PCF8549 [NXP]

65 x 102 pixels matrix LCD driver; 65 X 102像素矩阵LCD驱动器
PCF8549
型号: PCF8549
厂家: NXP    NXP
描述:

65 x 102 pixels matrix LCD driver
65 X 102像素矩阵LCD驱动器

驱动器 CD
文件: 总36页 (文件大小:274K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
DATA SHEET  
PCF8549  
65 × 102 pixels matrix LCD driver  
1997 Nov 21  
Product specification  
File under Integrated Circuits, IC12  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
FEATURES  
Single chip LCD controller/driver  
65 row and 102 column outputs  
Display data RAM 65 × 102 bits  
On-chip:  
– Generation of LCD supply voltage  
– Generation of intermediate LCD bias voltages  
GENERAL DESCRIPTION  
The PCF8549 is a low power CMOS LCD controller driver,  
designed to drive a graphic display of 65 rows and  
102 columns. All necessary functions for the display are  
provided in a single chip, including on-chip generation of  
LCD supply and bias voltages, resulting in a minimum of  
external components and low power consumption. The  
PCF8549 interfaces to most microcontrollers via an  
I2C interface.  
– Oscillator requires no external components (external  
clock also possible)  
400 kHz Fast I2C Interface  
CMOS compatible inputs  
Mux rate: 65  
Logic supply voltage range VDD1 VSS: 1.5 to 6 V  
Voltage generator voltage range VDD2/2_HV VSS  
:
Packages  
2.4 to 5 V  
Display supply voltage range VLCD VSS: 7.0 to 16 V  
The PCF8549U/2 is available as bumped die. Sawn wafer  
as chip sorted in chip tray. For further details see  
Section “Bonding pads”.  
Low power consumption, suitable for battery operated  
systems  
Temperature compensation of VLCD  
Customized TCP upon request.  
Interlacing for better display quality  
Slim chip layout, suited for chip-on-glass applications.  
APPLICATIONS  
Telecom equipment  
Portable instruments  
Point of sale terminals.  
ORDERING INFORMATION  
PACKAGE  
TYPE NUMBER  
NAME  
DESCRIPTION  
VERSION  
PCF8549U/2/F1  
TRAY  
chip with bumps in tray  
1997 Nov 21  
2
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
BLOCK DIAGRAM  
R0 to R64  
C0 to C101  
COLUMN DRIVERS  
DATA LATCHES  
ROW DRIVERS  
SHIFT REGISTER  
OSCILLATOR  
Bias vol-  
tage gene-  
rator  
VLCD2  
VLCD1  
OSC  
Dual Ported RAM  
65x102 Bit  
HVGEN  
7 stages  
TIMING GENERATOR  
IIC INTERFACE  
DISPLAY CONTROL LOGIC  
Fig.1 Block diagram.  
3
1997 Nov 21  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
PINNING  
SYMBOL  
R0 to R64  
DESCRIPTION  
LCD row driver outputs  
LCD column driver outputs  
negative power supply  
supply voltage  
C0 to C101  
VSS1,2,2_HV  
VDD1,2,2_HV  
VLCD1,2  
T1  
LCD supply voltage  
test 1 input  
T2  
test 2 output  
T3  
test 3 I/O  
T4  
test 4 I/O  
T5  
test 5 input  
T6  
test 6 input  
T7  
test 7 input  
SDA  
I2C data input  
SCL  
I2C clock line  
SDA_OUT  
SA0  
I2C output  
least significant bit of slave address  
oscillator  
OSC  
RES  
external reset input, low active  
Pin functions  
R0 TO R64: ROW DRIVER OUTPUTS  
These pads output the row signals.  
C0 TO C101: COLUMN DRIVER OUTPUTS  
These pads output the column signals.  
VSS1,2,2_HV: NEGATIVE POWER SUPPLY RAILS  
Negative power supplies.  
VDD1,2,2_HV: POSITIVE POWER SUPPLY RAILS  
VDD2 and VDD2_HV are the supply voltages for the internal voltage generator. Both have to be on the same voltage and  
may be connected together outside of the chip. If the internal voltage generator is not used, they should be both  
connected to ground. VDD1 is used as power supply for the rest of the chip. This voltage can be a different voltage than  
VDD2 and VDD2_HV  
.
VLCD1,2: LCD POWER SUPPLY  
Positive power supply for the liquid crystal display. If the internal voltage generator is used, the two supply rails  
VLCD1 and VLCD2 must be connected together. An external LCD supply voltage can be supplied using the V pad. In this  
case, VLCD1 has to be connected to ground, and the internal voltage generator has to be programmed to zero. If the  
PCF8549 is in power-down mode, the external LCD supply voltage has to be switched off.  
1997 Nov 21  
4
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
T1, T2, T3, T4, T5, T6 AND T7: TEST PADS  
FUNCTIONAL DESCRIPTION  
Block diagram functions  
OSCILLATOR  
T1, T3, T4, T5, T6 and T7 must be connected to VSS1, T2  
is to be left open. Not accessible to user.  
SDA/SDA_OUT: I2C DATA LINES  
The on-chip oscillator provides the clock signal for the  
display system. No external components are required and  
the OSC input must be connected to VDD1. An external  
clock signal, if used, is connected to this input.  
Output and input are separated. If both pads are  
connected together they behave like a standard I2C pad.  
SCL: I2C CLOCK SIGNAL  
I2C INTERFACE  
Input for the I2C-bus clock signal.  
The I2C interface receives and executes the commands  
sent via the I2C-bus. It also receives RAM-data and sends  
them to the RAM. During read access the 8-bit parallel  
data or the status register content is converted to a serial  
data stream and output via the I2C-bus.  
SA0: SLAVE ADDRESS  
With the SA0 pin two different slave addresses can be  
selected. That allows to connect two PCF8549 LCD  
drivers to the same I2C-bus.  
DISPLAY CONTROL LOGIC  
OSC: OSCILLATOR  
The display control logic generates the control signals to  
read out the RAM via the 101 bit parallel port. It also  
generates the control signals for the row, and  
column drivers.  
When the on-chip oscillator is used this input must be  
connected to VDD1. An external clock signal, if used, is  
connected to this input.  
RES: RESET  
DISPLAY DATA RAM (DDRAM)  
This signal will reset the device. Signal is active low.  
