PNX0161 [NXP]

PNX0161 personal audio IC; PNX0161个人音频IC
PNX0161
型号: PNX0161
厂家: NXP    NXP
描述:

PNX0161 personal audio IC
PNX0161个人音频IC

文件: 总21页 (文件大小:96K)
中文:  中文翻译
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PNX0161  
PNX0161 personal audio IC  
Rev. 01 — 17 January 2008  
Product data sheet  
1. Introduction  
The Nexperia PNX0161 is an integrated IC that serves as USB audio and HID class  
device for a USB headset.  
2. General description  
Recent development in mobile phones is to have the phone equipped with a  
USB micro A plug as a single plug for charging and connection to all enhancements (like a  
headset, but also for other enhancements like GPS accessories etc.)  
The PNX0161 is based on an ARM7TDMI CPU core with data/instruction cache of 8 kB  
and USB 2.0 FS device interface.  
3. Features  
3.1 General features  
I Enables one chip solution for USB headset.  
I Requires very low power.  
I Supports FM radio input including low-power audio bypass mode.  
I Is available in a small footprint package TFBGA88 of 7 × 7 sq. mm with 0.5 mm pitch.  
3.2 Hardware features  
I ARM7TDMI processor core with 8 kB data/instruction cache.  
I Embedded SRAM, 32 kB.  
I Embedded ROM memory for storing the boot code, 32 kB.  
I Embedded flash memory for storing the program code, 256 kB (second production  
version will be ROM based).  
I Integrated USB 2.0 full-speed device interface.  
I Intelligent configuration power management.  
I Embedded high-efficiency power supply unit powered from a USB supply.  
I Supports power optimization by optimizing supply voltages.  
I Embedded DMA controller.  
I Digital interfaces:  
N Integrated stereo ADC with programmable amplifier (microphone, line input and  
tuner input).  
N Integrated IIS input and output interfaces (configurable for master/slave options).  
N Integrated fast UART with DMA support.  
PNX0161  
NXP Semiconductors  
PNX0161 personal audio IC  
N Integrated master/slave I2C interface.  
I Analog interfaces:  
N Integrated stereo ADC with programmable amplifier (microphone, line input and  
tuner input).  
N Microphone bias block.  
N Integrated stereo DAC with Class-AB headphone amplifier for high quality audio  
with increased driving capabilities and for use in tuner applications.  
N The integrated ADC and DAC both have a 24 bits data path.  
I Two integrated general purpose timers.  
I Integrated watchdog timer.  
I Low-power tuner mode with direct connection between tuner input and Class-AB  
headphone amplifier with analog volume control.  
I JTAG interface with boundary scan and ARM debug access.  
3.3 Software features  
This section lists the software features that the PNX0161 is capable of performing.  
I Playback: playback by the headphones of a received USB audio stream from the  
USB host via the DAC.  
I Recording: audio stream converted by the ADC from the microphone is sent via the  
USB audio stream to the USB host.  
I Phone call: in addition to the first case, simultaneously returning a USB audio stream  
that is converted by the ADC from the microphone. The microphone is mixed to the  
headphone stream, known as side-tone mixing.  
I Tuner listening: the FM tuner audio stream is sent to the headphones. No stream is  
sent or received via USB.  
I Tuner recording: the FM tuner audio stream is sent to the headphones. In addition the  
FM tuner stream is streamed to the phone via USB.  
I USB HID class for FM tuner RDS info.  
I USB device firmware upgrade.  
I Intelligent power management software.  
I Audio postprocessing features like volume control.  
3.4 Software features on request  
This section lists the software features that the PNX0161 is capable of performing.  
I Audio source selection between line-in and USB audio in for playback path, by toggling  
GPIO pin.  
I Support for stereo recording from analog and I2S inputs at sample rates other than  
48 kHz.  
I Support for stereo playback from USB audio, I2S and analog inputs at sample rates  
other than 48 kHz.  
I Option for a “direct analog link” for playback applications where only volume control is  
performed in the PNX0161. The “direct analog link” provides a full analog audio path  
through the PNX0161 from the analog stereo line input to the low output impedance  
buffer output through an analog volume control block. When the option is not selected,  
the analog stereo input is converted to the digital domain by the on-chip ADC. Audio  
PNX0161_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 17 January 2008  
2 of 21  
PNX0161  
NXP Semiconductors  
PNX0161 personal audio IC  
postprocessing is performed in the digital domain. The processed signals are then  
converted back to analog by the on-chip DAC and fed to the analog outputs through  
the low impedance output buffer.  
I Digital EQ for loudspeaker characteristics compensation.  
I For audio rendering applications: digital bass boost, treble expander, stereo widening,  
FM radio acoustical performance improvement and other NXP software LifeVibes  
music algorithms.  
I For applications as USB (mobile)-phones hands-free teleconference stations:  
Full duplex acoustic echo cancellation, intelligibility improvement and other NXP  
software LifeVibes voice algorithms.  
4. Applications  
I USB headset  
I FM radio USB headset  
I Docking station  
5. Ordering information  
Table 1.  
