PCF2119FU2F2 [NXP]
LCD controllers/drivers Single-chip LCD controller and driver; LCD控制器/驱动器单芯片LCD控制器和驱动器型号: | PCF2119FU2F2 |
厂家: | NXP |
描述: | LCD controllers/drivers Single-chip LCD controller and driver |
文件: | 总83页 (文件大小:2409K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PCF2119x
LCD controllers/drivers
Rev. 7 — 15 November 2010
Product data sheet
1. General description
The PCF2119x is a low power CMOS1 LCD controller and driver, designed to drive a dot
matrix LCD display of 2-lines by 16 characters or 1-line by 32 characters with 5 × 8 dot
format. All necessary functions for the display are provided in a single chip, including
on-chip generation of LCD bias voltages, resulting in a minimum of external components
and lower system current consumption. The PCF2119x interfaces to most
microcontrollers via a 4-bit or 8-bit bus or via the 2-wire I2C-bus. The chip contains a
character generator and displays alphanumeric and kana (Japanese) characters.
The letter ‘x’ in PCF2119x characterizes the built-in character set. Various character sets
can be manufactured on request. In addition 16 user defined symbols (5 × 8 dot format)
are available.
2. Features and benefits
Single-chip LCD controller and driver
2-line display of up to 16 characters plus 160 icons or 1-line display of up to
32 characters plus 160 icons
5 × 7 character format plus cursor; 5 × 8 for kana (Japanese) and user defined
symbols
Reduced current consumption while displaying icons only
Icon blink function
On-chip:
Configurable 4, 3 or 2 times voltage multiplier generating LCD supply voltage,
independent of VDD, programmable by instruction (external supply also possible)
Temperature compensation of on-chip generated VLCDOUT: −0.16 %/K to
−0.24 %/K (programmable by instruction)
Generation of intermediate LCD bias voltages
Oscillator requires no external components (external clock also possible)
Display Data RAM (DDRAM): 80 characters
Character Generator ROM (CGROM): 240 characters (5 × 8)
Character Generator RAM (CGRAM): 16 characters (5 × 8); 4 characters used to drive
160 icons, 8 characters used if icon blink feature is used in application
4-bit or 8-bit parallel bus and 2-wire I2C-bus interface
Manufactured in silicon gate CMOS process
18 row and 80 column outputs
Multiplex rates 1:18 (2-line display or 1-line display), 1:9 (for 1-line display of up to
16 characters and 80 icons) and 1:2 (for icon only mode)
1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 20.
PCF2119x
NXP Semiconductors
LCD controllers/drivers
Uses common 11 code instruction set (extended)
Logic supply voltage: VDD1 − VSS1 = 1.5 V to 5.5 V (chip may be driven with two
battery cells)
LCD supply voltage: VLCDOUT − VSS2 = 2.2 V to 6.5 V
VLCD generator supply voltage: VDD2 − VSS2 = 2.2 V to 4 V and
VDD3 − VSS2 = 2.2 V to 4 V
Direct mode to save current consumption for icon mode and multiplex drive mode 1:9
(depending on VDD2 value and LCD liquid properties)
Very low current consumption (20 μA to 200 μA):
Icon mode: < 25 μA
Power-down mode: < 2 μA
Icon mode is used to save current. When only icons are displayed, a much lower LCD
operating voltage can be used and the switching frequency of the LCD outputs is
reduced; in most applications it is possible to use VDD as LCD supply voltage
3. Applications
Telecom equipment
Portable instruments
Point-of-sale terminals
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
PCF2119AU/2DA/2
PCF2119DU/2/2
PCF2119FU/2/F2
PCF2119RU/2/F2
PCF2119x
PCF2119x
PCF2119x
PCF2119x
bare die: 168 bumps; 7.59 × 1.71 × 0.38 mm
bare die: 168 bumps; 7.59 × 1.71 × 0.38 mm
bare die: 168 bumps; 7.59 × 1.71 × 0.38 mm
bare die: 168 bumps; 7.59 × 1.71 × 0.38 mm
bare die: 168 bumps; 7.59 × 1.71 × 0.38 mm
bare die: 168 bumps; 7.59 × 1.71 × 0.38 mm
PCF2119x
PCF2119x
PCF2119x
PCF2119x
PCF2119x
PCF2119x
PCF2119RU/2DB/2[1] PCF2119x
PCF2119SU/2/F2 PCF2119x
[1] With PI scratch protection coating, thickness 3.6 μm.
PCF2119X
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
2 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
5. Marking
Table 2.
Marking codes
Type number
Marking code
PC2119-2
PC2119-2
PC2119-2
PC2119-2
PC2119-2
PC2119-2
PCF2119AU/2DA/2
PCF2119DU/2/2
PCF2119FU/2/F2
PCF2119RU/2/F2
PCF2119RU/2DB/2
PCF2119SU/2/F2
PCF2119X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
3 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
6. Block diagram
C1 to C80
R17DUP
100
R1 to R18
60 to 99,
101 to 140
51 to 59,
141 to 149
80
18
COLUMN DRIVERS
80
ROW DRIVERS
BIAS
VOLTAGE
GENERATOR
44 to 49
V
LCDIN
18
DATA LATCHES
SHIFT REGISTER 18-BIT
37 to 43
36
80
V
LCDOUT
V
LCD
GENERATOR
SHIFT REGISTER 5 × 12 BIT
V
LCDSENSE
5
168
OSC
OSCILLATOR
CURSOR AND DATA CONTROL
5
1 to 6
V
DD1
7 to 14
V
V
DD2
DD3
CHARACTER
CHARACTER
GENERATOR
ROM
15 to 18
GENERATOR
RAM (128 × 5)
(CGRAM)
(CGROM)
16 CHARACTERS
240 CHARACTERS
22 to 29
30 to 35
TIMING
GENERATOR
V
V
SS1
SS2
8
20
T1
T2
T3
DISPLAY DATA RAM
(DDRAM)
80 CHARACTERS/BYTES
7
155
PD
21
153
7
7
DISPLAY
ADDRESS
COUNTER
ADDRESS COUNTER
(AC)
7
7
INSTRUCTION
DECODER
8
DATA
REGISTER
(DR)
INSTRUCTION
REGISTER
BUSY
FLAG
PCF2119X
154
8
POR
8
163
DB3/SA0
I/O BUFFER
156,
157
151,
152
160 to 162
164 to 167
19
158
159
E
RS
SCL
SDA
DB4 to DB7
DB0 to DB2
mgw571
R/W
Fig 1. Block diagram
PCF2119X
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
4 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
7. Pinning information
7.1 Pinning
49
44
dummy
R8
50
60
V
V
LCDIN
R1
R17
C80
LCDOUT
37
35
V
V
LCDSENSE
SS2
34
30
V
V
SS2
C66
C65
74
75
SS1
22
21
T2
T1
E
20
19
V
DD3
15
V
DD2
7
C41
R17DUP
C40
100
V
DD1
1
168
OSC
DB7
DB6
DB5
DB4
DB3/SA0
DB2
DB1
DB0
RS
C16
C15
125
126
158
R/W
PC2119
C1
R18
R9
SDA
PD
142
POR
T3
R16
149
150
SCL
dummy
151
mgw572
Top view. For mechanical details, see Figure 50.
Fig 2. Pinning diagram of PCF2119x (bare die)
PCF2119X
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
5 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
7.2 Pin description
Table 3.
Symbol
VDD1
Pin description
Pin
Description
1 to 6
supply voltage 1 (logic)
[1]
[1]
[2]
VDD2
7 to 14
15 to 18
19
supply voltage 2 (for high voltage generator)
supply voltage 3 (for high voltage generator)
data bus clock input
VDD3
E
• set HIGH to signal the start of a read or write operation
• data is clocked in or out of the chip on the negative edge
of the clock
T1 and T2
VSS1
20 and 21
22 to 29
30 to 35
36
test pins
• must be connected to VSS1
ground supply voltage 1
[3]
[3]
• for all circuits, except of high voltage generator
ground supply voltage 2
VSS2
• for high voltage generator
input for voltage multiplier regulation circuitry and for the bias
level generation
VLCDSENSE
• if VLCD is generated internally then this pin must be
connected to VLCDOUT and VLCDIN
• if VLCD is generated externally then this pin must be
connected to VLCDIN only
VLCDOUT
37 to 43
44 to 49
VLCD output
• if VLCD is generated internally then this pin must be
connected to VLCDIN and to VLCDSENSE
• if VLCD is generated externally then this pin must be left
open-circuit
VLCDIN
input for LCD bias level generator
• if VLCD is generated internally then this pin must be
connected to VLCDOUT and to VLCDSENSE
• if VLCD is generated externally then this pin must be
connected to VLCDSENSE and to the external VLCD power
supply
[4]
dummy
50
-
R8 to R1,
R17,
R17DUP,
R18,
51 to 58,
59,
100
LCD row driver output
• R17 has two pins: R17 and R17DUP
• R17 and R18 drive the icons
141,
R9 to R16
142 to 149
C80 to C41,
C40 to C1
dummy
SCL
60 to 99,
101 to 140
150
LCD column driver output
[4]
[5]
-
151 and 152
153
I2C-bus serial clock input
T3
test pin
• open-circuit
• not user accessible
POR
154
external Power-On Reset (POR) input
PCF2119X
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
6 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
Table 3.
Pin description …continued
Symbol
Pin
Description
power-down mode select
PD
155
• for normal operation pin PD must be LOW
I2C-bus serial data input/output
[5]
SDA
R/W
156 and 157
158
read/write input
• pin R/W = HIGH selects the read operation
• pin R/W = LOW selects the write operation
• this pin has an internal pull-up resistor
register select pin;
RS
159
• this pin has an internal pull-up resistor
8 bit bidirectional data bus (bit 0 to bit 7)
[6][7]
DB0 to DB2, 160 to 162,
DB3/SA0,
DB4 to DB7
163,
164 to 167
• the 8-bit bidirectional data bus (3-state) transfers data
between the microcontroller and the PCF2119x
• pin DB7 may be used as the busy flag, signalling that
internal operations are not yet completed
• 4-bit operations the 4 higher order lines DB7 to DB4 are
used, DB3 to DB0 must be left open-circuit
• data bus line DB3 has an alternative function (SA0) as the
I2C-bus address pin
• each data line has its own internal pull-up resistor
OSC
168
oscillator or external clock input
• when the on-chip oscillator is used this pin must be
connected to VDD1
[1] Always put VDD2 = VDD3
.
[2] When the I2C-bus is used, the parallel interface pin E must be LOW.
[3] The substrate (rear side of the die) is wired to VSS but should not be electrically connected.
[4] On the device connected to VSS1
.
[5] When the parallel bus is used, the pins SCL and SDA must be connected to VSS1 or VDD1; they must not be
left open-circuit.
[6] In the I2C-bus read mode, ports DB7 to DB4 and DB2 to DB0 should be connected to VDD1 or left
open-circuit.
[7] When the 4-bit interface is used without reading out from the PCF2119x (bit R/W is set permanently to
logic 0), the unused ports DB4 to DB0 can either be set to VSS1 or VDD1 instead of leaving them
open-circuit.
PCF2119X
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
7 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
8. Functional description
8.1 Oscillator and timing generator
The internal logic and the LCD drive signals of the PCF2119x are timed by the frequency
clk which equals either the built in oscillator frequency fosc or an external clock frequency
fclk(ext)
f
.
8.1.1 Timing generator
The timing generator produces the various signals required to drive the internal circuitry.
Internal chip operation is not disturbed by operations on the data buses.
8.1.2 Internal clock
To use the on-chip oscillator, pin OSC must be connected to VDD1. The on-chip oscillator
provides the clock signal for the display system. No external components are required.
8.1.3 External clock
If an external clock will be used, the input is at pin OSC. The resulting display frame
frequency is given by:
fosc
ffr
=
(1)
-----------
3072
Remark: Only in the power-down mode the clock is allowed to be stopped (pin OSC
connected to VSS), otherwise the LCD is frozen in a DC state, which is not suitable for the
liquid crystals.
8.2 Reset function and Power-On Reset (POR)
The PCF2119x must be reset externally when power is turned on. If no external reset is
performed, the chip might start-up in an unwanted state.
For the external reset, pin POR has to be active HIGH. The reset has to be active for at
least 3 oscillator periods in order for the reset to be executed. If the internal oscillator is
used, the minimum reset activity time follows from the lowest possible oscillator frequency
(fosc = 140 kHz, Tosc ~ 71 μs, 3 × Tosc ~ 215 μs). The internal oscillator start-up time is
200 μs (typ) up to 300 μs (max) after power-on. In case that an external oscillator is used,
Tosc is dependent from fosc(ext).
Afterwards the chip executes the Clear_display instruction, which requires 165 oscillator
cycles. After the reset the chip has the state shown in Table 4 and is then ready for use.
PCF2119X
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
8 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
Table 4.
State after reset
Step Function
Control bit and
register state
Description
Reference
1
2
Clear_display
Table 16
Entry_mode_set
bit I_D = 1
bit S = 0
bit D = 0
bit C = 0
bit B = 0
bit DL = 1
bit M = 0
bit SL = 0
incremental cursor move direction
no display shift
Table 18
3
4
Display_ctl
display off
Table 19
cursor off
cursor character blink off
8-bit interface
Function_set
Table 12
1-line display
1:18 multiplex drive mode
normal instruction set
bit H = 0
[1]
5
6
default address pointer to DDRAM
Icon_ctl
Table 22
Table 25
bit IM = 0
character mode, full display
icon blink disabled
bit IB = 0
7
Screen_conf
Disp_conf
Temp_ctl
bit L = 0
default configuration
default configurations
Table 23
Table 24
Table 28
Table 32
bit P = 0; bit Q = 0
8
9
bit TC1 = 0; bit TC2 = 0 default temperature coefficient
VLCD_set
register VA = 0;
register VB = 0
VLCD generator off
10
11
I2C-bus interface reset
HV_gen
bit S1 = 1; bit S0 = 0
VLCD generator set to 3 internal stages
(4 voltage multipliers)
Table 30
[1] The Busy Flag (BF) indicates the busy state (bit BF = 1) until initialization ends. The busy state lasts 2 ms. The chip may also be
initialized by software (see Table 43 and Table 44).
8.3 Power-down mode
The chip can be put into power-down mode by applying a HIGH-level to pin PD. In
power-down mode all static currents are switched off (no internal oscillator, no bias level
generation and all LCD outputs are internally connected to VSS).
During power-down, information in the RAM and the chip state are preserved. Instruction
execution during power-down is possible when pin OSC is externally clocked.
PCF2119X
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
9 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
8.4 LCD supply voltage generator
The LCD supply voltage may be generated on-chip. The VLCD generator is controlled by
two internal 6-bit registers: VA and VB. Register VA is programmed with the voltage for
character mode and register VB with the voltage for icon mode.
The nominal LCD operating voltage at room temperature is given by Equation 2:
VLCD(nom) = Vx × 0.08 + 1.82
(2)
Where Vx is the integer value of the register VA or VB.
It should be noted that VLCD is sometimes referred as the LCD operating voltage (Voper).