The PCF8549 contains a 65 × 102 bit static RAM which  
stores the display data. The RAM is divided into 8 banks of  
102 bytes and one bank of 102 bits  
((8 × 8 + 1) × 102 bits). During RAM access, data is  
transferred to the RAM via the I2C interface. There is a  
direct correspondence between X-address and column  
output number.  
TIMING GENERATOR  
The timing generator produces the various signals  
required to drive the internal circuitry. Internal chip  
operation is not disturbed by operations on the I2C-bus.  
LCD ROW AND COLUMN DRIVERS  
The PCF8549 contains 65 row and 102 column drivers,  
which connect the appropriate LCD bias voltages to the  
display in accordance with the data to be displayed.  
Figure 2 shows typical waveforms. Unused outputs should  
be left unconnected.  
1997 Nov 21  
5
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
frame n  
frame n+1  
Vstate1(t)  
VLCD  
V2  
V
state2(t)  
V3  
V4  
V5  
ROW 0  
R0 (t)  
VSS  
VLCD  
V2  
V3  
V4  
V5  
ROW 2  
R2 (t)  
VSS  
VLCD  
V2  
V3  
V4  
V5  
COL 0  
C0 (t)  
VSS  
VLCD  
V2  
V3  
V4  
V5  
COL 1  
C1 (t)  
VSS  
VLCD  
V3  
VLCD - V2  
V4 - V5  
0 V  
V5  
0 V  
V3 - V2  
V4 - VLCD  
- VLCD  
VLCD  
V3  
VLCD - V2  
0 V  
V3 - V2  
V4 - V5  
0 V  
V5  
V4 - VLCD  
- VLCD  
... 63  
0 2 4 6 8 10 ...  
... 63  
... 64 1 3 5 7 9 ...  
0 2 4 6 8 10 ...  
... 64 1 3 5 7 9 ...  
VSS=0V  
Vstate1(t) = C1(t) - R0(t)  
Vstate2(t) = C1(t) - R2(t)  
Fig.2 Typical LCD driver waveforms.  
6
1997 Nov 21  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
DDRAM  
bank 0  
bank 1  
bank 2  
bank 3  
bank 7  
bank 8  
Fig.3 DDRAM to display mapping.  
1997 Nov 21  
7
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
The MX bit allows a horizontal mirroring: When MX = 1,  
the X address space is mirrored: The address X = 0 is  
then located at the right side (column 101) of the display  
(see Fig.4). When MX = 0 the mirroring is disabled and the  
address X = 0 is located at the left side (column 0) of the  
display (see Fig.4).  
Addressing  
The Display data RAM of the PCF8549 is accessed as  
indicated in Figs 3, 4, 4, 6 and 7. The display RAM has a  
matrix of 65 × 102 bits. The columns are addressed by the  
address pointer. The address ranges are:  
X 0 to 101 (1100101b) and Y 0 to 8 (1000b). Addresses  
outside these ranges are not allowed. In vertical  
addressing mode (V = 1) the Y address increments (see  
Fig.7) after each byte. After the last Y address (Y = 8)  
Y wraps around to 0 and X increments to address the next  
column. In horizontal addressing mode (V = 0) the  
X address increments (see Fig.6) after each byte. After the  
last X address (X = 101) X wraps around to  
If the RM-bit (read-modify-write mode) is set, the address  
is only incremented after a write, otherwise the address is  
incremented after both read and write access to the  
display data RAM.  
0 and Y increments to address the next row. After the very  
last address (X = 101 and Y = 8) the address pointers  
wrap around to address (X = 0 and Y = 0).  
1997 Nov 21  
8
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
DISPLAY DATA RAM STRUCTURE  
MSB  
0
LSB  
MSB  
8
LSB  
0
X-address  
Y-address  
101  
Fig.4 RAM format, addressing (MX = 0).  
MSB  
LSB  
MSB  
LSB  
0
8
0
101  
X-address  
Y-address  
Fig.5 RAM format, addressing (MX = 1).  
9
1997 Nov 21  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
0
1
2
0
102 103 104  
204 205 206  
306 307 308  
408 409 410  
510 511 512  
612 613 614  
Y-address  
714 715 716  
816 817 818  
917  
8
101  
0
X-address  
Fig.6 Sequence of writing data bytes into RAM with horizontal addressing (V = 0).  
0
1
2
3
4
5
6
9
0
10  
Y-address  
7
8
917  
8
101  
0
Fig.7 Sequence of writing data bytes into RAM with vertical addressing (V = 1).  
10  
1997 Nov 21  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
period of the clock pulse as changes in the data line at this  
time will be interpreted as a control signal.  
RAM access  
If the D/C bit is 1 the RAM can be accessed in both read  
and write access mode, depending on the R/W bit. The  
data is written to the RAM during the acknowledge cycle.  
START AND STOP CONDITIONS (see Fig.10)  
Both data and clock lines remain HIGH when the bus is not  
busy. A HIGH-to-LOW transition of the data line, while the  
clock is HIGH is defined as the START condition (S). A  
LOW-to-HIGH transition of the data line while the clock is  
HIGH is defined as the STOP condition (P).  
Set Address  
SYSTEM CONFIGURATION (see Fig.11)  
Set Read  
Modify Write Mode  
Transmitter: The device which sends the data to the bus  
Receiver: The device which receives the data from the  
bus  
Master: The device which initiates a transfer, generates  
clock signals and terminates a transfer  
Read Data  
Write Data  
Slave: The device addressed by a master  
Multi-Master: More than one master can attempt to  
control the bus at the same time without corrupting the  
message  
Arbitration: Procedure to ensure that, if more than one  
master simultaneously tries to control the bus, only one  
is allowed to do so and the message is not corrupted  
no  
Finished?  
Synchronisation: Procedure to synchronize the clock  
signals of two or more devices.  
yes  
ACKNOWLEDGE (see Fig.12)  
END  
Each byte of eight bits is followed by an acknowledge bit.  
The acknowledge bit is a HIGH signal put on the bus by  
the transmitter during which time the master generates an  
extra acknowledge related clock pulse. A slave receiver  
which is addressed must generate an acknowledge after  
the reception of each byte. Also a master receiver must  
generate an acknowledge after the reception of each byte  
that has been clocked out of the slave transmitter. The  
device that acknowledges must pull-down the SDA line  
during the acknowledge clock pulse, so that the SDA line  
is stable LOW during the HIGH period of the acknowledge  
related clock pulse (set-up and hold times must be taken  
into consideration). A master receiver must signal an end  
of data to the transmitter by not generating an  
Fig.8 Read modify write access.  
