PCF8582E-2 [NXP]

256 x 8-bit CMOS EEPROMS with I2C-bus interface; 256 ×8位CMOS EEPROM器件采用I2C总线接口
PCF8582E-2
型号: PCF8582E-2
厂家: NXP    NXP
描述:

256 x 8-bit CMOS EEPROMS with I2C-bus interface
256 ×8位CMOS EEPROM器件采用I2C总线接口

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
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中文:  中文翻译
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INTEGRATED CIRCUITS  
DATA SHEET  
PCX8582X-2 Family  
256 x 8-bit CMOS EEPROMS  
with I2  
December 1994  
Product specification  
Supersedes data of February 1992  
File under Integrated Circuits, IC12  
Philips Semiconductors  
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
FEATURES  
Low power CMOS  
– maximum active current 2.0 mA  
– maximum standby current 10 µA (at 6.0 V),  
typical 4 µA  
Non-volatile storage of 2-Kbits organized as 256 × 8-bits  
Single supply with full operation down to 2.5 V  
On-chip voltage multiplier  
DESCRIPTION  
The PCX8582X-2 is a 2-Kbit (256 × 8-bit) floating gate  
electrically erasable programmable read only memory  
(EEPROM). By using an internal redundant storage code  
it is fault tolerant to single bit errors. This feature  
dramatically increases reliability compared to conventional  
EEPROM memories.  
Serial input/output I2C-bus  
Write operations  
– byte write mode  
– 8-byte page write mode  
Power consumption is low due to the full CMOS  
technology used. The programming voltage is generated  
on-chip, using a voltage multiplier.  
(minimizes total write time per byte)  
Read operations  
– sequential read  
As data bytes are received and transmitted via the serial  
I2C-bus, a package using eight pins is sufficient. Up to  
eight PCX8582X-2 devices may be connected to the  
I2C-bus. Chip select is accomplished by three address  
inputs (A0, A1, A2).  
– random read  
Internal timer for writing (no external components)  
Power-on reset  
High reliability by using a redundant storage code  
Endurance  
Timing of the ERASE/WRITE cycle is carried out  
internally, thus no external components are required. Pin 7  
(PTC) must be connected to either VDD or left open-circuit.  
– >500 k E/W-cycles at Tamb = 22 °C  
40 years non-volatile data retention time (typ.)  
Pin and address compatible to  
– PCX8570, PCF8571, PCF8572 and PCF8581  
– PCX8494X-2, PCX8598X-2 -Family.  
There is an option of using an external clock for timing the  
length of an ERASE/WRITE cycle.  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
2.5  
MAX.  
6.0  
UNIT  
VDD  
IDDR  
V
supply current READ  
fSCL = 100 kHz  
VDD = 3 V  
VDD = 6 V  
60  
µA  
µA  
200  
IDDW  
supply current ERASE/WRITE  
supply current STANDBY  
fSCL = 100 kHz  
VDD = 3 V  
0.6  
2.0  
3.5  
10  
mA  
mA  
µA  
VDD = 6 V  
IDDSB  
VDD = 3 V  
VDD = 6 V  
µA  
December 1994  
2
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
ORDERING INFORMATION  
PACKAGE  
DESCRIPTION  
TEMPERATURE (°C)  
MIN. MAX.  
+85  
SUPPLY (V)  
MIN. MAX.  
TYPE  
NUMBER  
NAME  
VERSION  
PCF8582C-2P  
PCD8582D-2P  
PCF8582E-2P  
PCA8582F-2P  
PCF8582C-2T  
PCD8582D-2T  
PCF8582E-2T  
PCA8582F-2T  
DIP8  
plastic dual in-line package; SOT97-1 40  
8 leads (300 mil)  
2.5  
3.0  
4.5  
4.5  
2.5  
3.0  
4.5  
4.5  
6.0  
6.0  
5.5  
5.5  
6.0  
6.0  
5.5  
5.5  
25  
+70  
+85  
+125  
+85  
+70  
+85  
+125  
40  
40  
SO8  
plastic small outline  
package;  