8.4.1 Programming ranges
Possible values for VA and VB are between 0 to 63.
Table 5.
Values of VA and VB and the corresponding VLCD values
All values at Tref = 27 °C; allowed values are highlighted.
Integer values Corresponding Integer values Corresponding
Integer values Corresponding
of VA and VB
value of VLCD in V
of VA and VB
value of VLCD in V
3.58
of VA and VB
value of VLCD in V
0
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
5.34
VLCD switched off
1.90
1
3.66
5.42
2
1.98
3.74
5.50
3
2.06
3.82
5.58
4
2.14
3.90
5.66
5
2.22
3.98
5.74
6
2.30
4.06
5.82
7
2.38
4.14
5.90
8
2.46
4.22
5.98
9
2.54
4.30
6.06
10
11
12
13
14
15
16
17
18
19
20
21
2.62
4.38
6.14
2.70
4.46
6.22
2.78
4.54
6.30
2.86
4.62
6.38
2.94
4.70
6.46
3.02
4.78
6.54
3.10
4.86
6.62
3.18
4.94
6.70
3.26
5.02
6.78
3.34
5.10
6.86
3.42
5.18
3.50
5.26
PCF2119X
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
10 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
Remarks:
• Values producing more than 6.5 V at operating temperature are not allowed.
Operation above this voltage may damage the device. When programming the
operating voltage the temperature coefficient of VLCDOUT must be taken into account.
• Values below 2.2 V are below the specified operating range of the chip and are
therefore not allowed.
When the LCD supply voltage is generated on-chip, the VLCD pins should be decoupled to
V
SS with a suitable capacitor. The generated VLCDOUT is independent of VDD and is
temperature compensated.
In Equation 2 the internal charge pump is not considered. However, if the supplied voltage
to VDD2 and VDD3 is below the required VLCD it is necessary to use the internal charge
pump. The multiplication factor has to be set such, that VDD2 and VDD3 (which are equal)
multiplied with the programmed multiplication factor exceeds the required VLCD under all
circumstances (i.e. at low temperatures and along with the temperature compensation -
see Section 10.2.3.4). If still a higher multiplication factor is chosen, VLCD will not increase
(it is set by Equation 2) but the current that can be delivered will be higher. Also current
consumption increases (see Section 16.6).
When the VLCD generator and the direct mode are switched off, an external voltage may
be supplied at connected pins VLCDIN and VLCDOUT. VLCDIN and VLCDOUT may be higher or
lower than VDD2
.
In direct mode (see Icon_ctl instruction, Section 10.2.3.3) the internal VLCD generator is
turned off and the VLCDOUT output voltage is directly connected to VDD2. This reduces the
current consumption depending on VDD2 value and LCD liquid properties.
The VLCD generator ensures that, as long as VDD2 and VDD3 are in the valid range (2.2 V
to 4 V), the required peak voltage VLCD = 6.5 V can be generated at any time.
8.5 LCD bias voltage generator
The intermediate bias voltages for the LCD display are also generated on-chip. This
removes the need for an external resistive bias chain and significantly reduces the system
current consumption. The optimum value of VLCD depends on the multiplex rate, the LCD
threshold voltage (Vth) and the number of bias levels. Using a 5-level bias scheme for the
1:18 multiplex rate allows VLCD < 5 V for most LCD liquids.
The intermediate bias levels for the different multiplex rates are shown in Table 6. These
bias levels are automatically set to the given values when switching to the corresponding
multiplex rate.
PCF2119X
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
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PCF2119x
NXP Semiconductors
LCD controllers/drivers
Table 6.
Bias levels as a function of multiplex rate
Multiplex
rate
Number of
bias levels
Bias voltages
V1
V2
V3
V4
V5
V6
1:18
5
5
4
VLCD
VSS
3
4
1
2
1
2
1
4
--
--
--
--
(VLCD – VSS
(VLCD – VSS
(VLCD – VSS
)
)
)
(VLCD – VSS
(VLCD – VSS
(VLCD – VSS
)
)
)
(VLCD – VSS
(VLCD – VSS
(VLCD – VSS
)
)
)
(VLCD – VSS
(VLCD – VSS
(VLCD – VSS
)
)
)
1:9
VLCD
VSS
VSS
3
1
1
1
--
--
--
--
4
2
2
4
1:2
VLCD
2
2
1
1
--
--
--
--
3
3
3
3
The RMS on-state voltage (Von(RMS)) for the LCD is calculated with Equation 3 and the
RMS off-state voltage (Voff(RMS)) with Equation 4:
a2 + 2a + n
n × (1 + a)2
Von(RMS)
=
=
-----------------------------
(3)
(4)
V
LCD
a2 – 2a + n
Voff(RMS)
-----------------------------
V
LCD
n × (1 + a)2
where the values of a are
a = 2 for 1⁄4 bias
a = 3 for 1⁄5 bias
and the values for n are
n = 2 for 1:2 multiplex rate
n = 9 for 1:9 multiples rate
n = 18 for 1:18 multiplex rate.
Discrimination (D) is the ratio of Von(RMS) to Voff(RMS) and is determined from Equation 5
(a + 1)2 + (n – 1)
Von(RMS)
Voff(RMS)
D =
=
-------------------------------------------
(5)
----------------------
(a – 1)2 + (n – 1)
8.5.1 Electro-optical performance
Suitable values for Von(RMS) and Voff(RMS) are dependant on the LCD liquid used. The
RMS voltage, at which a pixel will be switched on or off, determine the transmissibility of
the pixel.
For any given liquid, there are two threshold values defined. One point is at 10 % relative
transmission (at Vlow) and the other at 90% relative transmission (at Vhigh), see Figure 3.
For a good contrast performance, the following rules should be followed:
V
V
on(RMS) ≥ Vhigh
off(RMS) ≤ Vlow
(6)
(7)
PCF2119X
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
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PCF2119x
NXP Semiconductors
LCD controllers/drivers
Von(RMS) and Voff(RMS) are properties of the display driver and are affected by the selection
of a, n (see Equation 3 to Equation 5) and the VLCD voltage.
V
low and Vhigh are properties of the LCD liquid and can be provided by the module
manufacturer.
It is important to match the module properties to those of the driver in order to achieve
optimum performance.
100 %
90 %
10 %
V
RMS
[V]
V
low
V
high
OFF
SEGMENT
GREY
SEGMENT
ON
SEGMENT
001aam358
Fig 3. Electro-optical characteristic: relative transmission curve of the liquid
8.6 LCD row and column drivers
The PCF2119x contains 18 row and 80 column drivers, which drive the appropriate LCD
bias voltages in sequence to the display in accordance with the data to be displayed. R17
and R18 drive the icon rows. Unused outputs should be left open.
The bias voltages and the timing are selected automatically when the number of lines in
the display is selected. Figure 4 to Figure 6 show typical waveforms.
PCF2119X
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
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PCF2119x
NXP Semiconductors
LCD controllers/drivers
frame n
frame n +1
state 1 (on)
state 2 (off)
V
LCD
V
2
R1
R2
R3
R4
R5
R6
R7
R8
ROW 17 V /V
3
4
V
V
5
SS
V
LCD
V
2
ROW 18 V /V
3
4
V
V
5
SS
V
LCD
V
2
ROW 1 V /V
3
4
V
V
5
SS
R9
R10
V
LCD
V
2
ROW 9 V /V
3
4
V
V
5
SS
V
LCD
V
2
ROW 2 V /V
3
4
R17
R18
V
V
5
SS
V
LCD
V
2
C1 C2 C3 C4 C5
ROW 10 V /V
3
4
V
V
5
SS
V
V
LCD
2
COL 1
COL 2
V /V
3 4
V
V
5
SS
V
LCD
V
2
V /V
3
4
V
V
5
SS
V
LCD
0.5V
LCD
state 1
0.25V
LCD
0
−0.25V
LCD
LCD
−0.5V
−V
LCD
V
LCD
0.5V
LCD
state 2
0.25V
LCD
0
−0.25V
LCD
LCD
−0.5V
−V
LCD
013aaa140
1 2 3
18 1 2 3
18
state(n) marks intersection(row(x),col(n)) of pixel(x,n)
Vstate(n)(t) = VCOL(n)(t) − VROW(x)(t).
Vstate1(t) = VCOL1(t) − VROW1(t).
Vstate2(t) = VCOL2(t) − VROW1(t).
Fig 4. Waveforms for the 1:18 multiplex drive mode with 5 bias levels; character mode
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frame n
frame n +1
state 1 (off)
state 2 (on)
V
LCD
V
2
R1
R2
R3
R4
R5
R6
R7
R8
ROW 17 V /V
3
4
V
V
5
SS
V
LCD
V
2
ROW 1 V /V
3
4
V
V
5
SS
V
LCD
V
2
ROW 2 V /V
3
4
V
V
5
SS
V
LCD
V
2
ROW 3 V /V
3
4
V
V
5
SS
R17
V
LCD
V
2
C1 C2 C3 C4 C5
ROW 4 V /V
3
4
V
V
5
SS
V
V
LCD
2
COL 1
COL 2
V /V
3 4
V
V
5
SS
V
LCD
V
2
V /V
3
4
V
V
5
SS
V
LCD
0.5V
LCD
state 1
0.25V
LCD
0
−0.25V
LCD
LCD
−0.5V
−V
LCD
V
LCD
0.5V
LCD
state 2
0.25V
LCD
0
−0.25V
LCD
LCD
−0.5V
−V
LCD
013aaa141
1
2
3
9
1
2
3
9
state(n) marks intersection(row(x),col(n)) of pixel(x,n)
Vstate(n)(t) = VCOL(n)(t) − VROW(x)(t).
Vstate1(t) = VCOL1(t) − VROW1(t).
Vstate2(t) = VCOL2(t) − VROW1(t).
Fig 5. Waveforms for the 1:9 multiplex drive mode with 5 bias levels; character mode, R9 to R16 and R18 open
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frame n
frame n +1
only icons are
driven (MUX 1: 2)
V
LCD
2/3
1/3
SS
ROW 17
V
V
LCD
2/3
1/3
SS
ROW 18
V
V
LCD
2/3
1/3
SS
ROW 1 to 16
V
V
LCD
2/3
1/3
SS
COL 1
COL 2
COL 3
COL 4
ON/OFF
ON/OFF
ON/OFF
ON/OFF
V
V
LCD
2/3
1/3
V
SS
V
LCD
2/3
1/3
V
SS
V
LCD
2/3
1/3
V
SS
V
0.66V
0.33V
LCD
LCD
state 1 (ON)
state 2 (OFF)
LCD
0
state 1
state 2
−0.33V
−0.66V
−V
LCD
LCD
LCD
state 3 (OFF)
V
0.66V
0.33V
LCD
LCD
COL 2
COL 1
LCD
0
−0.33V
−0.66V
−V
LCD
LCD
LCD
V
0.66V
0.33V
LCD
LCD
LCD
0
state 3
−0.33V
−0.66V
−V
LCD
LCD
LCD
013aaa142
state(n) marks intersection(row(x),col(n)) of pixel(x,n)
Vstate(n)(t) = VCOL(n)(t) − VROW(x)(t).
Vstate1(t) = VCOL1(t) − VROW17(t).
Vstate2(t) = VCOL2(t) − VROW17(t).
Vstate3(t) = VCOL3(t) − VROW1 to 16(t).
Fig 6. Waveforms for the 1:2 multiplex drive mode with 4 bias levels; icon mode
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9. Display data RAM and ROM
9.1 DDRAM
The Display Data RAM (DDRAM) stores up to 80 characters of display data represented
by 8-bit character codes. RAM locations which are not used for storing display data can
be used as general purpose RAM.
The basic RAM to display addressing scheme is shown in Figure 7, Figure 8 and Figure 9.
With no display shift the characters represented by the codes in the first 32 RAM locations
starting at address 00h are displayed in line 1.
non-displayed DDRAM addresses
display
position
1
2
3
4
5
30 31 32
DDRAM
address
00 01 02 03 04
1D 1E 1F 20 21
4C 4D 4E 4F
1-line display
non-displayed DDRAM address
1
2
3
4
5
14 15 16
00 01 02 03 04
0D 0E 0F 10 11
24 25 26 27 line 1
DDRAM
address
1
2
3
4
5
14 15 16
40 41 42 43 44
4D 4E 4F 50 51
64 65 66 67 line 2
2-line display/MUX 1 : 9 mode
mgk892
All addresses are shown in hex.
Fig 7. DDRAM to display mapping: no shift
1
2
3
4
5
14 15 16
0C 0D 0E
line 1
27 00 01 02 03
DDRAM
address
1
2
3
4
5
14 15 16
4C 4D 4E
67 40 41 42 43
2-line display/MUX 1 : 9 mode
All addresses are shown in hex.
line 2
mgl536
Fig 8. DDRAM to display mapping: right shift
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display
position
1
2
3
4
5
30 31 32
1E 1F 20
01 02
04 05
03
DDRAM
address
1-line display
1
2
3
4
5
14 15 16
0E 0F 10
line 1
01 02 03 04 05
DDRAM
address
1
2
3
4
5
14 15 16
4E 4F 50
41 42 43 44 45
2-line display/MUX 1 : 9 mode
All addresses are shown in hex.
line 2
mgk894
Fig 9. DDRAM to display mapping: left shift
When data is written to or read from the DDRAM, wrap-around occurs from the end of one
line to the start of the next line. When the display is shifted each line wraps around within
itself, independently of the others. Thus all lines are shifted and wrapped around together.
The address ranges and wrap-around operations for the various modes are shown in
Table 7.
Table 7.
Address space and wrap-around operation
Mode
1 × 32
2 × 16
1 × 16
Address space
00h to 4Fh
00h to 27h;
40h to 67h
00h to 27h
Read/write wrap-around
(moves to next line)
4Fh to 00h
4Fh to 00h
27h to 40h;
67h to 00h
27h to 00h
27h to 00h
Display shift wrap-around
(stays within line)
27h to 00h;
67h to 40h
9.2 CGROM
The Character Generator ROM (CGROM) contains 240 character patterns in a 5 × 8 dot
format from 8-bit character codes. Figure 10 to Figure 15 show the character sets that are
currently implemented.
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upper
4 bits
0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111
lower
4 bits
1
2
xxxx 0000
xxxx 0001
xxxx 0010
xxxx 0011
xxxx 0100
xxxx 0101
xxxx 0110
xxxx 0111
xxxx 1000
xxxx 1001
xxxx 1010
xxxx 1011
xxxx 1100
xxxx 1101
xxxx 1110
xxxx 1111
3
4
5
6
7
8
9
10
11
12
13
14
15
16
mce190
The first column (0000) is the CGRAM, the other 15 columns (0001 to 1111) are the CGROM.
Fig 10. Character set ‘A’ in CGROM
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upper
4 bits
0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111
lower
4 bits
1
2
xxxx 0000
xxxx 0001
xxxx 0010
xxxx 0011
xxxx 0100
xxxx 0101
xxxx 0110
xxxx 0111
xxxx 1000
xxxx 1001
xxxx 1010
xxxx 1011
xxxx 1100
xxxx 1101
xxxx 1110
xxxx 1111
3
4
5
6
7
8
9
10
11
12
13
14
15
16
mce173
The first column (0000) is the CGRAM, the other 15 columns (0001 to 1111) are the CGROM.