I2C-BUS INTERFACE  
Characteristics of the I2C-bus  
The I2C-bus is for bi-directional, two-line communication  
between different ICs or modules. The two lines are a  
serial data line (SDA) and a serial clock line (SCL). Both  
lines must be connected to a positive supply via a pull-up  
resistor. Data transfer may be initiated only when the bus  
is not busy.  
acknowledge on the last byte that has been clocked out of  
the slave. In this event the transmitter must leave the data  
line HIGH to enable the master to generate a stop  
condition.  
BIT TRANSFER (see Fig.9)  
One data bit is transferred during each clock pulse. The  
data on the SDA line must remain stable during the HIGH  
1997 Nov 21  
11  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
SDA  
SCL  
data line  
stable;  
data valid  
change  
of data  
allowed  
MBC621  
Fig.9 Bit transfer.  
SDA  
SCL  
SDA  
SCL  
S
P
STOP condition  
START condition  
MBC622  
Fig.10 Definition of start and stop conditions.  
MASTER  
TRANSMITTER/  
RECEIVER  
SLAVE  
TRANSMITTER/  
RECEIVER  
MASTER  
TRANSMITTER/  
RECEIVER  
SLAVE  
RECEIVER  
MASTER  
TRANSMITTER  
SDA  
SCL  
MGA807  
Fig.11 System configuration.  
DATA OUTPUT  
BY TRANSMITTER  
not acknowledge  
DATA OUTPUT  
BY RECEIVER  
acknowledge  
8
SCL FROM  
MASTER  
1
2
9
S
clock pulse for  
acknowledgement  
START  
CONDITION  
MBC602  
Fig.12 Acknowledgement on the I2C-bus.  
12  
1997 Nov 21  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
I2C-bus protocol  
of the D/C-bit defines whether the data-byte is interpreted  
as a command or as RAM-data.The control and data bytes  
are also acknowledged by all addressed slaves on the bus.  
The PCF8549 supports both read and write access. The  
R/W bit is part of the slave address.  
After the last control byte, depending on the D/C bit  
setting, either a series of display data bytes or command  
data bytes may follow. If the D/C bit was set to ‘1’, these  
display bytes are stored in the display RAM at the address  
specified by the data pointer. The data pointer is  
automatically updated and the data is directed to the  
intended PCF8549 device. If the D/C bit of the last control  
byte was set to ‘0’, these command bytes will be decoded  
and the setting of the device will be changed according to  
the received commands. The acknowledgement after  
each byte is made only by the addressed slave. At the end  
of the transmission the I2C-bus master issues a stop  
condition (P).  
Before any data is transmitted on the I2C-bus, the device  
which should respond is addressed first. Two 7-bit slave  
addresses (0111100 and 0111101) are reserved for the  
PCF8549. The least significant bit of the slave address is  
set by connecting the input SA0 to either logic 0 (VSS1) or  
1 (VDD1).  
The I2C-bus protocol is illustrated in Fig.13.  
The sequence is initiated with a START condition (S) from  
the I2C-bus master which is followed by the slave address.  
All slaves with the corresponding address acknowledge in  
parallel, all the others will ignore the I2C-bus transfer. After  
acknowledgement, one or more command words follow  
which define the status of the addressed slaves. A  
If the R/W bit is set to one in the slave-address, the chip  
will output data immediately after the slave-address  
according to the D/C bit, which was sent during the last  
write access. If no acknowledge is generated by the  
master after a byte, the driver stops transferring data to the  
master.  
command word consists of a control byte, which defines  
Co and D/C, plus a data byte (see Fig.13 and Table 1).  
The last control byte is tagged with a cleared most  
significant bit, the continuation bit Co. After a control byte  
with a cleared Co-bit, only data bytes will follow. The state  
acknowledgement  
from PCF8549  
acknowledgement  
from PCF8549  
acknowledgement  
from PCF8549  
acknowledgement  
from PCF8549  
acknowledgement  
from PCF8549  
S
0
control byte  
0
1
1
1
1
0
data byte  
control byte  
data byte  
S
A
0
A 1 DC  
A
A 0 DC  
A
A P  
n > 0 bytes  
MSB................. LSB  
slave address  
1 byte  
2n > 0 bytes  
Co  
Co  
acknowledgement  
from Master  
acknowledgement  
from Master  
acknowledgement  
from Master  
acknowledgement  
from Master  
S
1
0
1
1
1
1
0
data byte  
data byte  
data byte  
data byte  
S
A
0
A
A
A
A
A P  
slave address  
S
A
0
R
W
CO DC 0 0 0 0 0 0 A  
0
1 1 1 1 0  
Control Byte  
PCF8549  
slave address  
Fig.13 I2C-bus protocol.  
1997 Nov 21  
13  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
INSTRUCTIONS  
The instruction format is divided into two modes: If D/C is set low, the status byte can be read or commands can be sent  
to the chip, depending on the R/W signal. If D/C is set high, the DDRAM will be accessed. Every instruction can be sent  
in any order to the PCF8549.  
Table 1 Instruction set  
COMMAND BYTE  
INSTRUCTION  
H = 0 or 1  
D/C R/W  
DESCRIPTION  
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
NOP  
0
0
0
0
0
0
0
0
1
0
0
0
0
0
no operation  
Function Set  
0
MX  
MY  
PD  
V
H
power down control; entry mode;  
Extended Instruction Set control (H)  
Read Status Byte  
Write Data  
0
1
1
1
0
1
X
X
D
E
MX  
D2  
MY  
D1  
X
reads status byte  
PD  
D7  
D7  
D6  
D6  
D5  
D5  
D4  
D4  
D3  
D3  
D0  
D0  
writes data to RAM  
reads data from RAM  
Read Data  
D2  
D1  
H = 0  
Set Read Modify  
Write  
0
0
0
0
0
0
0
0
1
RM  
sets the read-modify-write mode  
Reserved  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
1
X
X
do not use  
Display Control  
Reserved  
1
D
X
0
E
sets display configuration  
do not use  
X
Y3  
X
X
Set Y address of  
RAM  
Y2  
Y1  
Y0  
sets Y-address of RAM: 0 Y 8  
Set X address of  
RAM.  