8 leads; body width 3.9 mm  
SOT96-1 40  
25  
40  
40  
DEVICE SELECTION  
Table 1 Device selection code  
SELECTION  
DEVICE CODE  
CHIP ENABLE  
R/W  
Bit  
b71  
1
b6  
0
b5  
1
b4  
b3  
A2  
b2  
A1  
b1  
A0  
b0  
Device  
0
R/W  
Note  
1. The MSB b7 is sent first.  
Table 2 Endurance and data retention guarantees  
DEVICE  
ENDURANCE E/W CYCLES  
500000(1)  
DATA RETENTION YEARS  
PCF8582C-2; PCA8582F-2  
40  
Note  
1. At the time of publication of this data sheet the statistical history was not yet sufficient to guarantee 1000000000 E/W  
cycle performance for these types.  
December 1994  
3
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
BLOCK DIAGRAM  
BM7C94  
a n ,  
December 1994  
4
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
PINNING  
SYMBOL PIN  
DESCRIPTION  
address input 0  
handbook, halfpage  
A0  
1
2
3
4
5
6
7
8
V
1
2
3
4
8
7
6
5
A0  
A1  
A2  
DD  
A1  
address input 1  
PTC  
SCL  
A2  
address input 2  
PCX8582X-2  
VSS  
SDA  
SCL  
PTC  
VDD  
negative supply voltage  
serial data input/output (I2C-bus)  
serial clock input (I2C-bus)  
programming time control output  
positive supply voltage  
V
SDA  
SS  
MBC792  
Fig.2 Pin configuration.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
0.3  
MAX.  
+7.0  
UNIT  
VDD  
VI  
supply voltage  
V
V
voltage on any input pin  
current on any input pin  
output current  
|ZI| > 500 Ω  
V
SS 0.8 VDD + 0.8  
II  
1
mA  
mA  
°C  
IO  
10  
Tstg  
Tamb  
storage temperature  
operating ambient temperature  
PCF8582C-2; PCF8582E-2  
PCD8582D-2  
65  
+150  
40  
25  
40  
+85  
°C  
°C  
°C  
+70  
PCA8582F-2  
+125  
December 1994  
5
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
CHARACTERISTICS  
PCF8582C-2: VDD = 2.5 to 6.0 V; VSS = 0 V; Tamb = 40 to +85 °C; unless otherwise specified.  
PCD8582D-2: VDD = 3.0 to 6.0 V; VSS = 0 V; Tamb = 25 to +70 °C; unless otherwise specified.  
PCF8582E-2: VDD = 4.5 to 5.5 V; VSS = 0 V; Tamb = 40 to +85 °C; unless otherwise specified.  
PCA8582F-2: VDD = 4.5 to 5.5 V; VSS = 0 V; Tamb = 40 to +125 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
Supplies  
VDD  
supply voltage  
PCF8582C-2  
2.5  
6.0  
V
V
V
PCD8582D-2  
3.0  
4.5  
6.0  
5.5  
PCF8582E-2; PCA8582F-2  
supply current READ  
PCF8582C-2; PCD8582D-2  
IDDR  
fSCL = 100 kHz  
VDD = 3.0 V  
VDD = 6.0 V  
VDD = 5.5 V  
fSCL = 100 kHz  
VDD = 3.0 V  
VDD = 6.0 V  
VDD = 5.5 V  
fSCL = 100 kHz  
VDD = 3.0 V  
VDD = 6.0 V  
VDD = 5.5 V  
60  
µA  
µA  
µA  
200  
200  
PCF8582E-2; PCA8582F-2  
supply current ERASE/WRITE  
PCF8582C-2; PCD8582D-2  
IDDW  
0.6  
2.0  
2.0  
mA  
mA  
mA  
PCF8582E-2; PCA8582F-2  
supply current STANDBY  
PCF8582C-2; PCD8582D-2  
IDDSB  
3.5  
10  
10  
µA  
µA  
µA  
PCF8582E-2; PCA8582F-2  
PTC input (pin 7)  
VIL  
VIH  
LOW level input voltage  
HIGH level input voltage  
0.8  
0.1VDD  
V
V
0.9VDD  
VDD + 0.8  
SCL input (pin 6)  
VIL  
VIH  
ILI  
LOW level input voltage  
0.8  
0.3VDD  
VDD + 0.8  
±1  
V
HIGH level input voltage  
input leakage current  
clock input frequency  
input capacitance  
0.7VDD  
V
VI = VDD or VSS  
VI = VSS  
0
µA  
kHz  
pF  
fSCL  
CI  
100  
7
SDA input/output (pin 5)  
VIL  
VIH  
VOL  
ILO  
CI  
LOW level input voltage  
0.8  
0.3VDD  
V
HIGH level input voltage  
LOW level output voltage  
output leakage current  
input capacitance  
0.7VDD  
VDD + 0.8  
V
IOL = 3 mA; VDD(min)  
VOH = VDD  
0.4  
1
V
µA  
pF  
VI = VSS  
7
Data retention time  
tS  
data retention time  
Tamb = 55 °C  
10  
years  
December 1994  
6
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
WRITE CYCLE LIMITS  
Selection of the chip address is achieved by connecting the A0, A1 and A2 inputs to either VSS or VDD  
.
