PMBFJ108T/R [NXP]
TRANSISTOR 25 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET General Purpose Small Signal;
| 型号： | PMBFJ108T/R |
| 厂家： | 
NXP |
| 描述： | TRANSISTOR 25 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET General Purpose Small Signal |
| 文件： | 总9页 (文件大小：81K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PMBFJ108; PMBFJ109;
PMBFJ110
T23
SO
N-channel junction FETs
Rev. 4 — 20 September 2011
Product data sheet
1. Product profile
1.1 General description
Symmetrical N-channel junction FETs in a SOT23 package.
1.2 Features and benefits
High-speed switching
Interchangeability of drain and source connections
Low RDSon at zero gate voltage (8 for PMBFJ108).
1.3 Applications
Analog switches
Choppers and commutators
Audio amplifiers.
2. Pinning information
Table 1.
Pinning
Pin
1
Description[1]
Simplified outline
Symbol
drain
3
2
source
1
2
3
gate
3
1
2
sym053
[1] Drain and source are interchangeable.
PMBFJ108; PMBFJ109; PMBFJ110
NXP Semiconductors
N-channel junction FETs
3. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
Version
PMBFJ108
PMBFJ109
PMBFJ110
-
plastic surface mounted package; 3 leads
SOT23
4. Marking
Table 3.
Marking
Type number
PMBFJ108
PMBFJ109
PMBFJ110
Marking code[1]
38*
39*
40*
[1] * = p: Made in Hong Kong
* = t: Made in Malaysia
* = W: Made in China
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDS
VGSO
VGDO
IG
Parameter
Conditions
Min
Max
25
25
25
50
Unit
V
drain-source voltage (DC)
gate-source voltage
gate-drain voltage
-
-
V
-
V
forward gate current (DC)
total power dissipation
storage temperature
junction temperature
-
mA
mW
C
C
[1]
Ptot
Tamb = 25 C
-
250
+150
150
Tstg
65
Tj
-
[1] Mounted on an FR4 printed-circuit board.
6. Thermal characteristics
Table 5.
Thermal characteristics
Symbol Parameter
Conditions
Typ
Unit
K/W
[1]
Rth(j-a)
thermal resistance from junction to ambient
500
[1] Mounted on an FR4 printed-circuit board.
PMBFJ108_109_110
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 20 September 2011
2 of 9
PMBFJ108; PMBFJ109; PMBFJ110
NXP Semiconductors
N-channel junction FETs
7. Static characteristics
Table 6.
Static characteristics
Tj = 25 C.
Symbol Parameter
Conditions
Min Typ Max Unit
IGSS
IDSX
IDSS
gate-source leakage current
VGS = 15 V; VDS = 0 V
VGS = 10 V; VDS = 5 V
-
-
-
-
3
nA
nA
drain-source cut-off current
drain-source leakage current
PMBFJ108
3
VGS = 0 V; VDS = 15 V
VGS = 0 V; VDS = 15 V
VGS = 0 V; VDS = 15 V
80
40
10
-
-
-
-
-
-
mA
mA
mA
V
PMBFJ109
-
PMBFJ110
-
V(BR)GSS gate-source breakdown voltage IG = 1 A; VDS = 0 V
25
VGSoff
gate-source cut-off voltage
PMBFJ108
ID = 1 A; VDS = 5 V
ID = 1 A; VDS = 5 V
ID = 1 A; VDS = 5 V
10
6
-
-
-
3
2
V
V
PMBFJ109
PMBFJ110
4
0.5 V
RDSon
drain-source on-state resistance
PMBFJ108
VGS = 0 V; VDS = 0.1 V
VGS = 0 V; VDS = 0.1 V
VGS = 0 V; VDS = 0.1 V
-
-
-
-
-
-
8
PMBFJ109
12
18
PMBFJ110
8. Dynamic characteristics
Table 7.
Dynamic characteristics
Tj = 25 C unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max Unit
Ciss
input capacitance
VDS = 0 V; VGS = 10 V; f = 1 MHz
VDS = 0 V; VGS = 0 V; f = 1 MHz; Tamb = 25 C
VDS = 0 V; VGS = 10 V; f = 1 MHz
-
-
-
15
50
8
30
85
15
pF
pF
pF
Crss
feedback capacitance
Switching times (see Figure 2)
[1]
[1]
[1]
[1]
td
delay time
-
-
-
-
2
4
4
6
-
-
-
-
ns
ns
ns
ns
ton
ts
turn-on time
storage time
turn-off time
toff
[1] Test conditions for switching times are as follows:
VDD = 1.5 V, VGS = 0 V to VGSoff (all types);
VGSoff = 12 V, RL = 100 (PMBFJ108);
VGSoff = 7 V, RL = 100 (PMBFJ109);
VGSoff = 5 V, RL = 100 (PMBFJ110).
PMBFJ108_109_110
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 20 September 2011
3 of 9
PMBFJ108; PMBFJ109; PMBFJ110
NXP Semiconductors
N-channel junction FETs
0.1 μF
50 Ω
10 μF
V
DD
10 nF
R
L
SAMPLING
SCOPE
50 Ω
DUT
50 Ω
001aab288
Fig 1. Switching circuit.
V
= 0 V
GS
10%
90%
V
i
−V
GS off
t
t
on
off
t
t
t
t
r
s
f
d
90%
10%
V
o
001aab289
Fig 2. Input and output waveforms.
PMBFJ108_109_110
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 20 September 2011
4 of 9
PMBFJ108; PMBFJ109; PMBFJ110
NXP Semiconductors
N-channel junction FETs
9. Package outline
Plastic surface-mounted package; 3 leads
SOT23
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
b
w M
B
1
L
p
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.
1.1
0.9
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
2.5
2.1
0.45
0.15
0.55
0.45
mm
0.1
1.9
0.95
0.2
0.1
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
JEITA
04-11-04
06-03-16
SOT23
TO-236AB
Fig 3. Package outline.
PMBFJ108_109_110
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 20 September 2011
5 of 9
PMBFJ108; PMBFJ109; PMBFJ110
NXP Semiconductors
N-channel junction FETs
10. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
- PMBFJ108_109_110 v.3
PMBFJ108_109_110 v.4
Modifications:
20110920
Product data sheet
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Package outline drawings have been updated to the latest version.
PMBFJ108_109_110 v.3
(9397 750 13401)
20040804
Product data sheet
-
PMBFJ108_109_110_CNV v.2
PMBFJ108_109_110_CNV v.2 19971201
Product specification
-
-
PMBFJ108_109_110
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 20 September 2011
6 of 9
PMBFJ108; PMBFJ109; PMBFJ110
NXP Semiconductors
N-channel junction FETs
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
11.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
11.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
PMBFJ108_109_110
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 20 September 2011
7 of 9
PMBFJ108; PMBFJ109; PMBFJ110
NXP Semiconductors
N-channel junction FETs
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PMBFJ108_109_110
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4 — 20 September 2011
8 of 9
PMBFJ108; PMBFJ109; PMBFJ110
NXP Semiconductors
N-channel junction FETs
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 2
Static characteristics. . . . . . . . . . . . . . . . . . . . . 3
Dynamic characteristics . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6
3
4
5
6
7
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 September 2011
Document identifier: PMBFJ108_109_110
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