PCA9507D,118 [NXP]

PCA9507 - 2-wire serial bus extender for HDMI DDC I2C-bus and SMBus SOIC 8-Pin;
PCA9507D,118
型号: PCA9507D,118
厂家: NXP    NXP
描述:

PCA9507 - 2-wire serial bus extender for HDMI DDC I2C-bus and SMBus SOIC 8-Pin

PC 光电二极管 接口集成电路
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PCA9507  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
Rev. 01 — 7 February 2008  
Product data sheet  
1. General description  
The PCA9507 is a 2-wire serial bus extender providing 3.3 V to 5 V level shift that allows  
up to 18 meters bus extension for reliable DDC, I2C-bus or SMBus applications. While  
retaining all the operating modes and features of the I2C-bus system during the level  
shifts, it also permits extension of the I2C-bus by providing bidirectional buffering for both  
the data (SDA) and the clock (SCL) line as well as the rise time accelerator on port A  
enabling the bus to drive a load up to 1400 pF or distance of 18 m on port A, and 400 pF  
on port B. Using the PCA9507 enables the system designer to isolate bus capacitance to  
meet HDMI DDC version 1.3 distance specification. The SDA and SCL pins are  
overvoltage tolerant and are high-impedance when the PCA9507 is unpowered.  
The port B drivers with static level offset behave much like the drivers on the PCA9515  
device, while the port A drivers integrate the rise time accelerator, sink more current and  
eliminate the static offset voltage. This results in a LOW on port B translating into a nearly  
0 V LOW on port A. The static level offset design of the port B I/O drivers prevent them  
from being connected to another device that has rise time accelerator including the  
PCA9510, PCA9511, PCA9512, PCA9513, PCA9514, PCA9515, PCA9516A, PCA9517  
(B-side), or PCA9518. The port A sides of two or more PCA9507s can be connected  
together, however, to allow a star topography with port A on the common bus, and port A  
can be connected directly to any other buffer with static or dynamic offset voltage. Multiple  
PCA9507s can be connected in series, port A to port B, with no build-up in offset voltage  
with only time of flight delays to consider. Rise time accelerator on port A is turned on  
when input threshold is above 0.3VCC(A)  
.
The PCA9507 drivers are not enabled unless VCC(A) and VCC(B) are above 2.7 V. The EN  
pin can also be used to turn the drivers on and off under system control. Caution should  
be observed to only change the state of the enable pin when the bus is idle. The output  
pull-down on the port B internal buffer LOW is set for approximately 0.5 V, while the input  
threshold of the internal buffer is set about 70 mV lower (0.43 V). When the port B I/O is  
driven LOW internally, the LOW is not recognized as a LOW by the input. This prevents a  
lock-up condition from occurring.  
2. Features  
I 2 channel, bidirectional buffer isolates capacitance allowing 1400 pF on port A and  
400 pF on port B  
I Exceeds 18 meters (above the maximum distance for HDMI DDC)  
I Rise time accelerator and normal I/O on port A  
I Static level offset on port B  
I Voltage level translation from 2.7 V to 5.5 V  
I Upgrade replacement over PCA9517 for cable application  
 
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
I I2C-bus, SMBus and DDC-bus compatible  
I Active HIGH buffer enable input  
I Open-drain input/outputs  
I Lock-up free operation  
I Supports arbitration and clock stretching across the repeater  
I Accommodates Standard-mode and Fast-mode I2C-bus devices and multiple masters  
I Powered-off high-impedance I2C-bus pins  
I Port A operating supply voltage range of 2.7 V to 5.5 V  
I Port B operating supply voltage range of 2.7 V to 5.5 V  
I 5 V tolerant I2C-bus and enable pins  
I 0 Hz to 400 kHz clock frequency (the maximum system operating frequency may be  
less than 400 kHz because of the delays added by the repeater)  
I ESD protection exceeds 5000 V HBM per JESD22-A114, 400 V MM per  
JESD22-A115, and 1000 V CDM per JESD22-C101  
I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA  
I Packages offered: SO8 and TSSOP8  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Topside  
mark  
Package  
Name  
Description  
Version  
PCA9507D  
PCA9507 SO8  
plastic small outline package; 8 leads;  
body width 3.9 mm  
SOT96-1  
PCA9507DP  
9507  
TSSOP8[1] plastic thin shrink small outline package; SOT505-1  
8 leads; body width 3 mm  
[1] Also known as MSOP8.  
4. Functional diagram  
V
V
CC(B)  
CC(A)  
V
CC(A)  
DYNAMIC  
PULL-UP  
SDAA  
SCLA  
SDAB  
V
CC(A)  
DYNAMIC  
PULL-UP  
SCLB  
EN  
V
CC(B)  
100 k  
PCA9507  
002aad401  
GND  
Fig 1. Functional diagram of PCA9507  
Rev. 01 — 7 February 2008  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
2 of 20  
 