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
ERASE/WRITE cycle timing  
tE/W  
ERASE/WRITE cycle time  
internal oscillator  
external clock  
7
ms  
4
10  
ms  
Endurance  
NE/W  
ERASE/WRITE cycle per byte  
PCF8582C-2  
Tamb = 85 °C; tE/W = 4 to 10 ms  
Tamb = 22 °C; tE/W = 5 ms  
100000  
500000  
10000  
cycles  
cycles  
cycles  
PCD8582D-2  
PCF8582E-2  
PCA8582F-2  
Tamb = 25 to +70 °C;  
tE/W = 4 to 10 ms  
Tamb = 25 to +40 °C; tE/W = 5 ms  
100000  
10000  
cycles  
cycles  
Tamb = 40 to +85 °C;  
tE/W = 4 to 10 ms  
Tamb = 22 °C; tE/W = 5 ms  
100000  
50000  
cycles  
cycles  
cycles  
cycles  
Tamb = 125 °C; tE/W = 4 to 10 ms  
Tamb = 85 °C; tE/W = 4 to 10 ms  
Tamb = 22 °C; tE/W = 5 ms  
100000  
500000  
December 1994  
7
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
I2C-BUS PROTOCOL  
Each byte is followed by one acknowledge bit. This  
acknowledge bit is a HIGH level, put on the bus by the  
transmitter. The master generates an extra acknowledge  
related clock pulse. The slave receiver which is addressed  
is obliged to generate an acknowledge after the reception  
of each byte.  
The I2C-bus is for 2-way, 2-line communication between  
different ICs or modules. The serial bus consists of two  
bidirectional lines: one for data signals (SDA), and one for  
clock signals (SCL).  
Both the SDA and SCL lines must be connected to a  
positive supply voltage via a pull-up resistor.  
The master receiver must generate an acknowledge after  
the reception of each byte that has been clocked out of the  
slave transmitter.  
The following protocol has been defined:  
Data transfer may be initiated only when the bus is not  
busy.  
The device that acknowledges has to pull down the SDA  
line during the acknowledge clock pulse in such a way that  
the SDA line is stable LOW during the HIGH period of the  
acknowledge related clock pulse.  
During data transfer, the data line must remain stable  
whenever the clock line is HIGH. Changes in the data  
line while the clock line is HIGH will be interpreted as  
control signals.  
Set-up and hold times must be taken into account. A  
master receiver must signal an end of data to the slave  
transmitter by not generating an acknowledge on the last  
byte that has been clocked out of the slave. In this event  
the transmitter must leave the data line HIGH to enable the  
master generation of the stop condition.  
The following bus conditions have been defined:  
Bus not busy: both data and clock lines remain HIGH.  
Start data transfer: a change in the state of the data  
line, from HIGH-to-LOW, while the clock is HIGH,  
defines the start condition.  