0
0
1
X6  
X5  
X4  
X3  
X2  
X1  
X0  
sets X-address of RAM: 0 X 101  
H = 1  
Reserved  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
1
0
0
0
0
0
X
0
0
0
0
1
X
0
0
0
1
0
X
0
0
1
do not use  
Reserved  
0
1
X
do not use  
Temperature Control  
Reserved  
1
TC1  
X
TC0  
X
set temperature coefficient (TCx)  
do not use  
X
Bias System  
Reserved  
BS2  
X
BS1  
X
BS0  
X
Set Bias System(BSx)  
do not use (reserved for test...)  
Set VOP  
VOP6 VOP5 VOP4 VOP3 VOP2 VOP1 VOP0 write VOP to register  
1997 Nov 21  
14  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
Table 2 Explanations for symbols in Table 1  
BIT  
0
1
RESET STATE  
PD  
V
chip is active  
chip is in power down mode  
vertical addressing  
1
0
0
0
0
horizontal addressing  
H
use basic instruction set  
normal X-addressing  
use extended instruction set  
X-address is mirrored  
MX  
MY  
RM  
display is not vertically mirrored  
display is vertically mirrored  
read-modify-write mode is disabled read-modify-write mode is enabled 0  
D and E 00  
display blank  
D = 0  
E = 0  
10  
normal mode  
01  
all display segments on  
inverse video mode  
11  
TC[1 : 0] 00  
V
V
V
V
LCD temperature coefficient 0  
LCD temperature coefficient 1  
LCD temperature coefficient 2  
LCD temperature coefficient 3  
TC[1 : 0] = 00  
BS[2 : 0] = 000  
01  
10  
11  
BS[2 : 0]  
bias system  
External reset (RES)  
After power-on a reset pulse has to be applied immediately to the chip, as it is in an undefined state. A reset of the chip  
can be achieved with the external reset pin. After the reset the LCD driver is set to the following status:  
Power down mode (PD = 1)  
All LCD-outputs at VSS (display off)  
Read-modify-write mode is disabled (RM = 0)  
Horizontal addressing (V = 0)  
Normal instruction set (H = 0)  
Normal display (MX = MY = 0)  
Display blank (E = D = 0)  
Address counter X[6 : 0] = 0 and Y[3 : 0] = 0  
Temperature coefficient (TC[1 : 0] = 0)  
Bias system (BS[2 : 0] = 0)  
Read-modify-write mode disabled (RM = 0)  
VLCD is equal to 0, the HV generator is switched off (VOP[6 : 0] = 0)  
After power-on, RAM data are undefined; The reset signal does not change the content of the RAM.  
Set read-modify-write  
When RM = 0, the read-modify-write mode is disabled. The X/Y-address counter is incremented after every read or write  
access to the display data RAM.  
When RM = 1, the read-modify-write mode is enabled. In this mode the X/Y-address is incremented only after a write  
access to the display data RAM. The X/Y-address will not be incremented after a read access to the RAM.  
1997 Nov 21  
15  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
Function Set  
MX  
When MX = 0, the display is written from left to right (X = 0  
is on the left side, X = 100 is on the right side of the  
display). When MX = 1 the display is written from right to  
left (X = 0 is on the right side, X = 100 is on the left side of  
the display).  
PD (POWER DOWN)  
All LCD outputs at VSS (display off)  
Bias generator and VLCD generator off  
Oscillator off (external clock possible)  
VLCD can be disconnected  
MY  
Parallel bus, command, etc. function  
RAM contents not cleared; RAM data can be written.  
When MY = 1, the display is mirrored vertically.  
Display Control  
V
D AND E  
When V = 0, the horizontal addressing is selected. The  
data is written into the RAM as shown in Fig.6. When  
V = 1, the vertical addressing is selected. The data is  
written into the RAM as shown in Fig.7.  
The bits D and E select the display mode (see Table 2).  
Set Y address of RAM  
Y[3 : 0] defines the Y address vector address of the RAM.  
H
When H = 0 the commands ‘display control’, ‘set  
Y address’ and ‘set X address’ can be performed, when  
H = 1 the other commands can be executed. The  
commands ‘write data’ and ‘function set’ can be executed  
in both cases.  
Table 3 X-/Y-Address range  
Y Y Y Y  
CONTENT  
3 2 1 0  
ALLOWED X-RANGE  
0 0 0 0  
0 0 0 1  
0 0 1 0  
0 0 1 1  
0 1 0 0  
0 1 0 1  
0 1 1 0  
0 1 1 1  
1 0 0 0  
bank 0 (display RAM)  
bank 1 (display RAM)  
bank 2 (display RAM)  
bank 3 (display RAM)  
bank 4 (display RAM)  
bank 5 (display RAM)  
bank 6 (display RAM)  
bank 7 (display RAM)  
bank 8 (display RAM)  
0 to 101  
0 to 101  
0 to 101  
0 to 101  
0 to 101  
0 to 101  
0 to 101  
0 to 101  
0 to 101  
In bank 8 only the MSB is accessed.  
Set X address of RAM  
The X address points to the columns. The range of X is 0 to 101(65 hex).  
Temperature Control  
Due to the temperature dependency of the liquid crystals viscosity the LCD controlling voltage VLCD must be increased  
with lower temperature to maintain optimal contrast. There are 4 different temperature coefficients available in the  
1997 Nov 21  
16  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
PCF8549 (see Fig.14). The coefficients are selected by the two bits TC[1 : 0]. Table 6 shows the typical values of the  
different temperature coefficients. The coefficients are proportional to the programmed VLCD  
.
VLCD  
temperature  
16oC(typ)  
Fig.14 Temperature coefficients.  
Bias value:  
1
n + 4  
The bias voltage levels are set in the ratio of R R nR R R giving a  
bias system. The resulting bias levels  
------------  
are shown in table 5.  
Different multiplex rates require different factors n (see Table 4). This is programmed by BS[2 : 0]. For MUX 1 : 65 the  
optimum bias value n is given by: n = m 3 = 65 3 = 5.06 = 5  
resulting in 19bias.  
