PCA9555PW-T [NXP]
IC 16 I/O, PIA-GENERAL PURPOSE, PDSO24, 4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24, Parallel IO Port;
| 型号： | PCA9555PW-T |
| 厂家： | 
NXP |
| 描述： | IC 16 I/O, PIA-GENERAL PURPOSE, PDSO24, 4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24, Parallel IO Port 光电二极管 外围集成电路 |
| 文件： | 总34页 (文件大小：183K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PCA9555
16-bit I2C-bus and SMBus I/O port with interrupt
Rev. 08 — 22 October 2009
Product data sheet
1. General description
The PCA9555 is a 24-pin CMOS device that provides 16 bits of General Purpose parallel
Input/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed to
enhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvements
include higher drive capability, 5 V I/O tolerance, lower supply current, individual I/O
configuration, and smaller packaging. I/O expanders provide a simple solution when
additional I/O is needed for ACPI power switches, sensors, push buttons, LEDs, fans, etc.
The PCA9555 consists of two 8-bit Configuration (Input or Output selection); Input, Output
and Polarity Inversion (active HIGH or active LOW operation) registers. The system
master can enable the I/Os as either inputs or outputs by writing to the I/O configuration
bits. The data for each Input or Output is kept in the corresponding Input or Output
register. The polarity of the read register can be inverted with the Polarity Inversion
register. All registers can be read by the system master. Although pin-to-pin and I2C-bus
address compatible with the PCF8575, software changes are required due to the
enhancements, and are discussed in Application Note AN469.
The PCA9555 open-drain interrupt output is activated when any input state differs from its
corresponding input port register state and is used to indicate to the system master that
an input state has changed. The power-on reset sets the registers to their default values
and initializes the device state machine.
Three hardware pins (A0, A1, A2) vary the fixed I2C-bus address and allow up to eight
devices to share the same I2C-bus/SMBus. The fixed I2C-bus address of the PCA9555 is
the same as the PCA9554, allowing up to eight of these devices in any combination to
share the same I2C-bus/SMBus.
2. Features
I Operating power supply voltage range of 2.3 V to 5.5 V
I 5 V tolerant I/Os
I Polarity Inversion register
I Active LOW interrupt output
I Low standby current
I Noise filter on SCL/SDA inputs
I No glitch on power-up
I Internal power-on reset
I 16 I/O pins which default to 16 inputs
I 0 Hz to 400 kHz clock frequency
I ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
I Six packages offered: DIP24, SO24, SSOP24, TSSOP24, HVQFN24 and HWQFN24
3. Ordering information
Table 1.
Ordering information
Type number Package
Name
Description
Version
PCA9555N
PCA9555D
DIP24
SO24
plastic dual in-line package; 24 leads (600 mil)
SOT101-1
SOT137-1
plastic small outline package; 24 leads;
body width 7.5 mm
PCA9555DB SSOP24
plastic shrink small outline package; 24 leads;
body width 5.3 mm
SOT340-1
SOT355-1
SOT616-1
SOT994-1
PCA9555PW TSSOP24 plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
PCA9555BS HVQFN24 plastic thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 4 × 4 × 0.85 mm
PCA9555HF HWQFN24 plastic thermal enhanced very very thin quad flat
package; no leads; 24 terminals; body 4 × 4 × 0.75 mm
3.1 Ordering options
Table 2.
Ordering options
Type number
PCA9555N
Topside mark
PCA9555
PCA9555D
PCA9555
PCA9555
9555
Temperature range
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
−40 °C to +85 °C
PCA9555D
PCA9555DB
PCA9555PW
PCA9555BS
PCA9555HF
P55H
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
2 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
4. Block diagram
PCA9555
IO1_0
IO1_1
8-bit
IO1_2
A0
A1
A2
INPUT/
IO1_3
OUTPUT
PORTS
IO1_4
write pulse
IO1_5
IO1_6
read pulse
IO1_7
2
I C-BUS/SMBus
CONTROL
SCL
SDA
IO0_0
IO0_1
IO0_2
IO0_3
IO0_4
IO0_5
IO0_6
IO0_7
INPUT
FILTER
8-bit
INPUT/
OUTPUT
PORTS
write pulse
read pulse
V
DD
POWER-ON
RESET
V
SS
V
DD
LP filter
INT
002aac702
Remark: All I/Os are set to inputs at reset.