Fig 11. Character set ‘D’ in CGROM
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upper
4 bits
0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111
lower
4 bits
1
2
xxxx 0000
xxxx 0001
xxxx 0010
xxxx 0011
xxxx 0100
xxxx 0101
xxxx 0110
xxxx 0111
xxxx 1000
xxxx 1001
xxxx 1010
xxxx 1011
xxxx 1100
xxxx 1101
xxxx 1110
xxxx 1111
3
4
5
6
7
8
9
10
11
12
13
14
15
16
mgu552
The first column (0000) is the CGRAM, the other 15 columns (0001 to 1111) are the CGROM.
Fig 12. Character set ‘F’ in CGROM
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upper
4 bits
0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111
lower
4 bits
1
2
xxxx 0000
xxxx 0001
xxxx 0010
xxxx 0011
xxxx 0100
xxxx 0101
xxxx 0110
xxxx 0111
xxxx 1000
xxxx 1001
xxxx 1010
xxxx 1011
xxxx 1100
xxxx 1101
xxxx 1110
xxxx 1111
3
4
5
6
7
8
9
10
11
12
13
14
15
16
mgl535
The first column (0000) is the CGRAM, the other 15 columns (0001 to 1111) are the CGROM.
Fig 13. Character set ‘R’ in CGROM
PCF2119X
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upper
4 bits
0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111
lower
4 bits
1
2
3
xxxx 0000
xxxx 0001
xxxx 0010
xxxx 0011
xxxx 0100
xxxx 0101
xxxx 0110
xxxx 0111
xxxx 1000
xxxx 1001
xxxx 1010
xxxx 1011
xxxx 1100
xxxx 1101
xxxx 1110
xxxx 1111
4
5
6
7
8
9
10
11
12
13
14
15
16
mgl534
The first column (0000) is the CGRAM, the other 15 columns (0001 to 1111) are the CGROM.
Fig 14. Character set ‘S’ in CGROM
PCF2119X
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upper
4 bits
0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111
lower
4 bits
1
2
3
xxxx 0000
xxxx 0001
xxxx 0010
xxxx 0011
xxxx 0100
xxxx 0101
xxxx 0110
xxxx 0111
xxxx 1000
xxxx 1001
xxxx 1010
xxxx 1011
xxxx 1100
xxxx 1101
xxxx 1110
xxxx 1111
4
5
6
7
8
9
10
11
12
13
14
15
16
mgl597
The first column (0000) is the CGRAM, the other 15 columns (0001 to 1111) are the CGROM.
Fig 15. Character set ‘V’ in CGROM
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9.3 CGRAM
Up to 16 user defined characters may be stored in the Character Generator RAM
(CGRAM). Some CGRAM characters (see Figure 22) are also used to drive icons:
• 6 CGRAM characters if icons blink and both icon rows are used in the application
• 3 CGRAM characters if no icons blink but both icon rows are used in the application
• 0 CGRAM characters if no icons are driven by the icon rows
When the icons blink option is enabled, double the number of CGRAM characters are
used since both the on and off state of an icon is defined.
The CGROM and CGRAM use a common address space, of which the first column is
reserved for the CGRAM (see Figure 10 to Figure 15).
Figure 16 shows the addressing principle for the CGRAM.
character codes
(DDRAM data)
CGRAM
address
character patterns
(CGRAM data)
character code
(CGRAM data)
7
0
6
5
4
3
2
1
0
0
6
0
5
4
3
2
1
0
4
3
2
1
0
4
3
2
1
0
higher
order
bits
lower
order
bits
higher
order
bits
lower
order
bits
higher
order
bits
lower
order
bits
1
1
1
1
1
1
1
0
1
0
0
1
0
0
0
0
1
0
0
1
1
0
0
0
1
0
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
0
1
1
0
0
0
1
0
0
0
0
0
0
0
character
pattern
(4)
0
0
0
example 1
0
0
0
0
0
(2)
0
0
0
0
0
cursor
position
(3)
0
0
1
0
1
0
1
0
0
0
0
1
1
0
1
0
0
0
0
0
1
1
1
1
1
0
0
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
0
0
0
1
0
1
0
1
0
0
0
0
0
0
0
character
pattern
example 2
(1)
(1)
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
(5)
1
1
0
0
0
0
0
0
0
1
coa072
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
(1) Character code bit 0 to bit 3 correspond to CGRAM address bit 3 to bit 6.
(2) CGRAM address bit 0 to bit 2 designate the character pattern line position. The 8th line is the cursor position and display is
performed by logical OR with the cursor. Data in the 8th line will appear in the cursor position. Lines are numbered from 0 to 7.
(3) Character pattern column positions correspond to CGRAM data bit 0 to bit 4, as shown in Figure 10 to Figure 15.
(4) As shown in Figure 10 to Figure 15, CGRAM character patterns are selected when character code bit 4 to bit 7 are all logic 0.
CGRAM data = logic 1 corresponds to selection for display.
(5) Only bit 0 to bit 5 of the CGRAM address are set by the Set_CGRAM command. Bit 6 can be set using the Set_DDRAM
command in the valid address range or by using the auto-increment feature during CGRAM write. All bits from bit 0 to bit 6 can
be read using the BF_AC instruction.
Fig 16. Relationship between CGRAM addresses, data and display patterns
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9.4 Cursor control circuit
The cursor control circuit generates the cursor underline and/or cursor blink as shown in
Figure 17 at the DDRAM address contained in the address counter.
cursor
013aaa139
5 × 7 dot character font
alternating display
cursor display example
blink display example
Fig 17. Cursor and blink display examples
row 18
icon 1
icon 5
row 17
row 8
row 17
row 8
row 2
row 1
row 2
row 1
cursor
013aaa156
Fig 18. Example of displays with icons
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10. Registers
The PCF2119x has two 8-bit registers, an instruction register and a data register. Only
these two registers can be directly controlled by the microcontroller. Before an internal
operation, the control information is stored temporarily in these registers, to allow
interfacing to various types of microcontrollers which operate at different speeds or to
allow interface to peripheral control ICs.
The instruction set for the parallel interface is shown in Table 11 together with their
execution time. Details about the parallel interface can be found in Section 11.1.
Examples of operations on a 4-bit bus are given in Table 38, on a 8-bit bus in Table 39,
Table 40 and Table 41.
When using the I2C-bus, the instruction has to be commenced with a control byte as
shown in Table 8. Details about the I2C-bus interface can be found in Section 11.2. An
example of operations on the I2C-bus is given in Table 42.
Table 8.
Control byte
Instruction set for I2C-bus commands
Command byte
I2C-bus
command
[1]
CO RS
0
0
0
0
0
0
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
[1] R/W is set together with the slave address (see Figure 31).
Table 9.
Control byte bit description
Bit
Symbol
Value
Description
7
CO
0
1
0
1
0
last control byte
another control byte follows after data/command
instruction register selected
data register selected
6
RS
4 to 0
-
default logic 0
Instructions are of 4 types, those that:
1. Designate PCF2119x functions like display format, data length, etc.
2. Set internal RAM addresses
3. Perform data transfer with internal RAM
4. Others, like read ‘busy flag’ and read ‘address counter’
In normal use, type 3 instructions are used most frequently. However, automatic
incrementing by 1 (or decrementing by 1) of internal RAM addresses after each data write
lessens the microcontroller program load. The display shift in particular can be performed
concurrently with display data write, enabling the designer to develop systems in minimum
time with maximum programming efficiency.
During internal operation, no instructions other than the BF_AC instruction will be
executed. Because the busy flag is set to logic 1 while an instruction is being executed,
check to ensure it is logic 0 before sending the next instruction or wait for the maximum
instruction execution time, as given in Table 11. An instruction sent while the busy flag is
logic 1 will not be executed.
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The RS bit determines which register will be accessed and the R/W bit indicates if it is a
read or a write operation (see Table 10).
Table 10. Register access selection
Symbol
Value
Description
RS
register select
instruction register[1]
data register[2]
read/write
0
1
R/W
0
1
write operation
read operation
[1] There is only write access to the instruction register, but read access to the busy flag (BF) and the address
counter (AC) of the BF_AC instruction (see Section 10.2.1.2).
[2] Write and read access.
Details of the instructions are explained in subsequent sections.
10.1 Data register
The data register temporarily stores data to be read from the DDRAM and CGRAM. Prior
to being read by the Read_data instruction, data from the DDRAM or CGRAM,
corresponding to the address in the instruction register, is written to the data register.
10.2 Instruction register
The instruction register stores instruction codes such as Clear_display, Curs_disp_shift,
and address information for the Display Data RAM (DDRAM) and Character Generator
RAM (CGRAM). The instruction register can be written to but not read from by the system
controller.
The instruction register is sectioned into basic, standard and extended instructions. Bit
H = 1 of the Function_set instruction (see Section 10.2.1.1) sets the chip into extended
instruction set mode.
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Table 11. Instruction register overview
Instruction
Bits[1]
Required
Reference
clock
cycles[2]
RS
R/W
7
6
5
4
3
2
1
0
Basic instructions (bit H = 0 or 1)
[3]
NOP
0
0
0
1
1
0
0
1
1
0
0
0
0
1
0
0
0
0
0
0
3
3
0
3
3
-
Function_set
BF_AC
0
0
DL
M
SL
H
Section 10.2.1.1
Section 10.2.1.2
Section 10.2.1.3
Section 10.2.1.4
BF
AC
Read_data
Write_data
READ_DATA
WRITE_DATA
Standard instructions (bit H = 0)
Clear_display
Return_home
Entry_mode_set
Display_ctl
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
1
0
S
B
0
165
3
Section 10.2.2.1
Section 10.2.2.2
Section 10.2.2.3
Section 10.2.2.4
Section 10.2.2.5
Section 10.2.2.6
Section 10.2.2.7
0
0
0
0
1
0
0
0
1
I_D
C
0
3
0
0
1
D
RL
3
Curs_disp_shift
Set_CGRAM
Set_DDRAM
0
0
SC
3
1
ACG
3
ADD
3
Extended instructions (bit H = 1)
[4]
Reserved
Screen_conf
Disp_conf
Icon_ctl
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
1
V
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
0
0
0
0
1
-
-
0
1
L
3
3
3
3
3
3
Section 10.2.3.1
Section 10.2.3.2
Section 10.2.3.3
Section 10.2.3.4
Section 10.2.3.5
Section 10.2.3.6
1
P
IB
Q
IM
0
DM
Temp_ctl
HV_gen
TC1 TC2
S1 S0
0
VLCD_set
VA or VB
[1] The bits 0 to 7 correspond with the data bus lines DB0 to DB7.
[2] fosc cycles.
[3] No operation.
[4] Do not use.
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10.2.1 Basic instructions (bit H = 0 or 1)
10.2.1.1 Function_set
Table 12. Function_set bit description
Bit
Symbol
Value
0
Description
RS
-
see Table 10
R/W
7 to 5
4
-
0
-
001
fixed value
DL
interface data length (for parallel mode only)
2 × 4 bits (DB7 to DB4)
8 bits (DB7 to DB0)
[1]
[2]
0
1
0
3
2
-
unused
[3]
[4]
M
number of display lines
1 line × 32 characters
2 line × 16 characters
multiplex mode
0
1
1
0
SL
H
0
1
1:18 multiplex drive mode, 1 × 32 or 2 × 16
character display
[4][5]
[4]
1:9 multiplex drive mode, 1 × 16 character display
instruction set control
0
1
basic instruction set plus standard instruction set
basic instruction set plus extended instruction set
[1] When 4-bit width is selected, data is transmitted in two cycles using the parallel-bus. In a 4-bit application
ports DB3 to DB0 should be left open-circuit (internal pull-ups).
[2] Default value after power-on in I2C-bus mode.
[3] No impact if SL = 1.
[4] Due to the internal pull-ups on DB3 to DB0 in a 4-bit application, the first Function_set after power-on sets
bits M, SL and H to logic 1. A second Function_set must be sent to set bits M, SL and H to the required
values.
[5] Independent of bit M and bit L of the Screen_conf instruction (see Section 10.2.3.1). Only row 1 to row 8
and row 17 are used. All other rows must be left open-circuit. The DDRAM map is the same as in the 2 × 16
character display mode, however, the second line cannot be displayed.
10.2.1.2 BF_AC instructions
Table 13. BF_AC bit
Bit
RS
R/W
7
Symbol
Value
Description
-
0
1
see Table 10
-
[1]
BF
read busy flag
0
1
next instruction will be executed
internal operation is in progress;
next instruction will not be executed until BF = 0
6 to 0
AC
0000000 to
1111111
read address counter
[1] It is recommended that the BF status is checked before the next write operation is started.
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Busy flag: The busy flag indicates the internal status of the PCF2119x. A logic 1 indicates
that the chip is busy and further instructions will not be accepted. The busy flag is output
to pin DB7 when bit RS = 0 and bit R/W = 1. Instructions should only be started after
checking that the busy flag is at logic 0 or after waiting for the required number of cycles.
Address counter: The address counter is used by both CGRAM and DDRAM, and its
value is determined by the previous Set_CGRAM and Set_DDRAM instruction. After a
read/write operation the address counter is automatically incremented or decremented
by 1. The address counter value is output to the bus (DB6 to DB0) when bit RS = 0 and bit
R/W = 1.
10.2.1.3 Read_data
Table 14. Read_data bit description
Bit
Symbol
Value
Description
RS
-
-
1
1
see Table 10
R/W
7 to 0
READ_DATA 00000000 to
11111111
read data from CGRAM or DDRAM
Read_data from CGRAM or DDRAM: Read_data reads binary 8-bit data from the
CGRAM or DDRAM. The most recent ‘set address’ command (Set_CGRAM or
Set_DDRAM) determines whether the CGRAM or DDRAM is to be read.
The Read_data instruction gates the content of the data register to the bus while pin E is
HIGH. After pin E goes LOW again, internal operation increments (or decrements) the
address counter and stores RAM data corresponding to the new address counter into the
data register.
There are only three instructions that update the data register:
• Set_CGRAM
• Set_DDRAM
• Read_data from CGRAM or DDRAM
Other instructions (e.g. Write_data, Curs_disp_shift, Clear_display and Return_home) do
not modify the value of the data register.
10.2.1.4 Write_data
Table 15. Write_data bit description
Bit
Symbol
Value
Description
RS
-
-
1
0
see Table 10
R/W
7 to 0
WRITE_DATA 00000000 to
11111111
write data to CGRAM or DDRAM
Write_data to CGRAM or DDRAM: Write_data writes binary 8-bit data to the CGRAM or
the DDRAM.
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The previous Set_CGRAM or Set_DDRAM command determines if data is written into
CGRAM or DDRAM. After writing, the address counter automatically increments or
decrements by 1, in accordance with the Entry_mode_set (see Section 10.2.2.3). Only bit
4 to bit 0 of CGRAM data are valid, bit 7 to bit 5 are ‘don’t care’.
