PMEG3005EB,115 [NXP]

PMEG3005EB; PMEG3005EL - 0.5 A very low VF MEGA Schottky barrier rectifiers SOD 2-Pin;
PMEG3005EB,115
型号: PMEG3005EB,115
厂家: NXP    NXP
描述:

PMEG3005EB; PMEG3005EL - 0.5 A very low VF MEGA Schottky barrier rectifiers SOD 2-Pin

光电二极管
文件: 总10页 (文件大小:56K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PMEG3005EB; PMEG3005EL  
0.5 A very low VF MEGA Schottky barrier rectifiers  
Rev. 01 — 29 November 2006  
Product data sheet  
1. Product profile  
1.1 General description  
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an  
integrated guard ring for stress protection, encapsulated in ultra small Surface-Mounted  
Device (SMD) plastic packages.  
Table 1.  
Product overview  
Type number  
Package  
NXP  
Configuration  
JEITA  
SC-79  
-
PMEG3005EB  
PMEG3005EL  
SOD523  
SOD882  
single  
single  
1.2 Features  
I Forward current: IF 0.5 A  
I Reverse voltage: VR 30 V  
I Very low forward voltage  
I Ultra small SMD plastic packages  
1.3 Applications  
I Low voltage rectification  
I High efficiency DC-to-DC conversion  
I Switch mode power supply  
I Reverse polarity protection  
I Low power consumption applications  
1.4 Quick reference data  
Table 2.  
Symbol  
IF  
Quick reference data  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
A
forward current  
reverse voltage  
forward voltage  
Tsp 55 °C  
-
-
-
-
0.5  
30  
VR  
-
V
[1]  
VF  
IF = 500 mA  
430  
500  
mV  
[1] Pulse test: tp 300 µs; δ ≤ 0.02.  
 
 
 
 
 
 
PMEG3005EB; PMEG3005EL  
NXP Semiconductors  
0.5 A very low VF MEGA Schottky barrier rectifiers  
2. Pinning information  
Table 3.  
Pinning  
Pin  
Description  
Simplified outline  
Symbol  
SOD523  
[1]  
[1]  
1
2
cathode  
anode  
1
2
1
2
sym001  
SOD882  
1
2
cathode  
anode  
1
2
1
2
sym001  
Transparent  
top view  
[1] The marking bar indicates the cathode.  
3. Ordering information  
Table 4.  
Ordering information  
Type number  
Package  
Name  
SC-79  
-
Description  
plastic surface-mounted package; 2 leads  
Version  
PMEG3005EB  
PMEG3005EL  
SOD523  
leadless ultra small plastic package; 2 terminals; SOD882  
body 1.0 × 0.6 × 0.5 mm  
4. Marking  
Table 5.  
Marking codes  
Type number  
PMEG3005EB  
PMEG3005EL  
Marking code  
KB  
AM  
PMEG3005EB_PMEG3005EL_1  
© NXP B.V. 2006. All rights reserved.  
Product data sheet  
Rev. 01 — 29 November 2006  
2 of 10  
 
 
 
 
PMEG3005EB; PMEG3005EL  
NXP Semiconductors  
0.5 A very low VF MEGA Schottky barrier rectifiers  
5. Limiting values  
Table 6.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VR  
Parameter  
Conditions  
Min  
Max  
30  
Unit  
V
reverse voltage  
forward current  
-
-
-
IF  
Tsp 55 °C  
0.5  
1
A
IFRM  
repetitive peak forward current tp 1 ms;  
δ ≤ 0.25  
A
IFSM  
Ptot  
non-repetitive peak forward  
current  
square wave;  
tp = 8 ms  
-
3
A
[1]  
total power dissipation  
PMEG3005EB  
Tamb 25 °C  
-
310  
mW  
mW  
°C  
PMEG3005EL  
-
250  
Tj  
junction temperature  
ambient temperature  
storage temperature  
-
150  
Tamb  
Tstg  
65  
65  
+150  
+150  
°C  
°C  
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard  
footprint.  
6. Thermal characteristics  
Table 7.  
Thermal characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Unit  
[1][2]  
Rth(j-a)  
thermal resistance from  
junction to ambient  
in free air  
PMEG3005EB  
PMEG3005EL  
-
-
-
-
400  
500  
K/W  
K/W  
[3]  
Rth(j-sp)  
thermal resistance from  
junction to solder point  
PMEG3005EB  
-
-
75  
K/W  
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse  
power losses PR are a significant part of the total power losses.  
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.  
[3] Soldering point of cathode tab.  
PMEG3005EB_PMEG3005EL_1  
© NXP B.V. 2006. All rights reserved.  
Product data sheet  
Rev. 01 — 29 November 2006  
3 of 10  
 
