PCF1252-0 [NXP]
Threshold detector and reset generator; 阈值检测器和复位发生器型号: | PCF1252-0 |
厂家: | NXP |
描述: | Threshold detector and reset generator |
文件: | 总16页 (文件大小:111K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
PCF1252-X family
Threshold detector and reset
generator
1998 Apr 16
Product specification
Supersedes data of 1996 Jan 23
File under Integrated Circuits, IC11
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
FEATURES
GENERAL DESCRIPTION
• Very low current consumption, typically 10 µA
The PCF1252-Xs are low-power CMOS voltage threshold
detectors designed especially for supervision of
• 10 factory programmed threshold voltages available
microcontroller/microprocessor systems for detection of
power-on/off conditions and generation of a system reset
pulse. The PCF1252-X also provides a POWF (power fail)
output which is activated at a precise factory-programmed
trip point. A system RESET output has a built-in delay with
duration determined by an external capacitor (CCT).
covering trip voltages from 4.75 to 2.55 V
• ±50 mV trip point accuracy over full temperature range
• Variable RESET delay
• RESET pulse polarity selection
• Defined outputs at 0.6 V (typ.)
A second comparator (comparator 2) has been included to
enable the possibility of a second monitoring point in the
system.
• Comparator for second level detection
(e.g. overvoltage detection)
• Advance warning of power fail
• Operating temperature range −40 to +85 °C.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
SOT97-1
SOT96-1
PCF1252-XP(1)
PCF1252-XT(1)
DIP8
SO8
plastic dual in-line package; 8 leads (300 mil)
plastic small outline package; 8 leads; body width 3.9 mm
Note
1. X = 0 to 9; depending on threshold voltage.
BLOCK DIAGRAM
V
COMIN
3
DD
8
comparator 2
+
−
5
COMOUT
PCF1252-X
comparator 1
+
7
6
POWF
−
DELAY
1.30 V
RESET
4
1
2
MGC915
V
CT
SELECT
SS
Fig.1 Block diagram.
1998 Apr 16
2
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
PINNING
SYMBOL PIN
DESCRIPTION
handbook, halfpage
CT
1
2
3
4
5
6
7
8
connection for the external capacitor
select polarity or external reset input
comparator input
CT
1
2
3
4
8
7
6
5
V
DD
SELECT
COMIN
VSS
SELECT
COMIN
POWF
PCF1252-X
RESET
COMOUT
ground (0 V)
V
SS
COMOUT
RESET
POWF
VDD
comparator output
MGC916
reset output
power failure signal output
supply voltage
Fig.2 Pinning diagram.
FUNCTIONAL DESCRIPTION (see Fig.1)
Voltage trip-point
The PCF1252-X contains:
• A precise factory-programmed voltage reference
• Two comparators
By selecting the voltage trip-point slightly higher than the
minimum operating voltage of the
microcontroller/microprocessor, there is sufficient time for
data storage before the power actually fails.
• A delay circuit.
In order to prevent oscillations around the voltage
trip-point, a small hysteresis has been included, resulting
in a power-on switching point that is higher than the
voltage trip-point (minimum of 15 mV). The voltage
trip-point refers to the value at which power-off is signalled.
The PCF1252-X family is comprised of 10 versions with
different factory-programmed voltage trip-points (VTRIP),
see Chapter “Characteristics”.
Supply
COMIN
The supply voltage (VDD) is internally divided before being
compared, via comparator 1, with the internal reference
voltage.
Input to the second comparator (comparator 2).
When used in conjunction with an external voltage divider,
this allows a second point in the system to be monitored.
This input has no built-in hysteresis. When not in use
connect to VDD. COMOUT will be LOW or HIGH
depending on the voltage at COMIN:
POWF (see Fig.3)
The POWF output is:
• LOW, if VDD is below VTRIP
• COMOUT = HIGH, if voltage at COMIN is above the
switch point VSP (typically 1.30 V).
• HIGH, if VDD is above VTRIP
.
• COMOUT = LOW, if voltage at COMIN is below the
switch point VSP (typically 1.30 V).
