PCF8574 [NXP]
Remote 8-bit I/O expander for I2C-bus; 远程8位I / O扩展器I2C总线
| 型号： | PCF8574 |
| 厂家： | 
NXP |
| 描述： | Remote 8-bit I/O expander for I2C-bus |
| 文件： | 总24页 (文件大小：160K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
PCF8574
Remote 8-bit I/O expander for
I2C-bus
1997 Apr 02
Product specification
Supersedes data of September 1994
File under Integrated Circuits, IC12
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
CONTENTS
1
2
3
4
5
6
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
CHARACTERISTICS OF THE I2C-BUS
6.1
6.2
6.3
6.4
Bit transfer
Start and stop conditions
System configuration
Acknowledge
7
FUNCTIONAL DESCRIPTION
7.1
7.2
7.3
Addressing
Interrupt
Quasi-bidirectional I/Os
8
LIMITING VALUES
9
HANDLING
10
11
12
13
DC CHARACTERISTICS
I2C-BUS TIMING CHARACTERISTICS
PACKAGE OUTLINES
SOLDERING
13.1
Introduction
13.2
DIP
13.2.1
13.2.2
13.3
Soldering by dipping or by wave
Repairing soldered joints
SO and SSOP
13.3.1
13.3.2
13.3.3
Reflow soldering
Wave soldering
Repairing soldered joints
14
15
16
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I2C COMPONENTS
1997 Apr 02
2
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
1
FEATURES
2
GENERAL DESCRIPTION
• Operating supply voltage 2.5 to 6 V
• Low standby current consumption of 10 µA maximum
• I2C to parallel port expander
The PCF8574 is a silicon CMOS circuit. It provides general
purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I2C).
The device consists of an 8-bit quasi-bidirectional port and
an I2C-bus interface. The PCF8574 has a low current
consumption and includes latched outputs with high
current drive capability for directly driving LEDs. It also
possesses an interrupt line (INT) which can be connected
to the interrupt logic of the microcontroller. By sending an
interrupt signal on this line, the remote I/O can inform the
microcontroller if there is incoming data on its ports without
having to communicate via the I2C-bus. This means that
the PCF8574 can remain a simple slave device.
• Open-drain interrupt output
• 8-bit remote I/O port for the I2C-bus
• Compatible with most microcontrollers
• Latched outputs with high current drive capability for
directly driving LEDs
• Address by 3 hardware address pins for use of up to
8 devices (up to 16 with PCF8574A)
• DIP16, or space-saving SO16 or SSOP20 packages.
The PCF8574 and PCF8574A versions differ only in their
slave address as shown in Fig.9.
3
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PCF8574P;
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-1
PCF8574AP
PCF8574T;
PCF8574AT
SO16
plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
SOT266-1
PCF8574TS
SSOP20
plastic shrink small outline package; 20 leads; body width 4.4 mm
1997 Apr 02
3
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
4
BLOCK DIAGRAM
INT
13
INTERRUPT
LOGIC
LP FILTER
1
2
3
PCF8574
A0
A1
4
5
P0
P1
P2
P3
P4
P5
P6
P7
A2
6
14
15
SCL
SDA
2
7
INPUT
FILTER
I C BUS
SHIFT
REGISTER
I/O
PORT
CONTROL
8 BIT
9
10
11
12
WRITE pulse
READ pulse
16
8
V
DD
POWER-ON
RESET
V
SS
MBD980
Fig.1 Block diagram (SOT38-1 and SOT162-1).
1997 Apr 02
4
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
5
PINNING
SYMBOL
PIN
DIP16; SO16
DESCRIPTION
SSOP20
A0
1
2
6
7
address input 0
A1
address input 1
A2
3
9
address input 2
P0
4
10
11
12
14
15
16
17
19
20
1
quasi-bidirectional I/O 0
quasi-bidirectional I/O 1
quasi-bidirectional I/O 2
quasi-bidirectional I/O 3
supply ground
P1
5
P2
6
P3
7
VSS
P4
8
9
quasi-bidirectional I/O 4
quasi-bidirectional I/O 5
quasi-bidirectional I/O 6
quasi-bidirectional I/O 7
P5
10
11
12
13
14
15
16
−
P6
P7
INT
SCL
SDA
VDD
n.c.
n.c.
n.c.
n.c.
interrupt output (active LOW)
serial clock line
serial data line
2
4
5
supply voltage
3
not connected
−
8
not connected
−
13
18
not connected
−
not connected
handbook, halfpage
INT
P7
P6
1
2
20
19
handbook, halfpage
SCL
n.c.