10.2.2 Standard instructions (bit H = 0)
10.2.2.1 Clear_display
Table 16. Clear_display bit description
Bit
Symbol
Value
Description
RS
-
-
-
0
see Table 10
R/W
7 to 0
0
00000001
fixed value
Clear_display: writes usually the character code 20h (blank pattern) into all DDRAM
addresses except for the character sets ‘R’ and ‘V’ where the character code 20h is not a
blank pattern.
In addition Clear_display
• sets the DDRAM address counter to logic 0
• returns the display to its original position, if it was shifted. Thus, the display
disappears and the cursor or blink position goes to the left edge of the display
• sets entry mode bit I_D = 1 (increment mode); bit S of entry mode does not change
The instruction Clear_display requires extra execution time. This may be allowed by
checking the busy flag bit BF or by waiting until the 165 clock cycles have elapsed. The
latter must be applied where no read-back options are foreseen, as in some
Chip-On-Glass (COG) applications.
Remark: When using the character sets ‘R’ or ‘V’, where the character code 20h is not the
blank pattern, the following alternative instruction set has to be used:
1. Switch display off (Display_ctl, bit D = 0).
2. Write a blank pattern into all DDRAM addresses (Write_data).
3. Switch display on (Display_ctl, bit D = 1).
10.2.2.2 Return_home
Table 17. Return_home bit description
Bit
Symbol
Value
Description
RS
-
-
-
0
see Table 10
R/W
7 to 0
0
00000010
fixed value
Return_home: Sets the DDRAM address counter to logic 0 and switches a shifted
display back to an unshifted state. The DDRAM content remain unchanged. The cursor or
blink position goes to the left of the first display line. Bit I_D and bit S of the
Entry_mode_set instruction remain unchanged.
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10.2.2.3 Entry_mode_set
Table 18. Entry_mode_set bit description
Bit
Symbol
Value
Description
RS
-
0
see Table 10
R/W
7 to 2
1
-
0
-
000001
fixed value
I_D
address increment or decrement
0
1
DDRAM or CGRAM address decrements by 1,
cursor moves to the left
DDRAM or CGRAM address increments by 1,
cursor moves to the right
0
S
shift display to the left or right
display does not shift
display shifts
0
1
Bit I_D: When bit I_D = 1 the DDRAM or CGRAM address increments by 1 when data is
written into or read from the DDRAM or CGRAM. The cursor or blink position moves to the
right.
When bit I_D = 0 the DDRAM or CGRAM address decrements by 1 when data is written
into or read from the DDRAM or CGRAM. The cursor or blink position moves to the left.
The cursor underline and cursor character blink are inhibited when the CGRAM is
accessed.
Bit S: When bit S = 0, the display does not shift.
During DDRAM write, when bit S = 1 and bit I_D = 0, the entire display shifts to the right;
when bit S = 1 and bit I_D = 1, the entire display shifts to the left.
Thus it appears as if the cursor stands still and the display moves. The display does not
shift when reading from the DDRAM, or when writing to or reading from the CGRAM.
10.2.2.4 Display_ctl instructions
Table 19. Display_ctl bit description
Bit
Symbol
Value
Description
RS
-
-
0
see Table 10
R/W
7 to 3
2
0
00001
fixed value
D
C
B
display on or off
display is off; chip is in power-down mode
display is on
0
1
1
0
cursor on or off
0
1
cursor is off
cursor is on
character blink on or off
character blink is off
character blink is on
0
1
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Bit D: The display is on when bit D = 1 and off when bit D = 0. Display data in the DDRAM
is not affected and can be displayed immediately by setting bit D = 1.
When the display is off (bit D = 0) the chip is in partial power-down mode:
• The LCD outputs are connected to VSS
• The VLCD generator and bias generator are turned off
Three oscillator cycles are required after sending the ‘display off’ instruction to ensure all
outputs are at VSS, afterwards the oscillator can be stopped. If the oscillator is running
during partial power-down mode (‘display off’) the chip can still execute instructions. Even
lower current consumption is obtained by inhibiting the oscillator (pin OSC to VSS).
To ensure IDD < 1 μA:
• the parallel bus ports DB7 to DB0 should be connected to VDD
• pins RS and R/W should be connected to VDD or left open-circuit
• pin PD should be connected to VDD
Recovery from power-down mode:
• pin PD should be connected back to VSS
• if necessary pin OSC should be connected back to VDD
• a Display_ctl instruction with bit D = 1 should be sent
Bit C: The cursor is displayed when bit C = 1 and inhibited when bit C = 0. Even if the
cursor disappears, bit I_D and bit S (see Section 10.2.2.3) remain in operation during
display data write. The cursor is displayed using 5 dots in the 8th line (see Figure 17).
Bit B: The character indicated by the cursor blinks when bit B = 1. The character blink is
displayed by switching between display characters and all dots on with a period of
fosc
approximately 1 second, with fblink
=
--------------
52224
10.2.2.5 Curs_disp_shift
Table 20. Curs_disp_shift bit description
Bit
Symbol
Value
0
Description
RS
-
-
see Table 10
R/W
7 to 4
3
0
0001
fixed value
SC
RL
-
cursor move or display shift
move cursor
0
1
shift display
2
shift or move to the right or left
left shift or move
right shift or move
fixed value
0
1
1 to 0
00
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Bits SC and RL: Curs_disp_shift moves the cursor position or the display to the right or
left without writing or reading display data. This function is used to correct a character or
move the cursor through the display.
In 2-line displays, the cursor moves to the next line when it passes the last position (40) of
the line. When the displayed data is shifted repeatedly all lines shift at the same time;
displayed characters do not shift into the next line.
The address counter content does not change if the only action performed is shift display
(SC = 1) but increments or decrements with the shift cursor (SC = 0).
10.2.2.6 Set_CGRAM
Table 21. Set_CGRAM bit description
Bit
Symbol
Value
Description
RS
-
0
see Table 10
R/W
7 to 6
5 to 0
-
0
-
01
fixed value
ACG
000000 to
111111
set CGRAM address
Set_CGRAM: Sets the CGRAM address bits ACG[5:0] into the address counter. Data can
then be written to or read from the CGRAM.
Remark: The CGRAM address uses the same address register as the DDRAM address.
This register consists of 7 bits. But with the Set_CGRAM command, only bit 5 to bit 0 are
set. Bit 6 can be set using the Set_DDRAM command first, or by using the auto-increment
feature during CGRAM write. All bits 6 to 0 can be read using the BF_AC instruction.
When writing to the lower part of the CGRAM, ensure that bit 6 of the address is not set
(e.g. by an earlier DDRAM write).
10.2.2.7 Set_DDRAM
Table 22. Set_DDRAM bit description
Bit
Symbol
Value
Description
RS
-
0
0
1
see Table 10
R/W
7
-
-
fixed value
6 to 0
ADD
0000000 to
1111111
set DDRAM address
Set_DDRAM: Sets the DDRAM address bits ADD[6:0] into the address counter. Data can
then be written to or read from the DDRAM.
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10.2.3 Extended instructions (bit H = 1)
10.2.3.1 Screen_conf
Table 23. Screen_conf bit description
Bit
Symbol
Value
Description
RS
-
-
0
see Table 10
R/W
7 to 1
0
0
0000001
fixed value
L
screen configuration
0
1
split screen standard connection
split screen mirrored connection
Screen_conf:
• If bit L = 0, then the two halves of a split screen are connected in a standard way i.e.
column 1/81, 2/82 to 80/160.
• If bit L = 1, then the two halves of a split screen are connected in a mirrored way i.e.
column 1/160, 2/159 to 80/81. This allows single layer PCB or glass layout.
10.2.3.2 Disp_conf
Table 24. Disp_conf bit description
Bit
Symbol
Value
Description
RS
-
-
0
see Table 10
R/W
7 to 2
1
0
000001
fixed value
P
display column configuration
column data: left to right;
0
1
column data is displayed from column 1 to column
80
column data: right to left;
column data is displayed from column 80 to
column 1
0
Q
display row configuration
0
1
row data: top to bottom;
row data is displayed from row 1 to row 16 and
icon row data in row 17 and row 18
in single line mode (SL = 1) row data is displayed
from row 1 to row 8 and icon row data in row 17
row data: bottom to top;
row data is displayed from row 16 to row 1 and
icon row data in row 18 and row 17
in single line mode (SL = 1) row data is displayed
from row 8 to row 1 and icon row data in row 17
Bit P: The P bit is used to flip the display left to right by mirroring the column data, as
shown in Figure 19. This allows the display to be viewed from behind instead of front and
enhances the flexibility in the assembly of equipment and avoids complicated data
manipulation within the controller.
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P = 0
Q = 0
P = 1
Q = 0
013aaa122
Fig 19. Use of bit P
Bit Q: The Q bit flips the display top to bottom by mirroring the row data, as shown in
Figure 20.
P = 0
Q = 0
P = 0
Q = 1
013aaa113
Fig 20. Use of bit Q
Combination of bit P and bit Q: A combination of P and Q allows the display to be
rotated horizontally and vertically by 180 degree, as shown in Figure 21. This is useful for
viewing the display from the opposite edge.
P = 0
Q = 0
P = 1
Q = 1
013aaa123
Fig 21. Use of bit P and bit Q
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10.2.3.3 Icon_ctl
Table 25. Icon_ctl bit description
Bit
Symbol
Value
Description
RS
-
0
see Table 10
R/W
7 to 3
2
-
0
-
00001
fixed value
IM
icon mode
0
1
character mode, full display
icon mode, only icons displayed
1
0
IB
icon blink
icon blink disabled
icon blink enabled
direct mode
off
0
1
DM
0
1
on
The PCF2119x can drive up to 160 icons. See Figure 22 and Figure 23 for CGRAM to
icon mapping.
Bit IM: When bit IM = 0, the chip is in character mode. In the character mode characters
and icons are driven (multiplex drive mode 1:18 or 1:9). The VLCD generator, if used,
produces the VLCDOUT voltage programmed with register VA.
When bit IM = 1, the chip is in icon mode. In the icon mode only the icons are driven
(multiplex drive mode 1:2). The VLCD generator, if used, produces the VLCDOUT voltage as
programmed with register VB.
Table 26. Normal/icon mode operation
Bit IM
Mode
VLCDOUT
0
1
character mode
icon mode
generated from VA
generated from VB
Bit IB: Icon blink control is independent of the cursor/character blink function.
When bit IB = 0, the icon blink is disabled. Icon data is stored in CGRAM character 0 to 3
(4 × 8 × 5 = 160 bits for 160 icons).
When bit IB = 1, the icon blink is enabled. In this case each icon is controlled by two bits.
Blink consists of two half phases (corresponding to the cursor on and off phases called
even and odd phases hereafter).
Icon states for the even phase are stored in CGRAM characters 0 to 3
(4 × 8 × 5 = 160 bits for 160 icons). These bits also define icon state when icon blink is not
used (see Table 27).
Icon states for the odd phase are stored in CGRAM character 4 to 7 (another 160 bits for
the 160 icons). When icon blink is disabled CGRAM characters 4 to 7 may be used as
normal CGRAM characters.
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Table 27. Blink effect for icons and cursor character blink
Parameter Even phase Odd phase
cursor character blink block (all on)
icons state 1; CGRAM character 0 to 3
normal (display character)
state 2; CGRAM character 4 to 7
display:
COL 1 to 5
COL 6 to 10
COL 76 to 80
ROW 17 –
1
2
3
4
5
6
7
8
9
10
76 77 78 79 80
ROW 18 –
81 82 83 84 85
block of 5 columns
86 87 88 89 90
156 157 158 159 160
mgl249
Fig 22. CGRAM to icon mapping (a)
icon no.
phase
ROW/COL
character codes
CGRAM address
CGRAM data
icon view
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
4
3
2
1
0
MSB
LSB MSB
LSB MSB
LSB
1-5
6-10
11-15
even
even
even
17/1-5
17/6-10
17/11-15
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
0
0
1
1
1
0
1
0
1
1
1
0
0
76-80
81-85
even
even
17/76-80
18/1-5
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
1
1
0
1
0
1
0
1
0
1
1
1
1
1
0
1
0
1
0
156-160
1-5
even
18/76-80
17/1-5
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
0
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
0
1
0
odd (blink)
156-160
odd (blink) 18/76-80
0
0
0
0
0
1
1
1
0
1
1
1
1
1
1
0
0
1
1
0
mgk999
CGRAM data: logic 1 of a data bit turns the icon on and logic 0 turns the icon off.
Character codes: bits 0 to 3 define the icon state when icon blink is disabled or during the even phase when icon blink is
enabled. Bits 4 to 7 define the icon state during the odd phase when icon blink is enabled (not used for icons when icon blink is
disabled)
Fig 23. CGRAM to icon mapping (b)
Bit DM: When DM = 0, the chip is not in the direct mode. Either the internal VLCD
generator or an external voltage may be used to achieve VLCD
.
When DM = 1, the chip is in direct mode. The internal VLCD generator is turned off and the
output VLCDOUT is directly connected VDD2 (i.e. the VLCD generator supply voltage).
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Remark: In direct mode, no external VLCD is possible.
The direct mode can be used to reduce the current consumption when the required output
voltage VLCDOUT is close to the VDD2 supply voltage. This can be the case in icon mode or
in MUX 1:9 (depending on LCD liquid properties).
10.2.3.4 Temp_ctl
Table 28. Temp_ctl bit description
Bit
Symbol
Value
0
Description
RS
-
see Table 10
R/W
7 to 2
1 to 0
-
0
-
000100
00 to 11
TC[1:0]
temperature coefficient
The bit-field TC[1:0] selects the temperature coefficient for the internally generated
LCDOUT (see Table 29).
V
Table 29. TC[1:0] selection of VLCD temperature coefficient
TC[1:0]
00
Typical value
−0.16 %/K
−0.18 %/K
−0.21 %/K
−0.24 %/K
Description
VLCD temperature coefficient 0 (default value)
VLCD temperature coefficient 1
VLCD temperature coefficient 2
VLCD temperature coefficient 3
10
01
11
10.2.3.5 HV_gen
Table 30. HV_gen bit description
Bit
Symbol
Value
0
Description
RS
-
see Table 10
R/W
7 to 2
1 to 0
-
0
-
010000
00 to 11
fixed value
S[1:0]
voltage multiplier
A software configurable voltage multiplier is incorporated in the VLCD generator and can
be set via the HV_gen command. The voltage multiplier control can be used to reduce
current consumption by disconnecting internal voltage multiplier stages, depending on the
required VLCDOUT output voltage (see Table 31).