Fig 1. Block diagram of PCA9555
5. Pinning information
5.1 Pinning
1
2
24
23
22
21
20
19
18
17
16
15
14
13
1
2
24
23
22
21
20
19
18
17
16
15
14
13
INT
V
INT
A1
V
DD
DD
A1
A2
SDA
SDA
3
3
SCL
A2
SCL
4
4
IO0_0
IO0_1
IO0_2
IO0_3
IO0_4
IO0_5
IO0_6
IO0_7
A0
IO0_0
IO0_1
IO0_2
IO0_3
IO0_4
IO0_5
IO0_6
IO0_7
A0
5
5
IO1_7
IO1_6
IO1_5
IO1_4
IO1_3
IO1_2
IO1_1
IO1_0
IO1_7
IO1_6
IO1_5
IO1_4
IO1_3
IO1_2
IO1_1
IO1_0
6
6
PCA9555N
PCA9555D
7
7
8
8
9
9
10
11
12
10
11
12
V
SS
V
SS
002aac697
002aac698
Fig 2. Pin configuration for DIP24
Fig 3. Pin configuration for SO24
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
3 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
INT
A1
1
2
24
23
22
21
20
19
18
17
16
15
14
13
1
2
24
23
22
21
20
19
18
17
16
15
14
13
INT
A1
V
V
DD
DD
SDA
SDA
A2
3
3
A2
SCL
SCL
IO0_0
IO0_1
IO0_2
IO0_3
IO0_4
IO0_5
IO0_6
IO0_7
4
4
IO0_0
IO0_1
IO0_2
IO0_3
IO0_4
IO0_5
IO0_6
IO0_7
A0
A0
5
5
IO1_7
IO1_6
IO1_5
IO1_4
IO1_3
IO1_2
IO1_1
IO1_0
IO1_7
IO1_6
IO1_5
IO1_4
IO1_3
IO1_2
IO1_1
IO1_0
6
6
PCA9555DB
PCA9555PW
7
7
8
8
9
9
10
11
12
10
11
12
V
SS
V
SS
002aac699
002aac700
Fig 4. Pin configuration for SSOP24
Fig 5. Pin configuration for TSSOP24
terminal 1
index area
terminal 1
index area
1
2
3
4
5
6
18
17
16
15
14
13
IO0_0
IO0_1
IO0_2
IO0_3
IO0_4
IO0_5
A0
1
2
3
4
5
6
18
17
16
15
14
13
IO0_0
IO0_1
IO0_2
IO0_3
IO0_4
IO0_5
A0
IO1_7
IO1_6
IO1_5
IO1_4
IO1_3
IO1_7
IO1_6
IO1_5
IO1_4
IO1_3
PCA9555HF
PCA9555BS
002aac881
002aac701
Transparent top view
Transparent top view
Fig 6. Pin configuration for HVQFN24
Fig 7. Pin configuration for HWQFN24
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
4 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
5.2 Pin description
Table 3.
Symbol
Pin description
Pin
Description
DIP24, SO24,
HVQFN24,
SSOP24, TSSOP24
HWQFN24
INT
1
22
23
24
1
interrupt output (open-drain)
address input 1
A1
2
A2
3
address input 2
IO0_0
IO0_1
IO0_2
IO0_3
IO0_4
IO0_5
IO0_6
IO0_7
VSS
4
port 0 input/output
5
2
6
3
7
4
8
5
9
6
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
7
8
9[1]
10
11
12
13
14
15
16
17
18
19
20
21
supply ground
IO1_0
IO1_1
IO1_2
IO1_3
IO1_4
IO1_5
IO1_6
IO1_7
A0
port 1 input/output
address input 0
serial clock line
serial data line
supply voltage
SCL
SDA
VDD
[1] HVQFN and HWQFN package die supply ground is connected to both the VSS pin and the exposed center
pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced thermal,
electrical, and board-level performance, the exposed pad needs to be soldered to the board using a
corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias
need to be incorporated in the PCB in the thermal pad region.
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
5 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
6. Functional description
Refer to Figure 1 “Block diagram of PCA9555”.
6.1 Device address
slave address
0
1
0
0
A2 A1 A0 R/W
fixed
programmable
002aac219
Fig 8. PCA9555 device address
6.2 Registers
6.2.1 Command byte
The command byte is the first byte to follow the address byte during a write transmission.
It is used as a pointer to determine which of the following registers will be written or read.
Table 4.
Command byte
Register
Command
0
1
2
3
4
5
6
7
Input port 0
Input port 1
Output port 0
Output port 1
Polarity Inversion port 0
Polarity Inversion port 1
Configuration port 0
Configuration port 1
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
6 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
6.2.2 Registers 0 and 1: Input port registers
This register is an input-only port. It reflects the incoming logic levels of the pins,
regardless of whether the pin is defined as an input or an output by Register 3. Writes to
this register have no effect.
The default value ‘X’ is determined by the externally applied logic level.
Table 5.
