PMLL4148L [NXP]

High-speed switching diodes; 高速开关二极管
PMLL4148L
型号: PMLL4148L
厂家: NXP    NXP
描述:

High-speed switching diodes
高速开关二极管

整流二极管 开关
文件: 总11页 (文件大小:68K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PMLL4148L; PMLL4448  
High-speed switching diodes  
Rev. 07 — 31 January 2007  
Product data sheet  
1. Product profile  
1.1 General description  
Single high-speed switching diodes, fabricated in planar technology, and encapsulated in  
small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages.  
Table 1.  
Product overview  
Type number  
PMLL4148L  
PMLL4448  
Package  
Configuration  
SOD80C  
single  
1.2 Features  
I High switching speed: trr 4 ns  
I Reverse voltage: VR 75 V  
I Repetitive peak reverse voltage: VRRM 100 V  
I Repetitive peak forward current: IFRM 450 mA  
I Small hermetically sealed glass SMD package  
1.3 Applications  
I High-speed switching  
I Reverse polarity protection  
1.4 Quick reference data  
Table 2.  
Symbol  
IF  
Quick reference data  
Parameter  
Conditions  
Min  
Typ  
Max  
200  
450  
Unit  
mA  
mA  
[1]  
forward current  
-
-
-
-
IFRM  
repetitive peak forward  
current  
VR  
reverse voltage  
-
-
75  
V
PMLL4148L; PMLL4448  
NXP Semiconductors  
High-speed switching diodes  
Table 2.  
Quick reference data …continued  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VF  
forward voltage  
PMLL4148L  
PMLL4448  
IF = 50 mA  
IF = 5 mA  
-
-
-
-
-
1
V
620  
720  
1
mV  
V
IF = 100 mA  
-
-
[2]  
trr  
reverse recovery time  
4
ns  
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard  
footprint.  
[2] When switched from IF = 10 mA to IR = 60 mA; RL = 100 ; measured at IR = 1 mA.  
2. Pinning information  
Table 3.  
Pinning  
Pin  
1
Description  
cathode  
Simplified outline  
Symbol  
[1]  
k
a
2
anode  
sym006  
[1] The marking band indicates the cathode.  
3. Ordering information  
Table 4.  
Ordering information  
Type number  
Package  
Name  
-
Description  
Version  
PMLL4148L  
PMLL4448  
hermetically sealed glass surface-mounted package; SOD80C  
2 connectors  
4. Marking  
Table 5.  
Marking codes  
Type number  
PMLL4148L  
PMLL4448  
Marking code[1]  
marking band  
marking band  
[1] black: made in Philippines  
brown: made in China  
PMLL4148L_PMLL4448_7  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 07 — 31 January 2007  
2 of 11  
PMLL4148L; PMLL4448  
NXP Semiconductors  
High-speed switching diodes  
5. Limiting values  
Table 6.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
VRRM  
repetitive peak reverse  
voltage  
-
100  
V
VR  
IF  
reverse voltage  
forward current  
-
-
-
75  
V
[1]  
[2]  
200  
450  
mA  
mA  
IFRM  
repetitive peak forward  
current  
IFSM  
non-repetitive peak forward square wave  
current  
tp = 1 µs  
-
4
A
tp = 1 ms  
tp = 1 s  
-
1
A
-
0.5  
500  
200  
+200  
+200  
A
[1]  
Ptot  
Tj  
total power dissipation  
junction temperature  
ambient temperature  
storage temperature  
Tamb = 25 °C  
-
mW  
°C  
°C  
°C  
-
Tamb  
Tstg  
65  
65  
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.  
[2] Tj = 25 °C prior to surge.  
6. Thermal characteristics  
Table 7.  
Thermal characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
[1]  
Rth(j-a)  
thermal resistance from  
junction to ambient  
in free air  
-
-
350  
K/W  
Rth(j-sp)  
thermal resistance from  
junction to solder point  
-
-
300  
K/W  
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.  
PMLL4148L_PMLL4448_7  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 07 — 31 January 2007  
3 of 11  
PMLL4148L; PMLL4448  
NXP Semiconductors  
High-speed switching diodes  
7. Characteristics  
Table 8.  