 
 
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
5. Pinning information  
5.1 Pinning  
1
2
3
4
8
7
6
5
V
V
CC(B)  
CC(A)  
1
2
3
4
8
7
6
5
V
V
CC(B)  
CC(A)  
SCLA  
SDAA  
GND  
SCLB  
SDAB  
EN  
SCLA  
SDAA  
GND  
SCLB  
SDAB  
EN  
PCA9507D  
PCA9507DP  
002aad400  
002aad399  
Fig 2. Pin configuration for SO8  
Fig 3. Pin configuration for TSSOP8  
5.2 Pin description  
Table 2.  
Symbol  
Pin description  
Pin Description  
port A supply voltage (2.7 V to 5.5 V)  
VCC(A)  
SCLA  
1
2
serial clock port A bus with rise time accelerator for DDC line or cable,  
5 V tolerant  
SDAA  
3
serial data port A bus with rise time accelerator for DDC line or cable,  
5 V tolerant  
GND  
EN  
4
5
6
7
8
supply ground (0 V)  
active HIGH buffer enable input  
SDAB  
SCLB  
VCC(B)  
serial data port B bus with static level offset, 5 V tolerant  
serial clock port B bus with static level offset, 5 V tolerant  
port B supply voltage (2.7 V to 5.5 V)  
6. Functional description  
Refer to Figure 1 “Functional diagram of PCA9507”.  
The PCA9507 consists of a pair of bidirectional open-drain I/Os specifically designed to  
support up-translation/down-translation between low voltages (as low as 2.7 V) and a  
3.3 V or 5 V I2C-bus and SMBus. The device contains a rise time accelerator on port A  
that enables the device to drive a long cable or a heavier capacitive load for DDC, I2C-bus  
and SMBus applications. With dual supply rails, the device translates from voltage ranges  
2.7 V to 5.5 V down to a voltage as low as 2.7 V without degradation of system  
performance. All I/Os are overvoltage tolerant to 5.5 V even when the device is  
un-powered (VCC(B) and/or VCC(A) = 0 V).  
The PCA9507 includes a power-up circuit that keeps the output drivers turned off until  
VCC(A) and VCC(B) rise above 2.7 V. VCC(A) and VCC(B) can be applied in any sequence at  
power-up.  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
3 of 20  
 
 
 
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
V
CC(B)  
port B  
port A  
0.3V  
CC(B)  
0.5 V  
0.4 V  
0 V  
0 V  
V
CC(A)  
0.7V  
CC(A)  
0.3V  
CC(A)  
002aad435  
Fig 4. Port A and port B I/O levels  
When port B falls first and goes below 0.3VCC(B) the port A driver is turned on and port A  
pulls down to 0 V. As port A falls below 0.3VCC(A) the port B pull-down pulls port B down to  
about 0.5 V. Port B falls below 0.4 V because it is not possible to know who is driving the  
port A LOW, so the PCA9507 direction control assumes that port A is controlling the part  
unless port B falls below 0.4 V. When the port B voltage is 0.4 V the port A driver of the  
PCA9507 is on and holds port A down nearly 0 V. As the port B voltage rises because the  
external driver turns off, the port B voltage rises up to ~0.5 V because port A is LOW;  
once port B rises to ~0.5 V the port A pull-down driver turns off. Then port A rises with a  
rise time determined by the RC of port A when it crosses the port A threshold ~0.3VCC(A)  
the port B driver is turned off and the rising edge accelerator is turned on, which causes a  
faster rising edge until it reaches the turn-off point for the rising edge accelerator  
~0.7VCC(A). Then it continues to rise at the slower rate determined by the RC of port A.  
When the port B driver turns off, port B rises with the RC of port B.  
VCC(A) powers the port A I/Os and the 0.3VCC(A) reference for port A as well as the port A  
power good detect circuit. VCC(B) powers the rest of the chip including the port B I/Os and  
the support functions. Figure 4 illustrates the threshold and I/O levels for port A and  
port B.  
6.1 Enable  
The EN pin is active HIGH with an internal ~100 kpull-up to VCC(B) and allows the user  
to select when the buffer is active. This can be used to isolate the line when the HDMI  
DDC transmitter or receiver is not ready, or from a badly behaved slave on power-up until  
after the system power-up reset. It should never change state during an I2C-bus operation  
because disabling during a bus operation will hang the bus and enabling part way through  
a bus cycle could confuse the I2C-bus parts being enabled. The enable pin should only  
change state when the global bus and the buffer port are in an idle state to prevent system  
failures.  
6.2 Rise time accelerators  
PCA9507 has rise time accelerators on port A only. During port A positive bus transitions  
a current source is switched on to quickly slew the SDAA and SCLA lines HIGH once the  
input level of 0.3VCC(A) is exceeded for the PCA9507 and turns off as the 0.7VCC(A)  
voltage is approached.  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
4 of 20  
 
