RD2612 [NXP]

POS Reference Design NFC Peer to Peer communication showcase; POS参考设计NFC点对点通信展示


型号：	RD2612
厂家：	NXP
描述：	POS Reference Design NFC Peer to Peer communication showcase POS参考设计NFC点对点通信展示通信
文件：	总11页 (文件大小：207K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

OM5597/RD2612

POS Reference Design

Rev. 1.0 — 26 May 2011

208510

Objective short data sheet

COMPANY PUBLIC

1. General description

OM5597/RD2612 is a reference design of a cost effective EMV compliant Point of Sales

Terminal based on NXP components. It provides an EMV Level 1 compliant software

stack for contactless as well as contact payment based on PN512/C2 and TDA8026. The

user interface composed out of an LCD screen and a keyboard demonstrates the

following showcases:

• First steps of contact and contactless EMV payment with JCOP Dual Interface card

• First steps of payment with a mobile phone including P2P data exchange

• Closed loop payment based on MIFARE DESFire EV1 together with MIFARE SAM

AV2

The OM5597/RD2612 board comes together with all design files including the hardware

Gerber Files and the software source files.

2. Features and benefits

2.1 Features

EMVCo compliant contactless smart card reader based on PN512/C2 with RF

amplifier

EMVCo compliant contact smart card reader based on TDA8026

EMV Level 1 compliant contact and contactless software stack

First step of contact and contactless EMV payment application selection with

card/phoneshowcase

Closed loop payment showcase

NFC Peer to Peer communication showcase

2.2 Benefits

Easy integration of NXP components into a cost efficient POS reader

Fast development of a certifiable software stack, due to reuse of already EMV L1

certified source files

Reusable showcase of closed loop payment, contact and contactless payment card

selection as well as NFC functionality

3. Applications

Payment

OM5597/RD2612

NXP Semiconductors

POS Reference Design

4. Quick reference data

Table 1.

Quick reference data

Symbol Parameter

Conditions

Min

Typ

5.0

Max

Unit

V_DD

supply voltage

T_amb

ambient temperature

+25

°C

5. Ordering information

Table 2.

Ordering information

Type number

Package

Name

Description

Version

OM5597/RD2612

Package containing:

POS Reference Design Board

USB cable

MIFARE DESFire EV1 card

Pre Personalized JCOP Payment card

CD with documentation and software

OM5597_RD2612_SDS

All information provided in this document is subject to legal disclaimers.

Objective short data sheet

COMPANY PUBLIC

Rev. 1.0 — 26 May 2011

208510

2 of 11

OM5597/RD2612

NXP Semiconductors

POS Reference Design

6. Block diagram

SC1

card connector

COLOR LCD

DISPLAY

SAM2

SAM3

SAM4

SAM5

JTAG

card connector

BFL SPI

HAL

UART

7816

PN512/C2

TDA8026

I C

LPC1768

card connector

USB device

computer

Pin PAD entry

card connector

001aao152

card connector

Fig 1. Block diagram of OM5597/RD2612

OM5597_RD2612_SDS

All information provided in this document is subject to legal disclaimers.

Objective short data sheet

COMPANY PUBLIC

Rev. 1.0 — 26 May 2011

208510

3 of 11

OM5597/RD2612

NXP Semiconductors

POS Reference Design

7. Functional description

7.1 Content

The kit includes the following items:

• OM5597/RD2612, Point of Sales board

• 1 USB cable

• 1 MIFARE DESFire EV1 card

• 1 pre personalized JCOP Dual Interface card

• CD with documentation and software.

The MIFARE SAM AV2 needs to be organized separately.

7.2 Hardware architecture

The POS reference board, see Figure 1, is composed out of the following NXP

components:

• PN512/C2 contactless NFC reader IC supporting ISO/IEC 14443 type A and B, as

described in Ref. 1

• RF Amplifier for the PN512, as described in Ref. 8

• TDA8026 5-slot contact smart card IC, as described in Ref. 2

• Cortex M3 LPC1768, as described in Ref. 3

• a display for the user interface

• a key pad for PIN entry within the closed loop payment showcase

The quick startup guide, see Ref. 6, gives directions how to start working with the POS

reference design. The board is structured of two main parts.

The main board provides the connections on the user interface (display and key pad), the

daughter board implements the main electronics such as the PN512, TDA8026 and

LPC1768. The antenna is part of the main board but is directly connected to the daughter

board. If one wants to remove the daughter board, the antenna needs to be unsoldered in

advance.

A serial interface (RS232) can be used to adapt or reprogram the software of the board

using FlashMagic.

7.2.1 Power supply

The board can be supplied using USB or over an external power supply connected to the

powerplug. To power the board with USB, the type-B USB connector must be connected

to a host computer through a USB cable. The jumper close to the USB type-B connector

must be set in order to connect VBUS to the 5 V input.

OM5597_RD2612_SDS

All information provided in this document is subject to legal disclaimers.

Objective short data sheet

COMPANY PUBLIC

Rev. 1.0 — 26 May 2011

208510

4 of 11

OM5597/RD2612

NXP Semiconductors

POS Reference Design

7.3 Software architecture

The software stack coming together with the POS reference design is embedded into the

FreeRTOS environment of the LPC1768. It can be compiled and adapted using the

LPCXpresso environment. For more details, please refer to Ref. 7.

The software stack is composed of the following items:

• A contactless EMV library based on a PN512 HAL

• A contact EMV library based on a TDA8026 HAL

• Drivers for the interaction with the user interface such as the display and key pad.

