PBYR240CT [NXP]
Rectifier diodes Schottky barrier; 整流二极管肖特基势垒
| 型号： | PBYR240CT |
| 厂家： | 
NXP |
| 描述： | Rectifier diodes Schottky barrier |
| 文件： | 总5页 (文件大小：43K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Philips Semiconductors
Product specification
Rectifier diodes
Schottky barrier
PBYR245CT series
FEATURES
SYMBOL
QUICK REFERENCE DATA
• Low forward volt drop
• Fast switching
• Reverse surge capability
• High thermal cycling performance
• low profile surface mounting
package
VR = 40 V/ 45 V
IO(AV) = 2 A
a1
1
a2
3
k
2
VF ≤ 0.45V
GENERAL DESCRIPTION
PINNING
SOT223
Dual, common cathode schottky
PIN
DESCRIPTION
anode 1
cathode
4
rectifier diodes in
a
plastic
envelope. Intended for use as
output rectifiers in low voltage, high
frequency switched mode power
supplies.
1
2
3
anode 2
cathode
The PBYR245CT series is supplied
in the surface mounting SOT223
package.
tab
2
3
1
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS
MIN.
MAX.
UNIT
PBYR2
40CT
45CT
VRRM
VRWM
Peak repetitive reverse
-
-
40
45
45
45
V
V
voltage
Working peak reverse
voltage
Continuous reverse voltage
40
40
VR
T
sp ≤ 74 ˚C
-
-
V
A
IO(AV)
Average rectified output
current (both diodes
conducting)
square wave; δ = 0.5; Tsp ≤ 119 ˚C
2
2
IFRM
IFSM
Repetitive peak forward
current per diode
square wave; δ = 0.5; Tsp ≤ 119 ˚C
-
A
Non-repetitive peak forward t = 10 ms
-
-
6
6.6
A
A
current per diode
t = 8.3 ms
sinusoidal; Tj = 125 ˚C prior to
surge; with reapplied VRRM(max)
pulse width and repetition rate
limited by Tj max
IRRM
Tj
Peak repetitive reverse
surge current per diode
Operating junction
temperature
-
-
1
A
150
150
˚C
˚C
Tstg
Storage temperature
- 40
THERMAL RESISTANCES
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Rth j-a
Thermal resistance junction pcb mounted, minimum footprint
to ambient pcb mounted, pad area as in fig:1
-
-
156
70
-
-
K/W
K/W
July 1998
1
Rev 1.400
Philips Semiconductors
Product specification
Rectifier diodes
Schottky barrier
PBYR245CT series
ELECTRICAL CHARACTERISTICS
Tj = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
VF
IR
Forward voltage
Reverse current
IF = 1 A; Tj = 125˚C
IF = 2 A
-
-
-
-
-
0.41 0.45
V
V
mA
mA
pF
0.58
0.03
1.5
0.7
0.2
10
-
VR = VRWM
VR = VRWM; Tj = 100˚C
VR = 5 V; f = 1 MHz, Tj = 25˚C to 125˚C
Cd
Junction capacitance
60
PRINTED CIRCUIT BOARD
Dimensions in mm.
36
18
60
4.5
4.6
9
10
7
15
50
Fig.1. PCB for thermal resistance and power rating for SOT223.
PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 µm thick).
July 1998
2
Rev 1.400
Philips Semiconductors
Product specification
Rectifier diodes
Schottky barrier
PBYR245CT series
Forward dissipation, PF (W)
1
Reverse current, IR (mA)
10
1
Vo = 0.27 V
Rs = 0.183 Ohms
125 C
100 C
0.8
0.6
D = 1.0
0.5
0.2
0.1
0.1
75 C
50 C
0.4
0.2
0
t
T
p
tp
I
D =
0.01
Tj = 25 C
t
T
0.001
0
0.5
1
1.5
0
25
50
Average forward current, IF(AV) (A)
Reverse voltage, VR (V)
Fig.2. Maximum forward dissipation PF = f(IF(AV)) per
diode; square current waveform where
Fig.5. Typical reverse leakage current per diode;
IR = f(VR); parameter Tj
IF(AV) =IF(RMS) x √D.
Forward dissipation, PF (W)
Cd / pF
1
0.8
0.6
0.4
0.2
0
1000
100
10
Vo = 0.27 V
Rs = 0.183 Ohms
a = 1.57
1.9
2.2
2.8
4
1
10
100
0
0.2
0.4
0.6
0.8
1
Average forward current, IF(AV) (A)
VR / V
Fig.3. Maximum forward dissipation PF = f(IF(AV)) per
diode; sinusoidal current waveform where a = form
Fig.6. Typical junction capacitance per diode;
Cd = f(VR); f = 1 MHz; Tj = 25˚C to 125 ˚C.
factor = IF(RMS) / IF(AV)
.
Transient thermal impedance, Zth j-sp (K/W)
100
Forward current, IF (A)
3
2.5
2
Tj = 25 C
Tj = 125 C
10
1
typ
1.5
1
max
t
p
t
p
P
0.1
D =
D
T
0.5
0
t
T
0.01
1us
10us 100us 1ms
10ms 100ms
1s
10s
0
0.2
0.4
0.6
0.8
1
1.2
1.4
pulse width, tp (s)
Forward voltage, VF (V)
Fig.4. Typical and maximum forward characteristic
IF = f(VF); parameter Tj
Fig.7. Transient thermal impedance; per diode;
Zth j-sp = f(tp).
July 1998
3
Rev 1.400
Philips Semiconductors
Product specification
Rectifier diodes
Schottky barrier
PBYR245CT series
MECHANICAL DATA
Dimensions in mm
Net Mass: 0.11 g
6.7
6.3
B
3.1
2.9
0.32
0.24
0.2
M
A
A
4
0.10
0.02
7.3
6.7
3.7
3.3
16
max
13
2
3
1
10
max
1.05
0.85
0.80
0.60
2.3
1.8
max
M
0.1
(4x)
B
4.6
Fig.8. SOT223 surface mounting package.
Notes
1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines".
Order code: 9397 750 00505.
2. Epoxy meets UL94 V0 at 1/8".
July 1998
4
Rev 1.400
Philips Semiconductors
Product specification
Rectifier diodes
Schottky barrier
PBYR245CT series
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
July 1998
5
Rev 1.400
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