Bit
Input port 0 Register
7
I0.7
X
6
I0.6
X
5
I0.5
X
4
I0.4
X
3
I0.3
X
2
I0.2
X
1
I0.1
X
0
I0.0
X
Symbol
Default
Table 6.
Bit
Input port 1 register
7
I1.7
X
6
I1.6
X
5
I1.5
X
4
I1.4
X
3
I1.3
X
2
I1.2
X
1
I1.1
X
0
I1.0
X
Symbol
Default
6.2.3 Registers 2 and 3: Output port registers
This register is an output-only port. It reflects the outgoing logic levels of the pins defined
as outputs by Registers 6 and 7. Bit values in this register have no effect on pins defined
as inputs. In turn, reads from this register reflect the value that is in the flip-flop controlling
the output selection, not the actual pin value.
Table 7.
Bit
Output port 0 register
7
O0.7
1
6
O0.6
1
5
O0.5
1
4
O0.4
1
3
O0.3
1
2
O0.2
1
1
O0.1
1
0
O0.0
1
Symbol
Default
Table 8.
Bit
Output port 1 register
7
O1.7
1
6
O1.6
1
5
O1.5
1
4
O1.4
1
3
O1.3
1
2
O1.2
1
1
O1.1
1
0
O1.0
1
Symbol
Default
6.2.4 Registers 4 and 5: Polarity Inversion registers
This register allows the user to invert the polarity of the Input port register data. If a bit in
this register is set (written with ‘1’), the Input port data polarity is inverted. If a bit in this
register is cleared (written with a ‘0’), the Input port data polarity is retained.
Table 9.
Bit
Polarity Inversion port 0 register
7
N0.7
0
6
N0.6
0
5
N0.5
0
4
N0.4
0
3
N0.3
0
2
N0.2
0
1
N0.1
0
0
N0.0
0
Symbol
Default
Table 10. Polarity Inversion port 1 register
Bit
7
N1.7
0
6
N1.6
0
5
N1.5
0
4
N1.4
0
3
N1.3
0
2
N1.2
0
1
N1.1
0
0
N1.0
0
Symbol
Default
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
7 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
6.2.5 Registers 6 and 7: Configuration registers
This register configures the directions of the I/O pins. If a bit in this register is set (written
with ‘1’), the corresponding port pin is enabled as an input with high-impedance output
driver. If a bit in this register is cleared (written with ‘0’), the corresponding port pin is
enabled as an output. Note that there is a high value resistor tied to VDD at each pin. At
reset, the device's ports are inputs with a pull-up to VDD
.
Table 11. Configuration port 0 register
Bit
7
C0.7
1
6
C0.6
1
5
C0.5
1
4
C0.4
1
3
2
C0.2
1
1
C0.1
1
0
C0.0
1
Symbol
Default
C0.3
1
Table 12. Configuration port 1 register
Bit
7
C1.7
1
6
C1.6
1
5
C1.5
1
4
C1.4
1
3
C1.3
1
2
C1.2
1
1
C1.1
1
0
C1.0
1
Symbol
Default
6.3 Power-on reset
When power is applied to VDD, an internal power-on reset holds the PCA9555 in a reset
condition until VDD has reached VPOR. At that point, the reset condition is released and the
PCA9555 registers and SMBus state machine will initialize to their default states. The
power-on reset typically completes the reset and enables the part by the time the power
supply is above VPOR. However, when it is required to reset the part by lowering the power
supply, it is necessary to lower it below 0.2 V.
6.4 I/O port
When an I/O is configured as an input, FETs Q1 and Q2 are off, creating a
high-impedance input with a weak pull-up to VDD. The input voltage may be raised above
VDD to a maximum of 5.5 V.
If the I/O is configured as an output, then either Q1 or Q2 is on, depending on the state of
the Output Port register. Care should be exercised if an external voltage is applied to an
I/O configured as an output because of the low-impedance path that exists between the
pin and either VDD or VSS
.
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
8 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
data from
output port
shift register
register data
configuration
register
V
DD
data from
shift register
Q1
D
Q
100 kΩ
FF
write
configuration
pulse
D
Q
CK
Q
FF
I/O pin
Q2
write pulse
CK
V
input port
register
SS
output port
register
D
Q
input port
register data
FF
read pulse
CK
to INT
polarity inversion
register
data from
shift register
polarity
inversion
register data
D
Q
FF
write polarity
pulse
CK
002aac703
At power-on reset, all registers return to default values.
Fig 9. Simplified schematic of I/Os
6.5 Bus transactions
6.5.1 Writing to the port registers
Data is transmitted to the PCA9555 by sending the device address and setting the least
significant bit to a logic 0 (see Figure 8 “PCA9555 device address”). The command byte is
sent after the address and determines which register will receive the data following the
command byte.