 
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
6.3 Resistor pull-up value selection  
6.3.1 Port A (SDAA and SCLA)  
SDAA and SCLA are open-drain I/O that have rise time accelerators and strong pull-down.  
When the inputs transition above 0.3VCC(A), the rise time accelerator activates and boosts  
the pull-up current during rising edge to meet the I2C-bus rise time specification when the  
device drives a long cable or heavier capacitance load. The strong pull-down enables the  
output to drive to nearly zero voltage for logic LOW. The selection for pull-up resistors are  
defined in the HDMI DDC specification shown in Table 3. For HDMI transmitter  
applications like digital video player, recorder, or set-top box, the pull-up resistor is in the  
range of 1.5 kto 2 k. For HDMI receiver applications like in LCD TV or video card, the  
pull-up resistor is 47 kon the SCLA line, and there is no pull-up on the SDAA line.  
Please refer to Table 3, Figure 7 and Figure 8 for more details. Figure 5 shows the port A  
pull-up resistor values (in k) versus capacitance load (in nF) for 5 V supply voltage  
complied with 1 µs rise time per I2C-bus Standard-mode specification. The graph  
contrasts a shaded and unshaded region. Any resistor value chosen within the unshaded  
region would comply with 1 µs rise time, while any value chosen in the shaded region  
would not.  
Table 3.  
Pin  
HDMI DDC pull-up resistors specification  
Where  
Minimum  
1.5 k  
-
Maximum  
2.0 kΩ  
-
SDAA  
at the source (DVD/STB)  
at the sink (LCD TV)  
SCLA  
at the source (DVD/STB)  
at the sink (LCD TV)  
1.5 kΩ  
2.0 kΩ  
47 kΩ ± 10 %  
002aad620  
10.5  
R
PU  
(k)  
8.5  
6.5  
4.5  
2.5  
0.5  
does not comply with  
1 µs rise time  
complies with  
1 µs rise time  
0
1.0  
2.0  
3.0  
4.0  
C
L
(nF)  
rise time = 1 µs; VCC(A) = 5 V  
Fig 5. SDAA/SCLA line pull-up resistor versus load capacitance  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
5 of 20  
 
 
 
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
6.3.2 Port B (SDAB and SCLB)  
SDAB and SCLB are standard I2C-bus with static level offset that has no rise time  
accelerator. The static level offset produces an output LOW of 0.5 V (typical) at 6 mA. As  
with the standard I2C-bus system, pull-up resistors are required to provide the logic HIGH  
levels. The size of these pull-up resistors depends on the system requirement, and should  
meet the current sinking capability of the device that drives the buffer, as well as that of  
the buffer. The minimum and maximum pull-up resistors are determined and the pull-up  
resistor’s value is chosen to be within the minimum and maximum range.  
Using Equation 1, calculate the minimum pull-up resistor value:  
VCC(B)(max) 0.4 V  
RPU(min)  
=
(1)  
-------------------------------------------------  
IOL(max)  
Where:  
RPU(min) is the minimum pull-up resistor value for the open-drain SCLB and SDAB.  
CC(B)(max) is the maximum supply rail of the pull-up resistor.  
0.4 V is the maximum VOL of the device that drives the buffer on logic LOW.  
V
IOL(max) at VOL = 0.4 V is the maximum sink current of the device that drives the buffer  
on logic LOW.  
The maximum pull-up resistor should also be sized such that the RC time constant meets  
the standard I2C-bus rise time, which is 1 µs for Standard-mode (100 kHz) or 300 ns for  
Fast-mode (400 kHz). DDC bus complies with the I2C-bus Standard-mode and operates  
below 100 kHz, and maximum rise time is 1 µs using a simplified RC equation.  
Using Equation 2, calculate the maximum pull-up resistor value:  
RPU(max) × CL(max) = 1.2 × tr  
(2)  
Where:  
RPU(max) is the maximum allowable pull-up resistor on the SCLB and SDAB in order to  
meet the I2C-bus rise time specification.  
CL(max) is the maximum allowable capacitance load (include the capacitance of driver,  
the line, and the buffer) in order to meet the rise time specification.  
tr is the rise time specified as 1 µs (for bus speed 100 kHz or lower) and 300 ns (for bus  
speed 400 kHz or lower).  
The chosen pull-up resistor RPU is: RPU(min) RPU RPU(max)  
.
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
6 of 20  
 