Table 4 Programming the required Bias system  
BS[2]  
BS[1]  
BS[0]  
n
b (RES. COUNT)  
MUX RATE  
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
7
6
5
4
3
11  
10  
9
1 : 100  
1 : 81  
1 : 64  
1 : 49  
1 : 36  
8
7
1997 Nov 21  
17  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
BS[2]  
BS[1]  
BS[0]  
n
b (RES. COUNT)  
MUX RATE  
1
1
1
0
1
1
1
0
1
2
1
0
6
5
4
1 : 24  
1 : 16  
1 : 9  
Table 5 LCD bias voltage  
SYMBOL  
BIAS VOLTAGES⁄  
V1  
V2  
V3  
V4  
V5  
V6  
VLCD  
(b-1)/b × VLCD  
(b-2)/b × VLCD  
2/b × VLCD  
1/b × VLCD  
VSS  
Set VOP value:  
The operation voltage VLCD can be set by software. The generated voltage is dependent of the temperature, the  
programmed temperature coefficient (TC), and the programmed voltage at reference temperature (TCUT).  
(1)  
(2)  
VLCD = (a + VOP b) + (T TCUT) TC  
The voltage at reference temperature (VLCD(T=TCUT)) can be calculated as:  
VLCD = (a + VOP b)  
The parameters are explained in table 6.  
The maximum voltage that can be generated is depending on the VDD2/2_HV Voltage and the display load current. The  
relation ship is shown in Fig.16.  
The charge pump is turned off if Vop[6 : 0] is set to zero.  
For Mux 1 : 65 the optimum operation voltage of the liquid can be calculated as:  
1 + 65  
VLCD  
=
V th= 6.85 Vth  
--------------------------------------  
1
2
1 –  
----------  
65  
where Vth is the threshold voltage of the liquid crystal material used.  
1997 Nov 21  
18  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
VLCD  
b
a
00 01 02 03 04 05 06 07 08 09 0A ...  
VOP[6:0] (programmed) [00 hex ... 7F hex]  
Fig.15 VOP programming of PCF8549.  
Table 6 Typical values for parameters for the HV-Generator programming  
SYMBOL  
VALUE  
UNIT  
a
7.06  
0.06  
16  
V
b
V
0C  
V/oC  
TCUT  
TC  
00  
01  
10  
11  
0.142 103  
1.3 103  
V
LCD (T = TCUT  
)
V/oC  
V/oC  
V/oC  
V
LCD (T = TCUT)  
2.467 103  
3.483 103  
V
V
LCD (T = TCUT  
)
)
LCD (T = TCUT  
1997 Nov 21  
19  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
LIMITING VALUES  
In accordance with the Absolute Maximum System (IEC 134); all voltages referred to VSS = 0V unless otherwise  
specified.  
SYMBOL  
VDD  
VLCD  
ISS  
PARAMETER  
supply voltage range  
MIN  
-0.5  
-0.5  
-50  
-0.5  
-0.5  
-10  
-10  
-
MAX  
+7  
UNIT  
V
supply voltage range LCD  
supply current  
+17  
V
50  
mA  
V
Vi/VO  
VOLCD  
Ii  
input/output voltage range  
LCD output voltage range  
DC input current  
VDD+0.5  
VLCD+0.5  
10  
V
mA  
mA  
mW  
mW  
°C  
Io  
DC output current  
10  
PTOT  
PO  
power dissipation per package  
power dissipation per output  
300  
-
50  
TAMB  
operating ambient temperature.  
range  
-40  
+85  
TSTG  
storage temperature range  
-65  
+150  
°C  
Notes  
1. Stresses above those listed under Limiting Values may cause permanent damage to the device.  
2. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to  
VSS unless otherwise noted.  
3. with external LCD supply voltage external supplied (voltage generator disabled). VDDmax (VDD2,VDD2_HV) is 5V if  
LCD supply voltage is internally generated (voltage generator enabled).  
HANDLING  
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is  
desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices”). The PCF8549  
withstands the following stress:  
approximately 1.0kV Human Body Model  
approximately 150V Machine Model  
1997 Nov 21  
20  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
DC CHARACTERISTICS  
Table 7  
VDD1 = 1.5 to 6 V; VDD2/2_HV = 2.4 to 5.0 V; VDD2 = VDD2_HV; VSS1 = VSS2 = VSS2_HV = 0 V; VLCD = 7 to 16 V;  
Tamb = 40 to +85 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
Logic supply  
CONDITIONS  
MIN  
1.5  
TYP  
MAX  
UNIT  
VDD1  
3
6
V
voltage range  
VDD2,  
VDD2_HV  
HV Generator  
supply range  
2.4  
5
V
IVDD1  
supply current  
internal VLCD  
VLCD = 10.0V; fscl = 0;  
display load = 0;  
30  
600  
30  
0
80  
1200  
80  
10  
10  
130  
µA  
µA  
µA  
µA  
µA  
µA  
IVDD2/2_HV supply current  
internal VLCD  
VLCD = 10.0V; fscl = 0;  
display load = 0; (1)(5)  
IVDD1  
supply current  
external VLCD  
VLCD = 10.0V; fscl = 0;  
display load = 0;  
IVDD2/2_HV supply current  
external VLCD  
VLCD = 10.0V; fscl = 0;  
display load = 0; (2)(5)  
IVDD1  
ILCD  
VLCD(tol)  
VIL  
supply current  
power-down mode; VLCD = 0V;  
0.5  
50  
fscl = 0; display load = 0  
supply current  
external VLCD  
VLCD = 10 V; fSCL= 0,  
display load = 0; (2)  
VLCD tolerance  
internal generated  
VDD = 2.7V; VLCD = 10V; fSCL = 0;  
display load = 0;(3)(4)(6)  
+/- 500 mV  
LOW level input volt-  
age  
VSS  
0.3VDD  
VDD  
V
VIH  
HIGH level input  
voltage  
0.7 VDD  
V
IOL  
LOW level output  
current (SDA)  
VOL = 0.4V;  
VDD1 = 5 V  
3.0  
mA  
IL  
leakage current  
VI = VDD1 or VSS1  
-1  
+1  
20  
µA  
RROW  
Row output resis-  
tance R0 to R64  
12  
12  
kOhm  
RCOL  
Column output resis-  
tance C0 to C101  
20  
kOhm  
Note  
1. When a display is connected the IVDD2_HV increases with 7 x display load current due to 7 stage charge pump.  
2. With external VLCD, the display load current does not translate into increased IVDD2_HV  
.
