PESD5V0L1UA [NXP]
Low capacitance unidirectional ESD protection diodes; 低电容单向ESD保护二极管
| 型号： | PESD5V0L1UA |
| 厂家： | 
NXP |
| 描述： | Low capacitance unidirectional ESD protection diodes |
| 文件： | 总13页 (文件大小：113K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PESD5V0L1UA; PESD5V0L1UB;
PESD5V0L1UL
Low capacitance unidirectional ESD protection diodes
Rev. 01 — 17 June 2009
Product data sheet
1. Product profile
1.1 General description
Low capacitance unidirectional ElectroStatic Discharge (ESD) protection diodes in small
Surface-Mounted Device (SMD) plastic packages designed to protect one signal line from
the damage caused by ESD and other transients.
Table 1.
Product overview
Type number
Package
NXP
Package configuration
JEITA
SC-76
SC-79
-
PESD5V0L1UA
PESD5V0L1UB
PESD5V0L1UL
SOD323
SOD523
SOD882
very small
ultra small and flat lead
leadless ultra small
1.2 Features
I Unidirectional ESD protection of
one line
I ESD protection up to 26 kV
I Low diode capacitance: Cd = 25 pF
I Low clamping voltage: VCL = 12 V
I Very low leakage current: IRM = 10 nA
I IEC 61000-4-2; level 4 (ESD)
I AEC-Q101 qualified
1.3 Applications
I Computers and peripherals
I Subscriber Identity Module (SIM) card
protection
I Audio and video equipment
I Cellular handsets and accessories
I Communication systems
I Portable electronics
I FireWire
I High-speed data lines
1.4 Quick reference data
Table 2.
Quick reference data
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
Min
Typ
-
Max
5.0
30
Unit
V
VRWM
Cd
reverse standoff voltage
diode capacitance
-
-
f = 1 MHz; VR = 0 V
25
pF
PESD5V0L1UA/UB/UL
NXP Semiconductors
Low capacitance unidirectional ESD protection diodes
2. Pinning information
Table 3.
Pin
Pinning
Description
Simplified outline
Graphic symbol
PESD5V0L1UA; PESD5V0L1UB
[1]
1
2
cathode
anode
2
1
1
2
006aaa152
001aab540
PESD5V0L1UL
[1]
1
2
cathode
anode
2
1
1
2
006aaa152
Transparent
top view
[1] The marking bar indicates the cathode.
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
SC-76
SC-79
-
Description
Version
PESD5V0L1UA
PESD5V0L1UB
PESD5V0L1UL
plastic surface-mounted package; 2 leads
plastic surface-mounted package; 2 leads
SOD323
SOD523
SOD882
leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.5 mm
4. Marking
Table 5.
Marking codes
Type number
PESD5V0L1UA
PESD5V0L1UB
PESD5V0L1UL
Marking code
1J
Z8
XY
PESD5V0L1UA_UB_UL_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 17 June 2009
2 of 13
PESD5V0L1UA/UB/UL
NXP Semiconductors
Low capacitance unidirectional ESD protection diodes
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
PPP
Parameter
Conditions
tp = 8/20 µs
tp = 8/20 µs
Min
Max
42
Unit
W
[1][2]
[1][2]
peak pulse power
peak pulse current
junction temperature
ambient temperature
storage temperature
-
IPP
-
3.5
A
Tj
-
150
+150
+150
°C
°C
°C
Tamb
Tstg
−55
−65
[1] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
[2] Measured from pin 1 to pin 2.
Table 7.
ESD maximum ratings
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Max Unit
[1]
VESD
electrostatic discharge voltage
IEC 61000-4-2
-
26
kV
(contact discharge)
machine model
-
-
400
10
V
MIL-STD-883 (human
body model)
kV
[1] Device stressed with ten non-repetitive ESD pulses.
Table 8.