The eight registers within the PCA9555 are configured to operate as four register pairs.
The four pairs are Input Ports, Output Ports, Polarity Inversion Ports, and Configuration
Ports. After sending data to one register, the next data byte will be sent to the other
register in the pair (see Figure 10 and Figure 11). For example, if the first byte is sent to
Output Port 1 (register 3), then the next byte will be stored in Output Port 0 (register 2).
There is no limitation on the number of data bytes sent in one write transmission. In this
way, each 8-bit register may be updated independently of the other registers.
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
9 of 34
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SCL
1
2
3
4
5
6
7
8
9
slave address
A2 A1 A0
command byte
data to port 0
DATA 0
data to port 1
DATA 1
SDA
S
0
1
0
0
0
A
0
0
0
0
0
0
1
0
A
0.7
0.0
A
1.7
1.0
A
P
START condition
R/W acknowledge
from slave
acknowledge
from slave
acknowledge
from slave
STOP
condition
write to port
t
v(Q)
data out
from port 0
t
v(Q)
data out
from port 1
DATA VALID
002aac220
Fig 10. Write to Output port registers
SCL
SDA
1
2
3
4
5
6
7
8
9
data to register
data to register
slave address
A2 A1 A0
command byte
MSB
LSB
MSB
LSB
S
0
1
0
0
0
A
0
0
0
0
0
1
1
0
A
DATA 0
A
DATA 1
A
P
START condition
R/W acknowledge
from slave
acknowledge
from slave
acknowledge
from slave
STOP
condition
002aac221
Fig 11. Write to Configuration registers
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
6.5.2 Reading the port registers
In order to read data from the PCA9555, the bus master must first send the PCA9555
address with the least significant bit set to a logic 0 (see Figure 8 “PCA9555 device
address”). The command byte is sent after the address and determines which register will
be accessed. After a restart, the device address is sent again, but this time the least
significant bit is set to a logic 1. Data from the register defined by the command byte will
then be sent by the PCA9555 (see Figure 12, Figure 13 and Figure 14). Data is clocked
into the register on the falling edge of the acknowledge clock pulse. After the first byte is
read, additional bytes may be read but the data will now reflect the information in the other
register in the pair. For example, if you read Input Port 1, then the next byte read would be
Input Port 0. There is no limitation on the number of data bytes received in one read
transmission but the final byte received, the bus master must not acknowledge the data.
slave address
A2 A1 A0
(cont.)
SDA
S
0
1
0
0
0
A
COMMAND BYTE
A
START condition
R/W
acknowledge
from slave
acknowledge
from slave
data from lower or
upper byte of register
data from upper or
lower byte of register
slave address
A2 A1 A0
MSB
LSB
MSB
LSB
(cont.)
S
0
1
0
0
1
A
DATA (first byte)
A
DATA (last byte)
NA P
(repeated)
START condition
R/W
acknowledge
from master
no acknowledge STOP
from master condition
acknowledge
from slave
at this moment master-transmitter becomes master-receiver
and slave-receiver becomes slave-transmitter
002aac222
Remark: Transfer can be stopped at any time by a STOP condition.
Fig 12. Read from register
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
11 of 34
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data into port 0
data into port 1
INT
t
t
rst(INT_N)
v(INT_N)
SCL
SDA
1
2
3
4
5
6
7
8
9
R/W
STOP condition
slave address
A2 A1 A0
I0.x
I1.x
I0.x
I1.x
S
0
1
0
0
1
A
7
6
5
4
3
2
1
0
A
7
6
5
4
3
2
1
0
A
7
6
5
4
3
2
1
0
A
7
6
5
4
3
2
1
0
1
P
START condition
acknowledge
from slave
acknowledge
from master
acknowledge
from master
acknowledge
from master
non acknowledge
from master
read from port 0
read from port 1
002aac223
Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It
is assumed that the command byte has previously been set to ‘00’ (read Input Port register).
Fig 13. Read Input port register, scenario 1
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data into port 0
data into port 1
INT
DATA 00
DATA 01
DATA 02
t
DATA 03
t
h(D)
su(D)
DATA 10
DATA 11
DATA 12
t
t
su(D)
h(D)
t
t
rst(INT_N)
v(INT_N)
SCL
SDA
1
2
3
4
5
6
7
8
9
R/W
STOP condition
slave address
A2 A1 A0
I0.x
DATA 00
I1.x
I0.x
DATA 03
I1.x
S
0
1
0
0
1
A
A
DATA 10
A
A
DATA 12
1
P
START condition
acknowledge
from slave
acknowledge
from master
acknowledge
from master
acknowledge
from master
non acknowledge
from master
read from port 0
read from port 1
002aac224
Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It
is assumed that the command byte has previously been set to ‘00’ (read Input Port register).