Table 31. Voltage multiplier control bits
S[1:0]
00
Description
set VLCD generator stages to 1 (2 × voltage multiplier)
set VLCD generator stages to 2 (3 × voltage multiplier)
set VLCD generator stages to 3 (4 × voltage multiplier)
do not use
01
10
11
PCF2119X
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10.2.3.6 VLCD_set
Table 32. VLCD_set bit description
Bit
RS
R/W
7
Symbol
Value
Description
-
0
0
1
see Table 10
-
-
fixed value
6
V
set register VA or VB
set register VA
set register VB
0
1
5 to 0
VA or VB
000000 to
111111
factor for calculating VLCD
The VLCD value is calculated with the Equation 2 on page 10. The multiplication factor is
programmed by instruction. Two on-chip registers (VA and VB) hold the multiplication
factor for the character mode and the icon mode, respectively. The generated VLCDOUT
value is independent of VDD, allowing battery operation of the chip.
Vx programming:
1. Send Function_set instruction with bit H = 1.
2. Send VLCD_set instruction to write to the voltage register:
a. Bit 7 = 1 and bit 6 = 0: bit 5 to bit 0 are the multiplication factor for VLCD of character
mode (VA).
b. Bit 7 = 1 and bit 6 = 1: bit 5 to bit 0 are the multiplication factor for VLCD of icon
mode (VB).
c. Bit 5 to bit 0 = 0 switches VLCD generator off (when selected).
d. During ‘display off’/power-down the VLCD generator is also disabled.
3. Send Function_set instruction with bit H = 0 to resume normal programming.
PCF2119X
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11. Basic architecture
11.1 Parallel interface
The PCF2119x can send data in either two 4-bit operations or one 8-bit operation and can
thus interface to 4-bit or 8-bit microcontrollers.
In 8-bit mode data is transferred as 8-bit bytes using the 8 ports DB7 to DB0. Three further
control lines E, RS and R/W are required.
In 4-bit mode data is transferred in two cycles of 4 bits each using ports DB7 to DB4 for
the transaction. The higher order bits (corresponding to range of bit 7 to bit 4 in 8-bit
mode) are sent in the first cycle and the lower order bits (bit 3 to bit 0 in 8-bit mode) in the
second cycle. Data transfer is complete after two 4-bit data transfers. It should be noted
that two cycles are also required for the busy flag check. 4-bit operation is selected by
instruction (see Figure 24 to Figure 26 for examples of bus protocol).
In 4-bit mode, ports DB3 to DB0 must be left open-circuit. They are pulled up to VDD
internally.
RS
R/W
E
DB7
DB6
DB5
DB4
IR7
IR6
IR5
IR4
IR3
IR2
IR1
IR0
BF
AC3
AC2
AC1
AC0
DR7
DR6
DR5
DR4
DR3
DR2
DR1
DR0
AC6
AC5
AC4
busy flag and
address counter read
data register
read
instruction
write
mga804
Fig 24. 4-bit transfer example
PCF2119X
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LCD controllers/drivers
RS
R/W
E
internal
DB7
internal operation
not
busy
IR7
IR3
AC3
AC3
D7
D3
busy
instruction
write
busy flag
check
busy flag
check
instruction
write
mga805
IR7, IR3: instruction 7th, 3rd bit.
AC3: address counter 3rd bit.
D7, D3: data 7th, 3rd bit.
Fig 25. An example of 4-bit data transfer timing sequence
RS
R/W
E
internal
internal operation
not
busy
data
busy
busy
data
DB7
instruction
write
busy flag
check
busy flag
check
busy flag
check
instruction
write
mga806
Fig 26. Example of busy flag checking timing sequence
PCF2119X
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11.2 I2C-bus interface
The I2C-bus is for bidirectional, two-line communication between different ICs or modules.
The two lines are the Serial Data line (SDA) and the Serial Clock Line (SCL). Both lines
must be connected to a positive supply via pull-up resistors. Data transfer may be initiated
only when the bus is not busy.
Each byte of eight bits is followed by an acknowledge bit. A slave receiver which is
addressed must generate an acknowledge after the reception of each byte.
Also a master receiver must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter.
The device that acknowledges must pull-down the SDA line during the acknowledge clock
pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge
related clock pulse (set-up and hold times must be taken into consideration).
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge bit on the last byte that has been clocked out of the slave. In this event the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
MASTER
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER/
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
MASTER
TRANSMITTER
SDA
SCL
mga807
Fig 27. System configuration
SDA
SCL
data line
change
of data
allowed
stable;
data valid
mbc621
Fig 28. Bit transfer
SDA
SDA
SCL
SCL
S
P
START condition
STOP condition
mbc622
Fig 29. Definition of START and STOP conditions
PCF2119X
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data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
8
SCL from
master
1
2
9
S
clock pulse for
acknowledgement
START
condition
mbc602
Fig 30. Acknowledgement on the I2C-bus
The I2C-bus interface of PCF2119x is 5 V tolerant.
11.2.1 I2C-bus protocol
One I2C-bus slave address is reserved for the PCF2119x (see Figure 31).
S
A
0
0
1
1
1
0
1
0
slave address
R/W
013aaa143
Fig 31. PCF2119x I2C-bus slave address
Before any data is transmitted on the I2C-bus, the device which should respond is
addressed first. The addressing is always carried out with the first byte transmitted after
the START procedure.
The I2C-bus configuration for the different PCF2119x read and write cycles is shown in
Figure 32 to Figure 34.
The slow down feature of the I2C-bus protocol (receiver holds SCL line LOW during
internal operations) is not used in the PCF2119x.
11.2.2 I2C-bus definitions
Definitions:
• Transmitter: the device which sends the data to the bus.
• Receiver: the device which receives the data from the bus.
• Master: the device which initiates a transfer, generates clock signals and terminates a
transfer.
• Slave: the device addressed by a master.
• Multi-master: more than one master can attempt to control the bus at the same time
without corrupting the message.
PCF2119X
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• Arbitration: procedure to ensure that if more than one master simultaneously tries to
control the bus, only one is allowed to do so and the message is not corrupted.
• Synchronization: procedure to synchronize the clock signals of two or more devices.
acknowledgement
from PCF2119x
S
A
0
S
0
1
1
1
0
1
0
A
1 RS CONTROL BYTE
DATA BYTE
A
0 RS CONTROL BYTE
1 byte
A
DATA BYTE
A P
A
slave address
2n ≥ 0 bytes
n ≥ 0 bytes
R/W Co
Co
update
data pointer
mgk899
Fig 32. Master transmits to slave receiver; write mode
acknowledgement
S
A
0
(1)
0
1
1
1
0
1
A
1 RSCONTROL BYTE A
DATA BYTE
0 RSCONTROL BYTE
1 byte
DATA BYTE
S
0
A
A
A
slave address
2n ≥ 0 bytes
n ≥ 0 bytes
R/W
Co
Co
acknowledgement
acknowledgement
no acknowledgement
S
A
0
SLAVE
ADDRESS
1
A
DATA BYTE
A
DATA BYTE
1
P
S
n bytes
last byte
R/W
Co
update
data pointer
update
data pointer
mgg003
Last data byte is a dummy byte (may be omitted).
Fig 33. Master reads after setting word address; writes word address, set RS; Read_data
PCF2119X
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acknowledgement
from PCF2119x
acknowledgement
from master
no acknowledgement
from master
S
A
0
SLAVE
ADDRESS
DATA BYTE
DATA BYTE
1
A
A
1
P
S
n bytes
last byte
update
data pointer
update
data pointer
R/W
Co
013aaa155
Fig 34. Master reads slave immediately after first byte; read mode (RS previously
defined)
PCF2119X
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12. Internal circuitry
Table 33. Device protection circuits
Symbol
Pin
Internal circuit
VDD1
1 to 6
V
V
DD1
SS1
013aaa169
VDD2
7 to 14
V
V
DD2
SS2
V
SS1
013aaa170
VDD3
15 to 18
V
V
DD3
SS1
013aaa171
VSS1
VSS2
22 to 29
30 to 35
V
V
SS2
SS1
013aaa172
VLCDSENSE
VLCDIN
VLCDOUT
SCL
36
44 to 49
37 to 43
151 to 152
156 to 157
168
V
SS1
013aaa173
SDA
OSC
V
DD1
PD
155
POR
154
T1
20
V
SS1
T2
21
013aaa174
T3
153
E
19
RS
159
R/W
158
DB0 to DB7
R1 to R18
160 to 167
58, 57 to 51,
142 to 149,
59, 100, 141
V
V
LCDIN
C1 to C80
140 to 101,
99 to 60
SS1
013aaa175
PCF2119X
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13. Limiting values
Table 34. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDD1
VDD2
VDD3
VLCD
VI
Parameter
Conditions
logic
Min
−0.5
−0.5
Max
+6.5
+4.5
Unit
V
supply voltage 1
supply voltage 2
supply voltage 3
LCD supply voltage
input voltage
VLCD generator
V
−0.5
−0.5
−0.5
−10
−10
−50
−50
−50
-
+7.5
+6.5
+7.5
+10
+10
+50
+50
+50
400
100
V
VDD related
VLCD related
DC level
V
V
II
input current
mA
mA
mA
mA
mA
mW
mW
IO
output current
DC level
IDD
ISS
supply current
ground supply current
LCD supply current
total power dissipation
output power
IDD(LCD)
Ptot
Po
dissipation per
output
-
[1]
[2]
[3]
[4]
VESD
electrostatic discharge voltage HBM
MM
-
±3000
±300
200
V
-
V
Ilu
latch-up current
-
mA
°C
°C
Tstg
Tamb
storage temperature
−65
−40
+150
+85
ambient temperature
operating
device
[1] Pass level; Human Body Model (HBM) according to Ref. 5 “JESD22-A114”.
[2] Pass level; Machine Model (MM), according to Ref. 6 “JESD22-A115”.
[3] Pass level; latch-up testing according to Ref. 7 “JESD78” at maximum ambient temperature (Tamb(max)).
[4] According to the NXP store and transport requirements (see Ref. 9 “NX3-00092”) the devices have to be
stored at a temperature of +8 °C to +45 °C and a humidity of 25 % to 75 %. For long term storage products
deviant conditions are described in that document.
PCF2119X
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14. Static characteristics
Table 35. Static characteristics
VDD1 = 1.5 V to 5.5 V; VDD2 = VDD3 = 2.2 V to 4.0 V; VSS = 0 V; VLCD = 2.2 V to 6.5 V; Tamb = −40 °C to +85 °C;
unless otherwise specified.
Symbol
Supplies
VDD1
Parameter
Conditions
Min
Typ
Max
Unit
supply voltage 1
supply voltage 2
supply voltage 3
LCD supply voltage
logic
1.5
2.2
-
-
5.5
4.0
V
V
VDD2
internal VLCD generation;
VLCD > VDD2 = VDD3
VDD3
VLCD
pins VLCD, VLCDIN, VLCDOUT
2.2
-
6.5
V
[1]
Ground supply current using external VLCD
ISS ground supply current
-
-
-
70
35
25
120
80
μA
μA
μA
[2]
[2]
VDD = 3 V; VLCD = 5 V
icon mode; VDD = 3 V;
VLCD = 2.5 V
45
power-down mode; VDD = 3 V;
VLCD = 2.5 V;
-
0.5
5
μA
DB7 to DB0, RS and R/W = 1;
OSC = 0; PD = 1
[1][3]
Ground supply current using internal VLCD
ISS
ground supply current
-
-
-
190
135
85
400
400
-
μA
μA
μA
[2]
[2]
VDD = 3 V; VLCD = 5 V
icon mode; VDD = 2.5 V;
VLCD = 2.5 V
Logic
VI
input voltage
−0.5
-
-
-
VDD1 + 0.5 V
VIL
LOW-level input voltage
HIGH-level input voltage
VSS1
0.3VDD1
VDD1
V
V
VIH
0.7VDD1
Oscillator input; pin OSC
VIL
VIH
LOW-level input voltage
HIGH-level input voltage
VSS1
-
VDD1 − 1.2 V
VDD1 − 0.1 -
VDD1
V
Data bus; pins DB7 to DB0
IOL
IOH
Ipu
IL
LOW-level output current VOL = 0.4 V; VDD1 = 5 V
HIGH-level output current VOH = 4 V; VDD1 = 5 V
1.6
−1
4
-
mA
mA
μA
μA
−8
0.15
-
-
pull-up current
VI = VSS1
0.04
−1
1
+1
leakage current
VI = VDD1, 2, 3 or VSS1, 2
I2C-bus; pins SDA and SCL
Inputs: pins SDA and SCL
VI
input voltage
−0.5
-
5.5
V
VIL
VIH
ILI
LOW-level input voltage
HIGH-level input voltage
input leakage current
input capacitance
0
-
0.3VDD1
V
0.7VDD1
-
5.5
+1
-
V
VI = VDD1, 2, 3 or VSS1, 2
−1
-
μA
pF
Ci
-
5
PCF2119X
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Table 35. Static characteristics …continued
VDD1 = 1.5 V to 5.5 V; VDD2 = VDD3 = 2.2 V to 4.0 V; VSS = 0 V; VLCD = 2.2 V to 6.5 V; Tamb = −40 °C to +85 °C;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Output: pin SDA
IOL
LOW-level output current VOL = 0.4 V; VDD1 > 2 V
VOL = 0.2 VDD1; VDD1 < 2 V
3
2
-
-
-
-
mA
mA
LCD outputs
[4]
[4]
[5]
RO
output resistance
row output, pins R1 to R18
-
-
-
10
15
20
30
kΩ
kΩ
mV
column output, pins C1 to C80
40
ΔVbias
ΔVLCD
bias voltage variation
LCD voltage variation
on pins R1 to R18 and
C1 to C80
130
[3]
Tamb = 25 °C
VLCD < 3 V
VLCD < 4 V
VLCD < 5 V
VLCD < 6 V
-
-
-
-
-
-
-
-
160
200
260
340
mV
mV
mV
mV
[1] LCD outputs are open-circuit; inputs at VDD or VSS; bus inactive.
[2] Tamb = 25 °C; fosc = 200 kHz.
[3] LCD outputs are open-circuit; VLCD generator is on; load current ILCD = 5 μA.
[4] Resistance of output pins (R1 to R18 and C1 to C80) with a load current of 10 μA; outputs measured one at a time; external LCD supply
LCD = 3 V; VDD1 = VDD2 = VDD3 = 3 V.
V
[5] LCD outputs open-circuit; external LCD supply.