 
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
7. Application design-in information  
A typical application is shown in Figure 6. In this example, the system master is running  
on a 3.3 V I2C-bus while the slave is connected to a 5 V bus. Both buses run at 400 kHz.  
Master devices can be placed on either bus. HDMI DDC applications for DVD/R and  
LCD TV are shown in Figure 7 and Figure 8, respectively. In these applications the HDMI  
transmitter or receiver is 3.3 V, while the DDC line is 5 V, PCA9507 behaves like a voltage  
level shift, a buffer and long cable bus extender to ensure signal integrity for accessing the  
EDID on the DDC line.  
3.3 V  
5 V  
10 kΩ  
10 kΩ  
10 kΩ  
10 kΩ  
V
V
CC(A)  
CC(B)  
SDAB  
SCLB  
SDAA  
SCLA  
SDA  
SCL  
BUS  
MASTER  
400 kHz  
SDA  
SCL  
SLAVE  
PCA9507  
400 kHz  
EN  
bus B  
bus A  
002aad403  
Fig 6. Typical application  
3.3 V  
5 V  
1.5 kΩ  
to  
2.0 kΩ  
1.5 kΩ  
to  
2.0 kΩ  
10 kΩ  
(optional)  
0.1 µF  
0.1 µF  
10 k10 kΩ  
V
V
CC(A)  
CC(B)  
HDMI cable  
DDC line  
LCD TV (sink)  
PCA9507  
22 Ω  
PCA9507  
PCA9512A  
PCA9517  
PCA9515  
SDAB  
SCLB  
EN  
SDAA  
HDMI  
TRANSMITTER  
SCLA  
22 Ω  
GND  
DVD/R or STB  
002aad404  
Fig 7. Source or DVD/R, STB application  
3.3 V  
5 V  
10 kΩ  
(optional)  
0.1 µF  
0.1 µF  
10 k10 kΩ  
47 kΩ  
V
V
CC(A)  
CC(B)  
HDMI cable  
DDC line  
DVD (source)  
PCA9507  
22 Ω  
22 Ω  
PCA9507  
PCA9512A  
PCA9517  
PCA9515  
SDAB  
SCLB  
EN  
SDAA  
SCLA  
HDMI  
RECEIVER  
GND  
LCD TV  
002aad405  
Fig 8. Sink or LCD TV application  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
7 of 20  
 
 
 