Fig 14. Read Input port register, scenario 2
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
6.5.3 Interrupt output
The open-drain interrupt output is activated when one of the port pins changes state and
the pin is configured as an input. The interrupt is deactivated when the input returns to its
previous state or the Input Port register is read (see Figure 13). A pin configured as an
output cannot cause an interrupt. Since each 8-bit port is read independently, the interrupt
caused by Port 0 will not be cleared by a read of Port 1 or the other way around.
Remark: Changing an I/O from an output to an input may cause a false interrupt to occur
if the state of the pin does not match the contents of the Input Port register.
7. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
7.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 15).
SDA
SCL
data line
stable;
data valid
change
of data
allowed
mba607
Fig 15. Bit transfer
7.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S). A
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 16).
SDA
SCL
S
P
STOP condition
START condition
mba608
Fig 16. Definition of START and STOP conditions
Rev. 08 — 22 October 2009
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
14 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
7.2 System configuration
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 17).
SDA
SCL
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER/
RECEIVER
2
SLAVE
RECEIVER
MASTER
TRANSMITTER
I C-BUS
MULTIPLEXER
SLAVE
002aaa966
Fig 17. System configuration
7.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; set-up time and hold
time must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
1
2
8
9
S
clock pulse for
START
condition
acknowledgement
002aaa987
Fig 18. Acknowledgement on the I2C-bus
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
15 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
8. Application design-in information
V
DD
(5 V)
SUB-SYSTEM 1
(e.g., temp sensor)
10 kΩ
10 kΩ
10 kΩ
2 kΩ
V
V
DD
DD
INT
MASTER
CONTROLLER
PCA9555
SCL
SCL
IO0_0
IO0_1
IO0_2
IO0_3
IO0_4
IO0_5
SUB-SYSTEM 2
(e.g., counter)
SDA
INT
SDA
RESET
INT
A
GND
controlled
switch
(e.g., CBT device)
B
ENABLE
IO0_6
IO0_7
IO1_0
IO1_1
IO1_2
IO1_3
IO1_4
IO1_5
IO1_6
IO1_7
SUB-SYSTEM 3
(e.g., alarm system)
10 DIGIT
ALARM
NUMERIC
KEYPAD
A2
A1
A0
V
DD
V
SS
002aac704
Device address configured as 0100 000xb for this example.
IO0_0, IO0_2, IO0_3 configured as outputs.
IO0_1, IO0_4, IO0_5 configured as inputs.
IO0_6, IO0_7, and IO1_0 to IO1_7 configured as inputs.
Fig 19. Typical application
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
16 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
9. Limiting values
Table 13. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDD
VI/O
IO
Parameter
Conditions
Min
Max
+6.0
6
Unit
V
supply voltage
−0.5
voltage on an input/output pin
output current
V
SS − 0.5
V
on an I/O pin
-
±50
±20
160
200
200
+150
+85
mA
mA
mA
mA
mW
°C
II
input current
-
IDD
supply current
-
ISS
ground supply current
total power dissipation
storage temperature
ambient temperature
-
Ptot
Tstg
Tamb
-
−65
−40
operating
°C
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
17 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
10. Static characteristics
Table 14. Static characteristics
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol Parameter
Supplies
Conditions
Min
Typ
Max
Unit
VDD
IDD
supply voltage
supply current
2.3
-
-
5.5
V
Operating mode; VDD = 5.5 V; no load;
135
200
µA
fSCL = 100 kHz
Istb
standby current
Standby mode; VDD = 5.5 V; no load;
VI = VSS; fSCL = 0 kHz; I/O = inputs
-
-
-
1.1
1.5
1
mA
µA
V
Standby mode; VDD = 5.5 V; no load;