ESD standards compliance
Standard
Conditions
IEC 61000-4-2; level 4 (ESD)
> 15 kV (air); > 8 kV (contact)
> 4 kV
MIL-STD-883; class 3 (human body model)
PESD5V0L1UA_UB_UL_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 17 June 2009
3 of 13
PESD5V0L1UA/UB/UL
NXP Semiconductors
Low capacitance unidirectional ESD protection diodes
001aaa631
I
PP
001aaa630
120
100 %
90 %
100 % I ; 8 µs
PP
I
PP
(%)
80
−t
e
50 % I ; 20 µs
PP
40
10 %
t
t = 0.7 ns to 1 ns
r
0
30 ns
60 ns
0
10
20
30
40
t (µs)
Fig 1. 8/20 µs pulse waveform according to
Fig 2. ESD pulse waveform according to
IEC 61000-4-2
IEC 61000-4-5
6. Characteristics
Table 9.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
VRWM reverse standoff voltage
IRM
Min
Typ
-
Max
5.0
100
7.2
30
Unit
V
-
reverse leakage current
breakdown voltage
diode capacitance
VRWM = 5.0 V
IR = 5 mA
-
10
6.8
25
nA
V
VBR
Cd
6.4
-
f = 1 MHz;
VR = 0 V
pF
[1][2]
VCL
clamping voltage
IPP = 1 A
-
-
-
-
-
-
-
-
9
V
V
Ω
V
IPP = 3.5 A
IR = 5 mA
IF = 200 mA
12
30
1.2
rdif
VF
differential resistance
forward voltage
[1] Non-repetitive current pulse 8/20 µs exponential decay waveform according to IEC 61000-4-5.
[2] Measured from pin 1 to pin 2.
PESD5V0L1UA_UB_UL_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 17 June 2009
4 of 13
PESD5V0L1UA/UB/UL
NXP Semiconductors
Low capacitance unidirectional ESD protection diodes
I
006aab565
35
C
d
(pF)
30
25
20
15
10
−V
−V
−V
V
CL
BR
RWM
−I
−I
RM
R
−
+
P-N
−I
PP
0
1
2
3
4
5
V
(V)
R
006aaa407
f = 1 MHz; Tamb = 25 °C
Fig 3. Diode capacitance as a function of reverse
voltage; typical values
Fig 4. V-I characteristics for a unidirectional
ESD protection diode
PESD5V0L1UA_UB_UL_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 17 June 2009
5 of 13
PESD5V0L1UA/UB/UL
NXP Semiconductors
Low capacitance unidirectional ESD protection diodes
ESD TESTER
4 GHz DIGITAL
OSCILLOSCOPE
RG 223/U
50 Ω coax
R
Z
450 Ω
10×
ATTENUATOR
C
Z
50 Ω
DUT
(Device
Under
Test)
IEC 61000-4-2 network
= 150 pF; R = 330 Ω
C
Z
Z
vertical scale = 10 A/div
horizontal scale = 15 ns/div
vertical scale = 6 V/div
horizontal scale = 100 ns/div
GND
GND
unclamped +8 kV ESD pulse waveform
clamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
(IEC 61000-4-2 network)
vertical scale = 10 A/div
horizontal scale = 15 ns/div
GND
GND
vertical scale = 6 V/div
horizontal scale = 100 ns/div
unclamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
clamped −8 kV ESD voltage waveform
(IEC 61000-4-2 network)
006aab566
Fig 5. ESD clamping test setup and waveforms
PESD5V0L1UA_UB_UL_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 17 June 2009
6 of 13
PESD5V0L1UA/UB/UL
NXP Semiconductors
Low capacitance unidirectional ESD protection diodes
7. Application information
The PESD5V0L1Ux series is designed for the protection of one unidirectional data or
signal line from the damage caused by ESD and surge pulses. The devices may be used
on lines where the signal polarities are either positive or negative with respect to ground.