Ordering information  
Package  
Name  
Type numbers  
Description  
Version  
PNX0161ET/N101 TFBGA88  
TFBGA88: plastic thin fine-pitch ball grid array package; 88 balls; body  
7 x 7 x 0.8 mm  
SOT951-1  
6. Marking  
Table 2.  
Marking codes  
Lines  
Digits  
Comments  
A
B
0161ET/01  
Commercial name  
Diffusion batch ID DBID and ASID  
/wafer ID Assy  
sequence ID  
C
ZPDYYWW1X  
Z = Fab. Location (SSMC)  
P = Assembly Factory (APC)  
D = Green product meeting RoHS (Lead and Halogen free)  
YYWW = date code  
1 version = N1 version  
X = development status code (will change to ‘Y’ for  
production.)  
PNX0161_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 17 January 2008  
3 of 21  
PNX0161  
NXP Semiconductors  
PNX0161 personal audio IC  
A
: 10  
B1 : 7  
B2 : 7  
M347  
C
: 10  
0
7
010aaa417  
Fig 1. PNX0161 marking  
7. Block diagram  
RINGOSC  
PSU  
ARM7TDMI  
JTAG/TCB  
SDMA  
FC  
CACHE 8kB  
M
AHB MULTI-LAYER  
S
S
AHB2VPB3  
ASYNC  
S
S
S
S
S
MMIO  
RAMI  
FLASHCNTRL  
ROMI  
AUDIO_SYSCREG  
AUDIO SS  
RAM  
32kB  
EMB FLASH  
256kB  
ROM  
32kB  
SUBSYSTEM  
INTC  
SAO1  
SAO2  
SAI1  
AHB2VPB0  
ASYNC  
AHB2VPB1  
ASYNC  
AHB2VPB2  
SYNC  
SA12  
LNA PGA  
WATCHDOG  
SYSCREG  
CGU  
TIMER 1  
TIMER 2  
M
PGA SDC  
PGA SDC  
ADC DEC  
DAI  
DAO  
U
X
USB 2.0 FS  
UART  
PLL'S & OSC  
(C18X050M  
C18X032k  
2
1 CM/S  
M
U
X
C18PL160M  
C18PL550M)  
INT SDAC  
CLASS  
IOCONF  
MICSUP  
EVENT  
ANVC  
ROUTER  
AB  
010aaa407  
Fig 2. PNX0161 block diagram  
PNX0161_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 17 January 2008  
4 of 21  
PNX0161  
NXP Semiconductors  
PNX0161 personal audio IC  
8. Pinning information  
8.1 Pinning  
COILS/CAPACITORS  
SUPPLIES  
IO  
CORE  
USB  
4
FM RADIO  
2
SUPPLY SUPPLY  
12  
4
6
USB 2.0FS  
PHY  
I2C  
PSU  
IO/CORE  
MASTER/SLAVE  
IOCONF  
DAO  
2
MICBIAS  
4
3
IIS OUT  
IIS IN  
MIC IN  
LINE IN OR  
FM RADIO  
IOCONF  
DAI  
9
LNA/PGA/ADC  
11  
ANALOG OUT  
DAC/HP  
MODE 0  
MODE 1  
PSU_STOP  
GPIO  
8
RESET  
CLOCK_OUT  
32.768 kHz  
IOCONF(8)  
2
CGU  
XTAL'S  
12 MHz/  
8
OSC  
32.768 kHz  
IOCONF  
DAO  
2
1
6
MULTI-ICE  
JTAG/TCB  
FLASH  
SUPPLY  
010aaa415  
Fig 3. PNX0161 pin configuration diagram  
Table 3.  
Pinning list  
GPIO  
BGA pin name  
BGA ball Digital  
Application Pin  
state  
Cell type[1]  
Description  
I/O level function  
after  
reset  
12 MHz oscillator (fixed 4 pins)  
XTALH_IN  
-
-
-
-
J1  
-
analog  
input  
apio (Z)  
12 MHz clock input  
XTALH_OUT  
XTALH_VDDA18  
XTALH_VSSA  
H1  
H2  
K2  
-
analog  
output apio (IO)  
12 MHz clock output  
Analog supply oscillators  
Analog ground oscillators  
SUP2  
-
-
-
-
-
vddco  
vssco  
32.768 kHz oscillator (fixed 4 pins)  
XTALL_IN  
-
-
-
G1  
F1  
E2  
-
analog  
analog  
-
input  
apio (Z)  
32.768 kHz clock input  
32.768 kHz clock output  
XTALL_OUT  
XTALL_VDDA18  
-
output apio (IO)  
SUP2  
-
vddco  
Analog supply  
oscillators/PLLs  
XTALL_GNDA  
-
G2  
-
-
-
vssco  
Analog ground  
oscillators/PLLs  
I2C (fixed 2 pins)  
PNX0161_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 17 January 2008  
5 of 21  
PNX0161  
NXP Semiconductors  
PNX0161 personal audio IC  
Table 3.  