PCF2119X
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15. Dynamic characteristics
Table 36. Dynamic characteristics
VDD1 = 1.5 V to 5.5 V; VDD2 = VDD3 = 2.2 V to 4.0 V; VSS = 0 V; VLCD = 2.2 V to 6.5 V; Tamb = −40 °C to +85 °C; unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Clock and oscillator
ffr(LCD)
fosc
LCD frame frequency
internal clock; VDD = 5.0 V
not available at any pin
45
140
140
-
95
250
-
147
450
450
300
Hz
oscillator frequency
kHz
kHz
μs
fosc(ext)
external oscillator frequency
[1]
td(startup)(OSC) start-up delay time on pin OSC oscillator, after power-down
Timing characteristics of parallel interface[2]
200
Write operation (writing data from microcontroller to PCF2119x); see Figure 35
tcy(en)
tw(en)
tsu(A)
th(A)
enable cycle time
enable pulse width
address set-up time
address hold time
data input set-up time
data input hold time
500
220
50
-
-
-
-
-
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
25
tsu(D)
th(D)
60
25
Read operation (reading data from PCF2119x to microcontroller); see Figure 36
tcy(en)
tw(en)
tsu(A)
th(A)
enable cycle time
500
220
50
25
-
-
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
ns
enable pulse width
address set-up time
address hold time
-
-
-
td(DV)
data input valid delay time
VDD1 > 2.2 V
VDD1 > 1.5 V
150
250
100
-
th(D)
data input hold time
20
Timing characteristics of I2C-bus interface[2]; see Figure 37
fSCL
SCL clock frequency
LOW period of the SCL clock
HIGH period of the SCL clock
data set-up time
-
-
-
-
-
-
-
400
kHz
μs
μs
ns
tLOW
tHIGH
tSU;DAT
tHD;DAT
tr
1.3
-
0.6
-
100
-
data hold time
0
-
ns
[1][3]
[1][3]
rise time of both SDA and SCL
signals
15 + 0.1 Cb
300
ns
tf
fall time of both SDA and SCL
signals
15 + 0.1 Cb
-
-
-
-
300
ns
pF
μs
μs
Cb
capacitive load for each bus
line
-
400
tSU;STA
tHD;STA
set-up time for a repeated
START condition
0.6
0.6
-
-
hold time (repeated) START
condition
PCF2119X
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Table 36. Dynamic characteristics …continued
VDD1 = 1.5 V to 5.5 V; VDD2 = VDD3 = 2.2 V to 4.0 V; VSS = 0 V; VLCD = 2.2 V to 6.5 V; Tamb = −40 °C to +85 °C; unless
otherwise specified.
Symbol
tSU;STO
tSP
Parameter
Conditions
Min
0.6
-
Typ
Max
-
Unit
μs
set-up time for STOP condition
-
-
pulse width of spikes that must
be suppressed by the input
filter
50
ns
tBUF
bus free time between a STOP
and START condition
1.3
-
-
μs
[1] Tested on sample base.
[2] All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to VIL and VIH with an
input voltage swing of VSS to VDD
.
[3] Cb = total capacitance of one bus line in pF.
V
V
V
IH
V
IL
IH
IL
RS
t
t
t
su(A)
h(A)
R/W
E
V
V
IL
IL
t
w(en)
h(A)
V
V
IH
IH
V
V
IL
IL
V
IL
t
h(D)
t
su(D)
V
V
V
V
IH
IL
IH
IL
DB0 to DB7
valid data
mbk474
t
cy(en)
Fig 35. Parallel bus write operation sequence; writing data from microcontroller to
PCF2119x
V
IH
V
IL
V
IH
V
IL
RS
t
t
t
su(A)
IH
h(A)
V
V
IH
R/W
E
t
w(en)
h(A)
V
V
IH
IH
V
V
IL
IL
V
IL
t
h(D)
t
d(DV)
V
V
V
V
OH
OL
OH
OL
DB0 to DB7
mbk475
t
cy(en)
Fig 36. Parallel bus read operation sequence; writing data from PCF2119x to
microcontroller
PCF2119X
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SDA
t
t
t
f
BUF
LOW
SCL
SDA
t
HD;STA
t
r
t
t
SU;DAT
HD;DAT
t
HIGH
t
SU;STA
t
SU;STO
mga728
Fig 37. I2C-bus timing diagram
PCF2119X
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16. Application information
16.1 General application information
The required minimum value for the external capacitors in an application with the
PCF2119x are: Cext from pins VLCD to VSS = 100 nF and for pins VDD to VSS = 470 nF.
Higher capacitor values are recommended for ripple reduction.
For COG applications the recommended ITO track resistance is to be minimized for the
I/O and supply connections. Optimized values for these tracks are below 50 Ω for the
supply and below 100 Ω for the I/O connections. Higher track resistance reduce
performance and increase current consumption. To avoid accidental triggering of
Power-On Reset (POR) (especially in COG applications), the supplies must be
adequately decoupled. Depending on power supply quality, VDD1 may have to be risen
above the specified minimum.
When external LCD supply voltage is supplied, VLCDOUT should be left open-circuit to
avoid any stray current, and VLCDIN must be connected to VLCDSENSE
.
The PCF2119x I2C-bus interface is compatible with systems, where the I2C pull-up
resistors are connected to a 5 V ±10 % supply.
16.2 Power supply connections for internal VLCD generation
V
1.5 V to 5.5 V
2.2 V to 4.0 V
GND
V
DD1
DD1
V
V
V
V
DD2
DD2
2.2 V to 4.0 V
GND
DD3
DD3
V
SS1
V
SS2
V
SS1
V
SS2
013aaa114
013aaa115
Drawings are showing alternative circuits.
Decoupling capacitors are not shown in the drawings.
Fig 38. Recommended VDD connections for internal VLCD generation
V
V
V
LCDIN
LCDOUT
LCDSENSE
V
SS2
013aaa116
The value of the capacitor should be at least 100 nF.
Fig 39. Recommended VLCD connections for internal VLCD generation
PCF2119X
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16.3 Power supply connections for external VLCD generation
V
1.5 V to 5.5 V
2.2 V to 4.0 V
GND
2.2 V to 4.0 V
V
DD1
DD1
V
V
V
V
DD2
DD2
DD3
DD3
V
SS1
V
SS2
V
SS1
V
SS2
GND
013aaa114
013aaa117
Drawings are showing alternative circuits.
Decoupling capacitors are not shown in the drawings.
Fig 40. Recommended VDD connections for external VLCD generation
V
V
V
LCDIN
V
LCD(ext)
n.c.
LCDOUT
V
SS2
LCDSENSE
013aaa118
The value of the capacitor should be at least 100 nF.
Fig 41. Recommended VLCD connections for external VLCD generation
Remark: When using an external VLCD, the internal VLCD generator must never be
switched on and direct mode must be avoided otherwise damages will occur.
16.4 Information about VLCD connections
VLCDIN — This input is used for generating the 5 LCD bias levels. It is the power supply for
the bias level buffers.
V
LCDOUT — This is the VLCD output if VLCD is generated internally. In this case pin VLCDOUT
must be connected to VLCDIN and to VLCDSENSE. If VLCD is generated externally, VLCDOUT
must be left unconnected.
V
LCDSENSE — This input is used for the voltage multiplier’s regulation circuitry. When
using the internal VLCD generation, this pin must be connected to VLCDOUT and VLCDIN
When using an external VLCD supply it must be connected to VLCDIN only.
.
16.5 Reducing current consumption
Reducing current consumption can be achieved by one of the options given in Table 37.
When VLCD lies outside the VDD range and must be generated, it is usually more efficient
to use the on-chip VLCD generator than an external regulator.
PCF2119X
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Table 37. Reducing current consumption
Original mode
character mode
display on
Alternative mode
icon mode (control bit IM)
display off (control bit D)
direct mode
VLCD generator operating
any mode
power-down mode (pin PD)
16.6 Charge pump characteristics
Typical graphs of the total power consumption of the PCF2119x using the internal charge
pump are illustrated in Figure 42, Figure 43 and Figure 44.
The graphs were obtained under the following conditions:
• Tamb = 25 °C
• VDD1 = VDD2 = VDD3 = 2.2 V (minimum), 2.7 V (typical) and 4.0 V (maximum)
• Normal mode
• fosc = internal oscillator
• multiplex drive mode 1:18
• Typical current load for ILCD = 10 μA.
For each multiplication factor there is a separate line. The line ends where it is not
possible to get a higher voltage under its conditions (a higher multiplication factor is
needed to get higher voltages).
Connecting different displays may result in different current consumption. This affects the
efficiency and the optimum multiplication factor to be used to generate a certain output
voltage.
mgw573
400
I
DD
(μA)
300
(2)
200
100
0
(3)
(1)
1.25
2.75
4.25
5.75
7.25
V
LCD
(V)
(1) 2 × multiplication factor.
(2) 3 × multiplication factor.
(3) 4 × multiplication factor.
Fig 42. Typical charge pump characteristics (a), VDD = 2.2 V
PCF2119X
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mgw574
300
I
DD
(μA)
(3)
(2)
200
(1)
100
0
1.25
2.75
4.25
5.75
7.25
V
LCD
(V)
(1) 2 × multiplication factor.
(2) 3 × multiplication factor.
(3) 4 × multiplication factor.
Fig 43. Typical charge pump characteristics (b), VDD = 2.7 V
mgw575
300
I
DD
(μA)
(3)
(2)
(1)
200
100
0
1.25
2.75
4.25
5.75
7.25
V
LCD
(V)
(1) 2 × multiplication factor.
(2) 3 × multiplication factor.
(3) 4 × multiplication factor.
Fig 44. Typical charge pump characteristics (c), VDD = 4.0 V
PCF2119X
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16.7 Interfaces
OSC
R17, R18
V
DD
V
DD
2 × 16 CHARACTER
2
R1 to R16
16
LCD DISPLAY
PCF2119X
PLUS 160 ICONS
470
nF
V
V
LCD
100
nF
C1 to C80
V
SS
80
SS
4,8
013aaa119
DB7 to DB4
DB3 to DB0
E
RS R/W
Fig 45. Typical application using parallel interface, 4 or 8 bit bus possible
V
V
V
DD DD
DD
2
DB3/SAO
R17, R18
OSC
V
V
DD
V
DD
2 × 16 CHARACTER
LCD DISPLAY
PLUS 160 ICONS
R1 to R16
16
PCF2119X
470
nF
V
V
LCD
100
nF
80
C1 to C80
SS
SS
SCL SDA
V
SS
DB3/SAO
2
R17, R18
OSC
V
V
DD
V
DD
1 × 32 CHARACTER
LCD DISPLAY
PLUS 160 ICONS
R1 to R16
16
PCF2119X
470
nF
V
V
LCD
100
nF
80
C1 to C80
SS
SS
SCL SDA
SCL SDA
2
I C MASTER,
MICROCONTROLLER
mgk898
Fig 46. Application using I2C-bus interface
PCF2119X
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16.8 Connections with LCD modules
R17
Icons
8
R1 to R8
Character row 1
Character row 2
PCF2119X
C1 to C80 80
8
R9 to R16
R18
013aaa120
Fig 47. Connecting PCF2119x with 2 × 16 character LCD
C1 to C80
R17
Icons
Icons
8
R1 to R8
Character row 1
Character row 1
PCF2119X
C1 to C80 80
8
R9 to R16
R18
013aaa121
Fig 48. Connecting PCF2119x with 1 × 32 character LCD
PCF2119X
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16.9 4-bit operation, 1-line display using external reset
The program must set functions prior to a 4-bit operation (see Table 38). When power is
turned on, 8-bit operation is automatically selected and the PCF2119x attempts to perform
the first write as an 8-bit operation. Since nothing is connected to ports DB0 to DB3, a
rewrite is then required. However, since one operation is completed in two accesses of
4-bit operation, a rewrite is required to set the functions (see Table 38 step 3). Thus,
DB4 to DB7 of the Function_set are written twice.
Table 38. 4-bit operation, 1-line display example; using external reset (character set ‘A’)
Step
Instruction
Display
Operation
RS R/W DB7 DB6 DB5 DB4
power supply on
1
2
initialized by the external reset; no display appears
Function_set
sets to 4-bit operation; in this instance operation is handled as
8-bit by initialization and only this instruction completes with
one write
0
0
0
0
1
0
3
4
5
6
Function_set
sets to 4-bit operation, selects 1-line display and VLCD = V0;
4-bit operation starts from this point and resetting is needed
0
0
0
0
0
0
0
0
1
0
0
0
Display_ctl
turns display and cursor on; entire display is blank after
initialization
0
0
0
0
0
1
0
1
0
1
0
0
Entry_mode_set
sets mode to increment the address by 1 and to shift the cursor
to the right at the time of write to the DDRAM or CGRAM;
display is not shifted
0
0
0
0
0
0
0
1
0
1
0
0
Write_data to CGRAM/DDRAM
writes ‘P’; the DDRAM has already been selected by
initialization at power-on; the cursor is incremented by 1 and
shifted to the right
1
1
0
0
0
0
1
0
0
0
1
0
P
16.10 8-bit operation, 1-line display using external reset
Table 39 and Table 40 show an example of a 1-line display in 8-bit operation. The
PCF2119x functions must be set by the Function_set instruction prior to display. Since the
DDRAM can store data for 80 characters, the RAM can be used for advertising displays
when combined with display shift operation. Since the display shift operation changes
display position only and the DDRAM contents remain unchanged, display data entered
first can be displayed when the Return_home operation is performed.
