PDTC143Z [NXP]
NPN resistor-equipped transistors; R1 = 4.7 kW, R2 = 47 kW; NPN电阻配备晶体管; R1 = 4.7千瓦， R2 = 47千瓦
| 型号： | PDTC143Z |
| 厂家： | 
NXP |
| 描述： | NPN resistor-equipped transistors; R1 = 4.7 kW, R2 = 47 kW |
| 文件： | 总14页 (文件大小：92K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
PDTC143Z series
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
Product specification
2004 Aug 16
Supersedes data of 2004 Apr 06
Philips Semiconductors
Product specification
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
PDTC143Z series
FEATURES
QUICK REFERENCE DATA
• Built-in bias resistors
SYMBOL
PARAMETER
TYP. MAX. UNIT
• Simplified circuit design
VCEO
collector-emitter
voltage
−
50
V
• Reduction of component count
• Reduced pick and place costs.
IO
output current (DC)
bias resistor
−
100
−
mA
kΩ
kΩ
R1
R2
4.7
47
bias resistor
−
APPLICATIONS
• General purpose switching and amplification
• Inverter and interface circuits
• Circuit driver.
DESCRIPTION
NPN resistor-equipped transistor (see “Simplified outline,
symbol and pinning” for package details).
PRODUCT OVERVIEW
PACKAGE
TYPE NUMBER
MARKING CODE
PNP COMPLEMENT
PHILIPS
SOT416
EIAJ
PDTC143ZE
PDTC143ZEF
PDTC143ZK
PDTC143ZM
PDTC143ZS
PDTC143ZT
PDTC143ZU
SC-75
SC-89
SC-59
SC-101
SC-43
−
38
53
PDTA143ZE
PDTA143ZEF
PDTA143ZK
PDTA143ZM
PDTA143ZS
PDTA143ZT
PDTA143ZU
SOT490
SOT346
18
SOT883
E3
SOT54 (TO-92)
SOT23
TC143Z
*18(1)
*54(1)
SOT323
SC-70
Note
1. * = p: Made in Hong Kong.
* = t: Made in Malaysia.
* = W: Made in China.
2004 Aug 16
2
Philips Semiconductors
Product specification
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
PDTC143Z series
SIMPLIFIED OUTLINE, SYMBOL AND PINNING
PINNING
TYPE NUMBER
SIMPLIFIED OUTLINE AND SYMBOL
PIN
DESCRIPTION
PDTC143ZS
1
2
3
base
collector
emitter
handbook, halfpage
2
3
R1
1
2
3
1
R2
MAM364
PDTC143ZE
PDTC143ZEF
PDTC143ZK
PDTC143ZT
PDTC143ZU
1
2
3
base
emitter
collector
handbook, halfpage
3
3
2
R1
R2
1
1
2
Top view
MDB269
PDTC143ZM
1
2
3
base
emitter
collector
handbook, halfpage
3
2
R1
R2
2
1
3
1
bottom view
MHC506
2004 Aug 16
3
Philips Semiconductors
Product specification
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
PDTC143Z series
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PDTC143ZE
PDTC143ZEF
PDTC143ZK
PDTC143ZM
−
−
−
−
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
SOT416
SOT490
SOT346
leadless ultra small plastic package; 3 solder lands; body
SOT883
1.0 × 0.6 × 0.5 mm
PDTC143ZS
PDTC143ZT
PDTC143ZU
−
−
−
plastic single-ended leaded (through hole) package; 3 leads
plastic surface mounted package; 3 leads
SOT54
SOT23
SOT323
plastic surface mounted package; 3 leads
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VCBO
VCEO
VEBO
VI
PARAMETER
CONDITIONS
open emitter
MIN.
MAX.
UNIT
collector-base voltage
collector-emitter voltage
emitter-base voltage
input voltage
−
−
−
50
50
10
V
V
V
open base
open collector
positive
−
−
−
−
+30
−5
V
V
negative
IO
output current (DC)
peak collector current
total power dissipation
SOT54
100
100
mA
mA
ICM
Ptot
T
amb ≤ 25 °C
note 1
−
−
−
−
−
−
−
500
250
250
200
250
150
250
+150
150
+150
mW
mW
mW
mW
mW
mW
mW
°C
SOT23
note 1
SOT346
note 1
SOT323
note 1
SOT883
notes 2 and 3
note 1
SOT416
SOT490
notes 1 and 2
Tstg
Tj
storage temperature
junction temperature
−65
−
°C
Tamb
operating ambient
temperature
−65
°C
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60 µm copper strip line.
2004 Aug 16
4
Philips Semiconductors
Product specification
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
PDTC143Z series
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
in free air
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
SOT54
note 1
250
500
500
625
500
833
500
K/W
K/W
K/W
K/W
K/W
K/W
K/W
SOT23
note 1
SOT346
SOT323
SOT883
SOT416
SOT490
note 1
note 1
notes 2 and 3
note 1
notes 1 and 2
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60 µm copper strip line.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
VCB = 50 V; IE = 0 A
MIN.