VI = VDD; fSCL = 0 kHz; I/O = inputs
0.25
1.5
VPOR
power-on reset voltage[1] no load; VI = VDD or VSS
1.65
Input SCL; input/output SDA
VIL
VIH
IOL
IL
LOW-level input voltage
−0.5
-
+0.3VDD
V
HIGH-level input voltage
0.7VDD
-
5.5
-
V
LOW-level output current VOL = 0.4 V
3
-
mA
µA
pF
leakage current
VI = VDD = VSS
VI = VSS
−1
-
-
+1
10
Ci
input capacitance
6
I/Os
VIL
VIH
IOL
LOW-level input voltage
HIGH-level input voltage
−0.5
0.7VDD
8
-
+0.3VDD
V
-
5.5
-
V
[2]
[2]
[3]
[3]
[3]
[3]
[3]
[3]
LOW-level output current VDD = 2.3 V to 5.5 V; VOL = 0.5 V
VDD = 2.3 V to 5.5 V; VOL = 0.7 V
HIGH-level output voltage IOH = −8 mA; VDD = 2.3 V
IOH = −10 mA; VDD = 2.3 V
(8 to 20)
mA
mA
V
10
(10 to 24) -
VOH
1.8
1.7
2.6
2.5
4.1
4.0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1
V
IOH = −8 mA; VDD = 3.0 V
V
IOH = −10 mA; VDD = 3.0 V
V
IOH = −8 mA; VDD = 4.75 V
V
IOH = −10 mA; VDD = 4.75 V
V
ILIH
ILIL
HIGH-level input leakage VDD = 5.5 V; VI = VDD
current
µA
LOW-level input leakage VDD = 5.5 V; VI = VSS
current
-
-
−100
µA
Ci
input capacitance
output capacitance
-
-
3.7
3.7
5
5
pF
pF
Co
Interrupt INT
IOL
LOW-level output current VOL = 0.4 V
3
-
-
mA
Select inputs A0, A1, A2
VIL
VIH
ILI
LOW-level input voltage
−0.5
0.7VDD
−1
-
-
-
+0.3VDD
5.5
V
HIGH-level input voltage
input leakage current
V
+1
µA
[1] VDD must be lowered to 0.2 V for at least 5 µs in order to reset part.
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
18 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
[2] Each I/O must be externally limited to a maximum of 25 mA and each octal (IO0_0 to IO0_7 and IO1_0 to IO1_7) must be limited to a
maximum current of 100 mA for a device total of 200 mA.
[3] The total current sourced by all I/Os must be limited to 160 mA.
002aac706
002aac707
6.0
4.5
V
(V)
OH
V
(V)
OH
(1)
5.0
3.5
(2)
4.0
3.0
2.0
2.5
1.5
(1)
(2)
2.7
3.6
5.5
2.3
3.0
4.75
V
DD
(V)
V
DD
(V)
(1) IOH = −8 mA
(1) IOH = −8 mA
(2) IOH = −10 mA
(2) IOH = −10 mA
Fig 20. VOH maximum
Fig 21. VOH minimum
002aac705
1.6
I
DD
(mA)
(1)
1.2
(2)
(3)
0.8
0.4
0
all 1s
one 0
three 0s
all 0s
number of I/Os
VDD = 5.5 V; VI/O = 5.5 V; A2, A1, A0 set to logic 0.
(1) Tamb = −40 °C
(2) Tamb = +25 °C
(3) Tamb = +85 °C
Fig 22. IDD versus number of I/Os held LOW
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
19 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
11. Dynamic characteristics
Table 15. Dynamic characteristics
Symbol Parameter
Conditions
Standard-mode
I2C-bus
Fast-mode I2C-bus Unit
Min
0
Max
100
-
Min
0
Max
400
-
fSCL
tBUF
SCL clock frequency
kHz
bus free time between a STOP and
START condition
4.7
1.3
µs
tHD;STA
tSU;STA
hold time (repeated) START condition
4.0
4.7
-
-
0.6
0.6
-
-
µs
µs
set-up time for a repeated START
condition
tSU;STO
tVD;ACK
tHD;DAT
tVD;DAT
tSU;DAT
tLOW
tHIGH
tf
set-up time for STOP condition
data valid acknowledge time
data hold time
4.0
0.3
0
-
0.6
-
µs
µs
ns
ns
ns
µs
µs
ns
ns
ns
[1]
[2]
3.45
0.1
0.9
-
0
-
data valid time
300
250
4.7
4.0
-
-
50
-
-
data set-up time
-
-
100
1.3
LOW period of the SCL clock
HIGH period of the SCL clock
fall time of both SDA and SCL signals
rise time of both SDA and SCL signals
-
-
0.6
-
[3]
[3]
300
1000
50
20 + 0.1Cb
20 + 0.1Cb
-
300
300
50
tr
-
tSP
pulse width of spikes that must be
suppressed by the input filter
-
Port timing
tv(Q)
data output valid time
data input set-up time
data input hold time
-
150
1
200
-
150
1
200
ns
ns
µs
tsu(D)
-
-
-
-
th(D)
Interrupt timing
tv(INT_N)
valid time on pin INT
-
-
4
4
-
-
4
4
µs
µs
trst(INT_N) reset time on pin INT
[1] tVD;ACK = time for acknowledgement signal from SCL LOW to SDA (out) LOW.
[2] tVD;DAT = minimum time for SDA data out to be valid following SCL LOW.