Table 39. 8-bit operation, 1-line display example; using external reset (character set ‘A’)
Step
Instruction
Display
Operation
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
1
2
power supply on
initialized by the external reset; no
display appears
Function_set
sets to 8-bit operation, selects 1-line
display and VLCD = V0
0
0
0
0
0
1
0
1
0
0
1
0
1
0
1
0
0
3
Display_ctl
turns on display and cursor; entire
display is blank after initialization
0
0
0
PCF2119X
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Table 39. 8-bit operation, 1-line display example; using external reset (character set ‘A’) …continued
Step
Instruction
Display
Operation
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
4
Entry_mode_set
sets mode to increment the address
by 1 and to shift the cursor to the right
at the time of the write to the
0
0
0
0
0
0
0
0
1
1
0
0
1
0
0
0
0
0
DDRAM/CGRAM; display is not shifted
5
6
Write_data to CGRAM/DDRAM
writes ‘P’; the DDRAM has already
been selected by initialization at
power-on; the cursor is incremented
by 1 and shifted to the right
1
0
0
1
0
1
P
Write_data to CGRAM/DDRAM
writes ‘H’
1
0
0
1
0
0
:
PH
7 to 10
11
PHILIP
writes ‘ILIP’
writes ‘S’
Write_data to CGRAM/DDRAM
1
0
0
1
0
1
0
0
0
1
0
1
0
1
1
1
0
0
1
1
0
1
PHILIPS
PHILIPS
HILIPS
12
13
14
Entry_mode_set
sets mode for display shift at the time
of write
0
0
0
0
0
0
Write_data to CGRAM/DDRAM
writes space
1
0
0
0
1
0
Write_data to CGRAM/DDRAM
writes ‘M’
1
0
0
1
0
0
:
ILIPS
M
15 to 19
20
MICROK
writes ‘ICROK’
writes ‘O’
Write_data to CGRAM/DDRAM
1
0
0
1
0
0
0
0
0
0
1
1
1
0
0
0
1
0
1
0
1
0
0
0
1
1
1
0
1
0
0
1
0
0
0
1
1
0
0
1
0
0
1
0
MICROKO
MICROKO
MICROKO
ICROCO
21
22
23
24
25
26
27
Curs_disp_shift
shifts only the cursor position to the left
shifts only the cursor position to the left
0
0
0
Curs_disp_shift
0
0
0
Write_data to CGRAM/DDRAM
writes ‘C’ correction; display moves to
the left
1
0
0
1
0
0
0
0
0
0
1
1
Curs_disp_shift
shifts the display and cursor to the
right
0
0
0
MICROCO
MICROCO
ICROCOM
PHILIPS M
Curs_disp_shift
shifts only the cursor to the right
0
0
0
Write_data to CGRAM/DDRAM
writes ‘M’
1
0
0
1
0
0
Return_home
returns both display and cursor to the
original position (address 0)
0
0
0
0
0
0
PCF2119X
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Table 40. 8-bit operation, 1-line display and icon example; using external reset (character set ‘A’)
Step
Instruction
Display
Operation
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
1
2
power supply on
initialized by the external reset; no
display appears
Function_set
sets to 8-bit operation, selects 1-line
display and VLCD = V0
0
0
0
0
0
0
1
0
0
1
0
0
0
1
0
0
1
1
0
1
1
0
0
0
3
4
Display_ctl
turns on display and cursor; entire
display is blank after initialization
0
0
0
Entry_mode_set
sets mode to increment the address
by 1 and to shift the cursor to the right
at the time of the write to the
0
0
0
DD/CGRAM; display is not shifted
5
6
Set_CGRAM
sets the CGRAM address to position of
character 0; the CGRAM is selected
0
0
0
1
0
0
0
1
0
0
0
1
0
0
Write_data to CGRAM/DDRAM
writes data to CGRAM for icon even
phase; icons appears
1
0
0
0
0
0
:
7
8
Set_CGRAM
sets the CGRAM address to position of
character 4; the CGRAM is selected
0
0
0
1
1
1
0
1
0
0
0
1
0
0
9
Write_data to CGRAM/DDRAM
writes data to CGRAM for icon odd
phase
1
0
0
0
0
0
:
10
11
Function_set
sets bit H = 1
icons blink
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
0
1
0
0
0
1
0
0
0
0
0
0
0
1
0
0
0
0
1
0
1
0
0
0
12
13
14
15
16
Icon_ctl
0
0
0
Function_set
sets bit H = 0
0
0
0
Set_DDRAM
sets the DDRAM address to the first
position; DDRAM is selected
0
0
1
Write_data to CGRAM/DDRAM
writes ‘P’; the cursor is incremented
by 1 and shifted to the right
1
0
0
1
0
1
P
Write_data to CGRAM/DDRAM
writes ‘H’
1
0
0
1
0
0
0
0
:
PH
17 to 21
22
PHILIPS
writes ‘ILIPS’
Return_home
returns both display and cursor to the
original position (address 0)
0
0
0
0
0
0
1
0
PHILIPS
PCF2119X
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16.11 8-bit operation, 2-line display
For a 2-line display the cursor automatically moves from the first to the second line after
the 40th digit of the first line has been written. Thus, if there are only 8 characters in the
first line, the DDRAM address must be set after the 8th character is completed
(see Table 41). It should be noted that both lines of the display are always shifted
together; data does not shift from one line to the other.
Table 41. 8-bit operation, 2-line display example; using external reset (character set ‘A’)
Instruction
Step
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display
Operation
1
power supply on
initialized by the external reset; no
display appears
2
3
4
Function_set
sets to 8-bit operation; selects 2-line
display and VLCD generator off
0
0
0
0
1
1
0
0
0
1
0
1
1
1
0
1
1
0
0
0
display mode on/off control
turns on display and cursor; entire
display is blank after initialization
0
0
0
0
0
Entry_mode_set
sets mode to increment the address
by 1 and to shift the cursor to the right
at the time of write to the CG/DDRAM;
display is not shifted
0
0
0
0
0
5
Write_data to CGRAM/DDRAM
writes ‘P’; the DDRAM has already
been selected by initialization at
power-on; the cursor is incremented
by 1 and shifted to the right
1
0
0
1
0
1
0
0
0
0
P
6 to 10
11
:
PHILIP
writes ‘HILIP’
writes ‘S’
Write_data to CGRAM/DDRAM
1
0
0
1
0
1
0
0
0
0
1
0
1
0
PHILIPS
PHILIPS
12
13
Set_DDRAM
sets DDRAM address to position the
cursor at the head of the 2nd line
0
0
1
1
0
0
Write_data to CGRAM/ DDRAM
writes ‘M’
1
0
0
1
0
0
1
1
0
1
PHILIPS
M
14 to 18
19
:
PHILIPS
MICROC
writes ‘ICROC’
writes ‘O’
Write_data to CGRAM/DDRAM
1
0
0
1
0
0
1
0
1
1
1
1
1
1
0
1
1
1
PHILIPS
MICROCO
20
21
Write_data to CGRAM/DDRAM
sets mode for display shift at the time
of write
0
0
0
0
0
0
PHILIPS
MICROCO
Write_data to CGRAM/DDRAM
writes ‘M’; display is shifted to the left;
the first and second lines shift
together
1
0
0
1
0
0
HILIPS
ICROCOM
PCF2119X
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Table 41. 8-bit operation, 2-line display example; using external reset (character set ‘A’) …continued
Instruction
Step
22
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display
Operation
:
:
23
Return_home
returns both display and cursor to the
original position (address 0)
0
0
0
0
0
0
0
0
1
0
PHILIPS
MICROCOM
16.12 I2C-bus operation, 1-line display
A control byte is required with most commands (see Table 42).
Table 42. Example of I2C-bus operation; 1-line display (using external reset, assuming pin SA0 = VSS
[1]
)
Step
I2C-bus byte
Display
Operation
1
2
I2C-bus start
initialized; no display appears
slave address for write
during the acknowledge cycle SDA will be
pulled-down by the PCF2119x
SA6 SA5 SA4 SA3 SA2 SA1 SA0 R/W Ack
0
1
1
1
0
1
0
0
1
3
4
5
6
send a control byte for Function_set
control byte sets RS for following data bytes
CO RS
0
0
0
0
0
0
0
0
0
0
0
0
Ack
1
0
0
Function_set
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
selects 1-line display and VLCD = V0; SCL
pulse during acknowledge cycle starts
execution of instruction
0
0
1
X
0
0
0
0
1
Display_ctl
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
turns on display and cursor; entire display
shows character code 20h (blank in
ASCII-like character sets)
0
0
0
0
1
1
1
0
1
Entry_mode_set
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
sets mode to increment the address by 1
and to shift the cursor to the right at the time
of write to the DDRAM or CGRAM; display
is not shifted
0
0
0
0
0
1
1
0
1
7
8
I2C-bus start
for writing data to DDRAM, RS must be set
to 1; therefore a control byte is needed
slave address for write
SA6 SA5 SA4 SA3 SA2 SA1 SA0 R/W Ack
0
1
1
1
0
1
0
0
1
9
send a control byte for Write_data
CO RS
0
0
0
0
0
0
0
0
0
0
0
0
Ack
1
0
1
10
11
Write_data to DDRAM
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack
writes ‘P’; the DDRAM has been selected at
power-on; the cursor is incremented by 1
and shifted to the right
P
0
1
0
1
0
0
0
0
1
Write_data to DDRAM
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack PH
writes ‘H’
0
1
0
0
1
:
0
0
0
1
12 to 15
PHILIP
writes ‘ILIP’
PCF2119X
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[1]
Table 42. Example of I2C-bus operation; 1-line display (using external reset, assuming pin SA0 = VSS
)
…continued
Step
I2C-bus byte
Display
Operation
16
Write_data to DDRAM
writes ‘S’
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack PHILIPS
0
1
0
1
0
0
1
1
1
17
18
19
optional l2C-bus STOP
I2C-bus start
PHILIPS
PHILIPS
slave address for write
SA6 SA5 SA4 SA3 SA2 SA1 SA0 R/W Ack PHILIPS
0
1
1
1
0
1
0
0
1
20
21
control byte
CO RS
0
0
0
0
0
0
0
0
0
0
0
0
Ack PHILIPS
1
0
1
Return_home
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack PHILIPS
sets DDRAM address 0 in address counter
(also returns shifted display to original
position; DDRAM contents unchanged); this
instruction does not update the data register
0
0
0
0
0
0
1
0
1
22
23
I2C-bus start
slave address for read
SA6 SA5 SA4 SA3 SA2 SA1 SA0 R/W Ack PHILIPS
PHILIPS
during the acknowledge cycle the content of
the data register is loaded into the internal
I2C-bus interface to be shifted out; in the
previous instruction neither a ‘set address’
nor a Read_data has been performed;
therefore the content of the data register
was unknown; bit R/W has to be set to logic
1 while still in I2C-write mode
0
1
1
1
0
1
0
1
1
24
25
control byte for read
DDRAM content will be read from following
instructions
CO RS
0
1
0
0
0
0
0
0
0
0
0
0
Ack PHILIPS
0
1
1
Read_data: 8 × SCL + master acknowledge[2]
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack PHILIPS
8 × SCL; content loaded into interface
during previous acknowledge cycle is
shifted out over SDA; MSB is DB7; during
master acknowledge content of DDRAM
address 01 is loaded into the I2C-bus
interface
X
X
X
X
X
X
X
X
0
26
27
Read_data: 8 × SCL + master acknowledge[2]
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack PHILIPS
8 × SCL; code of letter ‘H’ is read first;
during master acknowledge code of ‘I’ is
loaded into the I2C-bus interface
0
1
0
0
1
0
0
0
0
Read_data: 8 × SCL + no master acknowledge[2]
no master acknowledge; after the content of
the I2C-bus interface register is shifted out
no internal action is performed; no new data
is loaded to the interface register, data
register is not updated, address counter is
not incremented and cursor is not shifted
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Ack PHILIPS
0
1
0
0
1
0
0
1
1
28
I2C-bus STOP
PHILIPS
[1] X = don’t care.
[2] SDA is left at high-impedance by the microcontroller during the read acknowledge.
PCF2119X
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16.13 Initialization
Table 43. Initialization by instruction, 8-bit interface ([1]
)
Step
Instruction
Description
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
1
2
3
power-on or unknown state
wait 2 ms
after internal reset has been applied
Function_set
interface is 8 bits long; BF cannot be checked before
this instruction
0
0
0
0
0
1
1
1
1
1
1
X
X
X
X
X
X
X
X
X
X
X
X
4
5
wait 2 ms
Function_set
interface is 8 bits long; BF cannot be checked before
this instruction
0
0
0
6
7
wait more than 40 μs
Function_set
interface is 8 bits long; BF cannot be checked before
this instruction
0
0
0
0
BF can be checked after the following instructions; when BF is not checked, the waiting time between instructions is the
specified instruction time (see Table 11)
8
Function_set (interface is 8 bits long)
specify number of display lines
0
0
0
0
0
0
0
0
1
0
0
0
1
0
0
0
0
1
0
0
M
0
0
H
0
9
Display_ctl
display off
0
0
0
10
11
12
Clear_display
0
0
0
0
0
1
Entry_mode_set
0
0
0
1
I_D
S
initialization ends
[1] X = don’t care.
PCF2119X
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Table 44. Initialization by instruction, 4-bit interface; not applicable for I2C-bus operation
Step
Instruction
Description
RS R/W DB7 DB6 DB5 DB4
power-on or unknown state
1
2
3
wait 2 ms after internal reset has been applied
Function_set interface is 8 bits long; BF cannot be checked
before this instruction
0
0
0
0
0
1
1
1
1
1
1
4
5
wait 2 ms
Function_set
interface is 8 bits long; BF cannot be checked
before this instruction
0
0
0
6
7
wait more than 40 μs
Function_set
interface is 8 bits long; BF cannot be checked
before this instruction
0
0
0
0
BF can be checked after the following instructions; when BF is not checked, the waiting time
between instructions is the specified instruction time (see Table 11)
8
Function_set
0
0
0
0
1
0
set interface to 4 bit long
interface is 8 bit long
9
Function_set
0
0
0
0
0
0
0
1
0
0
set interface to 4 bits long
M
H
specify number of display line
10
11
12
Display_ctl
0
0
0
0
0
1
0
0
0
0
0
0
display off
Clear_display
0
0
0
0
0
0
0
0
0
0
0
1
Entry_mode_set
0
0
0
0
0
0
0
1
:
0
0
I_D
S
13
Initialization ends
PCF2119X
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16.14 User defined characters and symbols
Up to 16 user defined characters may be stored in the CGRAM. The content of the
CGRAM is lost during power-down, therefore the CGRAM has to be rewritten after every
power-on.
0
0
0
1
1
0
0
0
0
1
1
1
1
1
1
0
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
0
0
0
1
0
013aaa144
Fig 49. User defined euro currency sign
Below some source code is printed, which shows how a user defined character is defined
- in this case the euro currency sign. The display used is a 2 lines by 16 characters display
and the interface is the I2C-bus:
// Write
a user defined character into the CGRAM
startI2C();
// PCF2119 slave address for write, SA0 is connected to Vdd
SendI2CAddress(0x70);
// MSB (Continuation bit Co)
// is command byte
= 0, more than one byte may follow. Bit6, RS=0, next byte
i2c_write(0x00);
//
2 lines x 16, 1/18 duty, basic instruction set. Next byte will be another command.
i2c_write(0x24);
// Set CGRAM address to
i2c_write(0x40);
0
// Repeated Start condition
startI2C();
SendI2CAddress(0x70);
// RS=1, next byte is
i2c_write(0x40);
a data byte
// Here the data bytes to define the character
// Behind the write commands the 5x8 dot matrix is shown, the
1 represents a on pixel.
// The Euro currency character can be recognized by the 0/1 pattern (see Figure 49
)
i2c_write(0x06); // 00110
i2c_write(0x09); // 01001
i2c_write(0x08); // 01000
i2c_write(0x1E); // 11110
i2c_write(0x1E); // 11110
i2c_write(0x08); // 01000
i2c_write(0x09); // 01001
PCF2119X
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i2c_write(0x06); // 00110
i2c_stop();
// Until here the definition of the character and writing it into the CGRAM. Now it
// still needs to be displayed. See below.
// PCF2119, setting of proper display modes
startI2C();
// PCF2119 slave address for write, SA0 is connected to Vdd
SendI2CAddress(0x70);
// MSB (Continuation bit Co)
// is command byte
= 0, more than one byte may follow. Bit6, RS=0, next byte
i2c_write(0x00);
//
2 lines x 16, 1/18 duty, extended instruction set. Next byte will be another
// command.
i2c_write(0x25);
// Set display configuration to right to left, column 80 to 1. Row data displ. top to
// bottom,1 to 16.
i2c_write(0x06);
// Set to character mode, full display, icon blink disabled
i2c_write(0x08);
// Set voltage multiplier to
i2c_write(0x40);
2
// Set Vlcd and store in register VA
i2c_write(0xA0);
// Change from extended instruction set to basic instruction set
i2c_write(0x24);
// Display control: set display on, cursor off, no blink
i2c_write(0x0C);
// Entry mode set, increase DDRAM after access, no shift
i2c_write(0x06);
// Return home, set DDRAM address
i2c_write(0x02);
0 in address counter
// Clear entire display, set DDRAM address to
i2c_write(0x01);
0 in address counter
// Repeated Start condition because RS needs to be changed from
0 to 1
startI2C();
SendI2CAddress(0x70);
// RS=1, next byte is data
i2c_write(0x40);
// Write the character at address 0, which is the previously defined Euro currency
// character
i2c_write(0x00);
i2c_stop();
PCF2119X
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17. Bare die outline
Bare die: 168 bumps; 7.59 x 1.71 x 0.38 mm
PCF2119X
D
Z
x
y
E
0
0
PC2119-2
Y
X
e
b
A
1
e
b
A
1
1
L
detail X
detail Y
detail Z
0
2.5
scale
5 mm
Dimensions
(1)
A
(1)
(1)
(1)
(1)
(1)
(1)
Unit
max
A
b
b
1
D
E
e
e
1
L
1
0.0225
mm nom 0.380 0.0175 0.050 0.100 7.59 1.71 0.070 0.350 0.090
min 0.0125
Note
1. Dimension not drawn to scale
pcf2119x_do
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
09-07-16
09-08-03
PCF2119X
Fig 50. Bare die outline of PCF2119x
PCF2119X
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NXP Semiconductors
LCD controllers/drivers
Table 45. Pin location
All X and Y coordinates are referenced to the center of the chip (dimensions in μm).