 
 
 
 
 
PMEG3005EB; PMEG3005EL  
NXP Semiconductors  
0.5 A very low VF MEGA Schottky barrier rectifiers  
7. Characteristics  
Table 8.  
Characteristics  
Tamb = 25 °C unless otherwise specified.  
Symbol Parameter Conditions  
Min  
Typ  
Max  
Unit  
[1]  
VF  
forward voltage  
IF = 0.1 mA  
IF = 1 mA  
-
-
-
-
-
-
-
-
90  
180  
200  
270  
360  
500  
200  
500  
30  
mV  
mV  
mV  
mV  
mV  
µA  
150  
210  
295  
430  
15  
IF = 10 mA  
IF = 100 mA  
IF = 500 mA  
VR = 10 V  
VR = 30 V  
IR  
reverse current  
70  
µA  
Cd  
diode capacitance VR = 1 V; f = 1 MHz  
24  
pF  
[1] Pulse test: tp 300 µs; δ ≤ 0.02.  
PMEG3005EB_PMEG3005EL_1  
© NXP B.V. 2006. All rights reserved.  
Product data sheet  
Rev. 01 — 29 November 2006  
4 of 10  
 
 
PMEG3005EB; PMEG3005EL  
NXP Semiconductors  
0.5 A very low VF MEGA Schottky barrier rectifiers  
006aaa856  
006aaa855  
5
4
10  
10  
I
R
(1)  
(2)  
I
F
(µA)  
4
3
2
10  
10  
10  
(mA)  
3
2
10  
(3)  
10  
(4)  
10  
10  
(1)  
(2)  
(3)  
(4)  
(5)  
1
1  
10  
(5)  
1
2  
10  
10  
3  
1  
10  
0
5
10  
15  
20  
25  
V
30  
(V)  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
V
1.4  
(V)  
R
F
(1) Tamb = 150 °C  
(2) Tamb = 125 °C  
(3) Tamb = 85 °C  
(4) Tamb = 25 °C  
(5) Tamb = 40 °C  
(1) Tamb = 150 °C  
(2) Tamb = 125 °C  
(3) Tamb = 85 °C  
(4) Tamb = 25 °C  
(5) Tamb = 40 °C  
Fig 1. Forward current as a function of forward  
voltage; typical values  
Fig 2. Reverse current as a function of reverse  
voltage; typical values  
006aaa857  
40  
C
d
(pF)  
30  
20  
10  
0
0
10  
20  
30  
V
(V)  
R
f = 1 MHz; Tamb = 25 °C  
Fig 3. Diode capacitance as a function of reverse voltage; typical values  
PMEG3005EB_PMEG3005EL_1  
© NXP B.V. 2006. All rights reserved.  
Product data sheet  
Rev. 01 — 29 November 2006  
5 of 10  
PMEG3005EB; PMEG3005EL  
NXP Semiconductors  
0.5 A very low VF MEGA Schottky barrier rectifiers  
8. Test information  
t
t
1
2
P
duty cycle δ =  
t
2
t
1
t
006aaa812  
Fig 4. Duty cycle definition  
9. Package outline  
0.85  
0.75  
0.65  
0.58  
0.50  
0.46  
0.62  
0.55  
1
2
1
0.30  
0.22  
1.65 1.25  
1.55 1.15  
1.02  
0.95  
0.65  
0.30  
0.22  
2
0.55  
0.47  
cathode marking on top side  
0.34  
0.26  
0.17  
0.11  
Dimensions in mm  
02-12-13  
Dimensions in mm  
03-04-17  
Fig 5. Package outline SOD523 (SC-79)  
Fig 6. Package outline SOD882  
10. Packing information  
Table 9.  
Packing methods  
The indicated -xxx are the last three digits of the 12NC ordering code.[1]  
Type number  
Package  
Description  
Packing quantity  
3000 8000 10000  
PMEG3005EB SOD523  
2 mm pitch, 8 mm tape and reel  
4 mm pitch, 8 mm tape and reel  
2 mm pitch, 8 mm tape and reel  
-
-315  
-
-115  
-
-
-
-135  
-315  
PMEG3005EL SOD882  
[1] For further information and the availability of packing methods, see Section 14.  
PMEG3005EB_PMEG3005EL_1  
© NXP B.V. 2006. All rights reserved.  
Product data sheet  
Rev. 01 — 29 November 2006  
6 of 10  
 
