PN2222A-T/R [NXP]
600mA, 40V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92, PLASTIC, SC-43A, 3 PIN;
| 型号： | PN2222A-T/R |
| 厂家： | 
NXP |
| 描述： | 600mA, 40V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92, PLASTIC, SC-43A, 3 PIN 开关 晶体管 |
| 文件： | 总7页 (文件大小：121K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
PN2222A
NPN switching transistor
Product data sheet
2004 Oct 11
Supersedes data of 1999 May 21
NXP Semiconductors
Product data sheet
NPN switching transistor
PN2222A
FEATURES
PINNING
• High current (max. 600 mA)
• Low voltage (max. 40 V).
PIN
1
DESCRIPTION
collector
base
2
APPLICATIONS
3
emitter
• General purpose switching and linear amplification.
DESCRIPTION
1
handbook, halfpage
1
3
2
3
NPN switching transistor in a TO-92; SOT54 plastic
package. PNP complement: PN2907A.
2
MAM279
Fig.1 Simplified outline (TO-92; SOT54) and
symbol.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
plastic single-ended leaded (through hole) package; 3 leads
VERSION
PN2222A
SC-43A
SOT54
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
collector-base voltage
CONDITIONS
open emitter
MIN.
MAX.
75
UNIT
VCBO
VCEO
VEBO
IC
−
−
−
−
−
−
−
V
collector-emitter voltage
emitter-base voltage
collector current (DC)
peak collector current
peak base current
open base
40
V
open collector
6
V
600
800
200
500
+150
150
+150
mA
mA
mA
mW
°C
°C
°C
ICM
IBM
Ptot
Tstg
Tj
total power dissipation
storage temperature
junction temperature
ambient temperature
Tamb ≤ 25 °C
−65
−
Tamb
−65
2004 Oct 11
2
NXP Semiconductors
Product data sheet
NPN switching transistor
PN2222A
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient note 1
250
K/W
Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
CONDITIONS
VCB = 60 V; IE = 0 A
MIN. MAX. UNIT
collector-base cut-off current
−
10
10
10
−
nA
µA
nA
VCB = 60 V; IE = 0 A; Tj = 125 °C
VEB = 3 V; IC = 0 A
−
IEBO
hFE
emitter-base cut-off current
DC current gain
−
VCE = 10 V; IC = 0.1 mA
VCE = 10 V; IC = 1 mA
35
50
75
35
50
100
40
−
−
VCE = 10 V; IC = 10 mA
VCE = 10 V; IC = 10 mA; Tj = −55 °C
VCE = 1 V; IC = 150 mA
VCE = 10 V; IC = 150 mA
VCE = 10 V; IC = 500 mA
−
−
−
300
−
VCEsat
collector-emitter saturation voltage IC = 150 mA; IB = 15 mA
IC = 500 mA; IB = 50 mA
300
−
mV
V
1
VBEsat
base-emitter saturation voltage
IC = 150 mA; IB = 15 mA
0.6
−
1.2
2
V
IC = 500 mA; IB = 50 mA
V
Cc
Ce
fT
collector capacitance
emitter capacitance
transition frequency
noise figure
VCB = 10 V; IE = ie = 0 A; f = 1 MHz
VEB = 500 mV; IC = ic = 0 A; f = 1 MHz
VCE = 20 V; IC = 20 mA; f = 100 MHz
−
8
pF
pF
MHz
dB
−
25
−
300
−
F
VCE = 5 V; IC = 100 µA; RS = 1 kΩ;
4
f = 1 kHz
Switching times (between 10 % and 90 % levels); see Fig.2
ton
td
tr
turn-on time
delay time
rise time
ICon = 150 mA; IBon = 15 mA;
−
−
−
−
−
−
35
ns
ns
ns
ns
ns
ns
I
Boff = −15 mA; Tamb = 25 °C
15
20
toff
ts
turn-off time
storage time
fall time
250
200
60
tf
2004 Oct 11
3
NXP Semiconductors
Product data sheet
NPN switching transistor
PN2222A
V
V
CC
BB
R
B
R
C
V
o
(probe)
(probe)
oscilloscope
oscilloscope
450 Ω
450 Ω
R2
V
I
DUT
R1
mlb826
Vi = 9.5 V; T = 500 µs; tp = 10 µs; tr = tf ≤ 3 ns.
R1 = 68 Ω; R2 = 325 Ω; RB = 325 Ω; RC = 160 Ω.
VBB = −3.5 V; VCC = 29.5 V.
Oscilloscope: input impedance Zi = 50 Ω.
Fig.2 Test circuit for switching times.
2004 Oct 11
4
NXP Semiconductors
Product data sheet
NPN switching transistor
PN2222A
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
2
e
1
e
D
3
b
1
L
1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
L
1
UNIT
A
b
b
c
D
d
E
e
e
L
1
1
max.
5.2
5.0
0.48
0.40
0.66
0.55
0.45
0.38
4.8
4.4
1.7
1.4
4.2
3.6
14.5
12.7
mm
2.54
1.27
2.5
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
04-06-28
04-11-16
SOT54
TO-92
SC-43A
2004 Oct 11
5
NXP Semiconductors
Product data sheet
NPN switching transistor
PN2222A
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
2004 Oct 11
6
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/04/pp7
Date of release: 2004 Oct 11
Document order number: 9397 750 13618
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