[3] Cb = total capacitance of one bus line in pF.
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
20 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
SDA
t
t
t
t
SP
t
r
f
HD;STA
BUF
t
LOW
SCL
t
t
t
SU;STO
HD;STA
SU;STA
t
t
t
SU;DAT
HD;DAT
HIGH
P
S
Sr
P
002aaa986
Fig 23. Definition of timing on the I2C-bus
12. Test information
V
DD
open
GND
V
R
500 Ω
DD
L
V
V
O
I
PULSE
GENERATOR
DUT
C
50 pF
L
R
T
002aab284
RL = load resistor.
CL = load capacitance includes jig and probe capacitance.
RT = termination resistance should be equal to the output impedance of Zo of the pulse generators.
Fig 24. Test circuitry for switching times
R
L
2V
S1
DD
from output under test
open
GND
500 Ω
C
50 pF
R
L
500 Ω
L
002aac226
Fig 25. Load circuit
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
21 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
13. Package outline
DIP24: plastic dual in-line package; 24 leads (600 mil)
SOT101-1
D
M
E
A
2
A
L
A
1
c
e
w M
Z
b
1
(e )
1
b
M
H
24
13
pin 1 index
E
1
12
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
w
1
1
E
max.
min.
max.
max.
1.7
1.3
0.53
0.38
0.32
0.23
32.0
31.4
14.1
13.7
3.9
3.4
15.80
15.24
17.15
15.90
5.1
0.2
0.51
4
2.54
0.1
15.24
0.6
0.25
0.01
2.2
0.066
0.051
0.021
0.015
0.013
0.009
1.26
1.24
0.56
0.54
0.15
0.13
0.62
0.60
0.68
0.63
inches
0.02
0.16
0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-13
SOT101-1
051G02
MO-015
SC-509-24
Fig 26. Package outline SOT101-1 (DIP24)
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
22 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
H
v
M
A
E
y
Z
24
13
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
12
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
mm
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
2.65
0.1
0.25
0.01
1.27
0.05
1.4
0.25
0.25
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.61
0.014 0.009 0.60
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches
0.055
0.01
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT137-1
075E05
MS-013
Fig 27. Package outline SOT137-1 (SO24)
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
23 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
D
E
A
X
v
c
H
M
A
y
E
Z
24
13
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
12
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
0.8
0.4
mm
2
0.65
1.25
0.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT340-1
MO-150
Fig 28. Package outline SOT340-1 (SSOP24)
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
24 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
D
E
A
X
c
H
v
M
A
y
E
Z
13
24
Q
A
2
(A )
3
A
A
1
pin 1 index
θ
L
p
L
1
12
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.5
0.2
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT355-1
MO-153
Fig 29. Package outline SOT355-1 (TSSOP24)
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
25 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
SOT616-1
B
A
D
terminal 1
index area
A
A
1
E
c
detail X
e
1
C
1/2 e
y
y
C
1
e
v
M
M
C
C
A
B
b
7
12
w
L
13
6
e
e
E
h
2
1/2 e
1
18
terminal 1
index area
24
19
X
D
h
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
mm
A
b
c
E
e
e
e
2
y
D
D
E
L
v
w
y
1
1
h
1
h
max.
0.05 0.30
0.00 0.18
4.1
3.9
2.25
1.95
4.1
3.9
2.25
1.95
0.5
0.3
0.05
0.1
1
0.2
0.5
2.5
2.5
0.1 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
01-08-08
02-10-22
SOT616-1
- - -
MO-220
- - -
Fig 30. Package outline SOT616-1 (HVQFN24)
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
26 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
HWQFN24: plastic thermal enhanced very very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.75 mm
SOT994-1
D
B
A
terminal 1
index area
E
A
A
1
c
detail X
e
1
1/2 e
b
C
M
M
v
C A
B
e
y
C
1
y
w
C
7
12
L
13
6
e
E
e
2
h
1/2 e
1
18
terminal 1
index area
24
19
X
D
h
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
D
D
E
E
e
e
1
e
2
L
v
w
y
y
1
1
h
h
max
0.05 0.30
0.00 0.18
4.1
3.9
2.25
1.95
4.1
3.9
2.25
1.95
0.5
0.3
mm
0.8
0.2
0.5
2.5
2.5
0.1
0.05 0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
- - -
07-02-07
07-03-03
SOT994-1
- - -
MO-220
Fig 31. Package outline SOT994-1 (HWQFN24)
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
27 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
14. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
© NXP B.V. 2009. All rights reserved.
PCA9555_8
Product data sheet
Rev. 08 — 22 October 2009
28 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 32) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 16 and 17
Table 16. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
235
≥ 350
220
< 2.5
≥ 2.5
220
220
Table 17. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 32.