V
1
2
3
4
5
6
7
8
16
15
A0
DD
3
18 n.c.
A1
A2
SDA
4
17
16
15
14
SDA
P5
14 SCL
V
P4
V
13
5
P0
P1
P2
P3
INT
DD
PCF8574
PCF8574A
PCF8574TS
12 P7
11 P6
A0
A1
6
SS
P3
7
10
9
P5
P4
n.c.
A2
8
13 n.c.
12 P2
V
SS
9
MBD979
P0
P1
10
11
MBD978
Fig.2 Pin configuration (DIP16; SO16).
Fig.3 Pin configuration (SSOP20).
1997 Apr 02
5
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
CHARACTERISTICS OF THE I2C-BUS
6.2
Start and stop conditions
6
The I2C-bus is for 2-way, 2-line communication between
different ICs or modules. The two lines are a serial data
line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when
connected to the output stages of a device. Data transfer
may be initiated only when the bus is not busy.
Both data and clock lines remain HIGH when the bus is not
busy. A HIGH-to-LOW transition of the data line, while the
clock is HIGH is defined as the start condition (S).
A LOW-to-HIGH transition of the data line while the clock
is HIGH is defined as the stop condition (P) (see Fig.5).
6.3
System configuration
6.1
Bit transfer
A device generating a message is a ‘transmitter’, a device
receiving is the ‘receiver’. The device that controls the
message is the ‘master’ and the devices which are
controlled by the master are the ‘slaves’ (see Fig.6).
One data bit is transferred during each clock pulse. The
data on the SDA line must remain stable during the HIGH
period of the clock pulse as changes in the data line at this
time will be interpreted as control signals (see Fig.4).
SDA
SCL
data line
stable;
data valid
change
of data
allowed
MBC621
Fig.4 Bit transfer.
SDA
SDA
SCL
SCL
S
P
STOP condition
START condition
MBC622
Fig.5 Definition of start and stop conditions.
SDA
SCL
MASTER
TRANSMITTER /
RECEIVER
SLAVE
TRANSMITTER /
RECEIVER
MASTER
TRANSMITTER /
RECEIVER
SLAVE
RECEIVER
MASTER
TRANSMITTER
MBA605
Fig.6 System configuration.
6
1997 Apr 02
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
transmitter. The device that acknowledges has to pull
down the SDA line during the acknowledge clock pulse, so
that the SDA line is stable LOW during the HIGH period of
the acknowledge related clock pulse, set-up and hold
times must be taken into account.
6.4
Acknowledge
The number of data bytes transferred between the start
and the stop conditions from transmitter to receiver is not
limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put
on the bus by the transmitter whereas the master
generates an extra acknowledge related clock pulse.
A master receiver must signal an end of data to the
transmitter by not generating an acknowledge on the last
byte that has been clocked out of the slave. In this event
the transmitter must leave the data line HIGH to enable the
master to generate a stop condition.
A slave receiver which is addressed must generate an
acknowledge after the reception of each byte. Also a
master must generate an acknowledge after the reception
of each byte that has been clocked out of the slave
DATA OUTPUT
BY TRANSMITTER
not acknowledge
acknowledge
DATA OUTPUT
BY RECEIVER
SCL FROM
1
2
8
9
MASTER
S
clock pulse for
acknowledgement
START
CONDITION
MBC602
Fig.7 Acknowledgment on the I2C-bus.
1997 Apr 02
7
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
7
FUNCTIONAL DESCRIPTION
V
DD
write pulse
100
µA
data from
shift register
D
C
Q
FF
P0 to P7
I
S
power-on
reset
V
SS
D
C
Q
FF
I
read pulse
S
to interrupt
logic
data to
shift register
MBD977
Fig.8 Simplified schematic diagram of each I/O.
7.1
Addressing
For addressing see Figs 9, 10 and 11.
slave address
slave address
S
0
1
0
0
A2 A1 A0
0
A
S
0
1
1
1
A2 A1 A0
0
A
MBD973
a.
b.
(a) PCF8574.
(b) PCF8574A.
Fig.9 PCF8574 and PCF8574A slave addresses.
Each of the PCF8574’s eight I/Os can be independently
used as an input or output. Input data is transferred from
the port to the microcontroller by the READ mode
(see Fig.11). Output data is transmitted to the port by the
WRITE mode (see Fig.10).