Pinning list …continued  
BGA pin name  
GPIO  
BGA ball Digital  
Application Pin  
state  
Cell type[1]  
Description  
I/O level function  
after  
reset  
I2C_SDA  
I2C_SCL  
-
-
C13  
C12  
0-5 VDC input/output  
tolerant  
input  
iic3m4sdat5v Serial data I2C  
iic3m4sdat5v Serial data I2C  
0-5 VDC input/output  
tolerant  
input  
USB interface (fixed 4 pins)  
USB_VBUS  
USB_CONNECT_N -  
-
A13  
B13  
SUP1  
-
-
input  
bpts5ptpht5v USB supply detection  
0-5 VDC  
tolerant  
output bpts5ptpht5v Soft connect output USB  
2.0 FS  
USB_DP  
-
-
A12  
A11  
-
-
-
-
input  
input  
usb 11f1  
usb 11f1  
Positive USB data line  
Negative USB data line  
USB_DM  
PSU (fixed 12 pins)  
PSU_VBUSA  
PSU_VBUSB  
PSU_VOUT33  
-
-
-
N9  
SUP1  
SUP1  
SUP3  
analog  
analog  
-
-
-
-
vddcobf  
vddcobf  
vddcobf  
USB supply voltage  
USB supply voltage  
N12  
M13  
DCDC1 3.3 V output  
voltage  
PSU_LX_VOUT33  
PSU_VSS1  
-
-
-
-
-
-
-
N10  
M9  
-
-
-
-
-
-
-
-
-
vddco  
vssco  
vssco  
vddco  
vddcobf  
vssco  
vssco  
Connection to DCDC1  
external coil (PSU_LX1)  
-
-
Ground for DCDC1  
Nswitch (no substrate)  
PSU_VSS2  
M10  
N11  
N13  
L12  
M11  
-
-
Ground for DCDC2  
Nswitch (no substrate)  
PSU_LX_VOUT14  
PSU_VOUT14  
PSU_CLEAN  
PSU_GND  
-
analog  
Connection to DCDC2 3  
external coil (PSU_LX2)  
SUP2  
-
-
-
DCDC1 1.4 V output  
voltage  
-
-
Reference circuit ground  
not connected to substrate  
Core ground and  
substrate  
PSU_PLAY  
-
-
L13  
K13  
-
-
analog  
analog  
-
-
apio  
apio  
Play button input  
Stop button input  
PSU_STOP  
GPIO (fixed 8 pins)  
GPIO_0  
Yes  
Yes  
Yes  
Yes  
Yes  
J13  
0-5 VDC input/output  
tolerant  
input  
input  
input  
input  
input  
bpts5ptpht5v General purpose IO pin  
MODE0 (pull-down)[2]  
GPIO_1  
GPIO_2  
GPIO_3  
GPIO_4  
G12  
H13  
G13  
H12  
0-5 VDC input/output  
tolerant  
bpts5ptpht5v General purpose IO pin  
MODE1 (pull-down)[3]  
0-5 VDC input/output  
tolerant  
bpts5ptpht5v General purpose IO pin  
STOP  
0-5 VDC input/output  
tolerant  
bpts5ptpht5v General purpose IO pin  
0-5 VDC input/output  
tolerant  
bpts5ptpht5v General purpose IO pin  
PNX0161_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 17 January 2008  
6 of 21  
PNX0161  
NXP Semiconductors  
PNX0161 personal audio IC  
Table 3.  
Pinning list …continued  
BGA pin name  
GPIO  
BGA ball Digital  
Application Pin  
state  
Cell type[1]  
Description  
I/O level function  
after  
reset  
GPIO_5  
GPIO_6  
GPIO_7  
Yes  
Yes  
Yes  
F13  
F12  
E13  
0-5 VDC input/output  
tolerant  
input  
input  
input  
bpts5ptpht5v General purpose IO pin  
bpts5ptpht5v General purpose IO pin  
bpts5ptpht5v General purpose IO pin  
0-5 VDC input/output  
tolerant  
0-5 VDC input/output  
tolerant  
DAI (fixed 3 pins)  
DAI_DATA  
Yes  
Yes  
Yes  
N1  
N4  
N6  
0-5 VDC input/output  
tolerant  
input  
(GPIO)  
bpts5ptpht5v I2S in data  
DAI_WS  
0-5 VDC input/output  
tolerant  
input  
(GPIO)  
bpts5ptpht5v I2S in wordselect  
bpts5ptpht5v I2S in bit clock  
DAI_BCK  
0-5 VDC input/output  
tolerant  
input  
(GPIO)  
DAO (fixed 4 pins)  
DAO_DATA  
Yes  
Yes  
Yes  
Yes  
N7  
M7  
M6  
N5  
0-5 VDC input/output  
tolerant  
input  
(GPIO)  
bpts5ptpht5v I2S out data  
DAO_WS  
DAO_BCK  
DAO_CLK  
0-5 VDC input/output  
tolerant  
input  
(GPIO)  
bpts5ptpht5v I2S out wordselect  
bpts5ptpht5v I2S out bit clock  
bpts5ptpht5v I2S out clock 256 FS  
0-5 VDC input/output  
tolerant  
input  
(GPIO)  
0-5 VDC input/output  
tolerant  
input  
(GPIO)  
UART (fixed 2 pins)  
UART_TXD  
Yes  
Yes  
K12  
J12  
0-5 VDC input/output  
tolerant  
input  
(GPIO)  
bpts5ptpht5v Serial output  
bpts5ptpht5v Serial input[4]  
UART_RXD  
0-5 VDC input/output  
tolerant  
input  
(GPIO)  
CGU (fixed 2 pins)  
RSTN_IN  
-
K1  
J2  
0-5 VDC input  
tolerant  
input  
bpts5ptpht5v System reset input  
(active low pull-up)  
CLK_OUT  
Yes  
0-5 VDC input/output  
tolerant  
output bpts5ptpht5v 32.768 kHz clock output  
Embedded flash (fixed 1 pin)  
FLASH_VDD_HV  
NA  
-
-
E12  
SUP2  
-
-
-
-
-
vddco  
Supply  
Not visible  
on  
bpts5ptpht5v Duty cycle measurement  
package  
-
-
-
-
Not visible  
on  
package  
-
-
-
-
-
-
bpts5ptpht5v Address count up  
(pull-down)  
Not visible  
on  
apio (IO)  
Sense amp trip point  
package  
PNX0161_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 17 January 2008  
7 of 21  
PNX0161  
NXP Semiconductors  
PNX0161 personal audio IC  
Table 3.  