3. For TC1, TC2 and TC3  
4. The maximum possible VLCD voltage that may be generated is dependent on voltage (VDD2/2_HV), temperature and  
(display) load.  
5. VDD2 VDD2_HV connected together  
6. Difference to the theoretical value given by equation 1  
1997 Nov 21  
21  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
AC CHARACTERISTICS  
Table 8  
VDD1 = 1.5 to 6 V; VDD2/2_HV = 2.4 to 5.0 V; VDD2 = VDD2_HV; VSS1 = VSS2 = VSS2_HV = 0 V; VLCD = 7 to 16 V;  
Tamb = 40 to +85 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
oscillator frequency  
CONDITIONS  
MIN.  
TYP.  
32  
MAX.  
64  
UNIT  
fOSC  
19  
10  
kHz  
kHz  
us  
(2)  
(5)  
fEXT  
external clock frequency  
oscillator start up time  
frame frequency  
32  
64  
tstart  
450  
62  
1600  
fFRAME  
tVHRL  
tPWRES  
fEXT = 32 kHz;(1)  
1
Hz  
(5)  
VDD to RES Low  
ms  
ns  
reset low pulse width  
400  
I2C timing characteristics  
(6)  
fSCLK  
tLOW  
tHIGH  
tSU;Data  
tHD;Data  
tR  
SCL clock frequency  
DC  
1.3  
0.6  
100  
0
400  
kHz  
us  
us  
ns  
us  
ns  
ns  
pF  
SCL clock low period  
SCL clock high period  
Data set-up time  
Data hold time  
0.9  
300  
300  
400  
(3)  
(3)  
SCL and SDA rise time  
SCL and SDA fall time  
20 + 0.1 Cb  
20 + 0.1 Cb  
tF  
cb  
Capacitive load represented by each  
bus line  
tSU;STA  
setup time for a repeated START con-  
dition  
0.6  
us  
tHD;STA  
tSU;DAT  
tHD;DAT  
tSU;STO  
tSW  
start condition hold time  
data set-up time  
0.6  
100  
0
us  
ns  
ns  
us  
ns  
us  
data hold-time  
setup time for STOP condition  
tolerable spike width on bus  
0.6  
(4)  
50  
tBUF  
BUS free time between a STOP and  
START condition  
1.3  
Note  
fEXT  
1. fFRAME  
=
----------  
520  
2. Duty cycle of 50 +/-5%.  
3. The rise and fall times specified here refer to the driver device (i.e. not PCF8549) and are part of the general fast  
I2C-bus specification. When PCF8549 asserts an acknowledge on SDA, the minimum fall time is 10ns. Cb=  
capacitive load per bus line.  
4. The device inputs SDA and SCL are filtered and will reject spikes on the bus lines of width < tSW(max)  
.
5. Not tested in production  
6. Only for VDD1= 2V to 6V  
1997 Nov 21  
22  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
TYPICAL CHARACTERISTICS  
16V  
15V  
I=0uA  
14V  
I=10uA  
I=20uA  
13V  
I=40uA  
12V  
1V  
0V  
2V  
3V  
4V  
5V  
VDD2, VDD2_HV  
Fig.16 VLCD dependency of VDD2,  
VDD2_HV and load current. Programmed  
VLCD=15.8V (@ Room Temperature in  
special Test mode)  
RESET  
VDD  
RES  
tVHRL  
tPWRES  
Fig.17 Reset timing.  
1997 Nov 21  
23  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
APPLICATION INFORMATION  
Table 9 programming example for PCF8549  
STEP  
DISPLAY  
OPERATION  
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
1
2
3
I2C start  
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
Slave address for write  
0
Control byte with cleared CO bit  
and D/C set to 0.  
4
5
6
0
0
1
0
1
0
1
0
1
0
0
0
1
0
0
0
0
1
1
1
0
0
Function Set  
PD = 0; V = 0; select extended  
instruction set (H = 1 mode)  
0
1
Set Bias System 2. This is the  
recommended Bias System for a  
multiplex rate 1:65  
set VOP  
VOP is set to a +16 × b [V].  
Please note: The required  
voltage is depending on the  
liquid.  
7
8
9
0
0
0
0
1
0
0
0
0
1
0
1
0
0
0
0
Function Set  
PD = 0; V = 0; select normal  
instruction set (H = 0 mode)  
Display Control  
set normal mode  
(D = 1 and E = 0)  
I2C start  
Restart: To write into the Display  
RAM the D/C must be set to 1;  
therefore a control byte is  
needed.  
10  
11  
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
Slave address for write  
1
Control byte with cleared CO bit  
and D/C set to 1.  
12  
13  
14  
1
1
1
1
1
1
1
1
0
0
1
0
0
0
0
0
0
0
0
0
0
0
Data Write  
Y and X are initialized to 0 by  
default, so they aren’t set here  
0
1
Data Write  
Data Write  
1997 Nov 21  
24  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
STEP  
DISPLAY  
OPERATION  
Data Write  
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
15  
16  
17  
18  
0
1
0
1
0
1
0
1
0
1
1
1
0
1
0
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
Data Write  
Data Write  
Data Write  
Restart  
19  
20  
21  
I2C start  
0
1
1
1
0
1
0
1
0
0
0
0
0
0
0
Slave address for write  
0
Control byte with set CO bit and  
D/C set to 0.  
22  
0
0
0
0
1
1
0
1
Display Control  
Set inverse video mode  
(D = 1 and E = 1)  
23  
24  
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Control byte with set CO bit and  
D/C set to 0.  
Set X address of RAM  
set address to ‘0000000’  
25  
26  
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
Control byte with set CO bit and  
D/C set to 1.  
Data Write  
27  
28  
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Control byte with cleared CO bit  
and D/C set to 0.  
Set X address of RAM  
Set address to ‘0000000’  
29  
0
0
0
0
0
0
0
1
Set Read Modify Write Mode  
1997 Nov 21  
25  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
STEP  
DISPLAY  
OPERATION  
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  
30  
31  
32  
I2C start  
Restart  
0
1
1
1
0
1
0
1
0
0
0
0
0
0
0
Slave address for write  
1
Control byte with set CO bit and  
D/C set to 1.  