Symbol
VDD1
VDD1
VDD1
VDD1
VDD1
VDD1
VDD2
VDD2
VDD2
VDD2
VDD2
VDD2
VDD2
VDD2
VDD3
VDD3
VDD3
VDD3
E
Pin
1
X
Y
Description
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
−274
logic supply voltage 1
2
−204
3
−134
4
−64
5
+6
6
+76
7
+146
VLCD generator supply voltage 2
8
+216
9
+286
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
+356
+426
+496
+566
+636
+706
+776
+846
+916
+986
data bus clock input
test pin 1
T1
+1196
+1406
+1616
+1686
+1756
+1826
+1896
+1966
+2036
+2106
+2176
+2246
+2316
+2386
+2456
+2666
+2736
+2806
+2876
+2946
+3016
T2
test pin 2
VSS1
ground 1
VSS1
VSS1
VSS1
VSS1
VSS1
VSS1
VSS1
VSS2
ground 2
VSS2
VSS2
VSS2
VSS2
VSS2
VLCDSENSE
VLCDOUT
VLCDOUT
VLCDOUT
VLCDOUT
input for voltage multiplier regulation
VLCD output
PCF2119X
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Table 45. Pin location …continued
All X and Y coordinates are referenced to the center of the chip (dimensions in μm).
Symbol
VLCDOUT
VLCDOUT
VLCDOUT
VLCDIN
Pin
41
42
43
44
45
46
47
48
49
X
Y
Description
+745
+745
+745
+745
+745
+745
+745
+745
+745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
+3086
+3156
+3226
+3296
+3366
+3436
+3506
+3576
+3646
+3576
+3506
+3436
+3366
+3296
+3226
+3156
+3086
+3016
+2946
+2876
+2806
+2736
+2666
+2596
+2526
+2456
+2386
+2316
+2246
+2176
+2106
+2036
+1966
+1896
+1756
+1686
+1616
+1546
+1476
+1406
VLCD output
input for generation of LCD bias levels
VLCDIN
VLCDIN
VLCDIN
VLCDIN
VLCDIN
dummy (VSS1) 50
dummy
R8
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
LCD row driver output
R7
R6
R5
R4
R3
R2
R1
R17
C80
C79
C78
C77
C76
C75
C74
C73
C72
C71
C70
C69
C68
C67
C66
C65
C64
C63
C62
C61
C60
LCD column driver output
PCF2119X
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Table 45. Pin location …continued
All X and Y coordinates are referenced to the center of the chip (dimensions in μm).
Symbol
C59
C58
C57
C56
C55
C54
C53
C52
C51
C50
C49
C48
C47
C46
C45
C44
C43
C42
C41
R17DUP
C40
C39
C38
C37
C36
C35
C34
C33
C32
C31
C30
C29
C28
C27
C26
C25
C24
C23
C22
C21
Pin
81
X
Y
Description
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
+1336
+1266
+1196
+1126
+1056
+986
+916
+846
+776
+706
+636
+566
+496
+426
+356
+286
+216
+146
+76
LCD column driver output
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
+6
LCD row driver output
−64
LCD column driver output
−134
−204
−274
−344
−414
−484
−554
−624
−694
−764
−834
−904
−974
−1044
−1114
−1184
−1254
−1324
−1394
PCF2119X
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LCD controllers/drivers
Table 45. Pin location …continued
All X and Y coordinates are referenced to the center of the chip (dimensions in μm).
Symbol
C20
C19
C18
C17
C16
C15
C14
C13
C12
C11
C10
C9
Pin
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
X
Y
Description
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
−745
+745
+745
+745
+745
+745
+745
+745
+745
+745
+745
−1464
−1534
−1604
−1674
−1744
−1884
−1954
−2024
−2094
−2164
−2234
−2304
−2374
−2444
−2514
−2584
−2654
−2724
−2794
−2864
−2934
−3004
−3074
−3144
−3214
−3284
−3354
−3424
−3494
−3704
−3704
−3634
−3494
−3424
−3214
−3004
−2934
−2584
−2374
−2164
LCD column driver output
C8
C7
C6
C5
C4
C3
C2
C1
R18
R9
LCD row driver output
R10
R11
R12
R13
R14
R15
R16
dummy (VSS1) 150
dummy
I2C-bus serial clock input
SCL
SCL
T3
151
152
153
154
155
156
157
158
159
160
test pin 3
POR
PD
external Power-On Reset (POR) input
power-down mode select input
I2C-bus serial data input/output
SDA
SDA
R/W
RS
read/write input
register select input
DB0
8-bit bidirectional data bus; bit 0
PCF2119X
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Table 45. Pin location …continued
All X and Y coordinates are referenced to the center of the chip (dimensions in μm).
Symbol
DB1
Pin
161
162
163
164
165
166
167
168
X
Y
Description
+745
+745
+745
+745
+745
+745
+745
+745
−1954
−1744
−1534
−1324
−1114
−904
−694
−484
8-bit bidirectional data bus; bit 1
8-bit bidirectional data bus; bit 2
8-bit bidirectional data bus; bit 3
8-bit bidirectional data bus; bit 4
8-bit bidirectional data bus; bit 5
8-bit bidirectional data bus; bit 6
8-bit bidirectional data bus; bit 7
oscillator or external clock input
DB2
DB3/SA0
DB4
DB5
DB6
DB7
OSC
Table 46. Alignment mark location
All X and Y coordinates are referenced to the center of the chip (dimensions in μm).
Symbol
AM1
Pin
X
Y
-
-
-
-
+745
+745
−745
−745
−2689
+2561
+3681
−3599
AM2
AM3
AM4
18. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
PCF2119X
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LCD controllers/drivers
19. Packing information
A
C
1.1
1.2
1.3
2.1
2.2
3.1
x.1
D
F
1.y
B
y
E
x
001aai624
For dimensions see Table 47.
Fig 51. Tray details
Table 47. Tray dimensions
Dimension
Description
Value
A
B
C
D
E
F
x
pocket pitch x direction
pocket pitch y direction
pocket width x direction
pocket width y direction
tray width x direction
tray width y direction
pockets in x direction
pockets in y direction
10.16 mm
4.45 mm
7.74 mm
1.91 mm
50.8 mm
50.8 mm
4
y
10
PCF2119X
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LCD controllers/drivers
marking code
001aaj623
The orientation of the IC in a pocket is indicated by the position of the IC type name on the die
surface with respect to the chamfer on the upper left corner of the tray. Refer to the bonding pin
location diagram for the orientating and position of the type name on the die surface.
Fig 52. Tray alignment
PCF2119X
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20. Abbreviations
Table 48. Abbreviations
Acronym
CGRAM
CGROM
CMOS
COG
DC
Description
Character Generator RAM
Character Generator ROM
Complementary Metal Oxide Semiconductor
Chip-On-Glass
Direct Current
DDRAM
HBM
I2C
Display Data RAM
Human Body Model
Inter-Integrated Circuit
Integrated Circuit
IC
ITO
Indium Tin Oxide
LCD
Liquid Crystal Display
Least Significant Bit
Machine Model
LSB
MM
MSB
MSL
Most Significant Bit
Moisture Sensitivity Level
Multiplexer
MUX
PCB
Printed-Circuit Board
Power-On Reset
POR
RAM
RMS
ROM
SCL
Random Access Memory
Root Mean Square
Read Only Memory
Serial Clock Line
SDA
Serial Data Line
PCF2119X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
79 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
21. References
[1] AN10170 — Design guidelines for COG modules with NXP monochrome LCD
drivers
[2] AN10706 — Handling bare die
[3] IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[4] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[5] JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[6] JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model
(MM)
[7] JESD78 — IC Latch-Up Test
[8] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[9] NX3-00092 — NXP store and transport requirements
[10] UM10204 — I2C-bus specification and user manual
22. Revision history
Table 49. Revision history
Document ID
PCF2119X v.7
Modifications:
PCF2119X v.6
PCF2119X_5
PCF2119X_4
PCF2119X_3
PCF2119X_2
PCF2119X_1
Release date
20101115
Data sheet status
Change notice
Supersedes
Product data sheet
-
PCF2119X v.6
• Removed product type PCF2119VU/2/F2
20100908
20090813
20030130
20020116
19990302
19971121
Product data sheet
Product data sheet
Product specification
Product specification
Product specification
Objective specification
-
-
-
-
-
-
PCF2119X_5
PCF2119X_4
PCF2119X_3
PCF2119X_2
PCF2119X_1
-
PCF2119X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
80 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
23. Legal information
23.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
23.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
23.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
PCF2119X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
81 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Bare die — All die are tested on compliance with their related technical
specifications as stated in this data sheet up to the point of wafer sawing and
are handled in accordance with the NXP Semiconductors storage and
transportation conditions. If there are data sheet limits not guaranteed, these
will be separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
23.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
24. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PCF2119X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 7 — 15 November 2010
82 of 83
PCF2119x
NXP Semiconductors
LCD controllers/drivers
25. Contents
1
2
3
4
5
6
General description. . . . . . . . . . . . . . . . . . . . . . 1
10.2.3.4 Temp_ctl. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
10.2.3.5 HV_gen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
10.2.3.6 VLCD_set. . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
11
Basic architecture. . . . . . . . . . . . . . . . . . . . . . 42
Parallel interface . . . . . . . . . . . . . . . . . . . . . . 42
I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . 44
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 45
I2C-bus definitions . . . . . . . . . . . . . . . . . . . . . 45
11.1
11.2
11.2.1
11.2.2
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
12
13
14
15
Internal circuitry . . . . . . . . . . . . . . . . . . . . . . . 48
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 49
Static characteristics . . . . . . . . . . . . . . . . . . . 50
Dynamic characteristics. . . . . . . . . . . . . . . . . 52
8
8.1
8.1.1
8.1.2
8.1.3
8.2
8.3
8.4
8.4.1
8.5
8.5.1
8.6
Functional description . . . . . . . . . . . . . . . . . . . 8
Oscillator and timing generator. . . . . . . . . . . . . 8
Timing generator. . . . . . . . . . . . . . . . . . . . . . . . 8
Internal clock . . . . . . . . . . . . . . . . . . . . . . . . . . 8
External clock . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Reset function and Power-On Reset (POR). . . 8
Power-down mode . . . . . . . . . . . . . . . . . . . . . . 9
LCD supply voltage generator . . . . . . . . . . . . 10
Programming ranges . . . . . . . . . . . . . . . . . . . 10
LCD bias voltage generator . . . . . . . . . . . . . . 11
Electro-optical performance . . . . . . . . . . . . . . 12
LCD row and column drivers . . . . . . . . . . . . . 13
16
16.1
16.2
Application information . . . . . . . . . . . . . . . . . 55
General application information . . . . . . . . . . . 55
Power supply connections for internal
VLCD generation . . . . . . . . . . . . . . . . . . . . . . . 55
Power supply connections for external
16.3
VLCD generation . . . . . . . . . . . . . . . . . . . . . . . 56
Information about VLCD connections . . . . . . . 56
Reducing current consumption . . . . . . . . . . . 56
Charge pump characteristics . . . . . . . . . . . . . 57
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Connections with LCD modules. . . . . . . . . . . 60
4-bit operation, 1-line display using
16.4
16.5
16.6
16.7
16.8
16.9
9
Display data RAM and ROM . . . . . . . . . . . . . . 17
DDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
CGROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
CGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Cursor control circuit. . . . . . . . . . . . . . . . . . . . 26
9.1
9.2
9.3
9.4
external reset . . . . . . . . . . . . . . . . . . . . . . . . . 61
8-bit operation, 1-line display using
16.10
external reset . . . . . . . . . . . . . . . . . . . . . . . . . 61
8-bit operation, 2-line display. . . . . . . . . . . . . 64
I2C-bus operation, 1-line display . . . . . . . . . . 65
Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . 67
User defined characters and symbols . . . . . . 69
10
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Data register . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Instruction register . . . . . . . . . . . . . . . . . . . . . 28
Basic instructions (bit H = 0 or 1) . . . . . . . . . . 30
16.11
16.12
16.13
16.14
10.1
10.2
10.2.1
10.2.1.1 Function_set. . . . . . . . . . . . . . . . . . . . . . . . . . 30
10.2.1.2 BF_AC instructions. . . . . . . . . . . . . . . . . . . . . 30
10.2.1.3 Read_data . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
10.2.1.4 Write_data . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
17
18
19
20
21
22
Bare die outline . . . . . . . . . . . . . . . . . . . . . . . . 71
Handling information . . . . . . . . . . . . . . . . . . . 76
Packing information . . . . . . . . . . . . . . . . . . . . 77
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 79
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Revision history . . . . . . . . . . . . . . . . . . . . . . . 80
10.2.2
Standard instructions (bit H = 0) . . . . . . . . . . . 32
10.2.2.1 Clear_display . . . . . . . . . . . . . . . . . . . . . . . . . 32
10.2.2.2 Return_home . . . . . . . . . . . . . . . . . . . . . . . . . 32
10.2.2.3 Entry_mode_set . . . . . . . . . . . . . . . . . . . . . . . 33
10.2.2.4 Display_ctl instructions. . . . . . . . . . . . . . . . . . 33
10.2.2.5 Curs_disp_shift. . . . . . . . . . . . . . . . . . . . . . . . 34
10.2.2.6 Set_CGRAM. . . . . . . . . . . . . . . . . . . . . . . . . . 35
10.2.2.7 Set_DDRAM. . . . . . . . . . . . . . . . . . . . . . . . . . 35
23
Legal information . . . . . . . . . . . . . . . . . . . . . . 81
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 81
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 82
23.1
23.2
23.3
23.4
10.2.3
Extended instructions (bit H = 1) . . . . . . . . . . 36
24
25
Contact information . . . . . . . . . . . . . . . . . . . . 82
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
10.2.3.1 Screen_conf . . . . . . . . . . . . . . . . . . . . . . . . . . 36
10.2.3.2 Disp_conf . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
10.2.3.3 Icon_ctl . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 November 2010
Document identifier: PCF2119X
相关型号:
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