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
According to Figure 6, when port A of the PCA9507 is pulled LOW by a driver on the  
I2C-bus, a comparator detects the falling edge when it goes below 0.3VCC(A) and causes  
the internal driver on port B to turn on, causing port B to pull down to about 0.5 V. When  
port B of the PCA9507 falls, first a CMOS hysteresis type input detects the falling edge  
and causes the internal driver on port A to turn on and pull the port A pin down to ground.  
In order to illustrate what would be seen in a typical application, refer to Figure 11 and  
Figure 12.  
If the bus master in Figure 6 were to write to the slave through the PCA9507, waveforms  
shown in Figure 11 would be observed on the A bus. This looks like a normal I2C-bus  
transmission except that the HIGH level may be as low as 2.7 V, and the turn on and turn  
off of the acknowledge signals are slightly delayed.  
The master drives the B bus to ground or lets it float to VCC(B) as it sends data to the slave  
at the falling edge of the 8th clock, master releases SDAB on the B bus and slave pulls  
SDAA on the A bus to ground, causing the PCA9507 to pull SDAB on the B bus to 0.5 V.  
At the falling edge of the 9th clock, the master again drives the B bus and slave releases  
the A bus.  
Multiple PCA9507 port A sides can be connected in a star configuration (Figure 9),  
allowing all nodes to communicate with each other.  
Multiple PCA9507s can be connected in series (Figure 10) as long as port A is connected  
to port B. I2C-bus slave devices can be connected to any of the bus segments. The  
number of devices that can be connected in series is limited by repeater  
delay/time-of-flight considerations on the maximum bus speed requirements.  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
8 of 20  
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
V
V
CC(B)  
CC(A)  
10 kΩ  
10 kΩ  
10 kΩ  
10 kΩ  
V
V
CC(B)  
CC(A)  
SDAA  
SCLA  
SDAB  
SCLB  
SDA  
SCL  
SDA  
SCL  
SLAVE  
BUS  
MASTER  
PCA9507  
400 kHz  
EN  
10 kΩ  
10 kΩ  
V
V
CC(B)  
CC(A)  
SDAA  
SCLA  
SDAB  
SCLB  
SDA  
SCL  
SLAVE  
PCA9507  
400 kHz  
EN  
10 kΩ  
10 kΩ  
V
V
CC(B)  
CC(A)  
SDAA  
SCLA  
SDAB  
SCLB  
SDA  
SCL  
SLAVE  
PCA9507  
400 kHz  
EN  
002aad406  
Fig 9. Typical star application  
V
CC  
10 kΩ  
10 kΩ  
10 kΩ  
10 kΩ  
10 kΩ  
10 kΩ  
10 kΩ  
10 kΩ  
SDAA  
SCLA  
SDAB  
SCLB  
SDAA  
SCLA  
SDAB  
SCLB  
SDAA  
SCLA  
SDAB  
SCLB  
SDA  
SCL  
BUS  
MASTER  
SDA  
SCL  
PCA9507  
PCA9507  
PCA9507  
SLAVE  
400 kHz  
EN  
EN  
EN  
002aad407  
Fig 10. Typical series application  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
9 of 20  
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
9th clock pulse  
acknowledge  
SCLA  
SDAA  
002aad431  
Fig 11. Bus A (2.7 V to 5.5 V bus) waveform  
9th clock pulse  
acknowledge  
SCLB  
SDAB  
V
of PCA9507  
OL  
002aad408  
V
of slave  
OL  
Fig 12. Bus B (2.7 V to 5.5 V) waveform  
8. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol Parameter  
Conditions  
2.7 V to 5.5 V  
adjustable  
Min  
0.5  
0.5  
0.5  
-
Max  
+7  
Unit  
V
VCC(B)  
VCC(A)  
VI/O  
II/O  
supply voltage port B  
supply voltage port A  
+7  
V
voltage on an input/output pin port B; enable pin (EN)  
+7  
V
input/output current  
input current  
port A; port B  
50  
mA  
mA  
mW  
°C  
°C  
°C  
II  
EN, VCC(A), VCC(B), GND  
-
50  
Ptot  
total power dissipation  
storage temperature  
ambient temperature  
junction temperature  
-
100  
+125  
+85  
+125  
Tstg  
Tamb  
Tj  
55  
40  
-
operating in free air  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
10 of 20  
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
9. Static characteristics  
Table 5.  
Static characteristics  
VCC = 2.7 V to 5.5 V; GND = 0 V; Tamb = 40 °C to +85 °C; unless otherwise specified.  
Symbol  
Supplies  
VCC(B)  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
supply voltage port B  
supply voltage port A  
2.7  
2.7  
-
-
5.5  
5.5  
1
V
[1]  
VCC(A)  
-
V
ICC(VCC(A)) supply current on pin VCC(A)  
-
mA  
mA  
ICCH(B)  
port B HIGH-level supply current both channels HIGH; VCC = 5.5 V;  
SDAn = SCLn = VCC  
-
1.5  
5
ICCL(B)  
port B LOW-level supply current both channels LOW; VCC = 5.5 V;  
one SDA and one SCL = GND;  
-
-
-
1.5  
1.5  
1.5  
5
5
5
mA  
mA  
mA  
other SDA and SCL open  