33  
34  
35  
I2C start  
Restart  
0
1
1
1
0
1
0
1
0
0
0
0
0
1
0
Slave address for read  
0
Read Data From  
Address ‘0000000’  
36  
1
0
0
0
0
0
0
0
Read Data From  
Address ‘0000000’ again.  
Master does not send an  
acknowledge to stop the read  
access.  
37  
38  
39  
I2C start  
Restart  
0
1
1
1
0
1
0
1
0
0
0
0
0
0
0
Slave address for write  
1
Control byte with set CO bit and  
D/C set to 1.  
40  
1
1
1
1
1
0
0
0
Write Data  
41  
1
0
0
0
0
0
0
0
Control byte with set CO bit and  
D/C set to 0.  
42  
43  
44  
I2C start  
Restart  
0
1
1
1
0
1
0
1
0
0
0
0
0
1
0
Slave address for read  
Read Status Byte  
0
APPLICATION INFORMATION  
1997 Nov 21  
26  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
VDD1  
SCL  
SCL  
VDD1  
SDA  
SDA  
SDA_OUT  
Fig.18 Application diagram: Connecting the I2C Interface  
1997 Nov 21  
27  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
DISPLAY 102x65  
33  
102  
32  
PCF8549  
13  
C2  
C3  
VDD1 VSS 1.5V  
VDD2 VSS 2.4V  
VDD2HV = VDD2  
C1  
I/O  
C4  
C1 100nF  
C2 100nF  
C3 1uF  
C4 100nF  
Fig.19 Application diagram: Connecting the power supplies  
The pinning of the PCF8549 is optimized for single plane wiring e.g. for chip-on-glass display modules.  
Display size: 65 × 102 pixels.  
CHIP INFORMATION  
The PCF8549 is manufactured in n-well CMOS technology.  
The substrate is on VSS potential.  
1997 Nov 21  
28  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
BONDING PADS  
VALUE  
UNIT  
Pad pitch  
min. 100  
µm  
µm  
µm  
Pad size, alumin. 80 × 100  
Passivation.  
Bumps  
48 × 78  
60 (±6) × 90 (±6) × 17.5 (±5) µm  
Wafer thickness 380 (±25)  
µm  
1997 Nov 21  
29  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
DUMMY  
R63  
Dummy  
R31  
Recognition  
Pattern  
R1  
R33  
C0  
OSC  
VDD1  
VDD2  
VDD2_HV  
RES  
SDA_OUT  
SDA  
SCL  
T2  
SA0  
T7  
T6  
T5  
T4  
T3  
T1  
VSS1  
VSS2_HV  
VSS2  
C101  
VLCD_1  
VLCD2  
R32  
R34  
R0  
R30  
Dummy  
R64  
DUMMY  
2.74mm  
Fig.20 Pads.  
1997 Nov 21  
30  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
Table 10 Bonding pad locations (dimensions in um).  
Pad  
Pad name  
X
Y
Pad  
Pad name  
T2  
X
Y
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
ROW<60>  
ROW<58>  
ROW<56>  
ROW<54>  
ROW<52>  
ROW<50>  
ROW<48>  
ROW<46>  
ROW<44>  
ROW<42>  
ROW<40>  
ROW<38>  
ROW<36>  
ROW<34>  
ROW<32>  
COL<101>  
COL<100>  
COL<99>  
COL<98>  
COL<97>  
COL<96>  
COL<95>  
COL<94>  
COL<93>  
COL<92>  
COL<91>  
COL<90>  
COL<89>  
COL<88>  
COL<87>  
COL<86>  
COL<85>  
COL<84>  
COL<83>  
COL<82>  
COL<81>  
COL<80>  
COL<79>  
COL<78>  
COL<77>  
570  
84  
1
7359.5  
6958  
6679  
6400  
6121  
5841.5  
5431.5  
5022  
4724  
4624  
4359  
4259  
4159  
3458.5  
2580  
2294  
1870  
1770  
1670  
1570  
1470  
1370  
1270  
1170  
1070  
970  
2462  
2462  
2462  
2462  
2462  
2462  
2462  
2462  
2458  
2458  
2458  
2458  
2458  
2458  
2462  
2462  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
84  
670  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
2
SA0  
770  
3
T7  
870  
4
T6  
970  
5
T5  
1070  
1170  
1270  
1370  
1470  
1570  
1670  
1770  
1870  
2137  
2812  
2914  
3014  
3114  
3214  
3314  
3560  
3660  
3760  
3860  
3960  
4060  
4160  
4260  
4360  
4460  
4560  
4660  
4760  
4860  
4960  
5060  
5306  
5406  
5506  
6
T4  
7
T3  
8
T1  
9
VSS1  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
VSS1  
VSS2_HV  
VSS2_HV  
VSS2_HV  
VSS2  
VLCD1  
VLCD2  
ROW<0>  
ROW<2>  
ROW<4>  
ROW<6>  
ROW<8>  
ROW<10>  
ROW<12>  
ROW<14>  
ROW<16>  
ROW<18>  
ROW<20>  
ROW<22>  
ROW<24>  
ROW<26>  
ROW<28>  
ROW<30>  
Dummy 4  
Dummy 5  
Dummy 6  
Dummy 3  
Dummy 2  
Dummy 1  
ROW<64>  
ROW<62>  
870  
770  
670  
570  
470  
370  
270  
170  
70  
70  
170  
84  
270  
84  
370  
84  
470  
84  
1997 Nov 21  
31  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
Pad  
Pad name  
X
Y
Pad  
121  
Pad name  
X
Y
81  
82  
83  
84  
85  
86  
87  
88  
89  
90  
91  
92  
93  
94  
95  
96  
97  
98  
99  
COL<76>  
COL<75>  
COL<74>  
COL<73>  
COL<72>  
COL<71>  
COL<70>  
COL<69>  
COL<68>  
COL<67>  
COL<66>  
COL<65>  
COL<64>  
COL<63>  
COL<62>  
COL<61>  
COL<60>  
COL<59>  
COL<58>  
COL<57>  
COL<56>  
COL<55>  
COL<54>  
COL<53>  
COL<52>  
COL<51>  
COL<50>  
COL<49>  
COL<48>  
COL<47>  
COL<46>  
COL<45>  
COL<44>  
COL<43>  
COL<42>  
COL<41>  
COL<40>  
COL<39>  
COL<38>  
COL<37>  
5606  
5706  
5806  
5906  
6006  
6106  
6206  
6306  
6406  
6506  
6606  
6706  
6806  
7052  
7152  
7252  
7352  
7452  
7552  
7652  
7752  
7852  
7952  
8052  
8152  
8252  
8352  
8452  
8552  
8798  
8898  
8998  
9098  
9198  
9298  
9398  
9498  
9598  
9698  
9798  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
COL<36>  
COL<35>  
COL<34>  
COL<33>  
COL<32>  
COL<31>  
COL<30>  
COL<29>  
COL<28>  
COL<27>  
COL<26>  
COL<25>  
COL<24>  
COL<23>  
COL<22>  
COL<21>  
COL<20>  
COL<19>  
COL<18>  
COL<17>  
COL<16>  
COL<15>  
COL<14>  
COL<13>  
COL<12>  
COL<11>  
COL<10>  
COL<9>  
9898  
84  
122  
123  
124  
125  
126  
127  
128  
129  
130  
131  
132  
133  
134  
135  
136  
137  
138  
139  
140  
141  
142  
143  
144  
145  
146  
147  
148  
149  
150  
151  
152  
153  
154  
155  
156  
157  
158  
159  
160  
9998  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
10098  