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
29 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 32. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
16. Soldering of through-hole mount packages
16.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 °C and 400 °C, contact may be up to 5 seconds.
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
30 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
16.4 Package related soldering information
Table 18. Suitability of through-hole mount IC packages for dipping and wave soldering
Package
Soldering method
Dipping
Wave
CPGA, HCPGA
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP[2]
suitable
-
suitable[1]
not suitable
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
17. Abbreviations
Table 19. Abbreviations
Acronym
CMOS
GPIO
I2C-bus
SMBus
I/O
Description
Complementary Metal Oxide Semiconductor
General Purpose Input/Output
Inter-Integrated Circuit bus
System Management Bus
Input/Output
ACPI
LED
Advanced Configuration and Power Interface
Light Emitting Diode
ESD
ElectroStatic Discharge
Human Body Model
HBM
MM
Machine Model
CDM
PCB
Charged Device Model
Printed-Circuit Board
FET
Field-Effect Transistor
MSB
Most Significant Bit
LSB
Least Significant Bit
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
31 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
18. Revision history
Table 20. Revision history
Document ID
PCA9555_8
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20091022
Product data sheet
-
PCA9555_7
• Table 2 “Ordering options”, Topside mark for TSSOP24 package, PCA9555PW, is changed from
“PCA9555PW” to “PCA9555”
• Figure 13 “Read Input port register, scenario 1” modified
• Figure 14 “Read Input port register, scenario 2” modified
• Table 14 “Static characteristics”, Table note [1] modified (added phrase “for at least 5 µs”)
• updated soldering information
PCA9555_7
PCA9555_6
20070605
20060825
20040930
Product data sheet
Product data sheet
Product data sheet
-
-
-
PCA9555_6
PCA9555_5
PCA9555_4
PCA9555_5
(9397 750 14125)
PCA9555_4
(9397 750 13271)
20040727
20020726
20020513
20010507
Product data sheet
Product data
-
PCA9555_3
PCA9555_3
(9397 750 10164)
853-2252 28672 of PCA9555_2
2002 July 26
PCA9555_2
(9397 750 09818)
Product data
-
PCA9555_1
PCA9555_1
Product data
-
-
(9397 750 08343)
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
32 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
19.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PCA9555_8
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
33 of 34
PCA9555
NXP Semiconductors
16-bit I2C-bus and SMBus I/O port with interrupt
21. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
17
18
19
19.1
19.2
19.3
19.4
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 31
Revision history . . . . . . . . . . . . . . . . . . . . . . . 32
Legal information . . . . . . . . . . . . . . . . . . . . . . 33
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 33
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 33
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3
3.1
4
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
20
21
Contact information . . . . . . . . . . . . . . . . . . . . 33
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6
6.1
6.2
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.3
6.4
6.5
6.5.1
6.5.2
6.5.3
Functional description . . . . . . . . . . . . . . . . . . . 6
Device address. . . . . . . . . . . . . . . . . . . . . . . . . 6
Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Command byte . . . . . . . . . . . . . . . . . . . . . . . . . 6
Registers 0 and 1: Input port registers . . . . . . . 7
Registers 2 and 3: Output port registers. . . . . . 7
Registers 4 and 5: Polarity Inversion registers . 7
Registers 6 and 7: Configuration registers . . . . 8
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8
I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . . 9
Writing to the port registers . . . . . . . . . . . . . . . 9
Reading the port registers . . . . . . . . . . . . . . . 11
Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . 14
7
Characteristics of the I2C-bus. . . . . . . . . . . . . 14
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
START and STOP conditions . . . . . . . . . . . . . 14
System configuration . . . . . . . . . . . . . . . . . . . 15
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.1
7.1.1
7.2
7.3
8
Application design-in information . . . . . . . . . 16
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17
Static characteristics. . . . . . . . . . . . . . . . . . . . 18
Dynamic characteristics . . . . . . . . . . . . . . . . . 20
Test information. . . . . . . . . . . . . . . . . . . . . . . . 21
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 22
Handling information. . . . . . . . . . . . . . . . . . . . 28
9
10
11
12
13
14
15
Soldering of SMD packages . . . . . . . . . . . . . . 28
Introduction to soldering . . . . . . . . . . . . . . . . . 28
Wave and reflow soldering . . . . . . . . . . . . . . . 28
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 28
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 29
15.1
15.2
15.3
15.4
16
16.1
Soldering of through-hole mount packages . 30
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Soldering by dipping or by solder wave . . . . . 30
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 30
Package related soldering information . . . . . . 31
16.2
16.3
16.4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 22 October 2009
Document identifier: PCA9555_8
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