Pinning list …continued  
BGA pin name  
GPIO  
BGA ball Digital  
Application Pin  
state  
Cell type[1]  
Description  
I/O level function  
after  
reset  
-
-
-
-
-
-
-
-
Not visible  
on  
package  
-
-
-
-
-
-
-
-
-
-
-
-
apio (ZI)  
Measure trip point current  
for sense amps  
Not visible  
on  
package  
bpts5ptpht5v Overrule write and erase  
security and protections  
(pull-down)  
Not visible  
on  
package  
VPEX  
Observe or supply positive  
write/erase voltage  
(11.5 V)  
Not visible  
on  
package  
VNEX  
Observe or supply  
negative write/erase  
voltage (5.5 V)  
DAC/HP (fixed 11 pins)  
DAC_VDDA33  
DAC_VREFP  
-
-
B10  
A9  
SUP3  
AI  
-
-
-
-
vddco  
apio  
SDAC analog supply  
SDAC positive reference  
voltage  
DAC_VREFN  
-
B9  
AI  
-
-
apio  
SDAC negative reference  
voltage  
HP_OUTL  
HP_OUTR  
HP_FCL  
-
-
-
A5  
A7  
B5  
AO  
AO  
AI  
-
-
-
-
-
-
apio  
apio  
apio  
Headphone left output  
Headphone right output  
Headphone filter capacitor  
left  
HP_FCR  
-
-
A8  
B6  
AI  
-
-
-
-
apio  
Headphone filter capacitor  
right  
HP_VDDA33  
Supply  
vddco  
Headphone analog supply  
class-AB  
-
-
B6  
B7  
Supply  
Ground  
-
-
-
-
vddco  
vssco  
Double bonding  
HP_GNDA  
HP_OUTC  
HP_VREF  
Headphone analog  
ground  
-
-
B7  
A6  
Ground  
AO  
-
-
-
-
vssco  
apio  
Double bonding  
Headphone common  
output reference Class-AB  
-
-
-
AO  
AI  
-
-
-
-
apio  
apio  
-
B8  
Analog reference supply  
For headphone and DAC  
ADC/MIC (fixed 9 pins)  
ADC_MIC  
ADC_VINL  
ADC_VINR  
ADC_VREF  
-
-
-
-
A4  
A2  
A1  
B1  
AI  
-
-
-
-
-
-
-
-
apio  
apio  
apio  
apio  
ADC microphone input  
ADC line input left  
AI  
AI  
ADC line input right  
AO  
ADC reference voltage  
output  
ADC_VREFN  
-
C2  
AI  
-
-
apio  
ADC negative reference  
voltage  
PNX0161_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 17 January 2008  
8 of 21  
PNX0161  
NXP Semiconductors  
PNX0161 personal audio IC  
Table 3.  