1997 Apr 02
8
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
BM9D74
n
1997 Apr 02
9
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
BM9D75
a n d b o o k , f u l l p a g e w
1997 Apr 02
10
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
• Interrupts which occur during the acknowledge clock
pulse may be lost (or very short) due to the resetting of
the interrupt during this pulse.
7.2
Interrupt (see Figs 12 and 13)
The PCF8574 provides an open drain output (INT) which
can be fed to a corresponding input of the microcontroller.
This gives these chips a type of master function which can
initiate an action elsewhere in the system.
Each change of the I/Os after resetting will be detected
and, after the next rising clock edge, will be transmitted as
INT. Reading from or writing to another device does not
affect the interrupt circuit.
An interrupt is generated by any rising or falling edge of the
port inputs in the input mode. After time tiv the signal INT is
valid.
7.3
Quasi-bidirectional I/Os (see Fig.14)
Resetting and reactivating the interrupt circuit is achieved
when data on the port is changed to the original setting or
data is read from or written to the port which has generated
the interrupt.
A quasi-bidirectional I/O can be used as an input or output
without the use of a control signal for data direction.
At power-on the I/Os are HIGH. In this mode only a current
source to VDD is active. An additional strong pull-up to VDD
allows fast rising edges into heavily loaded outputs. These
devices turn on when an output is written HIGH, and are
switched off by the negative edge of SCL. The I/Os should
be HIGH before being used as inputs.
Resetting occurs as follows:
• In the READ mode at the acknowledge bit after the rising
edge of the SCL signal
• In the WRITE mode at the acknowledge bit after the
HIGH-to-LOW transition of the SCL signal
PCF8574
PCF8574
(2)
PCF8574
(16)
V
(1)
DD
INT
INT
INT
MICROCOMPUTER
INT
MBD976
Fig.12 Application of multiple PCF8574s with interrupt.
slave address (PCF8574)
data from port
SDA
SCL
S
0
1
0
0
A2 A1 A0
1
A
1
1
P
P5
stop
condition
start condition
R/W acknowledge
from slave
1
2
3
4
5
6
7
8
DATA INTO
P5
INT
MBD972
t
t
iv
ir
Fig.13 Interrupt generated by a change of input to I/O P5.
11
1997 Apr 02
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
BM9D71
d b o o k , f u l l p a g e w i d
1997 Apr 02
12
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
8
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER
VDD
MIN.
MAX.
UNIT
supply voltage
−0.5
+7.0
VDD + 0.5
±20
V
V
VI
input voltage
V
−
−
−
−
−
−
SS − 0.5
II
DC input current
DC output current
supply current
mA
mA
mA
mA
mW
mW
°C
IO
±25
IDD
ISS
Ptot
PO
Tstg
Tamb
±100
±100
400
supply current
total power dissipation
power dissipation per output
storage temperature
100
−65
−40
+150
+85
operating ambient temperature
°C
9
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under
“Handling MOS Devices”.
10 DC CHARACTERISTICS
VDD = 2.5 to 6 V; VSS = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDD
IDD
supply voltage
2.5
−
6.0
V
supply current
operating mode; VDD = 6 V;
−
40
100
µA
no load; VI = VDD or VSS
;
fSCL = 100 kHz
Istb
standby current
standby mode; VDD = 6 V;
no load; VI = VDD or VSS
−
−
2.5
1.3
10
µA
VPOR
Power-on reset voltage
VDD = 6 V; no load;
2.4
V
VI = VDD or VSS; note 1
Input SCL; input/output SDA
VIL
VIH
IOL
IL
LOW level input voltage
−0.5
−
−
−
−
−
+0.3VDD
V
HIGH level input voltage
LOW level output current
leakage current
0.7VDD
VDD + 0.5
V
VOL = 0.4 V
VI = VDD or VSS
VI = VSS
3
−
mA
µA
pF
−1
−
+1
7
Ci
input capacitance
1997 Apr 02
13
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
SYMBOL
I/Os
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VIL
LOW level input voltage
HIGH level input voltage
−0.5
−
−
−
+0.3VDD
VDD + 0.5
±400
V
V
VIH
0.7VDD
IIHL(max)
maximum allowed input
current through protection
diode
VI ≥ VDD or VI ≤ VSS
−
µA
IOL
LOW level output current
HIGH level output current
transient pull-up current
VOL = 1 V; VDD = 5 V
VOH = VSS
10
30
−
25
−
−
mA
µA
IOH
IOHt
300
−
HIGH during acknowledge
−1
mA
(see Fig.14); VOH = VSS
VDD = 2.5 V
;
Ci
input capacitance
output capacitance
−
−
−
−
10
10
pF
pF
Co
Port timing; CL ≤ 100 pF (see Figs 10 and 11)
tpv
tsu
th
output data valid
−
0
4
−
−
−
4
−
−
µs
µs
µs
input data set-up time
input data hold time
Interrupt INT (see Fig.13)
IOL LOW level output current
IL leakage current
TIMING; CL ≤ 100 PF
VOL = 0.4 V
1.6
−
−
−
mA
VI = VDD or VSS
−1
+1
µA
tiv
tir
input data valid time
reset delay time
−
−
−
−
4
4
µs
µs
Select inputs A0 to A2
VIL
VIH
ILI
LOW level input voltage
−0.5
−
−
−
+0.3VDD
VDD + 0.5
+250
V
HIGH level input voltage
input leakage current
0.7VDD
−250
V
pin at VDD or VSS
nA
Note
1. The Power-on reset circuit resets the I2C-bus logic with VDD < VPOR and sets all I/Os to logic 1 (with current source
to VDD).