Characteristics  
Tamb = 25 °C unless otherwise specified.  
Symbol Parameter Conditions  
Min  
Typ  
Max  
Unit  
VF  
forward voltage  
PMLL4148L  
PMLL4448  
IF = 50 mA  
-
-
-
-
-
-
1
V
IF = 5 mA  
620  
720  
1
mV  
V
IF = 100 mA  
VR = 20 V  
-
-
-
IR  
reverse current  
25  
50  
nA  
µA  
VR = 20 V; Tj = 150 °C  
IR  
reverse current  
PMLL4448  
VR = 20 V; Tj = 100 °C  
-
-
-
-
-
-
-
-
3
µA  
pF  
ns  
V
Cd  
trr  
diode capacitance  
reverse recovery time  
forward recovery voltage  
VR = 0 V; f = 1 MHz  
4
[1]  
[2]  
4
VFR  
2.5  
[1] When switched from IF = 10 mA to IR = 60 mA; RL = 100 ; measured at IR = 1 mA.  
[2] When switched from IF = 50 mA; tr = 20 ns.  
PMLL4148L_PMLL4448_7  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 07 — 31 January 2007  
4 of 11  
PMLL4148L; PMLL4448  
NXP Semiconductors  
High-speed switching diodes  
mbg451  
mbg464  
300  
600  
I
I
F
F
(mA)  
(mA)  
200  
400  
(1)  
(2)  
(3)  
200  
100  
0
0
0
1
2
0
100  
200  
V
(V)  
F
T
(°C)  
amb  
FR4 PCB, standard footprint  
(1) Tj = 175 °C; typical values  
(2) Tj = 25 °C; typical values  
(3) Tj = 25 °C; maximum values  
Fig 1. Forward current as a function of ambient  
temperature; derating curve  
Fig 2. Forward current as a function of forward  
voltage  
mbg704  
mgd006  
2
3
10  
10  
I
R
(µA)  
I
FSM  
(A)  
2
10  
10  
(1)  
(2)  
(3)  
10  
1
1
1  
10  
2  
1  
10  
10  
2
3
4
1
10  
10  
10  
10  
0
100  
200  
T (°C)  
j
t
(µs)  
p
Based on square wave currents.  
(1) VR = 75 V; maximum values  
(2) VR = 75 V; typical values  
(3) VR = 20 V; typical values  
Tj = 25 °C; prior to surge  
Fig 3. Non-repetitive peak forward current as a  
function of pulse duration; maximum values  
Fig 4. Reverse current as a function of junction  
temperature  
PMLL4148L_PMLL4448_7  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 07 — 31 January 2007  
5 of 11  
PMLL4148L; PMLL4448  
NXP Semiconductors  
High-speed switching diodes  
mgd004  
1.2  
C
d
(pF)  
1.0  
0.8  
0.6  
0.4  
0
10  
20  
V
(V)  
R
f = 1 MHz; Tj = 25 °C  
Fig 5. Diode capacitance as a function of reverse voltage; typical values  
8. Test information  
t
t
p
r
t
D.U.T.  
10 %  
I
+ I  
F
t
F
rr  
R
S
= 50  
SAMPLING  
OSCILLOSCOPE  
t
R
i
= 50 Ω  
V = V + I × R  
S
R
F
(1)  
90 %  
V
R
mga881  
input signal  
output signal  
(1) IR = 1 mA  
Input signal: reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty cycle δ ≤ 0.05  
Oscilloscope: rise time tr = 0.35 ns  
Fig 6. Reverse recovery time test circuit and waveforms  
I
1 kΩ  
450 Ω  
I
V
90 %  
R
S
= 50 Ω  
OSCILLOSCOPE  
= 50 Ω  
V
FR  
D.U.T.  
R
i
10 %  
t
t
t
t
p
r
input signal  
output signal  
mga882  
Input signal: forward pulse rise time tr = 20 ns; forward current pulse duration tp 100 ns; duty cycle δ ≤ 0.005  
Fig 7. Forward recovery voltage test circuit and waveforms  
PMLL4148L_PMLL4448_7  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 07 — 31 January 2007  
6 of 11  
PMLL4148L; PMLL4448  
NXP Semiconductors  
High-speed switching diodes  
9. Package outline  
Hermetically sealed glass surface-mounted package; 2 connectors  
SOD80C  
k
a
(1)  
D
L
L
H
DIMENSIONS (mm are the original dimensions)  
0
1
2 mm  
L
D
H
UNIT  
scale  
1.60  
1.45  
3.7  
3.3  
mm  
0.3  
Note  
1. The marking band indicates the cathode.  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
05-01-26  
06-03-16  
SOD80C  
100H01  
Fig 8. Package outline SOD80C  
10. Packing information  
Table 9.  
