_1
© NXP B.V. 2008. All rights reserved.
Product short data sheet
Rev. 01 — 29 July 2008
6 of 8
P304/P308/P310G002 family
NXP Semiconductors
Smart eID
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
MIFARE — is a trademark of NXP B.V.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
P304_P308_P310G002_FAM_SDS_1
© NXP B.V. 2008. All rights reserved.
Product short data sheet
Rev. 01 — 29 July 2008
7 of 8
P304/P308/P310G002 family
NXP Semiconductors
Smart eID
12. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
1.4.1
Smart eID family approach . . . . . . . . . . . . . . . . 1
Smart eID family properties . . . . . . . . . . . . . . . 1
Naming convention . . . . . . . . . . . . . . . . . . . . . . 2
Architecture overview . . . . . . . . . . . . . . . . . . . . 2
Hardware platform . . . . . . . . . . . . . . . . . . . . . . 2
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Standard family features. . . . . . . . . . . . . . . . . . 2
Product-specific family features . . . . . . . . . . . . 3
Security features. . . . . . . . . . . . . . . . . . . . . . . . 3
RF interface: ISO/IEC 14443 type A. . . . . . . . . 3
Supported command set . . . . . . . . . . . . . . . . . 3
2.1
2.2
2.3
2.4
2.5
3
4
5
6
7
8
9
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Quick reference data . . . . . . . . . . . . . . . . . . . . . 4
Ordering information. . . . . . . . . . . . . . . . . . . . . 4
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
10
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
10.1
10.2
10.3
10.4
11
12
Contact information. . . . . . . . . . . . . . . . . . . . . . 7
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 July 2008
Document identifier: P304_P308_P310G002_FAM_SDS_1
相关型号:
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