Pinning list …continued  
BGA pin name  
GPIO  
BGA ball Digital  
Application Pin  
state  
Cell type[1]  
Description  
I/O level function  
after  
reset  
ADC_VREFP  
-
A3  
AI  
-
-
apio  
ADC positive reference  
voltage  
ADC_VDDA18  
ADC_VDDA33  
-
-
D1  
C1  
Supply  
Supply  
-
-
-
-
vddco  
vddco  
ADC digital voltage supply  
ADC analog voltage  
supply  
ADC_GNDA  
-
D2  
Ground  
-
-
vssco  
ADC analog ground  
MicSUP (fixed 2 pins)  
MIC_VREFSUP  
-
B4  
B3  
AI  
-
-
-
-
apio  
apio  
MIC clean reference  
voltage  
MIC_OUTSUP  
-
AO  
MIC supply voltage  
Debugging (fixed 6 pins)  
JTAGSEL_ARM  
-
-
-
-
-
-
M3  
M4  
N2  
N3  
M1  
M5  
0-5 VDC input  
tolerant  
input  
input  
input  
input  
input  
bpts5ptpht5v JTAG selection ARM  
(pull-down)  
JTAG_TDI  
0-5 VDC input  
tolerant  
bpts5ptpht5v JTAG data input (pull-up)  
JTAG_TCK  
0-5 VDC input  
tolerant  
bpts5ptpht5v JTAG clock input (pull-up)  
JTAG_TMS  
0-5 VDC input  
tolerant  
bpts5ptpht5v JTAG mode select input  
(pull-up)  
JTAG_TRST_N  
JTAG_TDO  
0-5 VDC input  
tolerant  
bpts5ptpht5v JTAG reset input  
(pull-down)  
0-5 VDC input/output  
tolerant  
output bpts5ptpht5v JTAG data output  
Supplies (fixed 10 pins)  
VDDE0  
VSSE0  
VDDE1  
VSSE1  
VDDE2  
VSSE2  
VDDI0  
VSSI0  
-
-
-
-
-
-
-
-
-
-
E1  
SUP3  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
vdde3v3  
vsse3v3  
vdde3v3  
vsse3v3  
vdde3v3  
vsse3v3  
vddco  
Peripheral supply  
Peripheral ground  
Peripheral supply  
Peripheral ground  
Peripheral supply  
Peripheral ground  
Core supply  
F2  
-
N8  
SUP3  
M8  
D13  
D12  
L1  
-
SUP3  
-
SUP2  
L2  
-
vssco  
Core ground  
VDDI1  
VSSI1  
A10  
B11  
SUP2  
-
vddco  
Core supply  
vssco  
Core ground  
Unused BGA balls (4 pins)  
Not used  
Not used  
Not used  
Not used  
-
-
-
-
B2  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
B12  
M2  
M12  
[1] Cell types are explained in Table 5.  
[2] GPIO0 is a bootstrap MODE pin, for further details see application note on PNX0161.  
PNX0161_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 17 January 2008  
9 of 21  
PNX0161  
NXP Semiconductors  
PNX0161 personal audio IC  
[3] GPIO1 is a bootstrap MODE pin, for further details see application note on PNX0161.  
[4] UART_TX is a bootstrap MODE pin, for further details see application note on PNX0161.  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
ADC_  
VINR  
ADC_  
VINL  
ADC_  
VREFP  
ADC_  
MIC  
DAC_  
VREFP  
USB_  
VBUS  
HP_OUTL HP_OUTC HP_OUTR HP_FCR  
VDDI1  
USB_DM  
USB_DP  
A
A
USB_  
CONNECT_  
N
ADC_  
VREF  
MIC_  
MIC_  
HP_  
VDDA33  
DAC_  
VREFN  
DAC_  
VDDA33  
#N/A  
HP_FCL  
HP_GNDA HP_VREF  
VSSI1  
#N/A  
B
C
D
E
B
C
D
E
OUTSUP VREFSUP  
ADC_V  
DDA33  
ADC_  
VREFN  
I2C_SCL  
VSSE2  
I2C_SDA  
ADC_  
VDDA18  
ADC_  
GNDA  
VDDE2  
GPIO_7  
XTALL_  
VDDA18  
FLASH_  
VDD_HV  
VDDE0  
XTALL_  
OUT  
F
VSSE0  
GPIO_6  
GPIO_1  
GPIO_5  
GPIO_3  
F
XTALL_  
IN  
XTALL_  
GNDA  
G
G
TFBGA88  
XTALH_  
OUT  
XTALH_  
VDDA18  
H
J
GPIO_4  
GPIO_2  
GPIO_0  
H
J
XTALH_IN CLK_OUT  
UART_RXD  
XTALH_  
RSTN_IN  
UART_TXD PSU_STOP  
PSU_CLEAN PSU_PLAY  
K
L
K
L
VSSA  
VDDI0  
VSSI0  
#N/A  
JTAG_  
TRST_N  
JTAGSEL_  
ARM  
PSU_  
#N/A  
M
N
M
N
JTAG_TDI JTAG_TDO DAO_BCK  
DAO_WS  
VSSE1  
PSU_VSS1 PSU_VSS2 PSU_GND  
VOUT33  
PSU_  
PSU_LX_ PSU_LX_  
PSU_  
PSU_VBUSB  
DAI_DATA JTAG_TCK JTAG_TMS DAI_WS  
DAO_CLK DAI_BCK DAO_DATA VDDE1  
VBUSA  
VOUT33  
VOUT14  
VOUT14  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
010aaa416  
Fig 4. Pinning diagram  
Table 4. Supply domains  
Supply domain  
SUP2  
Typical voltage (V)  
1.4 - 1.8  
Related supply pins  
Description  
VDDI0, VDDI1, VDDA18  
Core supply  
SUP3  
3.0 - 3.3  
VDDE0, VDDE1, VDDE2,  
ADC_VDDA33,  
Peripheral and analog  
supplies  
DAC_VDDA33, HP_VDDA33  
SUP1  
4.0 - 5.25  
PSU_VBUS  
USB VBUS voltage  
PNX0161_1  
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Product data sheet  
Rev. 01 — 17 January 2008  
10 of 21  
PNX0161  
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PNX0161 personal audio IC  
Table 5.  