ICCL(A)  
port A LOW-level supply current both channels LOW; VCC = 5.5 V;  
one SDA and one SCL = GND;  
other SDA and SCL open  
ICC(B)c  
contention port B supply current VCC(B) = 5.5 V;  
SDAB = SCLB = 0.2 V  
Input and output SDAB and SCLB  
VIH  
VIL  
HIGH-level input voltage  
LOW-level input voltage  
0.7VCC(B)  
0.5  
-
5.5  
V
V
V
[2]  
-
+0.3VCC(B)  
-
VILc  
contention LOW-level input  
voltage  
0.5  
0.4  
VIK  
ILI  
input clamping voltage  
input leakage current  
LOW-level input current  
LOW-level output voltage  
II = 18 mA  
-
-
1.2  
±1  
V
VI = 5.5 V  
-
-
µA  
µA  
V
IIL  
SDA, SCL; VI = 0.2 V  
IOL = 100 µA or 6 mA  
guaranteed by design  
-
-
10  
VOL  
0.47  
-
0.52  
-
0.6  
70  
VOLVILc  
difference between LOW-level  
output and LOW-level input  
voltage contention  
mV  
Cio  
input/output capacitance  
VI = 3 V or 0 V; VCC = 3.3 V  
VI = 3 V or 0 V; VCC = 0 V  
-
-
6
6
7
7
pF  
pF  
Input and output SDAA and SCLA  
VIH  
VIL  
VIK  
ILI  
HIGH-level input voltage  
LOW-level input voltage  
input clamping voltage  
input leakage current  
0.7VCC(A)  
-
5.5  
+1.5  
1.2  
±1  
10  
0.2  
7
V
[3]  
0.5  
-
V
II = 18 mA  
-
-
-
-
-
-
-
-
V
VCC = VI = 5.5 V  
-
µA  
µA  
V
IIL  
LOW-level input current  
LOW-level output voltage  
input/output capacitance  
SDA, SCL; VI = 0.2 V  
IOL = 6 mA  
-
VOL  
Cio  
0.1  
-
VI = 3 V or 0 V; VCC = 3.3 V  
VI = 3 V or 0 V; VCC = 0 V  
pF  
pF  
mA  
6
6
7
Itrt(pu)  
transient boosted pull-up current VCC(A) = 4.5 V;  
-
slew rate = 1.25 V/µs  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
11 of 20  
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
Table 5.  
Static characteristics …continued  
VCC = 2.7 V to 5.5 V; GND = 0 V; Tamb = 40 °C to +85 °C; unless otherwise specified.  
Symbol  
Enable  
VIL  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
LOW-level input voltage  
HIGH-level input voltage  
0.5  
-
+0.3VCC(B)  
5.5  
V
VIH  
0.7VCC(B)  
-
-
V
IIL(EN)  
LOW-level input current on pin  
EN  
VI = 0.2 V, EN; VCC = 3.6 V  
10  
30  
µA  
ILI  
Ci  
input leakage current  
input capacitance  
VI = VCC  
1  
-
+1  
7
µA  
VI = 3.0 V or 0 V  
-
6
pF  
[1] LOW-level supply voltage.  
[2] VIL specification is for the first LOW level seen by the SDAB/SCLB lines. VILc is for the second and subsequent LOW levels seen by the  
SDAB/SCLB lines.  
[3] VIL for port A with envelope noise must be below 0.3VCC(A) for stable performance.  
10. Dynamic characteristics  
Table 6.  
Dynamic characteristics  
VCC = 2.7 V to 5.5 V; GND = 0 V; Tamb = 40 °C to +85 °C; unless otherwise specified.[1][2]  
Symbol Parameter  
Conditions  
Min  
90  
Typ[3] Max  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
[4]  
tPLH  
tPHL  
tTLH  
tTHL  
tPLH  
tPHL  
tTLH  
tTHL  
tsu  
LOW-to-HIGH propagation delay  
HIGH-to-LOW propagation delay  
port B to port A; Figure 15  
port B to port A; Figure 13  
165  
91  
48  
42  
218  
91  
173  
39  
-
350  
180  
80  
55  
LOW to HIGH output transition time port A; Figure 13  
HIGH to LOW output transition time port A; Figure 13  
22  
20  
100  
310  
330  
260  
100  
-
[5]  
[5]  
LOW-to-HIGH propagation delay  
HIGH-to-LOW propagation delay  
port A to port B; Figure 14  
port A to port B; Figure 14  
140  
130  
100  
20  
LOW to HIGH output transition time port B; Figure 14  
HIGH to LOW output transition time port B; Figure 14  
[6]  
[6]  
set-up time  
hold time  
EN HIGH before START condition  
EN HIGH after STOP condition  
100  
100  
th  
-
-
[1] Times are specified with loads of 1.35 kpull-up resistance and 57 pF load capacitance on port B, and 450 pull-up resistance and  
57 pF load capacitance on port A. Different load resistance and capacitance will alter the RC time constant, thereby changing the  
propagation delay and transition times.  
[2] Pull-up voltages are VCC(A) on port A and VCC(B) on port B.  
[3] Typical values were measured with VCC(A) = 3.3 V at Tamb = 25 °C, unless otherwise noted.  
[4] The tPLH delay data from port B to port A is measured at 0.5 V on port B to 0.3VCC(A) on port A.  
[5] The proportional delay data from port A to port B is measured at 0.3VCC(A) on port A to 0.3VCC(B) on port B.  
[6] The enable pin, EN, should only change state when the global bus and the repeater port are in an idle state.  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
12 of 20  
 