DEVICE ADDRESSING  
Stop data transfer: a change in the state of the data  
line, from LOW-to-HIGH, while the clock is HIGH,  
defines the stop condition.  
Following a start condition the bus master must output the  
address of the slave it is accessing. The most significant  
four bits of the slave address are the device type identifier  
(see Fig.3). For the PCX8582X-2 this is fixed as 1010.  
Data valid: the state of the data line represents valid  
data when, after a start condition, the data line is stable  
for the duration of the HIGH period of the clock signal.  
There is one clock pulse per bit of data.  
Each data transfer is initiated with a start condition and  
terminated with a stop condition; the number of the data  
bytes, transferred between the start and stop conditions is  
limited to seven bytes in the ERASE/WRITE mode and  
eight bytes in the PAGE ERASE/WRITE mode. Data  
transfer is unlimited in the READ mode. The information is  
transmitted in bytes and each receiver acknowledges with  
a ninth bit.  
handbook, halfpage  
1
0
1
0
A2 A1 A0 R/W  
MBC793  
Fig.3 Slave address.  
Within the I2C-bus specifications a low-speed mode (2 kHz  
clock rate) and a high speed mode (100 kHz clock rate)  
are defined.  
The next three significant bits address a particular device.  
A system could have up to eight PCX8582X-2 devices on  
the bus. The eight addresses are defined by the state of  
the A0, A1 and A2 inputs.  
The PCX8582X-2 operates in both modes.  
By definition a device that sends a signal is called a  
‘transmitter’, and the device which receives the signal is  
called a ‘receive’. The device which controls the signal is  
called the ‘master’. The devices that are controlled by the  
master are called ‘slaves’.  
The last bit of the slave address defines the operation to  
be performed. When set to logic 1 a read operation is  
selected.  
Address bits must be connected to either VDD or VSS  
.
December 1994  
8
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
WRITE OPERATIONS  
Byte/word write  
PAGE WRITE  
The PCX8582X-2 is capable of an eight-byte page write  
operation. It is initiated in the same manner as the byte  
write operation. The master can transmit eight data bytes  
within one transmission. After receipt of each byte the  
PCX8582X-2 will respond with an acknowledge. The  
typical ERASE/WRITE time in this mode is  
For a write operation the PCX8582X-2 requires a second  
address field. This address field is a word address  
providing access to the 256 words of memory. Upon  
receipt of the word address the PCX8582X-2 responds  
with an acknowledge and awaits the next eight bits of data,  
again responding with an acknowledge. Word address is  
automatically incremented. The master can now terminate  
the transfer by generating a stop condition or transmit up  
to six more bytes of data and then terminate by generating  
a stop condition.  
9 × 7 ms = 63 ms.  
After the receipt of each data byte the three low order bits  
of the word address are internally incremented. The high  
order five bits of the address remain unchanged. If the  
master transmits more than eight bytes prior to generating  
the stop condition, no acknowledge will be given on the  
ninth (and following) data bytes and the whole  
transmission will be ignored. As in the byte write operation,  
all inputs are disabled until completion of the internal write  
cycles.  
After this stop condition the ERASE/WRITE cycle starts  
and the bus is free for another transmission. Its duration is  
7 ms (typ.) per byte.  
During the ERASE/WRITE cycle the slave receiver does  
not send an acknowledge bit if addressed via the I2C-bus.  
December 1994  
9
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
acknowledge  
from slave  
acknowledge  
from slave  
acknowledge  
from slave  
acknowledge  
from slave  
a
0
A
A
DATA  
A
DATA  
A
P
S
SLAVE ADDRESS  
WORD ADDRESS  
R/W  
auto increment  
word address  
auto increment  
word address  
MBA701  
Fig.4 Auto increment memory word address; two byte write.  
acknowledge  
from slave  
acknowledge  
from slave  
acknowledge  
from slave  
acknowledge  
from slave  
DATA N  
DATA N + 1  
S
SLAVE ADDRESS  
0
A
WORD ADDRESS  
A
A
A
R/W  
auto increment  
word address  
auto increment  
word address  
acknowledge  
from slave  
A
DATA N + 7  
last byte  
1
auto increment  
word address  
MBA702  
Fig.5 Page write operation; eight byte.  