Cell types  
Library name[1]  
Function  
Description  
bpts5ptpht5v  
Digital input/output Bidirectional pad; plain input; 3-state output; SSO control; CMOS with  
programmable hysteresis and repeater.  
bpts5ptpht5v  
apio  
Digital input/output IIC cell; clock signal; cell based ESD protection.  
Analog input/output Analog pad; analog input/output.  
vddco  
Core supply  
Core supply  
Core supply  
-
vddcobf  
vddco*  
-
An adapted VDDCO pad from library with the following modification:  
Removing the capacitive coupled gate triggering of the gcNMOST protection  
between pad and substrate.  
Connect the gate to substrate.  
Add a P-diode between ggNMOST and pad.  
Add a N-diode between pad and substrate.  
vddi  
Core supply  
-
-
-
-
-
vdde3v3  
vssco  
Peripheral supply  
Core ground  
vssis  
Core ground  
vsse3v3  
Peripheral ground  
[1] The library name is the official name of the cell in the CMOS library. To increase readability, nicknames for the cells have been created  
for this document. Throughout this document, the nickname is used to refer to a certain cell type instead of its official name.  
9. Limiting values  
Table 6.  
Limiting values  
In accordance with the absolute maximum rating system (IEC 134)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
All digital I/Os  
VI  
input voltage  
output voltage  
output current  
-
0.5  
0.5  
-
-
+5.0  
+3.6  
-
V
VO  
-
-
V
IO  
VDD(EXT) = 3.3 V  
4
mA  
Temperature values  
Tj  
junction temperature  
storage temperature  
ambient temperature  
-
-
-
0
-
125  
+85  
+70  
°C  
°C  
°C  
Tstg  
40  
15  
-
Tamb  
+25  
Electrostatic handling  
VESD  
electrostatic discharge HBM, human body  
2000  
-
+2000  
-
V
V
voltage  
mode  
CDM, charge, device  
mode  
-
500  
PNX0161_1  
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Product data sheet  
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11 of 21  
PNX0161  
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10. Static characteristics  
This chapter gives an overview of the most important static characteristics of the  
PNX0161. More detailed specifications will be given in future versions of this document.  
Table 7.  
Symbol  
VDD(EXT)  
Static characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
external supply  
voltage  
<0,2 >  
3.0  
3.3  
3.6  
V
VDD(INT)  
VDDA(1V8)  
VDDA(3V3)  
VBUS  
internal supply  
voltage  
<0..1 >  
1.3  
1.3  
3.0  
4.0  
1.4  
1.4  
3.3  
5.0  
1.95  
1.95  
3.6  
V
V
V
V
analog supply voltage 12 MHz XTAL osc/PLL  
(1.8 V)  
analog supply voltage  
(3.3 V)  
bus supply voltage  
5.25  
Table 8.  
Symbol  
PO(VBUS)  
VO(3V3)  
Power supply unit static characteristics  
Parameter  
Conditions  
Min  
4.0  
2.4  
50  
1.3  
50  
-
Typ  
5
Max  
5.25  
3.2  
+50  
1.95  
+50  
50  
Unit  
V
VBUS output power  
-
-
-
-
-
-
-
-
output voltage (3.3 V)  
output voltage variation (3.3 V)  
output voltage (1.4 V)  
output voltage variation (1.4 V)  
output current (3.3 V)  
output current (1.4 V)  
3.0  
-
V
VO(3V3)  
VO(1V4)  
mV  
V
1.4  
-
VO(1V4)  
IO(3V3)  
mV  
mA  
mA  
%
-
IO(1V4)  
-
-
50  
ηDCDC(33)  
DC-to-DC converter efficiency  
(33 %)  
-
85  
-
ηDCDC(14)  
DC-to-DC converter efficiency  
(14 %)  
-
-
81  
-
%
fclk  
fosc  
fsw  
clock frequency  
-
-
-
-
12  
10  
1
-
MHz  
MHz  
MHZ  
oscillator frequency  
switching frequency  
8
-
12  
-
Table 9.  
Symbol  
IDDA(ADC)(3V3)  
IDDA(ADC)(1V8)  
Iref(neg)  
Analog in - electrical parameters DC characteristics  
Parameter  
Conditions  
Min  
Typ  
2.2  
-
Max  
Unit  
mA  
mA  
µA  
ADC analog supply current (3.3 V)  
ADC analog supply current (1.8 V)  
negative reference current  
positive reference current  
SDC analog supply current  
PGA analog supply current  
PGA gain  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
20  
-
20  
Iref(pos)  
20  
-
µA  
IDDA(SDC)  
IDDA(PGA)  
GPGA  
0.4  
430  
1.94  
-
mA  
µA  
-
-
dB  
IDDA(bias)  
bias analog supply current  
N = 13 for all  
modules on  
190 +  
N*10  
-
µA  
IDDA(LNA)  
LNA analog supply current  
-
-
0.85  
1.2  
mA  
PNX0161_1  
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Product data sheet  
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PNX0161 personal audio IC  
Table 9.  
Symbol  
GLNA  
Analog in - electrical parameters DC characteristics …continued  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
LNA gain  
in a bandwidth  
between 300 Hz  
and 5 kHz.  