Power-on reset (SELECT = LOW)
As VDD rises past VTRIP, a positive reset pulse is generated
at RESET. The duration of the reset pulse (tR) is
determined by the value of the external capacitor (CCT
;
maximum 1 µF, see Fig.8) connected to CT. With no
external capacitor connected, CCT assumes a minimum
value of 100 pF. If SELECT is HIGH, the reset pulse is
inverted.
Power failure
During a power-off condition (VDD < VTRIP), POWF goes
LOW. After a time delay (tS), also determined by CCT
,
RESET goes HIGH. Any POWF assertion (VDD < VTRIP
will result in a subsequent RESET pulse.
)
1998 Apr 16
3
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VDD
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
UNIT
−0.5
−0.5
−
+7.0
V
V
VI
II
input voltage
VDD + 0.5
20
DC clamp-diode current
all pins: VI < −0.5 V
mA
or VI > VDD + 0.5 V
IO
output current
−
20
mA
mW
°C
Ptot
Tstg
Tamb
total power dissipation
storage temperature
operating ambient temperature
−
150
+100
+85
−65
−40
°C
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal handling precautions appropriate to handling MOS devices (see “Handling MOS Devices”).
CHARACTERISTICS
VDD = 2.4 to 6.0 V; VSS = 0 V; Tamb = −40 to +85 °C; (see Fig.3); unless otherwise specified.
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
2.4
TYP.
MAX.
UNIT
VDD
−
6.0
V
VTRIP
Voltage trip-point:
PCF1252-0
PCF1252-1
PCF1252-2
PCF1252-3
PCF1252-4
PCF1252-5
PCF1252-6
PCF1252-7
PCF1252-8
PCF1252-9
supply current
Tamb = 25 °C; note 1
4.70
4.50
4.20
4.00
3.70
3.50
3.20
3.00
2.70
2.50
−
4.75
4.55
4.25
4.05
3.75
3.55
3.25
3.05
2.75
2.55
10
4.80
4.60
4.30
4.10
3.80
3.60
3.30
3.10
2.80
2.60
15
V
V
V
V
V
V
V
V
V
V
µA
IDD
Tamb = 25 °C;
VDD = VTRIP + 0.5 V;
COMIN = VDD
;
see Figs. 4 and 5
∆VTRIP
voltage trip-point temperature
coefficient
note 2
−
±100 × 10−6 ±400 × 10−6 mV/K
30 50 mV
Vhys
voltage trip-point hysteresis
15
1998 Apr 16
4
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
SYMBOL
COMIN
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VSP
COMIN switch point
Tamb = 25 °C; note 1 1.28
1.30
1.32
V
∆VSP
COMIN switch point temperature note 2
coefficient
−
±0.1
±0.5
mV/K
SELECT
VIL
VIH
LOW level input voltage
HIGH level input voltage
−
−
−
0.3VDD
V
V
0.7VDD
−
SELECT and COMIN
ILI
ILI
LOW level leakage input current
HIGH level leakage input current
−
−
−
−
−1.0
µA
µA
1.0
POWF, RESET and COMOUT
IO
output sink current
VO = 0.4 V;
VDD = 2.4 V;
see Fig.6
1
3
−
−
mA
mA
IO
output source current
VO = 2.0 V;
−0.75
−2
VDD = 2.4 V;
see Fig.7
tR
reset time
CCT = 1 nF; note 3
CCT = 1 nF; note 3
400
40
−
1000
100
10
2000
200
−
µs
µs
tS
save time
tR/tS
Cint
reset to save time ratio
CT internal capacitance
−
100
−
pF
Notes
1. Long time stability of COMIN switch point VSP and voltage trip point VTRIP: within 10 years of continuous operation
at VDD(max) and an average operating temperature of 55 °C the drift of VSP will not exceed ±10 mV. The maximum
drift for VTRIP will not exceed (±VTRIP(typ)/VSP(typ)) 10 mV.
2. Values given per degree Kelvin; tested on a sample basis.
3. Conformance to these specifications is only guaranteed if the slew rate of VDD is less than 25 V/ms.
1998 Apr 16
5
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
V
DD
V
hys
supply voltage
typ. = 0.6 V
V
TRIP
0 V
POWF
0 V
undefined
output
reset
reset
RESET
(SELECT = V
)
SS
0 V
t
t
t
MGC917
R
S
R
undefined
output
tR = reset time (duration of reset pulse).
tS = save time (time between assertion of POWF and assertion of the reset output). This time can be used for storing of critical data and orderly system
shut-down.