10  
December 1994  
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
READ OPERATIONS  
Read operations are initiated in the same manner as write operations with the exception that the LSB of the slave address  
is set to logic 1. There are three basic read operations; current address read, random read and sequential read.  
acknowledge  
from slave  
acknowledge  
from slave  
acknowledge  
from slave  
acknowledge  
from master  
SLAVE ADDRESS  
DATA  
S
SLAVE ADDRESS  
0
A
WORD ADDRESS  
A
S
1
A
A
n bytes  
R/W  
R/W  
at this moment master  
transmitter becomes  
auto increment  
word address  
master receiver and  
EEPROM slave receiver  
becomes slave transmitter  
no acknowledge  
from master  
P
DATA  
1
last byte  
auto increment  
word address  
MBA703 - 1  
Fig.6 Master reads PCX8582X-2 slave after setting word address (WRITE word address; READ data).  
acknowledge  
from slave  
acknowledge  
from master  
no acknowledge  
from master  
1
A
A
DATA  
1
P
S
SLAVE ADDRESS  
DATA  
n bytes  
last bytes  
R/W  
auto increment  
word address  
auto increment  
word address  
MBA704 - 1  
Fig.7 Master reads PCX8582X-2 immediately after first byte (READ mode).  
11  
December 1994  
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
I2C-BUS TIMING  
BM7A05  
o  
December 1994  
12  
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
I2C-BUS CHARACTERISTICS  
All of the timing values are valid within the operating supply voltage and ambient temperature range and refer to VIL and  
VIH with an input voltage swing from VSS to VDD  
.
SYMBOL  
PARAMETER  
CONDITIONS MIN. MAX. UNIT  
fSCL  
clock frequency  
0
100  
kHz  
µs  
µs  
µs  
µs  
µs  
µs  
ns  
ns  
µs  
ns  
µs  
tBUF  
time the bus must be free before new transmission can start  
start condition hold time after which first clock pulse is generated  
LOW level clock period  
4.7  
tHD;STA  
tLOW  
4.0  
4.7  
tHIGH  
tSU;STA  
tHD;DAT  
tHD;DAT  
tSU;DAT  
tr  
HIGH level clock period  
4.0  
repeated start 4.7  
5
set-up time for start condition  
data hold time for bus compatible masters  
data hold time for bus devices  
data set-up time  
note 1  
0
250  
SDA and SCL rise time  
1
tf  
SDA and SCL fall time  
300  
tSU;STO  
set-up time for stop condition  
4.7  
Note  
1. The hold time required (not greater than 300 ns) to bridge the undefined region of the falling edge of SCL must be  
internally provided by a transmitter.  
December 1994  
13  
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
EXTERNAL CLOCK TIMING  
t
t
f
r
t
t
t
LOW  
d
HIGH  
1
PTC  
SDA  
2
257  
SCL  
MBA697  
STOP  
Fig.9 One byte ERASE/WRITE cycle.  
t
t
f
r
t
t
t
LOW  
d
HIGH  
1
n x 256 + 1  
PTC  
SDA  
2
SCL  
MBA698  
STOP  
Fig.10 n byte ERASE/WRITE cycle (n = 2 to 7).  
t
t
f
r
t
t
t
LOW  
d
HIGH  
1
PTC  
SDA  
2
1153  
SCL  
MBA699  
STOP  
Fig.11 Page mode.  
14  
December 1994  
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
SLAVE ADDRESS  
WORD ADDRESS  
2
I C-bus  
0 A  
A
DATA  
A
DATA  
A
(1)  
P
S
HIGH  
PTC  
undefined  
undefined  
LOW  
1
1
1
2
2
2
257  
513  
1153  
clock (2)  
clock (3)  
clock (4)  
negative edge  
SCL 8-bit  
t
0
d
MBA700  
(1) If an external clock is chosen, this information is latched internally by setting pin 7 (PTC) LOW  
after transmission of the eighth bit of the word address (negative edge of SCL).  