 
 
 
 
 
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
10.1 AC waveforms  
V
V
CC(A)  
CC(B)  
input  
0.3V  
PHL  
0.3V  
input  
0.3V  
PHL  
0.3V  
CC(A)  
CC(B)  
CC(B)  
CC(A)  
0.1 V  
t
t
t
t
PLH  
PLH  
1.2 V  
V
CC(B)  
80 %  
80 %  
80 %  
80 %  
0.3V  
0.3V  
0.3V  
0.3V  
CC(B) CC(B)  
output  
CC(A)  
output  
CC(A)  
20 %  
20 %  
20 %  
20 %  
V
OL  
t
t
t
t
TLH  
THL  
TLH  
THL  
002aad432  
002aad433  
Fig 13. Propagation delay and transition times;  
port B to port A  
Fig 14. Propagation delay and transition times;  
port A to port B  
input  
SDAB, SCLB  
0.5 V  
output  
SCLA, SDAA  
0.3V  
PLH  
CC(A)  
t
002aad434  
Fig 15. Propagation delay  
11. Test information  
V
CC(B)  
V
CC(A)  
CC(B)  
V
R
L
V
V
O
I
PULSE  
GENERATOR  
DUT  
C
L
R
T
002aab649  
RL = load resistor; 1.35 kon port B (2.7 V to 5 V) and 450 on port A (2.7 V to 5.5 V).  
CL = load capacitance includes jig and probe capacitance; 57 pF.  
RT = termination resistance should be equal to Zo of pulse generators.  
Fig 16. Test circuit for open-drain outputs  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
13 of 20  
 
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
12. Package outline  
SO8: plastic small outline package; 8 leads; body width 3.9 mm  
SOT96-1  
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
4
e
w
M
detail X  
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(2)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
5.0  
4.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.05  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.20  
0.014 0.0075 0.19  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches 0.069  
0.01 0.004  
Notes  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT96-1  
076E03  
MS-012  
Fig 17. Package outline SOT96-1 (SO8)  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
14 of 20  
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm  
SOT505-1  
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
A
(A )  
2
A
3
A
1
pin 1 index  
θ
L
p
L
1
4
detail X  
e
w M  
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT  
v
w
y
Z
θ
1
2
3
p
max.  
0.15  
0.05  
0.95  
0.80  
0.45  
0.25  
0.28  
0.15  
3.1  
2.9  
3.1  
2.9  
5.1  
4.7  
0.7  
0.4  
0.70  
0.35  
6°  
0°  
mm  
1.1  
0.65  
0.25  
0.94  
0.1  
0.1  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-04-09  
03-02-18  
SOT505-1  
Fig 18. Package outline SOT505-1 (TSSOP8)  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
15 of 20  
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
13. Soldering of SMD packages  
This text provides a very brief insight into a complex technology. A more in-depth account  
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow  
soldering description”.  
13.1 Introduction to soldering  
Soldering is one of the most common methods through which packages are attached to  
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both  
the mechanical and the electrical connection. There is no single soldering method that is  
ideal for all IC packages. Wave soldering is often preferred when through-hole and  
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not  
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high  
densities that come with increased miniaturization.  
13.2 Wave and reflow soldering  
Wave soldering is a joining technology in which the joints are made by solder coming from  
a standing wave of liquid solder. The wave soldering process is suitable for the following:  
Through-hole components  
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board  
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless  
packages which have solder lands underneath the body, cannot be wave soldered. Also,  
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,  
due to an increased probability of bridging.  
The reflow soldering process involves applying solder paste to a board, followed by  
component placement and exposure to a temperature profile. Leaded packages,  
packages with solder balls, and leadless packages are all reflow solderable.  
Key characteristics in both wave and reflow soldering are:  
Board specifications, including the board finish, solder masks and vias  
Package footprints, including solder thieves and orientation  
The moisture sensitivity level of the packages  
Package placement  
Inspection and repair  
Lead-free soldering versus SnPb soldering  
13.3 Wave soldering  
Key characteristics in wave soldering are:  
Process issues, such as application of adhesive and flux, clinching of leads, board  
transport, the solder wave parameters, and the time during which components are  
exposed to the wave  
Solder bath specifications, including temperature and impurities  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
16 of 20  
 