The PESD5V0L1Ux series provides a surge capability up to 42 W per line for an 8/20 µs
waveform.
line to be protected
line to be protected
(positive signal polarity)
(negative signal polarity)
PESD5V0L1Ux
PESD5V0L1Ux
GND
GND
unidirectional protection of one line
006aab613
Fig 6. Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD and Electrical Fast
Transient (EFT). The following guidelines are recommended:
1. Place the device as close to the input terminal or connector as possible.
2. The path length between the device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PESD5V0L1UA_UB_UL_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 17 June 2009
7 of 13
PESD5V0L1UA/UB/UL
NXP Semiconductors
Low capacitance unidirectional ESD protection diodes
9. Package outline
0.85
0.75
0.65
0.58
1.35
1.15
1.1
0.8
0.45
0.15
1
1
1.65 1.25
1.55 1.15
2.7 1.8
2.3 1.6
2
2
0.40
0.25
0.25
0.10
0.34
0.26
0.17
0.11
Dimensions in mm
03-12-17
Dimensions in mm
02-12-13
Fig 7. Package outline
Fig 8. Package outline
PESD5V0L1UA (SOD323/SC-76)
PESD5V0L1UB (SOD523/SC-79)
0.50
0.46
0.62
0.55
2
1
0.30
0.22
1.02
0.95
0.65
0.30
0.22
0.55
0.47
cathode marking on top side
Dimensions in mm
03-04-17
Fig 9. Package outline PESD5V0L1UL (SOD882)
10. Packing information
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
-115
-
8000
10000
-135
-
PESD5V0L1UA SOD323
PESD5V0L1UB SOD523
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
-
-315
-115
-
-
-
-135
-315
PESD5V0L1UL SOD882
[1] For further information and the availability of packing methods, see Section 14.
PESD5V0L1UA_UB_UL_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 17 June 2009
8 of 13
PESD5V0L1UA/UB/UL
NXP Semiconductors
Low capacitance unidirectional ESD protection diodes
11. Soldering
3.05
2.1
solder lands
solder resist
1.65 0.95
0.5 (2×) 0.6 (2×)
solder paste
occupied area
2.2
Dimensions in mm
0.5
(2×)
0.6
(2×)
sod323_fr
Fig 10. Reflow soldering footprint PESD5V0L1UA (SOD323/SC-76)
5
2.9
1.5 (2×)
solder lands
solder resist
occupied area
1.2
2.75
Dimensions in mm
(2×)
preferred transport
direction during soldering
sod323_fw
Fig 11. Wave soldering footprint PESD5V0L1UA (SOD323/SC-76)
PESD5V0L1UA_UB_UL_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 17 June 2009
9 of 13
PESD5V0L1UA/UB/UL
NXP Semiconductors
Low capacitance unidirectional ESD protection diodes
2.15
1.1
solder lands
solder resist
0.5 0.6
1.2
(2×) (2×)
solder paste
occupied area
Dimensions in mm
0.7
(2×)
0.8
(2×)
sod523_fr
Reflow soldering is the only recommended soldering method.
Fig 12. Reflow soldering footprint PESD5V0L1UB (SOD523/SC-79)
1.3
0.7
R0.05 (8×)
solder lands
solder resist
0.6 0.7
(2×) (2×)
0.9
solder paste
occupied area
0.3
(2×)
Dimensions in mm
0.4
(2×)
sod882_fr
Reflow soldering is the only recommended soldering method.
Fig 13. Reflow soldering footprint PESD5V0L1UL (SOD882)
PESD5V0L1UA_UB_UL_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 17 June 2009
10 of 13
PESD5V0L1UA/UB/UL
NXP Semiconductors
Low capacitance unidirectional ESD protection diodes
12. Revision history
Table 11. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PESD5V0L1UA_UB_UL_1 20090617
Product data sheet
-
-
PESD5V0L1UA_UB_UL_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 17 June 2009
11 of 13
PESD5V0L1UA/UB/UL
NXP Semiconductors
Low capacitance unidirectional ESD protection diodes
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PESD5V0L1UA_UB_UL_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 17 June 2009
12 of 13
PESD5V0L1UA/UB/UL
NXP Semiconductors
Low capacitance unidirectional ESD protection diodes
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 7
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 7
Quality information . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information. . . . . . . . . . . . . . . . . . . . . . 8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
3
4
5
6
7
8
8.1
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 June 2009
Document identifier: PESD5V0L1UA_UB_UL_1
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