1997 Apr 02
14
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
11 I2C-BUS TIMING CHARACTERISTICS
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
I2C-BUS TIMING (see Fig.15; note 1)
fSCL
SCL clock frequency
tolerable spike width on bus
bus free time
−
−
−
−
−
−
−
−
−
−
−
−
−
−
100
kHz
tSW
−
100
−
ns
µs
µs
µs
µs
µs
µs
µs
ns
ns
µs
µs
tBUF
4.7
4.7
4.0
4.7
4.0
−
tSU;STA
tHD;STA
tLOW
tHIGH
tr
START condition set-up time
START condition hold time
SCL LOW time
−
−
−
SCL HIGH time
−
SCL and SDA rise time
SCL and SDA fall time
data set-up time
1.0
0.3
−
tf
−
tSU;DAT
tHD;DAT
tVD;DAT
tSU;STO
250
0
data hold time
−
SCL LOW to data out valid
STOP condition set-up time
−
3.4
−
4.0
Note
1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to VIL
and VIH with an input voltage swing of VSS to VDD
.
START
CONDITION
(S)
BIT 7
MSB
(A7)
BIT 6
(A6)
BIT 0
LSB
(R/W)
ACKNOWLEDGE
(A)
STOP
CONDITION
(P)
PROTOCOL
t
t
t
HIGH
SU;STA
LOW
1 / f
SCL
SCL
SDA
t
t
t
f
BUF
r
t
t
t
t
t
HD;STA
SU;DAT
VD;DAT
SU;STO
HD;DAT
MBD820
Fig.15 I2C-bus timing diagram.
15
1997 Apr 02
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
12 PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.
max.
min.
max.
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
2.2
0.021
0.015
0.013
0.009
0.86
0.84
0.32
0.31
0.055
0.045
0.26
0.24
0.15
0.13
0.37
0.33
inches
0.19
0.020
0.15
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-02
95-01-19
SOT38-1
050G09
MO-001AE
1997 Apr 02
16
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A
X
c
H
v
M
A
E
y
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
detail X
e
w
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
1.27
0.050
1.4
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.41
0.014 0.009 0.40
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT162-1
075E03
MS-013AA
1997 Apr 02
17
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A
X
c
y
H
v
M
A
E
Z
11
20
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
10o
0o
0.15
0
1.4
1.2
0.32
0.20
0.20
0.13
6.6
6.4
4.5
4.3
6.6
6.2
0.75
0.45
0.65
0.45
0.48
0.18
mm
1.5
0.65
1.0
0.2
0.25
0.13
0.1
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
90-04-05
95-02-25
SOT266-1
1997 Apr 02
18
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
Several techniques exist for reflowing; for example,
13 SOLDERING
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
13.1 Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
13.3.2 WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
13.2 DIP
If wave soldering cannot be avoided, the following
conditions must be observed:
13.2.1 SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
• The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
13.2.2 REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
13.3 SO and SSOP
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
13.3.1 REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO and
SSOP packages.
13.3.3 REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1997 Apr 02
19
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
14 DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
15 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
16 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1997 Apr 02
20
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
NOTES
1997 Apr 02
21
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
NOTES
1997 Apr 02
22
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
NOTES
1997 Apr 02
23
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© Philips Electronics N.V. 1997
SCA53
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Printed in The Netherlands
417067/1200/02/pp24
Date of release: 1997 Apr 02
Document order number: 9397 750 01758
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