28  
30  
32  
dB  
Rref  
reference resistance  
headphone and  
DAC  
-
11.25  
-
kΩ  
Rcom  
common resistance  
gain mismatch  
headphone  
-
-
11.25  
-
-
kΩ  
G  
0
24  
dB  
PNX0161_1  
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Product data sheet  
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PNX0161  
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11. Dynamic characteristics  
This chapter shows the audio performance characteristics of the PNX0161. A more  
extensive list of dynamic characteristics will be given in future versions of this document.  
Table 10. Timing and other characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
12 MHz oscillator (XTALH)  
fosc  
δ
oscillator frequency  
-
-
12  
50  
-
-
MHz  
%
duty cycle  
-
-
-
Ci  
input capacitance  
output capacitance  
start time  
-
-
2
pF  
Co  
tstart  
P
-
-
-
0.74  
-
pF  
-
-
500  
-
µs  
power dissipation  
crystal level of drive  
100  
500  
µW  
Table 11. Dynamic characteristics of Class AB amplifier at 3.0 V - DC mode[1]  
Symbol  
VO  
Parameter  
Conditions  
HP unloaded  
RL = 32 Ω  
Min  
Typ  
830  
-
Max  
Unit  
mVRMS  
mW  
output voltage  
output power  
-
-
-
-
Po  
2.5  
-
(THD+N)/S total harmonic  
distortion plus  
(measured with 20 kHz block  
filter)  
59  
dB  
noise-to-signal ratio  
at 0 dBFS, fi = 1 kHz,  
RL = 32 Ω  
at 60 dBFS, fi = 1 kHz,  
RL = 32 Ω  
-
-
35  
30  
dBA  
dBA  
S/N  
signal-to-noise ratio  
ripple rejection  
HP unloaded (measured with  
20 kHz block filter)  
96  
-
αripple  
αct  
RL = 32 Ω  
-
-
6
-
-
dB  
dB  
crosstalk attenuation at 0 dBFS, fi = 1 kHz,  
42  
RL = 32 Ω  
[1] Tamb = 25 °C; unless otherwise specified.  
Table 12. Analog in - electrical parameters AC characteristics  
Symbol  
B
Parameter  
Conditions  
Min  
Typ  
-
Max  
21.7  
-
Unit  
kHz  
dB  
bandwidth  
at 48 kHz sampling rate  
THD+N @ 0 dBFS; fi = 1 kHz  
-
-
THD  
total harmonic  
distortion  
73  
tuner, line input level = 1 V,  
PGA setting 0 dB  
THD+N @ 60 dBFS;  
-
30  
-
dBA  
fi = 1 kHz; A-weighted  
tuner, line imputatively = 1 mV,  
PGA setting 0 dB  
S/N  
Zi  
signal-to-noise ratio  
input impedance  
tuner, line imputatively = 1 V,  
PGA setting 0 dB; A-weighted  
-
-
90  
12  
-
-
dBA  
line in/tuner mode  
kΩ  
PNX0161_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 17 January 2008  
14 of 21  
PNX0161  
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Table 12. Analog in - electrical parameters AC characteristics …continued  
Symbol  
Microphone  
THD  
Parameter  
Conditions  
Min  
Typ  
70  
31  
Max  
Unit  
dB  
total harmonic  
distortion  
THD+N @ 0 dBFS  
-
-
-
-
Vi mic = 20 µV; fi = 1 kHz  
THD+N @ 60 dBFS;  
dBA  
A-weighted  
Vi mic = 20 µV; fi = 1 kHz  
Zi  
input impedance  
-
-
5
-
kΩ  
Table 13. Digital - electrical parameters AC characteristics  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
fARM  
ARM frequency  
-
-
-
48  
MHz  
Table 14. Power figures  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Istb(susp)  
suspend mode  
standby current  
-
-
750  
-
µA  
P
power dissipation  
playback: by the headphones  
of a received USB audio  
stream from USB host via the  
DAC.  
-
45  
-
mW  
Vbus = 5 V  
VO(1V4) = 1.46 V  
VO(3V3) = 3.0 V  
DC-coupled (HP 32 ) output  
power adjusted to 0,5 mW  
using 1 kHz sine wave.  
normalized test MP3 file is  
used, tin arena, chains.  
playback volume: maximum  
volume in volume control,  
Vol = 35 in media player  
recording: audio stream  
-
53  
-
mW  
converted by the ADC from the  
microphone is sent via USB  
audio stream to the USB host.  
Vbus = 5 V  
VO(1V4) = 1.46 V  
VO(3V3) = 3.0 V  
PNX0161_1  
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Product data sheet  
Rev. 01 — 17 January 2008  
15 of 21  
PNX0161  
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Table 14. Power figures …continued  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
P
power dissipation  
phone call: in addition to the  
first case, simultaneously  
returning a USB audio stream  
that is converted by the ADC  
from the microphone. The  
microphone is mixed to the  
headphone stream, known as  
side-tone mixing.  
-
72  
-
mW  
Vbus = 5 V  
VO(1V4) = 1.46 V  
VO(3V3) = 3.0 V  
DC-coupled (HP 32 ).  
tuner listening: the FM tuner  
audio stream is sent to the  
headphones. No stream is sent  
or received via USB.  
