RB751 [NXP]
Schottky barrier single diodes; 肖特基势垒二极管单
| 型号： | RB751 |
| 厂家： | 
NXP |
| 描述： | Schottky barrier single diodes |
| 文件： | 总10页 (文件大小：65K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RB751 series
Schottky barrier single diodes
Rev. 01 — 21 May 2007
Product data sheet
1. Product profile
1.1 General description
Planar Schottky barrier single diodes with an integrated guard ring for stress protection,
encapsulated in small Surface-Mounted Device (SMD) plastic packages.
Table 1.
Product overview
Type number
Package
NXP
Package
configuration
JEITA
-
RB751CS40
RB751S40
RB751V40
SOD882
SOD523
SOD323
leadless ultra small
ultra small
SC-79
SC-76
very small
1.2 Features
I Low forward voltage
I Low capacitance
1.3 Applications
I Ultra high-speed switching
I Voltage clamping
I Line termination
I Reverse polarity protection
1.4 Quick reference data
Table 2.
Symbol
IF
Quick reference data
Parameter
Conditions
Min
Typ
Max
120
40
Unit
forward current
-
-
-
-
mA
V
VRRM
repetitive peak reverse
voltage
[1]
VF
forward voltage
IF = 1 mA
-
-
370
mV
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
RB751 series
NXP Semiconductors
Schottky barrier single diodes
2. Pinning information
Table 3.
Pinning
Pin
Description
Simplified outline
Symbol
SOD882
[1]
1
2
cathode
anode
1
2
1
2
sym001
Transparent
top view
SOD323; SOD523
[1]
1
2
cathode
anode
1
2
1
2
sym001
001aab540
[1] The marking bar indicates the cathode.
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
-
Description
Version
RB751CS40
leadless ultra small plastic package; 2 terminals;
SOD882
body 1.0 × 0.6 × 0.5 mm
RB751S40
RB751V40
SC-79
SC-76
plastic surface-mounted package; 2 leads
plastic surface-mounted package; 2 leads
SOD523
SOD323
4. Marking
Table 5.
Marking codes
Type number
RB751CS40
RB751S40
Marking code
F6
G4
W8
RB751V40
RB751_SER_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 21 May 2007
2 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VRRM
repetitive peak reverse
voltage
-
40
V
VR
IF
reverse voltage
forward current
-
-
-
40
V
120
200
mA
mA
IFSM
non-repetitive peak forward square wave;
current
tp < 10 ms
[1]
[2]
[2]
Ptot
total power dissipation
RB751CS40
Tamb ≤ 25 °C
-
250
mW
mW
mW
°C
RB751S40
-
280
RB751V40
-
280
Tj
junction temperature
ambient temperature
storage temperature
-
150
Tamb
Tstg
−65
−65
+150
+150
°C
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max Unit
[1]
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[2]
[2]
RB751CS40
RB751S40
RB751V40
-
-
-
-
-
-
500
450
450
K/W
K/W
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
Min
Typ
Max
370
0.5
-
Unit
[1]
VF
IR
forward voltage
reverse current
IF = 1 mA
VR = 30 V
-
-
-
-
mV
µA
pF
-
Cd
diode capacitance VR = 1 V; f = 1 MHz
2
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
RB751_SER_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 21 May 2007
3 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
mlc362
mlc361
2
3
2
10
10
I
R
(µA)
I
F
(mA)
(1)
10
10
10
1
(1) (2) (3)
(4)
(2)
1
−1
10
−1
10
(3)
−2
−2
10
10
0
0.2
0.4
0.6
0.8
1
0
10
20
30
40
V
(V)
V
(V)
F
R
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(4) Tamb = −40 °C
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
mlc363
5
C
d
(pF)
4
3
2
1
0
0
10
20
30
40
V
(V)
R
f = 1 MHz; Tamb = 25 °C
Fig 3. Diode capacitance as a function of reverse voltage; typical values
RB751_SER_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 21 May 2007
4 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
8. Package outline
0.85
0.75
0.65
0.58
0.50
0.46
0.62
0.55
1
2
1
0.30
0.22
1.65 1.25
1.55 1.15
1.02
0.95
0.65
0.30
0.22
2
0.55
0.47
cathode marking on top side
0.34
0.26
0.17
0.11
Dimensions in mm
03-04-17
Dimensions in mm
02-12-13
Fig 4. Package outline SOD882
Fig 5. Package outline SOD523 (SC-79)
1.35
1.15
1.1
0.8
0.45
0.15
1
2.7 1.8
2.3 1.6
2
0.40
0.25
0.25
0.10
Dimensions in mm
03-12-17
Fig 6. Package outline SOD323 (SC-76)
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
-
8000
10000
-315
-
RB751CS40
RB751S40
SOD882
SOD523
2 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
-
-
-315
-115
-115
-
-
-135
-135
RB751V40
SOD323
[1] For further information and the availability of packing methods, see Section 13.
RB751_SER_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 21 May 2007
5 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
10. Soldering
1.30
0.30
R = 0.05 (8×)
R = 0.05 (8×)
0.60 0.70 0.80
(2×) (2×) (2×)
0.90
0.30
(2×)
0.40
(2×)
0.50
(2×)
solder lands
solder paste
solder resist
occupied area
mbl872
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD882
2.15
0.50 0.60
1.20
solder lands
solder paste
solder resist
occupied area
0.30
0.40
1.80
1.90
mgs343
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 8. Reflow soldering footprint SOD523 (SC-79)
RB751_SER_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 21 May 2007
6 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
3.05
2.80
2.10
1.60
solder lands
solder resist
occupied area
solder paste
1.65 0.95
0.50 0.60
msa433
0.50
(2×)
Dimensions in mm
Fig 9. Reflow soldering footprint SOD323 (SC-76)
5.00
4.40
1.40
solder lands
solder resist
occupied area
2.75 1.20
msa415
preferred transport direction during soldering
Dimensions in mm
Fig 10. Wave soldering footprint SOD323 (SC-76)
RB751_SER_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 21 May 2007
7 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
11. Revision history
Table 10. Revision history
Document ID
Release date
20070521
Data sheet status
Change notice
Supersedes
RB751_SER_1
Product data sheet
-
-
RB751_SER_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 21 May 2007
8 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of a NXP Semiconductors product can reasonably be expected to
12.2 Definitions
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
13. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
RB751_SER_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 21 May 2007
9 of 10
RB751 series
NXP Semiconductors
Schottky barrier single diodes
14. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Packing information. . . . . . . . . . . . . . . . . . . . . . 5
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
3
4
5
6
7
8
9
10
11
12
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12.1
12.2
12.3
12.4
13
14
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 21 May 2007
Document identifier: RB751_SER_1
相关型号：
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