Vhys = hysteresis voltage (prevents oscillation around VTRIP).
Fig.3 Timing diagram.
1998 Apr 16
6
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
Typical performance characteristics
MGC918
MGC919
12
14
handbook, halfpage
handbook, halfpage
I
DD
I
DD
V
=
(µA)
TRIP
(µA)
2.55 V
12
10
8
V
=
TRIP
8
2.55 V
4.75 V
4.75 V
4
0
0
6
−40
2
4
6
8
0
40
80
T
120
( C)
o
V
(V)
DD
amb
Fig.4 Supply current as a function of temperature;
VDD = 5 V; COMIN = VDD
Fig.5 Supply current as a function of the supply
.
voltage; Tamb = +25 °C.
MGC921
MGC920
40
40
handbook, halfpage
handbook, halfpage
I
V
= 6 V
O
I
DD
V
=
O
DD
6 V
(mA)
(mA)
30
30
20
10
4.0 V
20
10
0
4.0 V
2.5 V
2.5 V
0
0
2
4
6
8
0
2
4
6
V
(V)
V
(V)
O
O
Fig.6 Output sink current as a function of the
output voltage.
Fig.7 Output source current as a function of the
output voltage.
1998 Apr 16
7
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
MGC922
3
2
10
10
handbook, full pagewidth
t
(1)
t (2)
S
(ms)
R
(ms)
2
10
10
10
1
−1
10
1
−2
−1
10
10
−3
−2
−1
2
3
10
10
10
1
10
10
10
external capacitor (nF)
(1) tR (typ.) = (0.1 + CCT) ms.
(2) tS (typ.) = (0.01 + 0.1 CCT) ms.
Fig.8 Reset and save times as a function of the external capacitor (CCT).
APPLICATION INFORMATION
V
DD
(+5 V)
V
V
DD
DD
PCF1252-X
COMIN
MICROCONTROLLER/
MICROPROCESSOR
RESET
RESET
SELECT
V
V
CT
SS
SS
MGC923
1 nF
V
SS
(0 V)
Fig.9 Typical power-on reset circuit for a microcontroller/microprocessor system; (when not used, COMIN must
be connected to VDD).
1998 Apr 16
8
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
VOLTAGE
5 V
12 V
REGULATOR
10
µF
6 MΩ
V
V
DD
DD
PCF1252-X
RESET
INT
COMIN
MICROCONTROLLER/
MICROPROCESSOR
COMOUT
RESET
SELECT
1 MΩ
V
V
CT
SS
SS
1 nF
addres/data bus
V
R/W
V
DD
RAM
RAM
CHIP-
DECODING
LOGIC
C
S
V
SS
MGC924
Fig.10 Data retention circuit for memory back-up systems.
V
DD
10
µF
V
V
V
DD
DD
DD
external reset
input signal (1)
RESET
INT
SELECT
RESET
POWF
MICROCONTROLLER/
MICROPROCESSOR
PCF1252-X
RAM
COMIN
V
V
V
CT
SS
SS
SS
V
SS
MGC925
(1) For external reset application, the SELECT input must be debounced.
Fig.11 Data retention circuit with external switchable reset for systems with a single voltage supply.
1998 Apr 16
9
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
D
M
E
A
2
A
A
1
L
c
w M
Z
b
1
e
(e )
1
M
H
b
b
2
8
5
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
1.15
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT97-1
050G01
MO-001AN
1998 Apr 16
10
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-02-04
97-05-22
SOT96-1
076E03S
MS-012AA
1998 Apr 16
11
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1998 Apr 16
12
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Apr 16
13
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
NOTES
1998 Apr 16
14
Philips Semiconductors
Product specification
Threshold detector and reset generator
PCF1252-X family
NOTES
1998 Apr 16
15
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Tel. +55 11 821 2333, Fax. +55 11 821 2382
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Spain: Balmes 22, 08007 BARCELONA,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Hungary: see Austria
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Tel. +1 800 234 7381
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1998
SCA59
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
295102/1200/03/pp16
Date of release: 1998 Apr 16
Document order number: 9397 750 03645
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