-
-
80  
-
-
mW  
mW  
tuner recording: the FM tuner  
audio stream is sent to the  
headphones. In addition the  
FM tuner stream is streamed to  
the phone via USB.  
117  
THD+N @ 0 dBFS; fi = 1 kHz.  
Pmax  
maximum power  
dissipation  
phone UC + max freq  
SYSBASE at 48 MHz and  
MAX volume.  
-
172  
-
mW  
Table 15. DFU downloading  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
fbit(UHCI)  
UHCI bit rate  
limited by a USB control end  
point size of 8 bytes measured  
with 2 kB transfer.  
-
8
-
kB  
fbit(OHCI)  
OHCI bit rate  
2 kB transfer  
-
77  
-
kB  
PNX0161_1  
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Product data sheet  
Rev. 01 — 17 January 2008  
16 of 21  
PNX0161  
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PNX0161 personal audio IC  
12. Package outline  
TFBGA88: plastic thin fine-pitch ball grid array package; 88 balls; body 7 x 7 x 0.8 mm  
SOT951-1  
B
A
D
ball A1  
index area  
A
2
A
E
A
1
detail X  
e
1
C
M
M
v
C
C
A
B
e
b
y
y
C
1
w
N
M
L
e
K
J
H
G
F
e
2
E
D
C
B
A
ball A1  
index area  
1
2
3
4
5
6
7
8
9
10 11 12 13  
X
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
UNIT  
A
1
A
2
b
D
E
e
e
1
e
2
v
w
y
y
1
max  
0.25 0.85 0.35  
0.15 0.75 0.25  
7.1  
6.9  
7.1  
6.9  
mm  
1.1  
0.5  
6
6
0.15 0.05 0.08  
0.1  
REFERENCES  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
06-05-26  
06-08-25  
SOT951-1  
- - -  
MO-195  
- - -  
Fig 5. Package outline SOT951-1 (TFBGA88)  
PNX0161_1  
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Product data sheet  
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17 of 21  
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13. Abbreviations  
Table 16. Abbreviations  
Acronym  
ADC  
Description  
Analog to Digital Converter  
AuDio SubSystem  
ADSS  
AHB  
Advanced Peripheral Bus  
Analog Volume Control  
Clock Generation Unit  
AVC  
CGU  
Class-AB  
DAC  
Class-AB headphone amplifier  
Digital to Analog Converter  
Digital Audio Input  
DAI  
DAO  
Digital Audio Output  
DMA  
Direct Memory Access  
ElectroStatic Discharge  
General Purpose Input/Output  
INTerrupt Controller  
ESD  
GPIO  
INTC  
IOCONF  
ISRAM  
ISROM  
I2C M/S  
JTAG  
Input Output CONFiguration  
Internal RAM Memory  
Internal ROM memory  
Inter IC Communication Master/Slave interface  
Joint Test Action Group  
PHYsical layer  
PHY  
PLL  
Phase Locked Loop  
PSU  
Power Supply Unit  
SAI  
Simple Audio Input  
SAO  
Simple Audio Output  
SDAC  
SDMA  
SysCReg  
Timer  
UART  
USB 2.0 FS  
VPB  
Stereo Digital to Analog Converter  
Simple Direct Memory Access controller  
System Control Registers  
Timer module  
Universal Asynchronous Receiver Transmitter  
Universal Serial Bus 2.0 Full-Speed device  
VSLI Peripheral Bus  
VPB bridge  
VSLI  
AHB to VPB bridge  
Very Large Scale Integration  
Watchdog timer  
Watchdog /  
WDOG  
PNX0161_1  
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Product data sheet  
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18 of 21  
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14. Revision history  
Table 17. Revision history  
Document ID  
Release date  
20080117  
Data sheet status  
Change notice  
Supersedes  
PNX0161_1  
Product data sheet  
-
-
PNX0161_1  
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15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
to result in personal injury, death or severe property or environmental  
15.2 Definitions  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
15.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
Nexperia — is a trademark of NXP B.V.  
16. Contact information  
For additional information, please visit: http://www.nxp.com  
For sales office addresses, send an email to: salesaddresses@nxp.com  
PNX0161_1  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 01 — 17 January 2008  
20 of 21  
PNX0161  
NXP Semiconductors  
PNX0161 personal audio IC  
17. Contents  
1
2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
General description . . . . . . . . . . . . . . . . . . . . . . 1  
3
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
General features. . . . . . . . . . . . . . . . . . . . . . . . 1  
Hardware features . . . . . . . . . . . . . . . . . . . . . . 1  
Software features . . . . . . . . . . . . . . . . . . . . . . . 2  
Software features on request . . . . . . . . . . . . . . 2  
3.1  
3.2  
3.3  
3.4  
4
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Ordering information. . . . . . . . . . . . . . . . . . . . . 3  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11  
Static characteristics. . . . . . . . . . . . . . . . . . . . 12  
Dynamic characteristics . . . . . . . . . . . . . . . . . 14  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19  
5
6
7
8
8.1  
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 20  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2008.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 17 January 2008  
Document identifier: PNX0161_1  

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