• A showcase using the LLCP protocol based on the contactless EMV library, showing

the possible Peer to Peer communication of a POS terminal with a NFC phone

• A showcase using the contactless EMV library, performing a Paypass Payment

Selection of a contactless payment media

• A showcase of a closed loop payment based on MIFARE DESFire EV1 and MIFARE

SAM AV2

• A showcase using the contact EMV library, performing a Payment Selection of a

contact payment card

LPC1768

FreeRTOS

P2P DEMO

LLCP

EMV:

PPSE

CLOSED LOOP

PAYMENT

EMV:

PSE

TRANSACTION (DESFire + SAM) TRANSACTION

CONTACTLESS

EMV LIBRARY

CONTACT

EMV LIBRARY

DRIVER

PN512HAL

TDA8026HAL

001aao206

Fig 2. Software overview

7.4 Certification

The OM5597/RD2612 went successfully through the EMV L1 certification both for contact

and contactless terminal certification.

OM5597_RD2612_SDS

All information provided in this document is subject to legal disclaimers.

Objective short data sheet

COMPANY PUBLIC

Rev. 1.0 — 26 May 2011

208510

5 of 11

OM5597/RD2612

NXP Semiconductors

POS Reference Design

8. Limiting values

Table 3.

Limiting values^[1]

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to

VSS (ground = 0 V).

Symbol Parameter

Conditions

active reader

Min

Typ

5.00

+25

Max

Unit

V_DD

T_amb

d_cpl

supply voltage

ambient temperature

coupling distance

°C

measured from the

center of the antenna

[1] Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only

and functional operation of the device at these or any other conditions beyond those indicated under

“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for

extended periods may affect device reliability.

9. Abbreviations

Table 4.

Abbreviations

Description

Acronym

EMV

Europay Mastercard VISA (a Payment Industry organization publishing the

EMV standard)

EMVCo

JCOP

NFC

Compliant to the Europay Mastercard VISA standard

Java Card Operating System

Near Field Communication

Personal Identification Number

Point Of Sales

POS

Radio Frequency

RTOS

USB

Real Time Operating System

Universal Serial Bus

OM5597_RD2612_SDS

All information provided in this document is subject to legal disclaimers.

Objective short data sheet

COMPANY PUBLIC

Rev. 1.0 — 26 May 2011

208510

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OM5597/RD2612

NXP Semiconductors

POS Reference Design

10. References

[1] Data sheet PN512/C2 Contactless reader IC — available on NXP web

[2] Data sheet TDA8026 Contact reader IC — available on NXP web

[3] Data sheet Cortex M3 LPC1768 — available on NXP web

[4] Short data sheet MF3ICD81 MIFARE DESFire EV1 — available on NXP web

[5] Short data sheet P5DF081 MIFARE SAM AV2 — available on NXP web

[6] User Manual POS Reference Design Quick Startup Guide — available on NXP

web

[7] User Manual POS Reference Design Firmware description — available on NXP

web

[8] Application Note AN10893 RF Amplifier for NXP contactless MFRC52x —

available on NXP web

OM5597_RD2612_SDS

All information provided in this document is subject to legal disclaimers.

Objective short data sheet

COMPANY PUBLIC

Rev. 1.0 — 26 May 2011

208510

7 of 11

OM5597/RD2612

NXP Semiconductors

POS Reference Design

11. Revision history

Table 5.

Revision history

Document ID

Release date

Data sheet status

Change

notice

Supersedes

OM5597_RD2612_SDS v 1.0

20110526

Objective short data sheet

OM5597_RD2612_SDS

All information provided in this document is subject to legal disclaimers.

Objective short data sheet

COMPANY PUBLIC

Rev. 1.0 — 26 May 2011

208510

8 of 11

OM5597/RD2612

NXP Semiconductors

POS Reference Design

12. Legal information

12.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

12.2 Definitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

12.3 Disclaimers

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

OM5597_RD2612_SDS

All information provided in this document is subject to legal disclaimers.

Objective short data sheet

COMPANY PUBLIC

Rev. 1.0 — 26 May 2011

208510

9 of 11

OM5597/RD2612

NXP Semiconductors

POS Reference Design

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

12.4 Licenses

Purchase of NXP ICs with ISO/IEC 14443 type B functionality

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

This NXP Semiconductors IC is ISO/IEC 14443 Type B

software enabled and is licensed under Innovatron’s

Contactless Card patents license for ISO/IEC 14443 B.

The license includes the right to use the IC in systems

and/or end-user equipment.

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

RATP/Innovatron

Technology

Purchase of NXP ICs with NFC technology

Purchase of an NXP Semiconductors IC that complies with one of the Near

Field Communication (NFC) standards ISO/IEC 18092 and ISO/IEC 21481

does not convey an implied license under any patent right infringed by

implementation of any of those standards. A license for the patents portfolio

of NXP B.V. for the NFC standards needs to be obtained at Via Licensing,

the pool agent of the NFC Patent Pool, e-mail: info@vialicensing.com.

12.5 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

MIFARE — is a trademark of NXP B.V.

DESFire — is a trademark of NXP B.V.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

OM5597_RD2612_SDS

All information provided in this document is subject to legal disclaimers.

Objective short data sheet

COMPANY PUBLIC

Rev. 1.0 — 26 May 2011

208510

10 of 11

OM5597/RD2612

NXP Semiconductors

POS Reference Design

14. Contents

General description. . . . . . . . . . . . . . . . . . . . . . 1

2.1

2.2

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Benefits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Functional description . . . . . . . . . . . . . . . . . . . 4

Content. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Hardware architecture . . . . . . . . . . . . . . . . . . . 4

Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Software architecture . . . . . . . . . . . . . . . . . . . . 5

Certification. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.1

7.2

7.2.1

7.3

7.4

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 6

References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8

Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.1

12.2

12.3

12.4

12.5

Contact information. . . . . . . . . . . . . . . . . . . . . 10

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 26 May 2011

208510

RD2612 [NXP]

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