 
 
 
PMEG3005EB; PMEG3005EL  
NXP Semiconductors  
0.5 A very low VF MEGA Schottky barrier rectifiers  
11. Soldering  
2.15  
0.50 0.60  
1.20  
solder lands  
solder paste  
solder resist  
occupied area  
0.30  
0.40  
1.80  
1.90  
mgs343  
Reflow soldering is the only recommended soldering method.  
Dimensions in mm  
Fig 7. Reflow soldering footprint SOD523 (SC-79)  
1.30  
R = 0.05 (8×)  
0.30  
R = 0.05 (8×)  
0.60 0.70 0.80  
(2×) (2×) (2×)  
0.90  
0.30  
(2×)  
0.40  
(2×)  
0.50  
(2×)  
solder lands  
solder paste  
solder resist  
occupied area  
mbl872  
Reflow soldering is the only recommended soldering method.  
Dimensions in mm  
Fig 8. Reflow soldering footprint SOD882  
PMEG3005EB_PMEG3005EL_1  
© NXP B.V. 2006. All rights reserved.  
Product data sheet  
Rev. 01 — 29 November 2006  
7 of 10  
 
PMEG3005EB; PMEG3005EL  
NXP Semiconductors  
0.5 A very low VF MEGA Schottky barrier rectifiers  
12. Revision history  
Table 10. Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
PMEG3005EB_PMEG3005EL_1 20061129  
Product data sheet  
-
-
PMEG3005EB_PMEG3005EL_1  
© NXP B.V. 2006. All rights reserved.  
Product data sheet  
Rev. 01 — 29 November 2006  
8 of 10  
 
PMEG3005EB; PMEG3005EL  
NXP Semiconductors  
0.5 A very low VF MEGA Schottky barrier rectifiers  
13. Legal information  
13.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of a NXP Semiconductors product can reasonably be expected to  
13.2 Definitions  
result in personal injury, death or severe property or environmental damage.  
NXP Semiconductors accepts no liability for inclusion and/or use of NXP  
Semiconductors products in such equipment or applications and therefore  
such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
13.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
13.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
14. Contact information  
For additional information, please visit: http://www.nxp.com  
For sales office addresses, send an email to: salesaddresses@nxp.com  
PMEG3005EB_PMEG3005EL_1  
© NXP B.V. 2006. All rights reserved.  
Product data sheet  
Rev. 01 — 29 November 2006  
9 of 10  
 
 
 
 
 
 
PMEG3005EB; PMEG3005EL  
NXP Semiconductors  
0.5 A very low VF MEGA Schottky barrier rectifiers  
15. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Packing information. . . . . . . . . . . . . . . . . . . . . . 6  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8  
3
4
5
6
7
8
9
10  
11  
12  
13  
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
13.1  
13.2  
13.3  
13.4  
14  
15  
Contact information. . . . . . . . . . . . . . . . . . . . . . 9  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2006.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 29 November 2006  
Document identifier: PMEG3005EB_PMEG3005EL_1  
 

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