10198  
10298  
10544  
10644  
10744  
10844  
10944  
11044  
11144  
11244  
11344  
11444  
11544  
11644  
11744  
11844  
11944  
12044  
12290  
12390  
12490  
12590  
12690  
12790  
12890  
12990  
13090  
13190  
13290  
13390  
13490  
13590  
13690  
13790  
14204  
14304  
14404  
100  
101  
102  
103  
104  
105  
106  
107  
108  
109  
110  
111  
112  
113  
114  
115  
116  
117  
118  
119  
120  
COL<8>  
COL<7>  
COL<6>  
COL<5>  
COL<4>  
COL<3>  
COL<2>  
COL<1>  
COL<0>  
ROW<33>  
ROW<35>  
ROW<37>  
1997 Nov 21  
32  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
Pad  
161  
Pad name  
X
Y
Pad  
201  
Pad name  
X
Y
ROW<39>  
ROW<41>  
ROW<43>  
ROW<45>  
ROW<47>  
ROW<49>  
ROW<51>  
ROW<53>  
ROW<55>  
ROW<57>  
ROW<59>  
ROW<61>  
ROW<63>  
Dummy 7  
Dummy 8  
Dummy 9  
Dummy 12  
Dummy 11  
Dummy 10  
ROW<31>  
ROW<29>  
ROW<27>  
ROW<25>  
ROW<23>  
ROW<21>  
ROW<19>  
ROW<17>  
ROW<15>  
ROW<13>  
ROW<11>  
ROW<9>  
ROW<7>  
ROW<5>  
ROW<3>  
ROW<1>  
OSC  
14504  
14604  
14704  
14804  
14904  
15004  
15104  
15204  
15304  
15404  
15504  
15604  
15704  
15804  
15904  
16004  
15961  
15861  
15761  
15661  
15561  
15461  
15361  
15261  
15161  
15061  
14961  
14861  
14761  
14661  
14561  
14461  
14361  
14261  
14161  
13738  
13147  
13047  
12947  
12145  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
84  
VDD2_HV_I 11145  
N
2461  
162  
163  
164  
165  
166  
167  
168  
169  
170  
171  
172  
173  
174  
175  
176  
177  
178  
179  
180  
181  
182  
183  
184  
185  
186  
187  
188  
189  
190  
191  
192  
193  
194  
195  
196  
197  
198  
199  
200  
202  
203  
VDD2_HV_I 11045  
N
2461  
2461  
2462  
VDD2_HV_I 10945  
N
204  
205  
RES_B_IN  
SDA_OUT  
10627  
10333.5 2462  
5
206  
207  
208  
209  
SDA_IN  
SDA_IN  
SCL_IN  
SCL_IN  
Recpat C1  
Recpat C2  
Recpat F  
9412.4  
9212.4  
8256.8  
8056.8  
16275  
2301  
2462  
2462  
2462  
2462  
2437  
80  
304  
1824  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2437  
2462  
2461  
2461  
2461  
2461  
VDD1  
VDD1  
VDD1  
VDD2  
1997 Nov 21  
33  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
PURCHASE OF PHILIPS I2C COMPONENTS  
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the  
components in the I2C system provided the system conforms to the I2C specification defined by  
Philips. This specification can be ordered using the code 9398 393 40011.  
1997 Nov 21  
34  
Philips Semiconductors  
Product specification  
65 × 102 pixels matrix LCD driver  
PCF8549  
NOTES  
1997 Nov 21  
35  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
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Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,  
Fax. +43 160 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
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Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Belgium: see The Netherlands  
Brazil: see South America  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 689 211, Fax. +359 2 689 102  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 755 6918, Fax. +7 095 755 6919  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. +852 2319 7888, Fax. +852 2319 7700  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,  
Tel. +65 350 2538, Fax. +65 251 6500  
Colombia: see South America  
Czech Republic: see Austria  
Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. +45 32 88 2636, Fax. +45 31 57 0044  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
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Tel. +27 11 470 5911, Fax. +27 11 470 5494  
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South America: Al. Vicente Pinzon, 173, 6th floor,  
04547-130 SÃO PAULO, SP, Brazil,  
Tel. +55 11 821 2333, Fax. +55 11 821 2382  
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 3 301 6312, Fax. +34 3 301 4107  
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Tel. +49 40 23 53 60, Fax. +49 40 23 536 300  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 632 2000, Fax. +46 8 632 2745  
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,  
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2686, Fax. +41 1 481 7730  
Hungary: see Austria  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,  
Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
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Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Indonesia: see Singapore  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
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Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
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Tel. +1 800 234 7381  
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Tel. +82 2 709 1412, Fax. +82 2 709 1415  
Uruguay: see South America  
Vietnam: see Singapore  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 625 344, Fax.+381 11 635 777  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Middle East: see Italy  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p,  
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1997  
SCA56  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
417067/1200/01/pp36  
Date of release: 1997 Nov 21  
Document order number: 9397 750 03044  

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