Thus the state of pin 7 may be previously undefined. Leaving pin 7 LOW causes a higher standby current.  
(2) 1-byte programming.  
(3) 2-byte programming.  
(4) One page (8 byte) programming.  
Fig.12 External clock.  
December 1994  
15  
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
PACKAGE OUTLINES  
8.25  
7.80  
9.8  
9.2  
3.2  
max  
4.2  
max  
0.51  
min  
3.60  
3.05  
2.54  
(3x)  
0.254  
M
0.38 max  
1.15  
max  
0.53  
max  
7.62  
10.0  
1.73 max  
8.3  
MSA252 - 1  
8
1
5
6.48  
6.20  
4
Dimensions in mm.  
Fig.13 Plastic dual in-line package; 8 leads (300 mil) DIP8; SOT97-1.  
December 1994  
16  
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
4.0  
3.8  
5.0  
4.8  
A
6.2  
5.8  
S
0.1 S  
0.7  
0.3  
8
1
5
4
0.7  
0.6  
1.45  
1.25  
1.75  
1.35  
0.25  
0.19  
1.0  
0.5  
0.25  
0.10  
o
0 to 8  
pin 1  
index  
detail A  
MBC180 - 1  
1.27  
0.49  
0.36  
0.25 M  
(8x)  
Dimensions in mm.  
Fig.14 Plastic small outline package; 8 leads; body width 3.9 mm (SO8; SOT96-1).  
December 1994  
17  
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
SOLDERING  
BY SOLDER PASTE REFLOW  
Reflow soldering requires the solder paste (a suspension  
of fine solder particles, flux and binding agent) to be  
applied to the substrate by screen printing, stencilling or  
pressure-syringe dispensing before device placement.  
Plastic dual in-line packages  
BY DIP OR WAVE  
The maximum permissible temperature of the solder is  
260 °C; this temperature must not be in contact with the  
joint for more than 5 s. The total contact time of successive  
solder waves must not exceed 5 s.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt, infrared, and  
vapour-phase reflow. Dwell times vary between 50 and  
300 s according to method. Typical reflow temperatures  
range from 215 to 250 °C.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified storage maximum. If the printed-circuit board has  
been pre-heated, forced cooling may be necessary  
immediately after soldering to keep the temperature within  
the permissible limit.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 min at 45 °C.  
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING  
IRON OR PULSE-HEATED SOLDER TOOL)  
REPAIRING SOLDERED JOINTS  
Fix the component by first soldering two, diagonally  
opposite, end pins. Apply the heating tool to the flat part of  
the pin only. Contact time must be limited to 10 s at up to  
300 °C. When using proper tools, all other pins can be  
soldered in one operation within 2 to 5 s at between 270  
and 320 °C. (Pulse-heated soldering is not recommended  
for SO packages.)  
Apply a low-voltage soldering iron below the seating plane  
(or not more than 2 mm above it). If its temperature is  
below 300 °C, it must not be in contact for more than 10 s;  
if between 300 and 400 °C, for not more than 5 s.  
Plastic small-outline packages  
BY WAVE  
For pulse-heated solder tool (resistance) soldering of VSO  
packages, solder is applied to the substrate by dipping or  
by an extra thick tin/lead plating before package  
placement.  
During placement and before soldering, the component  
must be fixed with a droplet of adhesive. After curing the  
adhesive, the component can be soldered. The adhesive  
can be applied by screen printing, pin transfer or syringe  
dispensing.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder bath is  
10 s, if allowed to cool to less than 150 °C within 6 s.  
Typical dwell time is 4 s at 250 °C.  
A modified wave soldering technique is recommended  
using two solder waves (dual-wave), in which a turbulent  
wave with high upward pressure is followed by a smooth  
laminar wave. Using a mildly-activated flux eliminates the  
need for removal of corrosive residues in most  
applications.  