TYP. MAX. UNIT
ICBO
ICEO
collector-base cut-off current
collector-emitter cut-off current
−
−
100
1
nA
µA
µA
µA
VCE = 30 V; IB = 0 A
−
−
VCE = 30 V; IB = 0 A; Tj = 150 °C
VEB = 5 V; IC = 0 A
−
−
50
170
−
IEBO
hFE
emitter-base cut-off current
DC current gain
−
−
VCE = 5 V; IC = 10 mA
100
−
−
VCEsat
Vi(off)
Vi(on)
R1
collector-emitter saturation voltage IC = 5 mA; IB = 0.25 mA
−
100
0.5
−
mV
V
input-off voltage
input-on voltage
input resistor
IC = 100 µA; VCE = 5 V
−
0.6
0.9
4.7
IC = 5 mA; VCE = 0.3 V
1.3
3.3
V
6.1
kΩ
R2
-------
R1
resistor ratio
8
10
12
Cc
collector capacitance
IE = ie = 0 A; VCB = 10 V;
f = 1 MHz
−
−
2.5
pF
2004 Aug 16
5
Philips Semiconductors
Product specification
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
PDTC143Z series
PACKAGE OUTLINES
Plastic surface mounted package; 3 leads
SOT346
E
A
D
B
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
L
p
e
1
b
p
w M
B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
A
p
1
p
1
E
1.3
1.0
0.1
0.013
0.50
0.35
0.26
0.10
3.1
2.7
1.7
1.3
3.0
2.5
0.6
0.2
0.33
0.23
mm
1.9
0.95
0.2
0.2
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
EIAJ
98-07-17
SOT346
TO-236
SC-59
2004 Aug 16
6
Philips Semiconductors
Product specification
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
PDTC143Z series
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
SOT883
L
L
1
2
b
3
b
e
1
1
e
1
A
A
1
E
D
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
1
UNIT
A
b
b
D
E
e
e
L
L
1
1
1
max.
0.50
0.46
0.20 0.55 0.62 1.02
0.12 0.47 0.55 0.95
0.30 0.30
0.22 0.22
mm
0.03
0.35 0.65
Note
1. Including plating thickness
REFERENCES
JEDEC
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEITA
03-02-05
03-04-03
SOT883
SC-101
2004 Aug 16
7
Philips Semiconductors
Product specification
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
PDTC143Z series
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
2
e
1
e
D
3
b
1
L
1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
L
1
UNIT
A
b
b
c
D
d
E
e
e
L
1
1
max.
5.2
5.0
0.48
0.40
0.66
0.55
0.45
0.38
4.8
4.4
1.7
1.4
4.2
3.6
14.5
12.7
mm
2.54
1.27
2.5
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
97-02-28
04-06-28
SOT54
TO-92
SC-43A
2004 Aug 16
8
Philips Semiconductors
Product specification
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
PDTC143Z series
Plastic surface mounted package; 3 leads
SOT23
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
1
b
p
w M
B
L
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.
1.1
0.9
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
2.5
2.1
0.45
0.15
0.55
0.45
mm
0.1
1.9
0.95
0.2
0.1
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
EIAJ
97-02-28
99-09-13
SOT23
TO-236AB
2004 Aug 16
9
Philips Semiconductors
Product specification
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
PDTC143Z series
Plastic surface mounted package; 3 leads
SOT323
D
B
E
A
X
H
y
v M
A
E
3
Q
A
A
1
c
1
2
L
p
e
1
b
p
w
M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
max
A
UNIT
b
c
D
E
e
e
H
E
L
Q
v
w
p
p
1
1.1
0.8
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.23
0.13
mm
0.1
1.3
0.65
0.2
0.2
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
SOT323
SC-70
97-02-28
2004 Aug 16
10
Philips Semiconductors
Product specification
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
PDTC143Z series
Plastic surface mounted package; 3 leads
SOT416
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
1
2
c
e
1
b
p
w
M
B
L
p
e
detail X
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
A
UNIT
b
c
D
E
e
e
H
L
p
Q
v
w
p
1
E
max
0.30
0.15
0.25
0.10
1.8
1.4
0.9
0.7
1.75
1.45
0.45
0.15
0.23
0.13
0.95
0.60
mm
0.1
1
0.5
0.2
0.2
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
97-02-28
SOT416
SC-75
2004 Aug 16
11
Philips Semiconductors
Product specification
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
PDTC143Z series
Plastic surface mounted package; 3 leads
SOT490
D
B
E
A
X
H
v
M
A
E
3
A
c
1
2
e
1
b
p
w M
B
L
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
b
p
c
D
E
e
e
H
L
v
w
A
p
1
E
0.8
0.6
0.33
0.23
0.2
0.1
1.7
1.5
0.95
0.75
1.7
1.5
0.5
0.3
mm
1.0
0.5
0.1
0.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
98-10-23
SOT490
SC-89
2004 Aug 16
12
Philips Semiconductors
Product specification
NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = 47 kΩ
PDTC143Z series
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Aug 16
13
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/07/pp14
Date of release: 2004 Aug 16
Document order number: 9397 750 13677
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