PSMA18A/T3 [NXP]
DIODE 400 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AC, PLASTIC PACKAGE-2, Transient Suppressor;型号: | PSMA18A/T3 |
厂家: | NXP |
描述: | DIODE 400 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AC, PLASTIC PACKAGE-2, Transient Suppressor 局域网 光电二极管 电视 |
文件: | 总8页 (文件大小:55K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, halfpage
PSMA8.5A to PSMA78A
Transient voltage suppressor
diodes
1999 Jan 26
Product specification
Supersedes data of 1998 Dec 04
Philips Semiconductors
Product specification
Transient voltage suppressor diodes
PSMA8.5A to PSMA78A
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic.
FEATURES
DESCRIPTION
• Glass passivated
DO-214AC surface mountable
package with glass passivated chip.
• High maximum operating
temperature
• Low leakage current
• Excellent stability
cathode
band
handbook, 4 columns
• UL 94V-O classified plastic
package
k
a
• Transient suppressor stand-off
voltage range: 8.5 to 78 V for
26 types
• Supplied in 12 mm embossed tape.
Top view
Side view
MSA473
Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
PRSM
non-repetitive peak reverse power 10/1000 µs exponential pulse;
400
W
dissipation
Tj = 25 °C prior to surge;
see Figs.3 and 5
1999 Jan 26
2
Philips Semiconductors
Product specification
Transient voltage suppressor diodes
PSMA8.5A to PSMA78A
ELECTRICAL CHARACTERISTICS
Total series
Tj = 25 °C unless otherwise specified.
SYMBOL
VF
PARAMETER
forward voltage
CONDITIONS
IF = 0.5 A
MIN.
−
MAX.
1.2
UNIT
V
Tstg
Tj
storage temperature
junction temperature
−65
−65
+175
+175
°C
°C
Per type
Tj = 25 °C unless otherwise specified.
REVERSE
VOLTAGE
(max)
@ IRSM
(CLAMPING
VOLTAGE)
REVERSE
LEAKAGE
CURRENT
(max)
REVERSE
SURGE
CURRENT
(max)
REVERSE
STAND-OFF
VOLTAGE
DEVICE
BREAKDOWN
VOLTAGE
@ VRWM
(note 1)
VBR
VRWM
(V)
min.
(V)
IT
(mA)
VRSM
(V)
IRSM
(A)
IR
(µA)
8.5
9.0
10
11
12
13
14
15
16
17
18
20
22
24
26
28
30
33
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
5.0
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
PSMA8.5A
PSMA9.0A
PSMA10A
PSMA11A
PSMA12A
PSMA13A
PSMA14A
PSMA15A
PSMA16A
PSMA17A
PSMA18A
PSMA20A
PSMA22A
PSMA24A
PSMA26A
PSMA28A
PSMA30A
PSMA33A
9.44
14.4
15.4
17.0
18.2
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
27.8
26.0
23.5
22.0
20.1
18.6
17.2
16.4
15.4
14.5
13.7
12.3
11.3
10.3
9.5
10.0
11.1
12.2
13.3
14.4
15.6
16.7
17.8
18.9
20.0
22.2
24.4
26.7
28.9
31.1
33.3
36.7
8.8
8.3
7.5
1999 Jan 26
3
Philips Semiconductors
Product specification
Transient voltage suppressor diodes
PSMA8.5A to PSMA78A
REVERSE
VOLTAGE
(max)
@ IRSM
(CLAMPING
VOLTAGE)
REVERSE
REVERSE
LEAKAGE
SURGE
REVERSE
BREAKDOWN
STAND-OFF
VOLTAGE
CURRENT
CURRENT
(max)
VOLTAGE
(max)
DEVICE
(note 1)
@ VRWM
VBR
VRWM
(V)
min.
(V)
IT
(mA)
VRSM
(V)
IRSM
(A)
IR
(µA)
36
40
43
45
48
51
54
58
60
64
70
75
78
1
1
1
1
1
1
1
1
1
1
1
1
1
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
PSMA36A
PSMA40A
PSMA43A
PSMA45A
PSMA48A
PSMA51A
PSMA54A
PSMA58A
PSMA60A
PSMA64A
PSMA70A
PSMA75A
PSMA78A
40.0
58.1
64.5
6.9
6.2
5.8
5.5
5.2
4.9
4.6
4.3
4.1
3.9
3.5
3.3
3.2
44.4
47.8
50.0
53.3
56.7
60.0
64.4
66.7
71.1
77.8
83.3
86.7
69.4
72.2
77.4
82.4
87.1
93.6
96.8
103.0
113.0
121.0
126.0
Note
1. Tolerance and Voltage Designation: Tolerance designation - The type number listed indicates a tolerance of ±.5%
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
25
UNIT
K/W
K/W
K/W
Rth j-tp
Rth j-a
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
note 1
note 2
100
150
Notes
1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.4.
2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.4.
For more information please refer to the ‘General part of the associated handbook’.
1999 Jan 26
4
Philips Semiconductors
Product specification
Transient voltage suppressor diodes
PSMA8.5A to PSMA78A
GRAPHICAL DATA
MGR465
MGR463
4
10
4
handbook, halfpage
handbook, halfpage
P
tot
(W)
P
RSM
(W)
3
3
2
1
0
10
2
10
−2
−1
0
100
200
10
10
1
10
T (°C)
t
(ms)
2
Solid line: tie-point temperature.
Tj = 25 °C prior to surge.
Dotted line: ambient temperature; device mounted on an Al2O3
printed-circuit board as shown in Fig.4.
Fig.3 Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (exponential pulse).
Fig.2 Maximum total power dissipation as a
function of temperature.
I
50
handbook, halfpage
RSM
(%)
100
90
4.5
50
50
10
2.5
t
1.25
MSB213
t
1
t
MGD521
2
In accordance with “IEC 60-1, Section 8”.
t1 = 10 µs.
t2 = 1000 µs.
Dimensions in mm.
Fig.5 Non-repetitive peak reverse current pulse
definition.
Fig.4 Printed-circuit board for surface mounting.
1999 Jan 26
5
Philips Semiconductors
Product specification
Transient voltage suppressor diodes
PSMA8.5A to PSMA78A
PACKAGE OUTLINE
Transfer-moulded thermo-setting plastic small rectangular surface mounted package;
2 connectors
SOD106
H
D
A
A
1
c
Q
E
b
(1)
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A
b
c
D
E
H
Q
1
1.6
1.4
2.3
2.0
4.5
4.3
2.8
2.4
5.5
5.1
3.3
2.7
mm
0.05
0.2
Note
1. The marking band indicates the cathode.
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
EIAJ
SOD106
DO-214AC
97-06-09
1999 Jan 26
6
Philips Semiconductors
Product specification
Transient voltage suppressor diodes
PSMA8.5A to PSMA78A
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Jan 26
7
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© Philips Electronics N.V. 1999
SCA61
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Printed in The Netherlands
135002/00/02/pp8
Date of release: 1999 Jan 26
Document order number: 9397 750 05028
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