 
 
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
13.4 Reflow soldering  
Key characteristics in reflow soldering are:  
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to  
higher minimum peak temperatures (see Figure 19) than a SnPb process, thus  
reducing the process window  
Solder paste printing issues including smearing, release, and adjusting the process  
window for a mix of large and small components on one board  
Reflow temperature profile; this profile includes preheat, reflow (in which the board is  
heated to the peak temperature) and cooling down. It is imperative that the peak  
temperature is high enough for the solder to make reliable solder joints (a solder paste  
characteristic). In addition, the peak temperature must be low enough that the  
packages and/or boards are not damaged. The peak temperature of the package  
depends on package thickness and volume and is classified in accordance with  
Table 7 and 8  
Table 7.  
SnPb eutectic process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
350  
220  
< 2.5  
235  
220  
2.5  
220  
Table 8.  
Lead-free process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
260  
350 to 2000  
> 2000  
260  
< 1.6  
260  
250  
245  
1.6 to 2.5  
> 2.5  
260  
245  
250  
245  
Moisture sensitivity precautions, as indicated on the packing, must be respected at all  
times.  
Studies have shown that small packages reach higher temperatures during reflow  
soldering, see Figure 19.  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
17 of 20  
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
maximum peak temperature  
= MSL limit, damage level  
temperature  
minimum peak temperature  
= minimum soldering temperature  
peak  
temperature  
time  
001aac844  
MSL: Moisture Sensitivity Level  
Fig 19. Temperature profiles for large and small components  
For further information on temperature profiles, refer to Application Note AN10365  
“Surface mount reflow soldering description”.  
14. Abbreviations  
Table 9.  
Abbreviations  
Description  
Acronym  
CDM  
Charged Device Model  
Complementary Metal Oxide Silicon  
Display Data Channel  
CMOS  
DDC  
DVD  
Digital Video Disc  
EDID  
ESD  
Extended Display Identification Data  
ElectroStatic Discharge  
Human Body Model  
HBM  
HDMI  
I2C-bus  
LCD  
High-Definition Multimedia Interface  
Inter Integrated Circuit bus  
Liquid Crystal Display  
MM  
Machine Model  
SMBus  
STB  
System Management Bus  
Set-Top Box  
15. Revision history  
Table 10. Revision history  
Document ID  
Release date  
20080207  
Data sheet status  
Change notice  
Supersedes  
PCA9507_1  
Product data sheet  
-
-
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
18 of 20  
 
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
16. Legal information  
16.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
to result in personal injury, death or severe property or environmental  
16.2 Definitions  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
16.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
16.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
I2C-bus — logo is a trademark of NXP B.V.  
17. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
PCA9507_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 7 February 2008  
19 of 20  
 
 
 
 
 
 
PCA9507  
NXP Semiconductors  
2-wire serial bus extender for HDMI DDC I2C-bus and SMBus  
18. Contents  
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6
Functional description . . . . . . . . . . . . . . . . . . . 3  
Enable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Rise time accelerators . . . . . . . . . . . . . . . . . . . 4  
Resistor pull-up value selection . . . . . . . . . . . . 5  
Port A (SDAA and SCLA) . . . . . . . . . . . . . . . . . 5  
Port B (SDAB and SCLB) . . . . . . . . . . . . . . . . . 6  
6.1  
6.2  
6.3  
6.3.1  
6.3.2  
7
Application design-in information . . . . . . . . . . 7  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10  
Static characteristics. . . . . . . . . . . . . . . . . . . . 11  
Dynamic characteristics . . . . . . . . . . . . . . . . . 12  
AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . 13  
Test information. . . . . . . . . . . . . . . . . . . . . . . . 13  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14  
8
9
10  
10.1  
11  
12  
13  
Soldering of SMD packages . . . . . . . . . . . . . . 16  
Introduction to soldering . . . . . . . . . . . . . . . . . 16  
Wave and reflow soldering . . . . . . . . . . . . . . . 16  
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16  
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17  
13.1  
13.2  
13.3  
13.4  
14  
15  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18  
16  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
16.1  
16.2  
16.3  
16.4  
17  
18  
Contact information. . . . . . . . . . . . . . . . . . . . . 19  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2008.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 7 February 2008  
Document identifier: PCA9507_1  
 

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