December 1994  
18  
Philips Semiconductors  
Product specification  
256 x 8-bit CMOS EEPROMS  
with I2C-bus interface  
PCX8582X-2 Family  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
PURCHASE OF PHILIPS I2C COMPONENTS  
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the  
components in the I2C system provided the system conforms to the I2C specification defined by  
Philips. This specification can be ordered using the code 9398 393 40011.  
December 1994  
19  
Philips Semiconductors – a worldwide company  
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BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367  
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Fax. (021)577035/5874546.  
Tel. (02)805 4455, Fax. (02)805 4466  
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Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474  
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Tel. (01)60 101-1236, Fax. (01)60 101-1211  
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,  
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Apartado 300, 2795 LINDA-A-VELHA,  
Tel. (01)4163160/4163333, Fax. (01)4163174/4163366.  
Brazil: Rua do Rocio 220 - 5th floor, Suite 51,  
CEP: 04552-903-SÃO PAULO-SP, Brazil.  
P.O. Box 7383 (01064-970).  
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Tel. (65)350 2000, Fax. (65)251 6500  
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Tel. (011)821-2333, Fax. (011)829-1849  
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Tel. (011)470-5911, Fax. (011)470-5494.  
Tel. (02)773 816, Fax. (02)777 6730  
Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,  
77621 BOGOTA, Tel. (571)249 7624/(571)217 4609,  
Fax. (571)217 4549  
Denmark:Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. (032)88 2636, Fax. (031)57 1949  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
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24-28 Kung Yip St., KWAI CHUNG, N.T.,  
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Tel. (0)8-632 2000, Fax. (0)8-632 2745  
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Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,  
TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382.  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong,  
Bangkok 10260, THAILAND,  
Tel. (662)398-0141, Fax. (662)398-3319.  
Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
Tel. (0212)279 2770, Fax. (0212)269 3094  
United Kingdom: Philips Semiconductors LTD.,  
276 Bath Road, Hayes, MIDDLESEX UB3 5BX,  
Tel. (081)730-5000, Fax. (081)754-8421  
United States:811 East Arques Avenue, SUNNYVALE,  
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556  
Uruguay: Coronel Mora 433, MONTEVIDEO,  
Tel. (852)424 5121, Fax. (852)428 6729  
India: Philips INDIA Ltd, Shivsagar Estate, A Block ,  
Dr. Annie Besant Rd. Worli, Bombay 400 018  
Tel. (022)4938 541, Fax. (022)4938 722  
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P.O. Box 4252, JAKARTA 12950,  
Tel. (02)70-4044, Fax. (02)92 0601  
Tel. (021)5201 122, Fax. (021)5205 189  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. (01)640 000, Fax. (01)640 200  
For all other countries apply to: Philips Semiconductors,  
International Marketing and Sales, Building BE-p,  
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,  
Telex 35000 phtcnl, Fax. +31-40-724825  
Italy: PHILIPS SEMICONDUCTORS S.r.l.,  
Piazza IV Novembre 3, 20124 MILANO,  
Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557  
Japan: Philips Bldg 13-37, Kohnan2-chome, Minato-ku, TOKYO 108,  
SCD36  
© Philips Electronics N.V. 1994  
Tel. (03)3740 5028, Fax. (03)3740 0580  
Korea: (Republic of) Philips House, 260-199 Itaewon-dong,  
All rights are reserved. Reproduction in whole or in part is prohibited without the  
prior written consent of the copyright owner.  
Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,  
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,  
Tel. 9-5(800)234-7381, Fax. (708)296-8556  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB  
The information presented in this document does not form part of any quotation  
or contract, is believed to be accurate and reliable and may be changed without  
notice. No liability will be accepted by the publisher for any consequence of its  
use. Publication thereof does not convey nor imply any license under patent- or  
other industrial or intellectual property rights.  
Tel. (040)783749, Fax. (040)788399  
Printed in The Netherlands  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Tel. (09)849-4160, Fax. (09)849-7811  
493061/1500/02/pp20  
Date of release: December 1994  
9397 743 70011  
Norway: Box 1, Manglerud 0612, OSLO,  
Tel. (022)74 8000, Fax. (022)74 8341  
Document order number:  
Philips Semiconductors  

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