Packing methods  
The indicated -xxx are the last three digits of the 12NC ordering code.[1]  
Type number  
Package  
Description  
Packing quantity  
2500  
10000  
PMLL4148L  
PMLL4448  
SOD80C  
4 mm pitch, 8 mm tape and reel  
-115  
-135  
[1] For further information and the availability of packing methods, see Section 14.  
PMLL4148L_PMLL4448_7  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 07 — 31 January 2007  
7 of 11  
PMLL4148L; PMLL4448  
NXP Semiconductors  
High-speed switching diodes  
11. Soldering  
4.55  
4.30  
2.30  
solder lands  
solder paste  
solder resist  
occupied area  
2.25 1.70 1.60  
Dimensions in mm  
sod080c  
0.90  
(2x)  
Fig 9. Reflow soldering footprint SOD80C  
6.30  
4.90  
2.70  
1.90  
solder lands  
solder resist  
occupied area  
tracks  
2.90 1.70  
Dimensions in mm  
sod080c  
Fig 10. Wave soldering footprint SOD80C  
PMLL4148L_PMLL4448_7  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 07 — 31 January 2007  
8 of 11  
PMLL4148L; PMLL4448  
NXP Semiconductors  
High-speed switching diodes  
12. Revision history  
Table 10. Revision history  
Document ID  
Release date  
Data sheet status  
Change notice Supersedes  
PMLL4148L_PMLL4448_7 20070131  
Product data sheet  
-
PMLL4148L_PMLL4448_6  
Modifications:  
The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors.  
Legal texts have been adapted to the new company name where appropriate.  
Section 1.2 “Features”: adapted  
Section 1.3 “Applications”: amended  
Table 2 “Quick reference data”: VF conditions for PMLL4148L updated  
Table 8 “Characteristics”: VF conditions for PMLL4148L updated  
Figure 4: unit for IR in axis description amended to µA  
Section 13 “Legal information”: updated  
PMLL4148L_PMLL4448_6 20050404  
Product data sheet  
Product specification  
Product specification  
Product specification  
Product specification  
Product specification  
-
-
-
-
-
-
PMLL4148L_4448_5  
PMLL4148L_4448_4  
PMLL4148_3  
PMLL4148_2  
PMLL4148_1  
-
PMLL4148L_4448_5  
PMLL4148L_4448_4  
PMLL4148_3  
20020123  
20001115  
19990527  
19960918  
19960423  
PMLL4148_2  
PMLL4148_1  
PMLL4148L_PMLL4448_7  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 07 — 31 January 2007  
9 of 11  
PMLL4148L; PMLL4448  
NXP Semiconductors  
High-speed switching diodes  
13. Legal information  
13.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of a NXP Semiconductors product can reasonably be expected to  
13.2 Definitions  
result in personal injury, death or severe property or environmental damage.  
NXP Semiconductors accepts no liability for inclusion and/or use of NXP  
Semiconductors products in such equipment or applications and therefore  
such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
13.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
13.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
14. Contact information  
For additional information, please visit: http://www.nxp.com  
For sales office addresses, send an email to: salesaddresses@nxp.com  
PMLL4148L_PMLL4448_7  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 07 — 31 January 2007  
10 of 11  
PMLL4148L; PMLL4448  
NXP Semiconductors  
High-speed switching diodes  
15. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1  
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Packing information. . . . . . . . . . . . . . . . . . . . . . 7  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9  
3
4
5
6
7
8
9
10  
11  
12  
13  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
13.1  
13.2  
13.3  
13.4  
14  
15  
Contact information. . . . . . . . . . . . . . . . . . . . . 10  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2007.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 31 January 2007  
Document identifier: PMLL4148L_PMLL4448_7  

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